High-pressure substrate processing apparatus

Abstract

This high-pressure substrate processing apparatus is disclosed. The high-pressure substrate processing apparatus includes an inner chamber, an outer chamber, and a fastening module. The inner chamber is formed so as to accommodate a substrate to be processed and a reactant gas supplied at a first pressure higher than atmospheric pressure. The outer chamber includes: an outer housing accommodating the inner chamber; and an outer door formed to be movable between a closed state in which the outer door is in contact with the outer housing and an open state in which the outer door is spaced apart from the outer housing. The outer chamber is formed to accommodate a protective gas supplied at a second pressure that is set in relation to the first pressure. The fastening module includes: a support protrusion installed in the outer housing; a rotary member disposed to be rotatable with respect to the outer door; and an engaging protrusion extending from the rotary member and formed to be placed on the support protrusion. The outer door includes an upper plate in contact with the outer housing in the closed state.

Description

High pressure substrate processing equipment

[0001] The present invention relates to a processing device used to process a substrate in a high pressure environment.

[0002]

[0003] Typically, during the semiconductor device manufacturing process, various processing processes are performed on the semiconductor substrate. Examples of these processes include oxidation, nitriding, ion implantation, and deposition. Hydrogen or deuterium heat treatment is also used to improve the interface properties of semiconductor devices.

[0004] The gases used for substrate processing are supplied to the chamber at high pressure and act on the semiconductor substrate. To maintain the chamber at high pressure, the door to the chamber housing must be securely closed.

[0005] If the chamber's seal is loosened by high-pressure gas, a gap may form between the housing and the door. This gap can allow gas within the chamber to escape to the outside.

[0006]

[0007] One object of the present invention is to provide a high-pressure substrate processing device that can firmly maintain a closed state between a housing and a door even under high pressure within a chamber.

[0008] Another object of the present invention is to provide a high-pressure substrate processing device that can minimize the power required for fastening between a housing and a door.

[0009]

[0010] According to one aspect of the present invention for achieving the above-described task, a high-pressure substrate processing device comprises: an inner chamber formed to receive a substrate to be processed and a reaction gas supplied at a first pressure higher than atmospheric pressure; an outer housing accommodating the inner chamber; and an outer door formed to be movable between a closed state in contact with the outer housing and an open state spaced apart from the outer housing, the outer chamber formed to receive a protective gas supplied at a second pressure set in relation to the first pressure; and a fastening module having a support protrusion installed on the outer housing, a rotation member rotatably arranged with respect to the outer door, and a catch protrusion formed to extend from the rotation member and be arranged on the support protrusion, wherein the outer door may include an upper plate that contacts the outer housing in the closed state.

[0011] Here, the catch can be positioned to be supported by the support protrusion as it rotates in the closed state.

[0012] Here, the rotating member may be located on the lower side of the upper plate.

[0013] Here, the support protrusion may be installed to protrude outward from the outer housing, and the catch protrusion may be formed to be bent so as to surround the support protrusion.

[0014] Here, the outer door further includes a lower plate arranged at a different level from the upper plate, and the rotating member can be positioned between the upper plate and the lower plate.

[0015] Here, the outer door may further include a spacer disposed between the upper plate and the lower plate, and the rotating member may include a rotating ring in which a hollow portion for accommodating the spacer is formed.

[0016] Here, the outer door further includes a sealing material disposed between the upper plate and the outer housing in the closed state, and the catch projection can be formed to rotate independently of contact between the upper plate, the sealing material, and the outer housing.

[0017] Here, the fastening module may further include a driving unit formed to rotate the rotating member to rotate the engaging projection.

[0018] Here, the driving unit may include a driven gear formed on the rotating member; a driving gear meshed with the driven gear; and a motor that rotates the driving gear.

[0019] Here, the outer door may further include an axial protrusion protruding downward from the upper plate, and the rotating member may include a receiving groove for rotatably receiving the axial protrusion.

[0020] Here, the rotating member may include a base portion in which the receiving groove is formed; and a protrusion formed to protrude downward from the base portion, and the fastening module may further include a driving unit formed to drive the rotating member to rotate, and the driving unit may include a driven gear formed on an outer surface of the protrusion portion; a driving gear engaged with the driven gear; and a motor that rotates the driving gear.

[0021] A high-pressure substrate processing device according to one aspect of the present invention comprises: a chamber having a housing formed to accommodate a substrate to be processed and a process gas supplied at a pressure higher than atmospheric pressure; a door formed to move between a closed state that closes the housing and an open state that opens the housing; and a fastening module having a support protrusion installed on the housing, a rotating member rotatably disposed with respect to the door, and a catching protrusion formed to extend from the rotating member and disposed on the support protrusion, wherein the door includes an upper plate that contacts the housing in the closed state, and the rotating member can be positioned on a lower side of the upper plate.

[0022] Here, the catch can be positioned to be supported by the support protrusion as it rotates in the closed state.

[0023] Here, the catch projection may include a catch surface facing the support projection and positioned at a higher level than the door.

[0024] Here, the process gas includes a reaction gas including an active gas and a protective gas which is an inert gas, and the housing includes an inner housing formed to accommodate the substrate to be processed and the reaction gas; and an outer housing coupled to the inner housing to accommodate the inner housing and form a closed space that accommodates the protective gas together with the inner housing, and the door can be formed to close the inner housing.

[0025]

[0026] According to the high-pressure substrate processing device according to the present invention configured as described above, the fastening module for fastening the housing and the door is configured such that the hooking protrusion moves relative to the support protrusion installed on the housing and is positioned on the support protrusion, thereby allowing the housing and the door to be firmly maintained in a closed state even under high pressure within the chamber due to the engagement between the hooking protrusion and the support protrusion.

[0027] Additionally, if the catch is moved independently of the door, only the catch, excluding the door, needs to move to secure the housing and door. This minimizes the power required to secure the housing and door.

[0028] Additionally, since the door remains fixed to the housing when the catch is moved, wear does not occur due to relative rotation between the door and the housing.

[0029]

[0030] FIG. 1 is a conceptual diagram of a high-pressure substrate processing device according to one embodiment of the present invention.

[0031] Fig. 2 is an exploded perspective view showing the open state of the high-pressure substrate processing device of Fig. 1.

[0032] Fig. 3 is a cross-sectional view showing the closed state of the high-pressure substrate processing device of Fig. 2.

[0033] Fig. 4 is a cutaway perspective view illustrating a configuration for driving the rotating member of Fig. 3.

[0034] Fig. 5 is a flowchart for explaining the state transition process of the high-pressure substrate processing device of Fig. 2.

[0035] Fig. 6 is a cross-sectional view showing a closed state of a high-pressure substrate processing device according to another embodiment of the present invention.

[0036]

[0037] Hereinafter, a preferred embodiment of the present invention will be described in detail with reference to the attached drawings.

[0038] The present invention is not limited to the embodiments disclosed below, but can be implemented in various forms and with various modifications. However, these embodiments are provided to ensure that the disclosure of the present invention is complete and to fully inform those skilled in the art of the scope of the invention. Therefore, the present invention is not limited to the embodiments disclosed below, but should be understood to include all modifications, equivalents, and substitutes included within the technical spirit and scope of the present invention, as well as substitutions or additions of the components of one embodiment with those of another embodiment.

[0039] The attached drawings are merely intended to facilitate understanding of the embodiments disclosed in this specification, and should not be construed as limiting the technical ideas disclosed in this specification, but should be understood to encompass all modifications, equivalents, and substitutes included within the spirit and technical scope of the present invention. In the drawings, the components may be expressed in exaggerated sizes or thicknesses for ease of understanding, but the scope of protection of the present invention should not be construed as being limited thereby.

[0040] The terminology used in this specification is only used to describe specific implementations or examples and is not intended to limit the present invention. In addition, the singular expression includes the plural expression unless the context clearly indicates otherwise. In the specification, terms such as "comprises" and "consists of" are intended to indicate the presence of a feature, number, step, operation, component, part, or combination thereof described in the specification. In other words, it should be understood that terms such as "comprises" and "consists of" do not exclude in advance the possibility of the presence or addition of one or more other features, numbers, steps, operations, components, parts, or combinations thereof.

[0041] Terms that include ordinal numbers, such as first, second, etc., may be used to describe various components, but the components are not limited by these terms. These terms are used solely to distinguish one component from another.

[0042] When a component is referred to as being "connected" or "connected" to another component, it should be understood that it may be directly connected or connected to that other component, but that there may be other components intervening. Conversely, when a component is referred to as being "directly connected" or "connected" to another component, it should be understood that there are no other components intervening.

[0043] When a component is referred to as being "above" or "below" another component, it should be understood that it is not only positioned directly above that other component, but that there may also be other components present in between.

[0044] Unless otherwise defined, all terms used herein, including technical or scientific terms, have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains. Terms defined in commonly used dictionaries should be interpreted as having a meaning consistent with their meaning in the context of the relevant technology, and will not be interpreted in an idealized or overly formal sense unless explicitly defined herein.

[0045] FIG. 1 is a conceptual diagram of a high-pressure substrate processing device according to one embodiment of the present invention.

[0046] Referring to this drawing, the high-pressure substrate processing device (100) may include an inner chamber (110), an outer chamber (120), an air supply module (130), and an exhaust module (140).

[0047] The inner chamber (110) forms a processing space that accommodates a substrate for processing. The inner chamber (110) may be made of a non-metallic material, for example, quartz, to reduce contamination in a high-temperature and high-pressure working environment. Depending on the operation of a heater (not shown) disposed outside the inner chamber (110), the temperature of the inner chamber (110) may reach several hundred to several thousand degrees Celsius. The substrate may be, for example, a semiconductor substrate (W, see FIG. 2) mounted on a holder. The holder may be a wafer boat (113, see FIG. 2) capable of stacking multiple layers of substrates (W) to be processed. The substrate is not limited to the wafer, and may be any other basic structure for forming a circuit. For example, the substrate may also include glass for display manufacturing.

[0048] The outer chamber (120) forms an internal space that accommodates the inner chamber (110). The outer chamber (120) is positioned outside the inner chamber (110). Unlike the inner chamber (110), the outer chamber (120) is free from concerns about causing contamination to the object, and thus can be made of metal.

[0049] The air supply module (130) is configured to supply gas to the inner chamber (110) and the outer chamber (120). The air supply module (130) has a gas supplier (131) that serves as a gas source. The gas supplier (131) can selectively supply hydrogen gas (H2), deuterium gas (D2), fluorine gas (F2), ammonia gas (NH3), chlorine gas (Cl2), nitrogen gas (N2), etc. as a reaction gas for a heat treatment process to the inner chamber (110). The gas supplier (131) can supply nitrogen gas or argon gas (Ar), which are inert gases, as a protective gas to the outer chamber (120). The reaction gas and the protective gas may be simply referred to as process gases. The process gases are supplied to the inner chamber (110) or the outer chamber (120) through a reaction gas line (133) or a protective gas line (135), respectively. The protective gas supplied to the outer chamber (120) is specifically supplied to the space (protection space) between the outer chamber (120) and the inner chamber (110).

[0050] The process gas may be supplied so as to form a pressure higher than atmospheric pressure (high pressure), for example, a pressure ranging from several atmospheres to several tens of atmospheres. When the pressure of the reaction gas is a first pressure and the pressure of the protective gas is a second pressure, they may be maintained in a set relationship. For example, the second pressure may be set to be substantially the same as or slightly greater than the first pressure. Such a pressure relationship provides the advantage that the reaction gas does not leak from the internal chamber (110). The second pressure may also be slightly lower than the first pressure, and due to such a pressure relationship, the internal chamber (110) may not be broken even under high pressure.

[0051] The exhaust module (140) is configured to exhaust the process gas. In order to exhaust the reaction gas from the inner chamber (110), an exhaust pipe (141) is connected to the upper portion of the inner chamber (110). Similarly, in order to exhaust the protective gas from the outer chamber (120), an exhaust pipe (145) connected to the outer chamber (120) may be provided. Since these exhaust pipes (141 and 145) are integrated into one, the reaction gas is diluted in the protective gas during the exhaust process, thereby lowering its concentration.

[0052] The fastening structure of the external chamber (120) is described with reference to FIGS. 2 and 3. FIG. 2 is an exploded perspective view showing the open state of the high-pressure substrate processing device of FIG. 1, and FIG. 3 is a cross-sectional view showing the closed state of the high-pressure substrate processing device of FIG. 2.

[0053] Referring to these drawings, the inner chamber (110) includes an inner housing (not shown) and an inner door (115). The inner housing forms the processing space for accommodating the substrate to be processed (W), and its lower portion may be open. The inner door (115) has a shape that closes the open lower portion of the inner housing. The inner door (115) may have a slit shape that is generally open downward.

[0054] As the inner door (115) descends, the processing space is opened (open state, see Fig. 2). In the open state, the substrate to be processed is unloaded from the boat (113), and a new substrate to be processed is loaded onto the boat (113). As the inner door (115) rises, the processing space is closed (closed state, see Fig. 3). In the closed state, more specifically, in the closed state, which will be described later, processing, such as heat treatment or deposition, is performed on the substrate to be processed (W).

[0055] The outer chamber (120) also includes an outer housing (121) and an outer door (125). The outer housing (121) has a size to accommodate the inner chamber (110). The inner housing is mounted on the outer housing (121). The outer door (125) can also be moved to open and close the outer housing (121). The outer door (125) is connected to the inner door (115) by a support member (119). The support member (119) has a spring support structure that elastically expands along the opening and closing direction (E). The support member (119) is not limited to a spring support structure, and may be formed of another hydraulic or pneumatic support structure, or a heat-resistant elastic material, etc. The opening and closing direction (E) is the direction in which the outer door (125) moves to switch between the closed state and the open state. When the outer housing (121) is erected, the opening and closing direction (E) may be the same direction as the height direction or the vertical direction. In the process of switching from the above open state to the above closed state, the support member (119) allows the outer door (125) to move toward the inner door (115).

[0056] The outer door (125) moves up and down together with the inner door (115) to open and close the outer housing (121). Unlike the above, the inner door (115) and the outer door (125) are not connected to each other and can be moved independently to open and close.

[0057] The high-pressure substrate processing device (100) may further include a fastening module (150) for fastening the outer housing (121) and the outer door (125) in the closed state to convert them (121 and 125) into the fastened state. Since the inner door (115) is supported by the support member (119) to the outer door (125), the fastening module (150) also causes the inner door (115) to be in close contact with the inner housing. The fastening module (150) causes the protective gas to be maintained at the second pressure within the outer chamber (120). The fastening module (150) also exerts a fastening force to cause the reaction gas to be maintained at the first pressure within the inner chamber (110).

[0058] The fastening module (150) may specifically include a support protrusion (151) and a hook protrusion (155).

[0059] The support protrusion (151) is a protrusion installed on the outer housing (121). The support protrusion (151) may be installed so as to be exposed to the outside on the outer peripheral surface of the outer housing (121), as in the present embodiment. The outer peripheral surface may be the outer surface of the outer chamber (120). The support protrusion (151) may be formed to protrude from the outer surface, or may be engraved on the outer surface. In the latter case, a first groove along the elevation direction (E) of the outer housing (121) and a second groove generally perpendicular thereto may be formed. The support protrusion is defined by the first and second grooves. The support surface (151a) described below may be a wall surface located below and delimiting the second groove. A plurality of support protrusions (151) may be arranged along the circumferential direction of the outer peripheral surface. A plurality of support protrusions (151) can be arranged on the same level or plane along the lifting direction (E).

[0060] The catch (155) is a catch connected to the outer door (125). The catch (155) is sized to pass between a pair of adjacent support protrusions (151) when the outer door (125) moves in the upward / downward direction (E). The catch (155) may be provided in multiple pieces, like the support protrusion (151).

[0061] The catch (155) can be moved while connected to the outer door (125). The catch (155) can be, for example, installed to be rotatable relative to the outer door (125). In an alternative embodiment, the catch (155) can also be rotated together with the outer door (125).

[0062] The catch (155) can be supported by the catch (151) when positioned on the support protrusion (151) according to movement, specifically rotation (fastened state). In the fastened state, the catch surface (155a), which is the lower surface of the catch (155), faces the support surface (151a), which is the upper surface of the support protrusion (151), and is also supported by the support surface (151a). The catch surface (155a) is positioned at a higher level than the outer door (125). In this fastened state, the outer door (125) can remain firmly fastened to the outer housing (121) even under high pressure of the process gas.

[0063] When a plurality of catches (155) are provided, the plurality of catches (155) can rotate individually. Alternatively, the catches (155) may be integrated with the rotating member (157) and rotate together with the rotating member (157). The catches (155) may be formed to extend outward from the outer circumferential surface of the rotating member (157). Specifically, the catches (155) may have a form that is bent and extended to wrap around the support protrusion (151) in cross section. The catches (155) may wrap around the support protrusion (151) on the outside of the outer housing (121). The rotating member (157) may be arranged to rotate along the rotation direction (R) (centered on the rotation axis (C) set along the lifting direction (E)).

[0064] The rotating member (157) may be rotatably coupled to the outer door (125). The outer door (125) may have an upper plate (126) and a lower plate (127). The rotating member (157) may be disposed between them (126 and 127). A bearing (159) may be disposed between each of the upper plate (126) and the lower plate (127) and the rotating member (157). A thrust bearing may be used as the bearing (159).

[0065] The upper plate (126) is arranged to be in contact with the outer housing (121) in the closed state. The upper plate (126) and the lower plate (127) may be connected by a spacer (128), which is an additional component of the outer door (125). The lower plate (127) may be arranged at a different level from the upper plate (126). The spacer (128) may have a smaller diameter or width than the upper plate (126) and / or the lower plate (127). The spacer (128) may be formed as a separate member from the upper plate (126) and the lower plate (127), or may form a single member with one or both of them. If the upper plate (126), the lower plate (127), and the spacer (128) form a single member, the rotating member (157) can be formed by making a plurality of pieces and then joining them together while each piece is inserted into the space between the upper plate (126) and the lower plate (127).

[0066] The rotating member (157) can be arranged generally parallel to the outer door (125) with a spacer (128) inserted into its hollow portion (158). This type of rotating member (157) can be referred to as a rotating ring.

[0067] While the rotary ring (157) rotates in the above closed state, the outer door (125) may not be linked to the rotation of the rotary ring (157). In other words, while the upper plate (126) maintains contact with the outer housing (121) through the sealing material (129), the rotary ring (157) may rotate independently of the contact state. The sealing material (129) may be an O-ring installed on the upper surface of the upper plate (126).

[0068] The configuration for driving the rotating ring (157) is described with reference to Fig. 4. Fig. 4 is a cutaway perspective view for explaining the configuration for driving the rotating ring of Fig. 3.

[0069] With further reference to this drawing, the rotating ring (157) can be driven to rotate by a driving unit (161).

[0070] The drive unit (161) may have a driven gear (163), a driving gear (164), and a motor (165). The driven gear (163) may be formed on the inner surface of the rotating ring (157). The driving gear (164) may be a gear that meshes with the driven gear (163). The driving gear (164) may be located between the rotating ring (157) and the spacer (128).

[0071] According to this configuration, the rotational power of the motor (165) is transmitted to the driving gear (164). The transmission shaft connecting the output shaft of the motor (165) and the driving gear (164) can be arranged to penetrate the lower plate (127). As the driving gear (164) rotates, the driven gear (163) that is meshed with the driving gear (164) also rotates. As the driven gear (163) rotates, the rotating ring (157) rotates around the rotational axis (C, FIG. 3), and thus the engaging projection (155) also rotates along the rotational direction (R, FIG. 3). The engaging projection (155) can move onto the supporting projection (151) or move to a position misaligned from the supporting projection (151) depending on its rotation. In the process of rotating the engaging projection (155), the outer door (125) does not rotate together with the engaging projection (155). The power to be output from the motor (165) is sufficient to rotate the catch (155) excluding the outer door (125).

[0072] Although the drive unit (161) is described as consisting of gears (163 and 164) and a motor (165), the present invention is not limited thereto. The drive unit may also be configured using other actuators such as cylinders.

[0073] The process from the above open state to the above closed state is further explained with reference to Fig. 5. Fig. 5 is a flowchart for explaining the state transition process of the high-pressure substrate processing device of Fig. 2.

[0074] Referring further to this drawing, in the open state (see FIG. 2), the outer door (125) can be raised toward the outer housing (121) (S1). The raising of the outer door (125) can be accomplished by a lifter (not shown) operating along the opening / closing direction (E).

[0075] A control module (not shown) can determine whether the elevation of the outer door (125) has reached a set elevation amount (S3). This determination can be made based on the elevation amount of the lifter. Alternatively, the determination can be made based on measuring the level of the outer door (125).

[0076] During the upward movement of the outer door (125), the catch (155) passes between a pair of adjacent support projections (151). As a result, the catch surface (155a) is positioned at a level slightly higher than the support surface (151a).

[0077] If the above-described set-up amount of increase is achieved, the outer door (125) can be said to have reached the closed state (S5). In the closed state, the upper plate (126) of the outer door (125) comes into contact with the outer housing (121). The sealing material (129) seals the gap between the upper plate (126) and the outer housing (121). The engaging surface (155a) is misaligned with the supporting surface (151a) and is not supported by the supporting surface (151a).

[0078] In the above closed state, the catch (155) can rotate (S7). Specifically, according to the operation of the driving unit (161), the rotating ring (157) rotates around the rotation axis (C, FIG. 3), and the catch (155) connected to the rotating ring (157) also rotates.

[0079] Whether the rotational degree of the rotating ring (157) has reached the set rotation amount can be determined by the control module (S9). This determination can be made based on the operating time of the driving unit (161). Alternatively, the determination can be made based on measuring the position / angle of the engaging projection (155).

[0080] When the above-described set rotation amount is achieved, the outer door (125) can be said to have reached the above-described fastening state (S11). In the above-described fastening state, the engaging projection (155) is positioned corresponding to the supporting projection (151). The engaging surface (155a) is supported by the supporting surface (151a).

[0081] The process of going from the above-mentioned connection state to the above-mentioned closed state and then to the above-mentioned open state can be carried out by proceeding in reverse order of the steps described above.

[0082] Another form of high-pressure substrate processing device (100') will be described with reference to FIG. 6. FIG. 6 is a cross-sectional view showing a closed state of a high-pressure substrate processing device according to another embodiment of the present invention.

[0083] Referring to this drawing, the high-pressure substrate processing device (100') is generally the same as the high-pressure substrate processing device (100) according to the previous embodiment, but differs in the external door (125'), the rotating member (157'), and the driving unit (161').

[0084] The rotating member (157') may not be in the shape of a ring, but may generally be in the shape of a disk. The rotating member (157') may specifically have a base portion (157'a) and a protrusion portion (157'b). If the base portion (157'a) is located on the lower side of the upper plate (126), the protrusion portion (157'b) is a portion that protrudes downward from the base portion (157'a).

[0085] A receiving groove (158') may be concavely formed in the base portion (157'a). Corresponding to the receiving groove (158'), the outer door (125') may have an axial protrusion (128') protruding downward from the upper plate (126). By allowing the axial protrusion (128') to be rotatably received in the receiving groove (158'), horizontal alignment between the upper plate (126) and the rotating member (157') may be maintained. For smooth rotation of the rotating member (157') (specifically, the protrusion (157'b)) with respect to the axial protrusion (128'), a bearing (159') may be positioned between them (128' and 157'b).

[0086] Depending on the structural relationship between the base portion (157'a) and the protrusion (157'b), the driving unit (161') may also vary. Specifically, a driven gear (163'), which is a component of the driving unit (161'), may be formed on the outer surface of the protrusion (157'b). A driving gear (164) connected to a motor (165) meshes with the driven gear (163'). The driving gear (164) may not penetrate the outer door (125') or the rotating member (157'), but may be located outside of them (125' and 157'). In this specification, a processing device having a dual chamber as a high-pressure substrate processing device (100) has been described as an example, but the present invention is not limited thereto. A processing device having a single chamber is also within the scope of the present invention. The single chamber is composed of one housing and one door. A wafer substrate is placed inside the chamber, and a gas for processing the wafer substrate is also supplied. The fastening module (150, 150') is also applicable to these single chambers. The fastening module (150, 150') ensures that the door is firmly fastened to the housing, despite the gas pressure.

[0087] The fastening module (150, 150') can also be applied to a semi-dual chamber, which is an intermediate form between the dual chamber and the single chamber. The semi-dual chamber can have two housings (an inner housing and an outer housing) and a door. The two housings can correspond to the inner housing and the outer housing (121) of the previous embodiment. The two housings can be combined by their own shapes or by interposing a separate member to form a closed space (corresponding to the protective space). Similar to the previous embodiment, the substrate is placed in the processing space of the inner housing and the reaction gas is injected, and the protective gas can be injected into the closed space. Unlike the previous embodiments, the door is not protected by the protective gas.

[0088] The above door may correspond to the external door (125) of the previous embodiment. The door can open and close the internal housing (and the external housing). The same fastening module (150, 150') as in the previous embodiment is applied to the operation between the external housing and the door.

[0089] Although this specification exemplifies a batch-type processing device, the present invention is not limited thereto. The present invention can also be applied to a single-wafer type processing device.

[0090]

[0091] The present invention has industrial applicability in the field of manufacturing high-pressure substrate processing devices.

Claims

1. An internal chamber formed to accommodate a substrate to be processed and a reaction gas supplied at a first pressure higher than atmospheric pressure; An outer chamber having an outer housing that accommodates the inner chamber, and an outer door that is formed to be movable between a closed state in contact with the outer housing and an open state spaced apart from the outer housing, and formed to accommodate a protective gas supplied at a second pressure set in relation to the first pressure; and A fastening module including a support protrusion installed on the outer housing, a rotating member rotatably arranged with respect to the outer door, and a hooking protrusion formed to extend from the rotating member and arranged on the support protrusion, The above outer door, A high-pressure substrate processing device comprising an upper plate that contacts the external housing in the closed state.

2. In paragraph 1, The above-mentioned stumbling block is, A high pressure substrate processing device positioned to be supported by the support protrusion as it rotates in the closed state.

3. In paragraph 1, The above rotating member is, A high-pressure substrate processing device located on the lower side of the upper plate.

4. In paragraph 1, The above supporting protrusions are, It is installed so as to protrude externally from the above outer housing, The above-mentioned stumbling block is, A high-pressure substrate processing device formed by bending to surround the above-mentioned support protrusion.

5. In paragraph 3, The above outer door, Further comprising a lower plate arranged at a different level from the upper plate, The above rotating member is, A high-pressure substrate processing device positioned between the upper plate and the lower plate.

6. In paragraph 5, The above outer door, Further comprising a spacer disposed between the upper plate and the lower plate, The above rotating member is, A high-pressure substrate processing device comprising a rotating ring in which a hollow portion for accommodating the spacer is formed.

7. In paragraph 1, The above outer door, Further comprising a sealing material disposed between the upper plate and the outer housing in the closed state; The above-mentioned stumbling block is, A high-pressure substrate processing device formed to rotate independently of contact between the upper plate, the sealing material, and the outer housing.

8. In paragraph 1, The above-mentioned fastening module, A high-pressure substrate processing device further comprising a driving unit formed to rotate the rotating member to rotate the above-described hook.

9. In paragraph 8, The above drive unit, A driven gear formed on the above rotating member; a driving gear meshing with the above driven gear; and A high-pressure substrate processing device comprising a motor that rotates the above-mentioned driving gear.

10. In paragraph 1, The above outer door, Further comprising an axial projection protruding downward from the upper plate, The above rotating member is, A high-pressure substrate processing device comprising a receiving groove for rotatably receiving the above-mentioned axle protrusion.

11. In paragraph 10, The above rotating member is, a base portion in which the above-mentioned receiving groove is formed; and It includes a protrusion formed to protrude downward from the above base portion, The above-mentioned fastening module, Further comprising a driving unit formed to drive the above-mentioned rotating member to rotate, The above drive unit, A driven gear formed on the outer surface of the above protrusion; a driving gear meshing with the above driven gear; and A high-pressure substrate processing device comprising a motor that rotates the above-mentioned driving gear.

12. A chamber having a housing formed to accommodate a substrate to be processed and a process gas supplied at a pressure higher than atmospheric pressure, and a door formed to move between a closed state that closes the housing and an open state that opens the housing; and It includes a fastening module having a support protrusion installed in the housing, a rotating member rotatably arranged with respect to the door, and a hooking protrusion formed to extend from the rotating member and arranged on the support protrusion. The above door, Including an upper plate that contacts the housing in the closed state, The above rotating member is, A high-pressure substrate processing device located on the lower side of the upper plate.

13. In paragraph 12, The above-mentioned stumbling block is, A high pressure substrate processing device positioned to be supported by the support protrusion as it rotates in the closed state.

14. In paragraph 12, The above-mentioned stumbling block is, A high-pressure substrate processing device comprising a catch surface facing the support protrusion and positioned at a higher level than the door.

15. In paragraph 12, The above process gas is, Contains a reactive gas containing an active gas and a protective gas which is an inert gas, The above housing, an internal housing formed to accommodate the above-described substrate to be processed and the above-described reaction gas; and An outer housing is included to accommodate the inner housing and is coupled to the inner housing to form a closed space that accommodates the protective gas together with the inner housing. The above door, A high pressure substrate processing device formed to close the inner housing.

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