X-ray detector

Abstract

The present invention provides an X-ray detector comprising: a sensor substrate; a sensor assembly including a phosphor layer or a photoelectric material layer and disposed on the front surface of the sensor substrate; a first waterproof film which coats the sensor assembly; and a second waterproof film which coats the first waterproof film and is made of a different material than the first waterproof film.

Description

X-ray detector {X-RAY DETECTOR}

[0001] The present invention relates to an X-ray detector.

[0002] In recent years, digital detectors have become widely used for X-ray photography.

[0003] X-ray detectors can experience performance degradation if moisture or oil penetrates their interior. To prevent this degradation, sealed structures are used. However, existing sealed structures lack sufficient moisture and oil repellency.

[0004] The present invention has a problem of providing an X-ray detector having a sealing structure that can effectively prevent moisture or oil penetration.

[0005] In order to achieve the above-described task, the present invention provides an X-ray detector comprising: a sensor assembly including a sensor substrate; a phosphor layer or a photoelectric material layer disposed on a front surface of the sensor substrate; a first waterproof film coating the sensor assembly; and a second waterproof film coating the first waterproof film and formed of a different material from the first waterproof film.

[0006] The first waterproof film can surround the entire sensor assembly, and the second waterproof film can cover the front of the first waterproof film.

[0007] It further includes an upper electrode formed under the phosphor layer or on the photoelectric material layer, and the upper electrode may extend to the outside of the phosphor layer or the photoelectric material layer.

[0008] One of the first and second waterproofing films may be formed of paraffin, and the other of the first and second waterproofing films may be formed of silicone or epoxy.

[0009] One of the first and second membranes formed by the above-mentioned parylin may be composed of a single membrane of parylin C or a double membrane of parylin N and parylin C.

[0010] It may further include a sealant covering the above phosphor layer or photoelectric material layer.

[0011] The above sealant may be made of a metal material and may be a common upper electrode that applies a bias voltage to the photoelectric material layer.

[0012] The above sealant and sensor assembly may further include an electromagnetic shielding sheet attached along the surface.

[0013] The sensor assembly coated with the first and second waterproof sheets may be inserted into an internal receiving space, and may further include a boot formed of a waterproof material; and a filler formed of a waterproof material that fills the receiving space into which the sensor assembly is inserted.

[0014] A case including a first case and a second case defining an internal space in which the boot with the sensor assembly inserted therein is accommodated; and a bonding material that bonds the first and second cases together may be further included.

[0015] According to the present invention, a fluorescent material layer or a photoelectric material layer that is vulnerable to moisture can be tightly sealed by surrounding it with a plurality of sealing members, and further, a detector module sealed with the sealing members can be placed inside a boot and then filled with a filler to seal it.

[0016] In this way, since the X-ray detector is equipped with a sealing structure that can substantially completely and firmly seal the phosphor layer or the photoelectric material layer, penetration of moisture or oil into the phosphor layer or the photoelectric material layer can be prevented to a very high degree.

[0017] Therefore, defects caused by moisture or oil penetration during manufacturing are prevented, thereby maximizing the yield.

[0018] FIG. 1 is a cross-sectional view schematically illustrating the configuration of an X-ray detector according to a first embodiment of the present invention.

[0019] FIG. 2 is a cross-sectional view schematically illustrating a detector module of an X-ray detector according to a first embodiment of the present invention.

[0020] FIG. 3 is a cross-sectional view schematically illustrating a sensor assembly and a sealing structure sealing the same according to a first embodiment of the present invention.

[0021] FIG. 4 is a cross-sectional view schematically illustrating a structure having an upper electrode extending outside a phosphor layer in an X-ray detector according to a first embodiment of the present invention.

[0022] Figure 5 is a cross-sectional view schematically illustrating the configuration of an X-ray detector according to a second embodiment of the present invention.

[0023] Figure 6 is a cross-sectional view schematically illustrating a detector module of an X-ray detector according to a second embodiment of the present invention.

[0024] Figure 7 is a cross-sectional view schematically illustrating a sensor assembly and a sealing structure sealing the same according to a second embodiment of the present invention.

[0025] FIG. 8 is a cross-sectional view schematically illustrating a structure having an upper electrode extending outside a photoelectric material layer in an X-ray detector according to a second embodiment of the present invention.

[0026] Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.

[0027] <First Embodiment>

[0028] Fig. 1 is a cross-sectional view schematically illustrating the configuration of an X-ray detector according to a first embodiment of the present invention. Fig. 2 is a cross-sectional view schematically illustrating a detector module of an X-ray detector according to a first embodiment of the present invention. Fig. 3 is a cross-sectional view schematically illustrating a sensor assembly and a sealing structure for sealing the same according to a first embodiment of the present invention.

[0029] Referring to FIGS. 1 to 3, the X-ray detector (10) according to the present embodiment may be configured, for example, in an indirect conversion method that converts an incident X-ray into visible light and then converts it into an electrical signal.

[0030] Such an X-ray detector (10) may include a detector module (100), a boot (or module cover) (400), and a case (or external case) (500).

[0031] Here, the detector module (100) may include a sensor assembly (110) and a plurality of sealing members that seal the sensor assembly (110).

[0032] First, the sensor assembly (110) may include a sensor substrate (120), a driving circuit board (130), and a fluorescent layer (140).

[0033] The phosphor layer (140) can be arranged in the direction in which X-rays are irradiated (or incident) in front of the sensor substrate (120). In other words, the phosphor layer (140) can be arranged on the upper surface, which is the front surface of the sensor substrate (120). Such a phosphor layer (140) can convert the incident X-rays into visible light.

[0034] This phosphor layer (140) may be composed of, for example, CsI (Cesium Iodide) or Gadolinium Oxysulfide (GoS or Gadox), but is not limited thereto.

[0035] The fluorescent layer (140) may be manufactured, for example, in the form of a film and attached to the light-incident surface, which is the upper surface of the sensor panel (120). As another example, the fluorescent layer (140) may be formed on the light-incident surface of the sensor panel (120) through a deposition process or the like.

[0036] The sensor substrate (120) may include an active region, which is a region that receives and detects visible light generated from the phosphor layer (140), and a non-active region located outside the active region. This sensor substrate (120) may be configured using a CMOS substrate or a TFT substrate.

[0037] Although not specifically shown, a pixel array in which a plurality of pixels are arranged may be configured in the active area of ​​the sensor substrate (120), and these plurality of pixels may be arranged in a matrix form along a plurality of row lines and a plurality of column lines.

[0038] Each pixel may be formed with a photodetector (or photodiode or light sensor) that detects incident visible light and generates a corresponding electrical signal.

[0039] The driving circuit board (130) may be placed on the rear of the sensor substrate (120), that is, it may be positioned on the opposite side from the fluorescent layer (140) with the sensor substrate (120) interposed therebetween. A driving circuit for driving the sensor substrate (120) may be mounted on the driving circuit board (130).

[0040] Meanwhile, a connector (135) for connection with an external system circuit may be mounted on the drive circuit board (130). A cable (CA) is connected to this connector (135), and an electrical connection with an external system circuit may be made through this cable (CA).

[0041] As above, the sensor assembly (110) of the present embodiment may be configured with a laminated structure of a driving circuit board (130), a sensor substrate (120), and a fluorescent layer (140).

[0042] Meanwhile, the phosphor layer (140) may be formed to expose the edge of the front surface of the sensor substrate (120). In other words, the edge area of ​​the sensor substrate (120) is not covered by the phosphor layer (140), and the area inside the edge area may be covered by the phosphor layer (140).

[0043] In this regard, for example, the fluorescent layer (140) can be arranged to correspond to the active area of ​​the sensor substrate (120), and the inactive area located at the edge of the sensor substrate (120) can be exposed without being covered by the fluorescent layer (140).

[0044] The sensor assembly (110) configured as above can be configured to be sealed by a plurality of sealing members.

[0045] In this regard, for example, a sealant (210), a sealing tape (or an electromagnetic wave shielding sheet) (220), a first waterproof film (or a first coating film) (230), and a second waterproof film (or a second coating film) (240) may be arranged in an outward direction in the sensor assembly (110).

[0046] The sealant (210) may be formed to cover the phosphor layer (140). In this regard, for example, the sealant material may be deposited through a sputtering process in a vacuum. In this way, the sealant (210) may directly seal the phosphor layer (140).

[0047] Here, the sealant material may be a metal, such as aluminum or gold, but is not limited thereto.

[0048] Accordingly, the sealant (210) can cover the upper and side surfaces of the phosphor layer (140), thereby sealing the phosphor layer (140) from the outside. Meanwhile, when the sealant (210) is formed in a vacuum, the penetration of additional moisture or oil can be prevented, and air bubbles inside the phosphor layer (140) can be removed.

[0049] Meanwhile, in the present embodiment, as illustrated in FIG. 4, the upper electrode (UE) of the photodetector may be configured to extend outwardly from beneath the phosphor layer (140). In this regard, the upper electrode (UE) of the photodetector to which a bias voltage (or reverse voltage) is applied may be formed substantially over the entire active region, and this upper electrode (UE) may extend outwardly from the phosphor layer (140) positioned thereon.

[0050] The upper electrode (UE) portion extended outward in this way is covered by the sealant (210) and can come into contact with the sealant (210).

[0051] Accordingly, the phosphor layer (140) can be completely sealed by being surrounded by the sealant (210) and the upper electrode (UE). By this sealing structure, the penetration of moisture or oil into the phosphor layer (140) can be further prevented.

[0052] The sealing tape (220) can be attached along the surface of the sensor assembly (110) on which the sealant (210) is formed. In this regard, for example, the sealing tape (220) can be formed in a form that covers the upper and side surfaces of the sealant (210), the upper surface of the edge of the sensor substrate (120), the side surfaces of the sensor substrate (120) and the driving circuit board (130), and the lower surface of the edge of the driving circuit board (130).

[0053] Here, the sealing tape (220) attached to the lower surface of the driving circuit board (130) may be configured to contact the ground terminal of the driving circuit board (130). This sealing tape (220) may be formed of a shielding material having the property of shielding electromagnetic waves.

[0054] By attaching the sealing tape (220) in this way, noise in front of the sensor substrate (120) can be minimized. Furthermore, the sealing tape (220) can perform the function of preventing surface scratches of the fluorescent layer (140).

[0055] The first waterproof film (230) can be formed to cover, for example, the entire outer surface of the sensor assembly (110) to which the sealing tape (220) is attached.

[0056] For example, the first waterproof film material can be coated on the entire outer surface of the sensor assembly (110) to which the sealing tape (220) is attached. Accordingly, the upper surface, side surfaces, and lower surface of the sensor assembly (110) to which the sealing tape (220) is attached can be completely sealed by the first waterproof film (230).

[0057] This first waterproofing film (230) may be formed of, for example, parylene. In this case, the first waterproofing film (230) may be formed of at least one of parylene C and parylene N.

[0058] For example, the first waterproof film (230) may be formed as a single film of paraffin C. In this case, the first waterproof film may have a thickness of approximately 15 μm or less.

[0059] As another example, the first waterproofing film (230) may be formed of a double film (or hybrid film) of parylene N and parylene C. In this case, in the first waterproofing film (230), a primary waterproofing film of parylene N is formed first, which may have a thickness of approximately 2 μm or less, and then a secondary waterproofing film of parylene C is formed, which may have a thickness of approximately 10 μm.

[0060] By forming the first waterproof film (230) as described above, microscopic holes that may exist when forming the aforementioned sealant (210) and sealing tape (220) can be filled. Furthermore, the first waterproof film (230) has excellent resistance to gases and chemicals, and thus can prevent their penetration.

[0061] The second waterproof film (240) may be formed to cover, for example, the front surface (or upper surface) of the sensor assembly (110) sealed with the first waterproof film (230). As another example, the second waterproof film (240) may be formed to cover the entire outer surface of the first waterproof film (230).

[0062] For example, the second waterproofing material can be coated on the front surface of the first waterproofing film (230). Accordingly, the front of the sensor assembly (110) can be sealed by the first waterproofing film (230) and the second waterproofing film (240).

[0063] This second waterproofing film (240) may be formed of a different material from the first waterproofing film (230) within it. For example, the second waterproofing film (240) may be formed of silicone or epoxy. Here, the second waterproofing film (240) may be formed by applying a liquid material or by spraying it.

[0064] In this way, by additionally forming a second waterproof film (240), moisture penetration can be further prevented. In addition, by forming the second waterproof film (240), the flatness of the front portion of the sensor substrate (120) can be substantially improved, thereby minimizing image distortion due to poor surface condition.

[0065] Meanwhile, the materials forming the first and second waterproofing films (230, 240) described above can be interchanged. In other words, the first waterproofing film (230) can be formed of silicone or epoxy, and the second waterproofing film (240) can be formed of paraffin.

[0066] The detector module (100) configured as above can be inserted and accommodated within a boot (400). In this regard, the boot (400) can have an accommodation space therein, and the detector module (100) can be inserted into the accommodation space within the boot (400).

[0067] Here, the boot (400) may be formed of a waterproof material, for example, silicone material, but is not limited thereto.

[0068] In this way, after the detector module (100) is inserted into the boot (400), the filler (300) can be injected into the receiving space of the boot (400). Accordingly, the receiving space of the boot (400) into which the detector module (100) is inserted can be filled with the filler (300). In other words, the space between the inner surface of the boot (400) and the detector module (100) can be filled with the filler (300).

[0069] After the filler (300) is injected in this manner, a curing process is performed, for example, in a vacuum chamber, to harden the filler (300).

[0070] In this way, by filling the space within the boot (400) into which the detector module (100) is inserted with a filler (300), air, gas, and empty space within the boot (400) that may affect the detector module (100) can be minimized.

[0071] The filler (300) may be formed of, for example, a waterproof material, such as a polymer material that is substantially free of oil. For example, the filler (300) may be formed of epoxy, but is not limited thereto. Meanwhile, the epoxy forming the filler (300) may be an epoxy having the same composition as the second waterproofing film (240), but is not limited thereto.

[0072] As above, the detector module (100) accommodated in the boot (400) can be encased in a case (500).

[0073] In this regard, the case (500) may be composed of an upper case (or first case) (510) and a lower case (520), and the upper case (510) and the lower case (520) may be combined to provide an accommodation space therein.

[0074] In the internal storage space of this case (500), a detector module (100) coupled with a boot (400) can be inserted and accommodated.

[0075] In this regard, for example, a detector (100) coupled with a boot (400) may be installed inside a lower case (520), and then the upper case (510) may be covered and coupled with the lower case (520).

[0076] Here, a bonding material (or sealing material) (550) may be used to bond and secure the upper case (510) and the lower case (520) to each other. For this purpose, the bonding material (550) may be formed by coating along the inner bonding portions of the upper case (510) and the lower case (520).

[0077] Such a bonding material (550) may be a waterproof material, for example, epoxy, but is not limited thereto.

[0078] These bonding materials (550) may be positioned to adhere to (or contact) the side of the corresponding boot (400).

[0079] Meanwhile, a cushioning material (560) may be interposed between the front surface of the boot (400) and the corresponding inner surface of the case (500). This cushioning material (560) may be formed of, for example, epoxy as a waterproof material, similar to the bonding material (550).

[0080] As described above, in the X-ray detector of the present embodiment, the phosphor layer, which is vulnerable to moisture, is tightly sealed by surrounding it with a plurality of sealing members, and further, the detector module sealed with the sealing members is placed in a boot and then filled with a filler to seal it.

[0081] In this way, the X-ray detector is provided with a sealing structure capable of substantially completely and firmly sealing the phosphor layer, so that penetration of moisture or oil into the phosphor layer can be prevented to a very high degree.

[0082] Therefore, defects caused by moisture or oil penetration during manufacturing are prevented, thereby maximizing the yield.

[0083] <Second Embodiment>

[0084] Fig. 5 is a cross-sectional view schematically illustrating the configuration of an X-ray detector according to a second embodiment of the present invention. Fig. 6 is a cross-sectional view schematically illustrating a detector module of an X-ray detector according to a second embodiment of the present invention. Fig. 7 is a cross-sectional view schematically illustrating a sensor assembly and a sealing structure for sealing the same according to a second embodiment of the present invention.

[0085] In this embodiment, a detailed description of a configuration identical to or similar to the first embodiment described above may be omitted.

[0086] Referring to FIGS. 5 to 7, the X-ray detector (10) according to the present embodiment, unlike the first embodiment, can be configured in a direct conversion manner that directly detects the incident X-ray and converts it into an electric signal.

[0087] Such an X-ray detector (10) may include a detector module (100), a boot (or module cover) (400), and a case (or external case) (500).

[0088] Here, the detector module (100) may include a sensor assembly (110) and a plurality of sealing members that seal the sensor assembly (110).

[0089] First, the sensor assembly (110) may include a sensor substrate (120), a photoelectric material layer (or photoconductive layer) (150), and a driving circuit board (130).

[0090] In this way, since the X-ray detector (10) of the present embodiment is configured in a direct conversion manner, unlike the first embodiment, the phosphor layer of the first embodiment is not provided, and instead, a photoelectric material layer (150) that directly detects X-rays and generates an electric signal can be arranged.

[0091] This photoelectric material layer (150) can be formed on the upper surface of the sensor substrate (120), and can be formed of, for example, perovskite, but is not limited thereto.

[0092] Meanwhile, although not specifically illustrated, a lower electrode may be formed for each pixel unit under the photoelectric material layer (150). In addition, an upper electrode (UE) may be formed on the photoelectric material layer (150), as illustrated in FIG. 8.

[0093] Meanwhile, the sensor substrate (120) can be configured using a CMOS substrate or a TFT substrate.

[0094] The driving circuit board (130) may be placed on the rear of the sensor substrate (120), that is, it may be positioned on the opposite side from the photoelectric material layer (150) with the sensor substrate (120) interposed therebetween. A driving circuit for driving the sensor substrate (120) may be mounted on the driving circuit board (130).

[0095] Meanwhile, a connector (135) for connection with an external system circuit may be mounted on the drive circuit board (130). A cable (CA) is connected to this connector (135), and an electrical connection with an external system circuit may be made through this cable (CA).

[0096] As above, the sensor assembly (110) of the present embodiment may be configured with a laminated structure of a driving circuit board (130), a sensor substrate (120), and a photoelectric material layer (150).

[0097] Meanwhile, the photoelectric material layer (150) may be formed to expose the edge of the front surface of the sensor substrate (120). In other words, the edge area of ​​the sensor substrate (120) is not covered by the photoelectric material layer (150), and the area inside the edge area may be covered by the photoelectric material layer (150).

[0098] In this regard, for example, the photoelectric material layer (150) can be arranged to correspond to the active area of ​​the sensor substrate (120), and the inactive area located at the edge of the sensor substrate (120) can be exposed without being covered by the photoelectric material layer (150).

[0099] The sensor assembly (110) configured as above can be configured to be sealed by a plurality of sealing members.

[0100] In this regard, for example, a sealant (210), a sealing tape (or an electromagnetic wave shielding sheet) (220), a first waterproof film (or a first coating film) (230), and a second waterproof film (or a second coating film) (240) may be arranged in an outward direction in the sensor assembly (110).

[0101] The sealant (210) may be formed to cover the photoelectric material layer (150). In this regard, for example, the sealant material may be deposited through a sputtering process in a vacuum. In this way, the sealant (210) may directly seal the photoelectric material layer (150).

[0102] Here, the sealant material may be a metal, such as aluminum or gold, but is not limited thereto.

[0103] Accordingly, the sealant (210) can cover the upper surface and side surfaces of the photovoltaic material layer (150), thereby sealing the photovoltaic material layer (150) from the outside. Meanwhile, when the sealant (210) is formed in a vacuum, additional moisture or oil penetration can be prevented, and air bubbles inside the photovoltaic material layer (150) can be removed. At this time, the sealant (210) can also serve as an upper electrode of the photovoltaic material layer (150). That is, the sealant (210) is a metal material that directly contacts the photovoltaic material layer (150), and can serve as a common upper electrode to which a bias voltage (or reverse voltage) is applied to the photovoltaic material layer (150) together with the lower electrode of each pixel unit below the photovoltaic material layer (150).

[0104] Meanwhile, in the present embodiment, as illustrated in FIG. 8, the upper electrode (UE) of the photodetector may be provided separately and configured to extend outward on the photoconductive material layer (150). In this regard, the upper electrode (UE) of the photodetector to which a bias voltage (or reverse voltage) is applied may be formed substantially over the entire active region, and such upper electrode (UE) may extend outward of the photoconductive material layer (150) positioned thereunder.

[0105] The upper electrode (UE) extended outward in this way is covered by the sealant (210) and can come into contact with the sealant (210).

[0106] In this case, the photoelectric material layer (150) can be double-covered by the sealant (210) and the upper electrode (UE) to achieve a more sealed state. With this sealing structure, the penetration of moisture or oil into the photoelectric material layer (150) can be further prevented.

[0107] The sealing tape (220) can be attached along the surface of the sensor assembly (110) on which the sealant (210) is formed. In this regard, for example, the sealing tape (220) can be formed in a form that covers the upper and side surfaces of the sealant (210), the upper surface of the edge of the sensor substrate (120), the side surfaces of the sensor substrate (120) and the driving circuit board (130), and the lower surface of the edge of the driving circuit board (130).

[0108] Here, the sealing tape (220) attached to the lower surface of the driving circuit board (130) may be configured to contact the ground terminal of the driving circuit board (130). This sealing tape (220) may be formed of a shielding material having the property of shielding electromagnetic waves.

[0109] By attaching the sealing tape (220) in this way, noise in front of the sensor substrate (120) can be minimized. Furthermore, the sealing tape (220) can perform the function of preventing surface scratches of the photoelectric material layer (150).

[0110] The first waterproof film (230) can be formed to cover, for example, the entire outer surface of the sensor assembly (110) to which the sealing tape (220) is attached.

[0111] For example, the first waterproof film material can be coated on the entire outer surface of the sensor assembly (110) to which the sealing tape (220) is attached. Accordingly, the upper surface, side surfaces, and lower surface of the sensor assembly (110) to which the sealing tape (220) is attached can be completely sealed by the first waterproof film (230).

[0112] This first waterproofing film (230) may be formed of, for example, parylene. In this case, the first waterproofing film (230) may be formed of at least one of parylene C and parylene N.

[0113] For example, the first waterproof film (230) may be formed as a single film of paraffin C. In this case, the first waterproof film may have a thickness of approximately 15 μm or less.

[0114] As another example, the first waterproofing film (230) may be formed of a double film (or hybrid film) of parylene N and parylene C. In this case, in the first waterproofing film (230), a primary waterproofing film of parylene N is formed first, which may have a thickness of approximately 2 μm or less, and then a secondary waterproofing film of parylene C is formed, which may have a thickness of approximately 10 μm.

[0115] By forming the first waterproof film (230) as described above, microscopic holes that may exist when forming the aforementioned sealant (210) and sealing tape (220) can be filled. Furthermore, the first waterproof film (230) has excellent resistance to gases and chemicals, and thus can prevent their penetration.

[0116] The second waterproof film (240) may be formed to cover, for example, the front surface (or upper surface) of the sensor assembly (110) sealed with the first waterproof film (230). As another example, the second waterproof film (240) may be formed to cover the entire outer surface of the first waterproof film (230).

[0117] For example, the second waterproofing material can be coated on the front surface of the first waterproofing film (230). Accordingly, the front of the sensor assembly (110) can be sealed by the first waterproofing film (230) and the second waterproofing film (240).

[0118] This second waterproofing film (240) may be formed of a different material from the first waterproofing film (230) within it. For example, the second waterproofing film (240) may be formed of silicone or epoxy. Here, the second waterproofing film (240) may be formed by applying a liquid material or by spraying it.

[0119] In this way, by additionally forming a second waterproof film (240), moisture penetration can be further prevented. In addition, by forming the second waterproof film (240), the flatness of the front portion of the sensor substrate (120) can be substantially improved, thereby minimizing image distortion due to poor surface condition.

[0120] Meanwhile, the materials forming the first and second waterproofing films (230, 240) described above can be interchanged. In other words, the first waterproofing film (230) can be formed of silicone or epoxy, and the second waterproofing film (240) can be formed of paraffin.

[0121] The detector module (100) configured as above can be inserted and accommodated within a boot (400). In this regard, the boot (400) can have an accommodation space therein, and the detector module (100) can be inserted into the accommodation space within the boot (400).

[0122] Here, the boot (400) may be formed of a waterproof material, for example, silicone material, but is not limited thereto.

[0123] In this way, after the detector module (100) is inserted into the boot (400), the filler (300) can be injected into the receiving space of the boot (400). Accordingly, the receiving space of the boot (400) into which the detector module (100) is inserted can be filled with the filler (300). In other words, the space between the inner surface of the boot (400) and the detector module (100) can be filled with the filler (300).

[0124] After the filler (300) is injected in this manner, a curing process is performed, for example, in a vacuum chamber, to harden the filler (300).

[0125] In this way, by filling the space within the boot (400) into which the detector module (100) is inserted with a filler (300), air, gas, and empty space within the boot (400) that may affect the detector module (100) can be minimized.

[0126] The filler (300) may be formed of, for example, a waterproof material, such as a polymer material that is substantially free of oil. For example, the filler (300) may be formed of epoxy, but is not limited thereto. Meanwhile, the epoxy forming the filler (300) may be an epoxy having the same composition as the second waterproofing film (240), but is not limited thereto.

[0127] As above, the detector module (100) accommodated in the boot (400) can be encased in a case (500).

[0128] In this regard, the case (500) may be composed of an upper case (or first case) (510) and a lower case (520), and the upper case (510) and the lower case (520) may be combined to provide an accommodation space therein.

[0129] In the internal storage space of this case (500), a detector module (100) coupled with a boot (400) can be inserted and accommodated.

[0130] In this regard, for example, a detector (100) coupled with a boot (400) may be installed inside a lower case (520), and then the upper case (510) may be covered and coupled with the lower case (520).

[0131] Here, a bonding material (or sealing material) (550) may be used to bond and secure the upper case (510) and the lower case (520) to each other. For this purpose, the bonding material (550) may be formed by coating along the inner bonding portions of the upper case (510) and the lower case (520).

[0132] Such a bonding material (550) may be a waterproof material, for example, epoxy, but is not limited thereto.

[0133] These bonding materials (550) may be positioned to adhere to (or contact) the side of the corresponding boot (400).

[0134] Meanwhile, a cushioning material (560) may be interposed between the front surface of the boot (400) and the corresponding inner surface of the case (500). This cushioning material (560) may be formed of, for example, epoxy as a waterproof material, similar to the bonding material (550).

[0135] As described above, in the X-ray detector of the present embodiment, the photoelectric material layer, which is vulnerable to moisture, is tightly sealed by surrounding it with a plurality of sealing members, and further, the detector module sealed with the sealing members is placed inside a boot and then filled with a filler to seal it.

[0136] In this way, the X-ray detector is equipped with a sealing structure that can substantially completely and firmly seal the photoelectric material layer, so that penetration of moisture or oil into the photoelectric material layer can be prevented to a very high degree.

[0137] Therefore, defects caused by moisture or oil penetration during manufacturing are prevented, thereby maximizing the yield.

[0138] The above-described embodiments of the present invention are merely examples of the present invention, and may be freely modified within the scope encompassed by the spirit of the present invention. Accordingly, the present invention includes modifications of the present invention within the scope of the appended claims and their equivalents.

Claims

1. A sensor assembly including a sensor substrate and a phosphor layer or photoelectric material layer arranged on the front surface of the sensor substrate; A first waterproof film coating the above sensor assembly; Coating the first waterproof film, and forming a second waterproof film with a different material from the first waterproof film An X-ray detector including:

2. In paragraph 1, The above first waterproof film surrounds the entire sensor assembly, The above second waterproof film covers the front of the above first waterproof film. X-ray detector.

3. In paragraph 1, Further comprising an upper electrode formed under the phosphor layer or on the photoelectric material layer, The upper electrode extends to the outside of the phosphor layer or the outside of the photoelectric material layer. X-ray detector.

4. In paragraph 1, One of the first and second waterproofing films is formed of paraffin, and the other of the first and second waterproofing films is formed of silicone or epoxy. X-ray detector.

5. In paragraph 4, One of the first and second membranes formed by the above-mentioned parylin is composed of a single membrane of parylin C or a double membrane of parylin N and parylin C. X-ray detector.

6. In paragraph 1, An X-ray detector further comprising a sealant covering the phosphor layer or photoelectric material layer.

7. In paragraph 6, The above sealant is an X-ray detector made of a metal material and is a common upper electrode that applies a bias voltage to the photoelectric material layer.

8. In paragraph 6, An X-ray detector further comprising an electromagnetic shielding sheet attached along the surface of the sealant and sensor assembly.

9. In paragraph 1, The sensor assembly coated with the first and second waterproof sheets is inserted into the internal receiving space, and a boot formed of a waterproof material; A filler formed of a waterproof material that fills the space in which the above sensor assembly is inserted. An X-ray detector further comprising:

10. In paragraph 9, A case comprising a first case and a second case defining an internal space in which the boot with the sensor assembly inserted therein is accommodated; A bonding agent that combines the above cases 1 and 2 An X-ray detector further comprising:

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