Water washing and degumming system for monocrystalline silicon wafer and degumming process therefor

Abstract

A water washing and degumming system for a monocrystalline silicon wafer and a degumming process therefor. The system comprises a basic driving mechanism (1) arranged as a drive. The basic driving mechanism (1) comprises a stable base plate (101), a cleaning table (102) is fixedly connected to the top portion of the stable base plate (101), and two cleaning and mounting mechanisms (2) are arranged on the inner side of the basic driving mechanism (1). In addition, with the coordination between an electric telescopic rod (117) and a gear cylinder (112), the two cleaning and mounting mechanisms (2) can operate in alternative, so that one can be used to clean a silicon wafer and the other one is to be replaced by staff. By mounting a first arc block (111) used in coordination with a second arc block (223) on the top portion of an inner cavity of a support linkage wall (103), the arrangement of the structures can enable the first arc block (111) and the second arc block (223) to abut against each other by raising a load-bearing connecting plate (202), so that the second arc block (223) is used to push an arc-shaped friction ring (225) into contact with a rotating rod (205) to increase a friction force, so as to stop and fasten the rotating rod (205).

Description

A single crystal silicon wafer water washing and degumming system and degumming process

[0001] This application claims priority to the Chinese patent application filed with the China Patent Office on September 8, 2023, with application number 202311155612.3 and application name “A single crystal silicon wafer water washing and degumming system and its degumming process”, the entire contents of which are incorporated by reference into this application. Technical Field

[0002] The embodiments of the present application relate to, but are not limited to, the technical field of single crystal silicon wafer degumming, and specifically to a single crystal silicon wafer water washing and degumming system and a degumming process thereof. Background Art

[0003] Monocrystalline silicon is a relatively active non-metallic element and an important component of crystalline materials. It is at the forefront of new material development. During the production process of monocrystalline silicon wafers, they must be strictly cleaned. However, the cleaning effect of existing silicon wafer water washing equipment is poor. After cleaning, the surface of the silicon wafers is not completely debonded, which reduces the yield of monocrystalline silicon wafers and is not conducive to the production of monocrystalline silicon wafers. Patent documents have now been issued to improve this.

[0004] As disclosed in the patent with publication number CN217797609U, a single crystal silicon wafer water washing and degumming device comprises an outer protective degumming cabinet, a degumming tank is provided inside the outer protective degumming cabinet, a lifting and fixing platform is provided inside the degumming tank, a hydraulic base is provided in the internal structure of the lifting and fixing platform, a hydraulic lifting rod is provided at the output end of the hydraulic base, a control platform is provided at the other end of the hydraulic lifting rod, a driving motor is provided inside the control platform, a threaded screw is fixedly connected to the output end of the driving motor, and the threaded screw is externally threadedly connected to a moving block, and the threaded screw fixedly connected to its output end can be driven to rotate by the driving motor provided inside the driving motor.

[0005] Although the above-mentioned document can clamp and fix the silicon wafer and increase the water temperature to effectively remove the colloid on the surface of the silicon wafer, it does not meet the production requirements in actual use, such as:

[0006] Monocrystalline silicon wafers are mostly produced in large batches, but this equipment can only wash and debond a single silicon wafer, and each cleaning process takes a long time. Therefore, the cleaning efficiency is not high and cannot meet the needs of production. If several equipment are set up at the same time, the equipment cost and labor cost will increase.

[0007] Therefore, a single crystal silicon wafer water washing and degumming system that can meet the needs of large-scale single crystal silicon wafer production is now designed to solve such defects. Summary of the Invention

[0008] The following is a summary of the subject matter described in detail herein. This summary is not intended to limit the scope of the claims.

[0009] The embodiment of the present invention provides a single crystal silicon wafer water washing and degumming system and a degumming process thereof, which solves the problem that the existing single crystal silicon wafer degumming equipment is low in efficiency and unsuitable for common production use.

[0010] To achieve the above objectives, an embodiment of the present invention is implemented through the following technical solutions: a single crystal silicon wafer water washing and degumming system, including a basic driving mechanism for driving, and cleaning and installation mechanisms for degumming are provided on both sides of the basic driving mechanism, and the number of cleaning and installation mechanisms is set to two.

[0011] Preferably, the basic driving mechanism includes a stable base plate, the top of the stable base plate is fixedly connected to a washing table, the rear side of the washing table is fixedly connected to a supporting linkage wall, both sides of the surface of the supporting linkage wall are fixedly connected to slide plates, and both sides of the top of the washing table are provided with washing pools for use in conjunction with the cleaning installation mechanism, and the two cleaning installation mechanisms are respectively arranged on the inner sides of the washing pools.

[0012] Preferably, the cleaning installation mechanism includes a slider seat, and the slider seat is slidably installed on the inner side of the slide plate, the surface of the slider seat is fixedly connected to the load-bearing connecting plate, the front end of the load-bearing connecting plate is fixedly connected to the sliding ring, the inner side of the sliding ring is provided with a sliding cylinder, the inner side of the sliding cylinder is rotatably connected to a rotating rod, the lower part of the surface of the rotating rod is fixedly connected to a polygonal sleeve rod, the surface of the polygonal sleeve rod is slidably installed with a polygonal rotating column, the surface of the polygonal rotating column is provided with a rotation limit groove, and a plurality of rotation limit grooves are arranged in a ring shape, and the bottom of the rotating rod is rotatably connected to an inner tooth ring frame through a bearing member.

[0013] Preferably, the surface of the rotating rod is fixedly connected to a sealing plate used in conjunction with the inner tooth ring frame, and the number of sealing plates is the same as the number of rotation limit grooves. The surface of the polygonal rotating column is fixedly connected to a fixed plug-in frame between two adjacent rotation limit grooves, and multiple fixed plug-in frames are provided. The surface of the rotating rod is fixedly connected to a multi-faceted lifting plate located between the inner tooth ring frame and the polygonal sleeve rod. A first spring is fixedly connected between the multi-faceted lifting plate and the polygonal rotating column. The surface of the multi-faceted lifting plate is fixedly connected to a supporting bottom plug-in plate used in conjunction with the fixed plug-in frame.

[0014] Preferably, the top of the inner cavity of the rotation limit groove is rotatably connected to a reciprocating threaded rod through a bearing member, and the bottom end of the reciprocating threaded rod passes through the sealing plate and extends to the inner side of the inner tooth ring frame, the surface of the reciprocating threaded rod and the inner side of the rotation limit groove are threadedly connected to the limiting threaded sleeve, and both sides of the surface of the limiting threaded sleeve are fixedly connected to a scraping brush plate used in conjunction with the fixed plug-in frame, and the bottom of the inner tooth ring frame is annularly opened with a through circular opening used in conjunction with the reciprocating threaded rod, and the surface of the reciprocating threaded rod and the inner side of the inner tooth ring frame are slidably installed with an inner limiting gear ring meshing with the inner tooth ring frame, and the bottom of the inner tooth ring frame is fixedly connected to a multi-angle positioning block.

[0015] Preferably, the two opposite sides of the load-bearing connecting plates are fixedly connected with toothed plates through brackets, the top of the load-bearing connecting plate is provided with a limit push groove extending to the bottom, a second arc block is slidably installed on the inner side of the limit push groove, a second spring is fixedly connected between the second arc block and the front part of the inner cavity of the limit push groove, the bottom of the second arc block is fixedly connected with an arc friction ring used in conjunction with the rotating rod through the bracket, and the top of the rotating rod is fixedly connected with a polygonal conical plug rod.

[0016] Preferably, the top of the support linkage wall is fixedly connected to the motor through a bracket, and the output shaft of the motor is fixedly connected to the rotating rod through a coupling, and the bottom end of the rotating rod passes through the support linkage wall and extends to the inner side of the support linkage wall, and the upper and lower surfaces of the rotating rod and located on the inner side of the support linkage wall are fixedly connected to the second pulley, and both sides of the top of the inner cavity of the support linkage wall are rotatably connected to the first pulley through the bearing frame, and the second pulley is connected to the first pulley through a belt transmission, and both sides of the top of the inner cavity of the support linkage wall are fixedly connected to the first arc block used in conjunction with the second arc block through the bracket, and the rear end of the inner cavity of the support linkage wall is rotatably connected to the gear cylinder used in conjunction with the tooth plate through the bearing member.

[0017] Preferably, circular lifting openings for cooperating with the polygonal conical insertion rod are provided on both sides of the top of the support linkage wall, and a rectangular lifting opening for cooperating with the tooth plate is provided on the rear side of the top of the support linkage wall. A limited movement groove is provided at the rear of the support linkage wall, and both sides of the top of the inner cavity of the support linkage wall are fixedly connected with a lower push rod for cooperating with the polygonal rotating column through a bracket, and an electric telescopic rod is fixedly installed on the rear of the support linkage wall, and the top of the electric telescopic rod is fixedly connected to the right tooth plate through a fixing plate, and the bottom of the inner cavity of the cleaning pool is fixedly connected with a polygonal slot seat for cooperating with the polygonal positioning block through an opening.

[0018] The present invention also discloses a process for washing and degumming a single crystal silicon wafer, which specifically comprises the following steps:

[0019] S1: When in use, first inject cleaning liquid into the inner side of the cleaning tank, then insert the single crystal silicon wafers into the inner side of the fixed plug-in frame on the right side, and dock the bottom of the silicon wafer with the inner side of the supporting bottom plug-in board. After all the installation is completed, go to step S2;

[0020] S2. After the cleaning and installation mechanism on the right side has installed the silicon wafer, the electric telescopic rod is started. The electric telescopic rod pulls the fixed plug-in frame on the right side to descend under the limit of the slide plate. The load-bearing connecting plate drives the rotating rod and the polygonal rotating column to descend through the action of the sliding ring and the sliding cylinder. The polygonal rotating column, the fixed plug-in frame and the supporting bottom plug-in plate are also lowered to the inner side of the cleaning tank to completely immerse the silicon wafer in the liquid. The polygonal positioning block is inserted into the polygonal slot seat to fix the inner tooth ring frame. At the same time, the multi-faceted lifting plate loses the pull of the rotating rod and descends to separate the supporting bottom plug-in plate from the fixed plug-in frame. The silicon wafer is inserted into the inner side of the fixed plug-in frame. At the same time, the polygonal The tapered plug rod is inserted into the inner side of the first pulley and docked, and then the motor is started. The two rotating rods are driven to rotate through the action of the second pulley, the first pulley and the belt. The rotating rod drives the entire polygonal rotating column to rotate through the polygonal sleeve rod. The rotation of the fixed plug-in frame drives water to impact the silicon wafer. The polygonal rotating column drives multiple inner limit gear rings to revolve at the same time. The engagement of the inner limit gear ring and the inner tooth ring frame drives the reciprocating threaded rod to rotate. The rotation of the reciprocating threaded rod drives the limit thread sleeve to move up and down under the limit of the rotation limit groove, and the scraping brush plate wipes both sides of the silicon wafer clean, and then goes to step S3;

[0021] When the load-bearing connecting plate rises to the top, the first arc block and the second arc block push the arc friction ring forward and resist against the rotating rod to fix the rotating rod to prevent rotation, making it convenient to replace the silicon wafer.

[0022] Preferably, in steps S2 and S3, the two cleaning and installation mechanisms are arranged in an alternating manner.

[0023] Still other aspects will become apparent upon reading and understanding the accompanying drawings and detailed description. Beneficial effects

[0024] The embodiment of the present invention provides a system and process for washing and degumming a single crystal silicon wafer. The system has the following beneficial effects:

[0025] (1) The single crystal silicon wafer water washing and degumming system is provided with two cleaning installation mechanisms on the inner side of the basic driving mechanism. At the same time, with the cooperation of the electric telescopic rod and the gear cylinder, the two cleaning installation mechanisms can be operated alternately. One can clean the silicon wafer, and the other is convenient for the staff to replace. In addition, the rise and fall of a single cleaning installation mechanism can perform different functions. When it is lowered and rotated, the surface glue can be efficiently removed by the scraping brush plate and the impact force of water. When it is raised, the silicon wafer can be lifted up by the supporting bottom plug plate. At the same time, the arc-shaped friction ring limits the rotating rod, which is convenient for the staff to replace. It effectively improves the cleaning efficiency of the silicon wafer and is easy to use, which meets the current use.

[0026] (2) The single crystal silicon wafer water washing and degumming system is characterized by rotating an inner tooth ring frame connected to the bottom end of the rotating rod, and a reciprocating threaded rod connected to the inner side of the rotating limit groove, and the surfaces of the reciprocating threaded rod are respectively connected to the limit thread sleeve and the inner limit gear ring, and are used in conjunction with a polygonal slot seat and a polygonal positioning block. When the rotating rod rotates, the inner tooth ring frame is first fixed by the polygonal slot seat, and then the multiple inner limit gear rings drive the reciprocating threaded rod to rotate under the meshing of the inner tooth ring frame, so that the scraping brush plate removes the glue on the surface of the silicon wafer on the adjacent side, thereby improving the degumming efficiency and quality.

[0027] (3) The single crystal silicon wafer water washing and degumming system is provided with a first arc block which is used in conjunction with a second arc block installed on the top of the inner cavity of the supporting linkage wall. The arrangement of these structures can make the first arc block and the second arc block offset each other through the rise of the load-bearing connecting plate, and use the second arc block to push the arc friction ring to contact the rotating rod to increase the friction force, stop and fix the rotating rod, so that the staff can be more stable when taking and installing the silicon wafers.

[0028] (4) The single crystal silicon wafer water washing and degumming system is a system in which a plurality of supporting bottom insert plates are installed under the surface of the rotating rod using a multi-faceted lifting plate for use with a fixed plug-in frame. The arrangement of these structures can allow the silicon wafer to be completely immersed in the inner side of the fixed plug-in frame when descending, making it easy to clean. When ascending, the silicon wafer is pushed out from the inner side of the fixed plug-in frame by the supporting bottom insert plates, making it easy to take out. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] FIG1 is a schematic structural diagram of an embodiment of the present invention;

[0030] FIG2 is a cross-sectional view of a cleaning station structure provided by an embodiment of the present invention;

[0031] FIG3 is a schematic diagram of a second pulley, a belt, and a first arc-shaped block structure provided by an embodiment of the present invention;

[0032] FIG4 is a schematic diagram of a rectangular lift opening, a position-limiting movable groove, a lower support rod, and an electric telescopic rod structure provided by an embodiment of the present invention;

[0033] FIG5 is a schematic diagram of a cleaning and installation mechanism structure provided by an embodiment of the present invention;

[0034] FIG6 is a schematic diagram of a rotating rod, a polygonal sleeve rod, and a polygonal tapered insertion rod structure provided by an embodiment of the present invention;

[0035] FIG7 is a partial enlarged view of point A in FIG6 provided by an embodiment of the present invention;

[0036] FIG8 is a partial enlarged view of point B in FIG6 provided by an embodiment of the present invention;

[0037] FIG9 is a schematic diagram of the structure of the inner tooth ring frame, the through circular opening and the multi-angle positioning block provided in an embodiment of the present invention;

[0038] 10 is a schematic diagram of a fixed plug-in frame, a multi-sided lifting plate and a supporting bottom plug-in plate structure provided in an embodiment of the present invention;

[0039] FIG11 is a schematic diagram of a structure of a reciprocating threaded rod, a limiting threaded sleeve, and a scraping brush plate provided in an embodiment of the present invention;

[0040] FIG12 is a partial enlarged view of point C in FIG11 provided by an embodiment of the present invention.

[0041] In the figure: 1. Basic drive mechanism; 2. Cleaning installation mechanism; 101. Stable bottom plate; 102. Cleaning table; 103. Support linkage wall; 104. Slide plate; 105. Cleaning tank; 106. Motor; 107. Rotating rod; 108. First pulley; 109. Second pulley; 110. Belt; 111. First arc block; 112. Gear cylinder; 113. Circular lifting port; 114. Rectangular lifting port; 115. Limiting moving slot; 116. Lower support rod; 117. Electric telescopic rod; 118. Multi-angle slot seat; 201. Slider seat; 202. Load-bearing connecting plate; 203. Sliding ring; 204. Sliding Cylinder; 205, rotating rod; 206, polygonal sleeve rod; 207, polygonal rotating column; 208, rotation limit groove; 209, inner tooth ring frame; 210, sealing plate; 211, fixed plug-in frame; 212, multi-faceted lifting plate; 213, supporting bottom plug-in plate; 214, reciprocating threaded rod; 215, limit thread sleeve; 216, scraping brush plate; 217, through-hole; 218, polygonal positioning block; 219, inner limit gear ring; 220, first spring; 221, tooth plate; 222, limit push groove; 223, second arc block; 224, second spring; 225, arc friction ring; 226, polygonal conical plug-in rod. Modes for Carrying Out the Invention

[0042] The technical solutions in the embodiments of the present invention will be described clearly and completely below with reference to the accompanying drawings in the embodiments of the present invention.

[0043] Please refer to Figures 1-12. An embodiment of the present invention provides a technical solution: a single crystal silicon wafer water washing and degumming system, including a basic driving mechanism 1 for driving, and cleaning and installation mechanisms 2 for degumming are provided on both sides of the basic driving mechanism 1, and the number of cleaning and installation mechanisms 2 is set to two.

[0044] Please refer to Figures 5, 6, 7, 8, 9, 10, 11 and 12, which show the overall structure of the cleaning installation mechanism 2. The basic driving mechanism 1 includes a stable base plate 101, and the top of the stable base plate 101 is fixedly connected to a cleaning table 102. The rear side of the cleaning table 102 is fixedly connected to a supporting linkage wall 103, and both sides of the surface of the supporting linkage wall 103 are fixedly connected to a slide plate 104. Cleaning pools 105 for use with the cleaning installation mechanism 2 are provided on both sides of the top of the cleaning table 102. The cleaning pool 105 has its own drainage function. The two cleaning installation mechanisms 2 are respectively arranged on the inner side of the cleaning pool 105. The cleaning installation mechanism 2 includes a slider seat 201, and the slider seat 201 is slidably installed in the inner side of the slide plate 104. On the side, the surface of the slider seat 201 is fixedly connected with a load-bearing connecting plate 202, and the front end of the load-bearing connecting plate 202 is fixedly connected with a sliding ring 203. A sliding cylinder 204 is provided on the inner side of the sliding ring 203. The sliding ring 203 and the sliding cylinder 204 are not connected. The inner side of the sliding cylinder 204 is rotatably connected with a rotating rod 205. The lower part of the surface of the rotating rod 205 is fixedly connected to a polygonal sleeve rod 206. The surface of the polygonal sleeve rod 206 is slidably installed with a polygonal rotating column 207. The surface of the polygonal rotating column 207 is provided with a rotation limiting groove 208, and a plurality of rotation limiting grooves 208 are arranged in an annular shape. The bottom of the rotating rod 205 is rotatably connected to an inner tooth ring frame 209 through a bearing member. The surface of the rotating rod 205 is fixedly connected to the inner tooth ring The sealing plate 210 is used in conjunction with the shaped frame 209, and the number of the sealing plate 210 is the same as the number of the rotation limit slots 208. The surface of the polygonal rotating column 207 is fixedly connected with a fixed plug-in frame 211 between two adjacent rotation limit slots 208. The fixed plug-in frame 211 is made of stainless steel as a whole and the frame is slender as a whole and can only be sleeved on the edge of the silicon wafer without blocking degumming. The fixed plug-in frame 211 is provided with multiple, and the surface of the rotating rod 205 is fixedly connected with a multi-faceted lifting plate 212 between the inner tooth ring frame 209 and the polygonal sleeve rod 206. A first spring 220 is fixedly connected between the multi-faceted lifting plate 212 and the polygonal rotating column 207. The surface of the multi-faceted lifting plate 212 is fixedly connected with the fixed plug-in frame 21 1. The supporting bottom plug-in plate 213 used in conjunction with the supporting bottom plug-in plate 213 is made of rubber material on the inner side, which is configured to dock and clamp the silicon wafer after insertion. The top of the inner cavity of the rotation limit groove 208 is rotatably connected to a reciprocating threaded rod 214 through a bearing. The lower parts of both sides of the reciprocating threaded rod 214 are provided with slots that can limit sliding, and the bottom ends of the reciprocating threaded rod 214 pass through the sealing plate 210 and extend to the inner side of the inner tooth ring frame 209. The surface of the reciprocating threaded rod 214 and the inner side of the rotation limit groove 208 are threadedly connected to the limiting threaded sleeve 215. Both sides of the surface of the limiting threaded sleeve 215 are fixedly connected with a scraping brush plate 216 used in conjunction with the fixed plug-in frame 211. The scraping brush plate 216 is provided with a brush on the side facing the silicon wafer.The bottom of the inner tooth ring frame 209 is annular and has a through circular opening 217 for use with the reciprocating threaded rod 214. The surface of the reciprocating threaded rod 214 is slidably installed on the inner side of the inner tooth ring frame 209 with an inner limit gear ring 219 that meshes with the inner tooth ring frame 209. The inner side of the inner limit gear ring 219 is provided with a limit sliding protrusion for use with the reciprocating threaded rod 214. The bottom of the inner tooth ring frame 209 is fixedly connected to a multi-angle positioning block 218. The opposite sides of the two load-bearing connecting plates 202 are fixedly connected to the tooth plate 221 through a bracket. The top of the load-bearing connecting plate 202 A limit push groove 222 is provided that runs through the bottom. A second arc block 223 is slidably installed inside the limit push groove 222. A second spring 224 is fixedly connected between the second arc block 223 and the front portion of the inner cavity of the limit push groove 222. The bottom of the second arc block 223 is fixedly connected to an arc friction ring 225 used in conjunction with the rotating rod 205 through a bracket. The inner surface of the arc friction ring 225 is rough, which increases the friction force to fix the rotating rod 205 after contact. The top of the rotating rod 205 is fixedly connected to a polygonal conical plug rod 226. The bottom edge of the polygonal conical plug rod 226 is arc-shaped for easy docking.

[0045] Please refer to Figures 1, 2, 3 and 4, which show the overall structure of the basic driving mechanism 1. The top of the supporting linkage wall 103 is fixedly connected to the motor 106 through a bracket. The motor 106 is a servo motor. The output shaft of the motor 106 is fixedly connected to the rotating rod 107 through a coupling. The bottom end of the rotating rod 107 passes through the supporting linkage wall 103 and extends to the inner side of the supporting linkage wall 103. The upper and lower parts of the surface of the rotating rod 107 and the inner side of the supporting linkage wall 103 are fixedly connected to the second pulley 109. Both sides of the top of the inner cavity of the supporting linkage wall 103 are rotatably connected to the first pulley 108 through the bearing frame. The second pulley 109 and the first pulley 108 are connected by a belt 110 for transmission. Both sides of the top of the inner cavity of the supporting linkage wall 103 are fixedly connected to the first arc block 111 used in conjunction with the second arc block 223 through a bracket. The rear part of the inner cavity of the wall 103 is rotatably connected to the gear cylinder 112 used in conjunction with the tooth plate 221 through a bearing part, and circular lifting openings 113 used in conjunction with the polygonal conical plug rod 226 are provided on both sides of the top of the supporting linkage wall 103, and a rectangular lifting opening 114 used in conjunction with the tooth plate 221 is provided on the rear side of the top of the supporting linkage wall 103. A limited movement groove 115 is provided at the rear part of the supporting linkage wall 103, and both sides of the top of the inner cavity of the supporting linkage wall 103 are fixedly connected to the lower push rod 116 used in conjunction with the polygonal rotating column 207 through a bracket. An electric telescopic rod 117 is fixedly installed on the rear part of the supporting linkage wall 103, and the top of the electric telescopic rod 117 is fixedly connected to the right tooth plate 221 through a fixing plate. The bottom of the inner cavity of the cleaning pool 105 is fixedly connected to a polygonal slot seat 118 used in conjunction with the polygonal positioning block 218 through an opening.

[0046] The embodiment of the present invention further discloses a process for washing and degumming a single crystal silicon wafer, which specifically comprises the following steps:

[0047] S1: When in use, first inject cleaning liquid into the inner side of the cleaning tank 105, then insert the single crystal silicon wafers into the inner side of the right fixed plug-in frame 211 in sequence, and dock the bottom of the silicon wafer with the inner side of the supporting bottom plug-in plate 213. After all the installation is completed, go to step S2;

[0048] S2, after the cleaning and installation mechanism 2 on the right side has installed the silicon wafer, the electric telescopic rod 117 is started, and the electric telescopic rod 117 pulls the right fixed plug-in frame 211 to descend under the limit of the slide plate 104, and the load-bearing connecting plate 202 drives the rotating rod 205 and the polygonal rotating column 207 to descend through the action of the sliding ring 203 and the sliding cylinder 204, and the polygonal rotating column 207, the fixed plug-in frame 211 and the supporting bottom plug-in plate 213 also descend together to the inner side of the cleaning tank 105 to completely immerse the silicon wafer in the liquid, and the polygonal positioning block 218 is inserted into the polygonal slot seat 118 to fix the inner tooth ring frame 209. At the same time, the multi-faceted lifting plate 212 loses the pull of the rotating rod 205 and descends to separate the supporting bottom plug-in plate 213 from the fixed plug-in frame 211, and the silicon wafer is inserted into the inner side of the fixed plug-in frame 211. The polygonal conical insertion rod 226 is inserted into the inner side of the first pulley 108 and docked, and then the motor 106 is started. The two rotating rods 205 are driven to rotate through the action of the second pulley 109, the first pulley 108 and the belt 110. The rotating rod 205 drives the entire polygonal rotating column 207 to rotate through the polygonal sleeve rod 206. The rotation of the fixed plug-in frame 211 drives water to impact the silicon wafer. When the polygonal rotating column 207 rotates, it drives multiple inner limit gear rings 219 to revolve. Due to the engagement of the inner limit gear ring 219 and the inner tooth ring frame 209, the reciprocating threaded rod 214 is driven to rotate. The rotation of the reciprocating threaded rod 214 drives the limit thread sleeve 215 to move up and down under the limit of the rotation limit groove 208. The scraping brush plate 216 wipes both sides of the silicon wafer clean, and then goes to step S3;

[0049] S3. When the right cleaning installation mechanism 2 descends, the toothed plate 221 drives the gear cylinder 112 to rotate. When the gear cylinder 112 rotates, it drives the entire cleaning installation mechanism 2 to rise and detach from the inner side of the cleaning tank 105 through the left toothed plate 221. After the left cleaning installation mechanism 2 rises, the polygonal conical plug rod 226 will separate from the first pulley 108 and rise to the top through the circular lifting port 113, so that the rotating rod 205 is located on the inner side of the first pulley 108 and does not contact the first pulley 108. Therefore, the rotation of the first pulley 108 will not drive the left rotating rod 205 to rotate. When the rotating rod 205 rises, it will first push the polygonal rotating column 207 to rise through the first spring 220, and the polygonal rotating column 207 will rise. After the rotating column 207 rises, it will first abut against the lower supporting rod 116. Then, during the upward pulling process of the rotating rod 205, the inner tooth ring frame 209 and the multi-faceted lifting plate 212 rise, and the supporting bottom plug-in plate 213 rises again and fits with the fixed plug-in frame 211, which is convenient for subsequently pushing the silicon wafer to the top for easy removal. The reciprocating threaded rod 214 extends to the bottom of the inner tooth ring frame 209 through the through circular opening 217. When the load-bearing connecting plate 202 rises to the top, the first arc block 111 and the second arc block 223 abut against each other, pushing the arc friction ring 225 forward and abutting against the rotating rod 205 to fix the rotating rod 205 to prevent rotation, making it convenient for replacing the silicon wafer. In steps S2 and S3, the two cleaning and installation mechanisms 2 are staggered.

[0050] The above embodiments are only used to illustrate the present invention and are not intended to limit the technical solutions described in the present invention. Although this specification has described the present invention in detail with reference to the above embodiments, the present invention is not limited to the above specific implementation methods. Therefore, any modification or equivalent replacement of the present invention; and all technical solutions and improvements thereof that do not depart from the spirit and scope of the invention are included in the scope of the claims of the present invention.

[0051] The above description is only a preferred specific embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Any technician familiar with the technical field, within the technical scope disclosed by the present invention, who makes equivalent replacements or changes based on the technical solution and inventive concept of the present invention, should be covered by the scope of protection of the present invention.

Claims

1. A single crystal silicon wafer water washing and degumming system, comprising a basic driving mechanism configured to drive, wherein: Cleaning and mounting mechanisms configured for debonding are arranged on both sides of the interior of the basic driving mechanism, and the number of the cleaning and mounting mechanisms is arranged to be two.

2. A single crystal silicon wafer water washing and degumming system according to claim 1, wherein: The basic driving mechanism includes a stable base plate, a cleaning table is fixedly connected to the top of the stable base plate, a supporting linkage wall is fixedly connected to the rear side of the cleaning table, slide plates are fixedly connected to both sides of the surface of the supporting linkage wall, cleaning pools used in conjunction with the cleaning installation mechanism are provided on both sides of the top of the cleaning table, and the two cleaning installation mechanisms are respectively arranged on the inner sides of the cleaning pools.

3. A single crystal silicon wafer water washing and degumming system according to claim 2, wherein: The cleaning installation mechanism includes a slider seat, and the slider seat is slidably installed on the inner side of the slide groove plate, the surface of the slider seat is fixedly connected with a load-bearing connecting plate, the front end of the load-bearing connecting plate is fixedly connected with a sliding ring, a sliding cylinder is provided on the inner side of the sliding ring, and a rotating rod is rotatably connected to the inner side of the sliding cylinder, the lower part of the surface of the rotating rod is fixedly connected with a polygonal sleeve rod, and a polygonal rotating column is slidably installed on the surface of the polygonal sleeve rod, a rotating limit groove is opened on the surface of the polygonal rotating column, and a plurality of rotating limit grooves are arranged in a ring shape, and the bottom of the rotating rod is rotatably connected with an inner tooth ring frame through a bearing member.

4. A single crystal silicon wafer water washing and degumming system according to claim 3, wherein: The surface of the rotating rod is fixedly connected with a sealing plate used in conjunction with the inner tooth ring frame, and the number of the sealing plates is the same as the number of the rotation limit grooves. The surface of the polygonal rotating column is fixedly connected with a fixed plug-in frame between two adjacent rotation limit grooves, and there are multiple fixed plug-in frames. The surface of the rotating rod is fixedly connected with a multi-faceted lifting plate between the inner tooth ring frame and the polygonal sleeve rod. A first spring is fixedly connected between the multi-faceted lifting plate and the polygonal rotating column. The surface of the multi-faceted lifting plate is fixedly connected with a supporting bottom plug-in plate used in conjunction with the fixed plug-in frame.

5. A single crystal silicon wafer water washing and degumming system according to claim 4, wherein: The top of the inner cavity of the rotation limit groove is rotatably connected with a reciprocating threaded rod through a bearing part, and the bottom end of the reciprocating threaded rod passes through the sealing plate and extends to the inner side of the inner tooth annular frame, the surface of the reciprocating threaded rod and the inner side of the rotation limit groove are threadedly connected to a limiting threaded sleeve, both sides of the surface of the limiting threaded sleeve are fixedly connected with scraping brush plates used in conjunction with the fixed plug-in frame, the bottom of the inner tooth annular frame is annularly provided with a through circular opening used in conjunction with the reciprocating threaded rod, the surface of the reciprocating threaded rod and the inner side of the inner tooth annular frame are slidably installed with an inner limiting gear ring meshing with the inner tooth annular frame, and the bottom of the inner tooth annular frame is fixedly connected with a multi-angle positioning block.

6. A single crystal silicon wafer water washing and degumming system according to claim 3, wherein: The opposite sides of the two load-bearing connecting plates are fixedly connected with toothed plates through brackets, and the top of the load-bearing connecting plate is provided with a limit push groove extending to the bottom, and a second arc block is slidably installed on the inner side of the limit push groove, and a second spring is fixedly connected between the second arc block and the front part of the inner cavity of the limit push groove, and the bottom of the second arc block is fixedly connected with an arc friction ring used in conjunction with the rotating rod through a bracket, and the top of the rotating rod is fixedly connected with a polygonal cone plug rod.

7. A single crystal silicon wafer water washing and degumming system according to claim 6, wherein: The top of the support linkage wall is fixedly connected to a motor through a bracket, and the output shaft of the motor is fixedly connected to a rotating rod through a coupling, and the bottom end of the rotating rod passes through the support linkage wall and extends to the inner side of the support linkage wall, and the upper and lower parts of the rotating rod surface and located on the inner side of the support linkage wall are fixedly connected to the second pulley, and both sides of the top of the inner cavity of the support linkage wall are rotatably connected to the first pulley through a bearing frame, and the second pulley is connected to the first pulley through a belt transmission, and both sides of the top of the inner cavity of the support linkage wall are fixedly connected to the first arc block used in conjunction with the second arc block through a bracket, and the rear part of the inner cavity of the support linkage wall is rotatably connected to the gear cylinder used in conjunction with the tooth plate through a bearing member.

8. A single crystal silicon wafer water washing and degumming system according to claim 7, wherein: Both sides of the top of the support linkage wall are provided with circular lifting openings for use with the polygonal conical insertion rod, the rear side of the top of the support linkage wall is provided with a rectangular lifting opening for use with the tooth plate, the rear part of the support linkage wall is provided with a limited movement groove, both sides of the top of the inner cavity of the support linkage wall are fixedly connected with lower push rods for use with the polygonal rotating column through brackets, an electric telescopic rod is fixedly installed at the rear part of the support linkage wall, and the top end of the electric telescopic rod is fixedly connected to the tooth plate on the right side through a fixing plate, and the bottom of the inner cavity of the cleaning tank is fixedly connected with a polygonal slot seat for use with the polygonal positioning block through an opening.

9. A process for washing and degumming a single crystal silicon wafer, wherein: The specific steps include: S1. When in use, first inject cleaning liquid into the inner side of the cleaning tank, then insert the single crystal silicon wafers into the inner side of the fixed plug-in frame on the right side in sequence, and dock the bottom of the silicon wafer with the inner side of the supporting bottom plug-in board. After all the installation is completed, go to step S2; S2. After the cleaning and installation mechanism on the right side has installed the silicon wafer, the electric telescopic rod is started. The electric telescopic rod pulls the fixed plug-in frame on the right side to descend under the limit of the slide slot plate. The load-bearing connecting plate drives the rotating rod and the polygonal rotating column to descend through the action of the sliding ring and the sliding cylinder. The polygonal rotating column, the fixed plug-in frame and the supporting bottom plug-in plate also descend to the inner side of the cleaning tank to completely immerse the silicon wafer in the liquid. The polygonal positioning block is inserted into the polygonal slot seat to fix the inner tooth ring frame. At the same time, the multi-faceted lifting plate loses the pull of the rotating rod and descends to separate the supporting bottom plug-in plate from the fixed plug-in frame. The silicon wafer is inserted into the inner side of the fixed plug-in frame. At the same time, the multi-faceted lifting plate on the right side The pyramidal plug rod is inserted into the inner side of the first pulley and docked, and then the motor is started. The two rotating rods are driven to rotate through the second pulley, the first pulley and the belt. The rotating rod drives the entire polygonal rotating column to rotate through the polygonal sleeve rod. The rotation of the fixed plug-in frame drives water to impact the silicon wafer. The polygonal rotating column drives multiple inner limit gear rings to revolve while rotating. The meshing of the inner limit gear ring and the inner tooth ring frame drives the reciprocating threaded rod to rotate. The rotation of the reciprocating threaded rod drives the limit thread sleeve to move up and down under the limit of the rotation limit groove. The scraping brush plate wipes both sides of the silicon wafer clean, and then go to step S3; S3. When the cleaning installation mechanism on the right side descends, the toothed plate will drive the gear cylinder to rotate. When the gear cylinder rotates, it will drive the entire cleaning installation mechanism to rise and detach from the inner side of the cleaning tank through the toothed plate on the left side. After the cleaning installation mechanism on the left side rises, the polygonal cone plug rod will separate from the first pulley and rise to the top through the circular lifting port, so that the rotating rod is located on the inner side of the first pulley and does not contact the first pulley. Therefore, the rotation of the first pulley will not drive the rotating rod on the left side to rotate. When the rotating rod rises, it will first be pushed by the first spring. The polygonal rotating column rises, and after rising, the polygonal rotating column will first resist against the lower resisting rod, and then during the upward pulling process of the rotating rod, the inner tooth ring frame and the multi-sided lifting plate rise, and the supporting bottom plug-in plate rises again and fits with the fixed plug-in frame, which is convenient for subsequently pushing the silicon wafer to the top for easy removal, and the reciprocating threaded rod extends to the bottom of the inner tooth ring frame through the through circular opening. When the load-bearing connecting plate rises to the top, the first arc block and the second arc block resist each other, pushing the arc friction ring forward and resisting against the rotating rod, thereby fixing the rotating rod to prevent rotation and facilitating the replacement of the silicon wafer.

10. A process for washing and degumming a single crystal silicon wafer according to claim 9, wherein: In the steps S2 and S3, the two cleaning and installation mechanisms are arranged in a staggered manner.

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