Electronic device including flexible circuit board

Abstract

The present invention relates to an electronic device. The electronic device according to an embodiment of the present invention comprises: a housing; a circuit board disposed inside the housing; a camera assembly spaced apart from the circuit board; and a flexible circuit board including a first rigid portion, which is connected to the camera assembly, a second rigid portion, which is connected to the circuit board, and a flexible portion, which connects the first rigid portion and the second rigid portion. The flexible circuit board may include: a base material layer; a first conductive layer coupled to the base material layer; a first shielding layer that is spaced apart from the first conductive layer and includes a 1-1 shielding layer portion located in the first rigid portion, a 1-2 shielding layer portion located in the second rigid portion, and a 1-3 shielding layer portion located in the flexible portion; and a first grounding layer which is connected to the first shielding layer and at least a portion of which extends along the perimeter of the first rigid portion. Various other embodiments are also possible.

Description

Electronic devices including flexible circuit boards

[0001] Various embodiments disclosed in this document relate to electronic devices, for example, electronic devices including flexible circuit boards.

[0002] Thanks to remarkable advancements in information and communication technology and semiconductor technology, the proliferation and use of various electronic devices is rapidly increasing. In particular, recent electronic devices are being developed to enable portable communication.

[0003] Electronic devices can refer to devices that perform specific functions based on the programs installed on them, such as home appliances, electronic notebooks, portable multimedia players, mobile communication terminals, tablet PCs, audio / video devices, desktop / laptop computers, and car navigation systems. For example, these electronic devices can output stored information as audio or video. As electronic device integration increases and ultra-high-speed, high-capacity wireless communications become more widespread, a single electronic device, such as a mobile communication terminal, can now be equipped with a variety of functions. For example, in addition to communication functions, entertainment functions such as games, multimedia functions such as music / video playback, communication and security functions such as mobile banking, and functions such as schedule management and electronic wallets are being integrated into a single electronic device. These electronic devices are becoming smaller and more portable for users.

[0004] The above information may be provided as background art to aid in understanding the present disclosure. No claim or determination is made as to whether any of the above is applicable as prior art related to the present disclosure.

[0005] An electronic device according to one embodiment of the present disclosure may include a housing.

[0006] An electronic device according to one embodiment of the present disclosure may include a circuit board disposed inside the housing.

[0007] An electronic device according to one embodiment of the present disclosure may include a camera assembly spaced apart from the circuit board.

[0008] An electronic device according to one embodiment of the present disclosure may include a flexible circuit board including a first rigid portion connected to the camera assembly, a second rigid portion connected to the circuit board, and a flexible portion connecting the first rigid portion and the second rigid portion.

[0009] A flexible circuit board according to one embodiment of the present disclosure may include a substrate layer.

[0010] A flexible circuit board according to one embodiment of the present disclosure may include a first conductive layer combined with the substrate layer.

[0011] A flexible circuit board according to one embodiment of the present disclosure may include a first shielding layer portion positioned in the first rigid portion, a first shielding layer portion positioned in the second rigid portion, and a first shielding layer portion positioned in the flexible portion, and may include a first shielding layer spaced apart from the first conductive layer.

[0012] A flexible circuit board according to one embodiment of the present disclosure may include a first ground layer extending at least partially along a perimeter of the first rigid portion and connected to the first shielding layer.

[0013] A flexible circuit board according to one embodiment of the present disclosure may include a substrate layer extending to correspond to each of a first rigid portion, a second rigid portion spaced apart from the first rigid portion, and a flexible portion connecting the first rigid portion and the second rigid portion.

[0014] A flexible circuit board according to one embodiment of the present disclosure may include a first conductive layer combined with the substrate layer.

[0015] A flexible circuit board according to one embodiment of the present disclosure may include a first shielding layer portion positioned in the first rigid portion, a first shielding layer portion positioned in the second rigid portion, and a first shielding layer portion positioned in the flexible portion, and may include a first shielding layer spaced apart from the first conductive layer.

[0016] A flexible circuit board according to one embodiment of the present disclosure may include a first ground layer extending at least partially along a perimeter of the first rigid portion and connected to the first shielding layer.

[0017] FIG. 1 is a block diagram of an electronic device within a network environment according to various embodiments.

[0018] FIG. 2 is a perspective view of an electronic device according to one embodiment of the present disclosure.

[0019] FIG. 3 is a perspective view of an electronic device according to one embodiment of the present disclosure.

[0020] FIG. 4 is an exploded perspective view of an electronic device according to one embodiment of the present disclosure.

[0021] FIG. 5 is an exploded perspective view of an electronic device according to one embodiment of the present disclosure.

[0022] FIG. 6 is a part of an electronic device according to one embodiment of the present disclosure.

[0023] FIG. 7 is a part of an electronic device according to one embodiment of the present disclosure.

[0024] FIG. 8 is a cross-sectional view of an electronic device according to one embodiment of the present disclosure.

[0025] FIG. 9 is a cross-sectional view of an electronic device according to one embodiment of the present disclosure.

[0026] FIG. 10 is a part of an electronic device according to one embodiment of the present disclosure.

[0027] FIG. 11 is a cross-sectional view of an electronic device according to one embodiment of the present disclosure.

[0028] FIG. 12 is a cross-sectional view of an electronic device according to one embodiment of the present disclosure.

[0029] FIG. 13A is a cross-sectional view of an electronic device according to one embodiment of the present disclosure.

[0030] FIG. 13b is a diagram illustrating assembly of a flexible circuit board according to one embodiment of the present disclosure.

[0031] FIG. 13c is a cross-sectional view of a flexible circuit board according to one embodiment of the present disclosure.

[0032] The following description of the accompanying drawings may provide an understanding of various exemplary implementations of the present disclosure, including the claims and their equivalents. While the exemplary embodiments disclosed in the following description include numerous specific details to aid understanding, they are to be considered as one example of various exemplary embodiments. Accordingly, those skilled in the art will appreciate that various modifications and variations of the various implementations described herein may be made without departing from the scope and spirit of the disclosure. Furthermore, descriptions of well-known functions and configurations may be omitted for clarity and conciseness.

[0033] The terms and words used in the following description and claims are not limited to their reference meanings and can be used to clearly and consistently describe one embodiment of the present disclosure. Therefore, it will be apparent to those skilled in the art that the following description of various implementations of the disclosure is provided for illustrative purposes, not for the purpose of limiting the scope of the disclosure and its equivalents.

[0034] Unless the context clearly dictates otherwise, the singular forms of "a," "an," and "the" should be understood to include plural meanings. Thus, for example, "a component surface" could be understood to include one or more of the surfaces of the component.

[0035] FIG. 1 is a block diagram of an electronic device (101) within a network environment (100) according to various embodiments.

[0036] Referring to FIG. 1, in a network environment (100), an electronic device (101) may communicate with an electronic device (102) via a first network (198) (e.g., a short-range wireless communication network), or may communicate with at least one of an electronic device (104) or a server (108) via a second network (199) (e.g., a long-range wireless communication network). In one embodiment, the electronic device (101) may communicate with the electronic device (104) via the server (108). According to one embodiment, the electronic device (101) may include a processor (120), a memory (130), an input module (150), an audio output module (155), a display module (160), an audio module (170), a sensor module (176), an interface (177), a connection terminal (178), a haptic module (179), a camera module (180), a power management module (188), a battery (189), a communication module (190), a subscriber identification module (196), or an antenna module (197). In some embodiments, the electronic device (101) may omit at least one of these components (e.g., the connection terminal (178)), or may have one or more other components added. In some embodiments, some of these components (e.g., the sensor module (176), the camera module (180), or the antenna module (197)) may be integrated into one component (e.g., the display module (160)).

[0037] The processor (120) may, for example, execute software (e.g., a program (140)) to control at least one other component (e.g., a hardware or software component) of the electronic device (101) connected to the processor (120) and perform various data processing or operations. According to one embodiment, as at least a part of the data processing or operations, the processor (120) may store commands or data received from other components (e.g., a sensor module (176) or a communication module (190)) in a volatile memory (132), process the commands or data stored in the volatile memory (132), and store result data in a non-volatile memory (134). According to one embodiment, the processor (120) may include a main processor (121) (e.g., a central processing unit or an application processor) or an auxiliary processor (123) (e.g., a graphics processing unit, a neural processing unit (NPU), an image signal processor, a sensor hub processor, or a communication processor) that can operate independently or together with the main processor (121). For example, when the electronic device (101) includes the main processor (121) and the auxiliary processor (123), the auxiliary processor (123) may be configured to use less power than the main processor (121) or to be specialized for a given function. The auxiliary processor (123) may be implemented separately from the main processor (121) or as a part thereof.

[0038] The auxiliary processor (123) may control at least a portion of functions or states associated with at least one component (e.g., a display module (160), a sensor module (176), or a communication module (190)) of the electronic device (101), for example, on behalf of the main processor (121) while the main processor (121) is in an inactive (e.g., sleep) state, or together with the main processor (121) while the main processor (121) is in an active (e.g., application execution) state. In one embodiment, the auxiliary processor (123) (e.g., an image signal processor or a communication processor) may be implemented as a part of another functionally related component (e.g., a camera module (180) or a communication module (190)). In one embodiment, the auxiliary processor (123) (e.g., a neural network processing unit) may include a hardware structure specialized for processing artificial intelligence models. The artificial intelligence models may be generated through machine learning. This learning can be performed, for example, on the electronic device (101) itself where the artificial intelligence model is executed, or can be performed through a separate server (e.g., server (108)). The learning algorithm can include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but is not limited to the examples described above. The artificial intelligence model can include multiple artificial neural network layers.The artificial neural network may be one of a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), a deep Q-network, or a combination of two or more of the above, but is not limited to the examples described above. In addition to, or alternatively to, a hardware structure, an artificial intelligence model may include a software structure.

[0039] The memory (130) can store various data used by at least one component (e.g., processor (120) or sensor module (176)) of the electronic device (101). The data can include, for example, software (e.g., program (140)) and input data or output data for commands related thereto. The memory (130) can include volatile memory (132) or non-volatile memory (134).

[0040] The program (140) may be stored as software in the memory (130) and may include, for example, an operating system (142), middleware (144), or an application (146).

[0041] The input module (150) can receive commands or data to be used in a component of the electronic device (101) (e.g., a processor (120)) from an external source (e.g., a user) of the electronic device (101). The input module (150) can include, for example, a microphone, a mouse, a keyboard, a key (e.g., a button), or a digital pen (e.g., a stylus pen).

[0042] The audio output module (155) can output audio signals to the outside of the electronic device (101). The audio output module (155) can include, for example, a speaker or a receiver. The speaker can be used for general purposes, such as multimedia playback or recording playback. The receiver can be used to receive incoming calls. In one embodiment, the receiver can be implemented separately from the speaker or as part of the speaker.

[0043] The display module (160) can visually provide information to an external party (e.g., a user) of the electronic device (101). The display module (160) may include, for example, a display, a holographic device, or a projector and a control circuit for controlling the device. According to one embodiment, the display module (160) may include a touch sensor configured to detect a touch, or a pressure sensor configured to measure the intensity of a force generated by the touch.

[0044] The audio module (170) can convert sound into an electrical signal, or vice versa, convert an electrical signal into sound. According to one embodiment, the audio module (170) can acquire sound through the input module (150), output sound through the sound output module (155), or an external electronic device (e.g., electronic device (102)) (e.g., speaker or headphone) directly or wirelessly connected to the electronic device (101).

[0045] The sensor module (176) can detect the operating status (e.g., power or temperature) of the electronic device (101) or the external environmental status (e.g., user status) and generate an electrical signal or data value corresponding to the detected status. According to one embodiment, the sensor module (176) can include, for example, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0046] The interface (177) may support one or more designated protocols that may be used to directly or wirelessly connect the electronic device (101) with an external electronic device (e.g., the electronic device (102)). In one embodiment, the interface (177) may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

[0047] The connection terminal (178) may include a connector through which the electronic device (101) may be physically connected to an external electronic device (e.g., electronic device (102)). According to one embodiment, the connection terminal (178) may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0048] The haptic module (179) can convert electrical signals into mechanical stimuli (e.g., vibration or movement) or electrical stimuli that a user can perceive through tactile or kinesthetic sensations. According to one embodiment, the haptic module (179) can include, for example, a motor, a piezoelectric element, or an electrical stimulation device.

[0049] The camera module (180) can capture still images and videos. According to one embodiment, the camera module (180) may include one or more lenses, image sensors, image signal processors, or flashes.

[0050] The power management module (188) can manage power supplied to the electronic device (101). According to one embodiment, the power management module (188) can be implemented as, for example, at least a part of a power management integrated circuit (PMIC).

[0051] A battery (189) may power at least one component of the electronic device (101). In one embodiment, the battery (189) may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

[0052] The communication module (190) may support the establishment of a direct (e.g., wired) communication channel or a wireless communication channel between the electronic device (101) and an external electronic device (e.g., electronic device (102), electronic device (104), or server (108)), and the performance of communication through the established communication channel. The communication module (190) may operate independently from the processor (120) (e.g., application processor) and may include one or more communication processors that support direct (e.g., wired) communication or wireless communication. According to one embodiment, the communication module (190) may include a wireless communication module (192) (e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module (194) (e.g., a local area network (LAN) communication module, or a power line communication module). Among these communication modules, the corresponding communication module can communicate with an external electronic device (104) via a first network (198) (e.g., a short-range communication network such as Bluetooth, wireless fidelity (WiFi) direct, or infrared data association (IrDA)) or a second network (199) (e.g., a long-range communication network such as a legacy cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., a LAN or WAN)). These various types of communication modules can be integrated into a single component (e.g., a single chip) or implemented as multiple separate components (e.g., multiple chips). The wireless communication module (192) can verify or authenticate the electronic device (101) within a communication network such as the first network (198) or the second network (199) by using subscriber information (e.g., an international mobile subscriber identity (IMSI)) stored in the subscriber identification module (196).

[0053] The wireless communication module (192) can support 5G networks and next-generation communication technologies following the 4G network, such as NR access technology (new radio access technology). The NR access technology can support high-speed transmission of high-capacity data (eMBB (enhanced mobile broadband)), minimization of terminal power and connection of multiple terminals (mMTC (massive machine type communications)), or high reliability and low latency (URLLC (ultra-reliable and low-latency communications)). The wireless communication module (192) can support, for example, a high-frequency band (e.g., mmWave band) to achieve a high data transmission rate. The wireless communication module (192) can support various technologies for securing performance in a high-frequency band, such as beamforming, massive multiple-input and multiple-output (MIMO), full dimensional MIMO (FD-MIMO), array antenna, analog beam-forming, or large scale antenna. The wireless communication module (192) can support various requirements specified in the electronic device (101), an external electronic device (e.g., the electronic device (104)), or a network system (e.g., the second network (199)). According to one embodiment, the wireless communication module (192) can support a peak data rate (e.g., 20 Gbps or more) for eMBB realization, a loss coverage (e.g., 164 dB or less) for mMTC realization, or a U-plane latency (e.g., 0.5 ms or less for downlink (DL) and uplink (UL), or 1 ms or less for round trip) for URLLC realization.

[0054] The antenna module (197) can transmit or receive signals or power to or from an external device (e.g., an external electronic device). In one embodiment, the antenna module (197) may include an antenna including a radiator formed of a conductor or a conductive pattern formed on a substrate (e.g., a PCB). In one embodiment, the antenna module (197) may include a plurality of antennas (e.g., an array antenna). In this case, at least one antenna suitable for a communication method used in a communication network, such as the first network (198) or the second network (199), may be selected from the plurality of antennas, for example, by the communication module (190). A signal or power may be transmitted or received between the communication module (190) and an external electronic device via the selected at least one antenna. In some embodiments, in addition to the radiator, another component (e.g., a radio frequency integrated circuit (RFIC)) may be additionally formed as a part of the antenna module (197).

[0055] According to various embodiments, the antenna module (197) may form a mmWave antenna module. In one embodiment, the mmWave antenna module may include a printed circuit board, an RFIC disposed on or adjacent a first side (e.g., a bottom side) of the printed circuit board and capable of supporting a designated high-frequency band (e.g., a mmWave band), and a plurality of antennas (e.g., an array antenna) disposed on or adjacent a second side (e.g., a top side or a side side) of the printed circuit board and capable of transmitting or receiving signals in the designated high-frequency band.

[0056] At least some of the above components can be interconnected and exchange signals (e.g., commands or data) with each other via a communication method between peripheral devices (e.g., a bus, GPIO (general purpose input and output), SPI (serial peripheral interface), or MIPI (mobile industry processor interface)).

[0057] According to one embodiment, commands or data may be transmitted or received between the electronic device (101) and an external electronic device (104) via a server (108) connected to a second network (199). Each of the external electronic devices (102 or 104) may be the same or a different type of device as the electronic device (101). According to one embodiment, all or part of the operations executed in the electronic device (101) may be executed in one or more of the external electronic devices (102, 104, or 108). For example, when the electronic device (101) is to perform a certain function or service automatically or in response to a request from a user or another device, the electronic device (101) may, instead of or in addition to executing the function or service itself, request one or more external electronic devices to perform the function or at least a part of the service. One or more external electronic devices that receive the request may execute at least a portion of the requested function or service, or an additional function or service related to the request, and transmit the result of the execution to the electronic device (101). The electronic device (101) may process the result as is or additionally and provide it as at least a portion of a response to the request. For this purpose, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology may be used, for example. The electronic device (101) may provide an ultra-low latency service by using distributed computing or mobile edge computing, for example. In one embodiment, the external electronic device (104) may include an Internet of Things (IoT) device. The server (108) may be an intelligent server utilizing machine learning and / or a neural network. According to one embodiment, the external electronic device (104) or the server (108) may be included in the second network (199).The electronic device (101) can be applied to intelligent services (e.g., smart home, smart city, smart car, or healthcare) based on 5G communication technology and IoT-related technology.

[0058] Electronic devices according to the various embodiments disclosed in this document may take various forms. Electronic devices may include, for example, portable communication devices (e.g., smartphones), computer devices, portable multimedia devices, portable medical devices, cameras, wearable devices, or home appliances. Electronic devices according to the embodiments of this document are not limited to the aforementioned devices.

[0059] The various embodiments of this document and the terminology used therein are not intended to limit the technical features described in this document to specific embodiments, but should be understood to include various modifications, equivalents, or substitutes of the embodiments. In connection with the description of the drawings, similar reference numerals may be used for similar or related components. The singular form of a noun corresponding to an item may include one or more of the items, unless the context clearly indicates otherwise. In this document, each of the phrases "A or B", "at least one of A and B", "at least one of A or B", "A, B, or C", "at least one of A, B, and C", and "at least one of A, B, or C" can include any one of the items listed together in the corresponding phrase among those phrases, or all possible combinations thereof. Terms such as "first," "second," or "first" or "second" may be used merely to distinguish one component from another, and do not limit the components in any other respect (e.g., importance or order). When a component (e.g., a first component) is referred to as "coupled" or "connected" to another component (e.g., a second component), with or without the terms "functionally" or "communicatively," it means that the component can be connected to the other component directly (e.g., wired), wirelessly, or through a third component.

[0060] The term "module" used in various embodiments of this document may include a unit implemented in hardware, software, or firmware, and may be used interchangeably with terms such as logic, logic block, component, or circuit. A module may be an integral component, or a minimum unit or part of such a component that performs one or more functions. For example, according to one embodiment, a module may be implemented in the form of an application-specific integrated circuit (ASIC).

[0061] Various embodiments of the present document may be implemented as software (e.g., a program (140)) including one or more instructions stored in a storage medium (e.g., an internal memory (136) or an external memory (138)) readable by a machine (e.g., an electronic device (101)). For example, a processor (e.g., a processor (120)) of the machine (e.g., an electronic device (101)) may call at least one instruction among the one or more instructions stored from the storage medium and execute it. This enables the machine to operate to perform at least one function according to the at least one called instruction. The one or more instructions may include code generated by a compiler or code executable by an interpreter. The machine-readable storage medium may be provided in the form of a non-transitory storage medium. Here, 'non-transitory' simply means that the storage medium is a tangible device and does not contain signals (e.g., electromagnetic waves), and the term does not distinguish between cases where data is stored semi-permanently or temporarily on the storage medium.

[0062] According to one embodiment, the method according to various embodiments disclosed in the present document may be provided as included in a computer program product. The computer program product may be traded as a product between a seller and a buyer. The computer program product may be distributed in the form of a machine-readable storage medium (e.g., compact disc read-only memory (CD-ROM)), or may be distributed online (e.g., downloaded or uploaded) through an application store (e.g., Play Store™) or directly between two user devices (e.g., smart phones). In the case of online distribution, at least a portion of the computer program product may be temporarily stored or temporarily generated in a machine-readable storage medium, such as the memory of a manufacturer's server, an application store's server, or an intermediary server.

[0063] According to various embodiments, each component (e.g., a module or a program) of the above-described components may include one or more entities, and some of the entities may be separated and placed in other components. According to various embodiments, one or more components or operations of the aforementioned components may be omitted, or one or more other components or operations may be added. Alternatively or additionally, a plurality of components (e.g., a module or a program) may be integrated into a single component. In such a case, the integrated component may perform one or more functions of each of the plurality of components identically or similarly to those performed by the corresponding component among the plurality of components prior to the integration. According to various embodiments, the operations performed by a module, program, or other component may be executed sequentially, in parallel, iteratively, or heuristically, or one or more of the operations may be executed in a different order, omitted, or one or more other operations may be added.

[0064] FIG. 2 is a perspective view showing the front of an electronic device according to one embodiment of the present disclosure.

[0065] FIG. 3 is a perspective view showing the rear side of an electronic device according to one embodiment of the present disclosure.

[0066] The embodiments of FIGS. 2 to 3 may be combined with the embodiments of FIG. 1 or the embodiments of FIGS. 4 to 13c.

[0067] Referring to FIGS. 2 and 3, an electronic device (101) according to one embodiment (e.g., the electronic device (101) of FIG. 1) may include a housing (210) that includes a first side (or front side) (210A), a second side (or back side) (210B), and a side surface (210C) that surrounds a space between the first side (210A) and the second side (210B). In one embodiment (not shown), the housing (210) may also refer to a structure that forms a portion of the first side (210A) of FIG. 2, the second side (210B) of FIG. 3, and the side surface (210C). According to one embodiment, the first side (210A) may be formed by a front plate (202) that is at least partially substantially transparent (e.g., a glass plate or a polymer plate including various coating layers). The second side (210B) may be formed by a substantially opaque back plate (211). The back plate (211) may be formed of, for example, coated or colored glass, ceramic, polymer, metal (e.g., aluminum, stainless steel (STS), or magnesium), or a combination of at least two of the foregoing materials. The back plate (211) may form the second side (210B). The side surface (210C) may be formed by a side structure (or “side bezel structure”) (218) that is joined to the front plate (202) and the back plate (211) and comprises a metal and / or a polymer. In one embodiment, the back plate (211) and the side structure (218) may be formed integrally and comprise the same material (e.g., a metal material such as aluminum).

[0068] Although not shown, the front plate (202) may include a seamlessly extending region(s) that curves toward the rear plate (211) at least along a portion of an edge. In one embodiment, the front plate (202) (or the rear plate (211)) may include only one of the curved extending regions toward the rear plate (211) (or the front plate (202)) at one edge of the first surface (210A). In some embodiments, the front plate (202) or the rear plate (211) may be substantially flat. For example, the curved extending region may not be included. When the curved extending region is included, the thickness of the electronic device (101) in the portion that includes the curved extending region may be smaller than that of other portions.

[0069] According to one embodiment, the electronic device (101) may include at least one of a display (220), an audio module (203, 207, 214), a sensor module (204, 219), a camera module (205, 212, 213), a key input device (217), a light emitting element (206), and a connector hole (208, 209). In one embodiment, the electronic device (101) may omit at least one of the components (e.g., the key input device (217) or the light emitting element (206)) or may additionally include other components.

[0070] The display (220) may be visually exposed, for example, through a significant portion of the front plate (202). In one embodiment, at least a portion of the display (220) may be visually exposed through the front plate (202) forming the first surface (210A) or through a portion of a side surface (210C). In one embodiment, the edge of the display (220) may be formed to be substantially the same as the adjacent outer shape of the front plate (202). In one embodiment (not shown), the gap between the outer edge of the display (220) and the outer edge of the front plate (202) may be formed to be substantially the same in order to expand the area over which the display (220) is visually exposed.

[0071] In one embodiment (not shown), a recess or opening may be formed in a portion of a screen display area of ​​the display (220), and at least one of an audio module (214), a sensor module (204), a camera module (205), and a light-emitting element (206) may be included that are aligned with the recess or opening. In one embodiment (not shown), at least one of an audio module (214), a sensor module (204), a camera module (205), a fingerprint sensor (not shown), and a light-emitting element (206) may be included on a back surface of the screen display area of ​​the display (220). In one embodiment (not shown), the display (220) may be coupled to or disposed adjacent to a touch detection circuit, a pressure sensor capable of measuring the intensity (pressure) of a touch, and / or a digitizer that detects a magnetic field-type stylus pen.

[0072] The audio module (203, 207, 214) may include a microphone hole (203) and a speaker hole (207, 214). The microphone hole (203) may have a microphone disposed therein for acquiring external sound, and in one embodiment, multiple microphones may be disposed so as to detect the direction of the sound. The speaker hole (207, 214) may include an external speaker hole (207) and a receiver hole (214) for calls. In one embodiment, the speaker hole (207, 214) and the microphone hole (203) may be implemented as a single hole, or a speaker may be included without the speaker hole (207, 214) (e.g., a piezo speaker).

[0073] The sensor module (204, 219) can generate an electrical signal or data value corresponding to an internal operating state of the electronic device (101) or an external environmental state. The sensor module (204, 219) may include, for example, a first sensor module (204) (e.g., a proximity sensor) and / or a second sensor module (not shown) (e.g., a fingerprint sensor) disposed on a first surface (210A) of the housing (210), and / or a third sensor module (219) and / or a fourth sensor module (e.g., a fingerprint sensor) disposed on a second surface (210B) of the housing (210). The fingerprint sensor may be disposed on not only the first surface (210A) (e.g., the display (220)) of the housing (210), but also the second surface (210B) or the side surface (210C). The electronic device (101) may further include, for example, at least one of a gesture sensor, a gyro sensor, a pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0074] The camera modules (205, 212, 213) may include a first camera device (205) disposed on a first surface (210A) of the electronic device (101), a second camera device (212) disposed on a second surface (210B), and / or a flash (213). The camera devices (205, 212) may include one or more lenses, an image sensor, and / or an image signal processor. The flash (213) may include, for example, a light-emitting diode or a xenon lamp. In one embodiment, two or more lenses (infrared camera, wide-angle and telephoto lenses) and image sensors may be disposed on one surface of the electronic device (101). In one embodiment, the flash (213) may emit infrared light, and infrared light emitted by the flash (213) and reflected by a subject may be received via the third sensor module (219). The electronic device (101) or the processor of the electronic device (101) can detect depth information of the subject based on the point in time when infrared rays are received from the third sensor module (219).

[0075] The key input device (217) may be disposed on a side surface (210C) of the housing (210). In one embodiment, the electronic device (101) may not include some or all of the above-mentioned key input devices (217), and the key input devices (217) that are not included may be implemented in other forms, such as soft keys, on the display (220). In one embodiment, the key input device may include a sensor module disposed on a second surface (210B) of the housing (210).

[0076] The light-emitting element (206) may be disposed, for example, on the first surface (210A) of the housing (210). The light-emitting element (206) may provide, for example, status information of the electronic device (101) in the form of light. In one embodiment, the light-emitting element (206) may provide a light source that is linked to the operation of, for example, the camera module (205). The light-emitting element (206) may include, for example, an LED, an IR LED, and a xenon lamp.

[0077] The connector holes (208, 209) may include a first connector hole (208) that can accommodate a connector (e.g., a USB connector) for transmitting and receiving power and / or data with an external electronic device, and / or a second connector hole (e.g., an earphone jack) (209) that can accommodate a connector for transmitting and receiving audio signals with an external electronic device.

[0078] FIG. 4 is an exploded perspective view showing the front of an electronic device according to one embodiment of the present disclosure.

[0079] FIG. 5 is an exploded perspective view showing the rear side of an electronic device according to one embodiment of the present disclosure.

[0080] The embodiments of FIGS. 4 to 5 may be combined with the embodiments of FIGS. 1 to 3, or the embodiments of FIGS. 6 to 13c.

[0081] Referring to FIGS. 3 and 4, the electronic device (101) (e.g., the electronic device (101) of FIG. 1 or 2) may include a side structure (310), a first support member (311) (e.g., a bracket), a front plate (320) (e.g., the front plate (202) of FIG. 1), a display (330) (e.g., the display (220) of FIG. 1), at least one printed circuit board (or board assembly) (340a, 340b), a battery (350), a second support member (360) (e.g., a rear case), an antenna, a camera assembly (307), and a rear plate (380) (e.g., the rear plate (211) of FIG. 2). When including a plurality of printed circuit boards (340a, 340b), the electronic device (101) can electrically connect different printed circuit boards by including at least one flexible printed circuit board (340c). For example, the printed circuit boards (340a, 340b) can include a first circuit board (340a) positioned above (e.g., in the +Y-axis direction) the battery (350) and a second circuit board (340b) positioned below (e.g., in the -Y-axis direction), and the flexible printed circuit board (340c) can electrically connect the first circuit board (340a) and the second circuit board (340b).

[0082] According to one embodiment, the electronic device (101) may omit at least one of the components (e.g., the first support member (311) or the second support member (360)) or may additionally include other components. At least one of the components of the electronic device (101) may be identical or similar to at least one of the components of the electronic device (101) of FIG. 1 or FIG. 2, and any redundant description will be omitted below.

[0083] The first support member (311) may be provided in a flat shape at least in part. In one embodiment, the first support member (311) may be disposed inside the electronic device (101) and connected to the side structure (310), or may be formed integrally with the side structure (310). The first support member (311) may be formed of, for example, a metallic material and / or a non-metallic (e.g., polymer) material. When the first support member (311) is formed at least partially of a metallic material, the side structure (310) or a portion of the first support member (311) may function as an antenna. The first support member (311) may have a display (330) coupled to one surface and a printed circuit board (340a, 340b) coupled to the other surface. A processor, a memory, and / or an interface may be mounted on the printed circuit board (340a, 340b). The processor may include, for example, one or more of a central processing unit, an application processor, a graphics processing unit, an image signal processor, a sensor hub processor, or a communication processor.

[0084] In one embodiment, the housing (301) may include a first support member (311) and a side structure (310). In one embodiment, the housing (301) may be understood as a structure for accommodating, protecting, or arranging a printed circuit board (340a, 340b) or a battery (350). In one embodiment, the housing (301) may be understood as including structures that can be visually or tactilely recognized by a user in the appearance of the electronic device (101), for example, the side structure (310), the front plate (320), and / or the rear plate (380). For example, the housing (301) may include structures forming the appearance of the electronic device (101), for example, the side structure (310), the front plate (320), and the rear plate (380). The housing (301) may be the same as the housing (210) described with reference to FIGS. 2 and 3 . In one embodiment, the 'front or rear side of the housing (301)' may refer to the first side (210A) of FIG. 1 or the second side (210B) of FIG. 2. In one embodiment, the first support member (311) is disposed between the front plate (320) (e.g., the first side (210A) of FIG. 2) and the rear plate (380) (e.g., the second side (210B) of FIG. 3), and may function as a structure for arranging electrical / electronic components such as printed circuit boards (340a, 340b) or camera assemblies (307).

[0085] The memory may include, for example, volatile memory or non-volatile memory.

[0086] The interface may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, and / or an audio interface. The interface may electrically or physically connect the electronic device (101) to an external electronic device, for example, and may include a USB connector, an SD card / MMC connector, or an audio connector.

[0087] The second support member (360) may include, for example, an upper support member (360a) or a lower support member (360b). In one embodiment, the upper support member (360a) may be arranged to surround a printed circuit board (340a, 340b) (e.g., the first circuit board (340a)) together with a portion of the first support member (311). For example, the upper support member (360a) of the second support member (360) may be arranged to face the first support member (311) with the first circuit board (340a) interposed therebetween. In one embodiment, the lower support member (360b) of the second support member (360) may be arranged to face the first support member (311) with the second circuit board (340b) interposed therebetween. Circuit devices implemented in the form of integrated circuit chips (e.g., processors, communication modules, or memories) or various electrical / electronic components may be placed on printed circuit boards (340a, 340b), and according to an embodiment, the printed circuit boards (340a, 340b) may be provided with an electromagnetic shielding environment from the second support member (360). In one embodiment, the lower support member (360b) may be utilized as a structure on which electrical / electronic components such as a speaker module or an interface (e.g., a USB connector, an SD card / MMC connector, or an audio connector) may be placed. In one embodiment, electrical / electronic components such as a speaker module or an interface (e.g., a USB connector, an SD card / MMC connector, or an audio connector) may be placed on an additional printed circuit board (not shown). For example, the lower support member (360b) may be arranged to surround an additional printed circuit board (e.g., a second printed circuit board (340b)) together with another portion of the first support member (311). An additional printed circuit board not shown or a speaker module or interface arranged on the lower support member (360b) may be arranged corresponding to the audio module (207) or connector holes (208, 309) of FIG. 2.

[0088] The battery (350) is a device for supplying power to at least one component of the electronic device (101), and may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell. At least a portion of the battery (350) may be disposed substantially on the same plane as, for example, the printed circuit boards (340a, 340b). The battery (350) may be disposed integrally within the electronic device (101), or may be disposed detachably from the electronic device (101).

[0089] Although not shown, the antenna may include a conductive pattern implemented on the surface of the second support member (360), for example, through a laser direct structuring process. In one embodiment, the antenna may include a printed circuit pattern formed on the surface of a thin film, and the thin film-type antenna may be disposed between the back plate (380) and the battery (350). The antenna may include, for example, a near field communication (NFC) antenna, a wireless charging antenna, and / or a magnetic secure transmission (MST) antenna. The antenna may, for example, perform short-range communication with an external device or wirelessly transmit and receive power required for charging. In one embodiment, another antenna structure may be formed by the side structure (310) and / or a portion or combination of the first support member (311).

[0090] In one embodiment, the camera assembly (307) may include at least one camera module. Within the electronic device (101), the camera assembly (307) (or at least one camera module) may receive at least a portion of light incident through an optical hole or camera window. In one embodiment, the camera assembly (307) may be disposed on the first support member (311) at a position adjacent to the printed circuit board (340a, 340b). In one embodiment, the camera module(s) of the camera assembly (307) may be generally aligned with one of the camera windows and may be at least partially wrapped around the second support member (360) (e.g., the upper support member (360a)).

[0091] According to one embodiment, the electronic device (101) may include camera holes (312, 313, 319). A plurality of camera holes (312, 313, 319) may be arranged spaced apart from each other. The camera assembly (307) may receive light passing through the camera holes (312, 313, 319). Each of the plurality of cameras (e.g., cameras 3071, 3072, 3073 of FIG. 6) may correspond to each of the plurality of camera holes (e.g., the plurality of camera holes (312)) that are spaced apart from each other.

[0092] According to one embodiment, the first support member (311) may include a receiving portion (3111). A battery (350) may be positioned within the receiving portion (3111). The battery (350) may include a terrace (353). The terrace (353) may protrude toward a circuit board (e.g., the circuit board (340) of FIG. 6). The battery (350) may include a battery connection member (3501) connecting the terrace (353) and the circuit board (340).

[0093] FIG. 6 is a drawing showing a state in which a back plate (e.g., the back plate (380) of FIGS. 4 and 5) is removed from the electronic device (101) illustrated in FIG. 3. FIG. 7 is an enlarged drawing of a portion (M) of FIG. 6. The components described with reference to FIGS. 6 and 7 may be partly or entirely the same as the components described with reference to FIGS. 1 to 5. The components described with reference to FIGS. 6 and 7 may be partly or entirely the same as the components described with reference to FIGS. 8 to 13c.

[0094] According to one embodiment, the electronic device (101) may include a housing (301), an antenna (308), and a circuit board (340). The housing (301) may be the same as the housing (301) described with reference to FIGS. 4 and 5. The description of the circuit board (340) may be the same as the description of the circuit boards (340a, 340b, 340c) described with reference to FIGS. 4 and 5. The antenna (308) may be coupled to the housing (301) and may be a part of the housing (301). The antenna (308) may form a part of the surface of the housing (301). The antenna (308) may be spaced apart from the camera assembly (307). Radio interference may occur between the antenna (308) and the camera assembly (307).

[0095] According to one embodiment, the electronic device (101) may include a camera assembly (307). The camera assembly (307) may capture a subject outside the back plate (e.g., the back plate (380) of FIG. 5). The camera assembly (307) may include a plurality of cameras (3071, 3072, 3073). Each of the plurality of cameras (3071, 3072, 3073) may be aligned in one direction (e.g., the Y direction).

[0096] According to one embodiment, the electronic device (101) may include a flexible circuit board (400). The flexible circuit board (400) may connect the camera assembly (307) and the circuit board (340). The flexible circuit board (400) may connect any one of a plurality of cameras (3071, 3072, 3073) and the circuit board (340). The flexible circuit board (400) may extend in one direction (e.g., in the X direction) from the circuit board (340) toward the camera assembly (307).

[0097] According to one embodiment, a flexible circuit board (400) may connect a first camera (3071) and a circuit board (340). At least a portion of the flexible circuit board (400) may be formed to be deformable. The flexible circuit board (400) may include a flexible material. The flexible circuit board (400) may include a rigid material.

[0098] According to one embodiment, the flexible circuit board (400) may include a first rigid portion (410). The flexible circuit board (400) may include a second rigid portion (420). The flexible circuit board (400) may include a flexible portion (430). The first rigid portion (410) may be connected to the camera assembly (307). The first rigid portion (410) may include a rigid material. The second rigid portion (420) may be connected to the circuit board (340). The second rigid portion (420) may include a rigid material. The flexible portion (430) may connect the first rigid portion (410) and the second rigid portion (420). The flexible portion (430) may include a flexible material.

[0099] According to one embodiment, the electronic device (101) may include a connector (480). The connector (480) may connect the flexible circuit board (400) and the circuit board (340). The connector (480) may connect the second rigid portion (420) and the circuit board (340).

[0100] FIG. 8 is a cross-sectional view of a flexible circuit board (400) connected to a camera assembly (307) and a connector (480) according to one embodiment of the present disclosure. FIG. 9 is a cross-sectional view of a flexible circuit board (400) connected to a camera assembly (307) and a connector (480) according to one embodiment of the present disclosure. FIG. 8 is a cross-sectional view of components (e.g., the camera assembly (307), the connector (480), the flexible circuit board (400)) taken along the line A-A' shown in FIGS. 6 and 7 according to one embodiment. FIG. 9 is a cross-sectional view of components (e.g., the camera assembly (307), the connector (480), the flexible circuit board (400)) taken along the line A-A' shown in FIGS. 6 and 7 according to one embodiment. The components described with reference to FIGS. 8 and 9 may be partially or entirely identical to the components described with reference to FIGS. 1 to 7. The components described with reference to FIGS. 8 and 9 may be partially or entirely identical to the components described with reference to FIGS. 10 to 13c.

[0101] According to one embodiment, the flexible circuit board (400) may include a first rigid portion (410), a second rigid portion (420), and a flexible portion (430). The flexible portion (430) may be positioned between the first rigid portion (410) and the second rigid portion (420), and may connect the first rigid portion (410) and the second rigid portion (420). The flexible circuit board (400) may be formed as an integral part. The first rigid portion (410), the second rigid portion (420), and the flexible portion (430) may be formed as an integral part.

[0102] According to one embodiment, the flexible circuit board (400) may include a substrate layer (441). The substrate layer (441) may be disposed between a first conductive layer (442) and a second conductive layer (446). A portion of the substrate layer (441) may be disposed on the first rigid portion (410). A portion of the substrate layer (441) may be disposed on the second rigid portion (420). A portion of the substrate layer (441) may be disposed on the flexible portion (430).

[0103] According to one embodiment, the flexible circuit board (400) may include a first conductive layer (442). The first conductive layer (442) may include a copper (Cu) material. The first conductive layer (442) may be disposed between the substrate layer (441) and the first adhesive layer (443). A portion of the first conductive layer (442) may be disposed on the first rigid portion (410). A portion of the first conductive layer (442) may be disposed on the second rigid portion (420). A portion of the first conductive layer (442) may be disposed on the flexible portion (430).

[0104] According to one embodiment, the flexible circuit board (400) may include a first adhesive layer (443). The first adhesive layer (443) may be disposed between the first conductive layer (442) and the first cover layer (444). The first adhesive layer (443) may bond the first conductive layer (442) and the first cover layer (444). A portion of the first adhesive layer (443) may be disposed on the first rigid portion (410). A portion of the first adhesive layer (443) may be disposed on the second rigid portion (420). A portion of the first adhesive layer (443) may be disposed on the flexible portion (430).

[0105] According to one embodiment, the flexible circuit board (400) may include a first cover layer (444). The first cover layer (444) may be disposed between the first adhesive layer (443) and the first shielding layer (445). A portion of the first cover layer (444) may be disposed on the first rigid portion (410). A portion of the first cover layer (444) may be disposed on the second rigid portion (420). A portion of the first cover layer (444) may be disposed on the flexible portion (430).

[0106] According to one embodiment, the flexible circuit board (400) may include a first shielding layer (445). A portion of the first shielding layer (445) may be disposed on the first rigid portion (410). A portion of the first shielding layer (445) may be disposed on the second rigid portion (420). A portion of the first shielding layer (445) may be disposed on the flexible portion (430).

[0107] According to one embodiment, the flexible circuit board (400) may include a second conductive layer (446). The second conductive layer (446) may include a copper (Cu) material. The second conductive layer (446) may be disposed between the substrate layer (441) and the second adhesive layer (447). A portion of the second conductive layer (446) may be disposed on the first rigid portion (410). A portion of the second conductive layer (446) may be disposed on the second rigid portion (420). A portion of the second conductive layer (446) may be disposed on the flexible portion (430).

[0108] According to one embodiment, the flexible circuit board (400) may include a second adhesive layer (447). The second adhesive layer (447) may be disposed between the second conductive layer (446) and the second cover layer (448). The second adhesive layer (447) may bond the second conductive layer (446) and the second cover layer (448). A portion of the second adhesive layer (447) may be disposed on the first rigid portion (410). A portion of the second adhesive layer (447) may be disposed on the second rigid portion (420). A portion of the second adhesive layer (447) may be disposed on the flexible portion (430).

[0109] According to one embodiment, the flexible circuit board (400) may include a second cover layer (448). The second cover layer (448) may be disposed between the second adhesive layer (447) and the second shielding layer (449). A portion of the second cover layer (448) may be disposed on the first rigid portion (410). A portion of the second cover layer (448) may be disposed on the second rigid portion (420). A portion of the second cover layer (448) may be disposed on the flexible portion (430).

[0110] According to one embodiment, the flexible circuit board (400) may include a second shielding layer (449). A portion of the second shielding layer (449) may be disposed on the first rigid portion (410). A portion of the second shielding layer (449) may be disposed on the second rigid portion (420). A portion of the second shielding layer (449) may be disposed on the flexible portion (430).

[0111] According to one embodiment, the flexible circuit board (400) may include a first ground layer (471). The first ground layer (471) may be disposed on the first rigid portion (410). The first ground layer (471) may surround at least a portion of the first rigid portion (410). A portion of the first ground layer (471) may be disposed between the first rigid layer (451) and the camera assembly (307). A portion of the first ground layer (471) may cover an end portion of each of a plurality of layers (e.g., the substrate layer (441), the first conductive layer (442), the first adhesive layer (443), the first cover layer (444), the first shielding layer (445), the second conductive layer (446), the second adhesive layer (447), and the second cover layer (448)). A portion of the first ground layer (471) may be placed between the first rigid layer (452) and the second shielding layer (449). The shape of the cross-section of the first ground layer (471) may be a square with one side open.

[0112] According to one embodiment, the flexible circuit board (400) may include a first ground protrusion (473). The first ground protrusion (473) may be connected to a first ground layer (471). The first ground protrusion (473) may protrude from the first ground layer (471) toward the first shielding layer (445). The first ground protrusion (473) may be disposed between the first shielding layer (445) and the first cover layer (444). The first ground protrusion (473) may provide a grounding structure of the first shielding layer (445).

[0113] According to one embodiment, the flexible circuit board (400) may include a first rigid layer (451, 452). The first rigid layer (451, 452) may include a rigid material. The first rigid layer (451, 452) may include a first-first rigid layer (451) and a first-second rigid layer (452). A plurality of layers (e.g., a substrate layer (441), a first conductive layer (442), a first adhesive layer (443), a first cover layer (444), a first shielding layer (445), a second conductive layer (446), a second adhesive layer (447), and a second cover layer (448)) may be disposed between the first-first rigid layer (451) and the first-second rigid layer (452). The first-first rigid layer (451) may be placed between the first ground layer (471) and the first shielding layer (445). The first-second rigid layer (452) may be placed between the first ground layer (471) and the second cover layer (448).

[0114] According to one embodiment, the flexible circuit board (400) may include a first rigid body (453, 454). The first rigid body (453, 454) may include a first-first rigid body (453) and a first-second rigid body (454). The first-first rigid body (453) may be disposed between a first ground layer (471) and a first conductive layer (442). The first-first rigid body (453) may be disposed between a substrate layer (441) and a first adhesive layer (443). The first-second rigid body (454) may be disposed between the first ground layer (471) and a second conductive layer (446). The first-second rigid body (454) can be placed between the substrate layer (441) and the second adhesive layer (447).

[0115] According to one embodiment, the flexible circuit board (400) may include a second ground layer (472). The second ground layer (472) may be disposed on the second rigid portion (420). The second ground layer (472) may surround at least a portion of the second rigid portion (420). A portion of the second ground layer (472) may be disposed between the second rigid layer (461) and the connector (480). A portion of the second ground layer (472) may cover an end portion of each of a plurality of layers (e.g., the substrate layer (441), the first conductive layer (442), the first adhesive layer (443), the first cover layer (444), the first shielding layer (445), the second conductive layer (446), the second adhesive layer (447), and the second cover layer (448)). A portion of the second ground layer (472) may be placed between the second rigid layer (462) and the second shielding layer (449). The shape of the cross-section of the second ground layer (472) may be a square with one side open.

[0116] According to one embodiment, the flexible circuit board (400) may include a second grounding protrusion (474). The second grounding protrusion (474) may be connected to a second grounding layer (472). The second grounding protrusion (474) may protrude from the second grounding layer (472) toward the first shielding layer (445). The second grounding protrusion (474) may be disposed between the first shielding layer (445) and the first cover layer (444). The second grounding protrusion (474) may provide a grounding structure of the first shielding layer (445).

[0117] According to one embodiment, the flexible circuit board (400) may include a second rigid layer (461, 462). The second rigid layer (461, 462) may include a rigid material. The second rigid layer (461, 462) may include a second-first rigid layer (461) and a second-second rigid layer (462). A plurality of layers (e.g., a substrate layer (441), a first conductive layer (442), a first adhesive layer (443), a first cover layer (444), a first shielding layer (445), a second conductive layer (446), a second adhesive layer (447), and a second cover layer (448)) may be disposed between the second-first rigid layer (461) and the second-second rigid layer (462). The second-first rigid layer (461) may be placed between the second ground layer (472) and the first shielding layer (445). The second-second rigid layer (462) may be placed between the second ground layer (472) and the second cover layer (448).

[0118] According to one embodiment, the flexible circuit board (400) may include a second rigid body (463, 464). The second rigid body (463, 464) may include a second-first rigid body (463) and a second-second rigid body (464). The second-first rigid body (463) may be disposed between the second ground layer (472) and the first conductive layer (442). The second-first rigid body (463) may be disposed between the substrate layer (441) and the first adhesive layer (443). The second-second rigid body (464) may be disposed between the second ground layer (472) and the second conductive layer (446). The second-second rigid body (464) can be placed between the substrate layer (441) and the second adhesive layer (447).

[0119] According to one embodiment, the substrate layer (441) may include a first substrate layer portion (4411), a second substrate layer portion (4412), and a third substrate layer portion (4413). The first, second, and third substrate layer portions (4411, 4412, 4413) may be integral. The first substrate layer portion (4411) may be disposed on the first rigid portion (410). The second substrate layer portion (4412) may be disposed on the second rigid portion (420). The third substrate layer portion (4413) may be disposed on the flexible portion (430). The first substrate layer portion (4411) may be disposed between the first-first conductive portion (4421) and the second-first conductive portion (4461). The second substrate layer portion (4412) may be arranged between the first-second conductive portion (4422) and the second-second conductive portion (4462). The third substrate layer portion (4413) may be arranged between the first-third conductive portion (4423) and the second-third conductive portion (4463).

[0120] According to one embodiment, the first conductive layer (442) may include a 1-1 conductive portion (4421), a 1-2 conductive portion (4422), and a 1-3 conductive portion (4423). The 1-1, 1-2, and 1-3 conductive portions (4421, 4422, 4423) may be integral. The 1-1 conductive portion (4421) may be disposed in the first rigid portion (410). The 1-2 conductive portion (4422) may be disposed in the second rigid portion (420). The 1-3 conductive portion (4423) may be disposed in the flexible portion (430). The 1-1 conductive portion (4421) may be disposed between the first substrate layer portion (4411) and the 1-1 adhesive layer portion (4431). The first-second conductive portion (4422) may be arranged between the second substrate layer portion (4412) and the first-second adhesive layer portion (4432). The first-third conductive portion (4423) may be arranged between the third substrate layer portion (4413) and the first-third adhesive layer portion (4433).

[0121] According to one embodiment, the first adhesive layer (443) may include a 1-1 adhesive layer portion (4431), a 1-2 adhesive layer portion (4432), and a 1-3 adhesive layer portion (4433). The 1-1, 1-2, and 1-3 adhesive layer portions (4431, 4432, 4433) may be integral. The 1-1 adhesive layer portion (4431) may be disposed on the first rigid portion (410). The 1-2 adhesive layer portion (4432) may be disposed on the second rigid portion (420). The 1-3 adhesive layer portion (4433) may be disposed on the flexible portion (430). The 1-1 adhesive layer portion (4431) may be disposed between the 1-1 conductive portion (4421) and the 1-1 cover layer portion (4441). The first-second adhesive layer portion (4432) may be positioned between the first-second conductive portion (4422) and the first-second cover layer portion (4442). The first-third adhesive layer portion (4433) may be positioned between the first-third conductive portion (4423) and the first-third cover layer portion (4443).

[0122] According to one embodiment, the first cover layer (444) may include a 1-1 cover layer portion (4441), a 1-2 cover layer portion (4442), and a 1-3 cover layer portion (4443). The 1-1, 1-2, and 1-3 cover layer portions (4441, 4442, 4443) may be integral. The 1-1 cover layer portion (4441) may be disposed on the first rigid portion (410). The 1-2 cover layer portion (4442) may be disposed on the second rigid portion (420). The 1-3 cover layer portion (4443) may be disposed on the flexible portion (430). The 1-1 cover layer portion (4441) may be disposed between the 1-1 adhesive layer portion (4431) and the 1-1 shielding layer portion (4451). The first-second cover layer portion (4442) may be positioned between the first-second adhesive layer portion (4432) and the first-second shielding layer portion (4452). The first-third cover layer portion (4443) may be positioned between the first-third adhesive layer portion (4433) and the first-third shielding layer portion (4453).

[0123] According to one embodiment, the first shielding layer (445) may include a first-first shielding layer portion (4451), a first-second shielding layer portion (4452), and a first-third shielding layer portion (4453). The first-first, first-second, and first-third shielding layer portions (4451, 4452, 4453) may be integral. The first-first shielding layer portion (4451) may be disposed on the first rigid portion (410). The first-second shielding layer portion (4452) may be disposed on the second rigid portion (420). The first-third shielding layer portion (4453) may be disposed on the flexible portion (430). The first-first shielding layer portion (4451) may be disposed between the first-first cover layer portion (4441) and the first-first rigid layer (451). The first-second shielding layer portion (4452) may be disposed between the first-second cover layer portion (4442) and the second-first rigid layer (461). The first-first shielding layer portion (4451) may include an extension portion (4451a) and a bending portion (4451b). The extension portion (4451a) may be disposed between the first rigid layer (451) and the first cover layer (444). The bending portion (4451b) may be bent from the extension portion (4451a). The bending portion (4451b) may surround at least a portion of the first grounding protrusion portion (473). The banding portion (4451b) may be connected to the first ground layer (471). The first ground protrusion portion (473) may be disposed between the banding portion (4451b) and the first cover layer (444). The first ground protrusion portion (473) may be disposed between the extension portion (4451a) and the first ground layer (471). The first-second shielding layer portion (4452) may include an extension portion (4452a) and a bending portion (4452b). The extension portion (4452a) may be disposed between the second rigid layer (461) and the first cover layer (444). The bending portion (4452b) may be bent from the extension portion (4452a). The bending portion (4452b) may surround at least a portion of the second ground protrusion portion (474). The banding portion (4452b) can be connected to the second ground layer (472).The second grounding protrusion (474) may be positioned between the banding portion (4452b) and the first cover layer (444). The second grounding protrusion (474) may be positioned between the extension portion (4452a) and the second grounding layer (472).

[0124] According to one embodiment, the second conductive layer (446) may include a 2-1 conductive portion (4461), a 2-2 conductive portion (4462), and a 2-3 conductive portion (4463). The 2-1, 2-2, and 2-3 conductive portions (4461, 4462, and 4463) may be integral. The 2-1 conductive portion (4461) may be disposed in the first rigid portion (410). The 2-2 conductive portion (4462) may be disposed in the second rigid portion (420). The 2-3 conductive portion (4463) may be disposed in the flexible portion (430). The 2-1 conductive portion (4461) may be disposed between the first substrate layer portion (4411) and the 2-1 adhesive layer portion (4471). The second-second conductive portion (4462) may be arranged between the second substrate layer portion (4412) and the second-second adhesive layer portion (4472). The second-third conductive portion (4463) may be arranged between the third substrate layer portion (4413) and the second-third adhesive layer portion (4473).

[0125] According to one embodiment, the second adhesive layer (447) may include a 2-1 adhesive layer portion (4471), a 2-2 adhesive layer portion (4472), and a 2-3 adhesive layer portion (4473). The 2-1, 2-2, and 2-3 adhesive layer portions (4471, 4472, 4473) may be integral. The 2-1 adhesive layer portion (4471) may be disposed on the first rigid portion (410). The 2-2 adhesive layer portion (4472) may be disposed on the second rigid portion (420). The 2-3 adhesive layer portion (4473) may be disposed on the flexible portion (430). The 2-1 adhesive layer portion (4471) may be disposed between the 2-1 conductive portion (4461) and the 2-1 cover layer portion (4481). The 2-2 adhesive layer portion (4472) may be positioned between the 2-2 conductive portion (4462) and the 2-2 cover layer portion (4482). The 2-3 adhesive layer portion (4473) may be positioned between the 2-3 conductive portion (4463) and the 2-3 cover layer portion (4483).

[0126] According to one embodiment, the second cover layer (448) may include a 2-1 cover layer portion (4481), a 2-2 cover layer portion (4482), and a 2-3 cover layer portion (4483). The 2-1, 2-2, and 2-3 cover layer portions (4481, 4482, 4483) may be integral. The 2-1 cover layer portion (4481) may be disposed on the first rigid portion (410). The 2-2 cover layer portion (4482) may be disposed on the second rigid portion (420). The 2-3 cover layer portion (4483) may be disposed on the flexible portion (430). The 2-1 cover layer portion (4481) may be disposed between the 2-1 adhesive layer portion (4471) and the 2-1 shielding layer portion (4491). The 2-2 cover layer portion (4482) may be positioned between the 2-2 adhesive layer portion (4472) and the 2-2 shielding layer portion (4492). The 2-3 cover layer portion (4483) may be positioned between the 2-3 adhesive layer portion (4473) and the 2-3 shielding layer portion (4493).

[0127] According to one embodiment, the second shielding layer (449) may include a 2-1 shielding layer portion (4491), a 2-2 shielding layer portion (4492), and a 2-3 shielding layer portion (4493). The 2-1, 2-2, and 2-3 shielding layer portions (4491, 4492, and 4493) may be integral. The 2-1 shielding layer portion (4491) may be disposed on the first rigid portion (410). The 2-2 shielding layer portion (4492) may be disposed on the second rigid portion (420). The 2-3 shielding layer portion (4493) may be disposed on the flexible portion (430). The second shielding layer (449) may include a first connecting portion (4494) and a second connecting portion (4495). The first connecting portion (4494) can connect the second-first shielding layer portion (4491) and the second-third shielding layer portion (4493). The second connecting portion (4495) can connect the second-second shielding layer portion (4492) and the second-third shielding layer portion (4493).

[0128] According to one embodiment, the first ground layer (471) may include a first side portion (4711), a first device coupling portion (4712), and a first shielding layer coupling portion (4713). The first side portion (4711), the first device coupling portion (4712), and the first shielding layer coupling portion (4713) may be formed integrally. The first side portion (4711) may cover an end portion of each of a plurality of layers (e.g., a substrate layer (441), a first conductive layer (442), a first adhesive layer (443), a first cover layer (444), a first shielding layer (445), a second conductive layer (446), a second adhesive layer (447), and a second cover layer (448)). The first shielding layer (445) may be connected to the first side portion (4711). The first ground protrusion portion (473) may protrude from the first side portion (4711) toward the first shielding layer (445). The first rigid body (453, 454) may be disposed between the conductive layer (442, 446) and the first side portion (4711). The first device coupling portion (4712) may be disposed between the camera assembly (307) and the first-first rigid layer (451). The first shielding layer coupling portion (4713) may be disposed between the first-second rigid layer (452) and the second-first shielding layer portion (4491).

[0129] According to one embodiment, the second ground layer (472) may include a second side portion (4721), a second device coupling portion (4722), and a second shielding layer coupling portion (4723). The second side portion (4721), the second device coupling portion (4722), and the second shielding layer coupling portion (4723) may be formed integrally. The second side portion (4721) may cover an end portion of each of a plurality of layers (e.g., a substrate layer (441), a first conductive layer (442), a first adhesive layer (443), a first cover layer (444), a first shielding layer (445), a second conductive layer (446), a second adhesive layer (447), and a second cover layer (448)). The first shielding layer (445) may be connected to the second side portion (4721). The second grounding protrusion (474) may protrude from the second side portion (4721) toward the first shielding layer (445). The second rigid body (463, 464) may be disposed between the conductive layer (442, 446) and the second side portion (4721). The second device coupling portion (4722) may be disposed between the connector (480) and the second-first rigid layer (461). The second shielding layer coupling portion (4723) may be disposed between the second-second rigid layer (462) and the second-second shielding layer portion (4492).

[0130] According to one embodiment, the flexible circuit board (400) may include a first conductive via (491) and a second conductive via (492). The first conductive via (491) may be disposed in the first rigid portion (410). The first conductive via (491) may be disposed at a boundary between the first rigid portion (410) and the flexible portion (430). The second conductive via (492) may be disposed in the second rigid portion (420). The second conductive via (492) may be disposed at a boundary between the second rigid portion (420) and the flexible portion (430). The first conductive via (491) may extend through a plurality of layers (e.g., the substrate layer (441), the first conductive layer (442), the first adhesive layer (443), the first cover layer (444), the first shielding layer (445), the second conductive layer (446), the second adhesive layer (447), the second cover layer (448), the first rigid layers (451, 452), and the first ground layer (471)). The first conductive via (491) may extend between the first device coupling portion (4712) and the first shielding layer coupling portion (4713). The first conductive via (491) may extend through the first ground layer (471) and be connected to the camera assembly (307). The first conductive via (491) may extend through the first ground layer (471) and be connected to the second shielding layer (449). The second conductive via (492) may extend through a plurality of layers (e.g., the substrate layer (441), the first conductive layer (442), the first adhesive layer (443), the first cover layer (444), the first shielding layer (445), the second conductive layer (446), the second adhesive layer (447), the second cover layer (448), the second rigid layers (461, 462), and the second ground layer (472)). The second conductive via (492) may extend between the second device coupling portion (4722) and the second shielding layer coupling portion (4723). The second conductive via (492) may extend through the second ground layer (472) and be connected to the second shielding layer (449).

[0131] Fig. 10 is a conceptual diagram illustrating the structure of a flexible circuit board (400). The components described with reference to Fig. 10 may be partially or entirely identical to the components described with reference to Figs. 1 to 9. The components described with reference to Fig. 10 may be partially or entirely identical to the components described with reference to Figs. 11 to 13c.

[0132] According to one embodiment, the flexible portion (430) can connect the first rigid portion (410) and the second rigid portion (420).

[0133] In one embodiment, the first ground layer (471) can surround at least a portion of the first rigid portion (410). The second ground layer (472) can surround at least a portion of the second rigid portion (420).

[0134] FIG. 11 is a cross-sectional view of a flexible circuit board (400) according to one embodiment of the present disclosure, wherein the flexible circuit board (400) is connected to a camera assembly (307) and a connector (480). The components described with reference to FIG. 11 may be partially or entirely identical to the components described with reference to FIGS. 1 to 10. The components described with reference to FIG. 11 may be partially or entirely identical to the components described with reference to FIGS. 12 to 13c.

[0135] According to one embodiment, the flexible circuit board (400) may include a substrate layer (441), a first conductive layer (442), a first adhesive layer (443), a first cover layer (444), a first shielding layer (445), a second conductive layer (446), a second adhesive layer (447), a second cover layer (448), a first rigid layer (451, 452), a second rigid layer (461, 462), a first ground layer (471), a second ground layer (472), a first conductive via (491), and a second conductive via (492). The description of the components described above (e.g., the substrate layer (441), the first conductive layer (442), the first adhesive layer (443), the first cover layer (444), the first shielding layer (445), the second conductive layer (446), the second adhesive layer (447), the second cover layer (448), the first rigid layer (451, 452), the second rigid layer (461, 462), the first ground layer (471), the second ground layer (472), the first conductive via (491), and the second conductive via (492)) can be equally applied to the description of the components described with reference to FIGS. 8 and 9.

[0136] According to one embodiment, the flexible circuit board (400) may include a second shielding layer (549). A portion of the second shielding layer (549) may be disposed on the first rigid portion (410). A portion of the second shielding layer (549) may be disposed on the second rigid portion (420). A portion of the second shielding layer (549) may be disposed on the flexible portion (430).

[0137] According to one embodiment, the second shielding layer (549) may include a first shielding layer portion (5491), a second shielding layer portion (5492), and a third shielding layer portion (5493). The first shielding layer portion (5491) may be disposed between the second cover layer (448) and the first-second rigid layer (452). The second shielding layer portion (5492) may be disposed between the second cover layer (448) and the second-second rigid layer (462).

[0138] According to one embodiment, the second shielding layer (549) may include a first shielding layer bending portion (5494) and a second shielding layer bending portion (5495). The first shielding layer bending portion (5494) may be bent from the first shielding layer portion (5491). The first shielding layer bending portion (5494) may be connected to the first ground layer (471). The second shielding layer bending portion (5495) may be bent from the second shielding layer portion (5492). The second shielding layer bending portion (5495) may be connected to the second ground layer (472).

[0139] According to one embodiment, the flexible circuit board (400) may include a third ground protrusion portion (575) and a fourth ground protrusion portion (576). The third ground protrusion portion (575) may be disposed between the first ground layer (471) and the first shielding layer portion (5491). The third ground protrusion portion (575) may be disposed between the second cover layer (448) and the first shielding layer banding portion (5494). The fourth ground protrusion portion (576) may be disposed between the second ground layer (472) and the second shielding layer portion (5492). The fourth ground protrusion portion (576) may be disposed between the second cover layer (448) and the second shielding layer banding portion (5495).

[0140] Fig. 12 is a cross-sectional view of a flexible circuit board (400) according to one embodiment of the present disclosure. The components described with reference to Fig. 12 may be partially or entirely identical to the components described with reference to Figs. 1 to 11. The components described with reference to Fig. 12 may be partially or entirely identical to the components described with reference to Figs. 13a to 13c.

[0141] According to one embodiment, the flexible circuit board (400) may include a substrate layer (441), a first conductive layer (442), a first adhesive layer (443), a first cover layer (444), a second conductive layer (446), a second adhesive layer (447), a second cover layer (448), a first rigid layer (451, 452), a second rigid layer (461, 462), a first ground layer (471), and a second ground layer (472). The description of the components described above (e.g., the substrate layer (441), the first conductive layer (442), the first adhesive layer (443), the first cover layer (444), the second conductive layer (446), the second adhesive layer (447), the second cover layer (448), the first rigid layer (451, 452), the second rigid layer (461, 462), the first ground layer (471), and the second ground layer (472)) can be equally applied to the description of the components described with reference to FIGS. 8 and 9.

[0142] According to one embodiment, the flexible circuit board (400) may include a first shielding layer (645). The first shielding layer (645) may include a first-first shielding layer portion (6451) disposed on a first rigid portion (410). The first shielding layer (645) may include a first-second shielding layer portion (6452) disposed on a second rigid portion (420). The first shielding layer (645) may include a first-third shielding layer portion (6453) disposed on a flexible portion (430). The first-first shielding layer portion (6451) may be connected to a first ground layer (471). The first-first shielding layer portion (6451) may be disposed between the first rigid layer (451) and the first cover layer (444). The first-second shielding layer portion (6452) may be connected to the second grounding layer (472). The first-second shielding layer portion (6452) may be positioned between the second rigid layer (461) and the first cover layer (444).

[0143] According to one embodiment, the flexible circuit board (400) may include a second shielding layer (649). The second shielding layer (649) may include a second-first shielding layer portion (6491) disposed on the first rigid portion (410). The second shielding layer (649) may include a second-second shielding layer portion (6492) disposed on the second rigid portion (420). The second shielding layer (649) may include a second-third shielding layer portion (6493) disposed on the flexible portion (430). The second-first shielding layer portion (6491) may be connected to the first ground layer (471). The second-first shielding layer portion (6491) may be disposed between the first rigid layer (452) and the second cover layer (448). The second-second shielding layer portion (6492) may be connected to the second grounding layer (472). The second-second shielding layer portion (6492) may be positioned between the second rigid layer (462) and the second cover layer (448).

[0144] According to one embodiment, the flexible circuit board (400) may include a first reinforcing layer (671, 672). The first reinforcing layer (671, 672) may be disposed between the first rigid layer (451, 452) and the first ground layer (471). The first reinforcing layer (671, 672) may include a first-first reinforcing layer (671) disposed between the first-first rigid layer (451) and the first ground layer (471). The first reinforcing layer (671, 672) may include a first-second reinforcing layer (672) disposed between the first-second rigid layer (452) and the first ground layer (471).

[0145] According to one embodiment, the flexible circuit board (400) may include a second reinforcing layer (673, 674). The second reinforcing layer (673, 674) may be disposed between the second rigid layer (461, 462) and the second ground layer (472). The second reinforcing layer (673, 674) may include a second-first reinforcing layer (673) disposed between the second-first rigid layer (461) and the second ground layer (472). The second reinforcing layer (673, 674) may include a second-second reinforcing layer (674) disposed between the second-second rigid layer (462) and the second ground layer (472).

[0146] FIGS. 13A, 13B, and 13C are drawings illustrating a method for manufacturing a flexible circuit board (400) according to one embodiment of the present disclosure. The components described with reference to FIGS. 13A to 13C may be partially or entirely identical to the components described with reference to FIGS. 1 to 12.

[0147] According to one embodiment, a method for manufacturing a flexible circuit board (400) may include a first process (S100), a second process (S200), and a third process (S300). The first process (S100) may be an operation of placing a substrate layer (441) and conductive layers (442, 446), as illustrated in FIG. 13a. The second process (S200) may be an operation of stacking a plurality of layers, as illustrated in FIG. 13b. The third process (S300) may be an operation of completing the flexible circuit board (400), as illustrated in FIG. 13c.

[0148] Referring to FIG. 13A, a first conductive layer (442) and a second conductive layer (446) can be bonded to a substrate layer (441). The first conductive layer (442) can be bonded to a first surface of the substrate layer (441), and the second conductive layer (446) can be bonded to a second surface of the substrate layer (441) opposite to the first surface. The first conductive layer (442) can include a plurality of holes (4424, 4425) and a plurality of portions (4421, 4422, 4423) spaced apart from each other based on the plurality of holes (4424, 4425).

[0149] Referring to FIG. 13b, other layers (e.g., a first adhesive layer (443), a first cover layer (444), a first shielding layer (445), a second adhesive layer (447), a second cover layer (448), a first rigid layer (451, 452), a second rigid layer (461, 462), a first grounding layer (4712, 4713), a second grounding layer (4722, 4723), and grounding protrusions (473, 575, 474, 576)) can be laminated on the assembly (441, 442, 446) of FIG. 13a. The first shielding layer (445) can include a plurality of through holes (445a).

[0150] Referring to FIG. 13c, after assembling as in FIG. 13b, the second shielding layer (449), the first ground layer (471), the second ground layer (472), the conductive vias (491, 492, 493), and the reinforcement (456, 457, 466, 467)) can be assembled.

[0151] An electronic device includes a housing, a circuit board positioned within the housing, a camera assembly connected to the circuit board, and an antenna. The electronic device includes a flexible printed circuit board connecting the camera assembly and the circuit board. The camera assembly and the antenna are positioned separately, and radio interference may occur between components of the camera assembly and the antenna. The flexible printed circuit board may include a shielding layer to reduce radio interference. Due to the structure of the shielding layer, a step may be formed at the connection point between the flexible printed circuit board and the camera assembly or connector. Due to the structure of the shielding layer, the shielding layer may not be properly grounded.

[0152] A problem to be solved in the present disclosure may be reducing radio interference between an antenna and a camera assembly.

[0153] The problem to be solved in the present disclosure may be to facilitate grounding of a flexible circuit board.

[0154] The problem to be solved in this disclosure is not limited to the problem mentioned above, and may be determined in various ways without departing from the spirit and scope of this disclosure.

[0155] An electronic device according to various embodiments of the present disclosure can reduce radio interference between an antenna and a camera assembly by arranging a shielding layer on a flexible circuit board.

[0156] An electronic device according to various embodiments of the present disclosure can facilitate grounding of a flexible circuit board by connecting a shielding layer and a ground layer.

[0157] The effects that can be obtained from the present disclosure are not limited to the effects mentioned above, and other effects that are not mentioned can be clearly understood by a person having ordinary skill in the art to which the present disclosure belongs from the description below.

[0158] An electronic device (e.g., 101 of FIGS. 1 to 13C) according to one embodiment of the present disclosure may include a housing (e.g., 301 of FIGS. 1 to 13C).

[0159] An electronic device (e.g., 101 of FIGS. 1 to 13C) according to one embodiment of the present disclosure may include a circuit board (e.g., 340 of FIGS. 1 to 13C) disposed inside the housing (e.g., 301 of FIGS. 1 to 13C).

[0160] An electronic device (e.g., 101 of FIGS. 1 to 13C) according to one embodiment of the present disclosure may include a camera assembly (e.g., 307 of FIGS. 1 to 13C) spaced apart from the circuit board (e.g., 340 of FIGS. 1 to 13C).

[0161] An electronic device (e.g., 101 of FIGS. 1 to 13C) according to one embodiment of the present disclosure may include a flexible circuit board (e.g., 400 of FIGS. 1 to 13C) including a first rigid part (e.g., 410 of FIGS. 1 to 13C) connected to the camera assembly (e.g., 307 of FIGS. 1 to 13C), a second rigid part (e.g., 420 of FIGS. 1 to 13C) connected to the circuit board (e.g., 340 of FIGS. 1 to 13C), and a flexible part (e.g., 430 of FIGS. 1 to 13C) connecting the first rigid part (e.g., 410 of FIGS. 1 to 13C) and the second rigid part (e.g., 420 of FIGS. 1 to 13C).

[0162] A flexible circuit board (e.g., 400 of FIGS. 1 to 13C) according to one embodiment of the present disclosure may include a substrate layer (e.g., 441 of FIGS. 1 to 13C).

[0163] A flexible circuit board (e.g., 400 of FIGS. 1 to 13C) according to one embodiment of the present disclosure may include a first conductive layer (e.g., 442 of FIGS. 1 to 13C) combined with the substrate layer (e.g., 441 of FIGS. 1 to 13C).

[0164] A flexible circuit board (e.g., 400 of FIGS. 1 to 13c) according to one embodiment of the present disclosure includes a first-first shielding layer portion (e.g., 4451 of FIGS. 1 to 13c) positioned on the first rigid portion (e.g., 410 of FIGS. 1 to 13c), a first-second shielding layer portion (e.g., 4452 of FIGS. 1 to 13c) positioned on the second rigid portion (e.g., 420 of FIGS. 1 to 13c), and a first-third shielding layer portion (e.g., 4453 of FIGS. 1 to 13c) positioned on the flexible portion (e.g., 430 of FIGS. 1 to 13c), and a first conductive layer (e.g., 442 of FIGS. 1 to 13c) spaced apart from the first shielding layer (e.g., 4451 of FIGS. 1 to 13c) 13c (445) may be included.

[0165] A flexible circuit board (e.g., 400 of FIGS. 1 to 13C) according to one embodiment of the present disclosure may include a first ground layer (e.g., 471 of FIGS. 1 to 13C) extending at least partly along the perimeter of the first rigid portion (e.g., 410 of FIGS. 1 to 13C) and connected to the first shielding layer (e.g., 445 of FIGS. 1 to 13C).

[0166] A flexible circuit board (e.g., 400 of FIGS. 1 to 13C) according to one embodiment of the present disclosure may include a first ground protrusion portion (e.g., 473 of FIGS. 1 to 13C) protruding from the first ground layer (e.g., 471 of FIGS. 1 to 13C) and positioned between the first ground layer (e.g., 471 of FIGS. 1 to 13C) and the first shielding layer (e.g., 445 of FIGS. 1 to 13C).

[0167] According to one embodiment of the present disclosure, the first shielding layer (e.g., 445 of FIGS. 1 to 13C) may include an extension portion (e.g., 4451a of FIGS. 1 to 13C) spaced apart from the first ground layer (e.g., 471 of FIGS. 1 to 13C).

[0168] According to one embodiment of the present disclosure, the first shielding layer (e.g., 445 of FIGS. 1 to 13C) may include a banding portion (e.g., 4451b of FIGS. 1 to 13C) that connects the extension portion (e.g., 4451a of FIGS. 1 to 13C) and the first ground layer (e.g., 471 of FIGS. 1 to 13C) and surrounds at least a portion of the first ground protrusion portion (e.g., 473 of FIGS. 1 to 13C).

[0169] A flexible circuit board (e.g., 400 of FIGS. 1 to 13C) according to one embodiment of the present disclosure may include a second ground layer (e.g., 472 of FIGS. 1 to 13C) extending at least a portion along a perimeter of the second rigid portion (e.g., 420 of FIGS. 1 to 13C) and connected to the first shielding layer (e.g., 445 of FIGS. 1 to 13C).

[0170] A flexible circuit board (e.g., 400 of FIGS. 1 to 13C) according to one embodiment of the present disclosure may include a second ground protrusion portion (e.g., 474 of FIGS. 1 to 13C) protruding from the second ground layer (e.g., 472 of FIGS. 1 to 13C) and positioned between the second ground layer (e.g., 472 of FIGS. 1 to 13C) and the first shielding layer (e.g., 445 of FIGS. 1 to 13C).

[0171] A flexible circuit board (e.g., 400 of FIGS. 1 to 13C) according to one embodiment of the present disclosure may include a second conductive layer (e.g., 446 of FIGS. 1 to 13C) positioned opposite to the first conductive layer (e.g., 442 of FIGS. 1 to 13C) with respect to the substrate layer (e.g., 441 of FIGS. 1 to 13C).

[0172] A flexible circuit board (e.g., 400 of FIGS. 1 to 13C) according to one embodiment of the present disclosure may include a second shielding layer (e.g., 449 of FIGS. 1 to 13C) spaced apart from the second conductive layer (e.g., 446 of FIGS. 1 to 13C) and coupled to the first ground layer (e.g., 471 of FIGS. 1 to 13C).

[0173] According to one embodiment of the present disclosure, the second shielding layer (e.g., 449 of FIGS. 1 to 13C) may include a second-first shielding layer portion (e.g., 4491 of FIGS. 1 to 13C) located on the first rigid portion (e.g., 410 of FIGS. 1 to 13C).

[0174] According to one embodiment of the present disclosure, the second shielding layer (e.g., 449 of FIGS. 1 to 13C) may include a second-second shielding layer portion (e.g., 4492 of FIGS. 1 to 13C) located on the second rigid portion (e.g., 420 of FIGS. 1 to 13C).

[0175] According to one embodiment of the present disclosure, the second shielding layer (e.g., 449 of FIGS. 1 to 13C) may include a second-third shielding layer portion (e.g., 4493 of FIGS. 1 to 13C) located in the flexible portion (e.g., 430 of FIGS. 1 to 13C).

[0176] According to one embodiment of the present disclosure, the second shielding layer (e.g., 449 of FIGS. 1 to 13C) may include a first connecting portion (e.g., 4494 of FIGS. 1 to 13C) connecting the 2-1 shielding layer portion (e.g., 4491 of FIGS. 1 to 13C) and the 2-3 shielding layer portion (e.g., 4493 of FIGS. 1 to 13C).

[0177] According to one embodiment of the present disclosure, the second shielding layer (e.g., 449 of FIGS. 1 to 13C) may include a second connecting portion (e.g., 4495 of FIGS. 1 to 13C) connecting the 2-2 shielding layer portion (e.g., 4492 of FIGS. 1 to 13C) and the 2-3 shielding layer portion (e.g., 4493 of FIGS. 1 to 13C).

[0178] A flexible circuit board (e.g., 400 of FIGS. 1 to 13C) according to one embodiment of the present disclosure may include a first rigid layer (e.g., 451 of FIGS. 1 to 13C) disposed between the first ground layer (e.g., 471 of FIGS. 1 to 13C) and the first shielding layer (e.g., 471 of FIGS. 1 to 13C).

[0179] The first ground layer (e.g., 471 of FIGS. 1 to 13C) according to one embodiment of the present disclosure may include a first side portion (e.g., 4711 of FIGS. 1 to 13C) covering an end portion of each of the substrate layer (e.g., 441 of FIGS. 1 to 13C), the first conductive layer (e.g., 442 of FIGS. 1 to 13C), and the first shielding layer (e.g., 445 of FIGS. 1 to 13C).

[0180] According to one embodiment of the present disclosure, a first device coupling portion (e.g., 4712 of FIGS. 1 to 13C) extending from the first side portion (e.g., 4711 of FIGS. 1 to 13C) and positioned between the first rigid layer (e.g., 451 of FIGS. 1 to 13C) and the camera assembly (e.g., 307 of FIGS. 1 to 13C) may be included.

[0181] A flexible circuit board (e.g., 400 of FIGS. 1 to 13C) according to one embodiment of the present disclosure may include a first conductive via (e.g., 491 of FIGS. 1 to 13C) connected to the first ground layer (e.g., 471 of FIGS. 1 to 13C).

[0182] According to one embodiment of the present disclosure, the first conductive via (e.g., 491 of FIGS. 1 to 13C) can penetrate the substrate layer (e.g., 441 of FIGS. 1 to 13C), the first conductive layer (e.g., 442 of FIGS. 1 to 13C), and the first shielding layer (e.g., 445 of FIGS. 1 to 13C).

[0183] A flexible circuit board (e.g., 400 of FIGS. 1 to 13C) according to one embodiment of the present disclosure may include a first adhesive layer (e.g., 443 of FIGS. 1 to 13C) disposed between the first conductive layer (e.g., 442 of FIGS. 1 to 13C) and the first shielding layer (e.g., 445 of FIGS. 1 to 13C).

[0184] A flexible circuit board (e.g., 400 of FIGS. 1 to 13C) according to one embodiment of the present disclosure may include a first cover layer (e.g., 444 of FIGS. 1 to 13C) disposed between the first adhesive layer (e.g., 443 of FIGS. 1 to 13C) and the first shielding layer (e.g., 445 of FIGS. 1 to 13C).

[0185] A flexible circuit board (e.g., 400 of FIGS. 1 to 13C) according to one embodiment of the present disclosure may include a first rigid body (e.g., 453 of FIGS. 1 to 13C) disposed between the first conductive layer (e.g., 442 of FIGS. 1 to 13C) and the first ground layer (e.g., 471 of FIGS. 1 to 13C).

[0186] A flexible circuit board (e.g., 400 of FIGS. 1 to 13C) according to one embodiment of the present disclosure may include a second conductive layer (e.g., 446 of FIGS. 1 to 13C) positioned opposite to the first conductive layer (e.g., 442 of FIGS. 1 to 13C) with respect to the substrate layer (e.g., 441 of FIGS. 1 to 13C).

[0187] A flexible circuit board (e.g., 400 of FIGS. 1 to 13C) according to one embodiment of the present disclosure may include a second shielding layer (e.g., 549 of FIGS. 1 to 13C) spaced apart from the second conductive layer (e.g., 446 of FIGS. 1 to 13C).

[0188] A flexible circuit board (e.g., 400 of FIGS. 1 to 13C) according to one embodiment of the present disclosure may include a third ground protrusion portion (e.g., 575 of FIGS. 1 to 13C) protruding from the first ground layer (e.g., 471 of FIGS. 1 to 13C) and at least a portion of which is surrounded by the second shielding layer (e.g., 549 of FIGS. 1 to 13C).

[0189] According to one embodiment of the present disclosure, the first-first shielding layer portion (e.g., 6451 of FIGS. 1 to 13c), the first-second shielding layer portion (e.g., 6452 of FIGS. 1 to 13c), and the first-third shielding layer portion (e.g., 6453 of FIGS. 1 to 13c) may be arranged parallel to each other.

[0190] A flexible circuit board (e.g., 400 of FIGS. 1 to 13C) according to one embodiment of the present disclosure may include a substrate layer (e.g., 441 of FIGS. 1 to 13C) extended to correspond to each of a first rigid portion (e.g., 410 of FIGS. 1 to 13C), a second rigid portion (e.g., 420 of FIGS. 1 to 13C) spaced apart from the first rigid portion (e.g., 410 of FIGS. 1 to 13C), and a flexible portion (e.g., 430 of FIGS. 1 to 13C) connecting the first rigid portion (e.g., 410 of FIGS. 1 to 13C) and the second rigid portion (e.g., 420 of FIGS. 1 to 13C).

[0191] Although the detailed description of this document has described specific embodiments, it will be apparent to those skilled in the art that various modifications are possible without departing from the scope of this document.

Claims

1. In an electronic device (101), Housing (301); A circuit board (340) placed inside the above housing (301); A camera assembly (307) including a camera and spaced apart from the circuit board (340); and A flexible circuit board (400) including a first rigid part (410) connected to the camera assembly (307), a second rigid part (420) connected to the circuit board (340), and a flexible part (430) connecting the first rigid part (410) and the second rigid part (420), The above flexible circuit board (400) is Substrate layer (441); A first conductive layer (442) combined with the above-mentioned substrate layer (441); A first shielding layer (445) comprising a first-first shielding layer portion (4451) positioned on the first rigid portion (410), a first-second shielding layer portion (4452) positioned on the second rigid portion (420), and a first-third shielding layer portion (4453) positioned on the flexible portion (430), and spaced apart from the first conductive layer (442); and An electronic device (101) comprising a first ground layer (471) extending at least partly along the perimeter of the first rigid portion (410) and connected to the first shielding layer (445).

2. In paragraph 1, The above flexible circuit board (400) is An electronic device including a first ground protrusion portion (473) protruding from the first ground layer (471) and positioned between the first ground layer (471) and the first shielding layer (445).

3. In paragraph 2, The above first shielding layer (445) is An extension portion (4451a) spaced apart from the first ground layer (471); and An electronic device including a banding portion (4451b) connecting the above-described extension portion (4451a) and the above-described first ground layer (471) and surrounding at least a portion of the above-described first grounding protrusion portion (473).

4. In any one of paragraphs 1 to 3, The above flexible circuit board (400) is An electronic device further comprising a second ground layer (472) extending at least partly along the perimeter of the second rigid portion (420) and connected to the first shielding layer (445).

5. In paragraph 4, The above flexible circuit board (400) is An electronic device including a second grounding protrusion portion (474) protruding from the second grounding layer (472) and positioned between the second grounding layer (472) and the first shielding layer (445).

6. In any one of paragraphs 1 to 5, The above flexible circuit board (400) is A second conductive layer (446) positioned opposite to the first conductive layer (442) based on the above substrate layer (441); and An electronic device further comprising a second shielding layer (449) spaced apart from the second conductive layer (446) and coupled to the first ground layer (471).

7. In paragraph 6, The above second shielding layer (449) is A second-first shielding layer portion (4491) located on the first rigid portion (410); A second-second shielding layer portion (4492) located on the second rigid portion (420); The 2nd-3rd shielding layer portion (4493) located in the above flexible portion (430); A first connecting portion (4494) connecting the above 2-1 shielding layer portion (4491) and the above 2-3 shielding layer portion (4493); and An electronic device including a second connecting portion (4495) connecting the second-second shielding layer portion (4492) and the second-third shielding layer portion (4493).

8. In any one of paragraphs 1 to 7, The above flexible circuit board (400) is An electronic device further comprising a first rigid layer (451) disposed between the first ground layer (471) and the first shielding layer (445).

9. In paragraph 8, The above first ground layer (471) is A first side portion (4711) covering each end of the above-mentioned substrate layer (441), the first conductive layer (442) and the first shielding layer (445); and An electronic device including a first device coupling portion (4712) extending from the first side portion (4711) and positioned between the first rigid layer (451) and the camera assembly (307).

10. In any one of paragraphs 1 to 9, The above flexible circuit board (400) is An electronic device further comprising a first conductive via (491) connected to the first ground layer (471).

11. In clause 10, The above first challenge via (491) is An electronic device penetrating the above-mentioned substrate layer (441), the first conductive layer (442), and the first shielding layer (445).

12. In any one of paragraphs 1 to 11, The above flexible circuit board (400) is A first adhesive layer (443) arranged between the first conductive layer (442) and the first shielding layer (445); and An electronic device further comprising a first cover layer (444) disposed between the first adhesive layer (443) and the first shielding layer (445).

13. In any one of paragraphs 1 to 12, The above flexible circuit board (400) is An electronic device further comprising a first rigid body (453) disposed between the first conductive layer (442) and the first ground layer (471).

14. In any one of paragraphs 1 to 13, The above flexible circuit board (400) is A second conductive layer (446) positioned opposite to the first conductive layer (442) based on the above substrate layer (441); A second shielding layer (549) spaced apart from the second challenge layer (446); and An electronic device further comprising a third grounding protrusion portion (575) protruding from the first grounding layer (471) and at least partly surrounded by the second shielding layer (549).

15. In any one of paragraphs 1 to 14, An electronic device in which the first-first shielding layer portion (6451), the first-second shielding layer portion (6452), and the first-third shielding layer portion (6453) are arranged parallel to each other.

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