Radio frequency device

Abstract

The present invention relates to the field of radio frequency circuits, in particular to a radio frequency device which comprises a plurality of dielectric plates; functional modules are respectively arranged on the dielectric plates; the functional modules comprise integrated circuits and electronic components; the dielectric plates are sequentially stacked; the dielectric plates at middle layers are partially hollowed out to form closed spaces, the closed spaces being used for placing the integrated circuits and electronic components. The design of the present invention can improve the isolation degree while maintaining the advantages of high integration level and small size of systems on chip.

Description

A radio frequency device This application claims priority to Chinese invention patent application 202311856874.2 filed on December 29, 2023. Technical Field

[0001] The present invention relates to the field of radio frequency circuits, and in particular to a radio frequency device. Background Art

[0002] Integrated circuits (chips) are highly integrated electronic devices used in a wide variety of fields. Their compact size and high integration have made them widely popular. To further enhance system integration, the concept of system-on-chip (SOC) has emerged. A SoC integrates digital circuits, analog circuits, radio frequency circuits, and antennas on a single chip. The high integration of SoCs allows electronic systems to be made smaller and smaller.

[0003] Based on existing highly integrated SoCs, products can be made small enough to meet market demand while achieving the same functionality. However, highly integrated SoCs also bring new challenges. From conception to mass production, a new SoC undergoes multiple rounds of verification and testing. If any specifications are not met, the system must be redesigned and remanufactured. Even minor issues require redoing the entire system, including digital circuits, analog circuits, RF circuits, and antennas. This is costly and time-consuming, and the cycle from design to productization is typically three to five years. This is due to the difficulty of quickly modifying and adjusting a chip once it has been finalized. Furthermore, isolation is a key performance metric for miniaturized SoCs. High isolation prevents interference between signals in the system, resulting in more stable performance. Low isolation, however, results in unstable device operation. Summary of the Invention

[0004] The purpose of the present invention is to address the problems of current on-chip systems that are difficult to quickly modify after being finalized and have low isolation. The present invention proposes a radio frequency device that inherits the advantages of high integration and small size of the on-chip system. At the same time, since the various parts are modularly split, only the parts to be modified need to be modified and reassembled without the need to redo the entire on-chip system. In addition, the isolation of the device of the present invention is significantly improved.

[0005] In order to achieve the above-mentioned purpose of the invention, the present invention provides the following technical solutions: A radio frequency device, comprising several dielectric plates, on which functional modules are arranged, and the functional modules include integrated circuits and electronic components. Several dielectric plates are stacked in sequence, and the dielectric plates in the middle layer are partially hollowed out to form an enclosed space, and the enclosed space is used to place integrated circuits and / or electronic components.

[0006] As a preferred solution, the dielectric board is a high-speed printed circuit board or a common printed circuit board.

[0007] As a preferred solution, there is electrical connection between the integrated circuit, the electronic components and the dielectric board.

[0008] As a preferred solution, there are electrical connections between the dielectric plates.

[0009] As a preferred solution, the electrical connection between the functional modules is achieved by means of: ball array packaging, gold fingers, plug-in pins, L-shaped pins, surface mount pins, gold wire bonding and mechanical screw connections.

[0010] As a preferred solution, the enclosed space is also used to fill with heat dissipation material or metal. The chip can be placed near the heat dissipation hole to facilitate chip heat dissipation.

[0011] As a preferred solution, it also includes an antenna, which is printed on the surface of the outermost dielectric plate.

[0012] As a preferred solution, the antenna is grounded to achieve ESD protection, and the grounding wire runs through several dielectric plates.

[0013] As a preferred solution, an integrated circuit is placed in the enclosed space, and the integrated circuit is a radio frequency chip, which can achieve a combination of antenna radiation and radio frequency chip electromagnetic shielding, radiating beneficial electromagnetic energy while shielding harmful electromagnetic energy.

[0014] As a preferred solution, the stacked dielectric plates are secured using metal screws and metal vias. The spacing between the edges of the metal screws and metal vias is no greater than K, where K is determined by one-tenth of the RF signal wavelength. The intermediate slotted dielectric plate, metal screws, metal vias in the dielectric plates, and the metal ground plane of the upper dielectric plate together form an "equivalent electromagnetic shield" (enclosed space), which offers superior electromagnetic interference resistance compared to traditional packaged antenna systems.

[0015] Compared with the prior art, the beneficial effects of the present invention are as follows: The present invention proposes a radio frequency device, which inherits the advantages of high integration and small size of the on-chip system. At the same time, since each part is modularly split, only the part to be modified needs to be modified and reassembled, without the need to redo the entire system, and the device isolation of the present invention is significantly improved. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 is a cross-sectional schematic diagram of a modular RF device in Example 1 of the present invention; Figure 2 is a schematic diagram of the antenna grounding of the modular RF device in Example 1 of the present invention; Figure 3(a) is a schematic diagram of the RF circuit design without a metal shielding cover in Example 2 of the present invention; Figure 3(b) is a schematic diagram of the RF circuit design with a metal shielding cover in Example 2 of the present invention; Figure 4(a) is a schematic diagram of the packaged antenna system in Example 2 of the present invention; Figure 4(b) is a schematic diagram of the RF module with an electromagnetic shielding structure in Example 2 of the present invention.

[0017] Figure numerals: 101-antenna, 102-dielectric layer one; 103-dielectric layer two; 104-dielectric layer three; 105-dielectric layer four; 106-dielectric layer five; 107-ball array pin; 108-L-shaped pin; 109-chip; 110-1 first enclosed cavity; 110-2 second dielectric layer cavity; 110-3 second enclosed cavity; 111-packaged electronic components; 112-metal screws; 113-metal traces; 114-electroplated vias; 115-metal or other material fillings; 116-antenna ground wire; 117-printed circuit board; 118-electromagnetic interference; 119-metal shielding cover; 120-dielectric board; 121-middle grooved dielectric board; 122-screws; 123-metal vias; 124-metal ground. DETAILED DESCRIPTION

[0018] The present invention will be further described in detail below in conjunction with test examples and specific embodiments. However, this should not be understood as limiting the scope of the present invention to the following embodiments, and all technologies implemented based on the present invention fall within the scope of the present invention.

[0019] Example 1 The radio frequency device is composed of multiple dielectric boards and integrated circuits (chips). The radio frequency device also includes packaged electronic components and an antenna. The antenna is printed on the dielectric board, and the antenna is grounded to achieve ESD protection. The dielectric board is a multi-layer, high-speed printed circuit board or ordinary printed circuit board made of different materials. Some layers in the dielectric board can be partially hollowed out. If the radio frequency device contains packaged electronic components, the hollowed-out parts of some layers in the dielectric board are used to place integrated circuits, packaged electronic components, fill metal or other materials. There can be electrical connections between different dielectric layers, between dielectric boards and integrated circuits, and between dielectric boards and packaged electronic components. The electrical connection methods include but are not limited to: ball array packaging, gold fingers, plug-in pins, L-shaped pins, surface mount pins, gold wire bonding, mechanical screw connections, etc.

[0020] The dielectric board can be slotted to create heat dissipation holes, and the chip can be placed near the heat dissipation holes to facilitate heat dissipation. The heat dissipation holes can be filled with materials including but not limited to metal, silicone grease, etc.

[0021] The antenna can be printed on or inside the dielectric board. The antenna can be grounded to achieve ESD (Electro-Static Discharge) protection.

[0022] Figure 1 is a cross-sectional schematic diagram of a modular RF device. The RF module consists of a multilayer dielectric board and an integrated circuit (chip). The multilayer dielectric board includes dielectric layer 1 102, dielectric layer 2 103, dielectric layer 3 104, dielectric layer 4 105, and dielectric layer 5 106, stacked in sequence. The module also includes packaged electronic components and an antenna 101 located on top of dielectric layer 1 102. The dielectric board can be a multilayer printed circuit board 117 made of various materials, including high-speed circuit boards, standard circuit boards, and low-temperature co-fired ceramic boards. Metal wires run inside and on the surface of the dielectric board. Each layer of the dielectric board can be hollowed out, allowing chips and electronic components to be placed on the surface or within the cavity of the dielectric board. The cavity can also be filled with materials including, but not limited to, metal and silicone grease. Electrical connections can be established between the chip, electronic components, and the dielectric board, as well as between different dielectric boards. The electrical connection methods include but are not limited to: ball array packaging, gold fingers, straight pins, L-shaped pins, surface mount pins, gold wire bonding, mechanical screw connections, etc.

[0023] In Figure 1, the ball array pins 107 are set below the dielectric layer 5 106, and the chip 109 is placed below the dielectric layer 4 105 and is located in the second dielectric layer cavity 110-2. The dielectric layer cavity 110 is a cavity formed by the dielectric layer 4 105 and the dielectric layer 5 106. The chip 109 and the dielectric layer 5 106 are connected by L-shaped pins 108; after the dielectric layer 3 104 is partially hollowed out, a second closed cavity 110-3 is formed with the dielectric layer 2 103 and the dielectric layer 4 105; after the dielectric layer 2 103 is partially hollowed out, a first closed cavity 110-1 is formed with the dielectric layer 1 102 and the dielectric layer 3 104. The packaged electronic components 111 are installed in the second enclosed cavity 110-3, the metal or other material filler 115 is installed in the first enclosed cavity 110-1, the metal screws 112 pass through the multi-layer dielectric board, and the metal traces are respectively arranged on the upper surface of the dielectric layer 1 102, between the dielectric layer 2 103 and the dielectric layer 3 104. There is a plated via 114 between the metal trace 113 on the upper surface of one dielectric layer 102 and the packaged electronic component 111, and the plated via 114 passes through the dielectric layer 1 102 and the dielectric layer 2 103.

[0024] Furthermore, the antenna can be printed on or within dielectric board 120. The antenna can be grounded to provide ESD (electro-static discharge) protection. A schematic diagram of modular RF device antenna grounding is shown in Figure 2 , where the antenna is grounded via 116 . The antenna ground wire runs through multilayer dielectric board 120, connecting antenna 101 on dielectric layer 102 to ball array pins 107 on the bottom layer (beneath dielectric layer 5 106).

[0025] This RF module has the characteristics of small size and high integration. It can be directly used as an independent small module in the design of electronic systems, simplifying the hardware design difficulty of users and reducing the hardware design cycle. This RF module has the characteristics of short adjustment cycle and low cost. It can be quickly adjusted according to user needs. Compared with the 3-5 year cycle of the on-chip system, the cycle of this RF module is about one month.

[0026] Example 2: In traditional RF circuit designs, a metal shield 119 is placed over the RF chip to shield electromagnetic noise from the system, as shown in Figures 3(a) and 3(b). Figure 3(a) illustrates the RF circuit design without the metal shield 119, while Figure 3(b) illustrates the RF circuit design with the metal shield 119.

[0027] Figure 4(a) is a schematic diagram of a packaged antenna system. As shown in Figure 4(a), the packaged antenna system in the prior art cannot be loaded with an electromagnetic shielding cover. Electromagnetic noise on the system's printed circuit board can be easily coupled into the chip, resulting in reduced chip performance. This is one of the reasons why the packaged antenna system has not been widely used.

[0028] Based on the miniaturized, universal RF module in Example 1, electromagnetic shielding can still be achieved without a metal shield, as shown in Figure 4(b). Figure 4(b) is a schematic diagram of the RF module in this embodiment. The middle slotted dielectric plate 121, metal screws (screws 122), metal vias 123 in the dielectric plate, and the metal ground 124 of the upper dielectric plate together constitute an "equivalent electromagnetic shield" (enclosed space), which can resist electromagnetic interference 118 compared to traditional packaged antenna systems. The edge spacing of metal components such as the metal vias 123 and the metal screws 122 is no greater than 0.52 mm. This spacing condition is set to meet shielding requirements and must be less than one-tenth of the wavelength corresponding to the operating frequency. Since the selected frequency is 57 GHz, the corresponding spacing is no greater than 0.52 mm. As a preferred solution, this electromagnetic shielding structure includes an antenna, achieving a combination of radiation and electromagnetic shielding, radiating beneficial electromagnetic energy while shielding harmful electromagnetic energy.

[0029] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention should be included in the scope of protection of the present invention.

Claims

1. A radio frequency device, comprising a plurality of dielectric plates, on which a functional module is provided, the functional module including an integrated circuit and electronic components, characterized in that, A number of dielectric plates are stacked in sequence, and a part of the dielectric plate in the middle layer is hollowed out to form a sealed space for placing integrated circuits and / or electronic components.

2. The radio frequency device according to claim 1, wherein The dielectric plate is a high-speed printed circuit board or a general printed circuit board.

3. A radio frequency device as claimed in claim 1, wherein, There is an electrical connection between the integrated circuit, the electronic component and the dielectric plate.

4. A radio frequency device according to claim 1, wherein There is an electrical connection between a number of dielectric plates.

5. A radio frequency device as claimed in claim 1, wherein The implementation methods of the electrical connection between the functional modules include: ball grid array packaging, gold finger, straight pin, L-shaped pin, surface mount pin, wire bonding and mechanical screw connection.

6. A radio frequency device according to claim 1, wherein The sealed space is also used for filling heat dissipation materials.

7. A radio frequency device according to claim 1, wherein It further includes an antenna printed on the surface of the outermost dielectric plate.

8. A radio frequency device according to claim 7, wherein The antenna realizes ESD protection through grounding, and the grounding wire penetrates through all dielectric plates.

9. A radio frequency device according to claim 8, wherein An integrated circuit, which is a radio frequency chip, is placed in the sealed space.

10. A radio frequency device as claimed in claim 9, wherein After the dielectric plates are stacked, they are fixed by metal screws and metal vias, and the interval between the edges of the metal screws and the metal vias is not greater than K, where K is determined according to one-tenth of the radio frequency signal wavelength.

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