Solid wood grain coaster board structure and manufacturing method

By adopting multi-layer thermal conductivity, heat dissipation, heat insulation integrated matrix structure and physical temperature control technology in solid wood grain coaster panels, the existing solid wood coaster panels are easily deformed and not wear-resistant at high temperatures, achieving efficient temperature control and heat insulation effects, extending product life and reducing costs.

WO2025055497A1PCT designated stage expired Publication Date: 2025-03-20SHANGHAI SHENGHE INTELLIGENT TECH CO LTD
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Patent Information

Application Number
PCT/CN2024/103506
Authority / Receiving Office
WO · WO
Patent Type
Applications
Current Assignee / Owner
Priority Date
2023-09-11
Filing Date
2024-07-04
Publication Date
2025-03-20

AI Technical Summary

Technical Problem

The existing solid wood coaster panels are prone to cracking, deforming, not wear-resistant and poor stain resistance at high temperatures. The traditional production methods are inefficient and costly, making it difficult to meet the needs of high temperature temperature control and heat insulation.

Method used

Multi-layer thermal conductivity, heat dissipation and heat insulation integrated matrix structures are adopted, including natural plant cortex, graphene thermal conduction and functional layer, aluminum foil thermal conduction layer, PET thermal insulation sheet layer, etc. The bonding strength and density are improved through physical temperature control technology and high-pressure synthesis technology.

Benefits of technology

It achieves natural temperature control, heat insulation and heat dissipation effects, extends the service life of solid wood grain coaster panels, improves the durability and aesthetics of the product, and reduces production costs.

✦ Generated by Eureka AI based on patent content.

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Abstract

A solid wood grain coaster board structure and a manufacturing method, relating to the technical field of panel machining. The solid wood grain coaster board structure comprises, successively arranged from top to bottom, a protective layer, a first adhesive layer (3), an adhesive adhesion primer coating (4), a first pattern effect layer, a UV primer coating (7), a natural plant leather layer (8), a second adhesive layer (9), a first heat transfer layer, a third adhesive layer (12), a thin filler interlayer (13), a fourth adhesive layer (14) and a second heat transfer layer, the protective layer comprising a transparent protective film layer (2) and an antibacterial hardened protective layer (1) which are successively arranged from bottom to top above the first adhesive layer (3), and the first pattern effect layer comprising a first print effect enhancement primer coating (6) and a first pattern printing layer (5) which are successively arranged from bottom to top above the UV primer coating; and further comprises a base body sealing resin adhesive edge sealing layer (19) that surrounds and adheres to the peripheral surface layer of a coaster board base body.
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Description

Solid wood grain pad structure and manufacturing method Technical Field

[0001] The present invention relates to the technical field of panel processing, in particular to a solid wood grain pad structure and a manufacturing method, and more particularly to an ultra-thin solid wood grain coaster panel with physical temperature control and a manufacturing method thereof. Background Art

[0002] The natural beauty of natural wood grain is commonly found in home decor and other fields. Coasters, placemats, and tea tray panels, particularly those used in the wine, tea, and coffee industries, have very stringent requirements for thickness, wear resistance, water resistance, stain resistance, temperature resistance, heat dissipation, thermal insulation, and aging resistance. The requirements for water resistance, heat resistance, heat dissipation, thermal insulation, and wear resistance are particularly stringent to ensure that the coaster base and tabletop are not damaged by high temperatures. However, among the many problems encountered in daily life with traditional coasters, placemats, and tea tray panels, the most significant is their limited high-temperature resistance, poor temperature control, insulation, and heat dissipation, and surface wear, which is prone to cracking, poor stain resistance, low strength, aging, and damage.

[0003] At present, the most common coaster base materials on the market are: tempered glass, PVC soft glass, TPU soft glass, tempered film, leather, knitted fabric, bamboo, wood, logs, ceramics, metal, hand-woven and other materials and forms.

[0004] Coasters are an indispensable accessory to the global culture of wine, tea, and coffee. Solid wood coasters are common in daily use. However, due to the natural expansion and contraction characteristics of solid wood when exposed to water, deformation, cracking, discoloration, and scratches are the most obvious problems. To address these issues, high-quality or precious wood with high air-dry density can only be used as the main material, which limits the choice of wood varieties and natural textures. Furthermore, this leads to low production efficiency, high material loss, high wood costs, complicated processes, and high prices.

[0005] In order to effectively realize the iterative upgrade of traditional solid wood coasters, placemats, and tea tray panels and fill the gaps in the domestic and foreign markets, an ultra-thin solid wood grain coaster panel with physical temperature control and a production method thereof are proposed, which can maximize the beauty of natural bamboo and wood textures, and has multiple practical effects such as temperature control, heat insulation and heat dissipation, anti-slip, scratch resistance, waterproof and stain-resistant, ultra-thin, lightweight, low cost, easy processing, low loss, and durability, as well as cultural and artistic creation and appreciation.

[0006] Summary of the Invention

[0007] In view of the defects in the prior art, the purpose of the present invention is to provide a solid wood grain pad structure and a manufacturing method.

[0008] According to the present invention, a solid wood grain backing plate structure is provided, comprising, arranged in order from top to bottom, a protective layer, a first adhesive layer, an adhesive adhesion primer, a first pattern effect layer, a UV primer, a natural plant cortex layer, a second adhesive layer, a first heat-conducting layer, a third adhesive layer, a filling sheet interlayer, a fourth adhesive layer, and a second heat-conducting layer; and further comprising a base sealing resin adhesive edge sealing layer surrounding and attached to the surface of the outer facade of the backing plate base.

[0009] Preferably, a second pattern effect layer is further provided below the second heat conducting layer; or a base material layer is further provided below the second heat conducting layer.

[0010] Preferably, the protective layer includes a transparent protective film layer and an antibacterial hardened protective layer arranged in sequence from bottom to top above the first adhesive layer; the first pattern effect layer includes a first printing effect enhancing primer layer and a first pattern printing layer arranged in sequence from bottom to top above the UV bottom sealing coating; the second pattern effect layer includes a second printing effect enhancing primer layer and a second pattern printing layer arranged in sequence from top to bottom below the second thermal conductive layer; the base material layer includes one or more of composite cork, rubber soft magnetic sheet, felt cloth, solid color or imitation texture plastic sheet, solid color or imitation texture metal sheet, water-absorbing and anti-slip material.

[0011] Preferably, the first heat-conducting layer includes a first graphene heat-conducting functional layer and a second metal foil layer sequentially arranged from top to bottom; the second heat-conducting layer includes a third graphene heat-conducting functional layer and a fourth metal foil layer sequentially arranged from top to bottom.

[0012] According to the present invention, a method for manufacturing a solid wood grain backing plate structure comprises the following steps:

[0013] Step S1: preparing materials:

[0014] Pre-processing the PET transparent protective film to form a protective layer;

[0015] The natural plant leather is stitched together to form a natural plant leather layer;

[0016] Processing the metal foil to form a first heat-conducting layer or a second heat-conducting layer;

[0017] Processing the sandwich sheet to form a filled sheet sandwich;

[0018] Step S2, preliminary synthesis:

[0019] The natural plant cortex layer, the first heat-conducting layer, the filling sheet interlayer, and the second heat-conducting layer prepared in step S1 are stacked in sequence from top to bottom and pressed together by gluing to form a cover substrate, a UV bottom-sealing coating is formed on the upper surface of the natural plant cortex layer of the cover substrate, and then a first printing effect enhancing primer layer is formed on the upper surface of the UV bottom-sealing coating, and after pattern printing, a first pattern printing layer is formed on the upper surface of the first printing effect enhancing primer layer;

[0020] Step S3: Laminating with protective film:

[0021] In step S2, an adhesive primer layer is formed on the upper surface of the first pattern printing layer of the cover substrate, and the protective layer in step S1 is bonded to the adhesive primer layer.

[0022] Step S4, secondary synthesis:

[0023] A self-adhesive layer is formed on the upper surface of the functional base material, and the second heat-conducting layer of the cover substrate with the protective layer in step S3 is attached to and pressed against the self-adhesive layer.

[0024] Preferably, for step S1,

[0025] Pre-processing the PET transparent protective film to form a protective layer includes the following sub-steps:

[0026] Step S1.1.1, passing the PET transparent protective film to be treated through an unwinding shaft, a pressure roller, a corona treatment or coating treatment, and winding, and completing the corona treatment or coating treatment on one upper surface of the PET transparent protective film;

[0027] Step S1.1.2: Roll-coat, spray, or flow-coat a hardening liquid on the side of the PET transparent protective film that has undergone corona treatment or coating, and dry and solidify it to form an antibacterial hardened protective layer;

[0028] The natural plant leather is stitched together to form a natural plant leather layer, including sub-step S1.2.1, aligning the edges of the plurality of natural plant leathers and performing stitching and bonding;

[0029] Processing the metal foil to form the first heat-conducting layer or the second heat-conducting layer includes the following sub-steps:

[0030] Step S1.3.1, frosting the front and back sides of the metal foil to grind the smooth surface of the metal foil into a rough surface;

[0031] Step S1.3.2, roller coating, spraying or curtain coating the heat dissipation ink onto one rough surface of the metal foil treated in step S1.3.1 to form a first superconducting thermal functional layer;

[0032] Step S1.3.3, cutting to obtain the first heat-conducting layer or the second heat-conducting layer;

[0033] The interlayer sheet is processed to form a filling sheet interlayer, including sub-step S1.4.1, forming a corona treatment layer on the upper and lower surfaces of the plastic interlayer sheet coil, thereby completing the processing of the filling sheet interlayer.

[0034] Preferably, step S3 includes the following sub-steps:

[0035] Step S3.1: coating the upper surface of the first pattern printed layer of the cover substrate in step S2 with an adhesive, and curing with UV light to form an adhesive primer layer;

[0036] Step S3.2: Apply UV liquid transparent glue between the protective layer and the adhesive base coating layer, and complete the synthetic processing of the protective layer after UV light curing.

[0037] Preferably, step S4 includes the following sub-steps:

[0038] Step S4.1: Stack the functional base material onto the feeding platform of the flat laminating machine, load the self-adhesive film roll onto the laminating machine's material unwinding air shaft, and secure it. The upper surface of the functional base material is placed against the adhesive surface of the self-adhesive film, and the two films are simultaneously fed into and passed through the self-adhesive cold-pressing laminating roller, thereby forming a self-adhesive layer on the upper surface of the functional base material.

[0039] Step S4.2: attach the second heat-conducting layer of the cover substrate with the protective layer in step S3 to the self-adhesive layer, and simultaneously enter and pass through the cold-pressed composite roller, thereby completing the composite processing of the functional base material and the cover substrate.

[0040] Preferably, the method further comprises step S5, profiling:

[0041] The cover plate substrate after the secondary synthesis in step S4 is engraved or punched according to a preset pattern, and the peripheral vertical surface of the engraved or punched cover plate substrate is polished.

[0042] Preferably, the process further comprises step S6, sealing:

[0043] The peripheral vertical surface of the cover plate base body after being polished and ground in step S5 is coated with sealing resin glue to form a base sealing resin glue edge sealing layer.

[0044] Compared with the prior art, the present invention has the following beneficial effects:

[0045] 1. The present invention adopts a multi-layer heat-conducting, heat-dissipating and heat-insulating integrated matrix composed of a first graphene heat-conducting and heat-dissipating functional layer, a second aluminum foil heat-conducting functional layer, a PET heat-insulating sheet layer, a third graphene heat-conducting and heat-dissipating functional layer and a fourth aluminum foil heat-conducting functional layer arranged on a natural plant skin bottom layer. Through the physical properties and structural matching of each layer of materials and the use of physical means, natural temperature control is achieved while effectively solving the prominent problems of the wood-grain coaster panel of the present invention such as delamination of the adhesive layer due to high temperature, deformation of the substrate, formation of orange peel or wavy wrinkles on the protective film layer, and irregular whitening and discoloration of the inner natural plant skin layer, thereby extending the service life of the solid wood-grain coaster panel and maintaining it in good condition for a long time.

[0046] 2. The present invention integrates the cover plate substrate into an integrated high-temperature, high-pressure and cold-pressed synthetic shaping process, thereby significantly improving the bonding strength and density of each layer of the cover plate substrate, making the synthetic cover plate substrate stronger, smoother and more durable.

[0047] 3. The present invention uses natural plant leather as the fabric and makes a solid wood grain coaster panel, which is particularly suitable for dining tables, tea tables and other tables that are often in contact with high-temperature objects, water, and grease. Covering the solid wood grain coaster panel on the original table surface will have obvious physical heat insulation, physical heat dissipation, anti-slip, anti-scratch, anti-wear, anti-water and stain resistance and other multiple practical effects.

[0048] 4. The present invention grinds and polishes the surface of the natural plant leather, applies glue on the natural plant leather layer through a UV bottom sealing glue coating machine, and then performs UV light curing to form a transparent isolation layer. This can prevent some moisture in the natural plant leather body from being discharged and completely seal it from the outside world. At the same time, it reduces the occurrence of bubbles in the natural plant leather layer 8 and the PET transparent protective film layer due to the unevenness of the natural grain on the surface of the natural plant leather. This effectively solves the bubble problem of the finished solid wood grain coaster panel, thereby helping to improve the product yield.

[0049] 5. The present invention provides a printing effect enhancing primer layer on the upper surface of the natural plant cortex, which helps to directly present calligraphy and painting patterns in high definition on the upper surface of the natural plant cortex through a printer or manual writing, thereby achieving the beauty of the solid wood grain coaster panel that combines art and nature, as well as ornamental and artistic effects.

[0050] 6. This invention utilizes a second aluminum foil heat-conducting functional layer, a plywood filling layer, and a fourth aluminum foil heat-conducting functional layer superimposed beneath the natural plant cortex, effectively controlling and balancing the tension between the functional layers of the cover substrate. This solves the problem of banana-like bends or warping that can occur during production and product use due to the thinness of solid wood-grain coaster panels. Especially useful for coasters, the solid wood-grain coaster panel adheres perfectly to the supporting surface, creating a smooth, seamless fit, enhancing the user experience.

[0051] 7. There is no restriction on the selection of natural plant leather raw materials used in the present invention. In particular, thin leather can be made from world-famous precious tree species such as golden nanmu, huanghuali, sandalwood, walnut, etc., which can enhance the natural texture of the solid wood grain coaster panel of the present invention, thereby promoting and popularizing people's lives.

[0052] 8. The natural plant skin used in the present invention is not restricted by tree species and has the functions and characteristics of the surface matrix, which broadens the diversified selection of solid wood materials for traditional solid wood coasters and further reduces the overall cost and price of solid wood coasters.

[0053] 9. The present invention provides a method for manufacturing an ultra-thin solid wood grain coaster panel with physical temperature control. The overall thickness of the finished cover substrate can be customized as needed to any thickness between 1 and 10 mm and any panel size between 1200 mm and 3000 mm in length and width. It can be expanded to related external industries with the main purpose of countertop protection and decoration according to the application environment, usage characteristics, and functional demands, such as but not limited to coasters, placemats, tea trays, trays, chessboards, dials, etc. BRIEF DESCRIPTION OF THE DRAWINGS

[0054] Other features, objects and advantages of the present invention will become more apparent upon reading the detailed description of non-limiting embodiments with reference to the following drawings:

[0055] FIG1 is a schematic diagram showing the overall structure of a coaster panel according to the present invention;

[0056] FIG2 is a schematic diagram showing the temperature control and heat insulation principle of the inner and outer layers of the coaster panel according to the present invention;

[0057] FIG3 is a schematic diagram showing the processing flow of a coaster panel according to the present invention;

[0058] FIG4 is a schematic diagram showing the base material primer processing process and processing principle of the present invention;

[0059] FIG5 is a schematic diagram showing the cutting process and processing principle of the base coil material according to the present invention;

[0060] FIG6 is a schematic diagram mainly showing the cold and hot pressing process and processing principle of the cover plate substrate of the present invention;

[0061] FIG7 is a schematic diagram showing the grinding and polishing process and processing principle of the cover plate substrate according to the present invention;

[0062] FIG8 is a schematic diagram showing the gluing and laminating process and processing principle of the cover substrate according to the present invention;

[0063] FIG9 is a schematic diagram showing the process and principle of the primer printing process for the cover substrate according to the present invention;

[0064] FIG10 is a main embodiment of the present invention, a real shot of the cover substrate processing;

[0065] FIG11 is a real shot showing the gluing and laminating process of the cover substrate according to the present invention;

[0066] FIG12 is a diagram showing the processing effect of the cover plate base according to the present invention;

[0067] FIG13 is a comparative photo of the application effect of the real wood grain coaster panel of the present invention.

[0068] As shown in the figure:

[0069] Antibacterial hardened protective layer 1 Second thermal conductive functional layer 11

[0070] Transparent protective film layer 2 Third adhesive layer 12

[0071] First adhesive layer 3 Filling sheet interlayer 13

[0072] Adhesive strength primer layer 4 Fourth adhesive layer 14

[0073] First pattern printing layer 5 Third super thermal conductive functional layer 15

[0074] First printing effect enhancing primer layer 6 Fourth heat conducting functional layer 16

[0075] UV bottom coating 7 Second printing effect enhancement bottom coating 17

[0076] Natural plant cortex layer 8 Second pattern printing layer 18

[0077] Second adhesive layer 9 Matrix sealing resin glue edge sealing layer 19

[0078] First superconducting thermal functional layer 10 Base material layer 20 DETAILED DESCRIPTION

[0079] The present invention will be described in detail below with reference to specific embodiments. The following examples will help those skilled in the art to further understand the present invention, but are not intended to limit the present invention in any form. It should be noted that, for those skilled in the art, several changes and improvements can be made without departing from the scope of the present invention. These all fall within the scope of protection of the present invention.

[0080] Example 1

[0081] As shown in Figures 1 and 2, the present invention provides a solid wood grain backing board structure and manufacturing method, comprising, arranged in order from top to bottom, a protective layer, a first adhesive layer 3, an adhesive primer 4, a first pattern effect layer, a UV sealant 7, a natural plant cortex layer 8, a second adhesive layer 9, a first thermally conductive layer, a third adhesive layer 12, a filler sheet interlayer 13, a fourth adhesive layer 14, and a second thermally conductive layer. Also included is a base sealing resin adhesive edge sealing layer 19, which surrounds and adheres to the outer surface of the backing board base. The protective layer comprises a transparent protective film layer 2 and an antibacterial hardened protective layer 1, arranged in order from bottom to top above the first adhesive layer 3.

[0082] The first heat-conducting layer includes a first graphene heat-conducting functional layer and a second metal foil layer sequentially arranged from top to bottom; the second heat-conducting layer includes a third graphene heat-conducting functional layer and a fourth metal foil layer sequentially arranged from top to bottom.

[0083] A second pattern effect layer is disposed below the second heat conducting layer, and a base material layer 20 is disposed below the second heat conducting layer. The second pattern printing layer 18 includes a second printing effect enhancing primer layer 17 and a second pattern printing layer 18 disposed from top to bottom below the second heat conducting layer.

[0084] Specifically, the first pattern effect layer includes a first printing effect enhancing primer layer 6 and a first pattern printing layer 5 disposed sequentially from bottom to top above the UV bottom seal layer 7. The base material layer 20 includes one or more of composite cork, rubber soft magnetic sheet, felt cloth, solid color or imitation texture plastic sheet, solid color or imitation texture metal sheet, PC plastic board, water-absorbing and anti-slip material.

[0085] As shown in FIG3 to FIG13 , the present invention also provides a method for manufacturing a solid wood grain backing plate structure, the manufacturing method comprising the following steps:

[0086] Step S1: preparing materials:

[0087] The PET transparent protective film is pre-processed to form a protective layer. Specifically, the process includes the following sub-steps:

[0088] Step S1.1.1, passing the PET transparent protective film to be treated through an unwinding shaft, a pressure roller, a corona treatment or coating treatment and winding, and completing the corona treatment or coating treatment on one upper surface of the PET transparent protective film.

[0089] Step S1.1.2: Roll-coat, spray or flow-coat the hardening liquid on the side of the PET transparent protective film that has been corona-treated or coated, and form an antibacterial hardened protective layer 1 after drying and curing.

[0090] The natural plant leather is stitched together to form the natural plant leather layer 8. Specifically, the process includes sub-step S1.2.1, aligning the edges of the plurality of natural plant leathers and stitching and gluing them together.

[0091] The metal foil is processed to form the first heat-conducting layer or the second heat-conducting layer. Specifically, the process includes the following sub-steps:

[0092] Step S1.3.1: frosting the front and back sides of the metal foil to grind the smooth surface of the metal foil into a rough surface.

[0093] Step S1.3.2: Roll, spray or flow-coat the heat dissipation ink onto one rough surface of the metal foil treated in step S1.3.1 to form a first super thermal conductive functional layer 10.

[0094] Step S1.3.3: cutting to obtain the first heat-conducting layer or the second heat-conducting layer.

[0095] The interlayer sheet is processed to form the filling sheet interlayer 13. Specifically, the process includes sub-step S1.4.1, forming a corona treatment layer on the upper and lower surfaces of the plastic interlayer sheet coil, thereby completing the processing of the filling sheet interlayer 13.

[0096] Step S2, preliminary synthesis:

[0097] The natural plant cortex layer 8, the first heat-conducting layer, the filling sheet interlayer 13, and the second heat-conducting layer prepared in step S1 are stacked in order from top to bottom and glued together to form a cover substrate. A UV bottom coating 7 is formed on the upper surface of the natural plant cortex layer 8 of the cover substrate. Then, a first printing effect enhancing primer layer 6 is formed on the upper surface of the UV bottom coating layer 7. After pattern printing, a first pattern printing layer 5 is formed on the upper surface of the first printing effect enhancing primer layer 6. Specifically,

[0098] Step S3: Laminating with protective film:

[0099] In step S2, an adhesive primer layer 4 is formed on the upper surface of the first pattern printed layer 5 of the cover substrate, and the protective layer in step S1 is bonded to the adhesive primer layer 4. Specifically, in step S3.1, an adhesive agent is applied to the upper surface of the first pattern printed layer 5 of the cover substrate in step S2, and the adhesive primer layer 4 is formed after UV curing.

[0100] Step S3.2: Apply UV liquid transparent glue between the protective layer and the adhesive primer layer 4, and cure with UV light to complete the synthetic processing of the protective layer.

[0101] Step S4, secondary synthesis:

[0102] A self-adhesive layer is formed on the upper surface of the functional base material, and the second heat-conducting layer of the cover substrate with the protective layer in step S3 is attached and pressed to the self-adhesive layer. Specifically, the process includes the following sub-steps:

[0103] Step S4.1: Stack the functional base material onto the feeding platform of the flat laminating machine, load the self-adhesive film roll onto the laminating machine's material unwinding air shaft, and secure it. The upper surface of the functional base material is placed against the adhesive surface of the self-adhesive film, and the two films are simultaneously fed into and passed through the self-adhesive cold-pressing laminating roller, thereby forming a self-adhesive layer on the upper surface of the functional base material.

[0104] Step S4.2: attach the second heat-conducting layer of the cover substrate with the protective layer in step S3 to the self-adhesive layer, and simultaneously enter and pass through the cold-pressed composite roller, thereby completing the composite processing of the functional base material and the cover substrate.

[0105] The process also includes step S5, profiling:

[0106] The cover plate substrate after the secondary synthesis in step S4 is engraved or punched according to a preset pattern, and the peripheral vertical surface of the engraved or punched cover plate substrate is polished.

[0107] The step S6 is also included, sealing:

[0108] The peripheral vertical surface of the cover plate base body after being polished and ground in step S5 is coated with sealing resin glue to form a base sealing resin glue edge sealing layer 19 .

[0109] The technical solution of the present application, through the physical properties and structural matching of each layer of material, utilizes physical means to achieve natural temperature control, while effectively solving the prominent problems of the wood grain pad structure of the present invention caused by high temperature, such as delamination of the adhesive layer, deformation of the substrate, formation of orange peel or wavy wrinkles in the protective film layer, and irregular whitening and discoloration of the inner natural plant cortex. This extends the service life of the solid wood grain coaster panel and maintains it in good condition for a long time.

[0110] It should be noted that the technical solution of this application proposes a solid wood grain pad structure and a manufacturing method, and the application of the solid wood grain pad structure recorded in the technical solution of this application falls within the scope of protection of this application. For example, the solid wood grain pad structure recorded in this application is made into coasters, placemats, tea trays, trays, chessboards, watch faces, etc.

[0111] Example 2

[0112] Based on the first embodiment, the present invention provides a solid wood grain backing plate structure, comprising a second patterned printed layer 18 or base material layer 20, a second print-effect enhancing primer layer 17, a fourth thermally conductive functional layer 16, a third superconducting thermally conductive functional layer 15, a fourth adhesive layer 14, a filler sheet interlayer 13, a third adhesive layer 12, a second thermally conductive functional layer 11, a first superconducting thermally conductive functional layer 10, a second adhesive layer 9, a natural plant cortex layer 8, a UV sealant coating 7, a first print-effect enhancing primer layer 6, a first patterned printed layer 5, an adhesive primer layer 4, a first adhesive layer 3, a transparent protective film layer 2, and a hardened protective coating layer 1, stacked in order from bottom to top. It also includes a matrix sealing resin adhesive edge sealing layer 19 surrounding and adhering to the outer surface of the cover plate base.

[0113] The present invention provides a method for manufacturing a solid wood grain backing plate structure, comprising:

[0114] Step S1: Material preparation: Take out the PET transparent protective film, natural plant leather, heat dissipation paint, metal foil, plastic interlayer sheet, curing liquid, hot melt glue, adhesion adhesive, functional base material, and backing glue for use.

[0115] Furthermore, the PET transparent protective film is pre-processed to form a protective layer. This includes passing the PET transparent protective film to be processed through a reel, a pressure roller, a corona treatment or coating process, and winding it up, completing the corona treatment or coating process on one upper surface of the PET transparent protective film. The hardened protective coating is a transparent liquid mixed with multiple substances. The coating thickness is set to 30μm. It is applied by a coating machine to the surface of the transparent protective film layer 22 with a thickness of 40μm PET and a width of 1.25m to form a protective layer. It has the characteristics of anti-scratch, wear resistance, oil resistance, antibacterial, and yellowing resistance. The surface of the PET transparent protective film layer 22 has a hardness of 3H or above.

[0116] Furthermore, the natural plant leather is stitched together to form a natural plant leather layer 8. The base material of the natural plant leather layer 8 is a plurality of pure natural solid wood thin sheets with a thickness of 0.2 mm to 0.8 mm, a length of 50 cm to 350 cm, and a width of 10 cm to 65 cm. The natural plant leather layer 8 is stitched together by gluing to form a natural plant leather layer 8 with a length of 3.5 m and a width of 1.25 m.

[0117] The steps of veneer splicing include:

[0118] Material Preparation: Prepare the natural plant leather material. Natural plant leather includes bamboo, white rubber, oak, teak, elm, silver pear, black walnut, and engineered wood veneer. The thickness of the natural plant leather material should be between 0.2mm and 0.8mm, the length should be between 50cm and 350cm, and the width should be between 10cm and 65cm.

[0119] Edge cleaning processing: Place the natural plant leather raw material on a special edge cleaning and cutting equipment, and make both sides of the natural plant leather raw material neat and smooth by cutting the leather edges.

[0120] Pattern classification: artificially classify the surface texture and color of natural plant leather raw materials according to the design effect.

[0121] Raw material splicing: Several separate, sorted sheets of natural plant leather are placed on the feed table of a professional gluing and seaming machine. After the seams are manually aligned on the feed table, the sheets are fed into an automatic gluing and seaming machine for gluing and joining. This process is repeated several times until the desired size, within a width of 3.4m x a length of 1.25m, is achieved, completing the solid wood veneer splicing process.

[0122] Furthermore, the metal foil is processed to form a first thermal conductive layer or a second thermal conductive layer. Both the second thermal conductive functional layer and the fourth thermal conductive functional layer are aluminum foil or other metal foil coil materials. The surface pretreatment adopts a roll-to-roll sanding and roughening method. After the aluminum foil coil material is preferably loaded onto the drawing machine unwinding reel and fixed, the aluminum foil is introduced into and passes through the grinding and drawing structure inside the flat drawing machine. After the aluminum foil surface is released from the grinding and drawing device, its smooth surface will become rough. The pretreated aluminum foil is fixed to the rewinding reel by winding until the end. The biggest advantage of the aluminum foil using surface roughening and wire drawing pretreatment is that the aluminum foil, as the core base layer of the first superconducting thermal functional layer 10 or the third superconducting thermal functional layer 15, will significantly improve the adhesion between the aluminum foil surface and the thermal conductive ink, as well as the adhesion between the aluminum foil surface and the hot melt adhesive layer. If the aluminum foil surface pretreatment step is missing, the adhesion and bonding strength between the materials will be significantly reduced, which can easily cause delamination problems.

[0123] The substrate of the first superconducting thermally conductive functional layer 10 is made of a highly thermally conductive material with graphene as its core, and is coated using specialized equipment, sprayed, painted, dip-coated, or canned. Using either the coating or spraying method, a graphene coating liquid is added to a coating liquid raw material tank, and a liquid conveyor delivers the graphene coating to a coating liquid outlet. From the outlet, the graphene coating liquid is applied to the coating rubber roller of the coating machine or delivered to a spray atomization port for pressurized atomization. The second thermally conductive functional layer of aluminum foil coil material is loaded onto the coating machine substrate unwinding shaft and fixed. Under the force of the puller, the aluminum foil substrate will pass through the lower surface of the rubber coating roller or the lower side of the spray atomization port. When the aluminum foil substrate passes through the coating processing unit, a graphene heat dissipation coating with a wet film thickness of 100um and a width of 1.3m will be formed on the front surface of the aluminum foil substrate. Then, at a speed of 1 to 3 meters per minute and a baking temperature set between 120 and 150 degrees, it will take 5 to 20 minutes to pass through a high-temperature drying tunnel furnace with a length of more than 25 meters. After the graphene wet film attached to the surface of the aluminum foil substrate is completely baked and cured, the film thickness will become an actual dry film thickness of 20um. Then, the material is taken up by the substrate reel until the second thermally conductive functional layer of the aluminum foil coil material coating is completed.

[0124] The first superconducting functional layer 10 uses graphene as a fan-heating functional layer. Its greatest advantages include: the graphene thermal conductive layer covering the aluminum foil of the second thermal conductive functional layer has a hardness of ≥ B, adhesion level 0, thermal shock resistance of >20 cycles from -20°C to 200°C, an operating temperature range of -50°C to 150°C, horizontal thermal conductivity ≥40 W / mK, vertical thermal conductivity ≥20 W / mK, thermal emissivity >0.95, impact resistance of 50 cm, and the absence of toxic or hazardous substances. The aluminum foil of the second thermal conductive functional layer serves as a graphene substrate. While aluminum has a much lower thermal conductivity than graphene, its use as a graphene substrate effectively synergizes and assists the graphene layer in heat conduction.

[0125] There are two different processing methods and processing sequences for forming the second adhesive layer 9. The changes in the method and processing sequence are subject to the use environment and temperature factors of the solid wood grain coaster panel. For areas with severe cold environments, irreversible hot melt adhesive will be used as the adhesive grafting layer between the natural plant skin and the first superconducting thermal functional layer 10. The processing step of forming the second adhesive layer 9 will be completed after the S2.2.3 metal matrix synthesis processing.

[0126] For areas with a mainly hot environment, a reversible hot melt adhesive will be used as the adhesive grafting layer between the natural plant skin and the first superconducting thermal functional layer 10, and the processing step of forming the second adhesive layer 9 will be completed in advance after the superconducting thermal functional layer is completed. The biggest advantage of using an irreversible hot melt adhesive is that, especially for ambient temperatures below zero, the irreversible hot melt adhesive molecules are stable and not easy to debond or delaminate, but the disadvantages are also quite obvious. Its biggest disadvantage is that the cost of the adhesive material is higher than that of the reversible hot melt adhesive material. More importantly, the natural plant skin and the cover plate substrate cannot be synthesized in one go and need to be synthesized separately through secondary processing, which leads to increased production processes, production losses, and costs. The biggest advantage of using a reversible hot melt adhesive is that, especially for ambient temperatures above zero, in addition to the fact that the reversible hot melt adhesive molecules are stable and not easy to debond or delaminate, the most significant feature is that the natural plant skin and the cover plate substrate can be synthesized in one go within the synthesis processing step, thereby improving production efficiency and reducing overall production costs.

[0127] The second adhesive layer 9 is processed using a flat-lay roll-to-roll laminating method. A second thermally conductive functional layer of aluminum foil with a graphene thermal conductive coating already attached to its surface is loaded onto the laminating machine's substrate unwinding shaft and secured thereto. A 50µm thick hot melt adhesive film is loaded onto the laminating machine's unwinding shaft and secured thereto. The first graphene thermal conductive functional layer is placed against the adhesive surface of the hot melt adhesive film. The laminating machine's laminating rollers are set to a temperature of 145°C and a speed of 10 meters per minute. Under the force of the feed drive mechanism, the first graphene thermal conductive functional layer and the hot melt adhesive film are simultaneously conveyed through the laminating rollers, forming the second adhesive layer 9 on the upper surface of the first graphene thermal conductive functional layer. The process is then completed and reeled up.

[0128] The second thermally conductive functional layer is slit using aluminum foil or other metal foil with a thickness of 210µm and a width within the range of 3.4µm. The third thermally conductive functional layer, aluminum foil coil, is loaded onto the substrate unwinding reel and secured there. The step-feed cutting system is set to any size within a 3.2µm range. Driven by the feeder's drive rollers, the coil passes beneath the automatic cutting machine's cutter blades, where it is cut every 3.2µm according to the set cutting interval. The cut coil forms individual sheets measuring 3.2µm long and 1.3µm wide. Drive roller 4 then feeds the individual sheets to the receiving platform for stacking until cutting is complete.

[0129] The second thermally conductive functional layer functions and operates as follows: It serves as the base material for the first superconducting functional layer 10, the graphene-coated thermal conductive layer. In addition to assisting the inner layers of the cover plate in conducting heat upward and downward in both the horizontal and vertical directions, the second thermally conductive functional layer, combined with the underlying plastic interlayer and the fourth thermally conductive functional layer, achieves top-to-bottom tension balance, ensuring the overall flatness and conformability of the cover plate when placed against other surfaces. The primary advantages of using aluminum foil as the core for heat conduction and tension balance are its excellent thermal conductivity, light weight, ease of shaping and leveling, ease of processing, low cost, and corrosion and rust resistance. In conjunction with the first superconducting functional layer 10, the graphene-coated material utilizes its inherent thermal conductivity to simultaneously conduct heat downward to the plastic interlayer, the third superconducting functional layer 15, the fourth thermally conductive functional layer, and the protected surface. In the process of transferring heat energy to each independently existing functional layer, the heat energy will be consumed in sequence in layers, and finally the temperature control and cooling technical effects will be achieved with the help of the natural constant temperature of the entity surface that is being protected, thereby consuming the residual heat of the bottom layer of the fourth heat-conducting functional layer, so as to achieve effective temperature control and cooling protection of the entity surface that is being protected, as well as the cover substrate and the upper surface of the natural plant skin.

[0130] Furthermore, the interlayer sheet is processed to form a filling sheet interlayer 13. The interlayer sheet substrate is made of PET plastic material with a thickness of 210 μm and a width of 1.3 μm. The surface treatment method used is to introduce the plastic interlayer sheet coil to be treated into a corona machine to apply an electric shock to the plastic sheet surface, causing the surface to become rough and fluffy, forming pits. This improves the wetting effect of the adhesive layer on the surface, thereby improving the adhesion strength. If this step is omitted, the adhesion strength between the front and back surfaces of the interlayer sheet substrate and the third adhesive layer 12 and the fourth adhesive layer 14 will be significantly reduced, which may easily lead to debonding and delamination, and poor adhesion strength.

[0131] The production method used to form the third adhesive layer 12 is to introduce the plastic interlayer sheet coil that has completed the corona treatment step into a hot melt adhesive coating machine for gluing. After the entire process of unwinding, gluing, drying and curing, and winding, the third adhesive layer 12 is formed on the upper surface of the interlayer sheet.

[0132] During the sandwich sheet slitting process, the finished sandwich sheet coil is loaded onto the substrate unwinding shaft and secured. The step-feed cutting pitch system is set to 3.2m. Driven by the feeder's drive roller, the coil passes beneath the automatic shear blade, where it is cut every 3.2m according to the set cutting pitch. The cut coil forms individual sheets measuring 3.2m long and 1.3m wide. The drive roller then feeds the individual sheets to the receiving platform for stacking until cutting is complete.

[0133] The processing method for forming the fourth adhesive layer 14 is as follows: the interlayer sheet that has completed the slitting step is loaded onto the first feeding platform of the hot melt adhesive film laminating machine for stacking, the hot melt adhesive film is loaded onto the second feeding inflatable shaft for fixing, the reverse side of the interlayer sheet coated with the third adhesive layer 12 is adhered to the adhesive surface of the hot melt adhesive film, and at the same time, it is fed into and passed between the heated pressing rollers of the laminating machine, and after the fourth adhesive layer 14 at the tail of the interlayer sheet is cut off by the cutting machine, the fourth adhesive layer 14 is formed on the reverse side of the third adhesive layer 12 of the interlayer sheet.

[0134] The specific processing method of the third superconducting thermal functional layer 15: Its processing method is the same as that of the first superconducting thermal functional layer 10, and it will not be repeated because it is easy to understand. The difference is that the graphene coating of the third superconducting thermal functional layer 15 is bonded to the fourth adhesive layer 14 of the filling sheet interlayer 13, and the fourth superconducting thermal functional layer is reversely passed through to the solid plane that needs to be temperature controlled and protected. When the graphene coating of the third superconducting thermal functional layer 15 is directly bonded to the fourth adhesive layer 14, it will receive the heat from the upper natural plant cortex 8 through the filling sheet interlayer 13 in the first time. Through the physical heat conduction and heat dissipation characteristics of the third superconducting thermal functional layer 15 graphene coating and the fourth heat conduction functional layer, the received heat is further transferred to the inner space of the cover substrate through horizontal and vertical up and down left and right and surrounding heat conduction, heat diffusion, heat radiation, and heat exchange to achieve a physical temperature control effect.

[0135] The printing effect enhancing primer layer is formed by an online coating method. The specific processing method is to add the printing effect enhancing coating liquid into the coating liquid raw material tank, and then use the liquid conveyor to transport the printing effect enhancing coating to the coating liquid outlet. From the liquid outlet, the printing effect enhancing coating liquid is coated on the coating rubber roller surface of the coating machine, or transported to the spray atomization port for pressurized atomization spraying. The third superconducting thermal functional layer 15 aluminum foil coil material is loaded onto the coating machine substrate unwinding shaft and fixed, and the surface away from the fourth thermal conductive functional layer of the third superconducting thermal functional layer 15 is facing the coating rubber roller. Under the force of the puller, the aluminum foil substrate will pass through the lower surface of the rubber coating roller or the lower side of the spray atomization port. When the aluminum foil substrate passes through the coating processing unit or, a printing effect enhancing coating with a wet film thickness of 20um will be formed on the front surface of the aluminum foil substrate it passes through. Then, at a speed of 1 to 3 meters per minute, the baking temperature is set between 120 and 150 degrees. It takes 5 to 20 minutes to pass through a high-temperature drying tunnel furnace with a length of more than 25 meters. After the wet film of the printing effect enhancing coating attached to the surface of the aluminum foil substrate is completely baked and cured, the film thickness will become a dry film thickness of 10um. Then, the material is collected by the substrate reel until the coating of the printing effect enhancing primer is completed. The main function of using the printing effect enhancement primer layer is to significantly improve the pattern effect printed on the surface of the third superconducting thermal functional layer 15 and to ensure that the printing ink has higher adhesion.

[0136] The fourth thermally conductive functional layer is made of aluminum foil or other metal foil with a thickness of 210 μm and a width of 3.2 μm, preferably aluminum foil. Its functions, characteristics, working methods, and principles are the same as those of the second thermally conductive functional layer (aluminum foil as a graphene substrate), and are not repeated here for ease of understanding. The slitting method is the same as that of the second thermally conductive functional layer, and is not repeated here for ease of understanding.

[0137] Furthermore, the initial synthesis includes one of the following two processing methods:

[0138] S2.1. The first method and steps:

[0139] S2.1.1. Preparation of base materials: Take out the natural plant cortex layer 8, the second heat-conducting functional layer 11, the filling sheet interlayer 13, and the fourth heat-conducting functional layer for later use.

[0140] S2.1.2. Stack the laminated steel plate, hot-pressed rubber cushion, natural plant cortex layer 8, second thermally conductive functional layer 11, filling sheet interlayer 13, fourth thermally conductive functional layer 16, and laminated steel plate in sequence from bottom to top, with the hot-pressed rubber cushion attached to the laminated steel plate, the hot-pressed rubber cushion attached to the natural plant cortex layer 8, the natural plant cortex layer 8 attached to the second adhesive layer 9, the second thermally conductive functional layer attached to the third adhesive layer 12, the third super thermally conductive functional layer 15 attached to the fourth adhesive layer 14, and the laminated steel plate attached to the fourth thermally conductive functional layer 16. The advantage of using laminated steel plates, hot-pressed rubber cushions, and laminated steel plates is that the laminated steel plates and laminated steel plates ensure uniform temperature and smoothness across the entire surface of the cover plate substrate when heated and pressurized. The hot-pressed rubber cushion ensures that the overall stress-bearing surface between the natural plant cortex and the inner layer of the cover plate substrate, as well as between the layers of the cover plate substrate, is more uniform when the cover plate substrate is subjected to hot or cold pressurization. If this link is missing, the cover plate substrate will be prone to delamination, false adhesion, bubbles and bulging due to uneven temperature and stress surfaces after synthesis.

[0141] S2.1.3. After stacking the functional layers, stack the cover substrates one by one on the feeding platform. Set the temperature of the hot pressing plate of the hot pressing unit to a constant temperature of 90°C, the holding time to 60 seconds, and the holding pressure to 1500 MPa. Feed the cover substrates placed on the feeding platform one by one into the interlayer of the hot pressing unit. Perform hot pressing and synthesis according to the parameters set in the hot pressing unit, and finally achieve integrated synthesis of the cover substrate. Then, feed the hot-pressed and synthesized cover substrates one by one into the interlayer of the cold pressing unit. Set the temperature of the flat cold pressing plate to a constant temperature of 5°C, the holding time to 60 seconds, and the holding pressure to 1500 MPa according to the parameters set in advance in the cold pressing unit, and finally achieve low-temperature shaping of the hot-pressed and synthesized cover substrates. Finally, transfer the cold-pressed and shaped cover substrates to the receiving platform for stacking and storage. The advantage of using the above-mentioned hot pressing and cold pressing to synthesize the cover plate substrate is that the bonding strength between the functional layers of the cover plate substrate is more uniform through continuous high temperature and high pressure. The cover plate substrate after being taken out of the oven passes through continuous low temperature and high pressure for a second time, so that the temperature of the panel base is rapidly cooled and absolutely fixed, thereby making the bonding strength and material density between the functional layers of the cover plate substrate reach a peak value, and finally achieving the overall flatness, hardness, flexibility and elasticity of the synthesized panel base, which is convenient for subsequent processing and is an important prerequisite for ensuring the overall quality and user experience of the ultra-thin solid wood grain coaster panel with physical temperature control of the present invention. It is particularly pointed out that in the processing process of stacking and pasting each functional layer, the release paper pasted on the surface of each adhesive layer will be peeled off in advance and then the layers will be pasted together.

[0142] S2.2. Second method steps and procedures

[0143] S2.2.1. Preparation of base materials: Take out the natural plant cortex 8, the second heat-conducting functional layer 11, the filling sheet interlayer 13, the fourth heat-conducting functional layer 16, and the PUR hot melt adhesive for use.

[0144] S2.2.2. Metal substrate stacking processing: stack the second thermal conductive functional layer 11 and the reverse side of the first super thermal conductive functional layer 10 that have completed the processing steps with the third adhesive layer 12, the fourth adhesive layer 14, and the fourth thermal conductive functional layer 16 one by one from bottom to top.

[0145] S2.2.3. Metal substrate synthesis processing: The completed metal stacking substrate is sent to a flat hot press at one time for high-temperature constant-pressure synthesis and cold-pressing shaping processing, thereby forming the cover substrate synthesis processing.

[0146] S2.2.4. Processing method of the second adhesive layer 9: load the cover plate substrate that has completed the metal base synthesis processing step onto the first feeding platform of the flat laminating machine for stacking, load the natural plant leather that has completed the natural plant leather seam processing onto the second feeding platform of the flat laminating machine for stacking, and place the reverse side of the printing effect enhancing primer layer formed on the cover plate substrate opposite to the back side of the natural plant leather. Driven by the feeding power mechanism, the cover plate substrate is introduced into the flat laminating machine and passed through the PUR hot melt adhesive coating roller to form a PUR hot melt adhesive wet film on the upper surface of the first superconducting functional layer 10 of the cover plate substrate, thereby forming the second adhesive layer 9.

[0147] S2.2.5. Natural plant leather synthesis processing method: After the cover plate substrate with the second adhesive layer 9 of the PUR hot melt adhesive wet film that has completed the processing steps is pasted face to face with the natural plant leather before entering the laminating roller, it is introduced into the composite pressing roller of the flat laminating machine under the drive of the feeding power mechanism, thereby completing the synthesis processing of the natural plant leather and the cover plate substrate.

[0148] S2.3. Stack the cover plate substrates synthesized by hot and cold pressing one by one on the feeding platform of the grinding and polishing machine, and introduce the cover plate substrates into the grinding and polishing machine one by one under the force of the transmission shaft. After the natural plant leather surface of the cover plate substrate is sanded, polished and polished, the cover plate substrate will be introduced to the receiving platform for storage. Because the natural plant leather on the upper surface of the cover plate substrate is solid wood plant leather, the biggest advantage of using the grinding and polishing process is to remove impurities on the surface of the natural plant leather 8, so that the surface of the solid wood plant leather will become smooth and burr-free, without obvious bumps and the natural grain is clear and smooth. At the same time, ensure that the transparent protective film layer 2 is smooth and clean in the subsequent laminating processing link, so as to avoid the retroperitoneal view of the solid wood plant leather surface of the film layer through the transparent PET protective film layer. If the grinding and polishing steps are omitted, the real problems such as obvious bumps, burrs, bubbles, and unclear natural grain on the surface of the solid wood plant leather of the film layer will be seen through the PET protective film layer.

[0149] S2.5. The cover substrates that have completed the grinding and polishing steps are stacked one by one on the feeding platform of the screen printing machine. Under the force of the transmission mechanism, the cover substrates are introduced one by one into the printing platform of the screen printing machine. The printing head device is perpendicular to the upper surface of the natural plant skin of the cover substrate. The UV bottom seal paint is evenly applied to the screen from left to right through the screen oiling scraper. The printing scraper and the screen are synchronously dropped to be in contact with the upper surface of the cover substrate. The printing scraper evenly applies the screen UV bottom seal paint to the upper surface of the natural plant skin of the cover substrate from right to left, thereby forming a UV bottom seal wet film with a thickness of 30μm. Under the force of the transmission mechanism, the cover substrate passes through the UV curing machine at a speed of 7 meters per minute to complete the UV curing of the UV bottom seal wet film to form a UV bottom seal coating 7. After that, the cover substrate is transferred to the receiving platform for stacking and storage. The biggest advantage of using UV bottom sealing coating 7 is that UV bottom sealing paint is printed on the natural plant leather, and UV light curing is performed after gluing to form a transparent isolation layer, which can prevent some moisture in the natural plant leather body from being discharged and completely seal it from the outside world. At the same time, it reduces the occurrence of bubbles in the natural plant leather layer 8 and the PET transparent protective film layer 2 during lamination due to the natural texture of the natural plant leather surface, effectively solving the bubble problem of the finished solid wood grain coaster panel, thereby helping to improve the product yield.

[0150] S2.6. Stack the cover substrates after the UV bottom coating 7 is completed one by one on the feeding platform of the screen printing machine. Under the action of the transmission mechanism, the cover substrates are introduced one by one into the printing platform of the screen printing machine. The print head device is perpendicular to the upper surface of the natural plant skin of the cover substrate. The screen oiling scraper drives the printing effect enhancing UV coating to be evenly applied to the screen from left to right. The printing scraper and the screen fall synchronously until they are in contact with the upper surface of the cover substrate. The printing scraper evenly applies the printing effect enhancing UV coating on the screen surface to the upper surface of the UV bottom coating 7 of the cover substrate from right to left, thereby forming a printing effect enhancing UV coating wet film with a thickness of 10μm. Under the action of the transmission mechanism, the cover substrate passes through the UV curing machine at a speed of 7 meters per minute to complete the UV curing of the UV coating wet film to form the printing effect enhancing coating. The cover substrate is then transferred to the receiving platform for stacking and storage. The main function of using the printing effect enhancement primer is to significantly improve the pattern effect printed on the surface of the UV bottom sealing coating 7 and to ensure that the printing ink has a higher adhesion.

[0151] S2.7. The pattern printing layer can be produced using a variety of artistic methods, including UV image printing, thermal transfer, live calligraphy, intangible cultural heritage handicrafts, and engraving. The pattern is applied to the upper surface of the print-enhancing coating, using the natural grain of the base natural plant cortex 8 as a background. This pattern printing layer organically integrates cultural creativity with nature, significantly enhancing the artistic and aesthetic appeal of the ultra-thin, solid wood grain coaster panel with physical temperature control.

[0152] Further protective film lamination includes:

[0153] Prepare materials: PET transparent protective film, UV adhesive, adhesion adhesive, and cover substrate for later use.

[0154] The adhesive primer 4 is a transparent coating printed on the upper surface of the pattern-printed layer. It serves as a basecoat that enhances the bonding strength of the first adhesive layer 3. The processing is as follows: Completed, pattern-printed cover substrates are stacked one by one on top of the screen printer's feed platform. Under the force of the transmission mechanism, the cover substrates are guided one by one onto the screen printer's printing platform. The print head assembly is perpendicular to the upper surface of the natural plant hide of the cover substrate. The stencil oiling scraper drives the adhesive coating to be evenly applied to the stencil from left to right. The printing scraper and stencil are synchronously lowered until they are in contact with the upper surface of the cover substrate. The printing scraper evenly applies the adhesive coating from the stencil surface to the upper surface of the pattern-printed layer of the cover substrate from right to left, forming a 10μm thick wet film of the adhesive primer 4. Under the action of the transmission mechanism, the cover board substrate passes through a high-temperature drying tunnel set at 80 degrees at a speed of 5 meters per minute to complete the far-infrared curing of the wet film of the adhesive primer 4 to form the adhesive primer 4. Then, the cover board substrate is transferred to the material receiving platform for stacking and storage.

[0155] The first adhesive layer 3 is a transparent liquid UV adhesive applied to the transparent protective film layer 2 on the upper surface of the cover substrate. The process involves stacking the cover substrate onto the laminating machine's feeder platform, injecting the UV adhesive into the coating material tank, and then conveying the liquid UV adhesive via the coating conveyor to the rubber coating roller, where it covers the roller's surface. Under the force of the laminating machine's power transmission mechanism, the cover substrate passes over the rubber coating roller, forming a wet film of UV adhesive 80 microns thick and 1.25 microns wide on the cover substrate surface. The use of UV adhesive as the core material for the adhesive layer offers key advantages: it seamlessly and securely bonds with the PET transparent protective film layer 2, allowing the natural texture of the natural plant cortex layer 8 and the pattern of the printed layer to be clearly visible through the transparent protective film layer 2. After UV curing, the adhesive strength exceeds 15 kg. The biggest advantage of using UV adhesive to bond the PET transparent protective film layer 2 is that it has a fast curing speed, the light curing temperature is lower than 70 degrees, the PET transparent protective film shrinks little, the bonding strength is strong and does not delaminate, and it does not cause delamination, debonding, deformation and other problems caused by high temperature to the internal structure of the coaster panel cover substrate. If UV adhesive light curing is not used as the core adhesive material of the adhesive layer, and a PUR hot melt adhesive tape transparent film laminating process is used, due to the properties of the PUR adhesive, the PUR hot melt adhesive layer attached to the PET transparent protective film must be heated to 150 degrees or above to melt before laminating, and then the process is compounded by the laminating machine rubber roller. This process is more suitable for conventional ordinary decorative panel lamination, but for the ultra-thin solid wood grain coaster panel with physical temperature control of the present invention, due to the characteristics of the cover plate substrate with many synthetic layers, many adhesive layers, many non-homogeneous materials, thin thickness and high integration, high temperature will cause the following problems of the cover plate substrate; the PET transparent protective film layer 2 has a high shrinkage ratio, which directly causes the cover plate substrate to show obvious banana bend after the solid wood grain coaster panel of the present invention is laminated, and bubbles are generated between the transparent protective film layer 2 of the solid wood grain coaster panel and the natural plant cortex layer 8, and orange peel texture, wavy texture and local degumming and delamination at uncertain positions of the inner layer of the cover plate substrate appear on the surface of the transparent protective film layer 2. Uncontrollable problems such as deformation and blistering lead to low product yield and production efficiency, as well as high material costs and production and repair costs.

[0156] The transparent protective film layer 2 is the transparent protective film layer 2 on the upper surface of the natural plant cortex layer 8 of the cover board substrate. The laminating process is as follows: after completing the UV adhesive coating process of the first adhesive layer 3, the UV adhesive liquid wet film attached to the surface of the cover board substrate passes through the laminating roller again. When passing through, the transparent protective film substrate and the UV adhesive liquid wet film on the surface of the cover board substrate are rolled and bonded under the pressure of the laminating roller. Simultaneously, under the light curing of the ultraviolet UV light curing machine, the UV adhesive liquid wet film between the transparent protective film substrate and the cover board substrate is initially cured and bonded. Then, the UV adhesive is deeply cured for a second time after passing through the ultraviolet UV light curing machine, thereby completing the complete lamination of the transparent protective film layer 2 and the cover board substrate containing the natural plant cortex layer 8.

[0157] Below the fourth thermally conductive functional layer, a print-enhancing primer layer, a pattern-printed layer, or a functional base material layer may be stacked sequentially from bottom to top. Specifically, if a solid wood grain coaster panel is stacked with the print-enhancing primer layer and the pattern-printed layer, the functional base material layer may be omitted. Specifically, if a solid wood grain coaster panel omits the print-enhancing primer layer and the pattern-printed layer, the base material layer may be present or omitted.

[0158] The pattern print layer is processed by stacking the completed cover substrates, covered with a transparent PET protective film, one by one onto the feed platform of a screen printer. Under the force of a transmission mechanism, the cover substrates are guided one by one onto the printing platform of the screen printer. The print head assembly is perpendicular to the surface of the cover substrate facing away from the third superconducting thermal functional layer 15 and the fourth thermal conductive functional layer. A stencil oiling scraper drives the printing ink to be evenly applied to the stencil from left to right. The printing scraper and stencil are synchronously lowered until they are in contact with the upper surface of the cover substrate. The printing scraper applies the printing ink from right to left through the stencil pattern to the upper surface of the print-enhancing primer, thus forming a 10μm thick pattern print layer. Under the force of the transmission mechanism, the cover substrates pass through a UV curing machine at a speed of 7 meters per minute. After the pattern print layer is UV-cured, the cover substrates are transferred to the receiving platform for stacking and storage.

[0159] Further, the secondary synthesis comprises the following steps:

[0160] Prepare materials: self-adhesive material, functional base material, and cover base and set aside.

[0161] Load the cork base coil material onto the laminating machine substrate unwinding shaft and fix it; load the self-adhesive film coil material with a thickness of 15um onto the laminating machine unwinding shaft and fix it; place the surface of one side of the cork against the adhesive surface of the self-adhesive film; set the temperature of the laminating roller of the laminating machine to 0 degrees and the running speed to 20 meters per minute; under the action of the feeding transmission mechanism, the cork base and the self-adhesive film are simultaneously conveyed and passed through the laminating roller, thereby forming a self-adhesive film coating on the upper surface of the cork base and completing the winding.

[0162] The cork base coil material that has completed the processing steps is loaded onto the laminating machine unwinding shaft and fixed, and the completed cover board substrate is stacked on the feeding platform of the flat laminating machine. The cover board substrate is conveyed and passed through the laminating roller under the action of the feeding transmission mechanism. At the same time, one end of the cork base self-adhesive film on the fixed machine unwinding shaft passes through the middle transition guide roller and the laminating roller. The adhesive surface of the self-adhesive film is attached to the cover board substrate's printing effect enhancing primer. The transmission mechanism and the film roller drive the cover board substrate and the cork base material from front to back to complete the self-adhesive film bonding. When passing through the automatic film cutting machine, the film cutting machine cuts off the self-adhesive film attached to the tail of the cork base material and automatically guides it to the receiving platform, thus completing the secondary synthesis processing. The biggest advantage of the cork base in the form of a coil is high production efficiency. In addition, it can also be adopted as an independent sheet of cork base and the cover board substrate bonding process.

[0163] It is particularly pointed out that the prerequisite for the secondary synthesis process of the cork base and the cover board substrate is the lack of a pattern printing layer, or the lack of a pattern printing layer and the requirement or non-requiring of a secondary synthesis process is an optional process taken as a prerequisite.

[0164] Furthermore, the profiling process comprises the following steps:

[0165] The cover plate substrate is introduced into the engraving machine and pattern engraving is performed according to the actual size of the designed cover plate substrate. The engraved cover plate substrate is separated from the main cover plate substrate and exists independently, thereby forming a contoured cover plate substrate corresponding to the designed size and shape.

[0166] The carved profiling cover plate substrate is placed on the edge grinding machine processing platform and fixed. The four sides of the profiling cover plate substrate are lightly touched by the high-speed rotating edge grinding wheel. The edge grinding wheel is driven by the movement of the driving mechanism to circle around the profiling cover plate substrate for one circle. After that, the knife marks and burrs formed on the four sides of the profiling cover plate substrate due to carving will be ground off and become smooth.

[0167] Furthermore, the sealing process includes the following steps:

[0168] Prepare materials: one-component sealing resin glue, toner.

[0169] Resin glue coloring: according to the actual base color of the natural plant leather, the coloring agent is injected into the sealing resin glue container in proportion and evenly stirred to form a sealing resin glue of the same color close to the actual base color of the natural plant leather.

[0170] Place the cover plate substrate on the processing platform of the edge banding machine and fix it. Inject the toned sealing resin glue into the glue box of the edge banding machine. Use the glue guide tube of the edge banding machine to introduce the sealing resin glue and cover the upper surface of the glue roller of the edge banding machine. The vertical surface of the cover plate substrate touches the glue roller of the edge banding machine lightly, and the driving mechanism drives the glue roller of the edge banding machine to circle around the cover plate substrate and apply glue for a week. After the vertical surface of the cover plate substrate forms a wet film layer of substrate sealing resin glue with a thickness of 30um, the cover plate substrates with sealing resin glue are introduced into the warm The sealing resin glue edge sealing glue is placed in a constant temperature bread baking room at 70 degrees for 30 minutes to complete the drying and curing of the sealing resin glue edge sealing glue, thereby forming the base sealing resin glue edge sealing layer 19, and then the cover plate base is placed on the processing platform of the edge polishing and chamfering machine to fix it. The vertical surface of the cover plate base containing the sealing resin glue layer touches the grinding wheel of the edge polishing and chamfering machine, and the grinding wheel is driven by the movement of the driving mechanism to polish around the cover plate base for one week. After that, the 90-degree right angle of the vertical surface of the cover plate base will become rounded and the surface of the sealing resin glue layer will become smooth and burr-free. The advantage of using sealing resin glue is that it can effectively isolate water or moisture from invading the inside of the cover plate base through the external facades around the cover plate base, thereby causing possible delamination. At the same time, by adjusting the color of the sealing resin glue, the visual beauty of the external facade of the cover plate base is achieved. If the external facade edge sealing of sealing resin is not used, the stratification lines of different medium layers will be clearly seen, affecting the viewing effect.

[0171] Variation Example 1

[0172] Based on Example 1 or Example 2, an ultra-thin solid wood grain coaster panel with physical temperature control provided by the present invention includes an antibacterial hardened protective coating 1, a transparent protective film layer 2, a first adhesive layer 3, an adhesive adhesion primer 4, a first pattern printing layer 5, a first printing effect enhancing primer 6, a UV bottom sealing coating 7, a natural plant cortex layer 8, a second adhesive layer 9, a second thermal conductive functional layer, a third adhesive layer 12, a filling sheet interlayer 13, a fourth adhesive layer 14, a fourth thermal conductive functional layer, and a base material layer 20, which are stacked in sequence from bottom to top; as shown in Figure 12, a base sealing resin glue edge sealing layer 19 is arranged on the outer surface layer of the cover base to surround it.

[0173] After deformation, the first superconducting functional layer 10 and / or the third superconducting functional layer 15 of the cover plate substrate are omitted. The omitted functional layers are replaced with a 0.2mm thick second thermal conductive layer 11 and / or fourth thermal conductive layer 16 made of aluminum foil, which directly serve as the heat conduction and heat dissipation functional layer. The omission of the first superconducting functional layer 10 and / or the third superconducting functional layer 15 is intended to allow for customized processing and supply for different scenarios and applications, improving the product's adaptability to various market applications and meeting customer pricing requirements.

[0174] Variation 2

[0175] Based on Example 1 or Example 2, an ultra-thin solid wood grain coaster panel with physical temperature control provided by the present invention, as shown in FIG1 , comprises a natural plant cortex layer 8, a second adhesive layer 9, a first superconducting functional layer 10, a third adhesive layer 12, a second thermally conductive functional layer, a filler sheet interlayer 13, a fourth adhesive layer 14, a third superconducting functional layer 15, a fourth thermally conductive functional layer 16, and a base material layer 20, stacked in order from bottom to top. A base sealing resin adhesive edge sealing layer 19 is provided on the outer surface of the cover base, surrounding it.

[0176] The hardened protective coating, transparent protective film layer 2, first adhesive layer 3, adhesive adhesion primer 4, pattern printing layer, printing effect enhancing primer, and UV bottom coating 7 of the deformed cover substrate are all omitted, and the natural plant cortex 8 is directly used as the decorative pattern base of the cover substrate. The upper surface of the natural plant cortex 8 is covered with traditional solid wood closed or semi-closed woodworking varnish or solid wood wax oil. Its visual and experience effects are no different from those of traditional solid wood decorative panels, while it has higher density, hardness, tension, and superconducting heat dissipation and temperature control, and other excellent properties and characteristics that traditional solid wood panels do not have and cannot be compared with. In this way, new materials that match their application scenarios can be customized according to different needs.

[0177] Variation Example 3

[0178] Based on Example 1 or Example 2, an ultra-thin solid wood grain coaster panel with physical temperature control provided by the present invention includes a second adhesive layer 9, a first superheat-conducting functional layer 10, a third adhesive layer 12, a second thermally conductive functional layer 11, a filler sheet interlayer 13, a fourth adhesive layer 14, a third superheat-conducting functional layer 15, a fourth thermally conductive functional layer 16, and a base material layer 20, stacked in order from bottom to top. A base sealing resin adhesive edge sealing layer 19 is provided on the outer surface of the cover base, surrounding it.

[0179] The antibacterial hardened protective coating 1, transparent protective film layer 2, first adhesive layer 3, adhesive adhesion primer 4, pattern printing layer, print effect enhancing primer, UV sealant 7, and natural plant cortex layer 8 of the deformed cover substrate are omitted. PET color-coated film or solid-color PET sheet material is used directly as the base for the decorative pattern on the cover substrate in place of the natural plant cortex layer 8. The first adhesive layer 3 is a PUR hot-melt adhesive made of solid-color PET sheet on the upper surface of the cover substrate. The processing process is as follows: the cover substrate is stacked on the laminating machine feeder platform, the PUR hot-melt adhesive solid is placed in the coating material box and heated at high temperature to melt into hot-melt adhesive liquid. The PUR hot-melt adhesive liquid is then conveyed to the coating rubber roller via the coating conveyor and covers the surface of the roller. Under the action of the laminating machine's power transmission mechanism, the cover substrate passes through the coating rubber roller, forming a PUR hot-melt adhesive wet film with a thickness of 80 μm and a width of 1.25 μm on its surface. A wet film of PUR hot-melt adhesive adheres to the upper surface of the first superconducting thermal functional layer 10 of the cover substrate and then passes through a laminating roller. During this process, the PET solid-color sheet substrate material, fixed to the laminating machine's unwinding shaft, and the PUR hot-melt adhesive wet film on the cover substrate surface are rolled and bonded together under the pressure of the laminating roller. Simultaneously, the laminated cover surface is subjected to circulating airflow at room temperature. The laminate passes through a high-temperature drying tunnel at a speed of 5 to 8 meters per minute to achieve bonding and curing, thus completing the complete lamination of the PET solid-color sheet substrate and the first superconducting thermal functional layer 10 of the cover substrate. Using PET solid-color sheet as a direct replacement for the natural plant cortex layer 8 offers higher density, hardness, tension, and superconducting heat dissipation and temperature control properties compared to traditional decorative panels. In particular, its heat dissipation and temperature control performance are significantly superior to those of traditional decorative panels, introducing a new panel material to the market and adapting it to a wider range of applications.

[0180] Variation 4

[0181] Based on Example 1 or Example 2, an ultra-thin solid wood grain coaster panel with physical temperature control provided by the present invention includes a hardened protective coating, a transparent protective film layer 2, a first adhesive layer 3, an adhesive adhesion primer layer 4, a pattern printing layer, a printing effect enhancing primer layer, a first superheat conductive functional layer 10, a third adhesive layer 12, a second thermal conductive functional layer, a thermal insulation sheet layer, a fourth adhesive layer 14, a third superheat conductive functional layer 15, a fourth thermal conductive functional layer, a matrix sealing resin adhesive edge sealing layer 19, and a base material layer 20, stacked in order from bottom to top. The matrix sealing resin adhesive edge sealing layer 19 is disposed on the outer surface of the cover substrate and surrounds it.

[0182] After deformation, the UV bottom coating 7 and natural plant cortex 8 of the cover substrate are omitted. Instead, a print-enhancing primer is applied directly to the upper surface of the first superconducting thermal functional layer 10. A patterned print layer is formed on the upper surface of the print-enhancing primer to directly replace the natural plant cortex 8 as the base texture. The greatest advantage of this alternative process is that the surface pattern and texture of the cover substrate offers a wider range of design and flat pattern effects, as well as lower costs. Compared to traditional decorative panels, it has higher density, hardness, tension, and superconducting heat dissipation and temperature control properties. In particular, its heat dissipation and temperature control performance are significant features and characteristics that traditional decorative panels lack and cannot match, thereby injecting a richer range of panel materials into the market and adapting to a wider range of application scenarios.

[0183] Variation 5

[0184] Based on Example 1 or Example 2, according to the present invention, an ultra-thin solid wood grain coaster panel with physical temperature control is provided. The second thermal conductive functional layer 11, third adhesive layer 12, filler sheet interlayer 13, fourth adhesive layer 14, and fourth thermal conductive functional layer 16 of the cover substrate are omitted. The omitted functional layers are directly used as the functional layers, using a PC endurance sheet with a thickness of 0.5 mm to 3 mm made of PC material. The first superconducting thermal functional layer 10 and the third superconducting thermal functional layer 15 are directly coated on the front and back surfaces of the PC endurance sheet.

[0185] The processing process is shown in Figure 5. One of the preferred methods of coating, spraying, roller coating or curtain coating is adopted to add the graphene coating liquid into the coating liquid raw material box, and the graphene coating is conveyed to the coating liquid output port by the liquid conveyor. The graphene coating liquid is covered on the surface of the coating rubber roller of the coating machine from the liquid output port, or conveyed to the spray atomization port to be pressurized and atomized for spraying. The PC sheet coil is loaded onto the coating machine's substrate unwinding reel 1, or the sheet is placed on the loading platform. Under the force of the feeder, the PC sheet passes under the rubber coating roller or under the spray atomizer. During the coating process, a graphene heat dissipation coating with a wet film thickness of 100μm and a width of up to 1.3m is formed on the front surface of the PC sheet. The sheet then passes through a high-temperature drying tunnel oven (>25 meters long) at a speed of 1-3 meters per minute and a baking temperature set between 70 and 150 degrees Celsius for 5-20 minutes. After the wet graphene film adheres to the PC sheet surface, it is completely cured and cured, achieving an actual dry film thickness of 20μm before the sheet is collected. Repeat the previous step to complete the graphene coating on both sides of the PC sheet.

[0186] The biggest advantage after the replacement is that PC endurance board as the core base material has the characteristics of high strength, good toughness, high temperature resistance, easy deformation, light weight, light transmittance, easy shaping, easy processing, and high flatness. Especially in terms of heat dissipation and temperature control performance, it has significant performance and characteristics that traditional decorative panels do not have and cannot match, thereby injecting more abundant panel materials into the market and adapting to a wider range of scenarios.

[0187] Variation Example 6

[0188] Based on Example 1 or Example 2, according to an ultra-thin solid wood grain coaster panel with physical temperature control provided by the present invention, the second adhesive layer 9, the first superconducting functional layer 10, the second thermal conductive functional layer 11, the third adhesive layer 12, the filling sheet interlayer 13, the fourth adhesive layer 14 and the fourth thermal conductive functional layer 16 of the cover plate substrate are omitted.

[0189] The process steps of the preliminary synthesis of step S2 are shown in Figure 9; a low-viscosity nano-platen adhesive layer that can be repeatedly pasted is applied to the upper surface of the density board with a thickness of 8 mm, and the natural plant leather is placed on top of the low-viscosity nano-platen adhesive layer with the front surface of the natural plant leather facing the low-viscosity nano-platen adhesive layer, and then placed on the feeding platform of the laminating machine, with the upper surface of the natural plant leather facing the direction of the coating rubber roller.

[0190] First, the UV adhesive is injected into the paint raw material box, and then the UV adhesive liquid is transported to the coating rubber roller through the paint conveyor and covers the surface of the rubber roller. Under the action of the power transmission mechanism of the laminating machine, the density board substrate with natural plant leather will pass through the coating rubber roller and form a UV adhesive liquid wet film with a thickness of 80um and a width of 1.25m on the surface of the natural plant leather.

[0191] After completing the UV adhesive coating process of the adhesive layer, the density board substrate will stop between the coating rubber roller and the laminating roller, and the transparent PC endurance board will be flatly laid on the upper surface of the natural plant leather and attached with the UV adhesive, and then move forward, and pass through the laminating roller again. The transparent PC endurance board, the upper surface of the natural plant leather and the UV adhesive wet film are rolled and attached under the pressure of the laminating roller. Simultaneously, under the light curing of the ultraviolet UV light curing machine, the UV adhesive wet film between the transparent PC endurance board and the natural plant leather is initially cured and attached. Finally, the UV adhesive is deeply cured for a second time after passing through the ultraviolet UV light curing machine, thereby completing the complete synthesis of the transparent PC endurance board and the natural plant leather. The attached density board will then be separated, and after separation, it will continue to be used as a reusable pallet.

[0192] The PC solid sheet has high light transmittance, and the UV light source can penetrate the PC solid sheet to completely cure the UV adhesive, thereby achieving synthesis with natural plant skin. If a PC solid sheet that does not have light transmittance is used, the UV light source cannot penetrate, resulting in the inability to synthesize natural plant skin and the PC solid sheet. The biggest feature of using PC solid sheet is that it is printable, coatable, high strength, good toughness, high temperature resistance, easy to manufacture, light weight, light transmittance, easy to shape, easy to process, high flatness, low cost, easy to package, and easy to transport. Especially for the packaging and transportation links, the large-sized finished panel substrate can be rolled and packaged as a whole. The substrate will naturally flatten after unrolling when used, which significantly reduces transportation costs and improves transportation efficiency.

[0193] After the complete synthesis of the PC endurance board and the natural plant skin, the third superconducting functional layer 15 is formed. The base material of the third superconducting functional layer 15 is made of a high thermal conductivity material with graphene as the core. Its process and performance are the same as the aforementioned graphene coating process, so no further explanation is required. The difference is that the PC endurance board is coated after the synthesis of the natural plant skin is completed, and the applied graphene coating is applied on the reverse side of the natural plant skin, eventually forming the third superconducting functional layer 15. The first superconducting functional layer 10 will be omitted. Although it is not as good as the double-sided graphene superconducting performance after omission, the third superconducting functional layer 15 with one side can also cope with general scenarios, thereby injecting more abundant panel materials into the market and adapting to a wider range of scenarios.

[0194] Principle description:

[0195] When the local center position of the surface above the natural plant cortex 8 is ≧100°C high temperature, the first graphene heat dissipation functional layer, as the base layer of the natural plant cortex 8, will receive the center point temperature through the natural plant cortex 8 for the first time. The received high temperature will be horizontally heat-conducted to the surrounding areas in the first graphene heat dissipation functional layer, and at the same time vertically upward through the natural plant cortex 8 with the outside world for heat conduction, heat diffusion, heat radiation, and heat exchange, thereby achieving the first stage of cooling and temperature control effect. While exchanging heat vertically upward, the heat is synchronously conducted vertically downward to the second heat-conducting functional layer of aluminum foil as a heat-conducting medium layer, and the heat received is horizontally heat-conducted to the surrounding areas, thereby achieving the second stage of cooling and temperature control effect. While conducting heat horizontally, heat is conducted vertically downward, and its heat is conducted to the third graphene heat dissipation functional layer through the filling sheet interlayer 13, and then the third graphene heat dissipation functional layer conducts heat horizontally to the surrounding areas, thereby achieving the third stage of cooling and temperature control effect. Simultaneously with lateral heat conduction, heat is conducted vertically downward to the fourth thermally conductive functional layer. From there, heat is then conducted horizontally to the surrounding areas, achieving the fourth stage of cooling and temperature control. Simultaneously with lateral heat conduction, the remaining heat is conducted vertically downward through the slippery ink printed layer to the protected solid surface, achieving the fifth stage of cooling and temperature control. The fourth thermally conductive functional layer adheres to the protected solid surface through the slippery ink printed layer, leveraging the natural, normal temperature of the protected solid surface to achieve the ultimate fourth stage of cooling and temperature control. Through a four-step temperature control and cooling implementation method, the central heat of the natural plant cortex 8 is subjected to continuous, multi-layered, stepped lateral and longitudinal simultaneous heat conduction, heat diffusion, heat radiation, and heat exchange. This reduces the temperature of the top natural plant cortex 8 center point by 15-30% with a cooling rate of less than 0.5 seconds, and reduces the temperature of the bottom protected solid surface by 30-45% with a cooling rate of less than 0.5 seconds.

[0196] After the second thermally conductive functional layer, the filling sheet interlayer 13, and the fourth thermally conductive functional layer, arranged beneath the natural plant cortex 8, are combined through hot and cold pressing, the three-layer matrix achieves maximum density, hardness, durability, and strength, thereby creating a tension control and tension balance between the upper and lower layers. This ultimately resolves the issues of banana bends, warping, unevenness, and poor fit that can occur with solid wood coaster panels. This is particularly important when using solid wood coaster panels as a cover for a tabletop. The panel's smooth, seamless, and ultra-lightweight, high-strength properties are particularly crucial.

[0197] To sum up, when a hot water blanket with a temperature of 100°C or a high-temperature object ≧100°C is placed on the upper surface of the natural plant cortex 8 and the high temperature is transferred to the desktop coaster panel below, the high temperature will be divided into four step-by-step temperature control and cooling stages by the functional layer of the desktop panel base, so as to protect the solid wood desktop and cover base from burns, scratches, blisters, oil stains and other problems, while extending the service life of the ultra-thin solid wood grain coaster panel with physical temperature control provided by the present invention, as well as its wider application adaptability and practicality.

[0198] In the description of this application, it should be understood that the terms "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc., indicating the orientation or position relationship, are based on the orientation or position relationship shown in the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on this application.

[0199] The above describes specific embodiments of the present invention. It should be understood that the present invention is not limited to the specific embodiments described above, and those skilled in the art may make various changes or modifications within the scope of the claims, which do not affect the essence of the present invention. The embodiments of this application and the features in the embodiments may be combined with each other in any manner unless there is a conflict.

Claims

1. A solid wood grain pad structure, characterized in that: It includes a protective layer, a first adhesive layer, an adhesive adhesion primer layer, a first pattern effect layer, a UV bottom coating layer, a natural plant skin layer, a second adhesive layer, a first heat conductive layer, a third adhesive layer, a filling sheet interlayer, a fourth adhesive layer and a second heat conductive layer arranged in sequence from top to bottom; It also includes a base sealing resin adhesive edge sealing layer which is attached around the surface of the base of the backing plate.

2. The solid wood grain pad structure according to claim 1, characterized in that: A second pattern effect layer is also disposed below the second heat conducting layer; Alternatively, a base material layer is further disposed below the second heat conducting layer.

3. The solid wood grain pad structure according to claim 2, characterized in that: The protective layer includes a transparent protective film layer and an antibacterial hardened protective layer arranged in sequence from bottom to top on the first adhesive layer; The first pattern printing layer includes a first printing effect enhancing primer layer and a first pattern printing layer which are sequentially arranged from bottom to top on the UV primer coating layer; The second pattern effect layer includes a second printing effect enhancing primer layer and a second pattern printing layer which are arranged from top to bottom below the second heat conductive layer; The base material layer includes one or more of composite cork, rubber soft magnetic sheet, felt cloth, solid color or imitation pattern plastic sheet, solid color or imitation pattern metal sheet, PC plastic board, water-absorbing and anti-slip material.

4. The solid wood grain pad structure according to claim 1, characterized in that: The first heat-conducting layer comprises a first graphene heat-conducting functional layer and a second metal foil layer arranged in sequence from top to bottom; The second heat-conducting layer includes a third graphene heat-conducting functional layer and a fourth metal foil layer which are sequentially arranged from top to bottom.

5. A method for manufacturing a solid wood grain pad structure, characterized in that: Used to make the solid wood grain pad structure according to any one of claims 1 to 4, the making method comprises the following steps: Step S1, preparing materials: Pre-processing the PET transparent protective film to form a protective layer; The natural plant leather is stitched and processed to form a natural plant leather layer; Processing the metal foil to form a first heat-conducting layer or a second heat-conducting layer; Processing the sandwich sheet to form a filling sheet sandwich; Step S2, preliminary synthesis: The natural plant cortex layer, the first heat-conducting layer, the filling sheet interlayer and the second heat-conducting layer prepared in step S1 are placed on the upper The layers are stacked one after another from top to bottom, and are pressed together by gluing to form a cover substrate, a UV bottom-sealing coating is formed on the upper surface of the natural plant cortex layer of the cover substrate, and then a first printing effect enhancing bottom coating is formed on the upper surface of the UV bottom-sealing coating, and a first pattern printing layer is formed on the upper surface of the first printing effect enhancing bottom coating after pattern printing; Step S3, protective film coating: In step S2, an adhesive primer layer is formed on the upper surface of the first pattern printing layer of the cover substrate, and the protective layer in step S1 is bonded to the adhesive primer layer. Step S4, secondary synthesis: A self-adhesive layer is formed on the upper surface of the functional base material, and the second heat-conducting layer of the cover substrate with the protective layer in step S3 is attached and pressed to the self-adhesive layer.

6. The method for manufacturing a solid wood grain pad structure according to claim 5, characterized in that: For the step S1, Pre-processing the PET transparent protective film to form a protective layer includes the following sub-steps: Step S1.1.1, passing the PET transparent protective film to be treated through an unwinding shaft, a pressure roller, a corona treatment or a coating treatment and winding, and completing the corona treatment or the coating treatment on the upper surface of one side of the PET transparent protective film; Step S1.1.2, roller coating, spray coating or pouring coating of hardening liquid on one side of the PET transparent protective film after corona or coating processing, and forming an antibacterial hardened protective layer after drying and curing; The natural plant leather is stitched to form a natural plant leather layer, including sub-step S1.2.1, aligning the edges of a plurality of natural plant leathers to stitch and bond them; Processing the metal foil to form a first heat-conducting layer or a second heat-conducting layer includes the following sub-steps: Step S1.3.1, frosting the front and back sides of the metal foil respectively, grinding the smooth surface of the metal foil into a rough surface; Step S1.3.2, roller coating, spraying or curtain coating the heat dissipation ink onto one rough surface of the metal foil treated in step S1.3.1 to form a first super thermal conductive functional layer; Step S1.3.3, obtaining a first heat-conducting layer or a second heat-conducting layer through cutting; The interlayer sheet is processed to form a filling sheet interlayer, including sub-step S1.4.1, forming a corona treatment layer on the upper and lower surfaces of the plastic interlayer sheet coil, thereby completing the processing of the filling sheet interlayer.

7. The solid wood grain pad structure and manufacturing method according to claim 1, characterized in that: Step S3 includes the following sub-steps: Step S3.1, coating the upper surface of the first pattern printing layer of the cover substrate in step S2 with an adhesive agent, and forming an adhesive primer coating after UV curing; Step S3.2, coating UV liquid transparent glue between the protective layer and the adhesive primer layer, and completing the synthetic processing of the protective layer after UV light curing.

8. The solid wood grain pad structure and manufacturing method according to claim 1, characterized in that: Step S4 includes the following sub-steps: Step S4.1, stacking the functional base material matrix onto the feeding platform of the flat laminating machine, loading the self-adhesive coil onto the material unwinding air shaft of the laminating machine and fixing it, pasting the upper surface of the functional base material to the adhesive surface of the self-adhesive adhesive and simultaneously entering and passing through the self-adhesive cold-pressing composite roller, thereby forming a self-adhesive adhesive layer on the upper surface of the functional base material; Step S4.2, attaching the second heat-conducting layer of the cover substrate with the protective layer in step S3 to the self-adhesive layer, and simultaneously entering and passing through the cold-pressed composite roller, thereby completing the synthesis processing of the functional base material and the cover substrate.

9. The method for manufacturing a solid wood grain pad structure according to claim 1, characterized in that: The step S5 is also included: The cover plate substrate after the secondary synthesis in step S4 is engraved or punched according to a preset pattern, and the peripheral vertical surface of the engraved or punched cover plate substrate is polished.

10. The method for manufacturing a solid wood grain pad structure according to claim 9, characterized in that: The step S6 is also included, sealing: The peripheral vertical surface of the cover plate substrate after polishing in step S5 is coated with sealing resin glue to form a substrate sealing resin glue edge sealing layer.

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