Bonding device, bonding system, bonding method, replacing device, and replacing method

Abstract

This bonding device bonds a plurality of dies to a substrate. This bonding device comprises a carrier-holding unit that holds a carrier on which a plurality of dies are mounted, a substrate-holding unit that holds a substrate, a transport unit that receives and transports the dies from the carrier held by the carrier-holding unit, and a mount unit that receives the dies from the transport unit and mounts the received dies on the substrate held by the substrate-holding unit. The carrier has a carrier substrate and a resin film that is formed on the carrier substrate, the dies being attached on the side opposite from the carrier substrate with reference to the resin film.

Description

Bonding device, bonding system, bonding method, transfer device, and transfer method

[0001] The present disclosure relates to a joining device, a joining system, a joining method, a transfer device, and a transfer method.

[0002] The chip mounting system described in Patent Document 1 includes a chip supply device, a bonding device, a surface treatment device, a carry-in / out unit, and a transport unit (paragraph

[0225] of Patent Document 1). The chip supply device supplies multiple chips individually. The chips are attached to tape covering an opening of a frame, and are pushed up one by one and turned upside down (paragraph

[0251] of Patent Document 1). The bonding device attaches the chips supplied from the chip supply device to a substrate.

[0003] Japanese Patent No. 6337400

[0004] One aspect of the present disclosure provides techniques for properly bonding a die to a substrate.

[0005] A bonding apparatus according to one aspect of the present disclosure bonds multiple dies to a substrate. The bonding apparatus includes a carrier holding unit that holds a carrier to which the multiple dies are attached, a substrate holding unit that holds the substrate, a transport unit that receives the dies from the carrier held by the carrier holding unit and transports them, and a mount unit that receives the dies from the transport unit and mounts them on the substrate held by the substrate holding unit. The carrier has a carrier substrate and a resin film formed on the carrier substrate, and adsorbs the dies on the side opposite the carrier substrate with respect to the resin film.

[0006] According to one aspect of the present disclosure, the die can be properly bonded to the substrate.

[0007] FIG. 1 is a plan view showing a transfer system according to an embodiment. FIG. 2 is a cross-sectional view showing an example of a die attached to a tape covering an opening of a frame. FIG. 3 is a cross-sectional view showing an example of a carrier. FIG. 4 is a cross-sectional view showing an example of a die attached to a carrier. FIG. 5 is a cross-sectional view showing a transfer device according to an embodiment. FIG. 6 is a cross-sectional view showing an example of a linear motor. FIG. 7 is a cross-sectional view showing an example of an air cylinder. FIG. 8 is a cross-sectional view showing an example of a spring. FIG. 9(A) is a cross-sectional view showing an example of a chamber when a seal portion contacts a carrier, and FIG. 9(B) is a cross-sectional view showing an example of a chamber when a die contacts a carrier. FIG. 10 is a plan view showing a bonding system according to an embodiment. FIG. 11 is a flowchart showing a bonding method according to an embodiment. FIG. 12 is a cross-sectional view showing an example of a substrate. FIG. 13 is a cross-sectional view showing an example of a die-attached substrate. FIG. 14 is a cross-sectional view showing an example of an operation of the bonding device. FIG. 15 is a cross-sectional view showing an example of an operation subsequent to FIG. 14. FIG. 16 is a cross-sectional view showing an example of an operation of the pressing unit.

[0008] Hereinafter, embodiments of the present disclosure will be described with reference to the drawings. Note that the same or corresponding components in each drawing are denoted by the same reference numerals, and descriptions thereof may be omitted. In this specification, the X-axis direction, Y-axis direction, and Z-axis direction are perpendicular to each other. The X-axis direction and Y-axis direction are horizontal directions, and the Z-axis direction is vertical. The X-axis direction includes the positive X-axis direction and the negative X-axis direction that is opposite to the positive X-axis direction. The Y-axis direction includes the positive Y-axis direction and the negative Y-axis direction that is opposite to the positive Y-axis direction. The Z-axis direction includes the positive Z-axis direction and the negative Z-axis direction that is opposite to the positive Z-axis direction.

[0009] First, a transfer system 101 according to one embodiment will be described, mainly with reference to Fig. 1 to Fig. 5. As shown in Fig. 5, the transfer system 101 transfers a die D from a tape TP covering an opening of a frame FR to a carrier A. The carrier A has higher durability than the tape TP. Therefore, as shown in Fig. 13, the bonding surface Da of the die D can be appropriately treated before bonding the die D to the substrate W, thereby enabling the die D to be appropriately bonded to the substrate W.

[0010] The die D has a second base substrate D1 and a second device D2 formed on the second base substrate D1. The second base substrate D1 is, for example, a silicon wafer or a compound semiconductor wafer. The second device D2 includes a semiconductor element, a circuit, a terminal, or the like. The die D has, on a bonding surface Da with the substrate W, the second device D2 that is electrically connected to the first device W2 of the substrate W.

[0011] The multiple dies D are obtained, for example, by dicing the second base substrate D1 or the like while the second base substrate D1 or the like is adhered to the tape TP. The bonding surface Da of the die D is protected by a protective film PF before dicing. The protective film PF is disposed on the opposite side of the die D from the tape TP. The protective film PF is removed before bonding the die D to the substrate W.

[0012] As shown in Figure 4, the carrier A has a carrier substrate A1 and a resin film A2, and adsorbs the die D on the side opposite the carrier substrate A1 with the resin film A2 as a reference. The resin film A2 adsorbs the die D by pressing the die D against the resin film A2. By pressing the die D against the resin film A2, the resin film A2 can be deformed so as to remove gas from between the die D and the resin film A2, and the die D can be vacuum-adsorbed onto the resin film A2. The carrier A does not electrostatically adsorb the die D. Therefore, a device for applying a voltage between the carrier A and the die D is not required, and the structure of the transfer device 121 can be simplified.

[0013] The carrier substrate A1 may be conductive or insulating. The carrier substrate A1 may be made of, for example, silicon, aluminum, an aluminum alloy, stainless steel, or titanium. The carrier substrate A1 may have through-holes A3 formed therein, penetrating the carrier substrate A1 in the thickness direction. The die D can be peeled off from the carrier A by supplying gas to the through-holes A3 or by inserting a pin (not shown) into the through-holes A3. The number and arrangement of the through-holes A3 are not particularly limited. One or more through-holes A3 may be formed for each die D.

[0014] The resin film A2 is preferably made of a flexible material, specifically a material with an elastic modulus of 2 GPa or less, more preferably 0.5 GPa or less. From the viewpoint of durability during modification of the bonding surface Da, the resin film A2 is preferably made of, for example, polyimide or EVA (ethylene-vinyl acetate copolymer). The thickness of the resin film A2 is, for example, 10 μm. In this embodiment, the resin film A2 is a single layer, but may be multiple layers. For example, the resin film A2 may have a polyolefin layer and an acrylic adhesive layer.

[0015] In this embodiment, the resin film A2 blocks the through-hole A3 of the carrier substrate A1, but may have a through-hole (not shown) that communicates with the through-hole A3. The through-hole (not shown) may penetrate the resin film A2 in the thickness direction. In this case, the die D can be directly pressed. Note that the diameter of the through-hole in the resin film A2 is preferably smaller than the diameter of the through-hole A3 of the carrier substrate A1.

[0016] 1, the transfer system 101 includes a loading / unloading station 110, a processing station 120, and a control device 190. The loading / unloading station 110 and the processing station 120 are arranged in this order from the negative side of the X-axis to the positive side of the X-axis.

[0017] The carry-in / out station 110 includes a mounting table 102. Cassettes C101 to C104 are mounted on the mounting table 102. The cassette C101 accommodates a frame FR on which a die D is attached via a tape TP. The cassette C102 accommodates a frame FR from which the die has been peeled off. The cassette C103 accommodates a carrier A on which the die D has not yet been attached. The cassette C104 accommodates a carrier A on which the die D has been attached (i.e., a die-attached carrier DA).

[0018] The carry-in / out station 110 includes a transfer area 111 and a transfer device 112. The transfer area 111 is adjacent to the mounting table 102. The transfer area 111 extends in the Y-axis direction. The transfer device 112 includes a carrier transfer arm 112a and a frame transfer arm 112b. The carrier transfer arm 112a holds and transfers a carrier A in the transfer area 111. The carrier A to be transferred may be one before a die D is mounted thereon or one after a die D has been mounted thereon (i.e., a die-attached carrier DA). The frame transfer arm 112b holds and transfers a frame FR in the transfer area 111. The frame FR to be transferred may be one on which a die D has been mounted or one on which the die D has been peeled off.

[0019] The transport device 112 has a drive unit (not shown) that moves or rotates the carrier transport arm 112 a and the frame transport arm 112 b. The carrier transport arm 112 a and the frame transport arm 112 b can move horizontally (in both the X-axis and Y-axis directions) and vertically (in the Z-axis direction), and can rotate around a vertical axis.

[0020] 1, the carrier transport arm 112a and the frame transport arm 112b may be mounted on the same Y-axis slider and moved simultaneously in the Y-axis direction, or may be mounted on different Y-axis sliders and moved independently in the Y-axis direction. The carrier transport arm 112a and the frame transport arm 112b are positioned at different heights.

[0021] The processing station 120 includes a transfer device 121. The transfer device 121 is adjacent to the transfer area 111. The carrier transfer arm 112a holds and transfers the carrier A between the cassettes C103 and C104 and the transfer device 121. The frame transfer arm 112b holds and transfers the frame FR between the cassettes C101 and C102 and the transfer device 121. The transfer device 121 transfers the die D from the tape TP covering the opening of the frame FR onto the carrier A.

[0022] The control device 190 is, for example, a computer, and includes an arithmetic unit 191 such as a CPU (Central Processing Unit), and a storage unit 192 such as a memory. The storage unit 192 stores programs that control various processes executed in the transfer system 101. The control device 190 controls the operation of the transfer system 101 by causing the arithmetic unit 191 to execute the programs stored in the storage unit 192. A device control unit that controls the operation of each device constituting the transfer system 101 may be provided, and a system control unit that controls multiple device control units may be provided. The device control units and the system control unit may form the control device 190.

[0023] Next, a transfer method according to one embodiment will be described. The following operations are performed under the control of the control device 190. First, the frame transport arm 112b removes the frame FR on which the die D has been mounted from the cassette C101 and transports it to the transfer device 121. The carrier transport arm 112a removes the carrier A from the cassette C103 and transports it to the transfer device 121. Next, the transfer device 121 transfers the die D from the tape TP covering the opening of the frame FR onto the carrier A. After that, the carrier transport arm 112a removes the carrier A on which the die D has been mounted (i.e., the die-attached carrier DA) from the transfer device 121 and transports it to the cassette C104. The frame transport arm 112b removes the frame FR from which the die D has been peeled from the transfer device 121 and transports it to the cassette C102.

[0024] Next, an example of the transfer device 121 will be described, mainly with reference to Fig. 5. The transfer device 121 includes a frame holding unit 122, a pressing unit 123, a carrier holding unit 124, and a conveying unit 125. The frame holding unit 122 holds a frame FR. The frame FR holds the die D, for example, with the bonding surface Da of the die D facing upward.

[0025] The pressing unit 123 locally presses the die D via the tape TP and locally deforms the tape TP. The pressing unit 123 can push up the dies D individually, which can prevent the dies D from rubbing against each other when the transport unit 125 picks up the dies D. The pressing unit 123 and the frame holding unit 122 are movable relative to each other, so that the position at which the dies D are pushed up can be changed.

[0026] The carrier holding unit 124 holds the carrier A. The carrier A holds the die D, for example, with the bonding surface Da of the die D facing upward. The transport unit 125 transports the die D with the bonding surface Da of the die D facing upward. The transport unit 125 does not turn the die D upside down. The transport unit 125 presses the die D against the resin film A2 to adsorb it.

[0027] The transport unit 125 has a suction head 125a and a moving mechanism 125b. The suction head 125a suctions the die D. The suction head 125a suctions the die D while facing the bonding surface Da of the die D. The bonding surface Da of the die D is covered with a protective film PF, and the suction head 125a suctions the die D via the protective film PF. The suction head 125a contacts the protective film PF, but does not contact the die D. This prevents contamination of the bonding surface Da of the die D.

[0028] The moving mechanism 125b moves the suction head 125a between a peeling position and a mounting position. The peeling position is a position where the suction head 125a peels the die D from the tape TP. The mounting position is a position where the suction head 125a mounts the die D on the carrier A. An alignment mark (not shown) may be provided on the carrier A. The control device 190 may correct the mounting position based on an image of the alignment mark.

[0029] Next, an example of the linear motor 126 will be described with reference to FIG. 6 . The conveying unit 125 may include a linear motor 126. The linear motor 126 presses the die D against the resin film A2. The linear motor 126 includes a stator 126a and a mover 126b. The stator 126a includes, for example, a permanent magnet. The mover 126b includes, for example, a coil. The arrangement of the coil and the permanent magnet may be reversed. The mover 126b is moved by the interaction between the magnetic field generated by the current flowing through the coil and the magnetic field generated by the permanent magnet. An adsorption head 125a is provided at one end (e.g., the lower end) of the mover 126b. The moving mechanism 125b moves the adsorption head 125a by moving the stator 126a. The control device 190 controls the pressure with which the die D is pressed against the resin film A2 by controlling the current supplied to the linear motor 126. The die D can be pressed against the resin film A2 with the desired pressure.

[0030] Next, an example of the air cylinder 127 will be described with reference to FIG. 7 . The conveying unit 125 may include an air cylinder 127. The air cylinder 127 presses the die D against the resin film A2. The air cylinder 127 includes a cylinder tube 127a, a piston 127b that divides the internal space of the cylinder tube 127a into two chambers, and a rod 127c that moves with the piston 127b. The rod 127c protrudes from the cylinder tube 127a. A suction head 125a is provided at the tip (e.g., the lower end) of the rod 127c. The moving mechanism 125b moves the suction head 125a by moving the cylinder tube 127a. The control device 190 controls the pressure supplied to the air cylinder 127 to control the pressure with which the die D is pressed against the resin film A2. The die D can be pressed against the resin film A2 with the desired pressure.

[0031] Next, an example of the spring 128 will be described with reference to FIG. 8 . The conveying section 125 may have a spring 128. The spring 128 presses the die D against the resin film A2. The spring 128 is used in combination with, for example, an air cylinder 127. However, the inside of the cylinder tube 127a is always open to the atmosphere, and the die D is pressed against the resin film A2 only by the elastic restoring force of the spring 128. The spring 128 is interposed between the cylinder tube 127a and the suction head 125a. The control device 190 controls the amount of deformation of the spring 128 to control the pressure with which the die D is pressed against the resin film A2. The die D can be pressed against the resin film A2 with the desired pressure.

[0032] Next, an example of the chamber 129 will be described with reference to FIG. 9 . The transport unit 125 may include a chamber 129, a sealing unit 130, and a suction unit 131. A suction head 125a is provided inside the chamber 129, and the chamber 129 accommodates the die D. For example, the chamber 129 is box-shaped and open downward, and the suction head 125a is fixed to the ceiling surface of the chamber 129. The sealing unit 130 seals the gap between the chamber 129 and the resin film A2. The sealing unit 130 is provided along the lower edge of the chamber 129. The suction unit 131 suctions gas inside the chamber 129. The suction unit 131 creates a reduced pressure atmosphere inside the chamber 129. When the die D is pressed against the resin film A2, the entrapment of air bubbles can be suppressed. This is particularly effective when the die D is warped.

[0033] The transport unit 125 may have a support unit 132 and a biasing unit 133 in addition to the chamber 129, etc. The support unit 132 supports the chamber 129 so that it can move toward and away from the resin film A2 (e.g., vertically). The support unit 132 has, for example, a plain bearing 132a. The plain bearing 132a supports the lift shaft 134 so that it can move up and down. The chamber 129 is provided at the lower end of the lift shaft 134, and a flange 135 is provided at the upper end of the lift shaft 134. The biasing unit 133 biases the chamber 129 toward the support unit 132 in a direction that moves it away from the resin film A2 (e.g., upward). The biasing unit 133 is, for example, interposed in a compressed state between the plain bearing 132a and the flange 135, and presses the chamber 129 against the plain bearing 132a. The biasing unit 133 is, for example, a spring.

[0034] The moving mechanism 125b moves the support portion 132, thereby moving the suction head 125a. First, as shown in FIG. 9A, the moving mechanism 125b moves the support portion 132 until the sealing portion 130 contacts the resin film A2. When the movement of the support portion 132 stops, a gap is formed between the die D and the resin film A2. In this state, the suction portion 131 creates a reduced pressure inside the chamber 129. A pressure difference occurs between the inside and outside of the chamber 129, and the chamber 129 approaches the resin film A2 against the biasing force of the biasing portion 133. As shown in FIG. 9B, the sealing portion 130 collapses, and the die D is pressed against the resin film A2. In this case, the die D can also be pressed against the resin film A2 with the desired pressure.

[0035] Next, a bonding system 1 according to one embodiment will be described mainly with reference to Fig. 10 to Fig. 13. As shown in Fig. 13, the bonding system 1 manufactures a die-attached substrate DW by bonding a plurality of dies D to a substrate W. The die-attached substrate DW includes the substrate W and a plurality of dies D bonded to the substrate W.

[0036] 12 and 13 , the substrate W has a first base substrate W1 and a plurality of first devices W2 formed on the first base substrate W1. The first base substrate W1 is, for example, a silicon wafer or a compound semiconductor wafer. The first devices W2 include semiconductor elements, circuits, terminals, etc. The substrate W has a plurality of first devices W2 on a bonding surface Wa with the die D. The first devices W2 of the substrate W and the second devices D2 of the die D are electrically connected.

[0037] Although not shown, a second die may be prepared separately from the die D. The second die has a third device on its bonding surface with the substrate W, which is electrically connected to the first device W2 of the substrate W. The third device has a different function, i.e., a different electrical circuit, from the second device D2. The second device D2 and the third device may be electrically connected to one first device W2.

[0038] 10 , the bonding system 1 includes a loading / unloading station 2, a first processing station 3, a second processing station 5, and a control device 90. The loading / unloading station 2, the first processing station 3, and the second processing station 5 are arranged in this order from the negative side of the X-axis to the positive side of the X-axis. Although not shown, a plurality of second processing stations 5 may be provided, and a plurality of second processing stations 5 may be arranged from the negative side of the X-axis to the positive side of the X-axis.

[0039] The carry-in / out station 2 includes a mounting table 20. Cassettes C1 to C4 are mounted on the mounting table 20. Cassette C1 accommodates a carrier A on which a die D is attached (i.e., a die-attached carrier DA). Cassette C2 accommodates a carrier A from which a die D has been peeled. Cassette C3 accommodates a substrate W to which a die D has not yet been bonded. Cassette C4 accommodates a substrate W to which a die D has been bonded (i.e., a die-attached substrate DW).

[0040] A carrier A is prepared, for example, for each substrate W. That is, one carrier A holds all the dies to be bonded to one substrate W. In this embodiment, the carrier A holds only multiple dies D having the same function, but may also hold the above-mentioned multiple second dies in addition to the multiple dies D.

[0041] It is preferable that the carrier A has the same diameter as the substrate W. In this case, the transport arm that transports the carrier A and the transport arm that transports the substrate W can be of the same model number (i.e., the same dimensions and the same shape), thereby reducing costs. Similarly, the first activation device 37 and the second activation device 39, or the first hydrophilization device 38 and the second hydrophilization device 40, can also be of the same model number, thereby reducing costs. This also prevents the device from becoming too large.

[0042] As shown in FIG. 10 , the load-out station 2 includes a third transfer region 21 and a third transfer device 22. The third transfer region 21 is adjacent to the mounting table 20. The third transfer region 21 extends in the Y-axis direction. The third transfer device 22 includes a third carrier transfer arm 22a and a third substrate transfer arm 22b. The third carrier transfer arm 22a holds and transfers a carrier A in the third transfer region 21. The carrier A to be transferred may be one to which a die D has been attached (i.e., a die-attached carrier DA), or one to which the die D has been removed. The third substrate transfer arm 22b holds and transfers a substrate W in the third transfer region 21. The substrate W to be transferred may be one to which a die D has not yet been bonded, or one to which a die D has been bonded (i.e., a die-attached substrate DW).

[0043] The third transfer device 22 has a drive unit (not shown) that moves or rotates the third carrier transfer arm 22 a and the third substrate transfer arm 22 b. The third carrier transfer arm 22 a and the third substrate transfer arm 22 b can move horizontally (in both the X-axis and Y-axis directions) and vertically (in the Z-axis direction), and can rotate about a vertical axis.

[0044] 10, the third carrier transport arm 22a and the third substrate transport arm 22b may be mounted on the same Y-axis slider and moved simultaneously in the Y-axis direction, or may be mounted on different Y-axis sliders and moved independently in the Y-axis direction. The third carrier transport arm 22a and the third substrate transport arm 22b are disposed at different heights.

[0045] The first processing station 3 includes a first transfer region 31 and a first transfer device 32. The first transfer region 31 extends in the X-axis direction. The first transfer device 32 includes a first carrier transfer arm 32a and a first substrate transfer arm 32b. The first carrier transfer arm 32a holds and transfers a carrier A in the first transfer region 31. The carrier A to be transferred may be one to which a die D is attached (i.e., a die-attached carrier DA) or one to which the die D has been removed. The first substrate transfer arm 32b holds and transfers a substrate W in the first transfer region 31. The substrate W to be transferred may be one to which a die D has not yet been bonded or one to which a die D has been bonded (i.e., a die-attached substrate DW).

[0046] The first transfer device 32 has a drive unit (not shown) that moves or rotates the first carrier transfer arm 32 a and the first substrate transfer arm 32 b. The first carrier transfer arm 32 a and the first substrate transfer arm 32 b can move horizontally (in both the X-axis and Y-axis directions) and vertically (in the Z-axis direction), and can rotate about a vertical axis.

[0047] 10, the first carrier transport arm 32a and the first substrate transport arm 32b may be mounted on the same X-axis slider and moved simultaneously in the X-axis direction, or may be mounted on different X-axis sliders and moved independently in the X-axis direction. The first carrier transport arm 32a and the first substrate transport arm 32b are disposed at different heights.

[0048] The first processing station 3 includes a third transition device 34, a fourth transition device 35, a cleaning device 36, a first activation device 37, a first hydrophilization device 38, a second activation device 39, a second hydrophilization device 40, an inspection device 41, a peeling device 42, and an annealing device 43. The third transition device 34, the fourth transition device 35, the cleaning device 36, the first activation device 37, the first hydrophilization device 38, the second activation device 39, the second hydrophilization device 40, the inspection device 41, the peeling device 42, and the annealing device 43 are adjacent to the first transport region 31.

[0049] The third transition device 34 is provided between the third transfer region 21 and the first transfer region 31 and temporarily stores the carrier A. The third transition device 34 relays the carrier A between the third carrier transfer arm 22a and the first carrier transfer arm 32a. The relayed carrier A may be one to which the die D is attached (i.e., die-attached carrier DA) or one from which the die D has been peeled off.

[0050] The fourth transition device 35 is provided between the third transfer region 21 and the first transfer region 31 and temporarily stores the substrate W. The fourth transition device 35 relays the substrate W between the third substrate transport arm 22 b and the first substrate transport arm 32 b. The relayed substrate W may be one to which the die D has not yet been bonded or one to which the die D has been bonded (i.e., a die-attached substrate DW).

[0051] The cleaning device 36 removes the protective film PF from the die D while the die D is held by the carrier A. The protective film PF protects the bonding surface Da of the die D, for example, during dicing. If the protective film PF is water-soluble, the cleaning device 36 supplies pure water to the protective film PF. After removing the protective film PF from the die D, the cleaning device 36 may further clean the bonding surface Da of the die D. This can improve the quality of the subsequent processing of the bonding surface Da of the die D.

[0052] The first activation device 37 activates the bonding surface Da of the die D while the die D is held by the carrier A. The first activation device 37 is, for example, a plasma processing device. In the first activation device 37, oxygen gas, which is a processing gas, is excited under reduced pressure, for example, to form plasma and is ionized. The bonding surface Da of the die D is activated by irradiating the oxygen ions onto the bonding surface Da of the die D. The processing gas is not limited to oxygen gas, and may be, for example, nitrogen gas.

[0053] The first hydrophilization device 38 hydrophilizes the bonding surface Da of the die D while the die D is held by the carrier A. For example, the first hydrophilization device 38 supplies pure water (e.g., deionized water) onto the die D while rotating the carrier A held by the spin chuck. The pure water imparts OH groups to the bonding surface Da of the die D, which has been activated in advance. The die D and the substrate W can be bonded together by utilizing hydrogen bonding between the OH groups.

[0054] The second activation device 39 activates the bonding surface Wa of the substrate W. The second activation device 39 is, for example, a plasma processing device. In the second activation device 39, oxygen gas, which is a processing gas, is excited under reduced pressure, for example, to form plasma and is ionized. The bonding surface Wa of the substrate W is activated by irradiating the oxygen ions onto the bonding surface Wa of the substrate W. The processing gas is not limited to oxygen gas, and may be, for example, nitrogen gas.

[0055] The second hydrophilization device 40 hydrophilizes the bonding surface Wa of the substrate W. For example, the second hydrophilization device 40 supplies pure water (e.g., deionized water) onto the substrate W while rotating the substrate W held by the spin chuck. The pure water provides OH groups to the bonding surface Wa of the substrate W, which has been activated in advance. The die D and the substrate W can be bonded by utilizing hydrogen bonds between the OH groups.

[0056] The inspection device 41 inspects whether the bonding state between the substrate W and the die D in the die-attached substrate DW is good or bad. The inspection is performed for each die D. The inspection items include at least one of the presence or absence of foreign matter such as air bubbles and the presence or absence of misalignment.

[0057] The delamination device 42 delaminates the die D, which has been found to have a poor bonding state in the inspection by the inspection device 41, from the substrate W. The delamination device 42 delaminates the die D before the annealing device 43 heats the die-attached substrate DW.

[0058] The annealing device 43 anneals (heat-treats) the die-attached substrate DW. Before the heat-treating process, the die D and the substrate W are bonded by hydrogen bonds between OH groups. The heat-treating process causes a dehydration condensation reaction, which creates covalent bonds and improves the bonding strength between the die D and the substrate W.

[0059] The second processing station 5 includes a second transfer region 51 and a second transfer device 52. The second transfer region 51 extends in the X-axis direction. The second transfer device 52 includes a second carrier transfer arm 52a and a second substrate transfer arm 52b. The second carrier transfer arm 52a holds and transfers a carrier A in the second transfer region 51. The carrier A to be transferred may be one to which a die D is attached (i.e., a die-attached carrier DA) or one to which the die D has been removed. The second substrate transfer arm 52b holds and transfers a substrate W in the second transfer region 51. The substrate W to be transferred may be one to which a die D has not yet been bonded or one to which a die D has been bonded (i.e., a die-attached substrate DW).

[0060] The second transfer device 52 has a drive unit (not shown) that moves or rotates the second carrier transfer arm 52 a and the second substrate transfer arm 52 b. The second carrier transfer arm 52 a and the second substrate transfer arm 52 b can move horizontally (in both the X-axis and Y-axis directions) and vertically (in the Z-axis direction) and can rotate about a vertical axis.

[0061] 10, the second carrier transport arm 52a and the second substrate transport arm 52b may be mounted on the same X-axis slider and moved simultaneously in the X-axis direction, or may be mounted on different X-axis sliders and moved independently in the X-axis direction. The second carrier transport arm 52a and the second substrate transport arm 52b are disposed at different heights.

[0062] The second processing station 5 includes a first transition device 54, a second transition device 55, and a joining device 56. The first transition device 54, the second transition device 55, and the joining device 56 are adjacent to the second transfer region 51.

[0063] The first transition device 54 is provided between the first transfer region 31 and the second transfer region 51 and temporarily stores the carrier A. The first transition device 54 relays the carrier A between the first carrier transfer arm 32a and the second carrier transfer arm 52a. The relayed carrier A may be one to which the die D is attached (i.e., die-attached carrier DA) or one from which the die D has been removed.

[0064] The second transition device 55 is provided between the first transfer region 31 and the second transfer region 51 and temporarily stores the substrate W. The second transition device 55 relays the substrate W between the first substrate transport arm 32b and the second substrate transport arm 52b. The substrate W to be relayed may be one to which the die D has not yet been bonded or one to which the die D has been bonded (i.e., a die-attached substrate DW).

[0065] 14 and 15 , the bonding device 56 removes the die D from the carrier A and bonds the die D to the substrate W with the bonding surface Da of the removed die D facing the bonding surface Wa of the substrate W. A die-attached substrate DW is obtained. The second device D2 of the die D and the first device W2 of the substrate W are electrically connected. Details of the bonding device 56 will be described later.

[0066] The control device 90 is, for example, a computer, and includes an arithmetic unit 91 such as a CPU (Central Processing Unit), and a storage unit 92 such as a memory. The storage unit 92 stores programs that control various processes executed in the bonding system 1. The control device 90 controls the operation of the bonding system 1 by causing the arithmetic unit 91 to execute the programs stored in the storage unit 92. A device control unit that controls the operation of each device constituting the bonding system 1 may be provided, and a system control unit that controls multiple device control units may be provided. The control device 90 may be configured with the device control units and the system control unit.

[0067] Next, a joining method according to one embodiment will be described with reference to Fig. 11. The process of Fig. 11 is performed under the control of a control device 90.

[0068] First, the third carrier transport arm 22a takes out the die-attached carrier DA from the cassette C1 and transports it to the third transition device 34. Next, the first carrier transport arm 32a takes out the die-attached carrier DA from the third transition device 34 and transports it to the cleaning device 36.

[0069] Next, the cleaning device 36 removes the protective film PF from the die D while the die D is held by the carrier A (step S101). After that, the first carrier transport arm 32a takes out the die-attached carrier DA from the cleaning device 36 and transports it to the first activation device 37.

[0070] Next, the first activation device 37 activates the bonding surface Da of the die D while the die D is held by the carrier A (step S102). After that, the first carrier transport arm 32a takes out the die-attached carrier DA from the first activation device 37 and transports it to the first hydrophilization device 38.

[0071] Next, the first hydrophilization device 38 hydrophilizes the bonding surface Da of the die D while the die D is held by the carrier A (step S103). Thereafter, the first carrier transport arm 32a takes out the die-attached carrier DA from the first hydrophilization device 38 and transports it to the first transition device 54. Subsequently, the second carrier transport arm 52a takes out the die-attached carrier DA from the first transition device 54 and transports it to the bonding device 56.

[0072] In parallel with the above steps S101 to S103, the following steps S104 to S105 are performed. First, the third substrate transport arm 22b takes out the substrate W from the cassette C3 and transports it to the fourth transition device 35. Thereafter, the first substrate transport arm 32b takes out the substrate W from the fourth transition device 35 and transports it to the second activation device 39.

[0073] Next, the second activation device 39 activates the bonding surface Wa of the substrate W (step S104). Thereafter, the first substrate transport arm 32b takes the substrate W out of the second activation device 39 and transports it to the second hydrophilization device 40.

[0074] Next, the second hydrophilization device 40 hydrophilizes the bonding surface Wa of the substrate W (step S105). Thereafter, the first substrate transport arm 32b takes out the substrate W from the second hydrophilization device 40 and transports it to the second transition device 55. Subsequently, the second substrate transport arm 52b takes out the substrate W from the second transition device 55 and transports it to the bonding device 56.

[0075] Next, the bonding device 56 removes the die D from the carrier A and bonds the die D to the substrate W with the bonding surface Da of the removed die D facing the bonding surface Wa of the substrate W (step S106). This results in a die-attached substrate DW. Thereafter, the second substrate transport arm 52b removes the die-attached substrate DW from the bonding device 56 and transports it to the second transition device 55. Subsequently, the first substrate transport arm 32b removes the die-attached substrate DW from the second transition device 55 and transports it to the inspection device 41.

[0076] Next, the inspection device 41 inspects whether the bonding state between the substrate W and the die D is good or bad (step S107). The inspection device 41 transmits the inspection results to the control device 90. The control device 90 checks whether there is a defect (step S108). The control device 90 controls the transport destination of the die-attached substrate DW to either the annealing device 43 or the peeling device 42 according to the inspection results by the inspection device 41. Inspection does not have to be performed every time. For example, inspection may be performed for each lot, for each predetermined number of substrates, or at predetermined intervals. A lot is made up of multiple substrates W (e.g., 25 substrates) stored in one cassette C3. Inspection may be performed on the first substrate W in the lot.

[0077] If the bonding state of the die D is defective (step S108, NO), the destination of the die-attached substrate DW is the peeling device 42. The first substrate transport arm 32b takes out the die-attached substrate DW from the inspection device 41 and transports it to the peeling device 42. Next, the peeling device 42 peels the die D that is defectively bonded from the substrate W (step S109). Thereafter, the first substrate transport arm 32b takes out the die-attached substrate DW from the peeling device 42 and transports it to the annealing device 43. Then, the processing from step S110 onwards is performed.

[0078] Note that another operation may be performed after step S109. First, the first substrate transport arm 32b takes the substrate W from the delamination device 42 and transports it to the second transition device 55. Next, the second substrate transport arm 52b takes the substrate W from the second transition device 55 and transports it to the bonding device 56. The bonding device 56 re-bonds the die D at the position where the die D was debonded. Thereafter, the processing from step S107 onwards may be performed again.

[0079] On the other hand, if there are no defects in the bonding state of any of the dies D (step S108, YES), the destination of the die-attached substrate DW is the annealing device 43. The first substrate transport arm 32b removes the die-attached substrate DW from the inspection device 41 and transports it to the annealing device 43. Next, the annealing device 43 anneals (heat-treats) the die-attached substrate DW (step S110). The heat-treats improve the bonding strength between the die D and the substrate W.

[0080] Thereafter, the first substrate transport arm 32b takes out the die-attached substrate DW from the annealing device 43 and transports it to the fourth transition device 35. Finally, the third substrate transport arm 22b takes out the die-attached substrate DW from the fourth transition device 35 and stores it in the cassette C4. The die-attached substrate DW stored in the cassette C4 is transported out of the bonding system 1.

[0081] After step S106, the second carrier transport arm 52a removes carrier A from the bonding device 56 and transports it to the first transition device 54. Then, the first carrier transport arm 32a removes carrier A from the first transition device 54 and transports it to the third transition device 34. Finally, the third carrier transport arm 22a removes carrier A from the third transition device 34 and stores it in cassette C2.

[0082] Next, the bonding device 56 will be described in detail, mainly with reference to Figures 14 to 16. The bonding device 56 removes the die D from the carrier A and bonds the die D to the substrate W with the bonding surface Da of the removed die D facing the bonding surface Wa of the substrate W. A die-attached substrate DW is obtained. The second device D2 of the die D and the first device W2 of the substrate W are electrically connected.

[0083] The bonding device 56 includes, for example, a carrier holding unit 61, a substrate holding unit 62, a transport unit 63, and a mount unit 65. The carrier holding unit 61 holds a carrier A. The substrate holding unit 62 holds a substrate W. The transport unit 63 receives and transports a die D from the carrier A held by the carrier holding unit 61. In this embodiment, there is one transport unit 63, but there may be multiple transport units 63. The mount unit 65 receives the die D from the transport unit 63 and mounts the received die D on the substrate W held by the substrate holding unit 62.

[0084] The carrier holding unit 61 holds the carrier A horizontally from below with the bonding surface Da of the die D facing upward. The substrate holding unit 62 holds the substrate W horizontally from below with the bonding surface Wa of the substrate W facing upward. The transport unit 63 turns the die D upside down while transporting the die D, so that the bonding surface Da of the die D faces downward. The mount unit 65 receives the die D from the transport unit 63 and mounts the received die D on the substrate W held by the substrate holding unit 62.

[0085] Although the carrier holding unit 61 of the present embodiment holds the carrier A horizontally from below with the joining surface Da of the die D facing upward, the technology of the present disclosure is not limited to this. For example, the carrier holding unit 61 may hold the carrier A horizontally from above with the joining surface Da of the die D facing downward. In this case, the transport unit 63 does not need to turn the die D upside down while transporting the die D. This eliminates the need for a mechanism for individually turning the die D upside down, and reduces dust generation from that mechanism.

[0086] The transport unit 63 has, for example, a suction head 63a and a moving mechanism 63b. The suction head 63a suctions the die D. The suction head 63a suctions the die D while facing the joining surface Da of the die D. It is preferable that the suction head 63a suctions the die D in a non-contact manner to prevent contamination of the joining surface Da of the die D. The moving mechanism 63b moves the suction head 63a.

[0087] The moving mechanism 63b moves the suction head 63a between a receiving position and a delivery position. The receiving position is a position where the suction head 63a receives the die D from the carrier A. The delivery position is a position where the suction head 63a delivers the die D to the mount unit 65. The moving mechanism 63b may turn the suction head 63a upside down while the die D is being transported, thereby turning the die D upside down.

[0088] The bonding device 56 may include a pressing unit 66. The pressing unit 66 presses the die D in a direction (e.g., upward) in which the die D peels from the resin film A2, for example, by supplying gas to the through-hole A3 of the carrier substrate A1 or by inserting a pin (not shown) into the through-hole A3. When the carrier A is turned upside down, the pressing unit 66 presses the die D downward. The pressing unit 66 simply presses the die D in a direction in which the die D peels from the carrier A. The transport unit 63 receives the die D pressed by the pressing unit 66 from the carrier A at a desired receiving position.

[0089] 16, the pressing unit 66 locally deforms the resin film A2 to form a gap between the resin film A2 and the die D. The formed gap can be used as a peeling starting point, making it possible to easily peel the die D from the resin film A2. Note that if the die D can be peeled from the carrier A simply by lifting the die D together with the suction head 63a, the pressing unit 66 may not be necessary.

[0090] When the pressing portion 66 is provided, the carrier holding portion 61 may adsorb only a portion of the underside of the carrier A. The pressing portion 66 can press the die D upward in the remaining portion of the underside of the carrier A. The carrier holding portion 61 is formed, for example, in a ring shape, and adsorbs the outer periphery of the underside of the carrier A. The pressing portion 66 can press the die D upward in the central portion of the underside of the carrier A.

[0091] As shown in FIGS. 14 and 15 , the bonding device 56 may include a carrier moving unit 67. The carrier moving unit 67 moves the carrier A together with the carrier holding unit 61. The carrier moving unit 67 moves the carrier A, for example, in the X-axis direction and the Y-axis direction. This allows the pressing unit 66 to press multiple dies D in a desired order without the need for the pressing unit 66 to move in the X-axis direction and the Y-axis direction. The transporting unit 63 can receive the dies D at the same receiving position every time. This simplifies the operation of the transporting unit 63. The carrier moving unit 67 may also move the carrier A in the Z-axis direction.

[0092] The bonding device 56 does not necessarily have to include the carrier moving unit 67. That is, the carrier holding unit 61 may be fixed. When the carrier holding unit 61 is provided above the substrate holding unit 62 and the mount unit 65, it is preferable that the carrier holding unit 61 be fixed from the viewpoint of the stability of the carrier holding unit 61. In this case, the receiving position changes for each die D. Therefore, the pressing unit 66 is moved in the X-axis direction and the Y-axis direction in accordance with the change in the receiving position.

[0093] The bonding device 56 may include a substrate moving unit 68. The substrate moving unit 68 moves the substrate W together with the substrate holder 62. The substrate moving unit 68 moves the substrate W, for example, in the X-axis direction and the Y-axis direction. This makes it possible to change the bonding position of the die D relative to the substrate W. As a result, the transport unit 63 can deliver the die D to the mount unit 65 at the same delivery position every time. This simplifies the operation of the transport unit 63. The substrate moving unit 68 may also move the substrate W in the Z-axis direction.

[0094] The mount unit 65 has, for example, a suction head 65a and a moving mechanism 65b. The suction head 65a suctions the die D from the side opposite to the suction head 63a. The die D has a joining surface Da and a back surface Db facing opposite to the joining surface Da. Since it does not matter if the back surface Db becomes dirty, the suction head 65a may come into contact with the back surface Db of the die D.

[0095] The moving mechanism 65b moves the suction head 65a in the Z-axis direction to bond the die D to the substrate W. The moving mechanism 65b may move the suction head 65a in the X-axis direction and the Y-axis direction, or may rotate the suction head 65a about a vertical axis, in order to improve the accuracy of the bonding position of the die D relative to the substrate W. The amount of movement or rotation required to improve the accuracy of the bonding position is small, and the suction head 65a does not need to move much when viewed from above.

[0096] The bonding device 56 may include at least one of a first imaging unit 71, a second imaging unit 72, and a third imaging unit 73 in order to improve the accuracy of the bonding position of the die D relative to the substrate W. Note that the first imaging unit 71, the second imaging unit 72, and the third imaging unit 73 do not have to capture an image every time the die D and the substrate W are bonded, and may capture images periodically.

[0097] 14, the first imaging unit 71 captures an image of the alignment marks on the bonding surface Da of the die D held by the suction head 65a. The number of alignment marks to be captured is, for example, two, but is not particularly limited. The alignment marks may be dedicated marks or may be part of the electrical circuit that constitutes the second device D2.

[0098] The first imaging unit 71 is disposed, for example, below the suction head 65a. The first imaging unit 71 transmits the captured image to the control device 90. The control device 90 processes the image captured by the first imaging unit 71 to detect the position of the die D in the first coordinate system set for the suction head 65a.

[0099] 15 , the second imaging unit 72 captures an image of the alignment marks on the bonding surface Wa of the substrate W held by the substrate holding unit 62. The number of alignment marks to be captured is, for example, two, but is not particularly limited. The alignment marks may be dedicated marks or may be part of the electrical circuit that constitutes the first device W2.

[0100] The second imaging unit 72 is disposed, for example, above the board holding unit 62 and is provided, for example, on the suction head 65a. The second imaging unit 72 transmits the captured image to the control device 90. The control device 90 detects the position of the first device W2 in the second coordinate system set in the board holding unit 62 by processing the image captured by the second imaging unit 72.

[0101] The control device 90 aligns the die D held by the suction head 65a with the substrate W held by the substrate holder 62, using an image captured by at least one of the first imaging unit 71 and the second imaging unit 72. The alignment is performed by controlling at least one of the movement mechanism 65b and the substrate movement unit 68. Before bonding the die D and the substrate W, the position of the die D or the substrate W can be corrected, thereby improving the accuracy of the bonding position.

[0102] After the die D and the substrate W are bonded, the third imaging unit 73 simultaneously captures images of both the alignment mark on the bonding surface Da of the die D and the alignment mark on the bonding surface Wa of the substrate W. The third imaging unit 73 captures images of the alignment marks of the die D and the substrate W, for example, by transmitting light through the die D. The third imaging unit 73 is configured by, for example, an infrared camera.

[0103] When the third imaging unit 73 captures an image of the alignment marks of the die D and the substrate W through the die D, the third imaging unit 73 is disposed, for example, above the substrate holding unit 62 and is provided, for example, on the suction head 65a. The third imaging unit 73 transmits the captured image to the control device 90. The control device 90 processes the image captured by the third imaging unit 73 to detect a deviation between the actual bonding position and the target bonding position.

[0104] The control device 90 uses the image captured by the third imaging unit 73 to align the die D held by the suction head 65a with the substrate W held by the substrate holder 62 in the next and subsequent bonding of the die D and the substrate W. The position of the die D or the substrate W can be corrected taking into account the behavior of the bonding device 56, and the accuracy of the bonding position can be improved.

[0105] 14 and 15, the carrier holding unit 61 and the substrate holding unit 62 are spaced apart in the vertical direction. By arranging the substrate holding unit 62 and the carrier holding unit 61 in the vertical direction, the installation area (area when viewed from above) of the bonding device 56 can be reduced compared to when they are arranged in the horizontal direction.

[0106] The substrate holding part 62 is preferably disposed below the carrier holding part 61. Disposing the substrate holding part 62 at a low position allows the substrate holding part 62 to be stably supported against gravity, improving the bonding accuracy of the die D to the substrate W. The bonding accuracy is mainly determined by the alignment accuracy between the mount part 65 and the substrate holding part 62. Compared to this alignment accuracy, the alignment accuracy between the transport part 63 and the carrier holding part 61 may be lower, and the carrier holding part 61 may be disposed at a higher position.

[0107] The mount 65 is provided between the carrier holding part 61 and the substrate holding part 62. For example, the substrate holding part 62, the mount 65, and the carrier holding part 61 are provided in this order from bottom to top. By arranging the substrate holding part 62, the mount 65, and the carrier holding part 61 in the vertical direction, the installation area of ​​the bonding device 56 can be reduced compared to when they are arranged horizontally.

[0108] Although the embodiments of the joining device, joining system, joining method, transfer device, and transfer method according to the present disclosure have been described above, the present disclosure is not limited to the above embodiments. Various changes, modifications, substitutions, additions, deletions, and combinations are possible within the scope of the claims. These naturally fall within the technical scope of the present disclosure.

[0109] 1 Bonding system 56 Bonding device 61 Carrier holding section 62 Substrate holding section 63 Transport section 65 Mounting section A Carrier A1 Carrier substrate A2 Resin film D Die W Substrate

Claims

1. A bonding device for bonding a plurality of dies to a substrate, comprising: a carrier holding section for holding a carrier having a plurality of the dies attached thereto; a substrate holding section for holding the substrate; a transport section for receiving the die from the carrier held by the carrier holding section and transporting it; and a mounting section for receiving the die from the transport section and mounting the received die on the substrate held by the substrate holding section, wherein the carrier has a carrier substrate and a resin film formed on the carrier substrate, and the die is adsorbed to the side opposite the carrier substrate using the resin film as a reference.

2. The bonding device according to claim 1, wherein the resin film adheres to the die by pressing the die against the resin film.

3. A bonding device as described in claim 1 or 2, wherein the carrier substrate has a plurality of through holes formed therein penetrating the carrier substrate in a thickness direction, and the bonding device is provided with a pressing unit that presses the die in a direction to peel it off from the resin film by supplying gas to the through holes or by inserting a pin into the through holes.

4. A bonding system comprising: the bonding apparatus according to claim 1 or 2; a first activation device which activates the bonding surface of the die with the die attached to the carrier; a first hydrophilization device which hydrophilizes the bonding surface of the die with the die attached to the carrier; a first transition device which temporarily stores the carrier; a first transport area adjacent to the first activation device, the first hydrophilization device and the first transition device; a first carrier transport arm which transports the carrier in the first transport area; a second transport area which is arranged on the opposite side of the first transport area with respect to the first transition device and which is adjacent to the first transition device and the bonding apparatus; and a second carrier transport arm which transports the carrier in the second transport area.

5. A bonding system comprising: the bonding apparatus according to claim 1 or 2; a second activation device which activates the bonding surfaces of the substrates; a second hydrophilization device which hydrophilizes the bonding surfaces of the substrates; a second transition device which temporarily stores the substrates; a first transport area adjacent to the second activation device, the second hydrophilization device and the second transition device; a first substrate transport arm which transports the substrate in the first transport area; a second transport area which is disposed on the opposite side of the first transport area with respect to the second transition device and which is adjacent to the second transition device and the bonding apparatus; and a second substrate transport arm which transports the substrate in the second transport area.

6. A bonding method comprising: bonding the die to the substrate using the bonding apparatus according to claim 1 or 2.

7. A transfer device for transferring a die from a tape covering an opening of a frame to a carrier, comprising: a frame holding section for holding the frame; a carrier holding section for holding the carrier; and a transport section for peeling the die from the tape and transporting the peeled die to the carrier held by the carrier holding section, wherein the carrier has a carrier substrate and a resin film formed on the carrier substrate, and the transport section presses the die against the resin film to adsorb it.

8. The transfer device according to claim 7, wherein the transport section has a linear motor that presses the die against the resin film.

9. The transfer device according to claim 7, wherein the transport section has an air cylinder for pressing the die against the resin film.

10. The transfer device according to claim 7, wherein the transport section has a spring that presses the die against the resin film.

11. The transfer device described in claim 7, wherein the transport unit has a chamber that accommodates the die, a sealing unit that seals the gap between the chamber and the resin film, and a suction unit that sucks gas inside the chamber.

12. The transfer device described in claim 11, wherein the transport unit has a support unit that supports the chamber so that it can move freely in a direction toward and away from the resin film, and a biasing unit that biases the chamber relative to the support unit in a direction away from the resin film.

13. A transfer method, comprising the steps of: transferring the die from the tape to the carrier using the transfer device according to any one of claims 7 to 12.

Images