Component mounting management system, component mounting machine, and method

Abstract

This component mounting management system comprises component mounting machines and a management device that manages the component mounting machines. The component mounting machines each comprise: a component mounting unit capable of executing a mounting process for mounting components to a board; a storage unit that stores information related to the performance of said component mounting machines for executing the mounting process; and a transmission unit that transmits the information stored in the storage unit to the management device. The management device comprises a reception unit that receives the information transmitted from the transmission unit, and a calculation unit that calculates, on the basis of the information received by the reception unit, a mounting time required for the mounting process performed by the component mounting machines.

Description

Component mounting management system, component mounting machine and method

[0001] The technology disclosed in this specification relates to a technology for managing a component mounter.

[0002] Patent Document 1 discloses a control device for production equipment that can automatically replace software to improve the functionality of the production equipment.

[0003] Japanese Patent Application Publication No. 8-76818

[0004] The mounting time required for the mounting process of mounting components onto a board varies depending on the performance of the component mounter. Therefore, if the performance of the component mounter changes (e.g., due to a component replacement), the mounting time calculated based on information related to the performance before the change may differ from the actual mounting time. This specification discloses a technology that can accurately calculate the mounting time based on information related to the performance of the component mounter.

[0005] The component mounting management system disclosed in this specification includes a component mounter and a management device that manages the component mounter. The component mounter includes a component mounting unit that can execute a mounting process to mount components on a board, a memory unit that stores information related to the performance of the component mounter for executing the mounting process, and a transmitter that transmits the information stored in the memory unit to the management device. The management device includes a receiver that receives the information transmitted from the transmitter, and a calculator that calculates a mounting time required for the mounting process in the component mounter based on the information received by the receiver.

[0006] In the component mounting management system described above, the mounter stores information related to the performance of the mounter, and the management device calculates the mounting time required for the mounting process in the mounter based on the information related to the performance of the mounter transmitted from the mounter. Therefore, even if the performance of the mounter changes, the management device does not need to manage the change in the performance of the mounter, and the accurate mounting time can be calculated based on the information transmitted from the mounter.

[0007] The mounters that make up the component mounting management system and the method for managing the mounters realized by the component mounting management system are also novel and useful.

[0008] 1 is a schematic diagram of a component mounting management system according to an embodiment of the present invention; FIG. 2 is a side view of a component mounter; FIG. 3 is a control configuration diagram of the component mounting management system; and FIG. 4 is a sequence diagram of processing executed in the component mounting management system.

[0009] The main features of the embodiments described below are listed below. Note that the technical elements described below are independent technical elements that exhibit technical utility alone or in various combinations, and are not limited to the combinations described in the claims at the time of filing.

[0010] (Feature 1) The component mounting management system may manage a plurality of component mounters, each of which may include the component mounting unit, the storage unit, and the transmission unit. In this case, the receiving unit may acquire the information transmitted from the transmission units of the plurality of component mounters, and the calculating unit may calculate the mounting time for each of the plurality of component mounters based on the information for each of the plurality of component mounters received by the receiving unit.

[0011] With this configuration, it is possible to accurately calculate the mounting time for multiple mounters based on information related to the performance of each mounter. However, in another embodiment, the component mounting management system may manage a single mounter.

[0012] (Feature 2) In the component mounting management system, the component mounter may include an imaging unit that captures an image of the component, and an image processing device that analyzes the image of the component captured by the imaging unit. In this case, the information may be information related to the performance of the image processing device.

[0013] With this configuration, the mounting time can be accurately calculated based on information related to the performance of the image processing device. However, in another embodiment, the information used to calculate the mounting time may be, for example, information related to the performance of the component mounting unit of the component mounter.

[0014] (Feature 3) In the component mounting management system, the management device may further include a job determination unit that determines a job to be executed in the mounting process of the component mounter based on the information acquired by the receiving unit. The job may specify at least the type and number of components to be mounted in the mounting process.

[0015] With this configuration, it is possible to determine an efficient job based on information related to the performance of the mounter.

[0016] (Feature 4) In the component mounting management system described above, the management device may further include a job sending unit that sends the job determined by the job determination unit to the component mounter.

[0017] According to this configuration, it is possible to make the mounter execute an efficient job determined based on information relating to the performance of the mounter.

[0018] (Feature 5) In the component mounting management system described above, the management device may further include an information request sending unit that sends an information request signal to the component mounter to request that the information be sent to the management device.

[0019] With this configuration, the management device can cause the mounters to transmit information related to the performance of the mounters to the management device at desired timing.

[0020] FIG. 1 shows a schematic diagram of a component mounting management system 100 according to this embodiment. The component mounting management system 100 includes a management device 50 and a component mounting line 10. The component mounting management system 100 is a system for mounting electronic components onto circuit boards using the component mounting line 10. The component mounting line 10 includes three component mounters 10A, 10B, and 10C. Although not shown, the component mounting line 10 also includes other board work machines such as a solder printer and a board inspection machine in addition to the component mounters 10A-10C. Circuit boards are transported in this order by the component mounters 10A, 10B, and 10C. Multiple electronic components are mounted on the circuit boards by each of the component mounters 10A-10C. The management device 50 is a computer that manages the component mounters 10A-10C on the component mounting line 10. The management device 50 is capable of communicating with each of the component mounters 10A-10C. In this embodiment, the component mounters 10A to 10C on the component mounting line 10 are all the same model and have the same configuration, except for the configuration of the control device 22, which will be described later. For this reason, this specification will mainly describe the configuration of the component mounter 10A. Below, electronic components will be referred to simply as "components," and circuit boards will be referred to simply as "boards."

[0021] The detailed structure of the component mounter 10A will be described with reference to Figure 2. The component mounter 10A executes a mounting process to mount components 4 at mounting positions on the board 2. As shown in Figure 2, the component mounter 10A includes a component feeder unit 12, a touch panel 13, a feeder holder 14, a component mounting unit 15 consisting of a mounting head 16 and a head moving device 18, an imaging device 30, a board conveyor 20, and a control device 22. The component feeder unit 12 has multiple feeders arranged in the +X direction (i.e., the direction into the paper surface of Figure 2), and each feeder stores multiple components 4. Each feeder of the component feeder unit 12 is detachably attached to the feeder holder 14 and supplies components 4 to the mounting head 16.

[0022] The touch panel 13 displays various information related to the mounter 10 A. The touch panel 13 also functions as an operation unit that receives various instructions from the operator.

[0023] The placement head 16 includes a detachably fixed nozzle 6. The nozzle 6 has a cylindrical shape extending downward toward the board 2. The nozzle 6 picks up a component 4 by maintaining a negative pressure inside the nozzle 6. The placement head 16 moves the nozzle 6 along the Z axis (i.e., the vertical direction on the paper surface of FIG. 2). The placement head 16 can pick up a component 4 from a feeder using the nozzle 6 and place the component 4 picked up by the nozzle 6 at a mounting position on the board 2. Note that the placement head 16 is not limited to having a single nozzle 6, and may include multiple nozzles 6. Furthermore, the placement head 16 may include a chuck, instead of the nozzle 6, that grips and holds the component 4.

[0024] The head moving device 18 is a device that moves the mounting head 16 and the imaging device 30 along the XY plane. The head moving device 18 moves the mounting head 16 to a mounting position on the board 2.

[0025] The imaging device 30 includes a camera 32 (an example of an imaging unit), an illumination light source (not shown), and a prism (not shown). The camera 32 captures an image of the side of the component 4 picked up by the nozzle 6 from the side (i.e., from the right side of the paper in FIG. 2 ). The camera 32 is, for example, a CCD camera. The illumination light source is configured with an LED and illuminates the imaging surface of the component 4. Note that, in a modified example, the imaging device 30 may include, for example, a camera that captures an image of the bottom surface of the component 4 picked up by the nozzle 6 from below, instead of the camera 32 that captures an image of the side of the component 4 picked up by the nozzle 6 from the side. In this case, the camera may be located, for example, between the feeder holder 14 and the board conveyor 20 of the component mounter 10A. In this modified example, the camera is an example of an "imaging unit." Alternatively, in another modification, the imaging device 30 may include both a camera 32 that captures an image of the side surface of the component 4 from the side, and a camera that captures an image of the bottom surface of the component 4 from below.

[0026] The board conveyor 20 is a device that carries in, positions, and carries out the board 2. As an example, the board conveyor 20 in this embodiment has a pair of belt conveyors and a support device (not shown) that supports the board 2 from below. When the mounting of components 4 in the component mounter 10A is completed, the board conveyor 20 carries out the board 2 to the adjacent component mounter 10B.

[0027] The control device 22 is a computer that controls each unit of the mounter 10A, and is connected to the management device 50 (see FIG. 1) so as to be able to communicate with it.

[0028] The control configuration of each device 50, 10A-10C of the component mounting management system 100 will be described with reference to FIG. 3 . The management device 50 is, for example, a terminal device such as a laptop computer, and includes an operation unit 52, a display unit 54, a communication I / F (abbreviation of interface) 56, and a management control board 60. The management device 50 may be a desktop PC or a terminal device such as a smartphone or PDA. The operation unit 52 accepts various instructions from a user. The display unit 54 displays various information related to the component mounting line 10. The communication I / F 56 is an I / F for connecting to each mounter 10A-10C on the component mounting line 10. In this embodiment, the management device 50 and each mounter 10A-10C are connected via a wired LAN via the communication I / F 56. However, in a modified example, each device in the component mounting management system 100 may be connected via a wireless LAN via the communication I / F 56 of the management device 50.

[0029] The management control board 60 is a control board for controlling the management device 50. The management control board 60 includes a CPU 62 and a memory 64. The memory 64 is composed of non-volatile memory and volatile memory and stores a program 66. The program 66 is a program for controlling the component mounting line 10 and includes, for example, a program for executing the job determination process described below. The program 66 is installed in the management device 50 at the time of shipment. In a modified example, the program 66 may be downloaded to the management device 50 from an external server afterward, or may be imported into the management device 50 from media shipped with the component mounter 10A. The CPU 62 executes various processes in accordance with the program 66 stored in the memory 64. The CPU 62 transmits job information to each of the component mounters 10A-10C based on, for example, a production program received from a higher-level production management device (not shown). The job information is instructions for causing each of the component mounters 10A-10C to execute the mounting process.

[0030] 3, the mounter 10A further includes a communication I / F 11 in addition to the touch panel 13, the component mounter 15, and the camera 32 described with reference to FIG. 2. The communication I / F 11 is connected to the communication I / F 56 of the management device 50.

[0031] The control device 22 includes a mounting control board 40 and an analysis control board 41. The mounting control board 40 is a control board mainly for controlling the component mounting unit 15. The mounting control board 40 includes a CPU 42 and a memory 46. The memory 46 is composed of non-volatile memory and volatile memory, and stores a program 48. The program 48 is a program related to the mounting process and is installed in the component mounter 10A at the time of shipment of the component mounter 10A. In a modified example, the program 48 may be imported into the component mounter 10A from a medium shipped together with the component mounter 10A. For example, the CPU 42 of the mounting control board 40 causes the component mounting unit 15 to mount the component 4 at the mounting position on the board 2 in accordance with the program 48.

[0032] The analysis control board 41 is a control board that mainly analyzes images of the component 4 captured by the camera 32 to determine whether the component 4 is properly attracted to the nozzle 6. That is, the analysis control board 41 analyzes the images of the component 4 captured by the camera 32. The analysis control board 41 includes a CPU 43 and a memory 45. The memory 45 is composed of non-volatile memory and volatile memory and stores a program 47. The program 47 is an image analysis program and includes a calculation formula F1. The program 47 is installed in the component mounter 10A prior to shipment, but may also be downloaded to the component mounter 10A from media shipped with the component mounter 10A. The calculation formula F1 is used to calculate the analysis time required for the analysis control board 41 to analyze the image of the component 4. The analysis time varies depending on, for example, the size of the component 4 and the number of electrodes on the analysis control board 41. The larger the size of the component 4, the longer the analysis time, and the smaller the size of the component 4, the shorter the analysis time. Furthermore, the electrodes on the analysis control board 41 process signals during image analysis. Therefore, the more electrodes on the analysis control board 41, the higher the image resolution and the longer the analysis time. The fewer electrodes on the analysis control board 41, the lower the image resolution and the shorter the analysis time. For this reason, the calculation formula F1 includes, for example, a size coefficient C1 by which the size value of the component 4 included in the image is multiplied, and an electrode coefficient C2 by which the number of electrodes on the analysis control board 41 is multiplied.

[0033] The size coefficient C1 is determined by the analysis time of the analysis control board 41 for the size value of the component 4 per unit. That is, the size coefficient C1 varies depending on the analysis performance of the analysis control board 41 (such as the processing power of the CPU 43). The electrode coefficient C2 is determined by the analysis time of the analysis control board 41 for each electrode. That is, the electrode coefficient C2 varies depending on the performance of the electrode and the analysis performance of the analysis control board 41. The calculation formula F1 includes a formula that adds together the value obtained by multiplying the size value of the component 4 included in the image by the size coefficient C1 and the value obtained by multiplying the number of electrodes on the analysis control board 41 by the electrode coefficient C2.

[0034] The control device 22 of the mounter 10B, like the mounter 10A, is equipped with an analysis control board 41. However, the control device 22 of the mounter 10C is equipped with an analysis control board 41R instead of the analysis control board 41. The analysis control board 41R is an improved version of the analysis control board 41. For example, the analysis control board 41R is equipped with a CPU 43R with improved processing power, improving its analysis processing capabilities. In other words, it may be difficult to procure a CPU with the same performance as the one installed on the analysis control board, and the CPU may be replaced with a higher-performance CPU to accommodate future increases in processing load. Therefore, even if the mounter 10 is the same product, the performance of the analysis control board may not be the same. Therefore, the improved analysis control board 41R has a calculation formula F2 instead of the calculation formula F1 of the analysis control board 41. Unlike calculation formula F1, calculation formula F2 includes a size coefficient C3 and an electrode coefficient C4. In this embodiment, the size coefficient C3 of calculation formula F2 is smaller than the size coefficient C1 of calculation formula F1. Furthermore, the electrode coefficient C4 of the formula F2 is greater than the electrode coefficient C2 of the formula F1.

[0035] As mentioned above, the mounters 10A to 10C are the same model. However, the mounters 10A and 10B are equipped with an analysis control board 41, and the mounter 10C is equipped with an analysis control board 41R. That is, although the mounter 10C is the same model as the mounters 10A and 10B, the performance of the image analysis device is different. For example, if an improved analysis control board 41R is later installed in the mounter 10C instead of the analysis control board 41 that was installed in the mounter 10C at the time of shipment, the performance of the image analysis device of each of the mounters 10A to 10C may differ.

[0036] 4, the processing executed between the devices 50, 10A to 10C of the component mounting management system 100 will be described. In the following, the processing executed by the management control board 60, the processing executed by the mounting control board 40, and the processing executed by the analysis control boards 41, 41R will be described mainly by the devices 50, 10A to 10C, rather than by the control boards 60, 40, 41, 41R. Also, although all communications between the devices 50, 10A to 10C in FIG. 4 are executed via the communication I / Fs 56, 11, the phrase "via the communication I / F" will be omitted below.

[0037] First, the management device 50 acquires a production program from a higher-level production management device (T10). In this case, the management device 50 transmits an information request signal to the mounter 10A (T20). The information request signal is a signal for requesting the mounter 10A to transmit performance information indicating the current performance of the mounter 10A. By transmitting the information request signal to the mounter 10A, the management device 50 can cause the mounter 10A to transmit the performance information.

[0038] When the mounter 10A receives an information request signal from the management device 50 (T20), it transmits performance information of the mounter 10A to the management device 50 (T22). The performance information includes the calculation formula F1 stored in the memory 45 of the analysis control board 41 of the mounter 10A.

[0039] When the management device 50 receives the performance information from the mounter 10A (T22), it stores the received performance information (T24).

[0040] Similarly, the management device 50 transmits an information request signal to the mounter 10B (T30) and receives performance information including the formula F1 from the mounter 10B (T32). As a result, the management device 50 stores the received performance information (T34).

[0041] Furthermore, the management device 50 transmits an information request signal to the mounter 10C (T40), and receives performance information including the formula F2 from the mounter 10C (T42). The management device 50 stores the received performance information (T44).

[0042] The management device 50 executes a job determination process based on the received performance information (T50). The job determination process is a process for determining the mounting process for each of the mounters 10A-10C. In the job determination process, the management device 50 optimizes the mounting process for each of the mounters 10A-10C so as to maximize the mounting efficiency of the component mounting line 10. The job determination process is executed in response to receiving performance information from all of the mounters 10A-10C on the component mounting line 10.

[0043] Specifically, the management device 50 first allocates the components included in the production program to each of the mounters 10A to 10C (S10). Specifically, the management device 50 allocates the components to the component number information and component type information included in the production program, and three component groups to be mounted by each of the mounters 10A to 10C. The component type information includes mounting position information that indicates the mounting position of the component.

[0044] The management device 50 calculates the mounting time required for the mounting process of the component group assigned in S10 (S12). Here, the management device 50 calculates the mounting time of the mounter 10A, for example, based on the performance information received in T22. That is, the management device 50 calculates the analysis time included in the mounting time of the mounter 10A based on calculation formula F1. Similarly, the management device 50 calculates the mounting time of the mounter 10B based on the performance information received in T32, and calculates the mounting time of the mounter 10C based on the performance information received in T42. That is, the management device 50 calculates the analysis time included in the mounting time of the mounter 10C based on calculation formula F2.

[0045] The management device 50 determines whether the mounting times of the mounters 10A-10C calculated in S12 are optimized (S20). Specifically, the management device 50 determines whether the difference in mounting time between the mounters 10A-10C is within a predetermined threshold. That is, the management device 50 determines whether the takt balance between the mounters 10A-10C is optimized. If the difference in mounting time between the mounters 10A-10C exceeds the predetermined threshold (NO in S20), the management device 50 reassigns the components (S10). If the difference in mounting time between the mounters 10A-10C is within the predetermined threshold (YES in S20), the management device 50 proceeds to S30. The management device 50 repeats the processes of S10 and S20 until the takt balance between the mounters 10A-10C is optimized.

[0046] The management device 50 determines the conditions determined to be optimized in S20, i.e., the component types and numbers of the component groups allocated to each of the mounters 10A-10C in S10, as jobs (S30). In this way, the management device 50 calculates the mounting time for each of the mounters 10A-10C based on the formulas F1 and F2 included in the performance information received from each of the mounters 10A-10C, and determines jobs based on the calculated mounting time. This allows jobs to be optimized based on accurate mounting times based on the latest analysis time calculation formulas.

[0047] Next, the management device 50 transmits the job information for the mounter 10A determined in S30 to the mounter 10A (T60). Similarly, the management device 50 transmits the job information for the mounter 10B to the mounter 10B (T62), and transmits the job information for the mounter 10C to the mounter 10C (T64). The job information includes the component types and quantities to be mounted by each of the mounters 10A to 10C.

[0048] When the mounter 10A receives the job information from the management device 50 (T60), it executes the mounting process based on the component types and numbers included in the job information (T70).

[0049] Similarly, when the mounter 10B receives job information from the management device 50 (T62), it executes mounting processing based on the job information (T72), and when the mounter 10C receives job information from the management device 50 (T64), it executes mounting processing based on the job information (T74). In this way, by the management device 50 sending jobs to each of the mounters 10A to 10C, it is possible to have each of the mounters 10A to 10C execute jobs that have been optimized based on the latest calculation formula for analysis time.

[0050] (Effects of the Present Embodiment) In conventional component mounting management systems, for example, the management device stores a calculation formula for analysis time in association with the model name of a component mounter. Therefore, in conventional component mounting management systems, even if the calculation formula for analysis time in a component mounter is subsequently changed, the management device calculates the mounting time based on the calculation formula before the change. As a result, the actual analysis time of the component mounter may deviate from the analysis time calculated by the management device, and as a result, the calculated mounting time may deviate from the actual mounting time. In the component mounting management system 100 of the present embodiment, for example, the mounting time of the component mounter 10A is calculated based on performance information including the calculation formula F2 of the component mounter 10C (S12). Therefore, even if the image analysis performance of the component mounter 10C is changed after installation, an accurate mounting time can be calculated based on the latest calculation formula F2. In this embodiment, the calculation formulas F1 and F2 are an example of "performance-related information." Although it is possible for the management device 50 to store (manage) performance information for each of the mounters 10A-10C, the mounters 10A-10C are the same model, and managing them as different models using the management device 50 would make management cumbersome. In this embodiment, the performance information for each of the mounters 10A-10C is stored in each mounter (for example, an improved analysis control board 41R). Therefore, the mounting time can be accurately calculated while taking into account various improvements made to the mounters 10A-10C, without complicating management using the management device 50.

[0051] The following points are to be noted regarding the component mounting management system 100 described in the embodiment. The performance information may be, for example, identification information that identifies the version of the analysis control board of each of the mounters 10A to 10C. In this case, the management device 50 may store the identification information of each of the mounters 10A to 10C in association with the calculation formulas F1 and F2 for the analysis time. The management device 50 may identify the calculation formula and calculate the mounting time based on the identification information received from each of the mounters 10A to 10C. In this modification, the identification information is an example of "information related to performance."

[0052] The component mounting line 10 may include one mounter 10 A. Generally speaking, the component mounting management system 100 does not need to manage multiple mounters 10 A to 10 C.

[0053] The performance information may include, instead of the formulas F1 and F2 for calculating the analysis time, a formula for calculating the mounting time of the component mounter 15. In this modification, the formula for calculating the mounting time is an example of "information related to performance."

[0054] 4, the management device 50 does not need to execute the job determination process. In this case, the management device 50 does not need to send jobs to each of the mounters 10A to 10C. In this modification, for example, the mounting time calculated based on the performance information may be displayed on the display unit 54 of the management device 50. This allows the administrator to know the accurate mounting time calculated based on the performance information.

[0055] The management device 50 does not need to send an information request signal to each of the mounters 10A to 10C. In this modification, for example, each of the mounters 10A to 10C may send performance information to the management device 50 at a predetermined timing.

[0056] The technical elements described in this specification or drawings exhibit technical utility either alone or in various combinations, and are not limited to the combinations described in the claims at the time of filing. Furthermore, the technologies illustrated in this specification or drawings simultaneously achieve multiple objectives, and achieving one of those objectives is itself technically useful.

[0057] For example, this specification also discloses the technical idea of ​​changing "the component mounting management system according to claim 1" to "the component mounting management system according to claim 1 or 2" in claim 3. Similarly, the technical idea of ​​changing "the component mounting management system according to claim 1" to "the component mounting management system according to any one of claims 1 to 3" in claim 4, and the technical idea of ​​changing "the component mounting management system according to claim 1" to "the component mounting management system according to any one of claims 1 to 5" in claim 6 are also disclosed.

Claims

1. A component mounting management system comprising a component mounter and a management device that manages the component mounter, wherein the component mounter comprises: a component mounting unit capable of executing a mounting process to mount components on a board; a memory unit that stores information related to the performance of the component mounter for executing the mounting process; and a transmission unit that transmits the information stored in the memory unit to the management device, and the management device comprises: a receiving unit that receives the information transmitted from the transmission unit; and a calculation unit that calculates a mounting time required for the mounting process in the component mounter based on the information received by the receiving unit.

2. The component mounting management system of claim 1, wherein the management device manages a plurality of component mounting machines, each of the plurality of component mounting machines having the component mounting unit, the memory unit, and the transmission unit, the receiving unit acquires the information transmitted from the transmission units of the plurality of component mounting machines, and the calculation unit calculates the mounting time for each of the plurality of component mounting machines based on the information for each of the plurality of component mounting machines received by the receiving unit.

3. The component mounting management system of claim 1, wherein the component mounting machine comprises: an imaging unit that captures an image of the component; and an image processing device that analyzes the image of the component captured by the imaging unit; and the information is information related to the performance of the image processing device.

4. The component mounting management system of claim 1, wherein the management device further includes a job determination unit that determines a job to be executed in the mounting process of the component mounter based on the information acquired by the receiving unit, and the job specifies at least the type and number of components to be mounted in the mounting process.

5. The component mounting management system according to claim 4, wherein the management device further comprises a job transmission section that transmits the job determined by the job determination section to the component mounter.

6. The component mounting management system according to claim 1, wherein the management device further comprises an information request transmission unit that transmits an information request signal to the component mounter to request that the information be transmitted to the management device.

7. A component mounter comprising: a component mounting unit capable of executing a mounting process to mount components on a board; a memory unit that stores information related to the performance of the component mounter for executing the mounting process; and a transmission unit that transmits the information stored in the memory unit to a management device, wherein the management device comprises: a receiving unit that receives the information transmitted from the transmission unit; and a calculation unit that calculates a mounting time required for the mounting process in the component mounter based on the information received by the receiving unit.

8. A method for managing a component mounter, the component mounter comprising: a component mounting unit capable of executing a mounting process to mount components on a board; and a memory unit that stores information related to the performance of the component mounter for executing the mounting process, the method including: an acquisition step of acquiring the information transmitted from the component mounter; and a calculation step of calculating a mounting time required for the mounting process in the component mounter based on the information received in the acquisition step.

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