Method for manufacturing semiconductor device

Abstract

The purpose of the present invention is to provide a technique for suppressing outflow of molten solder during reflow and for suppressing an increase in semiconductor device manufacturing costs. This method for manufacturing a semiconductor device comprises the steps for: mounting, on a base plate, a semiconductor mounting substrate-positioning jig which is frame-shaped in a top view; arranging plate solder in a semiconductor mounting substrate arrangement position where a semiconductor mounting substrate is to be disposed in the frame of the semiconductor mounting substrate-positioning jig mounted on the base plate; arranging the semiconductor mounting substrate on the plate solder; mounting a frame-shaped solder flow-prevention jig so as to surround the sides of the semiconductor mounting substrate in the frame of the semiconductor mounting substrate-positioning jig mounted on the base plate; and bonding, by means of reflow, the base plate and the semiconductor mounting substrate.

Description

Semiconductor device manufacturing method

[0001] The present disclosure relates to a method for manufacturing a semiconductor device.

[0002] A conventional method for soldering a semiconductor device is disclosed, for example, in Patent Document 1. Patent Document 1 proposes a technique in which an insulating substrate is placed on a base plate with solder interposed therebetween, and the solder and insulating substrate placed on the base plate are pressed together with a pressing member, thereby suppressing voids in the solder.

[0003] JP 2013-157377 A

[0004] However, with the technology described in Patent Document 1, there is a problem that pressing with a pressing member can cause molten solder to leak out from around the pressed area, and furthermore, since a separate pressing member is required, the manufacturing costs of the semiconductor device increase.

[0005] Therefore, an object of the present disclosure is to provide a technique for suppressing the outflow of molten solder during reflow and suppressing an increase in the manufacturing cost of semiconductor devices.

[0006] The method for manufacturing a semiconductor device according to the present disclosure is a method for manufacturing a semiconductor device in which a semiconductor mounting substrate having a semiconductor element mounted on an insulating substrate is bonded to a base plate, and includes the steps of: attaching a frame-shaped semiconductor mounting substrate positioning jig on the base plate when viewed from above; placing a plate of solder at a semiconductor mounting substrate position where the semiconductor mounting substrate will be placed within the frame of the semiconductor mounting substrate positioning jig attached to the base plate; placing the semiconductor mounting substrate on the plate of solder; attaching a frame-shaped solder flow prevention jig so as to surround the sides of the semiconductor mounting substrate within the frame of the semiconductor mounting substrate positioning jig attached to the base plate; and bonding the base plate and the semiconductor mounting substrate by reflow.

[0007] According to the present disclosure, since the sides of the semiconductor mounting substrate are surrounded by the solder flow prevention jig, it is possible to prevent the outflow of molten solder during reflow. Furthermore, since there is no need to provide a separate pressing member, it is possible to prevent an increase in the manufacturing cost of the semiconductor device.

[0008] The objects, features, aspects, and advantages of the present disclosure will become more apparent from the following detailed description and the accompanying drawings.

[0009] FIG. 1 is a top view showing a state in which a solder flow prevention jig is attached to a semiconductor mounting substrate positioning jig used in a manufacturing method of a semiconductor device according to a first embodiment. FIG. 2 is an exploded perspective view showing the arrangement of a semiconductor mounting substrate and a solder flow prevention jig with respect to the semiconductor mounting substrate positioning jig used in a manufacturing method of a semiconductor device according to a first embodiment. FIG. 3 is a flowchart showing a manufacturing method of a semiconductor device according to a first embodiment. FIG. 4 is a cross-sectional view showing a manufacturing method of a semiconductor device according to a first embodiment. FIG. 5 is a cross-sectional view showing a manufacturing method of a semiconductor device according to a first embodiment. FIG. 6 is a cross-sectional view showing a manufacturing method of a semiconductor device according to a first embodiment. FIG. 7 is a cross-sectional view showing a manufacturing method of a semiconductor device according to a first embodiment. FIG. 8 is a cross-sectional view showing a manufacturing method of a semiconductor device according to a first embodiment. Fig. 10 is a cross-sectional view showing a method for manufacturing a semiconductor device according to a second embodiment. Fig. 11 is a cross-sectional view showing a method for manufacturing a semiconductor device according to a second embodiment. Fig. 12 is a cross-sectional view showing a method for manufacturing a semiconductor device according to a second embodiment. Fig. 13 is a cross-sectional view showing a method for manufacturing a semiconductor device according to a second embodiment. Fig. 14 is a cross-sectional view showing a method for manufacturing a semiconductor device according to a second embodiment. Fig. 15 is a cross-sectional view showing a method for manufacturing a semiconductor device according to a second embodiment.

[0010] <First Embodiment> <Overall Configuration> The first embodiment will be described below with reference to the drawings. Fig. 1 is a top view showing a state in which a solder flow prevention jig 30 is attached to a semiconductor mounting substrate positioning jig 20 used in a semiconductor device manufacturing method according to the first embodiment. Fig. 2 is an exploded perspective view showing the arrangement of a semiconductor mounting substrate 10 and the solder flow prevention jig 30 relative to the semiconductor mounting substrate positioning jig 20.

[0011] 1 and 2, the method for manufacturing a semiconductor device according to the first embodiment is a method for bonding a semiconductor mounting substrate 10, which has a semiconductor element mounted on an insulating substrate, onto a base plate 1. First, a semiconductor mounting substrate positioning jig 20 and a solder flow prevention jig 30 used in the method for manufacturing a semiconductor device according to the first embodiment will be described.

[0012] As shown in FIGS. 1 and 2 , a semiconductor mounting substrate positioning jig 20 is attached to a base plate 1 and is used to position a semiconductor mounting substrate 10 on the base plate 1. The semiconductor mounting substrate positioning jig 20 is formed in a rectangular frame shape using a material that is not solder-wettable, such as a carbon material, and an opening 20a is formed within the frame of the semiconductor mounting substrate positioning jig 20. Holes 20b are formed in the four corners of the semiconductor mounting substrate positioning jig 20. The four holes 20b correspond to holes 1a formed in the four corners of the base plate 1, and the semiconductor mounting substrate positioning jig 20 is attached to the base plate 1 by metal rods (not shown) that are inserted into the four holes 20b of the semiconductor mounting substrate positioning jig 20 and the four holes 1a of the base plate 1, respectively. In addition, four protrusions 20c that protrude inward are formed on the inner circumferential surfaces of each long side of the semiconductor mounting substrate positioning jig 20.

[0013] The solder flow prevention jig 30 is attached within the frame of the semiconductor mounting substrate positioning jig 20 attached to the base plate 1, and is a jig for preventing molten solder from flowing during reflow from the periphery of the semiconductor mounting substrate 10 positioned within the frame of the solder flow prevention jig 30. The solder flow prevention jig 30 is formed in the shape of a rectangular frame, and an opening 30a is formed within the frame of the solder flow prevention jig 30. The solder flow prevention jig 30 is formed to a size that allows two solder flow prevention jigs 30 to be placed along each of the long and short sides of the semiconductor mounting substrate positioning jig 20 (a total of four).

[0014] The number of solder flow prevention jigs 30 arranged within the frame of the semiconductor mounting substrate positioning jig 20 is not limited to four, but can be changed according to the number of semiconductor mounting substrates 10 attached to the base plate 1. In this case, the size of the opening 20a of the semiconductor mounting substrate positioning jig 20 is determined according to the number of solder flow prevention jigs 30.

[0015] Two recesses 30b are provided on the outer peripheral surface of one of the two long sides of the solder flow prevention jig 30. The recesses 30b are formed to be recessed inward and can fit onto the protrusions 20c of the semiconductor mounting substrate positioning jig 20. In addition, the bottom of the recesses 30b is open, so the solder flow prevention jig 30 can be fitted into the semiconductor mounting substrate positioning jig 20 from above.

[0016] In addition, since it is sufficient that the convex portion 20c of the semiconductor mounting substrate positioning jig 20 and the concave portion 30b of the solder flow prevention jig 30 can be fitted together at least in one place, the number of convex portions 20c and concave portions 30b may be one or more.

[0017] A step 30c protruding outward is provided on the outer peripheral surface of the other long side of the solder flow prevention jig 30. The steps 30c of two solder flow prevention jigs 30 arranged along the short sides of the semiconductor mounting substrate positioning jig 20 are engageable with each other, and the widthwise positions of the two solder flow prevention jigs 30 are fixed by the engagement of the steps 30c of the two solder flow prevention jigs 30 within the frame of the semiconductor mounting substrate positioning jig 20. Furthermore, the depthwise positions of the two solder flow prevention jigs 30 are fixed by the abutment of the depthwise ends of the two solder flow prevention jigs 30 arranged along the long sides of the semiconductor mounting substrate positioning jig 20.

[0018] The solder flow prevention jig 30 has a width and depth of 100 mm or less, and a height of 20 mm or less. The solder flow prevention jig 30 has a clearance of 3 mm or less between it and the insulating substrate 4 (see FIG. 10) of the semiconductor mounting substrate 10. These structures make it possible to suppress solder splashing during reflow.

[0019] <Method of Manufacturing Semiconductor Device> Next, a method of manufacturing a semiconductor device will be described. Fig. 3 is a flowchart showing a method of manufacturing a semiconductor device according to the first embodiment. Figs. 4 to 14 are cross-sectional views showing the method of manufacturing a semiconductor device according to the first embodiment. Fig. 12 is a cross-sectional view taken along line A-A in Fig. 1.

[0020] 3 and 4, a ceramic base plate 1 is prepared (step S1). Holes 1a (see FIG. 2) are formed at the four corners of the base plate 1 for attaching a semiconductor mounting substrate positioning jig 20.

[0021] Next, as shown in Figures 3 and 5, wire bumps 2 are formed on the base plate 1 (step S2). As shown in Figures 3 and 6, a semiconductor mounting substrate positioning jig 20 is attached to the base plate 1 (step S3). As shown in Figure 2, the base plate 1 and the semiconductor mounting substrate positioning jig 20 are attached by inserting a metal rod (not shown) through the hole 1a in the base plate 1 and the hole 20b in the semiconductor mounting substrate positioning jig 20.

[0022] 3 and 7, the solder plate 3 is placed at the semiconductor mounting substrate placement position (step S4). Here, the semiconductor mounting substrate placement position is the position where the semiconductor mounting substrate 10 (see FIG. 10) is placed within the frame of the semiconductor mounting substrate positioning jig 20 attached to the base plate 1.

[0023] Next, as shown in Fig. 3, a semiconductor mounting substrate 10 is prepared (step S5). Here, a method for manufacturing the semiconductor mounting substrate 10 will be described. First, as shown in Fig. 8, an insulating substrate 4 is prepared with metal patterns 12 and 13 formed on the upper and lower surfaces of a ceramic plate 11, respectively. As shown in Fig. 9, a metal paste 14 is applied to the metal pattern 12. As shown in Fig. 10, a semiconductor element 15 is placed on the metal paste 14, and then the metal pattern 12 and the semiconductor element 15 are metal-bonded by reflow. Through these steps, a semiconductor mounting substrate 10 is completed in which the insulating substrate 4 and the semiconductor element 15 are integrated.

[0024] The semiconductor element 15 may be made of Si or a wide bandgap semiconductor such as silicon carbide, gallium nitride, gallium oxide, or diamond. Step S5 may be performed in parallel with steps S1 to S4.

[0025] Next, as shown in Figures 3 and 11, the semiconductor mounting substrate 10 is placed on the plate solder 3 (step S6). Next, as shown in Figures 3 and 12, the solder flow prevention jig 30 is attached so as to surround the sides of the semiconductor mounting substrate 10 within the frame of the semiconductor mounting substrate positioning jig 20 (step S7). At this time, the solder flow prevention jig 30 is fitted into the semiconductor mounting substrate positioning jig 20 from above. By fitting into the semiconductor mounting substrate positioning jig 20, the solder flow prevention jig 30 prevents misalignment between the semiconductor mounting substrate 10 and the solder flow prevention jig 30.

[0026] 3 and 13, the base plate 1 and the semiconductor mounting substrate 10 are joined by reflow (step S8). Thereafter, the solder flow prevention jig 30 and the semiconductor mounting substrate positioning jig 20 are removed from the base plate 1 as shown in FIG.

[0027] <Effects> As described above, the method for manufacturing a semiconductor device according to the first embodiment includes the steps of attaching the frame-shaped semiconductor mounting substrate positioning jig 20 on the base plate 1 when viewed from above, arranging the solder plate 3 at the semiconductor mounting substrate position where the semiconductor mounting substrate 10 will be placed within the frame of the semiconductor mounting substrate positioning jig 20 attached to the base plate 1, arranging the semiconductor mounting substrate 10 on the solder plate 3, attaching the frame-shaped solder flow prevention jig 30 so as to surround the sides of the semiconductor mounting substrate 10 within the frame of the semiconductor mounting substrate positioning jig 20 attached to the base plate 1, and joining the base plate 1 and the semiconductor mounting substrate 10 by reflow.

[0028] Therefore, since the sides of the semiconductor mounting substrate 10 are surrounded by the solder flow prevention jig 30, it is possible to prevent the outflow of molten solder during reflow. Furthermore, since there is no need to provide a separate pressing member, it is possible to prevent an increase in the manufacturing cost of the semiconductor device.

[0029] The solder flow prevention jig 30 has a width and depth of 100 mm or less, a height of 20 mm or less, and a clearance of 3 mm or less between the solder flow prevention jig 30 and the insulating substrate 4 of the semiconductor mounting substrate 10 .

[0030] Therefore, scattering of molten solder during reflow can be suppressed, and the yield of semiconductor devices can be improved.

[0031] Furthermore, a protrusion 20c that protrudes inward is formed on the inner peripheral surface of the semiconductor mounting substrate positioning jig 20. A recess 30b that is open downward and recessed inward and can fit into the protrusion 20c is formed on the outer peripheral surface of the solder flow prevention jig 30. In the process of attaching the solder flow prevention jig 30, the solder flow prevention jig 30 is fitted into the semiconductor mounting substrate positioning jig 20 from above.

[0032] Therefore, it is possible to prevent the semiconductor mounting substrate 10 and the solder flow prevention jig 30 from being misaligned.

[0033] <Embodiment 2> <Overall Configuration> Next, a method for manufacturing a semiconductor device according to embodiment 2 will be described. Figure 15 is a top view showing a state in which a semiconductor element positioning jig 50 is attached to an insulating substrate positioning jig 40 used in the method for manufacturing a semiconductor device according to embodiment 2. Note that in embodiment 2, the same components as those described in embodiment 1 are designated by the same reference numerals and their description will be omitted.

[0034] 15, the method for manufacturing a semiconductor device according to the second embodiment is a method for bonding a semiconductor element onto a base plate via an insulating substrate 4. First, an insulating substrate positioning jig 40 and a semiconductor element positioning jig 50 used in the method for manufacturing a semiconductor device according to the second embodiment will be described.

[0035] The insulating substrate positioning jig 40 is a jig corresponding to the semiconductor mounting substrate positioning jig 20 of the first embodiment, and has the same structure as the semiconductor mounting substrate positioning jig 20. The semiconductor element positioning jig 50 is a jig corresponding to the solder flow prevention jig 30 of the first embodiment, and has substantially the same structure as the solder flow prevention jig 30, although there are some differences.

[0036] The insulating substrate positioning jig 40 is attached to the base plate 1 and is used to position the insulating substrate 4 on the base plate 1. The insulating substrate positioning jig 40 is formed in a rectangular frame shape using a material that is not solder-wettable, such as a carbon material, and an opening 40a (see FIG. 19 ) is formed within the frame of the insulating substrate positioning jig 40. Holes 40b are formed in the four corners of the insulating substrate positioning jig 40. The four holes 40b correspond to the holes 1a formed in the four corners of the base plate 1 shown in FIG. 2 , and the insulating substrate positioning jig 40 is attached to the base plate 1 by metal rods (not shown) inserted through the four holes 40b of the insulating substrate positioning jig 40 and the four holes 1a of the base plate 1. In addition, four protrusions 40c (see FIG. 19 ) that protrude inward are formed on the inner circumferential surfaces of each long side of the insulating substrate positioning jig 40.

[0037] The semiconductor element positioning jig 50 is attached within the frame of the insulating substrate positioning jig 40 attached to the base plate 1, and is a jig for positioning a semiconductor element 6 (see FIG. 25 ) located within the frame of the semiconductor element positioning jig 50. The semiconductor element positioning jig 50 is formed in the shape of a rectangular frame, and an opening is formed within the frame of the semiconductor element positioning jig 50. The semiconductor element positioning jig 50 is formed to a size that allows two semiconductor element positioning jigs 50 to be placed along each of the long and short sides of the insulating substrate positioning jig 40 (a total of four semiconductor element positioning jigs 50).

[0038] The number of semiconductor element positioning jigs 50 arranged within the frame of the insulating substrate positioning jig 40 is not limited to four, but can be changed according to the number of insulating substrates 4 attached to the base plate 1. In this case, the size of the opening 40a of the insulating substrate positioning jig 40 is determined according to the number of semiconductor element positioning jigs 50.

[0039] Two recesses 50b (see FIG. 22) are provided on the outer peripheral surface of one of the two long sides of the semiconductor element positioning jig 50. The recesses 50b are formed to be recessed toward the inner peripheral side, and can fit into the protrusions 40c of the insulating substrate positioning jig 40. Furthermore, the bottom of the recesses 50b is open, so that the semiconductor element positioning jig 50 can be fitted into the insulating substrate positioning jig 40 from above.

[0040] A step (not shown) protruding outward is provided on the outer peripheral surface of the other long side of the semiconductor element positioning jig 50. The steps of the two semiconductor element positioning jigs 50 arranged along the short side of the insulating substrate positioning jig 40 can engage with each other, and the widthwise positions of the two semiconductor element positioning jigs 50 are fixed by the steps of the two semiconductor element positioning jigs 50 engaging with each other within the frame of the insulating substrate positioning jig 40. Furthermore, the depthwise positions of the two semiconductor element positioning jigs 50 are fixed by the depthwise ends of the two semiconductor element positioning jigs 50 arranged along the long side of the insulating substrate positioning jig 40 abutting against each other.

[0041] The width and depth of the semiconductor element positioning jig 50 are 100 mm or less, and the height is 20 mm or less. The semiconductor element positioning jig 50 has a clearance of 3 mm or less from the insulating substrate 4. These structures make it possible to suppress the scattering of solder during reflow.

[0042] Furthermore, the semiconductor element positioning jig 50 is provided with partitions 51 at the top to divide the interior of the frame of the semiconductor element positioning jig 50 into areas for the placement positions of the semiconductor elements 6 (see FIG. 25). The provision of the partitions 51 differs from the solder flow prevention jig 30.

[0043] <Method of Manufacturing Semiconductor Device> Next, a method of manufacturing a semiconductor device will be described. Fig. 16 is a flowchart showing a method of manufacturing a semiconductor device according to the second embodiment. Figs. 17 to 27 are cross-sectional views showing a method of manufacturing a semiconductor device according to the second embodiment. Fig. 22 is a cross-sectional view taken along line B-B in Fig. 15, and Fig. 23 is a cross-sectional view taken along line CC in Fig. 15.

[0044] 16 and 17, a base plate 1 made of, for example, ceramic is prepared (step S11). Holes 1a (see FIG. 2) for attaching an insulating substrate positioning jig 40 are formed at the four corners of the base plate 1.

[0045] Next, as shown in Figures 16 and 18, wire bumps 2 are formed on base plate 1 (step S12). As shown in Figures 16 and 19, insulating substrate positioning jig 40 is attached to base plate 1 (step S13). The two are attached by inserting a metal rod (not shown) through hole 1a in base plate 1 and hole 40b in insulating substrate positioning jig 40.

[0046] 16 and 20, the solder plate 3 is placed at the insulating substrate placement position (step S14). Here, the insulating substrate placement position is the position where the insulating substrate 4 (see FIG. 21) is placed within the frame of the insulating substrate positioning jig 40 attached to the base plate 1. The solder plate 3 corresponds to the first solder plate.

[0047] Next, as shown in Figures 16 and 21, the insulating substrate 4 is placed on the plate solder 3 (step S15). Next, as shown in Figures 16, 22, and 23, the semiconductor element positioning jig 50 is attached so as to surround the sides of the insulating substrate 4 within the frame of the insulating substrate positioning jig 40 (step S16). At this time, the semiconductor element positioning jig 50 is fitted into the insulating substrate positioning jig 40 from above. By fitting the semiconductor element positioning jig 50 into the insulating substrate positioning jig 40, misalignment between the insulating substrate 4 and the semiconductor element positioning jig 50 is prevented.

[0048] Next, as shown in Fig. 24, a solder plate 5 is placed on the insulating substrate 4. Here, the solder plate 5 corresponds to the second solder plate. As shown in Fig. 16 and Fig. 25, a semiconductor element 6 is placed on the insulating substrate 4 via the solder plate 5 (step S17).

[0049] The semiconductor element 6 may be made of Si, or may be a wide band gap semiconductor such as silicon carbide, gallium nitride, gallium oxide, or diamond.

[0050] Finally, as shown in Figures 16 and 26, the base plate 1 and the insulating substrate 4 are bonded by reflow, and the insulating substrate 4 and the semiconductor element 6 are bonded (step S18).After that, as shown in Figure 27, the semiconductor element positioning jig 50 and the insulating substrate positioning jig 40 are removed from the base plate 1.

[0051] <Effects> As described above, the method for manufacturing a semiconductor device according to the second embodiment includes the steps of attaching the frame-shaped insulating substrate positioning jig 40 on the base plate 1 when viewed from above, arranging the solder plate 3 at the insulating substrate positioning position where the insulating substrate 4 will be placed within the frame of the insulating substrate positioning jig 40 attached to the base plate 1, arranging the insulating substrate 4 on the solder plate 3, attaching the frame-shaped semiconductor element positioning jig 50 so as to surround the sides of the insulating substrate 4 within the frame of the insulating substrate positioning jig 40 attached to the base plate 1, arranging the semiconductor element 6 on the insulating substrate 4 via the solder plate 5, and joining the base plate 1 and the insulating substrate 4 by reflow, and also joining the insulating substrate 4 and the semiconductor element 6.

[0052] Therefore, since the sides of the insulating substrate 4 are surrounded by the semiconductor element positioning jig 50, the plate solders 5 and 3 arranged above and below the insulating substrate 4 are prevented from melting and flowing out during reflow. Also, since there is no need to provide a separate pressing member, increases in the manufacturing costs of the semiconductor device can be suppressed. Furthermore, since the semiconductor element 6, insulating substrate 4, and base plate 1 can be bonded together, the manufacturing costs of the semiconductor device can be further reduced.

[0053] The width and depth of the semiconductor element positioning jig 50 are 100 mm or less, and the height is 20 mm or less, and the semiconductor element positioning jig 50 has a clearance of 3 mm or less from the insulating substrate 4 .

[0054] Therefore, scattering of molten solder during reflow can be suppressed, and the yield of semiconductor devices can be improved.

[0055] In addition, a convex portion 40c that protrudes inward is formed on the inner surface of the insulating substrate positioning jig 40, and a concave portion 50b that is open at the bottom and recessed inward is formed on the outer surface of the semiconductor element positioning jig 50, and can fit into the convex portion 40c.In the process of attaching the semiconductor element positioning jig 50, the semiconductor element positioning jig 50 is fitted into the insulating substrate positioning jig 40 from above.

[0056] Therefore, it is possible to prevent the insulating substrate 4 and the semiconductor element positioning jig 50 from being misaligned.

[0057] Although this disclosure has been described in detail, the above description is illustrative in all respects and is not restrictive. It is understood that countless variations not illustrated can be envisioned.

[0058] It should be noted that the embodiments can be freely combined, and each embodiment can be modified or omitted as appropriate.

[0059] 1 base plate, 3 plate solder, 4 insulating substrate, 5 plate solder, 6 semiconductor element, 10 semiconductor mounting substrate, 15 semiconductor element, 20 semiconductor mounting substrate positioning jig, 20c convex portion, 30 solder flow prevention jig, 30b concave portion, 40 insulating substrate positioning jig, 40c convex portion, 50 semiconductor element positioning jig, 50b concave portion.

Claims

1. A method for manufacturing a semiconductor device in which a semiconductor mounting substrate having a semiconductor element mounted on an insulating substrate is bonded onto a base plate, the method comprising the steps of: attaching a semiconductor mounting substrate positioning jig that is frame-shaped when viewed from above onto the base plate; placing a solder plate at a semiconductor mounting substrate position where the semiconductor mounting substrate will be placed within the frame of the semiconductor mounting substrate positioning jig attached to the base plate; placing the semiconductor mounting substrate on the solder plate; attaching a frame-shaped solder flow prevention jig so as to surround the sides of the semiconductor mounting substrate within the frame of the semiconductor mounting substrate positioning jig attached to the base plate; and bonding the base plate and the semiconductor mounting substrate by reflow.

2. The method for manufacturing a semiconductor device according to claim 1, wherein the width and depth of the solder flow prevention jig are 100 mm or less, and the height is 20 mm or less, and the solder flow prevention jig has a clearance of 3 mm or less between the solder flow prevention jig and the insulating substrate of the semiconductor mounting board.

3. A method for manufacturing a semiconductor device as described in claim 1 or claim 2, wherein the inner surface of the semiconductor mounting substrate positioning jig is formed with a convex portion protruding inward, and the outer surface of the solder flow prevention jig is formed with a concave portion that is open downward and concaves inward, capable of engaging with the convex portion, and in the step of attaching the solder flow prevention jig, the solder flow prevention jig is engaged with the semiconductor mounting substrate positioning jig from above.

4. A method for manufacturing a semiconductor device in which a semiconductor element is bonded onto a base plate via an insulating substrate, comprising the steps of: attaching a frame-shaped insulating substrate positioning jig on the base plate when viewed from above; placing a first plate solder at an insulating substrate position where the insulating substrate will be placed within the frame of the insulating substrate positioning jig attached to the base plate; placing the insulating substrate on the first plate solder; attaching a frame-shaped semiconductor substrate positioning jig so as to surround the sides of the insulating substrate within the frame of the insulating substrate positioning jig attached to the base plate; placing the semiconductor substrate on the insulating substrate via a second plate solder; and bonding the base plate and the insulating substrate by reflow, and bonding the insulating substrate and the semiconductor substrate.

5. The method for manufacturing a semiconductor device according to claim 4, wherein the width and depth of the semiconductor element positioning jig are 100 mm or less, and the height is 20 mm or less, and the semiconductor element positioning jig has a clearance of 3 mm or less between the semiconductor element positioning jig and the insulating substrate.

6. A method for manufacturing a semiconductor device as described in claim 4 or claim 5, wherein a convex portion protruding inward is formed on the inner surface of the insulating substrate positioning jig, and a concave portion capable of engaging with the convex portion is formed on the outer surface of the semiconductor element positioning jig, the concave portion being open downward and recessed inward, and in the step of attaching the semiconductor element positioning jig, the semiconductor element positioning jig is engaged with the insulating substrate positioning jig from above.

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