Centering device, centering method, and substrate processing device

Abstract

In a centering technique and a substrate processing device using the centering technique wherein positioning of a substrate in a direction parallel to a first horizontal direction in a horizontal plane is performed by sandwiching by means of a first abutment member, a second abutment member, and a third abutment member, and positioning of the substrate in a direction orthogonal to the first horizontal direction is performed by means of the second abutment member and the third abutment member, in order to improve positioning accuracy of the substrate in the direction orthogonal to the first horizontal direction, the present invention is configured as follows. At least one of a second reference position and a third reference position is adjustable in the horizontal plane in this invention. Accordingly, by the adjustment, the second abutment member and the third abutment member are positioned in appropriate positions in the horizontal plane, and a centering process is executed in the appropriate state.

Description

Centering device, centering method, and substrate processing apparatus

[0001] The present invention relates to a centering technique for aligning the center of a disk-shaped substrate placed on the upper surface of a substrate support with the center of the substrate support, and to a substrate processing apparatus that processes the substrate using the centering technique, including bevel etching.

[0002] The disclosures in the specifications, drawings and claims of the following Japanese applications are incorporated herein by reference in their entirety: Japanese Patent Application No. 2023-149849 (filed September 15, 2023).

[0003] Substrate processing apparatuses are known that rotate substrates such as semiconductor wafers and supply processing liquids to the peripheral edges of the substrates to perform chemical processing, cleaning, and other processes. For example, in the apparatus described in Patent Document 1, the substrate is supported from below by a spin chuck (equivalent to an example of a "substrate support" in the present invention) and held by suction. If the center of the spin chuck and the center of the substrate are misaligned, processing quality will be reduced. Therefore, the apparatus is equipped with a centering device.

[0004] The centering device performs a so-called centering process, which reduces the eccentricity of the substrate relative to the spin chuck. More specifically, this centering device uses three abutment members to surround a substrate placed on the upper surface of a substrate support. Among these, the first abutment member is provided so as to be movable in a first horizontal direction from a first reference position toward the center of the substrate support in a horizontal plane, the first reference position being a reference distance from the center of the substrate support that is longer than the radius of the substrate. Meanwhile, the remaining second and third abutment members are provided on the opposite side of the first abutment member with respect to the center of the substrate support in the horizontal plane, as follows: The second abutment member is provided so as to be movable in a second horizontal direction, different from the direction from the second reference position toward the center of the substrate support and approaching the substrate, the second abutment member being deviated from an imaginary line extending from the center of the substrate support in the first horizontal direction and being a reference distance from the center of the substrate support. The third abutment member is provided on the opposite side of the second abutment member with respect to the imaginary line, a reference distance from the center of the substrate support portion, and movable in a third horizontal direction different from the direction from the third reference position toward the center of the substrate support portion and approaching the substrate. Repeated slight movements of these three abutment members gradually move closer to the substrate while maintaining the same distance from the center of the substrate support portion. During this approaching movement, the abutment members sequentially abut against the substrate, moving the substrate horizontally toward the center of the substrate support portion. As a result, when the substrate is sandwiched between these three abutment members, the center of the substrate coincides with the center of the substrate support portion, completing the centering process.

[0005] JP 2023-114594 A

[0006] In the centering device described above, the positioning of the substrate in the X direction, which is parallel to the first horizontal direction, is achieved by clamping the substrate between the first abutment member and the second and third abutment members. Meanwhile, the positioning of the substrate in the Y direction (corresponding to the "fourth horizontal direction" in the present invention), which is perpendicular to the X direction, is achieved by the second and third abutment members. For example, if the center of the substrate is offset from the center of the substrate support member in the Y2 direction in Patent Document 1, the second abutment member abuts the edge surface of the substrate during repeated micro-movements. Further micro-movements while maintaining this abutment state displace the substrate so that the center of the substrate shifts in the Y1 direction, and eventually the third abutment member abuts the edge surface of the substrate. Centering in the Y direction is achieved through this operation. In other words, the center of the substrate in the Y direction is determined by the relative positions of the second and third abutment members in the horizontal plane.

[0007] Therefore, when a substrate processing apparatus equipped with a centering device is newly installed or relocated, the frame supporting the centering device may be deformed. Furthermore, the second and third contact members may be worn out due to friction between the second and third contact members and the edge surfaces of the substrate. These factors may cause the positional relationship between the second and third contact members in the horizontal plane to fluctuate, which reduces the centering accuracy in the Y direction.

[0008] The present invention has been made in consideration of the above-mentioned problems, and aims to improve the positioning accuracy of a substrate in a direction perpendicular to the first horizontal direction in a substrate processing apparatus that utilizes centering technology and centering technology in which the positioning of a substrate in a first horizontal direction in a horizontal plane is performed by clamping the substrate between a first abutment member and a second abutment member and a third abutment member, and the positioning of the substrate in a direction perpendicular to the first horizontal direction is performed by the second abutment member and a third abutment member.

[0009] A first aspect of the present invention is a centering device that positions a substrate on a substrate support part so that the center of the disk-shaped substrate placed in a horizontal position on the upper surface of the substrate support part coincides with the center of the substrate support part, the centering device comprising: a first abutment member that is movable in a first horizontal direction from a first reference position that is a reference distance away from the center of the substrate support part in a horizontal plane, the reference distance being longer than the radius of the substrate, toward the center of the substrate support part; a second abutment member that is movable in a second horizontal direction different from the direction toward the center of the substrate support part and approaching the substrate, from a second reference position that is on the opposite side of the first abutment member with respect to the center of the substrate support part in the horizontal plane, deviating from an imaginary line extending from the center of the substrate support part in the first horizontal direction and being away from the center of the substrate support part by the reference distance; and a second abutment member that is movable in a second horizontal direction different from the direction toward the center of the substrate support part and approaching the substrate, the second abutment member being on the opposite side of the first abutment member with respect to the center of the substrate support part in the horizontal plane, the second abutment member being on the opposite side of the first abutment member with respect to the imaginary line. a third abutment member that is movable from a third reference position that is a reference distance away from the center of the holding portion in a third horizontal direction that is different from the direction toward the center of the substrate support portion and that approaches the substrate; a movement mechanism that moves the first abutment member, the second abutment member, and the third abutment member in the first horizontal direction, the second horizontal direction, and the third horizontal direction, respectively; and a movement control unit that repeats minute movements by the movement mechanism to move the first abutment member, the second abutment member, and the third abutment member by a first movement amount, a second movement amount, and a third movement amount, respectively, so that the distances of the first abutment member, the second abutment member, and the third abutment member from the center of the substrate support portion are kept constant until all of the first abutment member, the second abutment member, and the third abutment member have completely abutted against the substrate, and at least one of the second reference position and the third reference position is adjustable within the horizontal plane.

[0010] A second aspect of the present invention is a centering method for positioning a substrate on a substrate support part so that the center of the disk-shaped substrate placed in a horizontal position on the upper surface of the substrate support part coincides with the center of the substrate support part, the method comprising: (a) positioning a first abutting member at a first reference position in a horizontal plane that is a reference distance away from the center of the substrate support part by a reference distance longer than the radius of the substrate; and (b) positioning a first abutting member at a position opposite the center of the substrate support part that is deviated from an imaginary line extending from the first reference position through the center of the substrate support part and that is also away from the reference distance from the center of the substrate support part; and (b) placing a substrate on the upper surface of the substrate support part in a state where the second abutting member is positioned at a second reference position that is a reference distance from the center of the substrate support part and the third abutting member is positioned at a third reference position that is on the opposite side of the first abutting member with respect to the center of the substrate support part and on the opposite side of the second abutting member with respect to the imaginary line and that is a reference distance from the center of the substrate support part; and (c) repeating the micro-movements by moving the first abutment member in a first horizontal direction toward the substrate support member, moving the second abutment member by a second movement amount in a second horizontal direction different from the direction from the second reference position toward the center of the substrate support member and approaching the substrate, and moving the third abutment member by a third movement amount in a third horizontal direction different from the direction from the third reference position toward the center of the substrate support member and approaching the substrate; and (d) stopping the micro-movements when it is confirmed that the substrate has been sandwiched between the first abutment member, the second abutment member, and the third abutment member during the repetition of the micro-movements. and d) after performing steps (a) to (c), determining the amount of eccentricity by which the center of the substrate is eccentric from the center of the substrate support part in a fourth horizontal direction perpendicular to the first horizontal direction, based on peripheral information obtained by measuring the peripheral portion of the substrate placed on the upper surface of the substrate support part, wherein when the amount of eccentricity exceeds a preset tolerance, at least one of the second reference position and the third reference position is moved in the horizontal plane by a distance corresponding to the amount of eccentricity, and then steps (a) to (c) are performed again.

[0011] Furthermore, a third aspect of the present invention is a substrate processing apparatus comprising: a substrate support section having an upper surface that supports a horizontally oriented substrate; the centering device; a suction section that evacuates the space between the substrate positioned by the centering device and the substrate support section to adsorb and hold the substrate on the substrate support section; a rotation drive section that rotates the substrate support section that adsorbs and holds the substrate around the center of the substrate support section; and a processing liquid supply mechanism that supplies processing liquid to the peripheral edge of the substrate that is rotated around the center of the substrate support section integrally with the substrate support section.

[0012] In the invention configured as described above, similar to the centering device described in Patent Document 1, the positioning of the substrate in a direction perpendicular to the first horizontal direction in the horizontal plane is performed by the second and third abutment members. Therefore, if the positional relationship between the second and third abutment members deviates from the appropriate state for the substrate centering process when the micro-movement is initiated, it becomes difficult to align the center of the substrate with the center of the substrate support member. In consideration of this, in the present invention, at least one of the second and third reference positions is adjustable in the horizontal plane. Therefore, by this adjustment, the second and third abutment members are positioned in the appropriate positions in the horizontal plane, and the centering process is performed in that appropriate state.

[0013] As described above, according to the present invention, even if the positional relationship between the second and third contact members in the horizontal plane deviates from the appropriate state, the positional relationship can be adjusted, thereby improving the positioning accuracy of the substrate in the direction perpendicular to the first horizontal direction.

[0014] Not all of the multiple components of each of the above-described aspects of the present invention are essential, and in order to solve some or all of the above-described problems or achieve some or all of the effects described in this specification, it is possible to modify, delete, or replace some of the multiple components with new components, or to delete some of the limitations, as appropriate. Furthermore, in order to solve some or all of the above-described problems or achieve some or all of the effects described in this specification, it is possible to combine some or all of the technical features included in one aspect of the present invention described above with some or all of the technical features included in another aspect of the present invention described above to form an independent aspect of the present invention.

[0015] 1 is a plan view showing a schematic configuration of a substrate processing system equipped with a first embodiment of a substrate processing apparatus according to the present invention. FIG. 2 is a schematic view showing the configuration of the first embodiment of the substrate processing apparatus. FIG. 3 is a perspective view showing the configuration of a substrate holding unit and a centering mechanism of the substrate processing apparatus. FIG. 4 is a schematic view showing the configuration of a contact member that can be employed in the centering mechanism and its relationship with a notch in a substrate. FIG. 5 is a schematic view showing the operation of the centering mechanism. FIG. 6 is a schematic view showing the positional relationship between the contact member and the center of the spin base before and after minute movement. FIG. 7 is a graph showing fluctuations in load torque with respect to changes in distance from the center of the base to the contact surface in the first embodiment. FIG. 8 is a flowchart showing an initial adjustment process of the substrate processing apparatus shown in FIG. 2. FIG. 9 is a diagram showing the operation of each part of the apparatus in the initial adjustment process. FIG. 10 is a diagram showing the operation of each part of the apparatus in the initial adjustment process. FIG. 11 is a diagram showing substrate processing in the substrate processing apparatus shown in FIG. 2. FIG. 12 is a diagram showing the operation of each part of the apparatus in the substrate processing. FIG. 13 is a diagram showing the operation of each part of the apparatus in the substrate processing. FIG. 1 is a diagram schematically showing the operation of each part of the apparatus during substrate processing. FIG. 2 is a perspective view showing the configuration of a substrate holding part and a centering mechanism in a second embodiment of the substrate processing apparatus according to the present invention. FIG. 3 is a diagram schematically showing the operation of each part of the apparatus during substrate processing in the second embodiment. FIG. 4 is a diagram schematically showing the operation of each part of the apparatus during substrate processing in the second embodiment. FIG. 5 is a graph showing the relationship between the movement amount of a contact member and the movement amount of a substrate center in the second embodiment. FIG. 6 is a perspective view showing the configuration of a substrate holding part and a centering mechanism in a third embodiment of the substrate processing apparatus according to the present invention. FIG. 7 is a diagram schematically showing the operation of each part of the apparatus during substrate processing in the third embodiment. FIG. 8 is a graph showing the relationship between the movement amount of a contact member and the movement amount of a substrate center in the third embodiment. FIG. 9 is a diagram schematically showing the configuration and operation of each part of the apparatus during substrate processing in a fourth embodiment of the substrate processing apparatus according to the present invention. FIG. 10 is a diagram schematically showing the configuration and operation of each part of the apparatus during substrate processing in a fifth embodiment of the substrate processing apparatus according to the present invention.

[0016] FIG. 1 is a plan view showing the schematic configuration of a substrate processing system equipped with a first embodiment of a substrate processing apparatus according to the present invention. This is not a diagram showing the external appearance of the substrate processing system 100, but rather a schematic diagram showing the internal structure of the substrate processing system 100 by excluding the exterior wall panels and other components. The substrate processing system 100 is a single-wafer processing apparatus installed, for example, in a clean room, for processing substrates S, each of which has a circuit pattern or the like (hereinafter referred to as a "pattern") formed on only one main surface. The substrates are processed using a processing solution in a processing unit installed in the substrate processing system 100. In this specification, the pattern-formed surface (one main surface) of the two main surfaces of a substrate on which a pattern is formed is referred to as the "front surface," and the opposite main surface on which a pattern is not formed is referred to as the "rear surface." The surface facing downward is referred to as the "bottom surface," and the surface facing upward is referred to as the "top surface." In this specification, the "pattern-formed surface" refers to the surface of a substrate on which a concave-convex pattern is formed in any region.

[0017] Here, the "substrate" in this embodiment can be any of various substrates such as semiconductor wafers, glass substrates for photomasks, glass substrates for liquid crystal displays, glass substrates for plasma displays, substrates for FEDs (Field Emission Displays), substrates for optical disks, substrates for magnetic disks, substrates for magneto-optical disks, etc. The following description will be given with reference to the drawings, taking as an example a substrate processing apparatus used primarily for processing semiconductor wafers, but the invention can also be applied to processing the various substrates exemplified above.

[0018] As shown in FIG. 1 , the substrate processing system 100 includes a substrate processing area 110 where disk-shaped substrates S are processed. An indexer unit 120 is provided adjacent to the substrate processing area 110. The indexer unit 120 includes a container holder 121 capable of holding a plurality of containers C for accommodating the substrates S (e.g., a FOUP (Front Opening Unified Pod), an SMIF (Standard Mechanical Interface) pod, or an OC (Open Cassette) that accommodates a plurality of substrates S in a sealed state). The indexer unit 120 also includes an indexer robot 122 that accesses the containers C held in the container holder 121 to remove unprocessed substrates S from the containers C or store processed substrates S in the containers C. Each container C accommodates a plurality of substrates S in a substantially horizontal position.

[0019] The indexer robot 122 comprises a base 122a fixed to the apparatus housing, an articulated arm 122b rotatable about a vertical axis relative to the base 122a, and a hand 122c attached to the tip of the articulated arm 122b. The hand 122c is structured so that a substrate S can be placed on its upper surface and held thereon. Indexer robots having such articulated arms and hands for holding substrates are well known, and therefore a detailed description thereof will be omitted.

[0020] In the substrate processing area 110, a mounting table 112 is provided so that a substrate S from an indexer robot 122 can be placed thereon. In addition, a substrate transport robot 111 is arranged approximately in the center of the substrate processing area 110 in a plan view. Furthermore, a plurality of processing units 1 are arranged surrounding the substrate transport robot 111. The substrate transport robot 111 randomly accesses these processing units 1 to transfer the substrate S. Meanwhile, each processing unit 1 performs a predetermined process on the substrate S. In this embodiment, one of these processing units 1 corresponds to the substrate processing apparatus 10 according to the present invention.

[0021] FIG. 2 is a schematic diagram illustrating the configuration of a first embodiment of a substrate processing apparatus. FIG. 3 is a perspective view illustrating the configuration of a substrate holding unit and a centering mechanism of the substrate processing apparatus. FIG. 4 is a schematic diagram illustrating the configuration of a contact member that can be used in the centering mechanism and its relationship to a notch in a substrate. FIG. 5 is a schematic diagram illustrating the operation of the centering mechanism. FIG. 6 is a schematic diagram illustrating the positional relationship between the contact member and the center of the spin base before and after a micro-movement. The substrate processing apparatus 10 performs bevel etching as an example of the "process" of the present invention, and supplies a processing liquid to the peripheral portion of the upper surface of a substrate S in a processing chamber. For this purpose, the substrate processing apparatus 10 includes a substrate holding unit 2, a centering mechanism 3, which is the main component of the centering apparatus of the present invention, and a processing liquid supply mechanism 4. The operation of these components is controlled by a control unit 9, which controls the entire apparatus.

[0022] The substrate holder 2 includes a spin base 21, which is a disk-shaped member smaller than the substrate S. The spin base 21 is supported by a rotation support shaft 22 extending downward from the center of its bottom surface so that its top surface 211 is horizontal. The rotation support shaft 22 is rotatably supported by a rotation drive unit 23. The rotation drive unit 23 incorporates a rotation motor 231, which rotates in response to a control command from the control unit 9. This rotation drive force causes the spin base 21 to rotate around a vertical axis AX (dashed line) that passes through the center 21C of the spin base 21 and extends vertically. In FIG. 2 , the up-down direction is the vertical direction. The plane perpendicular to the paper surface of FIG. 2 is the horizontal plane. To clarify the directional relationships in FIG. 2 and subsequent figures, a coordinate system is appropriately provided in which the Z axis is the vertical direction and the XY plane is the horizontal plane.

[0023] The upper surface 211 of the spin base 21 is large enough to support the substrate S, allowing the substrate S to be placed on the upper surface 211 of the spin base 21. Although not shown, the upper surface 211 is provided with a plurality of suction holes and grooves. These suction holes and grooves are connected to a suction pump 24 via a suction pipe 241. The suction pump 24 functions as an example of a "suction unit" of the present invention. When the suction pump 24 operates in response to a control command from the control unit 9, the suction pump 24 applies suction force to the spin base 21. As a result, air is exhausted from between the upper surface 211 of the spin base 21 and the lower surface of the substrate S, and the substrate S is suction-held on the spin base 21. The substrate S thus suction-held rotates around the vertical axis AX together with the rotation of the spin base 21. Therefore, if the center SC of the substrate S does not coincide with the center 21C of the spin base 21, i.e., if the substrate S is eccentric, the quality of the bevel etching process will be reduced.

[0024] Therefore, in this embodiment, a centering mechanism 3 is provided, which functions as a "centering device" according to the present invention in cooperation with the control unit 9. The centering mechanism 3 has a measurement unit 37 that measures the peripheral edge of the substrate S held by suction on the spin base 21. As shown in FIG. 3 , this measurement unit 37 is positioned at the peripheral edge of the substrate S held by suction on the spin base 21 and is capable of acquiring peripheral information regarding the peripheral edge of the substrate S. Furthermore, in the radial direction D4 of the spin base 21, the measurement unit 37 is movable to a retracted position spaced apart from the peripheral edge of the substrate S. For example, an edge detection sensor described in Japanese Patent Application Laid-Open No. 2021-54562 can be used as the measurement unit 37. More specifically, the measurement unit 37 detects the edge position of the substrate S in the radial direction of the spin base 21 while the substrate S rotates at least once around the vertical axis AX together with the rotation of the spin base 21, and outputs an edge detection signal indicating the edge position as peripheral information to the control unit 9. Therefore, by analyzing the edge detection signal, it is possible to determine the amount of eccentricity (symbols ex and ey in FIG. 11C , which will be described later) of the center SC of the substrate S from the center 21C of the spin base 21 in the X and Y directions. In addition to the edge detection sensor, an imaging unit that images the peripheral edge of the substrate S may be used as the measurement unit 37. In this case, the continuous images captured by the imaging unit while the substrate S rotates around the vertical axis AX together with the rotation of the spin base 21 correspond to the peripheral edge information. Since the method of deriving the amount of eccentricity in the X and Y directions based on the edge detection signal and the continuous images of the peripheral edge is well known, a detailed description thereof will be omitted here.

[0025] The spin base 21 rotates while suction-holding the substrate S. When suction by the suction pump 24 is stopped, the substrate S becomes movable horizontally on the upper surface 211 of the spin base 21. In this state, a centering process is performed. This centering process eliminates the eccentricity, and the center SC of the substrate S coincides with the center 21C of the spin base 21. The detailed configuration and operation of the centering mechanism 3, including the attitude adjustment, will be described later. Furthermore, if the amount of eccentricity exceeds the allowable value even after the centering process has been performed, the reference position is adjusted based on the amount of eccentricity, which will also be described later in detail.

[0026] A processing liquid supply mechanism 4 is provided to perform a bevel etching process on the substrate S that has been subjected to the centering process. The processing liquid supply mechanism 4 has a processing liquid nozzle 41, a nozzle moving unit 42 that moves the processing liquid nozzle 41, and a processing liquid supply unit 43 that supplies a processing liquid to the processing liquid nozzle 41. The nozzle moving unit 42 moves the processing liquid nozzle 41 between a retracted position where the processing liquid nozzle 41 is retracted to the side from above the substrate S as shown by the solid line in Figure 2, and a processing position above the peripheral edge of the substrate S as shown by the dotted line in the same figure.

[0027] The processing liquid nozzle 41 is connected to a processing liquid supply unit 43. When an appropriate processing liquid is supplied from the processing liquid supply unit 43 to the processing liquid nozzle 41 positioned at the processing position, the processing liquid is ejected from the processing liquid nozzle 41 onto the peripheral edge of the rotating substrate S. As a result, a bevel etching process using the processing liquid is performed on the entire peripheral edge of the substrate S.

[0028] 2, a splash guard is provided to surround the sides of the substrate holder 2. The splash guard collects droplets of the processing liquid that are shaken off from the substrate S during the bevel etching process, and effectively prevents the droplets from scattering around the apparatus.

[0029] Next, the configuration of the centering mechanism 3 will be described with reference to Figures 2 to 6. The centering mechanism 3 has the function of horizontally moving and positioning the substrate S on the upper surface 211 of the spin base 21 so that the center SC of the substrate S placed on the upper surface 211 of the spin base 21 coincides with the center 21C of the spin base 21. As shown in Figure 3, the centering mechanism 3 has a contact member 31 arranged on the X2 direction (right-hand direction in the figure) side of the center 21C of the spin base 21 in the X direction, and contact members 32 and 33 arranged on the X1 direction (left-hand direction in the figure). The centering mechanism 3 also has a movement mechanism 34 for moving the contact members 31 to 33 in the horizontal direction.

[0030] The movement mechanism 34 has a single movement unit 35 for moving the contact member 31 and a multi-movement unit 36 ​​for collectively moving the contact members 32 and 33. With respect to the center 21C of the spin base 21, the single movement unit 35 is disposed on the X2 direction side, while the multi-movement unit 36 ​​is disposed on the X1 direction side.

[0031] The single movement unit 35 includes a fixed base 351, a rotary motor 352, a power transmission unit 353, and a slider 354. The rotary motor 352 is attached to the fixed base 351, and the power transmission unit 353 and slider 354 are stacked on the fixed base 351 in this order. The rotary motor 352 is a drive source for moving the abutting member 31 in the X direction. When the rotary motor 352 is activated in response to a control command from the control unit 9, a rotary shaft (not shown) rotates. This rotary shaft extends from the upper part of the fixed base 351 to the power transmission unit 353, and the rotational driving force generated by the rotary motor 352 is transmitted to the power transmission unit 353. The power transmission unit 353 converts the rotational motion corresponding to the rotational driving force into linear motion in the X direction using, for example, a rack-and-pinion structure and transmits it to the slider 354. As a result, the slider 354 reciprocates in the X direction by a distance corresponding to the amount of rotation. As a result, the contact member 31 attached to the upper part of the slider 354 is moved in the X direction in conjunction with the movement of the slider 354 .

[0032] The multi-movement unit 36 ​​is basically configured similarly to the single-movement unit 35, except for a partial difference in the structure of the slider 364. Specifically, the multi-movement unit 36 ​​applies a rotational driving force generated by a rotary motor 362 attached to a base member 361 to the slider 364 via a power transmission unit 363, moving the slider 364 in the X direction. The upper portion of the slider 364 has two arms 364a and 364b extending in the X2 direction, spaced apart from each other in the Y direction, forming a roughly C-shape in a vertically upward planar view. Abutment members 32 and 33 are attached to the ends of the arms 364a and 364b on the X2 direction side, respectively. Therefore, when the rotary motor 362 is actuated in response to a control command from the control unit 9, the slider 364 reciprocates in the X direction by a distance corresponding to the rotation amount of the rotary motor 362, similar to the single-movement unit 35. As a result, the abutment members 32 and 33 attached to the slider 364 move in the X direction in conjunction with the movement of the slider 364.

[0033] The contact members 31 to 33 have contact surfaces 311 to 331 that can come into contact with the edge surface Se of the substrate S, respectively. The contact members 31 to 33 are arranged to surround the substrate holding part 2 in the XY plane (horizontal plane) with the contact surfaces 311 to 331 facing the edge surface Se of the substrate S. The contact surfaces 311 to 331 have a curved shape that conforms to the edge surface Se of the substrate S. As shown in FIG. 4A, in the contact surface 321, a curved region 323 that intersects with an imaginary horizontal plane that includes the substrate S placed on the upper surface of the substrate holding part 2 functions as the contactable region. In other words, the contact surface 321 is finished so that the center of curvature of the curved region 323 is located on the substrate S side and the radius of curvature of the curved region 323 is larger than the radius of the substrate S. Therefore, during centering, when the abutting member 32 is moved toward the edge surface Se of the substrate S, it abuts against the edge surface Se of the substrate S at one or two points in the curved region 323. That is, as shown in the figure, when the notch NT is placed on the upper surface of the spin base 21 in an orientation facing the abutting surface 321, the two abutting points CP1 and CP2 on the curved region 323 are engaged with the shoulder portion of the notch NT, effectively preventing a portion of the abutting member 32 from entering the notch NT. Furthermore, although the abutting surface 321 moves to a position P3 that is located toward the substrate S by a deviation amount Lc from the position P0 where the abutting surface 321 abuts against the edge surface Se of the substrate S and is positioned, the deviation amount Lc is smaller than when the abutting surface 321 is finished flat. This also applies to the abutting surface 311 of the abutting member 31 and the abutting surface 331 of the abutting member 33.

[0034] When the contact member 31 is moved in the X1 direction by the single moving unit 35, the contact surface 311 of the contact member 31 moves toward the center 21C of the spin base 21 and contacts the edge surface Se of the substrate S. In this embodiment, the movement direction D1 of the contact member 31 for contacting the substrate S is the X1 direction, which corresponds to the "first horizontal direction" of the present invention. After contact, the contact member 31 further moves in the D1 direction, thereby pressing the substrate S in the X1 direction and horizontally moving it in the X1 direction on the upper surface 211 of the spin base 21. To facilitate understanding of the present invention, a virtual line VL extending from the center 21C of the spin base 21 in the X1 direction is additionally shown in FIGS. 3, 5, and 6. This corresponds to the "virtual line" of the present invention. Below, we will continue to explain the configuration of the centering mechanism 3, making appropriate use of the virtual line VL.

[0035] The movement of the abutment members 32 and 33 by the multi-movement unit 36 ​​is partially different from that of the abutment member 31. This is because the abutment members 32 and 33 are arranged symmetrically with respect to the imaginary line VL in the horizontal plane and are moved in the X direction while maintaining this arrangement. More specifically, as shown in FIG. 5A, the abutment member 32 is arranged offset from the imaginary line VL by a predetermined distance W (which is shorter than the radius rs of the substrate S) toward the Y2 direction. On the other hand, the abutment member 33 is arranged on the opposite side of the imaginary line VL from the abutment member 32, i.e., toward the Y1 direction, offset by the same distance W as the abutment member 32. Therefore, when the abutment members 32 and 33 are moved in the X2 direction by the multi-movement unit 36, the abutment surface 321 of the abutment member 32 abuts on the substrate end surface on the Y2 direction side of the imaginary line VL, and the abutment surface 331 of the abutment member 33 abuts on the substrate end surface on the Y1 direction side of the imaginary line VL. As described above, in this embodiment, the movement direction D2 of the contact member 32 for contacting the substrate S is the X2 direction, which corresponds to the "second horizontal direction" of the present invention. Furthermore, the movement direction D3 of the contact member 33 for contacting the substrate S is also the X2 direction, which corresponds to the "third horizontal direction" of the present invention. Therefore, in order to move the contact surfaces 311, 321, and 331 while maintaining the same distance from the center 21C of the spin base 21 to each of the contact surfaces 311, 321, and 331, it is necessary to make the movement amount per unit time different between the contact member 31 and the contact members 32 and 33. This point will be described in detail with reference to FIGS. 5 and 6 , and a centering process using the above-described movement mode will also be described.

[0036] In order to place the substrate S on the upper surface 211 of the spin base 21, it is desirable to position the contact surfaces 311, 321, and 331 at the reference position, taking into account at least the maximum value of the outer diameter tolerance of the substrate S. For example, for a substrate S with a diameter of 300 mm, the outer diameter tolerance is 0.2 mm. Therefore, the contact surfaces 311, 321, and 331 must be spaced 150.1 mm or more from the center 21C of the spin base 21. In this embodiment, this distance is referred to as the "reference distance r0," and as shown in FIG. 5A, the reference circle is a circle (dashed line) whose center is the center 21C of the spin base 21 and whose radius is the reference distance r0.

[0037] Next, consider the case where the contact members 31 to 33 are positioned so that the contact surfaces 311, 321, and 331 are located on the reference circle, and then the contact surfaces 311, 321, and 331 are moved toward the substrate S. In this case, the position of the contact member 31 for locating the contact surface 311 on the reference circle corresponds to the "first reference position" of the present invention, the position of the contact member 32 for locating the contact surface 321 on the reference circle corresponds to the "second reference position" of the present invention, and the position of the contact member 33 for locating the contact surface 331 on the reference circle corresponds to the "third reference position" of the present invention.

[0038] Here, consider the case where contact member 31 is slightly moved in direction D1 (X1 direction) by a first movement amount Δd1 toward substrate S from states in which contact members 31 to 33 are located at the first reference position, second reference position, and third reference position, respectively. If contact members 32 and 33 are correspondingly slightly moved by the same distance in direction D2 (X2 direction), the distances from center 21C of spin base 21 to contact surfaces 311, 321, and 331 will become non-uniform. Therefore, if the contact members 31 to 33 are repeatedly moved by small amounts while keeping the movement amount per unit time constant, the center SC of substrate S will not coincide with center 21C of spin base 21.

[0039] In contrast to this, as shown in column (b) of Figure 5 and Figure 6, by slightly moving the abutment member 31 in the direction D1 by the first movement amount Δd1, the abutment member 32 is slightly moved in the direction D2 by the second movement amount Δd2, and the abutment member 33 is slightly moved in the direction D3 by the third movement amount Δd3 (= Δd2), the abutment surfaces 311, 321, and 331 can be moved while maintaining the same distance from the center 21C of the spin base 21 to each abutment surface 311, 321, and 331.

[0040] FIG. 6 is a diagram schematically illustrating the positional relationship between the contact member 32 and the center 21C of the spin base 21 before and after the micro-movement. FIG. 6 illustrates the positional relationship between the contact member 32 and a circle with a radius r1 centered at the center 21C of the spin base 21, and the positional relationship between the contact member 32 and a circle with a radius r2 centered at the center 21C of the spin base 21. In FIG. 6, the contact member 32 before the contact member 32 is micro-moved in the D2 direction by the second movement amount Δd2 is shown by a solid line, and the contact member 32 after the micro-movement is shown by a two-dot chain line. FIG. 6 illustrates a point of contact 324 between the circle with a radius r1 centered at the center 21C of the spin base 21 and the contact member 32, and a point of contact 325 between the circle with a radius r2 centered at the center 21C of the spin base 21 and the contact member 32.

[0041] 6, contact point 324 and contact point 325 are located at different positions on contact member 32. However, the line connecting center 21C of spin base 21 and contact point 324 overlaps with the line connecting center 21C of spin base 21 and contact point 325. Furthermore, the angle formed by the line connecting center 21C of spin base 21 and contact point 324 and imaginary line VL is the same as the angle formed by the line connecting center 21C of spin base 21 and contact point 325 and imaginary line VL.

[0042] Therefore, the distance Δd2 by which the abutting member 32 is slightly moved (corresponding to the "second movement amount" of the present invention) and the distance Δd3 by which the abutting member 33 is slightly moved (corresponding to the "third movement amount" of the present invention) can be set as follows: Δd2 = Δd3 = (r1 - r2) / cos θ = Δd1 / cos θ r1 = r0 r2 = r1 - Δd1 where, r1: distance from the center 21C to the abutting surface 321 before the minute movement, θ: angle between the imaginary line VL and a straight line connecting the center 21C of the spin base 21 with the contact points 324 and 325, r2: distance from the center 21C to the abutting surface 321 after the minute movement, W: separation distance of the abutting member 32 from the imaginary line VL. In this case, the distances from the center 21C of the spin base 21 to the abutting surfaces 311, 321, and 331 remain the same even after the minute movement. By repeating this micro-movement, the contact members 31 to 33 approach the substrate S while maintaining the same distance from the center 21C of the spin base 21 to the contact surfaces 311, 321, and 331. If, for example, eccentricity as shown in FIG. 5 occurs, the contact member 31 first contacts the substrate S during the repetition of the micro-movement, moving the substrate S in the D1 direction (see section (c) of FIG. 5). Subsequently, the contact member 32 contacts the substrate S being pushed by the contact member 31, moving it horizontally. Subsequently, as the micro-movement is further repeated while the contact member 32 maintains its contact state with the edge surface of the substrate S, the substrate S is displaced so that the center SC of the substrate S shifts in the Y1 direction. As shown in section (d) of FIG. 5, the distance from the center 21C of the spin base 21 to the contact surfaces 311, 321, and 331 becomes the radius of the substrate S. Then, the last contact member 33 also contacts the substrate S. In this way, the substrate S is sandwiched between the contact members 31 to 33, the movement of the substrate S is stopped, and the center SC of the substrate S coincides with the center 21C of the spin base 21. In this way, the centering process of the substrate S can be performed.

[0043] In the centering device (=centering mechanism 3+controller 9) according to this embodiment, the positioning of the substrate S in direction X of the horizontal direction is performed by sandwiching the substrate between contact member 31 and contact members 32 and 33. Meanwhile, the positioning of the substrate S in direction Y (corresponding to the "fourth horizontal direction" of the present invention), which is perpendicular to direction X of the horizontal direction, is performed by contact members 32 and 33. That is, the center of the substrate S in direction Y is determined by the relative positions of contact members 32 and 33 in the horizontal plane. Here, as described above, deformation of the frame (not shown) supporting centering mechanism 3 in substrate processing apparatus 10, wear of contact members 32 and 33, and the like can cause the relative positions of contact members 32 and 33 in the horizontal plane to fluctuate, which can result in a decrease in centering accuracy in direction Y.

[0044] Therefore, in this embodiment, as shown in FIGS. 2 and 3 , a reference position adjustment unit 38 is provided. The reference position adjustment unit 38 includes a Y-movement stage 381 that is movable in the Y direction relative to the frame while supporting the base member 361 from below, a motor 382 that drives the Y-movement stage 381 in the Y direction, and a stopper 383 that prevents the Y-movement stage 381 from overrunning in the Y1 direction. The motor 382 moves the Y-movement stage 381 in the Y1 direction in accordance with a movement command from the control unit 9. For example, upon receiving a movement command to a specified position, the motor 382 moves the Y-movement stage 381 in the Y1 direction. Then, when the Y-movement stage 381 engages with the stopper 383, the motor 382 stops. As a result, the Y-movement stage 381 and the multi-movement unit 36 ​​and abutment members 32 and 33 supported by the Y-movement stage 381 are positioned at specified positions in the Y direction (the positions shown in FIG. 9A , which will be described later). In this manner, in this embodiment, the stopper 383 has not only the function of preventing overrun but also the function of positioning the contact members 32 and 33 at specified positions in the Y direction.

[0045] After positioning contact members 32, 33 at the specified positions in this manner, control unit 9 issues an initial position command to motor 382, ​​which causes motor 382 to move Y movement stage 381 in the Y2 direction by a distance Dof corresponding to the initial position command. As a result, as shown in Figures 3 and 5, contact members 32, 33 are positioned symmetrically with respect to virtual line VL. In other words, contact members 32, 33 are positioned at their initial positions. This will be described in detail later together with the initial adjustment of substrate processing apparatus 10 based on Figures 8, 9A, and 9B.

[0046] Furthermore, if the centering accuracy is reduced due to a change in the positional relationship between contact members 32 and 33 in the horizontal plane, control unit 9 issues an adjustment command to motor 382 accordingly. Motor 382 then moves Y-movement stage 381, multi-movement unit 36 ​​supported by Y-movement stage 381, and contact members 32 and 33 in direction Y by a distance corresponding to the adjustment command. As a result, contact members 32 and 33 are moved collectively in direction Y while maintaining the Y-directional spacing (=2W) therebetween, and the second and third reference positions in direction Y are adjusted. The effects of adjusting the second and third reference positions will be described in detail later, along with the normal operation of substrate processing apparatus 10, based on FIGS. 10 and 11A-11D.

[0047] In this embodiment having the centering mechanism 3 described above, the control unit 9 controls each unit of the substrate processing apparatus 10 to perform the initial adjustment process and normal operation (=centering process+bevel etching process). The control unit 9 is provided with an arithmetic processing unit 91 configured by a computer having a CPU (=Central Processing Unit), RAM (=Random Access Memory), etc., a storage unit 92 such as a hard disk drive, and a motor control unit 93.

[0048] The arithmetic processing unit 91 appropriately reads out an initial adjustment program, a centering program, a bevel etching program, a reference position adjustment program, and the like, which are pre-stored in the storage unit 92, and loads them into RAM (not shown) to execute the initial adjustment process, the centering process, the bevel etching process, and the reference position adjustment process. In particular, when performing the centering process, the arithmetic processing unit 91 calculates first to third movement amounts Δd1 to Δd3 and controls the rotation motors 352 and 362 of the movement mechanism 34 via the motor control unit 93 based on these movement amounts Δd1 to Δd3. The arithmetic processing unit 91 also calculates the load torque at the single movement unit 35 from the motor current value applied to the rotation motor 352, and calculates the load torque at the multi-movement unit 36 ​​from the motor current value applied to the rotation motor 362. Here, as the distance from the center 21C of the spin base 21 to the contact surfaces 311, 321, and 331 (the distance from the base center to the contact surfaces) changes during repeated micro-movements, the load torque fluctuates, for example, as shown in FIG. 7 . As shown in the figure, when the distance rs coincides with the radius rs of the substrate S, i.e., when the contact members 31-33 sandwich the substrate S, the load torque increases rapidly almost simultaneously in the single movement unit 35 and the multi-movement unit 36. Therefore, the calculation processing unit 91 determines that the centering process is complete when the load torque exceeds a threshold value and stops the movement of the contact members 31-33. While the present embodiment monitors the fluctuations in load torque for all motors 352 and 362, the timing for stopping the movement of the contact members 31-33 may be determined by monitoring only one of the motors. It goes without saying that the load torque may also be calculated based on something other than the motor current value. This also applies when the contact members 31-33 are each moved by a dedicated motor. Furthermore, when the contact members 31-33 are moved by a single motor, the load torque may be calculated based on the load torque or motor current value of that motor.

[0049] Furthermore, after the centering process, the arithmetic processing unit 91 calculates the amount of eccentricity by which the center SC of the substrate S is eccentric in direction Y from the center 21C of the spin base 21 based on peripheral information about the peripheral portion of the substrate S measured by the measurement unit 37. If the arithmetic processing unit 91 determines that the amount of eccentricity exceeds the allowable value, it moves the multi-movement unit 36 ​​in direction Y by a distance corresponding to the amount of eccentricity, thereby adjusting the second reference position and the third reference position. In this way, in this embodiment, the arithmetic processing unit 91 functions as the "eccentricity information acquisition unit" and "movement control unit" of the present invention.

[0050] FIG. 8 is a flowchart illustrating the initial adjustment process of the substrate processing apparatus shown in FIG. 2. FIGS. 9A to 9C are diagrams schematically illustrating the operation of each unit of the apparatus during the initial adjustment process. This initial adjustment process determines the first to third reference positions using a circular adjustment jig CJ, which has a diameter slightly larger than that of the substrate S and a uniform distance from its center to its edge (i.e., radius) along its entire circumference. As shown in FIG. 9A, with no circular adjustment jig placed on the spin base 21, the processor 91 issues a Y1 movement command to the motor control unit 93 to move the Y-movement stage 381 toward the stopper 383 (step S11). As a result, the Y-movement stage 381 moves the multi-movement unit 36 ​​and the abutment members 32 and 33 in the Y1 direction together. When the Y-movement stage 381 engages with the stopper 383 ("YES" in step S12), the processor 91 stops the movement of the Y-movement stage 381 (step S13). At this point, the midpoint between the contact members 32 and 33 in the Y direction is offset by a predetermined offset value Dof (for example, 1 mm) toward the Y1 direction from the center 21C of the spin base 21.

[0051] Subsequently, the arithmetic processing unit 91 issues a Y1 movement command to the motor control unit 93, causing the Y movement stage 381 to move in the Y2 direction by the offset value Dof (step S14). As a result, as shown in FIG. 9B , the midpoint between the contact members 32 and 33 in the Y direction coincides with the center 21C of the spin base 21. The arithmetic processing unit 91 also positions the contact members 31 to 33 at a distance from the center 21C that is greater than the radius of the disc jig CJ, creating a situation in which the disc jig CJ can be placed on the spin base 21. Under these conditions, the arithmetic processing unit 91 issues a loading request for the disc jig CJ to the substrate transport robot 111 and waits for the disc jig CJ to be carried into the substrate processing apparatus 10 and placed on the upper surface of the spin base 21. The disc jig CJ is then placed on the spin base 21 (step S15). In this embodiment, the disk jig CJ is loaded using the substrate transport robot 111, but the disk jig CJ may be loaded by an operator.

[0052] The disk jig CJ and the spin base 21 are shaped so that they can be fixed in a position where the center of the disk jig CJ coincides with the center 21C of the spin base 21. Therefore, when the loading of the disk jig CJ is complete, the center of the disk jig CJ coincides with the center 21C of the spin base 21. In this state, the arithmetic processing unit 91 slightly moves each of the abutment members 31-33 toward the disk jig CJ, as indicated by the dotted arrows ARx in FIG. 9C . Then, the disk jig CJ is gripped by the abutment members 31-33, thereby performing centering of the disk jig CJ (step S16). This process positions each of the abutment members 31-33 at a distance from the center 21C of the spin base 21 that corresponds to the radius of the disk jig CJ. Therefore, in this embodiment, the calculation processing unit 91 stores the X-direction positions of the abutment members 31 to 33 in the memory unit 92 as the "first reference position," "second reference position," and "third reference position" of the present invention, respectively (step S17).

[0053] Next, the calculation processing unit 91 releases the grip of the disc jig CJ by the abutment members 31 to 33 (step S18), and then unloads the disc jig CJ from the substrate processing apparatus 10 (step S19) in the reverse order of the loading process of the disc jig CJ (step S15).

[0054] In this manner, in this embodiment, by providing the reference position adjustment unit 38, it is possible to perform highly accurate mechanical positioning of the contact members 32, 33 in direction Y. Moreover, it is possible to set the first reference position to the third reference position with high accuracy using the adjustment disc jig CJ.

[0055] Next, substrate processing by the substrate processing apparatus 10 will be described with reference to Figure 10 and Figures 11A to 11D. Figure 10 is a flowchart showing substrate processing in the substrate processing apparatus shown in Figure 2, and Figures 11A to 11D are diagrams schematically showing the operation of each part of the apparatus during substrate processing. In the substrate processing apparatus 10, the calculation processing unit 91 controls each part of the apparatus to perform a centering process before a bevel etching process. More specifically, the following steps S21 to S26 are performed.

[0056] The calculation processing unit 91 causes the motor control unit 93 to move the contact members 31 to 33 and the measurement unit 37 to positions radially away from the spin base 21. This creates a transport space above the spin base 21 that is sufficient for the hand (not shown) of the substrate transport robot 111 to enter, and prevents the substrate S transported by the substrate transport robot 111 from interfering with the contact members 31 to 33 and the measurement unit 37.

[0057] After confirming that the transfer space has been formed and that interference with the substrate S has been prevented, the arithmetic processing unit 91 issues a loading request for the substrate S to the substrate transfer robot 111 and waits for the unprocessed substrate S to be carried into the substrate processing apparatus 10 and placed on the upper surface of the spin base 21. The substrate S is then placed on the spin base 21 (step S21). At this point, the suction pump 24 is stopped, and the substrate S can move horizontally on the upper surface of the spin base 21.

[0058] Once the loading of the substrate S is complete, the substrate transport robot 111 retreats from the substrate processing apparatus 10. Subsequently, as shown in FIG. 11A, the arithmetic processing unit 91 first controls the motor control unit 93 to move the contact members 31 to 33 to the first reference position or the third reference position acquired by the initial adjustment process. Next, as shown by the dotted arrows in FIG. 11B, the arithmetic processing unit 91 controls the single movement unit 35 to move the contact member 31 in the X1 direction, and the multi-movement unit 36 ​​to move the contact members 32 and 33 in the X2 direction. That is, as shown in FIG. 5, the contact members 31 to 33 are slightly moved toward the substrate S from the first, second, and third reference positions, respectively. By repeating this slight movement, the substrate S moves so that its center SC coincides with the center 21C of the spin base 21. That is, centering of the substrate S is performed (step S22). After this centering process, the arithmetic processing unit 91 operates the suction pump 24 to suck and hold the substrate S on the spin base 21. Furthermore, as indicated by the solid arrow ARx in Fig. 11C, the arithmetic processing unit 91 moves the contact member 31 in the X2 direction by the single movement unit 35, and moves the contact members 32 and 33 in the X1 direction by the multi-movement unit 36, so that the contact members 31 to 33 return to the first reference position, the second reference position, and the third reference position, respectively.

[0059] While step S22 may be performed only once to complete the centering process, in this embodiment, the eccentricity of the substrate S that has undergone the centering process is measured (step S23) to achieve higher-precision positioning. That is, the arithmetic processing unit 91 moves the measurement unit 37 from the retracted position along the radial direction D4 to the peripheral edge of the substrate S. The arithmetic processing unit 91 then rotates the spin base 21 at least once around the vertical axis AX via the motor control unit 93. As a result, the substrate S rotates together with the spin base 21 and then stops rotating. During this rotation, the arithmetic processing unit 91 receives an edge detection signal output from the measurement unit 37 as peripheral edge information, and derives the eccentricity amounts ex and ey of the center SC of the substrate S from the center 21C of the spin base 21 in the X and Y directions. If the obtained eccentricity amount exceeds a preset tolerance ("NO" in step S24), eccentricity adjustment is performed. More specifically, the arithmetic processing unit 91 issues a Y-direction movement command to the motor control unit 93, which moves the Y-movement stage 381 in the direction Y opposite the eccentricity direction by a distance equal to the eccentricity amount ey, as indicated by the solid-line arrow ARy in FIG. 11D (step S25: Y-direction eccentricity adjustment). The arithmetic processing unit 91 also issues an X-direction movement command to the motor control unit 93, which moves the contact members 31-33 in the direction X opposite the eccentricity direction by a distance equal to the eccentricity amount ex, as indicated by the solid-line arrow ARx in FIG. 11D (step S26: X-direction eccentricity adjustment). This adjusts the first, second, and third reference positions. After this, steps S22-S24 are executed again.

[0060] On the other hand, when the eccentricity amount obtained in step S24 is equal to or less than the preset tolerance value ("YES" in step S24), the calculation processing unit 91 causes the motor control unit 93 to move the abutment members 31 to 33 and the measurement unit 37 to a position radially away from the spin base 21, and then proceeds to the bevel etching process (step S27).

[0061] In the bevel etching process, the arithmetic processing unit 91 rotates the substrate S around the vertical axis AX using the motor control unit 93, with the center SC of the substrate S coinciding with the center 21C of the spin base 21. Then, while rotating the substrate S at, for example, 1800 rpm, the arithmetic processing unit 91 controls the processing liquid supply unit 43 to supply the processing liquid to the processing liquid nozzle 41. As a result, the processing liquid is ejected from the processing liquid nozzle 41 onto the peripheral edge of the rotating substrate S. As a result, the bevel etching process using the processing liquid is performed on the entire peripheral edge of the substrate S.

[0062] Then, when the arithmetic processing unit 91 detects that the processing time required for the bevel etching process of the substrate S has elapsed, it issues a supply stop command to the processing liquid supply unit 43 to stop discharging the processing liquid. The arithmetic processing unit 91 also stops the rotation of the spin base 21. This completes the bevel etching process, and the arithmetic processing unit 91 unloads the substrate S from the substrate processing apparatus 10 in the reverse order of the loading process of the substrate S.

[0063] As described above, according to the first embodiment, if the eccentricity ey in the direction Y exceeds the allowable value even after the centering process, the reference position adjustment unit 38 adjusts the second and third reference positions in the direction Y (step S25). This prevents a decrease in centering accuracy in the direction Y due to frame deformation or wear of the contact members 32 and 33, enabling highly accurate centering. Furthermore, in this embodiment, the calculation processing unit 91 calculates the eccentricity ey based on the peripheral information of the substrate S acquired by the measurement unit 37, and controls the multi-movement unit 36 ​​by a distance corresponding to the eccentricity ey, automatically adjusting the Y-direction eccentricity. This significantly reduces the need for operator intervention in adjusting the Y-direction eccentricity.

[0064] In this embodiment, not only the Y-direction eccentricity adjustment but also the X-direction eccentricity adjustment is performed simultaneously, thereby further improving centering accuracy. Furthermore, the arithmetic processing unit 91 calculates the amount of eccentricity ex based on the peripheral information of the substrate S acquired by the measurement unit 37, and controls the single movement unit 35 and the multi-movement unit 36 ​​by a distance corresponding to the amount of eccentricity ex, thereby automatically adjusting the X-direction eccentricity. Therefore, highly accurate centering processing can be performed without the need for operator intervention.

[0065] Furthermore, although it occurs less frequently, substrates S on which thin films with unexpectedly uneven thicknesses are formed or substrates S with relatively large warpage may be transported to the substrate processing apparatus 10. When viewed from above, these substrates S may have low circularity and uneven diameters around their entire circumference. This may result in the amount of eccentricity of the substrate S after centering being outside the specified range. In the prior art, the technical concept of adjusting the first or third reference position was lacking, and repeated centering processes only resulted in an increase in the number of retries, making it difficult to keep the amount of eccentricity within the allowable range. In contrast, in this embodiment, the first or third reference position is adjusted according to the amount of eccentricity of the substrate S after centering, as described above. Therefore, it is basically possible to keep the amount of eccentricity of the substrate S within the allowable range with a single retry.

[0066] Furthermore, in conventional apparatuses, because the first through third reference positions are fixed, it is difficult to avoid a decrease in centering accuracy due to wear of the contact members 31, 32, and 33. Therefore, when wear of the contact members 31, 32, and 33 progresses, it is necessary to stop operation of the substrate processing apparatus 10 and replace the worn contact members. In contrast, according to this embodiment, even if the contact members 31, 32, and 33 wear, the first through third reference positions are adjusted in response to the wear. This reduces the downtime of the substrate processing apparatus 10 and the frequency of replacement of the contact members, thereby reducing environmental impact. Note that, although this embodiment determines whether the eccentricity is within the allowable value each time the centering process is performed, it may also be configured to calculate a moving average of the eccentricity every certain number of times (e.g., 100 times) and determine whether the moving average is within the allowable value.

[0067] As described above, in the first embodiment, the contact members 31 to 33 correspond to examples of the "first contact member," the "second contact member," and the "third contact member" of the present invention, respectively.

[0068] FIG. 12 is a perspective view showing the configuration of a substrate holder and a centering mechanism in a second embodiment of a substrate processing apparatus according to the present invention. FIGS. 13A and 13B are schematic views showing the operation of each component of the apparatus during substrate processing in the second embodiment. The second embodiment differs significantly from the first embodiment in the configuration of the reference position adjustment unit 38. In other words, in the second embodiment, the reference position adjustment unit 38 is configured to move only the abutment member 33 in the Y direction, instead of moving the multi-movement unit 36 ​​and the abutment members 32 and 33 together in the Y direction. As shown in FIG. 12 , the abutment member 33 is supported on the arm 364b of the slider 364 so as to be movable in the Y direction, and a micrometer head 384 is attached to the arm 364b. The micrometer head 384 extends in the Y direction. The end of the micrometer head 384 on the Y2 side functions as a spindle, abutting against the abutment member 33 to position the abutment member 33 in the Y direction. That is, the operator operates the micrometer head 384 to move the contact member 33 in the Y direction, thereby adjusting the relative position of the third reference position with respect to the second reference position in the Y direction.

[0069] In the normal operation of the second embodiment, the centering process is performed before the bevel etching process, as in the first embodiment. The normal operation (=centering process+bevel etching process) of the second embodiment will be described below with reference to FIGS. 10, 13A, and 13B.

[0070] After the substrate S is placed on the spin base 21 (step S21), centering of the substrate S is performed (step S22). After this centering process, the arithmetic processing unit 91 operates the suction pump 24 to suction and hold the substrate S on the spin base 21. Furthermore, as indicated by the solid arrow ARx in FIG. 13A , the arithmetic processing unit 91 moves the contact member 31 in the X2 direction using the single movement unit 35 and moves the contact members 32 and 33 in the X1 direction using the multi-movement unit 36, so that the contact members 31 to 33 return to the first reference position, the second reference position, and the third reference position, respectively. Subsequently, as shown in FIG. 13A , the eccentricity of the substrate S that has undergone the centering process is measured (step S23). That is, the arithmetic processing unit 91 moves the measurement unit 37 from the retracted position along the radial direction D4 to the peripheral edge of the substrate S. Then, the arithmetic processing unit 91 rotates the spin base 21 at least once around the vertical axis AX via the motor control unit 93. As a result, the substrate S rotates together with the spin base 21 and then stops rotating. During this rotation, the calculation processing unit 91 receives the edge detection signal output from the measurement unit 37 as peripheral edge information, and derives the eccentricity amounts ex and ey of the center SC of the substrate S in the X and Y directions from the center 21C of the spin base 21. Then, when the obtained eccentricity amounts exceed a preset allowable value ("NO" in step S24), Y-direction eccentricity adjustment (step S25) and X-direction eccentricity adjustment (step S26) are executed.

[0071] In the second embodiment, as indicated by the solid arrow ARy in Fig. 13B , the Y-direction eccentricity adjustment is performed by moving only the contact member 33 in the direction Y using the micrometer head 384. More specifically, the calculation processing unit 91 notifies the operator of the amount of eccentricity ey to urge them to adjust the Y-direction eccentricity. For example, on a display unit (not shown), the calculation processing unit 91 displays a message indicating that Y-direction eccentricity adjustment is necessary, as well as the direction and amount of movement of the contact member 33.

[0072] It should be noted here that the amount of movement of the abutment member 33 is important. In the first embodiment, the abutment members 32 and 33 are moved collectively, and therefore, in the Y-direction eccentricity adjustment, the abutment members 32 and 33 are moved a distance equal to the eccentricity amount ey. In contrast, in the second embodiment, only the abutment member 33 is moved in the direction Y in the Y-direction eccentricity adjustment. Therefore, as shown in FIG. 14 , the movement amount Dy of the abutment member 33 and the associated movement amount ΔY of the center SC of the substrate S in the direction Y have a relationship expressed as ΔY = 0.5 × Dy. Therefore, in the second embodiment, the calculation processing unit 91 instructs the operator to move the abutment member 33 in the direction Y by a distance twice the eccentricity amount ey. In response to this, the operator operates the micrometer head 384 to move the third reference position in the direction Y.

[0073] 14, the center SC of the substrate S also moves in the X direction in response to the Y-direction eccentricity adjustment. More specifically, the movement amount Dy of the contact member 33 and the associated movement amount ΔX of the center SC of the substrate S in the X direction have the relationship expressed as ΔX = 0.2887 × Dy + 0.0002, as shown in Fig. 14. Therefore, in the second embodiment, in the X-direction eccentricity adjustment (step S26), the calculation processing unit 91 performs the X-direction eccentricity adjustment in consideration of the movement amount ΔX and the eccentricity amount ex (step S26).

[0074] By adjusting the eccentricity in the Y direction and the X direction, the first reference position, the second reference position, and the third reference position are adjusted, after which steps S22 to S24 are executed again.

[0075] On the other hand, when the eccentricity amount obtained in step S24 is equal to or less than the preset tolerance value ("YES" in step S24), the calculation processing unit 91 causes the motor control unit 93 to move the abutment members 31 to 33 and the measurement unit 37 to a position radially away from the spin base 21, and then proceeds to the bevel etching process (step S27).

[0076] As described above, according to the second embodiment, the same effects as those of the first embodiment can be obtained.

[0077] FIG. 15 is a perspective view showing the configuration of a substrate holder and a centering mechanism in a third embodiment of a substrate processing apparatus according to the present invention. FIGS. 16A and 16B are diagrams schematically showing the operation of each component of the apparatus during substrate processing in the third embodiment. The third embodiment differs significantly from the first embodiment in the configuration of the reference position adjustment unit 38. In other words, in the third embodiment, the reference position adjustment unit 38 is configured to move only the abutment member 33 in the X direction, instead of moving the multi-movement unit 36 ​​and the abutment members 32 and 33 collectively in the Y direction. As shown in FIG. 15 , the abutment member 33 is supported on the arm 364b of the slider 364 so as to be movable in the X direction, and a micrometer head 384 is attached to the arm 364b. The micrometer head 384 extends in the X direction. The end of the micrometer head 384 on the X2 side functions as a spindle, abutting against the abutment member 33 to position the abutment member 33 in the X direction. That is, the operator operates the micrometer head 384 to move the contact member 33 in the X direction, and adjusts the relative position of the third reference position with respect to the second reference position in the Y direction.

[0078] In the normal operation of the third embodiment, the centering process is performed before the bevel etching process, as in the first embodiment. The normal operation (=centering process+bevel etching process) of the third embodiment will be described below with reference to FIGS. 10, 16A, and 16B.

[0079] After the substrate S is placed on the spin base 21 (step S21), centering of the substrate S is performed (step S22). After this centering process, the arithmetic processing unit 91 operates the suction pump 24 to suction and hold the substrate S on the spin base 21. Furthermore, as indicated by the dotted arrow ARx in FIG. 16A , the arithmetic processing unit 91 moves the contact member 31 in the X2 direction using the single movement unit 35 and moves the contact members 32 and 33 in the X1 direction using the multi-movement unit 36, so that the contact members 31 to 33 return to the first reference position, the second reference position, and the third reference position, respectively. Subsequently, as shown in FIG. 16A , the eccentricity of the substrate S that has undergone the centering process is measured (step S23). That is, the arithmetic processing unit 91 moves the measurement unit 37 from the retracted position along the radial direction D4 to the peripheral edge of the substrate S. Then, the arithmetic processing unit 91 rotates the spin base 21 at least once around the vertical axis AX via the motor control unit 93. As a result, the substrate S rotates together with the spin base 21 and then stops rotating. During this rotation, the calculation processing unit 91 receives the edge detection signal output from the measurement unit 37 as peripheral edge information, and derives the eccentricity amounts ex and ey of the center SC of the substrate S in the X and Y directions from the center 21C of the spin base 21. Then, when the obtained eccentricity amounts exceed a preset allowable value ("NO" in step S24), Y-direction eccentricity adjustment (step S25) and X-direction eccentricity adjustment (step S26) are executed.

[0080] In the third embodiment, the Y-direction eccentricity adjustment is performed by moving only the contact member 33 in the X direction using the micrometer head 384. More specifically, the arithmetic processing unit 91 notifies the operator of the amount of eccentricity ey to urge the operator to adjust the Y-direction eccentricity. For example, the arithmetic processing unit 91 displays a message indicating that the Y-direction eccentricity adjustment is necessary, as well as the direction and amount of movement of the contact member 33, on a display unit (not shown).

[0081] It should be noted here that the amount of movement of the abutment member 33 is important. In the first embodiment, the abutment members 32 and 33 are moved collectively, and therefore, in the Y-direction eccentricity adjustment, the abutment members 32 and 33 are moved a distance equal to the eccentricity amount ey. In contrast, in the third embodiment, only the abutment member 33 is moved in the direction X in the Y-direction eccentricity adjustment. Therefore, as shown in FIG. 17 , the movement amount Dx of the abutment member 33 and the associated movement amount ΔY of the center SC of the substrate S in the direction Y have the relationship ΔY = 0.5 × Dx. Therefore, in the third embodiment, the calculation processing unit 91 instructs the operator to move the abutment member 33 in the direction Y by a distance twice the eccentricity amount ey. In response to this, the operator operates the micrometer head 384 to move the third reference position in the direction Y.

[0082] 17, the center SC of the substrate S also moves in the X direction in response to the Y-direction eccentricity adjustment. More specifically, the movement amount Dx of the abutting member 33 and the associated movement amount ΔX of the center SC of the substrate S in the X direction have the relationship expressed as ΔX≈0.5×Dx, as shown in FIG. 17. Therefore, in the X-direction eccentricity adjustment (step S26) in the third embodiment, the calculation processing unit 91 performs the X-direction eccentricity adjustment in consideration of the movement amount ΔX and the eccentricity amount ex (step S26).

[0083] By adjusting the eccentricity in the Y direction and the X direction, the first reference position, the second reference position, and the third reference position are adjusted, after which steps S22 to S24 are executed again.

[0084] On the other hand, when the eccentricity amount obtained in step S24 is equal to or less than the preset tolerance value ("YES" in step S24), the calculation processing unit 91 causes the motor control unit 93 to move the abutment members 31 to 33 and the measurement unit 37 to a position radially away from the spin base 21, and then proceeds to the bevel etching process (step S27).

[0085] As described above, according to the third embodiment, the same effects as those of the first embodiment can be obtained.

[0086] The present invention is not limited to the above embodiment, and various modifications can be made to the above without departing from the spirit of the present invention. For example, in the above embodiment, the two contact members 32 and 33 are moved in the D2 direction (X2 direction) and the D3 direction (X2 direction) by the multi-movement unit 36, but instead of the multi-movement unit 36, a single movement unit for the contact member 32 and a single movement unit for the contact member 33 configured similarly to the single movement unit 35 may be provided.

[0087] As modified examples of the second and third embodiments, the configurations shown in FIGS. 18 and 19 may be used, respectively.

[0088] 18 is a diagram schematically illustrating the configuration and operation of each unit of a substrate processing apparatus according to a fourth embodiment of the present invention. In this fourth embodiment, a single movement unit 36A for contact member 32 and a single movement unit 36B for contact member 33 are provided, and a micrometer head 384 is attached to a slider (not shown) of single movement unit 36B so that contact member 33 can be moved in direction Y.

[0089] 19 is a diagram schematically illustrating the configuration and operation of each unit of a substrate processing apparatus according to a fifth embodiment of the present invention. This fifth embodiment is provided with a single movement unit 36A for the contact member 32 and a single movement unit 36B for the contact member 33. The single movement unit 36B adjusts the third reference position, thereby enabling Y-direction eccentricity adjustment. In other words, the fifth embodiment does not require the installation of a micrometer head 384, and the first to third reference positions can be automatically adjusted, as in the first embodiment.

[0090] Furthermore, in the second to fourth embodiments, the Y-direction eccentricity adjustment is performed manually by an operator using the micrometer head 384, but the micrometer head 384 may be provided detachably with respect to the slider. That is, the micrometer head 384 may be removed from the substrate processing apparatus 10 except when adjusting the Y-direction eccentricity. Furthermore, instead of the micrometer head 384, the Y-direction eccentricity adjustment may be performed by inserting and removing an adjustment member such as a shim. Furthermore, instead of the micrometer head 384 or the shim, a piezoelectric actuator or a MEMS (Micro Electro Mechanical Systems) may be used.

[0091] In the above embodiment, the contact members 31 to 33 are finished so that the contact surfaces 311 to 331 have a curved shape that conforms to the edge surface Se of the substrate S, but the shape of the portion that contacts the edge surface Se of the substrate S is not limited to this. The shape may include, for example, a pointed shape, a semi-disk shape, a linear shape, etc., similar to the device described in Patent Document 1.

[0092] In the above embodiment, the present invention is applied to a centering device provided in the substrate processing apparatus 10 that performs bevel etching, but the centering device according to the present invention can be applied to any centering technology provided in a substrate processing apparatus that processes a disk-shaped substrate while rotating it. Also, the centering device according to the present invention may be used alone.

[0093] While the invention has been described with reference to specific embodiments, this description is not intended to be construed in a limiting sense. Various modifications of the disclosed embodiments, as well as other embodiments of the invention, will become apparent to those skilled in the art upon reference to the description of the invention. It is therefore contemplated that the appended claims will cover such modifications or embodiments within the true scope of the invention.

[0094] The present invention can be applied to a centering technique for aligning the center of a disk-shaped substrate placed on the upper surface of a substrate support part with the center of the substrate support part, and to substrate processing apparatuses in general that use this technique to process substrates.

[0095] 2...Substrate holding section 3...Centering mechanism 9...Control section 10...Substrate processing apparatus 21...Spin base 31...(First) abutment member 32...(Second) abutment member 33...(Third) abutment member 34...Moving mechanism 35, 36A, 36B...Single movement section 36...Multi-movement section 37...Measurement section 38...Reference position adjustment section 91...Calculation processing section 364...Slider 381...Y movement stage 383...Stopper 384...Micrometer head D1...First movement direction D2...Second movement direction D3...Third movement direction D4...Radial direction S...Substrate VL...Virtual line X...(First horizontal) direction Y...(Fourth horizontal) direction Δd1...First movement amount Δd2...Second movement amount Δd3...Third movement amount ex...Eccentricity amount (in direction X) ey... eccentricity (in direction Y)

Claims

1. A centering device that positions a disk-shaped substrate placed in a horizontal position on an upper surface of a substrate support part so that the center of the substrate coincides with the center of the substrate support part, comprising: a first abutment member that is movable in a first horizontal direction toward the center of the substrate support part from a first reference position that is a reference distance away from the center of the substrate support part by a reference distance longer than the radius of the substrate in a horizontal plane; and a second abutment member that is movable in a second horizontal direction different from the direction toward the center of the substrate support part and approaching the substrate from a second reference position that is on the opposite side of the first abutment member with respect to the center of the substrate support part and that deviates from an imaginary line extending from the center of the substrate support part in the first horizontal direction and that is away from the center of the substrate support part by the reference distance in the horizontal plane; a third contact member movable in the horizontal plane from a third reference position that is opposite to the first contact member with respect to a center of the substrate support portion and opposite to the second contact member with respect to the virtual line and away from the center of the substrate support portion by the reference distance, in a third horizontal direction different from the direction toward the center of the substrate support portion and approaching the substrate; a movement mechanism that moves the first contact member, the second contact member, and the third contact member in the first horizontal direction, the second horizontal direction, and the third horizontal direction, respectively; and a movement control unit that repeats micro-movements that move the first contact member, the second contact member, and the third contact member by a first movement amount, a second movement amount, and a third movement amount by the movement mechanism so that the distances of the first contact member, the second contact member, and the third contact member from the center of the substrate support portion are kept constant, until all of the first contact member, the second contact member, and the third contact member have been completely brought into contact with the substrate, A centering device, wherein at least one of the second reference position and the third reference position is adjustable within the horizontal plane.

2. A centering device as described in claim 1, further comprising a reference position adjustment unit that adjusts both the second reference position and the third reference position in the fourth horizontal direction by moving the second abutment member and the third abutment member in a fourth horizontal direction perpendicular to the first horizontal direction.

3. A centering device as described in claim 2, wherein the second horizontal direction and the third horizontal direction are parallel to the virtual line, the moving mechanism has a multi-movement unit that moves the second abutment member and the third abutment member collectively in the second horizontal direction and the third horizontal direction, respectively, and the reference position adjustment unit moves the multi-movement unit in the fourth horizontal direction, thereby adjusting the second reference position and the third reference position collectively while maintaining a constant distance between the second reference position and the third reference position in the fourth horizontal direction.

4. A centering device as described in claim 3, comprising: a rotational drive unit which rotates the substrate support unit on which the substrate is placed; a measurement unit which measures the peripheral portion of the substrate rotated by the rotational drive unit with the first abutment member, the second abutment member and the third abutment member spaced apart from the edge face of the substrate; and a control unit which controls a drive source provided in the reference position adjustment unit to move the multi-movement unit in the fourth horizontal direction, wherein the control unit has: an eccentricity information acquisition unit which determines the amount of eccentricity by which the center of the substrate is eccentric in the fourth horizontal direction from the center of the substrate support unit based on peripheral information relating to the peripheral portion of the substrate measured by the measurement unit; and a movement control unit which moves the multi-movement unit in the fourth horizontal direction by a distance corresponding to the amount of eccentricity.

5. A centering device as described in claim 4, wherein the eccentricity information acquisition unit calculates a moving average value of the eccentricity each time the positioning of the substrate on the substrate support unit is performed a preset number of times, and the movement control unit executes movement of the multi-movement unit in the fourth horizontal direction at the time when the moving average value exceeds a preset tolerance.

6. A centering device as described in claim 1, further comprising a reference position adjustment unit that adjusts the relative position of the third reference position with respect to the second reference position in the fourth horizontal direction by moving only the third abutment member, of the second abutment member and the third abutment member, in a fourth horizontal direction perpendicular to the first horizontal direction.

7. A centering device as described in claim 6, wherein the second horizontal direction and the third horizontal direction are directions parallel to the virtual line, the moving mechanism has a multi-movement unit that moves the second abutment member and the third abutment member collectively in the second horizontal direction and the third horizontal direction, respectively, the multi-movement unit has a slider that holds the second abutment member and supports the third abutment member movably in the fourth horizontal direction while being movable parallel to the first horizontal direction, and a motor for moving the slider parallel to the first horizontal direction, and the reference position adjustment unit adjusts the relative position of the third reference position with respect to the second reference position in the fourth horizontal direction by moving the third abutment member in the fourth horizontal direction relative to the slider.

8. A centering device according to claim 7, wherein the reference position adjustment portion is a micrometer head.

9. A centering device as described in claim 1, further comprising a reference position adjustment unit, wherein the second horizontal direction and the third horizontal direction are directions parallel to the virtual line, the moving mechanism has a multi-movement unit that moves the second abutment member and the third abutment member collectively in the second horizontal direction and the third horizontal direction, respectively, the multi-movement unit has a slider that holds the second abutment member and supports the third abutment member so as to be movable parallel to the third horizontal direction, while having a slider that is movable parallel to the first horizontal direction, and a motor for moving the slider parallel to the first horizontal direction, and the reference position adjustment unit adjusts the relative position of the third reference position with respect to the second reference position in the direction parallel to the third horizontal direction by moving the third abutment member parallel to the third horizontal direction relative to the slider.

10. The centering device according to claim 9, wherein the reference position adjustment portion is a micrometer head. 11.A centering method for positioning a disk-shaped substrate placed in a horizontal position on an upper surface of a substrate support part so that the center of the substrate coincides with the center of the substrate support part, the method comprising: (a) placing the substrate on the upper surface of the substrate support part in a horizontal plane with a first abutment member positioned at a first reference position that is a reference distance longer than a radius of the substrate from the center of the substrate support part; positioning a second abutment member at a second reference position on an opposite side of the first abutment member with respect to the center of the substrate support part, which is off an imaginary line extending from the first reference position through the center of the substrate support part and is away from the center of the substrate support part by the reference distance; and positioning a third abutment member at a third reference position on the opposite side of the first abutment member with respect to the center of the substrate support part and on the opposite side of the second abutment member with respect to the imaginary line, which is away from the center of the substrate support part by the reference distance. (b) repeating micro-movements, while keeping the substrate placed on the upper surface of the substrate support portion so as to be freely movable horizontally, by moving the first contact member in a first horizontal direction from the first reference position toward the center of the substrate support portion, moving the second contact member by a second movement amount in a second horizontal direction different from the direction from the second reference position toward the center of the substrate support portion and approaching the substrate, and moving the third contact member by a third movement amount in a third horizontal direction different from the direction from the third reference position toward the center of the substrate support portion and approaching the substrate, so that distances of the first contact member, the second contact member, and the third contact member from the center of the substrate support portion are kept constant; and (c) stopping the micro-movements when it is confirmed that the substrate is sandwiched between the first contact member, the second contact member, and the third contact member during the repetition of the micro-movements. (d) after performing steps (a) through (c), determining an amount of eccentricity of the center of the substrate from the center of the substrate support part in a fourth horizontal direction perpendicular to the first horizontal direction based on peripheral information obtained by measuring the peripheral portion of the substrate placed on the upper surface of the substrate support part, wherein, when the amount of eccentricity exceeds a preset allowable value, at least one of the second reference position and the third reference position is moved in the horizontal plane by a distance corresponding to the amount of eccentricity, and then steps (a) through (c) are performed again.

12. A substrate processing apparatus comprising: a substrate support part having an upper surface for supporting a substrate in a horizontal position; a centering device as defined in any one of claims 1 to 10; a suction part for evacuating the space between the substrate positioned by the centering device and the substrate support part, thereby adsorbing and holding the substrate on the substrate support part; a rotation drive part for rotating the substrate support part, which adsorbs and holds the substrate, about the center of the substrate support part; and a processing liquid supply mechanism for supplying processing liquid to a peripheral portion of the substrate which is rotated around the center of the substrate support part integrally with the substrate support part.

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