Heat dissipation device and manufacturing method therefor

Abstract

The present invention relates to a heat dissipation device and a manufacturing method therefor. The heat dissipation device according to the present invention includes a heat conduction panel body having formed therein a refrigerant flow space of a predetermined thickness to dissipate heat through one surface and the other surface thereof, wherein the heat conduction panel body includes a vacuumization unit which is installed with respect to any one of the one surface and the other surface to vertically communicate with the refrigerant flow space and which vacuumizes the refrigerant flow space before or after the refrigerant is filled in the refrigerant flow space. Thus, there are the advantages of preventing a refrigerant leak in the heat dissipation device and improving heat dissipation performance.

Description

Heat dissipation device and manufacturing method thereof

[0001] The present invention relates to a heat dissipation apparatus and a manufacturing method thereof, and more particularly, to a heat dissipation apparatus and a manufacturing method thereof capable of improving heat dissipation performance by actively transferring heat generated from a heat generating device (e.g., an electronic device) through a phase change of a refrigerant that is more effective than the heat conducting material properties of the device itself.

[0002] In diverse industries such as communications, electronics, and electrical engineering, related technologies are continuously being developed at an advanced level for application in more advanced industries. This advanced technological development requires high-power energy, and devices utilizing this energy inevitably face the problem of high heat generation. Consequently, the development of appropriate cooling systems is essential.

[0003] Heat dissipation systems are used in a variety of industries, including air conditioners, mobile communications, data centers, aerospace mobility, electric vehicles, energy storage devices, and displays. These systems are a major source of power consumption, and power consumption is steadily increasing as industries develop.

[0004] In general, heat dissipation devices are largely divided into Active Cooling Devices and Passive Cooling Devices. Active Cooling Devices mainly utilize Forced Convection by fans, while Passive Cooling Devices can be classified as a technology that utilizes Natural Convection without fans.

[0005] However, conventional heat dissipation systems have limitations in dissipating the high heat generated by continuously evolving advanced technologies. Therefore, related industries urgently need innovative technologies to address these issues. To address this, heat dissipation devices utilizing phase-change materials are being developed.

[0006] Phase change refers to the change in the inherent state of a liquid / gas / solid when it accumulates a large amount of energy or releases stored heat energy.

[0007] A phase change refers to a change in the physical arrangement of molecules rather than a chemical reaction such as chemical bonding or formation. When energy is applied to a substance, the heat that does not undergo a phase change is called sensible heat, and the heat used when the phase changes is called latent heat.

[0008] However, radiators have a problem: since temperature and pressure are proportional, pressure increases as temperature increases. This can lead to the rupture of the radiator itself if the high temperature transmitted from the heating element within the sealed radiator increases pressure. To address this, pressure must be prevented from increasing, and the radiator must have sufficient internal volume to ensure pressure equilibrium during the phase change cycle of the material.

[0009] In this way, in order to dissipate heat using the phase change material (refrigerant) provided inside the heat dissipation device, a vacuum process to control the internal pressure is necessary before filling the refrigerant.

[0010] The vacuumization process is a process of vacuuming through internal pumping using a device that generally operates by vacuum. The process is completed by forming the air vent hole portion to protrude further outward than the initial design size, performing the vacuumization process, and then performing the caulking finishing process to seal the inside.

[0011] At this time, the caulking finishing process is a process in which the inner surfaces forming the air vent hole are brought into contact with each other by pressing the additionally protruding portion using a caulking tool to form the air vent hole.

[0012] However, if the air vent hole originally has a completely circular cross-section, the shape is deformed by the uniform pressure of the caulking tool, so the inner surface of the air vent hole can be completely caulked without any separate leakage. However, if the air vent hole has a non-circular cross-section including an oval, the pressure transmitted by the caulking tool is uneven, so the shape is deformed unevenly, and there is a risk that a leak may occur in a part.

[0013] First, if a leak occurs in the heat dissipation device, not only can the refrigerant leak out, but the heat dissipation performance also rapidly deteriorates due to the difficulty in changing the phase of the refrigerant due to the decrease in internal pressure.

[0014]

[0015] The purpose of the present invention is to provide a heat dissipation mechanism and a manufacturing method thereof that can improve the heat dissipation performance of a heat generating device (electronic device) in order to solve the above-mentioned technical problem.

[0016] In addition, another object of the present invention is to provide a heat dissipation device including a vacuum unit that is provided to facilitate the performance of a caulking finishing process for an air vent hole formed to have an oval or non-circular cross-section, and a method for manufacturing the same.

[0017] The technical problems of the present invention are not limited to the technical problems mentioned above, and other technical problems not mentioned will be clearly understood by those skilled in the art from the description below.

[0018]

[0019] One embodiment of a heat dissipation device according to the present invention comprises a heat-conducting panel body having a refrigerant flow space of a predetermined thickness formed therein so as to radiate heat through one side and the other side, wherein the heat-conducting panel body is installed to be in vertical communication with the refrigerant flow space with respect to either the one side or the other side, and includes a vacuum unit for vacuuming the refrigerant flow space before or after filling the refrigerant into the refrigerant flow space.

[0020] Here, the refrigerant flow space of the heat-conducting panel body is formed as a closed empty space between the one-side heat-conducting panel forming the one surface and the other-side heat-conducting panel forming the other surface, and the refrigerant is filled and circulates in a gas-liquid manner to release heat while undergoing a phase change, and the vacuum unit may be provided in an air vent hole formed in either the one-side heat-conducting panel or the other-side heat-conducting panel.

[0021] In addition, the vacuum unit may include an air vent tube that is hung from the inside to the outside of the air vent hole and protrudes outward by a predetermined length, and a welding auxiliary ring interposed on the outer surface of the air vent tube for welding and fixing the air vent tube.

[0022] In addition, the air vent tube may include a tube body in the shape of a hollow pipe and a catch step portion positioned in the refrigerant flow space of the tube body and having an outer diameter larger than the outer circumference of the tube body.

[0023] In addition, the outer diameter of the above-mentioned hanging step portion can be formed to a size that hangs on the inner edge of the air vent hole.

[0024] In addition, the welding auxiliary ring can be fixed in close contact with the outer edge portion of one of the one-side heat-conducting panel and the other-side heat-conducting panel in which the air vent hole is formed.

[0025] Additionally, the vacuum unit may further include a shielding solder unit that solders the tube body to the air vent hole.

[0026] Additionally, the shielding solder portion may be a filler material that is soldered to shield the hollow portion of the tube body after the tube body is cut to match the outer end of the welding auxiliary ring.

[0027] In addition, the shielding solder portion may be a solder that covers both the outer end of the welding auxiliary ring and the hole of the tube body cut to match the outer end of the welding auxiliary ring.

[0028] In addition, the vacuum unit may include an air vent tube that is hung from the outside of the air vent hole in an inward direction and protrudes outward by a predetermined length, and the air vent tube may include a tube body in the shape of a hollow pipe and a welded reinforcement part that is integrally formed with the tube body and is hung on the outer edge of the air vent hole.

[0029] In addition, a tapered portion may be formed in the area adjacent to the air vent hole among the welded reinforcement portions so that a space is formed between the outer edge area of ​​the air vent hole to which a filler material can be applied.

[0030] In addition, the welded reinforcement part may have an outer diameter that catches the outer edge of the air vent hole when the tube body is installed from the outside to the inside through the air vent hole.

[0031] In addition, the vacuum unit may further include a shielding solder portion soldered with a filler metal to shield the hollow portion of the tube body after the tube body is cut to match the outer end of the welded reinforcement portion, and a fixing solder portion soldered with a filler metal to fix the space between the welded reinforcement portion and the outer edge portion of the air vent hole.

[0032] Additionally, the fixed solder portion can be formed by a filler material applied between the tapered portion of the weld reinforcement portion.

[0033] A method for manufacturing a heat dissipation device according to one embodiment of the present invention comprises: a heat-conducting panel body sheet metal process for processing one side heat-conducting panel and the other side heat-conducting panel, which form a refrigerant flow space therein, and integrally forming an air vent hole for filling or vacuumizing a refrigerant in one of the one side heat-conducting panel and the other side heat-conducting panel; a bonding process for bonding the one side heat-conducting panel and the other side heat-conducting panel, which are formed of a single metal panel member or of two metal panel members, to each other to form the refrigerant flow space; and a vacuumization process for vacuumizing the refrigerant flow space after the bonding process, wherein the vacuumization process includes a vacuumization unit installation process for installing a vacuumization unit in the air vent hole.

[0034] Here, when the one-side heat-conducting panel and the other-side heat-conducting panel are formed of a single metal panel member, a bending process may be further included to bend the single metal panel member before the bonding process so that the one-side heat-conducting panel forms one side of the refrigerant flow space and the other-side heat-conducting panel forms the other side of the refrigerant flow space.

[0035] In addition, the vacuum unit installation process may be a process of installing an air vent tube in advance before the bonding process so that it protrudes outward by a predetermined length while being caught on the inner edge end of the air vent hole, and interposing a welding auxiliary ring on the outer surface of the air vent tube protruding outward from the air vent hole.

[0036] In addition, the vacuum process may further include an air vent process of vacuumizing the refrigerant flow space using the air vent tube installed in the air vent hole, and a solder caulking process of cutting a portion of the air vent tube after the air vent process and then soldering the hollow portion of the air vent tube.

[0037] In addition, the vacuum unit installation process may be a process in which the air vent tube is installed from the outside inward so as to be caught on the outer edge end of the air vent hole after the bonding process, and the air vent tube is installed so as to be caught on the outer edge portion of the air vent hole.

[0038] In addition, the vacuum process may further include an air vent process of vacuumizing the refrigerant flow space using the air vent tube installed in the air vent hole, a solder fixing process of soldering a welded reinforcement part integrally formed with the air vent tube and the outer circumference of the air vent hole using a filler material after the air vent process, and a solder caulking process of cutting a part of the air vent tube after the air vent process and then soldering the hollow part of the air vent tube.

[0039]

[0040] According to one embodiment of the heat dissipation device and the manufacturing method thereof according to the present invention, it is possible to prevent refrigerant leakage in the completed heat dissipation device and to prevent a decrease in internal pressure, thereby ensuring the quality of the product.

[0041] The effects of the present invention are not limited to the effects mentioned above, and other effects not mentioned will be clearly understood by those skilled in the art from the description of the claims.

[0042]

[0043] FIG. 1a and FIG. 1b are perspective views showing two examples of the rear surface of an antenna device having a heat dissipation mechanism installed according to embodiments of the present invention.

[0044] Figures 2a and 2b are exploded perspective views showing the rear surface of the antenna device of Figures 1a and 1b, respectively.

[0045] Figure 3 is a perspective view of an assembled finger guard assembly that protects a heat dissipation mechanism from the outside according to one embodiment of the present invention.

[0046] FIG. 4 is a perspective view showing a manufacturing process of a heat dissipation device according to one embodiment of the present invention referenced in FIGS. 1a and 2a.

[0047] Figure 5 is a plan view showing a heat-conducting panel body among the components of a heat dissipation device according to one embodiment of the present invention.

[0048] FIG. 6 is a perspective view and a partially enlarged plan view of a heat dissipation mechanism according to one embodiment of the present invention referenced in FIGS. 1A and 2A;

[0049] Figure 7 is a plan view of Figure 6,

[0050] Fig. 8 is a cross-sectional view taken along line BB of Fig. 7.

[0051] Fig. 9 is a perspective view showing a heat dissipation mechanism according to another embodiment of the present invention.

[0052] Figure 10 is an exploded perspective view of Figure 9.

[0053] Figure 11 is a cutaway perspective view (a) of Figure 9, an enlarged view (b) of a portion thereof, a cross-sectional view (c) of the portion thereof, and an enlarged view (d) of the portion thereof.

[0054] Figure 12 is a perspective view and an enlarged view of a portion thereof showing a vacuum part among the components of a heat dissipation device according to embodiments of the present invention.

[0055] Figure 13 is a cross-sectional view showing a vacuum process using a vacuum unit among the configurations of a heat dissipation device according to embodiments of the present invention.

[0056] Fig. 14 is a partial cutaway perspective view of Fig. 13,

[0057] FIG. 15 is a perspective view and an enlarged cross-sectional view of a vacuum section of another embodiment of a heat dissipation mechanism according to embodiments of the present invention.

[0058] Figure 16 is a flowchart for explaining a method of manufacturing a heat dissipation device according to embodiments of the present invention.

[0059] Figure 17 is a flowchart showing the detailed process of the vacuum process (SA) of Figure 16.

[0060] Figure 18 is a flowchart showing the detailed process of the remaining process (SB) of Figure 16.

[0061]

[0062] <Explanation of symbols>

[0063] 100: Antenna device 110: Heat dissipation housing body

[0064] 200: Heat dissipation device 1200: Heat dissipation device

[0065] 200-1: One-sided heat-conducting panel 200-2: Other-sided heat-conducting panel

[0066] 201: Press-fit end 203: Heat sink part

[0067] 210: First refrigerant path 215: Slant guide

[0068] 220: Second refrigerant flow path 230: Third refrigerant flow path

[0069] 240: Multiple strength reinforcements 300: Absorber

[0070] 301: Auxiliary absorber T: Any baseline

[0071] 1200: Heat dissipation device 2000: Vacuum unit

[0072] 2100: Air vent tube 2100S: Hollow

[0073] 2101: Tube body 2103: Hook step

[0074] 2103': Welded reinforcement 2200: Welded auxiliary ring

[0075] 2300: Solder part

[0076]

[0077] Hereinafter, one embodiment of a heat dissipation device and a manufacturing method thereof according to the present invention will be described in detail with reference to the attached drawings.

[0078] When assigning reference numerals to components in each drawing, it should be noted that identical components are assigned the same numerals whenever possible, even if they appear on different drawings. Furthermore, when describing embodiments of the present invention, if a detailed description of a related known configuration or function is deemed to hinder understanding of the embodiments of the present invention, the detailed description will be omitted.

[0079] In describing components of embodiments of the present invention, terms such as first, second, A, B, (a), and (b) may be used. These terms are only intended to distinguish the components from other components, and the nature, order, or sequence of the components are not limited by these terms. Furthermore, unless otherwise defined, all terms used herein, including technical or scientific terms, have the same meaning as commonly understood by a person of ordinary skill in the art to which the present invention pertains. Terms defined in commonly used dictionaries should be interpreted as having a meaning consistent with the meaning they have in the context of the relevant technology, and shall not be interpreted in an idealized or overly formal sense unless explicitly defined in this application.

[0080]

[0081] FIGS. 1A and 1B are perspective views showing two examples of the rear surface of an antenna device having a heat dissipation mechanism installed according to embodiments of the present invention, FIGS. 2A and 2B are exploded perspective views showing the rear surface of the antenna device of FIGS. 1A and 1B, respectively, and FIG. 3 is a perspective view showing an assembled finger guard assembly that protects a heat dissipation mechanism from the outside according to one embodiment of the present invention.

[0082] In general, heat generating devices (electronic devices) are manufactured in various forms throughout the industry, but the applicant of the present invention is a company engaged in the manufacturing of other wireless communication equipment, and in explaining the heat dissipation mechanism according to one embodiment of the present invention, an antenna device (100) that is very familiar to the applicant of the present invention as a representative heat generating device (electronic device) that is a heat dissipation target will be described as a specific example.

[0083] However, it should be noted that the heat dissipation mechanism according to the embodiments of the present invention described below should not necessarily be interpreted as being limited to the antenna device (100), and that the specific terms 'antenna device (100)' and 'parts related thereto' used below should all be interpreted as concepts including all similar electronic devices and parts thereof.

[0084] First, let's look at the antenna device (100) employed as an example of a representative electronic device.

[0085] An antenna device (100) to which a heat dissipation mechanism (200) according to embodiments of the present invention is applied includes a heat dissipation housing body (110) formed in a rectangular parallelepiped shape that forms a receiving space opened forward and has a front-to-back receiving width that is approximately long and thin in the vertical direction, as shown in FIGS. 1A and 1B.

[0086] Here, the heat dissipation housing body (110) is provided with a sturdy material so as to provide an installation location (internal space) for various internal components described later and to protect the internal components against external impacts. In particular, it is preferable to be provided with a metal material having excellent thermal conductivity so as to be able to dissipate heat generated during system operation to the outside by utilizing the thermal conductivity properties of the material itself.

[0087] Inside the receiving space of the heat dissipation housing body (110), although not shown in the drawing, a main board with a plurality of MBF (Micro Bellows Filter) elements mounted on the front via a clamshell as a substrate for a PAU (Power Amplifier Unit) and a DTU (Digital Transceiver Unit) and a type of heat generating element mounted on the back can be stacked.

[0088] Here, components defined as heat-generating elements (not shown) that generate a large amount of heat during operation, such as RFIC elements or PA elements, may be mounted on the main board. However, it should be noted that in the embodiment of the present invention, the description is made by adopting an electronic device as the antenna device (100), and the heat-generating elements are not limited to the above configuration. For example, the heat-generating elements may also be adopted as semiconductors, which are representative heat-generating elements.

[0089] A radome panel (50) is installed on the front of the receiving space of the heat-dissipating housing body (110), which can protect the radiating elements implemented as antenna elements from the outside and at the same time ensure smooth radiation from the radiating elements.

[0090] Here, the radome panel (50) is formed of a non-conductive material through which the radiation beam of the radiating elements can easily pass, and can be classified as a component that hinders the heat dissipation of the system operation heat generated in the receiving space of the heat dissipation housing body (110) toward the front side. Accordingly, the heat dissipation housing body (10) itself is designed to be longer in the vertical direction in order to increase the heat dissipation surface area for concentrated heat dissipation toward the rear side of the heat dissipation housing body (110).

[0091] Meanwhile, a heat dissipation mechanism (200, 1200) according to embodiments of the present invention may be installed on the back surface of the heat dissipation housing body (110).

[0092] The heat dissipation device (200, 1200) according to embodiments of the present invention is provided in the form of a heat dissipation fin, and is characterized by being provided in the form of a thin vapor chamber type that essentially includes an absorber (300) that absorbs liquid refrigerant among refrigerants, unlike the fixed heat dissipation fins (200F, 200F-1, 200F-2) shown in FIGS. 1A and 1B.

[0093] Typically, a well-known (already known) vapor chamber is typically equipped with a wick member having a wick structure in which a plurality of pores are formed. The wick member here may be manufactured by sintering a metal powder so that a plurality of pores are formed through which a liquid refrigerant filled inside a panel member made of a heat-conductive material moves toward the side equipped with the heating element by capillary force, while a gaseous refrigerant can freely flow to the outside.

[0094] However, the above wick member is not limited to the wick member made of the sintered metal material described above, and may be defined as a concept including all possible materials, such as fiber materials, regardless of any name, such as the absorbent (300), to the extent that it can promote absorption and dispersion or vaporization of liquid refrigerant. This will be described in more detail later.

[0095] Meanwhile, the heat dissipation device (200, 1200) according to embodiments of the present invention can be manufactured in two different manufacturing methods.

[0096] That is, the heat dissipation device (200, 1200) according to embodiments of the present invention includes a heat-conducting panel body (200-1, 200-2, 1200-1, 1200-2) having a refrigerant flow space (205, 1205) in which a refrigerant is filled therein and flows while changing phases. In one embodiment, as shown in FIGS. 1A and 2A, a heat-conducting panel body (200-1, 200-2) formed of a single metal panel member is manufactured by bending it through a bending process and then joining the edge end portions excluding the bending portion. In another embodiment, as shown in FIGS. 1B and 2B, a heat-conducting panel body (1200-1, 1200-2) formed of two metal panel members is manufactured by joining them directly without a bending process.

[0097] Meanwhile, the heat dissipation device (200, 1200) according to one embodiment of the present invention may further include a finger guard assembly (60) that is provided to surround a portion of the rear side and upper side of the heat dissipation housing body (110) to block access of an external object (or person) to the heat dissipation device (200, 1200), as shown in (a) and (b) of FIG. 3.

[0098] The finger guard assembly (60) comprises a rear finger guard panel (61) vertically arranged to cover the entire rear end of the heat dissipation device (200, 1200), an upper upper finger guard panel (62) having a rear end coupled to the upper end of the rear finger guard panel (61) and a front end horizontally extended forward, a right finger guard panel (63) having a front end coupled to the right rear end of the heat dissipation housing body (110) and a rear end coupled to the right end of the rear finger guard panel (61), and arranged to cover the rear right portion of the heat dissipation housing body (110), a left finger guard panel (64) having a front end coupled to the left rear end of the heat dissipation housing body (110) and a rear end coupled to the left end of the rear finger guard panel (61), and arranged to cover the rear left portion of the heat dissipation housing body (110), and an upper upper finger guard It may include an upper front finger guard panel (65) arranged to cover between the front end of the panel (62) and the front upper portion of the heat dissipation housing body (110).

[0099] Here, the right finger guard panel (63) and the left finger guard panel (64) may include an upper side guard panel installed on the upper side with respect to the clamping bracket (5) described later and a lower side guard panel installed on the lower side with respect to the clamping bracket (5).

[0100] Meanwhile, the finger guard assembly (60) may further include a guard mounting bar (66, 67, 68) that provides a predetermined screw fastening hole (not indicated in the drawing symbol) for screw connection at each corner portion and reinforces the rigidity of the corner portion.

[0101] Here, the rear finger guard panel or front finger guard panel (61 to 65) described above may be made of plastic material to reduce the weight of the entire antenna device (100), and the guard mounting bars (66, 67, 68) described above may be manufactured and provided in the form of an aluminum extrusion bar to reinforce rigidity.

[0102] The guard mounting bars (66, 67, 68) may further include a front guard mounting bar (66) provided between the upper upper surface finger guard panel (62) and the upper front finger guard panel (65) and providing a plurality of screw fastening holes, a rear guard mounting bar (67) provided between the upper upper surface finger guard panel (62) and the rear finger guard panel (61) and providing a plurality of screw fastening holes, and a lower guard mounting bar (68) provided at the lower end of the rear finger guard panel (61) and having a plurality of screw fastening holes formed therein.

[0103] In addition, the finger guard assembly (60) must be able to allow air (outside air) from the external space to flow in for heat exchange with the heat dissipation device (200, 1200) provided inside, so that a plurality of ventilation holes (not indicated in the drawing) in the form of a mesh (or grid) can be formed.

[0104] A finger guard assembly (60) having such a configuration can be arranged to surround the entirety of the heat dissipation mechanism (200, 1200) coupled to the rear surface of the heat dissipation housing body (110), as shown in FIG. 3, except for the lower portion.

[0105] Meanwhile, a clamping bracket (5) that mediates mounting to a not-shown support pole can be installed on the left and right ends of the heat dissipation housing body (110) to surround the outer surface of the rear finger guard panel (61) of the finger guard assembly (60) described above.

[0106] The clamping bracket (5) not only mediates the mounting to the support pole as described above, but also can function as a handle that allows a worker on site to hold and move the antenna device (100) by hand, and a hole-shaped handle hole (6) can be formed on the left and right ends to facilitate the holding.

[0107] Hereinafter, a heat dissipation mechanism (200) according to one embodiment of the present invention will be described in detail with reference to FIGS. 1A, 2A, and 4 to 8, and a heat dissipation mechanism (1200) according to another embodiment of the present invention will be described in detail with reference to FIGS. 9 to 11.

[0108] FIG. 4 is a perspective view showing a manufacturing process of a heat dissipation mechanism according to an embodiment of the present invention referred to in FIGS. 1A and 2A, FIG. 5 is a plan view showing a heat conductive panel body among the components of a heat dissipation mechanism according to an embodiment of the present invention, FIG. 6 is a perspective view and a partially enlarged plan view of a heat dissipation mechanism according to an embodiment of the present invention referred to in FIGS. 1A and 2A, FIG. 7 is a plan view of FIG. 6, and FIG. 8 is a cross-sectional view taken along line BB of FIG. 7.

[0109] First, a heat dissipation device (200) according to one embodiment of the present invention will be described in detail as follows.

[0110] That is, as referenced in FIGS. 1A and 2A, on the back surface of the heat dissipation housing body (110), a plurality of heat dissipation devices (200) according to one embodiment of the present invention can be arranged so as to be inclined upward toward the left and right ends, respectively.

[0111] Meanwhile, the heat dissipation mechanism (200) according to embodiments of the present invention is provided in a plurality of pieces, but is formed in the same rectangular shape with the same length, so that the fixed heat dissipation fins (200F-1, 200F-2) can be arranged on the rear surface portion of the heat dissipation housing body (100) that is not occupied by the heat dissipation mechanism (200).

[0112] Here, the fixed heat dissipation fins (200F-1, 200F-2) may include an upper fixed heat dissipation fin (200F-1) disposed on the upper side of the rear surface of the heat dissipation housing body (110) that is not occupied by the heat dissipation mechanism (200) according to embodiments of the present invention, as referenced in FIGS. 1A and 2A, and a lower fixed heat dissipation fin (200F-2) disposed on the lower left and right sides of the rear surface of the heat dissipation housing body (110) that is not occupied by the heat dissipation mechanism (200) according to embodiments of the present invention.

[0113] It should be noted in advance that, unlike the heat dissipation mechanism (200) according to one embodiment of the present invention, the upper fixed heat dissipation fin (200F-1) and the lower fixed heat dissipation fin (200F-2) are configured to transfer heat according to the thermal conductivity of the metal material itself, without being filled with a refrigerant inside.

[0114] However, it is not necessary for the fixed heat dissipation fins (200F-1, 200F-2) to be provided separately at the upper and lower portions as shown in FIGS. 1A and 2A, and it may also be possible for the fixed heat dissipation fins (200F) to be provided only at the lower portion not occupied by the heat dissipation device (1200), as in the heat dissipation device (1200) according to another embodiment of the present invention.

[0115] Meanwhile, on the back surface of the heat dissipation housing body (110), a press-fit portion (150) may be formed for press-fitting installation of a heat dissipation mechanism (200) according to an embodiment of the present invention, which is provided in multiple pieces, as shown in FIGS. 1A and 2A.

[0116] As described above, the heat dissipation device (200) according to one embodiment of the present invention may also be provided with a plurality of press-in portions (150) in that they are arranged to be inclined upward toward the left and right ends with respect to the center (see drawing symbol 170), and may be arranged to form a 'V' shape with respect to the center (see drawing symbol 170).

[0117] That is, the heat dissipation mechanism (200) according to one embodiment of the present invention can be press-fitted (forced-fit) to a plurality of press-fit portions (150) formed on the back surface of the heat dissipation housing body (110), as shown in FIGS. 1A and 2A.

[0118] At this time, although not shown in the drawing, it is preferable to press-fit the press-fit portion (150) after thermal epoxy treatment to improve heat transfer efficiency.

[0119] Here, the press-fit portion (150) may be arranged to pass through at least one of the heat-generating surfaces (not shown) formed to protrude and sink backward so that the heat-generating surfaces of the heat-generating elements (140) are accommodated on the inner surface corresponding to the back surface of the heat-radiating housing body (110).

[0120] A heat dissipation device (200) according to one embodiment of the present invention includes a heat-conducting panel body (200-1, 200-2) having a refrigerant flow space (205) filled with refrigerant therein and providing a space in which the refrigerant circulates in a gas-liquid manner to release heat while changing phases within a closed space, as shown in FIGS. 4 to 8.

[0121] Here, the heat conductive panel body (200-1, 200-2) is a single metal panel member that can be formed in a predetermined manner to form a refrigerant flow space (205).

[0122] In particular, a heat dissipation device (200) according to one embodiment of the present invention can directly form at least a first refrigerant flow path (210) described later among refrigerant flow spaces in which refrigerant is filled and flows through a bending process among predetermined methods.

[0123] That is, the first refrigerant passage (210) is a portion of a single metal panel member that is shaped by bending in the above-described manner, and is formed so that liquid refrigerant among the refrigerants is filled in with a distance corresponding to the material thickness of the metal panel member between the heating element (140) or the press-fit portion (150) equipped with the heating element (140).

[0124] More specifically, a heat dissipation device (200) according to one embodiment of the present invention can be manufactured so that a sealed refrigerant flow space (205) is formed inside by bending a single heat-conducting panel body (200-1, 200-2) with respect to a predetermined arbitrary reference line (T) described later (bending process (S20)) and then joining them (joining process (S40)).

[0125] However, the manufacturing method of the heat dissipation device according to the present invention is not necessarily limited to the bending manufacturing method of the above-described embodiment (200).

[0126] That is, as described above, a method of manufacturing a heat dissipation device (1200) according to another embodiment of the present invention in which a sealed refrigerant flow space (1205) is formed inside by bonding two separated metal panel members (bonding process (S40)) is also possible. This will be described in more detail later.

[0127] Here, the refrigerant flow space (205) may include the first refrigerant flow path (210) as described above, which is provided at a portion located relatively lower in the direction of gravity.

[0128] The first refrigerant passage (210) can be defined as a refrigerant filling and flow space in which liquid refrigerant is filled, with a distance corresponding to the material thickness of the metal panel member between the press-fit portion (150) provided with heat generating elements (heating elements) and the portion that has been shaped through the bending (bending process (S20)).

[0129] Specifically, the above-mentioned separation distance refers to the distance between the first refrigerant passage (210) and the press-fit portion (150) equipped with heat generating elements, and the above-mentioned separation distance may be the material thickness of the metal panel member.

[0130] However, the definition of the first refrigerant passage (210) in the heat dissipation device (200) according to one embodiment of the present invention will be significant in that it includes a common technical configuration as an evaporation area, which is a widthwise end portion of the first refrigerant passage (210) that receives heat from a heating element (140) that is a heat dissipation target through a heat-conducting panel body (200-1, 200-2).

[0131] In addition, in the heat dissipation device (200) according to one embodiment of the present invention, the refrigerant flow space (205) may further include a plurality of second refrigerant passages (220) that induce the flow of liquid refrigerant toward the first refrigerant passage (210).

[0132] Here, when the area where the first refrigerant passage (210) is provided, and the area formed through the bending (bending process) is defined as an evaporation area where the liquid refrigerant among the refrigerants evaporates, and the area remaining outside the evaporation area is defined as a condensation area, the second refrigerant passage (220) can be provided in the condensation area.

[0133] In this case, a plurality of second refrigerant passages (220) are formed within the condensation area excluding the first refrigerant passage (210), and the liquid refrigerant condensed from a gaseous state to a liquid state from the other end in the width direction of the heat conductive panel body (200-1, 200-2) can act as a flow path toward the first refrigerant passage (210) by surface tension or gravity.

[0134] More specifically, when the gaseous refrigerant (gaseous refrigerant) condenses into a liquid refrigerant (liquid refrigerant) through a heat exchange process with the outside air in the condensation area, the volume gradually increases at a location within the refrigerant flow space (205) where condensation takes place, and when it flows down in the direction of gravity, a flow path is provided to supply a uniform amount of liquid refrigerant toward the first refrigerant flow path (210).

[0135] In particular, the second refrigerant passage (220) can be defined between a plurality of inclined guides (215), as described below, and when the liquid refrigerant that has been condensed in the condensation region flows toward the first refrigerant passage (210), the dispersion flow can be suppressed toward the second refrigerant passage (220) adjacent to the second refrigerant passage (220), which is a magnetic flow path, due to surface tension. That is, since the plurality of inclined guides (215) have a narrower flow space than the second refrigerant passage (220), the surface tension acts to suppress the flow toward the adjacent second refrigerant passage (220).

[0136] In addition, a plurality of second refrigerant passages (220) can be defined between a plurality of inclined guides (215) that are symmetrically formed to protrude inwardly from the facing surfaces of the heat-conducting panel bodies (200-1, 200-2) into the refrigerant flow space.

[0137] More specifically, the plurality of second refrigerant passages (220) are defined as spaces between a plurality of inclined guides (215) formed on the same surface of each identical heat-conducting panel body (200-1 or 200-2) among the heat-conducting panel bodies (200-1, 200-2), and are a concept distinct from the third refrigerant passage (230) defined as spaces between a plurality of inclined guides (215) formed to protrude and face each other in a direction in which the thickness decreases toward the refrigerant flow space (205) of the heat-conducting panel body (200-1, 200-2) described later.

[0138] Referring to (a) of FIG. 4, a heat dissipation device (200) according to one embodiment of the present invention can simultaneously form the first refrigerant flow path (210) and the second refrigerant flow path (220) and a plurality of inclined guides (215) described below for implementing them, by using a heat-conducting panel body (200-1, 200-2) made of a single member of a predetermined heat-conductive material through a pressing process (S10) described below.

[0139] At this time, if the thermal conductive panel body (200-1, 200-2) is formed as a rectangle with a width in the left-right direction smaller than the length in the up-down direction in the drawing of Fig. 4, the arbitrary reference line (T) is arranged to cross the center of the left and right ends in the up-down direction, and can be a reference for the bending process described later (see Fig. 4 (b) and (c)).

[0140] Referring to (b) and (c) of FIG. 4, a heat-conducting panel (200-1) on the left side and a heat-conducting panel (200-2) on the right side can be bent using a bending jig (not shown) so that they are in contact with each other based on an arbitrary reference line (T).

[0141] At this time, in addition to the first refrigerant passage (210) and the second refrigerant passage (220), a third refrigerant passage (230) additionally formed according to the embodiment can be formed, and a plurality of strength reinforcing parts (240) required for the bonding process (S40, see (d) of FIG. 3) described later can be formed to face each other.

[0142] Referring to (d) of FIG. 4, when one side of the thermal conductive panel (2001-1) and the other side of the thermal conductive panel body (2001-2) are mutually contacted, they are mutually contacted using a predetermined contact method along the edge ends, and then each of the plurality of mutually contacted strength reinforcing parts (240) can be mutually contacted using a predetermined contact method.

[0143] At this time, one end and the other end of the first refrigerant passage (210) formed through the bending process (S20) can be formed to be in communication with the refrigerant flow space (205) and the outside, and the remaining portion (heat sink portion (203)) can be sealed so that the refrigerant flow space is completely blocked from the outside.

[0144] More specifically, a heat dissipation device (200) according to one embodiment of the present invention, as referenced in FIG. 5, includes a heat-conducting panel body (200-1, 200-2) including a heat-conducting panel (200-1) on one side forming a left end before the bending process (S20) and a heat-conducting panel (200-1) on the other side forming a right end before the bending process (S20), based on an arbitrary reference line (T) defined in a straight line shape in the up-down direction. Here, it is sufficient to understand that the heat-conducting panel (200-1) on one side and the heat-conducting panel (200-1) on the other side define the heat-conducting panel body (200-1, 200-2) before the bending process (S20).

[0145] However, the thermal conductive panel body (200-1, 200-2) can be redefined as a configuration after the bending process (S20) described later.

[0146] For example, the heat conductive panel body (200-1, 200-2) is a part formed by the bending process (S20) and the bonding process (S40) described below, and can be defined as including a press-fit end (201) that is press-fitted to the press-fit part (150) formed to be inclined upward to the left and right, respectively, with respect to the center of the back surface of the heat conductive housing body (110) as the heat dissipation target (see reference numeral 170 of FIG. 2A), and a heat dissipation plate part (203) that performs heat dissipation according to the phase change of the refrigerant as the edge end of the heat conductive panel body (200-1, 200-2) excluding the press-fit end (201).

[0147] However, it is preferable that the heat sink portion (203) be defined as all areas that perform heat dissipation after heat exchange with the refrigerant filled inside, excluding the above-described press-fit end portion (201).

[0148] Here, in the heat sink portion (203), a plurality of strength reinforcing parts (240) can be formed to protrude into the refrigerant flow space from the inner surface of one side heat-conducting panel (200-1) and the inner surface of the other side heat-conducting panel (200-2) spaced apart in the thickness direction.

[0149] In addition, as described later, a plurality of strength reinforcing members (240) are formed simultaneously with the second refrigerant passage (220), the third refrigerant passage (230) and the plurality of inclined guides (215) through a pressing process, and it can be understood that they are formed to be sunken from the outside to the inside of the heat sink member (203) when observed from the outside after the bending process (S20) and the bonding process (S40).

[0150] The first refrigerant passage (210) is located at the lower side based on the direction of gravity, and when the refrigerant that has been phase-changed into a liquid refrigerant (liquid refrigerant) flows downward along the direction of gravity in the refrigerant flow space, it can be defined as a passage that performs the role of uniformly moving and dispersing the liquid refrigerant throughout the entire evaporation area by capturing it and changing it into a gas phase by heat transferred from the heat generating elements (140) of the heat dissipation housing body (110).

[0151] At this time, the uniform movement and distribution of the liquid refrigerant among the functions of the first refrigerant passage (210) may be a concept meaning transporting the liquid refrigerant in a direction different from the direction of gravity at least by the absorber (300) described below. This will be described in more detail in the description of the absorber (300).

[0152] By inserting and installing an absorbent (300) described later into the interior of the first refrigerant passage (210), it is possible to promote the capture and dispersion of the liquid refrigerant described above, and its transport in a direction different from the direction of gravity.

[0153] Here, the first refrigerant flow path (210) can be formed symmetrically in the thickness direction of the refrigerant flow space with respect to an arbitrary reference line (T) after the above-described bending process (S40).

[0154] In this way, the heat conductive panel body (200-1, 200-2) may be formed by bending the heat conductive panel (200-1) on one side and the heat conductive panel (200-2) on the other side with reference to an arbitrary reference line (T), as shown in FIGS. 5 and 6, to form a first refrigerant flow path (210) internally, and to have a press-fit end (201) coupled to a press-fit portion (150) formed on the back surface of the heat dissipation housing body (110) as a heat dissipation target externally.

[0155] In addition, the heat-conducting panel body (200-1, 200-2) may further include a heat sink portion (203) defined as the remaining portion excluding the press-fit end portion (201), as defined above.

[0156] The heat sink part (203) can seal the refrigerant flow space (205) by bonding the edges of one side heat-conducting panel (200-1) and the other side heat-conducting panel (200-2) to each other in a predetermined bonding manner after the bending process (S20).

[0157] The connection method herein may be either welding or bonding. Preferably, laser welding may be employed. However, laser welding is not required; any connection method may be employed as long as it provides a sealing strength sufficient to prevent leakage of the refrigerant contained within.

[0158] Meanwhile, the end portion of the press-fit end portion (201) inserted into the press-fit end portion (150) may be formed to have a semicircular round cross-section with a radius of R1, as shown in FIG. 6.

[0159] The outer surface of the press-fit end (201) having such a shape can be installed by press-fitting after thermal epoxy treatment on the press-fit end (150).

[0160] In addition, when the press-fit end (201) is inserted into the press-fit end (150), at least a portion of the first refrigerant passage (210) can flow into the inside of the tip of the press-fit end (150).

[0161] Meanwhile, the second refrigerant passage (220) can perform the role of inducing the refrigerant that has changed into a gaseous refrigerant (gaseous refrigerant) and flowed toward the heat sink (203), exchanged heat with the outside air, and then condensed back into a liquid refrigerant (liquid refrigerant) to naturally flow down toward the first refrigerant passage (210).

[0162] More specifically, the second refrigerant passage (220) is provided in a condensation area formed in a region other than the first refrigerant passage (210), as referenced in FIGS. 4 to 8, and can be defined between a plurality of inclined guides (215) that guide the flow of liquid refrigerant that has changed from a gaseous phase to a liquid phase to an evaporation area.

[0163] Here, a plurality of inclined guides (215) defining the second refrigerant flow path (220) may be provided in a form that protrudes toward the refrigerant flow space (205) from each inner surface of one side heat-conducting panel (200-1) and the other side heat-conducting panel (200-2) after the bending process (S20) described below, as referenced in FIG. 5.

[0164] The plurality of inclined guides (215) may be provided in a straight shape that is inclined downward in the direction of gravity toward the first refrigerant passage (210). Accordingly, the liquid refrigerant condensed on the side of the heat sink (203) can naturally coagulate and then flow down along the gap between the plurality of downwardly inclined inclined guides (215) toward the first refrigerant passage (210), thereby minimizing the interval of the gas-liquid circulation cycle corresponding to the phase change between the liquid refrigerant and the gaseous refrigerant, thereby playing a role in increasing the phase change speed.

[0165] Here, a plurality of second refrigerant passages (220) or a plurality of inclined guides (215) can be arranged so that adjacent second refrigerant passages (220) or inclined guides (215) are arranged in parallel to each other. In general, the flow of the condensed liquid refrigerant can be distributed through the second refrigerant passages (220) or inclined guides (215) that are arranged in parallel and densely and uniformly in a wide condensation area having a larger area than the evaporation area limited to the first refrigerant passage (210), thereby providing an advantage of heat dissipation through the entire condensation area (e.g., heat sink portion (203)) with uniform heat dissipation performance.

[0166] In addition, a plurality of inclined guides (215) may be formed on each of the one-side heat-conducting panel (200-1) and the other-side heat-conducting panel (200-2), but may be formed in a form in which each tip portion protruding toward the refrigerant flow space (205) is not joined but is spaced apart from each other within the refrigerant flow space (205).

[0167] In this way, the second refrigerant passage (220) preferably has a size in the thickness direction that allows the flow to be formed naturally in the direction of gravity without being stopped by surface tension, which is an inherent characteristic of the liquid, in that it performs the function of inducing the flow of the liquid refrigerant in the direction of gravity. In addition, the second refrigerant passage (220) can be formed so that, after the liquid refrigerant has coagulated to a predetermined size or more, the dispersion flow due to surface tension or gravity is suppressed toward the adjacent second refrigerant passage (220).

[0168] In addition, at least one of the first and second refrigerant passages (220) or the second refrigerant passages (215) is connected to the first refrigerant passage (210) at one end or the other end, and the end connected to the first refrigerant passage (210) is positioned relatively lower in the direction of gravity.

[0169] Furthermore, a plurality of second refrigerant passages (220) or a plurality of inclined guides (215) may be formed so that at least one of one end and the other end is connected to the first refrigerant passage (210), and the one end and the other end are connected in a straight line.

[0170] In this way, the distance between the first refrigerant passage (210) (i.e., one end) located closest to the heating elements and receiving heat from the heating elements and the outer end (i.e., the other end) of a plurality of second refrigerant passages (220) in which condensation actively takes place through heat exchange with the outside air is very short, and the second refrigerant passages (220) themselves are formed in an optimal shape that can minimize the overlapping length (flow resistance length) of the flow path of the liquid refrigerant and the flow path of the gaseous refrigerant through the straight shape of the second refrigerant passages.

[0171] Meanwhile, a plurality of inclined guides (215) can define a second refrigerant flow path (220) between each inclined guide (215) as a flow path that induces the flow of liquid refrigerant in the direction of gravity, as described above.

[0172] Here, the second refrigerant passage (220) defined by the adjacent interspace between a plurality of inclined guides (215) may be a refrigerant passage extending upwardly inclined from the first refrigerant passage (210) corresponding to the reference line (T) toward the width-wise end of the heat-conducting panel body (200-1, 200-2). This is to allow the liquid refrigerant liquefied on the heat sink portion (203) side to easily move by its own weight toward the first refrigerant passage (210) equipped with the absorber (300).

[0173] Meanwhile, the heat dissipation device (200) according to one embodiment of the present invention may further include a third refrigerant passage (230), as referenced in FIGS. 5 to 8.

[0174] Here, when the bending process and the bonding process are completed, the heat conductive panel body (200-1, 200-2) forms a refrigerant flow space (205) by bonding one side of one side of the heat conductive panel (200-1) and a part of one side of the other side of the heat conductive panel (200-2) with respect to an arbitrary reference line (T), and the refrigerant flow space (205) can form the first refrigerant flow path (210), the second refrigerant flow path (220), and the third refrigerant flow path (230) added according to the embodiment simultaneously with the bonding process (S40).

[0175] The second refrigerant flow path (220) is defined as being formed between a plurality of adjacent inclined guides (215) on each of the one-side heat-conducting panel (200-1) and the other-side heat-conducting panel (200-2), whereas the third refrigerant flow path (230) can be defined as a space between the inclined guide (215) formed on the one-side heat-conducting panel (200-1) and the inclined guide (215) formed on the other-side heat-conducting panel (200-2).

[0176] The third refrigerant passage (230) can serve to provide a gas passage for the refrigerant filled in the refrigerant flow space (205) to easily diffuse and flow throughout the entire heat sink section (203) after the refrigerant has been phase-changed into a gaseous refrigerant in the evaporation region, which is the first refrigerant passage (210). The gaseous refrigerant evaporated in the first refrigerant passage (210), which is the evaporation region, moves toward the heat sink section (203) and can be smoothly and evenly distributed through the third refrigerant passage (230) to perform heat dissipation and be condensed.

[0177] For example, when the liquid refrigerant flows naturally through the space between the inclined guides (215) adjacent to the second refrigerant passage (220), the gaseous refrigerant actively flows through the third refrigerant passage (230), which is a space not occupied by the liquid refrigerant.

[0178] However, this does not mean that the liquid refrigerant is completely separated from the gaseous refrigerant and is not occupied through the third refrigerant passage (230), but it is preferable to understand that the gaseous refrigerant flows more actively through the third refrigerant passage (230).

[0179] That is, the phase change of the refrigerant is not a process in which the liquid refrigerant and the gaseous refrigerant are completely separated, so it is difficult to define it precisely, but in general, the second refrigerant passage (220) may be a path through which the liquid refrigerant mainly flows, since the size in the thickness direction is relatively large, and the third refrigerant passage (230) may be a path through which the gaseous refrigerant mainly flows.

[0180] Meanwhile, a heat dissipation device (200) according to one embodiment of the present invention may further include a plurality of strength reinforcing parts (240) formed on at least one of a one-sided heat-conducting panel (200-1) and an other-sided heat-conducting panel (200-2), as shown in reference to FIGS. 4 to 8, and formed to protrude a predetermined length toward a refrigerant flow space (205) from the inner surface of the one-sided heat-conducting panel (200-1) and the other-sided heat-conducting panel (200-2), but formed to face each other.

[0181] A plurality of strength reinforcing members (240) are formed on at least one of a one-sided heat-conducting panel (200-1) and the other-sided heat-conducting panel (200-2) which are generally flat, and can serve to reinforce strength so as to prevent sagging or pressing due to external pressure.

[0182] Here, the plurality of strength reinforcement parts (240) may be formed so that the leading end surfaces protrude further than the leading ends of the plurality of inclined guides (215) into the refrigerant flow space (205) after bending at least in accordance with the bending process (S20). At this time, it is preferable that the amount by which the leading end surfaces of the plurality of strength reinforcement parts (240) protrude toward the refrigerant flow space (205) is at least such that the mutually facing portions of the one-sided heat-conducting panel (200-1) and the other-sided heat-conducting panel (200-2) can be mutually joined by a predetermined joining method during the joining process (S40) after the bending process (S20) described below. However, it is not necessary that the plurality of strength reinforcement parts (240) should be mutually joined after bending, and they may be mutually spaced apart within the refrigerant flow space, like the above-described inclined guides (215).

[0183] Meanwhile, the heat dissipation device (200) according to one embodiment of the present invention may further include an absorber (300) that absorbs liquid refrigerant among the refrigerant states induced through the second refrigerant passage (220) and then uniformly distributes the liquid refrigerant in the first refrigerant passage (210), as shown in FIGS. 4 and 8.

[0184] Here, the absorber (300) is a concept including a wick member having a wick structure provided inside a general vapor chamber, but is not limited thereto, and may be a concept including any material or configuration that can maximize heat dissipation performance by raising the limit of the heat conductive material of a heat dissipation fin formed in a conventional general heat sink fin type by capturing and transporting liquid refrigerant upward and downward on a first refrigerant passage (210) arranged at an angle with respect to the direction of gravity.

[0185] Meanwhile, the absorber (300) is preferably installed as close to the press-in end (201) as possible, as the closer it is to the press-in end (201), the more easily the liquid refrigerant can be actively transformed into a gaseous refrigerant by the heat transferred from the heat generating elements (140).

[0186] However, it is not necessary that the absorber (300) be installed only close to the pressurized end (201), and it is also possible to install it so that it is evenly distributed throughout the evaporation area where the refrigerant can evaporate.

[0187] However, in the case of the heat dissipation device (200) according to one embodiment of the present invention, the heat-conducting panel body (200-1, 200-2) provided as a single member is bent, and then the portions corresponding to the edge ends of the heat dissipation plate portion (203) are joined to each other, and then the absorber (300) is installed through the open portions at both ends on the side of the first refrigerant passage (210), so the evaporation area of ​​the refrigerant may be limited to the first refrigerant passage (210) for reasons related to the manufacturing method.

[0188] Here, the absorbent (300) may include any one of a nonwoven fabric that forms a plurality of pores (a type of wick structure) and a nonwoven fabric bonded to a braided body of copper wire material.

[0189] That is, the absorbent (300) may be adopted as a non-woven fabric made of a fiber material itself. In this case, since the non-woven fabric material itself is a very flexible material and, when liquid refrigerant is absorbed, it may be difficult to maintain its shape in the vertical direction due to the weight of the absorbed liquid refrigerant, a braided body made of copper wire is included in the non-woven fabric to maintain its shape, thereby stably fixing the non-woven fabric provided as the absorbent (300) on the first refrigerant passage (210) and preventing it from flowing.

[0190] In addition, the heat dissipation mechanism (200) according to one embodiment of the present invention may further include a plurality of absorbent fixing guides (250) formed simultaneously with the first to third refrigerant channels (210 to 230) and a plurality of inclined guides (215) or a plurality of strength reinforcing members (240) described above during the pressing process (S10), as referenced in FIG. 5.

[0191] A plurality of absorbent fixing guides (250) are formed to protrude toward the refrigerant flow space (205) to prevent the absorbent (300) adopted as a non-woven fabric from sagging in the direction of gravity when absorbing liquid refrigerant, and can play a role in stably fixing the absorbent (250) by pressing it when one side heat-conducting panel (200-1) and the other side heat-conducting panel (200-1) are bent by the bending process (S20).

[0192] In addition, a plurality of absorbent fixing guides (250) can simultaneously perform the function of securing a space for the evaporated gaseous refrigerant (gaseous refrigerant) to flow within the first refrigerant passage (210) by pressing the outer surface portion of the absorbent (300) adopted as a non-woven fabric.

[0193] In this way, an absorber (300) is installed inside the first refrigerant passage (210), so that the liquid refrigerant liquefied from the heat sink portion (203) moves to a region close to the heat generating elements (140) by the absorption force (or capillary force) of the absorber (300), and then the gaseous refrigerant that has undergone a phase change by the heat transferred from the heat generating elements (140) can move back to the heat sink portion (203).

[0194] The gaseous refrigerant moved toward the heat sink section (203) is smoothly and evenly distributed throughout the entire heat sink section (203) through the third refrigerant passage (230) to perform heat dissipation and is condensed, and the condensed liquid refrigerant can easily move toward the first refrigerant passage (210) in the direction of its own weight along the second refrigerant passage (220) which has a relatively large size in the thickness direction.

[0195] The heat generated from the heat generating elements (140) is preferentially transferred to the first refrigerant passage (210) where the absorber (300) is installed, and the refrigerant stored in the first refrigerant passage (210) where the absorber (300) is installed is mostly in a liquid state, and then changes into a gas phase by the heat transferred from the heat generating elements (140), and then flows to the entire heat dissipation plate (203) of the heat conducting panel body (200-1, 200-2) preferably through the third refrigerant passage (230) to perform heat dissipation.

[0196] Meanwhile, recent antenna devices to which Massive MIMO technology is applied are generally manufactured to be longer in the vertical direction than in the width direction, and in order to cover the heat generation of a plurality of heat generating elements (140) spaced apart in the vertical direction using a minimum number of heat dissipation devices (200), they must be manufactured to be as long as possible in the vertical direction.

[0197] However, if the heat-conducting panel body (200-1, 200-2) is formed long in one direction (e.g., in the direction of gravity), the length of the first refrigerant passage (210) in the direction of gravity cannot but also become long, and it is very difficult to sufficiently draw up and distribute the liquid refrigerant from the lower side in the direction of gravity to the upper end only with the absorption power of the absorbent body (300) itself, and since the absorption rate of the liquid refrigerant in the direction of gravity is different, the heat dissipation performance may also be uneven depending on the location.

[0198] In order to resolve such unevenness in heat dissipation performance, the heat dissipation mechanism (200) according to one embodiment of the present invention may further include an auxiliary absorber (301) arranged on some of a plurality of inclined guides (215) forming the second refrigerant flow path (220), as shown in FIG. 11 described below.

[0199] The auxiliary absorber (301) can play a role in inducing capture of liquid refrigerant on the upper side of the absorber (300) that is positioned relatively higher in the direction of gravity among the absorbers (300) arranged in the longitudinal direction.

[0200] That is, as referenced in Fig. 11, the liquid refrigerant that condenses and falls at the heat sink portion (203) located relatively upper in the direction of gravity is captured and then supplied to the upper portion of the absorber (300), thereby distributing and pulling up the liquid refrigerant from the position where the liquid refrigerant is supplied to the upper portion in the direction of gravity, thereby playing a role in supplementing the heat dissipation performance of the portion of the existing absorber (300) with low absorption rate.

[0201] In addition, since the high-temperature gaseous refrigerant that is generally evaporated from the lower side in the direction of gravity is concentrated and moved to the upper side of the refrigerant flow space, it may be difficult to dissipate the heat from the upper side of the refrigerant flow space due to the lack of sufficient condensation space (condensation area). The auxiliary absorber (301) performs the role of continuously supplying a portion of the liquid refrigerant flowing from the upper side to the lower side of the refrigerant flow space to the first refrigerant passage (210) corresponding to the upper side of the absorber (300), thereby enabling uniform heat dissipation overall.

[0202] However, the auxiliary absorber (301) illustrated in FIG. 11 is shown as a single unit for convenience of understanding, but it will be understood that a plurality of auxiliary absorbers (301) may be installed spaced apart from each other by a predetermined distance in the upper and lower directions in the direction of gravity, taking into consideration the size in the longitudinal direction of the heat dissipation device (200) according to one embodiment of the present invention.

[0203] FIG. 9 is a perspective view showing a heat dissipation mechanism according to another embodiment of the present invention, FIG. 10 is an exploded perspective view of FIG. 9, and FIG. 11 is a cut-away perspective view (a), a partial enlarged view (b) of FIG. 9, a cross-sectional view (c) of the corresponding portion, and a partial enlarged view (d) of FIG. 9.

[0204] Up to now, a detailed description has been given of a heat dissipation mechanism (200) according to one embodiment of the present invention, which is manufactured in a manufacturing method in which a single metal panel member is formed into a refrigerant flow space (205) through a bonding process (S40) after a bending process (S20), as referenced in FIGS. 1A and 2A and FIGS. 4 to 8.

[0205] However, the manufacturing method of the heat dissipation device of the present invention is not necessarily limited to the above-described bending process (S20), and below, as referenced in FIGS. 1b and 2b and FIGS. 9 to 11, a heat dissipation device (1200) according to another embodiment is proposed in which a coolant flow space (1205) including a first coolant flow path (1210) and a second coolant flow path (1220) is formed by joining two separated metal panel members by a joining method.

[0206] In a heat dissipation device (1200) according to another embodiment of the present invention, as referenced in FIGS. 9 to 11, a heat conductive panel body (1200-1, 1200-2) may be formed by bonding two separate metal panel members to form a refrigerant flow space (1205), and may include a one-side heat conductive panel (1200-1) that forms one side in the thickness direction of the refrigerant flow space (1205) after bonding, and an other-side heat conductive panel (1200-2) that forms the other side in the thickness direction of the refrigerant flow space (1205) after bonding.

[0207] Here, the first refrigerant passage (1210) and the second refrigerant passage (1220) can be formed symmetrically with respect to the joint surface of the one-side heat-conducting panel (1200-1) and the other-side heat-conducting panel (1200-2).

[0208] The joint surface of the one-sided heat-conducting panel (1200-1) and the other-sided heat-conducting panel (1200-2) can be defined as a boundary end that is a jointable area that includes both the press-fit end (1201) corresponding to the evaporation region and the heat-dissipating plate portion (1203) corresponding to the condensation region.

[0209] That is, in the case of a heat dissipation device (200, etc.) according to one embodiment of the present invention, the portion to be joined by the joining process (S40) described later is the edge end of the heat dissipation plate portion (203) excluding the press-fit end (201) side, which is the portion formed by the bending process (S20), and thus, it is to be noted in advance that there is a difference in some aspects from the joining portion of a heat dissipation device (1200) according to another embodiment of the present invention in which two separate metal panel members are joined and sealed.

[0210] Meanwhile, a heat dissipation device (1200) according to another embodiment of the present invention is installed in a press-fit portion (150) that is vertically arranged in the vertical direction on the back surface of the heat dissipation housing body (110), as shown in FIGS. 1B and 2B. Accordingly, the press-fit end portion (1201) corresponding to the front end and the outer end portion of the heat dissipation plate portion (1203) corresponding to the rear end can be mutually parallel.

[0211] In addition, a heat dissipation device (1200) according to another embodiment of the present invention may be further provided with an auxiliary absorbent (301) to improve the absorption rate of the liquid refrigerant of the absorbent (300), as shown in FIG. 9.

[0212] Here, the auxiliary absorber (301) also, in addition to performing the basic role of increasing the absorption rate of the absorber (300) itself, as in the heat dissipation device (200) according to one embodiment of the present invention described above, can also, as in the heat dissipation device (1200) according to another embodiment of the present invention, when it extends upwards beyond the upper portion of the heat dissipation housing body (110) so as to cover the upper portion thereof, perform the role of allowing the liquid refrigerant that has condensed on the side of the heat dissipation plate (1203) corresponding to the upper side of the heat dissipation housing body (110) to be easily captured and absorbed toward the upper portion of the absorber (300).

[0213] FIG. 12 is a perspective view and a partially enlarged view thereof showing a vacuum unit among the configurations of a heat dissipation device according to embodiments of the present invention, FIG. 13 is a cross-sectional view showing a vacuum process using a vacuum unit among the configurations of a heat dissipation device according to embodiments of the present invention, and FIG. 14 is a partially cut-away perspective view of FIG. 13.

[0214] The heat dissipation device (200, 1200) according to embodiments of the present invention may further include a vacuum unit (2000) provided in an air vent hole (1200-3) formed in one of the heat-conducting panels (200-1, 1200-1) on one side and the heat-conducting panel (200-2, 1200-2) on the other side, for vacuuming the refrigerant flow space (205, 1205) before or after filling the refrigerant into the refrigerant flow space (205, 1205), as shown in FIGS. 12 to 14.

[0215] It is sufficient to understand that the vacuum unit (2000) is an additional configuration provided for the vacuum process described below, which adjusts the internal pressure by venting air through an operation of pumping the air inside the heat-conducting panel body (200-1, 200-2, 1200-1, 1200-2) forming the refrigerant flow space (205, 1205).

[0216] Here, the vacuum unit (2000) may include an air vent tube (2100) that is hung from the inside to the outside of the air vent hole (1200-3) and protrudes outward by a predetermined length, and a welding auxiliary ring (2200) that is interposed on the outer surface of the air vent tube (2100) for welding and fixing the air vent tube (2100).

[0217] The air vent tube (2100) is provided in the shape of a hollow pipe, and serves as a passage for venting air through the hollow by connecting a pumping device (not shown).

[0218] Meanwhile, the welding auxiliary ring (2200) serves to provide a soldering location for the shielding solder portion (2300) to be installed, as it is difficult to directly weld the air vent hole (1200-3) itself because the thickness of the one-side heat-conducting panel (200-1, 1200-1) and the other-side heat-conducting panel (200-2, 1200-2) is very thin.

[0219] Conversely, if the thickness of one side heat-conducting panel (200-1, 1200-1) and the other side heat-conducting panel (200-2, 1200-2) is relatively large, the thickness itself can fix the air vent tube (2100), and thus the welding auxiliary ring (2200) can be excluded from the essential configuration.

[0220] However, in the case where the heat dissipation mechanism (200, 1200) according to embodiments of the present invention is limited to a case where the material of the metal panel member forming the heat-conducting panel body (200-1, 200-2, 1200-2, 1200-2) is adopted as SUS (stainless steel) material having an elongation that can be manufactured to a very thin thickness as described above, rather than the aluminum (Al) material that is commonly used, the welding auxiliary ring (2200) can have the meaning of an essential component.

[0221] For reference, although aluminum is a metal material with the advantage of excellent thermal conductivity, it has the problem of limiting the refrigerant filled in the refrigerant flow space (205, 1205).

[0222] For example, when the heat-conducting panel body is manufactured using a metal panel member made of aluminum, if the refrigerant is water (including natural water, distilled water, or ultrapure water) and filled in the refrigerant flow space (1205), there is a problem in that a predetermined chemical reaction occurs to generate hydrogen gas through contact with water.

[0223] Therefore, in the heat dissipation mechanism (200, 1200) according to embodiments of the present invention, since the heat conductive panel body (200-1, 200-2, 1200-2, 1200-2) is manufactured using a metal panel member made of SUS material that can use water as a refrigerant, a welding auxiliary ring (2200) may be essential for smooth installation during the vacuum process (SA) through the air vent tube (2100) described above.

[0224] In addition, when the material of the heat-conducting panel body (200-1, 200-2, 1200-2, 1200-2) is limited to SUS, as described above, when the press-fit end (201) is inserted into the press-fit portion (150) formed on the back surface of the heat-dissipating housing body (110), it has the advantage of being able to process so that at least a part of the first refrigerant flow path (210) can flow into the inside of the front end of the press-fit portion (150).

[0225] In this way, when the heat-conducting panel body (200-1, 200-2, 1200-2, 1200-2) is manufactured from SUS material, the elongation that directly affects processing is very good, so that the first refrigerant passage (210, 1210) in which the refrigerant (liquid refrigerant) that performs the actual heat conduction role is collected is provided as close as possible to the heat-generating elements (140), so that even if it is not manufactured from aluminum material with relatively excellent thermal conductivity, there is an advantage of having heat dissipation performance that is sufficient to overcome the relative disadvantage of the thermal conductivity.

[0226] For reference, in the case of pure aluminum material, the elongation is much better than that of SUS material, but when aluminum is manufactured using an alloy method to secure material strength, the processability is reduced, and in the case of SUS material, it may be possible to process a thinner thickness than when forming a heat-conducting panel body (200-1, 200-2, 1200-1, 1200-2) with an alloy aluminum material.

[0227] In this way, when manufacturing a heat-conducting panel body (200-1, 200-2, 1200-1, 1200-2) with a thin thickness using SUS material, a welding auxiliary ring (2200) to assist in the welding installation of the air vent tube (2100) described above must be adopted as an essential component.

[0228] Here, the air vent tube (2100) may include a tube body (2101) in the shape of a pipe having a hollow portion (2100S), as shown in FIGS. 13 and 14, and a catch step portion (1203) having an outer circumference size that is positioned in a refrigerant flow space (1205) of the tube body (2101) and catches the edge portion of the air vent hole (1200-3).

[0229] Since the length of such an air vent tube (2100) is at least greater than the thickness formed by the refrigerant flow space (1205), it can be installed so that it penetrates the air vent hole (1200-3) on the inside of a heat-conducting panel (in FIGS. 13 and 14 , the one-sided heat-conducting panel (200-1, 1200-1) corresponds to this) in which the air vent hole (1200-3) is formed in advance before the bonding process (S40) described later and protrudes outward by a predetermined length, and the engaging step (1203) is engaged with the edge end of the air vent hole (1200-3) at a portion corresponding to the inside of the refrigerant flow space (1205).

[0230] Afterwards, the welding auxiliary ring (2200) described above is inserted into the outer surface of the tube body (2101) protruding outside the air vent hole (1200-3), and then an air vent process (SA-20) using the tube body (2101) of the air vent tube (2100) can be performed using a pumping device.

[0231] In particular, the welding auxiliary ring (2200) can be fixed in close contact with the outer surface of one of the heat-conducting panels (200-1, 1200-1) and the other heat-conducting panel (200-2, 1200-2) in which the air vent hole (1200-3) is formed, as shown in FIGS. 13 and 14.

[0232] Meanwhile, the vacuum unit (2000) may further include a shielding solder unit (2300) that is soldered to shield the hollow portion (2100S) of the tube body (2101) after the tube body (2101) is cut to match the outer end of the welding auxiliary ring (2200), as shown in (b) of FIG. 13 and (b) of FIG. 14.

[0233] Here, it is preferable that the shielding solder portion (2300) be soldered so as to cover both the outer end of the welding auxiliary ring (2200) and the hollow portion (2100S) of the tube body (2101). This is to prevent the air vent tube (2100) from being separated and detached from the inside of the air vent hole (1200-3) after installation.

[0234] FIG. 15 is a perspective view and an enlarged cross-sectional view of a portion thereof showing a vacuum section of another embodiment of a heat dissipation mechanism according to embodiments of the present invention.

[0235] The vacuum unit (2000) described with reference to FIGS. 12 to 14 is installed such that it protrudes outward by a predetermined length through the air vent hole (1200-3) formed in advance on the inside of the heat-conducting panel (200-1, 1200-1) before the bonding process, and the engaging step (1203) is engaged with the edge end of the air vent hole (1200-3) at a location corresponding to the inside of the refrigerant flow space (1205).

[0236] This is to increase the fixing force by the solder caulking process (SA-40) described later by additionally interposing a welding auxiliary ring (2200) on the air vent tube (2100), but it is not necessary to have the welding auxiliary ring (2200) described above.

[0237] That is, as referenced in FIG. 15, the vacuum unit (2000) may be configured such that the welding reinforcement unit (2103') corresponding to the above-described welding auxiliary ring (2200) is integrally formed with the tube body (2101) and the joining directions thereof are different.

[0238] More specifically, the vacuum unit (2000) includes an air vent tube (2100) that is hung inward from the outside of the air vent hole (1200-3) and protrudes outward by a predetermined length, as shown in FIG. 15, and the air vent tube (2100) may include a tube body (2101) in the shape of a hollow pipe and a welded reinforcement part (2103') that is integrally formed to protrude with a relatively larger outer diameter with respect to the tube body (2101).

[0239] Here, since the outer diameter of the welded reinforcement part (2103') is relatively larger than the outer diameter of the tube body (2101), when the tube body (2101) is installed from the outside to the inside through the air vent hole (1200-3), it may be caught on the outer edge of the air vent hole (1200-3).

[0240] At this time, a space may be formed between the outer edge of the welded reinforcement portion (2103') and a portion of the edge of the air vent hole (1200-3), into which a fixed solder portion (2301), described later, is soldered. To this end, a tapered portion (2104) may be formed in a portion of the welded reinforcement portion (2103') adjacent to the air vent hole (1200-3) so that a space is formed between the outer edge of the air vent hole (1200-3) and the portion of the edge, into which a filler metal can be applied.

[0241] That is, the vacuum unit (2000) may further include a shielding solder unit (2300) soldered with a filler metal to shield the hollow portion of the tube body (2101) after the tube body (2101) is cut to match the outer end of the welding reinforcement unit (2103'), as shown in FIG. 15, and a fixing solder unit (2301) soldered with a filler metal to fix the space between the welding reinforcement unit (2103') and the outer edge portion of the air vent hole (1200-3).

[0242] According to the vacuum unit (2000) according to this modified example, since it can be installed from the outside even after the bonding process of the one-side heat-conducting panel (200-1) and the other-side heat-conducting panel (200-2), the installation process can be simplified, and it has the advantage of being stably fixed by the shielding solder unit (2300) and the fixed solder unit (2301).

[0243] However, the vacuum unit (2000) according to the modified example may also be formed by any method, and a catch (2105) may be formed to prevent arbitrary separation (detachment) to the outside even after being fixed to an air vent hole (1200-3) formed in one of the one-side heat-conducting panel (1200-1) and the other-side heat-conducting panel (1200-2) through a solder fixing process (SA-30).

[0244] The catch (2105) in the vacuum part (2000) according to the modified example not only serves to prevent arbitrary separation to the outside, but also serves to reinforce rigidity by melting between the welding reinforcement part (2103') and the air vent hole (1200-3) when the filler material forming the fixed solder part (2301) is melted, thereby further improving the bonding area.

[0245] FIG. 16 is a flowchart for explaining a method of manufacturing a heat dissipation device according to embodiments of the present invention, FIG. 17 is a flowchart showing a detailed process of the vacuum process (SA) of FIG. 16, and FIG. 18 is a flowchart showing a detailed process of the remaining process (SB) of FIG. 16.

[0246] A method for manufacturing a heat dissipation device according to embodiments of the present invention sequentially includes a pressing process (S10), a bonding process (S40), and a refrigerant filling process (S50).

[0247] First, a manufacturing method of a heat dissipation device (200) according to one embodiment of the present invention, which further includes a bending process (S20), will be described as follows.

[0248] A method for manufacturing a heat dissipation device (200) according to one embodiment of the present invention includes a pressing process (S10) of pressing a heat-conductive panel body (200-1, 200-2) made of a heat-conductive material as a single member so that a first refrigerant passage (210), a second refrigerant passage (220), and a third refrigerant passage (230) are sunken to a predetermined depth, respectively.

[0249] The press process (S10) can be defined as a process for manufacturing a single heat-conducting panel body (200-1, 200-2) equipped with the same standard and specification so that the first to third refrigerant channels (210 to 230) and a plurality of strength reinforcement parts (240) are symmetrically formed when mutually bent, as shown in FIG. 4.

[0250] Meanwhile, a method for manufacturing a heat dissipation device (200) according to one embodiment of the present invention may include, after a pressing process (S10), a bending process (S20) of folding a heat-conducting panel (200-1) on one side in the width direction and a heat-conducting panel (200-2) on the other side in the width direction using a bending jig (not shown) based on a reference line (T) based on a first coolant passage (210), and, after the bending process (S20), a bonding process (S40) of bonding a plurality of strength reinforcing parts (240) formed on the edge ends corresponding to the heat dissipation portions (203) of the heat-conducting panel (200-1) on one side and the heat-conducting panel (200-2) on the other side to the second coolant passage (220) and the third coolant passage (230) to each other.

[0251] In addition, the method for manufacturing a heat dissipation device (200) according to one embodiment of the present invention may further include an absorber installation process (S30) of installing an absorber (300) that forms a capillary force of a liquid refrigerant in a portion corresponding to the first refrigerant passage (210) close to the press-fit end (201) before the bonding process (S40).

[0252] Here, the absorber installation process (S30) is a process performed during the bending process (S20), but can be defined as a process of inserting and installing the absorber (300) into the first refrigerant passage (210) that is partially formed before the bending process (S20) is completed.

[0253] That is, the absorber (300) can be installed in a manner such that it is excreted in a portion corresponding to the first refrigerant passage (210) that is partially formed before the bending process (S20) so that the one-side heat-conducting panel (200-1) and the other-side heat-conducting panel (200-2) are completely in contact with each other based on an arbitrary reference line (T), and then, by additionally completing the bending process (S20), it can be installed in a manner such that it is stably fixed in a portion corresponding to the first refrigerant passage (210) by a plurality of absorber fixing guides (250).

[0254] Thereafter, when joining along the edge ends of one side heat-conducting panel (200-1) and the other side heat-conducting panel (200-2) through the joining process (S40) as described above, the longitudinal ends corresponding to one end and the other end of the press-fit end (201) constituting the first refrigerant passage (210) are opened, and one of the opened ends is caulked for the vacuum process (SA) described later, and then, after filling the refrigerant by the refrigerant filling process (S50) described later, the other one of the opened ends that is not caulked is caulked to shield the inside refrigerant from leaking, and a solder caulking process (SA-40) can be performed as a detailed process of the vacuum process (SA) described later.

[0255] In addition, the method for manufacturing a heat dissipation device (200) according to one embodiment of the present invention may further include, after the bonding process (S40), a refrigerant filling process (S50) of filling refrigerant through one longitudinal end or the other longitudinal end (i.e., either one of the open ends) of the first refrigerant passage (210), and, after the refrigerant filling process (S50), a heat dissipation chamber fastening process (S60) of installing the heat dissipation chamber in a press-fit manner into the press-fit portion (150) of the heat dissipation housing body (110).

[0256] The refrigerant filling process (S50) can be performed through either one of the openings formed at one end and the other end (i.e., both ends) in the longitudinal direction of the first refrigerant passage (210), and after the refrigerant is filled, the refrigerant can be completely sealed through the solder caulking process (SA-40) described below to prevent refrigerant leakage.

[0257] Meanwhile, although not shown in the drawing, a method for manufacturing a heat dissipation device (1200) according to another embodiment of the present invention may differ from a method for manufacturing a heat dissipation device (200, etc.) according to one embodiment of the present invention including the above-described bending process (S20) as follows.

[0258] That is, a method for manufacturing a heat dissipation device (1200) according to another embodiment of the present invention may include a pressing process (S10) for pressing two separate metal panel members to form a refrigerant flow space including a first refrigerant channel (1210) and a second refrigerant channel (1220) at a predetermined depth, a joining process (S40) for simultaneously forming a refrigerant flow space (1205) corresponding to the first refrigerant channel (1210) and the second refrigerant channel (1220) by joining along the edge ends of a heat-conducting panel body (1200-1, 1200-2) provided with two separate metal panel members after the pressing process (S10), and a refrigerant filling process (S50) for filling the refrigerant into the refrigerant flow space.

[0259] In a method for manufacturing a heat dissipation device (200) according to one embodiment of the present invention, a press process (S10) is performed using a single metal panel member to form a refrigerant flow space (205) including a first refrigerant passage (210) and a second refrigerant passage (220), and an edge end portion excluding a press-fit end portion (201) formed through a bending process (S20) is manufactured in a state in which it can be joined by a joining process (S40) performed later.

[0260] In contrast, a method for manufacturing a heat dissipation device (1200) according to another embodiment of the present invention may include forming a first coolant passage (1210) and a second coolant passage (1220) by sheet metalizing two separate metal panel members, each having a shape corresponding to a first edge end, through a pressing process (S10), and then immediately joining the respective edge ends of the two separate metal panel members using a joining process (S40).

[0261] Of course, it will be obvious that in the manufacturing method of the heat dissipation device (1200) according to another embodiment of the present invention, an absorber installation process (S30) for installing an absorber (300) or auxiliary absorber (301) before the bonding process (S40) can also be performed.

[0262] In addition, when the heat dissipation device (1200) according to another embodiment of the present invention includes a plurality of strength reinforcement parts (1240), the bonding process (S40) will be interpreted as a concept including a process of bonding the edge ends of two separate metal panel members in a predetermined manner while simultaneously bonding the plurality of strength reinforcement parts (1240) to each other.

[0263] However, the method for manufacturing a heat dissipation device according to an embodiment of the present invention may further include a cleaning process (not shown) for cleaning the refrigerant flow space (105) before the absorber installation process (S30), and a vacuuming process (SA) for vacuuming the refrigerant flow space (205, 1205) through a vacuuming unit (2000) provided in one of the one-side heat-conducting panel (200-1, 1200-1) and the other-side heat-conducting panel (200-2, 1200-2) before (SA-1) or after (SA-2) the refrigerant filling process (S50).

[0264] Here, the cleaning process can be defined as a process in which the heat dissipation device (200, 200A, 200B) according to embodiments of the present invention is sequentially immersed in a immersion tank - an ultrasonic tank - a rinse tank - a vapor degreasing tank, and finally dried to remove moisture.

[0265] The vacuumization process (SA) can be performed by either a process of vacuumizing the inside of a device that generally operates by vacuum through pumping, then filling it with refrigerant, then heating and evaporating the refrigerant, and then vacuumizing it again (heating vacuumization process) or a process of filling the refrigerant, then temporarily freezing (solidifying) the refrigerant, and then vacuumizing it (freezing vacuumization process).

[0266] For reference, the vacuum process (SA) of filling (injecting) refrigerant after vacuuming, which is the former method, is a method that utilizes the fact that the vacuum level changes when filling (injecting) the refrigerant, and that a high vacuum is formed first and then the refrigerant is filled, thereby changing to a low vacuum state. Since it is a cheaper process method, it can be mainly applied to mass production and the manufacturing of low-priced products that prioritize price over quality.

[0267] In addition, the latter method, which is a liquid refrigerant filling (injection) and a vacuum process (SA) after freezing the liquid refrigerant, is more complex than the former method in that it involves filling and freezing the liquid refrigerant after a first vacuum, and then performing a second vacuum, but has the advantage of being advantageous in high-vacuum products that have a fast reaction speed, can minimize NCG, and can increase Qmax, and can reduce the vacuum equipment capacity and increase the vacuum exhaust speed through the liquid refrigerant freezing process, and can be mainly applied to small-scale production and the manufacture of high-priced products.

[0268] Despite the differences in the detailed vacuumization methods as described above, the vacuumization process (SA) may include a vacuumization unit installation process (SA-10) of installing a vacuumization unit (2000) in an air vent hole (1200-3), an air vent process (SA-20) of vacuumizing a refrigerant flow space (205, 1205) using an air vent tube (2100) installed in an air vent hole (1200-3), and a solder caulking process (SA-40) of cutting a part of the air vent tube (2100) after the air vent process (SA-20) and then soldering the hollow portion (2100S) of the air vent tube (2100).

[0269] Here, the vacuum unit installation process (SA-10) can be defined as a process of installing an air vent tube (2100) so that it protrudes outward by a predetermined length while being hooked to the inner edge end of the air vent hole (1200-3) before the bonding process (S40), and interposing a welding auxiliary ring (2200) on the outer surface of the air vent tube (2100) protruding outward from the air vent hole (1200-3).

[0270] Meanwhile, the vacuum process (SA) may further include an air vent process (SA-20) of vacuumizing the refrigerant flow space (205) using an air vent tube (2100) installed in an air vent hole (1200-3), and a solder caulking process (SA-40) of cutting a portion of the air vent tube (2100) after the air vent process (SA-20) and then soldering the hollow portion of the air vent tube (2100).

[0271] However, the above-described vacuum process (SA) should be interpreted as a process using the vacuum unit (2000) (i.e., the air vent tube indicated by the drawing symbol '2100') referenced in FIGS. 11 to 13, and according to the vacuum unit (2000) according to the modified example referenced in FIG. 14 (i.e., the air vent tube indicated by the drawing symbol '2101'), it should be understood as a different process as follows.

[0272] More specifically, after the bonding process (S40), the air vent tube (2100) is installed from the outside inward so as to be caught on the outer edge end of the air vent hole (1200-3), and the process can be interpreted as installing the air vent tube (2100) so as to be caught on the outer circumference of the air vent hole (1200-3). This is because the tube body (2101) of the air vent tube (2100) can be installed on the outside of one side of the heat-conducting panel (200-1, 1200-1) with respect to the air vent hole (1200-3).

[0273] Meanwhile, the vacuum process (SA) to which the vacuum unit (2000) according to the modified example is applied can be interpreted as further including an air vent process (SA-20) of vacuumizing the refrigerant flow space (205) using an air vent tube (2100) installed in an air vent hole (1200-3), a solder fixing process (SA-30) of soldering the outer surface of the air vent hole (1200-3) and a welded reinforcement part (2103') integrally formed in the air vent tube (2100) after the air vent process (SA-20) using a filler metal, and a solder caulking process (SA-40) of cutting a part of the air vent tube (2100) after the air vent process (SA-20) and then soldering the hollow part of the air vent tube (2100).

[0274] In addition, the method for manufacturing a heat dissipation device (200, 1200) according to embodiments of the present invention may further include at least one of a leak test process (S70) for testing whether there is a leak of a refrigerant after a solder caulking process (SA-40) of a vacuum process (SA), a performance inspection process (S80) for testing the performance of the heat dissipation device (200, 1200) of the present invention, and a reliability test process (S90) for testing the reliability of the heat dissipation device (200, 1200) of the present invention.

[0275] Meanwhile, the method for manufacturing a heat dissipation device according to embodiments of the present invention may further include a coating process (not shown) of coating a hydrophobic coating material on one surface of a heat-conductive panel body (200-1, 200-2, 1200-1, 1200-2) that forms a refrigerant flow space (205, 1205) in which refrigerant filled by a refrigerant filling process (S50) before a bending process (S20) (or an absorber installation process (S30)) flows, although not shown in the drawing.

[0276] Here, the description is limited to a hydrophobic coating material as the coating layer, but it is natural that a hydrophilic coating material can be used depending on the type of refrigerant or the refrigerant path.

[0277] According to the heat dissipation mechanism (200, 1200) according to the embodiment of the present invention having such a configuration, heat transfer and heat release are achieved through the phase change of the refrigerant actively filled inside, thereby overcoming the material limitations of the heat dissipation fin itself provided in the form of a heat sink fin, and implementing higher heat dissipation performance, thereby providing the advantage of greatly improving the performance of the antenna device (100) or similar electronic devices.

[0278] In addition, when performing a vacuum process (SA) to adjust the internal pressure of a refrigerant flow space (205, 1205), by providing a vacuum unit (2000) only on one of the heat-conducting panels (200-1, 1200-1) and the other heat-conducting panel (200-2, 1200-2), it is possible to provide an advantage of manufacturing a high-quality product without concerns about refrigerant leakage.

[0279]

[0280] Hereinafter, embodiments of the heat dissipation device (200, 1200) and the manufacturing method thereof according to the present invention have been described in detail with reference to the attached drawings. However, the embodiments of the present invention are not necessarily limited to the above-described embodiments, and it will be understood that various modifications and equivalent implementations are possible by those skilled in the art to which the present invention pertains. Therefore, the true scope of the present invention is defined by the claims set forth below.

Claims

1. A heat-conducting panel body having a refrigerant flow space of a predetermined thickness formed inside to release heat through one side and the other side; including: A heat dissipation device, wherein the heat conductive panel body is installed to be in vertical communication with the refrigerant flow space with respect to one of the first and second surfaces, and includes a vacuum unit for vacuuming the refrigerant flow space before or after filling the refrigerant into the refrigerant flow space.

2. In claim 1, The refrigerant flow space of the above heat-conducting panel body is formed as a closed empty space between one side heat-conducting panel forming the one side and the other side heat-conducting panel forming the other side, and the refrigerant is filled and circulates in a gas-liquid manner to release heat as it undergoes a phase change. The above vacuum unit is a heat dissipation mechanism provided in an air vent hole formed in either one of the one-side heat-conducting panel and the other-side heat-conducting panel.

3. In claim 2, The above vacuum unit, An air vent tube that is hung from the inside to the outside of the air vent hole and protrudes outward by a predetermined length; and A heat dissipation device comprising a welding auxiliary ring interposed on the outer surface of the air vent tube for welding and fixing the air vent tube.

4. In claim 3, The above air vent tube, A tube body in the shape of a hollow pipe; and A heat dissipation device comprising: a step portion positioned in the refrigerant flow space among the tube bodies and having an outer diameter larger than the outer circumference of the tube bodies.

5. In claim 4, A heat dissipation mechanism in which the outer diameter of the above-mentioned hanging step is formed to a size that hangs on the inner edge of the air vent hole.

6. In claim 4, A heat dissipation device in which the above welding auxiliary ring is fixed in close contact with the outer edge portion of one of the one-side heat-conducting panel and the other-side heat-conducting panel in which the air vent hole is formed.

7. In claim 4, A heat dissipation device, wherein the vacuum unit further includes a shielding solder unit that solders the tube body to the air vent hole.

8. In claim 7, A heat dissipation device in which the above shielding solder portion is a filler material that is soldered to shield the hollow portion of the tube body after the tube body is cut to match the outer end of the welding auxiliary ring.

9. In claim 7, A heat dissipation device in which the above shielding solder portion is a filler material that is soldered to cover the entire hollow portion of the tube body cut to match the outer end of the welding auxiliary ring and the outer end of the welding auxiliary ring.

10. In claim 2, The above vacuum unit, An air vent tube is included, which is hung from the outside of the air vent hole in an inward direction and protrudes outward by a predetermined length; The above air vent tube, A tube body in the shape of a hollow pipe; and A heat dissipation device comprising a welded reinforcement part formed integrally with the tube body and hooked to the outer edge of the air vent hole.

11. In claim 10, A heat dissipation device, wherein a tapered portion is formed in a portion of the above welding reinforcement portion adjacent to the air vent hole so as to form a space in which a filler material can be applied between the portion and the outer edge of the air vent hole.

12. In claim 10, The above welding reinforcement part is a heat dissipation device having an outer diameter that catches the outer edge of the air vent hole when the tube body is installed from the outside to the inside through the air vent hole.

13. In claim 11, The above vacuum unit, A shielding solder portion that is soldered with a filler material to shield the hollow portion of the tube body after the tube body is cut to match the outer end of the welded reinforcement portion; and A heat dissipation device further comprising a fixed solder portion soldered by a filler metal to secure between the above welding reinforcement portion and the outer edge portion of the air vent hole.

14. In claim 13, A heat dissipation mechanism in which the above fixed solder portion is formed by a filler material applied between the tapered portion of the above welding reinforcement portion.

15. A heat-conducting panel body sheet metal process in which one side heat-conducting panel and the other side heat-conducting panel are processed to form a refrigerant flow space inside, and an air vent hole for refrigerant filling or vacuumization is integrally formed in one of the one side heat-conducting panel and the other side heat-conducting panel; After the above heat-conducting panel body sheet metal process, a bonding process of mutually bonding the one-side heat-conducting panel and the other-side heat-conducting panel, which are made of a single metal panel member or two metal panel members, to form the refrigerant flow space; and After the above bonding process, a vacuuming process for vacuuming the refrigerant flow space; The above vacuum process is, A method for manufacturing a heat dissipation device, comprising: a vacuum unit installation process for installing a vacuum unit in the air vent hole; 16. In claim 15, A method for manufacturing a heat dissipation device, further comprising: a bending process for bending the single metal panel member before the bonding process, when the one-side heat-conducting panel and the other-side heat-conducting panel are formed of a single metal panel member, such that the one-side heat-conducting panel forms one side of the refrigerant flow space and the other-side heat-conducting panel forms the other side of the refrigerant flow space; 17. In claim 15, The above vacuum unit installation process is: A method for manufacturing a heat dissipation device, which is a process of installing an air vent tube so that it protrudes outward by a predetermined length while being hooked to the inner edge end of the air vent hole before the above-mentioned bonding process, and interposing a welding auxiliary ring on the outer surface of the air vent tube protruding outward from the air vent hole.

18. In claim 17, The above vacuum process is, An air vent process for vacuuming the refrigerant flow space using the air vent tube installed in the air vent hole; and A method for manufacturing a heat dissipation device, further comprising: a solder caulking process of cutting a portion of the air vent tube after the air vent process and then soldering the hollow portion of the air vent tube; 19. In claim 15, The above vacuum unit installation process is: A method for manufacturing a heat dissipation device, wherein after the above bonding process, an air vent tube is installed from the outside inward so as to be caught on the outer edge end of the air vent hole, and the air vent tube is installed so as to be caught on the outer edge portion of the air vent hole.

20. In claim 19, The above vacuum process is, An air vent process for vacuumizing the refrigerant flow space using the air vent tube installed in the air vent hole; A solder fixing process in which a welded reinforcement part integrally formed in the air vent tube after the air vent process is soldered with a filler metal between the outer surface of the air vent hole; and A method for manufacturing a heat dissipation device, further comprising: a solder caulking process of cutting a portion of the air vent tube after the air vent process and then soldering the hollow portion of the air vent tube;

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