Display module and display device

Abstract

Provided are a display module (10) and a display device (1000). The display module (10) comprises a flexible printed circuit (110) and a display panel (120). The flexible printed circuit (110) is bonded to the display panel (120), and the flexible printed circuit (110) comprises a substrate layer (01) and a conductive layer (02) arranged in a laminated manner, the conductive layer (02) comprising a first grounding part (GND1) and a second grounding part (GND2) arranged spaced apart from each other. A connecting structure (LX) is provided at one end of the flexible printed circuit (110), the connecting structure (LX) comprises at least an electrostatic input end (201), the electrostatic input end (201) is electrically connected to the second grounding part (GND2), and the first grounding part (GND1) is electrically connected to a grounding wire (D1) in the display panel (120).

Description

Display module and display device

[0001] CROSS-REFERENCE TO RELATED APPLICATIONS

[0002] This application claims priority to Chinese patent application No. 202311219157.9, filed on September 20, 2023, entitled “Display Module and Display Device,” the entire contents of which are incorporated herein by reference. Technical Field

[0003] The present application belongs to the field of display technology, and in particular relates to a display module and a display device. Background Art

[0004] With the development of display technology, display modules are increasingly used in people's production and daily life. For example, a display module may include components such as a display panel and a flexible printed circuit (FPC). However, static electricity generated during the production and / or use of a display module can easily damage the electronic components in the display panel.

[0005] Summary of the Invention

[0006] Embodiments of the present application provide a display module and a display device, which can solve the problem that electronic components in a display panel have been damaged by static electricity.

[0007] In the first aspect, an embodiment of the present application provides a display module, which includes a flexible circuit board and a display panel, and the flexible circuit board is bound and connected to the display panel. The flexible circuit board includes a stacked base material layer and a conductive layer, and the conductive layer includes a first grounding portion and a second grounding portion arranged at intervals; a connection structure is provided at one end of the flexible circuit board, and the connection structure includes at least an electrostatic input terminal, the electrostatic input terminal is electrically connected to the second grounding portion, and the first grounding portion is electrically connected to the ground wire in the display panel.

[0008] According to the implementation of the first aspect of the present application, the flexible circuit board is further provided with an electrostatic absorption element, the electrostatic input end is electrically connected to the electrostatic absorption element through the second grounding portion, and the electrostatic absorption element is used to absorb static electricity.

[0009] In this way, in addition to the second ground portion itself absorbing static electricity from the ground terminal and the second ground portion, the static electricity absorption element further dissipates static electricity from the ground terminal and the second ground portion. This static electricity absorption element can significantly reduce the amount of static electricity in the flexible printed circuit board.

[0010] According to any of the aforementioned embodiments of the first aspect of the present application, the first end of the electrostatic absorption element is electrically connected to the second ground portion, and the second end of the electrostatic absorption element is electrically connected to the first ground portion.

[0011] In this way, an electrostatic discharge loop can be formed to guide the residual static electricity in the electrostatic absorption element into the first ground portion, thereby effectively preventing static electricity from accumulating in the electrostatic absorption element.

[0012] According to any of the aforementioned embodiments of the first aspect of the present application, the impedance of the second grounding portion is greater than the impedance of the first grounding portion.

[0013] In this way, the impedance of the second ground portion can be relatively large, thereby effectively consuming static electricity entering the second ground portion and reducing the amount of static electricity on the flexible printed circuit board.

[0014] According to any of the aforementioned embodiments of the first aspect of the present application, the cross-sectional area of ​​the second grounding portion is smaller than the cross-sectional area of ​​the first grounding portion.

[0015] In this way, since the cross-sectional area of ​​the second ground portion is smaller than that of the first ground portion, the impedance of the second ground portion can be relatively large, thereby better consuming static electricity entering the second ground portion and reducing the static electricity amount of the flexible circuit board.

[0016] According to any of the aforementioned embodiments of the first aspect of the present application, along the same straight line, the width of the second grounding portion is smaller than the width of the first grounding portion.

[0017] In this way, since the width of the second ground portion along the same straight line is smaller than that of the first ground portion, the impedance of the second ground portion can be relatively large, thereby better consuming static electricity entering the second ground portion and reducing the static electricity amount of the flexible circuit board.

[0018] According to any of the aforementioned embodiments of the first aspect of the present application, the second grounding portion includes a conductive trace.

[0019] In this way, since the second ground portion adopts a conductive trace and is narrow, the impedance of the second ground portion can be increased, thereby better consuming static electricity entering the second ground portion and reducing the static electricity amount of the flexible circuit board.

[0020] According to any of the aforementioned embodiments of the first aspect of the present application, along the thickness direction of the flexible circuit board, the area of ​​the orthographic projection of the first ground portion on the substrate layer is larger than the area of ​​the orthographic projection of the second ground portion on the substrate layer.

[0021] According to any of the aforementioned embodiments of the first aspect of the present application, the electrostatic absorption element includes an inductor, a first end of the inductor is electrically connected to the second ground portion, and a second end of the inductor is electrically connected to the first ground portion; or, the electrostatic absorption element includes a magnetic bead, a first end of the magnetic bead is electrically connected to the second ground portion, and a second end of the magnetic bead is electrically connected to the first ground portion.

[0022] In this way, on the one hand, the inductor generates a reverse electromotive force, which cancels out most or all of the static electricity. On the other hand, because the potential of the first ground is relatively low, the inductor can conduct the residual static electricity from the second ground to the first ground. On the one hand, the magnetic bead can generate a reverse electromotive force, which cancels out most or all of the static electricity. On the other hand, because the potential of the first ground is relatively low, the magnetic bead can conduct the residual static electricity from the second ground to the first ground.

[0023] According to any of the aforementioned embodiments of the first aspect of the present application, the display module includes a touch display module, and the display panel includes a touch display panel.

[0024] According to any of the aforementioned embodiments of the first aspect of the present application, the flexible circuit board also includes an insulating protective layer, which is located on the side of the conductive layer away from the substrate layer along the thickness direction of the flexible circuit board, and the insulating protective layer covers the conductive layer; the insulating protective layer is provided with a window area, the window area exposes a conductive part located in the conductive layer, and the conductive part is insulated from the first grounding part; the conductive part is electrically connected to the second grounding part, or the conductive layer is further provided with a third grounding part, the first grounding part and the third grounding part are spaced apart, and the conductive part is electrically connected to the third grounding part.

[0025] In this way, the static electricity of the conductive portion of the window area can be consumed by the second grounding portion or the third grounding portion, thereby reducing the static electricity of the conductive portion of the window area.

[0026] According to any of the aforementioned embodiments of the first aspect of the present application, the third grounding portion is electrically connected to the first end of the electrostatic absorption element, and the second end of the electrostatic absorption element is electrically connected to the first grounding portion.

[0027] In this way, the static electricity on the conductive portion of the window area can be further absorbed or released by the static electricity absorption element.

[0028] According to any of the aforementioned embodiments of the first aspect of the present application, the material of the conductive part includes copper.

[0029] According to any of the aforementioned embodiments of the first aspect of the present application, the conductive layer includes a first conductive layer, which is located on the first side of the substrate layer along the thickness direction of the flexible circuit board, and the connecting structure, the first grounding portion and the second grounding portion are all located in the first conductive layer.

[0030] According to any of the aforementioned embodiments of the first aspect of the present application, the conductive layer includes a first conductive layer and a second conductive layer. Along the thickness direction of the flexible circuit board, the first conductive layer is located on the first side of the substrate layer, the second conductive layer is located on the second side of the substrate layer, and the first side of the substrate layer is opposite to the second side of the substrate layer; the first grounding portion is located on the first conductive layer and / or the second conductive layer, and the second grounding portion is located on the first conductive layer and / or the second conductive layer.

[0031] According to any of the aforementioned embodiments of the first aspect of the present application, the connection structure and the second grounding portion are both located in the first conductive layer or are both located in the second conductive layer.

[0032] In this way, since the electrostatic input terminal and the second ground portion are located in the same film layer, electrical connection can be achieved between the electrostatic input terminal and the second ground portion without providing a via hole, which is conducive to simplifying the production process and reducing production costs.

[0033] According to any of the aforementioned embodiments of the first aspect of the present application, the first grounding portion includes a first sub-portion and a second sub-portion, the first sub-portion and the second grounding portion are located in the first conductive layer, the first sub-portion and the second grounding portion are spaced apart, and the second sub-portion is located in the second conductive layer.

[0034] According to any of the aforementioned embodiments of the first aspect of the present application, along the thickness direction of the flexible circuit board, the orthographic projection of the second sub-portion on the substrate layer at least partially overlaps with the orthographic projection of the first sub-portion on the substrate layer, and the orthographic projection of the second sub-portion on the substrate layer also at least partially overlaps with the orthographic projection of the second grounding portion on the substrate layer.

[0035] According to any of the aforementioned embodiments of the first aspect of the present application, along the thickness direction of the flexible circuit board, the area of ​​the orthographic projection of the second sub-part on the substrate layer is greater than the sum of the area of ​​the orthographic projection of the first sub-part on the substrate layer and the area of ​​the orthographic projection of the second grounding part on the substrate layer.

[0036] According to any of the aforementioned embodiments of the first aspect of the present application, the second grounding portion is located in the first conductive layer, the second conductive layer is provided with a hollow area, and along the thickness direction of the flexible circuit board, the orthographic projection of the second grounding portion on the substrate layer and the orthographic projection of the hollow area on the substrate layer at least partially overlap; or, the second grounding portion is located in the second conductive layer, the first conductive layer is provided with a hollow area, and along the thickness direction of the flexible circuit board, the orthographic projection of the second grounding portion on the substrate layer and the orthographic projection of the hollow area on the substrate layer at least partially overlap.

[0037] In this way, the conductive material on the other side of the substrate layer is avoided in the area where the second grounding part is located, which can effectively reduce the static electricity jumping between the first conductive layer and the second conductive layer. For example, it can prevent the static electricity of the second grounding part from jumping to the first grounding part on the other side of the substrate layer.

[0038] According to any of the aforementioned embodiments of the first aspect of the present application, a connecting structure is provided at the first end of the flexible circuit board, a binding area is provided at the second end of the flexible circuit board, the binding area includes a plurality of binding pads, and the flexible circuit board is bound and connected to the display panel through the plurality of binding pads; at least one binding pad includes a grounding pad, and the first grounding portion is electrically connected to the grounding wire in the display panel through the grounding pad.

[0039] According to any of the aforementioned embodiments of the first aspect of the present application, the connection structure is electrically connected to the control mainboard of the display device.

[0040] According to any of the aforementioned embodiments of the first aspect of the present application, the connection structure includes a gold finger or a connector.

[0041] According to any of the aforementioned embodiments of the first aspect of the present application, the display module also includes a touch chip, the touch chip is bound and connected to the flexible circuit board, at least one binding pad includes a touch electrode pad, and the touch chip is electrically connected to the touch electrode in the display panel through the touch electrode pad.

[0042] According to any of the aforementioned embodiments of the first aspect of the present application, the connection structure also includes a plurality of signal connection terminals arranged at intervals, the conductive layer also includes a plurality of signal lines, the plurality of signal connection terminals are electrically connected to the plurality of signal lines in a one-to-one correspondence, and the signal connection terminals are electrically connected to the pins of the touch chip through the signal lines.

[0043] According to any of the aforementioned embodiments of the first aspect of the present application, the flexible circuit board is further provided with an electronic device, and the signal connection end is electrically connected to the pin of the touch chip through a signal line and the electronic device.

[0044] In a second aspect, an embodiment of the present application provides a display device, which includes the display module provided in the first aspect.

[0045] The display module and display device of the present invention include a flexible circuit board and a display panel, which are bonded and connected to each other. The flexible circuit board includes a laminated substrate layer and a conductive layer, the conductive layer including a first grounding portion and a second grounding portion spaced apart from each other. A connection structure is provided at one end of the flexible circuit board, the connection structure including at least an electrostatic input terminal, which is electrically connected to the second grounding portion, and the first grounding portion is electrically connected to a ground line in the display panel. On one hand, the conductive layer of the flexible circuit board is provided with a first grounding portion and a second grounding portion, respectively. The first grounding portion is electrically connected to the ground line in the display panel, and the electrostatic input terminal is electrically connected to the second grounding portion, i.e., the electrostatic input terminal is no longer electrically connected to the first grounding portion. This prevents static electricity inputted from the electrostatic input terminal from entering the display panel through the first grounding portion, thereby reducing the amount of static electricity entering the display panel and reducing the impact of static electricity on electronic components in the display panel, thereby providing electrostatic protection for the display panel. On the other hand, because the second grounding portion has a certain impedance, static electricity entering the second grounding portion is further dissipated by the second grounding portion, thereby reducing the amount of static electricity in the flexible circuit board and at least partially dissipating the static electricity. BRIEF DESCRIPTION OF THE DRAWINGS

[0046] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the following is a brief introduction to the drawings required for use in the embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.

[0047] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the following is a brief introduction to the drawings required for use in the embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.

[0048] FIG1 is a schematic diagram of a top view of a display module provided in an embodiment of the present application;

[0049] FIG2 is a schematic diagram of a cross-sectional structure of the display module shown in FIG1 along the A1-A2 direction;

[0050] FIG3 is another schematic diagram of a top view of a display module provided in an embodiment of the present application;

[0051] FIG4 is a schematic diagram of a partial circuit of a display module provided in an embodiment of the present application;

[0052] FIG5 is another partial circuit diagram of a display module provided in an embodiment of the present application;

[0053] FIG6 is a schematic diagram of another top view of the display module provided in an embodiment of the present application;

[0054] FIG7 is a schematic diagram of a cross-sectional structure of the display module shown in FIG6 along the B1-B2 direction;

[0055] FIG8 is a schematic diagram of another top view of the display module provided in an embodiment of the present application;

[0056] FIG9 is a schematic cross-sectional view of the display module shown in FIG6 along the C1-C2 direction;

[0057] FIG10 is a schematic diagram of another cross-sectional structure of the display module shown in FIG6 along the C1-C2 direction;

[0058] FIG11 is a schematic diagram of another cross-sectional structure of the display module shown in FIG6 along the C1-C2 direction;

[0059] FIG12 is a schematic diagram of another top view of the display module provided in an embodiment of the present application;

[0060] FIG13 is a schematic cross-sectional view of the display module shown in FIG12 along the direction D1-D2;

[0061] FIG14 is a schematic structural diagram of a display device provided in an embodiment of the present application. DETAILED DESCRIPTION

[0062] The features and exemplary embodiments of various aspects of the present application will be described in detail below. In order to make the purpose, technical solutions and advantages of the present application clearer, the present application will be further described in detail below in conjunction with the accompanying drawings and specific embodiments. It should be understood that the specific embodiments described herein are only intended to explain the present application, rather than to limit the present application. For those skilled in the art, the present application can be implemented without the need for some of these specific details. The following description of the embodiments is merely to provide a better understanding of the present application by illustrating the examples of the present application.

[0063] It should be understood that the term "and / or" as used herein is merely a description of the relationship between associated objects, indicating that three possible relationships exist. For example, "A and / or B" can represent: A exists alone, A and B exist simultaneously, or B exists alone. Furthermore, the character " / " in this document generally indicates that the associated objects are in an "or" relationship.

[0064] In the embodiments of the present application, the term “electrically connected” may refer to a direct electrical connection between two components, or may refer to an electrical connection between two components via one or more other components.

[0065] It will be apparent to those skilled in the art that various modifications and variations can be made in this application without departing from the spirit or scope of this application. Therefore, this application is intended to cover modifications and variations of this application that fall within the scope of the corresponding claims (technical solutions claimed for protection) and their equivalents. It should be noted that the embodiments provided in the examples of this application can be combined with each other without contradiction.

[0066] Before describing the technical solutions provided by the embodiments of the present application, in order to facilitate understanding of the embodiments of the present application, the present application first specifically describes the problems existing in the related art:

[0067] With the development of display technology, display modules are increasingly used in people's production and daily life. Display modules are important components in display devices such as mobile phones, smart watches, and computers. The inventors of this application have discovered that when static electricity in the air strikes the display device housing and / or the flexible printed circuit board in the display module, it can enter the display panel through the flexible printed circuit board. This static electricity can easily damage the electronic components in the display panel.

[0068] In view of the above research findings of the inventors, the embodiments of the present application provide a display module and a display device that can solve the problem in the related art that electronic components in the display panel have been damaged by static electricity.

[0069] The technical concept of the embodiments of the present application is that: on the one hand, the conductive layer of the flexible circuit board is respectively provided with a first grounding portion and a second grounding portion, the first grounding portion is electrically connected to the ground line in the display panel, and the electrostatic input end is electrically connected to the second grounding portion, that is, the electrostatic input end is no longer electrically connected to the first grounding portion, which can prevent static electricity input from the electrostatic input end from entering the display panel through the first grounding portion, thereby reducing the amount of static electricity entering the display panel, reducing the impact of static electricity on electronic devices in the display panel, and achieving electrostatic protection for the display panel; on the other hand, since the second grounding portion has a certain impedance, the static electricity is further consumed by the second grounding portion after entering the second grounding portion, thereby reducing the amount of static electricity in the flexible circuit board and achieving at least partial dissipation of static electricity.

[0070] The following first introduces the display module provided in the embodiment of the present application.

[0071] FIG1 is a schematic diagram of a top view of the display module provided in an embodiment of the present application. FIG2 is a schematic diagram of a cross-sectional structure along the A1-A2 direction of the display module shown in FIG1 . As shown in FIG1 and FIG2 , the display module 10 may include a flexible printed circuit (FPC) 110 and a display panel 120. The flexible printed circuit 110 may be a printed circuit board made of a flexible substrate with high reliability and excellent flexibility, which has the characteristics of high wiring density, light weight, thin thickness and good bendability. Sub-pixels may be provided in the display panel 120 to realize the display of a picture. In some examples, the display module 10 may include a touch display module, and the display panel 120 may include a touch display panel. The touch display panel may be provided with sub-pixels to realize the display of a picture, and may also be provided with touch components to realize the touch function.

[0072] The flexible circuit board 110 can be bound and connected to the display panel 120. The flexible circuit board 110 may include a substrate layer 01 and a conductive layer 02 that are stacked. The material of the substrate layer 01 includes but is not limited to flexible insulating materials such as polyimide (PI) or polyester film. The thickness of the substrate layer 01 can be flexibly designed according to actual needs. The conductive layer 02 may include a first ground portion GND1 and a second ground portion GND2 that are spaced apart. That is, the first ground portion GND1 and the second ground portion GND2 can be insulated. In actual applications, the first ground portion GND1 can also be referred to as the system GND, which serves as the main reference ground terminal of the flexible circuit board 110.

[0073] The shape of the first ground portion GND1 and the shape of the second ground portion GND2 can be flexibly adjusted according to actual conditions, and the embodiments of the present application do not limit this. The shape of the first ground portion GND1 and the shape of the second ground portion GND2 can be regular or irregular. For example, in some examples, the first ground portion GND1 can be in the shape of a regular or irregular plate or line, and the second ground portion GND2 can also be in the shape of a regular or irregular plate or line.

[0074] One end of the flexible circuit board 110 is provided with a connection structure LX. In some examples, the connection structure LX includes, but is not limited to, a gold finger or a connector. When a gold finger and a connector are used for connection, the gold finger can be inserted into a slot of the connector to achieve an electrical connection. For example, when the connection structure LX is a gold finger, the gold finger of the flexible circuit board 110 can be inserted into a slot of a connector on another circuit board to achieve an electrical connection between the flexible circuit board 110 and the other circuit board. For another example, when the connection structure LX is a connector, the gold finger of the other circuit board can be inserted into a slot of the connector of the flexible circuit board 110 to achieve an electrical connection between the flexible circuit board 110 and the other circuit board.

[0075] The connection structure LX may include at least an electrostatic input terminal 201, which can be electrically connected to the second ground portion GND2. For example, the electrostatic input terminal 201 may include the ground terminal GND of the flexible printed circuit board. For example, the electrostatic input terminal 201 may be electrically connected to the ground terminal GND of the entire device housing, other circuit boards, and / or other connectors. Therefore, the electrostatic input terminal 201 may input static electricity from the entire device housing, other circuit boards, and / or other connectors. Therefore, the second ground portion GND2 can also be referred to as the electrostatic input portion.

[0076] The first ground portion GND1 can be electrically connected to the ground line D1 in the display panel 120. For example, in some examples, the first ground portion GND1 can be electrically connected to the ground line D1 in the display panel 120 through a bonding pad at the other end of the flexible circuit board 110.

[0077] A display module according to an embodiment of the present application includes a flexible circuit board and a display panel, the flexible circuit board and the display panel being bound and connected. The flexible circuit board includes a laminated substrate layer and a conductive layer, the conductive layer including a first grounding portion and a second grounding portion spaced apart from each other. A connection structure is provided at one end of the flexible circuit board, the connection structure including at least an electrostatic input terminal, the electrostatic input terminal being electrically connected to the second grounding portion, and the first grounding portion being electrically connected to a ground line in the display panel. In one aspect, the conductive layer of the flexible circuit board is provided with a first grounding portion and a second grounding portion, respectively. The first grounding portion is electrically connected to a ground line in the display panel, and the electrostatic input terminal is electrically connected to the second grounding portion, i.e., the electrostatic input terminal is no longer electrically connected to the first grounding portion. This prevents static electricity inputted from the electrostatic input terminal from entering the display panel through the first grounding portion, thereby reducing the amount of static electricity entering the display panel and the impact of static electricity on electronic components in the display panel, thereby providing electrostatic protection for the display panel. For example, if the display panel is a touch display panel, the electronic components may include touch electrodes. By reducing the amount of static electricity entering the touch display panel and reducing the impact of static electricity on the touch electrodes in the touch display panel, the problem of touch failure in the display module can be alleviated. On the other hand, since the second ground portion has a certain impedance, static electricity is further consumed by the second ground portion after entering the second ground portion, thereby reducing the amount of static electricity in the flexible circuit board and achieving at least partial dissipation of static electricity.

[0078] Taking a touch display panel as an example, in related technologies, when static electricity enters the touch electrodes of a touch display panel through a flexible circuit board, because the shapes (or areas) of the touch electrodes may vary, touch electrodes of different shapes (or different areas) have different resistance values ​​and discharge rates. This can lead to a large voltage difference between adjacent touch electrodes of different shapes (or different areas). Because the connections (such as bridges) between adjacent touch electrodes are relatively thin, the connections (such as bridges) between adjacent touch electrodes are prone to high temperatures when current flows through them, causing damage to the connections (such as bridges) between adjacent touch electrodes, resulting in touch failure in the display module.

[0079] The embodiments of the present application can reduce the voltage difference between adjacent touch electrodes of different shapes (or different areas) by reducing the amount of static electricity entering the touch display panel, thereby reducing the current flowing through the connection (such as the bridge) between adjacent touch electrodes, effectively preventing the connection (such as the bridge) between adjacent touch electrodes from being damaged, and improving the problem of touch failure that is prone to occur in the display module.

[0080] According to some embodiments of the present application, optionally, the impedance of the second ground portion GND2 may be smaller than the impedance of the first ground portion GND1 .

[0081] In this way, the impedance of the second ground portion GND2 can be relatively large, so that the static electricity entering the second ground portion GND2 can be better consumed, thereby reducing the amount of static electricity on the flexible printed circuit board.

[0082] According to some embodiments of the present application, the cross-sectional area of ​​the second ground portion GND2 may optionally be smaller than the cross-sectional area of ​​the first ground portion GND1. For example, in some examples, the maximum cross-sectional area of ​​the second ground portion GND2 may be smaller than the minimum cross-sectional area of ​​the first ground portion GND1.

[0083] In this way, since the cross-sectional area of ​​the second ground portion is smaller than that of the first ground portion, the impedance of the second ground portion can be relatively large, thereby better consuming static electricity entering the second ground portion and reducing the static electricity amount of the flexible circuit board.

[0084] In some specific embodiments, the thickness of the second ground portion GND2 can optionally be the same as the thickness of the first ground portion GND1 along the thickness direction of the flexible circuit board. For example, in some examples, the second ground portion GND2 and the first ground portion GND1 can be located in the same film layer, that is, the second ground portion GND2 and the first ground portion GND1 can be manufactured through the same process, which helps simplify the production process.

[0085] Accordingly, when the thickness of the second ground portion GND2 is the same as or similar to the thickness of the first ground portion GND1, the cross-sectional area of ​​the second ground portion GND2 is smaller than the cross-sectional area of ​​the first ground portion GND1. Specifically, along the same straight line, the width of the second ground portion GND2 can be smaller than the width of the first ground portion GND1. As shown in Figure 1, for example, along the same straight line ZL1, the width w2 of the second ground portion GND2 can be smaller than the width w1 of the first ground portion GND1. For example, along the same straight line ZL2, the width w4 of the second ground portion GND2 can be smaller than the width w3 of the first ground portion GND1. In some examples, straight lines (such as ZL1 and ZL2) include, for example, but are not limited to, any straight line extending along the row direction of the flexible circuit board or the display panel. In some specific examples, the maximum width of the second ground portion GND2 can be smaller than the minimum width of the first ground portion GND1.

[0086] In this way, since the width of the second ground portion GND2 along the same straight line is relatively small, the impedance of the second ground portion GND2 can be relatively large, thereby better consuming static electricity entering the second ground portion GND2 and reducing the static electricity amount of the flexible printed circuit board.

[0087] In some specific embodiments, optionally, the second ground portion GND2 includes but is not limited to conductive traces, such as metal traces. Of course, the shape of the second ground portion GND2 can be flexibly adjusted according to actual conditions. For example, in other embodiments, the second ground portion GND2 can also be in a regular or irregular block or plate shape. The width of the second ground portion GND2 can be flexibly adjusted according to actual conditions, and the embodiments of the present application are not limited to this. For example, in some specific embodiments, optionally, the value range of the width of the second ground portion GND2 includes but is not limited to 0.05 mm to 0.3 mm. For example, in some examples, the width of the second ground portion GND2 can be 0.3 mm. For example, in some examples, the width of the second ground portion GND2 can be 0.2 mm. For example, in some examples, the width of the second ground portion GND2 can be 0.1 mm. For example, in some examples, the width of the second ground portion GND2 can be 0.05 mm, etc.

[0088] Thus, since the second ground portion GND2 is thinner, that is, the width w2 of the second ground portion GND2 is smaller, the impedance of the second ground portion GND2 can be increased, thereby better dissipating static electricity entering the second ground portion GND2 and reducing the static electricity amount of the flexible printed circuit board.

[0089] Figure 3 is another schematic top view of the display module provided in an embodiment of the present application. As shown in Figure 3 , according to some embodiments of the present application, the flexible circuit board 110 may optionally be provided with an electrostatic absorption element 301. The electrostatic input terminal 201 may be electrically connected to the electrostatic absorption element 301 via the second ground portion GND2. The electrostatic absorption element 301 can be used to dissipate static electricity.

[0090] In this manner, in addition to the second ground portion GND2 itself dissipating static electricity from the static input terminal 201 and the second ground portion GND2, the static electricity absorption element 301 further dissipates static electricity from the static input terminal 201 and the second ground portion GND2. Thus, the static electricity absorption element 301 dissipates static electricity, significantly reducing the amount of static electricity in the flexible printed circuit board and achieving a high degree of static electricity dissipation.

[0091] The static electricity on the static electricity input terminal 201 and the second ground portion GND2 is further dissipated by the static electricity absorption element 301 , thereby further preventing the static electricity on the static electricity input terminal 201 and the second ground portion GND2 from entering the display panel 120 , thereby reducing the amount of static electricity entering the display panel.

[0092] For example, when the display module is a touch display module and the display panel is a touch display panel, the electrostatic absorption element 301 can be used to reduce the amount of electricity entering the touch electrode (Touch Panel sensor) area of ​​the touch display panel. Specifically, by further dissipating the static electricity on the electrostatic input terminal 201 and the second ground portion GND2 through the electrostatic absorption element 301, the amount of electricity entering the touch electrode area of ​​the touch display panel can be further reduced. This can reduce the voltage difference between adjacent touch electrodes of different shapes (or different areas), thereby reducing the current flowing through the connection (such as the bridge) between adjacent touch electrodes, effectively preventing the connection (such as the bridge) between adjacent touch electrodes from being damaged, and improving the problem of touch failure that is prone to occur in the display module.

[0093] 3 , according to some embodiments of the present application, optionally, the first end of the electrostatic absorption element 301 may be electrically connected to the second ground portion GND2 , and the second end of the electrostatic absorption element 301 may be electrically connected to the first ground portion GND1 .

[0094] In this way, an electrostatic discharge loop can be formed to guide the residual static electricity in the electrostatic absorption element 301 into the first ground portion GND1 , thereby effectively preventing static electricity from accumulating in the electrostatic absorption element 301 .

[0095] In combination with Figures 2 and 3, according to some embodiments of the present application, optionally, along the thickness direction Z of the flexible circuit board, the area of ​​the orthographic projection of the first ground portion GND1 on the substrate layer 01 may be larger than the area of ​​the orthographic projection of the second ground portion GND2 on the substrate layer 01.

[0096] As previously mentioned, the first ground portion GND1 can also be referred to as the system GND, and the first ground portion GND1 can be provided over a relatively large area on the flexible circuit board 110. The second ground portion GND2 is primarily used for discharging static electricity from the static electricity input terminal 201, and therefore, the area occupied by the second ground portion GND2 on the flexible circuit board 110 can be relatively small.

[0097] Figure 4 is a partial circuit diagram of a display module provided in an embodiment of the present application. As shown in Figure 4 , according to some embodiments of the present application, the electrostatic absorption element 301 optionally includes, but is not limited to, an inductor L. The first end of the inductor L can be electrically connected to the second ground GND2, and the second end of the inductor L can be electrically connected to the first ground GND1. Inductor L can generate a reverse electromotive force, which helps to offset static electricity.

[0098] In this way, on the one hand, the inductor L can generate a reverse electromotive force to offset most or all of the static electricity; on the other hand, since the potential of the first ground GND1 is relatively low, the inductor L can conduct the residual static electricity of the second ground GND2 into the first ground GND1.

[0099] The size of the inductor L can be flexibly adjusted according to actual conditions, and is not limited in this embodiment of the present application. For example, in some embodiments, the value range of the inductor L includes, but is not limited to, 1uH-10H. For example, in some examples, the inductor L can be 1uH, 10uH, 20uH, 50uH, 100uH, 500uH, 1H, 2H, 5H, or 10H.

[0100] When the inductor L is selected within the above value range, on the one hand, for example, a strong reverse electromotive force can be generated to offset most or even all of the static electricity. On the other hand, the inductor L can be prevented from being too large, the space occupied by the inductor L can be reduced, and the production cost can be reduced.

[0101] FIG5 is another partial circuit diagram of a display module provided in an embodiment of the present application. As shown in FIG5 , according to other embodiments of the present application, the electrostatic absorption element 301 optionally includes but is not limited to a magnetic bead M, the first end of which can be electrically connected to the second ground portion GND2, and the second end of which can be electrically connected to the first ground portion GND1. Magnetic beads can be used to suppress high-frequency noise and spike interference on signal lines and power lines, and also have the ability to absorb electrostatic pulses. Magnetic beads have high resistivity and magnetic permeability, and can be equivalent to a resistor and an inductor in series. The resistance and inductance values ​​of the magnetic beads can vary with frequency.

[0102] In this way, on the one hand, the magnetic bead M can generate reverse electromotive force to offset most or all of the static electricity; on the other hand, since the potential of the first ground portion GND1 is relatively low, the magnetic bead M can conduct the residual static electricity of the second ground portion GND2 into the first ground portion GND1.

[0103] The size of the magnetic bead M can be flexibly adjusted according to actual conditions, and the embodiments of the present application do not limit this. For example, in some embodiments, the value range of the magnetic bead M includes but is not limited to 10Ω / 100MHZ to 300Ω / 100MHZ. For example, in some examples, the magnetic bead M can be a magnetic bead of 10Ω / 100MHZ, 20Ω / 100MHZ, 50Ω / 100MHZ, 80Ω / 100MHZ, 100Ω / 100MHZ, 150Ω / 100MHZ, 180Ω / 100MHZ, 200Ω / 100MHZ, 250Ω / 100MHZ or 300Ω / 100MHZ, etc.

[0104] When the magnetic beads M are selected within the above value range, on the one hand, for example, a stronger reverse electromotive force can be generated to offset most or even all of the static electricity. On the other hand, the size of the magnetic beads M can be avoided to be too large, the space occupied by the magnetic beads M can be reduced, and the production cost can be reduced.

[0105] Figure 6 is another schematic top view of a display module provided in an embodiment of the present application. Figure 7 is a schematic cross-sectional view of the display module shown in Figure 6 along the B1-B2 direction. In combination with Figures 6 and 7, according to some embodiments of the present application, the flexible circuit board 110 may optionally further include an insulating protective layer 03. Along the thickness direction Z of the flexible circuit board, the insulating protective layer 03 may be located on the side of the conductive layer 02 away from the substrate layer 01, and the insulating protective layer 03 may cover the conductive layer 02.

[0106] The insulating protective layer 03 may be provided with a window region K, which exposes the conductive portion 701 located in the conductive layer 02. The conductive portion 701 is insulated from the first ground portion GND1. The shape and size of the conductive portion 701 can be flexibly adjusted according to actual conditions and are not limited in this embodiment of the present application. For example, in some examples, the conductive portion 701 can be a regular or irregular plate shape.

[0107] In some examples, the conductive portion 701 may be made of copper, so the window area K may also be referred to as a copper leakage area.

[0108] In some examples, the conductive portion 701 of the window area K may be electrically connected to other circuit boards or connectors, so the conductive portion 701 of the window area K may also receive static electricity.

[0109] As shown in FIG. 6 , in some embodiments, the conductive portion 701 of the window area K may be electrically connected to the second ground portion GND2 .

[0110] In this way, the static electricity of the conductive portion 701 in the window area K can be consumed by the second ground portion GND2, thereby reducing the static electricity of the conductive portion 701 in the window area K.

[0111] 6 , in some embodiments, the conductive portion 701 of the window area K may be electrically connected to the first end of the electrostatic absorption element 301 through the second ground portion GND2 , and the second end of the electrostatic absorption element 301 may be electrically connected to the first ground portion GND1 .

[0112] In this way, the static electricity on the conductive portion 701 of the window area K can be further absorbed or released by the static electricity absorption element 301 .

[0113] Figure 8 is another schematic diagram of the top structure of the display module provided by an embodiment of the present application. As shown in Figure 8, different from the embodiment shown in Figure 6, in other embodiments, the conductive layer 02 may also be provided with a third ground portion GND3. The shape of the third ground portion GND3 can be flexibly adjusted according to actual conditions. For example, in some examples, the third ground portion GND3 may include a conductive trace. The third ground portion GND3 is spaced apart from the first ground portion GND1, that is, the third ground portion GND3 is not electrically connected to the first ground portion GND1. In addition, the third ground portion GND3 may also be spaced apart from the second ground portion GND2, that is, the third ground portion GND3 is not electrically connected to the second ground portion GND2.

[0114] The conductive portion 701 may be electrically connected to the third ground portion GND3 .

[0115] In this way, the static electricity of the conductive portion 701 in the window area K can be consumed by the third ground portion GND3, thereby reducing the static electricity of the conductive portion 701 in the window area K.

[0116] It should be noted that in other embodiments of the present application, a fourth ground portion, a fifth ground portion, to an Nth ground portion (not shown in the figure), etc. may be provided as needed, and are not limited to the second ground portion GND2 and / or the third ground portion GND3, where N is an integer greater than 1. The functions of the fourth ground portion, the fifth ground portion, to the Nth ground portion are similar to those of the second ground portion GND2 and the third ground portion GND3, and can all be used to dissipate static electricity.

[0117] For example, when there is an electrostatic input device similar to the conductive part 701 of the window area K (such as an exposed rigid reinforcement structure) in the flexible circuit board, the conductive layer 02 can also be provided with a fourth grounding part, which is electrically connected to the rigid reinforcement structure, and the fourth grounding part is used to dissipate the static electricity of the rigid reinforcement structure.

[0118] 8 , in some embodiments, the third ground portion GND3 may be electrically connected to the first end of the electrostatic absorption element 301 , and the second end of the electrostatic absorption element 301 may be electrically connected to the first ground portion GND1 .

[0119] In this way, the static electricity on the conductive portion 701 of the window area K can be further absorbed or released by the static electricity absorption element 301 .

[0120] Similarly, the fourth ground portion, the fifth ground portion to the Nth ground portion may also be electrically connected to the electrostatic absorption element 301 , so that static electricity can be further dissipated through the electrostatic absorption element 301 .

[0121] According to some embodiments of the present application, the conductive layer 02 may optionally include, but is not limited to, copper. For example, in some embodiments, the conductive layer 02 may be formed by cladding one or both sides of the substrate layer 01 with copper foil. The copper foil is then patterned to form a circuit structure such as the first ground portion GND1 and the second ground portion GND2.

[0122] Copper foil is a cathodic electrolytic material that can be deposited as a thin, continuous layer on the surface of substrate layer 01. As the conductor of a flexible circuit board, copper foil easily adheres to the surface of substrate layer 01. After the copper foil circuit is printed on substrate layer 01, an insulating protective layer 03 can be added to the surface of the copper foil to form a flexible circuit board.

[0123] According to some embodiments of the present application, the flexible circuit board 110 may optionally include but is not limited to a single-layer board (or single-sided board). A single-layer board or single-sided board is a flexible circuit board having only a single conductor layer.

[0124] FIG9 is a schematic diagram of a cross-sectional structure along the C1-C2 direction of the display module shown in FIG6 . In combination with FIG6 and FIG9 , according to some embodiments of the present application, the conductive layer 02 may optionally include a first conductive layer 021 . Along the thickness direction Z of the flexible circuit board, the first conductive layer 021 may be located on the first side of the substrate layer 01 . The first side of the substrate layer 01 may be any side of the substrate layer 01 along the thickness direction Z of the flexible circuit board, that is, the front or back side of the substrate layer 01 , and this embodiment of the present application is not limited thereto. Along the thickness direction Z of the flexible circuit board, the insulating protective layer 03 may be located on the side of the first conductive layer 021 away from the substrate layer 01 , and the insulating protective layer 03 may cover the first conductive layer 021 .

[0125] The connection structure LX, the first ground portion GND1 and the second ground portion GND2 may all be located on the first conductive layer 021 . In other words, the electrostatic input terminal 201 and the second ground portion GND2 may all be located on the first conductive layer 021 .

[0126] In this way, since the electrostatic input terminal 201 and the second ground portion GND2 are located in the same film layer, electrical connection can be achieved between the electrostatic input terminal 201 and the second ground portion GND2 without setting a via hole, which is beneficial to simplifying the production process and reducing production costs.

[0127] According to some embodiments of the present application, the flexible circuit board 110 may optionally include but is not limited to a double-layer board (or double-sided board). A double-layer board or double-sided board is a flexible circuit board with two layers of conductors.

[0128] Figure 10 is another schematic cross-sectional view of the display module shown in Figure 6 along the C1-C2 direction. In combination with Figures 6 and 10 , according to other embodiments of the present application, the conductive layer 02 may optionally include a first conductive layer 021 and a second conductive layer 022. Along the thickness direction Z of the flexible circuit board, the first conductive layer 021 is located on the first side of the substrate layer 01, and the second conductive layer 022 is located on the second side of the substrate layer 01. The first side of the substrate layer 01 is opposite to the second side of the substrate layer 01. That is, along the thickness direction Z of the flexible circuit board, one of the first side of the substrate layer 01 and the second side of the substrate layer 01 is the front side of the substrate layer 01, and the other is the back side of the substrate layer 01.

[0129] The first ground portion GND1 can be located in the first conductive layer 021 and / or the second conductive layer 022. FIG10 illustrates an example in which the first ground portion GND1 is located in the first conductive layer 021 and the second conductive layer 022. However, in other embodiments, the first ground portion GND1 can also be located only in the first conductive layer 021 or only in the second conductive layer 022, and this embodiment of the present application is not limited thereto.

[0130] The second ground portion GND2 may also be located in the first conductive layer 021 and / or the second conductive layer 022. FIG10 illustrates an example in which the second ground portion GND2 is located in the first conductive layer 021. However, in other embodiments, the second ground portion GND2 may also be located in the second conductive layer 022, or a portion of the second ground portion GND2 may be located in the first conductive layer 021 and another portion of the second ground portion GND2 may be located in the second conductive layer 022. This embodiment of the present application is not limited to this.

[0131] As shown in conjunction with Figures 6 and 10 , according to some embodiments of the present application, the connection structure LX and the second ground portion GND2 may optionally both be located in the first conductive layer 021 or both in the second conductive layer 022. Figure 10 illustrates an example where the connection structure LX and the second ground portion GND2 are both located in the first conductive layer 021. However, in other embodiments, the connection structure LX and the second ground portion GND2 may also both be located in the second conductive layer 022. That is, the electrostatic input terminal 201 and the second ground portion GND2 may be located in the same film layer.

[0132] In this way, since the electrostatic input terminal 201 and the second ground portion GND2 are located in the same film layer, electrical connection can be achieved between the electrostatic input terminal 201 and the second ground portion GND2 without setting a via hole, which is beneficial to simplifying the production process and reducing production costs.

[0133] As shown in conjunction with Figures 6 and 10 , according to some embodiments of the present application, the first ground portion GND1 optionally includes a first sub-portion z1 and a second sub-portion z2. The first sub-portion z1 and the second ground portion GND2 may be located on the first conductive layer 021. The first sub-portion z1 may be spaced apart from the second ground portion GND2, i.e., the first sub-portion z1 and the second ground portion GND2 may be insulated. For example, along a direction parallel to the surface of the flexible printed circuit board, the first sub-portion z1 and the second ground portion GND2 may be isolated by the insulating material of the insulating protective layer 03. The second sub-portion z2 may be located on the second conductive layer 022.

[0134] In this way, the first ground portion GND1 is respectively located on the first conductive layer 021 and the second conductive layer 022, that is, the first ground portion GND1 can be located not only on the first conductive layer 021, but also on the second conductive layer 022. In this way, the area of ​​the first ground portion GND1 can be increased, and the impedance of the first ground portion GND1 can be reduced as much as possible, so that the first ground portion GND1 can achieve a role similar to the earth (such as zero potential), that is, the first ground portion GND1 is the system GND.

[0135] As shown in conjunction with Figures 6 and 10 , according to some embodiments of the present application, along the thickness direction Z of the flexible circuit board, the orthographic projection of the second sub-portion z2 on the substrate layer 01 may at least partially overlap with the orthographic projection of the first sub-portion z1 on the substrate layer 01. The orthographic projection of the second sub-portion z2 on the substrate layer 01 may also at least partially overlap with the orthographic projection of the second ground portion GND2 on the substrate layer 01. In other words, the second sub-portion z2 can cover a larger area of ​​the substrate layer 01. For example, in some examples, the orthographic projection of the second sub-portion z2 on the substrate layer 01 may cover the orthographic projection of the first sub-portion z1 on the substrate layer 01 and the orthographic projection of the second ground portion GND2 on the substrate layer 01. That is, along the thickness direction Z of the flexible circuit board, the orthographic projection area of ​​the second sub-portion z2 on the substrate layer 01 may be greater than the sum of the orthographic projection areas of the first sub-portion z1 and the orthographic projection areas of the second ground portion GND2 on the substrate layer 01. Of course, the shape and size of the second sub-portion z2 can be flexibly adjusted according to actual circumstances and are not limited in this embodiment of the present application.

[0136] FIG11 is another schematic diagram of a cross-sectional structure along the C1-C2 direction of the display module shown in FIG6 . In combination with FIG6 and FIG11 , according to some embodiments of the present application, optionally, the second ground portion GND2 may be located on the first conductive layer 021. The second conductive layer 022 may be provided with a hollow area Q. No conductive material may be provided in the hollow area Q. Along the thickness direction Z of the flexible circuit board, the orthographic projection of the second ground portion GND2 on the substrate layer 01 may at least partially overlap with the orthographic projection of the hollow area Q on the substrate layer 01. For example, the orthographic projection of the hollow area Q on the substrate layer 01 may completely cover the orthographic projection of the second ground portion GND2 on the substrate layer 01.

[0137] In this way, in the area where the second ground portion GND2 is located, the conductive material on the other side of the substrate layer 01 is avoided, which can effectively reduce the static electricity jumping between the first conductive layer 021 and the second conductive layer 022. For example, it can prevent the static electricity of the second ground portion GND2 from jumping to the first ground portion GND1 on the other side of the substrate layer 01, thereby effectively preventing static electricity from entering the display panel through the first ground portion GND1.

[0138] Unlike the embodiment shown in Figure 11 , in some other embodiments of the present application, the film layers where the second ground portion GND2 and the hollow area Q are located can optionally be interchanged. That is, the second ground portion GND2 can be located in the second conductive layer 022, while the first conductive layer 021 is provided with the hollow area Q. Along the thickness direction of the flexible circuit board, the orthographic projection of the second ground portion GND2 on the substrate layer 01 can at least partially overlap with the orthographic projection of the hollow area Q on the substrate layer 01. The details are similar to those in the embodiment shown in Figure 11 and will not be further described here.

[0139] In this way, in the area where the second ground portion GND2 is located, the conductive material on the other side of the substrate layer 01 is avoided, which can effectively reduce the static electricity jumping between the first conductive layer 021 and the second conductive layer 022. For example, it can prevent the static electricity of the second ground portion GND2 from jumping to the first ground portion GND1 on the other side of the substrate layer 01, thereby effectively preventing static electricity from entering the display panel through the first ground portion GND1.

[0140] As shown in FIG6 , according to some embodiments of the present application, optionally, a connection structure LX may be provided at the first end of the flexible circuit board 110, and a binding region 60 may be provided at the second end of the flexible circuit board 110. The binding region 60 may include a plurality of binding pads P, and the flexible circuit board 110 may be bound and connected to the display panel 120 via the plurality of binding pads P. For example, in some examples, the display panel 120 is also provided with a plurality of binding pads (not shown in the figure), and the plurality of binding pads P on the flexible circuit board 110 may be electrically connected to the plurality of binding pads on the display panel 120 in a one-to-one correspondence via conductive adhesive.

[0141] At least one bonding pad P in the bonding area 60 includes a ground pad Pd. The first ground portion GND1 can be electrically connected to the ground line D1 in the display panel 120 through the ground pad Pd. For example, the first ground portion GND1 can extend to the ground pad Pd and be electrically connected to the ground pad Pd. The ground pad Pd can be electrically connected to the ground line D1 in the display panel 120 through the bonding pad on the display panel 120.

[0142] According to some embodiments of the present application, the connection structure LX may optionally include, but is not limited to, a gold finger or a connector. The connection structure LX may be electrically connected to a control motherboard (not shown) of the display device. Taking a mobile phone as an example, the control motherboard may be a mobile phone motherboard (or main control circuit board). The control motherboard may be provided with devices such as a central processing unit (CPU) and / or a graphics processing unit (GPU). The connection structure LX may be used to receive signals sent by the control motherboard.

[0143] FIG12 is another schematic top view of a display module according to an embodiment of the present application. As shown in FIG12 , according to some embodiments of the present application, the display module 10 may optionally further include a touch chip 130. The touch chip 130 includes, but is not limited to, a touch panel driver integrated circuit (TPIC) or a touch and display driver integration (TDDI) chip.

[0144] The display panel 120 may be provided with touch electrodes TP. FIG12 illustrates a touch display panel that integrates mutual capacitance or self-capacitance as an example. The touch electrodes TP may include touch drive electrodes TX and touch sensing electrodes RX. Of course, in other embodiments, the display panel 120 may also be a self-capacitance touch display panel, and this embodiment of the present application is not limited thereto.

[0145] The touch chip 130 can be bonded to the flexible circuit board 110, employing a chip-on-film (COF) design. The at least one bonding pad P can include a touch electrode pad Px, through which the touch chip 130 can be electrically connected to the touch electrodes TP in the display panel 120. The touch chip 130 can provide touch drive signals to the touch electrodes TP and / or receive touch sensing signals.

[0146] Of course, in other embodiments, the touch chip 130 may also be directly bound and connected to the display panel 120 , using a COP (Chip On Panel) or COG (Chip On Glass) design, which is not limited in the embodiments of the present application.

[0147] FIG13 is a schematic diagram of a cross-sectional structure of the display module shown in FIG12 along the D1-D2 direction. In combination with FIG12 and FIG13, according to some embodiments of the present application, the connection structure LX may optionally further include a plurality of signal connection terminals 202 spaced apart. The conductive layer 02 may further include a plurality of signal lines L1, and the plurality of signal connection terminals 202 may be electrically connected to the plurality of signal lines L1 in a one-to-one correspondence. It should be noted that the signals transmitted by the plurality of signal lines L1 may be the same or different, and this is not limited in the embodiments of the present application. The signal connection terminals 202 may be electrically connected to the pins of the touch chip 130 via the signal lines L1.

[0148] As shown in conjunction with Figures 12 and 13 , according to some embodiments of the present application, the connection structure LX may optionally include at least two electrostatic input terminals 201. Figure 12 illustrates two electrostatic input terminals 201 as an example. The at least two electrostatic input terminals 201 may be electrically connected to the same second ground portion GND2. This second ground portion GND2 may be electrically connected to only one electrostatic absorption element 301, thereby reducing the number of electrostatic absorption elements 301. Of course, in other embodiments, the at least two electrostatic input terminals 201 may also be electrically connected to at least two second ground portions GND2, such as one electrostatic input terminal 201 being connected to a single second ground portion GND2. The at least two second ground portions GND2 may be electrically connected to the same electrostatic absorption element 301, or may be electrically connected to at least two electrostatic absorption elements 301, respectively. This embodiment of the present application is not limited to this.

[0149] In combination with Figures 12 and 13, according to some embodiments of the present application, optionally, when at least two electrostatic input terminals 201 are electrically connected to the same second ground portion GND2, a jumper wire Kx can be used to electrically connect the at least two electrostatic input terminals 201 to the same second ground portion GND2. The jumper wire Kx can be located in a different conductive layer from the signal line L1, thereby avoiding a short circuit between the second ground portion GND2 and the signal line L1. For example, in some implementations, the second ground portion GND2 and the signal line L1 can be located in the first conductive layer 021, the jumper wire Kx can be located in the second conductive layer 022, and the jumper wire Kx is electrically connected to the second ground portion GND2 through a via. Alternatively, the second ground portion GND2 and the signal line L1 can be located in the second conductive layer 022, the jumper wire Kx can be located in the first conductive layer 021, and the jumper wire Kx is electrically connected to the second ground portion GND2 through a via.

[0150] As shown in Figure 12, according to some embodiments of the present application, the flexible printed circuit board may optionally be provided with electronic components 203, including but not limited to resistors and / or capacitors. Resistors and / or capacitors can provide filtering, voltage division, and / or current limiting functions. The signal connection terminal 202 can be electrically connected to the pins of the touch control chip 130 via the signal line L1 and the electronic components 203, thereby providing overvoltage protection and / or overcurrent protection for the touch control chip 130.

[0151] Based on the display module provided in the above embodiments, accordingly, the present application also provides a display device, including the display module provided in the present application. In some embodiments, the display module may include a touch display module, and the display device may include a touch display device. Please refer to Figure 14, which is a structural schematic diagram of the display device provided in the embodiment of the present application. The display device 1000 provided in Figure 14 includes the display module 10 provided in any of the above embodiments of the present application. The embodiment of Figure 14 takes a mobile phone as an example to illustrate the display device 1000. It can be understood that the display device provided in the embodiment of the present application may be a wearable product, a computer, a television, a car display device, or other display device with a display function, and the present application does not impose specific restrictions on this. The display device provided in the embodiment of the present application has the beneficial effects of the display module 10 provided in the embodiment of the present application. For details, please refer to the specific description of the display module 10 in the above embodiments, and this embodiment will not be repeated here.

[0152] It should be understood that the specific circuit structures and cross-sectional structures of the display modules provided in the drawings of the embodiments of the present application are merely examples and are not intended to limit the present application. In addition, the above embodiments provided in the present application may be combined with each other unless there is any contradiction.

[0153] It should be understood that the various embodiments in this specification are described in a progressive manner, and the same or similar parts between the various embodiments can be referred to each other, and each embodiment focuses on the differences from other embodiments. According to the embodiments described above in accordance with the present application, these embodiments do not describe all the details in detail, nor do they limit the application to only the specific embodiments described. Obviously, many modifications and changes can be made based on the above description. This specification selects and specifically describes these embodiments in order to better explain the principles and practical applications of the present application, so that those skilled in the art can make good use of the present application and modifications based on the present application. The present application is limited only by the claims and their full scope and equivalents.

[0154] Those skilled in the art should understand that the above embodiments are illustrative rather than restrictive. Different technical features appearing in different embodiments can be combined to achieve beneficial effects. Based on a study of the drawings, the specification and the claims, those skilled in the art should be able to understand and implement other variations of the disclosed embodiments. In the claims, the term "comprising" does not exclude other structures; the quantity involves "one" but does not exclude multiple; the terms "first" and "second" are used to identify names rather than to indicate any specific order. Any figure marks in the claims should not be understood as limiting the scope of protection. The fact that certain technical features appear in different dependent claims does not mean that these technical features cannot be combined to achieve beneficial effects.

Claims

1. A display module, comprising: Display panel; A flexible circuit board, bound and connected to the display panel, the flexible circuit board comprising a substrate layer and a conductive layer stacked in layers, the conductive layer comprising a first grounding portion and a second grounding portion spaced apart; A connection structure is provided at one end of the flexible circuit board, and the connection structure at least includes an electrostatic input terminal, the electrostatic input terminal is electrically connected to the second grounding portion, and the first grounding portion is electrically connected to a grounding line in the display panel.

2. The display module according to claim 1, wherein: The flexible circuit board is further provided with a static electricity absorption element. The static electricity input end is electrically connected to the static electricity absorption element through the second grounding portion. The static electricity absorption element is used to absorb static electricity.

3. The display module according to claim 2, wherein: The first end of the electrostatic absorption element is electrically connected to the second grounding portion, and the second end of the electrostatic absorption element is electrically connected to the first grounding portion.

4. The display module according to claim 1, wherein: The impedance of the second grounding portion is greater than the impedance of the first grounding portion, and the cross-sectional area of ​​the second grounding portion is smaller than the cross-sectional area of ​​the first grounding portion.

5. The display module according to claim 1, wherein: Along the same straight line, the width of the second grounding portion is smaller than the width of the first grounding portion, and the second grounding portion includes a conductive trace.

6. The display module according to claim 1, wherein: Along the thickness direction of the flexible circuit board, an area of ​​an orthographic projection of the first grounding portion on the substrate layer is larger than an area of ​​an orthographic projection of the second grounding portion on the substrate layer.

7. The display module according to claim 2, wherein: The electrostatic absorption element comprises an inductor, a first end of the inductor is electrically connected to the second ground portion, and a second end of the inductor is electrically connected to the first ground portion; Alternatively, the electrostatic absorption element includes a magnetic bead, a first end of the magnetic bead is electrically connected to the second grounding portion, and a second end of the magnetic bead is electrically connected to the first grounding portion.

8. The display module according to claim 1, wherein: The display module includes a touch display module, and the display panel includes a touch display panel.

9. The display module according to claim 2, wherein: The flexible circuit board further comprises an insulating protective layer, which is located on a side of the conductive layer away from the substrate layer along the thickness direction of the flexible circuit board, and covers the conductive layer; The insulating protection layer is provided with a window area, the window area exposes a conductive portion located in the conductive layer, and the conductive portion is insulated from the first grounding portion; The conductive portion is electrically connected to the second grounding portion, or the conductive layer is further provided with a third grounding portion, the first grounding portion and the third grounding portion are spaced apart, and the conductive portion is electrically connected to the third grounding portion.

10. The display module according to claim 9, wherein: The third grounding portion is electrically connected to the first end of the electrostatic absorption element, and the second end of the electrostatic absorption element is electrically connected to the first grounding portion.

11. The display module according to claim 1, wherein: The conductive layer includes a first conductive layer. Along the thickness direction of the flexible circuit board, the first conductive layer is located on a first side of the substrate layer. The connecting structure, the first grounding portion and the second grounding portion are all located on the first conductive layer.

12. The display module according to claim 1, wherein: The conductive layer includes a first conductive layer and a second conductive layer. Along the thickness direction of the flexible circuit board, the first conductive layer is located on a first side of the substrate layer, and the second conductive layer is located on a second side of the substrate layer. The first side of the substrate layer is opposite to the second side of the substrate layer. The first grounding portion is located at the first conductive layer and / or the second conductive layer, the second grounding portion is located at the first conductive layer and / or the second conductive layer, and the connection structure is located at the first conductive layer or the second conductive layer.

13. The display module according to claim 12, wherein: The first grounding portion includes a first sub-portion and a second sub-portion, the first sub-portion and the second grounding portion are located in the first conductive layer, the first sub-portion and the second grounding portion are spaced apart, and the second sub-portion is located in the second conductive layer.

14. The display module according to claim 13, wherein: Along the thickness direction of the flexible circuit board, the orthographic projection of the second sub-portion on the substrate layer at least partially overlaps with the orthographic projection of the first sub-portion on the substrate layer, and the orthographic projection of the second sub-portion on the substrate layer also at least partially overlaps with the orthographic projection of the second grounding portion on the substrate layer; Along the thickness direction of the flexible circuit board, the area of ​​the orthographic projection of the second sub-portion on the substrate layer is larger than the sum of the area of ​​the orthographic projection of the first sub-portion on the substrate layer and the area of ​​the orthographic projection of the second grounding portion on the substrate layer.

15. The display module according to claim 12, wherein: The second grounding portion is located on the first conductive layer, and the second conductive layer is provided with a hollow area. Along the thickness direction of the flexible circuit board, the orthographic projection of the second grounding portion on the substrate layer and the orthographic projection of the hollow area on the substrate layer at least partially overlap; Alternatively, the second grounding portion is located in the second conductive layer, the first conductive layer is provided with a hollow area, and along the thickness direction of the flexible circuit board, the orthographic projection of the second grounding portion on the substrate layer and the orthographic projection of the hollow area on the substrate layer at least partially overlap.

16. The display module according to claim 1, wherein: The first end of the flexible circuit board is provided with the connection structure, the second end of the flexible circuit board is provided with a binding area, the binding area includes a plurality of binding pads, and the flexible circuit board is bound and connected to the display panel through the plurality of binding pads; At least one of the binding pads includes a ground pad, and the first ground portion is electrically connected to a ground line in the display panel through the ground pad.

17. The display module according to claim 16, wherein: The connection structure is electrically connected to a control mainboard of the display device, and the connection structure includes a gold finger or a connector.

18. The display module according to claim 16, wherein: The display module also includes a touch chip, which is bound and connected to the flexible circuit board. At least one of the binding pads includes a touch electrode pad, and the touch chip is electrically connected to the touch electrode in the display panel through the touch electrode pad.

19. The display module according to claim 18, wherein: The connection structure further includes a plurality of signal connection terminals arranged at intervals, the conductive layer further includes a plurality of signal lines, the plurality of signal connection terminals are electrically connected to the plurality of signal lines in a one-to-one correspondence, and the signal connection terminals are electrically connected to the pins of the touch control chip through the signal lines; The flexible circuit board is also provided with an electronic device, and the signal connection end is electrically connected to the pin of the touch chip through the signal line and the electronic device.

20. A display device, comprising the display module according to any one of claims 1 to 19.

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