Pre-melting device and welding apparatus

Abstract

A pre-melting device, comprising a first heat source (100), a heat transfer plate (200), a temperature measurement module (300) and a temperature control module. The heat transfer plate (200) is used for bearing a solar cell. The first heat source (100) is in contact with the heat transfer plate (200), and the first heat source (100) generates heat to the heat transfer plate (200), so as to contact-heat the solar cell, such that welding flux at each position of the solar cell is heated more uniformly and has substantially consistent melting processes, so as to reduce the situations in which the welding flux at some positions is excessively melted and the welding flux at some positions is insufficiently melted, helping to improve series welding effects. Also provided is a pre-melting apparatus.

Description

Pre-melting device and welding equipment

[0001] This application claims priority to the Chinese patent application with application number 2023226006579 filed with the Patent Office of China on September 22, 2023, and with the invention name “Pre-melting device and welding equipment”, the entire contents of which are incorporated by reference into this application. Technical Field

[0002] The present application relates to the field of photovoltaic power generation technology, and in particular to a pre-melting device and welding equipment. Background Art

[0003] Solar cell power generation is a sustainable source of clean energy. It uses the photovoltaic effect of semiconductor pn junction to convert sunlight into electrical energy.

[0004] In the prior art, to improve the string soldering performance of solar cells, solder is usually applied to the solder joints of the solar cells before string soldering, and then pre-melted and solidified in a curing oven. However, due to the difficulty in controlling the temperature field in the curing oven, the temperature at different locations in the curing oven varies, resulting in uneven curing. This can easily lead to excessive melting of the solder at some locations on the same solar cell, causing loss of height, thus making soldering difficult, and insufficient melting of the solder at some locations, causing it to fall off easily.

[0005] Therefore, how to melt the solder on the solar cell to improve the string soldering effect has become an urgent problem to be solved. Technical issues

[0006] One of the purposes of the embodiments of the present application is to provide a pre-melting device and welding equipment. Technical Solutions

[0007] The technical solution adopted in the embodiment of this application is:

[0008] In a first aspect, a pre-melting device is provided, comprising a first heat source, a heat conducting plate, a temperature detection module, and a temperature control module; the first heat source contacts the heat conducting plate, the temperature detection module is electrically connected to the temperature control module, and the temperature control module is electrically connected to the first heat source; the first heat source is used to generate heat; the heat conducting plate is used to support solar cells, the solar cells are provided with solder, and the heat generated by the first heat source is transmitted to the solar cells through the heat conducting plate; the temperature detection module is used to detect the temperature of the heat conducting plate; and the temperature control module is used to control the first heat source according to the detection result of the temperature detection module, so that the temperature of the heat conducting plate is within a preset range, and the preset range is associated with the melting point of the solder.

[0009] In one embodiment, the first heat source is a heating rod or a heating wire.

[0010] In one embodiment, the pre-melting device also includes a boss, which protrudes outward relative to the heat conducting plate; the heat generated by the first heat source is transmitted to the solar cell through the heat conducting plate and the boss, and the boss conducts the heat to the position where the solder is provided on the solar cell, with good heat transfer effect and high solder melting efficiency. In addition, by providing the boss, the contact area with the solar cell is reduced, making cleaning easier.

[0011] In one embodiment, there are at least two bosses, which are spaced apart to reduce the contact area with the solar cell. There are air gaps between adjacent bosses to facilitate the insertion of a clamp to hold the solar cell.

[0012] In one embodiment, the battery placement area of ​​the heat conducting plate is formed with an adsorption groove, which is used to adsorb the solar cells, thereby reducing the probability of the solar cells falling from the conveyor belt and reducing the warping of the solar cells.

[0013] In one embodiment, the solar cell includes a solder area where solder is disposed. The adsorption groove is staggered with the solder area, and heat is concentratedly conducted to the solder area, resulting in good heat transfer effect and high solder melting efficiency.

[0014] In one embodiment, the adsorption groove is in the shape of an elongated strip, and the length direction of the adsorption groove is perpendicular to the direction of the main grid of the solar cell, thereby increasing the adsorption area, achieving good adsorption effect and good heat transfer effect.

[0015] In one embodiment, the solder area is placed in a region of the heat conducting plate between two adjacent adsorption grooves.

[0016] In one embodiment, the pre-melting device also includes an adsorption interface and an adsorption device. The adsorption interface connects the adsorption tank and the adsorption device. The adsorption device is used to absorb the gas between the adsorption tank and the solar cell through the adsorption interface, so that the solar cell is adsorbed on the heat conduction plate, which has a good heat transfer effect and can reduce the warping of the solar cell.

[0017] In one embodiment, the difference between the temperature in the preset range and the melting point of the solder is 0° C.-20° C.

[0018] In one embodiment, the heating time of the first heat source is negatively correlated with the heating temperature.

[0019] In one embodiment, the heating temperature of the first heat source is 100°C-300°C.

[0020] In one embodiment, the contact surface between the heat conducting plate and the solar cell is provided with an anti-scratch layer to protect the solar cell.

[0021] In one embodiment, the contact surface between the heat conducting plate and the solar cell is a convex surface, which reduces the warping of the solar cell.

[0022] In one embodiment, the pre-melting device includes a heat-insulating cover, which covers the heat-conducting plate, thereby increasing the temperature uniformity of the conveyor belt, reducing heat loss, and lowering energy consumption.

[0023] In one embodiment, the pre-melting device includes a suction fan, the suction port of which is located on a side of the heat conducting plate supporting the solar cells, and the suction fan is used to absorb volatilized soldering flux.

[0024] In one embodiment, the pre-melting device includes a windshield, which is provided at the contact surface between the heat conducting plate and the solar cell. The windshield acts as a wind shield to prevent the solar cell from being displaced or even falling due to wind.

[0025] In one embodiment, the pre-melting device includes a second heat source, and the second heat source and the first heat source heat the solar cell together, which can increase the heating rate.

[0026] In one embodiment, the pre-melting device comprises an automatic optical detector for monitoring the melting of the solder.

[0027] In one embodiment, a heat-resistant layer is provided on the contact surface between the heat conducting plate and the solar cell.

[0028] In one embodiment, the pre-melting device includes a workbench, the workbench includes a linear guide rail and a driving member, and the driving member drives the heat conducting plate to move along the guide rail.

[0029] In one embodiment, the pre-melting device includes a workbench in a disc shape. The pre-melting device includes a driver, which drives the workbench to rotate and drives the heat conducting plate to rotate.

[0030] In one embodiment, the pre-melting device further includes a self-cleaning mechanism, which is used to clean dirt on the heat conducting plate.

[0031] In a second aspect, a welding device is provided, comprising the pre-melting device as described above. Beneficial effects

[0032] The beneficial effect of the pre-melting device provided in the embodiment of the present application is that: the pre-melting device provided in the present application includes a first heat source, a heat conducting plate, a temperature detection module and a temperature control module. Since the first heat source generates heat to the heat conducting plate, the heat conducting plate supports and heats the solar cell, so that contact heating of the solar cell can be achieved, so that the solder at various locations of the solar cell is heated more evenly, and the melting process of the solder is basically consistent, thereby reducing the situation where the solder at some locations is excessively melted and the solder at some locations is insufficiently melted, which is beneficial to improving the string soldering effect. BRIEF DESCRIPTION OF THE DRAWINGS

[0033] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the following briefly introduces the drawings required for use in the embodiments or exemplary technical descriptions. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.

[0034] FIG1 is a schematic structural diagram of an embodiment of a pre-melting device provided in an embodiment of the present application;

[0035] FIG2 is a schematic structural diagram of another embodiment of a pre-melting device provided in an embodiment of the present application;

[0036] Figure 3 is an enlarged schematic diagram of part A in Figure 1;

[0037] FIG4 is a schematic structural diagram of a pre-melting device according to an embodiment of the present application for placing solar cells;

[0038] FIG5 is a schematic structural diagram of an embodiment of a pre-melting device provided in an embodiment of the present application with a void-avoiding groove;

[0039] FIG6 is a schematic structural diagram of a convex surface of a heat conducting plate of an embodiment of a pre-melting device provided in an embodiment of the present application;

[0040] FIG7 is a schematic structural diagram of a convex surface-mounted solar cell according to an embodiment of a pre-melting device provided in an embodiment of the present application;

[0041] FIG8 is a schematic structural diagram of a fixed heating method of a pre-melting device according to an embodiment of the present application;

[0042] FIG9 is a schematic structural diagram of a fixed heating and loading and unloading method of a pre-melting device according to an embodiment of the present application;

[0043] FIG10 is a schematic structural diagram of a reciprocating heating method of a pre-melting device according to an embodiment of the present application;

[0044] FIG11 is a schematic structural diagram of a reciprocating heating and loading and unloading method of a pre-melting device according to an embodiment of the present application;

[0045] FIG12 is a schematic structural diagram of a turntable heating structure of an embodiment of a pre-melting device provided in an embodiment of the present application;

[0046] FIG13 is a schematic structural diagram of a turntable-type heating and loading and unloading pre-melting device according to an embodiment of the present application. Modes for Carrying Out the Invention

[0047] In order to make the purpose, technical solutions and advantages of this application more clearly understood, the present application is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not intended to limit this application.

[0048] It should be noted that when a component is referred to as being "fixed on" or "disposed on" another component, it may be directly on the other component or indirectly on the other component. When a component is referred to as being "connected to" another component, it may be directly or indirectly connected to the other component. The terms "upper", "lower", "left", "right", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings. They are only for the convenience of description and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, they cannot be understood as limitations on this application. For ordinary technicians in this field, the specific meanings of the above terms can be understood according to the specific circumstances. The terms "first" and "second" are only used for the purpose of convenience of description and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features. "Multiple" means two or more, unless otherwise clearly and specifically defined.

[0049] In order to illustrate the technical solution provided by this application, a detailed description is given below with reference to specific drawings and embodiments.

[0050] Some embodiments of the present application provide a pre-melting device, including a first heat source 100 , a heat conducting plate 200 , a temperature detection module 300 , and a temperature control module (not shown).

[0051] The first heat source 100 is in contact with the heat conducting plate 200, the temperature detection module 300 is electrically connected to the temperature control module, and the temperature control module is electrically connected to the first heat source 100; the first heat source 100 is used to generate heat; the heat conducting plate 200 is used to support the solar cell 400, and the solar cell 400 is provided with solder. The heat generated by the first heat source 100 is transmitted to the solar cell 400 through the heat conducting plate 200; the temperature detection module 300 is used to detect the temperature of the heat conducting plate 200; the temperature control module is used to control the first heat source 100 according to the detection result of the temperature detection module 300, so that the temperature of the heat conducting plate 200 is within a preset range, and the preset range is associated with the melting point of the solder.

[0052] Optionally, the heat conducting plate 200 is used to carry the solar cells 400 . Generally, the upper surface of the heat conducting plate 200 can be regarded as a carrying surface, and the solar cells 400 can be placed on the carrying surface.

[0053] Optionally, the heat conducting plate 200 is made of a material with high thermal conductivity, such as 6063 aluminum or 7075 aluminum, etc., without limitation.

[0054] Optionally, the heat conducting plate 200 contacts the first heat source 100, and the first heat source 100 can generate heat under the control of the temperature control module. The heat is conducted to the solar cell 400 via the heat conducting plate 200, and solder is provided on the solar cell 400 to melt the solder on the solar cell 400.

[0055] Optionally, the first heat source 100 may be a heating rod, a resistance wire, an electric heating wire, or other devices or apparatuses with the function of generating heat, without limitation.

[0056] Optionally, a plurality of first heat sources 100 may be provided on the heat conducting plate 200 , and the plurality of heat sources are electrically connected to the temperature control module, which can effectively improve the heating effect.

[0057] Optionally, the specifications of multiple first heat sources 100 can be the same. Taking the first heat source 100 as a heating rod as an example, the specifications of multiple heating rods are the same, so that the heating efficiency of the multiple heating rods remains consistent and the heating effect is also consistent, which facilitates temperature rise control.

[0058] In some possible embodiments, multiple first heat sources 100 are evenly distributed and in contact with the heat conducting plate 200. Taking the first heat source 100 as a heating rod as an example, multiple heating rods are evenly distributed and in contact with the heat conducting plate 200, so that the heating rods heat the heat conducting plate 200 more evenly, and then the heat conducting plate 200 heats the solar cell 400 more evenly, and the heating effect is good.

[0059] The temperature detection module 300 is used to detect the temperature of the heat conducting plate 200 . Optionally, the temperature detection module 300 may be a thermocouple or other components or devices with a temperature detection function, without limitation.

[0060] Optionally, multiple temperature detection modules 300 can be provided, and the multiple temperature detection modules 300 are distributed at different positions of the heat conducting plate 200. Preferably, the multiple temperature detection modules 300 are symmetrically and evenly distributed along the geometric center of the heat conducting plate 200, which can effectively improve the temperature detection accuracy.

[0061] It should be noted that the solder referred to in this application refers to a welding agent. During implementation, various types of welding agents, such as solder, can be used, and the above-mentioned preset interval also needs to be adjusted according to the type of welding agent, which will not be elaborated.

[0062] The temperature detection module 300 detects the temperature of the heat conducting plate 200 and transmits the detection result to the temperature control module, which then controls the first heat source 100 to keep the temperature of the heat conducting plate 200 within a preset range associated with the melting point of the solder.

[0063] Optionally, the preset interval can be set according to the melting point of the solder, for example, the value range of X is 0°C to 20°C, where the preset interval = the melting point of the solder + X, that is, the temperature of the heat conduction plate after heating is 0°C to 20°C higher than the melting point of the solder, thereby melting the solder.

[0064] Optionally, the value range of X of 0°C to 20°C is an example of an embodiment of the present application, and is not a specific limitation of the present application. In some other embodiments, X can also take other numerical ranges, for example, X can be designed to be 2°C to 15°C. Of course, X can also be any value between 0°C and 20°C, for example, X can be 5°C, 7°C, 10°C or 12°C, etc., as long as it can melt the solder while maintaining a certain height, without limitation.

[0065] For example, solder can be tin paste. Due to the diversity of tin paste types, the melting points of tin paste also vary. The melting point of tin paste is related to the alloy composition of the tin powder. For example, the melting point of lead-free low-temperature tin paste is around 140°C, the melting point of lead-free medium-temperature tin paste is around 180°C, the melting point of lead-free high-temperature tin paste is around 217°C, and the melting point of lead-free ultra-high-temperature tin paste is around 260°C. The melting point of leaded low-temperature tin paste is around 180°C, and the melting point of leaded high-temperature tin paste is around 296°C.

[0066] It is understood that a corresponding preset range can be set for each type of solder paste. For example, for lead-free low-temperature solder paste, the preset range can be set to 140°C to 143°C.

[0067] The heat conducting plate 200 contacts the solar cell 400 to conduct heat to the solar cell 400, so that the solder at various locations of the solar cell 400 is heated more evenly, and the melting process of the solder is basically consistent, thereby reducing the occurrence of excessive melting of the solder at some locations and insufficient melting of the solder at some locations, and can effectively improve the subsequent string soldering effect.

[0068] The pre-melting device provided in the present application includes a first heat source 100, a heat conducting plate 200, a temperature detection module 300, and a temperature control module. Since the first heat source 100 generates heat for the heat conducting plate 200, the heat conducting plate 200 supports and heats the solar cell 400, thereby achieving contact heating of the solar cell 400. This makes the solder at various locations of the solar cell 400 heated more evenly, and the melting process of the solder is basically consistent, thereby reducing the situation where the solder is over-melted in some locations and under-melted in some locations, which is conducive to improving the string soldering effect.

[0069] Example 2

[0070] In some embodiments, the pre-melting device provided in the present application further includes a boss 210 , which protrudes outward relative to the heat conducting plate 200 ;

[0071] The heat generated by the first heat source 100 is transferred to the solar cell 400 through the heat conducting plate 200 and the boss 210 .

[0072] During implementation, the boss 210 is a raised structure on the supporting surface of the heat conducting plate 200. When the solar cell 400 is placed on the heat conducting plate 200, the solar cell 400 contacts the boss 210, so that the heat generated by the first heat source 100 is transferred to the heat conducting plate 200, and then transferred from the heat conducting plate 200 to the solar cell 400 through the boss 210, so that the solder on the solar cell 400 is melted.

[0073] It can be understood that by providing the boss 210 , cleaning can be facilitated.

[0074] Optionally, the number of bosses 210 is at least two, and at least two bosses 210 are arranged at intervals. During implementation, an air avoidance groove 240 is formed between adjacent bosses 210. The air avoidance groove 240 can reduce the heating area of ​​the solar cell 400 and reduce the warping of the solar cell 400 due to heat. Moreover, when the solar cell 400 is placed on the heat conducting plate 200, the position of the solar cell 400 that does not need to be heated corresponds to the air avoidance groove 240, and the heat is concentratedly conducted to the solder, thereby improving the melting efficiency of the solder. It can also facilitate the insertion of a clamp into the air avoidance groove 240 from under the solar cell 400 to carry the solar cell 400.

[0075] Example 3

[0076] Furthermore, the battery placement area of ​​the heat conducting plate 200 is formed with an adsorption groove 220 , and the adsorption groove 220 is used to adsorb the solar cell 400 .

[0077] The heat conducting plate 200 is provided with a battery placement area. Specifically, the battery placement area is provided on the supporting surface of the heat conducting plate 200. When the solar cell 400 needs to be placed on the supporting surface, the solar cell 400 can be placed in a targeted manner aligned with the battery placement area.

[0078] Optionally, the battery placement area is provided with an adsorption groove 220, which can be regarded as a groove provided on the supporting surface. The adsorption groove 220 is connected to an external air suction device. For example, the heat conducting plate 200 is provided with an adsorption interface 230, and the adsorption groove 220 is connected to the adsorption interface 230 through a channel inside the heat conducting plate 200. The adsorption interface 230 is then connected to the external air suction device, so that the air between the adsorption groove 220 and the solar cell 400 can be absorbed by the external air suction device, so that a negative pressure is formed between the solar cell 400 and the heat conducting plate 200, so as to adsorb the solar cell 400 on the heat conducting plate 200, thereby reducing the probability of the solar cell 400 falling from the heat conducting plate 200, and the heat conducted from the heat conducting plate 200 to the solar cell 400 is more uniform, and the heat transfer effect is better, while also reducing the warping of the solar cell 400.

[0079] Example 4

[0080] Furthermore, the solar cell 400 includes a solder area where solder is disposed, and the adsorption groove 220 is staggered from the solder area.

[0081] During implementation, the solder area of ​​the solar cell 400 is used for printing solder. When the solar cell 400 is placed on the heat conducting plate 200, the suction force generated by the adsorption groove 220 can adsorb the solar cell 400 on the heat conducting plate 200, and the adsorption groove 220 is staggered with the solder area, so that the solder area contacts the heat conducting plate 200, so that heat can be quickly transferred to the solder area to accelerate the melting process of the solder, thereby improving the heat transfer effect and increasing the solder melting efficiency.

[0082] In some embodiments, the adsorption groove 220 is in the shape of an elongated strip, with the length of the adsorption groove 220 being perpendicular to the direction of the main grid of the solar cell 400. The elongated notch of the adsorption groove 220 increases the adsorption area and improves the adsorption effect. The length of the adsorption groove 220 is the direction in which the length of the elongated notch extends. When the solar cell 400 is placed on the heat conducting plate 200, the length of the adsorption groove 220 is perpendicular to the direction of the main grid of the solar cell 400. Solder is provided at predetermined intervals on the main grid of the solar cell 400, so the solder can be considered to be arranged in rows. The extension direction of the solder in the same row is parallel to the length of the adsorption groove 220, thereby staggering the adsorption groove 220 and the solder area (solder).

[0083] Optionally, the solder area is placed in the area of ​​the heat conducting plate 200 between two adjacent adsorption grooves 220. During implementation, the area between the two adsorption grooves 220 includes the portion of the heat conducting plate 200 that is used to directly contact the solar cell 400. By setting the solder area between two adjacent adsorption grooves 220, the heat conducting plate 200 concentrates heat and conducts it to the solder area, thereby achieving better heat transfer effect and higher solder melting efficiency.

[0084] Optionally, the size of the adsorption grooves 220 and the intervals between adjacent adsorption grooves 220 may be specifically set according to the size and position relationship between the solar cell 400 and the solder area, which will not be described in detail.

[0085] It should be noted that the above-mentioned adsorption groove 220 is in the shape of a long strip, which is an example of an embodiment of the present application, and not a specific limitation of the present application. During implementation, the adsorption groove 220 can be a whole long strip of groove, or it can be composed of several grooves to form the adsorption groove 220. Several grooves can be designed into point shape or other shapes without limitation.

[0086] Example 5

[0087] Furthermore, the pre-melting device also includes an adsorption interface 230 and an adsorption device. The adsorption interface 230 connects the adsorption tank 220 and the adsorption device. The adsorption device is used to absorb the gas between the adsorption tank 220 and the solar cell 400 through the adsorption interface 230, so that the solar cell 400 is adsorbed on the heat conduction plate 200.

[0088] During implementation, an adsorption groove 220 is provided on the surface of the side of the boss 210 facing the solar cell 400, and the heat conducting plate 200 is also provided with an adsorption interface 230 for communication, so that the adsorption device can absorb the air between the adsorption groove 220 and the solar cell 400, so that the contact between the heat conducting plate 200 and the solar cell 400 is closer, the heat transfer effect is better, and the warping of the solar cell caused by heating and cooling can be reduced.

[0089] Example 6

[0090] Furthermore, the heating time of the first heat source 100 is negatively correlated with the heating temperature.

[0091] Since the melting point of the solder is fixed, it is only necessary to raise the temperature of the solder to its melting point to melt the solder. The heating temperature of the first heat source 100 can be regarded as the temperature of the heat-conducting plate 200. When the heating temperature of the first heat source 100 is low, that is, when the temperature of the heat-conducting plate 200 is low, the time required for the heat-conducting plate 200 to conduct heat to the solder so that the temperature of the solder is raised to the melting point is long. When the heating temperature of the first heat source 100 is high, that is, when the temperature of the heat-conducting plate 200 is high, the time required for the heat-conducting plate 200 to conduct heat to the solder so that the temperature of the solder is raised to the melting point is shortened accordingly. Therefore, the heating time of the first heat source 100 is negatively correlated with the heating temperature. The specific relationship between the heating time of the first heat source 100 and the heating temperature is stored in the temperature control module, and the temperature control module controls the first heat source 100 according to the temperature of the heat-conducting plate 200 detected by the temperature detection module 300, which will not be described in detail.

[0092] Optionally, the heating temperature of the first heat source 100 is 100°C-300°C, which means that the first heat source 100 heats the heat conducting plate 200 so that the temperature of the heat conducting plate 200 after heating is 100°C-300°C. This can melt the solder while preventing the solder from excessively melting and losing height, thereby effectively improving the effect of subsequent welding.

[0093] Example 7

[0094] The contact surface between the heat conducting plate 200 and the solar cell 400 is provided with an anti-scratch layer 250 for protecting the solar cell 400 .

[0095] The contact surface between the heat conducting plate 200 and the solar cell 400 is the bearing surface of the heat conducting plate 200. Because the bearing surface contacts the solar cell 400, it can scratch or even wear the solar cell 400 during use, affecting the quality of the solar cell 400. By providing an anti-scratch layer 250 on the bearing surface, which can cover the entire bearing surface or a portion thereof, the anti-scratch layer 250 protects the solar cell 400, preventing scratches from the heat conducting plate 200 and ensuring the quality of the solar cell 400.

[0096] Example 8

[0097] In some embodiments, as shown in Figures 7 and 8 , the contact surface between the heat conducting plate 200 and the solar cell 400 is a convex surface (or, in other words, a curved surface). Compared to conventional solar cells 400 that experience significant warping after heating and cooling on a flat heating plate, the present invention effectively reduces the warping of the solar cell 400 after heating and cooling on the convex surface by designing the bearing surface to have a certain curvature, thereby ensuring the overall flatness of the solar cell 400.

[0098] It is understandable that in this eighth embodiment, the solar cell 400 is adsorbed onto the convex surface of the heat conducting plate 200 through the adsorption device, adsorption groove 220 and adsorption interface 230, so that the solar cell 400 can be adhered to the convex surface, reducing the warping of the solar cell 400.

[0099] Example 9

[0100] Furthermore, the pre-melting device includes a heat-insulating cover (not shown), which covers the heat-conducting plate 200 .

[0101] Optionally, the heat preservation cover can adopt a hollow cover-like structure to cover the heat conducting plate 200. During implementation, the heat preservation cover can adopt a heat preservation material or cover that is resistant to high temperature and has poor thermal conductivity, such as alumina ceramics, so as to increase temperature uniformity so that the solder melting process is basically consistent, while reducing heat loss and energy consumption.

[0102] Example 10

[0103] Furthermore, the pre-melting device provided in the present application includes a suction fan (not shown in the figure), the suction port of the suction fan is located on the side of the heat conducting plate 200 supporting the solar cell 400, and the suction fan is used to absorb the volatilized flux.

[0104] The suction fan can absorb the flux volatilized by the solder due to heating. During implementation, the suction fan can be installed on the pre-melting device or other positions, and the air inlet of the suction fan can be located on the side of the heat conducting plate 200 supporting the solar cell 400 to absorb the flux volatilized by the solder due to heating. There is no limitation.

[0105] Example 11

[0106] Furthermore, the pre-melting device provided in the present application includes a wind shield (not shown), which is provided on the contact surface between the heat conducting plate 200 and the solar cell 400 .

[0107] In practice, as shown in FIG8 , the pre-melting device provided herein can employ a fixed heating method. For example, the pre-melting device is provided with a base 600, on which one or more heating components can be mounted. Each heating component includes one or more heat conducting plates 200, and each heat conducting plate 200 can hold one or more solar cells 400. As shown in FIG9 , loading can be performed on one side and unloading can be performed on the opposite side. Loading and unloading can also be performed at other locations depending on the actual situation. One or more solar cells 400 can be loaded and unloaded at a time.

[0108] In some possible embodiments, the pre-melting device can adopt a mobile heating method, that is, the heat conducting plate 200 carries the solar cell 400 to drive the solar cell 400 to move and transport it to the next workstation, and achieves contact heating of the solar cell 400 during the moving and transporting process to melt the solder.

[0109] When a mobile heating method is adopted, a wind shield can be set on the bearing surface. The wind shield refers to a long strip-shaped protrusion set on the bearing surface. The length direction of the wind shield is perpendicular to the moving direction of the heat conducting plate 200, so as to achieve a wind shield function to ensure the stability of the solar cell 400 placed on the heat conducting plate 200 and prevent the solar cell 400 from being displaced or even falling due to the wind.

[0110] During implementation, the heat conducting plate 200 may be provided with multiple windshields. For example, a windshield may be provided in front of and behind the heat conducting plate 200 in its direction of movement, with the spacing between the two windshields being greater than the width of the solar cell 400. This allows the solar cell 400 to be placed between adjacent windshields, thus providing windshield protection during the reciprocating motion of the heat conducting plate 200. In some possible embodiments, the windshields may further enclose the solar cell 400. For example, four windshields may be provided on the support surface, forming a U-shaped space. The solar cell 400 may be placed within the U-shaped space enclosed by the windshields, providing windshield protection during transport and further strengthening the attachment between the solar cell 400 and the heat conducting plate 20.

[0111] Example 12

[0112] Furthermore, the pre-melting device provided in the present application includes a second heat source, and the second heat source and the first heat source 100 jointly heat the solar cell 400 .

[0113] The second heat source is a device that further heats the solar cell 400 based on the first heat source 100. The second heat source can also be called an auxiliary heat source. It is understood that by providing the second heat source, the melting rate of the solder can be accelerated.

[0114] Optionally, the second heat source uses an infrared heating device to achieve better heating effect.

[0115] Optionally, the second heat source may also be a hot air system, which blows hot air toward the surface of the solar cell 400 to make the surface temperature of the solar cell 400 more uniform.

[0116] In practice, when a second heat source is provided, for example, an infrared heating device, the first heat source 100 can be considered the primary heating device, and the infrared heating device can be considered the auxiliary heating device. Of course, the first heat source 100 can also be used as the auxiliary heating device, and the infrared heating device as the primary heating device. Similarly, when the second heat source is a hot air system, the first heat source 100 can be used as the primary heating device, and the hot air system can be used as the auxiliary heating device; or the first heat source 100 can be used as the auxiliary heating device, and the hot air system can be used as the primary heating device. This will not be elaborated further.

[0117] Example 13

[0118] In some embodiments, the pre-melting device provided by the present application includes an automatic optical detector (not shown), which is used to monitor the melting of the solder.

[0119] During implementation, the automatic optical detector can use AOI (Automated Optical Inspection) equipment. The AOI equipment is a device that detects common defects encountered in welding production based on optical principles, thereby monitoring the heating process of the solder or detecting the heating and melting effect of the solder, which can effectively improve product yield.

[0120] As an implementation method, the AOI equipment can detect the melting status of the solder in real time. The host computer adjusts the temperature control strategy based on the detection results or controls the robot to grab the solar cell at the appropriate time, or the system alarms when the AOI equipment detects that the heating effect is not good.

[0121] For example, if the AOI device detects that some of the solder on a solar cell is not melted, the host computer adjusts the temperature control strategy to increase the temperature of that area. If the AOI device detects that some of the solder on the solar cell is over-melted, the host computer adjusts the temperature control strategy to reduce the temperature of that area. Alternatively, the AOI device monitors the melting of the solder on the solar cell in real time. When the solder melts to a preset standard, the host computer controls the robotic arm to grasp the solar cell. Alternatively, if the AOI device detects that the solder melts below the preset standard, the system will issue an alarm.

[0122] Example 14

[0123] In some embodiments, a heat-resistant layer is provided on the contact surface between the heat conducting plate 200 and the solar cell 400 .

[0124] During implementation, the contact surface between the heat conducting plate 200 and the solar cell 400 is the aforementioned bearing surface, which is provided with a heat-resistant layer for protecting the solar cell 400 and preventing damage to the solar cell 400 due to high temperature.

[0125] Optionally, the heat-resistant layer can be made of a high-temperature resistant film or a spray-coated high-temperature resistant coating, for example, Teflon tape is affixed to the bearing surface of the heat conducting plate 200, or Teflon or other high-temperature resistant materials are sprayed on the bearing surface of the heat conducting plate 200 to protect the solar cell 400.

[0126] Optionally, the heat conducting plate 200 may be made of a material with a high thermal conductivity such as an aluminum alloy plate or a copper alloy. As another implementation method, the bearing surface of the heat conducting plate 200 may be hard-oxidized.

[0127] Example 15

[0128] In some embodiments, as shown in FIG. 10 , the pre-melting device provided in the present application includes a workbench 500 , and the workbench 500 includes a linear guide rail 510 and a driving member, and the driving member drives the heat conducting plate 200 to move along the guide rail.

[0129] The pre-melting device provided in the present application can adopt a reciprocating heating method, wherein a linear guide rail 510 is installed on the workbench 500, and the heat conducting plate 200 cooperates with the linear guide rail 510 so that the heat conducting plate 200 can reciprocate along the guide rail, thereby driving the solar cell 400 placed on the heat conducting plate 200 to reciprocate.

[0130] In practice, the pre-melting device provided herein includes one or more workbenches 500, each of which includes one or more heat-conducting plates 200. Each heat-conducting plate 200 can hold one or more solar cells 400. The heat-conducting plates 200 of each workbench 500 can reciprocate between two or more positions, thereby driving the solar cells 400 to reciprocate between two or more positions. As shown in FIG11 , loading can be performed on one side and unloading on the opposite side. Loading and unloading can also be performed at other positions depending on actual conditions. One or more solar cells 400 can be loaded and unloaded at a time.

[0131] Optionally, when loading or unloading, the solar cell 400 can be placed on the heat conducting plate 200 or removed by a robot.

[0132] In some possible embodiments, as shown in FIG12 , the pre-melting device provided in the present application includes a workbench 500 , which is disc-shaped. The pre-melting device includes a driver, which drives the workbench 500 to rotate, thereby driving the heat conducting plate 200 to rotate.

[0133] In practice, the pre-melting device provided herein can employ a turntable heating method, wherein one or more heating stations can be provided on a workbench 500, each station having one or more heat conducting plates 200, each heat conducting plate 200 being capable of holding one or more solar cells 400. Loading and unloading positions can be configured as shown in FIG13 , or alternatively, loading and unloading can be performed at other locations depending on practical circumstances, allowing for one or more solar cells 400 to be loaded and unloaded at a time.

[0134] Example 16

[0135] Optionally, the pre-melting device provided in the present application may also include a self-cleaning mechanism, which can clean the dirt on the heat conducting plate 200, on the one hand reducing the probability of the solar cell 400 being contaminated or damaged, and on the other hand making the solar cell 400 more closely contacted with the heat conducting plate 200, thereby improving the heating effect.

[0136] For example, the self-cleaning mechanism may be a negative pressure dust suction device. For another example, the self-cleaning structure may be a brush device.

[0137] Example 17

[0138] In some embodiments, the present application also provides a welding device comprising the pre-melting device as described above.

[0139] In the embodiment of the present application, the first heat source 100 generates heat for the heat conducting plate 200, so that the heat conducting plate 200 supports and heats the solar cell 400. Therefore, contact heating of the solar cell 400 can be achieved, so that the solder at various locations of the solar cell 400 is heated more evenly, and the melting process of the solder is basically consistent, thereby reducing the situation where the solder is over-melted in some locations and under-melted in some locations, which is conducive to improving the string soldering effect.

[0140] It is understandable that those skilled in the art can, under the guidance of the above embodiments, combine various implementation methods in the above embodiments to obtain technical solutions of multiple implementation methods.

[0141] The above are merely optional embodiments of the present application and are not intended to limit the present application. For those skilled in the art, the present application may have various modifications and variations. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present application should be included within the scope of the claims of the present application.

Claims

1. A pre-melting device, characterized in that: It includes a first heat source, a heat conducting plate, a temperature detection module, and a temperature control module; The first heat source is in contact with the heat conducting plate, the temperature detection module is electrically connected to the temperature control module, and the temperature control module is electrically connected to the first heat source; The first heat source is used to generate heat; The heat conducting plate is used to carry a solar cell, the solar cell is provided with solder, and the heat generated by the first heat source is transmitted to the solar cell through the heat conducting plate; The temperature detection module is used to detect the temperature of the heat conducting plate; The temperature control module is used to control the first heat source according to the detection result of the temperature detection module, so that the temperature of the heat conducting plate is within a preset range, and the preset range is associated with the melting point of the solder.

2. The pre-melting device according to claim 1, characterized in that: The first heat source is a heating rod or a heating wire.

3. The pre-melting device according to claim 2, characterized in that: The pre-melting device further comprises a boss, wherein the boss protrudes outward relative to the heat conducting plate; The heat generated by the first heat source is transmitted to the solar cell through the heat conducting plate and the boss.

4. The pre-melting device according to claim 3, characterized in that: The number of the bosses is at least two, and at least two of the bosses are arranged at intervals.

5. The pre-melting device according to claim 1, characterized in that: The battery placement area of ​​the heat conducting plate is formed with an adsorption groove, and the adsorption groove is used for adsorbing the solar cell.

6. The pre-melting device according to claim 5, characterized in that: The solar cell comprises a solder area where the solder is arranged, and the adsorption groove is staggered with the solder area.

7. The pre-melting device according to claim 5, characterized in that: The adsorption groove is in the shape of an elongated strip, and the length direction of the adsorption groove is perpendicular to the direction of the main grid of the solar cell.

8. The pre-melting device according to claim 6, characterized in that: The solder area is placed in the area of ​​the heat conducting plate between two adjacent adsorption grooves.

9. The pre-melting device according to claim 5, characterized in that: The pre-melting device also includes an adsorption interface and an adsorption device, wherein the adsorption interface is connected to the adsorption tank and the adsorption device, and the adsorption device is used to absorb the gas between the adsorption tank and the solar cell through the adsorption interface, so that the solar cell is adsorbed on the heat conducting plate.

10. The pre-melting device according to claim 1, characterized in that: The difference between the temperature in the preset interval and the melting point of the solder is 0° C.-20° C.

11. The premelting device according to any one of claims 1 to 10, characterized in that: The heating time of the first heat source is negatively correlated with the heating temperature.

12. The pre-melting device according to claim 1, characterized in that: The heating temperature of the first heat source is 100°C-300°C.

13. The pre-melting device according to claim 1, characterized in that: The contact surface between the heat conducting plate and the solar cell is provided with an anti-scratch layer.

14. The pre-melting device according to claim 9, characterized in that: The contact surface between the heat conducting plate and the solar cell is a convex surface.

15. The pre-melting device according to claim 1, characterized in that: The pre-melting device comprises a heat-insulating cover, and the heat-insulating cover covers the heat-conducting plate.

16. The pre-melting device according to claim 1, characterized in that: The pre-melting device comprises a suction fan, the suction port of which is located at a side of the heat conducting plate bearing the solar cell, and the suction fan is used to absorb volatilized soldering flux.

17. The pre-melting device according to claim 1, characterized in that: The pre-melting device comprises a wind shield, which is arranged on the contact surface between the heat conducting plate and the solar cell.

18. The premelting device according to claim 1, characterized in that: The pre-melting device includes a second heat source, and the second heat source and the first heat source heat the solar cell together.

19. The premelting device according to claim 1, characterized in that: The pre-melting device comprises an automatic optical detector, which is used to monitor the melting of the solder.

20. The premelting device according to claim 1, characterized in that: The contact surface between the heat conducting plate and the solar cell is provided with a heat resistant layer.

21. The premelting device according to claim 1, characterized in that: The pre-melting device comprises a workbench, and the workbench comprises a linear guide rail and a driving member, and the driving member drives the heat conducting plate to move along the guide rail.

22. The pre-melting device according to claim 1, characterized in that: The pre-melting device comprises a workbench, which is in a disc shape. The pre-melting device comprises a driver, which drives the workbench to rotate and drives the heat conducting plate to rotate.

23. The premelting device according to claim 1, characterized in that: The pre-melting device further comprises a self-cleaning mechanism, and the self-cleaning mechanism is used for cleaning dirt on the heat conducting plate.

24. A welding device, characterized in that: Comprising a pre-melting device according to any one of claims 1-23.

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