Substrate processing device

Abstract

According to the present invention, a substrate is held by a substrate holding device provided on a floor surface of a chamber. A brush device held by a brush arm is pressed against the substrate, and the substrate is cleaned. The brush device is held in the brush arm by a brush device holder to which a brush support shaft, a first connection member, a second connection member, and a rotation support mechanism are connected. The brush device holder holding the brush device is further supported by a piston of a double-acting air cylinder device. During a cleaning process of the substrate, the pressure in two spaces inside the double-acting air cylinder device is adjusted so that the force acting on the piston from the brush device holder is offset in a state in which a set pressing force is being applied to the substrate from the brush device.

Description

Substrate Processing Equipment

[0001] The present invention relates to a substrate processing apparatus that processes a substrate by bringing a cleaning tool into contact with the substrate.

[0002] Substrate processing apparatuses are used to perform various processes on substrates such as semiconductor substrates, substrates for FPDs (Flat Panel Displays) such as liquid crystal display devices or organic EL (Electro Luminescence) display devices, substrates for optical disks, substrates for magnetic disks, substrates for magneto-optical disks, substrates for photomasks, ceramic substrates, and substrates for solar cells.

[0003] As an example of such a substrate processing apparatus, a substrate processing apparatus described in Patent Document 1 includes a back surface cleaning unit that scrubs the back surface (one surface) of a substrate. The back surface cleaning unit includes a spin chuck, a brush, a holding arm, and a brush moving mechanism.

[0004] The spin chuck rotatably holds the substrate in a horizontal position. The holding arm holds a brush. A brush movement mechanism is connected to the holding arm. The brush movement mechanism moves the holding arm to bring the brush into contact with one surface of the substrate held and rotating by the spin chuck. The brush movement mechanism further moves the holding arm to move the brush over the one surface of the substrate. This cleans the one surface of the substrate.

[0005] In the holding arm, the brush is attached to the lower end of a rotating shaft that extends vertically. The rotating shaft is supported by the housing of the holding arm via a coil spring. Therefore, when the brush is not in contact with the substrate, the weight of the structure including the rotating shaft and the brush is offset by the elastic force of the coil spring.

[0006] Furthermore, the holding arm includes a built-in pressing actuator for pressing the rotating shaft downward to press the brush against the substrate while the brush is in contact with the surface of the substrate. The degree of cleaning power applied to the surface of the substrate varies depending on the pressing force (pressing force) applied by the brush to the surface of the substrate. Therefore, the pressing actuator presses the rotating shaft downward with a predetermined force to obtain a predetermined degree of cleaning power when cleaning the surface of the substrate.

[0007] JP 2009-206139 A

[0008] As various patterns formed on substrates become finer, more precise processing of the substrates is required, including the need to accurately clean one surface of the substrate with a predetermined cleaning power.

[0009] On the other hand, the substrate to be cleaned may have one or more films formed thereon. Alternatively, the substrate to be cleaned may have been subjected to a heat treatment or the like immediately before the cleaning. In this way, if the substrate to be cleaned has been subjected to one or more treatments in advance, there is a possibility that distortion (such as a bulge or a depression) may occur in the substrate.

[0010] When a substrate having localized distortion is held on a spin chuck, the height positions of the surface of the substrate held on the spin chuck will differ from one another. Therefore, when the holding arm moves horizontally during cleaning of the surface of the substrate, the distance between the holding arm and the substrate changes depending on the position on the surface of the substrate. When the distance between the holding arm and the substrate changes, the length of the coil spring built into the holding arm also changes.

[0011] The elastic force generated by the coil spring varies depending on the length of the coil spring. Therefore, if the elastic force generated by the coil spring varies across multiple areas of one surface of the substrate, it becomes difficult to accurately adjust the pressing force applied from the brush to the substrate. Taking into account the change in the elastic force generated by the coil spring, it is possible to measure the distance between the holding arm and the substrate and control the operation of the pressing actuator based on the measurement results. However, such control reduces the responsiveness of the adjustment of the pressing force applied from the brush to the substrate.

[0012] An object of the present invention is to provide a substrate processing apparatus that enables accurate adjustment of the pressing force applied to a substrate from a cleaning tool with high responsiveness.

[0013] A substrate processing apparatus according to one aspect of the present invention includes a substrate holding unit provided on a first installation surface and configured to hold a substrate, a cleaning tool that contacts one side of the substrate to process the substrate, a cleaning tool holder that holds the cleaning tool in a state where the cleaning tool faces the one side of the substrate held by the substrate holding unit, a pressing device that supports the cleaning tool holder, and a control unit, wherein the pressing device is disposed on a second installation surface having a predetermined positional relationship with the first installation surface and includes a cylinder member having an internal space, and a pair of cylinder members that are housed in the cylinder member and are arranged vertically in the internal space. The cleaning tool holder includes a piston that divides the chamber into one chamber and a second chamber, an axial member that extends from the piston above or below the cylinder member and has a tip connected to the cleaning tool holder, and a pressure adjustment device that adjusts the pressure in the first chamber and the pressure in the second chamber, and the control unit controls the pressure adjustment device to adjust the pressure in the first chamber and the second chamber so that, when the cleaning tool processes the substrate, a predetermined set pressing force is applied from the cleaning tool to the substrate and the force acting on the piston from the cleaning tool holder via the axial member is canceled out.

[0014] According to the present invention, it is possible to accurately adjust the pressing force acting on a substrate from a cleaning tool with high responsiveness when the substrate is processed using the cleaning tool.

[0015] FIG. 1 is a schematic plan view of a substrate processing apparatus according to an embodiment of the present invention. FIG. 2 is a diagram for explaining basic operations during a substrate cleaning process in the substrate processing apparatus of FIG. 1. FIG. 3 is a schematic plan view of a brush arm of FIG. 1. FIG. 4 is a longitudinal cross-sectional view of the brush arm taken along line A-A in FIG. 3. FIG. 5 is a longitudinal cross-sectional view of the brush arm taken along line B-B in FIG. 3. FIG. 6 is a longitudinal cross-sectional view of the brush arm taken along line C-C in FIG. 3. FIG. 7 is a diagram for explaining multiple members supported by a piston of a double-acting air cylinder device. FIG. 8 is a block diagram showing the configuration of a control system for the substrate processing apparatus of FIG. 1. FIG. 9 is a diagram for explaining a first example of cleaning condition information stored in the storage device of FIG. 8. FIG. 10 is a diagram for explaining a second example of cleaning condition information stored in the storage device of FIG. 8. FIG. 11 is a flowchart of a substrate cleaning process performed by a control unit.

[0016] A substrate processing apparatus according to an embodiment of the present invention will be described below with reference to the drawings. In the following description, the term "substrate" refers to a substrate for a flat panel display (FPD) used in a liquid crystal display device or an organic electroluminescence (EL) display device, a semiconductor substrate, an optical disk substrate, a magnetic disk substrate, a magneto-optical disk substrate, a photomask substrate, a ceramic substrate, a solar cell substrate, or the like.

[0017] In this embodiment, the substrate has a circular shape in a plan view excluding the portion where the notch is formed. The substrate also has a front surface on which a circuit is formed and a back surface opposite the circuit-forming surface. In the following description, regardless of whether it is the front surface or the back surface of the substrate, the surface facing upward of the two surfaces of the substrate will be referred to as the top surface of the substrate, and the surface facing downward of the two surfaces of the substrate will be referred to as the bottom surface of the substrate.

[0018] The substrate processing apparatus described below performs a cleaning process using a brush on a substrate to be processed. During the cleaning process, a predetermined cleaning liquid is supplied to the upper surface of the substrate while a brush is pressed against the upper surface of the substrate.

[0019] 1. Overall Configuration of Substrate Processing Apparatus Fig. 1 is a schematic plan view of a substrate processing apparatus according to one embodiment of the present invention. In Fig. 1 and certain figures following Fig. 2, arrows are added to indicate the mutually orthogonal X, Y, and Z directions to clarify the positional relationships. The X and Y directions are orthogonal to each other in a horizontal plane, and the Z direction corresponds to the up-down direction (vertical direction).

[0020] As shown in FIG. 1, the substrate processing apparatus 1 has a configuration in which multiple components are housed within a chamber CH, and includes a substrate holding device 10, a cup device 20, a nozzle device 30, a brush arm device 40, a brush device 50, a waiting pod 49, and a control unit 900.

[0021] The chamber CH has four side surfaces, a ceiling surface, and a floor (bottom surface) CHB. One side surface of the chamber CH is formed with a transfer opening (not shown) for transferring a substrate between the inside of the chamber CH and the outside of the chamber CH.

[0022] A substrate holding device 10 is provided at approximately the center of the floor CHB of the chamber CH. The substrate holding device 10 includes a spin base 11, a plurality of holding pins 12, a substrate holding drive unit 13 (FIG. 8), and a substrate rotation drive unit 14 (FIG. 8). The substrate rotation drive unit 14 includes, for example, a motor, and is fixed to the floor CHB of the chamber CH so that the rotation shaft of the motor faces upward. A disk-shaped spin base 11 is attached to the upper end of the rotation shaft.

[0023] The spin base 11 has an outer diameter larger than that of the substrate W to be processed. A plurality of holding pins 12 are provided on the peripheral portion of the upper surface of the spin base 11. Each of the plurality of holding pins 12 has an abutment portion. When the substrate W is placed on the spin base 11, each holding pin 12 is configured to be able to switch between a holding state in which the abutment portion abuts against the outer circumferential edge of the substrate W and a release state in which the abutment portion is separated from the substrate W. The substrate holding drive unit 13 includes, for example, a magnet and switches each holding pin 12 between the holding state and the release state using the magnetic force of the magnet. The abutment portions of the plurality of holding pins 12 in the holding state abut against multiple portions of the outer circumferential edge of the substrate W, thereby holding the substrate W on the spin base 11. In FIG. 1 , the outer shape of the substrate W held by the substrate holding device 10 is indicated by a dashed line.

[0024] The cup device 20 includes a cup body 21 and a cup lifting / lowering drive unit 22. The cup body 21 has a substantially cylindrical shape, surrounds the spin base 11 in a plan view, and extends in the Z direction. The cup body 21 is also provided to be movable in the Z direction.

[0025] The cup lifting drive unit 22 includes an actuator such as a motor or an air cylinder, and moves the cup body 21 between a predetermined cup upper position and a cup lower position. The cup upper position is the height position (vertical position) of the cup body 21 when the upper end of the cup body 21 is located above the substrate W held by the substrate holding device 10. The cup lower position is the height position of the cup body 21 when the upper end of the cup body 21 is located below the substrate W held by the substrate holding device 10.

[0026] The nozzle device 30 includes a fluid nozzle 31 and a fluid supply system 32. The fluid nozzle 31 is provided at a predetermined position above the substrate holding device 10 and the cup device 20. The fluid nozzle 31 is fixed so that its discharge port faces the rotation center SC of the spin base 11 of the substrate holding device 10. The fluid supply system 32 supplies a cleaning liquid to the fluid nozzle 31 during cleaning processing of the substrate W. As a result, the cleaning liquid is supplied to the upper surface of the substrate W held by the substrate holding device 10. The cleaning liquid is, for example, pure water (deionized water). Note that, instead of pure water, carbonated water, ozone water, hydrogen water, electrolytic ionized water, SC1 (a mixed solution of ammonia and hydrogen peroxide), TMAH (tetramethylammonium hydroxide), or the like can also be used as the cleaning liquid. The nozzle device 30 may also be configured to be able to spray a gas such as an inert gas from the fluid nozzle 31. Furthermore, the nozzle device 30 may have multiple fluid nozzles 31 capable of ejecting or spraying different fluids.

[0027] The brush arm device 40 includes a brush arm 41, a guide rail 43, an arm support unit 44, an arm horizontal drive unit 45, and an arm lift drive unit 46. The guide rail 43 is provided in the chamber CH so as to be adjacent to the substrate holding device 10 in the Y direction. The guide rail 43 extends in the X direction.

[0028] The arm support portion 44 is provided so as to be movable in the X direction along the guide rail 43. The arm horizontal drive portion 45 of this example includes a motor and moves the arm support portion 44 in the X direction under the control of a control portion 900, which will be described later. The brush arm 41 is supported by the arm support portion 44 so as to be movable (liftable) in the Z direction. The arm lift drive portion 46 of this example includes a motor and moves the brush arm 41 in the Z direction under the control of a control portion 900, which will be described later.

[0029] The brush arm 41 has a substantially rectangular parallelepiped shape and extends in the Y direction from the arm support portion 44 toward the substrate holding device 10. The tip of the brush arm 41 is configured as a brush holder 42 capable of holding a brush device 50 used for cleaning the substrate W. In the substrate processing apparatus 1 of Fig. 1, the brush holder 42 is located on an imaginary line L1 that passes through the rotation center SC of the spin base 11 and extends in the X direction in a plan view.

[0030] The brush device 50 includes a brush and has a cleaning surface that can come into contact with the upper surface of the substrate W. The brush is formed of, for example, a PVA (polyvinyl alcohol) sponge or a PVA sponge with abrasive grains dispersed therein.

[0031] In a plan view, the waiting pod 49 and the substrate holding device 10 are aligned on the virtual straight line L1. The waiting pod 49 is configured to be able to accommodate the brush device 50 held by the brush holding unit 42 in a clean state and to be able to clean the brush device 50. As indicated by the thick dotted line frame in Figure 1, in the substrate processing apparatus 1, a waiting position SP is set at a position overlapping the waiting pod 49 in a plan view. The control unit 900 controls the operation of each unit of the substrate processing apparatus 1. The control unit 900 will be described in detail below.

[0032] 2. Basic Cleaning Operation in Substrate Processing Apparatus Fig. 2 is a diagram for explaining the basic operation during cleaning processing of a substrate W in the substrate processing apparatus 1 of Fig. 1. In Fig. 2, a schematic plan view of the substrate processing apparatus 1 is shown in the upper part, and a schematic side view of the substrate processing apparatus 1 is shown in the lower part.

[0033] In the initial state of the cleaning process of the substrate W, the brush holder 42 that holds the brush device 50 is located at the standby position SP. The brush device 50 is housed in a standby pod 49. In addition, the cup body 21 is located at the below-cup position, and the discharge of the cleaning liquid from the fluid nozzle 31 is stopped.

[0034] When the cleaning process for the substrate W is started, the substrate W loaded into the substrate processing apparatus 1 is held by the substrate holding device 10 and rotated at a predetermined rotation speed. The cup body 21 is held in a position above the cup. Furthermore, a cleaning liquid is ejected from the fluid nozzle 31 toward the rotating substrate W.

[0035] 1 operate, the brush arm 41 is moved in the Z direction and the X direction. As a result, the brush device 50 held by the brush holder 42 is lifted up from the waiting pod 49 and pressed against the upper surface of the rotating substrate W. In this state, the brush device 50 is moved in the X direction along the imaginary straight line L1 in a plan view, as shown by the thick two-dot chain arrows a1 and a2 in FIG. In this manner, the upper surface of the substrate W is cleaned.

[0036] Once the upper surface of the substrate W has been cleaned, the brush device 50 is returned to its initial position. Furthermore, the fluid nozzle 31 stops discharging the cleaning liquid, and the substrate holding device 10 stops rotating the substrate W. Furthermore, the cup body 21 moves from the cup upper position to the cup lower position. This completes the cleaning process for the substrate W.

[0037] 2, the brush device 50 moves back and forth between the outer circumferential edge of the substrate W and the center of rotation SC of the spin base 11, but the brush device 50 may clean the substrate W by moving from one end to the other end of the substrate W along the imaginary straight line L1. Alternatively, the brush device 50 may clean the substrate W by moving only once between the outer circumferential edge of the substrate W and the center of rotation SC of the spin base 11.

[0038] 3. Configuration of Brush Arm 41 Figure 3 is a schematic plan view of the brush arm 41 of Figure 1. The brush arm 41 according to this embodiment has a configuration in which multiple members are housed in a housing H. The housing H has a top wall Ha (Figure 4), a bottom wall Hb, and four side walls Hc, Hd, He, and Hf. The top wall Ha is not shown in Figure 3. As a result, Figure 3 shows the internal configuration of the brush arm 41 in plan view.

[0039] Fig. 4 is a vertical cross-sectional view of the brush arm 41 taken along line A-A in Fig. 3, Fig. 5 is a vertical cross-sectional view of the brush arm 41 taken along line B-B in Fig. 3, and Fig. 6 is a vertical cross-sectional view of the brush arm 41 taken along line C-C in Fig. 3. In each of Figs. 4 to 6, some members inside the housing H are omitted as appropriate to make it easier to understand the internal configuration of the brush arm 41.

[0040] 3 and 4 , the bottom wall Hb of the housing H has a flat upper surface and a rectangular shape extending in the Y direction in plan view. The side walls Hc and Hd are formed to extend upward from two long sides of the bottom wall Hb that face each other in the X direction. The side walls He and Hf are formed to extend upward from two short sides of the bottom wall Hb that face each other in the Y direction.

[0041] An arm connection portion 41j is formed on one side wall He of the two side walls He, Hf of the housing H so as to extend outward in the Y direction from the housing H. The arm connection portion 41j is connected to the arm support portion 44 of FIG. 1 . This allows the brush arm 41 to be supported by the arm support portion 44. The other side wall Hf of the two side walls He, Hf of the housing H forms part of the brush holding portion 42. In other words, the side wall Hf is located at the tip of the brush arm 41.

[0042] The double-acting air cylinder device 100 is provided via a cylinder base 190 at approximately the center in the Y direction of the bottom wall Hb of the housing H. As shown in Figure 4, the double-acting air cylinder device 100 includes a cylinder member 110, a piston 121, and a shaft member 122. The cylinder member 110 is fixed onto the cylinder base 190 so that its axis extends in the Z direction.

[0043] The piston 121 is provided inside the cylinder member 110 and divides the internal space of the cylinder member 110 into a first chamber 111 and a second chamber 112 that are aligned in the Z direction. The first chamber 111 is located below the second chamber 112. The shaft member 122 is provided to extend from the piston 121 toward the top of the cylinder member 110. A portion of the shaft member 122, including its upper end, protrudes above the cylinder member 110 and is exposed to the outside of the cylinder member 110.

[0044] A first electropneumatic regulator 131 and a second electropneumatic regulator 132, which are provided outside the brush arm 41, are connected to the cylinder member 110 via piping (not shown). The first electropneumatic regulator 131 operates under the control of a control unit 900 (described later) and adjusts the pressure in the first chamber 111 by supplying air into the first chamber 111. The second electropneumatic regulator 132 operates under the control of the control unit 900 (described later) and adjusts the pressure in the second chamber 112 by supplying air into the second chamber 112. A force corresponding to the relationship between the pressure in the first chamber 111 and the pressure in the second chamber 112 acts on the piston 121.

[0045] A first connecting member 210 is connected to the upper end of the shaft member 122. The first connecting member 210 is made of a rod-shaped member having high rigidity, and one end thereof is rigidly connected (coupled) to the shaft member 122. In this state, the first connecting member 210 extends in the Y direction from the upper end of the double-acting air cylinder device 100 to the position of the brush holder 42. A second connecting member 220 is rigidly connected (coupled) to the other end of the first connecting member 210.

[0046] 6 , the second connecting member 220 is an inverted L-shaped member when viewed in the Y direction, and has a portion extending in the X direction and a portion extending in the Z direction. In the following description, the portion of the second connecting member 220 that extends in the X direction is referred to as a horizontal portion 221. The portion of the second connecting member 220 that extends in the Z direction is referred to as a vertical portion 222.

[0047] In the brush holding portion 42 of the brush arm 41, a through hole 34h is formed in the bottom wall Hb, which connects the internal space of the housing H with the space below the housing H. The horizontal portion 221 of the second connecting member 220 is disposed above the through hole 34h so as to overlap with the through hole 34h in the Z direction. A rotation support mechanism 290 is attached to the horizontal portion 221.

[0048] In the brush holding portion 42, the brush device 50 is supported by the brush support shaft 34 at a position below the bottom wall Hb. The rotation support mechanism 290 includes a bearing (not shown) and supports one end of the brush support shaft 34 rotatably about the axis of the brush support shaft 34. While supported by the rotation support mechanism 290, the brush support shaft 34 extends in the Z direction through the through-hole 34h to a position below the housing H. The brush device 50 is attached to the other end (lower end) of the brush support shaft 34.

[0049] A linear guide 230 is provided on the upper surface of the bottom wall Hb at a position to the side of the through-hole 34h in the X direction (a position between the through-hole 34h and the side wall Hd). The linear guide 230 extends upward from the bottom wall Hb. A guide groove extending in the Z direction is formed in the linear guide 230. The vertical portion 222 of the second connecting member 220 is fitted into the guide groove of the linear guide 230 along the Z direction. As a result, the linear guide 230 restricts the movement direction of the second connecting member 220 in the Z direction.

[0050] In the brush arm 41 according to the present embodiment, the brush device 50 is supported by the brush support shaft 34 so as to be rotatable about an axis in the Z direction, i.e., so as to be able to rotate on its own axis. By rotating the brush device 50 on its own axis during the cleaning process of the substrate W, the efficiency of the cleaning process of the substrate W is improved. In order to rotate the brush device 50 on its own axis, a motor 300 is provided inside the brush arm 41 for rotating the brush support shaft 34 on its own axis.

[0051] Specifically, as shown in Fig. 3, the motor 300 is provided via a motor base 390 at a position on the bottom wall Hb of the housing H between the double-acting air cylinder device 100 and the brush holder 42 in the Y direction. As shown in Fig. 5, the motor 300 is supported on the motor base 390 so that its rotation shaft extends downward. A rotational force transmission mechanism 310 is provided between the rotation shaft of the motor 300 and the brush support shaft 34 to transmit the rotational force generated in the motor 300 to the brush support shaft 34.

[0052] The rotational force transmission mechanism 310 includes two pulleys 311 and 312 and a belt 313. The pulley 311 is attached to the tip of the rotary shaft of the motor 300. More specifically, the pulley 311 is fixed to the rotary shaft of the motor 300 so as to be unrotatable and unmovable in the axial direction of the rotary shaft.

[0053] The pulley 312 is rotatably supported on the bottom wall Hb via a base (not shown) including a bearing. As a result, the pulley 312 is fixed at the same position (height position) as the pulley 311 in the Z direction. In this state, the pulley 312 is attached to the brush support shaft 34 by a serration structure. As a result, the pulley 312 cannot rotate relative to the brush support shaft 34 but can move in the axial direction of the brush support shaft 34. The belt 313 is stretched between the two pulleys 311 and 312.

[0054] 5, a motor drive circuit 301 provided outside the brush arm 41 is connected to the motor 300. The motor drive circuit 301 supplies current to the motor 300 under the control of a control unit 900 (described later), causing the motor 300 to rotate.

[0055] When the motor 300 is operating, the rotational force generated by the motor 300 is transmitted from the rotary shaft of the motor 300 to the brush support shaft 34 through the pulley 311, the belt 313, and the pulley 312. As described above, the pulley 312 is supported so as to be movable relative to the brush support shaft 34 in the axial direction of the brush support shaft 34. Therefore, even when the brush support shaft 34 moves in the Z direction, this movement does not affect the transmission of the rotational force from the motor 300 to the brush support shaft 34.

[0056] In the brush arm 41 having the above-described configuration, the pressing force of the brush device 50 against the substrate W is adjusted by adjusting the force acting on the piston 121 of the double-acting air cylinder device 100 during cleaning processing of the substrate W.

[0057] When the brush device 50 is not in contact with the substrate W, the brush device 50 and the plurality of members constituting part of the brush arm 41 are supported by the piston 121 of the double-acting air cylinder device 100. As a result, the weight of the plurality of members acts on the piston 121 of the double-acting air cylinder device 100 via the shaft member 122.

[0058] FIG. 7 is a diagram illustrating multiple members supported by the piston 121 of the double-acting air cylinder device 100. In FIG. 7, a schematic plan view of the brush arm 41 is shown in the upper part. In this schematic plan view, as in the example of FIG. 3, the upper wall Ha of the housing H is omitted. Furthermore, in FIG. 7, a vertical cross-sectional view taken along line A-A in FIG. 3 is shown in the middle part, and a vertical cross-sectional view taken along line C-C in FIG. 3 is shown in the lower part. In each view of FIG. 7, the multiple members supported by the piston 121 are marked with a dot pattern to make them easy to identify.

[0059] 7, in the brush arm 41 of this example, the first connecting member 210, the second connecting member 220, the rotation support mechanism 290, and the brush support shaft 34, which are all connected together, correspond to the plurality of members supported by the piston 121. In the following description, the structure consisting of the first connecting member 210, the second connecting member 220, the rotation support mechanism 290, and the brush support shaft 34, which are all connected together, will be referred to as the brush device holder.

[0060] When the pressure in the first chamber 111 (FIG. 4) and the second chamber 112 (FIG. 4) in the cylinder member 110 is adjusted and the piston 121 moves in the Z direction, the brush device holder also moves in the Z direction, as shown by the outline arrow in FIG. 7. The range in the Z direction over which the brush device holder can move within the housing H is equal to the range over which the piston 121 can move up and down in the cylinder member 110.

[0061] 4. Control of the double-acting air cylinder device 100 during cleaning processing of the substrate W In the substrate processing apparatus 1 according to this embodiment, before cleaning processing of the substrate W, a pressing force (hereinafter referred to as a set pressing force) to be applied from the brush device 50 to each part of the upper surface of the substrate W is determined. When determining the set pressing force, for example, the degree of contamination on the upper surface of the substrate W, the distribution of contamination on the upper surface of the substrate W, the method of cleaning processing of the substrate W, etc. are taken into consideration.

[0062] Here, the set pressing force corresponding to a portion of the upper surface of the substrate W is defined as "F", and the mass of the brush device holder is defined as "M". Furthermore, the area of ​​one face of the piston 121 which forms the first chamber 111 of the cylinder member 110 and is perpendicular to the axial direction of the cylinder member 110 is defined as "S1", and the area of ​​the other face of the piston 121 which forms the second chamber 112 of the cylinder member 110 and is perpendicular to the axial direction of the cylinder member 110 is defined as "S2". Furthermore, the pressure in the first chamber 111 is defined as "P1", and the pressure in the second chamber 112 is defined as "P2".

[0063] In this case, in order to properly clean a portion of the upper surface of the substrate W with the set pressing force, the following formula (1) must be satisfied when the cleaning surface of the brush device 50 is in contact with that portion of the upper surface of the substrate W. Note that "g" in formula (1) represents the acceleration of gravity.

[0064] F=Mg-(S1×P1)+(S2×P2) (1) Of the multiple elements expressed in equation (1), "F" is a predetermined fixed value, and "M," "S1," and "S2" are values ​​that cannot be changed due to the structure of the brush arm 41. Therefore, in the present embodiment, the values ​​of "P1" and "P2" are determined for each part of the upper surface of the substrate W to establish the above equation (1). Furthermore, with the brush device 50 in contact with each part of the upper surface of the substrate W, the value of the pressure "P1" in the first chamber 111 and the value of the pressure "P2" in the second chamber 112 are adjusted to be predetermined values ​​corresponding to the part.

[0065] When equation (1) is established, when a set pressing force is applied from the brush device 50 to a portion of the upper surface of the substrate W during cleaning processing of the substrate W, the force acting on the piston 121 from the brush device holder through the shaft member 122 is canceled out.

[0066] In this embodiment, the value of pressure "P1" in the first chamber 111 set for the entire upper surface of the substrate W is set as a fixed value to a value that offsets the weight of the brush device holder acting on the piston 121. In other words, the value of pressure "P1" in the first chamber 111 is set as a fixed value to a value that offsets the force acting on the piston 121 when the set pressing force is "0". This fixed value is the value obtained by multiplying the mass of the brush device holder by the gravitational acceleration (the weight of the brush device holder) and dividing it by the area "S1" of one surface of the piston 121.

[0067] On the other hand, the value of the pressure "P2" in the second chamber 112 set for each part of the upper surface of the substrate W is set to a value corresponding to the set pressing force of that part. The value corresponding to the set pressing force is a value obtained by dividing the set pressing force by the area "S2" of the other surface of the piston 121.

[0068] Pressure information indicating the value of pressure "P1" in the first chamber 111 and the value of pressure "P2" in the second chamber 112 set for each portion of the upper surface of the substrate W is stored in a storage device 904 ( FIG. 8 ) of the control unit 900, which will be described later, as part of the cleaning conditions, which will be described later. When the substrate W is cleaned, the first electropneumatic regulator 131 and the second electropneumatic regulator 132 operate based on the cleaning conditions. As a result, when the substrate W is cleaned, the value of pressure "P1" in the first chamber 111 and the value of pressure "P2" in the second chamber 112 of the double-acting air cylinder device 100 are adjusted to the set values.

[0069] 5. Control System of the Substrate Processing Apparatus 1 The control system of the substrate processing apparatus 1 will be described below, along with the configuration of the control unit 900 in FIG. 1 . FIG. 8 is a block diagram showing the configuration of the control system of the substrate processing apparatus 1 in FIG. 1 . As shown in FIG. 8 , the control unit 900 includes a CPU (Central Processing Unit) 901, a RAM (Random Access Memory) 902, a ROM (Read Only Memory) 903, and a storage device 904. The RAM 902 is used as a work area for the CPU 901. The ROM 903 stores a system program. The storage device 904 includes a storage medium such as a hard disk or semiconductor memory, and stores a substrate cleaning program for performing a cleaning process on the substrate W and cleaning conditions set in association with the cleaning process on the substrate W. In addition to the pressure information, the cleaning conditions include rotational speed information regarding the rotational speed of the substrate W and path information indicating the movement path and movement speed of the brush device 50 on the upper surface of the substrate W during the cleaning process.

[0070] The substrate cleaning program may be provided in a state stored in a recording medium such as a CD-ROM 909, and may be installed in the ROM 903 or the storage device 904. Alternatively, the substrate cleaning program may be distributed from a server external to the substrate processing apparatus 1 via a communication network, and may be installed in the ROM 903 or the storage device 904.

[0071] The CPU 901 executes the substrate cleaning program to control the operation of each part of the substrate processing apparatus 1. Specifically, the control unit 900 controls the substrate holding and driving unit 13. As a result, the control unit 900 transitions the state of the plurality of holding pins 12 from an open state to a holding state, thereby causing the substrate W to be loaded into the substrate processing apparatus 1 to be held by the substrate holding device 10. The control unit 900 also transitions the state of the plurality of holding pins 12 from a holding state to a released state in order to unload the substrate W from the substrate processing apparatus 1. Furthermore, the control unit 900 controls the substrate rotation and driving unit 14 based on the cleaning conditions (rotation speed information) stored in the storage device 904. As a result, the substrate W held by the substrate holding device 10 rotates at a preset speed during the cleaning process of the substrate W.

[0072] The control unit 900 also controls the cup lifting / lowering drive unit 22. This causes the cup body 21 in Fig. 1 to move between the cup upper position and the cup lower position during the cleaning process of the substrate W. The control unit 900 also controls the fluid supply system 32. This causes the cleaning liquid to be ejected onto the substrate W from the fluid nozzle 31 in Fig. 1 during the cleaning process of the substrate W.

[0073] Furthermore, the control unit 900 controls the arm horizontal drive unit 45 and the arm elevation drive unit 46 based on the cleaning conditions (path information) stored in the storage device 904. As a result, the brush arm 41 moves within the chamber CH when the substrate W is subjected to cleaning processing.

[0074] In this embodiment, each of arm horizontal drive unit 45 and arm lifting drive unit 46 includes a motor with a built-in encoder as a power source. Therefore, control unit 900 obtains the positions of brush arm 41 in the X and Z directions based on the outputs of the encoders of arm horizontal drive unit 45 and arm lifting drive unit 46. This allows control unit 900 to grasp the positional relationship between brush arm 41 and floor CHB of chamber CH.

[0075] Furthermore, the control unit 900 controls the motor drive circuit 301. As a result, during the cleaning process of the substrate W, the control unit 900 operates the motor 300 built into the brush arm 41, thereby causing the brush device 50 to rotate at a predetermined rotational speed.

[0076] Furthermore, during cleaning processing of the substrate W, the control unit 900 controls the first electropneumatic regulator 131 and the second electropneumatic regulator 132 based on the positional relationship between the substrate W and the brush arm 41 and the cleaning conditions (pressure information) stored in the storage device 904. As a result, the brush device 50 is pressed against each part of the upper surface of the substrate W with a predetermined set pressing force.

[0077] 8 , the substrate processing apparatus 1 further includes an operation unit 990. The operation unit 990 includes a keyboard and a pointing device and is configured to be operable by a user. By operating the operation unit 990, the user can input various types of information, such as the pressure information, rotation speed information, and path information, as cleaning conditions. When various types of information are input, the control unit 900 stores the input information in the storage device 904 as cleaning conditions.

[0078] 6. Examples of Cleaning Conditions Figure 9 is a diagram for explaining a first example of cleaning conditions stored in the storage device 904 of Figure 8. The cleaning conditions according to the first example include the pressure information, rotational speed information, and path information described above. In the cleaning conditions according to the first example, the rotational speed information is set so that the rotational speed of the substrate W is maintained constant at a predetermined value during the cleaning process of the substrate W.

[0079] The upper half of Fig. 9 shows, in a time chart, pressure information indicating the value of the pressure "P1" in the first chamber 111, pressure information indicating the value of the pressure "P2" in the second chamber 112, and path information. A balloon on the left of the lower half of Fig. 9 shows, in a plan view, the position on the substrate W of the brush device 50 to be disposed at time t1 when the cleaning process of the substrate W is started. A balloon in the center of the lower half of Fig. 9 shows, in a plan view, the position on the substrate W of the brush device 50 to be disposed at time t2, which is intermediate between the start and end of the cleaning process of the substrate W. A balloon on the right of the lower half of Fig. 9 shows, in a plan view, the position on the substrate W of the brush device 50 to be disposed at time t3 when the cleaning process of the substrate W is ended.

[0080] 9, the symbol "EP" represents the position of the brush device 50 in the X direction when the brush device 50 overlaps the outer peripheral edge of the substrate W or a portion in the vicinity thereof on the imaginary line L1. The symbol "CP" represents the position of the brush device 50 in the X direction when the brush device 50 overlaps the center of rotation SC of the spin base 11 in FIG. It is assumed that the center of the substrate W is located on the center of rotation SC of the spin base 11.

[0081] 9 , when the cleaning process of the substrate W is started, the brush device 50 is pressed against the center of the rotating substrate W at time t1. Next, the brush device 50 moves toward the outer peripheral edge of the substrate W at a constant speed. At time t2, the brush device 50 is pressed against the peripheral edge of the upper surface of the rotating substrate W. Thereafter, the brush device 50 moves toward the center of the substrate W at a constant speed, and reaches the center of the substrate W at time t3.

[0082] In this way, while the brush device 50 moves on the imaginary straight line L1, the pressure "P1" in the first chamber 111 of the double-acting air cylinder device 100 is maintained constant at a value α, and the pressure "P2" in the second chamber 112 is maintained constant at a value β.

[0083] In this example, the value α of the pressure "P1" in the first chamber 111 is a fixed value that offsets the weight of the brush device holder. On the other hand, the value β of the pressure "P2" in the second chamber 112 is a value that corresponds to the set pressing force. As a result, during the cleaning process of the substrate W, a set pressing force of a constant magnitude is applied to the entire surface of the substrate W from the brush device 50 that scans over the upper surface of the substrate W. Therefore, under the cleaning conditions of the first example, the entire surface of the substrate W is cleaned with a uniform pressing force.

[0084] Figure 10 is a diagram for explaining a second example of cleaning conditions stored in the storage device 904 of Figure 8. In Figure 10, as with the example of Figure 9, the upper half of the figure shows pressure information indicating the value of the pressure "P1" in the first chamber 111, pressure information indicating the value of the pressure "P2" in the second chamber 112, and path information in a time chart. The lower half of the figure shows, in a plan view, the positions of the brush device 50 on the substrate W at three times t1, t2, and t3 from the start to the end of the cleaning process of the substrate W. Differences between the cleaning conditions of the second example and the cleaning conditions of the first example will be described.

[0085] The cleaning conditions according to the second example are an example of cleaning conditions in which different magnitudes of set pressing force are set at multiple portions of the upper surface of the substrate W, and as shown in Fig. 10, the pressure information indicating the value of the pressure "P2" in the second chamber 112 is different from that in the first example. Specifically, in this example, the value of the pressure "P2" in the second chamber 112 is set to continuously increase from 0 to β while the brush device 50 moves from the center of the substrate W toward the outer circumferential edge of the substrate W. Furthermore, the value of the pressure "P2" in the second chamber 112 is set to continuously decrease from β to 0 while the brush device 50 moves from the outer circumferential edge of the substrate W toward the center of the substrate W.

[0086] As described above, in this embodiment, the value of the pressure "P2" in the second chamber 112 is a value corresponding to the set pressing force of that portion. Therefore, when the cleaning process of the substrate W is performed under the cleaning conditions of the second example, the pressing force acting on the substrate W from the brush device 50 continuously increases while the brush device 50 moves from the center of the substrate W toward the outer circumferential edge of the substrate W. Furthermore, the pressing force acting on the substrate W from the brush device 50 continuously decreases while the brush device 50 moves from the outer circumferential edge of the substrate W toward the center of the substrate W. Therefore, under the cleaning conditions of the second example, the upper surface of the substrate W is cleaned with a lower pressing force closer to the center of the substrate W and with a higher pressing force farther from the center of the substrate W.

[0087] 11 is a flowchart of the substrate cleaning process performed by the control unit 900. The substrate cleaning process described below is performed by the CPU 901 of the control unit 900 executing a substrate cleaning program stored in the storage device 904 on the RAM 902.

[0088] When the substrate cleaning process is started, the CPU 901 reads out the value of the pressure "P1" in the first chamber 111 to be currently adjusted from the pressure information of the cleaning conditions stored in the storage device 904 (step S11). The CPU 901 also controls the first electropneumatic regulator 131 to adjust the pressure "P1" in the first chamber 111 to the read value (step S12).

[0089] Next, the CPU 901 reads out the value of the pressure "P2" in the second chamber 112 to be currently adjusted from the pressure information of the cleaning conditions stored in the storage device 904 (step S13).The CPU 901 also controls the second electropneumatic regulator 132 to adjust the pressure "P2" in the second chamber 112 to the read-out value (step S14).

[0090] Next, the CPU 901 reads the current destination position from the path information stored in the storage device 904 (step S15). The CPU 901 also controls the arm horizontal drive unit 45 and the arm lift drive unit 46 to move the brush device 50 to the read position (step S16). Thereafter, the CPU 901 detects the position of the brush device 50 based on the outputs of the encoders of the arm horizontal drive unit 45 and the arm lift drive unit 46 (step S17).

[0091] Next, the CPU 901 reads the position (end position) of the brush device 50 at the end of the cleaning process from the path information stored in the memory device 904, and determines whether the brush device 50 detected in step S17 has reached the end position (step S18).

[0092] If the brush device 50 has reached the end position in step S18, the CPU 901 ends the process. On the other hand, if the brush device 50 has not reached the end position in step S18, the CPU 901 returns the process to step S11. The time required for the series of processes from step S11 to S18 is very short, for example, a few seconds or less.

[0093] In this embodiment, the value of the pressure "P1" in the first chamber 111 is maintained at a predetermined value (e.g., α in FIGS. 9 and 10) during the cleaning process of the substrate W. Therefore, after the substrate cleaning process is started and once the processes of steps S11 and S12 have been performed, the processes of steps S11 and S12 do not need to be performed. That is, the CPU 901 may return the process to step S13 after the process of step S18.

[0094] 10, if the value of the pressure "P2" in the second chamber 112 is also maintained at a predetermined value (e.g., β in FIG. 10) during the cleaning process of the substrate W, once the substrate cleaning process has started and the processes of steps S13 and S14 have been performed, the processes of steps S13 and S14 do not need to be performed. That is, the CPU 901 may return the process to step S15 after the process of step S18.

[0095] 8. Effects (a) In the above-described substrate processing apparatus 1, the substrate W held by the substrate holding device 10 is cleaned using the brush device 50. The brush device 50 is held by a brush device holder of the brush arm 41, and the brush device holder is supported on the housing H of the brush arm 41 by a double-acting air cylinder device 100. The double-acting air cylinder device 100 includes a cylinder member 110, and a piston 121 is provided within the cylinder member 110 to divide the internal space of the cylinder member 110 into a first chamber 111 and a second chamber 112.

[0096] With this configuration, the pressing force acting from the brush device 50 on the upper surface of the substrate W can be adjusted by adjusting the pressure "P1" in the first chamber 111 and the pressure "P2" in the second chamber 112. When the brush device 50 is performing a cleaning process on the substrate W, the first electropneumatic regulator 131 and the second electropneumatic regulator 132 are controlled in a state in which a predetermined set pressing force is acting on the substrate W from the brush device 50. This adjusts the pressure "P1" in the first chamber 111 and the pressure "P2" in the second chamber 112 of the cylinder member 110, and cancels out the force acting from the brush device holder on the piston 121 of the double-acting air cylinder device 100.

[0097] As a result, even if the distance between the brush arm 41 and the substrate W changes due to distortion of the substrate W, one side of the substrate W can be properly cleaned with the pressing force acting on the substrate W from the brush device 50 adjusted to the set pressing force. Furthermore, the shaft member 122 of the double-acting air cylinder device 100 is rigidly connected to the brush device holder. As a result, the pressure acting on the shaft member 122 from the piston 121 acts directly on the brush device 50 via the brush device holder. Therefore, the response of the adjustment of the pressing force of the brush device 50 by controlling the first electropneumatic regulator 131 and the second electropneumatic regulator 132 is high.

[0098] As a result, the pressing force applied to the substrate W from the brush device 50 can be adjusted accurately with high responsiveness.

[0099] (b) In the substrate processing apparatus 1 described above, the brush arm 41 is moved in the X direction and the Z direction by the arm horizontal drive unit 45 and the arm lift drive unit 46. This allows a wider area of ​​the upper surface of the substrate W to be easily cleaned by the brush device 50.

[0100] (c) In the substrate processing apparatus 1 described above, cleaning conditions are stored in the storage device 904 for each substrate W to be processed. The cleaning conditions include pressure information as information relating to the set pressing force of each part of the substrate W. As a result, the CPU 901 of the control unit 900 controls the first electropneumatic regulator 131 and the second electropneumatic regulator 132 based on the pressure information stored in the storage device 904 during the cleaning process of the substrate W. In this case, there is no need for feedback control such as measuring the pressing force acting on the substrate W from the brush device 50 and adjusting the drive unit so that the measurement result coincides with the set pressing force. Therefore, the top surface of the substrate W can be cleaned easily and with high responsiveness with a compact and simple configuration.

[0101] 9. Other Embodiments (a) The cleaning conditions stored in the storage device 904 may include, in addition to the pressure information, rotational speed information, and path information, information on the set pressing force of each part of the substrate W, and may also include information on the amount of cleaning liquid supplied to the fluid nozzle 31 during the cleaning process of the substrate W.

[0102] When the cleaning conditions include information on the set pressure, the CPU 901 of the control unit 900 may calculate the value of the pressure "P1" in the first chamber 111 and the value of the pressure "P2" in the second chamber 112 based on the information on the set pressure. In this case, the cleaning conditions do not need to include pressure information.

[0103] (b) In the above embodiment, the first example of cleaning conditions is shown in Fig. 9 and the second example of cleaning conditions is shown in Fig. 10. The rotational speed information of these cleaning conditions is set so that the rotational speed of the substrate W is maintained constant at a predetermined value during the cleaning process of the substrate W. However, the present invention is not limited to this. The rotational speed information of the cleaning conditions may be set so that the rotational speed of the substrate W changes during the cleaning process of the substrate W.

[0104] For example, the rotational speed information may be set so that the rotational speed of the substrate W becomes higher as the brush device 50 approaches the center of the substrate W and becomes lower as the brush device 50 approaches the outer circumferential edge of the substrate W. Alternatively, the rotational speed information may be set so that the rotational speed of the substrate W becomes lower as the brush device 50 approaches the center of the substrate W and becomes higher as the brush device 50 approaches the outer circumferential edge of the substrate W.

[0105] In this case, the rotation speed of the substrate W and the pressing force applied to the substrate W by the brush device 50 can be made different for a plurality of portions of the substrate W. This allows for a variety of cleaning methods.

[0106] (c) In the above embodiment, the value of the pressure "P1" in the first chamber 111 set for the entire upper surface of the substrate W is set as a fixed value to offset the weight of the brush device holder acting on the piston 121, but the present invention is not limited to this.

[0107] The value of the pressure "P1" in the first chamber 111 may be set as a fixed value different from the value that offsets the weight of the brush device holder. Even in such a case, by appropriately setting the value of the pressure "P2" in the second chamber 112 so that the above formula (1) is satisfied, the brush device 50 can be pressed against each part of the substrate W with the set pressing force.

[0108] (d) In the above embodiment, the value of pressure "P1" in the first chamber 111 set for the entire upper surface of the substrate W is set as a fixed value, which is a value that offsets the weight of the brush device holder acting on the piston 121. On the other hand, the value of pressure "P2" in the second chamber 112 is set to a value according to the set pressing force for each part of the substrate W. However, the present invention is not limited to this.

[0109] The value of the pressure "P2" in the second chamber 112 may be set as a fixed value that is set for the entire upper surface of the substrate W, to a value that offsets the weight of the brush device holder acting on the piston 121. In this case, the value of the pressure "P1" in the first chamber 111 may be set to a value that corresponds to the set pressing force for each part of the substrate W. In other words, the relationship between the role of the force acting on the piston 121 from the pressure "P1" in the first chamber 111 and the role of the force acting on the piston 121 from the pressure "P2" in the second chamber 112 may be reversed.

[0110] (e) The double-acting air cylinder device 100 according to the above embodiment may have a configuration in which an air bearing is provided between the cylinder member 110 and the piston 121. The double-acting air cylinder device 100 may also have a configuration in which an air bearing is provided between the cylinder member 110 and the shaft member 122. In this case, the sliding resistance generated in each part of the double-acting air cylinder device 100 during operation of the double-acting air cylinder device 100 is reduced. This allows the pressing force acting on the substrate W from the brush device 50 to be adjusted with higher precision.

[0111] (f) Although the brush device 50 according to the above embodiment is rotatably supported on the brush support shaft 34, the present invention is not limited to this. The brush device 50 may be supported on the brush support shaft 34 so as not to be rotatable. In this case, it is not necessary to provide the motor 300 and the rotational force transmission mechanism 310 inside the brush arm 41. This makes it possible to reduce the size of the brush arm 41 and the number of parts in the brush arm 41.

[0112] (g) In the substrate processing apparatus 1 according to the above embodiment, the substrate holding device 10 has a so-called mechanical chuck configuration in which the plurality of holding pins 12 abut against the outer periphery of the substrate W to hold the substrate W, but the present invention is not limited to this. The substrate holding device 10 may have a suction configuration in which the central portion of the lower surface of the substrate W is suction-held.

[0113] 10. Correspondence between each element of the claims and each part of the embodiment Examples of correspondence between each element of the claims and each element of the embodiment are described below, but the present invention is not limited to the following examples. Various other elements having the configuration or function described in the claims can also be used as each element of the claims.

[0114] In the above embodiment, the substrate processing apparatus 1 is an example of a substrate processing apparatus, the floor surface CHB of the chamber CH is an example of a first installation surface, the substrate holding device 10 is an example of a substrate holding part, the top surface of the substrate W is an example of one surface of the substrate, the brush device 50 is an example of a cleaning tool, and the brush device holder (a structure consisting of the first connecting member 210, the second connecting member 220, the rotation support mechanism 290 and the brush support shaft 34) is an example of a cleaning tool holder.

[0115] In addition, the double-acting air cylinder device 100, the first electro-pneumatic regulator 131, and the second electro-pneumatic regulator 132 are examples of a pressing device, the control unit 900 is an example of a control unit, the bottom wall Hb of the housing H is an example of a second installation surface, the cylinder member 110 is an example of a cylinder member, the first chamber 111 is an example of a first chamber, the second chamber 112 is an example of a second chamber, and the piston 121 is an example of a piston.

[0116] Furthermore, the first electropneumatic regulator 131 and the second electropneumatic regulator 132 are examples of a pressure adjusting device, the guide rail 43, the arm support unit 44, the arm horizontal drive unit 45 and the arm lift drive unit 46 are examples of a holder moving device, pressure information of the cleaning conditions is an example of information related to the set pressing force, and the memory device 904 is an example of an information storage unit.

[0117] 11. Overview of Embodiments (Item 1) A substrate processing apparatus according to item 1 includes: a substrate holding part that is provided on a first installation surface and holds a substrate; a cleaning tool that processes the substrate by contacting one side of the substrate; a cleaning tool holder that holds the cleaning tool in a state where the cleaning tool faces the one side of the substrate held by the substrate holding part; a pressing device that supports the cleaning tool holder; and a control part, wherein the pressing device includes: a cylinder member that is arranged on a second installation surface that has a predetermined positional relationship with the first installation surface and has an internal space; a piston that is housed in the cylinder member and divides the internal space into a first chamber and a second chamber that are aligned in the vertical direction; a shaft member that extends from the piston above or below the cylinder member and has a tip connected to the cleaning tool holder; and a pressure adjusting device that adjusts the pressure in the first chamber and the pressure in the second chamber, The control unit controls the pressure adjustment device to adjust the pressure in the first chamber and the second chamber so that, when the substrate is processed by the cleaning tool, a predetermined set pressing force acts on the substrate from the cleaning tool, and the force acting on the piston from the cleaning tool holder via the shaft member is canceled out.

[0118] In the substrate processing apparatus, a substrate is held by a substrate holder. A cleaning tool is held by a cleaning tool holder, and the cleaning tool holder is supported by a pressing device. In the pressing device, the pressure in the first and second chambers of the cylinder member is adjusted by a pressure adjusting device so that a force acting on the piston via the shaft member from the cleaning tool holder is canceled out while a predetermined pressing force is applied from the cleaning tool to the substrate.

[0119] This allows the cleaning tool to be properly cleaned even if the distance between the second installation surface and the first surface of the substrate changes due to distortion of the substrate. Furthermore, since the shaft member is connected to the cleaning tool holder, the pressure acting on the shaft member acts directly on the cleaning tool via the cleaning tool holder. Therefore, the cleaning tool pressure can be adjusted with high responsiveness by controlling the pressure adjustment device.

[0120] As a result, the pressure applied from the cleaning tool to the substrate can be adjusted accurately with high responsiveness.

[0121] (2) In the substrate processing apparatus described in 1, the substrate processing apparatus may further include a holder moving device that moves or rotates the cleaning tool holder in a horizontal plane, and the control unit may control the holder moving device.

[0122] In this case, a wide area on one surface of the substrate can be easily treated with the cleaning tool.

[0123] (Clause 3) In the substrate processing apparatus described in clause 2, the set pressure may be set to different values ​​corresponding to multiple portions on the one surface of the substrate, and the control unit may adjust the pressure in the first chamber and the pressure in the second chamber so that the set pressure, which is set at a position on the one surface of the substrate where the cleaning tool is located, acts.

[0124] In this case, the degree of processing on the substrate can be appropriately adjusted at multiple portions on one surface of the substrate.

[0125] (4) In the substrate processing apparatus described in the 3rd paragraph, the substrate processing apparatus may further include an information storage unit that stores information regarding set pressing forces of a plurality of portions on the one surface of the substrate.

[0126] In this case, multiple portions on one surface of the substrate can be appropriately cleaned based on the information about the set pressure stored in the information storage unit. Therefore, feedback control such as measuring the pressure actually acting on the substrate and adjusting the drive unit so that the measurement result matches the set pressure is not required. Therefore, one surface of the substrate can be processed easily and with high responsiveness with a compact and simple configuration.

[0127] (Item 5) In the substrate processing apparatus described in any one of items 1 to 4, the first chamber may be located below the second chamber, and the control unit may maintain the pressure value of the first chamber at a predetermined value by controlling the pressure adjustment device.

[0128] In this case, the pressure acting on the substrate from the cleaning tool can be adjusted by adjusting the pressure in the second chamber located above the first chamber.

[0129] (Item 6) In the substrate processing apparatus described in Item 5, the control unit may control the pressure adjustment device to maintain the pressure value of the first chamber at the predetermined value, which is a pressure value that offsets the force acting on the piston when the set pressing force is 0.

[0130] In this case, the pressure in the first chamber offsets the weight of the structure including the cleaning tool and the cleaning tool holder, and therefore, by adjusting the pressure in the second chamber to a value corresponding to the desired set pressure, the pressure applied from the cleaning tool to the substrate can be easily and accurately adjusted.

Claims

1. A system comprising: a substrate holding part provided on a first installation surface and holding a substrate; a cleaning tool for processing the substrate by contacting one side of the substrate; a cleaning tool holder for holding the cleaning tool in a state in which the cleaning tool faces the one side of the substrate held by the substrate holding part; a pressing device for supporting the cleaning tool holder; and a control part, wherein the pressing device comprises: a cylinder member provided on a second installation surface having a predetermined positional relationship with the first installation surface and having an internal space; a piston housed within the cylinder member and dividing the internal space into a first chamber and a second chamber aligned vertically; an axial member extending from the piston above or below the cylinder member and having a tip connected to the cleaning tool holder; and a pressure adjusting device for adjusting the pressure in the first chamber and the pressure in the second chamber, The control unit controls the pressure adjustment device to adjust the pressure in the first chamber and the second chamber so that, when the substrate is processed by the cleaning tool, a predetermined set pressing force acts on the substrate from the cleaning tool and a force acting on the piston from the cleaning tool holder via the shaft member is canceled out.

2. The substrate processing apparatus according to claim 1, further comprising a holder moving device that moves or rotates the cleaning tool holder in a horizontal plane, and the control unit controls the holder moving device.

3. A substrate processing apparatus as described in claim 2, wherein the set pressure is set to different values ​​corresponding to multiple portions on the one surface of the substrate, and the control unit adjusts the pressure in the first chamber and the pressure in the second chamber so that the set pressure, which is set at a position on the one surface of the substrate where the cleaning tool is located, acts.

4. The substrate processing apparatus according to claim 3, further comprising an information storage unit that stores information regarding set pressing forces for a plurality of portions on said one surface of said substrate.

5. A substrate processing apparatus as described in any one of claims 1 to 4, wherein the first chamber is located below the second chamber, and the control unit maintains the pressure value of the first chamber at a predetermined value by controlling the pressure adjustment device.

6. A substrate processing apparatus as described in claim 5, wherein the control unit controls the pressure regulating device to maintain the pressure value of the first chamber at the predetermined value, which is a pressure value that offsets the force acting on the piston when the set pressing force is 0.

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