Wafer holding device, bonding device, wafer holding method, and bonding method

Abstract

A wafer holding device (100) comprises a holding mechanism (110) and a deformation mechanism (170). The holding mechanism (110) vacuum-picks and holds a wafer (W). The deformation mechanism (170) deforms the holding mechanism (110). The holding mechanism (110) has a chuck (130) and a base (120) to which the chuck (130) is attached. The chuck (130) has a holding surface (130a) that holds the back surface (Wb) of the wafer (W). The deformation mechanism (170) deforms the chuck (130) such that the holding surface (130a) can achieve both a convex shape in which the center of the holding surface (130a) protrudes toward the wafer (W) and a concave shape in which said center is recessed toward the base (120).

Description

Substrate holding device, bonding device, substrate holding method, and bonding method

[0001] The present invention relates to a substrate holding device, a bonding device, a substrate holding method, and a bonding method.

[0002] Conventionally, substrate holding devices for holding substrates are known. Also known is a bonding apparatus that includes an upper substrate holding device for holding a substrate and a lower substrate holding device for holding a substrate (see, for example, Patent Document 1). Patent Document 1 describes a bonding system for bonding an upper wafer and a lower wafer. The bonding system includes a first holding unit for holding the upper wafer and a second holding unit for holding the lower wafer. The first holding unit has an upper chuck for holding the upper wafer. The second holding unit has a lower chuck for holding the lower wafer.

[0003] In the bonding system of Patent Document 1, the upper wafer and the lower wafer are bonded together while the upper chuck is deformed convexly downward and the lower chuck is deformed convexly upward. That is, the upper wafer and the lower wafer are bonded together while the device forming surface of the upper wafer is deformed convexly and the device forming surface of the lower wafer is deformed convexly.

[0004] Japanese Patent Application Laid-Open No. 2020-53685

[0005] Incidentally, warpage occurs in wafers. Specifically, the device-forming surface of a wafer is usually either convex or concave. However, when the device-forming surface of a wafer is, for example, concave, and the device-forming surface is deformed convexly as in the bonding system described in Patent Document 1, the wafer deforms from a concave shape to a convex shape, increasing the degree of deformation. In this case, there is a problem in that the stress applied to the wafer increases. This may have an adverse effect on the characteristics of elements formed on the wafer.

[0006] Furthermore, in a general bonding system other than the bonding system of Patent Document 1, both the holding surface provided below the upper chuck and the holding surface provided above the lower chuck are usually almost flat. However, when the wafer is attracted to the upper chuck or the lower chuck, the wafer deforms from a warped state to a flat state, which may apply stress to the wafer and adversely affect the characteristics of elements formed on the wafer.

[0007] The present invention has been made in consideration of the above-mentioned problems, and its purpose is to provide a substrate holding device, a bonding device, a substrate holding method, and a bonding method that are capable of suppressing stress from being applied to a substrate.

[0008] A substrate holding device according to a first aspect of the present invention includes a holding mechanism and a deformation mechanism. The holding mechanism adsorbs and holds a substrate. The deformation mechanism deforms the holding mechanism. The holding mechanism includes a chuck and a base to which the chuck is attached. The chuck has a holding surface that holds one side of the substrate. The base is disposed on the opposite side of the chuck from the holding surface. The deformation mechanism deforms the chuck so that the holding surface can assume both a convex shape in which the center of the holding surface protrudes toward the substrate, and a concave shape in which the center is recessed toward the base.

[0009] In one embodiment, a control unit for controlling the deformation mechanism is provided. The control unit acquires warpage information indicating at least a warpage direction of the substrate. The control unit causes the deformation mechanism to deform the chuck so that the holding surface assumes the convex shape or the concave shape based on the warpage information, and causes the holding mechanism to hold the substrate.

[0010] In one embodiment, the substrate has a front surface and a back surface, which is the one surface. The front surface is a device formation surface. The back surface is located opposite the front surface and is a non-device formation surface. When the warpage information indicates that the substrate has a concave substrate shape, the control unit causes the deformation mechanism to deform the chuck so that the holding surface has the concave shape, and causes the holding mechanism to hold the back surface of the substrate. The concave substrate shape indicates a shape in which the front surface is recessed toward the back surface and the back surface protrudes toward the opposite side of the front surface.

[0011] In one embodiment, the control unit brings the center of the holding surface into point contact with the center of the back surface of the substrate, and then uses the deformation mechanism to make the holding surface into the concave shape and make the curvature of the holding surface larger than the curvature of the substrate.

[0012] In one embodiment, the deformation mechanism includes a movable body fixed to a center of the chuck, the movable body moving relative to the base along a facing direction in which the chuck and the base face each other.

[0013] In one embodiment, the movable body includes a pipe having a through hole connected to the holding surface, the through hole being a suction hole that sucks the one surface of the substrate.

[0014] In one embodiment, the device includes a partition wall that divides the space between the chuck and the base into multiple spaces. The partition wall extends from the chuck toward the base. The base has an insertion hole into which a portion of the partition wall is inserted. When the holding surface is in a planar state, a portion of the partition wall is inserted into the insertion hole, and the insertion hole has an area where the partition wall can be further inserted into the insertion hole. The area is defined by a tip surface of the partition wall and an inner surface of the insertion hole.

[0015] A bonding apparatus according to a second aspect of the present invention bonds a first substrate and a second substrate. The bonding apparatus includes a first substrate holding device and a second substrate holding device. The first substrate holding device holds the first substrate. The second substrate holding device is disposed opposite the first substrate holding device and holds the second substrate. The first substrate holding device has a first holding mechanism that adsorbs and holds the first substrate, and a first deformation mechanism that deforms the first holding mechanism. The first holding mechanism includes a first chuck having a first holding surface that holds one side of the first substrate, and a first base that is disposed on the opposite side of the first chuck from the first holding surface and to which the first chuck is attached. The first deformation mechanism deforms the first chuck so that the first holding surface can assume both a convex shape in which the center of the first holding surface protrudes toward the first substrate, and a concave shape that is recessed toward the first base.

[0016] In one embodiment, the second substrate holding device includes a second holding mechanism that suction-holds the second substrate and a second deformation mechanism that deforms the second holding mechanism. The second holding mechanism includes a second chuck having a second holding surface that holds one side of the second substrate, and a second base that is disposed on the opposite side of the second chuck from the second holding surface and to which the second chuck is attached. The second deformation mechanism deforms the second chuck so that the second holding surface can assume both a convex shape in which the center of the second holding surface protrudes toward the second substrate and a concave shape in which the center of the second holding surface is recessed toward the second base.

[0017] In one embodiment, the first substrate holding device and the second substrate holding device bond the first substrate and the second substrate together while one of the first holding surface and the second holding surface is formed in the convex shape and the other of the first holding surface and the second holding surface is formed in the concave shape.

[0018] In one embodiment, the maximum curvature of the convex shape of the first holding surface is greater than the maximum curvature of the concave shape of the first holding surface.

[0019] A substrate holding method according to a third aspect of the present invention includes the steps of preparing a substrate, and deforming a chuck having a holding surface that adsorbs and holds one side of the substrate so that the holding surface has a concave shape, and holding the substrate with the chuck. The concave shape indicates a shape in which the center of the holding surface is recessed toward the opposite side to the substrate.

[0020] A bonding method according to a fourth aspect of the present invention includes the steps of: preparing a first substrate; deforming a first chuck having a first holding surface that adsorbs and holds one side of the first substrate so that the first holding surface has a concave shape, and holding the first substrate with the first chuck; adsorbing and holding one side of the second substrate with a second holding surface of a second chuck; and bonding the first substrate and the second substrate together in a state in which the first holding surface has the concave shape and the second holding surface opposing the first holding surface has a convex shape. The concave shape of the first holding surface indicates that the center of the first holding surface is recessed toward the opposite side to the first substrate. The convex shape of the second holding surface indicates that the center of the second holding surface protrudes toward the second substrate.

[0021] According to the present invention, it is possible to provide a substrate holding device, a bonding device, a substrate holding method, and a bonding method that can suppress the application of stress to a substrate.

[0022] 4 is a side view schematically showing the overall configuration of a substrate holding device of a first embodiment. FIG. 5 is a cross-sectional view schematically showing the substrate holding device of the first embodiment. FIG. 6 is a plan view schematically showing a chuck of the substrate holding device of the first embodiment. FIG. 7 is a cross-sectional view schematically showing a state in which the support pins are arranged in the protruding position along the line IV-IV of FIG. 3, showing a state in which the support pins are arranged in the non-protruding position. FIG. 8 is a cross-sectional view schematically showing a state in which the holding surface of the chuck of the substrate holding device of the first embodiment is convex. FIG. 9 is a cross-sectional view schematically showing a state in which the holding surface of the chuck of the substrate holding device of the first embodiment is concave. FIG. 10 is a block diagram showing the configuration of the substrate holding device of the first embodiment. FIG. 11 is a flowchart showing a substrate holding method by the substrate holding device of the first embodiment. FIG. 12 is a cross-sectional view schematically showing a method in which a substrate having a convex surface is held by the substrate holding device. FIG. 13 is a cross-sectional view schematically showing a method in which a substrate having a concave surface is held by the substrate holding device. FIG. 14 is a side view schematically showing a bonding apparatus according to a second embodiment. FIG. 10 is a cross-sectional view schematically showing a first substrate holding device and a second substrate holding device of a bonding apparatus according to a second embodiment. FIG. 11 is a cross-sectional view schematically showing a second substrate holding device, illustrating a state in which support pins are arranged in a protruding position. FIG. 12 is a block diagram showing a configuration of the bonding apparatus according to the second embodiment. FIG. 13 is a flowchart showing a bonding method by the bonding apparatus according to the second embodiment. FIG. 14 is a flowchart showing a bonding process (step S24) in the bonding method by the bonding apparatus according to the second embodiment. FIG. 15 is a schematic diagram for explaining a bonding method in a first combination pattern. FIG. 16 is a schematic diagram for explaining a bonding method in a second combination pattern. FIG. 17 is a schematic diagram for explaining a bonding method in a third combination pattern. FIG. 18 is a schematic diagram for explaining a bonding method in a fourth combination pattern. FIG. 19 is a schematic diagram for explaining a bonding method in a fifth combination pattern. FIG. 19 is a schematic diagram for explaining a bonding method in a sixth combination pattern.

[0023] Hereinafter, embodiments of a substrate holding device and a bonding device according to the present invention will be described with reference to the drawings. In the drawings, identical or corresponding parts are designated by the same reference numerals, and description thereof will not be repeated. In this specification, to facilitate understanding of the invention, mutually orthogonal X-, Y-, and Z-axes may be described. In this embodiment, the X- and Y-axes are approximately parallel to the horizontal direction, and the Z-axis is approximately parallel to the vertical direction. For convenience, one side Z1 of the Z-axis direction indicates the upward direction, and the other side Z2 of the Z-axis direction indicates the downward direction. However, the upward and downward directions are defined for convenience of explanation and do not necessarily correspond to the vertical direction.

[0024] 1 to 11, a substrate holding device 100 according to a first embodiment of the present invention will be described. Fig. 1 is a side view schematically showing the overall configuration of the substrate holding device 100 of the first embodiment. However, in Fig. 1, in order to avoid complicating the drawing, only two support pins 400 are drawn, in accordance with Fig. 4.

[0025] First, a schematic configuration of the substrate holding device 100 will be described with reference to Fig. 1. As shown in Fig. 1, the substrate holding device 100 includes a support base SB, a holding mechanism 110, a deformation mechanism 170, a suction mechanism 300, a plurality of support pins 400, and a pin actuator 450.

[0026] The support base SB is configured so as not to move in the vertical or horizontal directions. Specifically, the support base SB is fixed to the floor FL on which the substrate holding device 100 is installed. Note that the substrate holding device 100 may have a floor material (not shown), and the support base SB may be fixed to the floor material.

[0027] The support base SB is made of a material that is resistant to deformation due to the weight and heat of the holding mechanism 110. The support base SB is made of, for example, stone or a metal frame. The outer shape of the support base SB is, for example, a substantially rectangular parallelepiped shape. A substantially rectangular parallelepiped through-hole SBa that penetrates the support base SB in the vertical direction is formed in the support base SB. In other words, the support base SB is formed in the shape of a rectangular ring that extends in the vertical direction.

[0028] In this embodiment, the support base SB supports the plurality of support pins 400 of the holding mechanism 110. The support base SB supports the holding mechanism 110 from below. The outer periphery of the holding mechanism 110 is fixed to the support base SB with fasteners (not shown) such as bolts.

[0029] The holding mechanism 110 sucks and holds the substrate W. The holding mechanism 110 holds the substrate W in a substantially horizontal position.

[0030] The substrate W is, for example, a semiconductor wafer, a substrate for a liquid crystal display device, a substrate for a plasma display, a substrate for a field emission display (FED), a substrate for an optical disk, a substrate for a magnetic disk, a substrate for a magneto-optical disk, a substrate for a photomask, a ceramic substrate, or a substrate for a solar cell. In this embodiment, the substrate W is a semiconductor wafer.

[0031] The substrate W has, for example, a circular or rectangular shape in a plan view. In this embodiment, the substrate W has a substantially circular shape in a plan view.

[0032] In this embodiment, the substrate W has a front surface Wa and a back surface Wb located opposite the front surface Wa. The front surface Wa is a device formation surface on which elements are formed. The back surface Wb is a non-device formation surface on which elements are not formed. The back surface Wb is an example of the "one side" in the present invention.

[0033] In this embodiment, the holding mechanism 110 holds the substrate W from below. The holding mechanism 110 also holds the back surface Wb of the substrate W by suction. Therefore, when the substrate W is held by the holding mechanism 110, the back surface Wb of the substrate W is the lower surface and the front surface Wa of the substrate W is the upper surface. Needless to say, when the substrate W is not held by the holding mechanism 110, the substrate W can be turned upside down. However, in this embodiment, for ease of understanding, the substrate W is not turned upside down unless otherwise explained. In other words, in this embodiment, regardless of whether the substrate W is held by the holding mechanism 110 or not, the front surface Wa of the substrate W is the upper surface and the back surface Wb of the substrate W is the lower surface.

[0034] A portion of the deformation mechanism 170 is attached, for example, to the lower portion of the holding mechanism 110 using fasteners such as bolts (not shown). Specifically, the deformation mechanism 170 has a moving body 171 and a driving mechanism 173, as will be described later. The driving mechanism 173 is attached to the lower portion of the holding mechanism 110 using fasteners such as bolts (not shown). The deformation mechanism 170 has a function of deforming a portion of the holding mechanism 110. Note that the driving mechanism 173 may be attached to the support base SB. The configuration of the deformation mechanism 170 will be described later.

[0035] A portion of the suction mechanism 300 is attached, for example, to the floor FL on which the substrate holding device 100 is installed, using fasteners such as bolts (not shown). The suction mechanism 300 is a device for suctioning the substrate W to the holding mechanism 110, and sucks air. Note that a portion of the suction mechanism 300 may be attached to the support base SB. The configuration of the suction mechanism 300 and the suction method used by the suction mechanism 300 will be described later.

[0036] The multiple support pins 400 are arranged to penetrate the holding mechanism 110 in the vertical direction, and are provided so as to be movable in the vertical direction relative to the holding mechanism 110. The multiple support pins 400 support the substrate W before it is held by the holding mechanism 110. The multiple support pins 400 support the back surface Wb of the substrate W by suction. The multiple support pins 400 support the substrate W from below. The multiple support pins 400 receive the substrate W from a transport arm TA of the transport device TR. The transport device TR is, for example, a device other than the substrate holding device 100, or a device that transports the substrate W from a substrate cassette (not shown) to the substrate holding device 100.

[0037] The support pins 400 also transfer the substrate W received from the transport device TR to the holding mechanism 110. The configuration of the support pins 400 will be described later.

[0038] The pin actuator 450 is attached to, for example, the lower part of the holding mechanism 110 using fasteners (not shown) such as bolts. The pin actuator 450 drives the plurality of support pins 400. By the pin actuator 450 driving the plurality of support pins 400, the plurality of support pins 400 can receive a substrate W from the transport device TR and transfer the substrate W to the holding mechanism 110. The pin actuator 450 may be attached to the support base SB. The configuration of the pin actuator 450 will be described later.

[0039] Next, the substrate holding device 100 will be further described with reference to Fig. 2. Fig. 2 is a cross-sectional view that schematically shows the substrate holding device 100 of the first embodiment.

[0040] As shown in FIG. 2 , the holding mechanism 110 includes a base 120 , a chuck 130 , a support wall 140 , a fixing ring 150 , and a partition wall 160 .

[0041] The base 120 has a substantially circular shape in a plan view. The base 120 is, for example, a plate. The base 120 has an upper surface 120a and a lower surface 120b. The upper surface 120a and the lower surface 120b are disposed substantially horizontally.

[0042] The base 120 has a first member 121 and a second member 122. The first member 121 has a substantially circular shape in a plan view. The second member 122 has a ring shape in a plan view and surrounds the outer periphery of the first member 121. In other words, the first member 121 forms a central portion of the base 120, and the second member 122 forms an outer periphery of the base 120. Note that, in this embodiment, an example in which the base 120 has the first member 121 and the second member 122 will be described, but the base 120 does not have to be formed separately from the first member 121 and the second member 122, and may have the first member 121, the second member 122, and other members not shown.

[0043] The first member 121 is made of, for example, ceramic or metal. The first member 121 has a generally disk-like or generally cylindrical shape. The first member 121 is also formed with an insertion hole 121a through which a moving body 171 (described later) of the deformation mechanism 170 is inserted. The insertion hole 121a penetrates the first member 121 in the thickness direction (here, the up-down direction). The insertion hole 121a is formed at the center of the first member 121. The first member 121 is also formed with a through hole 121b through which air passes. The through hole 121b penetrates the first member 121 in the thickness direction. For example, a plurality of through holes 121b are provided. The through hole 121b is also formed radially outward of the insertion hole 121a.

[0044] The first member 121 also has seal grooves 121c and 121d. The seal groove 121c is formed in a substantially annular shape along the inner circumferential surface of the insertion hole 121a. The seal groove 121c is a groove formed on the inner circumferential surface of the insertion hole 121a, with its center at the central axis of the first member 121. The seal groove 121d is formed in a ring shape along the outer circumferential surface of the first member 121. The seal groove 121d is a groove formed on the outer circumferential surface of the first member 121, with its center at the central axis of the first member 121. The seal grooves 121c and 121d are formed by, for example, cutting.

[0045] The first member 121 also has a flange 121e. The flange 121e is formed on the lower part of the first member 121. The flange 121e protrudes radially outward further than other parts of the first member 121. The upper surface of the flange 121e is in contact with the lower surface of the second member 122, and the flange 121e has the function of positioning the second member 122 in the up-down direction.

[0046] The second member 122 is formed of, for example, ceramic or metal. The second member 122 is formed in an annular shape surrounding the periphery of the first member 121. In this embodiment, the second member 122 has a substantially annular or cylindrical shape. The second member 122 also has a stepped portion 122a. The stepped portion 122a is formed on the inner circumferential surface of the second member 122. An insertion groove 120c is formed by the stepped portion 122a of the second member 122 and the outer circumferential surface of the first member 121. The insertion groove 120c is formed on the upper surface 120a of the base 120. In other words, the insertion groove 120c is formed at a position of the base 120 facing the chuck 130. The insertion groove 120c also extends in the vertical direction. Note that the insertion groove 120c may also penetrate the base 120 in the vertical direction.

[0047] The second member 122 also has through-holes 122b formed therein, through which air passes. The through-holes 122b penetrate the second member 122 in the thickness direction (here, the up-down direction). For example, a plurality of through-holes 122b may be provided. The through-holes 122b are located radially outward of the insertion grooves 120c.

[0048] The second member 122 also has a seal groove 122c. The seal groove 122c is formed in a generally annular shape on the upper surface of the second member 122 along the outer circumferential edge of the second member 122. The seal groove 122c is formed by, for example, cutting.

[0049] The chuck 130 has a substantially circular shape in a plan view. The chuck 130 is, for example, a plate. The chuck 130 is disposed above the base 120. The chuck 130 is smaller than the base 120, and the lower surface of the chuck 130 faces the upper surface 120a of the base 120. The chuck 130 is disposed substantially parallel to the base 120 at a predetermined distance (for example, 5 mm or more) from the base 120. The chuck 130 is formed from, for example, ceramic, resin, metal, or synthetic rubber, and is capable of bending approximately several mm to 10 mm.

[0050] The chuck 130 has a holding surface 130a and a back surface 130c located opposite the holding surface 130a. The holding surface 130a holds the back surface Wb (here, the bottom surface) of the substrate W. In this embodiment, the holding surface 130a is the top surface of the chuck 130, and the back surface 130c is the bottom surface of the chuck 130. The back surface Wb (here, the bottom surface) of the substrate W is the surface that comes into contact with the holding surface 130a (here, the top surface) of the chuck 130.

[0051] 2, the chuck 130 is formed with through-holes 130b through which air passes. The through-holes 130b penetrate the chuck 130 in the thickness direction (here, the vertical direction). For example, a plurality of through-holes 130b are provided. The through-holes 130b are formed over substantially the entire area of ​​the chuck 130 on which the substrate W is placed. As will be described later, the through-holes 130b are holes for sucking air and adsorbing the substrate W.

[0052] The support wall 140 supports the chuck 130. In this embodiment, the support wall 140 and the chuck 130 are formed of a single member. However, the support wall 140 may be formed of a separate member from the chuck 130.

[0053] The support wall 140 extends from the outer peripheral end of the chuck 130 toward the base 120. In this embodiment, the support wall 140 extends downward from the outer peripheral end of the chuck 130. The lower end of the support wall 140 is fixed to the upper surface 120a of the base 120, and the upper end of the support wall 140 is connected to the chuck 130. Therefore, the chuck 130 is disposed a predetermined distance above the base 120.

[0054] The support wall 140 is formed in a substantially annular shape along the outer peripheral edge of the chuck 130. In other words, the support wall 140 is a substantially annular wall. A space S is formed by the base 120, the chuck 130, and the support wall 140.

[0055] The support wall 140 also has a flange 141. The flange 141 is formed on the lower part of the support wall 140. The flange 141 protrudes radially outward beyond the other parts of the support wall 140.

[0056] The fixing ring 150 has, for example, a substantially annular shape and is disposed along the outer peripheral surface of the support wall 140. The fixing ring 150 fixes the flange 141 to the upper surface 120a of the base 120. Specifically, the fixing ring 150 has a substantially L-shape in cross section and engages with the flange 141. In other words, a step that engages with the flange 141 is formed on the inner peripheral surface of the fixing ring 150. The fixing ring 150 is fixed to the base 120 by, for example, screws. In other words, the fixing ring 150 is fixed to the base 120, and thereby the flange 141 is fixed to the base 120.

[0057] The partition wall 160 extends from the chuck 130 toward the base 120. Specifically, the partition wall 160 extends from the back surface 130c, which is the lower surface of the chuck 130, toward the base 120. The partition wall 160 is formed in a substantially circular ring shape. The partition wall 160 is formed at a position corresponding to the insertion groove 120c of the base 120, and the vertical length of the partition wall 160 is longer than the vertical length of the support wall 140. Therefore, the tip of the partition wall 160 is inserted into the insertion groove 120c.

[0058] In this embodiment, when the holding surface 130a of the chuck 130 is planar (as shown in FIG. 2), a portion of the partition wall 160 is inserted into the insertion groove 120c, and the insertion groove 120c has a region S120 in which the partition wall 160 can be further inserted into the insertion groove 120c. The region S120 is defined by the leading end surface 160a of the partition wall 160 and the inner surface 120d of the insertion groove 120c. In other words, when the holding surface 130a is planar, a gap is formed between the inner surface (bottom surface in FIG. 2) of the insertion groove 120c and the leading end surface 160a (bottom surface in FIG. 2) of the partition wall 160. Therefore, the partition wall 160 can be further inserted into the insertion groove 120c. By further inserting the partition wall 160 into the insertion groove 120c, the holding surface 130a can be easily formed into a concave shape, as described below.

[0059] In this embodiment, the partition wall 160 and the chuck 130 are formed from a single member. In this embodiment, the partition wall 160, the chuck 130, and the support wall 140 are formed from a single member. Note that the partition wall 160 may be formed from a separate member from the chuck 130.

[0060] The deformation mechanism 170 deforms the holding mechanism 110. The deformation mechanism 170 also deforms the chuck 130 so that the center of the holding surface 130a has a convex shape that protrudes in a direction toward the substrate W (here, upward). The deformation mechanism 170 also deforms the chuck 130 so that the center of the holding surface 130a has a concave shape that is recessed in a direction away from the substrate W (here, downward). In other words, the deformation mechanism 170 deforms the chuck 130 so that the holding surface 130a has a convex shape, or deforms the chuck 130 so that the holding surface 130a has a concave shape. Hereinafter, the holding surface 130a being curved so that the center of the holding surface 130a protrudes in a direction toward the substrate W (here, upward) may be referred to as the holding surface 130a having a convex shape. Furthermore, when the holding surface 130a is curved such that the center of the holding surface 130a is recessed in a direction away from the substrate W (here, downward), this may be referred to as the holding surface 130a having a concave shape.

[0061] Specifically, the deformation mechanism 170 has a moving body 171, a fixed member 172, and a drive mechanism 173. The moving body 171 is formed, for example, from resin or metal. The moving body 171 is formed, for example, in a rod-like, columnar, or shaft-like shape. In this embodiment, the moving body 171 has a cylindrical shape and is disposed so as to extend in the vertical direction. The moving body 171 is inserted into the insertion hole 121a of the first member 121. In other words, the lower end of the moving body 171 protrudes downward from the insertion hole 121a of the first member 121. The upper end of the moving body 171 protrudes upward from the insertion hole 121a of the first member 121.

[0062] The upper end of the movable body 171 may be fixed directly to the center of the back surface 130c (the lower surface in FIG. 2 ) of the chuck 130, or may be fixed via a fixing member or the like. In this embodiment, the upper end of the movable body 171 is fixed to the center of the back surface 130c of the chuck 130 via a fixing member 172. Specifically, the fixing member 172 is disposed between the movable body 171 and the chuck 130. The fixing member 172 is fixed to the back surface 130c of the chuck 130 with an adhesive, screws, or the like. The fixing member 172 is also fixed to the upper end of the movable body 171 with an adhesive, screws, or the like. The fixing member 172 is formed of, for example, metal. In this embodiment, the fixing member 172 also functions as a sealing member that seals the gap between the movable body 171 and the chuck 130.

[0063] The movable body 171 is movable relative to the base 120 along the opposing direction (here, the up-and-down direction) in which the chuck 130 and the base 120 face each other.

[0064] The drive mechanism 173 moves the movable body 171 in the vertical direction relative to the base 120. The drive mechanism 173 has an actuator. The drive mechanism 173 is not particularly limited, but may have, for example, a drive source such as a pump or a motor, and a transmission member such as a gear and / or a cam that transmits the driving force of the drive source to the movable body 171. The drive mechanism 173 is fixed to, for example, the lower surface 120b of the base 120. When the drive mechanism 173 is driven, the movable body 171 moves in the vertical direction relative to the base 120. This causes the chuck 130 to deform. The deformation of the chuck 130 will be described later. Note that, to avoid complicating the drawings, the drive mechanism 173 may be omitted from Figure 3 and subsequent figures unless particularly necessary.

[0065] In this embodiment, the movable body 171 includes a pipe having a through hole 171a connected to the holding surface 130a. The through hole 171a penetrates the interior of the movable body 171 in the direction in which the movable body 171 extends. Air passes through the through hole 171a. The through hole 171a is a suction hole that sucks the substrate W. In this embodiment, the fixed member 172 is formed with a through hole 172a through which air passes. The through hole 172a is connected to the through hole 171a of the movable body 171. In this embodiment, one through hole 130b of the chuck 130 is connected to the through hole 171a of the movable body 171 via the through hole 172a of the fixed member 172. The through hole 130b connected to the through hole 171a is formed in the center of the chuck 130.

[0066] Continuing with reference to FIG. 2 , the holding mechanism 110 will be described. The holding mechanism 110 has a seal member 123a, a seal member 123b, and a seal member 123c. Each of the seal members 123a, 123b, and 123c is formed of an elastic material such as rubber. Each of the seal members 123a, 123b, and 123c is, for example, an O-ring.

[0067] The seal member 123a is disposed in the seal groove 121c. When disposed in the seal groove 121c, the seal member 123a is in contact with the outer circumferential surface of the movable body 171. The seal member 123a provides a seal between the movable body 171 and the first member 121. The seal member 123b is disposed in the seal groove 121d. When disposed in the seal groove 121d, the seal member 123b is in contact with the inner circumferential surface of the partition wall 160. The seal member 123b provides a seal between the first member 121 and the partition wall 160. The seal member 123c is disposed in the seal groove 122c. When disposed in the seal groove 122c, the seal member 123c is in contact with the lower surface of the support wall 140. The seal member 123c provides a seal between the support wall 140 and the second member 122. When the pressure in the space S is reduced by the suction mechanism 300, air can be prevented from flowing into the space S from between the moving body 171 and the first member 121, between the first member 121 and the partition wall 160, and between the support wall 140 and the second member 122.

[0068] The suction mechanism 300 is connected to the through-holes 171a, 121b, and 122b and sucks air. Specifically, the suction mechanism 300 includes a pipe 301a connected to the through-holes 171a, 121b, and 122b, a suction device 302, and a valve 310a. The suction device 302 is attached to, for example, the floor FL on which the substrate holding device 100 is installed using fasteners such as bolts (not shown). The suction device 302 includes, for example, a suction pump or an exhaust fan. Note that the substrate holding device 100 does not necessarily have to include the suction device 302. For example, the pipe 301a may be connected to the suction device 302 external to the substrate holding device 100. The valve 310a is provided in the pipe 301a and switches the inside of the pipe 301a between an open state and a closed state.

[0069] When the suction device 302 is driven and the valve 310a is open, air in the space S is sucked in through the through holes 121b and 122b, creating a negative pressure in the space S. As a result, air flows into the space S through the through hole 130b in the chuck 130 that is connected to the space S. Also, when the suction device 302 is driven and the valve 310a is open, air in the through hole 171a is sucked in, creating a negative pressure in the through hole 171a. As a result, air flows into the through hole 171a through the through hole 130b that is connected to the through hole 171a in the chuck 130. Therefore, when the suction device 302 is driven and the valve 310a is open, if the substrate W is brought close to the holding surface 130a of the chuck 130, the back surface Wb of the substrate W is sucked onto the holding surface 130a of the chuck 130.

[0070] Next, the chuck 130 and the partition wall 160 will be further described with reference to FIG. 3 . FIG. 3 is a plan view schematically illustrating the chuck 130 of the substrate holding device 100 of the first embodiment. As shown in FIGS. 2 and 3 , the partition wall 160 divides the space S into a plurality of spaces. In this embodiment, the partition wall 160 divides the space S into two spaces S1 and S2. The space S1 is a circular space located in the center of the space S. The space S2 is an annular space located on the outer side of the space S. Note that, in this embodiment, an example will be described in which the space S is divided into two spaces S1 and S2 by one partition wall 160. However, for example, the space S may be divided into three or more spaces by one or more partition walls 160.

[0071] Furthermore, one or more through holes 130b of the chuck 130 are formed at a position radially inward of the partition wall 160 of the chuck 130. In other words, the one or more through holes 130b connect the space S1 to the external space. In this embodiment, the multiple through holes 130b are formed at a position radially inward of the partition wall 160 of the chuck 130.

[0072] Furthermore, one or more through holes 130b of the chuck 130 are formed at a position radially outward of the partition wall 160 of the chuck 130. In other words, the one or more through holes 130b connect the space S2 to the external space. In this embodiment, the multiple through holes 130b are formed at a position radially outward of the partition wall 160 of the chuck 130.

[0073] In this embodiment, the through holes 130b include a through hole 130d, a plurality of through holes 130e through which the support pins 400 are inserted, and a plurality of through holes 130f through which the support pins 400 are not inserted. In this embodiment, the through hole 130d is formed in the center of the chuck 130. The plurality of through holes 130e are formed on the periphery of the chuck 130. The plurality of through holes 130f are formed throughout the entire area of ​​the chuck 130.

[0074] Next, the multiple support pins 400 will be described with reference to FIGS. 4 and 5. FIG. 4 is a schematic cross-sectional view taken along line IV-IV in FIG. 3, showing a state in which the support pins 400 are positioned at the protruding position P1. FIG. 5 is a schematic cross-sectional view taken along line IV-IV in FIG. 3, showing a state in which the support pins 400 are positioned at the non-protruding position P2. As shown in FIG. 4, the multiple support pins 400 support the substrate W before it is held by the holding mechanism 110. In this embodiment, the multiple support pins 400 support the back surface Wb (here, the lower surface) of the substrate W. The multiple support pins 400 support the substrate W and transfer the substrate W to the holding mechanism 110. Specifically, the multiple support pins 400 may transfer the substrate W from, for example, the transport device TR. Note that the substrate holding device 100 does not necessarily have to have the multiple support pins 400.

[0075] In this embodiment, the multiple support pins 400 include a plurality of (here, four) support pins 400 extending in the vertical direction. The support pins 400 are arranged at equal angular intervals in a plan view. The support pins 400 support the back surface Wb (here, the lower surface) of the substrate W. Note that the support pins 400 have through holes (not shown) through which air passes, and the multiple support pins 400 may suck the substrate W. In this embodiment, the support pins 400 do not have through holes (not shown).

[0076] In this embodiment, one or more (four in this example) through holes 130e are located above the through holes 122b. The support pin 400 is inserted through the through holes 122b and 130e.

[0077] The support pin 400 is movable between, for example, a protruding position P1 (see FIG. 4 ) where it protrudes upward from the holding surface 130 a and a non-protruding position P2 (see FIG. 5 ) where it does not protrude upward from the holding surface 130 a. In this embodiment, the multiple (four in this case) support pins 400 are connected to each other by a connecting member (not shown). Therefore, the multiple (four in this case) support pins 400 move vertically as a unit.

[0078] Specifically, as described above, the substrate holding device 100 has a pin actuator 450 that moves the support pins 400 in the vertical direction. The pin actuator 450 is fixed to, for example, the lower surface 120b of the base 120. The pin actuator 450 is not particularly limited, but includes, for example, a drive source such as a pump or a motor, and a transmission member such as a gear and / or a cam that transmits the drive force of the drive source to the lower portion of the support pin 400. When the pin actuator 450 is driven, the support pins 400 move in the vertical direction relative to the base 120. For example, when the pin actuator 450 moves the support pins 400 to the protruding position P1, the support pins 400 protrude from the holding surface 130a and become able to receive the substrate W from the transport device TR. In other words, the support pins 400 receive the substrate W at the protruding position P1. When receiving the substrate W from the transport device TR, the support pins 400 receive the substrate W in a state where they protrude, for example, 10 mm or more from the holding surface 130a. At this time, the height positions of the tips of all the support pins 400 are approximately constant. Furthermore, for example, the pin actuator 450 moves the support pins 400 from the protruding position P1 to the non-protruding position P2, so that the support pins 400 no longer protrude from the holding surface 130a. As a result, the substrate W is moved downward from a position above the holding surface 130a, and the substrate W is transferred from the support pins 400 to the holding surface 130a.

[0079] Next, deformation of the holding surface 130a of the chuck 130 will be described with reference to Fig. 6 and Fig. 7. Fig. 6 is a cross-sectional view schematically showing a state in which the holding surface 130a of the chuck 130 of the substrate holding device 100 of the first embodiment has a convex shape. Fig. 7 is a cross-sectional view schematically showing a state in which the holding surface 130a of the chuck 130 of the substrate holding device 100 of the first embodiment has a concave shape.

[0080] As shown in Figures 6 and 7 , in this embodiment, the chuck 130 can be deformed so that the holding surface 130a has a convex shape, and can also be deformed so that the holding surface 130a has a concave shape. The convex shape of the holding surface 130a means that the holding surface 130a is curved so that the center of the holding surface 130a protrudes in a direction toward the substrate W (upward in this case), as shown in Figure 6 . In other words, the convex shape of the holding surface 130a refers to a shape in which the center of the holding surface 130a protrudes in a direction toward the substrate W. The concave shape of the holding surface 130a refers to a curve in which the center of the holding surface 130a is recessed in a direction away from the substrate W (downward in this case), as shown in Figure 7 . In other words, the concave shape of the holding surface 130a refers to a shape in which the center of the holding surface 130a is recessed in a direction away from the substrate W.

[0081] For example, when the driving mechanism 173 moves the movable body 171 upward relative to the base 120, the upper end of the movable body 171 is fixed to the center of the chuck 130 by the fixing member 172, and therefore, as the movable body 171 moves upward relative to the base 120, the center of the chuck 130 is pressed upward relative to the base 120. Therefore, even though the outer peripheral edge of the chuck 130 is fixed by the fixing ring 150, the center of the chuck 130 is pressed upward. Therefore, the chuck 130 is able to bend, and is deformed to have an upwardly convex shape. As a result, the holding surface 130a becomes convex (see FIG. 6 ).

[0082] Furthermore, for example, when the driving mechanism 173 moves the movable body 171 downward relative to the base 120, the upper end of the movable body 171 is fixed to the center of the chuck 130 by the fixing member 172, and therefore, as the movable body 171 moves downward relative to the base 120, the central portion of the chuck 130 is pulled downward relative to the base 120. Therefore, even though the outer peripheral edge of the chuck 130 is fixed by the fixing ring 150, the central portion of the chuck 130 is pulled downward. Therefore, since the chuck 130 is flexible, the chuck 130 deforms to become concave downward. As a result, the holding surface 130a becomes concave (see FIG. 7 ).

[0083] Next, the substrate holding device 100 will be further described with reference to Fig. 8. Fig. 8 is a block diagram showing the configuration of the substrate holding device 100 of the first embodiment.

[0084] In this embodiment, the substrate holding device 100 has a control device 190. The control device 190 controls the substrate holding device 100. The control device 190 controls the deformation mechanism 170. In this embodiment, the control device 190 controls the deformation mechanism 170, the suction mechanism 300, the pin actuator 450, and a warpage detection device 500, which will be described later.

[0085] The control device 190 includes a control unit 191 and a storage unit 193. The control unit 191 has a processor. The control unit 191 has, for example, a central processing unit (CPU). Alternatively, the control unit 191 may have a general-purpose computer.

[0086] The storage unit 193 stores data and computer programs, for example, data defining the process content and process procedure for holding the substrate W.

[0087] The storage unit 193 includes a main storage device and an auxiliary storage device. The main storage device is, for example, a semiconductor memory. The auxiliary storage device is, for example, a semiconductor memory and / or a hard disk drive. The storage unit 193 may include removable media. The control unit 191 executes a computer program stored in the storage unit 193 to perform the substrate holding operation.

[0088] The control unit 191 acquires warpage information of the substrate W. The warpage information indicates at least the warpage direction of the substrate W. The warpage information indicates whether the substrate W has a concave substrate shape, a convex substrate shape, or a planar substrate shape. Specifically, the concave substrate shape indicates a shape in which the front surface Wa of the substrate W is concave toward the back surface Wb (here, downward), and the back surface Wb protrudes toward the opposite side from the front surface Wa (here, downward). That is, in this embodiment, the concave substrate shape indicates a shape in which the center of the front surface Wa (here, the upper surface) of the substrate W is concave downward. Furthermore, the convex substrate shape indicates a shape in which the front surface Wa of the substrate W protrudes toward the opposite side from the back surface Wb (here, upward), and the back surface Wb is concave toward the front surface Wa (here, upward). That is, in this embodiment, the convex substrate shape indicates a shape in which the center of the front surface Wa of the substrate W protrudes upward. The planar substrate shape indicates a shape in which both the front surface Wa and the back surface Wb of the substrate W are flat. In this embodiment, the warpage information indicates the amount of warpage of the substrate W in addition to the direction of warpage of the substrate W.

[0089] The warpage information of the substrate W may be transmitted to the control device 190 from, for example, a warpage detection device that detects warpage of the substrate W. Then, for example, the storage unit 193 may store the warpage information, and the control unit 191 may acquire the warpage information from the storage unit 193. The substrate holding device 100 may be provided with a warpage detection device. Alternatively, the warpage detection device may be provided separately from the substrate holding device 100. In this embodiment, the substrate holding device 100 is provided with a warpage detection device 500. The warpage detection device 500 may be a contact-type detection device that comes into contact with the substrate W, or a non-contact-type detection device that does not come into contact with the substrate W. In this embodiment, the warpage detection device 500 is, for example, a non-contact-type detection device having a laser light emitting unit and a light receiving unit.

[0090] The warpage detection device 500 may detect the warpage of the substrate W supported by the support pins 400, or may detect the warpage of the substrate W supported by the transport device TR. In this embodiment, the warpage detection device 500 detects the warpage of the substrate W supported by the support pins 400. The warpage detection device 500 transmits warpage information relating to the detected warpage to the control device 190, and the control device 190 stores the warpage information in the memory unit 193.

[0091] Furthermore, the control unit 191 causes the deformation mechanism 170 to deform the chuck 130 so that the holding surface 130a has, for example, a convex or concave shape based on the warpage information, and causes the holding mechanism 110 to hold the substrate W.

[0092] Specifically, when the warpage information indicates that the substrate W has a concave substrate shape (the front surface Wa is concave), the control unit 191 causes the deformation mechanism 170 to deform the chuck 130 so that the holding surface 130a has a concave shape. Then, with the holding surface 130a in a concave state, the control unit 191 causes the holding mechanism 110 to hold the back surface Wb (here, the lower surface) of the substrate W. Note that the control unit 191 may control the deformation mechanism 170 based on detection results from a detection unit (not shown) that detects the force of the deformation mechanism 170 and the amount of movement of the moving body 171.

[0093] Furthermore, the control unit 191 brings the center of the holding surface 130a, which is the upper surface of the chuck 130, into point contact with the center of the back surface Wb (here, the lower surface) of the substrate W. Specifically, the control unit 191 brings the holding surface 130a, which is the upper surface of the chuck 130, into contact with the back surface Wb of the substrate W, while the holding surface 130a is convex or flat. Alternatively, the control unit 191 brings the holding surface 130a into contact with the back surface Wb of the substrate W, while the holding surface 130a is concave and the curvature of the holding surface 130a is smaller than the curvature of the substrate W.

[0094] Thereafter, the control unit 191 causes the deformation mechanism 170 to deform the chuck 130 so that the holding surface 130a comes into close contact with the back surface Wb of the substrate W. As a result, the entire back surface Wb of the substrate W comes into close contact with the holding surface 130a. Therefore, the back surface Wb of the substrate W is held by the holding surface 130a. Note that the curvature is a value indicating the degree of bending of the curved surface. As the curvature increases, the radius of curvature decreases.

[0095] Next, a substrate holding method using the substrate holding device 100 of this embodiment will be described with reference to FIGS. 9 to 11 . FIG. 9 is a flowchart illustrating a substrate holding method using the substrate holding device 100 of the first embodiment. FIG. 10 is a schematic cross-sectional view illustrating a method for holding a substrate W having a convex surface Wa using the substrate holding device 100. FIG. 11 is a schematic cross-sectional view illustrating a method for holding a substrate W having a concave surface Wa using the substrate holding device 100. Note that the support pins 400 are omitted from FIGS. 10 and 11 to simplify the drawings. In this embodiment, the substrate holding method using the substrate holding device 100 includes steps S11 to S14. Note that step S11 is an example of a "substrate preparing step" in the present invention. Step S14 is an example of a "substrate holding step" in the present invention.

[0096] 9 , in step S11, a substrate W is prepared. Specifically, the control unit 191 may control the transport device TR to prepare the substrate W, or a transport device (not shown) other than the substrate holding device 100 may prepare the substrate W.

[0097] Next, in step S12, the control unit 191 detects the warpage of the substrate W using the warpage detection device 500. Specifically, with the substrate W placed above the holding surface 130a by the transport device TR, the control unit 191 causes the pin actuator 450 to protrude the multiple support pins 400 upward from the holding surface 130a. As a result, the multiple support pins 400 come into contact with the rear surface Wb (here, the lower surface) of the substrate W to lift the substrate W, and the substrate W moves from the transport device TR to the support pins 400. The control unit 191 then detects the warpage of the substrate W supported by the support pins 400 using the warpage detection device 500. Warpage information, which is the detection result of the warpage detection device 500, is stored in the memory unit 193.

[0098] Next, in step S13, the control unit 191 acquires the warpage information. Specifically, the control unit 191 acquires the warpage information from the storage unit 193.

[0099] Next, in step S14, the control unit 191 causes the deformation mechanism 170 to deform the chuck 130. Specifically, the control unit 191 causes the deformation mechanism 170 to deform the chuck 130 so that the holding surface 130a has a convex or concave shape based on the warpage information. More specifically, the control unit 191 drives the deformation mechanism 170 to move the moving body 171 in the vertical direction relative to the base 120, thereby deforming the chuck 130. Note that the control unit 191 may also cause the deformation mechanism 170 to deform the chuck 130 so that the holding surface 130a has a flat shape based on the warpage information. Also, in step S14, the control unit 191 drives the suction mechanism 300.

[0100] 10 , when the warpage information indicates that the substrate W has a convex shape (the front surface Wa of the substrate W has a convex shape) (see the upper part of FIG. 10 ), the control unit 191 causes the deformation mechanism 170 to deform the chuck 130 so that the holding surface 130 a has a convex shape. That is, the control unit 191 moves the moving body 171 upward relative to the base 120. At this time, the control unit 191 deforms the chuck 130 so that the curvature of the holding surface 130 a becomes larger than the curvature of the substrate W.

[0101] Then, the control unit 191 causes the pin actuators 450 to move the support pins 400 downward relative to the base 120, bringing the substrate W into contact with the holding surface 130a (see the middle part of FIG. 10 ). As a result, the center of the holding surface 130a, which is the upper surface of the chuck 130, comes into point contact with the center of the back surface Wb (here, the lower surface) of the substrate W. Therefore, the center of the substrate W is attracted by the through-hole 130b located at the center of the chuck 130. At this time, because the curvature of the holding surface 130a is greater than the curvature of the substrate W, the support pins 400 are located at the protruding position P1.

[0102] Thereafter, the control unit 191 makes the curvature of the holding surface 130a smaller than or equal to the curvature of the substrate W (see the lower part of FIG. 10 ). Specifically, the control unit 191 causes the driving mechanism 173 to move the movable body 171 downward relative to the base 120, and causes the pin actuators 450 to move the support pins 400 downward relative to the base 120 to position them at the non-protruding position P2. As a result, when the curvature of the holding surface 130a becomes the same as the curvature of the substrate W, the entire back surface Wb of the substrate W is attracted to the holding surface 130a. At this time, the back surface Wb (here, the lower surface) of the substrate W gradually comes into contact with the holding surface 130a from the center of the substrate W toward the radially outer side. Specifically, after the central through-hole 130d of the chuck 130 adsorbs the substrate W, the through-holes 130e and 130f radially outward of the through-hole 130d adsorb the substrate W, and then the through-hole 130f on the outer periphery of the chuck 130 adsorbs the substrate W. This makes it possible to prevent air from entering between the back surface Wb of the substrate W and the holding surface 130a.

[0103] Then, the control unit 191 stops the downward movement of the moving body 171 and the support pins 400. In this manner, the substrate W is held by the substrate holding device 100.

[0104] 11 , for example, when the warpage information indicates that the substrate W has a concave substrate shape (the front surface Wa of the substrate W has a concave shape) (see the upper part of FIG. 11 ), the control unit 191 causes the deformation mechanism 170 to deform the chuck 130 so that the holding surface 130 a becomes convex. That is, the control unit 191 causes the drive mechanism 173 to move the movable body 171 upward relative to the base 120. When the warpage information indicates that the substrate W has a concave substrate shape, the control unit 191 may cause the deformation mechanism 170 to deform the chuck 130 so that the holding surface 130 a becomes flat. When the warpage information indicates that the substrate W has a concave substrate shape, the control unit 191 may cause the deformation mechanism 170 to deform the chuck 130 so that the holding surface 130 a becomes concave. However, when the chuck 130 is deformed so that the holding surface 130a has a concave shape, the control unit 191 deforms the chuck 130 so that the curvature of the holding surface 130a is smaller than the curvature of the substrate W.

[0105] Then, the control unit 191 causes the pin actuators 450 to move the support pins 400 downward relative to the base 120, bringing the substrate W into contact with the holding surface 130a (see the middle part of FIG. 11 ). As a result, the center of the holding surface 130a, which is the upper surface of the chuck 130, comes into point contact with the center of the back surface Wb (here, the lower surface) of the substrate W. Therefore, the center of the substrate W is attracted by the through-hole 130b located at the center of the chuck 130. At this time, the support pins 400 are located at the protruding position P1.

[0106] Thereafter, the control unit 191 causes the holding surface 130a to have a concave shape and a curvature of the holding surface 130a that is greater than or equal to the curvature of the substrate W (see the lower part of FIG. 11 ). Specifically, the control unit 191 causes the driving mechanism 173 to move the movable body 171 downward relative to the base 120, and causes the pin actuators 450 to move the support pins 400 downward relative to the base 120 to position them at the non-protruding position P2. As a result, when the curvature of the holding surface 130a becomes the same as the curvature of the substrate W, the entire back surface Wb of the substrate W is attracted to the holding surface 130a. At this time, the back surface Wb (here, the lower surface) of the substrate W gradually comes into contact with the holding surface 130a from the center of the substrate W toward the radially outer side. Specifically, after the central through-hole 130d of the chuck 130 adsorbs the substrate W, the through-holes 130e and 130f radially outward of the through-hole 130d adsorb the substrate W, and then the through-hole 130f on the outer periphery of the chuck 130 adsorbs the substrate W. This makes it possible to prevent air from entering between the back surface Wb of the substrate W and the holding surface 130a.

[0107] Then, the control unit 191 stops the downward movement of the moving body 171 and the support pins 400. In this manner, the substrate W is held by the substrate holding device 100.

[0108] In addition, when the warpage information indicates that the substrate W has a planar substrate shape (the surface Wa of the substrate W is planar), the control unit 191 performs processing in the same manner as when the warpage information indicates that the substrate W has a convex substrate shape (the surface Wa of the substrate W is convex) (see Figure 10).

[0109] As described above with reference to FIGS. 1 to 11 , in this embodiment, the deformation mechanism 170 deforms the chuck 130 so that the holding surface 130 a has a convex shape, and also deforms the chuck 130 so that the holding surface 130 a has a concave shape. Therefore, the chuck 130 can be deformed so that the holding surface 130 a has a convex or concave shape depending on the warpage of the substrate W. This makes it possible to prevent the stress applied to the substrate W from increasing. Furthermore, when a substrate W on which elements are formed is used as in this embodiment, preventing the stress applied to the substrate W from increasing can prevent adverse effects on the characteristics of the elements. Therefore, applying the present invention is particularly effective when using a substrate W on which elements are formed.

[0110] Furthermore, as described above, the control unit 191 causes the deformation mechanism 170 to deform the chuck 130 so that the holding surface 130a has a convex or concave shape based on warpage information indicating at least the warpage direction, and causes the holding mechanism 110 to hold the substrate W. Therefore, it is possible to easily prevent the stress applied to the substrate W from increasing.

[0111] Furthermore, as described above, when the warpage information indicates that the substrate W has a concave substrate shape (the surface Wa has a concave substrate shape), the control unit 191 causes the deformation mechanism 170 to deform the chuck 130 so that the holding surface 130a has a concave shape, and causes the holding mechanism 110 to hold the substrate W. Therefore, when the substrate W has a concave substrate shape, it is possible to easily prevent the stress acting on the substrate W from becoming large.

[0112] Furthermore, as described above, when the warpage information indicates that the substrate W has a concave substrate shape (the front surface Wa has a concave shape), the control unit 191 brings the center of the holding surface 130a, which is the upper surface of the chuck 130, into point contact with the center of the back surface Wb (here, the lower surface) of the substrate W, and then uses the deformation mechanism 170 to make the curvature of the holding surface 130a greater than the curvature of the substrate W. Therefore, the back surface Wb of the substrate W gradually comes into contact with the holding surface 130a from the center toward the radially outer side of the substrate W. This prevents air from entering between the back surface Wb of the substrate W and the holding surface 130a. This makes it easy to bring the entire back surface Wb of the substrate W into close contact with the holding surface 130a. In other words, it is possible to prevent voids from being generated between the back surface Wb of the substrate W and the holding surface 130a.

[0113] As described above, the deformation mechanism 170 has the moving body 171 fixed to the center of the chuck 130, and the moving body 171 moves relative to the base 120 along the opposing direction in which the chuck 130 and the base 120 face each other. This allows the chuck 130 to be easily deformed so that the holding surface 130a has a convex or concave shape.

[0114] As described above, the movable body 171 includes a pipe having a through hole 171 a connected to the holding surface 130 a, and the through hole 171 a is a suction hole that sucks the back surface Wb (here, the lower surface) of the substrate W. Therefore, the movable body 171 can easily suck the center of the substrate W while being fixed to the center of the chuck 130.

[0115] Furthermore, as described above, with the holding surface 130a in a planar state, a portion of the partition wall 160 is inserted into the insertion groove 120c, and the insertion groove 120c has a region S120 where the partition wall 160 can be further inserted into the insertion groove 120c. Therefore, by further inserting the partition wall 160 into the insertion groove 120c, the holding surface 130a can be easily made concave.

[0116] Second Embodiment A bonding apparatus 1 according to a second embodiment of the present invention will be described with reference to Figures 12 to 23. Figure 12 is a side view that schematically shows the bonding apparatus 1 according to the second embodiment. However, in Figure 12, in order to avoid complicating the drawing, only two support pins 400 of the substrate holding device 100 are depicted, similar to Figure 1 of the first embodiment, and only two second support pins 410 of the second substrate holding device 200 are depicted, in line with Figure 14.

[0117] 12 , the bonding apparatus 1 according to the second embodiment includes a substrate holding device 100 (hereinafter referred to as a first substrate holding device 100) and a second substrate holding device 200 disposed opposite the first substrate holding device 100. In the second embodiment, for ease of understanding, the substrate holding device 100 of the first embodiment will be described as the first substrate holding device 100.

[0118] In addition, in the following explanation, for ease of understanding, the substrate W, holding mechanism 110, base 120, chuck 130, holding surface 130a, deformation mechanism 170, movable body 171 and support pin 400 of the first embodiment will be referred to as first substrate W1, first holding mechanism 110, first base 120, first chuck 130, first holding surface 130a, first deformation mechanism 170, first movable body 171 and first support pin 400, respectively.

[0119] In this embodiment, the first substrate holding device 100 does not include the suction mechanism 300 and the control device 190, and the bonding apparatus 1 includes the suction mechanism 300 and the control device 190. The other configurations of the first substrate holding device 100 are the same as those of the substrate holding device 100 of the first embodiment.

[0120] The bonding apparatus 1 bonds a first substrate W1 held by a first substrate holding device 100 to a second substrate W2 held by a second substrate holding device 200. The bonding apparatus 1 includes a support frame SF, the first substrate holding device 100, the second substrate holding device 200, a first moving mechanism 610, and a second moving mechanism 620.

[0121] The support frame SF is fixed to the floor FL on which the bonding apparatus 1 is installed. The support frame SF is made of, for example, metal. The support frame SF includes, for example, a plurality of first frames SF1 extending in the vertical direction and a plurality of second frames SF2 extending in the horizontal direction. In this embodiment, four first frames SF1 and four second frames SF2 are provided. The four first frames SF1 include two first frame SF1 sets (not shown), each consisting of two first frames SF1 arranged at a predetermined interval in the X direction. These two first frame SF1 sets overlap each other in the X direction and are arranged at a predetermined interval in the Y direction. In other words, the four first frames SF1 are arranged at positions corresponding to the four corners of a rectangle in a plan view. The lower end of each first frame SF1 is fixed to the floor FL. The four second frames SF2 include two second frames SF2 connecting the upper ends of adjacent first frames SF1 in the X direction and two second frames SF2 connecting the upper ends of adjacent first frames SF1 in the Y direction. That is, the four second frames SF2 are arranged at positions corresponding to the four sides of a rectangle in a plan view. The support frame SF may be fixed to a wall or ceiling of a room in which the bonding apparatus 1 is installed.

[0122] The support frame SF also supports the second substrate holding device 200. In this embodiment, the support frame SF has a horizontal rail SF3 that guides the second substrate holding device 200 in the horizontal direction and a vertical rail SF4 that guides the second substrate holding device 200 in the up-down direction. For example, two horizontal rails SF3 and two vertical rails SF4 are provided. The horizontal rails SF3 extend, for example, in the X direction. The two horizontal rails SF3 are fixed to two second frames SF2 that extend in the X direction, respectively. The two vertical rails SF4 are attached to two horizontal rails SF3, respectively. The vertical rails SF4 are configured to be movable in the X direction along the horizontal rails SF3.

[0123] In this embodiment, the second substrate holding device 200 is configured to be movable relative to the first substrate holding device 100. Specifically, the second substrate holding device 200 includes a second support base SB2. The second support base SB2 is supported by a vertical rail SF4 and moves horizontally along the horizontal rail SF3 together with the vertical rail SF4. The second support base SB2 also moves up and down along the vertical rail SF4.

[0124] In this embodiment, the second substrate holding device 200 is disposed above the first substrate holding device 100. The second substrate holding device 200 is provided by vertically inverting the first substrate holding device 100. Note that the first substrate holding device 100 and the second substrate holding device 200 may also be disposed by vertically inverting them. The configuration of the second substrate holding device 200 will be described later.

[0125] The first movement mechanism 610 is fixed to, for example, the horizontal rail SF3. The first movement mechanism 610 may also be fixed to the second frame SF2. The first movement mechanism 610 moves the second substrate holding device 200 in the horizontal direction. In this embodiment, the first movement mechanism 610 moves the second substrate holding device 200 in the horizontal direction together with the vertical rail SF4. The first movement mechanism 610 has an actuator. The first movement mechanism 610 is not particularly limited, but may have, for example, a drive source such as a pump or a motor, and a transmission member such as a gear that transmits the drive force of the drive source to the vertical rail SF4 or the second support base SB2. The first movement mechanism 610 may move the first substrate holding device 100, or may move both the first substrate holding device 100 and the second substrate holding device 200.

[0126] The second movement mechanism 620 is fixed to, for example, the vertical rail SF4. The second movement mechanism 620 moves the second substrate holding device 200 in the up and down direction. The second movement mechanism 620 has an actuator. The second movement mechanism 620 is not particularly limited, but may have, for example, a drive source such as a pump or a motor, and a transmission member such as a gear that transmits the drive force of the drive source to the second support base SB2. The second movement mechanism 620 may move the first substrate holding device 100, or may move both the first substrate holding device 100 and the second substrate holding device 200.

[0127] 12 , the second substrate holding device 200 will be described. In addition to the second support base SB2, the second substrate holding device 200 includes a second holding mechanism 210, a second deformation mechanism 270, a plurality of second support pins 410, and a second pin actuator 460.

[0128] As described above, the second support stand SB2 is configured to move in the vertical and horizontal directions. Furthermore, the second support stand SB2 is formed of a material that is resistant to deformation due to the weight and heat of the second holding mechanism 210. The second support stand SB2 is formed, for example, of a stone material or a metal frame. The outer shape of the second support stand SB2 is, for example, a substantially rectangular parallelepiped shape. A substantially rectangular parallelepiped through-hole SBa is formed in the second support stand SB2, penetrating it in the vertical direction. In other words, the second support stand SB2 is formed in the shape of a rectangular ring extending in the vertical direction.

[0129] In this embodiment, the second support base SB2 supports the second holding mechanism 210 and the plurality of second support pins 410. The second support base SB2 supports the second holding mechanism 210 from above. The outer periphery of the second holding mechanism 210 is fixed to the second support base SB2 with fasteners (not shown) such as bolts.

[0130] The second holding mechanism 210 holds the second substrate W2 by suction, and holds the second substrate W2 substantially horizontally.

[0131] In this embodiment, the second holding mechanism 210 holds the second substrate W2 from above. The second holding mechanism 210 also holds the back surface Wb of the second substrate W2 by suction. Therefore, when the second substrate W2 is held by the second holding mechanism 210, the back surface Wb of the second substrate W2 is the upper surface, and the front surface Wa of the second substrate W2 is the lower surface. Needless to say, when the second substrate W2 is not held by the second holding mechanism 210, the second substrate W2 can be turned upside down. However, in this embodiment, for ease of understanding, the second substrate W2 is not turned upside down unless otherwise specified. In other words, in this embodiment, regardless of whether the second substrate W2 is held by the second holding mechanism 210, the front surface Wa of the second substrate W2 is the lower surface, and the back surface Wb of the second substrate W2 is the upper surface.

[0132] A portion of the second deformation mechanism 270 is attached, for example, to the upper portion of the second holding mechanism 210 using fasteners (not shown) such as bolts. Specifically, as will be described later, the second deformation mechanism 270 has a second moving body 271 and a drive mechanism 273. The drive mechanism 273 is attached to the upper portion of the second holding mechanism 210 using fasteners (not shown) such as bolts. The second deformation mechanism 270 has a function of deforming a portion of the second holding mechanism 210. Note that the drive mechanism 273 may be attached to the second support base SB2. The configuration of the second deformation mechanism 270 will be described later.

[0133] A portion of the suction mechanism 300 is attached to, for example, the first frame SF1 of the support frame SF using fasteners (not shown) such as bolts. The suction mechanism 300 is a device for suctioning the first substrate W1 and the second substrate W2 to the first holding mechanism 110 and the second holding mechanism 210, respectively, and sucks air. Note that a portion of the suction mechanism 300 may be attached to the first support base SB1 or the second support base SB2, or may be attached to the second frame SF2 of the support frame SF, or may be placed on the floor FL on which the bonding apparatus 1 is installed. The configuration of the suction mechanism 300 and the suction method used by the suction mechanism 300 will be described later.

[0134] The multiple second support pins 410 are arranged to penetrate the second holding mechanism 210 in the vertical direction, and are provided to be movable in the vertical direction relative to the second holding mechanism 210. The multiple second support pins 410 support the second substrate W2 before it is held by the second holding mechanism 210. The multiple second support pins 410 support the back surface Wb of the second substrate W2 by suction. The multiple second support pins 410 support the second substrate W2 from above. The multiple second support pins 410 receive the second substrate W2 from the transport arm TA of the transport device TR.

[0135] Furthermore, the second support pins 410 transfer the second substrate W2 received from the transport device TR to the second holding mechanism 210. The configuration of the second support pins 410 will be described later.

[0136] The second pin actuator 460 is attached, for example, to the upper part of the second holding mechanism 210 using fasteners (not shown) such as bolts. Driving the second pin actuator 460 moves the plurality of second support pins 410 up and down. Driving the second pin actuator 460 moves the plurality of second support pins 410 up and down, allowing the plurality of second support pins 410 to receive the second substrate W2 from the transport device TR or to hand over the second substrate W2 to the second holding mechanism 210. The second pin actuator 460 may also be attached to the second support base SB2. The configuration of the second pin actuator 460 will be described later.

[0137] Next, the first substrate holding device 100 and the second substrate holding device 200 will be further described with reference to Figure 13. Figure 13 is a cross-sectional view that schematically shows the first substrate holding device 100 and the second substrate holding device 200 of the bonding apparatus 1 of the second embodiment. As shown in Figure 13, the second substrate holding device 200 has the same configuration as the first substrate holding device 100. Note that the second substrate holding device 200 is provided by inverting the first substrate holding device 100 in the up-down direction. A specific description will be given below.

[0138] The second holding mechanism 210 holds the second substrate W2 by suction. The second holding mechanism 210 holds the second substrate W2 in a substantially horizontal position. The second substrate W2 has the same configuration as the first substrate W1. However, the second substrate W2 is held by the second substrate holding device 200 with its front surface Wa facing downward and its back surface Wb facing upward.

[0139] The second holding mechanism 210 has a second base 220, a second chuck 230, a support wall 140, a fixing ring 150, and a partition wall 160. The second base 220 has a substantially circular shape in a plan view. The second base 220 is, for example, a plate. The second base 220 has a lower surface 220a and an upper surface 220b. Similarly to the first base 120, the second base 220 also has a first member 121 and a second member 122. The lower surface 220a and the upper surface 220b are disposed substantially horizontally.

[0140] The second chuck 230 has a substantially circular shape in a plan view. The second chuck 230 is, for example, a plate. The second chuck 230 is disposed below the second base 220. The second chuck 230 is smaller than the second base 220, and the upper surface of the second chuck 230 faces the lower surface 220a of the second base 220. The second chuck 230 is disposed substantially parallel to the second base 220 at a predetermined distance (for example, 5 mm or more) from the second base 220. The second chuck 230 is formed from, for example, ceramic, resin, metal, or synthetic rubber, and is capable of deflecting approximately several mm to 10 mm.

[0141] The second chuck 230 has a second holding surface 230a and a back surface 230c located on the opposite side to the second holding surface 230a. The second holding surface 230a holds the back surface Wb (here, the upper surface) of the second substrate W2. In this embodiment, the second holding surface 230a is the lower surface of the second chuck 230, and the back surface 230c is the upper surface of the second chuck 230. The back surface Wb (here, the upper surface) of the second substrate W2 is the surface that comes into contact with the second chuck 230.

[0142] The second deformation mechanism 270 deforms the second holding mechanism 210. In this embodiment, the second deformation mechanism 270 deforms the second chuck 230 so that the center of the second holding surface 230a has a convex shape that protrudes in a direction toward the second substrate W2 (here, downward). The second deformation mechanism 270 deforms the second chuck 230 so that the center of the second holding surface 230a has a concave shape that is recessed in a direction away from the second substrate W2 (here, upward). In other words, the second deformation mechanism 270 deforms the second chuck 230 so that the second holding surface 230a has a convex shape, or deforms the second chuck 230 so that the second holding surface 230a has a concave shape. Hereinafter, when the second holding surface 230a is curved so that the center of the second holding surface 230a protrudes in a direction toward the second substrate W2 (here, downward), it may be described as the second holding surface 230a having a convex shape. Also, when the second holding surface 230a is curved so that the center of the second holding surface 230a is recessed in a direction away from the second substrate W2 (here, upward), it may be described as the second holding surface 230a having a concave shape. In this embodiment, the second deformation mechanism 270 has a second movable body 271 fixed to the center of the second chuck 230. The second movable body 271 includes a pipe having a through hole 171a.

[0143] In this embodiment, the second deformation mechanism 270 has a drive mechanism 273 that moves the second moving body 271 in the vertical direction relative to the second base 220. To avoid complicating the drawings, the drive mechanism 273 may be omitted from FIG. 14 and subsequent figures unless specifically necessary. The drive mechanism 273 has an actuator. The drive mechanism 273 is not particularly limited, but may include, for example, a drive source such as a pump or a motor, and a transmission member such as a gear and / or a cam that transmits the driving force of the drive source to the second moving body 271. The drive mechanism 273 is fixed to, for example, the upper surface 220b of the second base 220. When the drive mechanism 273 is driven, the second moving body 271 moves in the vertical direction relative to the second base 220. This causes the second chuck 230 to deform.

[0144] The drive mechanism 273 of the second deformation mechanism 270 is configured similarly to the drive mechanism 173 of the first deformation mechanism 170. Specifically, for example, when the drive mechanism 273 moves the second movable body 271 downward relative to the second base 220, the lower end of the second movable body 271 is fixed to the center of the second chuck 230 by the fixing member 172. Therefore, as the second movable body 271 moves downward relative to the second base 220, the center of the second chuck 230 is pressed downward relative to the second base 220. Therefore, even when the outer peripheral edge of the second chuck 230 is fixed by the fixing ring 150, the center of the second chuck 230 is pressed downward. Therefore, since the second chuck 230 is flexible, the second chuck 230 deforms to have a downwardly convex shape. As a result, the second holding surface 230a becomes convex.

[0145] Furthermore, for example, when the drive mechanism 273 moves the second movable body 271 upward relative to the second base 220, the lower end of the second movable body 271 is fixed to the center of the second chuck 230 by the fixing member 172. Therefore, as the second movable body 271 moves upward relative to the second base 220, the center of the second chuck 230 is pulled upward relative to the second base 220. Therefore, even though the outer peripheral edge of the second chuck 230 is fixed by the fixing ring 150, the center of the second chuck 230 is pulled upward. Therefore, because the second chuck 230 is flexible, the second chuck 230 deforms to become concave in the upward direction. As a result, the second holding surface 230a becomes concave.

[0146] In this embodiment, the maximum curvature of the convex shape of the first holding surface 130a of the first substrate holding device 100 is greater than the maximum curvature of the concave shape of the first holding surface 130a. In other words, the maximum curvature that the first holding surface 130a can have when it is convex is greater than the maximum curvature that the first holding surface 130a can have when it is concave. Note that the maximum curvature of the convex shape of the first holding surface 130a may be smaller than or the same as the maximum curvature of the concave shape of the first holding surface 130a.

[0147] Similarly, the maximum curvature of the convex shape of the second holding surface 230a of the second substrate holding device 200 is greater than the maximum curvature of the concave shape of the second holding surface 230a. In other words, the maximum curvature that the second holding surface 230a can have when it is convex is greater than the maximum curvature that the second holding surface 230a can have when it is concave. Note that the maximum curvature of the convex shape of the second holding surface 230a may be smaller than or the same as the maximum curvature of the concave shape of the second holding surface 230a.

[0148] In this embodiment, the maximum curvature of the convex shape of the first holding surface 130a is approximately the same as the maximum curvature of the convex shape of the second holding surface 230a. Also, the maximum curvature of the concave shape of the first holding surface 130a is approximately the same as the maximum curvature of the concave shape of the second holding surface 230a.

[0149] In this embodiment, the suction mechanism 300 (see FIG. 12 ) of the bonding apparatus 1 is connected to the through holes 171 a, 121 b, and 122 b of the first substrate holding device 100 and the second substrate holding device 200, and sucks air. Specifically, the suction mechanism 300 has a pipe 301 a connected to the through holes 171 a, 121 b, and 122 b of the first substrate holding device 100, a pipe 301 c connected to the through holes 171 a, 121 b, and 122 b of the second substrate holding device 200, and a suction device 302 (see FIG. 12 ). The suction device 302 is attached to, for example, the first frame SF1 (see FIG. 12 ) of the support frame SF using fasteners (not shown), such as bolts.

[0150] In this embodiment, suction mechanism 300 includes adjustment units 303a, 303b, and 303c. Adjustment units 303a, 303b, and 303c adjust the suction forces for through-hole 171a, through-hole 121b, and through-hole 122b, respectively. Adjustment units 303a, 303b, and 303c include, for example, actuators. Adjustment units 303a, 303b, and 303c are not particularly limited, but may include, for example, adjustment valves provided in pipes 301a and 301c. Note that, in order to adjust the suction forces for through-hole 171a, through-hole 121b, and through-hole 122b, suction mechanism 300 may include, for example, multiple suction pumps or multiple exhaust fans that adjust the suction forces for through-hole 171a, through-hole 121b, and through-hole 122b, respectively. The bonding apparatus 1 does not necessarily have to include the suction device 302. For example, the pipes 301a and 301c may be connected to the external suction device 302.

[0151] Figure 14 is a cross-sectional view schematically showing the second substrate holding device 200, and shows a state in which the second support pins 410 are arranged at the protruding position P1. As shown in Figure 14, in this embodiment, the second substrate holding device 200 has a plurality of second support pins 410. The plurality of second support pins 410 support the second substrate W2 before it is held by the second holding mechanism 210. It should be noted that the second substrate holding device 200 does not necessarily have to have a plurality of second support pins 410.

[0152] In this embodiment, the multiple second support pins 410 suction and hold the back surface Wb (here, the upper surface) of the second substrate W2. The second support pins 410 have through holes through which air passes. The suction mechanism 300 has a pipe 301d connected to the through holes of the second support pins 410 and a valve 310a that switches the inside of the pipe 301d between an open state and a closed state. The pipe 301d has, for example, a rubber tube. The second support pins 410 are connected to the pipe 301d by inserting the upper ends (not shown) of the second support pins 410 into the rubber tube. When the suction mechanism 300 is driven and the valve 310a is opened, air is sucked out of the through holes of the second support pins 410, and negative pressure is created inside the through holes of the second support pins 410. Therefore, when the suction device 302 is driven and the valve 310a is open, and the second substrate W2 is brought close to the tips (here, the lower ends) of the second support pins 410, the back surfaces Wb of the second substrate W2 are sucked onto the second support pins 410. A suction device separate from the suction mechanism 300 may be connected to the through holes of the second support pins 410. Although not shown, the second substrate holding device 200 may be configured so that the second holding mechanism 210 is turned upside down after the second substrate W2 is transferred from the second support pins 410 to the second holding surfaces 230a with the second holding surfaces 230a facing upward. In this case, the second support pins 410 do not need to suck the second substrate W2.

[0153] Other configurations of the second support pin 410 are similar to those of the support pin 400. For example, the second support pin 410 is movable between a protruding position P1 (see FIG. 14 ) where the second support pin 410 protrudes downward from the second holding surface 230 a, and a non-protruding position P2 where the second support pin 410 does not protrude downward from the second holding surface 230 a.

[0154] As described above, the second substrate holding device 200 includes a pin actuator 460 that moves the second support pins 410 in the vertical direction. The pin actuator 460 is fixed to, for example, the upper surface 220b of the second base 220. The pin actuator 460 is not particularly limited, but includes, for example, a drive source such as a pump or a motor, and a transmission member such as a gear and / or a cam that transmits the drive force of the drive source to the upper portion of the second support pins 410. When the pin actuator 460 is driven, the second support pins 410 move in the vertical direction relative to the second base 220 and the second chuck 230. For example, when the pin actuator 460 moves the second support pins 410 to the protruding position P1, the second support pins 410 protrude from the second holding surface 230a and can receive the second substrate W2 from the transport device TR. In other words, the second support pins 410 adsorb the second substrate W2 at the protruding position P1. When receiving the second substrate W2 from the transport device TR, the second support pins 410 receive the second substrate W2 in a state in which they protrude, for example, 10 mm or more from the second holding surface 230a. At this time, the height positions of the tips of all of the second support pins 410 are approximately constant. The second substrate W2 may be warped by up to several mm, but the second support pins 410 attract and adsorb the second substrate W2 to the second support pins 410 due to the suction of air by the second support pins 410. Furthermore, for example, the pin actuators 460 move the second support pins 410 from the protruding position P1 to the non-protruding position P2, so that the second support pins 410 no longer protrude from the second holding surface 230a. As a result, the second substrate W2 is moved upward from a position below the second holding surface 230a, and the second substrate W2 is transferred from the second support pins 410 to the second holding surface 230a.

[0155] In this embodiment, the second substrate holding device 200 is provided with a warpage detection device 500 that detects warpage of the second substrate W2. Note that the second substrate holding device 200 does not necessarily have to be provided with the warpage detection device 500.

[0156] The other configurations of the second substrate holding device 200 are similar to those of the first substrate holding device 100 .

[0157] Next, the bonding apparatus 1 will be further described with reference to Fig. 15. Fig. 15 is a block diagram showing the configuration of the bonding apparatus 1 according to the second embodiment.

[0158] In this embodiment, the bonding apparatus 1 has a control device 190. In this embodiment, the control device 190 controls the bonding apparatus 1. The control device 190 controls the first substrate holding device 100, the second substrate holding device 200, the suction mechanism 300, and the like.

[0159] The control device 190 includes a control unit 191 and a memory unit 193. The memory unit 193 stores data and computer programs. The data, for example, defines the process content and process procedure for holding the first substrate W1 and the second substrate W2. The data also defines the process content and process procedure for bonding the first substrate W1 and the second substrate W2 together. The control unit 191 executes the computer program stored in the memory unit 193 to perform the substrate holding operation and the substrate bonding operation.

[0160] The control unit 191 controls the first movement mechanism 610. The control unit 191 aligns the first substrate holding device 100 and the second substrate holding device 200 using the first movement mechanism 610. Specifically, the control unit 191 moves at least one of the first substrate holding device 100 and the second substrate holding device 200 in the horizontal direction using the first movement mechanism 610. In this embodiment, the control unit 191 moves the second substrate holding device 200 in the horizontal direction using the first movement mechanism 610.

[0161] The control unit 191 controls the second movement mechanism 620. The control unit 191 moves at least one of the first substrate holding device 100 and the second substrate holding device 200 in the vertical direction using the second movement mechanism 620. In this embodiment, the control unit 191 moves the second substrate holding device 200 in the vertical direction relative to the first substrate holding device 100 using the second movement mechanism 620.

[0162] The control unit 191 controls the first substrate holding device 100 and the second substrate holding device 200. The control unit 191 acquires warpage information of the first substrate W1 and the second substrate W2. Similar to the first embodiment, the control unit 191 controls the first substrate holding device 100 to hold the first substrate W1 based on the warpage information of the first substrate W1. Also, similar to the first embodiment, the control unit 191 controls the second substrate holding device 200 to hold the second substrate W2 based on the warpage information of the second substrate W2.

[0163] The warpage information of the second substrate W2 indicates whether the second substrate W2 has a concave substrate shape, a convex substrate shape, or a planar substrate shape. Specifically, the concave substrate shape of the second substrate W2 indicates a shape in which the front surface Wa (here, the lower surface) of the second substrate W2 is concave toward the back surface Wb (here, upward) and the back surface Wb (here, the upper surface) of the second substrate W2 protrudes toward the opposite side from the front surface Wa (here, upward). That is, in this embodiment, the concave substrate shape of the second substrate W2 indicates a shape in which the center of the front surface Wa (here, the lower surface) of the second substrate W2 is concave upward. Furthermore, the convex substrate shape of the second substrate W2 indicates a shape in which the front surface Wa of the second substrate W2 protrudes toward the opposite side from the back surface Wb (here, downward) and the back surface Wb is concave toward the front surface Wa (here, downward). That is, in this embodiment, the convex substrate shape of the second substrate W2 indicates a shape in which the center of the front surface Wa of the substrate W2 protrudes downward. The substrate planar shape refers to a shape in which both the front surface Wa and the back surface Wb of the second substrate W2 are planar. In the following description, a state in which the substrate W (first substrate W1 and second substrate W2) has a concave substrate shape may be described as having a concave front surface Wa. A state in which the substrate W (first substrate W1 and second substrate W2) has a convex substrate shape may be described as having a convex front surface Wa. A state in which the substrate W (first substrate W1 and second substrate W2) has a planar substrate shape may be described as having a flat front surface Wa. In this embodiment, the warpage information of the second substrate W2 indicates not only the warpage direction of the second substrate W2 but also the warpage amount of the second substrate W2.

[0164] Furthermore, the control unit 191 controls the first substrate holding device 100 and the second substrate holding device 200 based on the warpage information of the first substrate W1 and the second substrate W2 to bond the first substrate W1 and the second substrate W2 together.

[0165] The other configurations of the second embodiment are similar to those of the first embodiment.

[0166] Next, a bonding method using the bonding apparatus 1 of this embodiment will be described with reference to FIG. 16. FIG. 16 is a flowchart showing the bonding method using the bonding apparatus 1 of the second embodiment. In this embodiment, the bonding method using the bonding apparatus 1 includes steps S21 to S24. Step S21 is an example of the "step of holding the first substrate" in the present invention. Step S22 is an example of the "step of holding the second substrate" in the present invention. Step S24 is an example of the "step of bonding" in the present invention.

[0167] 16, in step S21, the control unit 191 holds the first substrate W1 by the first substrate holding device 100. Specifically, the control unit 191 causes the first substrate holding device 100 to hold the first substrate W1 in the same manner as the substrate holding method described with reference to Fig. 9. At this time, the front surface Wa of the first substrate W1 faces upward, and the back surface Wb faces downward.

[0168] Next, in step S22, the control unit 191 holds the second substrate W2 using the second substrate holding device 200. Specifically, the control unit 191 causes the second substrate holding device 200 to hold the second substrate W2 in the same manner as the substrate holding method described with reference to FIG. 9 . At this time, the second support pins 410 of the second substrate holding device 200 suck the second substrate W2 to support the back surface Wb of the second substrate W2. Also, at this time, the front surface Wa of the second substrate W2 faces downward, and the back surface Wb faces upward. Note that the second substrate holding device 200 may be turned upside down by an inversion mechanism (not shown) after holding the second substrate W2 with the second holding surface 230a facing upward.

[0169] Note that steps S21 and S22 may be performed in the reverse order or in parallel.

[0170] Next, in step S23, the control unit 191 aligns the first substrate W1 and the second substrate W2 using the first moving mechanism 610. Specifically, the control unit 191 acquires relative position information indicating the relative positions of the first substrate W1 and the second substrate W2 using a position detection sensor (not shown). For example, the position detection sensor detects alignment marks provided on the first substrate W1 and the second substrate W2. Then, the control unit 191 moves the second substrate holding device 200 in the horizontal direction using the first moving mechanism 610 based on the relative position information. This aligns the first substrate W1 and the second substrate W2. Note that when detecting the alignment marks using the position detection sensor, the first deformation mechanism 170 and the second deformation mechanism 270 may flatten the surfaces Wa of the first substrate W1 and the second substrate W2. This configuration improves the detection accuracy of the position detection sensor.

[0171] Next, in step S24, the control unit 191 bonds the first substrate W1 and the second substrate W2 together using the second moving mechanism 620. Specifically, the control unit 191 bonds the first substrate W1 and the second substrate W2 together by moving at least one of the first substrate W1 and the second substrate W2 in the vertical direction. In this embodiment, the control unit 191 bonds the first substrate W1 and the second substrate W2 together by moving the second substrate holding device 200 downward using the second moving mechanism 620.

[0172] At this time, the control unit 191 deforms at least one of the first chuck 130 of the first substrate holding device 100 and the second chuck 230 of the second substrate holding device 200 based on the warpage information of the first substrate W1 and the warpage information of the second substrate W2, thereby bonding the first substrate W1 and the second substrate W2 together.

[0173] In this way, the joining process is completed.

[0174] Next, step S24 of the bonding method of the second embodiment will be described in detail with reference to Fig. 17. Fig. 17 is a flowchart showing the bonding step (step S24) in the bonding method using the bonding apparatus 1 of the second embodiment. In this embodiment, the bonding step (step S24) includes steps S241 to S244.

[0175] 17 , in step S241, the control unit 191 determines, based on the warpage information, the warpage shapes of the first chuck 130 and the second chuck 230 at the time of bonding. Specifically, the control unit 191 determines the combination pattern of the warpage directions of the first substrate W1 and the second substrate W2, based on the warpage information of the first substrate W1 and the second substrate W2.

[0176] Specifically, there are, for example, six combination patterns of the warpage directions of the first substrate W1 and the second substrate W2. For example, the first combination pattern is a pattern in which both the surfaces Wa of the first substrate W1 and the second substrate W2 are planar (substrate planar shape). The second combination pattern is a pattern in which one of the surfaces Wa of the first substrate W1 and the second substrate W2 is planar (substrate planar shape) and the other of the surfaces Wa of the first substrate W1 and the second substrate W2 is convex (substrate convex shape). The third combination pattern is a pattern in which one of the surfaces Wa of the first substrate W1 and the second substrate W2 is planar (substrate planar shape) and the other of the surfaces Wa of the first substrate W1 and the second substrate W2 is concave (substrate concave shape). The fourth combination pattern is a pattern in which both the surfaces Wa of the first substrate W1 and the second substrate W2 are convex (substrate convex shape). The fifth combination pattern is a pattern in which one of the surfaces Wa of the first substrate W1 and the second substrate W2 has a convex shape (convex substrate shape) and the other of the surfaces Wa of the first substrate W1 and the second substrate W2 has a concave shape (concave substrate shape).The sixth combination pattern is a pattern in which both of the surfaces Wa of the first substrate W1 and the second substrate W2 have concave shapes (concave substrate shape).

[0177] Then, the control unit 191 determines the warpage shapes of the first chuck 130 and the second chuck 230 at the time of bonding based on the first to sixth combination patterns. That is, the control unit 191 determines the warpage shapes of the first holding surface 130a and the second holding surface 230a at the time of bonding.

[0178] At this time, in this embodiment, the control unit 191 may determine the amount of warpage of the first chuck 130 and the second chuck 230 during bonding based on the amount of warpage of the first substrate W1 and the second substrate W2. In other words, the control unit 191 may determine the amount of warpage of the first holding surface 130 a and the second holding surface 230 a during bonding.

[0179] Next, in step S242, the control unit 191 deforms the first chuck 130 and the second chuck 230 so as to form the warpage shape determined in step S241. Specifically, the control unit 191 deforms the first chuck 130 using the first deformation mechanism 170 and deforms the second chuck 230 using the second deformation mechanism 270 so as to form the warpage shape determined in step S241. At this time, for example, the control unit 191 deforms the first chuck 130 by driving the first deformation mechanism 170 while keeping the first base 120 fixed, thereby moving the first movable body 171 in the vertical direction relative to the first base 120. Also, at this time, for example, the control unit 191 deforms the second chuck 230 by driving the second deformation mechanism 270 while keeping the second base 220 fixed, thereby moving the second movable body 271 in the vertical direction relative to the second base 220.

[0180] Next, in step S243, the control unit 191 brings the first substrate W1 and the second substrate W2 into point contact. Specifically, the control unit 191 causes the second moving mechanism 620 to bring the center of the first substrate W1 into point contact with the center of the second substrate W2.

[0181] Next, in step S244, the control unit 191 brings the first substrate W1 and the second substrate W2 into contact with each other over their entire surfaces. That is, the control unit 191 bonds the first substrate W1 and the second substrate W2 together.

[0182] Hereinafter, the lamination method for each of the first to sixth combination patterns will be further described with reference to FIGS.

[0183] (First combination pattern) Fig. 18 is a schematic diagram for explaining a bonding method in the first combination pattern. With reference to Fig. 18, a case where both the surfaces Wa of the first substrate W1 and the second substrate W2 are planar will be explained. In other words, a case where both the first substrate W1 and the second substrate W2 have a planar substrate shape will be explained.

[0184] 18 , when both the surfaces Wa of the first substrate W1 and the second substrate W2 are flat (the state shown in the upper part of FIG. 18 ), the control unit 191, for example, maintains either the first holding surface 130 a of the first chuck 130 or the second holding surface 230 a of the second chuck 230 flat, and causes the other of the first holding surface 130 a and the second holding surface 230 a to be convex. In this embodiment, the control unit 191, for example, maintains the first holding surface 130 a flat and causes the second holding surface 230 a to be convex (the state shown in the middle part of FIG. 18 ). At this time, for example, while the second base 220 is fixed, the control unit 191 drives the second deformation mechanism 270 to move the second movable body 271 downward relative to the second base 220, thereby causing the second holding surface 230 a to be convex. The control unit 191 may also make both the first holding surface 130a and the second holding surface 230a convex.

[0185] Thereafter, the control unit 191 moves the second substrate holding device 200 downward using the second moving mechanism 620. At this time, the second support stand SB2, the second base 220, and the second support pins 410 move downward by the same amount. As a result, the front surface Wa (here, the upper surface) of the first substrate W1 and the front surface Wa (here, the lower surface) of the second substrate W2 come into point contact.

[0186] The control unit 191 then gradually reduces the suction force on the second substrate W2. As a result, the second substrate W2 is peeled off from the second chuck 230 due to the restoring force of the second substrate W2, and the surface Wa (here, the lower surface) of the second substrate W2 deforms to become more planar, so that the entire surface Wa of the second substrate W2 comes into close contact with the entire surface Wa of the first substrate W1 (here, the upper surface) (the state shown in the lower part of FIG. 18 ). Specifically, from a state in which the surfaces Wa of the first substrate W1 and the second substrate W2 are in point contact at a single central point, the contact area gradually expands radially outward, and the surfaces Wa of the first substrate W1 and the second substrate W2 come into contact over their entire surfaces. This prevents voids from forming between the first substrate W1 and the second substrate W2.

[0187] In this embodiment, when gradually reducing the suction force on the second substrate W2, the control unit 191 gradually reduces the suction force from the center of the second substrate W2 toward the radially outer side. Specifically, the control unit 191 switches the adjustment unit 303a from an open state to a closed state, then switches the adjustment unit 303b from an open state to a closed state, and then switches the adjustment unit 303c from an open state to a closed state. In this manner, the suction forces on the through holes 171a, 121b, and 122b are reduced in this order. Therefore, from a state in which the first substrate W1 and the second substrate W2 are in point contact at a single point in the center, the contact area between the first substrate W1 and the second substrate W2 tends to gradually expand radially outward. This makes it easy to prevent voids from being generated between the first substrate W1 and the second substrate W2.

[0188] Furthermore, although not shown, the control unit 191 may deform the second chuck 230 from a state in which the front surface Wa of the first substrate W1 and the front surface Wa of the second substrate W2 are in point contact with each other so that the second holding surface 230a becomes flat without reducing the suction force on the second substrate W2. In this case, the control unit 191 moves the second base 220 downward so that the second movable body 271 does not move up and down. Specifically, while moving the second base 220 downward using the second deformation mechanism 270, the control unit 191 moves the second movable body 271 upward relative to the second base 220 at the same speed using the drive mechanism 273. At this time, the control unit 191 moves the second support pins 410 of the second substrate holding device 200 upward relative to the second base 220 using the pin actuator 460 so that the second support pins 410 do not protrude downward from the second holding surface 230a. As a result, the first substrate W1 and the second substrate W2 come into contact with each other over their entire surfaces.

[0189] (Second Combination Pattern) Figure 19 is a schematic diagram for explaining a bonding method in a second combination pattern. With reference to Figure 19, a case will be described in which one of the surfaces Wa of the first substrate W1 and the second substrate W2 has a planar shape, and the other of the surfaces Wa of the first substrate W1 and the second substrate W2 has a convex shape. In other words, a case will be described in which one of the first substrate W1 and the second substrate W2 has a planar substrate shape, and the other of the first substrate W1 and the second substrate W2 has a convex substrate shape.

[0190] As shown in FIG. 19 , when one of the surfaces Wa of the first substrate W1 and the second substrate W2 is planar and the other of the surfaces Wa of the first substrate W1 and the second substrate W2 is convex (the state shown in the upper part of FIG. 19 ), the control unit 191, for example, maintains one of the first holding surface 130a of the first chuck 130 and the second holding surface 230a of the second chuck 230 planar and makes the other of the first holding surface 130a and the second holding surface 230a convex. Here, an example will be described in which the surface Wa of the first substrate W1 is convex and the surface Wa of the second substrate W2 is planar. The control unit 191, for example, maintains the first holding surface 130a convex and the second holding surface 230a flat (the state shown in the middle part of FIG. 19 ). Note that the control unit 191 may also make both the first holding surface 130a and the second holding surface 230a convex.

[0191] Thereafter, the control unit 191 moves the second substrate holding device 200 downward using the second moving mechanism 620. As a result, the front surface Wa (here, the upper surface) of the first substrate W1 and the front surface Wa (here, the lower surface) of the second substrate W2 come into point contact.

[0192] The control unit 191 then causes the first deformation mechanism 170 to deform the first chuck 130 so that the first holding surface 130a becomes planar, while bringing the front surface Wa (here, the lower surface) of the second substrate W2 into contact with the front surface Wa (here, the upper surface) of the first substrate W1. In this case, the control unit 191 causes the drive mechanism 173 to move the first moving body 171 downward relative to the first base 120, while causing the second moving mechanism 620 to move the second substrate holding device 200 downward at the same speed. This brings the first substrate W1 and the second substrate W2 into contact over their entire surfaces (the state shown in the lower part of Figure 19). Alternatively, although not shown, the control unit 191 may, for example, deform the second chuck 230 so that the second holding surface 230a becomes concave, while bringing the front surface Wa (here, the lower surface) of the second substrate W2 into contact with the front surface Wa (here, the upper surface) of the first substrate W1.

[0193] (Third Combination Pattern) Figure 20 is a schematic diagram for explaining a bonding method in a third combination pattern. With reference to Figure 20, a case will be described in which one of the surfaces Wa of the first substrate W1 and the second substrate W2 is planar, and the other of the surfaces Wa of the first substrate W1 and the second substrate W2 is concave. In other words, a case will be described in which one of the first substrate W1 and the second substrate W2 has a planar substrate shape, and the other of the first substrate W1 and the second substrate W2 has a concave substrate shape.

[0194] 20 , when one of the surfaces Wa of the first substrate W1 and the second substrate W2 is planar and the other of the surfaces Wa of the first substrate W1 and the second substrate W2 is concave (the state shown in the upper part of FIG. 20 ), the control unit 191, for example, makes one of the first holding surface 130a of the first chuck 130 and the second holding surface 230a of the second chuck 230 convex, and makes the other of the first holding surface 130a and the second holding surface 230a concave. Here, an example will be described in which the surface Wa of the first substrate W1 is concave and the surface Wa of the second substrate W2 is convex. For example, the control unit 191 maintains the concave shape of the first holding surface 130a, and causes the second deformation mechanism 270 to make the second holding surface 230a convex (the state shown in the middle part of FIG. 20 ). At this time, for example, the control unit 191 drives the second deformation mechanism 270 while the second base 220 is fixed, thereby moving the second moving body 271 downward relative to the second base 220, thereby making the second holding surface 230a convex. Note that the control unit 191 may make both the first holding surface 130a and the second holding surface 230a convex. However, for example, if a substrate W (here, the first substrate W1) with a concave surface Wa is deformed so that the surface Wa becomes convex, the stress applied to the substrate W is likely to increase. Therefore, it is preferable not to deform the substrate W so that the warping direction of the substrate W is reversed.

[0195] When one of the first holding surface 130a and the second holding surface 230a is made convex and the other of the first holding surface 130a and the second holding surface 230a is made concave, the control unit 191 makes the curvature of one of the first holding surface 130a and the second holding surface 230a greater than the curvature of the other of the first holding surface 130a and the second holding surface 230a. In this embodiment, the control unit 191 makes the curvature of the second holding surface 230a greater than the curvature of the first holding surface 130a.

[0196] Thereafter, the control unit 191 moves the second substrate holding device 200 downward using the second moving mechanism 620. As a result, the front surface Wa (here, the upper surface) of the first substrate W1 and the front surface Wa (here, the lower surface) of the second substrate W2 come into point contact.

[0197] The control unit 191 then gradually reduces the suction force on the second substrate W2. As a result, the second substrate W2 is peeled off from the second chuck 230, and the front surface Wa (here, the lower surface) of the second substrate W2 deforms to become more planar, and the entire front surface Wa of the second substrate W2 comes into close contact with the entire front surface Wa (here, the upper surface) of the first substrate W1 (the state shown in the lower part of FIG. 20). Note that the manner in which the suction force is reduced and the manner in which the contact area between the first substrate W1 and the second substrate W2 expands are the same as those during bonding in the first combination pattern described above.

[0198] Furthermore, although not shown, the control unit 191 may deform the second chuck 230 so that the second holding surface 230a approaches a flat surface without reducing the suction force on the second substrate W2 from a state in which the front surface Wa of the first substrate W1 and the front surface Wa of the second substrate W2 are in point contact. In this case, the control unit 191 moves the second base 220 downward to prevent the second movable body 271 from moving vertically. The method of moving the second base 220 downward to prevent the second movable body 271 from moving vertically is the same as that used during bonding in the first combination pattern described above. This brings the first substrate W1 and the second substrate W2 into contact over their entire surfaces.

[0199] (Fourth Combination Pattern) Fig. 21 is a schematic diagram for explaining a bonding method in a fourth combination pattern. With reference to Fig. 21, a case where both the surfaces Wa of the first substrate W1 and the second substrate W2 have a convex shape will be explained. In other words, a case where both the first substrate W1 and the second substrate W2 have a convex substrate shape will be explained.

[0200] 21 , when both the surfaces Wa of the first substrate W1 and the second substrate W2 have a convex shape (the state shown in the upper part of FIG. 21 ), the control unit 191 maintains, for example, both the first holding surface 130 a of the first chuck 130 and the second holding surface 230 a of the second chuck 230 in a convex shape (the state shown in the middle part of FIG. 21 ). Note that the control unit 191 may, for example, make one of the first holding surface 130 a and the second holding surface 230 a flat.

[0201] Thereafter, the control unit 191 moves the second substrate holding device 200 downward using the second moving mechanism 620. As a result, the front surface Wa (here, the upper surface) of the first substrate W1 and the front surface Wa (here, the lower surface) of the second substrate W2 come into point contact.

[0202] Then, the control unit 191 deforms the first chuck 130 so that the first holding surface 130a becomes planar, and deforms the second chuck 230 so that the second holding surface 230a becomes planar. In this case, the control unit 191 causes the drive mechanism 173 to move the first movable body 171 downward relative to the first base 120, while causing the drive mechanism 273 to move the second movable body 271 downward at the same speed. At this time, the control unit 191 moves the second base 220 downward at a speed greater than that of the second movable body 271. In other words, the control unit 191 causes the drive mechanism 273 to move the second movable body 271 upward relative to the second base 220. At this time, the control unit 191 also causes the drive mechanism 173 to move the second support pin 410 upward relative to the second base 220 so that the second support pin 410 does not protrude downward from the second holding surface 230a. This brings the first substrate W1 and the second substrate W2 into contact over their entire surfaces (the state shown in the lower part of FIG. 21 ). Alternatively, although not shown, the control unit 191 may deform either the first chuck 130 or the second chuck 230 so that either the first holding surface 130a or the second holding surface 230a has a concave shape. This brings the first substrate W1 and the second substrate W2 into contact over their entire surfaces.

[0203] (Fifth Combination Pattern) Figure 22 is a schematic diagram for explaining a bonding method in a fifth combination pattern. With reference to Figure 22, a case will be described in which one of the surfaces Wa of the first substrate W1 and the second substrate W2 has a convex shape, and the other of the surfaces Wa of the first substrate W1 and the second substrate W2 has a concave shape. In other words, a case will be described in which one of the first substrate W1 and the second substrate W2 has a convex substrate shape, and the other of the first substrate W1 and the second substrate W2 has a concave substrate shape.

[0204] As shown in FIG. 22 , when one of the surfaces Wa of the first substrate W1 and the second substrate W2 is convex and the other of the surfaces Wa of the first substrate W1 and the second substrate W2 is concave (the state shown in the upper part of FIG. 22 ), the control unit 191, for example, maintains one of the first holding surface 130a of the first chuck 130 and the second holding surface 230a of the second chuck 230 in a convex shape and maintains the other of the first holding surface 130a and the second holding surface 230a in a concave shape. Here, an example will be described in which the surface Wa of the first substrate W1 is concave and the surface Wa of the second substrate W2 is convex. In this embodiment, the control unit 191, for example, maintains the first holding surface 130a in a concave shape and the second holding surface 230a in a convex shape (the state shown in the middle part of FIG. 22 ). Note that the control unit 191 may, for example, make the first holding surface 130a flat.

[0205] When one of the first holding surface 130a and the second holding surface 230a is made convex and the other of the first holding surface 130a and the second holding surface 230a is made concave, the control unit 191 makes the curvature of one of the first holding surface 130a and the second holding surface 230a greater than the curvature of the other of the first holding surface 130a and the second holding surface 230a. In this embodiment, the control unit 191 makes the curvature of the second holding surface 230a greater than the curvature of the first holding surface 130a.

[0206] Thereafter, the control unit 191 moves the second substrate holding device 200 downward using the second moving mechanism 620. As a result, the front surface Wa (here, the upper surface) of the first substrate W1 and the front surface Wa (here, the lower surface) of the second substrate W2 come into point contact.

[0207] Then, the control unit 191 deforms the second chuck 230 using the first deformation mechanism 170 so that the second holding surface 230a approaches a flat surface without reducing the suction force on the second substrate W2. In this case, the control unit 191 moves the second base 220 downward to prevent the second movable body 271 from moving vertically. The method of moving the second base 220 downward to prevent the second movable body 271 from moving vertically is the same as that used during bonding in the first combination pattern described above. This brings the first substrate W1 and the second substrate W2 into contact with each other over their entire surfaces. Alternatively, although not shown, the control unit 191 may deform the first chuck 130 so that the curvature of the first holding surface 130a is the same as the curvature of the second holding surface 230a. This brings the first substrate W1 and the second substrate W2 into contact with each other over their entire surfaces.

[0208] (Sixth Combination Pattern) Fig. 23 is a schematic diagram for explaining a bonding method in the sixth combination pattern. With reference to Fig. 23, a case where both the surfaces Wa of the first substrate W1 and the second substrate W2 have a concave shape will be explained. In other words, a case where both the first substrate W1 and the second substrate W2 have a concave substrate shape will be explained.

[0209] As shown in FIG. 23 , when both the surfaces Wa of the first substrate W1 and the second substrate W2 are concave (the state shown in the upper part of FIG. 23 ), the control unit 191, for example, causes one of the first holding surface 130 a of the first chuck 130 and the second holding surface 230 a of the second chuck 230 to be convex, while maintaining the other of the first holding surface 130 a and the second holding surface 230 a in a concave shape. Which of the first holding surface 130 a and the second holding surface 230 a is convex is determined as appropriate. For example, the control unit 191 may cause the holding surface that holds the first substrate W1 or the second substrate W2 with the least amount of warpage to be convex. Alternatively, the control unit 191 may cause the holding surface that holds the substrate that is less adversely affected by stress to be convex. In this embodiment, the control unit 191, for example, maintains the first holding surface 130 a in a concave shape and causes the second holding surface 230 a to be convex (the state shown in the middle part of FIG. 23 ). At this time, for example, the control unit 191 drives the second deformation mechanism 270 while the second base 220 is fixed, thereby moving the second moving body 271 downward relative to the second base 220, thereby forming the second holding surface 230a in a convex shape. Note that the control unit 191 may also form, for example, the other of the first holding surface 130a and the second holding surface 230a in a flat or convex shape.

[0210] When one of the first holding surface 130a and the second holding surface 230a is made convex and the other of the first holding surface 130a and the second holding surface 230a is made concave, the control unit 191 makes the curvature of one of the first holding surface 130a and the second holding surface 230a greater than the curvature of the other of the first holding surface 130a and the second holding surface 230a. In this embodiment, the control unit 191 makes the curvature of the second holding surface 230a greater than the curvature of the first holding surface 130a.

[0211] Thereafter, the control unit 191 moves the second substrate holding device 200 downward using the second moving mechanism 620. As a result, the front surface Wa (here, the upper surface) of the first substrate W1 and the front surface Wa (here, the lower surface) of the second substrate W2 come into point contact.

[0212] The control unit 191 then gradually reduces the suction force on the second substrate W2. As a result, the second substrate W2 is peeled off from the second chuck 230, and the front surface Wa (here, the lower surface) of the second substrate W2 deforms to become more planar, and the entire front surface Wa of the second substrate W2 comes into close contact with the entire front surface Wa (here, the upper surface) of the first substrate W1 (the state shown in the lower part of FIG. 23). Note that the manner in which the suction force is reduced and the manner in which the contact area between the first substrate W1 and the second substrate W2 expands are the same as those during bonding in the first combination pattern described above.

[0213] In this embodiment, as described above, the first deformation mechanism 170 deforms the first chuck 130 so that the first holding surface 130a has a convex shape, and also deforms the first chuck 130 so that the first holding surface 130a has a concave shape. Furthermore, the second deformation mechanism 270 deforms the second chuck 230 so that the second holding surface 230a has a convex shape, and also deforms the second chuck 230 so that the second holding surface 230a has a concave shape. Therefore, during bonding, various combinations of warpage shapes of the first chuck 130 and the second chuck 230 can be achieved. This makes it possible to prevent stresses acting on the first substrate W1 and the second substrate W2 from increasing.

[0214] Furthermore, as described above, the first substrate W1 and the second substrate W2 are bonded together with one of the first holding surface 130a and the second holding surface 230a being convex and the other being concave. Therefore, for example, when bonding a first substrate W1 having a concave surface Wa to a second substrate W2 having a convex surface Wa, the first substrate W1 and the second substrate W2 can be bonded together while maintaining the warpage directions of the first substrate W1 and the second substrate W2. This makes it easy to prevent stresses from increasing on the first substrate W1 and the second substrate W2.

[0215] Furthermore, as described above, the maximum curvature of the convex shape of the first holding surface 130 a and the second holding surface 230 a is greater than the maximum curvature of the concave shape of the first holding surface 130 a and the second holding surface 230 a. Therefore, for example, when the first holding surface 130 a is concave and the second holding surface 230 a is convex (see, for example, the middle part of FIG. 20 ), the curvature of the second holding surface 230 a can easily be made greater than the curvature of the first holding surface 130 a.

[0216] Other configurations and other effects of the second embodiment are similar to those of the first embodiment.

[0217] The embodiments of the present invention have been described above with reference to the drawings. However, the present invention is not limited to the above embodiments and can be embodied in various forms without departing from the spirit and scope of the present invention. Furthermore, various inventions can be formed by appropriately combining multiple components disclosed in the above embodiments. For example, some components may be omitted from all components shown in the embodiments. Furthermore, components from different embodiments may be appropriately combined. The drawings mainly show each component in a schematic manner to facilitate understanding. The thickness, length, number, spacing, etc. of each component shown may differ from the actual thickness, length, number, spacing, etc. of each component shown in the above embodiments due to the convenience of drawing. Furthermore, the materials, shapes, dimensions, etc. of each component shown in the above embodiments are merely examples and are not particularly limited. Various modifications are possible within a scope that does not substantially deviate from the effects of the present invention.

[0218] For example, in the above embodiment, the substrate W is a semiconductor wafer, but the present invention is not limited to this. The present invention can use various substrates other than semiconductor wafers as the substrate W.

[0219] Furthermore, for example, in the second embodiment, an example was described in which both the first holding surface 130a of the first substrate holding device 100 and the second holding surface 230a of the second substrate holding device 200 deform into a convex shape and a concave shape, but the present invention is not limited to this. For example, the first holding surface 130a of the first substrate holding device 100 may deform into a convex shape and a concave shape, while the second holding surface 230a of the second substrate holding device 200 does not have to be concave. In other words, a bonding apparatus may be configured by the first substrate holding device 100 and a second substrate holding device having a different structure from the first substrate holding device 100. However, when a bonding apparatus is configured by the first substrate holding device 100 and a second substrate holding device having a different structure from the first substrate holding device 100, it is preferable that the first substrate holding device 100, which does not have second support pins 410, be positioned below the second substrate holding device. In other words, it is preferable that the first substrate holding device 100 holds the lower substrate of the two substrates.

[0220] In the above embodiment, the chuck is deformed by moving the movable body fixed to the chuck in the vertical direction. However, the present invention is not limited to this. For example, the chuck may be deformed by providing a sealed space between the chuck and the base and introducing compressed air into the sealed space or reducing the pressure in the sealed space. In this case, the deformation mechanism includes, for example, a pump or a blower fan.

[0221] The present invention is suitably used for a substrate holding device, a bonding device, a substrate holding method, and a bonding method.

[0222] DESCRIPTION OF SYMBOLS 1: Bonding apparatus 100: Substrate holding device, first substrate holding device 110: Holding mechanism, first holding mechanism 120: Base, first base 120c: Insertion groove (insertion hole) 120d: Inner surface 130: Chuck, first chuck 130a: Holding surface, first holding surface 160: Partition wall 160a: Tip surface 170: Deformation mechanism, first deformation mechanism 171: Moving body 171a: Through hole 191: Control unit 200: Second substrate holding device 210: Second holding mechanism 220: Second base 230: Second chuck 230a: Second holding surface 270: Second deformation mechanism 400: Support pin, first support pin 410: Second support pin S, S1, S2: Space S120: Area S11: Step (Substrate preparation step) S14: Step (Substrate holding step) S21: Step (First substrate holding step) S22: Step (Second substrate holding step) S24: Step (Bonding step) W: Substrate W1: First substrate W2: Second substrate Wa: Front surface Wb: Back surface (one side)

Claims

1. A substrate holding device comprising: a holding mechanism which adsorbs and holds a substrate; and a deformation mechanism which deforms the holding mechanism, wherein the holding mechanism comprises a chuck having a holding surface which holds one side of the substrate, and a base which is arranged on the opposite side of the chuck from the holding surface and to which the chuck is attached, and wherein the deformation mechanism deforms the chuck so that the holding surface can assume both a convex shape in which the center of the holding surface protrudes towards the substrate, and a concave shape which is recessed towards the base.

2. A substrate holding device as described in claim 1, further comprising a control unit for controlling the deformation mechanism, which acquires warpage information indicating at least a warpage direction of the substrate, causes the deformation mechanism to deform the chuck so that the holding surface assumes the convex shape or the concave shape based on the warpage information, and causes the holding mechanism to hold the substrate.

3. The substrate holding device of claim 2, wherein the substrate has a surface which is a device forming surface and a back surface which is located opposite the surface and is the one side and is a non-device forming surface, and when the warpage information indicates that the substrate has a concave substrate shape, the control unit deforms the chuck using the deformation mechanism so that the holding surface has the concave shape and holds the back surface of the substrate using the holding mechanism, and the concave substrate shape indicates a shape in which the substrate is concave toward the back surface and the back surface protrudes opposite the substrate.

4. The substrate holding device of claim 3, wherein the control unit brings the center of the holding surface into point contact with the center of the back surface of the substrate, and then uses the deformation mechanism to make the holding surface into the concave shape and to make the curvature of the holding surface larger than the curvature of the substrate.

5. A substrate holding device as described in any one of claims 1 to 4, wherein the deformation mechanism has a movable body fixed to the center of the chuck, and the movable body moves relative to the base along a facing direction in which the chuck and the base face each other.

6. The substrate holding device according to claim 5, wherein the movable body includes a pipe having a through hole connected to the holding surface, the through hole being a suction hole that sucks the one surface of the substrate.

7. A substrate holding device as described in any one of claims 1 to 6, comprising a partition wall dividing the space between the chuck and the base into a plurality of spaces, the partition wall extending from the chuck towards the base, the base having an insertion hole into which a portion of the partition wall is inserted, and when the holding surface is planar, a portion of the partition wall is inserted into the insertion hole, the insertion hole having an area into which the partition wall can be further inserted, the area being defined by a tip surface of the partition wall and an inner surface of the insertion hole.

8. A bonding apparatus for bonding a first substrate and a second substrate, comprising: a first substrate holding device for holding the first substrate; and a second substrate holding device disposed opposite the first substrate holding device for holding the second substrate, the first substrate holding device having a first holding mechanism for adsorbing and holding the first substrate, and a first deformation mechanism for deforming the first holding mechanism, the first holding mechanism having a first chuck having a first holding surface for holding one side of the first substrate, and a first base disposed on the opposite side of the first holding surface of the first chuck to which the first chuck is attached, the first deformation mechanism deforming the first chuck so that the first holding surface can assume both a convex shape in which the center of the first holding surface protrudes toward the first substrate, and a concave shape in which the center is recessed toward the first base.

9. The bonding apparatus according to claim 8, wherein the second substrate holding device comprises: a second holding mechanism that adsorbs and holds the second substrate; and a second deformation mechanism that deforms the second holding mechanism, wherein the second holding mechanism comprises a second chuck having a second holding surface that holds one side of the second substrate, and a second base that is arranged on the opposite side of the second holding surface of the second chuck to the second base and to which the second chuck is attached, and the second deformation mechanism deforms the second chuck so that the second holding surface can realize both a convex shape in which the center of the second holding surface protrudes toward the second substrate, and a concave shape that is recessed toward the second base.

10. A bonding apparatus as described in claim 9, wherein the first substrate holding device and the second substrate holding device bond the first substrate and the second substrate together in a state in which one of the first holding surface and the second holding surface is formed in the convex shape and the other of the first holding surface and the second holding surface is formed in the concave shape.

11. A bonding apparatus according to any one of claims 8 to 10, wherein the maximum curvature of the convex shape of the first holding surface is greater than the maximum curvature of the concave shape of the first holding surface.

12. A substrate holding method comprising: a step of preparing a substrate; and a step of deforming a chuck having a holding surface that adsorbs and holds one side of the substrate so that the holding surface has a concave shape, and holding the substrate with the chuck, wherein the concave shape is such that the center of the holding surface is concave on the opposite side to the substrate.

13. A bonding method comprising the steps of: deforming a first chuck having a first holding surface that adsorbs and holds one side of a first substrate so that the first holding surface has a concave shape, and holding the first substrate with the first chuck; adsorbing and holding one side of a second substrate with a second holding surface of a second chuck; and bonding the first substrate and the second substrate together in a state in which the first holding surface has the concave shape and the second holding surface opposing the first holding surface has a convex shape, wherein the concave shape of the first holding surface indicates that the center of the first holding surface is recessed toward the opposite side to the first substrate, and the convex shape of the second holding surface indicates that the center of the second holding surface protrudes toward the second substrate.

Images