Substrate holding device, bonding device, substrate holding method, and bonding method

Abstract

A substrate holding device (100) comprises a chuck (130), a plurality of suction pins (400), and a pin actuator (450). The chuck (130) has a holding surface (130a) for suctioning and holding the rear surface (Wb) of a substrate (W). The plurality of suction pins (400) can protrude from the holding surface (130a) and suction and hold the substrate (W). The plurality of suction pins (400) suction the rear surface (Wb) of the substrate (W) from a protruding position (P1). The pin actuator (450) changes the amount of protrusion of at least one of the suction pins (400) with respect to the amount of protrusion of the other suction pins (400), thereby bending the substrate (W) to conform to the holding surface (130a). The pin actuator (450) moves the plurality of suction pins (400) from the protruding position (P1) to a non-protruding position (P2) so that the chuck (130) holds the substrate (W).

Description

Substrate holding device, bonding device, substrate holding method, and bonding method

[0001] The present invention relates to a substrate holding device, a bonding device, a substrate holding method, and a bonding method.

[0002] Conventionally, a bonding apparatus has been known that includes a first substrate holding device that holds a first substrate and a second substrate holding device that holds a second substrate, and bonds the first substrate and the second substrate together (see, for example, Patent Document 1). Patent Document 1 discloses a bonding apparatus that includes a first holding unit that suction-holds the first substrate, which is a wafer, from above, and a second holding unit that is positioned below the first holding unit and suction-holds the second substrate, which is a wafer, from below. The first holding unit has a plurality of suction holes. The bonding apparatus bonds the first substrate and the second substrate together.

[0003] Japanese Patent Application Laid-Open No. 2021-141115

[0004] However, wafers can sometimes be warped. Specifically, the device-forming surface of a wafer is usually convex or concave. In the apparatus described in Patent Document 1, a wafer having such warpage is placed on a holding surface, and then the wafer is attracted to the holding surface.

[0005] However, when a warped wafer is placed on a holding surface using the device described in Patent Document 1 or the like and then the wafer is sucked onto the holding surface, there is a risk that a portion of the wafer will remain warped on the holding surface, or in other words, a gap will be created between the holding surface and the wafer.

[0006] The present invention has been made in consideration of the above-mentioned problems, and its purpose is to provide a substrate holding device, a bonding device, a substrate holding method, and a bonding method that can prevent gaps from occurring between the substrate and the holding surface.

[0007] A substrate holding device according to a first aspect of the present invention includes a chuck, a plurality of suction pins, and a pin actuator. The chuck has a holding surface that suction-holds one side of a substrate. The plurality of suction pins are protruding from the holding surface and suction-hold the substrate. The pin actuator moves the plurality of suction pins between a protruding position where they protrude from the holding surface and a non-protruding position where they do not protrude from the holding surface. The plurality of suction pins suction-hold the one side of the substrate at the protruding position. The pin actuator changes the protruding amount of at least one of the suction pins relative to the protruding amounts of the other suction pins, thereby curving the substrate to conform to the holding surface. The pin actuator moves the plurality of suction pins from the protruding position to the non-protruding position, causing the chuck to hold the substrate.

[0008] In one embodiment, the plurality of suction pins include a central suction pin and a plurality of peripheral suction pins. The central suction pin suctions and holds the center of the substrate. The plurality of peripheral suction pins suction and hold the peripheral portion of the substrate. The pin actuator includes a central pin actuator and a peripheral pin actuator. The central pin actuator moves the central suction pin. The peripheral pin actuator moves the peripheral suction pin. The central pin actuator and the peripheral pin actuator move at least one of the central suction pin and the peripheral suction pin, and change the amount of protrusion of one of the central suction pin and the peripheral suction pin relative to the amount of protrusion of the other of the central suction pin and the peripheral suction pin, thereby curving the substrate to fit along the holding surface.

[0009] In one embodiment, when the central pin actuator and the outer peripheral pin actuator move the central suction pin and the outer peripheral suction pin from the protruding position to the non-protruding position, they first move the central suction pin to the non-protruding position and then move the outer peripheral suction pin to the non-protruding position.

[0010] In one embodiment, the substrate holding device includes a deformation mechanism. The deformation mechanism deforms the chuck so that the holding surface has a convex shape, and also deforms the chuck so that the holding surface has a concave shape. The convex shape refers to a shape in which the center of the holding surface protrudes toward the substrate. The concave shape refers to a shape in which the center of the holding surface is recessed in a direction away from the substrate. When the holding surface has the convex shape, the pin actuator bends the substrate so that the center of one surface is recessed in a direction away from the chuck. When the holding surface has the concave shape, the pin actuator bends the substrate so that the center of one surface protrudes toward the chuck.

[0011] In one embodiment, the substrate holding device includes a control unit that controls the pin actuators. The control unit acquires warpage information including information about at least a warpage direction of the holding surface. The control unit causes the pin actuator to change the protrusion amount of the at least one suction pin relative to the protrusion amounts of the other suction pins based on the warpage information, thereby curving the substrate to fit the holding surface.

[0012] In one embodiment, when the warpage information indicates that the center of the holding surface is concave, recessed in a direction away from the substrate, the control unit bends the substrate using the pin actuator so that the center of one of the surfaces protrudes in a direction toward the chuck.

[0013] In one embodiment, when the warpage information indicates that the holding surface has the concave shape, the control unit uses the pin actuator to bend the substrate so that the center of one surface protrudes in a direction toward the chuck, and then brings the center of the one surface into point contact with the center of the holding surface, and then uses the pin actuator to make the curvature of the one surface the same as the curvature of the holding surface.

[0014] A bonding apparatus according to a second aspect of the present invention bonds a first substrate and a second substrate. The bonding apparatus includes a first substrate holding device and a second substrate holding device. The first substrate holding device holds the first substrate. The second substrate holding device is disposed opposite the first substrate holding device and holds the second substrate. The first substrate holding device includes a first chuck, a plurality of first suction pins, and a first pin actuator. The first chuck has a first holding surface that suction-holds one side of the first substrate. The plurality of first suction pins are protruding from the first holding surface and suction-hold the first substrate. The first pin actuator moves the plurality of first suction pins between a protruding position where they protrude from the first holding surface and a non-protruding position where they do not protrude from the first holding surface. The plurality of first suction pins suction-hold the first substrate at the protruding position. The first pin actuator changes the protrusion amount of at least one of the first suction pins relative to the protrusion amounts of the other first suction pins to bend the first substrate along the first holding surface, and the first pin actuator moves the first suction pins from the protruding position to the non-protruding position to hold the first substrate with the first chuck.

[0015] In one embodiment, the second substrate holding device includes a second chuck, a plurality of second suction pins, and a second pin actuator. The second chuck has a second holding surface that suction-holds one side of the second substrate. The plurality of second suction pins are protruding from the second holding surface and suction-hold the second substrate. The second pin actuator moves the plurality of second suction pins between a protruding position where they protrude from the second holding surface and a non-protruding position where they do not protrude from the second holding surface. The plurality of second suction pins suction-hold the second substrate at the protruding position. The second pin actuator changes the protruding amount of at least one of the second suction pins relative to the protruding amounts of the other second suction pins, thereby bending the second substrate to conform to the second holding surface. The second pin actuator moves the plurality of second suction pins from the protruding position to the non-protruding position, thereby holding the second substrate with the second chuck.

[0016] In one embodiment, the second substrate holding device has a second chuck. The second chuck has a second holding surface that adsorbs and holds one side of the second substrate. The first substrate holding device and the second substrate holding device bond the first substrate and the second substrate together in a state in which one of the first holding surface and the second holding surface has a concave shape that is recessed in a direction away from the first substrate and the second substrate, and the other of the first holding surface and the second holding surface has a convex shape that protrudes in a direction toward the first substrate and the second substrate.

[0017] In one embodiment, the first holding surface is deformable into the convex shape and the concave shape, and a maximum curvature of the first holding surface in the convex shape is greater than a maximum curvature of the first holding surface in the concave shape.

[0018] A substrate holding method according to a third aspect of the present invention includes the steps of: suction-holding one surface of a substrate with a plurality of suction pins; bending the substrate so that it fits along a holding surface of a chuck that holds the substrate; transferring the substrate from the plurality of suction pins to the chuck; and holding the substrate with the chuck.

[0019] A bonding method according to a fourth aspect of the present invention includes the steps of: suction-holding one side of a first substrate with a plurality of suction pins; bending the first substrate so that it conforms to a first holding surface of a first chuck that holds the first substrate, transferring the first substrate from the plurality of suction pins to the first chuck, and holding the first substrate with the first chuck; suction-holding one side of a second substrate with a second holding surface of a second chuck; and bonding the first substrate and the second substrate together in a state in which one of the first holding surface and the second holding surface has a concave shape that is recessed in a direction away from the first substrate and the second substrate, and the other of the first holding surface and the second holding surface has a convex shape that protrudes in a direction toward the first substrate and the second substrate.

[0020] According to the present invention, it is possible to provide a substrate holding device, a bonding device, a substrate holding method, and a bonding method that can prevent a gap from occurring between the substrate and the holding surface.

[0021] 4 is a side view schematically showing the overall configuration of a substrate holding device of a first embodiment. FIG. 5 is a cross-sectional view schematically showing the substrate holding device of the first embodiment. FIG. 6 is a view schematically showing a chuck of the substrate holding device of the first embodiment from below. FIG. 7 is a cross-sectional view schematically showing a state in which the suction pins are arranged in a protruding position along line IV-IV of FIG. 3. FIG. 8 is a cross-sectional view schematically showing a state in which the suction pins are arranged in a non-protruding position along line IV-IV of FIG. 3. FIG. 9 is a cross-sectional view schematically showing a state in which the holding surface of the chuck of the substrate holding device of the first embodiment is convex. FIG. 10 is a cross-sectional view schematically showing a state in which the holding surface of the chuck of the substrate holding device of the first embodiment is concave. FIG. 11 is a block diagram showing the configuration of the substrate holding device of the first embodiment. FIG. 12 is a flowchart showing a substrate holding method by the substrate holding device of the first embodiment. FIG. 13 is a cross-sectional view schematically showing a method of holding a substrate by a chuck having a concave holding surface. FIG. 14 is a cross-sectional view schematically showing a method of holding a substrate by a chuck having a convex holding surface. FIG. 10 is a cross-sectional view schematically showing a first substrate holding device and a second substrate holding device of a bonding apparatus according to a second embodiment. FIG. 11 is a cross-sectional view schematically showing a second substrate holding device, illustrating a state in which a second suction pin is arranged in a protruding position. FIG. 12 is a block diagram showing a configuration of the bonding apparatus according to the second embodiment. FIG. 13 is a flowchart showing a bonding method by the bonding apparatus according to the second embodiment. FIG. 14 is a flowchart showing a bonding step (step S24) in the bonding method by the bonding apparatus according to the second embodiment. FIG. 15 is a schematic diagram for explaining a bonding method for a first combination pattern. FIG. 16 is a schematic diagram for explaining a bonding method for a second combination pattern. FIG. 17 is a schematic diagram for explaining a bonding method for a third combination pattern. FIG. 18 is a schematic diagram for explaining a bonding method for a fourth combination pattern. FIG. 19 is a schematic diagram for explaining a bonding method for a fifth combination pattern. FIG. 19 is a schematic diagram for explaining a bonding method for a sixth combination pattern.

[0022] Hereinafter, embodiments of a substrate holding device and a bonding device according to the present invention will be described with reference to the drawings. In the drawings, identical or corresponding parts are designated by the same reference numerals, and description thereof will not be repeated. In this specification, to facilitate understanding of the invention, mutually orthogonal X-, Y-, and Z-axes may be described. In this embodiment, the X- and Y-axes are approximately parallel to the horizontal direction, and the Z-axis is approximately parallel to the vertical direction. For convenience, one side Z1 of the Z-axis direction indicates the upward direction, and the other side Z2 of the Z-axis direction indicates the downward direction. However, the upward and downward directions are defined for convenience of explanation and do not necessarily correspond to the vertical direction.

[0023] 1 to 11, a substrate holding device 100 according to a first embodiment of the present invention will be described. Fig. 1 is a side view schematically showing the overall configuration of the substrate holding device 100 of the first embodiment. However, in Fig. 1, in order to avoid complicating the drawing, only three suction pins 400 are drawn, in line with Fig. 4.

[0024] First, a schematic configuration of the substrate holding device 100 will be described with reference to Fig. 1. As shown in Fig. 1, the substrate holding device 100 includes a support frame SF, a support base SB, a holding mechanism 110, a deformation mechanism 170, a suction mechanism 300, a plurality of suction pins 400, and a pin actuator 450.

[0025] The support frame SF is fixed to a floor (not shown) on which the substrate holding device 100 is installed. The support frame SF is made of, for example, metal. The support frame SF includes, for example, a plurality of first frames SF1 extending in the vertical direction and a plurality of second frames SF2 extending in the horizontal direction. In this embodiment, four first frames SF1 and four second frames SF2 are provided. The four first frames SF1 include two first frame SF1 sets (not shown), each consisting of two first frames SF1 arranged at a predetermined interval in the X direction. These two first frame SF1 sets overlap each other in the X direction and are arranged at a predetermined interval in the Y direction. The four first frames SF1 are arranged at positions corresponding to the four corners of a rectangle in a plan view. The lower end of each first frame SF1 is fixed to the floor. The four second frames SF2 include two second frames SF2 connecting the upper ends of adjacent first frames SF1 in the X direction and two second frames SF2 connecting the upper ends of adjacent first frames SF1 in the Y direction. That is, the four second frames SF2 are arranged at positions corresponding to the four sides of a rectangle in a plan view. The support frame SF may be fixed to a wall or ceiling of a room in which the substrate holding device 100 is installed.

[0026] The support base SB is configured so as not to move in the vertical or horizontal directions. Specifically, the support base SB is fixed to at least one of the first frame SF1 and the second frame SF2 of the support frame SF. In this embodiment, the support base SB is fixed to both the first frame SF1 and the second frame SF2. The support base SB is fixed to the first frame SF1 and the second frame SF2 by fasteners (not shown) such as bolts.

[0027] The support base SB is made of a material that is resistant to deformation due to the weight and heat of the holding mechanism 110. The support base SB is made of, for example, stone or a metal frame. The outer shape of the support base SB is, for example, a substantially rectangular parallelepiped shape. A substantially rectangular parallelepiped through-hole SBa that penetrates the support base SB in the vertical direction is formed in the support base SB. In other words, the support base SB is formed in the shape of a rectangular ring that extends in the vertical direction.

[0028] In this embodiment, the support base SB supports the plurality of suction pins 400 of the holding mechanism 110. The support base SB supports the holding mechanism 110 from above. The outer periphery of the holding mechanism 110 is fixed to the support base SB with fasteners (not shown) such as bolts.

[0029] The holding mechanism 110 sucks and holds the substrate W. The holding mechanism 110 holds the substrate W in a substantially horizontal position.

[0030] The substrate W is, for example, a semiconductor wafer, a substrate for a liquid crystal display device, a substrate for a plasma display, a substrate for a field emission display (FED), a substrate for an optical disk, a substrate for a magnetic disk, a substrate for a magneto-optical disk, a substrate for a photomask, a ceramic substrate, or a substrate for a solar cell. In this embodiment, the substrate W is a semiconductor wafer.

[0031] The substrate W has, for example, a circular or rectangular shape in a plan view. In this embodiment, the substrate W has a substantially circular shape in a plan view.

[0032] In this embodiment, the substrate W has a front surface Wa and a back surface Wb located opposite the front surface Wa. The front surface Wa is a device formation surface on which elements are formed. The back surface Wb is a non-device formation surface on which elements are not formed. The back surface Wb is an example of the "one side" in the present invention.

[0033] In this embodiment, the holding mechanism 110 holds the substrate W from above. The holding mechanism 110 also holds the back surface Wb of the substrate W by suction. Therefore, when the substrate W is held by the holding mechanism 110, the back surface Wb of the substrate W is the upper surface, and the front surface Wa of the substrate W is the lower surface. Needless to say, when the substrate W is not held by the holding mechanism 110, the substrate W can be turned upside down. However, in this embodiment, for ease of understanding, the substrate W is not turned upside down unless otherwise specified. In other words, in this embodiment, regardless of whether the substrate W is held by the holding mechanism 110 or not, the front surface Wa of the substrate W is the lower surface, and the back surface Wb of the substrate W is the upper surface.

[0034] A portion of the deformation mechanism 170 is attached, for example, to the upper portion of the holding mechanism 110 using fasteners such as bolts (not shown). Specifically, the deformation mechanism 170 has a moving body 171 and a driving mechanism 173, as will be described later. The driving mechanism 173 is attached to the upper portion of the holding mechanism 110 using fasteners such as bolts (not shown). The deformation mechanism 170 has a function of deforming a portion of the holding mechanism 110. Note that the driving mechanism 173 may be attached to the support base SB. The configuration of the deformation mechanism 170 will be described later.

[0035] A portion of the suction mechanism 300 is attached to, for example, the support frame SF using fasteners (not shown) such as bolts. The suction mechanism 300 is a device for suctioning the substrate W to the holding mechanism 110, and sucks air. Note that a portion of the suction mechanism 300 may be attached to the support base SB, or may be placed on the floor (not shown) on which the substrate holding device 100 is installed. The configuration of the suction mechanism 300 and the suction method used by the suction mechanism 300 will be described later.

[0036] The plurality of suction pins 400 are arranged to penetrate the holding mechanism 110 in the vertical direction, and are provided so as to be movable in the vertical direction relative to the holding mechanism 110. The plurality of suction pins 400 support the substrate W before it is held by the holding mechanism 110. The plurality of suction pins 400 support the back surface Wb of the substrate W by suction. The plurality of suction pins 400 support the substrate W from above. The plurality of suction pins 400 receive the substrate W from a transport arm TA of the transport device TR. The transport device TR is, for example, a device other than the substrate holding device 100, or a device that transports the substrate W from a substrate cassette (not shown) to the substrate holding device 100.

[0037] The suction pins 400 also transfer the substrate W received from the transport device TR to the holding mechanism 110. The configuration of the suction pins 400 will be described later.

[0038] The pin actuator 450 is attached, for example, to the upper part of the holding mechanism 110 using fasteners (not shown) such as bolts. Driving the pin actuator 450 moves the plurality of suction pins 400 up and down. Driving the pin actuator 450 causes the plurality of suction pins 400 to move up and down, thereby enabling the plurality of suction pins 400 to receive a substrate W from the transport device TR or to hand over the substrate W to the holding mechanism 110. The pin actuator 450 may also be attached to the support base SB. The configuration of the pin actuator 450 will be described later.

[0039] Next, the substrate holding device 100 will be further described with reference to Fig. 2. Fig. 2 is a cross-sectional view schematically showing the substrate holding device 100 of the first embodiment. Note that in Fig. 2 and Figs. 3 and 4 described below, the suction pins 400 are omitted for ease of understanding.

[0040] As shown in FIG. 2 , the holding mechanism 110 includes a base 120 , a chuck 130 , a support wall 140 , a fixing ring 150 , and a partition wall 160 .

[0041] The base 120 has a substantially circular shape in a plan view. The base 120 is, for example, a plate. The base 120 has a lower surface 120a and an upper surface 120b. The lower surface 120a and the upper surface 120b are disposed substantially horizontally.

[0042] The base 120 has a first member 121 and a second member 122. The first member 121 has a substantially circular shape in a plan view. The second member 122 has a ring shape in a plan view and surrounds the outer periphery of the first member 121. In other words, the first member 121 forms a central portion of the base 120, and the second member 122 forms an outer periphery of the base 120. Note that, in this embodiment, an example in which the base 120 has the first member 121 and the second member 122 will be described, but the base 120 does not have to be formed separately from the first member 121 and the second member 122, and may have the first member 121, the second member 122, and other members not shown.

[0043] The first member 121 is made of, for example, ceramic or metal. The first member 121 has a generally disk-like or generally cylindrical shape. The first member 121 is also formed with an insertion hole 121a through which a moving body 171 (described later) of the deformation mechanism 170 is inserted. The insertion hole 121a penetrates the first member 121 in the thickness direction (here, the up-down direction). The insertion hole 121a is formed at the center of the first member 121. The first member 121 is also formed with a through hole 121b through which air passes. The through hole 121b penetrates the first member 121 in the thickness direction. For example, a plurality of through holes 121b are provided. The through hole 121b is also formed radially outward of the insertion hole 121a.

[0044] The first member 121 also has seal grooves 121c and 121d. The seal groove 121c is formed in a generally annular shape along the inner circumferential surface of the insertion hole 121a, with the center being the central axis of the first member 121. The seal groove 121c is a groove formed in the inner circumferential surface of the insertion hole 121a. The seal groove 121d is formed in a generally annular shape along the outer circumferential surface of the first member 121, with the center being the central axis of the first member 121. The seal grooves 121c and 121d are formed, for example, by cutting.

[0045] The first member 121 also has a flange 121e. The flange 121e is formed on the upper part of the first member 121. The flange 121e protrudes radially outward beyond other parts of the first member 121. The lower surface of the flange 121e is in contact with the upper surface of the second member 122, and the flange 121e has the function of positioning the second member 122 in the up-down direction.

[0046] The second member 122 is formed of, for example, ceramic or metal. The second member 122 is formed in an annular shape surrounding the periphery of the first member 121. In this embodiment, the second member 122 has a substantially annular or cylindrical shape. The second member 122 also has a stepped portion 122a. The stepped portion 122a is formed on the inner circumferential surface of the second member 122. An insertion groove 120c is formed by the stepped portion 122a of the second member 122 and the outer circumferential surface of the first member 121. The insertion groove 120c is formed on the lower surface 120a of the base 120. In other words, the insertion groove 120c is formed at a position of the base 120 facing the chuck 130. The insertion groove 120c also extends in the vertical direction. Note that the insertion groove 120c may also penetrate the base 120 in the vertical direction.

[0047] The second member 122 also has through-holes 122b formed therein, through which air passes. The through-holes 122b penetrate the second member 122 in the thickness direction (here, the up-down direction). For example, a plurality of through-holes 122b may be provided. The through-holes 122b are located radially outward of the insertion grooves 120c.

[0048] The second member 122 also has a seal groove 122c. The seal groove 122c is formed in a substantially annular shape on the lower surface of the second member 122 along the outer circumferential edge of the second member 122. The seal groove 122c is formed by, for example, cutting.

[0049] The chuck 130 has a substantially circular shape in a plan view. The chuck 130 is, for example, a plate. The chuck 130 is disposed below the base 120. The chuck 130 is smaller than the base 120, and the upper surface of the chuck 130 faces the lower surface 120a of the base 120. The chuck 130 is disposed substantially parallel to the base 120 at a predetermined distance (for example, 5 mm or more) from the base 120. The chuck 130 is formed from, for example, ceramic, resin, metal, or synthetic rubber, and is capable of bending approximately several mm to 10 mm.

[0050] The chuck 130 has a holding surface 130a and a back surface 130c located opposite the holding surface 130a. The holding surface 130a holds the back surface Wb (here, the upper surface) of the substrate W. In this embodiment, the holding surface 130a is the lower surface of the chuck 130, and the back surface 130c is the upper surface of the chuck 130. The back surface Wb (here, the upper surface) of the substrate W is the surface that comes into contact with the holding surface 130a (here, the lower surface) of the chuck 130.

[0051] 2, the chuck 130 is formed with through-holes 130b through which air passes. The through-holes 130b penetrate the chuck 130 in the thickness direction (here, the vertical direction). For example, a plurality of through-holes 130b are provided. The through-holes 130b are formed over substantially the entire area of ​​the chuck 130 on which the substrate W is placed. As will be described later, the through-holes 130b are holes for sucking air and adsorbing the substrate W.

[0052] The support wall 140 supports the chuck 130. In this embodiment, the support wall 140 and the chuck 130 are formed of a single member. However, the support wall 140 may be formed of a separate member from the chuck 130.

[0053] The support wall 140 extends from the outer peripheral end of the chuck 130 toward the base 120. In this embodiment, the support wall 140 extends upward from the outer peripheral end of the chuck 130. The upper end of the support wall 140 is fixed to the lower surface 120a of the base 120, and the lower end of the support wall 140 is connected to the chuck 130. Therefore, the chuck 130 is disposed at a predetermined distance below the base 120.

[0054] The support wall 140 is formed in a substantially annular shape along the outer peripheral edge of the chuck 130. In other words, the support wall 140 is a substantially annular wall. A space S is formed by the base 120, the chuck 130, and the support wall 140.

[0055] The support wall 140 also has a flange 141. The flange 141 is formed on the upper part of the support wall 140. The flange 141 protrudes radially outward beyond the other parts of the support wall 140.

[0056] The fixing ring 150 has, for example, a substantially annular shape and is disposed along the outer peripheral surface of the support wall 140. The fixing ring 150 fixes the flange 141 to the lower surface 120a of the base 120. Specifically, the fixing ring 150 has a substantially L-shape in cross section and engages with the flange 141. In other words, a step that engages with the flange 141 is formed on the inner peripheral surface of the fixing ring 150. The fixing ring 150 is fixed to the base 120 by, for example, screws. Then, by fixing the fixing ring 150 to the base 120, the flange 141 is fixed to the base 120.

[0057] The partition wall 160 extends from the chuck 130 toward the base 120. Specifically, the partition wall 160 extends from the back surface 130c, which is the upper surface of the chuck 130, toward the base 120. The partition wall 160 is formed in a substantially circular ring shape. The partition wall 160 is formed at a position corresponding to the insertion groove 120c of the base 120, and the vertical length of the partition wall 160 is longer than the vertical length of the support wall 140. Therefore, the tip of the partition wall 160 is inserted into the insertion groove 120c.

[0058] In this embodiment, when the holding surface 130a of the chuck 130 is planar (as shown in FIG. 2), a portion of the partition wall 160 is inserted into the insertion groove 120c, and the insertion groove 120c has a region S120 in which the partition wall 160 can be further inserted into the insertion groove 120c. The region S120 is defined by the leading end surface 160a of the partition wall 160 and the inner surface 120d of the insertion groove 120c. In other words, when the holding surface 130a is planar, a gap is formed between the inner surface (ceiling surface in FIG. 2) of the insertion groove 120c and the leading end surface 160a (top surface in FIG. 2) of the partition wall 160. Therefore, the partition wall 160 can be further inserted into the insertion groove 120c. By further inserting the partition wall 160 into the insertion groove 120c, the holding surface 130a can be easily formed into a concave shape, as described below.

[0059] In this embodiment, the partition wall 160 and the chuck 130 are formed from a single member. In this embodiment, the partition wall 160, the chuck 130, and the support wall 140 are formed from a single member. Note that the partition wall 160 may be formed from a separate member from the chuck 130.

[0060] The deformation mechanism 170 deforms the holding mechanism 110. The deformation mechanism 170 also deforms the chuck 130 so that the center of the holding surface 130a has a convex shape that protrudes in a direction toward the substrate W (here, downward). The deformation mechanism 170 also deforms the chuck 130 so that the center of the holding surface 130a has a concave shape that recesses in a direction away from the substrate W (here, upward). In other words, the deformation mechanism 170 deforms the chuck 130 so that the holding surface 130a has a convex shape, or deforms the chuck 130 so that the holding surface 130a has a concave shape. Hereinafter, the holding surface 130a being curved so that the center of the holding surface 130a protrudes in a direction toward the substrate W (here, downward) may be referred to as the holding surface 130a having a convex shape. Furthermore, when the holding surface 130a is curved so that the center of the holding surface 130a is recessed in a direction away from the substrate W (here, upward), this may be referred to as the holding surface 130a having a concave shape.

[0061] Specifically, the deformation mechanism 170 has a moving body 171, a fixed member 172, and a drive mechanism 173. The moving body 171 is formed, for example, from resin or metal. The moving body 171 is formed, for example, in a rod-like, columnar, or shaft-like shape. In this embodiment, the moving body 171 has a cylindrical shape and is disposed so as to extend in the vertical direction. The moving body 171 is inserted into the insertion hole 121a of the first member 121. That is, the upper end of the moving body 171 protrudes upward from the insertion hole 121a of the first member 121. The lower end of the moving body 171 protrudes downward from the insertion hole 121a of the first member 121.

[0062] The lower end of the movable body 171 may be fixed directly to the center of the back surface 130c (upper surface in FIG. 2 ) of the chuck 130, or may be fixed via a fixing member or the like. In this embodiment, the lower end of the movable body 171 is fixed to the center of the back surface 130c of the chuck 130 via a fixing member 172. Specifically, the fixing member 172 is disposed between the movable body 171 and the chuck 130. The fixing member 172 is fixed to the back surface 130c of the chuck 130 with an adhesive, screws, or the like. The fixing member 172 is also fixed to the lower end of the movable body 171 with an adhesive, screws, or the like. The fixing member 172 is formed of, for example, metal. In this embodiment, the fixing member 172 also functions as a sealing member that seals the gap between the movable body 171 and the chuck 130.

[0063] The movable body 171 is movable relative to the base 120 along the opposing direction (here, the up-and-down direction) in which the chuck 130 and the base 120 face each other.

[0064] The drive mechanism 173 moves the movable body 171 in the vertical direction relative to the base 120. The drive mechanism 173 has an actuator. The drive mechanism 173 is not particularly limited, but may have, for example, a drive source such as a pump or a motor, and a transmission member such as a gear and / or a cam that transmits the driving force of the drive source to the movable body 171. The drive mechanism 173 is fixed to, for example, the upper surface 120b of the base 120. When the drive mechanism 173 is driven, the movable body 171 moves in the vertical direction relative to the base 120. This causes the chuck 130 to deform. The deformation of the chuck 130 will be described later. Note that, to avoid complicating the drawings, the drive mechanism 173 may be omitted from Figure 3 and subsequent figures unless particularly necessary.

[0065] In this embodiment, the movable body 171 includes a pipe having a through hole 171a connected to the holding surface 130a. The through hole 171a penetrates the interior of the movable body 171 in the direction in which the movable body 171 extends. Air passes through the through hole 171a. The through hole 171a is a suction hole that sucks the substrate W. In this embodiment, the fixed member 172 is formed with a through hole 172a through which air passes. The through hole 172a is connected to the through hole 171a of the movable body 171. In this embodiment, one through hole 130b of the chuck 130 is connected to the through hole 171a of the movable body 171 via the through hole 172a of the fixed member 172. The through hole 130b connected to the through hole 171a is formed in the center of the chuck 130.

[0066] Continuing with reference to FIG. 2 , the holding mechanism 110 will be described. The holding mechanism 110 has a seal member 123a, a seal member 123b, and a seal member 123c. Each of the seal members 123a, 123b, and 123c is formed of an elastic material such as rubber. Each of the seal members 123a, 123b, and 123c is, for example, an O-ring.

[0067] The seal member 123a is disposed in the seal groove 121c. When disposed in the seal groove 121c, the seal member 123a is in contact with the outer circumferential surface of the movable body 171. The seal member 123a provides a seal between the movable body 171 and the first member 121. The seal member 123b is disposed in the seal groove 121d. When disposed in the seal groove 121d, the seal member 123b is in contact with the inner circumferential surface of the partition wall 160. The seal member 123b provides a seal between the first member 121 and the partition wall 160. The seal member 123c is disposed in the seal groove 122c. When disposed in the seal groove 122c, the seal member 123c is in contact with the upper surface of the support wall 140. The seal member 123c provides a seal between the support wall 140 and the second member 122. Therefore, when the pressure in the space S is reduced by the suction mechanism 300, air can be prevented from flowing into the space S from between the moving body 171 and the first member 121, between the first member 121 and the partition wall 160, and between the support wall 140 and the second member 122.

[0068] The suction mechanism 300 is connected to the through-holes 171a, 121b, and 122b and sucks air. Specifically, the suction mechanism 300 includes a pipe 301a connected to the through-holes 171a, 121b, and 122b, a suction device 302, and a valve 310a. The suction device 302 is attached to, for example, the support frame SF (see FIG. 1 ) using fasteners such as bolts (not shown). The suction device 302 includes, for example, a suction pump or an exhaust fan. Note that the substrate holding device 100 does not necessarily have to include the suction device 302. For example, the pipe 301a may be connected to a suction device external to the substrate holding device 100. The valve 310a is provided in the pipe 301a and switches the inside of the pipe 301a between an open state and a closed state.

[0069] When the suction device 302 is driven and the valve 310a is open, air in the space S is sucked in through the through holes 121b and 122b, creating a negative pressure in the space S. As a result, air flows into the space S through the through hole 130b in the chuck 130 that is connected to the space S. Also, when the suction device 302 is driven and the valve 310a is open, air in the through hole 171a is sucked in, creating a negative pressure in the through hole 171a. As a result, air flows into the through hole 171a through the through hole 130b that is connected to the through hole 171a in the chuck 130. Therefore, when the suction device 302 is driven and the valve 310a is open, if the substrate W is brought close to the holding surface 130a of the chuck 130, the back surface Wb of the substrate W is sucked onto the holding surface 130a of the chuck 130.

[0070] Next, the chuck 130 and the partition wall 160 will be further described with reference to FIG. 3 . FIG. 3 is a diagram schematically illustrating the chuck 130 of the substrate holding device 100 of the first embodiment from below. As shown in FIGS. 2 and 3 , the partition wall 160 divides the space S into a plurality of spaces. In this embodiment, the partition wall 160 divides the space S into two spaces S1 and S2. The space S1 is a circular space located in the center of the space S. The space S2 is a substantially annular space located on the outer side of the space S. Note that, in this embodiment, an example will be described in which the space S is divided into two spaces S1 and S2 by one partition wall 160. However, for example, the space S may be divided into three or more spaces by one or more partition walls 160.

[0071] Furthermore, one or more through holes 130b of the chuck 130 are formed at a position radially inward of the partition wall 160 of the chuck 130. In other words, the one or more through holes 130b connect the space S1 to the external space. In this embodiment, the multiple through holes 130b are formed at a position radially inward of the partition wall 160 of the chuck 130.

[0072] Furthermore, one or more through holes 130b of the chuck 130 are formed at a position radially outward of the partition wall 160 of the chuck 130. In other words, the one or more through holes 130b connect the space S2 to the external space. In this embodiment, the multiple through holes 130b are formed at a position radially outward of the partition wall 160 of the chuck 130.

[0073] In this embodiment, through-hole 130b includes through-hole 130d and a plurality of through-holes 130e through which suction pin 400 is inserted, and a plurality of through-holes 130f through which suction pin 400 is not inserted. In this embodiment, through-hole 130d is formed in the center of chuck 130. The plurality of through-holes 130e are formed on the periphery of chuck 130.

[0074] Next, the plurality of suction pins 400 will be described with reference to FIGS. 4 and 5. FIG. 4 is a schematic cross-sectional view taken along line IV-IV in FIG. 3, showing a state in which the suction pins 400 are positioned at the protruding position P1. FIG. 5 is a schematic cross-sectional view taken along line IV-IV in FIG. 3, showing a state in which the suction pins 400 are positioned at the non-protruding position P2. As shown in FIG. 4, the plurality of suction pins 400 support the substrate W before it is held by the holding mechanism 110. In this embodiment, the plurality of suction pins 400 support the back surface Wb (here, the upper surface) of the substrate W. The plurality of suction pins 400 support the substrate W and transfer the substrate W to the holding mechanism 110. Specifically, the plurality of suction pins 400 include a plurality of suction pins 400 extending in the vertical direction. The plurality of suction pins 400 suck and hold the substrate W. The plurality of suction pins 400 transfer the substrate W to the holding mechanism 110. The plurality of suction pins 400 may transfer the substrate W from the transport device TR. In addition, the transport arm TA of the transport device TR may transport the substrate W to the holding mechanism 110 from another position.

[0075] The suction pins 400 are arranged at equal angular intervals in a plan view. The suction pins 400 suck and hold the back surface Wb (here, the upper surface) of the substrate W. Specifically, the suction pins 400 have through-holes (not shown) through which air passes. The suction mechanism 300 has pipes 301b connected to the through-holes of the suction pins 400 and valves 310b that switch the inside of the pipes 301b between an open state and a closed state. The pipes 301b have, for example, rubber tubes. The suction pins 400 are connected to the pipes 301b by inserting their upper ends (not shown) into the rubber tubes. When the suction mechanism 300 is driven and the valves 310b are opened, air is sucked out of the through-holes of the suction pins 400, creating a negative pressure inside the through-holes of the suction pins 400. Therefore, when the suction device 302 is driven and the valve 310b is open, and the substrate W is brought close to the tip (here, the lower end) of the suction pin 400, the back surface Wb of the substrate W is sucked onto the suction pin 400. Note that a suction device separate from the suction mechanism 300 may be connected to the through-hole of the suction pin 400.

[0076] The suction pins 400 include a central suction pin 400a and multiple (eight in this example) peripheral suction pins 400b. The central suction pin 400a sucks and holds the center of the back surface Wb (here, the upper surface) of the substrate W. The multiple peripheral suction pins 400b suck and hold the outer periphery of the back surface Wb of the substrate W.

[0077] In this embodiment, one or more (eight in this example) through-holes 130e are located below through-holes 122b. The outer periphery suction pins 400b are inserted through through-holes 122b and 130e. The center suction pins 400a are inserted through through-holes 171a and 130d.

[0078] The suction pins 400 are movable, for example, between a protruding position P1 (see FIG. 4 ) where they protrude downward from the holding surface 130 a and a non-protruding position P2 (see FIG. 5 ) where they do not protrude downward from the holding surface 130 a. In this embodiment, the multiple (eight in this example) outer periphery suction pins 400 b are connected to one another by connecting members (not shown). As a result, all of the outer periphery suction pins 400 b move vertically as a unit. Meanwhile, the center suction pin 400 a and the outer periphery suction pins 400 b are configured to be able to move vertically separately.

[0079] As described above, the substrate holding device 100 includes a pin actuator 450 that moves the suction pins 400 in the vertical direction. The pin actuator 450 is fixed to, for example, the upper surface 120b of the base 120. The pin actuator 450 is not particularly limited, but includes, for example, a drive source such as a pump or a motor, and a transmission member such as a gear and / or a cam that transmits the driving force of the drive source to the upper portion of the suction pins 400. When the pin actuator 450 is driven, the suction pins 400 move in the vertical direction relative to the base 120. For example, when the pin actuator 450 moves the suction pins 400 to the protruding position P1, the suction pins 400 protrude from the holding surface 130a and come into contact with the substrate W, thereby enabling them to receive the substrate W from the transport device TR. In other words, the suction pins 400 suck the substrate W at the protruding position P1. When receiving the substrate W from the transport device TR, the suction pins 400 receive the substrate W in a state in which they protrude, for example, 10 mm or more from the holding surface 130a. At this time, the height positions of the tips of all the suction pins 400 are approximately constant. The substrate W may be warped by up to several millimeters, but the suction of air by the suction pins 400 attracts and adsorbs the substrate W to the suction pins 400. Note that warpage information of the substrate W may be acquired, and the height positions of the central suction pins 400a and the peripheral suction pins 400b may be made different based on the warpage information. Also, for example, the pin actuator 450 may move the suction pins 400 from the protruding position P1 to the non-protruding position P2, so that the suction pins 400 no longer protrude from the holding surface 130a. As a result, the substrate W is moved upward from a position below the holding surface 130a and comes into contact with the holding surface 130a, and the substrate W is transferred from the suction pins 400 to the holding surface 130a.

[0080] The pin actuator 450 changes the amount of protrusion of at least one suction pin 400 relative to the amount of protrusion of the other suction pins 400, thereby moving the substrate W along the holding surface 130a.

[0081] Specifically, the pin actuator 450 includes a central pin actuator 450a and peripheral pin actuators 450b. The central pin actuator 450a and the peripheral pin actuators 450b are fixed to, for example, the upper surface 120b of the base 120. The central pin actuator 450a moves the central suction pin 400a vertically relative to the base 120. The peripheral pin actuator 450b moves the peripheral suction pins 400b vertically relative to the base 120. In this embodiment, the peripheral pin actuator 450b moves all of the peripheral suction pins 400b by the same amount. To avoid complicating the drawings, the pin actuators 450 (central pin actuator 450a, peripheral pin actuator 450b) may be omitted from FIG. 6 and subsequent figures unless specifically necessary.

[0082] Next, deformation of the holding surface 130a of the chuck 130 will be described with reference to Fig. 6 and Fig. 7. Fig. 6 is a cross-sectional view schematically showing a state in which the holding surface 130a of the chuck 130 of the substrate holding device 100 of the first embodiment has a convex shape. Fig. 7 is a cross-sectional view schematically showing a state in which the holding surface 130a of the chuck 130 of the substrate holding device 100 of the first embodiment has a concave shape.

[0083] As shown in Figures 6 and 7 , in this embodiment, the chuck 130 can be deformed so that the holding surface 130a has a convex shape, and can also be deformed so that the holding surface 130a has a concave shape. The convex shape of the holding surface 130a means that the holding surface 130a is curved so that the center of the holding surface 130a protrudes in a direction toward the substrate W (here, downward), as shown in Figure 6 . In other words, the convex shape of the holding surface 130a refers to a shape in which the center of the holding surface 130a protrudes in a direction toward the substrate W. The concave shape of the holding surface 130a refers to a curve in which the center of the holding surface 130a is recessed in a direction away from the substrate W (here, upward), as shown in Figure 7 . In other words, the concave shape of the holding surface 130a refers to a shape in which the center of the holding surface 130a is recessed in a direction away from the substrate W.

[0084] For example, when the driving mechanism 173 moves the movable body 171 downward relative to the base 120, the lower end of the movable body 171 is fixed to the center of the chuck 130 by the fixing member 172, and therefore, as the movable body 171 moves downward relative to the base 120, the center of the chuck 130 is pressed downward relative to the base 120. Therefore, even though the outer peripheral edge of the chuck 130 is fixed by the fixing ring 150, the center of the chuck 130 is pressed downward. Therefore, the chuck 130 is flexible, and is deformed to have a downwardly convex shape. As a result, the holding surface 130a has a convex shape (see FIG. 6 ).

[0085] Furthermore, for example, when the driving mechanism 173 moves the movable body 171 upward relative to the base 120, the lower end of the movable body 171 is fixed to the center of the chuck 130 by the fixing member 172, and therefore, as the movable body 171 moves upward relative to the base 120, the central portion of the chuck 130 is pulled upward relative to the base 120. Therefore, even though the outer peripheral edge of the chuck 130 is fixed by the fixing ring 150, the central portion of the chuck 130 is pulled upward. Therefore, since the chuck 130 is flexible, the chuck 130 deforms to become concave upward. As a result, the holding surface 130a becomes concave (see FIG. 7 ).

[0086] Next, the substrate holding device 100 will be further described with reference to Fig. 8. Fig. 8 is a block diagram showing the configuration of the substrate holding device 100 of the first embodiment.

[0087] In this embodiment, the substrate holding device 100 has a control device 190. The control device 190 controls the substrate holding device 100. The control device 190 controls the deformation mechanism 170. In this embodiment, the control device 190 controls the deformation mechanism 170, the suction mechanism 300, and the pin actuator 450.

[0088] The control device 190 includes a control unit 191 and a storage unit 193. The control unit 191 has a processor. The control unit 191 has, for example, a central processing unit (CPU). Alternatively, the control unit 191 may have a general-purpose computer.

[0089] The storage unit 193 stores data and computer programs, for example, data defining the process content and process procedure for holding the substrate W.

[0090] The storage unit 193 includes a main storage device and an auxiliary storage device. The main storage device is, for example, a semiconductor memory. The auxiliary storage device is, for example, a semiconductor memory and / or a hard disk drive. The storage unit 193 may include removable media. The control unit 191 executes a computer program stored in the storage unit 193 to perform the substrate holding operation.

[0091] The control unit 191 causes the deformation mechanism 170 to deform the chuck 130 so that the holding surface 130 a has a concave or convex shape. The control unit 191 may control the deformation mechanism 170 based on a detection result from a detection unit (not shown) that detects the force of the deformation mechanism 170 or the amount of movement of the moving body 171.

[0092] The control unit 191 acquires warpage information of the holding surface 130a. The warpage information includes information on at least the warpage direction of the holding surface 130a. In other words, the warpage information includes information on whether the holding surface 130a is convex, concave, or flat. In this embodiment, the warpage information includes information on the warpage direction of the holding surface 130a as well as information on the warpage amount of the holding surface 130a.

[0093] The warpage information includes, for example, information indicating the height position of the movable body 171. Furthermore, the warpage information may include, for example, information indicating the height position of the base 120 in addition to the information indicating the height position of the movable body 171. Furthermore, the warpage information may include, for example, information indicating the relative height position of the movable body 171 with respect to the base 120. Furthermore, the warpage information may include, for example, information regarding a control signal transmitted from the control unit 191 to the drive mechanism 173 when the control unit 191 moves the movable body 171 using the drive mechanism 173. Alternatively, the warpage information may be transmitted to the control device 190 from a warpage detection sensor that detects warpage of the holding surface 130a. For example, the memory unit 193 stores the warpage information, and the control unit 191 acquires the warpage information from the memory unit 193.

[0094] Furthermore, based on the warpage information, the control unit 191 causes the pin actuator 450 to change the protrusion amount of at least one suction pin 400 relative to the protrusion amounts of the other suction pins 400, thereby curving the substrate W along the holding surface 130a. In other words, the control unit 191 changes the protrusion amount of at least one suction pin 400 relative to the protrusion amounts of the other suction pins 400, thereby curving the substrate W in the same direction as the holding surface 130a.

[0095] Specifically, for example, when the warpage information indicates that the holding surface 130a has a concave shape, the control unit 191 causes the pin actuators 450 to bend the substrate W so that the center of the back surface Wb (here, the upper surface) of the substrate W has a convex shape that protrudes in a direction toward the chuck 130. Then, the control unit 191 causes the chuck 130 to hold the back surface Wb of the substrate W with the back surface Wb in a convex shape. Here, making the back surface Wb convex means that the substrate W is curved so that the center of the back surface Wb protrudes in a direction toward the chuck 130 (here, upward). Making the back surface Wb convex means that the front surface Wa is concave. Making the front surface Wa concave means that the substrate W is curved so that the center of the front surface Wa is recessed in a direction toward the chuck 130 (here, upward).

[0096] Furthermore, for example, when the warpage information indicates that the holding surface 130a has a convex shape, the control unit 191 causes the pin actuators 450 to bend the substrate W so that the center of the back surface Wb (here, the upper surface) of the substrate W has a concave shape that is recessed in a direction away from the chuck 130. Then, the control unit 191 causes the chuck 130 to hold the back surface Wb of the substrate W with the back surface Wb in a concave shape. Here, making the back surface Wb have a concave shape means that the substrate W is curved so that the center of the back surface Wb is recessed in a direction away from the chuck 130 (here, downward). Making the back surface Wb have a concave shape means that the front surface Wa has a convex shape. Making the front surface Wa have a convex shape means that the substrate W is curved so that the center of the front surface Wa protrudes in a direction away from the chuck 130 (here, downward).

[0097] More specifically, the control unit 191 brings the center of the back surface Wb (here, the upper surface) of the substrate W into point contact with the center of the holding surface 130a (here, the lower surface) of the chuck 130. At this time, for example, when the warpage information indicates that the holding surface 130a has a concave shape, the control unit 191 brings the back surface Wb of the substrate W into point contact with the holding surface 130a in a state where the back surface Wb is convex and the curvature of the substrate W is larger than the curvature of the holding surface 130a. Note that when the warpage information indicates that the holding surface 130a has a convex shape, the control unit 191 brings the back surface Wb of the substrate W into contact with the holding surface 130a in a state where the back surface Wb is concave, flat, or convex.

[0098] Thereafter, the control unit 191 causes the pin actuators 450 to move the suction pins 400 to deform the substrate W so that the back surface Wb (here, the upper surface) of the substrate W comes into close contact with the holding surface 130a. At this time, the control unit 191 causes the pin actuators 450 to make the curvature of the back surface Wb the same as the curvature of the holding surface 130a. As a result, the entire back surface Wb of the substrate W comes into close contact with the holding surface 130a. Therefore, the back surface Wb of the substrate W is held by the holding surface 130a. Note that the curvature is a value indicating the degree of bending of the curved surface. As the curvature increases, the radius of curvature decreases.

[0099] Next, a substrate holding method using the substrate holding device 100 of this embodiment will be described with reference to FIGS. 9 to 11 . FIG. 9 is a flowchart showing the substrate holding method using the substrate holding device 100 of the first embodiment. FIG. 10 is a schematic cross-sectional view illustrating a method for holding a substrate W using a chuck 130 whose holding surface 130 a is concave. FIG. 11 is a schematic cross-sectional view illustrating a method for holding a substrate W using a chuck 130 whose holding surface 130 a is convex. In this embodiment, the substrate holding method using the substrate holding device 100 includes steps S11 to S13. Step S11 is an example of the "step of holding by suction with suction pins" of the present invention. Step S13 is an example of the "step of holding a substrate by a chuck" and the "step of holding a first substrate by a first chuck" of the present invention.

[0100] 9 , in step S11, the control unit 191 holds the substrate W with the suction pins 400. Specifically, with the substrate W positioned below the holding surface 130a by the transport device TR, the control unit 191 controls the pin actuator 450 to cause the plurality of suction pins 400 to protrude downward from the holding surface 130a. At this time, the control unit 191 causes the pin actuator 450 to bring the plurality of suction pins 400 into contact with or approach the back surface Wb (here, the upper surface) of the substrate W. Furthermore, with the suction device 302 driven, the control unit 191 switches the valve 310b from the closed state to the open state. As a result, the plurality of suction pins 400 suction the back surface Wb (here, the upper surface) of the substrate W to lift the substrate W, and the plurality of suction pins 400 hold the substrate W held by the transport device TR. The timing at which the valve 310b is switched from the closed state to the open state may be, for example, before, after, or simultaneously with the timing at which the suction pins 400 come into contact with or approach the rear surface Wb of the substrate W.

[0101] Next, in step S12, the control unit 191 acquires the warpage information. Specifically, the control unit 191 acquires the warpage information from the storage unit 193.

[0102] Next, in step S13, the control unit 191 deforms the substrate W using the pin actuators 450. Specifically, the control unit 191 changes the protrusion amount of one of the central suction pins 400a and the outer peripheral suction pins 400b using the pin actuators 450 based on the warpage information, relative to the protrusion amount of the other of the central suction pins 400a and the outer peripheral suction pins 400b, thereby curving the substrate W to fit along the holding surface 130a. Specifically, for example, the control unit 191 does not drive the outer peripheral pin actuator 450b but drives the central pin actuator 450a, thereby moving the central suction pins 400a up and down relative to the outer peripheral suction pins 400b, thereby deforming the substrate W. In this embodiment, curving the substrate W so that it conforms to the holding surface 130a means, for example, when the holding surface 130a has an upward concave shape, curving the substrate W so that the back surface Wb of the substrate W has an upward convex shape, and when the holding surface 130a has a downward convex shape, curving the substrate W so that the back surface Wb of the substrate W has a downward concave shape. Note that the control unit 191 may deform the substrate W using the pin actuators 450 based on the warpage information so that the substrate W becomes flat.

[0103] 10 , when the warpage information indicates that the holding surface 130a (here, the lower surface) of the chuck 130 has a concave shape (see the upper part of FIG. 10 ), the control unit 191 controls the pin actuators 450 to move the suction pins 400 so that the back surface Wb (here, the upper surface) of the substrate W has a convex shape. Specifically, the control unit 191 controls the central suction pins 400a to move upward relative to the outer peripheral suction pins 400b. At this time, the control unit 191 deforms the substrate W so that the curvature of the back surface Wb of the substrate W becomes larger than the curvature of the holding surface 130a.

[0104] Then, the control unit 191 controls the pin actuators 450 to move the suction pins 400 upward relative to the base 120, bringing the substrate W into contact with the holding surface 130a (see the middle part of FIG. 10 ). At this time, the control unit 191 controls the pin actuators 450 to simultaneously move the central suction pins 400a and the peripheral suction pins 400b by the same amount, so that the curvature of the substrate W does not change. As a result, the center of the back surface Wb (here, the upper surface) of the substrate W comes into point contact with the center of the holding surface 130a (here, the lower surface) of the chuck 130. Therefore, the center of the substrate W is sucked by the through hole 130b located at the center of the chuck 130. At this time, the central suction pin 400a is located at the non-protruding position P2, and the peripheral suction pins 400b are located at the protruding position P1.

[0105] Thereafter, the controller 191 adjusts the curvature of the substrate W to be the same as that of the holding surface 130a (see the lower part of FIG. 10 ). Specifically, the controller 191 moves the outer periphery suction pins 400b upward relative to the base 120 using the pin actuators 450. As a result, when the curvature of the back surface Wb of the substrate W becomes the same as that of the holding surface 130a, the entire back surface Wb of the substrate W is sucked onto the holding surface 130a. At this time, the outer periphery suction pins 400b are positioned at the non-protruding position P2. Also, at this time, the back surface Wb of the substrate W gradually comes into contact with the holding surface 130a from the center toward the radially outer side of the substrate W. Specifically, after the central through-hole 130d of the chuck 130 adsorbs the substrate W, the through-hole 130f radially outer than the through-hole 130d adsorbs the substrate W, and then the outer peripheral through-hole 130e of the chuck 130 adsorbs the substrate W. This can prevent air from entering between the rear surface Wb of the substrate W and the holding surface 130a.

[0106] In this manner, the substrate W is held by the substrate holding device 100 .

[0107] 11 , when the warpage information indicates that the holding surface 130a (here, the lower surface) of the chuck 130 has a convex shape (see the upper part of FIG. 11 ), the control unit 191 controls the pin actuators 450 to move the suction pins 400 so that the back surface Wb (here, the upper surface) of the substrate W has a concave shape. Specifically, the control unit 191 controls the outer periphery suction pins 400b to move upward relative to the central suction pins 400a. At this time, the control unit 191 deforms the substrate W so that the curvature of the back surface Wb of the substrate W is smaller than the curvature of the holding surface 130a. When the warpage information indicates that the holding surface 130a has a convex shape, the control unit 191 may control the pin actuators 450 to deform the substrate W so that the back surface Wb of the substrate W has a flat shape. When the warpage information indicates that the holding surface 130a has a convex shape, the control unit 191 may control the pin actuators 450 to deform the substrate W so that the back surface Wb of the substrate W has a convex shape.

[0108] Then, the control unit 191 controls the pin actuators 450 to move the suction pins 400 upward relative to the base 120, bringing the substrate W into contact with the holding surface 130a (see the middle part of FIG. 11 ). At this time, the control unit 191 controls the pin actuators 450 to simultaneously move the central suction pin 400a and the peripheral suction pins 400b by the same amount, so that the curvature of the substrate W does not change. As a result, the center of the back surface Wb (here, the upper surface) of the substrate W comes into point contact with the center of the holding surface 130a (here, the lower surface) of the chuck 130. Therefore, the center of the substrate W is sucked by the through hole 130b located at the center of the chuck 130. At this time, the central suction pin 400a is located at the non-protruding position P2, and the peripheral suction pins 400b are located at the protruding position P1.

[0109] Thereafter, the controller 191 causes the back surface Wb of the substrate W to have a concave shape and the curvature of the back surface Wb of the substrate W to be the same as the curvature of the holding surface 130a (see the lower part of FIG. 11 ). Specifically, the controller 191 moves the outer periphery suction pins 400b upward relative to the base 120. As a result, when the curvature of the back surface Wb of the substrate W becomes the same as the curvature of the holding surface 130a, the entire back surface Wb of the substrate W is sucked onto the holding surface 130a. At this time, the outer periphery suction pins 400b are positioned at the non-protruding position P2. Also, at this time, the back surface Wb of the substrate W gradually comes into contact with the holding surface 130a from the center of the substrate W toward the radially outer side. Specifically, after the central through-hole 130d of the chuck 130 sucks the substrate W, the through-hole 130f radially outward of the through-hole 130d sucks the substrate W, and then the outer peripheral through-hole 130e of the chuck 130 sucks the substrate W. This can prevent air from entering between the rear surface Wb of the substrate W and the holding surface 130a.

[0110] In this manner, the substrate W is held by the substrate holding device 100 .

[0111] In addition, when the warpage information indicates that the holding surface 130a of the chuck 130 is flat, the control unit 191 performs processing in the same manner as when the warpage information indicates that the holding surface 130a of the chuck 130 is concave (see Figure 10).

[0112] As described above with reference to FIGS. 1 to 11 , in this embodiment, the pin actuator 450 changes the protrusion amount of at least one suction pin 400 relative to the protrusion amounts of the other suction pins 400, thereby curving the substrate W so that it follows the holding surface 130a. The pin actuator 450 then moves the plurality of suction pins 400 from the protruding position P1 to the non-protruding position P2, thereby causing the chuck 130 to hold the substrate W. This makes it possible to hold the substrate W by the chuck 130 in a state in which the substrate W is curved along the holding surface 130a. This makes it possible to prevent a gap from occurring between the substrate W and the holding surface 130a. In other words, it is possible to prevent the substrate W from being partially bent on the holding surface 130a.

[0113] As described above, the central pin actuator 450a and the outer peripheral pin actuator 450b move at least one of the central suction pins 400a and the outer peripheral suction pins 400b and change the amount of protrusion of one of the central suction pins 400a and the outer peripheral suction pins 400b relative to the amount of protrusion of the other of the central suction pins 400a and the outer peripheral suction pins 400b, thereby curving the substrate W along the holding surface 130a. Therefore, the central pin actuator 450a and the outer peripheral pin actuator 450b can easily bend the substrate W.

[0114] Furthermore, as described above, when moving the central suction pin 400a and the peripheral suction pins 400b from the protruding position P1 to the non-protruding position P2, the central pin actuator 450a and the peripheral pin actuator 450b first move the central suction pin 400a to the non-protruding position P2 and then move the peripheral suction pin 400b to the non-protruding position P2. Therefore, after the center of the back surface Wb of the substrate W is brought into point contact with the holding surface 130a, the entire back surface Wb of the substrate W can be brought into contact with the holding surface 130a. At this time, the substrate W is sucked in order from the central through-hole 130d of the chuck 130 to the peripheral through-hole 130e. This further reduces the occurrence of a gap between the substrate W and the holding surface 130a.

[0115] As described above, the first substrate holding device 100 includes a deformation mechanism 170 that deforms the chuck 130 so that the holding surface 130a has a convex shape and that deforms the chuck 130 so that the holding surface 130a has a concave shape. Therefore, the holding surface 130a can be easily deformed into a convex or concave shape. Furthermore, when the holding surface 130a has a convex shape, the pin actuator 450 bends the substrate W so that the center of the back surface Wb is recessed in a direction away from the chuck 130 (here, downward). When the holding surface 130a has a concave shape, the pin actuator 450 bends the substrate W so that the center of the back surface Wb protrudes toward the chuck 130 (here, upward). Therefore, whether the holding surface 130a has a convex shape or a concave shape, the pin actuator 450 can easily bend the substrate W along the holding surface 130a.

[0116] Furthermore, as described above, the control unit 191 acquires warpage information. Then, based on the warpage information, the control unit 191 causes the pin actuator 450 to change the protrusion amount of at least one suction pin 400 relative to the protrusion amounts of the other suction pins 400, thereby curving the substrate W so that it fits along the holding surface 130a. Therefore, since the substrate W can be curved based on the warpage information, the substrate W can be easily curved so that it fits along the holding surface 130a.

[0117] Furthermore, as described above, when the warpage information indicates that the holding surface 130a has a concave shape, the control unit 191 causes the pin actuators 450 to bend the substrate W so that the center of the back surface Wb protrudes toward the chuck 130 (here, upward). Therefore, when the holding surface 130a has a concave shape, the substrate W can be easily bent to fit along the holding surface 130a.

[0118] Furthermore, as described above, when the warpage information indicates that the holding surface 130a has a concave shape, the control unit 191 uses the pin actuators 450 to bend the substrate W so that the center of the back surface Wb protrudes toward the chuck 130 (here, upward), and after bringing the center of the back surface Wb of the substrate W into point contact with the center of the holding surface 130a, uses the pin actuators 450 to make the curvature of the back surface Wb the same as the curvature of the holding surface 130a. Therefore, when the holding surface 130a has a concave shape, it is easy to bring the center of the back surface Wb of the substrate W into point contact with the holding surface 130a, and then bring the entire back surface Wb of the substrate W into contact with the holding surface 130a. This makes it easy to further prevent a gap from being generated between the substrate W and the holding surface 130a.

[0119] Furthermore, by holding the substrate W by the holding surface 130a in a concave state, when the back surface Wb of the substrate W gradually comes into contact with the holding surface 130a from the center toward the outside in the radial direction, a restoring force acts on the back surface Wb of the substrate W, which tries to return the back surface Wb of the substrate W from a convex shape to a flat shape. Therefore, by utilizing the restoring force of the substrate W, the entire surface of the substrate W from the center to the outer edge can be easily brought into close contact with the holding surface 130a.

[0120] Second Embodiment A bonding apparatus 1 according to a second embodiment of the present invention will be described with reference to Figures 12 to 23. Figure 12 is a side view that schematically shows the bonding apparatus 1 according to the second embodiment. However, in Figure 12, in order to avoid complicating the drawing, only three first suction pins 400 of the substrate holding device 100 are depicted, similar to Figure 1 of the first embodiment, and only three second suction pins 410 of the second substrate holding device 200 are depicted, similar to Figure 14.

[0121] 12 , the bonding apparatus 1 according to the second embodiment includes a substrate holding device 100 (hereinafter referred to as a first substrate holding device 100) and a second substrate holding device 200 disposed opposite the first substrate holding device 100. In the second embodiment, for ease of understanding, the substrate holding device 100 of the first embodiment will be described as the first substrate holding device 100.

[0122] In the following description, for ease of understanding, the substrate W, support base SB, holding mechanism 110, base 120, chuck 130, holding surface 130a, deformation mechanism 170, and movable body 171 of the first embodiment will be referred to as first substrate W1, first support base SB1, first holding mechanism 110, first base 120, first chuck 130, first holding surface 130a, first deformation mechanism 170, and first movable body 171. In addition, the suction pins 400, central suction pins 400a, outer periphery suction pins 400b, pin actuators 450, central pin actuators 450a, and outer periphery pin actuators 450b of the first embodiment will be referred to as first suction pins 400, first central suction pins 400a, first outer periphery suction pins 400b, first pin actuators 450, first central pin actuators 450a, and first outer periphery pin actuators 450b, respectively.

[0123] In this embodiment, the first substrate holding device 100 does not include the support frame SF, the suction mechanism 300, and the control device 190, and the bonding apparatus 1 includes the support frame SF, the suction mechanism 300, and the control device 190. The other configurations of the first substrate holding device 100 are the same as those of the substrate holding device 100 of the first embodiment.

[0124] The bonding apparatus 1 bonds a first substrate W1 held by a first substrate holding device 100 to a second substrate W2 held by a second substrate holding device 200. The bonding apparatus 1 includes a support frame SF, the first substrate holding device 100, the second substrate holding device 200, a first moving mechanism 610, and a second moving mechanism 620.

[0125] The support frame SF is fixed to a floor (not shown) on which the bonding apparatus 1 is installed. The support frame SF supports the first substrate holding device 100. In this embodiment, the support frame SF has a horizontal rail SF3 that guides the first substrate holding device 100 in the horizontal direction and a vertical rail SF4 that guides the first substrate holding device 100 in the up-down direction. For example, two horizontal rails SF3 and two vertical rails SF4 are provided. The horizontal rails SF3 extend, for example, in the X direction. The two horizontal rails SF3 are fixed to two second frames SF2 that extend in the X direction, respectively. The two vertical rails SF4 are attached to two horizontal rails SF3, respectively. The vertical rails SF4 are configured to be movable in the X direction along the horizontal rails SF3. The other configuration of the support frame SF is the same as that of the first embodiment.

[0126] In this embodiment, the first substrate holding device 100 is configured to be movable relative to the second substrate holding device 200. Specifically, the first support base SB1 of the first substrate holding device 100 is supported by a vertical rail SF4 and moves horizontally along the horizontal rail SF3 together with the vertical rail SF4. The first support base SB1 also moves up and down along the vertical rail SF4. As the first support base SB1 moves, the first holding mechanism 110, the first base 120, the first chuck 130, the first holding surface 130a, the first deformation mechanism 170, and the first movable body 171 also move horizontally and up and down.

[0127] In this embodiment, the second substrate holding device 200 is disposed below the first substrate holding device 100. The second substrate holding device 200 is provided by vertically inverting the first substrate holding device 100. Note that the first substrate holding device 100 and the second substrate holding device 200 may also be disposed by vertically inverting them. The configuration of the second substrate holding device 200 will be described later.

[0128] The first movement mechanism 610 is fixed to, for example, the horizontal rail SF3. The first movement mechanism 610 may also be fixed to the second frame SF2. The first movement mechanism 610 moves the first substrate holding device 100 in the horizontal direction. In this embodiment, the first movement mechanism 610 moves the first substrate holding device 100 in the horizontal direction together with the vertical rail SF4. The first movement mechanism 610 has an actuator. The first movement mechanism 610 is not particularly limited, but may have, for example, a drive source such as a pump or a motor, and a transmission member such as a gear that transmits the drive force of the drive source to the vertical rail SF4 or the first support base SB1. The first movement mechanism 610 may move the second substrate holding device 200, or may move both the first substrate holding device 100 and the second substrate holding device 200.

[0129] The second movement mechanism 620 is fixed to, for example, the vertical rail SF4. The second movement mechanism 620 moves the first substrate holding device 100 in the up and down direction. The second movement mechanism 620 has an actuator. The second movement mechanism 620 is not particularly limited, but may have, for example, a drive source such as a pump or a motor, and a transmission member such as a gear that transmits the drive force of the drive source to the first support base SB1. The second movement mechanism 620 may move the second substrate holding device 200, or may move both the first substrate holding device 100 and the second substrate holding device 200.

[0130] 12 , the second substrate holding device 200 will be described. The second substrate holding device 200 includes a second support base SB2, a second holding mechanism 210, a second deformation mechanism 270, a plurality of second suction pins 410, and a second pin actuator 460.

[0131] The second support stand SB2 is configured so as not to move in the vertical or horizontal directions. Specifically, the second support stand SB2 is fixed to a floor (not shown) on which the bonding apparatus 1 is installed. Note that the support frame SF may have a floor material, and the second support stand SB2 may be fixed to the floor material of the support frame SF.

[0132] The second support base SB2 is formed from a material that is resistant to deformation due to the weight and heat of the second holding mechanism 210. The second support base SB2 is formed, for example, from a stone material or a metal frame. The outer shape of the second support base SB2 is, for example, a substantially rectangular parallelepiped shape. A substantially rectangular parallelepiped through-hole SBa that penetrates the second support base SB2 in the vertical direction is formed in the second support base SB2. In other words, the second support base SB2 is formed in the shape of a rectangular ring that extends in the vertical direction.

[0133] In this embodiment, the second support base SB2 supports the second holding mechanism 210 and the plurality of second suction pins 410. The second support base SB2 supports the second holding mechanism 210 from below. The outer periphery of the second holding mechanism 210 is fixed to the second support base SB2 with fasteners (not shown) such as bolts.

[0134] The second holding mechanism 210 holds the second substrate W2 by suction, and holds the second substrate W2 substantially horizontally.

[0135] In this embodiment, the second holding mechanism 210 holds the second substrate W2 from below. The second holding mechanism 210 also holds the back surface Wb of the second substrate W2 by suction. Therefore, when the second substrate W2 is held by the second holding mechanism 210, the back surface Wb of the second substrate W2 is the lower surface, and the front surface Wa of the second substrate W2 is the upper surface. Needless to say, when the second substrate W2 is not held by the second holding mechanism 210, the second substrate W2 can be turned upside down. However, in this embodiment, for ease of understanding, the second substrate W2 is not turned upside down unless otherwise specified. In other words, in this embodiment, regardless of whether the second substrate W2 is held by the second holding mechanism 210, the front surface Wa of the second substrate W2 is the upper surface, and the back surface Wb of the second substrate W2 is the lower surface.

[0136] A portion of the second deformation mechanism 270 is attached, for example, to the lower portion of the second holding mechanism 210 using fasteners (not shown) such as bolts. Specifically, as will be described later, the second deformation mechanism 270 has a second moving body 271 and a drive mechanism 273. The drive mechanism 273 is attached to the lower portion of the second holding mechanism 210 using fasteners (not shown) such as bolts. The second deformation mechanism 270 has a function of deforming a portion of the second holding mechanism 210. Note that the drive mechanism 273 may be attached to the second support base SB2. The configuration of the second deformation mechanism 270 will be described later.

[0137] A portion of the suction mechanism 300 is attached to, for example, the first frame SF1 of the support frame SF using fasteners (not shown) such as bolts. The suction mechanism 300 is a device for suctioning the first substrate W1 and the second substrate W2 to the first holding mechanism 110 and the second holding mechanism 210, respectively, and sucks air. Note that a portion of the suction mechanism 300 may be attached to the first support base SB1 or the second support base SB2, or may be attached to the second frame SF2 of the support frame SF, or may be placed on the floor (not shown) on which the bonding apparatus 1 is installed. The configuration of the suction mechanism 300 and the suction method used by the suction mechanism 300 will be described later.

[0138] The multiple second suction pins 410 are arranged to penetrate the second holding mechanism 210 in the vertical direction, and are provided to be movable in the vertical direction relative to the second holding mechanism 210. The multiple second suction pins 410 support the second substrate W2 before it is held by the second holding mechanism 210. The multiple second suction pins 410 support the back surface Wb of the second substrate W2 by suction. The multiple second suction pins 410 support the second substrate W2 from below. The multiple second suction pins 410 receive the second substrate W2 from the transport arm TA of the transport device TR.

[0139] Furthermore, the second suction pins 410 transfer the second substrate W2 received from the transport device TR to the second holding mechanism 210. The configuration of the second suction pins 410 will be described later.

[0140] The second pin actuator 460 is attached, for example, to the lower part of the second holding mechanism 210 using fasteners (not shown) such as bolts. The second pin actuator 460 drives the plurality of second suction pins 410. By the second pin actuator 460 driving the plurality of second suction pins 410, the plurality of second suction pins 410 can receive the second substrate W2 from the transport device TR and transfer the second substrate W2 to the second holding mechanism 210. The second pin actuator 460 may also be attached to the second support base SB2. The configuration of the second pin actuator 460 will be described later.

[0141] Next, the first substrate holding device 100 and the second substrate holding device 200 will be further described with reference to FIG. 13 . FIG. 13 is a cross-sectional view schematically showing the first substrate holding device 100 and the second substrate holding device 200 of the bonding apparatus 1 of the second embodiment. Note that the first suction pins 400 and the second suction pins 410 are omitted from FIG. 13 for ease of understanding. As shown in FIG. 13 , the second holding mechanism 210 of the second substrate holding device 200 holds the second substrate W2 by suction. The second holding mechanism 210 holds the second substrate W2 substantially horizontally. The second substrate W2 has the same configuration as the first substrate W1. However, the second substrate W2 is held by the second substrate holding device 200 with its front surface Wa facing upward and its back surface Wb facing downward.

[0142] The second holding mechanism 210 has a second base 220, a second chuck 230, a support wall 140, a fixing ring 150, and a partition wall 160. The second base 220 has a substantially circular shape in a plan view. The second base 220 is, for example, a plate. The second base 220 has an upper surface 220a and a lower surface 220b. Similarly to the first base 120, the second base 220 also has a first member 121 and a second member 122. The upper surface 220a and the lower surface 220b are arranged substantially horizontally.

[0143] The second chuck 230 has a substantially circular shape in a plan view. The second chuck 230 is, for example, a plate. The second chuck 230 is disposed above the second base 220. The second chuck 230 is smaller than the second base 220, and the lower surface of the second chuck 230 faces the upper surface 220a of the second base 220. The second chuck 230 is disposed substantially parallel to the second base 220 at a predetermined distance (for example, 5 mm or more) from the second base 220. The second chuck 230 is formed from, for example, ceramic, resin, metal, or synthetic rubber, and is capable of deflecting approximately several mm to 10 mm.

[0144] The second chuck 230 has a second holding surface 230a and a back surface 230c located on the opposite side to the second holding surface 230a. The second holding surface 230a holds the back surface Wb (here, the bottom surface) of the second substrate W2. In this embodiment, the second holding surface 230a is the upper surface of the second chuck 230, and the back surface 230c is the bottom surface of the second chuck 230. The back surface Wb (here, the bottom surface) of the second substrate W2 is the surface that comes into contact with the second chuck 230.

[0145] The second deformation mechanism 270 deforms the second holding mechanism 210. In this embodiment, the second deformation mechanism 270 deforms the second chuck 230 so that the center of the second holding surface 230a has a convex shape that protrudes in a direction toward the second substrate W2 (here, upward). The second deformation mechanism 270 deforms the second chuck 230 so that the center of the second holding surface 230a has a concave shape that is recessed in a direction away from the second substrate W2 (here, downward). In other words, the second deformation mechanism 270 deforms the second chuck 230 so that the second holding surface 230a has a convex shape, or deforms the second chuck 230 so that the second holding surface 230a has a concave shape. Hereinafter, when the second holding surface 230a is curved so that the center of the second holding surface 230a protrudes in a direction toward the second substrate W2 (here, upward), this may be referred to as the second holding surface 230a having a convex shape. Also, when the second holding surface 230a is curved so that the center of the second holding surface 230a is recessed in a direction away from the second substrate W2 (here, downward), this may be referred to as the second holding surface 230a having a concave shape. In this embodiment, the second deformation mechanism 270 has a second movable body 271 fixed to the center of the second chuck 230. The second movable body 271 includes a pipe having a through hole 171a.

[0146] In this embodiment, the second deformation mechanism 270 has a drive mechanism 273 that moves the second movable body 271 in the vertical direction relative to the second base 220. To avoid complicating the drawings, the drive mechanism 273 may be omitted from FIG. 14 and subsequent figures unless particularly necessary. The drive mechanism 273 has an actuator. The drive mechanism 273 of the second deformation mechanism 270 has a configuration similar to the drive mechanism 173 of the first deformation mechanism 170. The drive mechanism 273 is fixed to, for example, the lower surface 220b of the second base 220. When the drive mechanism 273 is driven, the second movable body 271 moves in the vertical direction relative to the second base 220. This causes the second chuck 230 to deform.

[0147] Specifically, for example, when the drive mechanism 273 moves the second movable body 271 upward relative to the second base 220, the upper end of the second movable body 271 is fixed to the center of the second chuck 230 by the fixing member 172. Therefore, as the second movable body 271 moves upward relative to the second base 220, the center of the second chuck 230 is pressed upward relative to the second base 220. Therefore, even when the outer peripheral edge of the second chuck 230 is fixed by the fixing ring 150, the center of the second chuck 230 is pressed upward. Therefore, since the second chuck 230 is flexible, the second chuck 230 is deformed to have an upwardly convex shape. As a result, the second holding surface 230a has a convex shape.

[0148] Furthermore, for example, when the drive mechanism 273 moves the second movable body 271 downward relative to the second base 220, the upper end of the second movable body 271 is fixed to the center of the second chuck 230 by the fixing member 172. Therefore, as the second movable body 271 moves downward relative to the second base 220, the center of the second chuck 230 is pulled downward relative to the second base 220. Therefore, even though the outer peripheral edge of the second chuck 230 is fixed by the fixing ring 150, the center of the second chuck 230 is pulled downward. Therefore, because the second chuck 230 is flexible, the second chuck 230 deforms to become concave downward. As a result, the second holding surface 230a becomes concave.

[0149] In this embodiment, the maximum curvature of the convex shape of the first holding surface 130a of the first substrate holding device 100 is greater than the maximum curvature of the concave shape of the first holding surface 130a. In other words, the maximum curvature that the first holding surface 130a can have when it is convex is greater than the maximum curvature that the first holding surface 130a can have when it is concave. Note that the maximum curvature of the convex shape of the first holding surface 130a may be smaller than or the same as the maximum curvature of the concave shape of the first holding surface 130a.

[0150] Similarly, the maximum curvature of the convex shape of the second holding surface 230a of the second substrate holding device 200 is greater than the maximum curvature of the concave shape of the second holding surface 230a. In other words, the maximum curvature that the second holding surface 230a can have when it is convex is greater than the maximum curvature that the second holding surface 230a can have when it is concave. Note that the maximum curvature of the convex shape of the second holding surface 230a may be smaller than or the same as the maximum curvature of the concave shape of the second holding surface 230a.

[0151] In this embodiment, the maximum curvature of the convex shape of the first holding surface 130a is approximately the same as the maximum curvature of the convex shape of the second holding surface 230a. Also, the maximum curvature of the concave shape of the first holding surface 130a is approximately the same as the maximum curvature of the concave shape of the second holding surface 230a.

[0152] In this embodiment, the suction mechanism 300 (see FIG. 12 ) of the bonding apparatus 1 is connected to the through holes 171 a, 121 b, and 122 b of the first substrate holding device 100 and the second substrate holding device 200, and sucks air. Specifically, the suction mechanism 300 has a pipe 301 a connected to the through holes 171 a, 121 b, and 122 b of the first substrate holding device 100, a pipe 301 c connected to the through holes 171 a, 121 b, and 122 b of the second substrate holding device 200, and a suction device 302 (see FIG. 12 ). The suction device 302 is attached to, for example, the first frame SF1 (see FIG. 12 ) of the support frame SF using fasteners (not shown), such as bolts.

[0153] In this embodiment, suction mechanism 300 includes adjustment units 303a, 303b, and 303c. Adjustment units 303a, 303b, and 303c adjust the suction forces for through-hole 171a, through-hole 121b, and through-hole 122b, respectively. Adjustment units 303a, 303b, and 303c include, for example, actuators. Adjustment units 303a, 303b, and 303c are not particularly limited, but may include, for example, adjustment valves provided in pipes 301a and 301c. Note that, in order to adjust the suction forces for through-hole 171a, through-hole 121b, and through-hole 122b, suction mechanism 300 may include, for example, multiple suction pumps or multiple exhaust fans that adjust the suction forces for through-hole 171a, through-hole 121b, and through-hole 122b, respectively. The bonding apparatus 1 does not necessarily have to have the suction device 302. For example, the pipes 301a and 301c may be connected to an external suction device.

[0154] 14 is a cross-sectional view schematically showing the second substrate holding device 200, and shows a state in which the second suction pins 410 are positioned at the protruding position P1. As shown in FIG. 14 , in this embodiment, the second substrate holding device 200 has a plurality of second suction pins 410. The plurality of second suction pins 410 of the second substrate holding device 200 support the second substrate W2 before it is held by the second holding mechanism 210.

[0155] In this embodiment, the multiple second suction pins 410 of the second substrate holding device 200 suction-hold the back surface Wb (here, the lower surface) of the second substrate W2. Specifically, the second suction pins 410 have through-holes (not shown) through which air passes. The suction mechanism 300 has a pipe 301d connected to the through-holes of the second suction pins 410 and a valve 310d that switches the inside of the pipe 301d between an open state and a closed state. The pipe 301d has, for example, a rubber tube. The second suction pins 410 are connected to the pipe 301d by inserting their lower ends (not shown) into the rubber tube. When the suction mechanism 300 is driven and the valve 310d is opened, air is sucked out of the through-holes of the second suction pins 410, creating a negative pressure inside the through-holes of the second suction pins 410. Therefore, when the suction device 302 is driven and the valve 310d is open, and the second substrate W2 is brought close to the tips (here, the upper ends) of the second suction pins 410, the back surface Wb of the second substrate W2 is sucked onto the second suction pins 410. Note that a suction device other than the suction device 302 may be connected to the through-holes of the second suction pins 410.

[0156] The second suction pins 410 include a second central suction pin 410a and a plurality of second outer periphery suction pins 410b. The second central suction pin 410a suctions and holds the center of the back surface Wb (here, the lower surface) of the second substrate W2. The second outer periphery suction pins 410b suction and hold the outer periphery of the back surface Wb (here, the lower surface) of the second substrate W2.

[0157] As described above, the second substrate holding device 200 has the second pin actuator 460 that moves the second suction pins 410 in the up-down direction. The second pin actuator 460 is fixed to, for example, the lower surface 220b of the second base 220. When the second pin actuator 460 is driven, the second suction pins 410 move in the up-down direction relative to the second base 220.

[0158] The second pin actuator 460 changes the amount of protrusion of at least one second suction pin 410 relative to the amount of protrusion of the other second suction pins 410, thereby moving the second substrate W2 so that it fits along the second holding surface 230a.

[0159] Specifically, the second pin actuator 460 includes a second central pin actuator 460a and a second outer peripheral pin actuator 460b. The second central pin actuator 460a and the second outer peripheral pin actuator 460b are fixed to, for example, the lower surface 220b of the second base 220. The second central pin actuator 460a moves the central suction pins 410a in the vertical direction relative to the second base 220. The second outer peripheral pin actuator 460b moves the outer peripheral suction pins 410b in the vertical direction relative to the second base 220.

[0160] The other configurations of the second substrate holding device 200 are similar to those of the first substrate holding device 100 .

[0161] Next, the bonding apparatus 1 will be further described with reference to Fig. 15. Fig. 15 is a block diagram showing the configuration of the bonding apparatus 1 according to the second embodiment.

[0162] In this embodiment, the bonding apparatus 1 has a control device 190. In this embodiment, the control device 190 controls the bonding apparatus 1. The control device 190 controls the first substrate holding device 100, the second substrate holding device 200, the suction mechanism 300, and the like.

[0163] The control device 190 includes a control unit 191 and a memory unit 193. The memory unit 193 stores data and computer programs. The data, for example, defines the process content and process procedure for holding the first substrate W1 and the second substrate W2. The data also defines the process content and process procedure for bonding the first substrate W1 and the second substrate W2 together. The control unit 191 executes the computer program stored in the memory unit 193 to perform the substrate holding operation and the substrate bonding operation.

[0164] The control unit 191 controls the first movement mechanism 610. The control unit 191 aligns the first substrate holding device 100 and the second substrate holding device 200 using the first movement mechanism 610. Specifically, the control unit 191 moves at least one of the first substrate holding device 100 and the second substrate holding device 200 in the horizontal direction using the first movement mechanism 610. In this embodiment, the control unit 191 moves the first substrate holding device 100 in the horizontal direction using the first movement mechanism 610.

[0165] The control unit 191 controls the second movement mechanism 620. The control unit 191 moves at least one of the first substrate holding device 100 and the second substrate holding device 200 in the vertical direction using the second movement mechanism 620. In this embodiment, the control unit 191 moves the first substrate holding device 100 in the vertical direction relative to the first substrate holding device 100 using the second movement mechanism 620.

[0166] The control unit 191 controls the first substrate holding device 100 and the second substrate holding device 200. The control unit 191 acquires warpage information of the first holding surface 130a and the second holding surface 230a. The warpage information of the second holding surface 230a is the same as the warpage information of the first holding surface 130a. The control unit 191 controls the first substrate holding device 100 to hold the first substrate W1 based on the warpage information of the first holding surface 130a, as in the first embodiment. The control unit 191 also controls the second substrate holding device 200 to hold the second substrate W2 based on the warpage information of the second holding surface 230a, as in the first embodiment.

[0167] Furthermore, the control unit 191 controls the first substrate holding device 100 and the second substrate holding device 200 based on the warpage information of the first holding surface 130a and the second holding surface 230a to bond the first substrate W1 and the second substrate W2 together.

[0168] The control unit 191 acquires first substrate warpage information. The first substrate warpage information includes information indicating the warpage direction and warpage amount of the first substrate W1 before it is held by the first substrate holding device 100. The first substrate warpage information includes, for example, information on whether the surface Wa is convex, concave, or flat. The first substrate warpage information may be transmitted to the control unit 191 from a device that detects the warpage of the first substrate W1, separate from the bonding apparatus 1. Furthermore, for example, the bonding apparatus 1 may be equipped with a detection sensor that detects the warpage of the first substrate W1. For example, the memory unit 193 stores the first substrate warpage information, and the control unit 191 acquires the first substrate warpage information from the memory unit 193.

[0169] The control unit 191 acquires second substrate warpage information. The second substrate warpage information includes information indicating the warpage direction and amount of the second substrate W2 before it is held by the second substrate holding device 200. The second substrate warpage information includes, for example, information on whether the surface Wa is convex, concave, or flat. The second substrate warpage information may be transmitted to the control unit 191 from a device that detects the warpage of the second substrate W2, separate from the bonding apparatus 1. Furthermore, for example, the bonding apparatus 1 may be equipped with a detection sensor that detects the warpage of the second substrate W2. For example, the memory unit 193 stores the second substrate warpage information, and the control unit 191 acquires the second substrate warpage information from the memory unit 193.

[0170] The other configurations of the second embodiment are similar to those of the first embodiment.

[0171] Next, a bonding method using the bonding apparatus 1 of this embodiment will be described with reference to Fig. 16. Fig. 16 is a flowchart showing the bonding method using the bonding apparatus 1 of the second embodiment. In this embodiment, the bonding method using the bonding apparatus 1 includes steps S21 to S24. Step S22 is an example of the "step of adsorbing and holding one side of the second substrate" in the present invention. Step S24 is an example of the "step of bonding the first substrate and the second substrate together" in the present invention.

[0172] 16, in step S21, the control unit 191 holds the first substrate W1 by the first substrate holding device 100. Specifically, the control unit 191 causes the first substrate holding device 100 to hold the first substrate W1 in the same manner as the substrate holding method described with reference to Fig. 9. At this time, the front surface Wa of the first substrate W1 faces downward, and the back surface Wb faces upward.

[0173] Next, in step S22, the control unit 191 holds the second substrate W2 by the second substrate holding device 200. Specifically, the control unit 191 causes the second substrate holding device 200 to hold the second substrate W2 in the same manner as the substrate holding method described with reference to Fig. 9. At this time, the front surface Wa of the second substrate W2 faces upward, and the back surface Wb faces downward.

[0174] Note that steps S21 and S22 may be performed in the reverse order or in parallel.

[0175] Next, in step S23, the control unit 191 aligns the first substrate W1 and the second substrate W2 using the first moving mechanism 610. Specifically, the control unit 191 acquires relative position information indicating the relative positions of the first substrate W1 and the second substrate W2 using a position detection sensor (not shown). For example, the position detection sensor detects alignment marks provided on the first substrate W1 and the second substrate W2. Then, the control unit 191 moves the first substrate holding device 100 in the horizontal direction using the first moving mechanism 610 based on the relative position information. This aligns the first substrate W1 and the second substrate W2. Note that when detecting the alignment marks using the position detection sensor, the first deformation mechanism 170 and the second deformation mechanism 270 may flatten the surfaces Wa of the first substrate W1 and the second substrate W2. This configuration improves the detection accuracy of the position detection sensor.

[0176] Next, in step S24, the control unit 191 bonds the first substrate W1 and the second substrate W2 together using the second moving mechanism 620. Specifically, the control unit 191 bonds the first substrate W1 and the second substrate W2 together by moving at least one of the first substrate W1 and the second substrate W2 in the vertical direction. In this embodiment, the control unit 191 bonds the first substrate W1 and the second substrate W2 together by moving the first substrate holding device 100 downward using the second moving mechanism 620.

[0177] At this time, the control unit 191 deforms at least one of the first chuck 130 of the first substrate holding device 100 and the second chuck 230 of the second substrate holding device 200 based on the warpage information of the first holding surface 130a and the warpage information of the second holding surface 230a, thereby bonding the first substrate W1 and the second substrate W2 together.

[0178] In this way, the joining process is completed.

[0179] Next, step S24 of the bonding method of the second embodiment will be described in detail with reference to Fig. 17. Fig. 17 is a flowchart showing the bonding step (step S24) in the bonding method using the bonding apparatus 1 of the second embodiment. In this embodiment, the bonding step (step S24) includes steps S241 to S244.

[0180] 17 , in step S241, the control unit 191 determines, based on the warpage information, the warpage shapes of the first chuck 130 and the second chuck 230 at the time of bonding. Specifically, the control unit 191 determines the combination pattern of the warpage directions of the first chuck 130 and the second chuck 230 based on the warpage information of the first holding surface 130 a and the second holding surface 230 a.

[0181] There are, for example, six combination patterns of the warpage directions of the first chuck 130 and the second chuck 230. For example, the first combination pattern is a pattern in which both the first holding surface 130a and the second holding surface 230a are concave. The second combination pattern is a pattern in which one of the first holding surface 130a and the second holding surface 230a is flat and the other of the first holding surface 130a and the second holding surface 230a is concave. The third combination pattern is a pattern in which one of the first holding surface 130a and the second holding surface 230a is convex and the other of the first holding surface 130a and the second holding surface 230a is concave. The fourth combination pattern is a pattern in which both the first holding surface 130a and the second holding surface 230a are flat. The fifth combination pattern is a pattern in which one of the first holding surface 130a and the second holding surface 230a is convex and the other of the first holding surface 130a and the second holding surface 230a is flat. The sixth combination pattern is a pattern in which both the first holding surface 130a and the second holding surface 230a are convex.

[0182] Then, the control unit 191 determines the warpage shapes of the first chuck 130 and the second chuck 230 at the time of bonding based on the first to sixth combination patterns. That is, the control unit 191 determines the warpage shapes of the first holding surface 130a and the second holding surface 230a at the time of bonding.

[0183] At this time, in the present embodiment, the control unit 191 may determine the amount of warpage of the first chuck 130 and the second chuck 230 at the time of bonding based on the acquired amount of warpage. In other words, the control unit 191 may determine the amount of warpage of the first holding surface 130 a and the second holding surface 230 a at the time of bonding.

[0184] Next, in step S242, the control unit 191 deforms the first chuck 130 and the second chuck 230 so as to form the warpage shape determined in step S241. Specifically, the control unit 191 deforms the first chuck 130 using the first deformation mechanism 170 and deforms the second chuck 230 using the second deformation mechanism 270 so as to form the warpage shape determined in step S241. At this time, for example, while the first base 120 is fixed, the control unit 191 drives the first deformation mechanism 170 to move the first movable body 171 in the vertical direction relative to the first base 120, thereby deforming the first chuck 130. At this time, for example, the control unit 191 also drives the second deformation mechanism 270 to move the second movable body 271 in the vertical direction relative to the second base 220, thereby deforming the second chuck 230.

[0185] Next, in step S243, the control unit 191 brings the first substrate W1 and the second substrate W2 into point contact. Specifically, the control unit 191 causes the second moving mechanism 620 to bring the center of the first substrate W1 into point contact with the center of the second substrate W2.

[0186] Next, in step S244, the control unit 191 brings the first substrate W1 and the second substrate W2 into contact with each other over their entire surfaces. That is, the control unit 191 bonds the first substrate W1 and the second substrate W2 together.

[0187] Hereinafter, the lamination method for each of the first to sixth combination patterns will be further described with reference to FIGS.

[0188] 18 is a schematic diagram for explaining a bonding method in the first combination pattern. With reference to FIG. 18, a case where both the first holding surface 130a and the second holding surface 230a have a concave shape will be described.

[0189] 18 , when both the first holding surface 130a and the second holding surface 230a are concave (the state shown in the upper part of FIG. 18 ), the control unit 191, for example, makes either the first holding surface 130a, which is the lower surface of the first chuck 130, or the second holding surface 230a, which is the upper surface of the second chuck 230, convex, and maintains the other of the first holding surface 130a and the second holding surface 230a in a concave shape. Which of the first holding surface 130a and the second holding surface 230a is made convex is determined appropriately. For example, the control unit 191 may make the holding surface with the lesser amount of warping, out of the first holding surface 130a and the second holding surface 230a, convex. Alternatively, the control unit 191 may acquire first substrate warpage information indicating the warpage direction and amount of warpage of the first substrate W1 before being held by the first substrate holding device 100 and second substrate warpage information indicating the warpage direction and amount of warpage of the second substrate W2 before being held by the second substrate holding device 200, and determine which of the first holding surface 130a and the second holding surface 230a should be made convex based on the first substrate warpage information and the second substrate warpage information. In this case, the control unit 191 may make the holding surface that holds the substrate that experiences less change in warpage when made convex into a convex shape. In other words, the control unit 191 may determine which of the first holding surface 130a and the second holding surface 230a should be made convex so as to prevent stresses generated in the first substrate W1 and the second substrate W2 from increasing.

[0190] In this embodiment, the control unit 191, for example, maintains the first holding surface 130a, which is the lower surface of the first chuck 130, in a concave shape and changes the second holding surface 230a, which is the upper surface of the second chuck 230, to a convex shape (the state shown in the middle of FIG. 18 ). At this time, for example, the control unit 191 drives the second deformation mechanism 270 to move the second moving body 271 upward relative to the second base 220, thereby changing the second holding surface 230a to a convex shape. Note that the control unit 191 may, for example, change the other of the first holding surface 130a and the second holding surface 230a to a flat or convex shape.

[0191] When one of the first holding surface 130a and the second holding surface 230a is made convex and the other of the first holding surface 130a and the second holding surface 230a is made concave, the control unit 191 makes the curvature of one of the first holding surface 130a and the second holding surface 230a greater than the curvature of the other of the first holding surface 130a and the second holding surface 230a. In this embodiment, the control unit 191 makes the curvature of the second holding surface 230a greater than the curvature of the first holding surface 130a.

[0192] Thereafter, the control unit 191 moves the first substrate holding device 100 downward using the second moving mechanism 620. At this time, the first support stand SB1, the first base 120, and the first suction pins 400 move downward by the same amount. As a result, the front surface Wa (here, the lower surface) of the first substrate W1 and the front surface Wa (here, the upper surface) of the second substrate W2 come into point contact.

[0193] Then, the control unit 191, for example, gradually reduces the suction force on the second substrate W2. As a result, the second substrate W2 is peeled off from the second chuck 230 due to the restoring force of the second substrate W2, and the surface Wa (here, the upper surface) of the second substrate W2 deforms to become more planar, and the entire surface Wa of the second substrate W2 comes into close contact with the entire surface Wa of the first substrate W1 (here, the lower surface) (the state shown in the lower part of FIG. 18 ). Specifically, from a state in which the surfaces Wa of the first substrate W1 and the second substrate W2 are in point contact at a single central point, the contact area gradually expands radially outward, and the surfaces Wa of the first substrate W1 and the second substrate W2 come into contact over their entire surfaces. This prevents voids from forming between the first substrate W1 and the second substrate W2.

[0194] In this embodiment, when gradually reducing the suction force on the second substrate W2, the control unit 191 gradually reduces the suction force from the center of the second substrate W2 toward the radially outer side. Specifically, the control unit 191 switches the adjustment unit 303a of the second substrate holding device 200 from an open state to a closed state, then switches the adjustment unit 303b from an open state to a closed state, and then switches the adjustment unit 303c from an open state to a closed state. In this manner, the suction forces on the through holes 171a, 121b, and 122b are reduced in this order. Therefore, from a state in which the first substrate W1 and the second substrate W2 are in point contact at a single point in the center, the contact area between the first substrate W1 and the second substrate W2 tends to gradually expand radially outward. This makes it easy to prevent voids from being generated between the first substrate W1 and the second substrate W2.

[0195] Furthermore, although not shown, the control unit 191 may deform the second chuck 230 so that the second holding surface 230a approaches a flat surface without reducing the suction force on the second substrate W2 from a state in which the front surface Wa of the first substrate W1 and the front surface Wa of the second substrate W2 are in point contact. In this case, the control unit 191 moves the first substrate holding device 100 downward by the distance that the second moving body 271 moves downward. Specifically, the control unit 191 moves the first moving body 171 downward relative to the first base 120 using the drive mechanism 173 while moving the first substrate holding device 100 downward using the second moving mechanism 620. Furthermore, the control unit 191 causes the drive mechanism 273 to move the second moving body 271 downward relative to the second base 220 at a speed equal to the sum of the movement speed of the first substrate holding device 100 by the second moving mechanism 620 and the movement speed of the first moving body 171 relative to the first base 120. At this time, the control unit 191 causes the second pin actuator 460 to move the second suction pin 410 downward relative to the second base 220 so that the second suction pin 410 does not protrude upward from the second holding surface 230a. This brings the first substrate W1 and the second substrate W2 into contact over their entire surfaces.

[0196] Whether to reduce the suction force on the second substrate W2 or deform the second chuck 230 from a state in which the first substrate W1 and the second substrate W2 are in point contact may be determined based on the second substrate warpage information and the warpage information of the first holding surface 130a. Specifically, if the surface Wa of the second substrate W2 before being held by the second substrate holding device 200 (hereinafter sometimes referred to as the second substrate W2 before being held) is concave or flat, the control unit 191 may reduce the suction force on the second substrate W2 from a state in which the first substrate W1 and the second substrate W2 are in point contact. Also, if the surface Wa of the second substrate W2 before being held is convex and the amount of warpage of the surface Wa of the second substrate W2 before being held is smaller than the amount of warpage of the first holding surface 130a, the control unit 191 may reduce the suction force on the second substrate W2 from a state in which the first substrate W1 and the second substrate W2 are in point contact. On the other hand, if the surface Wa of the second substrate W2 before holding has a convex shape and the amount of warping of the surface Wa of the second substrate W2 before holding is greater than or the same as the amount of warping of the first holding surface 130a, the control unit 191 may deform the second chuck 230 from a state in which the first substrate W1 and the second substrate W2 are in point contact.

[0197] 19 is a schematic diagram illustrating a bonding method in a second combination pattern, in which one of the first holding surface 130 a and the second holding surface 230 a is flat, and the other of the first holding surface 130 a and the second holding surface 230 a is concave.

[0198] 19 , when one of the first holding surface 130a and the second holding surface 230a is planar and the other of the first holding surface 130a and the second holding surface 230a is concave (the state shown in the upper part of FIG. 19 ), the control unit 191, for example, makes one of the first holding surface 130a (the lower surface of the first chuck 130) and the second holding surface 230a (the upper surface of the second chuck 230) convex, while maintaining the other of the first holding surface 130a and the second holding surface 230a concave. In this embodiment, the control unit 191, for example, maintains the first holding surface 130a concave and makes the second holding surface 230a convex (the state shown in the middle part of FIG. 19 ). Note that the control unit 191 may, for example, make the other of the first holding surface 130a and the second holding surface 230a planar or convex.

[0199] The other lamination methods in the second combination pattern are the same as those in the first combination pattern.

[0200] 20 is a schematic diagram illustrating a bonding method in a third combination pattern, in which one of the first holding surface 130 a and the second holding surface 230 a has a convex shape and the other of the first holding surface 130 a and the second holding surface 230 a has a concave shape.

[0201] 20 , when one of the first holding surface 130a and the second holding surface 230a is convex and the other of the first holding surface 130a and the second holding surface 230a is concave (the state shown in the upper part of FIG. 20 ), the control unit 191 maintains, for example, one of the first holding surface 130a (the lower surface of the first chuck 130) and the second holding surface 230a (the upper surface of the second chuck 230) in a convex shape and the other of the first holding surface 130a and the second holding surface 230a in a concave shape. In this embodiment, the control unit 191 maintains, for example, the first holding surface 130a in a concave shape and the second holding surface 230a in a convex shape (the state shown in the middle part of FIG. 20 ). Note that the control unit 191 may, for example, make the other of the first holding surface 130a and the second holding surface 230a flat or convex.

[0202] The other bonding methods in the second combination pattern are the same as those in the first and second combination patterns.

[0203] 21 is a schematic diagram for explaining a bonding method in the fourth combination pattern. With reference to FIG. 21, a case where both the first holding surface 130a and the second holding surface 230a are flat will be described.

[0204] 21 , when both the first holding surface 130 a and the second holding surface 230 a are flat (the state shown in the upper part of FIG. 21 ), the control unit 191, for example, maintains either the first holding surface 130 a (the lower surface of the first chuck 130) or the second holding surface 230 a (the upper surface of the second chuck 230) flat, and makes the other of the first holding surface 130 a and the second holding surface 230 a convex. Which of the first holding surface 130 a and the second holding surface 230 a is to be made convex is determined appropriately. For example, the control unit 191 may acquire first substrate warpage information indicating the warpage direction and amount of warpage of the first substrate W1 before being held, and second substrate warpage information indicating the warpage direction and amount of warpage of the second substrate W2 before being held, and determine which of the first holding surface 130 a and the second holding surface 230 a is to be made convex based on the first substrate warpage information and the second substrate warpage information. In this case, the control unit 191 may make the holding surface that holds the substrate with the least change in warpage when the holding surface is made convex. In this embodiment, the control unit 191, for example, maintains the first holding surface 130a in a flat shape and makes the second holding surface 230a in a convex shape (the state shown in the middle of FIG. 21 ). Note that the control unit 191 may, for example, make the other of the first holding surface 130a and the second holding surface 230a convex, and make one of the first holding surface 130a and the second holding surface 230a concave or convex. Alternatively, the control unit 191 may, for example, maintain both the first holding surface 130a and the second holding surface 230a in a flat shape.

[0205] Thereafter, the control unit 191 moves the first substrate holding device 100 downward using the second moving mechanism 620. As a result, the first substrate W1 and the second substrate W2 come into point contact with each other.

[0206] Then, the control unit 191, for example, gradually reduces the suction force on the second substrate W2. As a result, the second substrate W2 is peeled off from the second chuck 230 due to the restoring force of the second substrate W2, and the front surface Wa (here, the upper surface) of the second substrate W2 is deformed into a planar shape, and the entire front surface Wa of the second substrate W2 comes into close contact with the entire front surface Wa (here, the lower surface) of the first substrate W1 (the state shown in the lower part of FIG. 21 ). Note that the manner in which the suction force is reduced and the manner in which the contact area between the first substrate W1 and the second substrate W2 expands are the same as those during bonding in the first combination pattern described above.

[0207] Furthermore, although not shown, the control unit 191 may deform the second chuck 230 from a state in which the first substrate W1 and the second substrate W2 are in point contact to a state in which the second holding surface 230a becomes flat without reducing the suction force on the second substrate W2. In this case, the control unit 191 moves the first substrate holding device 100 downward by the distance that the second movable body 271 moves downward using the second moving mechanism 620. Specifically, the control unit 191 moves the second movable body 271 downward relative to the second base 220 using the drive mechanism 273, while moving the first base 120 and the first movable body 171 downward at the same speed using the second moving mechanism 620. At this time, the control unit 191 moves the second suction pins 410 downward relative to the second base 220 so that the second suction pins 410 do not protrude upward from the second holding surface 230a. As a result, the first substrate W1 and the second substrate W2 come into contact with each other over their entire surfaces.

[0208] Whether to reduce the suction force on the second substrate W2 or deform the second chuck 230 from a state in which the first substrate W1 and the second substrate W2 are in point contact may be determined based on the second substrate warpage information and the warpage information of the first holding surface 130a (here, the amount of warpage is zero). Specifically, if the surface Wa of the second substrate W2 before being held is concave, the control unit 191 may reduce the suction force on the second substrate W2 from a state in which the first substrate W1 and the second substrate W2 are in point contact. Furthermore, if the surface Wa of the second substrate W2 before being held is convex or flat, the control unit 191 may deform the second chuck 230 from a state in which the first substrate W1 and the second substrate W2 are in point contact.

[0209] 22 is a schematic diagram illustrating a bonding method in a fifth combination pattern. Referring to FIG. 22, a case will be described in which one of the first holding surface 130 a and the second holding surface 230 a has a convex shape, and the other of the first holding surface 130 a and the second holding surface 230 a has a flat shape.

[0210] 22 , when one of the first holding surface 130a and the second holding surface 230a is convex and the other of the first holding surface 130a and the second holding surface 230a is flat (the state shown in the upper part of FIG. 22 ), the control unit 191, for example, makes one of the first holding surface 130a, which is the lower surface of the first chuck 130, and the second holding surface 230a, which is the upper surface of the second chuck 230, convex and maintains the other of the first holding surface 130a and the second holding surface 230a flat. In this embodiment, the control unit 191, for example, maintains the first holding surface 130a flat and maintains the second holding surface 230a convex (the state shown in the middle part of FIG. 22 ). For example, the control unit 191 may make one of the first holding surface 130a and the second holding surface 230a convex and the other of the first holding surface 130a and the second holding surface 230a concave or convex. Alternatively, the control unit 191 may make both the first holding surface 130a and the second holding surface 230a flat.

[0211] The other lamination methods in the fifth combination pattern are the same as those in the fourth combination pattern.

[0212] 23 is a schematic diagram for explaining a bonding method in the sixth combination pattern. With reference to FIG. 23, a case where both the first holding surface 130a and the second holding surface 230a have a convex shape will be described.

[0213] 23, when both the first holding surface 130a and the second holding surface 230a have a convex shape (the state shown in the upper part of FIG. 23), the control unit 191 maintains both the first holding surface 130a, which is the lower surface of the first chuck 130, and the second holding surface 230a, which is the upper surface of the second chuck 230, in a convex shape (the state shown in the middle part of FIG. 23). Note that the control unit 191 may, for example, make either the first holding surface 130a or the second holding surface 230a flat or concave.

[0214] Thereafter, the control unit 191 moves the first substrate holding device 100 downward using the second moving mechanism 620. As a result, the front surface Wa (here, the lower surface) of the first substrate W1 and the front surface Wa (here, the upper surface) of the second substrate W2 come into point contact.

[0215] Then, the control unit 191, for example, deforms the first chuck 130 so that the first holding surface 130a becomes planar, and deforms the second chuck 230 so that the second holding surface 230a becomes planar. In this case, the control unit 191 causes the drive mechanism 273 to move the second moving body 271 downward relative to the second base 220, while causing the second moving mechanism 620 to move the first moving body 171 downward at the same speed. At this time, the control unit 191 causes the first base 120 to move downward at a speed greater than that of the first moving body 171. In other words, the control unit 191 causes the second moving mechanism 620 to move the first moving body 171 upward relative to the first base 120. At this time, the control unit 191 also controls the first pin actuators 450 to move the first suction pins 400 of the first substrate holding device 100 upward relative to the first base 120 so that the first suction pins 400 do not protrude downward from the first holding surface 130a, thereby bringing the first substrate W1 and the second substrate W2 into contact over their entire surfaces (the state shown in the lower part of FIG. 23 ).

[0216] In this embodiment, as described above, the first pin actuator 450 changes the protrusion amount of at least one first suction pin 400 relative to the protrusion amounts of the other first suction pins 400, thereby bending the first substrate W1 along the first holding surface 130a. The first pin actuator 450 then moves the multiple first suction pins 400 from the protruding position P1 to the non-protruding position P2, thereby causing the first chuck 130 to hold the first substrate W1. Therefore, the first chuck 130 can hold the first substrate W1 in a state in which the first substrate W1 is curved along the first holding surface 130a. This can prevent a gap from being formed between the first substrate W1 and the first holding surface 130a. In other words, it can prevent the first substrate W1 from being partially bent on the first holding surface 130a.

[0217] In this way, it is possible to prevent the first substrate W1 from being partially warped on the first holding surface 130a, and therefore it is possible to prevent a gap from being formed between the first substrate W1 and the second substrate W2 when the first substrate W1 and the second substrate W2 are bonded together, i.e., it is possible to prevent a void from being formed between the first substrate W1 and the second substrate W2.

[0218] As described above, the second pin actuator 460 changes the protrusion amount of at least one second suction pin 410 relative to the protrusion amounts of the other second suction pins 410, thereby curving the second substrate W2 so that it conforms to the second holding surface 230a. The second pin actuator 460 then moves the multiple second suction pins 410 from the protruding position P1 to the non-protruding position P2, thereby causing the second chuck 230 to hold the second substrate W2. Therefore, the second chuck 230 can hold the second substrate W2 in a state in which the second substrate W2 is curved along the second holding surface 230a. This can prevent a gap from being formed between the second substrate W2 and the second holding surface 230a. In other words, this can prevent the second substrate W2 from being partially bent on the second holding surface 230a. This can further prevent a gap from being formed between the first substrate W1 and the second substrate W2 when the first substrate W1 and the second substrate W2 are bonded together. In other words, it is possible to further prevent voids from occurring between the first substrate W1 and the second substrate W2.

[0219] Furthermore, as described above, the first substrate holding device 100 and the second substrate holding device 200 bond the first substrate W1 and the second substrate W2 together in a state in which one of the first holding surface 130a and the second holding surface 230a is convex and the other of the first holding surface 130a and the second holding surface 230a is concave. Specifically, the first substrate W1 and the second substrate W2 are bonded together as described with reference to Figures 18 to 20 (first to third combination patterns). Therefore, the first substrate W1 and the second substrate W2 can be bonded together by utilizing the restoring force of the first substrate W1 or the second substrate W2 held on one of the first holding surface 130a and the second holding surface 230a.

[0220] Furthermore, when utilizing the restoring force, by making the other of the first holding surface 130a and the second holding surface 230a concave, the first substrate W1 and the second substrate W2 can be more reliably brought into close contact from the center to the outer ends, compared to when the other of the first holding surface 130a and the second holding surface 230a is made, for example, flat or convex.

[0221] Furthermore, as described above, the maximum curvature of the convex shape of the first holding surface 130a and the second holding surface 230a is greater than the maximum curvature of the concave shape of the first holding surface 130a and the second holding surface 230a. Therefore, for example, when the first holding surface 130a is concave and the second holding surface 230a is convex (see, for example, the middle rows of FIGS. 18 to 20), the curvature of the second holding surface 230a can easily be made greater than the curvature of the first holding surface 130a.

[0222] Other configurations and other effects of the second embodiment are similar to those of the first embodiment.

[0223] The embodiments of the present invention have been described above with reference to the drawings. However, the present invention is not limited to the above embodiments and can be embodied in various forms without departing from the spirit and scope of the present invention. Furthermore, various inventions can be formed by appropriately combining multiple components disclosed in the above embodiments. For example, some components may be omitted from all components shown in the embodiments. Furthermore, components from different embodiments may be appropriately combined. The drawings mainly show each component in a schematic manner to facilitate understanding. The thickness, length, number, spacing, etc. of each component shown may differ from the actual thickness, length, number, spacing, etc. of each component shown in the above embodiments due to the convenience of drawing. Furthermore, the materials, shapes, dimensions, etc. of each component shown in the above embodiments are merely examples and are not particularly limited. Various modifications are possible within a scope that does not substantially deviate from the effects of the present invention.

[0224] For example, in the above embodiment, the substrate W is a semiconductor wafer, but the present invention is not limited to this. The present invention can use various substrates other than semiconductor wafers as the substrate W.

[0225] In addition, for example, in the first embodiment, an example has been described in which the substrate holding device 100 is arranged so that the holding surface 130 a faces downward, but the present invention is not limited to this. For example, the substrate holding device 100 may be arranged so that the holding surface 130 a faces upward.

[0226] In addition, for example, in the first embodiment, an example has been described in which the holding surface 130 a of the substrate holding device 100 is deformed into a convex shape and also into a concave shape, but the present invention is not limited to this. The holding surface 130 a of the substrate holding device 100 does not have to be deformed.

[0227] Furthermore, for example, in the second embodiment, an example was described in which both the first holding surface 130a of the first substrate holding device 100 and the second holding surface 230a of the second substrate holding device 200 deform into a convex shape and a concave shape, but the present invention is not limited to this. For example, the first holding surface 130a of the first substrate holding device 100 may deform into a convex shape and a concave shape, while the second holding surface 230a of the second substrate holding device 200 may not be concave. In other words, a bonding apparatus may be configured by the first substrate holding device 100 and a second substrate holding device having a different structure from the first substrate holding device 100. However, when a bonding apparatus is configured by the first substrate holding device 100 and a second substrate holding device having a different structure from the first substrate holding device 100 and the second substrate holding device 200 does not have a second suction pin 410, it is preferable that the first substrate holding device 100 be disposed above the second substrate holding device. In other words, it is preferable that the first substrate holding device 100 holds the upper substrate of the two substrates.

[0228] Furthermore, for example, in the second embodiment, an example has been described in which the second substrate holding device 200 arranged on the lower side has the second suction pins 410, but the present invention is not limited to this. The second substrate holding device 200 arranged on the lower side may not have the second suction pins 410 that suction-hold the second substrate W2, but may have, for example, support pins that support the second substrate W2 from below. However, when the second substrate W2 is suction-hold by the second suction pins 410, positional displacement of the second substrate W2 can be suppressed, unlike when the second substrate W2 is simply supported from below by support pins.

[0229] In the first embodiment, the suction pin 400 includes one central suction pin 400a and eight outer peripheral suction pins 400b. However, the present invention is not limited to this. The suction pin 400 may include, for example, two outer peripheral suction pins 400b that are symmetrically arranged around the central suction pin 400a. The suction pin 400 may also include, for example, two or more central suction pins 400a.

[0230] For example, in the above embodiment, the chuck is deformed by moving the movable body fixed to the chuck in the vertical direction, but the present invention is not limited to this. For example, a sealed space may be provided between the chuck and the base, and the chuck may be deformed by introducing compressed air into the sealed space or reducing the pressure in the sealed space. In this case, the deformation mechanism may include, for example, a pump or a blower fan.

[0231] The present invention is suitably used for a substrate holding device, a bonding device, a substrate holding method, and a bonding method.

[0232] 1: Bonding apparatus 100: Substrate holding device, first substrate holding device 130: Chuck, first chuck 130a: Holding surface, first holding surface 170: Deformation mechanism 191: Control unit 200: Second substrate holding device 230: Second chuck 230a: Second holding surface 400: Suction pin, first suction pin 400a: Central suction pin 400b: Periphery suction pin 410: Second suction pin 450: Pin actuator, first pin actuator 450a: Central pin actuator 450b: Periphery pin actuator 460: Second pin actuator P1: Protruding position P2: Non-protruding position S11: Step (process of suction and holding by suction pin) S13: Step (process of holding substrate by chuck, process of holding first substrate by first chuck) S22 : step (step of adsorbing and holding one side of the second substrate) S24: step (step of bonding the first substrate and the second substrate) W: substrate W1: first substrate W2: second substrate Wb: back surface (one side)

Claims

1. A substrate holding device comprising: a chuck having a holding surface which adsorbs and holds one side of a substrate; a plurality of suction pins which can protrude from the holding surface and which adsorb and hold the substrate; and a pin actuator which moves the plurality of suction pins between a protruding position at which they protrude from the holding surface and a non-protruding position at which they do not protrude from the holding surface, wherein the plurality of suction pins adsorb the one side of the substrate at the protruding position, and the pin actuator changes the amount of protrusion of at least one of the suction pins relative to the amount of protrusion of the other suction pins, thereby curving the substrate to conform to the holding surface, and moves the plurality of suction pins from the protruding position to the non-protruding position, thereby causing the chuck to hold the substrate.

2. The substrate holding device described in claim 1, wherein the multiple suction pins include a central suction pin that suctions and holds the center of the substrate, and multiple peripheral suction pins that suctions and holds the outer periphery of the substrate, the pin actuator includes a central pin actuator that moves the central suction pin, and a peripheral pin actuator that moves the peripheral suction pins, and the central pin actuator and the peripheral pin actuator move at least one of the central suction pin and the peripheral suction pin, and change the amount of protrusion of one of the central suction pin and the peripheral suction pin relative to the amount of protrusion of the other of the central suction pin and the peripheral suction pin, thereby curving the substrate to conform to the holding surface.

3. The substrate holding device of claim 2, wherein when moving the central suction pin and the peripheral suction pin from the protruding position to the non-protruding position, the central pin actuator and the peripheral pin actuator move the central suction pin to the non-protruding position and then move the peripheral suction pin to the non-protruding position.

4. A substrate holding device as described in any one of claims 1 to 3, comprising a deformation mechanism that deforms the chuck so that the holding surface has a convex shape and also deforms the chuck so that the holding surface has a concave shape, wherein the convex shape indicates a shape in which the center of the holding surface protrudes in a direction toward the substrate, and the concave shape indicates a shape in which the center of the holding surface is concave in a direction away from the substrate, and wherein the pin actuator, when the holding surface has the convex shape, bends the substrate so that the center of one side is concave in a direction away from the chuck, and when the holding surface has the concave shape, bends the substrate so that the center of one side protrudes in a direction toward the chuck.

5. A substrate holding device as described in any one of claims 1 to 4, further comprising a control unit for controlling the pin actuator, wherein the control unit acquires warping information including information regarding at least the warping direction of the holding surface, and causes the pin actuator to change the protrusion amount of at least one of the suction pins relative to the protrusion amounts of the other suction pins based on the warping information, thereby curving the substrate to conform to the holding surface.

6. A substrate holding device as described in claim 5, wherein when the warpage information indicates that the center of the holding surface is concave in a direction away from the substrate, the control unit uses the pin actuator to bend the substrate so that the center of one surface protrudes in a direction toward the chuck.

7. A substrate holding device as described in claim 6, wherein, when the warpage information indicates that the holding surface has the concave shape, the control unit uses the pin actuator to bend the substrate so that the center of one side protrudes in a direction toward the chuck, and after bringing the center of one side into point contact with the center of the holding surface, the control unit uses the pin actuator to make the curvature of the one side the same as the curvature of the holding surface.

8. A bonding apparatus for bonding a first substrate and a second substrate, comprising: a first substrate holding device for holding the first substrate; and a second substrate holding device disposed opposite the first substrate holding device for holding the second substrate, wherein the first substrate holding device has a first chuck having a first holding surface for suction-holding one side of the first substrate; a plurality of first suction pins capable of protruding from the first holding surface for suction-holding the first substrate; and a first pin actuator for moving the plurality of first suction pins between a protruding position at which they protrude from the first holding surface and a non-protruding position at which they do not protrude from the first holding surface, wherein the plurality of first suction pins suction the first substrate at the protruding position; and the first pin actuator for curving the first substrate to fit the first holding surface by changing the amount of protrusion of at least one of the first suction pins relative to the amount of protrusion of the other first suction pins, a bonding apparatus for holding the first substrate by the first chuck by moving the first suction pins from the protruding position to the non-protruding position.

9. The bonding apparatus described in claim 8, wherein the second substrate holding device comprises: a second chuck having a second holding surface which adsorbs and holds one side of the second substrate; a plurality of second suction pins which can protrude from the second holding surface and which adsorb and hold the second substrate; and a second pin actuator which moves the plurality of second suction pins between a protruding position at which they protrude from the second holding surface and a non-protruding position at which they do not protrude from the second holding surface, wherein the plurality of second suction pins adsorb the second substrate at the protruding position, and the second pin actuator changes the amount of protrusion of at least one of the second suction pins relative to the amount of protrusion of the other second suction pins, thereby curving the second substrate to conform to the second holding surface, and moves the plurality of second suction pins from the protruding position to the non-protruding position, thereby causing the second substrate to be held by the second chuck.

10. A bonding apparatus as described in claim 8 or claim 9, wherein the second substrate holding device has a second chuck having a second holding surface that adsorbs and holds one side of the second substrate, and the first substrate holding device and the second substrate holding device bond the first substrate and the second substrate together in a state in which one of the first holding surface and the second holding surface has a concave shape that is recessed in a direction away from the first substrate and the second substrate, and the other of the first holding surface and the second holding surface has a convex shape that protrudes in a direction toward the first substrate and the second substrate.

11. The bonding apparatus according to claim 10, wherein the first holding surface is deformable into the convex shape and also into the concave shape, and the maximum curvature of the first holding surface in the convex shape is greater than the maximum curvature of the first holding surface in the concave shape.

12. A substrate holding method comprising the steps of: adsorbing and holding one side of a substrate with a plurality of suction pins; curving the substrate so that it fits along the holding surface of a chuck that holds the substrate, transferring the substrate from the plurality of suction pins to the chuck, and holding the substrate with the chuck.

13. A bonding method comprising the steps of: adsorbing and holding one side of a first substrate with a plurality of suction pins; curving the first substrate so that it fits along a first holding surface of a first chuck that holds the first substrate, transferring the first substrate from the plurality of suction pins to the first chuck, and holding the first substrate with the first chuck; adsorbing and holding one side of a second substrate with a second holding surface of a second chuck; and bonding the first substrate and the second substrate together in a state in which one of the first holding surface and the second holding surface has a concave shape that is concave in a direction away from the first substrate and the second substrate, and the other of the first holding surface and the second holding surface has a convex shape that protrudes in a direction toward the first substrate and the second substrate.

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