Display substrate and display device

Abstract

A display substrate and a display device. The display substrate comprises a substrate base, and a conductive structure and a first inorganic layer which are located on the substrate base. The substrate base comprises a first area and a second area; the conductive structure is located in the first area and the second area; the first inorganic layer is located on the side of the conductive structure away from the substrate base and is located in the first area and the second area. In at least part of the first area, an insulating layer is provided between the first inorganic layer and the conductive structure, and in at least part of the second area, the first inorganic layer is in contact with the surface of the conductive structure. In the display substrate provided in the present disclosure, the first inorganic layer is provided in both the first area and the second area, and in the second area, the first inorganic layer is in direct contact with the surface of the conductive structure, thereby implementing protection of the conductive structure by the first inorganic layer and preventing defects caused by etching of the conductive structure due to exposure.

Description

Display substrate and display device TECHNICAL FIELD

[0001] Embodiments of the present disclosure relate to a display substrate and a display device. BACKGROUND

[0002] Organic light emitting diode (OLED) display products have a wide range of applications due to their advantages such as rich colors, fast response time, and foldability. An OLED display device includes a tandem device, which improves the lifetime and brightness of the light emitting device and reduces power consumption by adding at least one light emitting layer and a charge generation layer in the tandem device to meet the user's demand for the service life and power consumption of the display device.

[0003] SUMMARY

[0004] The present disclosure provides a display substrate and a display device.

[0005] Embodiments of the present disclosure provide a display substrate, comprising: a substrate, and a conductive structure and a first inorganic layer on the substrate. The substrate includes a first region and a second region; the conductive structure is located on the first region and the second region of the substrate; the first inorganic layer is located on the side of the conductive structure away from the substrate, and is located in the first region and the second region. In at least part of the first region, an insulating layer is provided between the first inorganic layer and the conductive structure, and in at least part of the second region, the first inorganic layer is in surface contact with the conductive structure.

[0006] For example, according to embodiments of the present disclosure, the thickness of the insulating layer is greater than the thickness of any one of the first inorganic layer and the conductive structure.

[0007] For example, according to embodiments of the present disclosure, the part of the conductive structure located in the second region includes a power signal line.

[0008] For example, according to embodiments of the present disclosure, the first region includes a display region, and the second region includes part of a non-display region; the display region includes a plurality of sub-pixels, each of at least part of the sub-pixels includes a light emitting functional layer, the light emitting functional layer includes a plurality of film layers; the display substrate includes a limiting structure, the limiting structure includes part of the first inorganic layer located in the first region, the limiting structure is located between the light emitting functional layer and the substrate, and part of the limiting structure located between adjacent sub-pixels is configured to block at least one layer of the light emitting functional layer.

[0009] For example, according to an embodiment of the present disclosure, the insulating layer includes a first organic layer, the first organic layer is located at a portion of the first region and is disposed between the first inorganic layer and the conductive structure, the defined structure further includes at least one protrusion in the first organic layer in contact with a surface of the first inorganic layer, at least a part of an edge of the protrusion is recessed relative to an edge of the first inorganic layer in the defined structure.

[0010] For example, according to an embodiment of the present disclosure, the conductive structure includes at least two sub-conductive structures disposed in a stack, at a portion of the first region, an other organic layer is disposed between adjacent two of the at least two sub-conductive structures, at the second region, at least a part of adjacent two of the at least two sub-conductive structures directly contact, or at least a second inorganic layer is disposed between two sub-conductive structures.

[0011] For example, according to an embodiment of the present disclosure, the substrate substrate further includes a third region, the third region includes a portion of the non-display region, the conductive structure is located at a portion of the third region and includes at least one annular first isolation column, in a direction perpendicular to the substrate substrate, the first isolation column does not overlap with the first organic layer; each of the at least part of the sub-pixels further includes a first electrode and a second electrode located on both sides of the light-emitting functional layer, the first electrode is located between the light-emitting functional layer and the substrate substrate; at least a portion of the third region close to the first region or at least a portion of the first region close to the third region includes a second isolation column, the second isolation column includes a stacked structure formed by the first inorganic layer and the first organic layer, in the second isolation column, an edge of the first inorganic layer includes a first protruding part protruding relative to at least a part of an edge of the first organic layer, the first isolation column and the second isolation column are configured to isolate at least one of the light-emitting functional layer and the second electrode.

[0012] For example, according to an embodiment of the present disclosure, the second isolation column includes a plurality of second isolation columns surrounding a center of the third region, at least one of the second isolation columns, the first organic layer is provided with a first groove, the first inorganic layer includes an opening exposing the first groove; the display substrate further includes a second organic layer located on a side of the first inorganic layer away from the substrate substrate, the second organic layer includes a first covering part, the first covering part covers the first groove and an edge of the first inorganic layer close to the first groove.

[0013] For example, according to an embodiment of the present disclosure, the substrate substrate further comprises a third region, the third region comprises a partial area of the non-display region, the third region is provided with at least one annular first isolation column, the first isolation column comprises a first isolation layer and a second isolation layer arranged in a stack, the second isolation layer is located on a side of the first isolation layer away from the substrate substrate; the first organic layer is located in a part of the third region comprising the first isolation layer, the first inorganic layer is located in a part of the third region comprising the second isolation layer, and the second isolation layer is arranged protruding relative to an edge of the first isolation layer to form a second protruding portion, or, a third organic layer is further arranged between the first organic layer and the substrate substrate, the third organic layer is located in a part of the third region comprising the first isolation layer, the first inorganic layer is located in a part of the third region comprising the second isolation layer, and the second isolation layer is arranged protruding relative to an edge of the first isolation layer to form a second protruding portion.

[0014] For example, according to an embodiment of the present disclosure, a second groove is arranged on a side of the first isolation layer away from the substrate substrate, and the second isolation layer exposes the second groove; the display substrate further comprises a second organic layer located on a side of the first inorganic layer away from the substrate substrate, the second organic layer comprises a second covering portion, and the second covering portion covers at least the second groove.

[0015] For example, according to an embodiment of the present disclosure, the second organic layer located in a part of the first region further comprises a pixel definition pattern, the pixel definition pattern comprises a plurality of first openings and a plurality of second openings, one sub-pixel corresponds to at least one first opening, at least part of a light-emitting functional layer of the sub-pixel is located in the first opening corresponding to the sub-pixel, and the first opening is configured to expose the first electrode, and the second opening is configured to expose an edge of the definition structure.

[0016] For example, according to an embodiment of the present disclosure, each of the at least part of the sub-pixels further comprises a first electrode and a second electrode located on two sides of the light-emitting functional layer, and a pixel circuit, the first electrode is located between the light-emitting functional layer and the substrate substrate, and the first inorganic layer is located between the first electrode and the substrate substrate; the insulating layer comprises a first organic layer, in a partial area of the first region, the first organic layer comprises a via, the first electrode is electrically connected to the pixel circuit through the via, and the first inorganic layer covers at least part of an inner wall of the via.

[0017] For example, according to an embodiment of the present disclosure, the first organic layer at a position other than the via comprises at least one protrusion in contact with a surface of the first inorganic layer in the definition structure, the definition structure comprises the protrusion, and an edge of the protrusion is recessed relative to an edge of the first inorganic layer in the definition structure.

[0018] For example, according to an embodiment of the present disclosure, the display substrate further includes at least one ring of blocking portions surrounding the display region, at least part of a film layer of the blocking portions being located on a side of the conductive structure away from the substrate. A projection of the power signal line on the substrate overlaps a projection of the at least one ring of blocking portions on the substrate, a portion of the power signal line located in the second region extends in a first direction, a portion of the at least one ring of blocking portions located in the second region includes a strip-shaped blocking portion extending in a second direction, and at least part of the first inorganic layer located in the second region extends in the second direction, the first direction intersecting the second direction.

[0019] For example, according to an embodiment of the present disclosure, at least part of the first inorganic layer located in the second region includes at least one inorganic layer pattern, the inorganic layer pattern covering at least part of an edge of the power signal line extending in the first direction.

[0020] For example, according to an embodiment of the present disclosure, the at least one inorganic layer pattern includes a plurality of inorganic layer patterns, the number of the strip-shaped blocking portions is at least one, and the strip-shaped blocking portions and the plurality of inorganic layer patterns are alternately arranged in the first direction.

[0021] For example, according to an embodiment of the present disclosure, an edge of the strip-shaped blocking portion covers an edge of the inorganic layer pattern, or an edge of the strip-shaped blocking portion is flush with at least part of an edge of the inorganic layer pattern.

[0022] For example, according to an embodiment of the present disclosure, the substrate includes a fourth region surrounding part of the display region, a projection of a portion of the power signal line located in the fourth region on the substrate is completely located within a projection of the at least one ring of blocking portions on the substrate.

[0023] For example, according to an embodiment of the present disclosure, in a direction perpendicular to the substrate, the portion of the power signal line located in the fourth region does not overlap the first inorganic layer.

[0024] For example, according to an embodiment of the present disclosure, the power signal line includes a first power signal line and a second power signal line, only the second power signal line is arranged in the fourth region, and the first power signal line and the second power signal line are arranged in the second region.

[0025] For example, according to an embodiment of the present disclosure, the display region includes a plurality of sub-pixels, each of at least part of the sub-pixels includes a first electrode, a light-emitting functional layer and a second electrode which are sequentially stacked, the light-emitting functional layer includes a plurality of film layers; the display substrate includes a limiting structure, the limiting structure includes a part of the first inorganic layer located in the first region, the limiting structure is located between the light-emitting functional layer and the substrate, and a part of the limiting structure between adjacent sub-pixels is configured to block at least one layer of the light-emitting functional layer; the display substrate further includes a second organic layer located on a side of the first inorganic layer away from the substrate, and a part of the second organic layer located in the first region includes a pixel limiting pattern, the pixel limiting pattern includes a plurality of first openings, one sub-pixel corresponds to at least one first opening, at least part of the light-emitting functional layer of the sub-pixel is located in the first opening corresponding to the sub-pixel, and the first opening is configured to expose the first electrode, and a part of the second organic layer located in the second region includes a film layer of the blocking part.

[0026] For example, according to an embodiment of the present disclosure, the insulating layer includes a first organic layer, a part of the first organic layer located in the second region includes a first film layer of the blocking part, a film layer of the second organic layer located in the second region includes a second film layer of the blocking part, the second film layer is located on a side of the first film layer away from the substrate, and in a direction perpendicular to the substrate, a part of the inorganic layer pattern overlapping with the blocking part is located between the first film layer and the second film layer.

[0027] For example, according to an embodiment of the present disclosure, at least one of the plurality of inorganic layer patterns includes a main part extending along the second direction and a widened part located on at least one side of the main part in the first direction, in the second direction, the length of the widened part is less than the length of the main part, in the first direction, the width of the widened part is less than the size of the blocking part, and the widened part covers an edge of the power signal line extending along the second direction.

[0028] For example, according to an embodiment of the present disclosure, the display substrate further includes an encapsulation layer located on a side of the second organic layer away from the substrate. At least part of the edge of the first protruding part of the second isolation column closest to the center of the third region is covered by the second organic layer, and at least part of the edge of the second organic layer is covered by the encapsulation layer.

[0029] For example, according to an embodiment of the present disclosure, the display substrate further includes: an encapsulation layer located on a side of the second organic layer away from the substrate substrate. The first inorganic layer covers a portion of the first organic layer farthest away from the edge of the first region and a portion of the edge of the first organic layer protruding relative to the edge of the first organic layer is covered by the second organic layer, and the encapsulation layer covers at least a portion of the edge of the second organic layer.

[0030] For example, according to an embodiment of the present disclosure, the first inorganic layer includes a plurality of notches exposing the first organic layer, and the second organic layer fills the plurality of notches.

[0031] For example, according to an embodiment of the present disclosure, the substrate substrate includes a bending region, the insulating layer includes a first organic layer, the display substrate further includes a second organic layer, the second organic layer is located on a side of the first inorganic layer away from the conductive structure, and the conductive structure, the first inorganic layer, the first organic layer and the second organic layer are located in a portion of the bending region and are configured to be bendable. The portion of the first inorganic layer in the bending region includes an opening, the portion of the first organic layer in the bending region includes a third groove, and the second organic layer fills the opening and the third groove.

[0032] An embodiment of the present disclosure provides a display substrate, including: a substrate substrate and a first inorganic layer, a first organic layer, a second organic layer and a conductive structure located on the substrate substrate. The substrate substrate includes a first sub-region and a second sub-region; the first inorganic layer is located on the first sub-region and the second sub-region of the substrate substrate; the first organic layer is located between the film layer where the first inorganic layer is located and the substrate substrate; the second organic layer is located on a side of the film layer where the first inorganic layer is located away from the substrate substrate; and the conductive structure is located between the film layer where the first inorganic layer is located and the substrate substrate. The portion of the first inorganic layer in the first sub-region is in contact with the first organic layer, the portion of the first inorganic layer in the second sub-region is in contact with the conductive structure, and in the first sub-region, at least a portion of the edge of the first inorganic layer covering the first organic layer is covered by the second organic layer.

[0033] For example, according to an embodiment of the present disclosure, the substrate substrate further includes a third sub-region, the first sub-region includes a partial region of a non-display region, the second sub-region includes a partial region of a non-display region, and the third sub-region includes a partial region of the display region; the display region includes a plurality of sub-pixels, each of at least a portion of the sub-pixels includes a light-emitting functional layer, and the light-emitting functional layer includes a plurality of film layers; the display substrate includes a limiting structure, the limiting structure includes a portion of the first inorganic layer located in the first region, the limiting structure is located between the light-emitting functional layer and the substrate substrate, and a portion of the limiting structure located between adjacent sub-pixels is configured to block at least one layer of the light-emitting functional layer.

[0034] For example, according to an embodiment of the present disclosure, each of the at least part of the sub-pixels further comprises a first electrode and a second electrode located on both sides of the light-emitting functional layer, the first electrode is located between the light-emitting functional layer and the substrate substrate; the second organic layer is located in part of the third sub-region including a pixel defining pattern, located on the side of the first electrode away from the substrate substrate, the pixel defining pattern comprises a plurality of first openings and a plurality of second openings, one sub-pixel corresponds to at least one first opening, at least part of the light-emitting functional layer of the sub-pixel is located in the first opening corresponding to the sub-pixel, and the first opening is configured to expose the first electrode, and the second opening is configured to expose the edge of the limiting structure.

[0035] For example, according to an embodiment of the present disclosure, the first organic layer is located in part of the first sub-region including a groove, the first inorganic layer is located in part of the first sub-region including an opening hole exposing at least part of the groove, and the second organic layer is located in part of the first sub-region filling the opening hole and the groove.

[0036] For example, according to an embodiment of the present disclosure, the display area comprises a plurality of sub-pixels, each of at least part of the sub-pixels comprises a light-emitting functional layer, and a first electrode and a second electrode located on both sides of the light-emitting functional layer, the first electrode is located between the light-emitting functional layer and the substrate substrate; the non-display area comprises at least one annular first isolation column, the first isolation column comprises a first isolation layer and a second isolation layer arranged in layers, the first isolation layer is located between the second isolation layer and the substrate substrate, and the second isolation layer protrudes relative to the edge of the first isolation layer to isolate the light-emitting functional layer and the second electrode; the second organic layer is located in part of the non-display area including the first isolation layer, and the first inorganic layer is located in part of the non-display area including the second isolation layer.

[0037] For example, according to an embodiment of the present disclosure, the first isolation layer is provided with a first sub-groove away from the substrate substrate, and the second isolation layer exposes the first sub-groove; the second organic layer is located in part of the non-display area covering the first sub-groove and the edge of the second isolation layer close to the first sub-groove.

[0038] For example, according to an embodiment of the present disclosure, the display substrate is provided with at least one second isolation column located on a side of the first isolation column away from a center of the partial non-display area surrounded thereby, the second isolation column includes a third isolation layer and a fourth isolation layer which are stacked, the third isolation layer is located between the fourth isolation layer and the substrate, and an edge of the fourth isolation layer protrudes relative to an edge of the third isolation layer to isolate at least one of the light-emitting functional layer and the second electrode; a distance between at least part of the fourth isolation layer and the substrate is greater than a distance between the second isolation layer and the substrate.

[0039] For example, according to an embodiment of the present disclosure, the third isolation layer is provided with a second sub-groove on a side thereof away from the substrate, and the fourth isolation layer exposes the second sub-groove; the second organic layer covers the second sub-groove and an edge of the fourth isolation layer close to the second sub-groove.

[0040] An embodiment of the present disclosure provides a display substrate, comprising: a substrate, and an inorganic layer, a conductive structure and at least one barrier located on the substrate. The substrate comprises a display area and a non-display area surrounding the display area; the inorganic layer is located on the display area and the non-display area of the substrate; the conductive structure is located between the inorganic layer and the substrate, and the conductive structure comprises a power signal line; the at least one barrier is located in the non-display area and surrounds the display area, and at least part of a film layer of the barrier is located on a side of the conductive structure away from the substrate. The non-display area comprises a first non-display area located on a side of the display area, the power signal line is located in part of the first non-display area extending in a first direction, the barrier located in part of the first non-display area comprises a strip-shaped barrier extending in a second direction and overlapping the power signal line, and the inorganic layer located in part of the first non-display area comprises an inorganic layer pattern extending in the second direction, and in a direction perpendicular to the substrate, an edge of the strip-shaped barrier overlaps at least part of an edge of the inorganic layer pattern.

[0041] For example, according to an embodiment of the present disclosure, the non-display area comprises a second non-display area surrounding the display area, and a projection of part of the power signal line located in the second non-display area on the substrate is completely located within a projection of the at least one barrier on the substrate.

[0042] For example, according to an embodiment of the present disclosure, in a direction perpendicular to the substrate, part of the power signal line located in the second non-display area does not overlap the inorganic layer.

[0043] For example, according to an embodiment of the present disclosure, the power signal lines include a first power signal line and a second power signal line, and the second power signal line is arranged in the second non-display area only, and the first power signal line and the second power signal line are arranged in the first non-display area.

[0044] For example, according to an embodiment of the present disclosure, the at least one inorganic layer pattern includes a plurality of inorganic layer patterns, and the number of the strip-shaped barrier portions is at least one, and the strip-shaped barrier portions are arranged alternately with the plurality of inorganic layer patterns along the first direction.

[0045] For example, according to an embodiment of the present disclosure, the inorganic layer pattern covers an edge of the power signal line extending along the first direction.

[0046] For example, according to an embodiment of the present disclosure, the display substrate further includes a first organic layer between the inorganic layer and the substrate, and a part of the first organic layer in the display area includes a planar layer. A part of the first organic layer in the non-display area includes a first film layer of the barrier portion, and a part of the inorganic layer overlapping with the barrier portion in a direction perpendicular to the substrate covers at least part of an edge of the first film layer.

[0047] For example, according to an embodiment of the present disclosure, the display substrate further includes a second organic layer on a side of the inorganic layer away from the substrate. A part of the second organic layer in the non-display area includes a second film layer of the barrier portion, and the second film layer is on a side of the first film layer away from the substrate, and in a direction perpendicular to the substrate, a part of the inorganic layer overlapping with the barrier portion is between the first film layer and the second film layer.

[0048] For example, according to an embodiment of the present disclosure, the display substrate further includes an encapsulation layer on a side of the second organic layer away from the substrate. The encapsulation layer includes a part in contact with the barrier portion and a part in contact with the inorganic layer.

[0049] An embodiment of the present disclosure provides a display device including any of the display substrates described above. BRIEF DESCRIPTION OF DRAWINGS

[0050] In order to more clearly illustrate the technical solutions of the embodiments of the present disclosure, the drawings of the embodiments will be briefly introduced as follows. Obviously, the drawings in the following description are only related to some embodiments of the present disclosure and are not limiting of the present disclosure.

[0051] FIG. 1 is a schematic plan view of a display substrate according to an embodiment of the present disclosure.

[0052] FIG. 2 is a schematic view of a partial cross-sectional structure of the first area and the second area shown in FIG. 1.

[0053] FIG. 3 is a plan view of a partial structure of the second area shown in FIG. 1.

[0054] FIG. 4 is a scanning electron microscope view of a cross-sectional view along AA' shown in FIG. 3.

[0055] FIGS. 5 and 6 are schematic diagrams of partial cross-sectional structures of display substrates according to different examples of embodiments of the present disclosure.

[0056] FIG. 7 is a schematic diagram of a partial planar structure of the second area shown in FIG. 1.

[0057] FIG. 8 is a schematic diagram of pixel arrangement in a display substrate according to an embodiment of the present disclosure.

[0058] FIGS. 9 and 10 are schematic diagrams of partial cross-sectional structures of the display substrate shown in FIG. 8 according to different examples of embodiments of the present disclosure.

[0059] FIG. 11 is a schematic diagram of a planar structure of the first area and the third area of the display substrate shown in FIG. 1.

[0060] FIG. 12 is a schematic diagram of a partial planar structure of the third area shown in FIG. 11.

[0061] FIG. 13 is a schematic diagram of a partial cross-sectional structure of the display substrate shown in FIG. 12 in an example.

[0062] FIGS. 14 to 16 are process step diagrams of forming the display substrate shown in FIG. 13.

[0063] FIG. 17 is a schematic diagram of a partial cross-sectional structure of the display substrate shown in FIG. 12 in another example.

[0064] FIGS. 18 and 19 are schematic diagrams of partial cross-sectional structures of the third area of the display substrate shown in FIG. 1 in different examples.

[0065] FIG. 20 is a schematic diagram of a package layer in which a fracture occurs at a boundary of a first inorganic layer.

[0066] FIG. 21 is a scanning electron microscope view of a package layer in which a fracture occurs at a boundary of a first inorganic layer.

[0067] FIGS. 22 and 23 are structure diagrams in different examples of embodiments of the present disclosure at a position shown in FIG. 20.

[0068] FIGS. 24 and 25 are schematic diagrams of partial structures of a bending area in a display substrate shown in FIG. 1 in different examples.

[0069] FIG. 26 is a schematic diagram of a partial cross-sectional structure of a non-display area of a display substrate according to an embodiment of the present disclosure.

[0070] FIG. 27 is a schematic diagram of a partial cross-sectional structure of a display substrate according to an example of an embodiment of the present disclosure.

[0071] FIG. 28 is a schematic diagram of a partial cross-sectional structure of a display substrate according to another example provided by embodiments of the present disclosure.

[0072] FIG. 29 is a schematic block diagram of a display device according to another embodiment of the present disclosure. DETAILED DESCRIPTION

[0073] In order to make the objects, technical solutions and advantages of the embodiments of the present disclosure clearer, the technical solutions of the embodiments of the present disclosure will be described clearly and completely below with reference to the drawings of the embodiments of the present disclosure. Obviously, the described embodiments are some but not all of the embodiments of the present disclosure. Based on the described embodiments of the present disclosure, all other embodiments obtained by those of ordinary skill in the art without creative effort belong to the scope of the present disclosure.

[0074] Unless otherwise defined, technical terms or scientific terms used in the present disclosure should be understood as having the same meaning as commonly understood by one of ordinary skill in the art to which the present disclosure belongs. The terms "first", "second", and similar terms used in the present disclosure do not denote any order, quantity, or importance, but are used to distinguish different components. The terms "include", "contain", and similar terms mean that the elements or objects before the terms encompass the elements or objects listed after the terms and their equivalents, and do not exclude other elements or objects.

[0075] The terms "parallel", "perpendicular", and "same" and the like used in at least one embodiment of the present disclosure include the strict "parallel", "perpendicular", "same" and the like, and "approximately parallel", "approximately perpendicular", "approximately same" and the like with a certain error, which, considering the measurement and the error related to the measurement of a specific value (for example, the limitation of the measurement system), represents the acceptable deviation range for the specific value determined by those of ordinary skill in the art. For example, "approximately" can mean within one or more standard deviations, or within 10% or 5% of the value. When the quantity of a component is not specifically indicated in the following embodiments of the present disclosure, it means that the component can be one or more, or can be understood as at least one. "At least one" means one or more, and "multiple" means at least two. The "same layer" in the disclosure means that two (or more) structures are formed by the same deposition process and patterned by the same patterning process, and their materials can be the same or different. The "integrally arranged structure" in the present disclosure means that two (or more) structures are formed by the same deposition process and patterned by the same patterning process, and are connected to each other, and their materials can be the same or different.

[0076] In the research, the inventors of the present application found that the light-emitting functional layer of the light-emitting element can include a plurality of light-emitting layers arranged in a stack, such as a tandem device. The tandem device has the characteristics of low power consumption and long service life. However, at least two of the plurality of light-emitting layers in the tandem device are provided with a charge generation layer (CGL), and the conductivity of the charge generation layer is relatively large. For example, when the charge generation layer is a full-area film layer, the charge generation layers of the adjacent two light-emitting elements are continuous film layers, and there is a phenomenon of lateral migration of charges, which causes the display substrate to deviate in low gray scale monochromatic chroma, such as causing crosstalk between adjacent sub-pixels, resulting in color deviation of the display substrate. For example, the charge generation layer can easily cause crosstalk between different color sub-pixels at low brightness, resulting in low gray scale color deviation.

[0077] The present disclosure provides a display substrate, comprising a substrate, a conductive structure and a first inorganic layer on the substrate. The substrate comprises a first region and a second region; the conductive structure is located in the first region and the second region; the first inorganic layer is located on the side of the conductive structure away from the substrate, and is located in the first region and the second region. In at least part of the first region, an insulating layer is provided between the first inorganic layer and the conductive structure, and in at least part of the second region, the first inorganic layer is in surface contact with the conductive structure. In the display substrate provided by the present disclosure, by providing the first inorganic layer in the first region and the second region, and by directly contacting the first inorganic layer with the conductive structure in the second region, the protection of the conductive structure by the first inorganic layer is facilitated, and the etching of the conductive structure due to exposure is prevented.

[0078] The present disclosure provides a display substrate, comprising a substrate, a first inorganic layer, a first organic layer, a second organic layer and a conductive structure on the substrate. The substrate comprises a first sub-region and a second sub-region; the first inorganic layer is located in the first sub-region and the second sub-region of the substrate; the first organic layer is located between the film layer where the first inorganic layer is located and the substrate; the second organic layer is located on the side of the film layer where the first inorganic layer is located away from the substrate; and the conductive structure is located between the film layer where the first inorganic layer is located and the substrate. Part of the first inorganic layer located in the first sub-region is in contact with the first organic layer, part of the first inorganic layer located in the second sub-region is in contact with the conductive structure, and in the first sub-region, at least part of the edge of the first inorganic layer covering the first organic layer is covered by the second organic layer. In the display substrate provided by the present disclosure, by setting at least part of the edge of the first inorganic layer covering the first organic layer to be covered by the second organic layer, the breakage of the encapsulation layer covering the edge of the first inorganic layer is prevented.

[0079] The display substrate provided by the present disclosure comprises a substrate, an inorganic layer on the substrate, a conductive structure, and at least one barrier. The substrate comprises a display area and a non-display area surrounding the display area; the inorganic layer is on the display area and the non-display area of the substrate; the conductive structure is between the inorganic layer and the substrate, and the conductive structure comprises a power signal line; the at least one barrier is in the non-display area and surrounds the display area, and at least part of the film layer of the barrier is on the side of the conductive structure away from the substrate. The non-display area comprises a first non-display area on one side of the display area, the power signal line extends in a first direction in part of the first non-display area, the barrier in part of the first non-display area comprises a strip-shaped barrier extending in a second direction and overlapping the power signal line, and the inorganic layer in part of the first non-display area comprises an inorganic layer pattern extending in the second direction. In a direction perpendicular to the substrate, the edge of the strip-shaped barrier overlaps at least part of the edge of the inorganic layer pattern. The display substrate provided by the present disclosure is advantageous in covering the edge of the power signal line to prevent etching and other adverse effects on the edge of the power signal line by arranging the inorganic layer comprising the inorganic layer pattern in the first non-display area where the extension direction of the power signal line intersects with the extension direction of the strip-shaped barrier.

[0080] The display substrate and the display device provided by the present disclosure are described below with reference to the accompanying drawings.

[0081] FIG. 1 is a schematic plan view of a display substrate provided by an embodiment of the present disclosure. FIG. 2 is a schematic view of the partial cross-sectional structure of the first area and the second area shown in FIG. 1.

[0082] As shown in FIG. 1 and FIG. 2, the display substrate comprises a substrate 01, a conductive structure 100, and a first inorganic layer 210 on the substrate 01. The substrate 01 comprises a first area 011 and a second area 012. The conductive structure 100 is on the first area 011 and the second area 012 of the substrate 01, the first inorganic layer 210 is on the side of the conductive structure 100 away from the substrate 01, and is on the first area 011 and the second area 012. In at least part of the first area 011, an insulating layer is arranged between the first inorganic layer 210 and the conductive structure 100; in at least part of the second area 012, the first inorganic layer 210 is in surface contact with the conductive structure 100. In the display substrate provided by the present disclosure, the first inorganic layer 210 is arranged in the first area 011 and the second area 012, and the first inorganic layer 210 is in direct surface contact with the conductive structure 100 in the second area 012, which is advantageous in protecting the conductive structure 100 by the first inorganic layer 210 and preventing adverse effects caused by etching of the exposed conductive structure 100.

[0083] In some examples, as shown in FIGS. 1 and 2, the first area 011 includes a display area, and the second area 012 includes a part of a non-display area. For example, the display area is an area for displaying an image, and the non-display area is an area that does not display an image. For example, the second area 012 is located on a side of the first area 011. For example, the second area 012 can be an area provided with an electrical contact pad. For example, the second area 012 can be an area for electrical connection with a circuit board.

[0084] In some examples, as shown in FIG. 2, the display area includes a plurality of sub-pixels 300, and each of at least part of the sub-pixels 300 includes a light-emitting functional layer 310 including a plurality of film layers. Each of the at least part of the sub-pixels 300 further includes a first electrode 320 and a second electrode 330 located on both sides of the light-emitting functional layer 310, and the first electrode 320 is located between the light-emitting functional layer 310 and the substrate 01, and the first inorganic layer 210 is located between the first electrode 320 and the substrate 01.

[0085] For example, as shown in FIG. 2, the light-emitting functional layer 310 includes a charge generation layer. For example, the light-emitting functional layer can be a light-emitting functional layer included in an organic light-emitting element. For example, each of the sub-pixels 300 located in the display area includes a light-emitting element.

[0086] For example, as shown in FIG. 2, the light-emitting functional layer 310 can include a first light-emitting layer (EML), a charge generation layer (CGL), and a second light-emitting layer (EML) stacked, and the charge generation layer is located between the first light-emitting layer and the second light-emitting layer. The charge generation layer has strong conductivity, which can make the light-emitting functional layer 310 have the advantages of long service life, low power consumption, and high brightness. For example, compared with the light-emitting functional layer 310 without the charge generation layer, the sub-pixel 300 can increase the light-emitting brightness by nearly one time by setting the charge generation layer in the light-emitting functional layer 310.

[0087] For example, the light-emitting element of the same sub-pixel 300 can be a tandem light-emitting element, such as a Tandem OLED.

[0088] For example, the charge generation layer can include an N-type charge generation layer and a P-type charge generation layer.

[0089] For example, in each of the sub-pixels 300, the light-emitting functional layer 310 can further include a hole injection layer (HIL), a hole transport layer (HTL), an electron transport layer (ETL), and an electron injection layer (EIL).

[0090] For example, the hole injection layer, the hole transport layer, the electron transport layer, the electron injection layer, and the charge generation layer are common film layers of the plurality of sub-pixels 300, which can be referred to as common layers. For example, the common layers and the second electrode 330 can be film layers formed using an open mask.

[0091] For example, the second light-emitting layer can be located between the first light-emitting layer and the second electrode 330, and the hole injection layer can be located between the first electrode 320 and the first light-emitting layer. For example, an electron transport layer can be further provided between the charge generation layer and the first light-emitting layer. For example, a hole transport layer can be provided between the second light-emitting layer and the charge generation layer. For example, an electron transport layer and an electron injection layer can be provided between the second light-emitting layer and the second electrode 330.

[0092] For example, in the same sub-pixel 300, the first light-emitting layer and the second light-emitting layer can be light-emitting layers emitting the same color light. For example, in the same sub-pixel 300, the first light-emitting layer and the second light-emitting layer can be light-emitting layers emitting different colors of light. By providing light-emitting layers emitting different colors of light in the same sub-pixel 300, the light emitted by the multiple light-emitting layers included in the sub-pixel 300 can be mixed to white light. By providing a color filter layer, the color of the light emitted by each sub-pixel 300 can be adjusted.

[0093] For example, the material of the electron transport layer can include an aromatic heterocyclic compound, such as a benzimidazole derivative, an imidazopyridine derivative, a benzimidazophenanthroline derivative, and other imidazole derivatives; a pyrimidine derivative, a triazine derivative, and other azine derivatives; a quinoline derivative, an isoquinoline derivative, a phenanthroline derivative, and other compounds containing a nitrogen-containing six-membered ring structure (including compounds having a phosphine oxide group as a substituent on the heterocycle); and the like.

[0094] For example, the material of the charge generation layer can be a material containing a phosphorus oxygen group or a material containing a triazine.

[0095] For example, the ratio of the electron mobility of the charge generation layer to the electron mobility of the electron transport layer is 10 -2 ~ 10 2 .

[0096] For example, the first electrode 320 can be an anode, and the second electrode 330 can be a cathode. For example, the cathode can be formed of a material with high conductivity and a low work function, for example, the cathode can be made of a metal material. For example, the anode can be formed of a transparent conductive material with a high work function.

[0097] For example, as shown in FIG. 2, the orthographic projection of the second electrode 330 on the substrate 01 in at least part of the sub-pixels 300 is a full-area structure. For example, the second electrode 330 can be a common electrode shared by the plurality of sub-pixels 300.

[0098] In some examples, as shown in FIG. 2, the display substrate includes a defined structure 400, the defined structure 400 includes the first inorganic layer 210 located at the portion of the first region 011, the defined structure 400 is located between the light-emitting functional layer 310 and the substrate substrate 01, and the portion of the defined structure 400 between the adjacent sub-pixels 300 is configured to isolate at least one layer of the light-emitting functional layer 310. For example, the defined structure 400 can isolate the charge generation layer described above to prevent crosstalk between the adjacent sub-pixels 300 of different colors. For example, all film layers between the charge generation layer and the substrate substrate 01 in the light-emitting functional layer 310 can be isolated at the edge of the defined structure 400. For example, all film layers in the light-emitting functional layer 310 can be isolated at the edge of the defined structure 400. For example, the second electrode 330 can be continuous or can be isolated at the edge of the defined structure 400.

[0099] In some examples, as shown in FIG. 2, the thickness of the insulating layer 510 is greater than the thickness of any layer of the first inorganic layer 210 and the conductive structure 100. For example, the conductive structure 100 can be a metal structure.

[0100] For example, the insulating layer can be one film layer or can include multiple film layers. For example, the insulating layer includes multiple organic layers, or the multiple film layers included in the insulating layer can include organic layers and inorganic layers, or a metal layer can be provided between the multiple film layers included in the insulating layer.

[0101] In some examples, as shown in FIG. 2, the insulating layer described above includes at least one organic layer, the at least one organic layer includes the first organic layer 510, the first organic layer 510 is provided between the first inorganic layer 210 and the conductive structure 100 at the portion of the first region 011, and the defined structure 400 further includes at least one protrusion 501 of the first organic layer 510 in contact with the surface of the first inorganic layer 210, at least a portion of the edge of the protrusion 501 is recessed relative to the edge of the first inorganic layer 210 in the defined structure 400. For example, the first organic layer 510 includes multiple protrusions 501, the multiple protrusions 501 are provided one-to-one corresponding to the multiple sub-pixels 300, and the orthographic projection of the light-emitting region of the sub-pixel 300 on the substrate substrate 01 is located within the orthographic projection of the protrusion 501 on the substrate substrate 01.

[0102] For example, as shown in FIG. 2, the defining structure 400 is composed of the first inorganic layer 210 and the protrusion 501 of the first organic layer 510. For example, the orthographic projection of the first electrode 320 of the sub-pixel 300 on the substrate substrate 01 is entirely within the orthographic projection of the defining structure 400 on the substrate substrate 01. For example, the orthographic projection of the protrusion 501 on the substrate substrate 01 is entirely within the orthographic projection of the first inorganic layer 210 on the substrate substrate 01. For example, the thickness of the first organic layer 510 can be 2 microns. For example, the portion of the first organic layer 510 located in the display area can be the planarization layer (PLN) closest to the first electrode 320 of the sub-pixel 300. For example, the material of the first inorganic layer 210 can include silicon nitride, silicon oxide, or silicon oxynitride. For example, the material of the first organic layer 510 can include polyimide and the like.

[0103] In some examples, as shown in FIG. 2, the display substrate further includes a second organic layer 520 located on the side of the first inorganic layer 210 away from the substrate substrate 01. The portion of the second organic layer 520 located in the first area 011 includes a pixel defining pattern 5200, the pixel defining pattern 5200 including a plurality of first openings 5210 and a plurality of second openings 5220, one sub-pixel 300 corresponding to at least one first opening 5210, at least part of the light-emitting functional layer 310 of the sub-pixel 300 being located in the first opening 5210 corresponding to the sub-pixel 300, and the first opening 5210 being configured to expose the first electrode 320, and the second opening 5220 being configured to expose the edge of the defining structure 400. For example, one sub-pixel 300 corresponds to one first opening 5210, and the light-emitting functional layer 310 located in the first opening 5210 realizes light emission by contacting the first electrode 320 and the second electrode 330. For example, the first opening 5210 is used to define the light-emitting area of the sub-pixel 300. For example, the edge of the defining structure 400 exposed by the second opening 5220 is used to separate at least one layer of the light-emitting functional layer 310. For example, the pixel defining pattern 5200 includes a pixel defining portion surrounding the first opening 5210 and the second opening 5220, and the light-emitting functional layer can include a portion located in the first opening 5210 and a portion located on the pixel defining portion.

[0104] In some examples, as shown in FIGS. 1 and 2, the display substrate further includes at least one ring of dam 630 around the display area, at least part of the film layer of the dam 630 is located on the side of the conductive structure 100 away from the substrate 01. The dam 630 can be used to prevent the organic layer in the encapsulation layer 700 (described later) from overflowing the substrate 01 during the manufacturing process. FIG. 1 schematically shows two rings of dam 630, but is not limited thereto, and the number of dam 630 can be set according to product requirements. For example, the heights of different dams can be the same, or different. For example, the widths of different dams can be the same, or different. For example, the dam can have part of the film layer between the conductive structure and the substrate.

[0105] In some examples, as shown in FIG. 2, the first organic layer 510 is located on the first film layer 631 of the dam 630 in the part of the second area 012, and the second organic layer 520 is located on the second film layer 632 of the dam 630 in the part of the second area 012, and the second film layer 632 is located on the side of the first film layer 631 away from the substrate 01. For example, the dam 630 can include a first film layer 631 and a second film layer 632 stacked, the first organic layer 510 is located on the first film layer 631 of the dam 630 in the part of the second area 012, and the second organic layer 520 is located on the second film layer 632 of the dam 630 in the part of the second area 012. For example, the first film layer 631 and the second film layer 632 can be made of the same material. For example, the thickness of the second film layer 632 can be greater than the thickness of the first film layer 631. Of course, the embodiments of the present disclosure are not limited thereto, and the dam 630 can further include more layers of film.

[0106] In some examples, as shown in FIG. 1 and FIG. 2, the part of the conductive structure 100 located in the second area 012 includes a power signal line 110. For example, the power signal line 110 can be a signal line for transmitting at least one of a VDD power signal and a VSS power signal. FIG. 2 schematically shows that the conductive structure 100 includes one layer of structure, but is not limited thereto, and the conductive structure can include multiple layers of structure, and an organic layer or an organic layer and an inorganic layer can be arranged between two adjacent layers of structure in the multiple layers of structure located in the first area. For example, the boundaries of different layers of conductive structure are different. For example, the conductive structure can include three layers of conductive structure, such as a first conductive structure, a second conductive structure and a third conductive structure arranged in sequence in a direction perpendicular to the substrate base plate, the first conductive structure is located between the second conductive structure and the substrate base plate 01, and is located in the conductive structure in the second area, the second conductive structure is located on a side of the first conductive structure away from the display area, the third conductive structure is located on a side of the first conductive structure close to the display area, and the second conductive structure and the third conductive structure both overlap the first conductive structure, and the second conductive structure and the third conductive structure do not overlap. For example, the third conductive structure can include multiple vias to achieve a gas release effect on the organic layer between the substrate base plates. For example, in the above-mentioned three layers of conductive structure, only the first conductive structure overlaps the barrier portion in the direction perpendicular to the substrate base plate. For example, the above-mentioned second conductive structure does not overlap the first inorganic layer. For example, the above-mentioned first conductive structure is in surface contact with the first inorganic layer. For example, the edge of the above-mentioned third conductive structure overlapping the first conductive structure overlaps the first inorganic layer. For example, the above-mentioned one layer of structure can include one layer of metal layer, or can include multiple layers of metal layer arranged in layers, such as a titanium / aluminum / titanium laminated film layer.

[0107] FIG. 2 does not show other film layers between the conductive structure 100 and the substrate base plate 01, such as at least one layer of metal layer, such as structures including a gate of a thin film transistor as a pixel electrode, a gate line electrically connected to the gate, and multiple layers of insulating layer, such as film layers including a gate insulating layer, a buffer layer, an interlayer insulating layer, etc. FIG. 2 omits the structure between the pixel defining pattern and the barrier portion.

[0108] FIG. 3 is a plan view of part of the structure of the second area shown in FIG. 1, and FIG. 4 is a scanning electron microscope image of a cross-sectional view along the AA' line shown in FIG. 3.

[0109] In some examples, as shown in FIG. 1 and FIG. 3, the orthogonal projection of the power signal line 110 on the substrate 01 overlaps with the orthogonal projection of the at least one blocking part 630 on the substrate 01, the part of the power signal line 110 located in the second area 012 extends along the first direction, the part of the at least one blocking part 630 located in the second area 012 includes the strip-shaped blocking part 6300 extending along the second direction, and at least part of the first inorganic layer 210 located in the second area 012 extends along the second direction, the first direction intersects with the second direction. For example, the first direction can be the X direction shown in FIG. 1, and the second direction can be the Y direction shown in FIG. 1. For example, the angle between the first direction and the second direction can be 80-100 degrees. For example, the first direction and the second direction are perpendicular. The embodiments of the present disclosure are not limited to this, and the first direction and the second direction can be interchanged.

[0110] In some examples, as shown in FIG. 3, at least part of the first inorganic layer 210 located in the second area 012 includes at least one inorganic layer pattern 211, the inorganic layer pattern 211 extends along the second direction and covers the edge of the power signal line 110 extending along the first direction. For example, the inorganic layer pattern 211 is in contact with the surface of the power signal line 110. For example, part of the edge of the power signal line 110 is covered by the inorganic layer pattern 211 and the strip-shaped blocking part 6300 at the same time. For example, the edge of the power signal line 110 includes a part covered only by the first inorganic layer 210, a part covered only by the blocking part 630, and a part covered by the first inorganic layer 210 and the strip-shaped blocking part 630 at the same time. For example, the inorganic layer pattern 211 can be a strip-shaped film layer.

[0111] The display substrate provided by the present disclosure sets the first inorganic layer located in part of the display area to form a limiting structure to separate at least one layer of the light-emitting functional layer of adjacent and color-different sub-pixels, achieving the purpose of reducing crosstalk, while the first inorganic layer located in part of the non-display area covers the edge of the power signal line exposed by the blocking part, which can enhance the stringent reliability verification condition of the non-display area and avoid the occurrence of related growing dark spot (GDS) problems.

[0112] In some examples, as shown in FIG. 3, the at least one inorganic layer pattern 211 includes a plurality of inorganic layer patterns 211, the number of strip-shaped blocking parts 6300 is at least one, and the strip-shaped blocking part 6300 and the plurality of inorganic layer patterns 211 are arranged alternately along the first direction. For example, the number of strip-shaped blocking parts 6300 is two, the number of inorganic layer patterns 211 is three, the inorganic layer pattern 211 and the strip-shaped blocking part 6300 are arranged alternately along the first direction, and the inorganic layer pattern 211 is located on both sides of the strip-shaped blocking part 6300.

[0113] In some examples, as shown in FIGS. 3 and 4, the edge of the strip-shaped barrier 6300 covers at least part of the edge of the inorganic layer pattern 211, or the edge of the strip-shaped barrier 6300 is flush with part of the edge of the inorganic layer pattern 211. For example, the edge of the inorganic layer pattern 211 near the strip-shaped barrier 6300 on both sides of the strip-shaped barrier 6300 extends into the strip-shaped barrier 6300, so as to prevent the strip-shaped barrier 6300 and the inorganic layer pattern 211 from being misaligned and exposing part of the conductive structure 100 due to process reasons. For example, the inorganic layer pattern 211 covers the conductive structure 100 exposed by the strip-shaped barrier 6300.

[0114] In some examples, as shown in FIGS. 2 to 4, in a direction perpendicular to the substrate 01, the part of the inorganic layer pattern 211 overlapping with the barrier 630 is located between the first film layer 631 and the second film layer 632. For example, the first film layer 631 and the second film layer 632 can be made of the same material, and there can be no obvious boundary between the first film layer 631 and the second film layer 632 except for the position where the first inorganic layer 210 is arranged. For example, the first inorganic layer 210 has an opening in the barrier 630. The first film layer is schematically shown as including one film layer, but is not limited thereto, and the first film layer can also include two film layers, such as the part of the first organic layer and the part of the second organic layer, and there can be no obvious boundary between the two film layers.

[0115] For example, as shown in FIGS. 2 to 4, the thickness of the first inorganic layer 210 can be 20-100 nanometers. For example, the thickness of the first inorganic layer 210 can be 30-50 nanometers. For example, the thickness of the first inorganic layer 210 can be 40-80 nanometers. For example, the thickness of the first inorganic layer 210 can be 60-90 nanometers.

[0116] For example, as shown in FIG. 3, the number of inorganic layer patterns 211 can be 3, and the size of the inorganic layer pattern 211 in the middle in the first direction is not greater than the size of the inorganic layer patterns 211 on both sides in the first direction. For example, the size of the inorganic layer pattern 211 in the middle in the first direction, such as the width, is about 40 microns, which is determined by the distance between the two strip-shaped barriers 6300. For example, the size of the inorganic layer pattern 211 farthest from the display area in the first direction, such as the width, is about 90 microns, which is determined by the boundary of the first organic layer 510 and the second organic layer 520 on the side farthest from the display area.

[0117] For example, as shown in FIGS. 2 to 4, in a direction perpendicular to the substrate 01, the size of the portion where the inorganic layer pattern 211 overlaps with the strip-shaped barrier portion 6300 in the first direction is 10 to 40 micrometers. For example, the size of the portion where the inorganic layer pattern 211 overlaps with the strip-shaped barrier portion 6300 in the first direction is 15 to 20 micrometers. For example, the size of the portion where the inorganic layer pattern 211 overlaps with the strip-shaped barrier portion 6300 in the first direction is 12 to 18 micrometers. For example, the size of the portion where the edge of the inorganic layer pattern 211 located at the most edge away from the edge of the strip-shaped barrier portion 6300 overlaps with at least one of the first organic layer 510 and the second organic layer 520 in the first direction is 10 to 40 micrometers. For example, the size of the portion where the edge of the inorganic layer pattern 211 located at the most edge away from the edge of the strip-shaped barrier portion 6300 overlaps with at least one of the first organic layer 510 and the second organic layer 520 in the first direction is 15 to 30 micrometers.

[0118] In some examples, as shown in FIGS. 2 to 4, at least one of the plurality of inorganic layer patterns 211 includes a main portion 2111 extending in the second direction and a widened portion 2112 located at at least one side of the main portion 2111 in the first direction, the length of the widened portion 2112 in the second direction is less than the length of the main portion 2111, the width of the widened portion 2112 in the first direction is less than the size of the barrier portion 630, and the widened portion 2112 covers the edge of the power signal line 110 extending in the second direction.

[0119] For example, as shown in FIG. 3, the widened portion 2112 can be located only at the position of the edge of the power signal line 110 to widen the size of the edge of the power signal line 110 covered by the inorganic layer pattern 211, and prevent the process deviation from causing the inorganic layer pattern 211 and the strip-shaped barrier portion 6300 to both expose the edge of the power signal line 110.

[0120] For example, as shown in FIG. 3, the width of the widened portion 2112 in the first direction can be 5 to 20 micrometers. For example, the width of the widened portion 2112 can be 6 to 15 micrometers. For example, the width of the widened portion 2112 can be 7 to 10 micrometers. For example, the width of the widened portion 2112 can be 8 to 12 micrometers.

[0121] For example, as shown in FIG. 4, other structures provided with conductive materials, such as signal lines provided with metal materials, etc. can also be provided between the conductive structure 100 and the substrate 01.

[0122] For example, as shown in FIG. 2, in the first area 011, no other inorganic layer is arranged between the conductive structure 100 and the first inorganic layer 210. For example, in the first area 011, only an organic layer is arranged between the conductive structure 100 and the first inorganic layer 210. For example, the conductive structure can include a multi-layer conductive structure, such as the first conductive structure and the second conductive structure described above. In the first area, only an organic layer is arranged between the first conductive structure and the first inorganic layer, and only an organic layer is arranged between the second conductive structure and the first inorganic layer, such as that an organic layer is arranged between the first conductive structure and the second conductive structure; in the second area, the second conductive structure is in direct contact with the first inorganic layer, and the first conductive structure is in direct contact with the second conductive structure.

[0123] In the research, the inventors of the present application found that when the blocking part intersects with the power signal line included in the conductive structure in the extension direction in the second area, the organic layer on the conductive structure outside the blocking part is completely removed, causing the conductive structure at the position to be exposed, so that the edge of the conductive structure at the position is prone to side etching to form an undercut structure in the subsequent development process, and further causing a major potential risk of crack or micro-crack of the encapsulation layer covering the surface of the conductive structure, and the position is prone to GDSX failure risk in the subsequent reliability environment.

[0124] In order to avoid the side etching of the conductive structure, a passivation layer (PVX) is generally arranged on the side of the conductive structure away from the substrate in the display substrate to cover the conductive structure not covered by the blocking part, so as to protect the side edge of the conductive structure, thereby achieving the purpose of product reliability verification.

[0125] Compared with the display substrate in which the passivation layer (PVX) is arranged on the side of the conductive structure away from the substrate, in an example of the embodiment provided by the present disclosure, the first inorganic layer is used to replace the passivation layer in the general display substrate, so that the first inorganic layer protects the conductive structure exposed by the blocking part (such as the first inorganic layer being in direct contact with the conductive structure) while limiting the film layers of the structure in the compatible display area, thereby saving the mask process for forming the passivation layer, saving the production cost, and improving the production capacity of the backplane circuit.

[0126] FIGS. 5 and 6 are schematic diagrams of partial cross-sectional structures of display substrates provided according to different examples of the embodiment of the present disclosure.

[0127] The display substrate shown in FIG. 5 is different from the display substrate shown in FIG. 2 in that the conductive structure 100 includes different numbers of structure layers, and the organic layer and / or the inorganic layer is arranged between different structure layers included in the conductive structure 100.

[0128] In some examples, as shown in FIG. 5, the conductive structure 100 includes at least two sub-conductive structures 101 arranged in a stack, and between adjacent two of the at least two sub-conductive structures 101, in the partial area of the first area 011, an additional organic layer such as a third organic layer 530 and the second inorganic layer 220 are arranged, and in the second area 012, only the second inorganic layer 220 is arranged between the adjacent two of the at least two sub-conductive structures 101, without the third organic layer. For example, the second inorganic layer 220 can be a passivation layer (PVX). For example, a plurality of inorganic layers or an inorganic layer and other metal layers can be arranged between the adjacent two of the at least two sub-conductive structures 101. For example, the thickness of the second inorganic layer 220 is greater than the thickness of the first inorganic layer 210. FIG. 5 schematically shows two sub-conductive structures 101, but is not limited thereto, and three sub-conductive structures 101 can also be arranged, and an organic layer and / or an inorganic layer is arranged between adjacent two of the three sub-conductive structures 101.

[0129] For example, as shown in FIG. 5, the second inorganic layer 220 can be a passivation layer (PVX) in the general display substrate. When only the passivation layer (corresponding to the second inorganic layer 220 shown in FIG. 5) is arranged in the second area 012 of the general display substrate, and the first inorganic layer 210 is not arranged, the organic layer between the adjacent barrier portions 630 is removed to expose the uppermost sub-conductive structure, in order to prevent the sub-conductive structure from being side-etched, the sub-conductive structure is also patterned and removed, and thus only the film layer other than the organic layer between the second inorganic layer 220 and the substrate 01 is reserved. In the display substrate provided by the present disclosure, by arranging the first inorganic layer 210 away from the substrate 01 side of the sub-conductive structure 100 farthest away from the substrate 01 in the at least two conductive structures 100, the sub-conductive structure 100 farthest away from the substrate 01 in the second area 012 can be reserved, which is beneficial to reduce the resistance of the conductive structure 100 in the second area 012.

[0130] The display substrate shown in FIG. 6 is different from the display substrate shown in FIG. 2 in that the number of film layers included in the conductive structure 100 is different, and an organic layer is arranged between different film layers included in the conductive structure 100.

[0131] In some examples, as shown in FIG. 6, the conductive structure 100 includes at least two sub-conductive structures 100 arranged in a stack, in the first area 011, an organic layer, such as a third organic layer 530, is arranged between adjacent two sub-conductive structures 100 among the at least two sub-conductive structures 100, but no inorganic layer is arranged; in the second area 012, at least part of the above-mentioned adjacent two sub-conductive structures 100 directly contact. In contrast to the general display substrate, a passivation layer is arranged between the above-mentioned adjacent two sub-conductive structures 100 in the first area 011, and no first inorganic layer 210 is arranged on the side of the sub-conductive structure 100 farthest from the substrate 01. The conductive structure 100 in the second area 012 only includes the substrate of the sub-conductive structure 100 among the above-mentioned adjacent two sub-conductive structures 100 located between the inorganic layer and the substrate 01. The display substrate provided by the present disclosure saves the above-mentioned passivation layer between the adjacent two sub-conductive structures 100 to reduce one step of patterning process, and at the same time, the first inorganic layer 210 is arranged on the side of the adjacent two sub-conductive structures 100 farthest from the substrate 01 to protect the adjacent two sub-conductive structures 100 in the second area 012, and the adjacent two sub-conductive structures 100 directly contact, which is conducive to further reducing the resistance of the conductive structure 100 in the second area 012.

[0132] In some examples, as shown in FIG. 1, the substrate 01 includes a fourth area 014, and the fourth area 014 surrounds part of the display area. The orthogonal projection of the part of the fourth area 014 on the substrate 01 is completely located in the orthogonal projection of at least one circle of the blocking part 630 on the substrate 01. However, it is not limited to this. The orthogonal projection of the edge of the power signal line located in the fourth area on the substrate can be completely located in the orthogonal projection of the blocking part on the substrate. For example, the first area 011 is the display area, and the fourth area 014 and the second area 012 constitute a circle of non-display area surrounding the display area. For example, the direction indicated by the arrow in the X direction is upward, the second area 012 is located on the lower side of the display area, and the fourth area 014 is located on the upper side, the left side and the right side of the display area. For example, the blocking part 630 is distributed in the circle of non-display area composed of the fourth area 014 and the second area 012, the blocking part 630 located in the fourth area 014 completely covers the power signal line 110, and the blocking part 630 located in the second area 012 intersects with the power signal line and exposes part of the power signal line 110. The part of the power signal line 110 exposed is covered by the first inorganic layer 210.

[0133] In some examples, as shown in FIG. 1 and FIG. 3, in the direction perpendicular to the substrate 01, the power signal line 110 does not overlap with the first inorganic layer 210 in the portion of the fourth area 014. For example, the power signal line 110 in the fourth area 014 is completely covered by the blocking portion 630, and the first inorganic layer 210 is not disposed in the fourth area 014. For example, in the non-display area outside the display area, only the first inorganic layer 210 is disposed in the lower side (e.g., the pad area) where the second area 012 is located.

[0134] For example, in the fourth area, in the direction perpendicular to the substrate, the power signal line does not overlap with the first inorganic layer, and in the third area, part of the edge of the power signal line is still covered by the blocking portion after being covered by the first inorganic layer.

[0135] In some examples, as shown in FIG. 1 and FIG. 3, the power signal line 110 includes a first power signal line 111 and a second power signal line 112, and only the second power signal line 112 is disposed in the fourth area 014, and the first power signal line 111 and the second power signal line 112 are disposed in the second area 012. For example, the second power signal line 112 can be a VSS power signal line, which can be connected to a voltage source to output a constant voltage signal, such as a negative voltage signal. For example, the second power signal line 112 can also be grounded. For example, the first power signal line 111 can be a VDD power signal line, which can be connected to a voltage source to output a constant voltage signal, such as a positive voltage signal. For example, the first power signal line 111 also includes a portion located in the display area to electrically connect with the pixel circuit 340 included in the sub-pixel 300 to provide a power signal. For example, the second power signal line 112 is located in the non-display area and is disposed around the display area, and the second power signal line 110 can include a portion located in the display area to electrically connect with the second electrode 330 included in the sub-pixel 300.

[0136] FIG. 7 is a schematic diagram of a partial planar structure of the second area shown in FIG. 1.

[0137] For example, as shown in FIG. 1 and FIG. 7, the second area 012 is provided with the first power signal line 111 and the second power signal line 112. For example, the second power signal line 112 is located on both sides of the first power signal line 111 in the second direction. For example, the conductive structure 100 shown in FIG. 3 can be the second power signal line 112, but is not limited thereto, and can also be the first power signal line 111. For example, the power signal line can be electrically connected with the pins of the circuit board through the contact pad located on the side of the blocking portion away from the display area. FIG. 7 schematically shows a fan-out area F electrically connected with the data line (not shown in the figure), which is electrically connected with the pixel circuit of the sub-pixel to provide a data signal.

[0138] FIG. 8 is a schematic view of a pixel arrangement in a display substrate according to an embodiment of the present disclosure. FIGS. 9 and 10 are schematic views of a partial cross-sectional structure of a BB' shown in FIG. 8 according to different examples of an embodiment of the present disclosure.

[0139] For example, as shown in FIG. 8, the sub-pixel 300 can include different color sub-pixels 300, such as a red sub-pixel emitting red light, a green sub-pixel emitting green light, and a blue sub-pixel emitting blue light. The area of the light emitting region of one blue sub-pixel is greater than the area of the light emitting region of one red sub-pixel, and the area of the light emitting region of one red sub-pixel is greater than the area of the light emitting region of one green sub-pixel. For example, the red sub-pixels and the blue sub-pixels are alternately arranged in the row direction and the column direction, and the blue sub-pixels are arranged in an array in the row direction and the column direction. The first pixel row including the red sub-pixels and the second pixel row including the green sub-pixels are alternately arranged in the column direction, and the first pixel row and the second pixel row are staggered in the row direction. FIG. 8 schematically shows one arrangement of the plurality of sub-pixels, but is not limited thereto. The plurality of sub-pixels can also use other arrangements.

[0140] For example, as shown in FIGS. 9 and 10, the sub-pixel 300 further includes a pixel circuit 340, such as a plurality of transistors and at least one capacitor. For example, the pixel circuit 340 can be a 7T1C, 8T1C, 2T1C, 3T1C, or the like structure, and the present disclosure does not limit the same. The actual needs of the display substrate can be set. FIGS. 9 and 10 schematically show that the conductive structure 100 is part of the pixel circuit 340, but is not limited thereto.

[0141] For example, as shown in FIGS. 9 and 10, the first inorganic layer 210 and the first organic layer 510 are both located between the first electrode 320 of the sub-pixel 300 and the substrate 01, and the first organic layer 510 includes a via 5101, such as an anode via 5101. The first electrode 320 of the sub-pixel 300 is electrically connected to the pixel circuit 340 through the via 5101. For example, the first inorganic layer 210 includes an opening exposing the via 5101 of the first organic layer 510 to form a sleeve hole design.

[0142] In the research, the inventors of the present application found that, as shown in FIG. 9, similar to the structural features of the above-mentioned limiting structure 400, the edge of the first inorganic layer 210 located at the edge of the anode via 5101 protrudes relative to the edge of the first organic layer 510. Therefore, the first electrode 320 of the sub-pixel 300 is prone to breakage during the lapping process with the sleeve hole formed by the first inorganic layer 210 and the first organic layer 510 through the pixel circuit 340, such as the conductive structure 100. This further causes display mura or pixel dark spots when the display substrate is used for display.

[0143] In some examples, as shown in FIG. 10, the first inorganic layer 210 covers at least part of the inner wall of the above-mentioned anode via hole 5101 of the first organic layer 510 to prevent the first electrode 320 of the sub-pixel 300 from being broken during the lapping process with the pixel circuit 340. For example, the first inorganic layer 210 wraps the anode via hole 5101 formed by the surface of the first organic layer 510 originally exposed by the first inorganic layer 210 as shown in FIG. 9.

[0144] For example, FIG. 10 schematically shows that the first inorganic layer 210 can cover the entire inner wall of the anode via hole 5101, at this time, the position where the first organic layer 510 contacts the first inorganic layer 210 can not form the loss caused by etching, but not limited thereto, the first inorganic layer 210 can cover part of the inner wall of the anode via hole 5101 away from the substrate 01.

[0145] For example, as shown in FIG. 10, the size d, such as the thickness, of the part of the sidewall of the anode via hole 5101 where the first inorganic layer 210 is located is greater than 1 micrometer. For example, compared to the general display substrate, when the first inorganic layer does not cover the inner wall of the anode via hole, the size of the anode via hole in the first organic layer is a, and in the embodiment of the present disclosure, the size of the anode via hole in the first organic layer whose inner wall is covered by the first inorganic layer is greater than a. For example, the size of the anode via hole in the first organic layer whose inner wall is covered by the first inorganic layer can be 2-3 micrometers.

[0146] FIGS. 9 and 10 only schematically show the structure between the first electrode 320 of the sub-pixel 300 and the substrate 01, and the side of the first electrode 320 away from the substrate 01 is also provided with structures such as the light-emitting functional layer 310, the second electrode 330, the pixel definition pattern 5200, etc. as shown in FIG. 2.

[0147] For example, in the first area, the first inorganic layer and the layer of the insulating layer in direct contact therewith, such as the first organic layer, can only be provided with the first inorganic layer in one area of the first area, such as the anode via hole shown in FIG. 10, and can only be provided with the first organic layer in another area of the first area, such as between adjacent sub-pixels.

[0148] In some examples, as shown in FIG. 1, the substrate 01 also includes a third area 013, and the third area 013 includes part of the non-display area. For example, the first area 011 surrounds the third area 013. For example, the third area 013 includes a light-transmitting area and a non-light-transmitting area, and the light-transmitting area is used to set a light sensor, such as an infrared sensor, an ultrasonic sensor, a LIDAR (Light Detection and Ranging) sensor, a radar sensor, a camera, a distance sensor, but not limited thereto; and the non-light-transmitting area surrounds the light-transmitting area. For example, the third area 013 can also be referred to as an AA hole area.

[0149] FIG. 11 is a schematic view of a plan structure of the first area and the third area of the display substrate shown in FIG. 1. FIG. 12 is a schematic view of a partial plan structure of the third area shown in FIG. 11. FIG. 13 is a schematic view of a partial cross-sectional structure of the display substrate shown in FIG. 12 in an example. The structure shown in FIG. 12 can be the structure of the leftmost part shown in FIG. 11. FIGS. 13-17 omit the blocking part between the first isolation column and the second isolation column.

[0150] In some examples, as shown in FIGS. 11-13, the part of the conductive structure 100 located in the third area 013 includes at least one annular first isolation column 610, which does not overlap the first organic layer 510 in a direction perpendicular to the substrate 01. For example, the first isolation column 610 does not overlap the first inorganic layer 210 in a direction perpendicular to the substrate 01. However, the first inorganic layer may, for example, coat the sidewall of the first isolation column to avoid problems such as the broken cathode connecting with the metal layer included in the first isolation column, leading to water and oxygen intrusion.

[0151] For example, FIGS. 12 and 13 schematically show that the part of the conductive structure 100 located in the third area 013 includes four annular first isolation columns 610, and multiple annular first isolation columns 610 can be arranged at equal intervals. However, the number of first isolation columns can also be one, two, or three, etc. For example, the conductive structure 100 can include at least one sub-conductive structure, and one of the sub-conductive structures includes the first isolation column 610.

[0152] For example, as shown in FIG. 11, the third area 013 can include multiple light-transmitting areas 0130, such as three light-transmitting areas 0130, but the third area 013 can also include one light-transmitting area 0130. For example, one annular first isolation column 610 can surround at least one light-transmitting area 0130. For example, different first isolation columns 610 can surround the same light-transmitting area 0130 or different light-transmitting areas 0130.

[0153] In some examples, as shown in FIGS. 11-13, the first area 011 is adjacent to at least part of the edge of the third area 013 or the third area 013 is adjacent to at least part of the edge of the first area 011, and includes a second isolation column 620. For example, the third area 013 is provided with a second isolation column 620 adjacent to at least part of the edge of the first area 011. For example, the third area 013 is also provided with at least one annular blocking part 630, which has the same function as the blocking part 630 shown in FIG. 3.

[0154] For example, B1 in FIG. 11 represents the boundary of the light-emitting layer formed by using a fine metal mask (FMM) in the light-emitting functional layer 310, and B2 represents the boundary of the first inorganic layer 210 located in the third region 013, and other common film layers in the light-emitting functional layer 310 entirely cover the third region 013, and the second electrode 330 of the sub-pixel 300 entirely covers the third region 013. For example, B3 in FIG. 12 represents the boundary of the second organic layer 520, and B4 represents the boundary of the first organic layer 510, and the first organic layer 510 is arranged only in the blocking part 630 closest to the second isolation column 620 between the two B4 boundaries.

[0155] For example, when only one light-transmitting region 0130 is arranged in the third region 013, the second isolation column 620 can be arranged at all edges of the third region 013 close to the first region 011, such as the second isolation column 620 surrounding the first isolation column 610. For example, when multiple light-transmitting regions 0130 are arranged in the third region 013, the second isolation column 620 is arranged not only at the edges of the third region 013 close to the first region 011, but also between adjacent two light-transmitting regions 0130, and each light-transmitting region 0130 is surrounded by the second isolation column 620.

[0156] In some examples, as shown in FIG. 13, the second isolation column 620 includes a stacked structure formed by the first inorganic layer 210 and the first organic layer 510, and the edge of the first inorganic layer 210 in the second isolation column 620 includes a first protruding part 621 protruding relative to at least part of the edge of the first organic layer 510, and the first isolation column 610 and the second isolation column 620 are configured to isolate the light-emitting functional layer 310 and the second electrode 330, or the first isolation column 610 and the second isolation column 620 are configured to isolate the light-emitting functional layer 310.

[0157] FIGS. 14 to 16 are process step diagrams of forming the display substrate shown in FIG. 13.

[0158] For example, as shown in FIG. 14, after the pre-isolation column 6100 arranged in the same layer as the power signal line 110 is patterned, a first organic material layer covering the pre-isolation column 6100 is formed, and the first organic material layer is patterned to form the first organic layer 510, and the process of patterning the first organic material layer includes removing the first organic material layer covering the surface of the pre-isolation column 6100 and forming the anode via hole 5101 shown in FIG. 10. The above-mentioned pre-isolation column 6100 is a structure before the first isolation column 610 is etched, and the edges of each film layer (such as each film layer in a three-layer structure, which can include a titanium / aluminum / titanium structure) in the pre-isolation column 6100 are substantially flush, and no protruding part for isolating the light-emitting functional layer 310 or the second electrode 330 is included.

[0159] For example, as shown in FIG. 15, a first inorganic material layer 2100 is formed on the pre-isolation column 6100 and the first organic layer 510, which can be an integral film layer.

[0160] For example, as shown in FIG. 16, the first inorganic material layer 2100 is patterned to form the defined structure 400 located in the first area 011 and the second isolation column 620 located at the edge of the third area 013. In the process of patterning the first inorganic material layer 2100, the first organic layer 510 in contact with the surface thereof will be etched to a certain extent, resulting in a loss, and then the position where the first organic layer 510 is in contact with the first inorganic layer 210 forms an undercut structure, and the part of the first inorganic layer 210 protruding relative to the first organic layer 510 is the protruding part.

[0161] In the research, the inventors of the present application found that in the display substrate provided with the first inorganic layer 210, in the dry etching process of patterning and removing the first organic material layer on the pre-isolation column, the sidewall of the pre-isolation column will be side-etched to a certain extent, so that in the process of removing the first inorganic material layer on the pre-isolation column, a part of the inorganic material 0210 will remain at the position where the sidewall of the pre-isolation column is side-etched, resulting in the inability to form the first isolation column 610 with the undercut morphology shown in FIG. 13. Therefore, an additional etching process is needed to remove the inorganic material remaining on the sidewall of the pre-isolation column. For example, in the process of etching to form the first electrode 320 after forming the first inorganic layer 210, the pre-isolation column can be etched to form the first isolation column 610.

[0162] For example, as shown in FIGS. 11-13, while the first isolation column 610 formed by the conductive structure 100 is provided in the third area 013, the second isolation column 620 formed by the first inorganic layer 210 and the first organic layer 510 is provided, which is beneficial to further isolate the common film layer in the light-emitting functional layer 310 between the third area 013 and the first area 011 and the second electrode 330 provided in the whole surface shared by the plurality of sub-pixels 300, so as to better ensure the reliability verification of the AA hole area in the reliability process.

[0163] FIG. 17 is a schematic diagram of a partial cross-sectional structure of the display substrate shown in FIG. 12 in another example. The difference between the cross-sectional structure of the display substrate shown in FIG. 17 and the cross-sectional structure of the display substrate shown in FIG. 13 is that the structure of the second isolation column 620 is different.

[0164] In some examples, as shown in FIG. 17, in at least one of the second isolation columns 620, the first organic layer 510 is provided with a first recess 511, the first inorganic layer 210 includes an opening 2110 exposing the first recess 511, and the second organic layer 520 includes a first covering portion 521 covering the first recess 511 and an edge of the first inorganic layer 210 close to the first recess 511.

[0165] The display substrate provided by the present disclosure has the advantages of facilitating water vapor outgassing of the first organic layer and preventing peeling of the first inorganic layer in the second isolation column from the first organic layer due to poor adhesion.

[0166] For example, as shown in FIG. 17, one second isolation column 620 can be provided with one opening 2110, or can be provided with multiple openings 2110. For example, the opening 2110 can have a closed annular shape to surround the light transmission region. For example, the opening 2110 can have a non-closed annular shape, such as multiple small openings arranged at intervals. For example, the openings 2110 provided by different second isolation columns 620 can have the same shape or different shapes. For example, when the openings 2110 provided by different second isolation columns 620 are all closed annular shapes, the widths of the different openings 2110 in different second isolation columns 620 can be the same or different.

[0167] For example, as shown in FIG. 17, the size of the opening 2110 of the first inorganic layer 210 exposing the first recess 511 can be the same as or different from the size of the first recess 511, such as the size of the opening 2110 being smaller than the size of the first recess 511.

[0168] For example, as shown in FIG. 17, in a direction perpendicular to the substrate 01, the first covering portion 521 does not overlap the first protruding portion 621. For example, in a direction perpendicular to the substrate 01, the first covering portion 521 does not overlap the spacing between adjacent second isolation columns 620.

[0169] For example, as shown in FIG. 17, the minimum distance between the surface of the first organic layer 510 away from the substrate 01 and the surface of the conductive structure 100 away from the substrate 01 is 1.7-1.9 microns, such as 1.8 microns. For example, the maximum thickness of the first organic layer 510 directly above the conductive structure 100 is 2-2.2 microns, such as 2.1 microns.

[0170] For example, as shown in FIG. 17, the first organic layer 510 included in the plurality of second isolation columns 620 can be a structure provided integrally, and the first organic layer 510 included in the plurality of second isolation columns 620 includes portions separated from each other.

[0171] FIGS. 18 and 19 are schematic diagrams of partial cross-sectional structures of a third area of the display substrate shown in FIG. 1 in different examples. The cross-sectional structures of the display substrate shown in FIGS. 18 and 19 differ from the cross-sectional structure of the display substrate shown in FIG. 13 in that the structures of the first isolation columns 610 are different.

[0172] In some examples, as shown in FIG. 18, the first isolation column 610 includes the first isolation layer 611 and the second isolation layer 612 provided in layers, and the second isolation layer 612 is located on a side of the first isolation layer 611 away from the substrate 01; the portion of the first organic layer 510 located in the third area 013 includes the first isolation layer 611, the portion of the first inorganic layer 210 located in the third area 013 includes the second isolation layer 612, and the second isolation layer 612 is provided protruding relative to the edge of the first isolation layer 611 to form a second protruding portion 613. For example, the first isolation column 610 and the second isolation column 620 shown in FIG. 18 are both located in the third area 013.

[0173] Compared with the formation of the first isolation column 610 using the conductive structure 100 shown in FIGS. 13 to 17, in this example, the first inorganic layer 210 is used to replace the original passivation layer to save one step of mask (such as PVX mask), and the first isolation column 610 formed by the first inorganic layer 210 and the first organic layer 510 provided in layers is used to replace the first isolation column 610 formed by the conductive structure 100, which can avoid the problem that the first inorganic layer 210 is prone to being left on the first isolation column 610, thereby further reducing one step of mask process, such as a hole mask process.

[0174] For example, as shown in FIG. 18, the maximum distance between the surface of the first organic layer 510 located directly above the conductive structure 100 away from the substrate 01 and the surface of the conductive structure 100 away from the substrate 01 is 2-2.2 microns, such as 2.1 microns. For example, the minimum distance between the surface of the first organic layer 510 located directly above the conductive structure 100 away from the substrate 01 and the surface of the conductive structure 100 away from the substrate 01 is 1.7-1.9 microns, such as 1.8 microns. For example, the thickness of the portion of the first organic layer 510 serving as the second isolation column 620 can be 0.2-0.4 microns, such as 0.3 microns.

[0175] For example, as shown in FIG. 18, the thickness of the first isolation layer 611 can be 2-2.2 microns, such as 2.1 microns.

[0176] For example, as shown in FIG. 18, the first isolation layer 611 of one of the first isolation columns 610 closest to the second isolation column 620 and the first organic layer 510 can be integrally arranged. For example, the distance between the second isolation layer 612 of one of the first isolation columns 610 closest to the second isolation column 620 and the conductive structure 100 can be 3.9-4.1 microns, such as 4 microns. For example, the distance between the second isolation layers 612 of adjacent first isolation columns 610 can be 9.5-10.5 microns, such as 10 microns.

[0177] For example, in other examples, referring to FIG. 18, a third organic layer is further arranged between the first organic layer 510 and the substrate substrate 01, the third organic layer is located in the portion of the third area 013 including the first isolation layer 611, the first inorganic layer 210 is located in the portion of the third area 013 including the second isolation layer 612, and the second isolation layer 612 is arranged protruding relative to the edge of the first isolation layer 611 to form a second protruding portion 613. In this example, the third organic layer between the first organic layer 510 and the substrate substrate 01 in the second isolation column 620 has been removed, and the first isolation column 610 uses an organic layer different from that in the second isolation column 620 as the first isolation layer 611. For example, the materials of the first organic layer and the third organic layer can be the same. For example, when the third organic layer is used as the first isolation layer 611, the thickness of the first isolation layer 611 is less than when the first organic layer 510 is used as the first isolation layer 611. For example, when the third organic layer is used as the first isolation layer 611, the thickness of the first isolation layer 611 can be 1.4-1.6 microns, such as 1.5 microns; or can be 0.7-0.9 microns, such as 0.8 microns.

[0178] In some examples, as shown in FIG. 19, the first isolation layer 611 is provided with a second groove 614 on the side away from the substrate substrate 01, and the second isolation layer 612 exposes the second groove 614; the display substrate further includes a second organic layer 520 located on the side of the first inorganic layer 210 away from the substrate substrate 01, and the second organic layer 520 includes a second covering portion 522 covering at least the second groove 614.

[0179] In the display substrate provided by the present disclosure, by arranging the second groove in the first isolation layer included in the first isolation column, and using the second covering portion to cover the second groove and the edge of the second isolation layer close to the second groove, not only is it beneficial to realize the water vapor outgassing of the first isolation layer, but also can prevent the peeling problem caused by poor adhesion between the first isolation layer and the second isolation layer in the first isolation column.

[0180] For example, FIG. 19 schematically shows that the first isolation column 610 is covered by the second covering part 522 while the second isolation column 620 is covered by the first covering part 521, so that water vapor discharge of the organic layer in the first isolation column 610 and the second isolation column 620 can be achieved while the inorganic layer in the first isolation column 610 and the second isolation column 620 is prevented from being peeled off. Of course, the embodiments of the present disclosure are not limited thereto, and the second isolation column 620 can also be as shown in FIG. 18 while the first isolation column 610 is covered by the second covering part 522.

[0181] FIG. 20 is a schematic view of a crack of the encapsulation layer at the boundary of the first inorganic layer. FIG. 21 is a scanning electron microscope view of a crack of the encapsulation layer at the boundary of the first inorganic layer. The structure shown in FIG. 20 can be located at a position of the first isolation column 610 close to the first area 011 in the third area 013, or can be located at an edge of the second area 012 far away from the first area 011.

[0182] For example, as shown in FIG. 20 and FIG. 21, the edge etching of the first inorganic layer 210 can cause loss to the first organic layer 510 thereunder, so that the first inorganic layer 210 includes a protruding part protruding from the edge of the second inorganic layer 220, and the part of the first inorganic layer 210 protruding from the edge of the first organic layer 510 is not covered by the second organic layer 520, and is prone to crack when the encapsulation layer 700 is deposited at the edge of the first inorganic layer 210, forming a crack area 701.

[0183] FIG. 22 and FIG. 23 are structural views of different examples of the embodiments of the present disclosure at the position shown in FIG. 20.

[0184] In some examples, as shown in FIG. 12 and FIG. 22, the encapsulation layer 700 is located at a side of the second organic layer 520 far away from the substrate 01, the first inorganic layer 210 covers the part of the first organic layer 510 farthest from the edge of the first area 011 and protruding from the edge of the first organic layer 510, the part is covered by the second organic layer 520, and the encapsulation layer 700 covers the edge of the second organic layer 520. For example, the first organic layer 510 and the first inorganic layer 210 shown in FIG. 22 are stacked to form the second isolation column 620 located in the third area 013.

[0185] In some examples, as shown in FIG. 3 and FIG. 22, the encapsulation layer 700 is located at a side of the second organic layer 520 far away from the substrate 01, the first inorganic layer 210 covers the part of the first organic layer 510 farthest from the edge of the first area 011 and protruding from the edge of the first organic layer 510, the part is covered by the second organic layer 520, and the encapsulation layer 700 covers the edge of the second organic layer 520. For example, the second organic layer 520 shown in FIG. 22 can be a part of the blocking part 630.

[0186] For example, the encapsulation layer 700 can include multiple film layers arranged in a stack, such as an inorganic encapsulation layer, an organic encapsulation layer, and an inorganic encapsulation layer arranged in a stack in sequence.

[0187] In the display substrate provided by the present disclosure, by covering the portion of the first inorganic layer protruding relative to the edge of the first organic layer with the second organic layer, the encapsulation layer can be prevented from breaking at the portion of the first inorganic layer protruding relative to the edge of the first organic layer.

[0188] In some examples, as shown in FIG. 23, the first inorganic layer 210 includes multiple notches 212 exposing the first organic layer 510, and the second organic layer 520 fills the multiple notches 212. For example, the first organic layer 510 includes multiple recesses 513, the first inorganic layer 210 includes multiple notches 212 exposing the multiple recesses 513, and the second organic layer 520 fills the multiple recesses 513.

[0189] In research, the inventors of the present disclosure found that when a large-area first organic layer is arranged between the first inorganic layer and the substrate of the display substrate, on the one hand, the water vapor discharge of the first organic layer is not facilitated, and on the other hand, the adhesion between the first inorganic layer and the first organic layer is poor, and the first inorganic layer is prone to peeling. The display substrate provided by the present disclosure, as shown in FIG. 23, by arranging notches in the first inorganic layer covering the large-area first organic layer to expose part of the first organic layer, facilitates the water vapor discharge of the first organic layer; at the same time, the second organic layer located on the side of the first inorganic layer away from the first organic layer fills the notches of the first inorganic layer, which facilitates the lamination of the first organic layer and the second organic layer and solves the problem of peeling of the first inorganic layer.

[0190] FIGS. 24 and 25 are schematic diagrams of the partial structure of the bending area in the display substrate shown in FIG. 1 in different examples.

[0191] In some examples, as shown in FIGS. 1, 24, and 25, the substrate 01 includes a bending area 015, and the display substrate includes the substrate 01, the conductive structure 100, the first organic layer 510, the first inorganic layer 210, the second organic layer 520, and the encapsulation layer 700 arranged in a stack, and the conductive structure 100, the first inorganic layer 210, the first organic layer 510, and the second organic layer 520 are configured to be bendable at the part of the bending area 015. For example, the bending area 015 can overlap with part of the second area 012. FIGS. 24 and 25 schematically show the topography of the structure in the bending area in the bent state, but are not limited thereto, and the structure in the bending area can also be in a non-bent state.

[0192] In the research, the inventors of the present application found that for some medium and large size display devices, or display devices applied to mobile phones, the folding design is adopted in the bending area 015. When the bending area 015 is provided with a first inorganic layer 210 with a large area and the display device in the bending area 015 is bent, the first inorganic layer 210 and the first organic layer 510 are prone to peeling as shown in FIG. 24 due to the inability to release stress, and the first inorganic layer 210 and the second organic layer 520 are also prone to peeling similar to that shown in FIG. 24.

[0193] In some examples, as shown in FIG. 25, the part of the first inorganic layer 210 located in the bending area 015 includes an opening 2113, the part of the first organic layer 510 located in the bending area 015 includes a third groove 512, and the second organic layer 520 fills the opening 2113 and the third groove 512.

[0194] The display substrate provided by the present disclosure is provided by patterning the first inorganic layer in the bending area to include a plurality of openings exposing the first organic layer, and the second organic layer is in contact with the first organic layer through the plurality of openings, so that the organic layers on both sides of the first inorganic layer are adhered through the plurality of openings. While achieving the release of water vapor of the first organic layer and reducing the peeling probability of the first inorganic layer, it is also beneficial to release the bending force through the openings to improve the reliability and folding effect of the flexible display substrate.

[0195] For example, as shown in FIG. 25, the bending area 015 can be within 3 mm on both sides of the bending line of the display substrate. For example, the shape of the orthographic projection of the opening 2113 on the substrate 01 can be a regular shape such as a circle, an ellipse, a rectangle, a strip, etc., or an irregular shape. For example, the plurality of openings 2113 are uniformly arranged.

[0196] The display substrate provided by the present disclosure can be designed differently for the first inorganic layer in different regions. At least one layer of the light-emitting functional layer of the adjacent and differently colored sub-pixels in the display area can be blocked to reduce crosstalk. Meanwhile, the original passivation layer covering the power signal line is replaced between the adjacent blocking portions in the non-display area. On the basis of reducing one step of the patterning process and reducing the cost, the passivation layer can be used to solve the growing dark spot (GDS) problem in the reliability verification process of the region, which is beneficial to the product yield improvement and quality control, and / or, the second isolation column formed by the first inorganic layer and the first organic layer is additionally arranged at a position other than the first isolation column formed by the conductive structure in the non-display area, so as to further block the common film layer in the light-emitting functional layer and the second electrode of the sub-pixel, which is beneficial to improving the isolation column power-off effect of the non-display area and reducing the growing dark spot (GDS) problem prone to occur in the reliability process, and / or, the first isolation column formed by the first inorganic layer and the first organic layer or other organic layer is used to replace the first isolation column formed by the original conductive structure, so as to save one step of the patterning process for removing the inorganic material remaining on the sidewall of the pre-designed isolation column formed by the conductive structure, and / or, the opening exposing the first organic layer is arranged in the first inorganic layer to release water vapor while preventing the first inorganic layer from being peeled off, and / or, the second organic layer is used to cover the part of the first inorganic layer protruding relative to the edge of the first organic layer to prevent the encapsulation layer from being broken at the edge of the first organic layer, and / or, the first inorganic layer is arranged on the inner wall of the anode via hole formed by the first organic layer to prevent the pixel dark spot or display uneven phenomenon caused by the breakage of the first electrode (such as the anode) at the edge of the anode via hole.

[0197] Another display substrate is provided in the embodiments of the present disclosure. Referring to FIGS. 1-7, the display substrate includes a substrate 01, an inorganic layer 210 on the substrate 01, a conductive structure 100, and at least one blocking portion 630. The substrate 01 includes a display area 031 and a non-display area 032 surrounding the display area 031; the inorganic layer 210 is located on the display area 031 and the non-display area 032 of the substrate 01; the conductive structure 100 is located between the inorganic layer 210 and the substrate 01, and the conductive structure 100 includes a power signal line 110; the at least one blocking portion 630 is located in the non-display area 032 and surrounds the display area 031, and the blocking portion 630 is located on a side of the conductive structure 100 away from the substrate 01. The inorganic layer 210, the conductive structure 100, and the blocking portion 630 in the display substrate provided by the present embodiment can have the same features as the first inorganic layer 210, the conductive structure 100, and the blocking portion 630 in the display substrate provided by the above-mentioned embodiments.

[0198] Referring to FIGS. 1-7, the non-display region 032 includes a first non-display region 0321 located at one side of the display region 031, the portion of the power signal line 110 located in the first non-display region 0321 extends in the first direction, the portion of the blocking portion 630 located in the first non-display region 0321 includes a strip-shaped blocking portion 6300 extending in the second direction and overlapping the power signal line 110, and the portion of the inorganic layer 210 located in the first non-display region 0321 includes an inorganic layer pattern 211 extending in the second direction. In a direction perpendicular to the substrate 01, an edge of the strip-shaped blocking portion 6300 overlaps at least a portion of an edge of the inorganic layer pattern 211. For example, in a direction perpendicular to the substrate 01, an edge of the strip-shaped blocking portion 6300 completely overlaps an edge of the inorganic layer pattern 211. The first direction and the second direction in the present embodiment can have the same characteristics as the first direction and the second direction in the above-described embodiments, respectively. The inorganic layer pattern 211, the strip-shaped blocking portion 6300, and the overlapping relationship therebetween in the display substrate provided by the present embodiment can be the same as the inorganic layer pattern 211, the strip-shaped blocking portion 6300, and the overlapping relationship therebetween in the display substrate provided by the above-described embodiments. The display region 031 and the first non-display region 0321 in the display substrate provided by the present embodiment can be the first region 011 and the second region 012 in the display substrate provided by the above-described embodiments, respectively.

[0199] The display substrate provided by the present disclosure is advantageous in covering the edge of the power signal line to prevent etching or other adverse effects from occurring to the edge of the power signal line by providing the inorganic layer including the inorganic layer pattern in the first non-display region where the extension direction of the power signal line intersects the extension direction of the strip-shaped blocking portion.

[0200] For example, the inorganic layer provided by the present disclosure can replace the passivation layer in the above-described display substrate to save one step of patterning process.

[0201] In some examples, referring to FIGS. 1-7, the non-display region 032 includes a second non-display region 0322 surrounding the display region 031, and the portion of the power signal line 110 located in the second non-display region 0322 has a footprint on the substrate 01 completely within the footprint of at least one circle of the blocking portion 630 on the substrate 01. The second non-display region 0322 in the present embodiment can be the fourth region 014 in the above-described embodiments, and the relationship between the portion of the power signal line 110 located in the second non-display region 0322 and the blocking portion 630 in the display substrate provided by the present embodiment can be the same as the relationship between the portion of the power signal line 110 located in the fourth region 014 and the blocking portion 630 in the display substrate provided by the above-described embodiments.

[0202] In some examples, referring to FIGS. 1-7, in a direction perpendicular to the substrate 01, the power signal line 110 does not overlap the inorganic layer 210 at the portion of the second non-display area 0322. The display substrate provided in the present embodiment can have the same overlapping relationship between the power signal line 110 at the portion of the second non-display area 0322 and the inorganic layer 210 as the display substrate provided in the above-mentioned embodiments has between the power signal line 110 at the portion of the fourth area 014 and the first inorganic layer 210.

[0203] In some examples, referring to FIGS. 1-7, the power signal line 110 includes a first power signal line 111 and a second power signal line 112, and only the second power signal line 112 is arranged in the second non-display area 0322, and the first power signal line 111 and the second power signal line 112 are arranged in the first non-display area 0321. The first power signal line 111 and the second power signal line 112 in the present embodiment can have the same features as the first power signal line 111 and the second power signal line 112 in the above-mentioned embodiments, respectively. The display substrate provided in the present embodiment can have the same distribution of the first power signal line 111 and the second power signal line 112 in the first non-display area 0321 and the second non-display area 0322 as the display substrate provided in the above-mentioned embodiments has in the second area 012 and the fourth area 014.

[0204] In some examples, referring to FIGS. 1-7, the at least one inorganic layer pattern 211 includes a plurality of inorganic layer patterns 211, and the number of the strip-shaped barrier portions 6300 is at least one, and the strip-shaped barrier portions 6300 and the plurality of inorganic layer patterns 211 are arranged alternately in the first direction. The display substrate provided in the present embodiment can have the same alternating arrangement relationship between the inorganic layer patterns 211 and the strip-shaped barrier portions 6300 as the display substrate provided in the above-mentioned embodiments has. For example, the display substrate provided in the present embodiment can have the same shape and size of the inorganic layer patterns as the display substrate provided in the above-mentioned embodiments has.

[0205] In some examples, referring to FIGS. 1-7, the inorganic layer pattern 211 covers the edge of the power signal line 110 extending in the first direction. The display substrate provided in the present embodiment can have the same covering relationship between the inorganic layer pattern 211 and the edge of the power signal line 110 as the display substrate provided in the above-mentioned embodiments has.

[0206] In some examples, referring to FIGS. 1-7, the display substrate further includes a first organic layer 510 between the inorganic layer and the base substrate 01, a portion of the first organic layer 510 in the display area includes a planarization layer (PLN), a portion of the first organic layer 510 in the non-display area 032 includes a first film layer 631 of the barrier portion 630, and the inorganic layer pattern 211 overlaps an edge of the first film layer 631 in a direction perpendicular to the base substrate 01. The first organic layer 510 in the display substrate provided in the present embodiment has the same characteristics as the first organic layer 510 in the display substrate provided in the above-mentioned embodiments, which is located in the planarization layer in the first area 011 and the first film layer 631 of the barrier portion 630 in the second area 012.

[0207] In some examples, referring to FIGS. 1-7, the display substrate further includes a second organic layer 520 on a side of the inorganic layer 210 away from the base substrate 01, a portion of the second organic layer 520 in the non-display area 032 includes a second film layer 632 of the barrier portion 630, the second film layer 632 is on a side of the first film layer 631 away from the base substrate 01, and in a direction perpendicular to the base substrate 01, the inorganic layer pattern 211 overlaps between the first film layer 631 and the second film layer 632. The second film layer 632 of the barrier portion 630 in the non-display area 032 in the second organic layer 520 in the present embodiment has the same characteristics as the second film layer 632 of the barrier portion 630 in the second area 012 in the second organic layer 520 in the above-mentioned embodiments, and the positional relationship between the inorganic layer pattern 211, the first film layer 631, and the second film layer 632 in the display substrate provided in the present embodiment has the same characteristics as the positional relationship between the inorganic layer pattern 211, the first film layer 631, and the second film layer 632 in the display substrate provided in the above-mentioned embodiments.

[0208] FIG. 26 is a schematic diagram of a partial cross-sectional structure of a non-display area of a display substrate provided in an embodiment of the present disclosure.

[0209] In some examples, as shown in FIG. 26, the display substrate further includes an encapsulation layer 700 on a side of the second organic layer 520 away from the base substrate 01, the encapsulation layer 700 includes a portion in contact with the barrier portion 630 and a portion in contact with the inorganic layer. The encapsulation layer in the display substrate provided in the present embodiment can have the same characteristics as the encapsulation layer in the display substrate provided in the above-mentioned embodiments.

[0210] The structures provided in the display area in the embodiments of the present disclosure can be the same as the structures provided in the display area in the above-mentioned embodiments, such as the sub-pixel 300, the pixel definition pattern 5200, the limiting structure 400, and the like.

[0211] The display substrate provided by the present disclosure can be designed differently for the inorganic layers in the display area and the non-display area. At least one layer of the light-emitting functional layer of the adjacent and differently colored sub-pixels in the display area can be blocked to reduce crosstalk, and the conductive structure in the non-display area can be covered by the original passivation layer to reduce one step of the patterning process.

[0212] The display substrate provided by the present embodiment can be the same display substrate as the display substrate provided by the above-mentioned embodiments, or can be a different display substrate with different features in the non-display area. For example, the display substrate provided by the present embodiment can include the third area in the above-mentioned embodiments, or can not include the third area in the above-mentioned embodiments. For example, only the first isolation column in the above-mentioned embodiments can be provided in the present embodiment, or the first isolation column and the second isolation column in the above-mentioned embodiments can be provided at the same time. For example, the first isolation column formed by the conductive structure in the above-mentioned embodiments can be used in the present embodiment, or the first isolation column formed by the lamination of the first inorganic layer and the first organic layer in the above-mentioned embodiments can be used in the present embodiment. For example, in the display area, the sidewall of the anode via included in the planarization layer in the present embodiment can be covered by the inorganic layer, or can not be covered by the inorganic layer. For example, the display substrate provided by the present embodiment can include the bending area in the above-mentioned embodiments, or can not include the bending area in the above-mentioned embodiments.

[0213] Another embodiment of the present disclosure provides a display substrate. FIG. 27 is a schematic diagram of a partial cross-sectional structure of a display substrate provided by an example according to an embodiment of the present disclosure. FIG. 27 omits the structure between the blocking portion and the edge position of the first inorganic layer prone to fracture.

[0214] As shown in FIG. 27, the display substrate includes a substrate 01, a first inorganic layer 210, a first organic layer 510, a second organic layer 520, and a conductive structure 100 on the substrate 01. The substrate 01 includes a first sub-area 021 and a second sub-area 022; the first inorganic layer 210 is located on the first sub-area 021 and the second sub-area 022 of the substrate 01; the first organic layer 510 is located between the film layer where the first inorganic layer 210 is located and the substrate 01; the second organic layer 520 is located on the side of the film layer where the first inorganic layer 210 is located away from the substrate 01; and the conductive structure 100 is located between the film layer where the first inorganic layer 210 is located and the substrate 01. The part of the first inorganic layer 210 located in the first sub-area 021 is in contact with the first organic layer 510, the part of the first inorganic layer 210 located in the second sub-area 022 is in contact with the conductive structure 100, and in the first sub-area 021, at least part of the edge of the first inorganic layer 210 covering the first organic layer 510 is covered by the second organic layer 520. For example, all the edges of the first inorganic layer 210 covering the first organic layer 510 are covered by the second organic layer 520.

[0215] The display substrate provided by the present disclosure is advantageous in preventing the encapsulation layer covering the edge of the first inorganic layer from being broken by covering the edge of the first inorganic layer with the second organic layer.

[0216] Referring to FIG. 27, the first inorganic layer 210, the first organic layer 510, the second organic layer 520 and the conductive structure 100 in the display substrate provided by the present embodiment can have the same features as the first inorganic layer 210, the first organic layer 510, the second organic layer 520 and the conductive structure 100 in the display substrate provided by any of the embodiments shown in FIGS. 1-26. The first sub-area 021 in the display substrate provided by the present embodiment can have the same features as the edge portion of the second area 012 or the third area 013 in the display substrate provided by the above-mentioned embodiments, and the second sub-area 022 in the display substrate provided by the present embodiment can have the same features as the non-edge portion of the second area 012 in the display substrate provided by the above-mentioned embodiments. Of course, the embodiments of the present disclosure are not limited thereto. When other inorganic layers, such as a second inorganic layer, are further provided between the conductive structure and the substrate, the first inorganic layer in the second sub-area can also be in contact with the second inorganic layer.

[0217] In some examples, referring to FIGS. 1 and 2, the substrate 01 further includes a third sub-area 023, the first sub-area 021 includes a partial area of the non-display area, the second sub-area 022 includes a partial area of the non-display area, and the third sub-area 023 includes a partial area of the display area; the display area includes a plurality of sub-pixels 300, each of at least some of the sub-pixels 300 includes a light-emitting functional layer 310, and the light-emitting functional layer 310 includes a plurality of film layers; the display substrate includes a limiting structure 400, the limiting structure 400 includes a portion of the first inorganic layer 210 located in the first area 011, the limiting structure 400 is located between the light-emitting functional layer 310 and the substrate 01, and a portion of the limiting structure 400 located between adjacent sub-pixels 300 is configured to separate at least one layer of the light-emitting functional layer 310. The third sub-area 023 in the display substrate provided by the present embodiment can have the same features as the first area 011 in the display substrate provided by the above-mentioned embodiments, and the sub-pixel 300 and the limiting structure 400 in the display substrate provided by the present embodiment can have the same features as the sub-pixel 300 and the limiting structure 400 in the display substrate provided by the above-mentioned embodiments, respectively.

[0218] In some examples, referring to FIGS. 1 and 2, each of the at least partial sub-pixels 300 further includes a first electrode 320 and a second electrode 330 located on both sides of the light-emitting functional layer 310, the first electrode 320 is located between the light-emitting functional layer 310 and the substrate substrate 01; the second organic layer 520 located in the part of the third sub-region 023 includes a pixel defining pattern 5200, which is located on the side of the first electrode 320 away from the substrate substrate 01, the pixel defining pattern 5200 includes a plurality of first openings 5210 and a plurality of second openings 5220, one sub-pixel 300 corresponds to at least one first opening 5210, at least part of the light-emitting functional layer 310 of the sub-pixel 300 is located in the first opening 5210 corresponding to the sub-pixel 300, and the first opening 5210 is configured to expose the first electrode 320, and the second opening 5220 is configured to expose the edge of the limiting structure 400. The pixel defining pattern 5200 in the display substrate provided by the embodiment and its positional relationship with the sub-pixel 300 and the limiting structure 400 can have the same features as the pixel defining pattern 5200 in the display substrate provided by the above-mentioned embodiment and its positional relationship with the sub-pixel 300 and the limiting structure 400.

[0219] FIG. 28 is a schematic diagram of a partial cross-sectional structure of a display substrate provided by another example according to an embodiment of the present disclosure.

[0220] In some examples, as shown in FIG. 28, the first inorganic layer 210 located in the part of the first sub-region 021 includes an opening 2101, the first organic layer 510 located in the part of the first sub-region 021 includes a groove 5102, and the second organic layer 520 located in the part of the first sub-region 021 fills the opening 2101 and the groove 5102.

[0221] In the research, the inventors of the present application found that when a large-area first organic layer is arranged between the first inorganic layer and the substrate substrate of the display substrate, on the one hand, it is not conducive to the water vapor discharge of the first organic layer; on the other hand, the adhesion between the first inorganic layer and the first organic layer is poor, and the first inorganic layer is prone to peeling. The display substrate provided by the present disclosure as shown in FIG. 28 exposes part of the first organic layer 510 by arranging an opening in the first inorganic layer 210 covering the large-area first organic layer 510, which is conducive to the water vapor discharge of the first organic layer 510; at the same time, the second organic layer 520 located on the side of the first inorganic layer 210 away from the first organic layer 520 fills the opening of the first inorganic layer 210, which is conducive to realizing the adhesion of the first organic layer 510 and the second organic layer 520, and solving the problem of peeling of the first inorganic layer 210.

[0222] In some examples, referring to FIGS. 18 and 19, the non-display area includes at least one annular first isolation column 610 including a first isolation layer 611 and a second isolation layer 612 arranged in layers, the first isolation layer 611 being located between the second isolation layer 612 and the substrate 01, and the second isolation layer 612 protruding relative to the edge of the first isolation layer 611 to partition the light-emitting functional layer 310 and the second electrode 330; the second organic layer 520 is located on the portion of the non-display area including the first isolation layer 611, and the first inorganic layer 210 is located on the portion of the non-display area including the second isolation layer 612. The first isolation column 610 including the first isolation layer 611 and the second isolation layer 612 in the display substrate provided in this embodiment can have the same features as the first isolation column 610 including the first isolation layer 611 and the second isolation layer 612 in the display substrate provided in the above-described embodiments.

[0223] In some examples, referring to FIG. 19, the first isolation layer 611 is provided with a first sub-groove 6101 on the side away from the substrate 01, and the second isolation layer 612 exposes the first sub-groove 6101; the second organic layer 520 is located on the portion of the non-display area covering the first sub-groove 6101 and the edge of the second isolation layer 612 close to the first sub-groove 6101. The first sub-groove 6101 and the position relationship between the second organic layer 520 and the first sub-groove 6101 in the display substrate provided in this embodiment can have the same features as the second groove 614 and the position relationship between the second organic layer 520 and the second groove 614 in the display substrate provided in the above-described embodiments.

[0224] In some examples, referring to FIGS. 18 and 19, the display substrate is provided with at least one second isolation column 620 located on the side of the first isolation column 610 away from the center of the portion of the non-display area surrounded thereby, the second isolation column 620 including a third isolation layer 623 and a fourth isolation layer 624 arranged in layers, the third isolation layer 623 being located between the fourth isolation layer 624 and the substrate 01, and the edge of the fourth isolation layer 624 protruding relative to the edge of the third isolation layer 623 to partition the light-emitting functional layer 310 and the second electrode 330; the distance between at least a portion of the fourth isolation layer 624 and the substrate 01 is greater than the distance between the second isolation layer 612 and the substrate 01. The third isolation layer 623 and the fourth isolation layer 624 in the display substrate provided in this embodiment are respectively the first organic layer 510 and the first inorganic layer 210, and the second isolation column 620 in the display substrate provided in this embodiment can have the same features as the second isolation column 620 in the display substrate provided in the above-described embodiments.

[0225] In some examples, referring to FIG. 19, the third isolation layer 623 is provided with a second sub-groove 6231 away from one side of the substrate 01, and the fourth isolation layer 624 exposes the second sub-groove 6231; and the second organic layer 520 covers the second sub-groove 6231 and the edge of the fourth isolation layer 624 close to the second sub-groove 6231. The second sub-groove 6231 in the display substrate provided by the embodiment has the same features as the first groove 511 in the display substrate provided by the above-mentioned embodiments, and the positional relationship between the second organic layer 520 and the second sub-groove 6231 in the display substrate provided by the embodiment has the same features as the positional relationship between the second organic layer 520 and the first groove 511 in the display substrate provided by the above-mentioned embodiments.

[0226] For example, referring to FIG. 10, the first inorganic layer 210 covers at least part of the inner wall of the above-mentioned anode via hole 5101 of the first organic layer 510, so as to prevent the first electrode 320 of the sub-pixel 300 from being broken during the lapping process with the pixel circuit 340. For example, the first inorganic layer 210 wraps the anode via hole 5101 formed by the surface of the first organic layer 510 originally exposed by the first inorganic layer 210 as shown in FIG. 9.

[0227] The display substrate provided by the present disclosure can be designed differently for the first inorganic layer in different regions, so as to separate at least one layer of the light-emitting functional layer of the adjacent sub-pixels with different colors in the display area to reduce crosstalk, while using the first inorganic layer to replace the original passivation layer to cover the conductive structure between the adjacent blocking parts in the non-display area, so as to reduce one step of patterning process and reduce the cost, and at the same time, the passivation layer can be used to solve the GDSX problem in the reliability verification process of this area, which is beneficial to the product yield improvement and quality control, and / or, the second isolation column formed by the first inorganic layer and the first organic layer additionally arranged at the position except the first isolation column formed by the conductive structure in the non-display area, so as to further separate the common film layer in the light-emitting functional layer and the second electrode of the sub-pixel, which is beneficial to improve the isolation effect of the isolation column in the non-display area and reduce the GDSH problem easily occurred in the reliability process, and / or, the first isolation column formed by the first inorganic layer and the first organic layer or other organic layer is used to replace the original first isolation column formed by the conductive structure, so as to save one step of patterning process, and / or, the opening exposing the first organic layer is arranged in the first inorganic layer to release water vapor while preventing the first inorganic layer from being peeled off, and / or, the second organic layer is used to cover the part of the first inorganic layer protruding relative to the edge of the first organic layer to prevent the encapsulation layer from being broken at the edge of the first organic layer, and / or, the first inorganic layer is arranged to cover the inner wall of the anode via hole formed by the first organic layer, so as to prevent the first electrode (such as anode) from being broken at the edge of the anode via hole and causing pixel dark spots or display unevenness.

[0228] The display substrate provided in the embodiment can be the same display substrate as the display substrate provided in the above embodiment, or can be a different display substrate having different characteristics in the non-display area. For example, the first isolation column formed by the conductive structure in the above embodiment can be used in the embodiment, or the first isolation column formed by the lamination of the first inorganic layer and the first organic layer in the above embodiment can be used. For example, the display substrate provided in the embodiment can include the bending area in the above embodiment, or can not include the bending area in the above embodiment.

[0229] FIG. 29 is a schematic block diagram of a display device provided in another embodiment of the present disclosure. As shown in FIG. 29, the display device 1000 includes a display substrate 1001. The display substrate 1001 can be the display substrate in any of the above embodiments.

[0230] For example, the display device 1000 can be an organic light-emitting diode display device.

[0231] For example, the display device 1000 can further include a cover plate located on the light-emitting side of the display substrate 1001.

[0232] For example, the display device 1000 can be any product or component having a display function, such as a television, a digital camera, a mobile phone, a watch, a tablet computer, a notebook computer, a navigator, etc., and the embodiment is not limited thereto.

[0233] For example, the display device 1000 can be a medium-large size smart handheld display device (NB) or a touch display device (TPC), and also has wide application potential in the field of folding products.

[0234] The following points need to be explained:

[0235] (1) In the drawings of the embodiments of the present disclosure, only the structures related to the embodiments of the present disclosure are involved, and other structures can be referred to the general design.

[0236] (2) In the case of no conflict, the features in the same embodiment and different embodiments of the present disclosure can be combined with each other.

[0237] The above description is only exemplary embodiments of the present disclosure, and is not used to limit the protection scope of the present disclosure, and the protection scope of the present disclosure is determined by the appended claims.

Claims

1. A display substrate, comprising: a substrate, comprising a first region and a second region; a conductive structure on the substrate in the first region and the second region; a first inorganic layer on a side of the conductive structure away from the substrate, and in the first region and the second region; wherein, in at least a part of the first region, an insulating layer is provided between the first inorganic layer and the conductive structure, and in at least a part of the second region, the first inorganic layer is in surface contact with the conductive structure. 2.The display substrate of claim 1, wherein, The thickness of the insulating layer is greater than the thickness of any one of the first inorganic layer and the conductive structure. 3.The display substrate according to claim 1 or 2, wherein, The part of the conductive structure in the second region comprises a power signal line. 4.The display substrate of any one of claims 1-3, wherein, The first region comprises a display region, and the second region comprises a part of a non-display region; The display region comprises a plurality of sub-pixels, and each of at least a part of the sub-pixels comprises a light-emitting functional layer, the light-emitting functional layer comprising a plurality of film layers; The display substrate comprises a limiting structure, the limiting structure comprising a part of the first inorganic layer in the first region, the limiting structure being between the light-emitting functional layer and the substrate, and a part of the limiting structure between adjacent sub-pixels being configured to isolate at least one layer of the light-emitting functional layer. 5.The display substrate of claim 4, wherein, The insulating layer comprises a first organic layer, the first organic layer being provided between the first inorganic layer and the conductive structure in a part of the first region, and the limiting structure further comprises at least one protrusion of the first organic layer in surface contact with the first inorganic layer, at least a part of an edge of the protrusion being recessed relative to an edge of the first inorganic layer in the limiting structure. 6.The display substrate of any one of claims 1-5, wherein, The conductive structure comprises at least two sub-conductive structures arranged in layers, and in a part of the first region, an additional organic layer is provided between adjacent two of the at least two sub-conductive structures, and in the second region, at least a part of adjacent two of the at least two sub-conductive structures is in direct contact, or at least a second inorganic layer is provided between the two sub-conductive structures. 7.The display substrate of claim 5, wherein, The substrate further comprises a third region, the third region comprising a part of the non-display region, and a part of the conductive structure in the third region comprises at least one annular first isolation column, the first isolation column not overlapping the first organic layer in a direction perpendicular to the substrate; Each of at least a part of the sub-pixels further comprises a first electrode and a second electrode on both sides of the light-emitting functional layer, the first electrode being between the light-emitting functional layer and the substrate; At least a part of the first region close to the third region or at least a part of the third region close to the first region comprises a second isolation column, the second isolation column comprising a layered structure formed by the first inorganic layer and the first organic layer, and in the second isolation column, an edge of the first inorganic layer comprises a first protrusion protruding relative to at least a part of an edge of the first organic layer, the first isolation column and the second isolation column being configured to isolate at least one of the light-emitting functional layer and the second electrode. 8.The display substrate of claim 7, wherein, The second isolation column includes a plurality of second isolation columns around the center of the third area, and at least one of the second isolation columns is provided with a first recess in the first organic layer, and the first inorganic layer includes an opening exposing the first recess; The display substrate further includes a second organic layer on a side of the first inorganic layer away from the substrate, and the second organic layer includes a first covering portion covering the first recess and an edge of the first inorganic layer close to the first recess. 9.The display substrate of claim 5, wherein, The substrate further includes a third area including a part of the non-display area, and the third area is provided with at least one annular first isolation column including a first isolation layer and a second isolation layer stacked. The first organic layer includes the first isolation layer in a part of the third area, the first inorganic layer includes the second isolation layer in a part of the third area, and the second isolation layer is protrudingly arranged relative to an edge of the first isolation layer to form a second protruding portion, or the first organic layer is further provided with a third organic layer between the first organic layer and the substrate, the third organic layer includes the first isolation layer in a part of the third area, the first inorganic layer includes the second isolation layer in a part of the third area, and the second isolation layer is protrudingly arranged relative to an edge of the first isolation layer to form a second protruding portion. 10.The display substrate of claim 9, wherein, The first isolation layer is provided with a second recess on a side away from the substrate, and the second isolation layer exposes the second recess. The display substrate further includes a second organic layer on a side of the first inorganic layer away from the substrate, and the second organic layer includes a second covering portion covering at least the second recess. 11.The display substrate according to claim 8 or 10, wherein The second organic layer in a part of the first area further includes a pixel definition pattern including a plurality of first openings and a plurality of second openings, one sub-pixel corresponding to at least one first opening, at least part of a light-emitting functional layer of the sub-pixel being located in the first opening corresponding to the sub-pixel, and the first opening being configured to expose the first electrode, and the second opening being configured to expose an edge of the definition structure. 12.The display substrate of claim 4, wherein, Each of the at least part of the sub-pixels further includes a first electrode and a second electrode located on both sides of the light-emitting functional layer, and a pixel circuit, the first electrode being located between the light-emitting functional layer and the substrate, and the first inorganic layer being located between the first electrode and the substrate. The insulating layer includes a first organic layer, and in a part of the first area, the first organic layer includes a via, the first electrode is electrically connected to the pixel circuit through the via, and the first inorganic layer covers at least part of an inner wall of the via. 13.The display substrate of claim 12, wherein, The first organic layer at a position other than the via includes at least one protrusion in contact with a surface of the first inorganic layer in the definition structure, the definition structure includes the protrusion, and an edge of the protrusion is recessed relative to an edge of the first inorganic layer in the definition structure.

14. The display substrate of claim 3, further comprising: at least one ring of barrier portions surrounding the display region, at least some of the film layers of the barrier portions being on a side of the conductive structure distal to the substrate, wherein a footprint of the power signal line on the substrate overlaps a footprint of the at least one ring of barrier portions on the substrate, the portion of the power signal line in the second region extending in a first direction, the portion of the at least one ring of barrier portions in the second region comprising a strip-shaped barrier portion extending in a second direction, and the first inorganic layer extending in at least some of the second region in the second direction, the first direction intersecting the second direction. 15.The display substrate of claim 14, wherein, the portion of the first inorganic layer in the second region comprises at least one inorganic layer pattern, the inorganic layer pattern covering at least some edges of the power signal line extending in the first direction. 16.The display substrate of claim 15, wherein, the at least one inorganic layer pattern comprises a plurality of inorganic layer patterns, and the number of strip-shaped barrier portions is at least one, the strip-shaped barrier portions being arranged alternately with the plurality of inorganic layer patterns in the first direction. 17.The display substrate of claim 16, wherein, an edge of the strip-shaped barrier portion covers an edge of the inorganic layer pattern, or an edge of the strip-shaped barrier portion is flush with at least some edges of the inorganic layer pattern.

18. The display substrate according to any one of claims 14-17, wherein, the substrate includes a fourth region surrounding a portion of the display region, and a footprint of the portion of the power signal line in the fourth region on the substrate is entirely within a footprint of the at least one ring of barrier portions on the substrate.

19. The display substrate of claim 18, wherein, in a direction perpendicular to the substrate, the portion of the power signal line in the fourth region does not overlap the first inorganic layer.

20. The display substrate of claim 18, wherein, the power signal line includes a first power signal line and a second power signal line, and only the second power signal line is provided in the fourth region, and the first power signal line and the second power signal line are provided in the second region.

21. The display substrate of any of claims 15-17, wherein, the display region includes a plurality of sub-pixels, and each of at least some of the sub-pixels includes a first electrode, a light-emitting functional layer, and a second electrode arranged in sequence, and the light-emitting functional layer includes a plurality of film layers; the display substrate includes a confinement structure including a portion of the first inorganic layer in the first region, the confinement structure being between the light-emitting functional layer and the substrate, and a portion of the confinement structure between adjacent sub-pixels is configured to partition at least one layer of the light-emitting functional layer; the display substrate further includes a second organic layer on a side of the first inorganic layer distal to the substrate, and a portion of the second organic layer in the first region includes a pixel confinement pattern, the pixel confinement pattern including a plurality of first openings, one sub-pixel corresponding to at least one first opening, at least some of the light-emitting functional layer of the sub-pixel being in the first opening corresponding to the sub-pixel, and the first opening being configured to expose the first electrode, a portion of the second organic layer in the second region includes a film layer of the barrier portion.

22. The display substrate of claim 21, wherein, The insulating layer includes a first organic layer, a first film layer of the second region including the barrier portion, a second organic layer, a second film layer of the second region including the barrier portion, the second film layer being located on a side of the first film layer distal to the substrate, and in a direction perpendicular to the substrate, a portion of the inorganic layer pattern overlapping the barrier portion is located between the first film layer and the second film layer.

23. The display substrate of claim 16, wherein, At least one of the plurality of inorganic layer patterns includes a main portion extending in the second direction and a widened portion located on at least one side of the main portion in the first direction, in the second direction, a length of the widened portion is less than a length of the main portion, in the first direction, a width of the widened portion is less than a size of the barrier portion, and the widened portion covers an edge of the power signal line extending in the second direction.

24. The display substrate of claim 8, further comprising: an encapsulation layer located on a side of the second organic layer distal to the substrate, wherein at least a portion of an edge of the first protruding portion of the second spacer column closest to a center of the third region is covered by the second organic layer, and at least a portion of an edge of the second organic layer is covered by the encapsulation layer.

25. The display substrate of claim 22, further comprising: an encapsulation layer located on a side of the second organic layer distal to the substrate, wherein a portion of the first inorganic layer covering a portion of the first organic layer distal to the first region and protruding relative to an edge of the first organic layer is covered by the second organic layer, and at least a portion of an edge of the second organic layer is covered by the encapsulation layer. 26.The display substrate according to claim 24 or 25, wherein The first inorganic layer includes a plurality of notches exposing the first organic layer, and the second organic layer fills the plurality of notches. 27.The display substrate of claim 1, wherein, The substrate includes a bending region, the insulating layer includes a first organic layer, the display substrate further includes a second organic layer located on a side of the first inorganic layer distal to the conductive structure, and portions of the conductive structure, the first inorganic layer, the first organic layer, and the second organic layer in the bending region are configured to be bendably arranged, a portion of the first inorganic layer in the bending region includes an opening, a portion of the first organic layer in the bending region includes a third groove, and the second organic layer fills the opening and the third groove.

28. A display substrate, comprising: a substrate including a first sub-region and a second sub-region; a first inorganic layer located on the first sub-region and the second sub-region of the substrate; a first organic layer located between a film layer in which the first inorganic layer is located and the substrate; a second organic layer located on a side of the film layer in which the first inorganic layer is located distal to the substrate; a conductive structure located between the film layer in which the first inorganic layer is located and the substrate; The first inorganic layer is located at a portion of the first sub-region in contact with the first organic layer, and is located at a portion of the second sub-region in contact with the conductive structure. 29.The display substrate of claim 28, wherein, The substrate substrate further includes a third sub-region, the first sub-region includes a partial area of a non-display region, the second sub-region includes a partial area of a non-display region, and the third sub-region includes a partial area of a display region. The display region includes a plurality of sub-pixels, and each of at least some of the sub-pixels includes a light-emitting functional layer including a plurality of film layers. The display substrate includes a limiting structure including a portion of the first inorganic layer located in the third sub-region, the limiting structure is located between the light-emitting functional layer and the substrate substrate, and a portion of the limiting structure located between adjacent sub-pixels is configured to isolate at least one layer of the light-emitting functional layer. 30.The display substrate of claim 29, wherein, Each of at least some of the sub-pixels further includes a first electrode and a second electrode located on both sides of the light-emitting functional layer, and the first electrode is located between the light-emitting functional layer and the substrate substrate. The portion of the second organic layer located in the third sub-region includes a pixel defining pattern located on a side of the first electrode away from the substrate substrate, the pixel defining pattern includes a plurality of first openings and a plurality of second openings, one sub-pixel corresponds to at least one first opening, at least a portion of the light-emitting functional layer of the sub-pixel is located in the first opening corresponding to the sub-pixel, and the first opening is configured to expose the first electrode, and the second opening is configured to expose an edge of the limiting structure.

31. The display substrate of any of claims 28-30, wherein, The portion of the first organic layer located in the first sub-region includes a groove, the portion of the first inorganic layer located in the first sub-region includes an opening exposing at least a portion of the groove, and the portion of the second organic layer located in the first sub-region fills the opening and the groove. 32.The display substrate of claim 28, wherein, The substrate substrate further includes a third sub-region, the first sub-region includes a partial area of a non-display region, the second sub-region includes a partial area of a non-display region, and the third sub-region includes a partial area of a display region. The display region includes a plurality of sub-pixels, and each of at least some of the sub-pixels includes a light-emitting functional layer including a plurality of film layers. Each of at least some of the sub-pixels further includes a first electrode and a second electrode located on both sides of the light-emitting functional layer, and the first electrode is located between the light-emitting functional layer and the substrate substrate. The non-display region includes at least one annular first isolation column, the first isolation column includes a first isolation layer and a second isolation layer stacked, the first isolation layer is located between the second isolation layer and the substrate substrate, and the second isolation layer protrudes relative to an edge of the first isolation layer to isolate the light-emitting functional layer and the second electrode. The portion of the second organic layer located in the non-display region includes the first isolation layer, and the portion of the first inorganic layer located in the non-display region includes the second isolation layer. 33.The display substrate of claim 32, wherein, The first isolation layer is provided with a first sub-groove on a side away from the substrate, and the second isolation layer exposes the first sub-groove. The second organic layer covers the first sub-groove and an edge of the second isolation layer close to the first sub-groove. 34.The display substrate according to claim 32 or 33, wherein The display substrate is provided with at least one second isolation column, the second isolation column is located on a side of the first isolation column away from a center of the part of the non-display area surrounded thereby, the second isolation column comprises a third isolation layer and a fourth isolation layer stacked, the third isolation layer is located between the fourth isolation layer and the substrate, and an edge of the fourth isolation layer protrudes relative to an edge of the third isolation layer to isolate at least one of the light-emitting functional layer and the second electrode. A distance between at least part of the fourth isolation layer and the substrate is greater than a distance between the second isolation layer and the substrate. 35.The display substrate of claim 34, wherein, The third isolation layer is provided with a second sub-groove on a side away from the substrate, and the fourth isolation layer exposes the second sub-groove. The second organic layer covers the second sub-groove and an edge of the fourth isolation layer close to the second sub-groove.

36. A display substrate, comprising: a substrate comprising a display area and a non-display area surrounding the display area; an inorganic layer on the display area and the non-display area on the substrate; a conductive structure between the inorganic layer and the substrate, the conductive structure comprising a power signal line; at least one ring of a barrier portion in the non-display area and surrounding the display area, at least part of a film layer of the barrier portion is on a side of the conductive structure away from the substrate, wherein the non-display area comprises a first non-display area on a side of the display area, the power signal line is in part of the first non-display area and extends in a first direction, the barrier portion in part of the first non-display area comprises a strip-shaped barrier portion extending in a second direction and overlapping the power signal line, and the inorganic layer in part of the first non-display area comprises an inorganic layer pattern extending in the second direction, in a direction perpendicular to the substrate, an edge of the strip-shaped barrier portion overlaps at least part of an edge of the inorganic layer pattern. 37.The display substrate of claim 36, wherein, The non-display area comprises a second non-display area surrounding the display area, and a projection of part of the power signal line in the second non-display area on the substrate is completely within a projection of the at least one ring of the barrier portion on the substrate. 38.The display substrate of claim 37, wherein, In a direction perpendicular to the substrate, part of the power signal line in the second non-display area does not overlap the inorganic layer. 39.The display substrate of claim 37, wherein, The power signal line comprises a first power signal line and a second power signal line, only the second power signal line is provided in the second non-display area, and the first power signal line and the second power signal line are provided in the first non-display area.

40. The display substrate of any of claims 36-39, wherein, The at least one inorganic layer pattern comprises a plurality of inorganic layer patterns, and the number of the strip-shaped barrier portions is at least one, and the strip-shaped barrier portions and the plurality of inorganic layer patterns are alternately arranged in the first direction.

41. The display substrate of any of claims 36-40, wherein, The inorganic layer pattern covers at least part of an edge of the first film layer.

42. The display substrate of claim 40, further comprising: a first organic layer between the inorganic layer and the substrate, a portion of the first organic layer in the display area including a planarization layer, wherein a portion of the first organic layer in the non-display area includes a first film layer of the barrier portion, and a portion of the inorganic layer pattern overlapping the barrier portion in a direction perpendicular to the substrate covers at least part of an edge of the first film layer.

43. The display substrate of claim 42, further comprising: a second organic layer on a side of the inorganic layer distal to the substrate, wherein a portion of the second organic layer in the non-display area includes a second film layer of the barrier portion, the second film layer is on a side of the first film layer distal to the substrate, and in a direction perpendicular to the substrate, a portion of the inorganic layer pattern overlapping the barrier portion is between the first film layer and the second film layer.

44. The display substrate of claim 43, further comprising: an encapsulation layer on a side of the second organic layer distal to the substrate, wherein the encapsulation layer includes a portion in contact with the barrier portion and a portion in contact with the inorganic layer.

45. A display device comprising the display substrate of any one of claims 1-44. ​

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