Display panel and manufacturing method therefor, and display apparatus

Abstract

A display panel and a manufacturing method therefor, and a display apparatus. The display panel comprises: a first region; a second region; a third region; a plurality of sub-pixels; a base substrate; and an inorganic layer, a first partition structure, and a second partition structure which are located on the base substrate. The first partition structure comprises a first separation portion and a second separation portion which are stackedly arranged, and the first separation portion comprises a first protruding portion protruding relative to an edge of the second separation portion. The second partition structure comprises a first separation member and a second separation member which are stackedly arranged, and the first separation member comprises a second protruding portion protruding relative to at least part of an edge of the second separation member. The first partition structure and the second partition structure are both configured to partition at least one layer of light-emitting functional layers, at least a portion of the inorganic layer located in the first region serves as the first separation portion, and at least a portion of the inorganic layer located in the third region serves as the first separation member. The first partition structure and the second partition structure of the display panel provided by the present disclosure have simple structures and are easy to manufacture.

Description

Display panel, manufacturing method thereof and display device TECHNICAL FIELD

[0001] Embodiments of the present disclosure relate to a display panel, a manufacturing method thereof, and a display device. BACKGROUND

[0002] Organic light emitting diode (OLED) display products have advantages of rich colors, fast response time, foldability, and the like, and are gradually replacing liquid crystal displays (LCDs). As a result, the market has increasingly high requirements for the service life, power consumption, and high-brightness mode of organic light emitting diode display products. An organic light emitting diode display device includes a tandem device. By adding at least one light emitting layer and a charge generation layer in the tandem device, the service life and brightness of the light emitting device can be improved, and the power consumption can be reduced, thereby meeting the requirements of users for the service life and power consumption of the display device.

[0003] SUMMARY

[0004] Embodiments of the present disclosure provide a display panel, a manufacturing method thereof, and a display device.

[0005] The display panel provided by the embodiments of the present disclosure includes a first area, a second area, a third area, a plurality of sub-pixels, a substrate, an inorganic layer on the substrate, a first partition structure, and a second partition structure. The first area is configured to display. The second area is configured to transmit light. The first area is located on at least one side of the second area. The third area is located between the first area and the second area. The plurality of sub-pixels are located in the first area. Each of at least part of the sub-pixels includes a light emitting functional layer, and the light emitting functional layer includes a plurality of film layers. The first partition structure is located on the substrate and between adjacent sub-pixels in the first area. The first partition structure includes a first isolation part and a second isolation part arranged in layers. The first isolation part is located on a side of the second isolation part away from the substrate. The first isolation part includes a first protruding part protruding relative to an edge of the second isolation part. The second partition structure is located on the substrate and in the third area. The second partition structure includes a first isolation piece and a second isolation piece arranged in layers. The first isolation piece is located on a side of the second isolation piece away from the substrate. The first isolation piece includes a second protruding part protruding relative to at least part of an edge of the second isolation piece. The first partition structure and the second partition structure are both configured to partition at least one layer of the light emitting functional layer. At least part of the inorganic layer located in the first area serves as the first isolation part. At least part of the inorganic layer located in the third area serves as the first isolation piece.

[0006] For example, the display panel provided by the embodiments of the present disclosure further comprises an organic layer on the substrate, and the inorganic layer is located on the side of the organic layer away from the substrate, wherein at least part of the organic layer located in the first region serves as the second isolation part, and at least part of the organic layer located in the third region serves as at least part of the second isolation piece.

[0007] For example, the display panel provided by the embodiments of the present disclosure, the first protruding part of the first isolation part has a first ring shape in the orthographic projection on the substrate, the second protruding part of the first isolation piece has a second ring shape in the orthographic projection on the substrate, and the average ring width of the first ring shape is smaller than the average ring width of the second ring shape.

[0008] For example, the display panel provided by the embodiments of the present disclosure, the average ring width of the second ring shape is 1.2-3 times the average ring width of the first ring shape.

[0009] For example, the display panel provided by the embodiments of the present disclosure, in the direction perpendicular to the substrate, the thickness of the first isolation part is substantially equal to the thickness of the first isolation piece.

[0010] For example, the display panel provided by the embodiments of the present disclosure, in the direction perpendicular to the substrate, the maximum thickness of the part of the organic layer located in the first region is greater than or equal to the maximum thickness of the part of the organic layer located in the third region.

[0011] For example, the display panel provided by the embodiments of the present disclosure, the orthographic projection of the first isolation piece of the second partition structure on the substrate falls within the orthographic projection of the second isolation piece of the second partition structure on the substrate.

[0012] For example, the display panel provided by the embodiments of the present disclosure, the second isolation piece comprises a first sub-isolation part and a second sub-isolation part, the first sub-isolation part is located on the side of the second sub-isolation part away from the substrate, the edge of the first isolation piece protrudes relative to the edge of the first sub-isolation part, and the edge of the second sub-isolation part protrudes relative to the edge of the first isolation piece or is flush with the edge of the first isolation piece.

[0013] For example, the display panel provided by the embodiments of the present disclosure, the second isolation piece comprises at least one layer of metal structure, and at least part of the organic layer located in the third region covers the surface of the at least one layer of metal structure.

[0014] For example, the display panel provided by the embodiment of the present disclosure, the at least one metal structure comprises a first metal structure and a second metal structure which are sequentially stacked in a direction perpendicular to the substrate substrate, the first metal structure is closer to the first isolation piece than the second metal structure, and an edge of the second metal structure protrudes relative to an edge of the first metal structure.

[0015] For example, the display panel provided by the embodiment of the present disclosure, the first metal structure and the first isolation piece are in contact with each other, and a projection of the first metal structure on the substrate substrate falls in a projection of the first isolation piece on the substrate substrate.

[0016] For example, the display panel provided by the embodiment of the present disclosure, a thickness of a portion of the organic layer covering a surface of the first metal structure is less than a thickness of a portion of the organic layer covering a surface of the second metal structure.

[0017] For example, the display panel provided by the embodiment of the present disclosure, the second isolation piece further comprises an insulating structure between the first metal structure and the second metal structure, so that the first metal structure and the second metal structure are insulated from each other, and the insulating structure comprises an inorganic material.

[0018] For example, the display panel provided by the embodiment of the present disclosure, in a direction perpendicular to the substrate substrate, a maximum thickness of the second isolation piece is 1 / 3-1 of a maximum thickness of a portion of the organic layer located in the first region.

[0019] For example, the display panel provided by the embodiment of the present disclosure further comprises a pixel definition pattern located on the substrate and in the first region, the pixel definition pattern comprising a plurality of first openings to define a light emitting region of the at least partial sub-pixel, wherein the first partition structure is located between the light emitting functional layer and the substrate, the first partition structure comprising a portion surrounding the light emitting region of each of the at least partial sub-pixel, the pixel definition pattern further comprising a second opening, the portion of at least one layer of the light emitting functional layer located in the first opening being a continuous portion, and at least partial partition located in at least one second opening, the portion of the first partition structure exposed by the second opening being configured to partition the at least one layer of the light emitting functional layer; each of the at least partial sub-pixel further comprises a first electrode and a second electrode located on both sides of the light emitting functional layer in a direction perpendicular to the substrate, the first electrode being located between the light emitting functional layer and the substrate, the pixel definition pattern being located on a side of the first electrode away from the substrate, the first partition structure being located between the first electrode and the substrate, and the display panel further comprises a pixel circuit located on a side of the first partition structure close to the substrate, the pixel circuit being electrically connected with the first electrode.

[0020] For example, the display panel provided by the embodiment of the present disclosure further comprises a data line and a gate line, the data line and the gate line being located on the substrate and in the first region, the data line and the gate line being electrically connected with the pixel circuit respectively, the data line being configured to provide a data signal to the pixel circuit, and the gate line being configured to provide a scanning signal to the pixel circuit, wherein the first metal structure is arranged in the same layer as the data line, and the second metal structure is arranged in the same layer as the gate line.

[0021] For example, the display panel provided by the embodiment of the present disclosure, in a direction perpendicular to the substrate, the thickness of the first sub-insulation portion is 1 / 4-1 / 3 of the thickness of the second sub-insulation portion.

[0022] At least one embodiment of the present disclosure further provides a display device comprising the display panel of any one of the above.

[0023] At least one embodiment of the present disclosure also provides a manufacturing method of a display panel, the display panel comprising a first region, a second region, and a third region between the first region and the second region, the first region being configured to display, the second region being configured to transmit light, and the first region being located at least one side of the second region; the manufacturing method comprising: forming an organic material layer on the substrate, patterning the organic material layer to form an organic layer pattern in the third region; forming an inorganic material layer on the organic layer pattern, patterning the inorganic material layer to form a first partition structure in the first region and a second partition structure in the third region, wherein the first partition structure comprises a first isolation portion and a second isolation portion arranged in layers, the first isolation portion being located on a side of the second isolation portion away from the substrate, the first isolation portion comprising a first protruding portion protruding relative to an edge of the second isolation portion; the second partition structure comprises a first isolation piece and a second isolation piece arranged in layers, the first isolation piece being located on a side of the second isolation piece away from the substrate, the first isolation piece comprising a second protruding portion protruding relative to at least part of an edge of the second isolation piece, the first partition structure and the second partition structure are both configured to partition at least one layer of the light-emitting functional layer, at least part of the patterning of the inorganic material layer in the first region forms the first isolation portion, and at least part of the patterning of the inorganic material layer in the third region forms the first isolation piece.

[0024] For example, the manufacturing method of a display panel provided by at least one embodiment of the present disclosure, wherein the forming an inorganic material layer on the organic layer pattern, patterning the inorganic material layer to form a first partition structure in the first region and a second partition structure in the third region, comprises: patterning the inorganic material layer to form the first partition structure in the first region and an initial partition structure in the third region, wherein the initial partition structure comprises the first isolation piece and a second initial isolation piece, the first isolation piece and the second initial isolation piece are arranged in layers, and an edge of the first isolation piece protrudes relative to at least part of an edge of the second initial isolation piece; and further etching the second initial isolation piece in the third region to form the second partition structure. BRIEF DESCRIPTION OF DRAWINGS

[0025] In order to more clearly illustrate the technical solutions of the embodiments of the present disclosure, the drawings of the embodiments will be briefly introduced below. Obviously, the drawings in the following description are only related to some embodiments of the present disclosure, but not limit the present disclosure.

[0026] FIG. 1 is a schematic plan view of a display panel according to at least one embodiment of the present disclosure.

[0027] FIG. 2 is a schematic cross-sectional view taken along line W1-W1' in FIG. 1.

[0028] FIG. 3 is a schematic view of another display panel according to at least one embodiment of the present disclosure.

[0029] FIG. 4 is a schematic view of yet another display panel according to at least one embodiment of the present disclosure.

[0030] FIG. 5A is a schematic view of yet another display panel according to at least one embodiment of the present disclosure.

[0031] FIG. 5B is a schematic view of yet another display panel according to at least one embodiment of the present disclosure.

[0032] FIG. 6A is a schematic view of yet another display panel according to at least one embodiment of the present disclosure.

[0033] FIG. 6B is a schematic view of a light emitting element having a Tandem structure.

[0034] FIG. 7 is a schematic view of a first region of the display panel shown in FIG. 1 in an example.

[0035] FIG. 8 is a schematic view of a portion of the M region shown in FIG. 7.

[0036] FIG. 9 is a schematic block diagram of a display device according to at least one embodiment of the present disclosure.

[0037] FIGS. 10-14 are flowcharts of methods of manufacturing display panels according to embodiments of the present disclosure. DETAILED DESCRIPTION

[0038] In order to make the objects, technical solutions, and advantages of the embodiments of the present disclosure clearer, the technical solutions of the embodiments of the present disclosure will be described clearly and completely below with reference to the drawings of the embodiments of the present disclosure. Obviously, the described embodiments are some but not all of the embodiments of the present disclosure. Based on the described embodiments of the present disclosure, all other embodiments obtained by a person of ordinary skill in the art without creative effort belong to the scope of the present disclosure.

[0039] Unless otherwise defined, technical terms or scientific terms used in the present disclosure shall have the meanings as understood by one of ordinary skill in the art to which the present disclosure pertains. The terms "first", "second", and similar terms are used herein to distinguish one element from another, and are not necessarily used in a sequence or to denote importance or quantity. The terms "comprise", "comprising", "include", "including" and the like are used herein to mean including but not limited to.

[0040] The terms "parallel", "perpendicular", and "same" as used in at least one embodiment of the present disclosure include the strict meanings of "parallel", "perpendicular", "same", and also include cases where there is an error included, taking into account measurement and error associated with measurement of a particular quantity (e.g., limitations of a measurement system), within an acceptable range of deviation for a particular value as determined by one of ordinary skill in the art. For example, "approximately" can mean within one or more standard deviations, or within 10% or 5% of the value. In the following description of embodiments of the present disclosure, where a quantity of an element is not specifically indicated, it means that the element can be one or more, or can be understood as at least one. "At least one" means one or more, and "a plurality of" means at least two.

[0041] As referred to in the present disclosure, "disposed in the same layer" means that two (or more) structures are formed by the same deposition process and patterned by the same patterning process, and the materials of the structures can be the same or different. As referred to in the present disclosure, "integrally disposed structures" means that two (or more) structures are formed by the same deposition process and patterned by the same patterning process, and the structures are connected to each other, and the materials of the structures can be the same or different.

[0042] Generally, a display panel with a "pinhole screen" generally includes a display area for normal display and a hollowed-out area for disposing a sensor (e.g., a camera). The display area for normal display generally includes light emitting elements and pixel circuits, the pixel circuits are electrically connected to the light emitting elements, and the pixel circuits are used to drive the light emitting elements to emit light. The sensor is generally disposed in the hollowed-out area, which is a region where material is removed relative to the normal display area, so that the sensor can receive external ambient light. Therefore, the display panel with a "pinhole screen" is different from a display panel with a "full screen", and the hollowed-out area of the display panel with a "pinhole screen" has good light transmission performance. Generally, the display panel further includes a third area between the display area and the hollowed-out area.

[0043] In the research, the inventors of the present application found that the tandem device has the characteristics of low power consumption and long service life. For the tandem device, the light emitting functional layer in the light emitting element can include a plurality of film layers arranged in a stacked manner, but since the charge generation layer (CGL) is arranged between at least two of the plurality of film layers in the tandem device, and the conductivity of the charge generation layer (CGL) is relatively large, when the charge generation layer (CGL) is a full-area film layer, the charge generation layers (CGL) of the two adjacent light emitting elements are continuous film layers, so the phenomenon of lateral charge migration is easy to occur, which causes the low gray scale monochromatic chromaticity shift of the display panel, and is easy to cause crosstalk between adjacent sub-pixels, resulting in color shift of the display panel.

[0044] In order to reduce the risk of crosstalk between sub-pixels of different colors, at least one film layer in the light emitting functional layer between sub-pixels of different colors needs to be blocked, and in order to ensure the blocking effect of the film layer such as the light emitting functional layer, it is necessary to further arrange a blocking structure in the area close to the edge of the display area (for example, the third area between the display area and the hollow area), thereby further blocking the film layer such as the light emitting functional layer in the edge area, to reduce the crosstalk phenomenon and ensure the display effect of the sub-pixels in the display area. In some display panels, the blocking structure in the third area has a different topography and structure from the blocking structure in the display area, for example, the blocking structure in the display area usually has a composite structure formed by an inorganic structure layer and an organic structure layer, and the blocking structure in the third area usually has a multi-layer metal composite structure, such as Ti / Al / Ti, etc., so that the blocking structure in the third area usually needs different manufacturing processes, thereby making the manufacturing process cumbersome and prone to process deviation, therefore, the overall uniformity of the blocking structures in the display area and the third area needs to be improved.

[0045] At least one embodiment of the present disclosure provides a display panel and a manufacturing method thereof, and a display device.

[0046] The display panel provided by at least one of the embodiments of the present disclosure comprises a first area, a second area, a third area, a plurality of sub-pixels, a substrate, an inorganic layer on the substrate, a first partition structure and a second partition structure, the first area is configured to display; the second area is configured to transmit light, the first area is located at least one side of the second area; the third area is located between the first area and the second area; the plurality of sub-pixels are located in the first area, each of at least part of the sub-pixels comprises a light-emitting functional layer, and the light-emitting functional layer comprises a plurality of film layers; the first partition structure is located on the substrate and between adjacent sub-pixels in the first area, the first partition structure comprises a first isolation part and a second isolation part arranged in layers, the first isolation part is located on a side of the second isolation part away from the substrate, and the first isolation part comprises a first protruding part protruding relative to an edge of the second isolation part; the second partition structure is located on the substrate and in the third area, the second partition structure comprises a first isolation piece and a second isolation piece arranged in layers, the first isolation piece is located on a side of the second isolation piece away from the substrate, and the first isolation piece comprises a second protruding part protruding relative to at least part of an edge of the second isolation piece; the first partition structure and the second partition structure are both configured to partition at least one layer of the light-emitting functional layer, at least part of the inorganic layer in the first area serves as the first isolation part, and at least part of the inorganic layer in the third area serves as the first isolation piece.

[0047] In the display panel provided by at least one of the embodiments of the present disclosure, the first isolation part of the first partition structure in the first display area and the first isolation piece of the second partition structure in the third area are arranged in the same layer, that is, formed by the same deposition process and patternized by the same patterning process, which is beneficial to simplify the manufacturing process of the first isolation part and the first isolation piece, so that the structures of the first partition structure and the second partition structure can be simplified and have good uniformity.

[0048] The display panel, the manufacturing method thereof and the display device provided by the embodiments of the present disclosure are described below with reference to the drawings.

[0049] FIG. 1 is a schematic plan view of a display panel provided by at least one of the embodiments of the present disclosure; and FIG. 2 is a schematic partial cross-sectional view taken along line W1-W1' in FIG. 1.

[0050] As shown in FIG. 1, the display panel 01 includes a first area A1, a second area A2, and a third area A3. The first area A1 is a display area and is configured to display. The second area A2 is a hollow area and is configured to transmit light. For example, a device such as a photosensitive sensor can be disposed in the second area A2. For example, the first area A1 can be located at least one side of the second area A2. For example, in some embodiments, the first area A1 surrounds the second area A2, that is, the second area A2 can be surrounded by the first area A1. For example, the second area A2 can also be disposed at other positions, which can be determined as needed. For example, the second area A2 can be located at the top center position of the substrate BS.

[0051] For example, as shown in FIG. 1, the number of the second areas A2 and the third areas A3 is the same. For example, in some embodiments, the number of the second areas A2 and the third areas A3 can be greater than 1. For example, a plurality of second areas A2 can be set at different positions according to design requirements, or have different shapes. For example, the shape of the second area A2 can be circular, elliptical, or polygonal. For example, the second area A2 and the third area A3 can also be other shapes, such as a racetrack shape or a polygonal shape, and embodiments of the present disclosure are not limited thereto.

[0052] For example, as shown in FIG. 1, the display panel 01 includes a substrate BS and a plurality of sub-pixels 10 disposed on the substrate BS. The plurality of sub-pixels 10 are located in the first area A1, so that the first area A1 is a display area. As shown in FIGS. 1 and 2, each of at least part of the sub-pixels 10 includes a light emitting element 100, the light emitting element 100 includes a light emitting functional layer 110, and a first electrode 120 and a second electrode 130 located on both sides of the light emitting functional layer 110 in a direction perpendicular to the substrate BS (for example, the Z direction as shown in FIG. 2), the first electrode 120 is located between the light emitting functional layer 110 and the substrate BS. For example, each sub-pixel 10 located in the first area A1 includes a light emitting element 100, for example, the light emitting element 100 can be an organic light emitting element.

[0053] For example, as shown in FIG. 2, the light-emitting functional layer 110 in the light-emitting element 100 can include a first light-emitting layer (EML) 111, a charge generation layer (CGL) 113, and a second light-emitting layer (EML) 112, which are stacked, and the charge generation layer 113 is located between the first light-emitting layer 111 and the second light-emitting layer 112. The charge generation layer 113 has strong conductivity, and can make the light-emitting functional layer 110 have the advantages of long service life, low power consumption, and high brightness. For example, compared with the light-emitting functional layer 110 without the charge generation layer 113, the light-emitting brightness of the light-emitting element 100 can be increased by nearly one time by setting the charge generation layer 113 in the light-emitting functional layer 110. For example, the light-emitting element 100 of the sub-pixel 10 can be a tandem light-emitting element, such as a Tandem OLED. For example, the first light-emitting layer 111 and the second light-emitting layer 112 can be structures obtained after patterning processing, and the charge generation layer 113 can be a structure of an entire layer.

[0054] For example, as shown in FIG. 2, the charge generation layer 113 can include an N-type charge generation layer and a P-type charge generation layer. For example, in each sub-pixel 10, the light-emitting functional layer 110 can further include a hole injection layer (HIL), a hole transport layer (HTL), an electron transport layer (ETL), and an electron injection layer (EIL). For example, the hole injection layer (HIL), the hole transport layer (HTL), the electron transport layer (ETL), the electron injection layer (EIL), and the charge generation layer 113 are common film layers of the plurality of sub-pixels 10, and can be referred to as common layers.

[0055] For example, as shown in FIG. 2, the second light-emitting layer 112 can be located between the first light-emitting layer 111 and the second electrode 130, and the hole injection layer can be located between the first electrode 120 and the first light-emitting layer 111. For example, an electron transport layer can be further provided between the charge generation layer 113 and the first light-emitting layer 111. For example, a hole transport layer can be provided between the second light-emitting layer 112 and the charge generation layer 113. For example, an electron transport layer and an electron injection layer can be provided between the second light-emitting layer 112 and the second electrode 130.

[0056] For example, the material of the electron transport layer can include an aromatic heterocyclic compound, such as a benzimidazole derivative, an imidazopyridine derivative, an imidazole derivative such as a benzimidazophenanthroline derivative; a pyrimidine derivative, a triazine derivative, and a heteroaromatic compound containing a nitrogen-containing six-membered ring structure (also including a compound having a phosphine oxide group as a substituent on a heterocycle); and the like. For example, as shown in FIG. 2, the material of the charge generation layer 113 can be a material containing a phosphorus oxygen group, or a material containing a triazine. For example, the ratio of the electron mobility of the material of the charge generation layer 113 to the electron mobility of the electron transport layer is 10 -2 ~ 102 .

[0057] For example, as shown in FIG. 2, the first electrode 120 can be an anode, and the second electrode 130 can be a cathode. For example, the cathode can be formed of a material with high conductivity and low work function, for example, the cathode can be made of a metal material. For example, the anode can be formed of a transparent conductive material with high work function.

[0058] For example, as shown in FIG. 2, the second electrode 130 in at least part of the sub-pixels 10 has a full-area structure in orthographic projection on the substrate BS. For example, the second electrode 130 can be a common electrode shared by the plurality of sub-pixels 10. For example, the second electrode 130 can be a common electrode shared by the at least part of the sub-pixels 10.

[0059] For example, as shown in FIG. 2, an insulating layer 020 is provided between the first electrode 120 and the substrate BS. For example, a film layer 021 and a film layer 022 are further provided between the insulating layer 020 and the substrate BS to serve as insulating layers. FIG. 2 omits some structures between the insulating layer 020 and the substrate BS, such as film layers where signal lines such as data lines are located and other insulating layers.

[0060] As shown in FIG. 2, the display panel 01 further includes an inorganic layer 010 on the substrate BS. For example, the inorganic layer 010 is located on a side of the insulating layer 020 away from the substrate BS and in contact with the insulating layer 020.

[0061] As shown in FIG. 2, the display panel 01 further includes a first partition structure 200 and a second partition structure 300 on the substrate BS. The first partition structure 200 is located between adjacent sub-pixels 10 in the first region A1 and includes a first isolation portion 210 and a second isolation portion 220 arranged in layers, the first isolation portion 210 is located on a side of the second isolation portion 220 away from the substrate BS, and the first isolation portion 210 includes a first protruding portion 201 protruding relative to an edge of the second isolation portion 220. The second partition structure 300 is located in the third region A3 and includes a first isolation member 310 and a second isolation member 320 arranged in layers, the first isolation member 310 is located on a side of the second isolation member 320 away from the substrate BS, and the first isolation member 310 includes a second protruding portion 301 protruding relative to at least part of an edge of the second isolation member 320.

[0062] As shown in FIG. 2, the first partition structure 200 and the second partition structure 300 are both configured to partition at least one film layer of the light-emitting functional layer 100. For example, the first protruding part 201 of the first partition structure 200 can partition at least one film layer in the light-emitting functional layer 100, so as to reduce the risk of crosstalk between adjacent sub-pixels 10. The second protruding part 301 of the second partition structure 300 can partition at least one film layer in the light-emitting functional layer 100, so as to further reduce the risk of crosstalk.

[0063] As shown in FIG. 2, at least part of the inorganic layer 010 located in the first area A1 serves as the first isolation part 210, and at least part of the inorganic layer 010 located in the third area A3 serves as the first isolation piece 310. That is, the first isolation part 210 and the first isolation piece 310 are disposed in the same layer, and are formed by the same deposition process and patterned by the same patterning process, for example, the first isolation part 210 and the first isolation piece 310 are made of the same material. Thus, the first isolation part 210 and the first isolation piece 310 can be patterned by the same mask, so as to simplify the manufacturing process, and make the structure of the first partition structure 200 and the second partition structure 300 simple, easy to manufacture and easy to control process deviation, so that the first partition structure 200 located in the first display area A1 and the second partition structure 300 located in the third area A3 have good structural uniformity.

[0064] For example, as shown in FIG. 2, the display panel 01 further includes an organic layer 020 (i.e., the above-mentioned insulating layer 020) located on the substrate substrate BS, and the inorganic layer 010 is located on the side of the organic layer 020 away from the substrate substrate BS. At least part of the organic layer 020 located in the first area A1 serves as the second isolation part 220, and at least part of the organic layer 020 located in the third area A3 serves as at least part of the second isolation piece 320.

[0065] For example, referring to FIG. 2, the second isolation part 220 in the first partition structure 200 and the second isolation piece 320 in the second partition structure 300 can also be disposed in the same layer, and can be formed by the same deposition process and patterned by the same patterning process, for example, the second isolation part 220 and the second isolation piece 320 are made of the same material. Thus, the second isolation part 220 and the second isolation piece 320 can be patterned by the same mask, so as to simplify the manufacturing process, and make it easy to control process deviation, so that the first partition structure 200 located in the first display area A1 and the second partition structure 300 located in the third area A3 have good structural uniformity.

[0066] Of course, referring to FIG. 2, when the thickness of the light-emitting functional layer 110 that needs to be partitioned is different, the thickness of the second partitioning member 320 can be set according to design needs in the direction perpendicular to the substrate base plate BS. For example, when the thickness of the light-emitting functional layer 110 that needs to be partitioned is large, the thickness of the second partitioning member 320 can be correspondingly large to enhance the partitioning capability of the second partitioning structure 300. For example, when the thickness of the light-emitting functional layer 110 that needs to be partitioned is small, the thickness of the second partitioning member 320 can be small as long as the second partitioning structure 300 can play its partitioning role. For example, in some embodiments of the present disclosure, the first light-emitting layer 111 and the second light-emitting layer 112 can also not be arranged in the third region A3, so that the second partitioning structure 300 can be used to partition at least one film layer in the light-emitting functional layer 110 other than the first light-emitting layer 111 and the second light-emitting layer 112.

[0067] For example, as shown in FIG. 2, when the thickness of the light-emitting functional layer 110 is small, the thickness of the second partitioning member 320 is smaller than the maximum thickness of the part of the organic layer 020 in the first region A1 in the direction perpendicular to the substrate base plate BS. For example, the thickness of the second partitioning member 320 is smaller than the thickness of the second partitioning portion 220, but is not limited thereto. For example, when the thickness of the second partitioning member 320 is small, the second partitioning member 320 can be a structure obtained after at least part of the organic layer 020 is subjected to a thinning process. For example, a half-tone mask can be used to form the second partitioning portion 220 in the first region A1 and the second partitioning member 320 in the third region A3.

[0068] For example, as shown in FIG. 2, the number of the second partitioning structures 300 can be 5-10, for example, 5-8, such as 7 or 8, which is not limited in the embodiments of the present disclosure.

[0069] For example, as shown in FIG. 2, the inorganic layer 010 can include an inorganic material, for example, silicon nitride, silicon oxide, or silicon oxynitride. For example, the organic layer 020 can include an organic material, for example, polyimide or the like.

[0070] For example, as shown in FIG. 2, the first protruding portion 201 of the first isolation portion 210 has a first ring shape in the orthographic projection on the substrate BS, the second protruding portion 301 of the first isolation member 310 has a second ring shape in the orthographic projection on the substrate BS, and the average ring width P1 of the first ring shape is less than the average ring width P2 of the second ring shape. For example, the first partition structure 200 can form a "undercut" structure by the first protruding portion 201 in the first isolation portion 210 to partition at least one film layer in the light-emitting functional layer 100, so as to reduce the risk of crosstalk between adjacent sub-pixels 10. For example, the second partition structure 300 can form a "undercut" structure by the second protruding portion 301 in the first isolation member 310 to further play a partitioning role. By setting the average ring width P2 of the above-mentioned second ring shape to be greater than the average ring width P1 of the above-mentioned first ring shape, the protruding degree of the second protruding portion 301 of the first isolation member 310 relative to the second isolation member 320 can be greater, so that the partitioning capability of the second partition structure 300 is stronger. For example, in the third region A3, the second partition structure 300 can partition all the film layers in the light-emitting functional layer 100. For example, in the third region A3, the second partition structure 300 can partition all the film layers in the light-emitting functional layer 100 and simultaneously partition the second electrode 130.

[0071] For example, as shown in FIG. 2, the average ring width of the above-mentioned second ring shape is 1.2-3 times the average ring width of the above-mentioned first ring shape, for example, can be at least one of 1.2-1.5 times, 1.6-1.8 times, 1.7-2 times, 2.2-2.5 times, and 2.6-3 times. For example, can be 1.5 times, 1.8 times, 2 times, 2.5 times, 2.8 times, or 3 times, and the embodiments of the present disclosure are not limited thereto.

[0072] For example, as shown in FIG. 2 (and as shown in FIG. 7 described below), the first ring shape corresponding to the first protruding portion 201 in the first partition structure 200 surrounds the light-emitting area of the sub-pixel 10, and the second ring shape corresponding to the second protruding portion 301 in the second partition structure 300 surrounds the third region A3, i.e., the non-display region. For example, the above-mentioned first ring shape is a non-closed ring shape, and the above-mentioned second ring shape is a closed ring shape. For example, the above-mentioned first ring shape and the above-mentioned second ring shape can have substantially the same shape, or have different shapes. For example, the above-mentioned first ring shape can be a circular ring shape or a rectangular shape with rounded corners. For example, the above-mentioned second ring shape can be a circular ring shape or a rectangular shape with rounded corners.

[0073] For example, as shown in FIG. 2 (and as shown in FIG. 7 described below), the outer circumference of the first annular corresponding to the first protruding portion 201 in the first partition structure 200 is 10-90 microns, for example, can be at least one of 10-20 microns, 25-35 microns, 40-50 microns, 55-65 microns, 70-80 microns, 75-85 microns, and 80-90 microns, but not limited thereto. For example, the outer circumference of the second annular corresponding to the second protruding portion 301 in the second partition structure 300 is 100-800 microns, for example, can be at least one of 100-300 microns, 200-400 microns, 350-450 microns, 450-600 microns, 500-650 microns, and 700-800 microns, and the embodiments of the present disclosure are not limited thereto.

[0074] For example, as shown in FIG. 2 (and as shown in FIG. 7 described below), the light emitting area of one sub-pixel 10 can be surrounded by one continuous first annular described above. For example, the first annular surrounding the light emitting area of one sub-pixel 10 can also include a plurality of first sub-annular, and the plurality of first sub-annular are arranged at intervals. For example, the shapes of the plurality of first sub-annular surrounding the light emitting area of the same sub-pixel 10 can be substantially the same, or can not be the same. For example, the outer circumferences of the plurality of first sub-annular surrounding the light emitting area of the same sub-pixel 10 can also be unequal, and the embodiments of the present disclosure are not limited thereto.

[0075] For example, as shown in FIG. 1 and FIG. 2, the number of the second annular surrounding the third area A3 can be 1-5, for example, can be at least one of 1-3, 2-4, 3-5, 1-4, and 4-5. For example, when the number of the second annular surrounding the third area A3 is multiple, the plurality of second annular can have substantially the same shape, for example, can be at least one of a circle, an ellipse, and a rectangle with rounded corners, and the embodiments of the present disclosure are not limited thereto.

[0076] For example, as shown in FIG. 2, in the direction perpendicular to the substrate BS, the thickness of the first isolation portion 210 is substantially equal to the thickness of the first isolation piece 310, that is, in the process of forming the first isolation portion 210 and the first isolation piece 310, the inorganic layer 010 is not locally thinned, and the thickness is substantially uniform, so that the first isolation portion 210 and the first isolation piece 310 are arranged in the same layer. The above-mentioned "substantially equal" can mean that the thicknesses of the two are equal, or the thickness difference between the two is not greater than 3% of the thickness of one of them.

[0077] For example, as shown in FIG. 2, in the direction perpendicular to the substrate base plate BS, the maximum thickness of the portion of the organic layer 020 located in the first region A1 is greater than or equal to the maximum thickness of the portion of the organic layer 020 located in the third region A3. For example, the maximum thickness of the portion of the organic layer 020 located in the first region A1 is the size P0 shown in FIG. 2. For example, the maximum thickness of the portion of the organic layer 020 located in the third region A3 is the thickness of the second isolation piece 320.

[0078] For example, as shown in FIG. 2, the maximum thickness of the portion of the organic layer 020 located in the first region A1 is 3-5 microns, for example, can be at least one of 3-3.5 microns, 3.5-4 microns, 4-4.5 microns, and 4.5-5 microns. For example, the maximum thickness of the portion of the organic layer 020 located in the third region A3 is 0.5-1.5 microns, for example, can be at least one of 0.5-0.8 microns, 1.0-1.2 microns, and 1.3-1.5 microns.

[0079] For example, as shown in FIG. 2, a third partition structure R is also provided in the third region A3, and the third partition structure R is also configured to partition at least one layer in the light-emitting functional layer 110. For example, the orthographic projection of the third partition structure R on the substrate base plate BS can be a closed ring. For example, the number of the third partition structure R can be 1-5, for example, can be at least one of 2-4, 3-5, and 1-2, and the embodiments of the present disclosure are not limited thereto.

[0080] It should be noted that the drawings of the embodiments of the present disclosure are only schematic illustrations of the film layer structure contained in the first partition structure 200, the second partition structure 300, and the third partition structure R, and are not limiting. For example, the display panel in the embodiments of the present disclosure can have other structures between the first partition structure 200 and the third partition structure R, and can also have other structures between the second partition structure 300 and the third partition structure R, and the embodiments of the present disclosure are not limited thereto. FIG. 3 is a schematic diagram of another display panel provided by at least one embodiment of the present disclosure.

[0081] For example, as shown in FIG. 3, at least one embodiment of the present disclosure also provides another display panel 02. Compared with the display panel 01 in FIG. 2, the thickness of the second isolation piece 320 in the display panel 02 in the direction perpendicular to the substrate base plate BS is greater, and the rest of the structures are the same, and specific reference can be made to the related descriptions of FIG. 2 in the above embodiments, which will not be repeated here.

[0082] For example, as shown in FIG. 3, in a direction perpendicular to the substrate base BS, the thickness of the second isolation piece 320 in the second partition structure 300 is substantially equal to the maximum thickness of the portion of the organic layer 020 located in the first region A1. Thus, the second partition structure 300 has strong partitioning capability, for example, can partition all the film layers of the light-emitting functional layer 110 with a large thickness, and also partition the second electrode 130.

[0083] For example, as shown in FIGS. 2 and 3, the orthographic projection of the second isolation piece 320 on the substrate base BS is entirely located within the orthographic projection of the first isolation piece 310 on the substrate base BS.

[0084] FIG. 4 is a schematic diagram of yet another display panel provided by at least one embodiment of the present disclosure.

[0085] For example, as shown in FIG. 4, at least one embodiment of the present disclosure also provides yet another display panel 03. Compared with the display panel 01 in FIG. 2, the second isolation piece 320 in the second partition structure 300 in the display panel 03 is different, and the rest of the structures are the same, which can be referred to the related description about FIG. 2 in the above embodiments, and will not be repeated here.

[0086] For example, as shown in FIG. 4, the orthographic projection of the first isolation piece 310 of the second partition structure 300 on the substrate base BS falls within the orthographic projection of the second isolation piece 320 of the second partition structure 300 on the substrate base BS. For example, the area of the orthographic projection of the second isolation piece 320 of the second partition structure 300 on the substrate base BS is greater than the area of the orthographic projection of the first isolation piece 310 of the second partition structure 300 on the substrate base BS.

[0087] For example, as shown in FIG. 4, in the display panel 03, the second isolation piece 320 includes a first sub-isolation part 3201 and a second sub-isolation part 3202, and the first sub-isolation part 3201 is located on the side of the second sub-isolation part 3202 away from the substrate base BS. The edge of the first isolation piece 310 protrudes relative to the edge of the first sub-isolation part 3201, and the edge of the second sub-isolation part 3202 protrudes relative to the edge of the first isolation piece 310.

[0088] Of course, in some embodiments, the edge of the first isolation piece 310 protrudes relative to the edge of the first sub-isolation part 3201, and the edge of the second sub-isolation part 3202 can also be flush with the edge of the first isolation piece 310.

[0089] For example, as shown in FIG. 4, the first sub-isolation part 3201 and the second sub-isolation part 3202 are integrally arranged, and the materials of the two are the same. For example, the area of the first sub-isolation part 3201 in the orthographic projection on the substrate substrate BS is smaller than the area of the second sub-isolation part 3202 in the orthographic projection on the substrate substrate BS, the orthographic projection of the first sub-isolation part 3201 on the substrate substrate BS falls into the orthographic projection of the second sub-isolation part 3202 on the substrate substrate BS, and the second sub-isolation part 3202 has a third protruding part 3211. For example, the second partition structure 300 can separate at least one film layer in the light-emitting functional layer 110 through the second protruding part 301 to reduce the risk of crosstalk. For example, the encapsulation layer is further arranged on the side of the second electrode 130 away from the substrate substrate BS, the second sub-isolation part 3202 has the third protruding part 3211, the encapsulation layer is facilitated to be overlapped on the second isolation part 320 through the third protruding part 3211, and the encapsulation layer is facilitated to “climb”, so that the risk of breaking of the encapsulation layer can be reduced to ensure the continuity of the encapsulation layer. In addition, in this way, the second partition structure 300 also has good stability, so that the second partition structure 300 is not prone to tilting, mispositioning and the like.

[0090] For example, as shown in FIG. 4, in the direction perpendicular to the substrate substrate BS, the thickness of the first sub-isolation part 3201 is smaller than the thickness of the second sub-isolation part 3202. For example, the thickness of the first sub-isolation part 3201 is 1 / 4-1 / 3, such as 1 / 4, 7 / 24 or 1 / 3, of the thickness of the second sub-isolation part 3202. For example, the size L1 of the first sub-isolation part 3201 in the direction perpendicular to the substrate substrate BS can be 0.2-0.3 microns, such as 0.2 microns, 0.25 microns, 0.28 microns or 0.3 microns. For example, the size L2 of the second sub-isolation part 3202 in the direction perpendicular to the substrate substrate BS can be 0.6-0.8 microns, such as 0.6 microns, 0.65 microns, 0.7 microns, 0.75 microns or 0.8 microns, which is not limited in the embodiments of the present disclosure. For example, in the direction perpendicular to the substrate substrate BS, the maximum thickness of the second isolation part 320 is substantially equal to the maximum thickness of the part of the organic layer 020 in the first display area A1, but is not limited thereto.

[0091] FIG. 5A is a schematic diagram of another display panel provided by at least one embodiment of the present disclosure; and FIG. 5B is a schematic diagram of another display panel provided by at least one embodiment of the present disclosure.

[0092] For example, as shown in FIG. 5A, at least one embodiment of the present disclosure further provides a display panel 04. Compared with the display panel 01 in FIG. 2, the second partition structure 300 of the display panel 04 is different in the second partition piece 320, and the rest of the structures are the same, which can be referred to the related description about FIG. 2 in the above embodiments, and will not be repeated here.

[0093] For example, as shown in FIG. 5A, the second partition structure 300 includes the first partition piece 310 and the second partition piece 320, and the first partition piece 310 is located on the side of the second partition piece 320 away from the substrate BS. The second partition piece 320 includes at least one layer of metal structure 3200, and at least part of the organic layer 020 located in the third area A3 covers the surface of the at least one layer of metal structure 3200.

[0094] For example, as shown in FIG. 5A, the at least one layer of metal structure 3200 can include one or more layers of metal structure. For example, the layer of metal structure farthest away from the substrate BS in the at least one layer of metal structure 3200 is in contact with the first partition piece 310. The at least one layer of metal structure 3200 can "raise" the first partition piece 310, so as to facilitate the second protruding part 301 in the first partition piece 310 to partition the at least one layer of film layer in the light-emitting functional layer 110. For example, at least part of the organic layer 020 located in the third area A3 covers the surface of the at least one layer of metal structure 3200, which can prevent the metal structure 3200 from being exposed, thereby preventing the partitioned light-emitting functional layer 110 from being electrically connected with the metal structure 3200, so as to reduce the risk of crosstalk.

[0095] For example, as shown in FIG. 5A, the at least one layer of metal structure 3200 can include a first metal structure 3210 and a second metal structure 3220 which are sequentially stacked in a direction perpendicular to the substrate BS, and the first metal structure 3210 is closer to the first partition piece 310 than the second metal structure 3220. The first metal structure 3210 and the first partition piece 310 are in contact with each other, and the orthographic projection of the first metal structure 3210 on the substrate BS falls into the orthographic projection of the first partition piece 310 on the substrate BS.

[0096] For example, as shown in FIG. 5A, the orthographic projection area of the first metal structure 3210 on the first partition piece 310 is smaller than the orthographic projection area of the second metal structure 3220 on the first partition piece 310, the edge of the first partition piece 310 protrudes relative to the edge of the first metal structure 3210, and the edge of the second metal structure 3220 protrudes relative to the edge of the first metal structure 3210. In this way, the edge of the first partition piece 310 protrudes relative to the edge of the first metal structure 3210, so as to facilitate the formation of an "undercut" structure, thereby enabling the second partition structure 300 to have good partitioning function.

[0097] For example, as shown in FIG. 5A, the at least one layer of metal structures 3200 further includes a third metal structure 3230, the third metal structure 3230 is located on the side of the second metal structure 3220 close to the substrate BS, and the third metal structure 3230 has a larger area of the orthographic projection on the substrate BS than the second metal structure 3220. Thus, the areas of the orthographic projection on the substrate BS of the first metal structure 3210, the second metal structure 3220 and the third metal structure 3230 gradually increase, and thus the area of the orthographic projection on the substrate BS of the portion of the first isolation member 310 protruding relative to the first metal structure 3210 is larger, thereby facilitating the formation of the undercut structure. For example, in some embodiments, the at least one layer of metal structures 3200 can further include other metal structures, for example, the at least one layer of metal structures 3200 can include 4-8 layers of metal structures, thereby making the thickness of the second isolation member 320 in the direction perpendicular to the substrate BS larger, so as to facilitate the second isolation member 320 to isolate the light-emitting functional layer 110 with a larger thickness. The number of layers of metal structures in the second isolation member 320 is not limited in the embodiments of the present disclosure.

[0098] For example, as shown in FIG. 5A, the thickness H1 of the portion of the organic layer 020 covering the surface of the first metal structure 3210 is smaller than the thickness H2 of the portion of the organic layer 020 covering the surface of the second metal structure 3220. For example, in the process of forming the first isolation member 310, the portion of the organic layer 020 covering the surface of the first metal structure 3210 is etched at the same time, so that the thickness of the portion of the organic layer 020 is reduced, thereby making the undercut structure of the second isolation member 300 more prominent.

[0099] For example, as shown in FIG. 5B, the display panel further includes a data line 850 and a gate line 750, and the data line 850 and the gate line 750 are electrically connected to the pixel circuit (for example, the pixel circuit 500 shown in FIG. 5A). The data line 850 is configured to provide a data signal to the pixel circuit. The gate line 750 is electrically connected to the gate electrode 710 in the pixel circuit, and the gate line 750 is configured to provide a scanning signal, for example, a gate signal, to the pixel circuit. For example, the first metal structure 3210 can be disposed in the same layer as the data line 850, and the second metal structure 3220 can be disposed in the same layer as the gate line 750, thereby simplifying the manufacturing process of the first metal structure 3210 and the second metal structure 3220, respectively, and facilitating the control of the manufacturing precision of the first metal structure 3210 and the second metal structure 3220.

[0100] FIG. 6A is a schematic diagram of another display panel provided by at least one embodiment of the present disclosure.

[0101] For example, as shown in FIG. 6A, at least one embodiment of the present disclosure further provides a display panel 05. Compared with the display panel 04 in FIG. 5A, the display panel 05 is different in that the second isolation piece 320 in the second partition structure 300, and the rest of the structures are the same, which can be referred to the related description about FIG. 5A in the above embodiments, and will not be repeated here.

[0102] For example, as shown in FIG. 6A, the second isolation piece 320 further includes an insulating structure 3001 between the first metal structure 3210 and the second metal structure 3220, so that the first metal structure 3210 and the second metal structure 3220 are insulated from each other, and the insulating structure 3001 includes an inorganic material. For example, the first metal structure 3210 and the second metal structure 3220 are spaced apart from each other by the insulating structure 3001, and the material of the insulating structure 3001 is different from the material of the organic layer 020, so as to reduce the influence on the organic layer 020. For example, the orthographic projection of the insulating structure 3001 on the substrate substrate BS is not less than the orthographic projection of the first metal structure 3210 on the substrate substrate BS. For example, the orthographic projection of the insulating structure 3001 on the substrate substrate BS can substantially coincide with the orthographic projection of the first metal structure 3210 on the substrate substrate BS. For example, the insulating structure 3001 can be disposed in the same layer as the insulating structure on the substrate substrate BS in the first area A1, so as to facilitate simplifying the manufacturing process.

[0103] For example, as shown in FIG. 6A, in the direction perpendicular to the substrate substrate BS, the maximum thickness of the second isolation piece 320 is 1 / 3-1 of the maximum thickness of the part of the organic layer 020 in the first area A1, for example, can be 1 / 3-2 / 3 or 1 / 3-3 / 4, and the embodiments of the present disclosure are not limited thereto.

[0104] For example, as shown in FIG. 6A, the display panel 05 further includes a pixel definition pattern 400 located on the substrate substrate BS and in the first area A1, and the pixel definition pattern 400 includes a plurality of first openings 410 to define the light-emitting area of at least part of the sub-pixel 10. For example, one sub-pixel 10 corresponds to at least one first opening 410, and at least part of the light-emitting element 100 of the sub-pixel 10 is located in the first opening 410 corresponding to the sub-pixel 10, and the first opening 410 is configured to expose the first electrode 120 of the sub-pixel 10. For example, the first opening 410 exposes a part of the first electrode 120. For example, one sub-pixel 10 can correspond to one first opening 410.

[0105] For example, as shown in FIG. 6A, the pixel defining pattern 400 is located on the side of the first electrode 120 away from the substrate base BS, and the first partition structure 200 is located between the first electrode 120 and the substrate base BS. When the light emitting functional layer 110 is formed in the first opening 410 of the pixel defining pattern 400, the first electrode 120 and the second electrode 130 located on both sides of the light emitting functional layer 110 can drive the light emitting functional layer 110 in the first opening 410 to emit light. For example, the above-mentioned light emitting area can refer to the area of the effective light emission of the sub-pixel, and the shape of the light emitting area refers to a two-dimensional shape, for example, the shape of the light emitting area can be the same as the shape of the first opening 410 of the pixel defining pattern 400.

[0106] For example, as shown in FIG. 6A, the first partition structure 200 is located in the first area A1 and between the light emitting functional layer 110 and the substrate base BS, and the first partition structure 200 includes a portion surrounding the light emitting area of each of the at least part of the sub-pixels 10. For example, the first partition structure 200 is located between the first electrode 120 and the substrate base BS, and the orthographic projection of the first opening 410 on the substrate base BS falls into the orthographic projection of the first partition structure 200 on the substrate base BS. For example, the orthographic projection of the first electrode 120 on the substrate base BS falls into the orthographic projection of the first partition structure 200 on the substrate base BS.

[0107] For example, as shown in FIG. 6A, the display panel 01 further includes a pixel circuit 500. The pixel circuit 500 is located on the side of the first partition structure 200 close to the substrate base BS, and the pixel circuit 500 is electrically connected to the first electrode 120. For example, the pixel circuit 500 is configured to drive the light emitting element 100 to emit light. For example, the pixel circuit 500 is configured to provide a driving current to drive the light emitting element 100 to emit light. For example, the pixel circuit 500 can include a plurality of transistors and at least one capacitor (not shown in the figure), and the first electrode 120 can be electrically connected to the pixel circuit 500 through a connection via N1. For example, the pixel circuit can adopt a 2T1C, 3T1C or 7T1C design.

[0108] FIG. 6B is a schematic diagram of a light emitting element with a Tandem structure.

[0109] For example, as shown in FIG. 6B, the charge generation layers (CGLs) between different light emitting elements with a Tandem structure are connected to each other. FIG. 6B shows a first electrode E1, a second electrode E2, a light coupling layer CPL, a hole transport layer HTL, a hole injection layer HIL, an electron transport layer ETL, an electron injection layer EIL, a hole blocking layer HBL, a P-doped charge generation layer P-CGL, an N-doped charge generation layer N-CGL, a light emitting layer R, a light emitting layer G, and a light emitting layer B. As shown in FIG. 6B, the hole transport layer HTL includes a hole transport layer HTL-1 and a hole transport layer HTL-2. The electron transport layer ETL includes an electron transport layer ETL-1 and an electron transport layer ETL-2. The hole blocking layer HBL includes a hole blocking layer HBL-1 and a hole blocking layer HBL-2. For example, the hole transport layer HTL, the hole injection layer HIL, the electron transport layer ETL, the electron injection layer EIL, the hole blocking layer HBL, the P-doped charge generation layer P-CGL, and the N-doped charge generation layer N-CGL can be common layers of the light emitting functional layers.

[0110] For example, as shown in FIG. 6B, the light emitting layer R includes a first sub light emitting layer R1 and a first auxiliary light emitting layer R2, the light emitting layer G includes a second sub light emitting layer G1 and a second auxiliary light emitting layer G2, and the light emitting layer B includes a third sub light emitting layer B1 and a third auxiliary light emitting layer B2. For example, the first auxiliary light emitting layer R2, the second auxiliary light emitting layer G2, and the third auxiliary light emitting layer B2 can adjust the microcavity thickness and the transport rate of the carriers, so that the excitons can recombine and emit light in the light emitting layer.

[0111] FIG. 7 is a structural diagram of a first area of the display panel shown in FIG. 1 in an example. FIG. 8 is a partial enlarged view of the M area in FIG. 7.

[0112] For example, as shown in FIG. 6A and FIG. 7, the pixel defining pattern 400 further includes a second opening 420, the part of at least one layer of the light emitting functional layers 110 located in the first opening 410 is a continuous part, and at least part of the at least one layer of the light emitting functional layers 110 located in the at least one second opening 420 is a discontinuous part. The part of the first discontinuous structure 200 exposed by the second opening 420 is configured to be a discontinuous part of the at least one layer of the light emitting functional layers 110.

[0113] For example, as shown in FIG. 6A and FIG. 7, the portion of the first partition structure 200 exposed by the second opening 420 includes a partition portion 415, the partition portion 415 is arranged between at least two adjacent sub-pixels 10, and at least one film layer in the light-emitting functional layer 110 is disconnected at the edge of the partition portion 415. By arranging the partition portion 415 for partitioning at least one film layer in the light-emitting functional layer 110 between adjacent sub-pixels 10, it is beneficial to reduce the probability of crosstalk between adjacent sub-pixels 10. For example, the above-mentioned partition portion 415 refers to a structure in the first partition structure 200 exposed by the second opening 420.

[0114] The “adjacent sub-pixel” in any embodiment of the present disclosure refers to two sub-pixels without other sub-pixels arranged therebetween. The adjacent sub-pixel can refer to two sub-pixels of the same color, or two sub-pixels of different colors.

[0115] For example, as shown in FIG. 6A and FIG. 7, at least part of the second electrode 120 is disconnected at the edge of the partition portion 415.

[0116] For example, as shown in FIG. 7, the display panel 01 includes a first sub-pixel 11, a second sub-pixel 12, and a third sub-pixel 13. For example, the first sub-pixel 11, the second sub-pixel 12, and the third sub-pixel 13 are configured to emit light of different colors, but are not limited thereto. For example, any two of the first sub-pixel 11, the second sub-pixel 12, and the third sub-pixel 13 can also be configured to emit light of the same color. For example, the area of the light-emitting region of one first sub-pixel 11 is greater than the area of the light-emitting region of one second sub-pixel 12, and the area of the light-emitting region of one first sub-pixel 11 is greater than the area of the light-emitting region of one third sub-pixel 13. For example, the area of the light-emitting region of one second sub-pixel 12 is greater than the area of the light-emitting region of one third sub-pixel 13.

[0117] In some examples, as shown in FIG. 7, the first sub-pixel 11 is a blue sub-pixel, one of the second sub-pixel 12 and the third sub-pixel 13 is a red sub-pixel, and the other of the second sub-pixel 12 and the third sub-pixel 13 is a green sub-pixel. FIG. 7 schematically shows that the second sub-pixel 12 is a red sub-pixel and the third sub-pixel 13 is a green sub-pixel, but is not limited thereto. For example, the second sub-pixel 12 can also be a green sub-pixel, and the third sub-pixel 13 can be a red sub-pixel.

[0118] For example, as shown in FIG. 6A and FIG. 7, in a direction perpendicular to the substrate base BS, the first partition structure 200 includes a portion overlapping with the pixel definition pattern 400, a portion overlapping with the first opening 410, and a portion overlapping with the second opening 420. The portion of the first partition structure 200 exposed by the second opening 420 is configured to partition at least one film layer of the light-emitting functional layer 110. For example, the display panel 01 includes a first partition portion 1101, a second partition portion 1102, and a third partition portion 1103. For example, the first partition portion 1101 includes a portion overlapping with the light-emitting region of the first sub-pixel 11 and a portion surrounding the light-emitting region of the first sub-pixel 11, the second partition portion 1102 includes a portion overlapping with the light-emitting region of the second sub-pixel 12 and a portion surrounding the light-emitting region of the second sub-pixel 12, and the third partition portion 1103 includes a portion overlapping with the light-emitting region of the third sub-pixel 13 and a portion surrounding the light-emitting region of the third sub-pixel 13.

[0119] For example, as shown in FIG. 7, the portion of the first partition portion 1101 exposed by the second opening 420 is a first defined partition portion 11011, and the portion of the second partition portion 1102 exposed by the second opening 420 is a second defined partition portion 11021. For example, the light-emitting functional layer 110 and the second electrode 130 of the first sub-pixel 11 are disconnected at the edge of the first defined partition portion 11011. The light-emitting functional layer 110 and the second electrode 130 of the second sub-pixel 12 are disconnected at the edge of the second defined partition portion 11021.

[0120] For example, as shown in FIG. 7, only one first defined partition portion 11011 or one second defined partition portion 11021 is arranged between two adjacent sub-pixels arranged in the U direction, and only one first defined partition portion 11011 or one second defined partition portion 11021 is arranged between two adjacent sub-pixels arranged in the V direction, thereby facilitating the balance between crosstalk and power consumption between adjacent sub-pixels. For example, the U direction and the V direction are both parallel to the substrate base, and the U direction is perpendicular to the V direction.

[0121] For example, as shown in FIG. 7, the portion of the first partition portion 1101 corresponding to the first sub-pixel 11 exposed by the second opening 420 is a structure arranged at intervals, and the portion of the second partition portion 1102 corresponding to the second sub-pixel 12 exposed by the second opening 420 is a structure arranged at intervals. The orthographic projection of the first defined partition portion 11011 and the second defined partition portion 11021 on the substrate base is a non-closed ring. The third partition portion 1103 corresponding to the third sub-pixel 13 is not exposed by the second opening 420.

[0122] For example, as shown in FIG. 7, the first sub-pixel 11 includes a first corner 011 formed by connecting two adjacent edges of the light-emitting region thereof, a second corner 012 formed by connecting two adjacent edges of the light-emitting region thereof, a third corner 013 formed by connecting two adjacent edges of the light-emitting region thereof, and a fourth corner 014 formed by connecting two adjacent edges of the light-emitting region thereof. The portion of the first partition 1101 corresponding to the first sub-pixel 11 that is exposed by the second opening 420 only surrounds the portion of the two adjacent edges of the light-emitting region thereof other than the first corner 011, the portion of the two adjacent edges of the light-emitting region thereof other than the second corner 012, the portion of the two adjacent edges of the light-emitting region thereof other than the third corner 013, and the portion of the two adjacent edges of the light-emitting region thereof other than the fourth corner 014, thereby facilitating the continuity of the second electrode 130 (as shown in FIG. 6A) and reducing the power consumption of the display panel.

[0123] For example, as shown in FIG. 7, the second sub-pixel 12 includes a fifth corner 015 formed by connecting two adjacent edges of the light-emitting region thereof, a sixth corner 016 formed by connecting two adjacent edges of the light-emitting region thereof, a seventh corner 017 formed by connecting two adjacent edges of the light-emitting region thereof, and an eighth corner 018 formed by connecting two adjacent edges of the light-emitting region thereof. The portion of the second partition 1102 corresponding to the second sub-pixel 12 that is exposed by the second opening 420 only surrounds the portion of the two adjacent edges of the light-emitting region thereof other than the fifth corner 015, the portion of the two adjacent edges of the light-emitting region thereof other than the sixth corner 016, the portion of the two adjacent edges of the light-emitting region thereof other than the seventh corner 017, and the portion of the two adjacent edges of the light-emitting region thereof other than the eighth corner 018, thereby facilitating the continuity of the second electrode 130 (as shown in FIG. 6A) and reducing the power consumption of the display panel.

[0124] For example, as shown in FIG. 8, the display panel includes a plurality of first connecting portions 2101 extending along the direction X, and a plurality of second connecting portions 2102 extending along the direction Y. The first connecting portions 2101 and the second connecting portions 2102 are both integrally provided with the first isolation portion 210, the first partition 1101 is connected to the second partition 1102 through the second connecting portion 2102, and the third isolation portion 1103 is connected to the second connecting portion 2102 through the first connecting portion 2101. The second connecting portion 2102 extends along the direction Y and is substantially in the shape of a strip, so as to reduce the risk of peeling and facilitate the outgassing of the organic layer 020 located on the side of the first isolation portion 210 close to the substrate BS. For example, the direction X is parallel to the substrate BS, and the direction X is perpendicular to the direction Y. For example, the direction X intersects the direction U, and the direction Y intersects the direction V. For example, the angle between the direction X and the direction U is 45°, and the angle between the direction Y and the direction V is 45°.

[0125] For example, as shown in FIG. 8, the minimum distance between the orthographic projection of the second opening 420 corresponding to the first or second sub-pixel 11 or 12 on the substrate and the orthographic projection of the second connecting portion 2102 on the substrate is d1, and d1 is greater than 2 microns, for example, can be 3 microns or 4 microns, so that the portion of the first or second partition portion 1101 exposed by the second opening 420 can effectively partition at least one film layer in the light-emitting functional layer, or the portion of the second partition portion 1102 exposed by the second opening 420 can effectively partition at least one film layer in the light-emitting functional layer, in the case of conforming to the process deviation.

[0126] For example, as shown in FIG. 8, the minimum distance between the orthographic projection of the second opening 420 corresponding to the first or second sub-pixel 11 or 12 on the substrate and the orthographic projection of the second connecting portion 2102 on the substrate is d2, and d2 is greater than 2 microns, for example, can be 3 microns or 4 microns, so that the portion of the first or second partition portion 1101 exposed by the second opening 420 can effectively partition at least one film layer in the light-emitting functional layer, or the portion of the second partition portion 1102 exposed by the second opening 420 can effectively partition at least one film layer in the light-emitting functional layer, in the case of conforming to the process deviation.

[0127] For example, as shown in FIG. 8, the portion of the first partition portion 1101 exposed by the second opening 420 corresponding to the first sub-pixel 11 is a first non-closed partition ring, the portion of the second partition portion 1102 exposed by the second opening 420 corresponding to the second sub-pixel 12 is a second non-closed partition ring, and the average ring width of the first partition ring and the average ring width of the second partition ring are both d3, and d3 is greater than 3 microns, for example, can be 4 microns or 5 microns, so that the orthographic projection area of the portion of the first and second partition portions 1101 and 1102 exposed by the second opening 420 on the substrate is large enough to meet the requirement of partitioning at least one film layer in the light-emitting functional layer.

[0128] For example, as shown in FIG. 8, the orthographic projection of the second opening 420 corresponding to the first sub-pixel 11 on the substrate is a non-closed ring, and the difference between the average ring width of the ring and the average ring width d3 of the first partition ring described above is d4, and d4 is greater than 3 microns, for example, can be 4 microns or 5 microns. For example, the orthographic projection of the second opening 420 corresponding to the second sub-pixel 12 on the substrate is a non-closed ring, and the difference between the average ring width of the ring and the average ring width d3 of the second partition ring described above is also d4. For example, the orthographic projection of the second opening 420 on the substrate is a non-closed ring, and the ring width of the ring is d3+d4, and is greater than 10 microns, for example, can be 11 microns, 12 microns or 13 microns.

[0129] In this way, the second opening 420 can have a large enough opening area, which is conducive to the part of the first partition portion 1101 exposed by the second opening 420 to partition at least one film layer in the light-emitting functional layer, and conducive to the part of the second partition portion 1102 exposed by the second opening 420 to partition at least one film layer in the light-emitting functional layer.

[0130] For example, as shown in FIG. 8, the third partition portion 1103 corresponding to the third sub-pixel 13 is not exposed by the second opening 420, and the part of the third partition portion 1103 beyond the first electrode 120 of the third sub-pixel 13 has a substantially annular shape on the substrate substrate, and the average ring width of the annular shape is d5, and d5 is not greater than 3 microns, for example, can be 2 microns, 1 micron or 0.5 microns, which is conducive to improving the continuity of the second electrode 130 (as shown in FIG. 6A).

[0131] For example, as shown in FIG. 7 and FIG. 8, the part of the first partition portion 1101 corresponding to the first sub-pixel 11 exposed by the second opening 420 includes a plurality of sub-portions arranged at intervals, for example, a first sub-portion 1001, a second sub-portion 1002, a third sub-portion 1003 and a fourth sub-portion 1004, and the minimum distance between the second openings 420 corresponding to adjacent sub-portions (for example, the first sub-portion 1001 and the second sub-portion 1002) is d6, and d6 is not less than 20 microns, for example, can be 22 microns, 24 microns or 25 microns, etc. For example, the part of the second partition portion 1102 corresponding to the second sub-pixel 12 exposed by the second opening 420 also includes a plurality of sub-portions arranged at intervals, and the minimum distance between the second openings 420 corresponding to adjacent sub-portions is also d6. In this way, it is conducive to ensuring the continuity of the second electrode 130 (as shown in FIG. 6A), so that the second electrode 130 of adjacent sub-pixels 10 can be well overlapped, and it is conducive to reducing power consumption.

[0132] For example, as shown in FIG. 6A and FIG. 7, the side of the pixel defining pattern 400 away from the substrate substrate BS can also be provided with a spacer 800, which can serve as a support layer and be configured to support an evaporation mask plate for manufacturing the light-emitting functional layer 110, such as an FMM (high-precision mask plate). For example, the orthogonal projection of the spacer 800 on the substrate substrate BS falls within the orthogonal projection of the second connecting portion 2102 on the substrate substrate BS, and the spacer 800 is arranged at a distance from the connecting via N1. For example, the minimum distance between the spacer 800 and the connecting via N1 is greater than 3 microns, which can be 3.5 microns, 4 microns or 5 microns, so as to reduce the impact on the pixel circuit 500.

[0133] FIG. 9 is a schematic block diagram of a display device according to at least one embodiment of the present disclosure.

[0134] As shown in FIG. 9, the display device 1000 includes a display panel 001. The display panel 001 can be any of the display panels in the above embodiments.

[0135] For example, the display device 1000 can be an organic light-emitting diode display device.

[0136] For example, the display device 1000 can further include a cover plate located on the light-out side of the display panel 1001.

[0137] For example, the display device 1000 can be any product or component with display function, such as a television, a digital camera, a mobile phone, a watch, a tablet computer, a notebook computer, a navigator, etc., and the embodiments are not limited thereto.

[0138] For example, the display device 1000 can be a medium-large size smart handheld display device (NB) or a touch display device (TPC), and also has wide application potential in the field of folding products.

[0139] FIGS. 10-14 are flowcharts of manufacturing methods of display panels according to the embodiments of the present disclosure.

[0140] At least one embodiment of the present disclosure further provides a manufacturing method of a display panel. For example, the manufacturing method is applicable to any of the display panels in the above embodiments.

[0141] As shown in FIG. 10, the display panel 0001 includes a first area A1, a second area A2, and a third area A3 located between the first area A1 and the second area A2, the first area A1 is configured to display, the second area A2 is configured to transmit light, and the first area A1 is located on at least one side of the second area A2. For example, the first area A1 is a display area configured to display. The second area A2 is a hollow area configured to transmit light, and hardware such as a photosensitive sensor can be arranged in the second area A2.

[0142] As shown in FIGS. 10 and 11, the manufacturing method of the display panel 0001 includes:

[0143] An organic material layer 020 is formed on the substrate BS, and the organic material layer 020 is patterned to form an organic layer pattern 0200 in the third area A3.

[0144] Then, as shown in FIGS. 12 and 13, the inorganic material layer 010 is formed on the organic layer pattern 0200, and the inorganic material layer 010 is patterned to form the first partition structure 200 in the first area A1 and the second partition structure 300 in the third area A3. For example, as shown in FIG. 14, after the inorganic material layer 010 is patterned, the first isolation portion 210 is formed in the first area A1, and the first isolation piece 310 is formed in the third area A3, so that at least part of the inorganic material layer 010 located in the first area A1 is patterned to form the first isolation portion 210, and at least part of the inorganic material layer 010 located in the third area A3 is patterned to form the first isolation piece 310.

[0145] As shown in FIG. 13, the first partition structure 200 and the second partition structure 300 are both configured to partition at least one layer of the light-emitting functional layer 110. The first partition structure 200 includes the first isolation portion 210 and the second isolation portion 220 which are stacked, the first isolation portion 210 is located on the side of the second isolation portion 220 away from the substrate substrate BS, and the first isolation portion 210 includes the first protruding portion 201 which protrudes relative to the edge of the second isolation portion 220. The second partition structure 300 includes the first isolation piece 310 and the second isolation piece 320 which are stacked, the first isolation piece 310 is located on the side of the second isolation piece 320 away from the substrate substrate BS, and the first isolation piece 310 includes the second protruding portion 301 which protrudes relative to at least part of the edge of the second isolation piece 320. For example, the second protruding portion 301 protrudes relative to the edge of the part of the second isolation piece 320 close to and in contact with the first isolation piece 310.

[0146] The manufacturing method of the display panel proposed by the embodiments of the present disclosure is simple and easy to implement, and can make the first isolation portion 210 and the first isolation piece 310 be patterned by the same mask to form, so as to simplify the manufacturing process and easily control the process deviation, and at the same time, the structure of the first partition structure 200 and the second partition structure 300 can be simple, so that the first partition structure 200 located in the first display area A1 and the second partition structure 300 located in the third area A3 have good structural uniformity.

[0147] For example, as shown in FIGS. 12-14, forming the inorganic material layer 010 on the organic layer pattern 0200, and patterning the inorganic material layer 010 to form the first partition structure 200 in the first area A1 and the second partition structure 300 in the third area A3, comprising:

[0148] Firstly, as shown in FIG. 12 and FIG. 14, the inorganic material layer 010 is patterned to form the first partition structure 200 in the first area A1 and form the initial partition structure 3000 in the third area A3, the initial partition structure 3000 includes the first isolation piece 310 and the initial isolation piece 3200, the first isolation piece 310 and the initial isolation piece 3200 are arranged in a stack, and the edge of the first isolation piece 310 protrudes relative to at least part of the edge of the initial isolation piece 3200. For example, the part of the first isolation piece 310 protruding relative to at least part of the edge of the initial isolation piece 3200 is the initial protruding part 3010, and the projection of the initial protruding part 3010 on the substrate substrate BS is annular, and the average ring width of the annular ring is D1.

[0149] Then, as shown in FIG. 13 and FIG. 14, the initial isolation piece 3200 in the third area A3 in FIG. 14 is further etched to form the second partition structure 300 in FIG. 13. For example, the initial isolation piece 3200 can be etched by additionally setting a layer of mask in the third area A3, so that at least part of the initial isolation piece 3200 directly below the first isolation piece 310 is etched. For example, the part of the first isolation piece 310 protruding relative to at least part of the edge of the second isolation piece 320 is the second protruding part 301, the orthographic projection of the second protruding part 301 on the substrate substrate BS is annular, and the average ring width of the annular ring is D2. As shown in FIG. 13 and FIG. 14, D2 is greater than D1. Thus, by further etching the initial isolation piece 3200 in the third area A3, the second partition structure 300 can have a clear "undercut" structure to enhance the partitioning capability. For example, in some embodiments, in the first area A1, the first partition structure 200 only partitions part of the film layers in the light-emitting functional layer, but does not partition the second electrode. In the third area A3, the second partition structure 300 partitions all the film layers in the light-emitting functional layer, and also partitions the second electrode, so that the second partition structure 300 can have stronger partitioning capability.

[0150] For example, as shown in FIG. 10, the manufacturing method of the display panel provided by the embodiments of the present disclosure can include: preparing a substrate substrate BS on a glass carrier plate. For example, the substrate substrate BS can be a flexible substrate substrate. For example, forming the substrate substrate BS can include sequentially forming a first flexible material layer, a first inorganic material layer, a semiconductor layer, a second flexible material layer and a second inorganic material layer on the glass carrier plate. The material of the first flexible material layer and the second flexible material layer adopts polyimide (PI), polyethylene terephthalate (PET) or a surface-treated polymer soft film and the like. The material of the first inorganic material layer and the second inorganic material layer adopts silicon nitride (SiNx) or silicon oxide (SiOx) and the like, which is used to improve the water and oxygen resistance of the substrate substrate, and the first inorganic material layer and the second inorganic material layer are also called barrier layers.

[0151] For example, as shown in FIG10, the method for manufacturing a display panel provided in the embodiments of this disclosure may further include: forming a driving structure layer for pixel circuits on a substrate BS. The driving structure layer includes a plurality of pixel circuits 500, each pixel circuit 500 including a plurality of transistors and at least one storage capacitor. For example, the pixel circuits 500 may adopt a 2T1C, 3T1C, or 7T1C design. For example, in some embodiments, forming the driving structure layer may include: sequentially depositing a first insulating film and an active layer film on the substrate BS, patterning the active layer film through a patterning process to form a first insulating layer covering the entire substrate BS, and an active layer pattern disposed on the first insulating layer, the active layer pattern including at least an active layer. For example, sequentially depositing a second insulating film and a first metal film, patterning the first metal film through a patterning process to form a second insulating layer covering the active layer pattern, and a first gate metal layer pattern disposed on the second insulating layer, the first gate metal layer pattern including at least a gate electrode and a first capacitor electrode. For example, a third insulating film and a second metal film are deposited sequentially. The second metal film is patterned using a patterning process to form a third insulating layer covering the first gate metal layer, and a second gate metal layer pattern disposed on the third insulating layer. The second gate metal layer pattern includes at least a second capacitor electrode, the position of which corresponds to the position of the first capacitor electrode. Subsequently, a fourth insulating film is deposited and patterned using a patterning process to form a fourth insulating layer covering the second gate metal layer. At least two vias are formed on the fourth insulating layer, and the fourth, third, and second insulating layers within the two vias are etched away to expose the surface of the active layer of the active layer pattern. Subsequently, a third metal film is deposited and patterned using a patterning process to form a source / drain metal layer pattern on the fourth insulating layer. The source / drain metal layer pattern includes at least a source electrode and a drain electrode located in the display area. The source electrode and drain electrode can be connected to the active layer in the active layer pattern through vias, respectively.

[0152] For example, the first, second, third and fourth insulating layers can be any one or more of silicon oxide (SiOx), silicon nitride (SiNx) and silicon oxynitride (SiON), and can be a single layer, multiple layers or a composite layer. For example, the first insulating layer can be a buffer layer for improving the water-oxygen resistance of the substrate BS. For example, the second and third insulating layers can be gate insulator (GI) layers. For example, the fourth insulating layer can be an interlayer dielectric (ILD) layer. For example, the first, second and third metal thin films can be any one or more of silver (Ag), copper (Cu), aluminum (Al), titanium (Ti) and molybdenum (Mo), or an alloy material of the above metals, such as aluminum-neodymium alloy (AlNd) or molybdenum-niobium alloy (MoNb), and can be a single layer structure or a multi-layer composite structure, such as Ti / Al / Ti, etc. For example, the active layer thin film can be one or more of amorphous indium gallium zinc oxide material (a-IGZO), zinc oxynitride (ZnON), indium zinc tin oxide (IZTO), amorphous silicon (a-Si), polycrystalline silicon (p-Si), hexathienyl, polythiophene, etc., i.e., the present disclosure is applicable to transistors manufactured based on oxide technology, silicon technology and organic technology.

[0153] For example, as shown in FIG. 2, after the first and second partition structures 200 and 300 are formed, the manufacturing method of the display panel provided by the embodiments of the present disclosure further includes patterning the first electrode 120 on the first partition structure 200. For example, the first electrode 120 can be any one or more of magnesium (Mg), silver (Ag), copper (Cu), aluminum (Al), titanium (Ti) and molybdenum (Mo), or an alloy material of the above metals, such as aluminum-neodymium alloy (AlNd) or molybdenum-niobium alloy (MoNb), and can be a single layer structure or a multi-layer composite structure, such as Ti / Al / Ti, etc., or a stack structure formed by a metal and a transparent conductive material, such as ITO / Ag / ITO, Mo / AlNd / ITO, etc. For example, the first electrode 120 is electrically connected to the pixel circuit 500 through the connection via N1.

[0154] For example, as shown in FIG. 2, after the first electrode 120 is formed, the pixel defining pattern 400 can be formed. For example, a pixel defining film is coated on the substrate BS on which the aforementioned pattern is formed, and the pixel defining pattern 400 is formed through a mask, exposure, and development process. For example, the pixel defining pattern 400 of the first area Al includes a first opening 410 and a second opening 420 (as shown in FIG. 7), the pixel defining film in the first opening 410 and the second opening 420 is developed away, the first opening 410 exposes at least part of the surface of the first electrode 120 of the plurality of sub-pixels 10, and the second opening 420 exposes the first partition structure 200.

[0155] For example, as shown in FIG. 2 and FIG. 7, after the pixel defining pattern 400 is formed, the spacer 800 can be formed on the pixel defining pattern 400. For example, an organic material film is coated on the substrate BS on which the aforementioned pattern is formed, and the spacer is formed through a mask, exposure, and development process. The spacer can be configured as a support layer to support an FMM (fine mask) during an evaporation process.

[0156] For example, as shown in FIG. 2 and FIG. 7, after the spacer 800 is formed, the light emitting functional layer 110 and the second electrode 130 are sequentially formed. For example, the second electrode 130 can be a transparent cathode. The light emitting functional layer 110 can emit light from the side away from the substrate BS through the transparent cathode, achieving top emission. For example, the second electrode 130 can be made of any one or more of magnesium (Mg), silver (Ag), and aluminum (Al), or an alloy made of any one or more of the aforementioned metals, or a transparent conductive material, for example, indium tin oxide (ITO), or a multi-layer composite structure of a metal and a transparent conductive material.

[0157] For example, as shown in FIG. 2, forming the light emitting functional layer 110 can include: sequentially evaporating to form a hole injection layer and a hole transport layer using an open mask; sequentially evaporating to form first light emitting layers 111 emitting light of different colors, such as a blue light emitting layer, a green light emitting layer, or a red light emitting layer, using an FMM; sequentially evaporating to form an electron transport layer, a charge generation layer 113, and a hole transport layer using an open mask; sequentially evaporating to form second light emitting layers 112 emitting light of different colors, such as a blue light emitting layer, a green light emitting layer, or a red light emitting layer, using an FMM; and sequentially evaporating to form an electron transport layer, a second electrode 130, and a light coupling layer using an open mask. For example, the hole injection layer, the hole transport layer, the electron transport layer, the charge generation layer, the second electrode 130, and the light coupling layer are common layers of the plurality of sub-pixels.

[0158] For example, as shown in FIG. 2 and FIG. 7, in the first area A1, the formed light-emitting functional layer 110 is disconnected at the edge of the first partition structure 200, so that the risk of crosstalk between adjacent sub-pixels 10 can be reduced. In the third area A3, the formed light-emitting functional layer 110 is disconnected at the edge of the second partition structure 300, so that the risk of crosstalk of the sub-pixel 10 located near the edge of the first area A1 can be further reduced.

[0159] For example, after the second electrode is formed, the manufacturing method of the display panel further includes forming an encapsulation layer, which can include a first encapsulation layer, a second encapsulation layer and a third encapsulation layer stacked. The first encapsulation layer is made of inorganic material and covers the second electrode in the display area. The second encapsulation layer is made of organic material. The third encapsulation layer is made of inorganic material and covers the first encapsulation layer and the second encapsulation layer. However, the present embodiment is not limited thereto. For example, the encapsulation layer can also adopt a five-layer structure of inorganic / organic / inorganic / organic / inorganic.

[0160] The following points need to be explained:

[0161] (1) In the drawings of the embodiments of the present disclosure, only the structures related to the embodiments of the present disclosure are involved, and other structures can be referred to the general design.

[0162] (2) In the case of no conflict, the features in the same and different embodiments of the present disclosure can be combined with each other.

[0163] The above only describes exemplary embodiments of the present disclosure, and is not used to limit the protection scope of the present disclosure, and the protection scope of the present disclosure is determined by the appended claims.

Claims

1. A display panel, comprising: a first area configured to display; a second area configured to transmit light, the first area being located at least one side of the second area; a third area located between the first area and the second area; a plurality of sub-pixels located in the first area, each of at least part of the sub-pixels comprising a light-emitting functional layer, the light-emitting functional layer comprising a plurality of film layers; a substrate and an inorganic layer located on the substrate; a first partition structure located on the substrate and between adjacent sub-pixels in the first area, the first partition structure comprising a first isolation portion and a second isolation portion arranged in layers, the first isolation portion being located on a side of the second isolation portion away from the substrate, the first isolation portion comprising a first protruding portion protruding relative to an edge of the second isolation portion; and a second partition structure located on the substrate and in the third area, the second partition structure comprising a first isolation member and a second isolation member arranged in layers, the first isolation member being located on a side of the second isolation member away from the substrate, the first isolation member comprising a second protruding portion protruding relative to at least part of an edge of the second isolation member; wherein the first partition structure and the second partition structure are both configured to partition at least one layer of the light-emitting functional layer, at least part of the inorganic layer located in the first area serving as the first isolation portion, and at least part of the inorganic layer located in the third area serving as the first isolation member. 2.The display panel of claim 1, further comprising an organic layer located on the substrate, the inorganic layer being located on a side of the organic layer away from the substrate, at least part of the organic layer located in the first area serving as the second isolation portion, and at least part of the organic layer located in the third area serving as at least part of the second isolation member. The first protruding portion of the first isolation portion has a first ring shape in orthographic projection on the substrate, and the second protruding portion of the first isolation member has a second ring shape in orthographic projection on the substrate, an average ring width of the first ring shape being smaller than an average ring width of the second ring shape. The average ring width of the second ring shape is 1.2 to 3 times the average ring width of the first ring shape. 5.The display panel of any one of claims 1 to 4, in a direction perpendicular to the substrate, a thickness of the first isolation portion being substantially equal to a thickness of the first isolation member. In a direction perpendicular to the substrate, a maximum thickness of the part of the organic layer located in the first area is greater than or equal to a maximum thickness of the part of the organic layer located in the third area. The first isolation member of the second partition structure has orthographic projection on the substrate falling within orthographic projection on the substrate of the second isolation member of the second partition structure. The second isolation member comprises a first sub-isolation portion and a second sub-isolation portion, the first sub-isolation portion being located on a side of the second sub-isolation portion away from the substrate, ​ ​ wherein, ​ 3. The display panel of claim 1 or 2, wherein, ​ 4. The display panel of claim 3, wherein, ​ ​ 6. The display panel of claim 2, wherein, ​ 7. The display panel of claim 6, wherein, ​ 8. The display panel of claim 6 or 7, wherein, ​ An edge of the first spacer protrudes relative to an edge of the first sub-spacer, and an edge of the second sub-spacer protrudes relative to or is flush with an edge of the first spacer.

9. The display panel of claim 2, wherein, The second spacer includes at least one metal structure, and at least part of the organic layer in the third region covers a surface of the at least one metal structure.

10. The display panel of claim 9, wherein, The at least one metal structure includes a first metal structure and a second metal structure stacked in a direction perpendicular to the substrate in sequence, the first metal structure is closer to the first spacer than the second metal structure, and an edge of the second metal structure protrudes relative to an edge of the first metal structure.

11. The display panel of claim 10, wherein, The first metal structure and the first spacer are in contact with each other, and a projection of the first metal structure on the substrate falls within a projection of the first spacer on the substrate.

12. The display panel of claim 11, wherein, A thickness of a part of the organic layer covering a surface of the first metal structure is less than a thickness of a part of the organic layer covering a surface of the second metal structure.

13. The display panel of claim 10, wherein, The second spacer further includes an insulating structure between the first metal structure and the second metal structure to insulate the first metal structure from the second metal structure, and the insulating structure includes an inorganic material.

14. The display panel according to any one of claims 9 to 13, wherein, In a direction perpendicular to the substrate, a maximum thickness of the second spacer is 1 / 3 to 1 of a maximum thickness of a part of the organic layer in the first region.

15. The display panel of any one of claims 10-14, further comprising: a pixel definition pattern on the substrate in the first region, the pixel definition pattern including a plurality of first openings to define light emitting regions of the at least part of the sub-pixels, wherein the first partition structure is between the light emitting functional layer and the substrate, the first partition structure including a portion surrounding the light emitting region of each of the at least part of the sub-pixels, the pixel definition pattern further includes second openings, a part of the at least one layer of the light emitting functional layer in the first openings is a continuous part, and at least part of the partition in at least one second opening, a part of the first partition structure exposed by the second openings is configured to partition the at least one layer of the light emitting functional layer; each of the at least part of the sub-pixels further includes a first electrode and a second electrode on both sides of the light emitting functional layer in a direction perpendicular to the substrate, the first electrode is between the light emitting functional layer and the substrate, the pixel definition pattern is on a side of the first electrode away from the substrate, and the first partition structure is between the first electrode and the substrate, the display panel further includes a pixel circuit, the pixel circuit is on a side of the first partition structure close to the substrate, and the pixel circuit is electrically connected to the first electrode.

16. The display panel of claim 15, further comprising a data line and a gate line on the substrate and in the first region, the data line and the gate line being electrically connected to the pixel circuit respectively, the data line being configured to provide a data signal to the pixel circuit, and the gate line being configured to provide a scan signal to the pixel circuit, wherein, the first metal structure is disposed in the same layer as the data line, and the second metal structure is disposed in the same layer as the gate line.

17. The display panel of claim 8, wherein, In a direction perpendicular to the substrate, a thickness of the first sub-isolation portion is 1 / 4 to 1 / 3 of a thickness of the second sub-isolation portion.

18. A display device comprising the display panel of any one of claims 1-17.

19. A method of manufacturing a display panel, wherein, The display panel comprises a first region, a second region, and a third region between the first region and the second region, the first region being configured to display, the second region being configured to transmit light, and the first region being located on at least one side of the second region; The manufacturing method comprises: forming an organic material layer on the substrate, and patterning the organic material layer to form an organic layer pattern in the third region; forming an inorganic material layer on the organic layer pattern, and patterning the inorganic material layer to form a first partition structure in the first region and a second partition structure in the third region, wherein the first partition structure comprises a first isolation portion and a second isolation portion stacked, the first isolation portion is located on a side of the second isolation portion away from the substrate, the first isolation portion comprises a first protruding portion protruding relative to an edge of the second isolation portion; the second partition structure comprises a first isolation piece and a second isolation piece stacked, the first isolation piece is located on a side of the second isolation piece away from the substrate, the first isolation piece comprises a second protruding portion protruding relative to at least part of an edge of the second isolation piece, the first partition structure and the second partition structure are both configured to partition at least one layer of the light-emitting functional layer, at least part of the patterning of the inorganic material layer in the first region forms the first isolation portion, and at least part of the patterning of the inorganic material layer in the third region forms the first isolation piece.

20. The method of manufacturing according to claim 19, wherein, forming an inorganic material layer on the organic layer pattern, and patterning the inorganic material layer to form a first partition structure in the first region and a second partition structure in the third region, comprises: patterning the inorganic material layer to form the first partition structure in the first region and an initial partition structure in the third region, wherein the initial partition structure comprises the first isolation piece and a second initial isolation piece, the first isolation piece and the second initial isolation piece are stacked, and an edge of the first isolation piece protrudes relative to at least part of an edge of the second initial isolation piece; and further etching the second initial isolation piece in the third region to form the second partition structure.

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