Display panel and manufacturing method therefor

Abstract

The present application provides a display panel and a manufacturing method therefor. According to the display panel, the area of the orthographic projection of a heat dissipation surface of a metal heat conduction layer distant from a driving circuit layer is larger than the area of the orthographic projection of a connecting surface in direct contact with the driving circuit layer, and the connecting surface is arranged corresponding to a wiring area, such that the metal heat conduction layer can be in direct contact with the driving circuit layer in the wiring area; and the metal heat conduction layer can replace a glass substrate, such that the thickness of the display panel would not be increased, and the heat dissipation effect can be improved.

Description

Display panel and manufacturing method thereof Technical Field

[0001] The present application relates to the field of display technology, and in particular to a display panel and a method for preparing the same. Background Art

[0002] Micro-LED (micro light-emitting diode) display devices are widely used due to their advantages such as self-luminescence, high brightness, high contrast, high resolution and color saturation, long life, fast response speed, and low power consumption. However, since the photoelectric conversion rate of Micro-LED is only about 30%, a large amount of power consumption is converted into heat, resulting in high temperature of Micro-LED devices. In order for Micro-LED display devices to operate normally, the heat of Micro-LED devices is dissipated through heat conduction, thermal radiation, convection, etc. However, in actual use, it is found that the thermal conductivity of glass substrates is poor, making it difficult for heat from Micro-LED devices to be conducted through the glass. This leads to high temperature of Micro-LED display devices, which cannot be used normally and shortens their lifespan. Moreover, as display devices develop towards high resolution and high brightness, the number of light-emitting chips will increase, further increasing the heat, aggravating the display problems of Micro-LED display devices, and shortening their lifespan.

[0003] Therefore, existing Micro-LED display devices have a problem in which the heat dissipation performance of the glass substrate is poor, resulting in poor display of the Micro-LED display device. SUMMARY OF THE INVENTION

[0004] The embodiments of the present application provide a display panel and a method for manufacturing the same, which are used to alleviate the problem of poor heat dissipation performance of the glass substrate in existing Micro-LED display devices, resulting in poor display of the Micro-LED display devices.

[0005] To solve the above problems, the technical solutions provided by this application are as follows:

[0006] An embodiment of the present application provides a display panel, comprising:

[0007] Metal thermal conductive layer;

[0008] an organic layer, disposed on one side of the metal heat-conducting layer;

[0009] A driving circuit layer is provided on a side of the organic layer away from the metal heat-conducting layer, the driving circuit layer including thin film transistors and metal wiring;

[0010] A display layer is provided on a side of the driving circuit layer away from the organic layer and is control-connected to the driving circuit layer;

[0011] In which, the display panel includes a routing area and a non-routing area, and the routing area is provided with at least one of a thin film transistor and the metal routing; the metal thermal conductive layer includes a connection surface close to the driving circuit layer and in direct contact with the driving circuit layer, and a heat dissipation surface away from the driving circuit layer. In the orthographic projection direction of the display panel, the orthographic projection area of ​​the heat dissipation surface is larger than the orthographic projection area of ​​the connection surface, and the connection surface is arranged corresponding to the routing area.

[0012] At the same time, an embodiment of the present application provides a method for manufacturing a display panel, wherein the method for manufacturing a display panel is for manufacturing a display panel as described in any of the above embodiments, and the method for manufacturing a display panel includes:

[0013] providing a substrate;

[0014] forming a release layer on the substrate;

[0015] forming a metal heat-conducting layer and an organic layer on the peeling layer, and etching the metal heat-conducting layer;

[0016] forming a driving circuit layer and a display layer in sequence on the organic layer;

[0017] The release layer and the substrate are peeled off to obtain a display panel. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] The following detailed description of the specific embodiments of the present application in conjunction with the accompanying drawings will make the technical solutions and other beneficial effects of the present application apparent.

[0019] FIG1 is a schematic diagram of a conventional Micro-LED display device.

[0020] FIG2 is a schematic diagram of a display panel provided in an embodiment of the present application.

[0021] FIG3 is a schematic diagram of the heat dissipation process of the test trace provided in an embodiment of the present application.

[0022] FIG4 is a flow chart of a method for manufacturing a display panel provided in an embodiment of the present application.

[0023] FIG5 is a schematic diagram of a first structure of a display panel corresponding to each step of the method for manufacturing a display panel provided in an embodiment of the present application.

[0024] FIG6 is a schematic diagram of a second structure of a display panel corresponding to each step of the method for manufacturing a display panel provided in an embodiment of the present application. Modes for Carrying Out the Invention

[0025] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the embodiments described are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without making creative efforts are within the scope of protection of this application.

[0026] In the description of the present application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present application. In addition, the terms "first" and "second" are used for descriptive purposes only and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of the said features. In the description of the present application, "multiple" means two or more, unless otherwise clearly and specifically defined.

[0027] In the description of this application, it should be noted that, unless otherwise expressly specified or limited, the terms "installed," "connected," and "connected" should be understood in a broad sense. For example, they can refer to fixed connections, detachable connections, or integral connections; they can refer to mechanical connections, electrical connections, or mutual communication; they can refer to direct connections or indirect connections through an intermediate medium; they can refer to internal communication between two components or the interaction between two components. Those skilled in the art will understand the specific meanings of the above terms in this application based on specific circumstances.

[0028] In this application, unless otherwise expressly specified or limited, a first feature being "above" or "below" a second feature may include the first and second features being in direct contact, or may include the first and second features being in contact not directly but through another feature between them. Moreover, a first feature being "above," "above," and "above" a second feature may include the first feature being directly above or obliquely above the second feature, or may simply mean that the first feature is higher in level than the second feature. A first feature being "below," "below," and "below" a second feature may include the first feature being directly below or obliquely below the second feature, or may simply mean that the first feature is lower in level than the second feature.

[0029] The disclosure below provides many different embodiments or examples for realizing different structures of the present application. In order to simplify the disclosure of the present application, the components and settings of specific examples are described below. Of course, they are merely examples and are not intended to limit the present application. In addition, the present application may repeat reference numbers and / or reference letters in different examples, and such repetition is for the purpose of simplicity and clarity, and does not itself indicate the relationship between the various embodiments and / or settings discussed. In addition, the present application provides examples of various specific processes and materials, but those of ordinary skill in the art will appreciate the application of other processes and / or the use of other materials.

[0030] As shown in Figure 1, the existing Micro-LED display device includes a glass substrate 11, a thin film transistor array layer 12, a light-emitting chip 13, an encapsulant 14 and a glass cover plate 15. The light-emitting chip 13 is connected to the thin film transistor array layer 12 through a solder joint 131. During the use of the Micro-LED display device, the photoelectric conversion efficiency of the light-emitting chip 13 is only 30%, and a large amount of power consumption will be converted into heat. Part of the heat will be conducted out through the encapsulant 14 and the glass cover plate 15, and the heat conducted to the glass cover plate 15 will be dissipated through thermal radiation and convection with the air. Part of the heat will be conducted out through the solder joint 131, the thin film transistor array layer 12 and the glass substrate 11, and the heat conducted to the glass substrate 11 will be dissipated through thermal radiation and convection with the air, thereby preventing the temperature of the light-emitting chip 13 from being too high, preventing the temperature of the Micro-LED display device from being too high, and enabling the Micro-LED display device to display normally and have a long life. However, in actual use, it was found that when heat is transferred to the glass substrate 11, due to the poor thermal conductivity of the glass substrate, the heat generated by the light-emitting chip 13 is difficult to dissipate from the glass substrate 11, resulting in a high temperature of the Micro-LED display device. As display devices develop towards high resolution and high brightness, the number of light-emitting chips will increase, which will further increase the heat, causing the Micro-LED display device to malfunction and shorten its lifespan. Therefore, existing Micro-LED display devices have the problem of poor heat dissipation performance of the glass substrate, which leads to poor display of the Micro-LED display device.

[0031] In response to the above technical problems, embodiments of the present application provide a display panel and a method for manufacturing the same to alleviate the above technical problems.

[0032] As shown in FIG2 , an embodiment of the present application provides a display panel, wherein the display panel 2 includes:

[0033] Metal heat conducting layer 21;

[0034] The organic layer 22 is provided on one side of the metal heat-conducting layer 21;

[0035] A driving circuit layer 24 is provided on a side of the organic layer 22 away from the metal heat-conducting layer 21 , and includes a thin film transistor 247 and a metal trace 248 ;

[0036] The display layer 25 is disposed on a side of the driving circuit layer 24 away from the organic layer 22;

[0037] In which, the display panel 2 includes a routing area 281 and a non-routing area 282, and the routing area 281 is provided with at least one of a thin film transistor 247 and the metal routing 248; the metal thermal conductive layer 21 includes a connection surface 211 close to the driving circuit layer 24 and in direct contact with the driving circuit layer 24, and a heat dissipation surface 212 away from the driving circuit layer 24. In the orthographic projection direction of the display panel 2 (for example, the horizontal plane direction at a top-down angle of the display panel 2), the orthographic projection area of ​​the heat dissipation surface 212 is larger than the orthographic projection area of ​​the connection surface 211, and the connection surface 211 is arranged corresponding to the routing area 281.

[0038] An embodiment of the present application provides a display panel, which is provided with a metal thermal conductive layer so that the orthographic projection area of ​​the heat dissipation surface of the metal thermal conductive layer away from the driving circuit layer is larger than the orthographic projection area of ​​the connection surface directly in contact with the driving circuit layer. The connection surface is provided corresponding to the routing area, so that the metal thermal conductive layer can be in direct contact with the driving circuit layer in the routing area. When the display panel generates heat, the heat can be conducted away through the metal thermal conductive layer. The thermal conductivity of the metal thermal conductive layer is better than that of glass, which can improve the heat dissipation effect of the display panel. The metal thermal conductive layer can replace the glass substrate without increasing the thickness of the display panel. At the same time, the heat dissipation surface can conduct heat to the entire surface, further improving the heat dissipation effect.

[0039] In some embodiments, the projection of the metal heat-conducting layer on the plane where the display layer is located covers the projection of the driving circuit layer on the plane where the display layer is located.

[0040] In some embodiments, in a direction perpendicular to the display panel, the thickness of the portion of the metal thermal conductive layer located in the routing area is greater than the thickness of the portion of the metal thermal conductive layer located in the non-routing area, and in the non-routing area, the organic layer is provided between the metal thermal conductive layer and the driving circuit layer.

[0041] In some embodiments, the sum of the thickness of the portion of the metal heat-conducting layer located in the non-routing area and the thickness of the organic layer is equal to the sum of the thickness of the portion of the metal heat-conducting layer located in the routing area.

[0042] In some embodiments, a thin film transistor is provided in the routing area, and a portion of the metal heat conductive layer located in the routing area covers the routing area corresponding to the thin film transistor.

[0043] In some embodiments, a metal trace is provided in the trace area, the portion of the metal thermal conductive layer located in the trace area is arranged corresponding to the metal trace, and the portion of the metal thermal conductive layer located in the trace area covers the projection area of ​​the metal trace on the display layer.

[0044] In some embodiments, a metal wiring is provided in the wiring area, and the metal wiring is electrically connected to the metal heat conducting layer.

[0045] In some embodiments, the thickness of the portion of the metal heat-conducting layer located in the non-routing area ranges from one-fiftieth to one-fifth of the thickness of the portion of the metal heat-conducting layer located in the routing area.

[0046] In some embodiments, the material of the metal heat-conducting layer includes at least one of copper, aluminum, and tin.

[0047] In some embodiments, the display layer includes a micro light-emitting diode device, the micro light-emitting diode device includes an electrode layer and a light-emitting layer, the display panel also includes a solder pad, the electrode layer is arranged between the light-emitting layer and the driving circuit layer, the electrode layer is connected to the driving circuit layer through the solder pad, and the electrode layer solder pad is arranged corresponding to the part of the metal thermal conductive layer located in the routing area.

[0048] In some embodiments, the projection of the metal thermally conductive layer on the plane where the display layer resides covers the projection area of ​​the drive circuit layer on the plane where the display layer resides. By ensuring that the projection area of ​​the metal thermally conductive layer on the plane where the display layer resides is greater than or equal to the projection area of ​​the drive circuit layer on the plane where the display layer resides, the surface area of ​​the metal thermally conductive layer can be increased, allowing the metal thermally conductive layer to be provided over the entire surface. When the metal thermally conductive layer dissipates heat through convection and thermal radiation, the thermal resistance can be reduced, the heat dissipation performance of the metal thermally conductive layer can be improved, and the heat dissipation effect of the display panel can be enhanced.

[0049] Specifically, the area of ​​the metal thermal conductive layer in the display panel can be made greater than or equal to the area of ​​any other film layer in the display panel except the metal thermal conductive layer, so that the area of ​​the metal thermal conductive layer is maximized, the surface area of ​​the metal thermal conductive layer is increased, and the heat dissipation effect of the display panel is improved.

[0050] In some embodiments, as shown in FIG2 , in a direction perpendicular to the display panel 2, the thickness h3 of the metal thermal conductive layer 21 in the routing area 281 is greater than the thickness h1 of the metal thermal conductive layer 21 in the non-routing area 282. In the non-routing area 282, the organic layer 22 is disposed between the metal thermal conductive layer 21 and the drive circuit layer 24. By providing a metal thermal conductive layer, the thickness of the metal thermal conductive layer in the routing area is greater than the thickness of the metal thermal conductive layer in the non-routing area. In the routing area, the metal thermal conductive layer is in direct contact with the drive circuit layer. This allows heat to be conducted away from the display panel through the metal thermal conductive layer. The metal thermal conductive layer has better thermal conductivity than glass, improving the heat dissipation of the display panel. Furthermore, the metal thermal conductive layer can replace a glass substrate without increasing the thickness of the display panel. Furthermore, in the non-routing area, an organic layer is disposed between the metal thermal conductive layer and the drive circuit layer, eliminating static electricity when forming the drive circuit layer and improving the yield of the display panel.

[0051] Specifically, the driving circuit layer 24 includes a buffer layer 23. In the routing area 281, the metal thermal conductive layer 21 is in direct contact with the buffer layer 23. In the non-routing area 282, the organic layer 22 is provided between the metal thermal conductive layer 21 and the buffer layer 23. By providing the organic layer between the metal thermal conductive layer and the buffer layer, static electricity is prevented during the formation of the buffer layer, thereby improving the yield of the display panel.

[0052] Specifically, no glass substrate is provided under the metal heat-conducting layer to avoid poor thermal conductivity of the glass substrate, which makes it impossible to dissipate heat through conduction, radiation, convection, and the like.

[0053] Specifically, no other film layers are disposed beneath the metal thermally conductive layer to avoid the poor thermal conductivity of the other film layers, which would prevent heat dissipation through conduction, radiation, convection, etc. For example, no backplane, no support layer, and no heat dissipation layer are disposed beneath the metal thermally conductive layer. Heat is dissipated through the metal thermally conductive layer, which can reduce the thickness and weight of the display panel.

[0054] Specifically, the thermal conductivity of the metal heat-conducting layer is greater than the thermal conductivity of glass.

[0055] Specifically, as shown in FIG3 , a test trace 31 is taken as an example to illustrate the thermal resistance in the heat dissipation process. As shown in FIG3 , the length of the test trace 31 is L, the surface area is A, the cross-sectional area is S, the thermal conductivity is C, and the heat conduction direction is horizontal, that is, the direction from left to right as shown by T1 in FIG3 , or the direction from right to left as shown by T2. During the heat transfer process, the test trace 31 will dissipate heat from left to right through heat conduction, dissipate heat from the upper surface to other objects through heat radiation, and dissipate heat from the upper surface to the air through convection. The heat conduction resistance of the test trace 31 when dissipating heat through heat conduction is the ratio of the length L of the test trace 31 to the thermal conductivity C of the test trace and the cross-sectional area S of the test trace, that is, the heat conduction resistance is L / (C×S). The test trace 31 dissipates heat from left to right through heat conduction, dissipates heat from the upper surface to other objects through heat radiation, and dissipates heat from the upper surface to the air through convection. The convection thermal resistance during heat dissipation is the ratio of 1 to the convection heat transfer coefficient K1 and the surface area A of the test trace 31, that is, the convection thermal resistance is 1 / (K1×A). When the test trace 31 transfers temperature to a relatively lower temperature object through thermal radiation, the thermal radiation thermal resistance of the test trace 31 is the ratio of 1 to the radiation heat transfer coefficient K2 and the surface area A of the test trace 31, that is, the thermal radiation thermal resistance is 1 / (K2×A). From the above analysis, it can be seen that the thermal resistance of the test trace 31 is proportional to its length and inversely proportional to its surface area, cross-sectional area, and thermal conductivity. Therefore, to improve the heat dissipation performance of the test trace 31, its surface area, cross-sectional area, and thermal conductivity can be achieved. The embodiments of the present application improve the heat dissipation capacity of the display panel by replacing the glass substrate with a metal heat-conducting layer, that is, replacing the glass with a material with a higher thermal conductivity coefficient. Moreover, by making the thickness of the portion of the metal heat-conducting layer located in the routing area greater than the thickness of the portion of the metal heat-conducting layer located in the non-routing area, the cross-sectional area of ​​the portion of the heat-conducting layer located in the routing area can be increased, thereby further improving the heat dissipation capacity of the display panel. Moreover, the metal heat-conducting layer can be provided on the entire surface to increase its surface area, thereby further improving the heat dissipation capacity of the display panel.

[0056] Specifically, compared to using a glass substrate for heat dissipation, the glass substrate has a lower thermal conductivity, while the light-emitting chip is smaller in size. As a result, when heat from the light-emitting chip is dissipated to the glass substrate, the heat accumulates in the area of ​​the glass substrate corresponding to the light-emitting chip. The actual heat dissipation area is smaller, resulting in higher convection and radiation resistances, and poor heat dissipation. However, the present application uses metal for heat dissipation, which has a higher thermal conductivity. When heat is dissipated to the metal, it is transferred to the entire surface of the metal, which increases the surface area of ​​the metal for heat dissipation, reduces convection and radiation resistances, and improves the heat dissipation effect.

[0057] Specifically, compared to a display panel that has other film layers arranged under the metal heat-conducting layer, such as a glass substrate, the embodiment of the present application can reduce the thermal resistance under the display layer by not setting other film layers under the metal heat-conducting layer, thereby improving the heat dissipation effect of the display panel.

[0058] Specifically, compared to display panels that do not have other film layers between the metal thermal conductive layer and the drive circuit layer, the embodiments of the present application, by providing an organic layer between the metal thermal conductive layer and the drive circuit layer, can avoid static electricity that can cause display defects when the drive circuit layer is formed directly on the metal thermal conductive layer. Furthermore, compared to display panels with a uniform thickness of the metal thermal conductive layer across the entire surface, the thickness of the metal thermal conductive layer in the wiring area is greater than the thickness of the metal thermal conductive layer in the non-wiring area in the embodiments of the present application. This allows heat to be transferred to the wiring area and reduces the thickness of the display panel.

[0059] Specifically, compared to a display panel in which patterned metal is arranged in an organic layer, the embodiment of the present application sets the heat dissipation surface of the metal thermal conductive layer to the entire surface. Therefore, when heat is transferred through the portion of the metal thermal conductive layer located in the routing area, the heat can be quickly transferred to the entire surface of the metal thermal conductive layer due to the large thermal conductivity of the metal thermal conductive layer, thereby improving the heat dissipation effect.

[0060] Specifically, the thickness of the metal thermal conductive layer located in the routing area is greater than the thickness of the metal thermal conductive layer located in the non-routing area, so that in the process of heat transfer by the display panel, the thin film transistors and / or routings conduct heat, and the heat can be quickly transferred to the metal thermal conductive layer, thereby improving the heat conduction efficiency and the heat dissipation effect.

[0061] Specifically, the routing area and the non-routing area can be located in the display area or the non-display area. The routing area can be provided with thin film transistors and routing. The non-routing area refers to the area other than the routing area.

[0062] The embodiments of the present application take into account that during the heat dissipation process of the display layer, heat will be conducted to the metal, namely, the wiring and the thin-film transistors, and that the heat has a greater impact on the wiring and the thin-film transistors. Therefore, the thickness of the portion of the metal thermal conductive layer located in the wiring area is made thicker than the thickness of the portion of the metal thermal conductive layer located in the non-wiring area, so that the heat in the wiring area can be quickly transferred to the portion of the metal thermal conductive layer located in the wiring area, and the heat is conducted to the entire metal thermal conductive layer, and the heat is dissipated through the metal thermal conductive layer, thereby improving the heat dissipation effect of the display panel.

[0063] In some embodiments, the sum of the thickness of the portion of the metal heat-conducting layer located in the non-routing area and the thickness of the organic layer is greater than the sum of the thickness of the portion of the metal heat-conducting layer located in the routing area.

[0064] In some embodiments, the sum of the thickness of the portion of the metal heat-conducting layer located in the non-routing area and the thickness of the organic layer is less than the sum of the thickness of the portion of the metal heat-conducting layer located in the routing area.

[0065] In some embodiments, as shown in Figure 2, the sum of the thickness h1 of the metal thermally conductive layer 21 located in the non-wiring area 282 and the thickness h2 of the organic layer 22 is equal to the sum of the thickness h3 of the metal thermally conductive layer 21 located in the wiring area 281, that is, h1 + h2 equals h3. By ensuring that the sum of the thickness of the metal thermally conductive layer located in the non-wiring area and the thickness of the organic layer is equal to the sum of the thickness of the metal thermally conductive layer located in the wiring area, the surface of the metal thermally conductive layer on the side of the organic layer near the buffer layer is smooth, facilitating the preparation of the buffer layer. The metal thermally conductive layer and the organic layer are coordinated so that the sum of the thicknesses of the metal thermally conductive layer and the organic layer equals the thickness of the metal thermally conductive layer located in the wiring area, thereby reducing the thickness of the display panel.

[0066] Specifically, compared with the sum of the thickness of the portion of the metal thermal conductive layer located in the non-routing area and the thickness of the organic layer, it is less than or greater than the sum of the thickness of the portion of the metal thermal conductive layer located in the routing area. By making the sum of the thickness of the portion of the metal thermal conductive layer located in the non-routing area and the thickness of the organic layer equal to the sum of the thickness of the portion of the metal thermal conductive layer located in the routing area, the sum of the thicknesses of the metal thermal conductive layer and the organic layer is smaller, and the upper surfaces of the metal thermal conductive layer and the organic layer are flat. When preparing other film layers, the other film layers can also be kept flat, thereby improving the yield of the display panel.

[0067] In some embodiments, as shown in FIG2 , a thin film transistor 247 is provided in the routing area 281, and the portion of the metal thermal conductive layer 21 located in the routing area 281 covers the routing area corresponding to the thin film transistor 247. By ensuring that the portion of the metal thermal conductive layer located in the routing area covers the routing area corresponding to the thin film transistor, when heat is transferred to the thin film transistor, the thin film transistor can transfer the heat to the portion of the metal thermal conductive layer located in the routing area. The metal thermal conductive layer then conducts the heat to the entire surface and dissipates the heat through convection and thermal radiation, thereby improving the heat dissipation effect of the display panel, preventing the thin film transistor from malfunctioning due to excessive heat, and improving the yield of the display panel.

[0068] Specifically, as shown in FIG2 , a thin-film transistor 247 is provided in the routing area 281, and the projected area of ​​the portion of the metal thermal conductive layer 21 located in the routing area 281 on the display layer 25 is greater than or equal to the projected area of ​​the thin-film transistor 247 on the display layer 25. By ensuring that the projected area of ​​the portion of the metal thermal conductive layer located in the routing area on the display layer is greater than or equal to the projected area of ​​the thin-film transistor on the display layer, when heat is transferred to the thin-film transistor, the thin-film transistor can transfer the heat to the portion of the metal thermal conductive layer located in the routing area. The metal thermal conductive layer then conducts the heat to the entire surface and dissipates the heat through convection and thermal radiation, thereby improving the heat dissipation effect of the display panel, preventing the thin-film transistor from malfunctioning due to excessive heat, and improving the yield of the display panel.

[0069] Specifically, a thin film transistor includes a gate, a source, a drain and an active layer. When heat is transferred to the thin film transistor, the high temperature may cause the thin film transistor to malfunction, or the performance of the thin film transistor may change under high temperature. By placing the portion of the metal thermal conductive layer located in the routing area under the thin film transistor and the area of ​​the metal thermal conductive layer being larger than the area of ​​the thin film transistor, the heat of the thin film transistor can be transferred away, and the heat generated by the thin film transistor itself can also be dissipated through the metal thermal conductive layer, thereby improving the heat dissipation effect of the display panel.

[0070] In some embodiments, as shown in FIG2 , a metal trace 248 is disposed within the trace area 281. The portion of the metal thermal conductive layer 21 located in the trace area 281 corresponds to the metal trace 248, and the portion of the metal thermal conductive layer 21 located in the trace area 281 covers the projected area of ​​the metal trace 248 on the display layer 25. By ensuring that the portion of the metal thermal conductive layer located in the trace area covers the projected area of ​​the metal trace on the display layer, heat from the metal trace can be transferred through the portion of the metal thermal conductive layer located in the trace area, and then dissipated through the entire metal thermal conductive layer. This improves the heat dissipation of the display panel and prevents the display panel from not displaying properly due to poor heat dissipation from the metal trace.

[0071] Specifically, the projected area of ​​the portion of the metal thermal conductive layer 21 located in the routing area 281 on the display layer 25 is greater than or equal to the projected area of ​​the metal routing 248 on the display layer 25. By ensuring that the projected area of ​​the portion of the metal thermal conductive layer located in the routing area on the display layer is greater than or equal to the projected area of ​​the metal routing on the display layer, heat from the metal routing can be transferred through the portion of the metal thermal conductive layer located in the routing area, and then dissipated through the entire metal thermal conductive layer. This improves the heat dissipation effect of the display panel and prevents the display panel from not displaying properly due to poor heat dissipation from the metal routing.

[0072] Specifically, FIG2 illustrates an example of metal wiring being set in the source and drain layers, but the embodiments of the present application are not limited thereto. The metal wiring can be set in other film layers. Accordingly, the metal wiring includes scan lines, data lines, and power signal lines.

[0073] In some embodiments, a metal trace is provided within the trace area, and the metal trace is electrically connected to the metal thermal conductive layer. By electrically connecting the metal trace to the metal thermal conductive layer, the metal thermal conductive layer can function as both a heat conductor and an electrical conductor. Accordingly, the width of the metal trace located in other film layers can be reduced, making the metal thermal conductive layer part of the metal trace. This increases the width of the metal trace, reduces the impedance of the metal trace, and increases the space for other signal lines. This reduces the impedance and voltage drop of the signal lines within the display panel, reduces the thermal resistance of the signal lines, and improves the heat dissipation capability of the display panel.

[0074] In some embodiments, the metal trace includes a power signal line, and the metal thermal conductive layer is connected to the power signal line. By connecting the metal thermal conductive layer to the power signal line, the power signal line can input a constant voltage to the metal thermal conductive layer, allowing the metal thermal conductive layer to simultaneously perform both thermal and electrical conductivity functions. This can correspondingly reduce the width of the power signal line located in other film layers, making the metal thermal conductive layer part of the power signal line, increasing the width of the power signal line, reducing the impedance of the power signal line, and increasing the space for other signal lines. This reduces the impedance and voltage drop of the signal line within the display panel, reduces the thermal resistance of the signal line, and improves the heat dissipation capability of the display panel.

[0075] Specifically, the power signal line includes a high-potential power signal line and a low-potential power signal line, and the metal heat conductive layer is connected to one of the high-potential power signal line and the low-potential power signal line.

[0076] In some embodiments, as shown in FIG2 , the thickness range of the portion of the metal thermal conductive layer 21 located in the non-routing area 282 is one-fiftieth to one-fifth of the thickness h3 of the portion of the metal thermal conductive layer 21 located in the routing area 281 . This allows the metal thermal conductive layer to be disposed on the entire surface, thereby improving the heat dissipation effect of the display panel. Furthermore, the weight of the metal thermal conductive layer is relatively small, and the possibility of generating static electricity when preparing a buffer layer on the metal thermal conductive layer is relatively small, thereby improving the yield of the display panel.

[0077] Specifically, the thickness of the portion of the metal heat conducting layer located in the non-routing area ranges from 0.05 microns to 0.1 microns; the thickness of the portion of the metal heat conducting layer located in the routing area ranges from 0.5 microns to 2.5 microns.

[0078] In some embodiments, the material of the metal heat-conducting layer includes at least one of copper, aluminum, tin, and molybdenum, thereby improving the heat dissipation effect of the display panel.

[0079] Table 1 Comparison of thermal conductivity of different materials

[0080]

[0081] As can be seen from Table 1 above, the unit of thermal conductivity is W / (m×K), that is, watt / (meter×degrees Celsius). At different temperatures, the thermal conductivity of glass ranges from 1W / (m×K) to 2(m×K), while the thermal conductivity of copper, aluminum, and tin are 401W / (m×K), 237W / (m×K), and 67W / (m×K), respectively. The thermal conductivity of these metals is one to two orders of magnitude greater than that of glass. This allows the metal thermal conductive layer to conduct heat to the entire surface, increasing the surface area for heat dissipation, rather than concentrating heat in a single area like glass, thereby improving the heat dissipation effect.

[0082] In some embodiments, as shown in FIG2 , the display layer 25 includes a micro-LED device, which includes an electrode layer 251 and a light-emitting layer 252. The display panel 2 also includes a solder pad 29. The electrode layer 251 is disposed between the light-emitting layer 252 and the drive circuit layer 24. The electrode layer 251 is connected to the drive circuit layer 24 via the solder pad 29. The electrode layer 251 is disposed correspondingly to the portion of the metal thermal conductive layer 21 located in the routing area 281. By arranging the portion of the metal thermal conductive layer located in the routing area correspondingly to the electrode layer and the solder pad, the portion of the metal thermal conductive layer located in the routing area can directly dissipate heat generated by the micro-LED through the electrode layer and the solder pad, thereby improving the heat dissipation effect of the display panel.

[0083] Specifically, FIG2 illustrates an example in which the two electrodes of the micro-LED device are located on the same side of the light-emitting layer, but the embodiments of the present application are not limited thereto. The two electrodes of the micro-LED device may be located on both sides of the light-emitting layer.

[0084] In some embodiments, the organic layer comprises polyimide. Disposing the polyimide between the buffer layer and the metal thermal conductive layer can prevent static electricity when forming other layers on the metal thermal conductive layer using chemical vapor deposition, thereby preventing static electricity from damaging the display panel and improving the yield of the display panel.

[0085] In some embodiments, as shown in FIG. 2 , the driving circuit layer 24 includes a buffer layer 23 , an active layer 241 , a gate insulating layer 242 , a gate layer 243 , an interlayer insulating layer 244 , a source and drain electrode layer 245 , and a passivation layer 246 .

[0086] In some embodiments, as shown in FIG. 2 , the display panel 2 further includes an encapsulation layer 26 and a glass cover 27 .

[0087] The above embodiments illustrate various aspects of the display panel of the present application. It is understood that, when there is no conflict between the embodiments, they can be combined to achieve better technical effects. For example, thin-film transistors and metal traces are provided in the trace area, and the projected area of ​​the portion of the metal thermal conductive layer located in the trace area on the display layer is greater than or equal to the sum of the projected area of ​​the thin-film transistors on the display layer and the projected area of ​​the metal traces on the display layer. For the structures of other embodiments, please refer to the above description and will not be repeated here.

[0088] Figure 5 is a schematic diagram of a first structure of a display panel corresponding to each step of the method for manufacturing a display panel provided in an embodiment of the present application. Figure 6 is a schematic diagram of a second structure of a display panel corresponding to each step of the method for manufacturing a display panel provided in an embodiment of the present application.

[0089] At the same time, an embodiment of the present application provides a method for preparing a display panel, which prepares the display panel as described in any of the above embodiments.

[0090] Specifically, as shown in FIG4 , the display panel prepared by the method for preparing the display panel includes a wiring area and a non-wiring area, and the method for preparing the display panel includes:

[0091] S1, providing a substrate; the display panel corresponding to this step is shown in (a) of FIG5 ;

[0092] S2, forming a peeling layer on the substrate; the display panel corresponding to this step is shown in (a) of FIG5 ;

[0093] Specifically, as shown in FIG. 5 , a peeling layer 42 may be attached to the substrate 41 . The peeling layer 42 may be made of a hot melt adhesive based on polyurethane resin and / or polyamide.

[0094] S3, forming a metal heat-conducting layer and an organic layer on the peeling layer, and etching the metal heat-conducting layer; the display panels corresponding to this step are shown in FIG5 (b), FIG5 (c) and FIG5 (c);

[0095] S4, forming a driving circuit layer and a display layer in sequence on the organic layer; the display panel corresponding to this step is shown in FIG6 ;

[0096] S5, peeling off the peeling layer and the substrate to obtain a display panel; the display panel corresponding to this step is shown in FIG2 .

[0097] An embodiment of the present application provides a method for preparing a display panel, by forming a peeling layer on a substrate, forming a metal thermal conductive layer, an organic layer, a driving circuit layer and a display layer on the peeling layer, and subsequently peeling off the substrate and the peeling layer, so that the metal thermal conductive layer can directly contact the outside world, and the metal thermal conductive layer conducts heat away. The thermal conductivity of the metal thermal conductive layer is better than that of glass, which can improve the heat dissipation effect of the display panel, and the metal thermal conductive layer can replace the glass substrate without increasing the thickness of the display panel. At the same time, in the non-routing area, an organic layer is provided between the metal thermal conductive layer and the driving circuit layer, so that static electricity will not occur when the driving circuit layer is formed, thereby improving the yield of the display panel.

[0098] Specifically, when forming the metal thermal conductive layer and the organic layer, as shown in FIG. 5 (a) to FIG. 5 (c), the metal thermal conductive layer can be first provided on the entire surface, then etched, and then the organic layer can be formed on the metal thermal conductive layer.

[0099] Specifically, when forming the metal heat conducting layer and the organic layer, the metal heat conducting layer may be first disposed on the entire surface, and then the organic layer may be disposed on the entire surface. Holes may be drilled in the organic layer, and the metal heat conducting layer may be disposed in the drilled areas.

[0100] Specifically, the embodiment of the present application uses metal as the material of the metal thermal conductive layer, so that the metal thermal conductive layer and the peeling layer are easier to peel off, thereby avoiding the inability to peel off the substrate and the peeling layer, resulting in poor heat dissipation effect of the display panel.

[0101] Specifically, the peeling force between the peeling layer and the metal heat-conducting layer decreases rapidly at a certain temperature, so that the substrate and the peeling layer can be peeled off, thereby improving the heat dissipation effect of the display panel.

[0102] At the same time, an embodiment of the present application provides a display device, which includes the display panel as described in any of the above embodiments.

[0103] According to the above embodiments, it can be seen that:

[0104] An embodiment of the present application provides a display panel and a preparation method thereof; the display panel comprises a metal thermal conductive layer, an organic layer, a driving circuit layer and a display layer, wherein the organic layer is arranged on one side of the metal thermal conductive layer, the driving circuit layer is arranged on a side of the organic layer away from the metal thermal conductive layer, the driving circuit layer includes a thin film transistor and a metal wiring, and the display layer is arranged on a side of the driving circuit layer away from the organic layer, wherein the display panel includes a wiring area and a non-wiring area, at least one of a thin film transistor and a metal wiring is provided in the wiring area, the metal thermal conductive layer includes a connection surface close to the driving circuit layer and in direct contact with the driving circuit layer, and a heat dissipation surface away from the driving circuit layer, in the orthographic projection direction of the display panel, the orthographic projection area of ​​the heat dissipation surface is larger than the orthographic projection area of ​​the connection surface, and the connection surface is arranged corresponding to the wiring area. The present application provides a metal thermal conductive layer so that the orthographic projection area of ​​the heat dissipation surface of the metal thermal conductive layer away from the driving circuit layer is larger than the orthographic projection area of ​​the connection surface in direct contact with the driving circuit layer, and the connection surface is provided corresponding to the routing area. Therefore, the metal thermal conductive layer can be in direct contact with the driving circuit layer in the routing area, so that when the display panel generates heat, the heat can be conducted away through the metal thermal conductive layer. The thermal conductivity of the metal thermal conductive layer is better than that of glass, which can improve the heat dissipation effect of the display panel. The metal thermal conductive layer can replace the glass substrate without increasing the thickness of the display panel. At the same time, the heat dissipation surface can conduct heat to the entire surface, further improving the heat dissipation effect.

[0105] In the above embodiments, the description of each embodiment has its own focus. For parts that are not described in detail in a certain embodiment, reference can be made to the relevant descriptions of other embodiments.

[0106] The above is a detailed introduction to a display panel and a preparation method thereof provided in the embodiments of the present application. Specific examples are used herein to illustrate the principles and implementation methods of the present application. The description of the above embodiments is only used to help understand the technical solutions and core ideas of the present application. Ordinary technicians in this field should understand that they can still modify the technical solutions recorded in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein. These modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present application.

Claims

1. A display panel, comprising: Metal thermal conductive layer; An organic layer is disposed on one side of the metal heat-conducting layer; A driving circuit layer, arranged on a side of the organic layer away from the metal heat-conducting layer, the driving circuit layer comprising a thin film transistor and a metal wiring; A display layer, disposed on a side of the driving circuit layer away from the organic layer, and control-connected to the driving circuit layer; Among them, the display panel includes a routing area and a non-routing area, and the routing area is provided with at least one of a thin film transistor and the metal routing; the metal thermal conductive layer includes a connecting surface close to the driving circuit layer and in direct contact with the driving circuit layer, and a heat dissipation surface away from the driving circuit layer. In the orthographic projection direction of the display panel, the orthographic projection area of ​​the heat dissipation surface is larger than the orthographic projection area of ​​the connecting surface, and the connecting surface is arranged corresponding to the routing area.

2. The display panel according to claim 1, wherein: The projection of the metal heat-conducting layer on the plane where the display layer is located covers the projection of the driving circuit layer on the plane where the display layer is located.

3. The display panel according to claim 1, wherein: In a direction perpendicular to the display panel, the thickness of the portion of the metal thermal conductive layer located in the routing area is greater than the thickness of the portion of the metal thermal conductive layer located in the non-routing area. In the non-routing area, the organic layer is provided between the metal thermal conductive layer and the driving circuit layer.

4. The display panel according to claim 3, wherein: The sum of the thickness of the portion of the metal heat-conducting layer located in the non-routing area and the thickness of the organic layer is equal to the sum of the thickness of the portion of the metal heat-conducting layer located in the routing area.

5. The display panel according to claim 3, wherein: The driving circuit layer includes a buffer layer. In the routing area, the metal heat-conducting layer is in direct contact with the buffer layer. In the non-routing area, the organic layer is provided between the metal heat-conducting layer and the buffer layer.

6. The display panel according to claim 1, wherein: A thin film transistor is arranged in the wiring area, and a portion of the metal heat conductive layer located in the wiring area covers the wiring area corresponding to the thin film transistor.

7. The display panel according to claim 6, wherein: The thin film transistor includes a gate electrode, a source electrode, a drain electrode and an active layer.

8. The display panel according to claim 1, wherein: A metal wiring is arranged in the wiring area, a portion of the metal heat conductive layer located in the wiring area is arranged corresponding to the metal wiring, and a portion of the metal heat conductive layer located in the wiring area covers a projection area of ​​the metal wiring on the display layer.

9. The display panel according to claim 1, wherein: A metal wiring is arranged in the wiring area, and the metal wiring is electrically connected to the metal heat conducting layer.

10. The display panel according to claim 9, wherein: The metal wiring includes a power signal line, and the metal heat conductive layer is connected to the power signal line.

11. The display panel according to claim 10, wherein: The power signal line includes a high potential power signal line and a low potential power signal line, and the metal heat conductive layer is connected to one of the high potential power signal line and the low potential power signal line.

12. The display panel according to claim 1, wherein: The thickness of the portion of the metal heat-conducting layer located in the non-routing area ranges from one-fiftieth to one-fifth of the thickness of the portion of the metal heat-conducting layer located in the routing area.

13. The display panel according to claim 1, wherein: The thickness of the portion of the metal heat-conducting layer located in the non-routing area ranges from 0.05 microns to 0.1 microns.

14. The display panel according to claim 1, wherein: The thickness of the portion of the metal heat-conducting layer located in the wiring area ranges from 0.5 microns to 2.5 microns.

15. The display panel according to claim 1, wherein: The material of the metal heat-conducting layer includes at least one of copper, aluminum and tin.

16. The display panel according to claim 1, wherein: The display layer includes a micro light-emitting diode device, which includes an electrode layer and a light-emitting layer. The display panel also includes a solder pad, the electrode layer is arranged between the light-emitting layer and the driving circuit layer, the electrode layer is connected to the driving circuit layer through the solder pad, and the solder pad and the metal thermal conductive layer are arranged corresponding to the part located in the routing area.

17. The display panel according to claim 1, wherein: The material of the organic layer includes polyimide.

18. The display panel according to claim 1, wherein: The driving circuit layer includes a buffer layer, an active layer, a gate insulating layer, a gate layer, an interlayer insulating layer, a source and drain electrode layer, and a passivation layer.

19. The display panel according to claim 1, wherein: The display panel also includes an encapsulation layer and a glass cover plate.

20. A method for preparing a display panel, wherein: The method for preparing the display panel is to prepare the display panel according to claim 1, and the method for preparing the display panel comprises: providing a substrate; forming a release layer on the substrate; forming a metal heat-conducting layer and an organic layer on the stripping layer, and etching the metal heat-conducting layer; forming a driving circuit layer and a display layer in sequence on the organic layer; The release layer and the substrate are peeled off to obtain a display panel.

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