Suction nozzle mechanism for chip manufacturing, and packaging apparatus

Abstract

A suction nozzle mechanism for chip manufacturing and a packaging apparatus. The suction nozzle mechanism comprises: a suction nozzle, a joint assembly and a pipeline, wherein the joint assembly comprises a rotating body, which is provided with a transition cavity, and a supporting body, the side of the rotating body facing the supporting body being provided with an air intake hole, which is in communication with the transition cavity, the supporting body being located on the side of the rotating body provided with the air intake hole and covering the air intake hole, the rotating body being capable of circumferentially rotating relative to the supporting body, a sealing structure being provided between the rotating body and the supporting body so as to cut off the communication between the air intake hole and the outside, and a supporting-body air hole in communication with the air intake hole being provided on the supporting body; and the pipeline is in communication with the suction nozzle and the transition cavity, and rotates synchronously with the rotating body and the suction nozzle. In the present invention, the joint assembly is configured to comprise the rotating body and the supporting body, which can rotate relative to each other, and the pipeline connected to the suction nozzle is in communication with the transition cavity of the rotating body, such that the pipeline is enabled to rotate synchronously with the rotating body, thereby preventing the pipeline from tangling and wearing when the suction nozzle rotates.

Description

Nozzle mechanism and packaging equipment for chip manufacturing

[0001] The present invention is based on and claims the priority of Chinese patent application with application number 202311253348.7 and application date September 26, 2023. The entire contents of the above patent application are hereby introduced into the present invention as a reference. Technical Field

[0002] The present invention relates to the field of chip manufacturing, in particular to a nozzle mechanism and packaging equipment used for chip manufacturing. Background Art

[0003] Chips need to be transferred during the manufacturing process. In order to avoid damage to the transferred components during the transfer process, vacuum adsorption is generally used to adsorb the transferred components onto the suction nozzle. In order to realize the transmission of vacuum gas, it is generally connected to the suction nozzle through a pipe. The air outlet of the suction nozzle forms a negative pressure environment under the action of vacuum adsorption, thereby realizing the adsorption of the components.

[0004] During transfer, the nozzle typically rotates significantly as needed. For example, the nozzle used in an internal pin bonding machine flips 180° during operation. This movement causes friction between the tubing connected to the nozzle's end and the nozzle's connecting rod. This friction can cause the tubing to wear over time. Furthermore, to prevent the tubing from restricting the nozzle's rotation, it is typically designed to be relatively long. This design can easily cause the tubing to become tangled as the nozzle rotates, thus affecting the nozzle's usability.

[0005] The reference to any prior art in the specification is not an acknowledgement or suggestion that the prior art forms part of the common general knowledge in any jurisdiction, or that it could reasonably be expected that the person skilled in the art would understand, consider relevant and / or combine with other prior art. Summary of the Invention

[0006] The purpose of the present invention is to provide a nozzle mechanism for chip manufacturing to solve the shortcomings of the existing technology. It can make the pipeline rotate synchronously with the rotating body. When the nozzle flips, the nozzle drives the pipeline to rotate, and the pipeline can drive the rotating body to rotate, thereby avoiding entanglement and wear of the pipeline.

[0007] The nozzle mechanism for chip manufacturing provided by the present invention includes a nozzle, a joint assembly and a pipeline;

[0008] The joint assembly includes a rotating body having a transition cavity and a supporting body. The rotating body has an air inlet hole communicating with the transition cavity on a side facing the supporting body. The supporting body is located on a side of the rotating body where the air inlet hole is provided and covers the air inlet hole.

[0009] The rotating body can rotate relative to the supporting body along the circumferential direction of the rotating body, and a sealing structure is provided between the rotating body and the supporting body to isolate the connection between the air inlet and the outside world; a supporting body air hole connected to the air inlet is provided on the supporting body; the pipe connects the suction nozzle and the transition chamber, and the pipe rotates synchronously with the rotating body and the suction nozzle.

[0010] Furthermore, the outer contour of the rotating body is generally cylindrical, the rotating body and the support body are arranged side by side along the axial direction of the rotating body, and a rotating support part is provided on the side of the support body facing the rotating body. The rotating body is sleeved outside the rotating support part and can rotate along the circumferential direction of the rotating support body.

[0011] Furthermore, the sealing structure includes an annular groove and an annular protrusion adapted to the annular groove, the annular groove and the annular protrusion are respectively arranged on the rotating body and the supporting body, and the annular groove or the annular protrusion is arranged around the air inlet.

[0012] Furthermore, the annular groove is provided on a side of the rotating body facing the supporting body and is provided in plurality, and the plurality of annular grooves are concentrically arranged;

[0013] The annular protrusion is arranged on a side of the support body facing the rotating body, and is provided in plurality, and the plurality of annular protrusions are arranged concentrically; the annular groove is arranged around the air inlet hole.

[0014] Furthermore, the joint assembly also has a rotating bearing, which has a coaxially arranged fixed ring and a movable ring. Relative to the fixed ring, the movable ring can rotate along the circumferential direction of the movable ring. The fixed ring is fixed on the support body, and the movable ring is connected and fixed to the rotating body.

[0015] Furthermore, a protruding mounting portion is formed on the support body on one side facing the rotating body, and the movable ring is sleeved outside the protruding mounting portion and fixed on the protruding mounting portion;

[0016] A bearing groove is provided on the rotating body, and the bearing groove is provided on the side of the rotating body facing the supporting body. The air inlet is connected to the bearing groove, and the air inlet has an inlet located at the bottom of the bearing groove; the movable ring is positioned in the bearing groove.

[0017] Furthermore, the joint assembly also has an auxiliary support body arranged on the side of the rotating body away from the supporting body, and the rotating body can rotate along the circumferential direction of the rotating body relative to the auxiliary support body; the rotating body is rotatably installed between the supporting body and the auxiliary support body; the joint assembly has a sealing structure arranged between the auxiliary support body and the rotating body.

[0018] Furthermore, a secondary rotary bearing is provided between the rotating body and the secondary supporting body, the secondary rotary bearing having a secondary fixed ring and a secondary movable ring, the secondary movable ring being rotatable in a circumferential direction relative to the secondary fixed ring, the secondary fixed ring being fixed on the secondary supporting body, and the secondary movable ring being connected and fixed to the rotating body;

[0019] The auxiliary supporting body is provided with an auxiliary supporting protrusion, and the auxiliary fixing ring is fixed on the auxiliary supporting protrusion; the side of the rotating body facing the auxiliary supporting body is provided with an auxiliary bearing groove, and the auxiliary movable ring is positioned in the auxiliary bearing groove.

[0020] Furthermore, the rotating body has a pipeline connection hole extending in the radial direction, the pipeline connection hole is communicated with the transition cavity, and the pipeline is communicated with the pipeline connection hole;

[0021] The nozzle mechanism for chip manufacturing further comprises a driving unit, which drives the nozzle to rotate, and the rotation center of the nozzle is coaxially arranged with the rotation center of the rotating body.

[0022] Another embodiment of the present invention further discloses a packaging device, including the nozzle mechanism for chip manufacturing.

[0023] Compared with the prior art, the present invention configures the joint assembly as a rotating body and a supporting body that can rotate relative to each other, and connects the pipe connecting the suction nozzle with the transition cavity of the rotating body, so that the pipe can rotate synchronously with the rotating body. When the suction nozzle flips, the suction nozzle drives the pipe to rotate, and the pipe can drive the rotating body to rotate, thereby avoiding entanglement and wear of the pipe.

[0024] As used herein, the term "comprise" and variations of the term, such as "comprises," "comprised," "comprising," "including," and "containing" do not exclude other features, components, elements, or steps unless the context clearly requires otherwise. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] FIG1 is a first perspective view of a nozzle mechanism for chip manufacturing disclosed in an embodiment of the present invention;

[0026] FIG2 is a second perspective view of the nozzle mechanism for chip manufacturing disclosed in an embodiment of the present invention;

[0027] FIG3 is a schematic diagram of the internal structure of a nozzle mechanism for chip manufacturing disclosed in an embodiment of the present invention;

[0028] FIG4 is a schematic structural diagram of a rotating body in a nozzle mechanism for chip manufacturing disclosed in an embodiment of the present invention;

[0029] FIG5 is a top view of a nozzle mechanism for chip manufacturing disclosed in an embodiment of the present invention;

[0030] FIG6 is a cross-sectional view taken along the AA direction in FIG5 ;

[0031] FIG7 is a schematic structural diagram of a support body in a nozzle mechanism for chip manufacturing disclosed in an embodiment of the present invention;

[0032] FIG8 is a front view of a support body in a nozzle mechanism for chip manufacturing disclosed in an embodiment of the present invention;

[0033] Figure 9 is a cross-sectional view taken along the BB direction in Figure 8;

[0034] Explanation of the accompanying drawings: 1-suction nozzle, 2-joint assembly, 20-transition chamber, 21-rotating body, 211-air inlet, 212-bearing groove, 213-auxiliary bearing groove, 214-pipe connection hole, 22-support body, 221-rotation support part, 222-support body air hole, 223-protrusion mounting part, 23-sealing structure, 231-annular groove, 232-annular protrusion, 24-rotational bearing, 241-fixed ring, 242-movable ring, 25-auxiliary support body, 251-auxiliary support protrusion, 26-auxiliary rotary bearing, 261-auxiliary fixed ring, 262-auxiliary movable ring, 3-pipeline, 4-drive unit. DETAILED DESCRIPTION

[0035] The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and are not to be construed as limiting the present invention.

[0036] The present invention discloses a nozzle mechanism for chip manufacturing, which can be used in chip production equipment to operate components in the chip production process. Specifically, the nozzle mechanism for chip manufacturing can be used in an internal pin bonding machine. The nozzle mechanism of the internal pin bonding machine will have a 180° flipping action during operation, and the pipe connected to the nozzle is prone to wear and entanglement when the nozzle mechanism flips. The nozzle mechanism for chip manufacturing disclosed by the present invention can avoid the occurrence of the above-mentioned problems. In addition, it should be noted that the nozzle mechanism for chip manufacturing can also be used in other production equipment to operate chips or heat sinks, etc.

[0037] As shown in Figures 1-9, the nozzle mechanism for chip manufacturing disclosed in the present invention includes a nozzle 1, a joint assembly 2 and a pipe 3.

[0038] The joint assembly 2 includes a rotating body 21 and a supporting body 22. The rotating body 21 has a transition cavity 20, and the rotating body 21 has an air inlet 211 communicating with the transition cavity 20. The air inlet 211 is located on the side of the rotating body 21 facing the supporting body 22. The supporting body 22 is located on the side of the rotating body 21 where the air inlet 211 is provided and covers the air inlet 211.

[0039] The rotating body 21 can rotate relative to the supporting body 22 along the circumferential direction of the rotating body 21, and a sealing structure 23 is provided between the rotating body 21 and the supporting body 22 to isolate the communication between the air inlet 211 and the outside world; the supporting body 22 is provided with a supporting body air hole 222 connected to the air inlet 211.

[0040] The pipe 3 connects the suction nozzle 1 and the transition chamber 20 , and the pipe 3 can move synchronously with the rotating body 21 .

[0041] The present invention configures the joint assembly 2 into a rotating body 21 and a supporting body 22 that can rotate relative to each other, and connects the pipe 3 connected to the suction nozzle 1 with the transition cavity 20 of the rotating body 21, so that the pipe 3 can rotate synchronously with the rotating body 21. When the suction nozzle 1 flips, the suction nozzle 1 drives the pipe 3 to rotate, and the pipe 3 can drive the rotating body 21 to rotate, thereby avoiding entanglement and wear of the pipe 3.

[0042] In this embodiment, the pipe 3 has a certain rigidity and does not deform when subjected to a certain force, so that the pipe 3 can serve as a force transmission tool to transmit the force generated during the rotation of the nozzle 1 to the rotating body 21. Specifically, the pipe 3 can be a metal pipe such as a steel pipe or a stainless steel pipe.

[0043] It is understood that, as shown in Figures 3-6, the outer contour of the rotating body 21 is generally cylindrical, and the rotating body 21 and the support body 22 are arranged side by side along the axial direction of the rotating body 21. A rotation support portion 221 is provided on the side of the support body 22 facing the rotating body 21. The rotating body 21 is sleeved outside the rotation support portion 221 and can rotate along the circumferential direction of the rotation support portion 221. The rotation support portion 221 is generally cylindrical and is used to provide stable support for the rotation of the rotating body 21.

[0044] As shown in Figures 3-8, the sealing structure 23 includes an annular groove 231 and an annular protrusion 232 that matches the annular groove 231. One of the annular groove 231 and the annular protrusion 232 is provided on the rotating body 21, and the other is provided on the supporting body 22. The annular groove 231 or the annular protrusion 232 on the rotating body 21 is provided around the air inlet 211. The cooperation of the annular groove 231 and the annular protrusion 232 forms a labyrinth seal structure. The annular protrusion 232 can move within the annular groove 231. While both of them provide sealing, they can also avoid restricting the relative rotation of the rotating body 21 and the supporting body 22.

[0045] It is understood that the annular protrusion 232 can be provided on the support body 22 or on the rotating body 21. When the annular protrusion 232 is provided on the support body 22, the annular groove 231 is correspondingly provided on the rotating body 21. When the annular protrusion is provided on the rotating body 21, the annular groove is correspondingly provided on the support body 22.

[0046] As shown in Figures 3-6, the air inlet 211 is generally annular in shape and extends from the rotating body 21. The air inlet 211 comprises an inner ring and an outer ring. The outer and inner rings are arranged radially along the rotating body 21, with the outer ring located further away from the center of the rotating body 21 than the inner ring. A support body air hole 222 is provided on the support body 22 opposite the air inlet 211. The support body air hole 222 communicates with the transition chamber 20 through the air inlet 211. The annular shape of the air inlet 211 ensures that the air inlet 211 remains opposite the support body air hole 222 during rotation of the rotating body 21 relative to the support body 22. The support body air hole 222 is used to communicate with a vacuum device to maintain a negative pressure in the transition chamber 20, thereby enabling the suction nozzle 1 to absorb components.

[0047] In order to achieve a sealing effect, in one embodiment, the sealing structure 23 also includes an outer sealing structure and an inner sealing structure. The outer sealing structure is arranged on the outer side of the outer ring of the air inlet hole 211, and the inner sealing structure is arranged on the inner side of the inner ring of the air inlet hole 211. The outer side of the outer ring is relatively farther away from the center of the rotating body 21, and the inner side of the inner ring is relatively closer to the center of the rotating body 21.

[0048] The above structure actually provides a sealing structure around the air inlet 211 to achieve sealing of the transition chamber 20 and the air inlet 211. Of course, in other embodiments, an outer sealing structure can be provided outside the outer ring of the air inlet 211, and an inner sealing structure can be provided between the rotating body 21 and the rotating support portion 221.

[0049] In this embodiment, the joint assembly 2 also has an auxiliary support body 25, which is arranged on the side of the rotating body 21 away from the supporting body 22. The rotating body 21 can rotate along the circumferential direction of the rotating body 21 relative to the auxiliary support body 25. The rotating body 21 is rotatably installed between the supporting body 22 and the auxiliary support body 25.

[0050] Specifically, as shown in FIG3 , the auxiliary support body 25 is fixed to the rotating support portion 221 so that the auxiliary support body 25 and the support body 22 form a support body assembly. The provision of the auxiliary support body 25 enables the rotating body 21 to be more stable and smooth during rotation. The auxiliary support body 25 is fixed to the end of the rotating support portion 221 away from the support body 22. It is understood that a seal is provided between the auxiliary support body 25 and the rotating support portion 221 to prevent the transition chamber 20 from leaking air outward through the gap between the auxiliary support body 25 and the rotating support portion 221, thereby achieving a better sealing effect.

[0051] In this embodiment, the sealing structure 23 includes a first sealing structure disposed between the rotating body 21 and the supporting body 22, and a second sealing structure disposed between the rotating body 21 and the auxiliary supporting body 25. The second sealing structure has the same design as the first sealing structure, both including an annular protrusion 232 and an annular groove adapted to fit the annular protrusion. The first sealing structure and the second sealing structure are positioned opposite each other, with the annular groove of the second sealing structure disposed on the side of the rotating body 21 facing away from the supporting body 22, and the annular groove of the second sealing structure is disposed on opposite sides of the rotating body 21 from the annular groove of the first sealing structure.

[0052] In this embodiment, the annular groove 231 is arranged on the side of the rotating body 21 facing the supporting body 22 and is provided in plurality, and the plurality of annular grooves 231 are concentrically arranged; the center of the annular groove 231 is coaxially arranged with the rotation center of the rotating body 21.

[0053] The annular protrusion 232 is disposed on a side of the support body 22 facing the rotating body 21 and is provided in plurality. The plurality of annular protrusions 232 are concentrically disposed; the center of the annular protrusion 232 is coaxially disposed with the rotation center of the rotating body 21 .

[0054] The annular groove 231 is arranged around the air inlet 211. The sealing structure 23 is formed by the cooperation of a plurality of annular protrusions 232 and annular grooves 231. The cooperation of the plurality of annular protrusions 232 and annular grooves 231 can achieve better sealing.

[0055] As shown in FIG3 , in order to better realize the rotation of the support body 22, the joint assembly 2 further has a rotary bearing 24, which has a fixed ring 241 and a movable ring 242. The movable ring 242 is sleeved outside the fixed ring 241 and can rotate circumferentially relative to the fixed ring 241. The fixed ring 241 is fixed to the support body 22, and the movable ring 241 is connected and fixed to the rotating body 21. The provision of the rotary bearing 24 can make the relative rotation of the rotating body 21 and the support body 22 smoother.

[0056] In this embodiment, as shown in FIG3 , the fixed ring 241 and the movable ring 242 are both annularly arranged, and the movable ring 242 is concentrically arranged with the fixed ring 241 . Balls may be further provided between the fixed ring 241 and the movable ring 242 to achieve relative rotation therebetween.

[0057] As shown in FIG7 , in order to better achieve the installation and fixation of the rotating bearing 24 , a protruding mounting portion 223 is formed on the side of the support body 22 facing the rotating body 21 , and the movable ring 242 is sleeved outside the protruding mounting portion 223 and fixed on the protruding mounting portion 223 ;

[0058] A bearing groove 212 is provided on the rotating body 21, and the bearing groove 212 is provided on the side of the rotating body 21 facing the supporting body 22. The air inlet 211 is connected to the bearing groove 212, and the air inlet 211 has an inlet located at the bottom of the bearing groove 212; the movable ring 242 is positioned in the bearing groove 212.

[0059] Similarly, in order to better realize the relative rotation between the rotating body 21 and the auxiliary support body 25, a secondary rotating bearing 26 is arranged between the rotating body 21 and the auxiliary support body 25. The secondary rotating bearing 26 has a secondary fixed ring 261 and a secondary movable ring 262. The secondary movable ring 262 can rotate in the circumferential direction relative to the secondary fixed ring 261. The secondary fixed ring 261 is fixed on the auxiliary support body 25, and the secondary movable ring 262 is connected and fixed to the rotating body 21.

[0060] As shown in Figure 3, a secondary support protrusion 251 is provided on the secondary support body 25, and the secondary fixed ring 261 is fixed on the secondary support protrusion 251; a secondary bearing groove 213 is provided on the side of the rotating body 21 facing the secondary support body 25, and the secondary movable ring 262 is positioned in the secondary bearing groove 213.

[0061] As shown in FIG. 4-6 , the rotating body 21 has a pipe connection hole 214 extending in the radial direction. The pipe connection hole 214 is communicated with the transition chamber 20 , and the pipe 3 is communicated with the pipe connection hole 214 .

[0062] The nozzle mechanism for chip manufacturing further includes a driving unit 4 , which drives the nozzle 1 to rotate. The rotation center of the nozzle 1 is coaxially arranged with the rotation center of the rotating body 21 .

[0063] Another embodiment of the present invention further discloses a chip packaging device, including the nozzle mechanism for chip manufacturing.

[0064] The above describes in detail the structure, features and effects of the present invention based on the embodiments shown in the drawings. The above is only a preferred embodiment of the present invention, but the scope of implementation of the present invention is not limited to what is shown in the drawings. Any changes made in accordance with the concept of the present invention, or modifications to equivalent embodiments with equivalent changes, which do not exceed the spirit covered by the description and drawings, should be within the scope of protection of the present invention.

Claims

1. A nozzle mechanism for chip manufacturing, characterized in that: Includes a nozzle, a connector assembly, and a pipe; The joint assembly comprises a rotating body and a supporting body, the rotating body having a transition cavity, the rotating body having an air inlet hole communicating with the transition cavity on one side facing the supporting body, and the supporting body being located on the side of the rotating body where the air inlet hole is arranged and covering the air inlet hole; The rotating body can rotate relative to the supporting body along the circumferential direction of the rotating body, and a sealing structure is arranged between the rotating body and the supporting body to isolate the connection between the air inlet and the outside; a supporting body air hole connected to the air inlet is arranged on the supporting body; the pipe connects the suction nozzle and the transition chamber, and the pipe rotates synchronously with the rotating body and the suction nozzle.

2. The nozzle mechanism for chip manufacturing according to claim 1, characterized in that: The outer contour of the rotating body is generally cylindrical. The rotating body and the supporting body are arranged side by side along the axial direction of the rotating body. A rotating support part is arranged on the side of the supporting body facing the rotating body. The rotating body is sleeved outside the rotating support part and can rotate along the circumferential direction of the rotating support body.

3. The nozzle mechanism for chip manufacturing according to claim 2, characterized in that: The sealing structure includes an annular groove and an annular protrusion matched with the annular groove. One of the annular groove and the annular protrusion is arranged on the rotating body, and the other is arranged on the supporting body. The annular groove or the annular protrusion is arranged around the air inlet hole.

4. The nozzle mechanism for chip manufacturing according to claim 3, characterized in that: The annular groove is arranged on a side of the rotating body facing the supporting body and is provided in plurality, and the plurality of annular grooves are arranged concentrically; The annular protrusion is arranged on a side of the support body facing the rotating body, and a plurality of the annular protrusions are arranged concentrically; the annular groove is arranged around the air inlet hole.

5. The nozzle mechanism for chip manufacturing according to claim 1, characterized in that: The joint assembly also has a rotating bearing, which has a coaxially arranged fixed ring and a movable ring. Relative to the fixed ring, the movable ring can rotate along the circumferential direction of the movable ring. The fixed ring is fixed on the support body, and the movable ring is connected and fixed to the rotating body.

6. The nozzle mechanism for chip manufacturing according to claim 5, characterized in that: A protrusion mounting portion is formed on the support body on one side facing the rotating body, and the movable ring is sleeved outside the protrusion mounting portion and fixed on the protrusion mounting portion; A bearing groove is provided on the rotating body, and the bearing groove is provided on the side of the rotating body facing the supporting body. The air inlet is connected to the bearing groove, and the air inlet has an inlet located at the bottom of the bearing groove; the movable ring is positioned in the bearing groove.

7. The nozzle mechanism for chip manufacturing according to claim 1, characterized in that: The joint assembly also has an auxiliary support body arranged on the side of the rotating body away from the supporting body, and the rotating body can rotate along the circumferential direction of the rotating body relative to the auxiliary support body; the rotating body is rotatably installed between the supporting body and the auxiliary support body; the joint assembly has a sealing structure arranged between the auxiliary support body and the rotating body.

8. The nozzle mechanism for chip manufacturing according to claim 7, characterized in that: A secondary rotating bearing is arranged between the rotating body and the secondary supporting body, the secondary rotating bearing has a secondary fixed ring and a secondary movable ring, the secondary movable ring can rotate in the circumferential direction relative to the secondary fixed ring, the secondary fixed ring is fixed on the secondary supporting body, and the secondary movable ring is connected and fixed to the rotating body; The auxiliary support body is provided with an auxiliary support protrusion, and the auxiliary fixing ring is fixed on the auxiliary support protrusion; A secondary bearing groove is arranged on one side of the rotating body facing the secondary supporting body, and the secondary movable ring is positioned in the secondary bearing groove.

9. The nozzle mechanism for chip manufacturing according to claim 1, characterized in that: The rotating body has a pipeline connection hole extending in the radial direction, the pipeline connection hole is communicated with the transition cavity, and the pipeline is communicated with the pipeline connection hole; The nozzle mechanism for chip manufacturing further comprises a driving unit, which drives the nozzle to rotate, and the rotation center of the nozzle is coaxially arranged with the rotation center of the rotating body.

10. A packaging device, characterized in that: It comprises a nozzle mechanism for chip manufacturing as described in any one of claims 1 to 9.

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