Substrate holding device
By employing a multi-seal structure in the substrate holding device, the problem of electroplating defects caused by air bubbles trapped on the substrate surface is solved, and the electroplating solution is effectively sealed, thereby improving the electroplating quality and uniformity.
Patent Information
- Authority / Receiving Office
- WO · WO
- Patent Type
- Applications
- Current Assignee / Owner
- ACM RES (SHANGHAI) INC
- Filing Date
- 2024-08-23
- Publication Date
- 2026-05-15
AI Technical Summary
In the chemical electroplating process, the retention of air bubbles on the substrate surface leads to electroplating defects. Existing substrate holding devices cannot effectively prevent the electroplating solution from entering through the gap between the pressure plate and the cup, thus affecting the electroplating quality.
A substrate holding device is designed, which adopts a multi-seal structure, including a first, second and third sealing part of the seal. By matching the shape of the seal with the upper end face of the cup, a multi-seal is formed to prevent the electroplating solution from entering the interior of the substrate holding device.
It effectively prevents plating solution from entering the substrate holding device, improves plating quality, reduces plating defects, and ensures the uniformity of plating in bubble-free areas on the substrate surface.
Smart Images
Figure CN2024114237_15052026_PF_FP_ABST
Abstract
Description
substrate holding device Technical Field
[0001] This invention belongs to the field of integrated circuit manufacturing technology, and specifically relates to a substrate holding device. Background Technology
[0002] In semiconductor integrated circuit manufacturing processes, chemical electroplating of substrates is an essential process for achieving high-quality integrated circuits. During chemical electroplating, to achieve high-quality substrate plating, it is crucial to ensure that no air bubbles remain on the substrate's plating surface after it enters the plating solution. The presence of air bubbles on the substrate's plating surface can lead to numerous problems. Areas with air bubbles on the plating surface are not exposed to the plating solution and will not be plating. The resulting plating defects may manifest as no plating or reduced plating thickness in the areas with air bubbles, depending on the duration of the air bubble's presence on the substrate and the length of time it remains in that area. In an inverted configuration (substrate plating surface facing down), buoyancy tends to pull air bubbles upwards onto the plating surface. Air bubbles are difficult to remove from the substrate surface because there is no mechanism within the plating chamber to drive them to the substrate edge, which is the only path for the air bubbles to leave the substrate surface. Therefore, when holding the substrate as it descends into the electroplating solution, the substrate holding device typically rotates while controlling the substrate to tilt at a certain angle as it enters the solution. Then, it adjusts the substrate to a horizontal angle (parallel to the surface of the electroplating solution). This tilt angle allows air bubbles to escape and prevents them from becoming trapped on the electroplating surface. When the substrate holding device holds the substrate and tilts it to contact the electroplating solution, the solution can easily enter the substrate holding device through the gap between the pressure plate and the cup, coming into contact with the conductive areas of the substrate and causing a voltage increase during electroplating.
[0003] Summary of the Invention
[0004] To prevent the electroplating solution from entering the substrate holding device through the gap between the periphery of the pressure plate and the upper end face of the cup when the substrate is fixed in the substrate holding device, thus affecting the electroplating quality, the present invention proposes a substrate holding device.
[0005] A substrate holding device, comprising:
[0006] The cup body is configured to support the substrate;
[0007] A pressure plate is configured to press against the back of the substrate to fix the substrate relative to the cup body, thereby holding the substrate in place.
[0008] A pressure plate driving device is connected to the pressure plate. The pressure plate driving device drives the pressure plate to descend or rise, so that the pressure plate presses against the back of the substrate to clamp the substrate or causes the pressure plate to leave the back of the substrate.
[0009] A sealing element is provided on the pressure plate;
[0010] The sealing element includes:
[0011] A fixing portion configured to secure the seal to the pressure plate;
[0012] A first sealing portion protruding downward from the fixing portion, wherein the cross-sectional shape of the first sealing portion is the cross-sectional shape of the gap between the periphery of the pressure plate and the cup body when the pressure plate abuts against the cup body, and the first sealing portion abuts against the upper end face of the cup body when pressed by the pressure plate in order to define a sealing area.
[0013] According to one specific embodiment of this application, the sealing element is an elastomer.
[0014] According to one specific embodiment of the present application, the sealing member further includes a second sealing portion extending downward and outward from the outer edge of the fixing portion.
[0015] According to a specific embodiment of this application, the lower end face of the second sealing part is lower than the lower end face of the first sealing part, and the second sealing part abuts against the upper end face of the cup body when pressed by the pressure plate in order to define the sealing area.
[0016] According to a specific embodiment of this application, when the second sealing part abuts against the upper end surface of the cup body, part of the second sealing part is pressed to a horizontal state, and the end of the second sealing part is approximately flush with the edge of the cup body.
[0017] According to a specific embodiment of this application, the sealing member further includes a third sealing portion formed by protruding downward from the lower end surface of the sealing member; the third sealing portion is located between the first sealing portion and the second sealing portion.
[0018] According to one specific embodiment of this application, the lower end face of the third sealing portion is lower than the lower end face of the first sealing portion.
[0019] According to one specific embodiment of the present application, the sealing element is disposed on the periphery of the pressure plate.
[0020] According to a specific embodiment of the present application, the fixing part includes a limiting groove, the limiting groove is disposed on the inner side wall of the fixing part, and the outer side wall of the pressure plate is provided with a limiting protrusion. The limiting groove matches the limiting protrusion to fix the sealing member to the periphery of the pressure plate.
[0021] According to a specific embodiment of this application, the top end of the fixing part is engaged in the fixing groove opened on the lower end face of the pressure plate.
[0022] According to one specific embodiment of the present application, the pressure plate further includes a protective cover, which is formed on the edge of the pressure plate and surrounds the outside of the pressure plate driving device.
[0023] According to one specific embodiment of this application, the sealing element is disposed on the protective cover of the corresponding area on the upper end of the cup body.
[0024] According to one specific embodiment of this application, a through hole is provided on the side wall of the pressure plate.
[0025] According to one specific embodiment of the present application, the lower surface of the pressure plate is provided with a downwardly extending protrusion.
[0026] The substrate holding device of the present invention is configured by setting a sealing element on the periphery of the pressure plate. The shape of the sealing element is the cross-sectional shape of the gap between the periphery of the pressure plate and the upper region of the cup. When the pressure plate and the cup are in contact, the gap between the periphery of the pressure plate and the upper end face of the cup is blocked, forming a fluid seal, thereby achieving a better sealing effect, protecting the substrate, and improving the electroplating quality of the substrate.
[0027] Simultaneously, multiple seals are incorporated into the sealing element. As the pressure plate moves from the top plate towards the cup body, the second sealing part first makes tight contact with the upper surface of the cup body, achieving the first layer of sealing. As the pressure plate continues to move towards the cup body, the lower surface of the third sealing part makes tight contact with the upper surface of the cup body, achieving the second layer of sealing. As the pressure plate continues to move towards the cup body, the first sealing part contacts the upper surface of the cup body and is pressed into the gap, achieving the third layer of sealing. When the pressure plate abuts against the cup body, the vertical force from the pressure plate further compresses the sealing element to form a fluid seal. Through the combined action of the first, second, and third sealing parts of the sealing element, multiple seals are formed, achieving fluid sealing effects simultaneously in different directions, forms, and action points, further ensuring the sealing effect.
[0028] The third and second sealing parts are located on the outer periphery of the gap, defining a larger sealing area. At the same time, the third and second sealing parts contact the upper surface of the cup body before the first sealing part, which ensures a better sealing effect.
[0029] Other features and advantages of the invention will be set forth in the following description, and will be apparent in part from the description, or may be learned by practicing the invention. The objects and other advantages of the invention may be realized and obtained by means of the structures pointed out in the description and the drawings.
[0030] Overview of the attached figures
[0031] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.
[0032] Figure 1 shows a schematic diagram of the substrate holding device according to an embodiment of the present invention;
[0033] Figure 2 shows a partial structural schematic diagram of the sealing element according to an embodiment of the present invention;
[0034] Figure 3 shows a schematic diagram of the relative positions of the seal and the pressure plate in an embodiment of the present invention;
[0035] Figure 4 shows a schematic diagram of the assembly structure of the seal and pressure plate according to an embodiment of the present invention;
[0036] Figure 5 shows a schematic diagram of the sealing structure when the pressure plate and the cup body are in contact with each other according to an embodiment of the present invention;
[0037] Figure 6 shows another structural schematic diagram of the substrate holding device according to an embodiment of the present invention;
[0038] Figure 7 shows a three-dimensional structural diagram of a pressure plate with through holes according to an embodiment of the present invention;
[0039] Figure 8 shows a bottom view of the pressure plate according to an embodiment of the present invention; and
[0040] Figure 9 shows a schematic diagram of the bump structure according to an embodiment of the present invention.
[0041] Preferred embodiments of the present invention
[0042] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.
[0043] This invention proposes a substrate holding device. Referring to Figure 1, Figure 1 shows a schematic diagram of the substrate holding device 100 according to an embodiment of the invention. The substrate holding device 100 includes a cup body 101, a pressure plate 102, a pressure plate driving device 106, and a sealing member 107. The cup body 101 is configured to support a substrate 400. The pressure plate 102 is configured to press against the back surface of the substrate 400 (the upper surface in the figure) to fix the substrate 400 relative to the cup body 101, thereby holding the substrate 400. The pressure plate driving device 106 is connected to the pressure plate 102, pressing and driving the pressure plate 102 to descend or rise, so that the pressure plate 102 presses against the back surface of the substrate 400 to clamp the substrate 400 or moves the pressure plate 102 away from the back surface of the substrate 400. The bottom of the cup body 101 is covered with a sealing lip 105. When the cup body 101 contains the substrate 400, and the pressure plate drive device 106 provides a vertical force between the cup body 101 and the pressure plate 102, fixing the substrate 400 in the cup body 101 by the pressure plate 102, the substrate 400 abuts against the sealing lip 105, forming a fluid seal to isolate the edge of the substrate 400 from the electroplating solution. The cup body 101 is supported by a support rod 103, which is connected to the top plate 104. For the purposes of discussion, the assembly including components 101-107 is collectively referred to as the substrate holding device 100. However, note that the concept of "substrate holding device" generally extends to various combinations and sub-combinations of components that abut against the substrate 400 and allow its movement and positioning.
[0044] As described above, the cup body 101 is supported by a support rod 103 and a top plate 104. Typically, the cup body 101 provides a support member 1011 on which a substrate 400 can be placed. The cup body 101 includes an opening through which the electroplating solution can contact the electroplating surface of the substrate 400. Note that the substrate 400 has a front side (lower surface in the figure), on which electroplating is performed. The outer periphery of the substrate 400 rests on the support member 1011 of the cup body 101, and a pressure plate 102 presses down on the back side of the substrate 400 to hold the substrate 400 between the pressure plate 102 and the cup body 101.
[0045] To load the substrate 400 into the substrate holding device 100, the pressure plate 102 is lifted from its depicted position via the pressure plate drive device 106, creating a receiving space between the cup body 101 and the pressure plate 102, into which the substrate 400 can be inserted, thereby being placed into the cup body 101. Then, as depicted, the pressure plate 102 is lowered to abut against the outer periphery of the cup body 101 while its lower end face abuts against the substrate 400. The pressure plate drive device 106 transmits a vertical force to bring the pressure plate 102 against the substrate 400. These transmitted forces are indicated by the arrows in Figure 1.
[0046] In one embodiment, the sealing lip 105 at the bottom of the cup body 101 is an elastomer with a certain deformation capacity. When the pressure plate 102 is lowered to abut against the cup body 101, and the two work together to clamp the substrate 400, the sealing lip 105 undergoes elastic deformation under the pressure of the substrate 400, forming a tight seal between the sealing lip 105 and the substrate 400. The sealing lip 105 prevents the electrolyte from contacting the back of the substrate 400, thereby ensuring the electroplating quality.
[0047] In one embodiment, the seal 107 is an elastomer. In this embodiment, the material used to prepare the seal 107 is selected as fluororubber (e.g., perfluorinated or fluorinated rubber), silicone rubber, etc. Specifically, the seal 107 can be made of different materials depending on the process application. For example, in copper electroplating, a semi-fluorinated rubber (e.g., Viton fluororubber) with good sealing properties and low hardness can be used, while in high-temperature electroplating processes such as nickel or gold electroplating, perfluorinated rubber can be used. In other embodiments, the seal 107 is hydrophobically treated to reduce the adhesion of electroplating solution to the surface of the seal 107. The seal 107 can be hydrophobically treated in various ways, such as: 1) using a hydrophobic material (e.g., Teflon) for the seal 107; 2) applying a hydrophobic coating (e.g., a Teflon coating) to the surface of the seal 107; 3) doping the seal 107 with a hydrophobic material (e.g., doping with Teflon).
[0048] As shown in Figure 1, when the edge of the pressure plate 102 abuts against the upper region of the cup body 101, the seal 107 is located on the periphery of the pressure plate 102 and forms a seal with the upper end face of the cup body 101 to protect the back side of the substrate 400 and prevent any electrolyte that may enter the substrate holding device 100 through the gap 200. Here, the gap 200 is the space between the upper end face of the cup body 101 and the periphery of the pressure plate 102 when the pressure plate 102 and the upper end face region of the cup body 101 abut against each other.
[0049] The seal 107 has a three-dimensional annular structure. Further details of the seal 107 will be described below. Figure 2 shows a partial structural diagram of the seal according to an embodiment of the present invention; Figure 3 shows a structural diagram of the relative position of the seal and the pressure plate according to an embodiment of the present invention. As shown in Figures 2 and 3, the seal 107 includes a fixing part 1071 and a first sealing part 1072. The fixing part 1071 is the main body of the seal 107, fixed to the periphery of the pressure plate 102. The first sealing part 1072 protrudes downward from the fixing part 1071. The cross-sectional shape of the first sealing part 1072 is the same as the cross-sectional shape of the gap 200. When the pressure plate 102 abuts against the cup body 101, and the edge of the pressure plate 102 abuts against the upper region of the cup body 101, the gap 200 is formed between the periphery of the pressure plate 102 and the upper region of the cup body 101. For example, as shown in Figure 3, when the cross-sectional shape of the gap 200 is triangular, the shape of the first sealing part 1072 is approximately prism, and its cross-sectional shape is a triangle that matches the cross-sectional shape of the gap 200. It should be understood that when the cross-sectional shape of the gap 200 is rectangular, the first sealing part 1072 is a cuboid, and its cross-sectional shape is rectangular. The cross-sectional shape of the gap 200 can be designed according to actual needs. Therefore, the shape of the first sealing part 1072 can be any shape that matches the gap 200. When the first sealing part 1072 is pressed against the upper surface of the cup body 101 by the pressure plate 102, it blocks the gap 200 to define a sealing area, and the electroplating solution is substantially discharged from the sealing area during the electroplating process. Specifically, please continue to refer to Figures 2 and 3. The fixing part 1071 includes a limiting groove 109A provided on the inner side wall of the fixing part 1071. The outer side wall of the pressure plate 102 is provided with a limiting protrusion 109B that matches the limiting groove 109A. The limiting groove 109A and the limiting protrusion 109B are matched to limit and fix the sealing member 107 to the periphery of the pressure plate 102. Referring to Figure 1, when the pressure plate 102 is driven by the vertical force provided by the pressure plate driving device 106 to abut against the cup body 101, the vertical force from the pressure plate 102 compresses the sealing member 107 to form a fluid seal. The cross-sectional shape of the first sealing part 1072 of the seal 107 matches the cross-sectional shape of the gap 200 between the periphery of the pressure plate 102 and the upper end face of the cup body 101. Therefore, when the pressure plate 102 and the cup body 101 abut, the first sealing part 1072 is pressed tightly between the gaps 200 to form a fluid seal, preventing the electroplating solution from entering the substrate holding device 100 through the gap 200 between the pressure plate 102 and the cup body 101 and affecting the electroplating quality.
[0050] Furthermore, referring to Figure 4, the top end of the fixing part 1071 is engaged in the fixing groove 109C opened on the lower end face of the pressure plate 102. By engaging the fixing part 1071 in the fixing groove 109C, the seal 107 is fixed in the left-right direction; by matching the limiting groove 109A and the limiting protrusion 109B, the seal 107 is fixed in the up-down direction, thereby ensuring the stability of the seal 107 during installation.
[0051] In another embodiment, the seal 107 further includes a second sealing portion 1073 extending downward and outward from the outer edge of the fixing portion 1071. Referring to FIG2 and in conjunction with FIG4, the downward and outward extension of the second sealing portion 1073 from the outer edge of the fixing portion 1071 is a beveled design. Furthermore, the lower end face of the second sealing portion 1073 is lower than the lower end face of the first sealing portion 1072, that is, when the pressure plate 102 moves from the top plate 104 toward the cup body 101, the second sealing portion 1073 contacts the cup body 101 first. This design enables the second sealing portion 1073 to have both a sealing function and a blocking function, so that when the electroplating liquid splashes onto the upper end face of the cup body 101, it falls directly onto the flattened upper end face of the second sealing portion 1073. When the pressure plate drive device 106 drives the pressure plate 102 to move towards the top plate 104, the second sealing part 1073 returns to its inclined shape, thereby guiding the electroplating liquid falling on the second sealing part 1073 to the outside of the cup body 101, preventing the splashed electroplating liquid from remaining on the upper surface of the cup body 101, and thus eliminating the possibility of the electroplating liquid flowing into the interior of the cup body 101. Secondly, the second sealing part 1073 is an elastic body with an inclined design. When the pressure plate 102 abuts against the cup body 101, the vertical force from the pressure plate 102 compresses the sealing member 107, causing the second sealing part 1073 to become horizontally positioned, thus forming a fluid seal by tightly fitting the upper surface of the cup body 101. The combined action of the first sealing part 1072 and the second sealing part 1073 of the sealing member 107 forms a secondary seal, resulting in a better sealing effect.
[0052] Furthermore, to ensure that the electroplating solution falling on the second sealing part 1073 is drained to the outside of the cup body 101 when the pressure plate drive device 106 drives the pressure plate 102 to move towards the top plate 104, it is required that the end of the second sealing part 1073, which is pressed into a horizontal state, is approximately flush with the edge of the cup body 101. It should be understood that, in some cases, the horizontal distance between the end of the second sealing part 1073, which is pressed into a horizontal state, and the edge of the cup body 101 can be between approximately 0.01 and 5 mm.
[0053] Referring to FIG2, in another embodiment, the seal 107 further includes a third sealing portion 1074 formed by protruding downward from the lower end face of the seal 107 (more specifically, the fixing portion 1071). The third sealing portion 1074 is located between the first sealing portion 1072 and the second sealing portion 1073. Furthermore, the lower end face of the third sealing portion 1074 is lower than the lower end face of the first sealing portion 1072. As the pressure plate 102 moves from the top plate 104 toward the cup body 101, the second sealing part 1073 first makes tight contact with the upper end face of the cup body 101, achieving the first seal; as the pressure plate 102 continues to move toward the cup body 101, the lower end face of the third sealing part 1074 then makes tight contact with the upper end of the cup body 101, achieving the second seal; as the pressure plate 102 continues to move toward the cup body 101, the first sealing part 1072 contacts the upper end face of the cup body 101 and is pressed between the gaps 200, achieving the third seal; when the pressure plate 102 abuts against the cup body 101, the vertical force from the pressure plate 102 further compresses the sealing element 107 to form a fluid seal. When the pressure plate driving device 106 drives the pressure plate 102 to fully abut against the cup body 101, and the first sealing part 1072, the second sealing part 1073, and the third sealing part 1074 all form a seal with the upper end surface of the cup body 101, as shown in Figure 5, Figure 5 shows a schematic diagram of the sealing structure when the pressure plate and the cup body abut against each other according to an embodiment of the present invention. Multiple seals are formed by the combined action of the first sealing part 1072, the second sealing part 1073, and the third sealing part 1074 of the sealing member 107. This achieves fluid sealing simultaneously in different directions, forms, and working locations, further ensuring the sealing effect. The third sealing part 1074 and the second sealing part 1073 are located on the outer periphery of the gap 200, defining a larger sealing area. Furthermore, the fact that the third sealing part 1074 and the second sealing part 1073 contact the upper end surface of the cup body 101 before the first sealing part 1072 ensures a better sealing effect.
[0054] Furthermore, the number of third sealing parts 1074 is two or more. The sealing element 107 is an elastic body with a certain degree of elasticity. Under the vertical pressure of the pressure plate 102, it can produce slight deformation, so that multiple sealing parts of the sealing element 107 can simultaneously achieve fluid sealing with the upper end face of the cup body 101, thereby realizing multi-stage sealing between the cup body 101 and the pressure plate 102 and achieving a better sealing effect.
[0055] Furthermore, referring to Figure 6, the pressure plate 102 also includes a protective cover 500, which is formed on the edge of the pressure plate 102 and surrounds the outside of the pressure plate drive device 106. The protective cover 500 can be integrated with the pressure plate 102 or set independently relative to the pressure plate 102, and the pressure plate 102 and the protective cover 500 are fixedly connected by fasteners. Exemplarily, in this embodiment, the protective cover 500 is fixedly connected to the pressure plate 102 by bolts. The protective cover 500 can protect the pressure plate 102 and the pressure plate drive device 106 connected to the pressure plate 102, preventing electroplating liquid from splashing onto the upper surface of the pressure plate 102, thereby preventing the electroplating liquid from corroding the pressure plate 102 and the pressure plate drive device 106 connected to the pressure plate 102 under long-term process conditions, affecting equipment safety and service life. In the described embodiment, the protective cover 500 is cylindrical, sleeved on the outside of the pressure plate 102, and fixedly connected to the pressure plate 102 by bolts. When the pressure plate drive device 106 drives the pressure plate 102 to move up and down, the protective cover 500 moves up and down along with the pressure plate 102.
[0056] Furthermore, in order to prevent the protective cover 500 from affecting the normal operation of the substrate holding device 100 itself, the inner sidewall of the protective cover 500 is provided to be at a certain distance from the edge of the top plate 104. For example, the distance between the inner sidewall of the protective cover 500 and the edge of the top plate 104 is 2mm.
[0057] Furthermore, referring to Figures 1 and 7, at least one through hole 1021 is provided on the side wall of the pressure plate 102. When the pressure plate 102 abuts against the cup body 101, the sealing lip 105 located at the bottom of the cup body 101 and the sealing element 107 located between the pressure plate 102 and the cup body 101 simultaneously achieve a fluid sealing effect, creating a negative pressure environment (compared to the pressure inside the electroplating equipment during the electroplating process) within the space 300. When the pressure plate 102 needs to be separated from the substrate 400, the substrate 400 is easily sucked by the pressure plate 102, making separation of the pressure plate 102 from the substrate 400 difficult. Therefore, by providing the through hole 1021, the air pressure inside the space 300 can be kept in balance with the air pressure of the electroplating environment inside the external electroplating equipment, facilitating the separation of the pressure plate 102 from the substrate 400.
[0058] Furthermore, referring to Figures 8 and 9, the lower surface of the pressure plate 102 is also provided with protrusions 1022 protruding towards the substrate 400. When the pressure plate 102 contacts the substrate 400, only the protrusions 1022 on the lower surface of the pressure plate 102 contact the back surface of the substrate 400, while the rest of the lower surface of the pressure plate 102 does not contact the substrate 400. This design reduces the contact area between the pressure plate 102 and the substrate 400, reducing scratches and contamination on the back surface of the substrate 400. It also ensures that the pressure on the back surface of the substrate 400 is equal to the ambient pressure, facilitating separation of the substrate 400 from the pressure plate 102 during unloading. During the manufacturing process, it was found that while the design of bump 1022 effectively reduced scratches and contamination on the back of substrate 400, bump 1022 would occasionally stick to substrate 400 during unloading, resulting in suboptimal separation between substrate 400 and pressure plate 102. To address this, the researchers created grooves 1023 on the lower surface of bump 1022 to further reduce the contact area between bump 1022 and substrate 400. This further reduces the likelihood of scratches and contamination on the back of substrate 400 and facilitates separation of substrate 400 from pressure plate 102 during unloading. It is noteworthy that the grooves 1023 should be symmetrically positioned about the center of bump 1022 to ensure more stable and uniform contact between bump 1022 and substrate 400.
[0059] In another embodiment, referring to FIG6, the seal 107 is disposed on the protective cover 500. When the seal 107 is disposed on the protective cover 500, the manner of disposal is the same as that of disposal on the pressure plate 102, and will not be described in detail here.
[0060] Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features; and these modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of the present invention.
Claims
1. A substrate holding device, characterized in that: include: The cup body is configured to support the substrate; A pressure plate is configured to press against the back of the substrate to fix the substrate relative to the cup body, thereby holding the substrate in place. A pressure plate driving device is connected to the pressure plate and drives the pressure plate to descend or rise, so that the pressure plate presses against the back of the substrate to clamp the substrate or causes the pressure plate to leave the back of the substrate. A sealing element is provided on the pressure plate; The sealing element includes: A fixing part fixed to the pressure plate; A first sealing portion protrudes downward from the fixing portion, wherein the cross-sectional shape of the first sealing portion is the same as the cross-sectional shape of the gap between the periphery of the pressure plate and the cup body when the pressure plate abuts against the cup body, and the first sealing portion abuts against the upper end surface of the cup body when pressed by the pressure plate in order to define a sealing area.
2. The substrate holding device according to claim 1, characterized in that: The seal is an elastomer.
3. The substrate holding device according to claim 2, characterized in that: The seal also includes a second sealing portion extending downward and outward from the outer edge of the fixing portion.
4. The substrate holding device according to claim 3, characterized in that: Before the pressure plate comes into contact with the cup body, the lower end face of the second sealing part is lower than the lower end face of the first sealing part. When the second sealing part is pressed by the pressure plate, it abuts against the upper end face of the cup body to define the sealing area.
5. The substrate holding device according to claim 4, characterized in that: When the second sealing part abuts against the upper surface of the cup body, part of the second sealing part is pressed to a horizontal state, and the end of the second sealing part is roughly flush with the edge of the cup body.
6. The substrate holding device according to claim 3, characterized in that: The sealing element further includes a third sealing portion protruding downward from the lower end of the fixing portion, the third sealing portion being located between the first sealing portion and the second sealing portion.
7. The substrate holding device according to claim 6, characterized in that: Before the pressure plate comes into contact with the cup body, the lower end face of the third sealing part is lower than the lower end face of the first sealing part.
8. The substrate holding device according to claim 1, characterized in that: The seal is disposed on the periphery of the pressure plate.
9. The substrate holding device according to claim 8, characterized in that: The fixing part includes a limiting groove, which is disposed on the inner side wall of the fixing part. The outer side wall of the pressure plate is provided with a limiting protrusion. The limiting groove and the limiting protrusion match each other to fix the fixing part to the periphery of the pressure plate.
10. The substrate holding device according to claim 9, characterized in that: The top of the fixing part is engaged in the fixing groove opened on the lower end face of the pressure plate.
11. The substrate holding device according to claim 1, characterized in that: The pressure plate also includes a protective cover formed on the edge of the pressure plate and surrounding the outside of the pressure plate drive device.
12. The substrate holding device according to claim 11, characterized in that: The sealing element is disposed on the protective cover of the corresponding area on the upper end of the cup body.
13. The substrate holding device according to claim 1, characterized in that: The pressure plate has through holes on its side wall.
14. The substrate holding device according to claim 1, characterized in that: The lower surface of the pressure plate is provided with downwardly protruding bumps.