Chip packaging structure and radio frequency front-end module

Abstract

The present application relates to the technical field of packaging, and particularly relates to a chip packaging structure. A first adhesive material portion is provided on a support structure and partially covers a side surface of a packaged chip, and a second adhesive material portion is provided on the upper surface of the packaged chip. The first adhesive material portion is provided with a first slope peak, and the second adhesive material portion is provided with a second slope peak. The provision of the first adhesive material portion ensures the formation of a cavity between the bottom surface of the chip and a substrate and reduces the stress on the side surface of the packaged chip, and the first slope peak alleviates the stress caused by thermal deformation of the first adhesive material portion. The provision of the second adhesive material portion reduces the stress on the upper surface of the packaged chip, and the second slope peak alleviates the stress caused by thermal deformation of the second adhesive material portion. Hence, the overall performance of the chip is ensured and the reliability of the chip is enhanced.

Description

A chip packaging structure and radio frequency front-end module

[0001] This application claims priority to the Chinese patent application filed with the China Patent Office on September 28, 2023, with application number CN202311275660.6 and application name “A chip packaging structure and RF front-end module”, the entire contents of which are incorporated by reference into this application. Technical Field

[0002] The present application belongs to the field of packaging technology, and in particular relates to a chip packaging structure and a radio frequency front-end module. Background Art

[0003] During the packaging process, some surface acoustic wave (SAW) and bulk acoustic wave (BAW) packaged chips require a cavity structure between the chip and the substrate to meet their functions, performance or other special requirements.

[0004] During the packaging process, a film is usually applied to the outer surface of the packaged chip to ensure that a closed cavity is formed between the packaged chip and the substrate. However, the lamination process is generally full-surface lamination. The process of laminating the outer surface of the filter alone is complex and difficult to control. The cost of full-surface lamination is high, and lamination will cause the subsequent plastic encapsulation material to not be completely filled, resulting in cavities in some chips that do not require cavity formation (such as power amplifiers, passive components, etc.), affecting the reliability of the device. At the same time, during the process or use, the covered film is easily deformed by heat, thereby causing stress on the outer surface of the chip. In addition, during the plastic encapsulation process of the chip package, the film cannot buffer the stress caused by the plastic encapsulation material on the packaged chip, thereby further affecting the reliability of the packaged chip.

[0005] Therefore, for the increasing number of chips, how to ensure the reliability of the packaging structure is an urgent problem to be solved in packaging design.

[0006] Application Contents

[0007] The present application solves the technical problem of low chip reliability in the prior art and provides a chip packaging structure and a radio frequency front-end module.

[0008] In a first aspect, an embodiment of the present application provides a chip packaging structure, comprising: a substrate, a first chip pad being provided on the first surface; a support structure being provided on the first surface of the substrate; a packaging chip being provided on the first surface, a first conductive bump being provided on the bottom surface of the packaging chip, the first conductive bump being interconnected with the first chip pad, and a cavity structure being formed between the packaging chip, the support structure and the substrate; a first glue portion being provided on a side surface of the support structure facing away from the substrate, and the first glue portion at least partially covering the side surface of the packaging chip, and the first glue portion including a first slope peak; a second glue portion being provided on an upper surface of the packaging chip facing away from the substrate, and the second glue portion including a second slope peak; and a plastic encapsulation material, the plastic encapsulation material covering the packaging chip, the support structure, the first glue portion and the second glue portion.

[0009] In a second aspect, an embodiment of the present application provides a chip packaging structure, comprising: a substrate, a first chip pad being provided on a first surface; a support structure being provided on the first surface of the substrate; a packaged chip being provided on the first surface, a first conductive bump being provided on a bottom surface of the packaged chip, the first conductive bump being interconnected with the first chip pad, and a cavity structure being formed between the packaged chip, the support structure, and the substrate; a first adhesive portion being provided on a surface of the support structure facing away from the substrate, the first adhesive portion at least partially covering a side surface of the packaged chip, the first adhesive portion including a first peak; a second adhesive portion being provided on an upper surface of the packaged chip facing away from the substrate, the second adhesive portion including a second peak; a third adhesive portion being provided on an upper surface of the packaged chip facing away from the first surface, the third adhesive portion including a third peak, the second adhesive portion not being in contact with the third adhesive portion, or the second adhesive portion being in at least partial contact with the third adhesive portion; and a molding material covering the packaged chip, the support structure, the first adhesive portion, the second adhesive portion, and the third adhesive portion.

[0010] In a third aspect, an embodiment of the present application provides a radio frequency front-end module, comprising the chip packaging structure as described above.

[0011] In a fourth aspect, an embodiment of the present application provides an electronic device, comprising a circuit board and a chip packaging structure as described above, wherein the chip packaging structure is arranged on the circuit board and electrically connected to the circuit board.

[0012] In the embodiments of the present application, on the one hand, a first glue portion is provided on the supporting structure, and the first glue portion partially covers the side surface of the packaged chip, thereby protecting the substrate formed between the packaged chip and the substrate, and the first glue portion partially covers the side surface of the packaged chip, which can reduce the stress caused by the plastic packaging material on the side surface of the packaged chip when filling, and the first glue portion is provided with a first slope peak, through which the stress caused by the thermal deformation of the first glue portion can be released, further protecting the side surface of the packaged chip, and improving the reliability of the packaged chip; on the other hand, a second glue portion is also provided on the upper surface of the packaged chip, and the second glue portion can reduce the stress caused by the plastic packaging material on the upper surface of the packaged chip when filling, and at the same time, a second slope peak is provided to release the stress caused by the thermal deformation of the second glue portion, protect the upper surface of the packaged chip, further improve the reliability of the packaged chip, and ensure the reliability of the chip packaging structure. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] The present application is further described below with reference to the accompanying drawings and examples.

[0014] FIG1 is a schematic structural diagram of a chip packaging structure in one embodiment of the present application;

[0015] FIG2 is a schematic structural diagram of a chip packaging structure in another embodiment of the present application;

[0016] FIG3 is a schematic structural diagram of a chip packaging structure in another embodiment of the present application;

[0017] FIG4 is a schematic structural diagram of a chip packaging structure in another embodiment of the present application;

[0018] FIG5 is a schematic structural diagram of a chip packaging structure in another embodiment of the present application;

[0019] FIG6 is a schematic structural diagram of a chip packaging structure in another embodiment of the present application;

[0020] FIG7 is an enlarged schematic diagram of a portion of the structure in FIG6 ;

[0021] FIG8 is a schematic structural diagram of a chip packaging structure in another embodiment of the present application;

[0022] FIG9 is a schematic structural diagram of a chip packaging structure in another embodiment of the present application;

[0023] FIG10 is a schematic structural diagram of a chip packaging structure in another embodiment of the present application;

[0024] FIG11 is a schematic structural diagram of a chip packaging structure in another embodiment of the present application;

[0025] FIG12 is a schematic structural diagram of a chip packaging structure in another embodiment of the present application;

[0026] FIG13 is a schematic structural diagram of a chip packaging structure in another embodiment of the present application;

[0027] FIG14 is a schematic structural diagram of a chip packaging structure in another embodiment of the present application;

[0028] FIG15 is a schematic structural diagram of a chip packaging structure in another embodiment of the present application;

[0029] FIG16 is a schematic structural diagram of a chip packaging structure in another embodiment of the present application.

[0030] The reference numerals are as follows:

[0031] 10. Support structure; 11. First surface; 12. Substrate; 13. First chip pad; 14. Molding material; 15. Second chip pad; 16. Third chip pad;

[0032] 21. First adhesive material section; 22. Second adhesive material section; 23. Third adhesive material section; 211. First section; 212. Second section; 223. Third section; 224. Fourth section; 225. First module; 226. Second module; 2111. First section peak; 2122. Second section peak; 2112. First slope valley; 2233. Third section peak; 2244. Fourth section peak; 2234. Second slope valley;

[0033] 30. Packaged chip; 31. First conductive bump; 32. Cavity structure; 33. First chip; 331. Bonding wire; 332. Third conductive bump. DETAILED DESCRIPTION

[0034] The following will be combined with the drawings in the embodiments of this application to clearly and completely describe the technical solutions in the embodiments of this application. Obviously, the embodiments described are part of the embodiments of this application, not all of them. Based on the embodiments in this application, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of this application.

[0035] It should be understood that the present application can be implemented in various forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided to make the disclosure thorough and complete and to fully convey the scope of the present application to those skilled in the art. In the drawings, the dimensions and relative dimensions of layers and regions may be exaggerated for clarity. Like reference numerals denote like elements throughout.

[0036] It should be understood that although the terms first, second, third, etc. may be used to describe various elements, components, regions, layers, and / or portions, these elements, components, regions, layers, and / or portions should not be limited by these terms. These terms are merely used to distinguish one element, component, region, layer, or portion from another element, component, region, layer, or portion. Thus, a first element, component, region, layer, or portion discussed below may be referred to as a second element, component, region, layer, or portion without departing from the teachings of this application.

[0037] The purpose of the terms used herein is only to describe specific embodiments and is not intended to limit the present application. When used herein, the singular forms "a", "an", and " / the" are intended to include the plural forms, unless the context clearly indicates otherwise. It should also be understood that the terms "comprising" and / or "including", when used in this specification, identify the presence of features, integers, steps, operations, elements and / or parts, but do not exclude the presence or addition of one or more other features, integers, steps, operations, elements, parts and / or groups. When used herein, the term "and / or" includes any and all combinations of the relevant listed items.

[0038] In order to fully understand the present application, detailed structures and steps will be presented in the following description to illustrate the technical solutions proposed by the present application. The preferred embodiments of the present application are described in detail below. However, in addition to these detailed descriptions, the present application may also have other implementation methods.

[0039] An embodiment of the present application provides a chip packaging structure, comprising: a substrate, a first chip pad being provided on the first surface; a support structure formed on the first surface of the substrate; a packaged chip being provided on the first surface, a first conductive bump being provided on the bottom surface of the packaged chip, the first conductive bump being interconnected with the first chip pad, and a cavity structure being formed between the packaged chip, the support structure and the substrate; a first adhesive portion being provided on a side surface of the support structure facing away from the substrate, the first adhesive portion at least partially covering the side surface of the packaged chip, the first adhesive portion including a first slope peak; a second adhesive portion being provided on an upper surface of the packaged chip facing away from the substrate, the second adhesive portion including a second slope peak; and a plastic encapsulation material, the plastic encapsulation material covering the packaged chip, the support structure, the first adhesive portion and the second adhesive portion.

[0040] As shown in Figure 1 , in the chip packaging structure, the substrate 12 includes a first surface 11, wherein the substrate 12 can be a resin substrate, a ceramic substrate, a glass substrate or other types of substrates. Optionally, the substrate 12 is a resin substrate.

[0041] The first chip pad 13 arranged on the first surface 11 can be arranged on the first surface 11 of the substrate 12 (that is, protruding from the first surface 11), or the first chip pad 13 can be embedded in the first surface 11 (as shown in Figure 1), or the first chip pad 13 can also be embedded in the first surface 11 and protrude above the first surface 11, or other feasible chip pad setting methods are not specifically limited here.

[0042] In this embodiment, the first surface 11 is also covered with a support structure 10, wherein the support structure 10 can be a solder resist layer, and the support structure 10 can be formed using a solder resist material; the solder resist layer on the substrate 12 serves as a support layer, thereby reducing the formation of additional layers and reducing the consumption of additional materials and processes.

[0043] The support structure 10 is provided with at least one opening, at which the chip pad is exposed, and the conductive bump of the packaged chip is connected to the chip pad; in some embodiments, the opening can also simultaneously expose part of the substrate 12 and the chip pad, and the conductive bump of the packaged chip is interconnected with the chip pad at the opening.

[0044] In this embodiment, the packaged chip 30 can be a filter-type chip such as a surface acoustic wave packaged chip 30 and a bulk acoustic wave packaged chip 30, which requires forming a cavity structure 32 between the substrate 12. The packaged chip 30 can also be other non-filter-type chips such as power amplifiers, and no specific restrictions are made here.

[0045] A plurality of first conductive bumps 31 are provided on the bottom surface of the packaging chip 30, wherein the bottom surface of the packaging chip 30 is regarded as the side where the working area of ​​the packaging chip 30 is located, and the surface opposite to the bottom surface of the packaging chip 30 is set as the upper surface of the packaging chip 30, that is, the upper surface of the packaging chip 30 is the side surface of the packaging chip 30 facing away from the substrate 12.

[0046] In this embodiment, the first chip pad 1313 is embedded in the first surface 1111 as an example. As shown in Figure 1, the first surface 1111 of the substrate 1210 may include multiple first chip pads 1313, and the bottom surface of the packaged chip 30 is provided with a first conductive bump 31. The first conductive bump 31 of the packaged chip 30 is interconnected with the first chip pad 13, and a cavity structure 32 is formed between the packaged chip 30 and the substrate 12; in the area where the cavity structure 32 is located, the support structure 10 is provided with a through hole, that is, the first conductive bump 31 of the packaged chip 30 is interconnected with the first chip pad 13 through the through hole, thereby forming a cavity structure 32 between the packaged chip 30, the support structure 10 and the substrate 12.

[0047] The chip packaging structure in this embodiment further includes a first adhesive portion 21 and a second adhesive portion 22. The first adhesive portion 21 is disposed on a side surface of the support structure 10 facing away from the substrate 12, and the first adhesive portion 21 at least partially covers the side surface of the packaged chip 30. The side surface of the packaged chip 30 is considered to be the surrounding surface except for the top and bottom surfaces of the packaged chip 30. The first adhesive portion 21 at least partially covers the side surface of the packaged chip 30 to prevent other materials, structures, liquids, or gases from entering the cavity structure 32 formed between the packaged chip 30 and the substrate 12 during the packaging process, causing contamination and affecting the performance of the chip or even leading to chip failure.

[0048] In this embodiment, the first adhesive portion 21 is disposed around the packaged chip 30 to form a closed ring structure, thereby preventing moisture from invading the cavity structure and further improving the reliability of the cavity structure 32 .

[0049] The first adhesive portion 21 includes a first slope peak, which is considered to be a point on the outer surface of the first adhesive portion 21 facing away from the support structure 10 where the height in the thickness direction is greater than the height of the surrounding structures in the thickness direction. In this embodiment, there can be one or more first slope peaks, such as 2, 5, 20, etc., and no specific limitation is imposed here.

[0050] Among them, the heights of multiple first peaks in the thickness direction can be the same or different, and the first peak can be a position point or a region. When the first peak is a region, the heights of different position points in the region in the thickness direction of the substrate 12 are the same.

[0051] In this embodiment, the direction away from the side surface of the packaged chip 30 can also be used as a reference. Here, the direction away from the side surface of the packaged chip 30 is defined as the extension direction. Specifically, a certain point on the side surface of the packaged chip 30 is used as the initial starting point, and the direction from the initial starting point to the side surface away from the packaged chip 30 or away from the initial starting point is used as the extension direction, and the extension direction should be perpendicular to the side surface of the packaged chip 30, or the extension direction should be regarded as being parallel to the plane where the support structure 10 is located. As shown in Figure 1, the structure of the first adhesive portion 21 in two extension directions in a certain cross-sectional view of the chip packaging structure is schematically shown. In each extension direction, the first adhesive portion 21 has a first peak, and the number of the first peaks can be one or more. The height of the first peak in the extension direction in the thickness direction is greater than the height of the first adhesive portion 21 around the first peak in the extension direction in the thickness direction.

[0052] When there are multiple first slope peaks in a certain extension direction, the heights of the multiple first slope peaks in the thickness direction may be the same or different.

[0053] In this embodiment, the second adhesive portion 22 is disposed on the upper surface of the packaged chip 30 facing away from the substrate 12, and the second adhesive portion 22 includes a second peak. Similar to the first peak, the second peak can be one or more, such as two, five, or twenty, without specific limitation. The heights of the multiple second peaks in the thickness direction can be the same or different, and the second peak can be a single point or a region. When the second peak is a region, the different points in the region have the same height in the thickness direction.

[0054] In a certain extension direction, the second adhesive portion 22 has one or more second peaks, and the height of the second peaks in the extension direction in the thickness direction is greater than the height of the first adhesive portion 21 around the second peaks in the extension direction in the thickness direction. When there are multiple second peaks in a certain extension direction, the heights of the multiple second peaks in the thickness direction can be the same or different.

[0055] The chip packaging structure in this embodiment further includes a plastic packaging material 14 . The plastic packaging material 14 covers the packaged chip 30 , the support structure 10 , the first adhesive portion 21 and the second adhesive portion 22 .

[0056] The filling of the plastic packaging material 14 can be used to isolate the chip packaging structure from the external environment, preventing the humidity, temperature, particles, etc. of the external environment from affecting the chip packaging structure, thereby protecting the chip packaging structure.

[0057] The molding material 14 can be an insulating resin material or other conventional molding material 14. Optionally, the molding material 14 is a resin material containing particles; the particles can be silicon dioxide (SiO2) particles or aluminum oxide (Al2O3) particles, which are not limited in this embodiment. It is understood that other insulating materials with good fluidity or liquid properties at high temperatures can also be used, as can other materials that can achieve a sealing function.

[0058] In this embodiment, the first adhesive portion 21 is provided to partially cover the side surface of the packaged chip 30. On the one hand, the plastic encapsulation material 14 and foreign matter are reduced from entering the cavity structure 32, thereby protecting the internal environment of the cavity structure 32. On the other hand, the stress caused by the plastic encapsulation material 14 on the side surface of the packaged chip 30 during filling is alleviated. At the same time, during the chip packaging process or use, the temperature of the first adhesive portion 21 increases, causing the first adhesive portion 21 to deform due to heat and generate stress. This stress will also affect the side surface of the first adhesive portion 21. In this embodiment, at least one first slope peak is provided. Since the height of the adhesive at this location is slightly higher than the height of the surrounding adhesive, the stress caused by the thermal deformation of the first adhesive portion 21 is released, thereby protecting the side surface of the packaged chip 30, thereby improving the reliability of the packaged chip 30 and ensuring the reliability of the chip packaging structure.

[0059] Similarly, in this embodiment, the second adhesive portion 22 is provided to alleviate the stress on the upper surface of the packaged chip 30 caused by the filling of the plastic encapsulation material 14. At the same time, the second slope peak is provided to release the stress caused by the thermal deformation of the second adhesive portion 22, thereby protecting the upper surface of the packaged chip 30, thereby reducing the pressure on the cavity structure 32 and the first conductive bump 31, further improving the reliability of the packaged chip 30, and ensuring the reliability of the chip packaging structure.

[0060] In one embodiment, the first adhesive portion 21 can be made of insulating adhesive, insulating ink, etc., for example, an insulating adhesive whose main component is resin. In at least one embodiment, the adhesive portion can be composed of a liquid polymer material that is mainly insulating. In at least one embodiment, the adhesive portion can be made of a fast-curing adhesive (for example, a UV-curing adhesive). It is understandable that in other embodiments, the adhesive portion can also be made of other commonly used adhesives or materials with similar properties to the adhesive (insulating, curable). The adhesive portion can be formed by processes such as dipping (Dip), brushing (Brush), spraying (Spray Coating), jetting (Jetting Dispense), needle dispensing (Needle Dispense) or printing (print).

[0061] The first adhesive portion 21 in this embodiment can be formed of one material or multiple materials, which is not specifically limited here.

[0062] In one embodiment, the second adhesive portion 22 can be made of insulating adhesive, insulating ink, etc., for example, an insulating adhesive whose main component is resin. In at least one embodiment, the adhesive portion can be composed of a liquid polymer material that mainly uses insulation. In at least one embodiment, the adhesive portion can be made of a fast-curing adhesive (for example, a UV-curing adhesive). It is understandable that in other embodiments, the adhesive portion can also be made of other commonly used adhesives or materials with similar properties to the adhesive (insulating, curable). The adhesive portion can be formed by processes such as dipping (Dip), brushing (Brush), spraying (Spray Coating), jetting (Jetting Dispense), needle dispensing (Needle Dispense) or printing (print).

[0063] The second adhesive portion 22 in this embodiment can be formed of one material or multiple materials, which is not specifically limited here.

[0064] In one embodiment, the materials of the first adhesive portion 21 and the second adhesive portion 22 may be the same or different, and there is no specific limitation here.

[0065] In one embodiment, the first adhesive portion 21 at least partially covers the side surface of the packaged chip 30 to a height of not less than 10 microns or greater than 5% of the thickness of the packaged chip 30 . That is, the distance between any position of the outer surface of the first adhesive portion 21 in contact with the side surface of the packaged chip 30 and the support structure 10 is not less than 10 microns or greater than 5% of the thickness of the packaged chip 30 . For example, this height can be 20 microns, 23 microns, 26 microns, etc., and is not specifically limited here.

[0066] In this embodiment, the height of the first adhesive portion 21 covering the side surface of the packaged chip 30 is greater than or equal to 10 microns, or should be greater than 5% of the thickness of the packaged chip 30. The thickness of the packaged chip 30 can be regarded as the thickness value of the packaged chip 30 in the thickness direction of the substrate 12, excluding the height of the conductive bumps. In this way, by covering the side surface of the packaged chip 30 with the first adhesive portion 21, a sealed cavity structure 32 can be formed between the packaged chip 30 and the substrate 12, preventing debris from entering the cavity structure 32 through the gap between the packaged chip 30 and the support structure 10, thereby contaminating the cavity structure 32 and causing chip failure.

[0067] In one embodiment, the width of the first adhesive portion 21 on the support structure 10 is greater than 50 micrometers, such as 60 micrometers, 65 micrometers, 75 micrometers, etc., which is not specifically limited here.

[0068] In this embodiment, the first adhesive portion 21 having a width greater than 50 microns on the support structure 10 can be interpreted as the width of the first adhesive portion 21 on the support structure 10 being greater than 50 microns in any extending direction. Alternatively, the vertical distance between the outermost position of the first adhesive portion 21 away from the packaged chip 30 and the side surface of the packaged chip 30 in the extending direction in any extending direction can be interpreted as being greater than 50 microns. Alternatively, the maximum distance between the position where the first adhesive portion 21 contacts the support structure 10 and the side surface of the packaged chip 30 in any extending direction can be interpreted as being greater than 50 microns. Of course, the aforementioned distance between the first adhesive portion 21 and the side surface of the packaged chip 30 can be interpreted as being perpendicular to the plane where the side surface of the packaged chip 30 is located. If there is a gap between the packaged chip 30 and the support structure 10, the maximum distance between the position where the first adhesive portion 21 contacts the support structure 10 and the gap in any extending direction can be interpreted as being greater than 50 microns.

[0069] It should be noted that if there is a gap between the packaged chip 30 and the support structure 10, and part of the first adhesive portion 21 extends into the gap between the packaged chip 30 and the support structure 10, then the width of the first adhesive portion 21 on the support structure 10 proposed in this embodiment does not include the portion of the first adhesive portion 21 extending into the gap between the packaged chip 30 and the support structure 10, but only includes the width of the portion of the first adhesive portion 21 on the support structure 10 that is away from the packaged chip 30.

[0070] In one embodiment, there is a gap between the packaged chip 30 and the support structure 10 , and a portion of the first adhesive portion 21 extends to form the gap between the packaged chip 30 and the support structure 10 .

[0071] In this embodiment, the first adhesive portion 21 at least partially extends to the gap formed between the packaged chip 30 and the support structure 10, thereby preventing impurities from entering the cavity structure 32 through the gap during the chip packaging process, contaminating the cavity structure 32 and causing failure of the packaged chip 30.

[0072] It should be noted that in the previous embodiment, the width of the first adhesive portion 21 on the support structure 10 does not include the portion extending to the gap formed between the packaged chip 30 and the support structure 10. That is, the width of the first adhesive portion 21 on the support structure 10 only refers to the width of the first adhesive portion 21 on the side away from the packaged chip 30, and does not include the width of the first adhesive portion 21 extending to the gap formed between the packaged chip 30 and the support structure 10.

[0073] Of course, in other embodiments, there is no gap between the packaged chip 30 and the support structure 10 , and in this case, the first adhesive portion 21 will not extend to the gap formed between the packaged chip 30 and the support structure 10 .

[0074] In one embodiment, there is a gap between the packaged chip 30 and the support structure 10. The distance of the gap formed between the packaged chip 30 and the support structure 10 is set to d1. The position of the first adhesive portion away from the first point on the outer surface of the packaged chip satisfies:

[0075] Among them, the first point is any point on the outer surface of the first adhesive portion facing away from the packaged chip, x1 is the distance between the first point and the side surface of the packaged chip, that is, the vertical distance (shortest distance) between the first point and the side surface, and y1 is the distance from the first point to the support structure, that is, the vertical distance (shortest distance) between the first point and the support structure.

[0076] In this embodiment, by setting the position of the first adhesive portion away from the first point on the outer surface of the packaged chip to satisfy the above formula, the thickness between the first adhesive portion and the gap can be ensured to be greater than the length of the gap, thereby reducing the possibility of the plastic encapsulation material breaking through the first adhesive portion, entering the cavity, and contaminating the cavity environment.

[0077] For details, please refer to Figure 4. For the sake of convenience, only some structures are adaptively shown in Figure 4. It should be understood that in other embodiments, there are other structures that are not shown yet, and the figure marks of related structures in Figure 4 can refer to Figure 3.

[0078] As shown in FIG4 , the position of the first point satisfies the above formula, which means that the thickness between the first adhesive portion and the gap can be essentially considered as the shortest distance between any point (the first point) on the outer surface of the first adhesive portion and the projection of the packaged chip on the support structure in any extension direction. That is, in this extension direction, the projection of the packaged chip on the support structure can be considered as a straight line, and the shortest distance is the length of the shortest path from any point on the outer surface of the first adhesive portion to the straight line. As shown in FIG4 , the shortest path is essentially the straight line between the first point and the projection point of the side surface of the packaged chip closest to the first point onto the support structure in the extension direction. The shortest path can be obtained by the distance between the first point and the side surface of the packaged chip and the distance between the first point and the support structure.

[0079] Setting the position parameters of the first point can effectively prevent impurities (such as the molding material 14) from entering the cavity structure 32 during the packaging process, thereby preventing the molding material 14 from breaking through the area where the first adhesive portion 21 covers the side surface of the packaged chip 30 and the gap opening, thereby entering the cavity structure 32 and contaminating the environment of the cavity structure 32. At the same time, ensuring the thickness of the first adhesive portion 21 at the opening can reduce the stress effect on the side surface of the packaged chip 30 when the first adhesive portion 21 is deformed by heat, and at the same time, can prevent the first adhesive portion 21 from entering the gap between the packaged chip 30 and the support structure when it is deformed by heat.

[0080] In one embodiment, the distance of the gap formed between the packaged chip and the support structure is denoted as d1. An angle region exists between the first adhesive portion and the outer surface of the packaged chip facing away from the packaged chip. A shortest path exists between a second point in the angle region and the projection of the packaged chip on the support structure. The angle between the straight line corresponding to the shortest path and the thickness direction is within a range of 40°-60°. The second point is any point in the angle region. The position of the second point satisfies the following conditions:

[0081] Wherein, x2 is the distance between the second point and the side surface of the packaged chip, and y2 is the distance between the second point and the supporting structure.

[0082] In this embodiment, the position parameter of the second point is set so that the angle between the straight line corresponding to the shortest path and the thickness direction is within the range of 40°-60°. The position parameter is essentially the thickness of the gap between the outer surface of the first adhesive portion at the second point, and the thickness is set to be greater than 1.5d1, which can reduce the risk of the first adhesive portion being broken by the plastic packaging material.

[0083] Specifically, the angle between the straight line corresponding to the shortest path and the thickness direction is in the range of 40°-60°. Since this range is generally opposite to the gap and is more easily broken through by the plastic packaging material, setting a slightly larger thickness value in this area can reduce the risk of the plastic packaging material being broken through.

[0084] Similarly, referring to FIG. 4 , where the angle between the straight line corresponding to the shortest path and the thickness direction is within the range of 40°-60°, it can be considered that in any extension direction, the angle between the straight line corresponding to the shortest path between a point on the outer surface of the first adhesive portion and the projection of the packaged chip on the support structure and the straight line corresponding to the thickness direction is within the range of 40°-60°, and all points on the outer surface of the first adhesive portion within the range of 40°-60° in the extension direction satisfy the positional relationship of the second point.

[0085] The shortest path is essentially a straight line between a second point on the outer surface of the first adhesive portion within the range of 40°-60° in the extension direction and a projection point of the side surface of the packaged chip closest to the second point onto the support structure, which can be obtained by the distance between the second point and the side surface of the packaged chip and the distance between the second point and the support structure.

[0086] In this embodiment, the thickness of the first adhesive portion is set to have an angle between the straight line corresponding to the shortest path and the thickness direction within a range of 40°-60°. This can effectively prevent impurities (such as the molding material 14) from entering the cavity structure 32 during the packaging process, and prevent the molding material 14 from breaking through the area of ​​the first adhesive portion 21 covering the side surface of the packaged chip 30 and the area covering the gap opening during the packaging process due to excessive pressure, and entering the cavity structure 32, thereby contaminating the environment of the cavity structure 32. At the same time, ensuring the thickness of the first adhesive portion 21 at the opening can reduce the stress effect on the side surface of the packaged chip 30 when the first adhesive portion 21 is deformed by heat, and can also prevent the first adhesive portion 21 from entering the gap between the packaged chip 30 and the support structure when it is deformed by heat.

[0087] In one embodiment, in any extension direction, the first slope peak contacts the side surface of the packaged chip 30, or there is a first distance between the first slope peak and the side surface of the packaged chip 30, and at least a portion of the outer surface of the first adhesive portion 21 is concave and / or convex in the direction toward the support structure 10 from the first slope peak and / or extends smoothly to the support structure 10.

[0088] In this embodiment, there is only one first slope peak in one extension direction, and the first slope peak contacts the side surface of the packaged chip 30. At this time, the height of the first adhesive portion 21 at the position covering the side surface of the packaged chip 30 in the thickness direction is greater than the height of the first adhesive portion 21 at other positions in the thickness direction in the extension direction. At this time, the outer surface of the first adhesive portion 21 is concave and / or convex and / or extends smoothly from the first slope peak toward the support structure 10 to the support structure 10.

[0089] If there are multiple first peaks in the extension direction, one of the multiple first peaks is in contact with the side surface of the packaged chip 30, and there is another first peak. The outer surface of the first adhesive portion 21 on one side of the other first peak is concave and / or convex and / or extends smoothly from the first peak toward the support structure 10 to the support structure 10, that is, the outer surface of a portion of the first adhesive portion 21 connected to the other first peak is concave and / or convex and / or extends smoothly from the first peak toward the support structure 10 to the support structure 10, and there is at least one valley between the multiple first peaks, specifically, there is a valley between two adjacent first peaks.

[0090] In this embodiment, a valley can be considered as a valley when, in a certain extension direction, a certain point on the outer surface of the first adhesive portion 21 has a height in the thickness direction lower than the heights in the thickness direction of the points on both sides of the same extension direction.

[0091] In this embodiment, there is a first slope peak in an extension direction. The first slope peak does not contact the side surface of the packaged chip 30, that is, there is a first distance between the first slope peak and the side surface of the packaged chip 30. The value of the first distance should be less than 50 microns, such as 10 microns, 15 microns, 30 microns, etc. Preferably, the value of the first distance is less than 30 microns. The closer the first slope peak is to the side of the packaged chip 30, the better it can release the stress on the side of the packaged chip 30 caused by the thermal deformation of the first adhesive material part 21, thereby improving the reliability of the packaged chip 30.

[0092] When the first wave crest does not contact the side surface of the packaged chip 30, a portion of the outer surface of the first adhesive portion 21 in the extension direction is concave and / or convex and / or extends smoothly from the first slope crest toward the support structure 10 to the support structure 10, and another portion is concave and / or convex and / or extends smoothly from the first slope crest toward the support structure 10 to contact the side surface of the packaged chip 30.

[0093] When the first wave crest does not contact the side surface of the packaged chip 30 and there are multiple first crests in the extension direction, none of the multiple first crests contact the side surface of the packaged chip 30, and the outer surface of the first adhesive portion 21 on one side of one and only one first crest is concave and / or convex and / or extends smoothly from the first crest toward the support structure 10 to the support structure 10, that is, there is only one first crest, and the outer surface of a portion of the first adhesive portion 21 connected to the first crest is concave and / or convex and / or extends smoothly from the first crest toward the support structure 10 to the support structure 10, and there is at least one valley between the multiple first crests. Specifically, there is a valley between two adjacent first crests.

[0094] The outer surface of the first adhesive portion 21 is the outer surface of the first adhesive portion 21 facing away from the packaged chip 30 and / or the support structure 10, or the outer surface of the first adhesive portion 21 is the side surface of the first adhesive portion 21 exposed when the molding material 14 is not filled.

[0095] In this embodiment, at least a portion of the outer surface of the first adhesive portion 21 is convex at the first slope peak toward the support structure 10 and extends to the support structure 10. For ease of viewing, the plastic encapsulation material 14 is not shown in FIG2 . The arrows in FIG2 can be regarded as two extension directions in the cross-sectional structure diagram shown in FIG2 , and the two first slope peaks in FIG2 are in contact with the outer surface of the first adhesive portion 21 in their respective extension directions. Of course, FIG2 is exemplary only. In other embodiments, or in other extension directions of this embodiment, the first slope peaks do not contact the outer surface of the first adhesive portion 21 in their respective extension directions.

[0096] 2 , in this embodiment, at least a portion of the outer surface of the first adhesive portion 21 is convexly extended toward the support structure 10 at the first slope peak. This can be seen as a convex structure on the outer surface of the first adhesive portion 21 in the front view shown in FIG. 2 .

[0097] Specifically, in this embodiment, the absolute value of the tangent slope of the outer surface of the first adhesive portion 21 can be used as a reference. In one extension direction, the outer surface of the first adhesive portion 21 can be regarded as an arc. Starting from the first slope peak in the extension direction, the absolute value of the tangent slope at each position on the arc is calculated. The absolute value of the tangent slope is the absolute value of the tangent slope of the outer surface of the first adhesive portion 21 in the extension direction.

[0098] In this extension direction, the height of the position where the first peak is located in the thickness direction is greater than the height of the positions on both sides adjacent to the position where the first peak is located in the thickness direction. Therefore, the absolute value of the tangent slope of the first peak is "0" or "infinite". Then, the absolute values ​​of the tangent slopes at other positions on the arc are calculated. If, on one side of the first peak, as the distance between each position point on the arc and the support structure 10 becomes shorter, that is, as each position point on the arc gradually extends toward the support structure 10, and the absolute value of the tangent slope becomes larger, then the arc on this side can be regarded as convex. Then, on the side of the first peak, it can be regarded as that the outer surface of the first adhesive portion 21 is convex at the first peak toward the support structure 10 and extends to the support structure 10 or the support structure 10. It can also be considered that the absolute value of the tangent slope of the first peak is 0 at this time.

[0099] Of course, in a certain extension direction, there is a distance between the first peak and the side surface of the packaged chip 30. At this time, the outer surfaces on both sides of the first peak can respectively convexly extend toward the support structure 10 with the first peak to the side surface of the support structure 10 or the packaged chip 30.

[0100] In this embodiment, at least a portion of the outer surface of the first adhesive portion 21 is recessed toward the support structure 10 at the first slope peak and extends toward the support structure 10. For a related schematic diagram, reference may be made to FIG3 . Similarly, the molding material 14 is not shown in FIG3 . The arrows in FIG3 may be considered as two extension directions in the cross-sectional structure diagram shown in FIG3 , and the two first slope peaks in FIG3 are in contact with the outer surface of the first adhesive portion 21 in their respective extension directions. Of course, FIG3 is merely exemplary. In other embodiments, or in other extension directions of this embodiment, the first slope peaks do not contact the outer surface of the first adhesive portion 21 in their respective extension directions.

[0101] According to the structure of the first adhesive portion 21 on the right side of FIG. 3 , in this embodiment, at least a portion of the outer surface of the first adhesive portion 21 is recessed at the first slope peak toward the support structure 10 and extends toward the support structure 10 . This can be considered to be a recessed structure on the outer surface of the first adhesive portion 21 in the front view shown in FIG. 3 .

[0102] Specifically, the absolute value of the tangent slope of the outer surface of the first adhesive portion 21 is also used as a reference. In one extension direction, the outer surface of the first adhesive portion 21 can be regarded as an arc, and the absolute value of the tangent slope at each position on the arc is used as the absolute value of the tangent slope of the outer surface of the first adhesive portion 21 in the extension direction.

[0103] If, on one side of the first slope peak, the distance between each point on the arc and the support structure 10 becomes shorter, that is, as each point on the arc gradually extends toward the support structure 10, and the absolute value of the tangent slope becomes smaller, then the arc on this side can be considered to be concave. In this case, on the side of the first slope peak, it can be considered that the portion of the outer surface of the first adhesive portion 21 at the first slope peak is concave and extends toward the support structure 10 or to the support structure 10. It can also be considered that the absolute value of the tangent slope of the first slope peak is infinite at this time.

[0104] Of course, in a certain extension direction, there is a distance between the first peak and the side surface of the packaged chip 30. In this case, the outer surfaces on both sides of the first peak can be respectively recessed toward the support structure 10 and extend to the side surface of the support structure 10 or the packaged chip 30 in the direction of the first peak.

[0105] In this embodiment, at least a portion of the outer surface of the first adhesive portion 21 extends smoothly toward the support structure 10 at the first slope peak toward the support structure 10. For a related schematic diagram, the structure of the first adhesive portion 21 on the left side of FIG. 3 can be referred to. In this embodiment, at least a portion of the outer surface of the first adhesive portion 21 extends smoothly toward the support structure 10 at the first slope peak toward the support structure 10. In the front view direction shown in FIG. 3 , the shape of the outer surface of the first adhesive portion 21 is approximately a straight line structure.

[0106] Specifically, the absolute value of the tangent slope of the outer surface of the first adhesive portion 21 is also used as a reference. In one extension direction, the outer surface of the first adhesive portion 21 can be regarded as an arc, and the absolute value of the tangent slope at each position on the arc is used as the absolute value of the tangent slope of the outer surface of the first adhesive portion 21 in the extension direction.

[0107] If, on one side of the first crest, the distance between each point on the arc and the support structure 10 becomes shorter, that is, as each point on the arc gradually extends toward the support structure 10, and the absolute value of the tangent slope remains unchanged, or the difference or ratio between the absolute values ​​of the tangent slopes at any two points is within a preset error range, then the arc on that side can be considered concave. In this case, on the side of the first crest, the outer surface of the first adhesive portion 21 on that side of the first crest can be considered to smoothly extend toward the support structure 10 from the first crest to the support structure 10 or to the support structure 10.

[0108] The preset error range in this embodiment can be set based on empirical parameter values. For example, in the case of ratio, the preset error range can be [0, 0.06], specifically 0, 0.01, 0.03 and other values. In the case of difference, the preset error range can be [0, 0.07], specifically 0, 0.025, 0.036 and other values.

[0109] Based on the above-mentioned fact that at least a portion of the outer surface of the first adhesive portion 21 is concave and / or convex and / or extends smoothly from the first slope peak toward the support structure 10 to the support structure 10, the principle that at least a portion of the outer surface of the first adhesive portion 21 is concave and / or convex and / or extends smoothly from the first slope peak toward the support structure 10 to other structures or contacts other structures and is concave and / or convex and / or extends smoothly to the support structure 10 is the same and will not be repeated hereafter.

[0110] In this embodiment, in a certain extension direction, for a certain first slope peak, at least a portion of the first slope peak may not be a single outer surface that is concave or convex from the first slope peak toward the support structure 10 or extends smoothly to the support structure 10. It is also possible that the outer surface of at least a portion is first concave and extends for a distance from the first slope peak toward the support structure 10, then convex and extends for a distance, and finally extends smoothly to the support structure 10. It is also possible that the outer surface of at least a portion is first concave and extends for a distance from the first slope peak toward the support structure 10, then convex and extends to the support structure 10. The outer surface of the structure 10, that is, at least a portion of the first adhesive portion 21, is concave and / or convex and / or extends smoothly from the first slope peak toward the support structure 10 to the support structure 10, wherein the shape of the outer surface extending to the support structure 10 can be any one or more combinations of concave, convex, and smooth as shown in Figures 2 and 3, and when the first slope peak does not contact the side surface of the packaged chip 30, the outer surface of at least a portion of the first adhesive portion 21 is concave and / or convex and / or extends smoothly from the first slope peak toward the support structure 10 until it contacts the side surface of the packaged chip 30.

[0111] For example, in an extension direction, the outer surface of at least a portion of the first adhesive portion 21 first extends concavely from the first slope peak toward the support structure 10 for a distance, and then convexly extends to the support structure 10. In this extension direction, the outer surface of at least a portion of the first adhesive portion 21 is regarded as an arc. As the distance between each point on the arc and the support structure 10 becomes shorter, the absolute value of the tangent slope first decreases and then increases until it reaches the support structure 10. Of course, the above is exemplary. In other embodiments, the outer surface of the first adhesive portion 21 may extend from the first slope peak toward the support structure 10 or the side surface of the packaged chip 30 in other ways, which are not specifically limited here.

[0112] In one embodiment, in a certain extension direction, the first adhesive portion 21 includes an adjacent first portion 211 and a second portion 212. The first portion 211 and the second portion 212 are both arranged on a side of the support structure 10 facing away from the substrate 12. The first portion 211 at least partially covers the side surface of the packaged chip 30, and the second portion 212 is arranged on a side away from the packaged chip 30.

[0113] As shown in Figure 5, there are a first part 211 and a second part 212 in both extension directions of the chip packaging structure. In this embodiment, the division of the first part 211 and the second part 212 in any extension direction can be based on the first slope peak. Specifically, the part where the first slope peak closest to the side surface of the filter is located is called the first part 211, and the part adjacent to the first part 211 and away from the packaged chip 30 is called the second part 212.

[0114] Of course, in this embodiment, the first adhesive portion 21 in a certain extension direction is divided into the first portion 211 and the second portion 212 for exemplary purposes only. In other embodiments, the first adhesive portion 21 may be divided into other portions in addition to the first portion 211 and the second portion 212. Specifically, the number of portions may be divided according to the number of first slope peaks in the extension direction. The number of portions that can be divided into by the number of first slope peaks in the extension direction is considered to be the number of portions that the first adhesive portion 21 in the extension direction can be divided into.

[0115] In this embodiment, in a certain extension direction, the first adhesive portion 21 includes a first portion 211 and a second portion 212 adjacent to each other. The first portion 211 includes a first portion peak 2111, the second portion 212 includes a second portion peak 2122, and the connecting portion between the first portion 211 and the second portion 212 forms a first valley 2112.

[0116] 5 , for each first adhesive portion 21 extending in each direction, the first portion 211 corresponds to a first portion peak 2111 , and the second portion 212 corresponds to a second portion peak 2122 . Furthermore, when there are two peaks, there must be a valley. In this embodiment, the number of divisions of the first adhesive portion 21 is determined based on the number of first peaks in the extending direction, and the valleys between two adjacent first peaks are used to divide the first portion 211 into different sections. Specifically, the vertical line between the first valley 2112 and the support structure 10 can be used as the dividing line between the first portion 211 and the second portion 212 .

[0117] Of course, in this embodiment, if there are multiple first slope peaks in a certain extension direction, the first adhesive material portion 21 in this extension direction can be divided into multiple parts, but in another extension direction, there may be only one first slope peak, and the first adhesive material portion 21 in this extension direction does not need to be divided into multiple parts.

[0118] In one embodiment, the first adhesive portion 21 is divided into a first portion 211 and a second portion 212 in a certain extension direction. The first portion 211 and the second portion 212 have corresponding first portion peaks 2111 and second portion peaks 2122. At this time, the heights of the first portion peaks 2111 and the second portion peaks 2122 in the thickness direction of the substrate 12 are the same or different. However, in order to protect the side surface of the packaged chip 30, the height of the first peak close to the side surface of the packaged chip 30 in the thickness direction of the substrate 12 may be slightly higher. In this way, the stress on the side surface of the packaged chip 30 is released through the first peak. That is, the height of the first portion peak 2111 in the thickness direction of the substrate 12 is greater than the height of the second portion peak 2122 in the thickness direction of the substrate 12.

[0119] In one embodiment, the first adhesive portion 21 is divided into a first portion 211 and a second portion 212 in a certain extension direction. The first portion 211 and the second portion 212 have corresponding first portion slope peaks 2111 and second portion slope peaks 2122. The first portion slope peak 2111 is closer to the side surface of the packaged chip 30 than the second portion slope peak 2122. In this case, the first portion slope peak 2111 may contact the side surface of the packaged chip 30, or there may be a second distance between the first portion slope peak 2111 and the side surface of the packaged chip 30 in the extension direction. In this case, at least a portion of the outer surface of the first portion 211 is concave and / or convex and / or extends smoothly from the first portion slope peak 2111 toward the support structure 10 until it contacts the second portion 212.

[0120] Based on the above embodiments, it can be seen that in a certain extension direction, starting from the first slope crest, as the distance between each position point on the outer surface of the first adhesive material portion 21 and the support structure 10 becomes shorter, the absolute value of the tangent slope at the corresponding position point becomes larger. In this case, the outer surface of the first adhesive material portion 21 is considered to be convexly extending toward the support structure 10 at the first slope crest. As the distance between each position point on the outer surface of the first adhesive material portion 21 and the support structure 10 becomes shorter, the absolute value of the tangent slope at the corresponding position point becomes smaller. In this case, the outer surface of the first adhesive material portion 21 is considered to be concavely extending toward the support structure 10 at the first slope crest. As the distance between each position point on the outer surface of the first adhesive material portion 21 and the support structure 10 becomes shorter, the absolute value of the tangent slope at the corresponding position point remains unchanged or the difference or ratio of the absolute values ​​of the tangent slopes between any two positions is within a preset error range. In this case, the outer surface of the first adhesive material portion 21 is considered to be gently extending toward the support structure 10 at the first slope crest.

[0121] In this embodiment, in one extension direction, the first portion's slope peak 2111 contacts the side surface of the packaged chip 30, and the outer surface of the first portion 211 is concave and / or convex and / or extends gently from the first portion's slope peak 2111 toward the support structure 10 until it contacts the second portion 212. Similar to the above embodiment, the outer surface of the first portion 211 can be concave, convex, or gently extending from the first portion's slope peak 2111 toward the support structure 10 until it contacts the second portion 212. Alternatively, the outer surface of the first adhesive portion 21 can be concave and / or convex and / or gently extending from the first portion's slope peak 2111 toward the support structure 10 until it contacts the second portion 212. The shape of the outer surface extending to contact the second portion 212 can be any one of the concave, convex, and gentle shapes shown in Figures 2 and 3, or a combination of multiple shapes.

[0122] In this embodiment, in one extension direction, the first portion peak 2111 does not contact the side surface of the packaged chip 30, that is, there is a second distance. Then, a portion of the outer surface of the first portion 211 extends from the first portion peak 2111 toward the support structure 10 in a concave and / or convex and / or gently extending until it contacts the second portion 212, and another portion of the outer surface of the first portion 211 extends from the first portion peak 2111 toward the support structure 10 in a concave and / or convex and / or gently extending until it contacts the side surface. Part of the outer surface of the first portion 211 extends from the first portion peak 2111 toward the support structure 10 in a manner of concave, convex, or gently extending, or a combination of multiple thereof as shown in Figures 2 and 3 until it contacts the second portion 212, and another portion of the outer surface of the first portion 211 extends from the first portion peak 2111 toward the support structure 10 in a manner of concave, convex, or gently extending, or a combination of multiple thereof as shown in Figures 2 and 3 until it contacts the side surface.

[0123] The second distance in this embodiment can be regarded as the first distance in any extension direction. For specific parameter settings, please refer to the description of the first distance in the above embodiment, and no repeated description will be given here.

[0124] In this embodiment, in some extension directions, the first adhesive portion 21 can be divided into multiple parts, and different parts correspond to their own first peaks. In this way, by providing multiple first peaks, while stress is released through the first peaks close to the side surface of the packaged chip 30, the first peaks of other parts can receive the stress released and transmitted by the first peaks close to the side surface of the packaged chip 30, thereby further releasing stress. Moreover, when filling with the molding material 14, the presence of the other first peaks can reduce the extrusion of the entire first adhesive portion 21 caused by the molding material 14, and reduce the stress on the side surface of the packaged chip 30 caused by the deformation of the first adhesive portion 21 caused by the extrusion. In addition, when the first adhesive portion 21 is deformed by heat, the other first peaks can reduce the thermal deformation, thereby further reducing the stress caused by the thermal deformation on the side surface of the packaged chip 30, thereby improving the reliability of the chip packaging structure.

[0125] Based on the above embodiments, in one embodiment, the first portion of the slope peak 2111 contacts the side surface of the packaged chip 30, or there is a second distance between the first portion of the slope peak 2111 and the side surface of the packaged chip 30 in the extension direction. At this time, a portion of the outer surface of the second portion 212 is concave and / or convex and / or extends smoothly toward the support structure 10 until it contacts the first portion 211, and another portion of the outer surface of the second portion 212 is concave and / or convex toward the support structure 10 and / or extends smoothly to the support structure 10.

[0126] Similar to the manner in which the outer surface of the first portion 211 extends from the first portion peak 2111, the manner in which the outer surface of either side of the second portion 212 extends from the second portion peak 2122 toward the support structure 10 can be any one of the concave, convex, and flat manners shown in Figures 2 and 3, or a combination of multiple manners.

[0127] As shown in FIG5 , in the structures of the first adhesive portion 21 in two extension directions, in the structure of the first adhesive portion 21 on the left side, the first peak of the first portion 211 does not contact the side surface of the filter, a portion of the outer surface of the first portion 211 convexly extends from the first portion peak 2111 toward the support structure 10 to contact the second portion 212, and another portion of the outer surface of the first portion 211 convexly extends from the first portion peak 2111 toward the support structure 10 to contact the side surface of the filter; a portion of the outer surface of the second portion peak 2122 convexly extends from the second portion peak 2122 toward the support structure 10 to contact the first portion 211, and another portion of the outer surface of the second portion 212 convexly extends from the second portion peak 2122 toward the support structure 10 to contact the support structure 10.

[0128] In the structure of the first adhesive portion 21 on the right side of Figure 5, the first peak of the first portion 211 contacts the side surface of the filter, the outer surface of the first portion 211 is concave from the first portion peak 2111 toward the support structure 10 and extends to contact the second portion 212, a portion of the outer surface of the second portion peak 2122 is convex from the second portion peak 2122 toward the support structure 10 and extends to contact the first portion 211, and another portion of the outer surface of the second portion 212 is convex from the second portion peak 2122 toward the support structure 10 and extends to contact the support structure 10.

[0129] For example, referring to FIG6 , in the two extending directions in FIG6 , the first adhesive portion 21 structure on the left side has a first slope peak, that is, there is no first portion 211 and the second portion 212 , or the first adhesive portion 21 structure on the right side is considered to be the first portion 211 and does not have the second portion 212 , and the first adhesive portion 21 structure on the right side has two slope peaks, that is, there is the first portion 211 and the second portion 212 .

[0130] In the structure of the first adhesive portion 21 on the right side of Figure 6 , the first portion's peak 2111 contacts the side surface of the filter, a portion of the outer surface of the second portion's peak 2122 convexly extends from the second portion's peak 2122 toward the support structure 10 until it contacts the first portion 211, and another portion of the outer surface of the second portion 212 convexly extends from the second portion's peak 2122 toward the support structure 10 until it contacts the support structure 10. Regarding the extended outer surface of the first portion 211, i.e., portion A in Figure 6 , please refer to the enlarged schematic diagram of portion A in Figure 7 .

[0131] Referring to Figure 7, the first part peak 2111 of the first part 211 does not contact the side surface of the packaged chip 30. The part extending from the first part peak 2111 to the contact with the side surface of the packaged chip 30 can be regarded as: a part of the outer surface of the first part 211 first convexly extends from the first part peak 2111 toward the direction of the support structure 10, that is, the AE area in Figure 7. In the AE area, the outer surface of the first part 211 first convexly extends from the first part peak 2111 toward the direction of the support structure 10, and then concavely extends toward the direction of the support structure 10 until it contacts the side surface of the packaged chip 30, that is, the BE area. In the BE area, the outer surface of the first part 211 is concavely extended toward the support structure 10 until it contacts the side surface of the packaged chip 30.

[0132] The other side of the first portion peak 2111 in FIG7 , that is, the portion extending from the first portion peak 2111 to the contact with the second portion 212 can be considered as: a portion of the outer surface of the first portion 211 first extends convexly from the first portion peak 2111 toward the support structure 10, that is, the CE region in FIG7 . In the CE region, the outer surface of the first portion 211 first extends convexly from the first portion peak 2111 toward the support structure 10, and then extends concavely toward the support structure 10, that is, the DE region. In the DE region, a portion of the outer surface of the first portion 211 extends concavely toward the support structure 10, and then extends convexly to contact the second portion 212, or extends to the first valley 2112, that is, the FE region. In the FE region, a portion of the outer surface of the first portion 211 extends convexly toward the support structure 10 to contact the second portion 212.

[0133] Of course, Figures 6 and 7 are merely exemplary. In other embodiments, in a certain extension direction, no matter how many parts the first adhesive portion 21 is divided into, the manner in which the outer surface of each part extends from the corresponding first slope peak toward the support structure 10 can refer to the concave, convex, and gentle extension manners in Figures 2 and 3 and the textual descriptions of the concave, convex, and gentle extension manners in Figures 2 and 3 in the above embodiments, and the extension manner can be any one manner or a combination of multiple manners of the concave, convex, and gentle extension manners in Figures 2 and 3, and no specific limitation is made here.

[0134] In this embodiment, multiple extension methods such as concave, convex, and flat are used to create multiple first slope peaks in a certain extension direction, thereby further alleviating stress on the side surface of the packaged chip 30 and improving the reliability of the chip packaging structure.

[0135] Based on the above embodiment, in one embodiment, the first adhesive portion 21 can be set on the support structure 10 around the periphery of the packaged chip 30. The surrounding setting can be intermittent or uninterrupted. When it is set uninterruptedly, the first adhesive portion 21 can completely surround the periphery of the packaged chip 30, that is, the first adhesive portion 21 is set in each extension direction. The first adhesive portion 21 can not completely surround the packaged chip 30, that is, the first adhesive portion 21 is set in the extension direction of a certain area; when it is set intermittently, the first adhesive portion 21 is set in some extension directions, and the first adhesive portion 21 is not set in some extension directions.

[0136] Of course, no matter it is an intermittent setting or an uninterrupted setting, in some extension directions, the first adhesive portion 21 at least partially covers the side surface of the packaged chip 30, while in other extension directions, the first adhesive portion 21 only partially covers the side surface of the packaged chip 30. Preferably, the first adhesive portion 21 is provided in each extension direction, and the first adhesive portion 21 at least partially covers the side surface of the packaged chip 30, so as to prevent foreign matter from entering the cavity structure 32 and causing contamination.

[0137] Based on the above embodiment, in one embodiment, the first adhesive portion 21 is intermittently disposed around the packaged chip 30 on the support structure 10. Specifically, the first adhesive portion 21 can be periodically and intermittently disposed around the packaged chip 30, that is, the first adhesive portion 21 is divided into a plurality of plates at a certain interval, and each plate is intermittently disposed around the packaged chip 30 on the support structure 10 at the same interval. Of course, the first adhesive portion 21 can be non-periodically and intermittently disposed around the packaged chip 30, that is, the first adhesive portion 21 is divided into a plurality of plates, and is intermittently disposed around the packaged chip 30 on the support structure 10 at different intervals.

[0138] Based on the above embodiment, in one embodiment, the second adhesive portion 22 completely covers the upper surface of the packaged chip 30. As shown in FIG8 , the number of second peaks of the second adhesive portion 22 may be one or more. When there is one second peak, the outer surface of the second adhesive portion 22 facing away from the packaged chip 30 extends from the second peak toward the upper surface of the packaged chip 30 until the upper surface of the packaged chip 30 is completely covered with the second adhesive portion 22.

[0139] In this embodiment, the upper surface of the packaged chip 30 is completely covered, thereby reducing the contact interface between the outer surface of the packaged chip 30 and the cavity, better isolating water vapor, and thus improving the reliability of the packaged chip 30.

[0140] There are multiple second peaks, and the outer surface of the second adhesive portion 22 extends from different second peaks toward the upper surface of the packaged chip 30 until the upper surface of the packaged chip 30 is completely covered with the second adhesive portion 22 .

[0141] In this embodiment, when there are multiple second peaks, the heights of different second peaks in the thickness direction can be the same or different. In the second adhesive portion 22, the height of each second peak at the position of the second peak is greater than the height of the positions around the second peak.

[0142] In this embodiment, the second adhesive portion 22 is provided to alleviate the stress of the plastic encapsulation material 14 on the upper surface of the packaged chip 30 . The second slope peak is provided to release the stress caused by the thermal deformation of the second adhesive portion 22 , thereby improving the performance of the packaged chip 30 .

[0143] Based on the above embodiments, in one embodiment, the second adhesive portion 22 and the working area of ​​the packaged chip 30 at least partially overlap in the thickness direction, and / or the second adhesive portion 22 and the first conductive bump 31 at least partially overlap in the thickness direction.

[0144] The second adhesive portion 22 can be a continuous structure or a discontinuous or continuous structure. If the second adhesive portion 22 is a continuous structure, the second adhesive portion 22 can cover the entire upper surface of the packaged chip 30, or be continuously arranged to cover certain areas of the upper surface of the packaged chip 30. If the second adhesive portion 22 is a discontinuous structure, the second adhesive portion 22 can be divided into at least two modules, and different modules are arranged in certain areas of the upper surface of the packaged chip 30, and the different modules are not connected.

[0145] The second adhesive portion 22 entirely covers the upper surface of the packaged chip 30 . At this time, the second adhesive portion 22 completely overlaps with the packaged chip 30 in the thickness direction, that is, completely overlaps with the working area of ​​the packaged chip 30 in the thickness direction, and completely overlaps with the first conductive bumps 31 in the thickness direction.

[0146] The second adhesive portion 22 is continuously and uninterruptedly arranged to cover some areas on the upper surface of the packaged chip 30, or different modules of the second adhesive portion 22 are arranged in certain areas on the upper surface of the packaged chip 30. In this case, the second adhesive portion 22 at least partially overlaps with the working area of ​​the packaged chip 30 in the thickness direction, or at least partially overlaps with the first conductive bumps 31 in the thickness direction, or the second adhesive portion 22 at least partially overlaps with the working area of ​​the packaged chip 30 in the thickness direction and at least partially overlaps with the first conductive bumps 31 in the thickness direction.

[0147] In this embodiment, the working area of ​​the packaged chip 30 can be regarded as the area where the functional devices of the packaged chip 30 are located. The working area of ​​the packaged chip 30 requires a cavity structure 32, that is, the working area of ​​the packaged chip 30 is set in the cavity structure 32.

[0148] In this embodiment, the second adhesive portion 22 is provided to at least partially overlap with the working area of ​​the packaged chip 30 in the thickness direction, thereby reducing the extrusion of the cavity structure 32 where the working area of ​​the packaged chip 30 is located, thereby ensuring the space of the cavity structure 32 and the performance of the packaged chip 30; at the same time, the second adhesive portion 22 can also be provided to at least partially overlap with the first conductive bump 31 in the thickness direction, thereby reducing the stress on the first conductive bump 31, thereby preventing the first conductive bump 31 from being broken due to stress and affecting the performance of the packaged chip 30.

[0149] Based on the above embodiments, in one embodiment, the second slope peak at least partially overlaps with the working area of ​​the packaged chip 30 in the thickness direction, and / or the second slope peak at least partially overlaps with the first conductive bump 31 in the thickness direction.

[0150] In this embodiment, regardless of whether the second adhesive portion 22 covers the entire upper surface of the packaged chip 30, or the second adhesive portion 22 is continuously and uninterruptedly arranged to cover some areas on the upper surface of the packaged chip 30, or different modules of the second adhesive portion 22 are arranged in some areas on the upper surface of the packaged chip 30, the second adhesive portion 22 is continuously and uninterruptedly arranged to cover some areas on the upper surface of the packaged chip 30, or different modules of the second adhesive portion 22 are arranged in some areas on the upper surface of the packaged chip 30, at this time, the second slope peak at least partially overlaps with the working area of ​​the packaged chip 30 in the thickness direction, or at least partially overlaps with the first conductive bump 31 in the thickness direction, or the second slope peak at least partially overlaps with the working area of ​​the packaged chip 30 in the thickness direction and at least partially overlaps with the first conductive bump 31 in the thickness direction.

[0151] Specifically, the number of second peaks that at least partially overlap with the working area of ​​the packaged chip 30 in the thickness direction can be one or more, and the number of second peaks that at least partially overlap with the first conductive bump 31 in the thickness direction can be one or more. At the same time, the second peak can be at least partially overlapping with one first conductive bump 31 in the thickness direction, and the second peak can also be at least partially overlapping with multiple first conductive bumps 31 in the thickness direction. The number of second peaks that at least partially overlap with different first conductive bumps 31 in the thickness direction can be the same or different, and no specific restrictions are made here.

[0152] In this embodiment, the second slope peak is set to at least partially overlap with the working area of ​​the packaged chip 30 in the thickness direction. In this way, while reducing the extrusion of the cavity structure 32 where the working area of ​​the packaged chip 30 is located, the stress of the second adhesive portion 22 caused by thermal deformation on the area above the working area of ​​the packaged chip 30 is released, thereby further ensuring the space of the cavity structure 32 and the performance of the packaged chip 30. The second slope peak can be set to at least partially overlap with the first conductive bump 31 in the thickness direction. In this way, the stress extrusion of the first conductive bump 31 is reduced, and the stress of the second adhesive portion 22 caused by thermal deformation on the area above the first conductive bump 31 is released, thereby preventing the first conductive bump 31 from being broken due to stress and affecting the performance of the packaged chip 30.

[0153] Based on the above embodiment, in one embodiment, at least a portion of the outer surface of the second adhesive portion 22 is concave and / or convex from the second slope peak toward the upper surface of the package chip 30 and / or extends smoothly to the upper surface of the package chip 30 .

[0154] In this embodiment, when the second adhesive portion 22 has only one second slope peak, the outer surface of the second adhesive portion 22 is concave and / or convex and / or smoothly extends from the second slope peak toward the upper surface of the package chip 30 to the upper surface of the package chip 30 .

[0155] When the second adhesive portion 22 has multiple second peaks and the second adhesive portion 22 is a continuous structure, then for a certain second peak a, there is a portion of the outer surface of the second adhesive portion 22 that is concave and / or convex and / or gently extends from the second peak a toward the upper surface of the package chip 30 to the upper surface of the package chip 30, and there is at least a second peak b, and the portion of the outer surface of the second adhesive portion 22 that is concave and / or convex and / or gently extends from the second peak a toward the upper surface of the package chip 30 is the same as the portion of the outer surface of the second adhesive portion 22 that is concave and / or convex and / or gently extends from the second peak b toward the upper surface of the package chip 30. In other words, the outer surface of the second adhesive material portion 22 is concave and / or convex and / or gently extends from the second slope peak a and the second slope peak b toward the upper surface of the packaged chip 30 for a distance before making contact. Of course, there may also be a second slope peak c, and the outer surface of the second adhesive material portion 22 does not extend from the second slope peak c to the upper surface of the packaged chip 30. The outer surface of the second adhesive material portion 22 is concave and / or convex and / or gently extends from the second slope peak c and the other second slope peaks toward the upper surface of the packaged chip 30 for a distance before making contact.

[0156] When the second adhesive portion 22 has multiple second peaks and is a discontinuous structure, similar to when the second adhesive portion 22 has multiple second peaks and is a continuous structure, second peaks of types a, b, and c may exist. However, a second peak d may also exist. Part of the outer surface of the second adhesive portion 22 is concave and / or convex and / or gently extends from the second peaks toward the upper surface of the packaged chip 30 to the upper surface of the packaged chip 30, and does not contact other second peaks that are concave and / or convex and / or gently extend toward the upper surface of the packaged chip 30 for a distance. That is, the outer surface of the second adhesive portion 22 located around the second peak d extends to the upper surface of the packaged chip 30.

[0157] The concave and / or convex and / or gently extending portion toward the upper surface of the packaged chip 30 in this embodiment can refer to the concave, convex, and gently extending portions in FIG. 2 and FIG. 3 , as well as the textual descriptions of the concave, convex, and gently extending portions in FIG. 2 and FIG. 3 in the aforementioned embodiments. Specifically, each second slope peak can be used as a reference point, and the direction scattering from the reference point in all directions can be set as a reference direction. The reference direction is parallel to the plane of the substrate 12 . Based on each reference direction, an arc extending from a different second slope peak toward the upper surface of the packaged chip 30 on the outer surface of the second adhesive portion 22 can be obtained. Thus, referring to the concave, convex, and gently extending portions in FIG. 2 and FIG. 3 , as well as the textual descriptions of the concave, convex, and gently extending portions in FIG. 2 and FIG. 3 in the aforementioned embodiments, the manner in which the outer surface of the second adhesive portion 22 extends from a different second slope peak toward the upper surface of the packaged chip 30 can be determined.

[0158] Based on the above embodiments, in one embodiment, the second adhesive portion 22 extends from the upper surface of the packaged chip 30 to at least partially cover the side surface of the packaged chip 30, or the second adhesive portion 22 extends from the upper surface of the packaged chip 30 to at least partially cover the side surface of the packaged chip 30, and contacts the first adhesive portion 21 on the side surface of the packaged chip 30.

[0159] 9 , in this embodiment, a portion of the second adhesive portion 22 may extend to the side surface of the packaged chip 30 and not contact the first adhesive portion 21 . FIG10 shows that a portion of the second adhesive portion 22 extends to the side surface of the packaged chip 30 and contacts the first adhesive portion 21 . In this case, the entire portion of the first adhesive portion 21 extending to the side surface of the packaged chip 30 contacts the second adhesive portion, or a portion of the portion contacts the first adhesive portion 21 . No specific limitation is imposed herein.

[0160] In this embodiment, the second adhesive portion 22 can extend to the side surface of the packaged chip 30 to protect the side surface of the chip. At the same time, when the first adhesive portion 21 is no longer required, a large amount of adhesive is used to increase the height of the first adhesive portion 21 covering the side surface of the packaged chip 30. However, if there is too much material in the first adhesive portion 21, the adhesive may flow into the cavity structure 32 through the gap between the packaged chip 30 and the support structure 10, contaminating the cavity. Therefore, the second adhesive portion 22 can extend to the side surface of the packaged chip 30, thereby buffering stress and further improving the reliability of the packaged chip 30.

[0161] Based on the above embodiment, in one embodiment, the second adhesive portion 22 includes at least an adjacent third portion 223 and a fourth portion 224, and the third portion 223 and the fourth portion 224 are both arranged on the upper surface of the packaged chip 30; wherein the second slope peak includes a third portion slope peak 2233 and a fourth portion slope peak 2244, the third portion 223 is provided with a third portion slope peak 2233, the fourth portion 224 is provided with a fourth portion slope peak 2244, and the connecting portion between the third portion 223 and the fourth portion 224 forms a second slope valley 2234.

[0162] In this embodiment, the second adhesive portion 22 includes at least a third portion 223 and a fourth portion 224 that are adjacent to each other, and each portion corresponds to a second slope peak. Of course, the third portion 223 and the fourth portion 224 are merely exemplary. In other embodiments, the second adhesive portion 22 may also include other numbers of portions. One second slope peak may be regarded as one portion. When there are more than two portions, any two portions may be adjacent or not adjacent, and there is no limitation here.

[0163] Specifically, the second adhesive portion 22 can be divided into modules, and different modules do not contact each other. For example, two modules are shown in FIG9 , which are defined as a first module 225 and a second module. The first module 225 and the second module each include two adjacent parts, such as the two parts in the first module 225 are respectively regarded as the third part 223 and the fourth part 224.

[0164] Of course, the top view of the chip packaging structure in Figure 9 can be referred to Figure 11 (the plastic encapsulation material 14 is not shown in Figure 11). Based on Figure 11, it can be seen that in Figure 11, the second adhesive portion 22 may include 4 modules, each module is not connected to each other, and each module includes two adjacent parts, and the first adhesive portion 21 is an annular closed structure.

[0165] For the same module in the second adhesive portion 22, there must be a valley between two adjacent parts. The valley can be regarded as the existence of the valley between the two adjacent parts, and the height of the outer surfaces of the two adjacent parts changes in the valley when extending toward the upper surface of the packaged chip 30. That is, the height of the outer surfaces of the two adjacent parts in the thickness direction should gradually decrease when extending toward the upper surface of the packaged chip 30, but after passing through the valley, the height of the outer surfaces tends to increase, as shown in the third part 223 and the fourth part 224 defined in Figure 9. Of course, the third part 223 and the fourth part 224 here are only schematic names, and other modules of the second adhesive portion 22 may also have adjacent third parts 223 and fourth parts 224.

[0166] The connecting portion between the third portion 223 and the fourth portion 224 forms a second valley 2234. At this valley, if the third portion 223 and the fourth portion 224 continue to extend, the height of their outer surfaces tends to become higher. Thus, the third portion 223 and the fourth portion 224 are divided by the second valley 2234.

[0167] In this embodiment, the first adhesive portion 21 has a plurality of second peaks, and the different portions of the adhesive portion are divided based on the second peaks, thereby better releasing and buffering stress and further improving the reliability of the packaged chip 30 .

[0168] Based on the above embodiments, in one embodiment, a portion of the outer surface of the third portion 223 is concave and / or convex and / or extends smoothly from the third portion peak 2233 toward the upper surface of the packaged chip 30 until it contacts the fourth portion 224, and another portion of the outer surface of the third portion 223 is concave and / or convex and / or extends smoothly from the third portion peak 2233 toward the upper surface of the packaged chip 30 until it contacts the upper surface of the packaged chip 30.

[0169] In this embodiment, a portion of the outer surface of the third portion 223 is concave and / or convex and / or extends smoothly from the peak 2233 of the third portion toward the upper surface of the packaged chip 30 until it contacts the fourth portion 224, that is, extends to the second valley 2234, while the other portion is concave and / or convex and / or extends smoothly from the peak 2233 of the third portion toward the upper surface of the packaged chip 30 until it contacts the upper surface of the packaged chip 30.

[0170] Of course, another portion of the outer surface of the third portion 223 may also extend to contact another portion other than the fourth portion 224 , which is obtained by the same division method as the third portion 223 , or extend to cover the side surface of the packaged chip 30 .

[0171] Or in some embodiments, a portion of the outer surface of the third portion 223 is concave and / or convex and / or extends smoothly from the third portion peak 2233 toward the upper surface of the packaged chip 30 until it contacts the fourth portion 224, and another portion of the outer surface of the third portion 223 is concave and / or convex and / or extends smoothly from the third portion peak 2233 toward the upper surface of the packaged chip 30 until it partially covers the side surface of the packaged chip 30.

[0172] Or in some other embodiments, a portion of the outer surface of the third portion 223 is concave and / or convex and / or extends smoothly from the third portion peak 2233 toward the upper surface of the packaged chip 30 until it contacts the fourth portion 224, a portion of the outer surface of the third portion 223 is concave and / or convex and / or extends smoothly from the third portion peak 2233 toward the upper surface of the packaged chip 30 until it partially covers the side surface of the packaged chip 30, and a portion of the outer surface of the third portion 223 is concave and / or convex and / or extends smoothly from the third portion peak 2233 toward the upper surface of the packaged chip 30 until it partially covers the upper surface of the packaged chip 30.

[0173] Or in some other embodiments, a portion of the outer surface of the third portion 223 is concave and / or convex and / or extends smoothly from the third portion slope peak 2233 toward the upper surface of the packaged chip 30 until it contacts the fourth portion 224; a portion of the outer surface of the third portion 223 is concave and / or convex and / or extends smoothly from the third portion slope peak 2233 toward the upper surface of the packaged chip 30 until it partially covers the side surface of the packaged chip 30; a portion of the outer surface of the third portion 223 is concave and / or convex and / or extends smoothly from the third portion slope peak 2233 toward the upper surface of the packaged chip 30 until it contacts the upper surface of the packaged chip 30; a portion of the outer surface of the third portion 223 is concave and / or convex and / or extends smoothly from the third portion slope peak 2233 toward the upper surface of the packaged chip 30 until it contacts another portion of the second adhesive portion 22 except the fourth portion 224.

[0174] In the above embodiments, the outer surface of the third portion 223 may extend in a concave, convex, or flat manner toward the upper surface of the packaged chip 30. Reference may be made to the concave, convex, or flat extension manners in FIG. 2 and FIG. 3 , as well as the textual descriptions of the concave, convex, and flat extension manners in the above embodiments. Specifically, the third portion peak 2233 of the third portion 223 may be used as a starting point, and the scattering direction of the starting point may be used as a reference direction. Note that the scattering direction is parallel to the plane on which the upper surface of the packaged chip 30 lies. Based on each reference direction, an arc corresponding to the reference direction may be obtained, thereby determining whether the outer surface of the third portion 223 corresponding to the arc extends in one or more of the following manners: concave, convex, or flat. The extension manner of the outer surface of the third portion 223 is the same as that of the first portion 211 or the second portion 212 of the second adhesive portion 22, with only the definitions of the reference direction and the extension direction being different. For details, reference may be made to the description of the extension manner of the first portion 211 or the second portion 212.

[0175] In this embodiment, if a portion of the outer surface of the third portion 223 is concave and / or convex and / or gently extends from the third portion peak 2233 toward the upper surface of the packaged chip 30 to partially cover the side surface of the packaged chip 30, the third portion 223 may be in contact with the second adhesive portion 22 on the side surface of the packaged chip 30, or may not be in contact with the second adhesive portion 22.

[0176] Based on the above embodiments, in one embodiment, a portion of the outer surface of the fourth portion 224 is concave and / or convex and / or extends smoothly from the fourth portion peak 2244 toward the upper surface of the packaged chip 30 until it contacts the third portion 223, and another portion of the outer surface of the fourth portion 224 is concave and / or convex and / or extends smoothly from the fourth portion peak 2244 toward the upper surface of the packaged chip 30 until it contacts the upper surface of the packaged chip 30.

[0177] Similar to the third portion 223 , a portion of the outer surface of the fourth portion 224 is concave and / or convex and / or gently extends from the fourth portion peak 2244 toward the upper surface of the packaged chip 30 until it contacts the third portion 223 , that is, extends to the second valley 2234 . Another portion of the outer surface of the fourth portion 224 may extend to partially cover the side surface of the packaged chip 30 , or may extend to contact another portion of the second adhesive portion 22 other than the third portion 223 , or may extend to contact the upper surface of the packaged chip 30 .

[0178] In some embodiments, in addition to a portion of the outer surface of the fourth portion 224 extending to contact the third portion 223, another portion of the outer surface of the fourth portion 224 extends to partially cover the side surface of the packaged chip 30 and contact another portion of the second adhesive portion 22 except the third portion 223, or extends to contact another portion of the second adhesive portion 22 except the third portion 223 and contact the upper surface of the packaged chip 30, or extends to partially cover the side surface of the packaged chip 30 and contact the upper surface of the packaged chip 30, or extends to partially cover the side surface of the packaged chip 30 and extend to contact another portion of the second adhesive portion 22 except the third portion 223, and extend to contact the upper surface of the packaged chip 30.

[0179] In this embodiment, the outer surface of the fourth part 224 extends in the direction of the upper surface of the packaged chip 30 in the form of concave and / or convex and / or flat, which is the same as the third part 223. The third part slope peak 2233 of the third part 223 can also be used as the starting point, and the scattering direction of the starting point and the direction parallel to the upper surface of the packaged chip 30 can be used as the reference direction to determine that the outer surface of the fourth part 224 corresponding to the arc in each reference direction extends in one or more ways such as concave, convex, flat, etc., and the description will not be repeated here.

[0180] In this embodiment, if a portion of the outer surface of the fourth portion 224 is concave and / or convex and / or gently extends from the fourth portion peak 2244 toward the upper surface of the packaged chip 30 to partially cover the side surface of the packaged chip 30, the fourth portion 224 may be in contact with the second adhesive portion 22 on the side surface of the packaged chip 30, or may not be in contact with the second adhesive portion 22.

[0181] Based on the above embodiment, in one embodiment, if the second adhesive portion 22 has multiple second peaks, the heights of the second peaks in the thickness direction can be the same or different. For example, the height of the third portion peak 2233 in the thickness direction of the substrate 12 can be the same as or different from the height of the fourth portion peak 2244 in the thickness direction of the substrate 12.

[0182] Preferably, the overlapping area of ​​the projection of the third portion of the slope peak 2233 and the first conductive bump 31 in the thickness direction is larger than the overlapping area of ​​the projection of the fourth portion of the slope peak 2244 and the first conductive bump 31 in the thickness direction, and the distance between the projection of the third portion of the slope peak 2233 in the thickness direction and the projection of the first power-off bump in the thickness direction is less than the distance between the projection of the third portion of the slope peak 2233 in the thickness direction and the projection of the first power-off bump in the thickness direction, that is, the projection of the third portion of the slope peak 2233 in the thickness direction is closer to the projection of the first power-off bump in the thickness direction. At this time, the height of the third portion of the slope peak 2233 in the thickness direction of the substrate 12 is set to be greater than the height of the fourth portion of the slope peak 2244 in the thickness direction of the substrate 12, so as to better release the stress in the area above the first conductive bump 31 and improve the reliability of the first conductive bump 31.

[0183] Based on the above embodiment, in one embodiment, the chip packaging structure further includes: a third adhesive portion 23 disposed on the upper surface of the packaged chip 30 , and the third adhesive portion includes a third slope peak.

[0184] In this embodiment, the number of the third slope peaks can be one or more, and the third adhesive portion 23 in this embodiment is an integral structure, that is, the third adhesive portion 23 does not have two partially contacting modules.

[0185] In this embodiment, the material of the third adhesive portion 23 can be the same as or different from the materials of the first adhesive portion 21 and the second adhesive portion 22. That is, the first adhesive portion 21, the second adhesive portion 22, and the third adhesive portion 23 can use the same material or different materials, which is not specifically limited here.

[0186] In one embodiment, the outer surface of the third adhesive portion 23 is concave and / or convex and / or smoothly extends from the third slope peak toward the upper surface of the package chip 30 until contacting the upper surface of the package chip 30 .

[0187] In this embodiment, if the number of the third slope peaks is one, the outer surface of the third glue material portion 23 is concave and / or convex and / or extends gently from the third slope peak toward the upper surface of the packaged chip 30 until it contacts the upper surface of the packaged chip 30. If the number of the third slope peaks is at least two, the outer surface of the third glue material portion 23 is concave and / or convex and / or extends gently from the third slope peak toward the upper surface of the packaged chip 30 until it contacts the upper surface of the packaged chip 30, and the outer surfaces that are concave and / or convex and / or extend gently from two adjacent third slope peaks toward the upper surface of the packaged chip 30 are at least partially in contact.

[0188] In this embodiment, the third adhesive portion 23 may or may not contact the second adhesive portion 22. As shown in FIG12 , the second adhesive portion 22 and the third adhesive portion 23 are not in contact. As shown in FIG13 , the second adhesive portion 22 and the third adhesive portion 23 are in contact. If the second adhesive portion 22 has multiple modules, the third adhesive portion 23 may or may not contact one module of the second adhesive portion 22.

[0189] In this embodiment, the modules of the second adhesive portion 22 are considered to be unconnected, i.e., independent modules. The third adhesive portion 23 contacts the second adhesive portion 22 , and at least a portion of the outer surface of the third adhesive portion 23 is concave and / or convex and / or gently extends from the third slope peak toward the upper surface of the packaged chip 30 until it contacts the second adhesive portion 22 .

[0190] In this embodiment, the outer surface of the third adhesive portion 23 is concave and / or convex and / or extends smoothly from the third slope peak toward the upper surface of the packaged chip 30. The manner in which the outer surface of the second adhesive portion 22 is concave and / or convex and / or extends smoothly from the second slope peak toward the upper surface of the packaged chip 30 can be referred to. Specifically, with the third slope peak as the starting point and the direction of scattering from the starting point and parallel to the upper surface of the packaged chip 30 as the reference direction, the outer surface of the third adhesive portion 23 corresponding to the arc in each reference direction is determined to extend in one or more manners such as concave, convex, or smooth. This description will not be repeated here.

[0191] Of course, if there are multiple third peaks, the second trough 2234 in the second adhesive portion 22 can be referred to, and the trough in the third adhesive portion 23 can be used as a dividing line to divide the second adhesive portion 22 into multiple parts, with each part having a peak and two adjacent parts having troughs. Then, it can be confirmed that the outer surface of each part extends in one or more ways, such as concave, convex, or flat.

[0192] In one embodiment, the third slope peak at least partially overlaps with the working area of ​​the packaged chip 30 in the thickness direction of the substrate 12 .

[0193] In this embodiment, the third adhesive portion 23 exists when the second adhesive portion 22 exists, and when the second adhesive portion 22 does not entirely cover the upper surface of the package chip 30, the third adhesive portion 23 exists, and the second adhesive portion 22 has an overlapping area with the first conductive bump 31 in the thickness direction, that is, the second adhesive portion 22 and the working area of ​​the package chip 30 do not have an overlapping area in the thickness direction of the substrate 12, or the second adhesive portion 22 and the working area of ​​the package chip 30 only have a small overlapping area in the thickness direction of the substrate 12, or the second adhesive portion 22 and the working area of ​​the package chip 30 have an overlapping area in the thickness direction of the substrate 12, or the second adhesive portion 22 and the working area of ​​the package chip 30 have an overlapping area in the thickness direction of the substrate 12. The portion 22 does not completely overlap with the working area of ​​the packaged chip 30 in the thickness direction of the substrate 12. At this time, in order to protect the cavity structure 32 under the working area of ​​the packaged chip 30, a third adhesive portion 23 may be provided on the upper surface of the packaged chip 30 in the area corresponding to the working area of ​​the packaged chip 30. Of course, the area of ​​the third adhesive portion 23 on the upper surface of the packaged chip 30 may exceed the area of ​​the area corresponding to the working area of ​​the packaged chip 30, and the third slope peak and the working area of ​​the packaged chip 30 in the thickness direction of the substrate 12 only need to at least partially overlap.

[0194] In this embodiment, the number of third slope peaks is one, then the one third slope peak only needs to overlap with the working area of ​​the packaged chip 30 in the thickness direction of the substrate 12. If the number of third slope peaks is multiple, then at least one third slope peak only needs to overlap with the working area of ​​the packaged chip 30 in the thickness direction of the substrate 12, and the other third slope peaks may overlap with the working area of ​​the packaged chip 30 in the thickness direction of the substrate 12, or may not overlap with the working area of ​​the packaged chip 30 in the thickness direction of the substrate 12. No specific restrictions are made here.

[0195] In one embodiment, the Young's modulus of the molding material 14 is greater than the Young's modulus of the first adhesive portion 21 , and the Young's modulus of the molding material 14 is greater than the Young's modulus of the second adhesive portion 22 .

[0196] In this embodiment, the Young's modulus of the first adhesive portion 21 and the second adhesive portion 22 is lower than that of the molding material 14 , thereby buffering the stress caused by the molding material 14 filling and further improving the reliability of the packaged chip 30 .

[0197] In this embodiment, the third adhesive portion 23 is provided. The Young's modulus of the third adhesive portion 23 is lower than that of the molding material 14 . Thus, the third adhesive portion 23 can also buffer the stress caused by the molding material 14 when filling.

[0198] In one embodiment, the first adhesive portion 21 includes a barrier region, which includes the first adhesive portion 21 at least partially covering the side surface of the packaged chip 30. The Young's modulus of the barrier region is greater than the Young's modulus of other regions of the first adhesive portion 21 except the barrier region, and the Young's modulus of the barrier region is greater than the Young's modulus of the second adhesive portion 22.

[0199] In this embodiment, the portion of the first adhesive portion 21 covering the side surface of the packaged chip 30 is referred to as a barrier region. The Young's modulus of the barrier region is greater than the Young's modulus of other regions of the first adhesive portion 21 except the barrier region. This can more effectively buffer the stress on the side surface of the packaged chip 30 and improve the package reliability.

[0200] In one embodiment, the chip packaging structure also includes a first chip 33, a bonding wire 331 is set on the top surface of the first chip 33, and the bonding wire 331 of the first chip 33 is interconnected with the second chip pad 15 set on the first surface 11, or a third conductive bump 332 is set on the bottom surface of the first chip 33, and the third conductive bump 332 is interconnected with the third chip pad 16 set on the first surface 11.

[0201] In this embodiment, as shown in Figures 14 and 15, the chip packaging structure also includes a first chip 33. The first chip 33 can be a non-filtering chip, such as a power amplifier, a low-noise amplifier, a radio frequency switch, a passive component, etc., wherein the passive component includes passive components such as capacitors, inductors or resistors.

[0202] The first chip 33 includes a wire bonding structure and a flip-chip structure, wherein the wire bonding structure can be referred to in Figure 14, a bonding wire 331 is set on the top surface of the first chip 33, and the bonding wire 331 of the first chip 3330 is interconnected with the second chip pad 15 set on the first surface 11; the flip-chip structure can be referred to in Figure 15, a third conductive bump 332 is set on the bottom surface of the first chip 33, and the third conductive bump 332 is interconnected with the third chip pad 16 set on the first surface 11. In the chip packaging structure, there should be a plastic packaging material 14 also covering the first chip 33.

[0203] The present application also provides a chip packaging structure, as shown in FIG16, comprising: a substrate 12, a first chip pad 13 being provided on the first surface 11; a support structure 10 being provided on the first surface 11 of the substrate 12; a packaged chip 30 being provided on the first surface 11, a first conductive bump 31 being provided on the bottom surface of the packaged chip 30, the first conductive bump 31 being interconnected with the first chip pad 13, and a cavity structure 32 being formed between the packaged chip 30, the support structure 10 and the substrate 12; a first adhesive portion 21 comprising a first portion 211 and a second portion 212 adjacent to each other, the first portion 211 and the second portion 212 being ... Both the portion 211 and the second portion 212 are arranged on a side of the support structure 10 facing away from the substrate 12. The first portion 211 at least partially covers the side surface of the packaged chip 30, and the second portion 212 is arranged on a side away from the packaged chip 30. The first portion 211 is provided with a first portion peak 2111, the second portion 212 is provided with a second portion peak 2122, and the connection portion between the first portion 211 and the second portion 212 forms a first valley 2112. The plastic encapsulation material 14 covers the packaged chip 30, the support structure 10 and the first adhesive portion 21.

[0204] The chip packaging structure provided in this embodiment belongs to the same creative concept as the chip packaging structure proposed in Figures 1 to 15. Therefore, for related descriptions, please refer to the contents of the above embodiments, and the embodiments of this application will not be repeated here.

[0205] Of course, the adjacent first portion 211 and second portion 212 included in the first adhesive portion 21 of this embodiment may be located in some areas of the outer surface of the packaged chip 30, while the adjacent first portion 211 and second portion 212 may not exist in other areas. That is, in some extending directions, there may be two first peaks, or in some extending directions, there may be one first peak, or in some extending directions, there may be no first peak. In the direction where there is no first peak, it can be regarded as that the first adhesive portion 21 is not provided in the corresponding area.

[0206] In this embodiment, the first adhesive portion provided on the support structure includes a first portion and a second portion. In an extension direction, the first portion and the second portion have a first portion slope peak and a second portion slope peak. Thus, the first portion slope peak and the second portion slope peak can buffer the stress caused by the filling of the plastic packaging material. At the same time, the first portion at least partially covers the side surface of the packaged chip to buffer the stress on the side of the packaged chip and prevent other substances from entering the cavity structure. In this way, while ensuring the airtightness of the cavity structure, the reliability of the packaged chip is further improved and the reliability of the chip packaging structure is ensured.

[0207] The present application also provides a chip packaging structure, comprising: a substrate, a first chip pad being provided on the first surface; a support structure being provided on the first surface of the substrate; a packaged chip being provided on the first surface, a first conductive bump being provided on the bottom surface of the packaged chip, the first conductive bump being interconnected with the first chip pad, and a cavity structure being formed between the packaged chip, the support structure and the substrate; a first glue portion being provided on a side of the support structure facing away from the substrate, and the first glue portion at least partially covering the side surface of the packaged chip, the first glue portion including a first slope peak; a second glue portion being provided on an upper surface of the packaged chip facing away from the substrate, and the second glue portion including a second slope peak; a third glue portion being provided on an upper surface of the packaged chip facing away from the first surface, the third glue portion including a third slope peak, the second glue portion not being in contact with the third glue portion or the second glue portion being in at least partial contact with the third glue portion; and a plastic encapsulation material, the plastic encapsulation material covering the packaged chip, the support structure, the first glue portion, the second glue portion and the third glue portion.

[0208] The chip packaging structure provided in this embodiment belongs to the same creative concept as the chip packaging structure proposed in Figures 1 to 16. Therefore, for related descriptions, please refer to the contents of the above embodiments, and the embodiments of this application will not be repeated here.

[0209] In this embodiment, a first adhesive portion, a second adhesive portion, and a third adhesive portion are provided in the chip packaging structure. The first adhesive portion is used to buffer side stress, the second adhesive portion is used to buffer stress on the first conductive bump, and the third adhesive portion is used to buffer stress on the cavity structure. At the same time, the first adhesive portion, the second adhesive portion, and the third adhesive portion, the slope peak on the first adhesive portion can release stress caused by heat in the adhesive, thereby further ensuring the reliability of the packaged chip operation.

[0210] The present application also provides a chip packaging structure, including: a substrate, a first chip pad is provided on the first surface; a support structure is provided on the first surface of the substrate; a packaged chip is provided on the first surface, and a first conductive bump is provided on the bottom surface of the packaged chip, the first conductive bump is interconnected with the first chip pad, and a cavity structure is formed between the packaged chip, the support structure and the substrate; a first adhesive part, including a connected first part and a second part, the first part and the second part are both provided on a side of the support structure away from the substrate, the first part at least partially covers the side surface of the packaged chip, and the second part is provided on a side away from the packaged chip; wherein the first part is provided with a first part peak, the second part is provided with a second part peak, and the connecting part of the first part and the second part forms a first valley; a second adhesive part is provided on the upper surface of the packaged chip away from the first surface, and the second adhesive part includes a second peak.

[0211] The chip packaging structure provided in this embodiment belongs to the same creative concept as the chip packaging structure proposed in Figures 1 to 16. Therefore, for related descriptions, please refer to the contents of the above embodiments, and the embodiments of this application will not be repeated here.

[0212] The present application also provides a chip packaging structure, comprising: a substrate, a first chip pad being provided on the first surface; a support structure being provided on the first surface of the substrate; a packaged chip being provided on the first surface, a first conductive bump being provided on the bottom surface of the packaged chip, the first conductive bump being interconnected with the first chip pad, and a cavity structure being formed between the packaged chip, the support structure and the substrate; a first adhesive portion comprising a first portion and a second portion connected to each other, the first portion and the second portion being both provided on a side of the support structure facing away from the substrate, the first portion at least partially covering a side surface of the packaged chip, and the second portion being provided on a side away from the packaged chip; wherein the first portion is provided with a first portion peak, the second portion is provided with a second portion peak, and a connecting portion of the first portion and the second portion forms a first valley; a second adhesive portion being provided on an upper surface of the packaged chip facing away from the first surface, and the second adhesive portion comprises a second peak; a third adhesive portion being provided on an upper surface of the packaged chip facing away from the first surface, the third adhesive portion comprises a third peak, the second adhesive portion is not in contact with the third adhesive portion or the second adhesive portion is at least partially in contact with the third adhesive portion.

[0213] The chip packaging structure provided in this embodiment belongs to the same concept as the chip packaging structure proposed in Figures 1 to 16. For related descriptions, please refer to the contents of the above embodiments, and the embodiments of this application will not be repeated.

[0214] The present application also provides a chip packaging structure, comprising: a substrate, a first chip pad being provided on the first surface; a support structure being provided on the first surface of the substrate; a packaged chip being provided on the first surface, a first conductive bump being provided on the bottom surface of the packaged chip, the first conductive bump being interconnected with the first chip pad, and a cavity structure being formed between the packaged chip, the support structure and the substrate; a first adhesive portion comprising a first portion and a second portion connected to each other, the first portion and the second portion being both provided on a side of the support structure facing away from the substrate, the first portion at least partially covering a side surface of the packaged chip, and the second portion being provided on a side away from the packaged chip; wherein the first portion is provided with a first portion peak, the second portion is provided with a second portion peak, and a connecting portion of the first portion and the second portion forms a first valley; a second adhesive portion being provided on an upper surface of the packaged chip facing away from the first surface, and the second adhesive portion comprises a second peak; a third adhesive portion being provided on an upper surface of the packaged chip facing away from the first surface, the third adhesive portion comprises a third peak, the second adhesive portion is not in contact with the third adhesive portion or the second adhesive portion is at least partially in contact with the third adhesive portion.

[0215] The chip packaging structure provided in this embodiment belongs to the same concept as the chip packaging structure proposed in Figures 1 to 16. For related descriptions, please refer to the contents of the above embodiments, and the embodiments of this application will not be repeated.

[0216] It should be noted that the chip packaging structure provided in this application is a chip scale package (CSP) structure.

[0217] An embodiment of the present application provides a radio frequency front-end module, including the chip packaging structure proposed in the above embodiment.

[0218] The present application also provides an electronic device, including a circuit board and a chip packaging structure. The chip packaging structure is arranged on the circuit board and electrically connected to the circuit board. The chip packaging structure includes the structure described in the above embodiment. For related descriptions, please refer to the contents of the above embodiment. The embodiments of the present application will not be repeated here.

[0219] In an exemplary embodiment, the electronic device includes but is not limited to any electronic device or component having a PCBA board assembly, such as an LED panel, a tablet computer, a laptop computer, a navigator, a mobile phone, and an electronic watch, and this application does not impose any specific restrictions on this.

[0220] It is understandable that the electronic device may also include electronic devices such as personal digital assistants (PDAs) and / or music player functions, such as mobile phones, tablet computers, wearable electronic devices with wireless communication functions (such as smart watches), etc. The above-mentioned electronic devices may also be other electronic devices, such as laptop computers (Laptops) with touch-sensitive surfaces (such as touch panels), etc. In some embodiments, the electronic device may have a communication function, that is, it may establish communication with the network through 2G (second-generation mobile phone communication technology specifications), 3G (third-generation mobile phone communication technology specifications), 4G (fourth-generation mobile phone communication technology specifications), 5G (fifth-generation mobile phone communication technology specifications), 6G (sixth-generation mobile phone communication technology specifications) or W-LAN (wireless local area network) or communication methods that may appear in the future. For the sake of simplicity, this embodiment of the present application is not further limited.

[0221] It is understandable that in order to avoid redundancy, some details of the same or similar technical features in the above specification are not described in detail in some embodiments or implementations, but in fact these details are also applicable to different embodiments or implementations.

[0222] The above are only preferred embodiments of the present application and are not intended to limit the present application. Any modifications, equivalent replacements, and improvements made within the spirit and principles of the present application should be included in the scope of protection of the present application.

Claims

1. A chip packaging structure, wherein: A substrate having a first chip pad disposed on a first surface; A support structure, disposed on the first surface of the substrate; A packaged chip is arranged on the first surface, a first conductive bump is arranged on the bottom surface of the packaged chip, the first conductive bump is interconnected with the first chip pad, and a cavity structure is formed between the packaged chip, the support structure and the substrate; A first adhesive portion is disposed on a side surface of the support structure away from the substrate, and the first adhesive portion at least partially covers the side surface of the packaged chip, and the first adhesive portion includes a first slope peak; A second adhesive material portion is disposed on an upper surface of the packaged chip facing away from the substrate, and the second adhesive material portion includes a second slope peak; A plastic encapsulation material covers the packaged chip, the support structure, the first adhesive material portion, and the second adhesive material portion.

2. The chip packaging structure according to claim 1, wherein: The distance between the portion of the first adhesive portion that at least partially covers the side surface of the packaged chip and the support structure is not less than 10 micrometers or greater than 5% of the thickness of the packaged chip.

3. The chip packaging structure according to claim 1, wherein: The width of the first adhesive material portion on the support structure is greater than 50 micrometers.

4. The chip packaging structure according to claim 1, wherein: The first adhesive material portion at least partially extends to a gap formed between the packaged chip and the supporting structure.

5. The chip packaging structure according to claim 1, wherein: The distance of the gap formed between the packaged chip and the support structure is set to d1, and the position of the first adhesive portion away from the first point on the outer surface of the packaged chip satisfies: The first point is any point on the outer surface of the first adhesive portion away from the packaged chip, x1 is the distance from the first point to the side surface of the packaged chip, and y1 is the distance from the first point to the support structure.

6. The chip packaging structure according to claim 1, wherein: The distance of the gap formed between the packaged chip and the support structure is set to d1, the first adhesive portion has an angle region away from the outer surface of the packaged chip, a second point in the angle region and the projection of the packaged chip on the support structure have a shortest path, the angle between the straight line corresponding to the shortest path and the thickness direction is within the range of 40°-60°, and the second point is any point in the angle region; The position of the second point satisfies: Among them, x2 is the distance between the second point and the side surface of the packaged chip, and y2 is the distance between the second point and the supporting structure.

7. The chip packaging structure according to claim 1, wherein: The first slope peak contacts the side surface of the packaged chip, or there is a first distance between the first slope peak and the side surface of the packaged chip, and at least a portion of the outer surface of the first adhesive portion is concave and / or convex and / or gently extends from the first slope peak toward the support structure to the support structure.

8. The chip packaging structure according to claim 1, wherein: In a direction away from the side surface of the packaged chip, the first adhesive portion includes a first portion and a second portion which are adjacent to each other, the first portion and the second portion are both arranged on a side of the support structure away from the substrate, the first portion at least partially covers the side surface of the packaged chip, and the second portion is arranged on a side away from the packaged chip; The first slope peak includes a first portion slope peak and a second portion slope peak, the first portion is provided with the first portion slope peak, the second portion is provided with the second portion slope peak, and the connecting portion between the first portion and the second portion Forming the first slope valley.

9. The chip packaging structure according to claim 8, wherein: The height of the first portion of the slope peaks in the thickness direction of the substrate is greater than the height of the second portion of the slope peaks in the thickness direction of the substrate.

10. The chip packaging structure according to claim 8 or 9, wherein: A portion of the outer surface of the second part is concave and / or convex and / or extends smoothly toward the supporting structure until it contacts the first part, and another portion of the outer surface of the second part is concave and / or convex toward the supporting structure and / or extends smoothly to the supporting structure.

11. The chip packaging structure according to claim 1, wherein: The first adhesive material portion is disposed on the supporting structure around the periphery of the packaged chip.

12. The chip packaging structure according to claim 1, wherein: The second adhesive material portion completely covers the upper surface of the packaged chip.

13. The chip packaging structure according to claim 1, wherein: The second adhesive material portion at least partially overlaps with the working area of ​​the packaged chip in the thickness direction, and / or the second adhesive material portion at least partially overlaps with the first conductive bump in the thickness direction.

14. The chip packaging structure according to claim 1, wherein: The second slope peak at least partially overlaps with the working area of ​​the packaged chip in the thickness direction, and / or the second slope peak at least partially overlaps with the first conductive bump in the thickness direction.

15. The chip packaging structure according to claim 1, wherein: At least a portion of the outer surface of the second adhesive portion is concave and / or convex from the second slope peak toward the upper surface of the packaged chip and / or extends smoothly to the upper surface of the packaged chip.

16. The chip packaging structure according to claim 1, wherein: The second adhesive portion extends from the upper surface of the packaged chip to at least partially cover the side surface of the packaged chip, or the second adhesive portion extends from the upper surface of the packaged chip to at least partially cover the side surface of the packaged chip and contacts the first adhesive portion on the side surface of the packaged chip.

17. The chip packaging structure according to claim 1, wherein: The second adhesive material portion at least includes a third portion and a fourth portion which are adjacent to each other, and the third portion and the fourth portion are both arranged on the upper surface of the packaged chip; wherein, The second slope peak includes a third portion slope peak and a fourth portion slope peak. The third portion is provided with the third portion slope peak, the fourth portion is provided with the fourth portion slope peak, and a connecting portion between the third portion and the fourth portion forms a second slope valley.

18. The chip packaging structure according to claim 1, wherein: The chip packaging structure further includes: a third adhesive material portion, which is arranged on the upper surface of the packaged chip, and the third adhesive material portion includes a third slope peak.

19. The chip packaging structure according to claim 18, wherein: At least a portion of the outer surface of the third adhesive material portion is concave and / or convex and / or gently extends from the third slope peak toward the upper surface of the packaged chip until it contacts the second adhesive material portion.

20. The chip packaging structure according to claim 18 or 19, wherein: The third adhesive portion and the working area of ​​the packaged chip at least partially overlap in the thickness direction of the substrate.

21. The chip packaging structure according to claim 18 or 19, wherein: The third slope peak at least partially overlaps with the working area of ​​the packaged chip in the thickness direction of the substrate.

22. The chip packaging structure according to claim 1, wherein: The Young's modulus of the plastic encapsulation material is greater than the Young's modulus of the first adhesive material portion, and the Young's modulus of the plastic encapsulation material is greater than the Young's modulus of the second adhesive material portion.

23. The chip packaging structure according to claim 1, wherein: The first glue part includes a blocking area, the blocking area includes the first glue part that at least partially covers the side surface of the packaged chip, the Young's modulus of the blocking area is greater than the Young's modulus of other areas of the first glue part except the blocking area, and the Young's modulus of the blocking area is greater than the Young's modulus of the second glue part.

24. The chip packaging structure according to claim 1, wherein: The chip packaging structure also includes a first chip, a bonding wire is set on the top surface of the first chip, and the bonding wire of the first chip is interconnected with a second chip pad set on the first surface, or a third conductive bump is set on the bottom surface of the first chip, and the third conductive bump is interconnected with a third chip pad set on the first surface.

25. A chip packaging structure, wherein: A substrate having a first chip pad disposed on a first surface; A support structure, disposed on the first surface of the substrate; A packaged chip is arranged on the first surface, a first conductive bump is arranged on the bottom surface of the packaged chip, the first conductive bump is interconnected with the first chip pad, and a cavity structure is formed between the packaged chip, the support structure and the substrate; The first adhesive part includes a first part and a second part which are adjacent to each other, wherein the first part and the second part are both arranged on a side of the support structure away from the substrate, the first part at least partially covers the side surface of the packaged chip, and the second part is arranged on a side away from the packaged chip; wherein, The first part is provided with a first slope peak, the second part is provided with a second slope peak, and a connection portion between the first part and the second part forms a first slope valley; A plastic encapsulation material covers the packaged chip, the support structure and the first adhesive material portion.

26. A chip packaging structure, wherein: A substrate having a first chip pad disposed on a first surface; A support structure, disposed on the first surface of the substrate; A packaged chip is arranged on the first surface, a first conductive bump is arranged on the bottom surface of the packaged chip, the first conductive bump is interconnected with the first chip pad, and a cavity structure is formed between the packaged chip, the support structure and the substrate; A first adhesive portion is disposed on a side of the support structure away from the substrate, and the first adhesive portion at least partially covers a side surface of the packaged chip, and the first adhesive portion includes a first slope peak; A second adhesive material portion is disposed on an upper surface of the packaged chip facing away from the substrate, and the second adhesive material portion includes a second slope peak; A third adhesive portion is arranged on the upper surface of the packaged chip away from the first surface, the third adhesive portion includes a third slope peak, the second adhesive portion is not in contact with the third adhesive portion or the second adhesive portion is in at least partial contact with the third adhesive portion; A plastic encapsulation material covers the packaged chip, the support structure, the first adhesive part, the second adhesive part, and the third adhesive part.

27. A chip packaging structure, wherein: A substrate having a first chip pad disposed on a first surface; A support structure, disposed on the first surface of the substrate; A packaged chip is arranged on the first surface, a first conductive bump is arranged on the bottom surface of the packaged chip, the first conductive bump is interconnected with the first chip pad, and a cavity structure is formed between the packaged chip, the support structure and the substrate; A first adhesive portion is disposed on a side surface of the support structure away from the substrate, and the first adhesive portion at least partially covers the side surface of the packaged chip, and the first adhesive portion includes a first slope peak; A plastic encapsulation material, wherein the plastic encapsulation material covers the packaged chip, the support structure and the first adhesive material portion; There is an angle region on the outer surface of the first adhesive portion away from the packaged chip, a second point in the angle region and a projection of the packaged chip on the support structure have a shortest path, an angle between a straight line corresponding to the shortest path and the thickness direction is in the range of 40°-60°, and the second point is any point in the angle region; the position of the second point satisfies: x2 is the distance between the second point and the side surface of the packaged chip, and y2 is the distance between the second point and the supporting structure.

28. A chip packaging structure, wherein: A substrate having a first chip pad disposed on a first surface; A support structure, disposed on the first surface of the substrate; A packaged chip is arranged on the first surface, a first conductive bump is arranged on the bottom surface of the packaged chip, the first conductive bump is interconnected with the first chip pad, and a cavity structure is formed between the packaged chip, the support structure and the substrate; A first adhesive portion is disposed on a side surface of the support structure away from the substrate, and the first adhesive portion at least partially covers the side surface of the packaged chip, and the first adhesive portion includes a first slope peak; A plastic encapsulation material, wherein the plastic encapsulation material covers the packaged chip, the support structure and the first adhesive material portion; The distance of the gap formed between the packaged chip and the support structure is set to d1, and the position of the first adhesive portion away from the first point on the outer surface of the packaged chip satisfies: The first point is any point on the outer surface of the first adhesive portion away from the packaged chip, x1 is the distance from the first point to the side surface of the packaged chip, and y1 is the distance from the first point to the support structure.

29. A radio frequency front-end module, wherein: Comprising the chip packaging structure as described in any one of claims 1-28.

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