Electric device, electric device surface temperature control method, electric device surface temperature control apparatus, medium, and chip system

Abstract

An electric device surface temperature control method, an electric device surface temperature control apparatus, an electric device, a computer readable storage medium, and a chip system. The method comprises: acquiring a historical temperature of at least one heating component located inside and / or outside an electric device between a first moment and a second moment (S210); taking the historical temperature as an input of a temperature prediction model, and outputting a predicted temperature of an external surface of the electric device at a third moment later than the first moment and the second moment, wherein the temperature prediction model represents the relationship between the historical temperature and the predicted temperature (S220); and adjusting the working state of the electric device on the basis of the predicted temperature so as to control the temperature of the external surface of the electric device (S230). The hysteresis between the temperature measurement and the temperature control can be overcome, and on the basis of a temperature prediction result of the prediction model, measures are taken as soon as possible for temperature control, so that the control capability of the external temperature of the electric device is improved, thereby improving the user experience.

Description

Electrical equipment and surface temperature control method, device, medium and chip system thereof

[0001] This application claims priority to the Chinese patent application filed with the State Intellectual Property Office of China on September 25, 2023, with application number 202311250217.3 and application name “Electrical equipment and its surface temperature control method, device, medium and chip system”, all contents of which are incorporated by reference into this application. Technical Field

[0002] The present application relates to the field of equipment control technology, and in particular to a method for controlling the surface temperature of an electrical device, a device for controlling the surface temperature of an electrical device, an electrical device, a computer-readable storage medium, and a chip system. Background Art

[0003] There are temperature control technologies for electrical equipment in this field. These existing technologies usually control the resource consumption of internal components of the electrical equipment based on the power consumption performance of the internal components, aiming to ensure that the internal components do not overheat, ignoring the fact that excessively high external surface temperatures will have a negative impact on user experience. Although some existing technologies can control the external surface temperature, the means adopted are still to achieve this by controlling the working state of the internal components. It is not realized that it takes a certain amount of time for the temperature or working energy consumption of the internal components to be transmitted to the external surface, resulting in a lag in the control of the external surface temperature. Therefore, there is an urgent need in this field for a temperature control technology that can timely control the external surface temperature of electrical equipment, overcome the lag between temperature measurement and temperature control, and significantly improve the user experience.

[0004] Summary of the Invention

[0005] To this end, the present application is dedicated to providing a surface temperature control method for electrical equipment, a surface temperature control device for electrical equipment, electrical equipment, a computer-readable storage medium, and a chip system, which can timely control the surface temperature of the electrical equipment, overcome the lag between temperature measurement and temperature control, and significantly improve the user experience.

[0006] On the one hand, the present application provides a method for controlling the surface temperature of an electrical equipment, comprising: first, obtaining the historical temperature of at least one heat-generating component located inside and / or outside the electrical equipment between a first moment and a second moment; then, using the historical temperature as the input of a temperature prediction model, and outputting the predicted temperature of the external surface of the electrical equipment at a third moment after the first moment and the second moment, the temperature prediction model characterizing the relationship between the historical temperature and the predicted temperature; finally, adjusting the working state of the electrical equipment according to the predicted temperature to control the external surface temperature of the electrical equipment.

[0007] According to this aspect, a technical means of using a temperature prediction model for prediction overcomes the lag between internal temperature measurement and surface temperature control, so that the control of the working state of the electrical equipment can be carried out before the surface temperature actually rises, thereby smoothing out large fluctuations in the surface temperature and keeping the surface temperature as stable as possible, significantly improving the user experience and solving the problem of excessively high surface temperature.

[0008] In addition, temperature prediction based on the temperature prediction model is conducive to the use of mature artificial intelligence technologies such as machine learning in this field to achieve the correspondence between historical temperature and predicted temperature, improve the timeliness and accuracy of predicted temperature, and thus help improve the timeliness and accuracy of temperature control, avoid erroneous control measures due to incorrect predictions, and cause unreasonable temperature fluctuations.

[0009] In a special embodiment of the present application, in order to adjust the working state of the electrical equipment according to the predicted temperature, first, the heat generation of each heating component in at least one heating component can be determined based on the working state of each heating component and the heat capacity model, and the heat capacity model characterizes the mapping relationship between the working state and the heat generation of the heating component; then, based on the predicted temperature and the heat generation of each heating component, the resource limitation ratio of each heating component is determined, and the resource limitation ratio represents the reduction ratio of one or more of the power consumption, voltage, frequency and load of the heating component; finally, according to the resource limitation ratio, the working state of each heating component is controlled.

[0010] According to this embodiment, the heat generation of the heating device is determined by the heat capacity model instead of directly measuring the operating temperature of the heating device. This is because, considering that the installation positions of some heating devices are very close, the temperature obtained by direct measurement is affected by the surrounding environment and cannot accurately reflect the actual temperature of a single heating device. Therefore, the temperature calculated by the heat capacity model is more conducive to determining the actual temperature of a single heating device, especially multiple heating devices with close installation positions.

[0011] In addition, by controlling electrical equipment by setting resource limit ratios, the control strategy can be flexibly adjusted to achieve variability and flexibility in control means and control ranges, avoiding the incompatibility and inaccuracy that may be caused by simply controlling the device temperature based on the predicted temperature.

[0012] In a particular embodiment of the present application, at least one heat-generating component includes a first heat-generating component, and the first heat-generating component includes multiple heat-generating sub-components. The method also includes: first, with the goal of maximizing the performance of the first heat-generating component, allocating the resource limitation ratio of the first heat-generating component to multiple heat-generating sub-components to determine the resource limitation ratio of each heat-generating sub-component in the multiple heat-generating sub-components; and then, based on the resource limitation ratio of each heat-generating sub-component, controlling the working state of each heat-generating sub-component.

[0013] According to this embodiment, the resource limit ratio is redistributed for a particularly heat-generating device having multiple sub-devices, which can improve the accuracy of temperature control based on the resource limit ratio. The working state of the device can be finely controlled based on the performance characteristics of the particularly heat-generating device, thereby achieving effective and rapid temperature control.

[0014] In addition, allocating the resource limit ratio with the goal of maximizing the performance of the first heat-generating component is conducive to avoiding excessive impact of resource limits on the working performance of the heat-generating component. While controlling the working status according to the resource limit ratio, it is possible to ensure that the heat-generating component can still work normally and perform stably, thereby achieving harmless temperature control, reducing the negative impact of temperature control, and improving the overall user experience and performance of electrical equipment.

[0015] In a special embodiment of the present application, in order to allocate the resource limitation of the first heat-generating component to multiple heat-generating sub-components, the resource limitation ratio of each heat-generating sub-component can be determined based on the resource limitation ratio of the first heat-generating component and a mapping table. The mapping table records the multiple resource limitation ratios corresponding to the first heat-generating component, as well as the resource limitation ratios of the multiple heat-generating sub-components corresponding to each of the multiple resource limitation ratios.

[0016] According to this embodiment, the resource restriction ratio of the sub-device is determined through a mapping table, which can speed up the calculation speed of the resource restriction ratio of the sub-device. The corresponding resource restriction ratio value can be simply and quickly obtained through table lookup, eliminating redundant calculation processes, and can speed up the response speed of temperature control and improve the effect of temperature control.

[0017] In a special embodiment of the present application, in order to determine the resource limitation ratio of each heating component based on the predicted temperature and the heat generation of each heating component, the resource limitation ratio of the electrical equipment can be first determined based on the predicted temperature; then, based on the heat generation of each heating component, the resource limitation ratio of the electrical equipment can be distributed to multiple heating components to obtain the resource limitation ratio of each heating component.

[0018] According to this embodiment, in addition, the resource limit ratio of the entire electrical equipment is distributed to each heating component in proportion according to the heat generated by each heating component, so that each heating component can adopt a temperature control strategy of different amplitudes according to its own heating situation, which is conducive to achieving refinement and accuracy of temperature control and effectively improving the actual effect of temperature control.

[0019] In a particular embodiment of the present application, the working status includes one or more of power consumption, voltage, frequency and load.

[0020] According to this embodiment, power consumption, voltage, frequency and load are working conditions or working indicators that can directly affect the temperature of the heat-generating components. Adjusting and controlling these indicators is conducive to controlling the temperature and heat of the heat-generating components through the most direct means, thereby achieving the purpose of quickly and timely reducing the external or surface temperature.

[0021] In a particular embodiment of the present application, the at least one heat-generating component includes one or more of a system-on-chip, a modem, a housing of an electric device, and a battery.

[0022] According to this embodiment, the inventors have discovered that the system-on-chip (SoC), modem, electrical device housing, and battery are the components that most significantly impact surface temperature. These components typically generate significant heat, thereby increasing surface temperature. By inputting the historical temperatures of these components into the prediction model, a more accurate temperature prediction can be obtained, thereby improving prediction performance.

[0023] In a particular embodiment of the present application, the historical temperature of at least one heat-generating component is obtained by directly measuring it through a temperature sensor; or, the historical temperature of at least one heat-generating component is obtained by calculating the temperature of other reference positions, and the temperature of other reference positions includes the temperature of other components or structures of the electrical equipment other than the at least one heat-generating component.

[0024] According to this embodiment, obtaining historical temperature information by directly measuring with a temperature sensor or calculating the historical temperature information by reference position temperature is an effective means of obtaining historical temperature. The former can improve the timeliness and accuracy of obtaining historical temperature, and the latter can reduce the increase in equipment cost and increased maintenance difficulty caused by direct measurement.

[0025] In a particular embodiment of the present application, the power-consuming device includes a central processing unit, a graphics processing unit, and a double-read / write speed memory, and the input also includes one or more of the load information of the central processing unit, the load information of the graphics processing unit, and the load information of the double-read / write speed memory.

[0026] According to this embodiment, the workloads of the CPU, GPU, and DDR memory usually directly affect their heat generation. Using the load information of these devices as input to the temperature prediction model can further improve the accuracy and objectivity of temperature prediction.

[0027] In a special embodiment of the present application, the electrical equipment also includes a cooling device for cooling a target device of the electrical equipment; in order to adjust the working state of the electrical equipment according to the predicted temperature to control the surface temperature of the electrical equipment, first, the cooling target temperature of the target device can be determined according to the predicted temperature; then, according to the cooling target temperature, the working state of the cooling device can be controlled to cool the target device to the cooling target temperature.

[0028] According to this embodiment, in addition to reducing working resources or frequency, an active cooling method is also provided to reduce device temperature. This allows for a multi-pronged approach to enrich cooling methods and achieve a fast and efficient cooling effect.

[0029] On the other hand, the present application provides a surface temperature control device for electrical equipment, including: an acquisition module for acquiring the historical temperature of at least one heat-generating component located inside and / or outside the electrical equipment between a first moment and a second moment; a prediction module for using the historical temperature as the input of a temperature prediction model, and outputting the predicted temperature of the external surface of the electrical equipment at a third moment after the first moment and the second moment, wherein the temperature prediction model characterizes the relationship between the historical temperature and the predicted temperature; an adjustment module for adjusting the working state of the electrical equipment according to the predicted temperature to control the external surface temperature of the electrical equipment.

[0030] In a particular embodiment of the present application, the adjustment module is further configured to: first, determine the heat generation of each heat-generating component based on the working state and heat capacity model of each heat-generating component in at least one heat-generating component, and the heat capacity model characterizes the mapping relationship between the working state and the heat generation of the heat-generating component; then, determine the resource limitation ratio of each heat-generating component based on the predicted temperature and the heat generation of each heat-generating component, and the resource limitation ratio represents the reduction ratio of one or more of the power consumption, voltage, frequency and load of the heat-generating component; finally, control the working state of each heat-generating component based on the resource limitation ratio.

[0031] In a special embodiment of the present application, at least one heat-generating component includes a first heat-generating component, and the first heat-generating component includes multiple heat-generating sub-components. The device also includes: an allocation module, which is used to allocate the resource limitation ratio of the first heat-generating component to the multiple heat-generating sub-components with the goal of maximizing the performance of the first heat-generating component, so as to determine the resource limitation ratio of each heat-generating sub-component in the multiple heat-generating sub-components; and a control module, which is used to control the working state of each heat-generating sub-component based on the resource limitation ratio of each heat-generating sub-component.

[0032] In a special embodiment of the present application, the allocation module is further configured to: determine the resource limitation ratio of each heat-generating sub-component based on the resource limitation ratio of the first heat-generating component and a mapping table, wherein the mapping table records multiple resource limitation ratios corresponding to the first heat-generating component, and the resource limitation ratios of the multiple heat-generating sub-components corresponding to each resource limitation ratio in the multiple resource limitation ratios.

[0033] In a special embodiment of the present application, the adjustment module is further configured to: first, determine the resource limitation ratio of the electrical equipment based on the predicted temperature; then, distribute the resource limitation ratio of the electrical equipment to multiple heating components based on the heat generation of each heating component to obtain the resource limitation ratio of each heating component.

[0034] In a particular embodiment of the present application, the working status includes one or more of power consumption, voltage, frequency and load.

[0035] In a particular embodiment of the present application, the at least one heat-generating component includes one or more of a system-on-chip, a modem, a housing of an electric device, and a battery.

[0036] In a particular embodiment of the present application, the historical temperature of at least one heat-generating component is obtained by directly measuring it through a temperature sensor; or, the historical temperature of at least one heat-generating component is obtained by calculating the temperature of other reference positions, and the temperature of other reference positions includes the temperature of other components or structures of the electrical equipment other than the at least one heat-generating component.

[0037] In a particular embodiment of the present application, the power-consuming device includes a central processing unit, a graphics processing unit, and a double-read / write speed memory, and the input also includes one or more of the load information of the central processing unit, the load information of the graphics processing unit, and the load information of the double-read / write speed memory.

[0038] In a special embodiment of the present application, the electrical equipment also includes a cooling device for cooling a target device of the electrical equipment, and the adjustment module is further configured to: first, determine the cooling target temperature of the target device based on the predicted temperature; then, control the working state of the cooling device based on the cooling target temperature to cool the target device to the cooling target temperature.

[0039] On the other hand, the present application provides an electrical device, which includes a processor and a memory, and the processor is used to execute a computer program stored in the memory to implement the above-mentioned method for controlling the surface temperature of the electrical device.

[0040] On the other hand, the present application provides a computer-readable storage medium, which stores a computer program for executing the above-mentioned method for controlling the surface temperature of electrical equipment.

[0041] On the other hand, the present application provides a chip system, which includes a processor coupled to a memory, and the processor executes a computer program stored in the memory to implement the steps of the above-mentioned method for controlling the surface temperature of electrical equipment.

[0042] On the other hand, the present application provides a computer program product, including program code, which enables a computer to implement the above-mentioned method for controlling the surface temperature of an electrical device when the computer program product is executed by the computer.

[0043] In another aspect, the present application provides a terminal comprising a processor and memory, wherein the processor is configured to execute a computer program stored in the memory to implement the aforementioned method for controlling the surface temperature of an electrical device. The terminal may be a desktop computer, a laptop computer, a tablet computer, a smartphone, a smartwatch, a car, or virtual reality (VR) glasses.

[0044] Any of the electrical equipment surface temperature control devices, electrical equipment, computer-readable storage media, computer program products, chip systems or terminals provided above are used to execute the electrical equipment surface temperature control method provided above. Therefore, the beneficial effects that can be achieved can refer to the beneficial effects of the corresponding schemes in the corresponding methods provided above, and will not be repeated here. BRIEF DESCRIPTION OF THE DRAWINGS

[0045] The specific embodiments of the present application are described in detail below with reference to the accompanying drawings, wherein:

[0046] FIG1 is a schematic block diagram of a method for controlling the surface temperature of an electrical device according to an embodiment of the present application;

[0047] FIG2 is a schematic flow chart of a method for controlling the surface temperature of an electrical device according to another embodiment of the present application;

[0048] FIG3 is a schematic diagram showing a model training process in the method for controlling the surface temperature of an electrical device according to the embodiment of FIG2 ;

[0049] FIG4 is a schematic diagram showing a model prediction process in the method for controlling the surface temperature of an electrical device according to the embodiment of FIG2 ;

[0050] FIG5 is a schematic flow chart showing a method for controlling the surface temperature of an electrical device according to another embodiment of the present application;

[0051] FIG6 is a schematic diagram showing a heat capacity model between the working state and the heat generation in the surface temperature control method of the electrical equipment according to the embodiment of FIG5 ;

[0052] FIG7 shows a mapping relationship diagram between the predicted temperature and the resource limit ratio in the method for controlling the surface temperature of the electrical equipment according to the embodiment of FIG5 ;

[0053] FIG8 is a schematic diagram showing resource restriction ratio allocation in the method for controlling the surface temperature of an electrical device according to the embodiment of FIG5 ;

[0054] FIG9 is a schematic diagram showing the allocation of sub-component resource restriction ratios in the method for controlling the surface temperature of an electrical device according to the embodiment of FIG5 ;

[0055] FIG10 is a schematic block diagram showing a method for controlling the surface temperature of an electrical device according to another embodiment of the present application;

[0056] FIG11 is a schematic structural diagram of a surface temperature control device for electrical equipment according to an embodiment of the present application;

[0057] FIG12 is a schematic diagram showing the architecture of an electric device according to an embodiment of the present application;

[0058] FIG13 shows a schematic structural diagram of an electrical device according to another embodiment of the present application. DETAILED DESCRIPTION

[0059] In order to make those skilled in the art understand the concept and idea of ​​the present application more clearly, the present application is described in detail below in conjunction with specific embodiments. It should be understood that the embodiments provided herein are only a part of all possible embodiments of the present application. After reading the specification of the present application, those skilled in the art are capable of making improvements, modifications, or replacements to part or all of the following embodiments, and these improvements, modifications, or replacements are also included in the scope of protection claimed in the present application.

[0060] In this document, the terms "one", "an" and other similar words are not intended to indicate that there is only one of the things described, but rather that the relevant description is only for one of the things described, and the things described may have one or more. In this document, the terms "include", "comprise" and other similar words are intended to indicate logical relationships, and cannot be regarded as indicating relationships in spatial structure. For example, "A includes B" is intended to indicate that B logically belongs to A, but does not mean that B is spatially located inside A. In addition, the meanings of the terms "include", "include" and other similar words should be regarded as open, not closed. For example, "A includes B" is intended to indicate that B belongs to A, but B does not necessarily constitute the whole of A. A may also include other elements such as C, D, and E.

[0061] In this document, the terms "first", "second" and other similar words are not intended to imply any order, quantity or importance, but are merely used to distinguish different elements. In this document, the terms "embodiment", "present embodiment", "one embodiment" and "an embodiment" do not indicate that the relevant description is only applicable to a specific embodiment, but rather indicate that these descriptions may also be applicable to one or more other embodiments. Those skilled in the art should understand that in this document, any description made for a certain embodiment can be replaced, combined, or otherwise combined with the relevant description in one or more other embodiments, and the new embodiment generated by the replacement, combination, or other combination is easily conceivable by those skilled in the art and falls within the scope of protection of this application.

[0062] In the various embodiments of the present application, electrical equipment may refer to equipment that requires electrical energy to work. In some embodiments of the present application, electrical equipment may refer to equipment that will or may generate heat due to the input of electrical energy, and this heat can be clearly perceived by the outside world or the human body. Electrical equipment may include, for example, household appliances, power facilities, and electronic products. Household appliances may include televisions, stereos, telephones, etc. Power facilities may include various transformers, switches, transducers, etc. Electronic products may include computers (desktop computers, laptops, tablets, PDAs, workstations, etc.), smart phones, smart watches, AR (augmented reality) glasses, etc.

[0063] In the various embodiments of this application, surface temperature may refer to the temperature of the housing or exterior of an electrical device that can be sensed by the outside world. Since surface temperature is one of the indicators that directly affects the user experience of electrical devices, especially those frequently touched by humans, the prediction and control of surface temperature has become an important technical issue.

[0064] Some technologies in this field read the temperature of a physical sensor to obtain the current temperature of the device. Through calculations using a temperature control algorithm, they ultimately limit the frequency of heat-generating components to reduce heat generation, lowering the device temperature and preventing overheating that could damage the device or scald the user. To implement temperature control algorithm technology, the industry generally uses DVFS (dynamic voltage and frequency scaling), which adjusts the voltage and frequency of the device based on the chip's performance and power consumption requirements to reduce device power consumption and heat generation in dynamic scenarios. However, while this method provides a mechanism for dynamically adjusting the operating state of the device, it still has many shortcomings, including the lack of a corresponding strategy to determine how to adjust the device state to control heat generation in different scenarios.

[0065] Some technologies in this field include software modules including a power arbiter, a power model, and a temperature monitor, while hardware modules include a CPU (central processing unit), a GPU (graphics processing unit), and a temperature sensor. Their functions are as follows: using the SOC (system on chip) temperature as input, the power arbiter uses a PID (proportional-integral-derivative) algorithm to calculate the total allocable power consumption of the system. This power consumption is then allocated based on the power consumption requirements reported by the devices. Each device then uses the power consumption model to convert the allocated power consumption into an operational state. The logical (working / connection) relationship between the software and hardware is as follows: the temperature monitor obtains the current temperature through the temperature sensor, and the power arbiter obtains the reported power consumption values ​​based on the power model and the operating status of devices such as the CPU and GPU. After calculation, the available power consumption is allocated to each device. The specific steps are as follows: 1) The temperature read by the SOC temperature sensor is used as input. When the temperature reaches a certain threshold, the algorithm logic is triggered; 2) A PID controller is used as the control algorithm, and the read SOC temperature is used as input. The difference between the temperature and the pre-set target SOC temperature is calculated to obtain the current power consumption quota that can be allocated to the entire machine. The power consumption quota is allocated to each device, and the device state is adjusted to reduce the SOC temperature and achieve the control effect; 3) The IPA (intelligent power allocator) obtains the current power consumption reported by each power-consuming device, calculates the relationship between the total reported power consumption and the power consumption quota output by the PID. If the total reported power consumption is less than the power consumption quota, it means that the system can currently increase the power supply and continue to allocate the excess power consumption to the required devices. If the total reported power consumption is greater than the power consumption quota, it indicates that the current power consumption quota of the system is insufficient. This ratio will be used as the device power consumption limit ratio to recover the available power consumption of each device and lower the operating state of the device to achieve the effect of reducing the SOC temperature.

[0066] These technologies can, to a certain extent, control the device's SOC temperature and solve the problem of device overheating. However, they cannot accurately control the backshell temperature, and the temperature control accuracy is insufficient. These deficiencies are caused by the following reasons: 1) IPA controls the SOC temperature, sets a target temperature value for the SOC temperature, and controls the SOC temperature near the target temperature. However, in terminal scenarios, the main factor affecting user experience is the backshell temperature. Simply controlling the SOC temperature ignores the impact on user experience. 2) Due to the hysteresis between the backshell temperature and the SOC temperature, temperature control can only indirectly affect the shell temperature by controlling the device state and affecting the SOC temperature. Simply modifying the IPA algorithm input to the backshell temperature will result in severe control hysteresis, resulting in large temperature fluctuations and system resource constraints, seriously affecting the stability of system performance. 3) IPA uses a power consumption model as a method to allocate resources to control heat. However, temperature is affected by factors such as structure and heat dissipation materials. The heat generation and power consumption of the device are not equivalent, and the allocation algorithm based on the power consumption model is not accurate enough.

[0067] To this end, some embodiments of the present application are intended to solve the following technical problems: 1) solving the time lag of adjusting the state of the SOC device to affect the SOC temperature, thereby indirectly controlling the temperature of the rear shell, improving the stability of temperature control, and improving performance stability; 2) solving the problem of deviation in the power consumption model used in the heat calculation and distribution process and the inability to accurately control the temperature.

[0068] In response to the problem of hysteresis in controlling surface temperature in this field, some embodiments of this application propose surface temperature prediction technology to eliminate control lag, intervene in advance, reduce temperature fluctuations, improve environmental adaptability, and provide a better user temperature experience. In response to the problem of errors in controlling temperature using power consumption models in this field, some embodiments of this application propose surface temperature control technology to make temperature control more accurate, strategies more flexible, and maximize performance while controlling temperature to ensure user performance experience. In response to the problem of how to accurately count the heat generated by devices and calculate the allocation ratio of each device in this field, some embodiments of this application propose heat source identification and resource allocation technology, which can accurately control the device state and deterministically control the temperature.

[0069] FIG1 shows a schematic block diagram of a method for controlling the surface temperature of an electrical device according to an embodiment of the present application.

[0070] As shown in Figure 1, in the surface temperature control method for electrical equipment of this embodiment, historical temperature information is first obtained from several components of the electrical equipment. These components can be any heat-generating components of the electrical equipment. This historical temperature information is then input into a temperature prediction model, which calculates the predicted surface temperature of the electrical equipment at a future time. Finally, based on the predicted temperature, a control unit adjusts the operating state of the electrical equipment. This control unit can be internal to the electrical equipment or external to the electrical equipment and in communication with the electrical equipment. The temperature prediction model can be integrated within the control unit or stored elsewhere and executed by the control unit or separately by another controller.

[0071] FIG2 is a schematic flow chart of a method for controlling the surface temperature of an electrical device according to another embodiment of the present application.

[0072] According to this embodiment, the method for controlling the surface temperature of an electrical device includes steps S210 to S230 , each of which is described in detail below.

[0073] S210: Obtain a historical temperature of at least one heat-generating component located inside and / or outside the electrical equipment between a first moment and a second moment.

[0074] In this embodiment, a heat-generating component may refer to a component inside or outside the electrical device that can generate heat. The heat-generating component of the electrical device may be on various power-consuming devices or core components inside the electrical device, or may be on a housing, bracket, etc. outside the electrical device. For example, the heat-generating component of the electrical device may be a component that can reflect the energy consumption characteristics of the electrical device and can significantly affect the overall heat performance of the electrical device. Other types of heat-generating components are also conceivable.

[0075] As an example, the at least one heat-generating component includes one or more of a system-on-chip, a modem, a housing of a power-consuming device, and a battery.

[0076] In this embodiment, the historical temperature may refer to the temperature value obtained by the temperature measuring element or the temperature calculating element at the time of measurement or calculation, or it may be the temperature value at other times, which is obtained directly or indirectly based on the actual situation or operating status of the electrical equipment.

[0077] In this embodiment, the historical temperature between the first moment and the second moment may refer to the temperature at a certain moment (time point) between the first and second moments, or may refer to the average temperature over a certain period of time between the first and second moments, or may refer to the temperature calculated by calculating temperature values ​​sampled at certain time points between the first and second moments. Other historical temperature calculation methods are also conceivable.

[0078] As an example, the historical temperature of at least one heat-generating component is directly measured by a temperature sensor.

[0079] Specifically, a temperature sensor refers to a sensor that senses temperature and converts it into a usable output signal. Based on the measurement method, it can be categorized as contact or non-contact. Based on the sensor material and electronic component characteristics, it can be categorized as thermal resistors or thermocouples. In some embodiments, the component may include internal components and / or a housing. The predicted temperature can be calculated based on historical temperature information from the internal components and / or the housing, thereby improving the accuracy of historical temperature information.

[0080] In this example, the temperature sensor can determine the temperature at the corresponding location based on the different hardware characteristics at different temperatures. Terminal devices typically have temperature sensors at key nodes, such as the system-on-chip (SoC) and modem. For example, a temperature sensor could be a temperature monitoring sensor on the SoC or the back cover of a mobile phone, such as an analog-to-digital converter (ADC).

[0081] As an example, the historical temperature of at least one heat-generating component is calculated by using the temperatures of other reference locations. The temperatures of other reference locations include the temperatures of other components or structures of the electrical equipment except the at least one heat-generating component.

[0082] Specifically, the historical temperature of the shell is calculated based on the temperatures of multiple reference positions, and the surface temperature at future moments is predicted based on the calculated historical temperature. This eliminates the need for temperature sensors on the shell surface, making the surface of the electrical equipment simpler and easier to maintain.

[0083] In this example, the surface temperature sensor may be a non-physical sensor, which is obtained by fitting data from sensors at other locations (reference locations), such as a room temperature sensor, an SOC node temperature sensor, a system high temperature zone temperature sensor, and a mainboard temperature sensor.

[0084] S220. Use the historical temperature as input of a temperature prediction model, and output a predicted temperature of the external surface of the electrical equipment at a third moment after the first moment and the second moment. The temperature prediction model represents the relationship between the historical temperature and the predicted temperature.

[0085] In this embodiment, the temperature prediction model may refer to a machine learning model or other artificial intelligence model for predicting temperature. A machine learning model may refer to an algorithm or mathematical function that can convert input data into a specific output. They are the core components of machine learning. Through training data, the machine learning model can automatically learn and improve itself, making it more accurate and effective when processing new data. Machine learning models are usually based on a specific algorithm or model structure. For example, a linear regression model uses a linear equation to model an output variable from the data; a decision tree model classifies or predicts data based on a tree structure; a neural network model uses multiple layers of neurons to process complex data patterns, and so on.

[0086] A linear regression model refers to a mathematical model that uses regression analysis in mathematical statistics to determine the quantitative relationship between two or more variables. For example, linear regression is a type of regression analysis that models the relationship between one or more independent variables and a dependent variable using a least-squares function called the linear regression equation. This function is a linear combination of one or more model parameters, called regression coefficients. A simple regression is used with only one independent variable, while a multiple regression is used with more than one independent variable.

[0087] A neural network model refers to a mathematical model based on the mathematical model of neurons, represented by network topology, node characteristics, and learning rules. For example, a neural network is a complex network system formed by a large number of simple processing units (called neurons) that are widely interconnected. It reflects many basic characteristics of human brain function and is a highly complex nonlinear dynamic learning system. Neural network models include convolutional neural network models (CNN) and deep neural network models (DNN).

[0088] In this embodiment, external surface temperature prediction uses a machine learning model to record historical temperatures and predict future case temperatures. The model inputs factors that affect the future rear case temperature of the device. This data is stored as historical data. After model calculation, the output is the future device surface temperature over a period of time. To perform surface temperature prediction, core and case temperature data from multiple scenarios can be collected offline to train a surface temperature prediction model for future temperatures. During system operation, historical core and case temperatures are dynamically collected and used to predict future surface temperatures using the surface temperature prediction model.

[0089] In this embodiment, external surface temperature prediction can be achieved using a machine learning model that records historical temperatures and predicts future surface temperatures. For example, a linear regression model can be used to predict the surface temperature n seconds from now based on the SOC temperature and surface temperature n seconds ago. Specifically, SOC and surface temperature change data for various scenarios can be collected in advance. A prediction model for converting historical temperatures to surface temperature can then be pre-trained offline. Next, SOC and surface temperature data over the past n seconds can be collected online. Finally, the prediction model can be used to predict the surface temperature n seconds from now based on the historical data. This embodiment can be expanded to more complex models that use more temperature sensors as input.

[0090] Figure 3 illustrates an example of the training process for a machine learning model in the electrical equipment surface temperature control method according to this embodiment. As shown in Figure 3, in this example, the temperature prediction model is a regression model. During the training process, the regression model is fed with temperature and load data from multiple scenarios to train a temperature prediction model (e.g., a shell temperature prediction model).

[0091] As an example, the powered devices include a central processing unit (CPU), a graphics processing unit (GPU), and a DDR memory, and the input further includes one or more of CPU load information, GPU load information, and DDR memory load information.

[0092] FIG4 shows an example of the prediction process of the machine learning model in the surface temperature control method of the electrical equipment according to this embodiment. As shown in FIG4 , in this example, the temperature prediction model is a linear regression model or a neural network model. During the prediction process, the SOC historical temperature, the back shell historical temperature, the modem historical temperature, the battery historical temperature, the CPU load, the GPU load, the DDR (double data rate, double read and write rate memory) load, and (optionally) other device historical temperatures are input into the machine learning model (e.g., the case temperature prediction model), and the predicted surface (e.g., back shell) temperature can be calculated.

[0093] In this embodiment, the future time may refer to a time after the historical temperature time. The specific time of the future time can be set based on the needs of temperature prediction and the characteristics of the electrical equipment. For example, for electrical equipment with rapid temperature changes, the future time may be closer, while for large electrical equipment with slow temperature changes, the future time may be farther in the future. For ordinary electronic equipment, the future time may be, for example, a few seconds, a dozen seconds, or even dozens of seconds in the future.

[0094] In this embodiment, the predicted temperature may refer to a temperature value that may be generated or reached in the future and is obtained through calculation of a temperature prediction model.

[0095] S230: Adjust the working state of the electrical equipment according to the predicted temperature to control the external surface temperature of the electrical equipment.

[0096] In this embodiment, the working status of the electrical equipment may refer to various indicators related to the working operation of the electrical equipment as a whole or each component of the electrical equipment (devices, parts, etc.), especially indicators related to energy consumption and heat, such as operating frequency, operating voltage, workload, operating temperature, electrical energy consumed during operation, heat generated during operation, etc.

[0097] As an example, the operating status includes one or more of power consumption, voltage, frequency, and load.

[0098] In this embodiment, to adjust the operating state of the electrical device based on the predicted temperature, a threshold can be set. Once the predicted temperature reaches this threshold, the energy consumption of the electrical device is reduced or even shut down. Alternatively, a reference value can be calculated based on the predicted temperature. When this reference value falls within a certain range, the power consumption or load of the electrical device is controlled. Other technical means for controlling the operating state based on the predicted temperature are also conceivable.

[0099] Figure 5 shows a flow chart of a method for controlling the surface temperature of an electrical device according to an embodiment of the present application. In this embodiment, the working state of the heating device is controlled by allocating a limited ratio of device resources.

[0100] According to this embodiment, the method for controlling the surface temperature of an electrical device includes steps S510 to S570 , each of which is described in detail below.

[0101] S510: Obtain a historical temperature of at least one heating component located inside and / or outside an electrical device between a first moment and a second moment.

[0102] S520: Use the historical temperature as input of a temperature prediction model to output a predicted temperature of the external surface of the electrical equipment at a third moment after the first moment and the second moment. The temperature prediction model represents the relationship between the historical temperature and the predicted temperature.

[0103] For details about S510 to S520, please refer to the detailed description about S210 to S220 in the embodiment of FIG2 , which will not be repeated here.

[0104] S530: Determine the heat generation of each heat generating component according to the working state of each heat generating component and a heat capacity model of at least one heat generating component, where the heat capacity model represents a mapping relationship between the working state of the heat generating component and the heat generation.

[0105] In this embodiment, the operating state may refer to the operating state of the heating device at a certain moment or at the current moment of measurement or calculation. It may be a quantitative indicator such as operating frequency or operating voltage, or a qualitative indicator such as low load, full load, or overload. Other forms of operating states are also conceivable.

[0106] In this embodiment, the operating status of each heating device can be obtained directly from the heating device, or from an input or output port of the heating device. For example, a monitor can be provided on the input line of the heating device to monitor the input voltage of the heating device. Other acquisition methods are also conceivable.

[0107] In this embodiment, a heat capacity model between the working state and the heat output of each of the multiple heat generating devices can be established through testing. Testing can refer to actually simulating the working process of the heat generating device by controlling variables and other means, so as to obtain the mapping relationship between the working state and the heat output during the working process. For example, the heat generating device in the device is removed or installed in place, and the heat output of the heat generating device under the corresponding state is obtained by controlling the current input to the heat generating device or controlling the working indicators or parameters of other heat generating devices. These values ​​are then recorded and sorted out or a heat capacity model is calculated based on these values.

[0108] In this embodiment, the working state may refer to an indicator or parameter related to the work of the heating device that can be measured or directly obtained. By determining these indicators or parameters, the working condition or operating state of the heating device can be judged, for example, whether it is running at full load or whether the working efficiency is decreasing. The calorific value may refer to the heat generated by the heating device in a certain working state (such as working voltage, frequency, etc.) or other temperature values ​​that can be obtained by external measurement means. The heat or temperature has a practical effect on the calorific value or surface temperature of the entire device. The heat capacity model may refer to a model that can reflect the corresponding relationship between the working state and the calorific value, which can be a function, a table, an algorithm model, a machine learning model, etc. For example, if the working state and the calorific value are a linear relationship model, then the heat capacity model is a linear function. For another example, if the relationship between the working state and the calorific value is complex and there is no obvious linear relationship, then the relationship between them can be calculated or fitted according to a nonlinear function model or a machine learning model to obtain the corresponding heat capacity model.

[0109] In this embodiment, in order to establish a heat capacity model, the device heat capacity parameters can be obtained through testing, the device heat capacity model can be constructed, the device frequency and other operating conditions can be counted in real time, and the heat generated by the device can be calculated. For example, first, the device heat capacity parameters of each heating device under different working conditions are obtained through offline testing. During operation, the working state distribution of each heating device in the previous cycle is periodically counted to calculate the corresponding heat generation of each device. For another example, a corresponding relationship table (heat capacity model) between the working state (frequency or voltage, etc.) of each device and the temperature rise in the corresponding temperature zone can be obtained through thermal testing first; then, the operating state of each device in the system can be obtained in real time; finally, the operating state and the device heat capacity model can be used to calculate the heat generation.

[0110] In this embodiment, in order to establish a thermal capacity model and identify heat sources, the relationship between the different operating states of each device (including the different operating states of each sub-device of the device) and the heat generation can be tested to establish a thermal model for each device; the operating state of the device over a period of time is counted in real time, and the heat generation of each device is calculated based on the thermal model; the total system resource limit ratio obtained by the shell temperature control module is proportionally allocated according to the device heat generation obtained by the heat source identification module to obtain the usage limit ratio of each device, and the device with a larger heat generation is allocated a larger limit ratio.

[0111] Figure 6 shows an example of a thermal capacity model between the working state and the heat output in the surface temperature control method of the electrical equipment according to this embodiment. As shown in Figure 6, different thermal capacity models can be established according to the different characteristics of each heating device. In Figure 6, the heating devices include a CPU, a GPU, and a DDR, which respectively have the operating state (i.e., the working state) and heat output of the CPU, the operating state and heat output of the GPU, and the operating state and heat output of the DDR. A CPU thermal capacity model can be established between the operating state and the heat output of the CPU. A GPU thermal capacity model can be established between the operating state and the heat output of the GPU. A DDR thermal capacity model can be established between the operating state and the heat output of the DDR. In addition to these devices, those skilled in the art should know that thermal capacity models between the working state and the heat output can also be established for other devices (such as batteries, modems, SOCs, etc.).

[0112] In this embodiment, in order to determine the calorific value of each heating device based on its operating state and its heat capacity model, the numerical value of the operating state or the conversion of the operating state into a specific numerical value can be input into the heat capacity model, and the calorific value of each heating device can be calculated or fitted by the model. Alternatively, an intermediate value can be calculated based on the numerical value of the operating state combined with other parameters, and then the intermediate value can be input into the heat capacity model to calculate or fit the calorific value of the heating device. Other methods are also conceivable.

[0113] S540 : Determine a resource restriction ratio for each heat-generating component based on the predicted temperature and the heat generated by each heat-generating component. The resource restriction ratio indicates a reduction ratio of one or more of power consumption, voltage, frequency, and load of the heat-generating component.

[0114] In this embodiment, the resource restriction ratio may refer to the reduction ratio of the power consumption, frequency, voltage, or other resources required for normal operation of the power-consuming device. The resource restriction ratio of the power-consuming device may refer to the overall resource restriction ratio for the device, which is used to indicate the extent to which the resource usage (energy consumption, operating frequency, voltage, etc.) of the device will be restricted, and may be expressed as a percentage.

[0115] In this example, to determine the resource restriction ratio for an electrical device based on the predicted temperature, one can first determine whether the electrical device requires resource restriction based on the predicted temperature. If the predicted temperature exceeds a certain threshold or the magnitude or rate of increase exceeds a certain threshold, then it is determined that the electrical device's resources require restriction. Then, based on the relationship between the predicted temperature value and the threshold, the resource restriction ratio required for the entire device is determined, or an intermediate parameter is calculated based on the predicted temperature value, and the resource restriction ratio is determined based on the intermediate parameter. Of course, those skilled in the art can conceive of other methods for determining the resource restriction ratio of a device based on the predicted temperature.

[0116] Figure 7 shows a mapping diagram between the predicted surface temperature and resource limit ratio in the electrical equipment surface temperature control method according to this embodiment. As shown in Figure 7, a predicted surface temperature-resource limit ratio mapping table is established based on the thermal model. When the surface temperature reaches 40°C, the limit begins, and when it reaches 48°C, the limit reaches 100%. Based on the predicted surface temperature, the total system resource limit ratio is queried.

[0117] To control surface temperature, system resources can be restricted based on the predicted surface temperature. The overall trend here is that the higher the predicted surface temperature, the greater the restriction on system resources, which in turn reduces the heat generated by heat-generating components, leading to faster cooling. When performing surface temperature control, a thermal model can be tested to determine the relationship between different system resource restriction ratios and surface temperature. Based on the future surface temperature determined by the surface temperature prediction module, the total system resource restriction ratio can be calculated from the thermal model.

[0118] S540 : Determine a resource restriction ratio for each heat-generating component based on the predicted temperature and the heat generated by each heat-generating component. The resource restriction ratio indicates a reduction ratio of one or more of power consumption, voltage, frequency, and load of the heat-generating component.

[0119] In this embodiment, the resource restriction ratio of each heating device may refer to the resource restriction ratio for a single device, which is used to indicate the extent to which the used resources (frequency, voltage, etc.) of the device will be restricted, and may be expressed as a percentage.

[0120] In this embodiment, in order to allocate the resource restriction ratio of the electrical equipment to multiple heaters based on the heat output of each heating device to obtain the resource restriction ratio of each heating device, it is possible to first determine whether resource restriction is required or to what extent resource restriction is required based on the heat output of each of the multiple heating devices (and their own performance characteristics). Then, based on this result, the overall resource restriction ratio of the equipment is distributed to each heating device, so that devices that require significant restriction receive a larger resource restriction ratio, and devices that only require a smaller restriction receive a smaller resource restriction ratio. Other allocation methods are also conceivable.

[0121] In this embodiment, resource limit ratios may be allocated based on heat generation ratios. Based on the heat generation values ​​of the heat generating components during each execution cycle, resource limit ratios are allocated based on heat generation ratios. The principle for allocating resource limit ratios based on heat generation ratios is that for components with higher heat generation, resource limit ratios are higher, while for components with lower heat generation, resource limit ratios are lower.

[0122] In this embodiment, the resource limit ratio can be allocated according to the heat generation ratio. For example, the resource ratio available to each device can be calculated according to the following formula:

[0123] Where p is the total resource ratio obtained by shell temperature control, t i is the heat generated by device i, p i The resource ratio allocated to device i. For devices with multiple sub-devices (e.g., a CPU with multiple clusters), the sub-device resource limit ratios can inherit the device limit ratios. When allocating device resource limit ratios, for devices with multiple sub-modules, the heat generation (thermal model) and performance of each sub-module under different operating conditions can be used to solve the optimization problem to achieve the optimal performance of the sub-device limit combination while meeting the device temperature rise limit.

[0124] FIG8 shows an example of resource restriction ratio allocation in the surface temperature control method of an electrical device according to this embodiment. As shown in FIG8 , the heat generating devices may include a CPU, a GPU, and a DDR, wherein the CPU generates the most heat (i.e., the operating temperature), the GPU generates the second most heat, and the DDR generates the least heat. For this reason, the restriction ratio for CPU resources is the largest, the restriction ratio for GPU resources is the second largest, and the restriction ratio for DDR resources is the smallest. In other words, different device resource restriction ratios are allocated to the CPU, GPU, and DDR according to their different operating temperatures. For example, the higher the operating temperature of the device, the larger the device resource restriction ratio allocated.

[0125] S550: Control the working state of each heating component according to the resource limit ratio to control the external surface temperature of the electrical equipment.

[0126] In this embodiment, in order to control the operating state of each heating device based on the resource limit ratio of each heating device, the operating frequency of the heating device, or the operating voltage or current of the heating device can be controlled based on the ratio. Control can be performed directly based on the resource limit ratio of each heating device, for example, by reducing the operating frequency by a ratio that is equal to the resource limit ratio. Control can also be performed indirectly based on the resource limit ratio, for example, by calculating an intermediate parameter or ratio based on the limit ratio and then controlling the heating device based on this intermediate ratio. Other control methods are also conceivable.

[0127] In this embodiment, to achieve device cooling control, the operating state of the heat-generating components can be adjusted to reduce heat generation. For example, device cooling control can be achieved by calling the corresponding interface provided by the hardware driver based on the target resource limit ratio of each heat-generating component.

[0128] Specifically, to control the working status of each heat-generating device, dynamic frequency modulation can be adopted to dynamically adjust the maximum operating frequency of devices such as CPU, GPU, DDR, etc., for example, through DVFS technology.

[0129] As an example, the at least one heat-generating component includes a first heat-generating component, which includes multiple heat-generating sub-components. In this case, the electrical equipment surface temperature control method may further include: allocating a resource restriction ratio of the first heat-generating component to the multiple heat-generating sub-components with the goal of maximizing the performance of the first heat-generating component, thereby determining a resource restriction ratio for each of the multiple heat-generating sub-components; and controlling an operating state of each heat-generating sub-component based on the resource restriction ratio of each heat-generating sub-component.

[0130] As an example, in order to allocate the resource restriction of the first heat-generating component to multiple heat-generating sub-components, the resource restriction ratio of each heat-generating sub-component can be determined based on the resource restriction ratio of the first heat-generating component and a mapping table. The mapping table records the multiple resource restriction ratios corresponding to the first heat-generating component, and the resource restriction ratios of the multiple heat-generating sub-components corresponding to each resource restriction ratio in the multiple resource restriction ratios.

[0131] In this example, the first heat-generating device may refer to a device having multiple sub-devices, each of which may have separate functions, energy consumption performance, or performance characteristics. Control of the sub-devices may directly or indirectly affect the heat generation or energy consumption of the entire device.

[0132] In this example, the mapping table between the resource limitation ratio of the first heating device and the resource limitation ratios of multiple heating sub-devices of the first heating device may refer to a mapping table used to describe the relationship between the value of the resource limitation ratio of the first heating device and the value of the resource limitation ratio of each heating sub-device. Through this mapping table, the resource limitation ratio that each heating sub-device should obtain can be quickly determined according to the given value of the resource limitation ratio of the first heating device, thereby limiting the resources or working indicators of the heating sub-device.

[0133] In this example, the resource limit ratios of each heating sub-component are determined based on the resource limit ratio of the first heating component and a mapping table. The resource limit ratios of each heating sub-component can be queried in the mapping table based on the resource limit ratio value of the first heating component. The limit ratio values ​​of each heating sub-component can be directly obtained from the mapping table, or they can be inferred from the values ​​in the mapping table. Other methods of using mapping tables to obtain the resource limit ratios of heating sub-components are also conceivable.

[0134] In this example, for a first heat-generating device with multiple heat-generating sub-devices (e.g., a CPU with multiple clusters), the resource limit ratio of the heat-generating sub-devices can be selected in a way that maximizes performance while meeting the temperature limit. This problem can be formally defined as: max Cap = ∑ cap i st∑Δt i <T

[0135] Where cap i is the performance of sub-device i, Δt i is the temperature rise of sub-device i, and T is the temperature rise of the device.

[0136] In this example, in order to establish the relationship between the resource restriction ratio of the first heat-generating component and the resource restriction ratio of each heat-generating sub-component, a mapping table of the CPU restriction ratio and the optimal restriction ratio combination of the sub-component can be constructed, and the optimal sub-component restriction combination can be found according to the table.

[0137] FIG9 shows an example of resource restriction ratio allocation for heating sub-components in the surface temperature control method for electrical equipment according to this embodiment. As shown in FIG9 , a resource restriction ratio mapping table between the first heating component and each heating sub-component can be established based on the temperature-frequency characteristics and performance-frequency characteristics of each heating sub-component. FIG9 takes the CPU and the multiple clusters it contains as an example. When the CPU's temperature restriction ratio (i.e., the resource restriction ratio of the first heating component) is 0, the heating sub-components do not need to restrict resources, so the resource restriction ratios of cluster0, cluster1, and cluster2 are all 0. When the CPU's temperature restriction ratio is 5 (e.g., 5%), based on the characteristics of different heating sub-components, the resource restriction ratios of cluster0 and cluster1 are 5, and the resource restriction ratio of cluster2 is 0. When the CPU's temperature restriction ratio is 10, based on the characteristics of different heating sub-components, the resource restriction ratios of cluster0, cluster1, and cluster2 are all 10.

[0138] As an example, the electrical device may also include a cooling device for cooling a target component of the electrical device. To adjust the operating state of the electrical device based on the predicted temperature to control the surface temperature of the electrical device, a target cooling temperature for the target component can be determined based on the predicted temperature. The operating state of the cooling device can then be controlled based on the target cooling temperature to cool the target component to the target cooling temperature.

[0139] In this example, in order to lower the temperature of the target heat-generating device or component, in addition to adjusting the working state of the device and the consumed resources, the working state of the cooling device used to dissipate heat or cool the device can also be adjusted. When the temperature of the target device is too high and requires a higher intensity of cooling, the working state of the cooling device can be adjusted to high-intensity operation, thereby increasing the heat dissipation intensity, so that the target device has a larger temperature reduction range. When the temperature of the target device is low and only a smaller degree of cooling is required, the working state of the cooling device can be adjusted to low-intensity operation, thereby reducing the heat dissipation intensity, so that the target device has a smaller temperature reduction range.

[0140] Specifically, the surface temperature control method for electrical equipment according to this embodiment can be applied to PCs (personal computers) or notebook platforms. Unlike terminal platforms, the cooling devices on PCs and notebooks use active cooling, such as fans, while the cooling devices on terminal platforms use passive cooling, achieving temperature reduction by reducing device frequency. The technical solution for PC platforms can modify the cooling device portion from a thermal capacity model to a fan heat dissipation capacity model. On notebook platforms, the surface temperature in the embodiments of this application can be specifically defined as, for example, the temperature of the housing or keyboard.

[0141] Figure 10 shows a schematic block diagram of a method for controlling the surface temperature of an electrical device according to an embodiment of the present application. This embodiment differs from other embodiments in that the surface temperature of the electrical device is specifically the outer shell temperature (shell temperature), and an SOC overheat protection mechanism is provided.

[0142] According to this embodiment, the temperature sensor obtains the temperature value of the corresponding position based on the different hardware characteristics at different temperatures. The shell temperature prediction module uses a machine learning model to record historical temperatures and predict future shell temperatures. The shell temperature control module limits system resources based on the predicted shell temperature. The device heat source identification module obtains the device thermal capacitance parameters through testing, constructs a device thermal capacitance model, and counts the device frequency and other operating conditions in real time to calculate the heat generated by the device. The device heat source allocation module allocates resource limit ratios according to the heat generation ratio. The device cooling control module adjusts the working state of the heat-generating components to reduce heat generation. The SOC overheating protection module controls the device temperature of the electrical equipment based on the temperature obtained by directly measuring the SOC to prevent the SOC from overheating, avoids the deviation or hysteresis effect that may be caused by indirectly controlling the device temperature based on the shell temperature, and realizes dual protection of the SOC.

[0143] In this embodiment, the shell temperature prediction module obtains the required temperature data through the hardware temperature sensor, and after processing by subsequent modules, obtains the target operating state of the device, and finally adjusts the hardware to the corresponding operating state.

[0144] Based on the method embodiment shown in FIG2 , the present application also provides a device 1100 for controlling the surface temperature of an electrical device, a schematic diagram of which is shown in FIG11 . The device is used to perform each step shown in FIG2 .

[0145] According to this embodiment, the electrical equipment surface temperature control device includes an acquisition module 1110, a prediction module 1120, and an adjustment module 1130. The acquisition module 1110 is used to acquire the historical temperature of at least one heat-generating component located inside and / or outside the electrical equipment between a first moment and a second moment; the prediction module 1120 is used to use the historical temperature as input to a temperature prediction model and output a predicted temperature of the electrical equipment's external surface at a third moment after the first and second moments, wherein the temperature prediction model represents the relationship between the historical temperature and the predicted temperature; and the adjustment module 1130 is used to adjust the operating state of the electrical equipment based on the predicted temperature to control the external surface temperature of the electrical equipment.

[0146] It should be noted that the embodiment of FIG11 provides an electrical equipment surface temperature control device 1100, when executing the electrical equipment surface temperature control method, using only the division of the aforementioned functional modules as an example. In actual applications, the aforementioned functions can be assigned to different functional modules as needed, that is, the internal structure of the device can be divided into different functional modules to complete all or part of the functions described above. In addition, the electrical equipment surface temperature control device 1100 provided in the above embodiment and the method embodiment shown in FIG2 respectively share the same concept. The specific implementation process is detailed in the method embodiment and will not be repeated here.

[0147] Figure 12 shows a schematic diagram of the architecture of an electric device 1200 according to an embodiment of the present application. This embodiment differs from other embodiments in that the electric device is an electronic product, such as a computer, smartphone, or smartwatch, and includes software and hardware, including an operating system and application programs, and hardware including a CPU, GPU, and the like.

[0148] In the electric device 1200 of this embodiment, a product implementation form of the method for controlling the surface temperature of an electric device is given, which can be a program code contained in the operating system kernel and deployed on the hardware of the terminal device. As shown in Figure 12, the program code for executing the method for controlling the surface temperature of an electric device exists in the operating system kernel of the platform software. During operation, these program codes run in the host memory of the terminal device. Figure 12 shows the implementation form of the method for controlling the surface temperature of an electric device in the server and platform software. The thermal management module shown in the figure is a module modified in this embodiment based on the platform software. Inside the thermal management module, the electric device 1200 implements shell temperature prediction, shell temperature control, device heat source identification, device resource allocation and SOC overheating protection.

[0149] FIG13 shows a schematic diagram of the hardware structure of an electric device 1300 according to another embodiment of the present application.

[0150] 13 , an electric device 1300 includes a processor 1310, a memory 1320, a communication interface 1330, and a bus 1340. The processor 1310, the memory 1320, and the communication interface 1330 are connected to each other via the bus 1340. The processor 1310, the memory 1320, and the communication interface 1330 may also be connected using other connection methods besides the bus 1340.

[0151] Among them, the memory 1320 can be various types of storage media, such as random access memory (RAM), read-only memory (ROM), non-volatile RAM (NVRAM), programmable ROM (PROM), erasable PROM (EPROM), electrically erasable PROM (EEPROM), flash memory, optical storage, hard disk, etc.

[0152] Processor 1310 may be a general-purpose processor, which may be a processor that performs specific steps and / or operations by reading and executing content stored in a memory (e.g., memory 1320). For example, a general-purpose processor may be a CPU. Processor 1310 may include at least one circuit to execute all or part of the steps of the method for controlling the surface temperature of an electrical device provided in the embodiment shown in FIG2 .

[0153] The communication interface 1330 includes input / output (I / O) interfaces, physical interfaces, and logical interfaces, etc., for interconnecting components within the power-consuming device 1300, as well as interfaces for interconnecting the power-consuming device 1300 with other devices (e.g., other power-consuming devices or user devices). Physical interfaces may include Ethernet interfaces, fiber optic interfaces, ATM interfaces, etc. The communication interface 1330 can be connected to external input and output devices. For example, the input device may be a microphone or microphone array for capturing voice input signals; a communication network connector for receiving collected input signals from the cloud or other devices; or a keyboard, mouse, etc. The output device can output various information to the outside, including determined distance information, direction information, etc. The output device may include, for example, a display, a speaker, a printer, a communication network, and remote output devices connected thereto.

[0154] The bus 1340 may be any type of communication bus for interconnecting the processor 1310 , the memory 1320 , and the communication interface 1330 , such as a system bus.

[0155] The above-mentioned devices can be provided on separate chips, or at least partially or entirely on the same chip. Whether to provide each device independently on different chips or to integrate them on one or more chips often depends on the product design requirements. The embodiments of this application do not limit the specific implementation of the above-mentioned devices.

[0156] The electric device 1300 shown in FIG13 is merely exemplary. During implementation, the electric device 1300 may further include other components, which are not listed one by one herein.

[0157] An embodiment of the present application may also be a computer-readable storage medium having computer program instructions stored thereon, which, when executed by a processor, causes the processor to execute the steps of the method for controlling the surface temperature of electrical equipment according to various embodiments of the present application described above in this specification.

[0158] The computer-readable storage medium can adopt any combination of one or more readable media. The readable medium can be a readable signal medium or a readable storage medium. The readable storage medium can, for example, include but is not limited to a system, device or component of electricity, magnetism, light, electromagnetic, infrared, or semiconductor, or any combination thereof. More specific examples (non-exhaustive list) of readable storage media include: an electrical connection with one or more wires, a portable disk, a hard disk, a random access memory (RAM), a read-only memory (ROM), an erasable programmable read-only memory (EPROM or flash memory), an optical fiber, a portable compact disk read-only memory (CD-ROM), an optical storage device, a magnetic storage device, or any suitable combination thereof.

[0159] Embodiments of the present application also provide a chip system. The chip system includes a processor coupled to a memory, and the processor executes a computer program stored in the memory to implement the steps of any of the methods for controlling the surface temperature of an electrical device described herein. The chip system can be a single chip or a chip module composed of multiple chips.

[0160] The concepts, principles, and ideas of the present application are described in detail above in conjunction with specific implementation methods (including embodiments and examples). Those skilled in the art should understand that the implementation methods of the present application are more than the several forms given above. After reading this application document, those skilled in the art can make any possible improvements, replacements, and equivalent forms to the steps, methods, devices, and components in the above-mentioned implementation methods, and these improvements, replacements, and equivalent forms should be deemed to fall within the scope of the present application. The scope of protection of this application shall be subject only to the claims.

Claims

1. A method for controlling the surface temperature of electrical equipment, characterized in that: The method comprises: Acquire a historical temperature of at least one heat-generating component located inside and / or outside the electrical device between a first moment and a second moment; Using the historical temperature as an input of a temperature prediction model, outputting a predicted temperature of the external surface of the electrical equipment at a third moment after the first moment and the second moment, wherein the temperature prediction model characterizes a relationship between the historical temperature and the predicted temperature; According to the predicted temperature, the working state of the electrical equipment is adjusted to control the external surface temperature of the electrical equipment.

2. The method according to claim 1, characterized in that The step of adjusting the working state of the electrical equipment according to the predicted temperature includes: Determine the calorific value of each heat-generating component according to the working state of each heat-generating component in the at least one heat-generating component and a heat capacity model, wherein the heat capacity model represents a mapping relationship between the working state of the heat-generating component and the calorific value; Determine a resource restriction ratio of each heat-generating component according to the predicted temperature and the heat generation of each heat-generating component, wherein the resource restriction ratio indicates a reduction ratio of one or more of power consumption, voltage, frequency, and load of the heat-generating component; According to the resource limit ratio, the working state of each heat generating component is controlled.

3. The method according to claim 2, characterized in that The at least one heat-generating component includes a first heat-generating component, the first heat-generating component includes a plurality of heat-generating subcomponents, and the method further includes: With the goal of maximizing the performance of the first heat-generating component, allocating the resource limit ratio of the first heat-generating component to the multiple heat-generating sub-components to determine the resource limit ratio of each heat-generating sub-component in the multiple heat-generating sub-components; Based on the resource limit ratio of each heat generating subcomponent, the working state of each heat generating subcomponent is controlled.

4. The method according to claim 3, characterized in that: The allocating the resource limit of the first heat generating component to the plurality of heat generating sub-components comprises: Based on the resource limitation ratio of the first heat-generating component and a mapping table, the resource limitation ratios of the various heat-generating sub-components are determined. The mapping table records a plurality of resource limitation ratios corresponding to the first heat-generating component, and the resource limitation ratios of the plurality of heat-generating sub-components corresponding to each of the plurality of resource limitation ratios.

5. The method according to claim 2, characterized in that: The determining the resource limit ratio of each heat generating component according to the predicted temperature and the heat generated by each heat generating component includes: Determining a resource restriction ratio of the electrical equipment according to the predicted temperature; According to the heat generation of each heat-generating component, the resource limit ratio of the electric device is allocated to the plurality of heat-generating components to obtain the resource limit ratio of each heat-generating component.

6. The method according to any one of claims 1 to 5, characterized in that The working status includes one or more of power consumption, voltage, frequency and load.

7. The method according to any one of claims 1 to 5, characterized in that The at least one heat generating component includes one or more of a system-level chip, a modem, a housing of an electric device, and a battery.

8. The method according to any one of claims 1 to 5, characterized in that The historical temperature of the at least one heat-generating component is directly measured by a temperature sensor; or, the historical temperature of the at least one heat-generating component is calculated by temperatures of other reference positions, and the temperatures of the other reference positions include temperatures of other components or structures of the electrical equipment except the at least one heat-generating component.

9. The method according to any one of claims 1 to 5, characterized in that The power-consuming device includes a central processing unit, a graphics processing unit and a double-speed memory, and the input also includes one or more of the load information of the central processing unit, the load information of the graphics processing unit and the load information of the double-speed memory.

10. The method according to any one of claims 1 to 5, characterized in that The electrical device further includes a cooling device for cooling a target device of the electrical device, and adjusting the working state of the electrical device according to the predicted temperature to control the surface temperature of the electrical device includes: Determining a cooling target temperature of the target device according to the predicted temperature; According to the cooling target temperature, the working state of the cooling device is controlled to cool the target device to the cooling target temperature.

11. A surface temperature control device for electrical equipment, characterized in that: The device comprises: An acquisition module, used to acquire a historical temperature of at least one heat-generating component located inside and / or outside the electrical device between a first moment and a second moment; a prediction module, configured to use the historical temperature as an input of a temperature prediction model, and output a predicted temperature of the external surface of the electrical equipment at a third moment after the first moment and the second moment, wherein the temperature prediction model characterizes a relationship between the historical temperature and the predicted temperature; The adjustment module is used to adjust the working state of the electrical device according to the predicted temperature to control the external surface temperature of the electrical device.

12. The device according to claim 11, characterized in that The adjustment module is further configured to: Determine the calorific value of each heat-generating component according to the working state of each heat-generating component in the at least one heat-generating component and a heat capacity model, wherein the heat capacity model represents a mapping relationship between the working state of the heat-generating component and the calorific value; Determine a resource restriction ratio of each heat-generating component according to the predicted temperature and the heat generation of each heat-generating component, wherein the resource restriction ratio indicates a reduction ratio of one or more of power consumption, voltage, frequency, and load of the heat-generating component; According to the resource limit ratio, the working state of each heat generating component is controlled.

13. The device according to claim 12, characterized in that The at least one heat generating component includes a first heat generating component, the first heat generating component includes a plurality of heat generating sub-components, and the device further includes: an allocation module, configured to allocate the resource limit ratio of the first heat-generating component to the plurality of heat-generating subcomponents with the goal of maximizing the performance of the first heat-generating component, so as to determine the resource limit ratio of each heat-generating subcomponent in the plurality of heat-generating subcomponents; The control module is used to control the working state of each heat generating sub-component based on the resource limit ratio of each heat generating sub-component.

14. The device according to claim 13, characterized in that The allocation module is further configured to: Based on the resource limitation ratio of the first heat-generating component and a mapping table, the resource limitation ratios of the various heat-generating sub-components are determined. The mapping table records a plurality of resource limitation ratios corresponding to the first heat-generating component, and the resource limitation ratios of the plurality of heat-generating sub-components corresponding to each of the plurality of resource limitation ratios.

15. The device according to claim 12, characterized in that The adjustment module is further configured to: Determining a resource restriction ratio of the electrical equipment according to the predicted temperature; According to the heat generation of each heat-generating component, the resource limit ratio of the electric device is allocated to the plurality of heat-generating components to obtain the resource limit ratio of each heat-generating component.

16. The device according to any one of claims 11 to 15, characterized in that The working status includes one or more of power consumption, voltage, frequency and load.

17. The device according to any one of claims 11 to 15, characterized in that The at least one heat generating component includes one or more of a system-level chip, a modem, a housing of an electric device, and a battery.

18. The device according to any one of claims 11 to 15, characterized in that The historical temperature of the at least one heat-generating component is directly measured by a temperature sensor; or, the historical temperature of the at least one heat-generating component is calculated by temperatures of other reference positions, and the temperatures of the other reference positions include temperatures of other components or structures of the electrical equipment except the at least one heat-generating component.

19. The device according to any one of claims 11 to 15, characterized in that The power-consuming device includes a central processing unit, a graphics processing unit and a double-speed memory, and the input also includes one or more of the load information of the central processing unit, the load information of the graphics processing unit and the load information of the double-speed memory.

20. The device according to any one of claims 11 to 15, characterized in that The electrical device further includes a cooling device for cooling a target device of the electrical device, and the adjustment module is further configured to: Determining a cooling target temperature of the target device according to the predicted temperature; According to the cooling target temperature, the working state of the cooling device is controlled to cool the target device to the cooling target temperature.

21. An electrical equipment, characterized in that: The electrical equipment comprises a processor and a memory, and the processor is used to execute a computer program stored in the memory to implement the surface temperature control method of the electrical equipment according to any one of claims 1 to 10.

22. A computer-readable storage medium, characterized in that: The computer-readable storage medium stores a computer program, and the computer program is used to execute the surface temperature control method of an electrical equipment according to any one of claims 1 to 10.

23. A chip system, characterized in that: The chip system includes a processor, which is coupled to a memory. The processor executes a computer program stored in the memory to implement the steps of the method for controlling the surface temperature of an electrical equipment according to any one of claims 1 to 10.

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