Decoating of uneven substrates

Abstract

The invention relates to the removal of an edge region (14, 14') of a working layer (12, 12') arranged on an uneven substrate (10) with the aid of a decoating device (100). The decoating device (100) has a decoating unit (20), a working plane movement unit (30) and a distance adjustment unit (50). The decoating unit (20) is designed to remove the edge region (14, 14') and has a decoating outlet (22, 22') designed to be arranged opposite the working layer (12, 12'). The working plane movement unit (30) is designed to move the decoating unit (20) in a working plane (40) over the edge region (14, 14'). The distance adjustment unit (50) is designed to keep deviations from a predetermined distance between the decoating outlet (22) of the decoating unit (20) and a surface (16) of the edge region (14) in a distance direction (z) perpendicular to the working plane (40) within a predetermined deviation value when moving the decoating unit (20) in the working plane (40) over the edge region (14, 14'). This enables improved removal of the edge region of a working layer on an uneven substrate.

Description

[0001] Decoating uneven substrates

[0002] FIELD OF THE INVENTION

[0003] The invention relates to the decoating of uneven, particularly curved, substrates. A decoating device and a method are provided for removing an edge region of a working layer from uneven, particularly curved, substrates.

[0004] STATE OF THE ART

[0005] US 2006 / 0003591 A1 describes a method for removing an edge bead on a wafer. The method comprises providing a wafer with a layer, coating the layer with a photoresist, rotating the wafer, and removing an edge bead from the wafer by removing a hump portion of the edge bead in a first step and an edge portion of the edge bead in a second step.

[0006] DESCRIPTION OF THE INVENTION

[0007] It can be seen as an object of the invention to provide a decoating device, a decoating module, a decoating system, a substrate processing system, and a method for removing an edge region of a working layer arranged on an uneven substrate, which make it possible to better remove an edge region of a working layer arranged on an uneven substrate, in particular a curved substrate.

[0008] According to a first aspect of the invention, a decoating device is provided for removing an edge region of a working layer arranged on an uneven substrate. The decoating device comprises a decoating unit, a working plane movement unit, and a distance adjustment unit. The decoating unit is designed to remove the edge region and has a decoating outlet. The decoating outlet is designed to be arranged opposite the working layer. The working plane movement unit is designed to move the decoating unit in a working plane over the edge region.The distance adjustment unit is designed to keep deviations from a predetermined distance between the decoating outlet of the decoating unit and a surface of the edge region in a distance direction perpendicular to the working plane when the decoating unit is moved in the working plane over the edge region within a predetermined deviation value. Since a distance adjustment unit is provided which is designed to keep the deviations from the predetermined distance between the decoating outlet of the decoating unit and the surface of the edge region in the distance direction when the decoating unit is moved in the working plane over the edge region within a predetermined deviation value, a collision of the decoating unit with the substrate can be avoided and an edge region of the working layer can be removed with improved precision on an uneven substrate.Because a virtually constant distance can be maintained between the decoating outlet and the surface of the edge area, a virtually straight edge can be created at the transition from the removed edge area to the working layer. This makes it possible to reduce edge effects that can occur more frequently with an uneven, particularly wavy edge. A wavy edge occurs particularly in cases where the distance between the decoating outlet and the surface of the edge area fluctuates and the removed area depends on the distance between the decoating outlet and the surface of the edge area. This is the case, for example, if the decoating outlet is not arranged perpendicular to the surface of the edge area, but at an angle to the surface, e.g. at a 45° angle, and / or the decoating outlet has a conical output volume so that a larger area is removed with a greater distance and a smaller area with a smaller distance.

[0009] The distance between the decoating outlet of the decoating unit and the surface of the edge region in the distance direction perpendicular to the working plane can, for example, be the shortest distance in the perpendicular direction between a point of the decoating outlet closest to the surface, in particular its distal end, and the surface of the edge region. However, the distance can also be the distance of any other point of the decoating outlet from the surface of the edge region in the perpendicular direction.

[0010] The decoating outlet can be designed to apply a decoating agent, e.g. a solvent medium or an etching medium, to the edge region in order to remove the edge region. The decoating outlet can be an outlet of a nozzle, for example. The decoating outlet can be designed to apply the decoating agent to an area of ​​the edge region that depends on the distance of the decoating outlet to the surface of the edge region in the vertical direction. This makes it possible to remove an area of ​​different sizes depending on the distance of the decoating outlet from the surface of the edge region. The decoating outlet can, for example, be designed to create a conical output volume, so that a larger area is removed with a greater distance and a smaller area with a smaller distance.Alternatively or additionally, the decoating outlet can be arranged perpendicular to the surface of the edge region or at an angle to the surface of the edge region, for example, at an angle between 5° and 85° to the surface of the edge region, in particular at an angle of 45° to the surface of the edge region. This allows the decoating agent to be applied from the decoating outlet to the surface of the edge region at an angle and thus to remove different sized areas of the edge region depending on the distance between the decoating outlet and the surface of the edge region.

[0011] The distance adjustment unit can be designed to keep the deviations from the predetermined distance during the movement of the decoating unit in the working plane over the edge region, for example, within a predetermined deviation value of 6 mm or less, preferably 3 mm or less. The predetermined distance can be a fixed distance between the decoating outlet of the decoating unit and the surface of the edge region in the distance direction, for example, an optimal distance of the decoating outlet of the decoating unit from the surface of the edge region in the distance direction for processing the edge region. The predetermined distance can also differ along the edge region, for example, be variable depending on a predetermined height profile. This can make it possible to remove an edge region based on a height profile.The height profile can, for example, be a measured height profile of the working layer on the substrate or of the uneven substrate. The height profile of the working layer or of the uneven substrate can, for example, be measured in advance or during removal of the edge region. Alternatively, the height profile can also be a predefined height profile that creates predetermined structures on the edge region or at the transition between the removed edge region and the working layer. In addition, the predefined height profile can take into account the height profile of the working layer and / or the uneven substrate.

[0012] The substrate can, for example, be a square substrate. A square substrate is a substrate that is not completely round. In other words, a square substrate is a substrate that has long sides that are connected to each other via a corner. One, several, or all corners of the square substrate can be rounded. The square substrate can, for example, be rectangular or square.

[0013] The decoating unit can be or have a decoating head with one or more nozzles. In this case, the decoating outlet is the outlet of the nozzle or one of the multiple nozzles. Multiple decoating outlets can also be provided, each on different nozzles. The nozzles can be designed to apply a solvent or etching medium to the working layer on the substrate in order to remove parts of the working layer, in particular the edge region. The decoating unit can also have multiple decoating heads, for example two decoating heads. The decoating heads can be arranged on opposite longitudinal sides of the substrate in the working plane. Each of the decoating heads can have one or more nozzles.A higher number of nozzles allows for increased processing speed and greater flexibility in the material to be removed, as the nozzles can be supplied with different media.

[0014] The uneven substrate can be a curved substrate, in particular a substrate that is curved along one or more directions or in one or more planes. For example, an edge of the substrate can have a convex contour along a section perpendicular to the working plane. Alternatively or additionally, the uneven substrate can have a surface that is not smooth or flat, i.e., one or more elevations and / or depressions can be located on the surface. The substrate can also have structures, for example circuits, that are arranged underneath the working layer on the substrate. In this case, the structures are to be understood as part of the substrate and are to be distinguished from the working layer. The substrate and the working layer are formed from different materials. The substrate can be formed from glass, for example. The substrate can, for example, have a substrate thickness of between 100 μm and 1 cm, e.g.B. between 200 pm and 6 mm, in particular between 200 pm and 3.5 mm. For example, for a curved substrate, the substrate thickness can be essentially constant, i.e. have a constant substrate thickness whose value deviates by only a few pm along the substrate. A deepest point of the uneven substrate can, for example, have a height difference to a highest point of the uneven substrate of between 100 pm and 2 cm, preferably between 1 mm and 15 mm, in particular between 1 mm and 6 mm. For example, for a curved substrate, the height difference can be generated by the curvature.

[0015] The work plane movement unit can have one or more linear travel systems. The linear travel systems can be aligned orthogonally to one another. For example, the work plane movement unit can have two linear travel systems arranged orthogonally to one another in the work plane. The linear travel systems can, for example, each be designed in the form of a linear axis (linear stage) and be configured to move the decoating unit linearly in one direction in the work plane. This enables the decoating unit to move in the work plane. The edge region can, for example, be between more than 0 mm and 20 mm, in particular between 100 pm and 1 mm.

[0016] The distance adjustment unit can comprise a distance sensor and a distance direction movement unit. The distance sensor can be configured to determine a distance between the decoating outlet of the decoating unit and the surface of the edge region in the distance direction. The distance direction movement unit can be configured to move the uneven substrate and the decoating outlet of the decoating unit relative to one another in the distance direction based on the distance determined by the distance sensor. This makes it possible to keep deviations from the predetermined distance between the decoating outlet of the decoating unit and the surface of the edge region in the distance direction within the predetermined deviation value while the decoating unit is moved over the edge region in the working plane.

[0017] The distance direction moving unit may be configured to move the uneven substrate and the stripping outlet of the stripping unit relative to each other in the distance direction to the predetermined distance based on the distance determined by the distance sensor.

[0018] The distance-direction movement unit can be a linear movement system, for example in the form of a linear axis (linear stage), which is designed to move the substrate and / or the decoating unit linearly in the distance direction. By moving the decoating unit, the decoating outlet is also moved relative to the substrate in the distance direction. Multiple distance sensors can also be provided, for example, each on a decoating unit. Multiple distance-direction movement units can also be provided, for example, one on each decoating unit or several on each decoating unit.This makes it possible to keep deviations from the predetermined distance between the decoating outlet of the respective decoating unit and the surface of the edge region within the predetermined deviation value in the distance direction while the respective decoating unit is moved over the edge region in the working plane. If a decoating unit has multiple distance sensors and distance direction movement units, deviations from the predetermined distance between multiple decoating outlets of the respective decoating unit and the surface of the edge region, in particular on the top and bottom sides, can also be kept within the predetermined deviation value in the distance direction while the respective decoating unit is moved over the edge region in the working plane.

[0019] The distance sensor can be designed to determine the distance between the decoating outlet of the decoating unit and the surface of the edge region based on a distance measurement, for example a time-of-flight measurement or based on a chromatic aberration measurement. The distance sensor can be, for example, a confocal-chromatic sensor designed to determine the distance based on a chromatic aberration measurement. The distance sensor can have a signal transmitter and a signal receiver. The signal transmitter can be arranged at a specific distance from the decoating outlet of the decoating unit and can be designed to send a signal in the distance direction to the surface of the edge region. The signal can be reflected at the surface of the edge region and the signal receiver can be designed to receive the reflected signal.The distance sensor can have a time-of-flight meter configured to determine a distance between the decoating output of the decoating unit and the surface of the edge region based on the signal's time-of-flight. The distance sensor can be configured to generate a control signal based on the determined distance. The control signal can be transmitted to the distance adjustment unit so that the latter can control the distance adjustment unit to keep the deviations from the predetermined distance between the decoating output of the decoating unit and the surface of the edge region in the distance direction within the predetermined deviation value. For example, the decoating output of the decoating unit or the substrate can be moved in the distance direction based on the control signal.

[0020] The distance sensor can have a control unit configured to generate the control signal. The control unit can contain the transit time meter. The transit time meter can be a physical unit or implemented as software. The control signals can, for example, control stepper motors, linear motors, or other drives of the distance direction movement unit in order to adjust the distance between the decoating outlet of the decoating unit and the surface of the edge region in the distance direction and thus keep the deviations from the predetermined distance between the decoating outlet of the decoating unit and the surface of the edge region in the distance direction when moving the decoating unit in the working plane over the edge region within the predetermined deviation value.

[0021] The decoating device can have a holding unit. The holding unit can be configured to hold the substrate. Alternatively or additionally, the holding unit can be configured to rotate the substrate relative to the decoating unit. The holding unit can be configured to rotate about an axis of rotation extending perpendicular to the working plane in order to rotate the substrate relative to the decoating unit. This can make it possible to remove the edge region of different longitudinal sides of the uneven substrate using a decoating head.

[0022] The holding unit may be included in the distance adjustment unit or be part of the distance adjustment unit.

[0023] The holding unit can have one or more holders. The holder(s) can be designed to hold the uneven substrate without contact. The holder(s) can be, for example, air cushion holders or gas cushion holders. Alternatively, the holder(s) can also hold the substrate firmly, for example by sucking the substrate in. One or more gas cushion holders and one or more holders that suck the substrate in can also be provided. The holding unit can, for example, have four holders. The four holders can be arranged in a specific shape relative to one another, for example aligned in the shape of a circle or square, in order to hold the uneven substrate.

[0024] The holding unit can have at least two holders that are designed to hold a respective region of the underside of the uneven substrate. The holders can be arranged such that an unevenness of the substrate is reduced. This makes it possible to reduce the unevenness of the substrate so that deviations from the predetermined distance between the decoating outlet of the decoating unit and the surface of the edge region in the distance direction when moving the decoating unit in the working plane over the edge region can be kept within the predetermined deviation value. For example, the holders can be arranged along the curvature of a curved substrate such that the curvature is reduced or eliminated.

[0025] The holders can each have a suction unit to pull the underside of the substrate toward the holder, thus further reducing the substrate's unevenness. The suction unit can, for example, be configured to use the Bemoulli effect to suck in the substrate by creating a vacuum using a gas flow.

[0026] The holding unit can have a movable holder. The movable holder can be configured to hold the uneven substrate. The distance adjustment unit can be configured to move the movable holder in a holding plane parallel to the working plane, parallel to the decoating unit, so that the movable holder is at a constant distance from the decoating outlet of the decoating unit in the distance direction.Since the uneven substrate is held by the movable holder and the distance between the movable holder and the decoating outlet of the decoating unit is kept constant in the distance direction during the movement, deviations from the predetermined distance between the decoating outlet of the decoating unit and the surface of the edge region of a curved substrate with a substantially constant substrate thickness in the distance direction when the decoating unit is moved in the working plane over the edge region can be kept within the predetermined deviation value.

[0027] The movable holder can be designed to hold the uneven, particularly curved, substrate without contact. For this purpose, the movable holder can be, for example, an air cushion holder or a gas cushion holder.

[0028] The decoating unit can be configured to simultaneously remove the edge region on a top side and another edge region on a bottom side of the working layer. This enables faster and more complete removal of the edge region. Since the deviations from the predetermined distance between the decoating outlet of the decoating unit and the surface of the edge region in the distance direction are kept within a predetermined deviation value when moving the decoating unit in the working plane over the edge region, a collision of the decoating unit with the substrate can be avoided.

[0029] The decoating unit can have a top-side decoating head opposite the top side of the working layer and a bottom-side decoating head opposite the underside of the working layer. Alternatively, only one decoating head can be provided for the top side and the bottom side, which is designed to remove the edge regions on the top side and the bottom side in parallel. The bottom-side decoating head can be arranged during operation of the decoating device such that the substrate is located between the top-side decoating head and the bottom-side decoating head. The top-side decoating head and the bottom-side decoating head can have an identical number and configuration of nozzles. Alternatively, they can also have a different number and / or configuration of nozzles.Depending on the configuration of a nozzle, it can be operated at different pressures, for example between 0.5 bar and 10 bar, and in particular between 0.5 bar and 2 bar. Using a higher pressure can enable improved decoating, but can also increase nozzle wear. Depending on the configuration of the nozzle, it can be supplied with a different solvent or etching medium in addition to or alternatively. Depending on the configuration of the nozzle, it can be suitable for various solvent or etching media, for example, it can be chemical-resistant. This makes it possible to remove edge areas formed by different materials. The solvent or etching medium can be or contain, for example, sodium persulfate, sulfuric acid (H2SO4), carbon tetrabromoethane, hydrogen peroxide (H2O2) or nitrogen (N2).

[0030] The decoating device can have one or more rinsing nozzles. The rinsing nozzle(s) can be contained in the decoating unit or be part of the decoating unit. The rinsing nozzles can be designed to apply a rinsing medium to the edge region to be removed in order to rinse it, especially any dissolved material. The rinsing medium can be, for example, deionized (DI) water or an alcohol, especially isopropanol.

[0031] The decoating device can have one or more suction units designed to extract the dissolving and / or etching medium together with the removed material. This makes it possible to reduce or prevent contamination of the decoating device, the substrate, and the working layer. For example, when spraying etching and dissolving medium onto the edge region of the working layer, droplets, such as microsplashes, of the etching and dissolving medium can splash from the edge region into its surroundings, e.g., onto the substrate or the working layer. By extracting the droplets while they are in flight, contamination of the substrate and the working layer can be prevented.Adjusting the pressure and suction strength provided by the suction unit(s) makes it possible to ensure that no residual material, such as solvent or etching medium, remains on the surface at the edge of the substrate after the working layer has been removed.

[0032] The decoating unit can be designed to remove an edge region of the working layer containing Ajinomoto Build-up Film (ABF), copper (Cu), or titanium (Ti). The edge region can contain a predetermined percentage, preferably more than 50%, of ABF, Cu, or Ti, or can be formed from one or more of these. The edge region can also be formed from another material or contain another material, for example a metal. Depending on the material to be removed, the decoating unit can contain a different number and / or configuration of nozzles. The solvent or etching medium and / or the pressure can be tailored to the material or materials to be removed. This enables optimized removal of edge regions of different materials.

[0033] According to a further aspect of the invention, a decoating module is provided with a decoating device according to at least one of claims 1 to 7 or any embodiment of the decoating device. The decoating module additionally contains at least one media reservoir. The media reservoir is configured to contain one or more solvent media, one or more etching media, or one or more solvent media and one or more etching media, and to supply the decoating unit of the decoating device with the media.

[0034] According to a further aspect of the invention, a decoating system is provided with one or more decoating modules according to claim 8 or any embodiment of the decoating module. The decoating system additionally includes a substrate transfer system for transferring the uneven substrate. The substrate transfer system can be configured to transfer uneven substrates between different modules, for example, decoating modules.

[0035] According to a further aspect of the invention, a substrate processing system with one or more decoating systems according to claim 9 or any embodiment of the decoating system is provided. The substrate processing system additionally contains at least one functional module for processing the uneven substrate. The substrate processing system can, for example, be designed to process an uneven substrate in the form of a curved wafer, in particular a curved glass wafer. The glass wafer can, for example, be a rounded, angular glass wafer. The substrate processing system can, for example, contain a plurality of functional modules, such as a spin coater, a chemical development unit, one or more ovens, an exposure unit, or the like, for processing the uneven substrate.

[0036] According to a further aspect of the invention, a method for removing an edge region of a working layer arranged on an uneven substrate is provided. The method comprises the steps:

[0037] Moving a decoating unit in a working plane with a decoating outlet arranged opposite the working layer over the edge area and

[0038] Removing the edge region, wherein deviations from a predetermined distance between the decoating outlet of the decoating unit and a surface of the edge region in a distance direction perpendicular to the working plane are kept within a predetermined deviation value when the decoating unit is moved in the working plane over the edge region. Since deviations from the predetermined distance between the decoating outlet of the decoating unit and the surface of the edge region in the distance direction are kept within the predetermined deviation value when the decoating unit is moved in the working plane over the edge region, the edge region can be removed with improved precision on the uneven substrate, thus enabling complete removal of the edge region of the working layer from the substrate.

[0039] The method may comprise one or more of the following steps:

[0040] Providing the decoating unit, which is designed to remove the edge region and has the decoating output,

[0041] Providing a working plane movement unit which is designed to move the decoating unit in the working plane over the edge area,

[0042] Providing a distance adjustment unit which is designed to keep deviations from the predetermined distance between the decoating outlet of the decoating unit and the surface of the edge region in the distance direction when moving the decoating unit in the working plane over the edge region within the predetermined deviation value,

[0043] Providing a distance sensor which is designed to determine the distance between the decoating outlet of the decoating unit and the surface of the edge region in the distance direction,

[0044] Providing a distance-direction movement unit configured to move the uneven substrate and the stripping exit of the stripping unit relative to each other in the distance direction based on the distance determined by the distance sensor. Several or all steps can be performed in a reasonable order or in parallel. Some steps can also be performed in parallel and in series with one or more other steps.

[0045] The method may comprise one or more of the following steps:

[0046] Measuring a distance between the decoating outlet of the decoating unit and the surface of the edge area in the distance direction perpendicular to the working plane,

[0047] Moving the uneven substrate and the decoating outlet of the decoating unit relative to each other in the distance direction based on the distance between the decoating outlet of the decoating unit and the surface of the edge region determined by the distance sensor, in order to keep deviations from the predetermined distance between the decoating outlet of the decoating unit and the surface of the edge region in the distance direction perpendicular to the working plane when moving the decoating unit in the working plane over the edge region within the predetermined deviation value,

[0048] Holding the uneven substrate,

[0049] Rotating the uneven substrate relative to the decoating unit, holding the uneven substrate at at least two areas of the underside of the uneven substrate so that unevenness of the substrate is reduced,

[0050] Moving a movable holder in a holding plane parallel to the working plane parallel to the decoating unit while the movable holder holds the uneven substrate, so that the movable holder is at a constant distance from the decoating outlet of the decoating unit in the distance direction,

[0051] Simultaneous removal of the edge region on an upper side and another edge region on an underside of the working layer, providing a solvent or etching medium adapted to a material of the edge region for removing the edge region.

[0052] Removal of an edge region of the working layer containing ABF, Cu or Ti.

[0053] According to a further aspect of the invention, a use of the decoating device according to at least one of claims 1 to 7 or any embodiment of the decoating device is provided for: the removal of an edge region, and / or the removal of an edge region of a metallic layer or a lacquer, and / or the removal of an edge region of a working layer on a rectangular substrate, and / or the removal of an edge region of a working layer on a wafer.

[0054] According to a further aspect of the invention, a use of the method according to claim 11 or 12 or any embodiment of the method is provided for: the removal of an edge region, and / or the removal of an edge region of a metallic layer or a resist, and / or the removal of an edge region of a working layer on a rectangular substrate, and / or the removal of an edge region of a working layer on a wafer.

[0055] According to a further aspect of the invention, a computer program product is provided for removing an edge region of a working layer arranged on an uneven substrate. The computer program product contains computer program code means that cause a processor to execute the method according to claim 11 or 12 or any embodiment of the method when the computer program product is executed on the processor.

[0056] According to a further aspect, a computer-readable medium is provided that stores the computer program product for removing an edge region of a working layer arranged on an uneven substrate. Alternatively, or additionally, the computer-readable medium may store the computer program product according to one or more embodiments of the computer program product.

[0057] The stripping device according to claim 1, the stripping module according to claim 8, the stripping system according to claim 9, the substrate processing system according to claim 10, the method according to claim 11, the use according to claim 13, the use according to claim 14, and the computer program product according to claim 15, as well as the computer-readable medium, may have similar and / or identical preferred embodiments, as defined in particular in the dependent claims.

[0058] Furthermore, a preferred embodiment of the invention may also be any combination of the features of the dependent claims or the aforementioned embodiments in conjunction with the corresponding independent claim.

[0059] These and other aspects of the invention are explained in more detail below with reference to embodiments shown in the figures.

[0060] SHORT DESCRIPTION OF THE CHARACTERS

[0061] In the following figures shows:

[0062] Fig. 1 shows schematically and exemplarily an exemplary curved substrate with a working layer of Cu on the top and bottom sides;

[0063] Fig. 2 shows schematically and exemplarily a first embodiment of the decoating device in the xz plane;

[0064] Fig. 3 shows schematically and exemplarily the first embodiment of the decoating device in the yz plane;

[0065] Fig. 4 shows schematically and exemplarily a second embodiment of the decoating device in the xy plane;

[0066] Fig. 5 shows schematically and exemplarily a third embodiment of the decoating device in the xz plane;

[0067] Fig. 6 shows schematically and exemplarily a fourth embodiment of the decoating device in the xz plane;

[0068] Fig. 7 shows schematically and exemplarily a fifth embodiment of the decoating device in the xz plane;

[0069] Fig. 8 shows schematically and exemplarily a sixth embodiment of the decoating device in the xy plane;

[0070] Fig. 9 shows schematically and exemplarily a seventh embodiment of the decoating device in the xy plane;

[0071] Fig. 10 schematically and exemplarily shows an embodiment of the substrate processing system with a functional module, a substrate transfer system and decoating systems containing decoating modules and decoating devices;

[0072] Fig. 11 is an exemplary diagram of an embodiment of a method for removing an edge region of a working layer arranged on an uneven substrate. DESCRIPTION OF THE EMBODIMENTS

[0073] Fig. 1 shows a curved substrate 10 in a section in the xz plane. The substrate 10 has a working layer 12 made of Cu with an edge region 14 to be removed on the top side 18 and a working layer 12' made of Cu with an edge region 14' to be removed on the bottom side 18'. In this embodiment, the substrate is a rectangular glass wafer. In other embodiments, the substrate can also have a different shape and / or be made of a different material or materials. In other embodiments, the working layers can be made of different materials, for example the working layer on the top side of the substrate can be made of a different material than the working layer on the bottom side of the substrate. The working layers can also be made of multiple materials.

[0074] The following Figures 2 to 9 show different exemplary embodiments of a stripping device 100 for removing the edge region 14 and / or 14' of the working layer 12 and / or 12' arranged on the uneven substrate 10. The stripping device 100 can be used, for example, to remove the edge region 14 and / or 14' of a working layer in the form of a metallic layer or a lacquer, which is arranged, for example, on a rectangular substrate, in particular a rectangular glass wafer. Parts, components, or units of the different exemplary embodiments of the stripping device 100 with essentially the same function are provided with identical reference numerals. For reasons of clarity, some parts of the various exemplary embodiments have not been identified with reference numerals.

[0075] Fig. 2 shows a schematic sectional view of a first embodiment of the decoating device 100 in the xz plane, and Fig. 3 shows the first embodiment of the decoating device 100 in the yz plane. The decoating device 100 includes a decoating unit 20, a work plane movement unit 30, and a distance adjustment unit 50. In this embodiment, the decoating device 100 additionally includes a control unit 500. In other embodiments, the decoating device can also be connected to a control unit that controls the decoating device. The control unit can be a computer, for example.

[0076] The decoating unit 20 serves to remove the edge region 14 and the edge region 14'. In this exemplary embodiment, the decoating unit 20 contains two decoating outlets 22 and 22', which are each arranged opposite the working layer 12 and 12' and form the respective end of a nozzle 24 and 24'. The nozzles 24 and 24' are supplied with a dissolving or etching medium from a respective media reservoir (not shown). The nozzle 24 sprays the dissolving or etching medium from its decoating outlet 22 at a predetermined pressure, preferably between 0.5 bar and 10 bar, onto the surface 16 of the edge region 14 on the top side 18 of the substrate 10 in order to remove the edge region 14. The dissolving or etching medium and the pressure are tailored to the material of the working layer to be removed.To remove the Cu working layer 12 from the substrate 10 in the form of a rectangular glass wafer using the decoating device 100 of the first embodiment, the pressure is between 0.5 bar and 2 bar, and an ammonia-sodium chlorite mixture or a sodium persulfate-sulfuric acid mixture is used as the solvent or etching medium. To enable the decoating unit 20 to spray the etching medium, it is made of a chemically resistant material, for example, polyetheretherketone (PEEK) for the ammonia-sodium chlorite mixture and quartz for the sodium persulfate-sulfuric acid mixture. In other embodiments, the decoating unit can also be configured to remove, for example, an edge region of the working layer containing ABF or Ti.

[0077] In addition to the nozzle 24, the decoating unit 20 also contains two rinsing nozzles 26, which are arranged next to the nozzle 24 and spray a rinsing medium onto the surface 16 of the edge region 14 to rinse away dissolved material and the dissolving or etching medium. Depending on the direction in which the decoating unit 20 is moved, one or the other rinsing nozzle 26 can be used to spray the rinsing medium onto the surface 16, following the nozzle 24. Alternatively, the rinsing nozzles 26 can also be operated in parallel.

[0078] Alternatively or in addition to the rinsing nozzles, one or more suction units can be provided to suction off the dissolving and etching medium, rinsing medium, and / or the removed material. The suction units can be nozzle-shaped and / or create a vacuum to suck in and remove the media and / or material. The suction units can be arranged, for example, on the decoating head or heads. Alternatively, the suction units can also be separate units. The suction unit can make it possible to reduce or prevent contamination of the decoating device, as well as the substrate and the working layer.

[0079] The nozzle 24' whose decoating outlet 22' of the working layer

[0080] 12' is arranged opposite, sprays dissolving or etching medium from its decoating outlet 22' onto the surface 16' of the edge region 14' on the underside 18' of the substrate 10 in order to remove the edge region 14'. The decoating unit 20 also contains two rinsing nozzles 26', which are arranged next to the nozzle 24' and spray rinsing medium onto the surface 16' of the edge region 14'. The decoating unit 20 can therefore simultaneously remove the edge region 14 of the working layer 12 on an upper side 18 and the further edge region 14' of the working layer 12' on the underside 18' of the substrate 10. In other exemplary embodiments, the decoating unit can also be designed to remove only the edge region of the upper side or underside.

[0081] In this embodiment, the stripping outlets 22 and 22' are arranged perpendicular to the surface 16 and 16' of the edge region 14 and 14'. In other embodiments, the stripping outlets can also be arranged at an angle, for example, between 5° and 85°, in particular 45°, to the surface of the edge region. The outlets of the rinsing nozzles can also be arranged perpendicularly or at an angle to the surface of the edge region.

[0082] Furthermore, in this exemplary embodiment, the nozzles 24, 24' and the rinsing nozzles 26, 26' are arranged on a decoating head 28. In other exemplary embodiments, multiple decoating heads can also be provided. In particular, one decoating head can be provided for the top side and one decoating head for the bottom side. Furthermore, more or fewer nozzles can be provided on the decoating unit. For example, one nozzle or multiple nozzles can be provided only for removing the edge region on the top side or only for removing the edge region on the bottom side. In addition to the nozzle, only one rinsing nozzle or no rinsing nozzle can be provided.

[0083] In this embodiment, the rinsing medium is DI water. In other embodiments, a different rinsing medium can be used, for example, an alcohol such as isopropanol.

[0084] The work plane movement unit 30 serves to move the decoating unit 20 in a work plane 40 across the edge region 14 and 14'. The work plane 40 lies in the xy plane perpendicular to the distance direction z. In this embodiment, the work plane movement unit 30 has a linear axis 32 connected to the decoating unit 20 to move the decoating unit 20 linearly across the edge region 14 and 14'. In other embodiments, other movement systems may be provided.

[0085] The distance adjustment unit 50 serves to keep deviations from a predetermined distance between the decoating outlet 22 of the decoating unit 20 and the surface 16 of the edge region 14 in the distance direction z perpendicular to the working plane 40 within a predetermined deviation value when the decoating unit 20 is moved in the working plane 40 over the edge regions 14 and 14'. In this exemplary embodiment, the distance adjustment unit 50 has a distance direction movement unit 52 in the form of a linear axis, a holding unit 54 in the form of a wafer chuck, a holder 56, and a distance sensor 60.

[0086] In this exemplary embodiment, the holding unit 54 has four holders 56 that hold the substrate 10. In this exemplary embodiment, the holders 56 are gas cushion holders that hold the substrate without contact, in that the working layer 12' of the substrate 10 rests on the gas cushions generated by the holders 56, so that the working layer 12' is not damaged or contaminated. In other exemplary embodiments, other types of holders can also be provided, for example, suction holders or a combination of contactless holding and suction holders. The holders 56 are arranged in a cross shape around a center of the substrate 10, so that the substrate 10 is held in four areas that are rotated 90° relative to each other around the center of the substrate about the z-axis. In this exemplary embodiment, the holding unit 54 is rotatable about the z-axis, so that the substrate 10 can be rotated relative to the decoating unit 20 in the working plane 40.

[0087] The distance sensor 60 serves to determine a distance value for the distance d between the decoating outlet 22 of the decoating unit 20 and the surface 16 of the edge region 14 in the distance direction z. In this exemplary embodiment, the distance sensor 60 is a confocal-chromatic sensor that determines the distance value for the distance d based on a chromatic-confocal aberration measurement. The distance sensor 60 contains a distance measuring unit 62 that determines the distance value for the distance d based on a distance measurement signal 64 received from the surface 16. Furthermore, the distance measuring unit 62 determines a deviation value of the deviation from the predetermined distance between the decoating outlet 22 and the surface 16 in the distance direction z. In other exemplary embodiments, a different distance sensor can also be provided. In alternative exemplary embodiments, a distance sensor can also be omitted.

[0088] The distance direction moving unit 52 receives the deviation value of the deviation from the predetermined distance from the distance measuring unit 62 and moves the substrate 10 and the stripping unit 20 relative to each other in the distance direction z based on the distance d determined by the distance sensor 60 by moving the holding unit 54 by the deviation value of the deviation from the predetermined distance in the distance direction z.

[0089] In other embodiments, particularly with multiple decoating units, instead of the substrate resting on the holding unit, the decoating units can also be moved individually (see, for example, the embodiments in Figures 4 and 8). In alternative embodiments, multiple distance sensors and distance direction movement units can also be arranged on a decoating unit, for example, on a decoating head for the underside and a decoating head for the top side, and the decoating heads can be moved independently of one another. This can make it possible to set an optimal distance between the surface on the underside and the top side and the decoating outlets in order to improve the removal of the edge region.In particular, the precision of removal can be improved and less pressure can be applied if the decoating outlet is moved closer to the surface of the edge area during the removal of the edge area.

[0090] The control unit 500 contains a processor 510 and a computer-readable medium in the form of a memory 520. A computer program product for removing the edge regions 14 and 14' of the working layers 12 and 12' arranged on the uneven substrate 10 is stored in the memory 520. The computer program product contains computer program code means that cause the processor 510 to execute a method for removing the edge regions 14 and 14', for example, in accordance with the exemplary embodiment of the method for removing the edge regions 14 and 14' shown in Figure 11, when the computer program product is executed on the processor 510. In addition, the memory 520 can store further data, such as operating parameters or processing parameters, and make them available to the processor 510 for processing.

[0091] Fig. 4 schematically and exemplarily shows a second embodiment of the decoating device 100 in the xy plane. The nozzles 24 and 24' of the decoating unit 20 are partially viewed in perspective to illustrate that edge regions on both the top and bottom sides of the substrate can be removed by the decoating unit 20. In this embodiment, the substrate 10 is held contactlessly by four cross-shaped holders 56 in the form of gas cushions.

[0092] The second embodiment of the decoating device 100 differs from the first embodiment in that two decoating units 20 and 20' are provided, and each of the decoating units 20, 20' has a distance sensor 60. Furthermore, the decoating head 28 of the respective decoating unit 20, 20' is connected to a distance direction movement unit 52 in the form of a linear axis, which can individually move the decoating outlets of the nozzles 24 and 24' of the respective decoating unit 20, 20' in the distance direction z.The two decoating units 20, 20' can therefore be moved simultaneously in the working plane along the edge region 14 in the y-direction by means of the linear axis 32 of the working plane movement unit 30, without the risk of a collision between the nozzles 24 and 24' and the substrate 10, since deviations from the predetermined distance between the decoating outlet of the respective decoating unit and the surface of the edge region can be kept within the predetermined deviation value in the distance direction while the respective decoating unit is moved in the working plane over the edge region. This enables the edge regions to be removed in parallel with two or more decoating units and increases the processing speed.

[0093] Once one long side of the substrate has been processed by the decoating units, i.e., an edge region 14 of the working layer 12 has been removed along the length of the long side, the substrate can be rotated 90° around the z-axis so that the remaining long sides can be processed. In other embodiments, four decoating units, one per long side, can be arranged to remove the edge region along the length of the respective long side.

[0094] Fig. 5 shows a schematic and exemplary third embodiment of the stripping device 100 in the xz plane. In contrast to the first two embodiments of the stripping device 100, the third embodiment of the stripping device 100 does not contain a distance sensor or a distance direction movement unit. Instead, the holding unit 54 has eight holders 58 that hold a respective region of the underside 18' of the curved substrate 10 and are arranged such that they reduce the curvature of the substrate 10. In this embodiment, the holders 58 are arranged in a cross shape, so that each arm of the cross comprises two of the eight holders 58. In addition, the holders 58 suck the substrate 10 onto its underside 18', so that the suction force reduces the curvature and a nearly flat substrate 10 is created.By reducing the curvature of the substrate 10, deviations from the predetermined distance between the decoating outlet 22 and 22' of the decoating unit 20 and the surface 16 and 16' of the edge region 14 and 14' in the distance direction z can be kept within a predetermined deviation value when the decoating unit 20 is moved in the working plane 40 over the edge region 14 and 14' by means of the linear axis 32 of the working plane movement unit 30. In this exemplary embodiment, the holding unit 54 is also rotatable about the z-axis, so that the substrate can be rotated such that the decoating unit 20 can process the various longitudinal sides of the rectangular substrate 10.

[0095] Fig. 6 schematically and exemplarily shows a fourth embodiment of the decoating device 100 in the xz plane. The fourth embodiment includes all the features of the third embodiment but, like the first two embodiments of the decoating device 100, additionally has a distance sensor 60 and a distance direction movement unit 52. The distance sensor 60 and the distance direction movement unit 52 of the fourth embodiment function equivalently to those of the first and second embodiments, which is why a repeated description of their operation will be omitted here.The combination of reducing the curvature of the substrate 10 by arranging the holders 58 sucking the underside 18' of the substrate 10 and moving the stripping outlets 22 and 22' relative to the surface 16 and 16' of the edge region 14 and 14' in the distance direction z makes it possible to further reduce deviations from the predetermined distance between them.

[0096] Fig. 7 shows a schematic and exemplary fifth embodiment of the decoating device 100 in the xz plane. In this embodiment, the substrate 10 is held contactlessly by movable holders 59 in the form of movable gas cushion holders. The movable holders 59 are moved parallel to the decoating unit 20 via linear axes 57 of the distance adjustment unit 50 in a holding plane 70 parallel to the working plane 40, so that the movable holder 59 is at a constant distance from the decoating outlet 22 of the decoating unit 20 in the distance direction z. This makes it possible to reduce the curvature of the substrate at the respective part of the edge region 14 that is currently to be removed and to avoid a collision of the nozzles 24 and 24' with the substrate 10. To stabilize the position of the substrate, the movable holders 59 are moved in a coordinated manner.To further stabilize the substrate, additional holders, for example suction holders near the center of the substrate, can be provided (see seventh embodiment of the decoating device in Fig. 9).

[0097] Fig. 8 shows a schematic and exemplary sixth embodiment of the decoating device 100 in the xy plane. In this embodiment, eight holders 58 for suctioning the underside of the substrate are arranged in a cross shape around a center of the substrate. In addition, four holders 56 in the form of gas cushion holders for contactless holding of the substrate are arranged in a cross shape around the center. The holders 56 are arranged rotated 45° about the z-axis relative to the holders 58. The holders 56 make it possible to prevent contamination or damage to the working layer on the underside near the edge region. In other embodiments, a different number of gas cushion holders and suction holders can also be provided.

[0098] In this embodiment, nozzles and rinsing nozzles are also provided. In other embodiments, only one nozzle may be provided, or multiple nozzles and one or more rinsing nozzles may be provided. A larger number of nozzles increases the processing speed, as more fluid can be sprayed onto the edge area in a shorter time to remove it.

[0099] Fig. 9 schematically and exemplarily shows a seventh embodiment of the decoating device 100 in the xy plane. In this embodiment, the movable holders 59 are combined with the suction holders 58. The movable holders 59 are gas cushion holders that can be moved in the y-direction parallel to the decoating units 20, 20'.

[0100] Fig. 10 shows schematically and exemplarily an embodiment of the substrate processing system 400 with two decoating systems 300 and 300', a functional module 410, a substrate transfer system 420 and a control unit 500.

[0101] In this exemplary embodiment, the decoating systems 300 and 300' each have two decoating modules 200 and 200'. In other exemplary embodiments, they may also have one or more decoating modules. Additionally, the decoating systems 300 and 300' include a substrate transfer system 310 for transferring substrates. The substrate transfer system 310 transfers substrates 10 between the decoating systems 300 and 300' and the substrate transfer system 420 of the functional module 410. Furthermore, the substrates 10 can also be transferred between the decoating systems 300 and 300', for example, if several different working layers are arranged one above the other on the substrate 10, the edge regions of which are removed one after the other by different decoating devices 100.

[0102] The decoating modules 200 and 200' each have a decoating device 100 according to the invention and several media reservoirs 210 and 220.

[0103] The decoating device 100 can be configured according to one of the embodiments of the decoating devices 100 shown in Figures 2 to 9. In other embodiments of the substrate processing system, different embodiments or alternative embodiments of the decoating device can also be provided in the decoating modules.

[0104] In this embodiment, the media reservoirs 210 and 220 contain a dissolving or etching medium and a rinsing medium and supply them to the decoating unit of the decoating device 100. In other embodiments, more or fewer media reservoirs can be provided, for example, one or three, four, five, six, or more. Depending on how many nozzles need to be supplied with media and how many different media are provided, a larger or smaller number of media reservoirs must be provided.

[0105] In this exemplary embodiment, the functional module 410 contains several functional units, namely a spin coater 412, a chemical development unit 414, an exposure unit 416, and an oven 418. In other exemplary embodiments, the functional module can also contain only one or other functional units or be a functional unit, for example, a spin coater. The functional module 410 serves to process the substrate 10. In this exemplary embodiment, the functional module 410 creates a working layer on the substrate 10. The edge region of the working layer on the substrate 10 is subsequently removed by the decoating systems 300 and 300'. The processed substrates thus created can then be fed to further processing steps.For this purpose, the substrate transfer system 420 can transfer the substrates 10 between the functional module 410 and the decoating systems 300 and 300' and transfer them out of the substrate processing system 400 (not shown). In this exemplary embodiment, the processing processes of the substrate processing system 400 are centrally controlled by the control unit 500. In other exemplary embodiments, multiple local control units can also be provided, or the control can be carried out by an external control unit.

[0106] The control unit 500 includes a processor 510 and a computer-readable medium in the form of a memory 520. The processor 510 performs calculations. The memory 520 stores various data, such as operating parameters and computer program products, and provides them to the processor 510 so that the control unit 500 can execute various methods for operating the various parts, modules, devices, and units of the substrate processing system 400.

[0107] Fig. 11 shows the timing of an embodiment of a method 1000 for removing an edge region of a working layer arranged on an uneven substrate. The method can be carried out by means of a decoating device, for example by means of one of the decoating devices 100 shown in Figures 2 to 9, in particular the embodiment of the decoating device 100 shown in Fig. 8. The method can be used, for example, to remove an edge region of a metallic layer or a resist from a substrate, such as a rectangular substrate, for example a rectangular glass wafer. The method can also be used, for example, in a decoating device that is installed in a substrate processing system.

[0108] In step 1100, the uneven substrate is held by suction at eight areas on the underside of the uneven substrate, thereby reducing the unevenness of the substrate. Furthermore, the uneven substrate is held non-contact at four areas on the underside of the uneven substrate at or near the edge to prevent contamination and / or damage to the edge area of ​​the working layer. To hold the eight areas, eight holders for suctioning the underside of the substrate are arranged in a cross shape around a center point of the substrate, so that two suction holders each form one arm of the resulting cross. For non-contact holding of the uneven substrate at the four areas, gas cushion holders are arranged. These gas cushions create a gas cushion on which the uneven substrate is held non-contact. The substrate can be held in this way, for example, by the embodiment of the decoating device 100 shown in Fig. 8.In other embodiments, the uneven substrate can also be held in a different manner or by a different number of holders. The method step is adapted accordingly to the holding unit, in particular the number and type of holders.

[0109] In this embodiment, step 1100 is carried out continuously in time and thus in parallel to all subsequent steps until the edge region is removed and the substrate has been replaced by a new substrate to be processed, ie the substrate is held permanently during processing.

[0110] In step 1200, a distance between the decoating outlet of the decoating unit and the surface of the edge region is measured in the distance direction perpendicular to the working plane to determine a distance value. For this purpose, a distance sensor can be used, for example; in particular, the distance can be measured based on a chromatic aberration measurement.

[0111] In step 1300, the uneven substrate and the decoating outlet of the decoating unit are moved relative to each other in the distance direction based on the distance value of the distance between the decoating outlet of the decoating unit and the surface of the edge region determined by the distance sensor, in order to keep deviations from the predetermined distance between the decoating outlet of the decoating unit and the surface of the edge region in the distance direction perpendicular to the working plane when moving the decoating unit in the working plane over the edge region within the predetermined deviation value. The movement in the distance direction can be carried out, for example, by means of a distance direction movement unit.

[0112] In step 1400, the decoating unit is moved over the edge area in a working plane with a decoating output arranged opposite the working layer.

[0113] Steps 1100 to 1300 are performed parallel to step 1400, so that when the decoating unit is moved in the working plane over the edge region, deviations from a predetermined distance between the decoating outlet of the decoating unit and the surface of the edge region in the distance direction perpendicular to the working plane are kept within a predetermined deviation value. In other embodiments, the uneven substrate can also be moved relative to the decoating unit, for example, rotated. Especially for a round substrate, rotating the substrate enables a simple method for removing the edge region.

[0114] Furthermore, in other embodiments, steps 1200 and 1300 can be omitted, so that even without adjusting the distance in the distance direction perpendicular to the working plane, deviations from the predetermined distance between the decoating outlet of the decoating unit and the surface of the edge region in the distance direction perpendicular to the working plane can be kept within a predetermined deviation value. In particular, for a curved substrate, this can be achieved, for example, solely based on suction by holders, since these can reduce the curvature of the substrate, so that the deviations from the predetermined distance between the decoating outlet of the decoating unit and the surface of the edge region in the distance direction perpendicular to the working plane can be kept within a predetermined deviation value.

[0115] In step 1500, the edge region is removed. In this exemplary embodiment, the edge regions of the working layer on the top and bottom sides of the substrate are removed simultaneously, as shown, for example, in Figs. 2 and 3. To remove the edge region, depending on the material of the edge region to be removed, for example ABF, Cu, or Ti, a corresponding solvent or etching medium is sprayed onto the edge region at a corresponding pressure, for example between 0.5 bar and 10 bar, from a decoating outlet of a nozzle of the decoating unit. In addition, the edge region is rinsed with a rinsing nozzle, which sprays a rinsing medium, for example DI water or an alcohol such as isopropanol, onto the edge region in order to rinse away dissolved material of the edge region and the solvent or etching medium.In this embodiment, the rinsing nozzle is spatially arranged directly behind the nozzle that sprays the solvent or etching medium, so that rinsing occurs immediately after the solvent or etching medium is applied. Alternatively, in other embodiments, rinsing can also occur after a certain exposure time to the solvent or etching medium.

[0116] In step 1600, the uneven substrate is rotated relative to the stripping unit so that the edge region of one side of the substrate can be removed. By rotating the substrate relative to the stripping unit, the substrate is also rotated relative to the stripping exit so that it can be moved over a different part of the edge region. Step 1500 can be carried out in parallel to steps 1400 and 1600. Step 1600 is optional and depends on the shape of the substrate and how the substrate is moved relative to the stripping unit. In other embodiments, step 1600 can be omitted. For example, in the case of a round substrate, the substrate can be rotated in step 1400 to be moved over the edge region so that the entire edge region of the working layer on the substrate can be removed.

[0117] Several or all steps can be performed in a meaningful order or in parallel. Some steps can also be performed in parallel and in series with one or more other steps.

[0118] In further embodiments, for example, it may be provided to move a movable holder in a holding plane parallel to the working plane, parallel to the decoating unit, while the movable holder holds the uneven substrate, so that the movable holder is at a constant distance from the decoating outlet of the decoating unit in the distance direction. Alternatively or additionally, in other embodiments, it may be provided to provide a solvent or etching medium tailored to a material of the edge region for removing the edge region.

[0119] The above description of the invention in conjunction with the drawings serves to explain the features of the invention by way of example in the form of exemplary embodiments. However, the features explained in the exemplary embodiments are only examples and should not be understood as restrictive. In particular, the invention is not limited to the exemplary embodiments or the combination of features of individual exemplary embodiments. For example, it is also possible to operate the invention in an exemplary embodiment with other holders or other decoating units or decoating means. Different layers, for example different metal layers, are conceivable as working layers. Furthermore, different materials can be used for the decoating outlet(s).In particular, the decoating outlets, the material of the decoating outlets and the decoating agent can be adapted or matched to each other and to the material to be removed from the edge area of ​​the working layer.

[0120] Other variants and variations of the embodiments shown can be understood and implemented by those skilled in the art by reworking the claimed invention in view of the figures, description and claims.

[0121] The words “contain”, “comprise”, “include” do not exclude further elements, components or steps and the indefinite articles “a” or “an” do not exclude a plurality.

[0122] For example, a unit, processor, or device can perform a variety of functions of different subject matter recited in the claims. The fact that certain means are recited in different claims should not be understood to mean that a combination of these means cannot be used advantageously.

[0123] Method steps such as removing the edge region, keeping deviations from a predetermined distance between the decoating outlet of the decoating unit and a surface of the edge region in a distance direction perpendicular to the working plane when moving the decoating unit in the working plane over the edge region within a predetermined deviation value, measuring a distance between the decoating outlet of the decoating unit and the surface of the edge region in the distance direction perpendicular to the working plane, moving the uneven substrate and the decoating outlet of the decoating unit relative to each other in the distance direction based on the distance between the decoating outlet of the decoating unit and the surface of the edge region determined by the distance sensor,To keep deviations from the predetermined distance between the decoating outlet of the decoating unit and the surface of the edge region in the distance direction perpendicular to the working plane when moving the decoating unit in the working plane over the edge region within the predetermined deviation value, holding the uneven substrate, rotating the uneven substrate relative to the decoating unit, holding the uneven substrate at least at two areas of the underside of the uneven substrate so that unevenness of the substrate is reduced, moving a movable holder in a holding plane parallel to the working plane parallel to the decoating unit while the movable holder holds the uneven substrate, so that the movable holder is at a constant distance from the decoating outlet to the decoating unit in the distance direction,Simultaneous removal of the edge region of the working layer on a top side and another edge region of the working layer on a bottom side of the substrate, provision of a solvent or etching medium tailored to a material of the edge region for removing the edge region, etc., which are carried out by one or more units, components, or devices, can also be carried out by a different number of units, components, or devices. These method steps and / or the method can be implemented or provided, for example, as computer program code or computer program code means and / or as specific hardware.

[0124] A computer program product may be stored or delivered on a suitable medium, such as an optical storage medium or a solid-state medium. It may also be delivered together with or as part of other hardware. Furthermore, it may also be delivered by other means, such as over the Internet, Ethernet, or another wired or wireless telecommunications system.

[0125] The reference numerals used in the claims are not to be understood as limiting the features of the embodiments, but merely as examples of the features of the claims.

[0126] The invention relates to the removal of an edge region of a working layer arranged on an uneven substrate with the aid of a decoating device. The decoating device has a decoating unit, a working plane movement unit and a distance adjustment unit. The decoating unit is designed to remove the edge region and has a decoating outlet which is designed to be arranged opposite the working layer. The working plane movement unit is designed to move the decoating unit in a working plane over the edge region. The distance adjustment unit is designed to keep deviations from a predetermined distance between the decoating outlet of the decoating unit and a surface of the edge region in a distance direction perpendicular to the working plane when moving the decoating unit in the working plane over the edge region within a predetermined deviation value.This enables improved removal of the edge area of ​​a working layer on an uneven substrate.

Claims

CLAIMS:

1. Decoating device (100) for removing an edge region (14, 14') of a working layer (12, 12') arranged on an uneven substrate (10), comprising: a decoating unit (20) which is designed to remove the edge region (14, 14') and has a decoating outlet (22, 22') which is designed to be arranged opposite the working layer (12, 12'), a working plane movement unit (30) which is designed to move the decoating unit (20) in a working plane (40) over the edge region (14, 14'), and characterized by a distance adjustment unit (50) which is designed to compensate for deviations from a predetermined distance between the decoating outlet (22) of the decoating unit (20) and a surface (16) of the edge region (14) in a distance direction (z) perpendicular to the working plane (40) when moving the Decoating unit (20) in the working plane (40) over the edge area (14,14') within a predetermined deviation value., 2. Decoating device (100) according to claim 1, wherein the distance setting unit (50) comprises a distance sensor (60) and a distance direction movement unit (52), and wherein the distance sensor (60) is designed to determine a distance (d) between the decoating outlet (22) of the decoating unit (20) and the surface (16) of the edge region (14) in the distance direction (z), and wherein the distance direction movement unit (52) is designed to move the uneven substrate (10) and the decoating outlet (22) of the decoating unit (20) relative to each other in the To move from the standing direction (z) based on the distance (d) determined by the distance sensor (60).

3. Decoating device (100) according to claim 1 or 2, comprising a holding unit (54) designed to hold the substrate (10).

4. Decoating device (100) according to claim 3, wherein the holding unit (54) has at least two holders (58) which are designed to hold a respective region of the underside (18') of the uneven substrate (10) and wherein the holders (58) are arranged such that an unevenness of the substrate (10) is reduced.

5. Decoating device (100) according to claim 3 or 4, wherein the holding unit (54) has a movable holder (59) which is designed to hold the uneven substrate (10) and wherein the distance setting unit (50) is designed to move the movable holder (59) in a holding plane (70) parallel to the working plane (40) parallel with the decoating unit (20), so that the movable holder (59) is in From the stand direction (z) at a constant distance to the decoating outlet (22) of the decoating unit (20).

6. Decoating device (100) according to at least one of claims 1 to 5, wherein the decoating unit (20) is designed to simultaneously remove the edge region (14) of the working layer (12) on an upper side (18) and a further edge region (14') of the working layer (12') on an underside (18') of the substrate (10).

7. Decoating device (100) according to at least one of claims 1 to 6, wherein the decoating unit (20) is designed to remove an edge region (14, 14') of the working layer (12, 12') containing Ajinomoto build-up film, Cu or Ti.

8. Decoating module (200) with a decoating device (100) according to at least one of claims 1 to 7, which additionally contains at least one media reservoir (210, 220) which is designed to contain one or more dissolving media, one or more etching media or one or more dissolving media and one or more etching media and to supply the decoating unit (20) of the decoating device (100) with this or these.

9. Decoating system (300) with one or more decoating modules (200, 200') according to claim 8, which additionally contains a substrate transfer system (310) for transferring the uneven substrate (10).

10. Substrate processing system (400) with one or more decoating systems (300, 300') according to claim 9, which additionally contains at least one functional module (410) for processing the uneven substrate (10).

11. A method (1000) for removing an edge region (14, 14') of a working layer (12, 12') arranged on an uneven substrate (10), comprising: Moving a decoating unit in a working plane with a decoating outlet arranged opposite the working layer over the edge area and Removing the edge area, characterized in that Deviations from a predetermined distance between the decoating outlet of the decoating unit and a surface of the edge region in a distance direction perpendicular to the working plane are kept within a predetermined deviation value when the decoating unit is moved in the working plane over the edge region.

12. Method (1000) according to claim 11, comprising one or more of the steps: Measuring a distance between the decoating outlet of the decoating unit and the surface of the edge area in the distance direction perpendicular to the working plane, Moving the uneven substrate and the decoating outlet of the decoating unit relative to each other in the distance direction based on the distance between the decoating outlet of the decoating unit and the surface of the edge region determined by the distance sensor, in order to keep deviations from the predetermined distance between the decoating outlet of the decoating unit and the surface of the edge region in the distance direction perpendicular to the working plane when moving the decoating unit in the working plane over the edge region within the predetermined deviation value, Holding the uneven substrate, Rotating the uneven substrate relative to the decoating unit, holding the uneven substrate at least two areas of the underside of the uneven substrate so that unevenness of the substrate is reduced, Moving a movable holder in a holding plane parallel to the working plane parallel to the decoating unit while the movable holder holds the uneven substrate, so that the movable holder is at a constant distance from the decoating outlet of the decoating unit in the distance direction, Simultaneous removal of the edge region of the working layer on a top side and another edge region of the working layer on a bottom side of the substrate, Providing a solvent or etching medium tailored to a material of the edge region for removing the edge region.

13. Use of the decoating device (100) according to at least one of claims 1 to 7 for: the removal of an edge region (14, 14'), and / or the removal of an edge region (14, 14') of a metallic layer or a lacquer, and / or the removal of an edge region (14, 14') of a working layer (12, 12') on a rectangular substrate (10), and / or the removal of an edge region (14, 14') of a working layer (12, 12') on a wafer.

14. Use of the method (1000) according to claim 11 or 12 for: the removal of an edge region (14, 14'), and / or the removal of an edge region (14, 14') of a metallic layer or a lacquer, and / or the removal of an edge region (14, 14') of a working layer (12, 12') on a rectangular substrate (10), and / or the removal of an edge region (14, 14') of a working layer (12, 12') on a wafer.

15. A computer program product for removing an edge region (14, 14') of a working layer (12, 12') arranged on an uneven substrate (10), the computer program product comprising computer program code means which cause a processor (510) to carry out the method according to claim 11 or 12 when the computer program product is executed on the processor.

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