Carrier assembly and system

Abstract

The invention relates to a carrier assembly (24) for the play-free positioning of a wafer (22), with a carrier (26) for the wafer (22), a tilting mechanism (40), and a positioning part (34). The carrier (26) has an opening (30) to accommodate the wafer (22). The positioning part (34) has a positioning surface (36) for laterally positioning the wafer (22). The tilting mechanism (40) is configured to tilt the positioning part (34) between a release position and a positioning position in which the wafer (22) is positioned between an edge of the opening (30) and the positioning surface (36). The invention further relates to a system (10) and a method for the play-free positioning of a wafer or for removing a wafer from a carrier.

Description

CARRIER ASSEMBLY AND SYSTEM

[0001] The invention relates to a carrier assembly for the play-free positioning of a wafer. Furthermore, the invention relates to a system and a method for the play-free positioning of a wafer in a carrier for the wafer and to a method for removing a wafer from a carrier for the wafer.

[0002] It is known from the prior art that wafers are positioned in a carrier for processing, e.g., ion irradiation and / or measuring, so that the wafers are held in a position that is as defined as possible. This is in particular important for automated systems or process lines in which the wafer passes through several stations in succession, e.g., a first measuring station, an irradiation station, and a second measuring station.

[0003] In the case of the carrier assemblies known from the prior art, it has been found that the processability of the wafers is limited because the carrier assemblies known from the prior art either partially cover the wafer so that the wafer can only be processed on one side, or parts of the outer edge of the wafer are covered, whereby the surface available for processing is limited compared to the entire surface of the wafer.

[0004] In addition, the carrier assemblies known from the prior art typically require manual unlocking, which means that their use in a fully automated process line is only possible to a limited extent.

[0005] Furthermore, in the carrier assemblies known from the prior art, the wafer is held or clamped within the carrier by means of complex mechanisms that require a corresponding amount of space. This reduces the efficiency of fully automated processing, because the number of wafers that can be processed simultaneously is limited.

[0006] The object of the invention is to provide a carrier assembly with which a fully automated processing of the wafer is possible, and, simultaneously, the efficiency of the processing is maximized.

[0007] The object is achieved according to the invention by a carrier assembly for the play-free positioning of a wafer. The carrier assembly includes a carrier for the wafer, a tilting mechanism, and a positioning part. The carrier has an opening to accommodate the wafer. The positioning part has a positioning surface for laterally positioning the wafer. The tilting mechanism is configured to tilt the positioning part between a release position and a positioning position in which the wafer is positioned between an edge of the opening and the positioning surface.

[0008] The basic idea of the invention is to allow for a positioning of the wafer with repeatable accuracy by means of the carrier assembly by positioning the wafer in the carrier by means of the positioning surface of the positioning part. This (exactly) determines the position of the wafer within the carrier, ensuring repeatability of the positioning. In other words, it is ensured that all wafers inserted into the carrier assembly are positioned in the same way. In addition, the positioning part ensures that the wafer remains in its specified position, even if the carrier assembly is subject to (light) vibrations, which can occur, for example, in a process line, i.e. , in a (fully) automated system. In this respect, the wafer can be positioned in a play-free manner during measurement, transport, and processing in a vacuum chamber.

[0009] Since the positioning part is adjusted between its release position and its positioning part via the tilting mechanism, a space-saving and simple way of fixing the wafer with regard to its position in the carrier is also created. The tilting mechanism ensures that the carrier assembly is suitable for fully automated processing, since the tilting mechanism can be actuated both manually and automatically - for example, via a trigger element that interacts with the tilting mechanism.

[0010] Furthermore, the tilting mechanism ensures that the carrier assembly is also suitable for (ultra-) high vacuum applications in which other types of positioning mechanisms would fail - for example, positioning mechanisms in which sliding elements slide against one another. In contrast, the tilting mechanism comprises pivoting or tilting around an axis, i.e., a pivotable or tiltable bearing. Such a bearing has significantly lower friction compared to a plain bearing.

[0011] Since the positioning part positions the wafer laterally by means of the positioning surface, it is also ensured that the surface of the wafer to be processed is not (partially) covered by the positioning part, as would be the case, for example, with a hold-down device that contacts a surface of the wafer to hold the wafer down.

[0012] Due to the tilting mechanism, a space-saving yet play-free positioning of the wafer in the carrier, a maximum processing possibility of the surface(s) of the wafer, as well as the possibility of automating the loading of the carrier with the wafer and the removal of the wafer from the carrier can be realized.

[0013] One aspect provides that the tilting mechanism have at least one actuating surface via which the tilting mechanism can be actuated, in order to tilt the positioning part between the positioning position and the release position. In the positioning position of the positioning part, the actuating surface is perpendicular to the positioning surface. In this respect, the tilting mechanism ensures that the direction of force action changes by 90°, since the tilting mechanism is triggered from above or below by actuating the actuating surface, which results in a lateral force on the wafer, which is applied to the wafer via the positioning surface of the positioning part. The reversal of direction is achieved by tilting the positioning part using the tilting mechanism.

[0014] The actuation direction of the tilting mechanism, i.e., the direction in which the tilting mechanism is triggered, is therefore parallel to the loading and removal direction of the wafer.

[0015] The tilting mechanism may have an actuating part which is mechanically connected to the positioning part, wherein the actuating surface is formed on the actuating part. In this respect, there are at least two separately designed parts that meet different requirements. The positioning part, which is in direct contact with the wafer via its positioning surface, can be made of a different material than the actuating part, which is not in direct contact with the wafer. In this respect, a more cost-effective carrier assembly can be realized.

[0016] In particular, the positioning part is made of an ion-beam resistant material - for example, graphite or PTFE. This applies analogously to the carrier. In other words, the components that contact the wafer are made of the ion-beam resistant material. Such a material is also suitable for (ultra-) high vacuum applications.

[0017] In contrast, the actuating part can be made of a metal, such as aluminum, so that it is as light as possible yet stable, thereby reducing the overall weight of the carrier assembly.

[0018] The positioning part itself can also have the actuating surface, so that two separate parts are not provided, but, rather, a one-piece component which takes over the functions of the positioning part and the actuating part simultaneously. In this respect, this one-piece component would be provided for laterally positioning the wafer as well as for the actuation of the tilting mechanism.

[0019] A further aspect provides that the tilting mechanism have at least one bearing block which defines a pivot point for the actuating part. The bearing block can be made of a PTFE material, making it suitable for (ultra-) highvacuum applications. A dowel pin can be arranged in the bearing block, which defines a pivot axis of the tilting mechanism. In this respect, the pivot point for the actuating part is specified via the bearing block or the dowel pin inserted in the bearing block.

[0020] A further aspect provides that the carrier have an edge-side recess through which the tilting mechanism partially extends. This results in a compact design of the carrier assembly, since the support is reduced to a minimum material thickness due to the edge-side recess. The tilting mechanism runs partially parallel to the loading or removal direction through the edge-side recess. In other words, the edge-side recess ensures that the tilting mechanism does not protrude laterally beyond the edge of the carrier. This ensures, among other things, that several carrier assemblies can be placed next to one another on a multiple carrier, thus maximizing the number of carrier assemblies per multiple carrier. This in turn increases processing efficiency, since multiple wafers can be processed simultaneously.

[0021] Furthermore, the tilting mechanism can be provided at a lateral distance from the opening in a plan view of the opening, such that a wafer accommodated in the carrier is accessible from two opposite sides. The two sides correspond to the top and bottom sides of the wafer, so that the surfaces of the wafer provided for processing are both accessible, in particular fully accessible. “Fully accessible” is understood to mean that a maximum of 1 to 2 mm of a surface of the wafer is covered, i.e., a corresponding edge of the bottom side or top side. Unlike the prior art, both sides of the carrier are (fully) accessible, allowing one side to be processed, e.g., exposed to ion radiation, while cooling takes place on the opposite side simultaneously. For example, the bottom side of the wafer is irradiated with ions, whereas the top side of the wafer is cooled. For this purpose, a cooling device can be brought closer to the side to be cooled. Complicated cooling, as is the case in the prior art, can therefore be dispensed with.

[0022] Furthermore, a spring can be provided which interacts with the tilting mechanism in such a way that the positioning part is pre-tensioned in the positioning position. Provided that the tilting mechanism is actuated, the positioning part is in the positioning position, in which an inserted wafer would be fixed in terms of its position. Provided that there is no wafer in the carrier, loading is possible only if the tilting mechanism is actuated. In other words, insertion of the wafer or loading of the carrier can be prevented, provided that the tilting mechanism is simultaneously actuated, to move the positioning part from the positioning position to the release position. The spring can be supported on the carrier - in particular, be arranged between the carrier and the actuating part.

[0023] According to one embodiment variant, the positioning part is a clamping part which has a clamping surface for laterally clamping the wafer, wherein the tilting mechanism is configured to tilt the clamping part between the release position and a clamping position, in which the wafer is clamped between an edge of the opening and the clamping surface. In particular, on an inner side of the carrier, a clamping contour is formed which is opposite the clamping surface. By means of the clamping contour and the clamping surface, a three- point contact can be formed, via which the wafer is clamped in the carrier in a positionally accurate manner. The position of the wafer can accordingly be fixed using a clamp.

[0024] In principle, the positioning or clamping surface can be adapted to the contour of the wafer, resulting in a flat abutment in the region of the positioning or clamping surface. In other words, the positioning or clamping surface can be formed in a partially circular manner, provided that the positioning or clamping part comes into lateral abutment in the region of a circular portion of the wafer.

[0025] Alternatively, it can be provided that the positioning or clamping part be used in the region of a notch or a flat of the wafer, whereby the positioning or clamping surface has a shape adapted to the notch or flat. Provided that thepositioning or clamping part is used in the region of a notch or flat, an antitwisting effect can be ensured simultaneously, since the wafer can be inserted into the carrier only in a specific position.

[0026] If the positioning or clamping part is not provided in the region of the notch or flat, an exact angular alignment of the wafer when inserting it into the carrier assembly is irrelevant. This can simplify the corresponding process.

[0027] A further aspect provides that at least one support for one edge of the wafer be provided at the edge of the opening. In particular, the at least one support is interrupted in a region in which the positioning part is arranged. The support can be provided entirely at the edge of the opening, except for the interruption in the region of the positioning part. The at least one support thus corresponds to an inwardly projecting collar on which the edge of the wafer can be placed. It may also be provided that several supports be provided which extend over segments of the edge of the opening - for example, three segments or four segments. In any case, it is ensured that no segment is provided in the region of the positioning part which, via its positioning surface, contacts the edge of the wafer laterally, in order to determine the position of the wafer in the carrier. The support can a length

[0028] The length of at least one support is a maximum of 2 mm. In other words, the support protrudes a maximum of 2 mm towards the center of the opening. In particular, the length is 1 mm. This results in a maximum coverage of the edge of the wafer of up to 2 mm, viz., the length of the support. If several segmented supports are provided, the total area covered can be reduced accordingly.

[0029] Furthermore, an adapter ring can be provided in which the carrier is inserted. The adapter ring may be made from a different material than the carrier - for example, a metal such as aluminum. This ensures that a more stable material or material that is better suited for handling is used on the outside of the carrier assembly. In addition, the adapter ring can be made froma cheaper material than the carrier, reducing the overall cost. The other material selection is possible in particular because the adapter ring itself does not come into contact with the wafer, which means that the adapter ring has to meet lower requirements than the carrier, which is also exposed to corresponding conditions during processing of the wafer.

[0030] Furthermore, the invention provides a system with a gripping unit and a carrier assembly of the aforementioned type. The gripping unit is provided for loading the carrier assembly with the wafer or removing the wafer from the carrier assembly. The gripping unit can be a manual gripping unit - for example, vacuum tweezers. In this case, the tilting mechanism can be triggered manually - for example, by an operator pressing the actuating surface. With the other hand, the operator can hold the vacuum tweezers, i.e. , the manually operated gripping unit, to insert the wafer into the carrier of the carrier assembly or to remove the wafer from the carrier assembly.

[0031] Alternatively, the gripping unit can be an automated gripping unit - for example, in the form of an end effector of a robot. In this case, it can be provided that the tilting mechanism be automatically triggered when the automated gripping unit inserts the wafer into the carrier assembly or removes it from the carrier assembly.

[0032] For example, the gripping unit is a vacuum gripper that uses vacuum to hold the wafer in position relative to the gripping unit during handling, a Bernoulli gripper, also known as a flow gripper, or an electrostatic gripper. Other types of grippers that are also suitable can of course also be used.

[0033] One aspect provides that the gripping unit have a trigger element which is configured to actuate the tilting mechanism, wherein the gripping unit is movable at least along a loading and removal direction. The loading and removal direction is parallel to an actuation direction of the tilting mechanism of the carrier assembly. When loading the carrier with the wafer and whenremoving the wafer from the carrier, the trigger element actuates the tilting mechanism so as to tilt the positioning part into the release position. This results in the automated triggering of the tilting mechanism, since the gripping unit has the trigger element which automatically actuates the tilting mechanism when the gripping unit is moved in relation to the carrier assembly, viz., along the loading or removal direction, so that the trigger element comes into contact with the tilting mechanism, in particular the actuating surface.

[0034] The trigger element can be pin-shaped and laterally adjacent to a suction device of the gripping unit, by means of which the wafer is held. When the wafer is placed along the loading direction, the trigger element actuates the tilting mechanism as of a specific distance from the carrier, whereby the positioning part is tilted into the release position so that the gripping unit can insert the carrier. The vacuum on the suction device is removed, allowing the wafer to be released. The gripping unit is then moved to its starting position, whereby the trigger element releases the tilting mechanism again so that it is reset due to the spring pre-tensioning. This results in the positioning part moving into the positioning position in which the positioning part positions the wafer laterally, i.e. , fixes the position of the wafer within the carrier in a play-free manner.

[0035] In an analogous manner, the tilting mechanism is actuated when the wafer is removed from the carrier by means of the gripping unit, since the gripping unit is moved along the removal direction in order to contact the wafer, wherein the trigger element has previously actuated the tilting mechanism so that the positioning part is tilted into the release position, which results in the gripping unit being able to remove the wafer from the carrier. The gripping unit can then contact the wafer via the suction device and hold it by means of vacuum to remove the wafer.

[0036] In particular, the trigger element is designed to be resilient, thereby resulting in an additional stroke for the gripping unit. It is ensured that the trigger element first actuates the tilting mechanism before the gripping unit even contactsthe wafer during removal, in particular the suction device of the gripping unit. After the tilting mechanism is triggered, the gripping unit is moved further in the direction of the wafer by means of the trigger element, so that the trigger element compresses. This ensures the additional stroke distance for the gripping unit. This occurs in an analogous manner during loading, since here too the trigger element springs in and thus ensures an additional stroke distance for the gripping unit, so that the gripping unit, in particular its suction device, can be moved further in the loading direction in order to place the wafer on the at least one support. The spring travel of the trigger element can be adjusted to ensure that the gripping unit does not damage the wafer when removing or inserting it, since a progressive spring characteristic is provided, for example, which prevents the gripping unit from being moved too far in the loading direction. This provides additional safety, if the gripping unit of the robot moves too far.

[0037] Furthermore, the trigger element has a greater spring strength than the tilting mechanism, so that it is ensured that, when the trigger element is contacted, the tilting mechanism is actuated first, i.e. , the spring of the tilting mechanism is compressed in order to tilt the positioning part into the release position before the trigger element compresses, or a spring assigned to the trigger element is compressed.

[0038] Furthermore, the invention relates to a method for positioning a wafer in a carrier for the wafer in a play-free manner. The method includes the following steps:- providing a carrier assembly with the carrier for the wafer,- actuating a tilting mechanism of the carrier assembly to tilt a positioning part, with a positioning surface for laterally positioning the wafer in the carrier, from a positioning position into a release position,- inserting the wafer into the carrier, and- releasing the tilting mechanism of the carrier assembly so that the positioning part returns from the release position to the positioning position, and the positioning surface abuts laterally against the wafer to position it in the carrier.

[0039] Furthermore, the invention relates to a method for removing a wafer from a carrier for the wafer. The method includes the following steps:- providing a carrier assembly with the carrier for the wafer, wherein the wafer is positioned in the carrier,- actuating a tilting mechanism of the carrier assembly to tilt a positioning part, with a positioning surface for laterally positioning the wafer in the carrier, from a positioning position, in which the positioning surface abuts laterally on the wafer, into a release position,- removing the wafer from the carrier, and- releasing the tilting mechanism of the carrier assembly so that the positioning part returns from the release position to the positioning position.

[0040] In both methods, it can be provided that the tilting mechanism be actuated via the trigger element, which is part of the gripping unit, if an automated process is provided which provides an automated gripping unit. Provided that manual loading or removal is planned, the tilting mechanism can also be actuated manually by means of one hand of the operator, whereby the positioning part is tilted into the release position.

[0041] In both cases, it is ensured that the position of the wafer in the carrier is ensured by lateral positioning by means of the positioning part, in particular its positioning surface, since the tilting mechanism provides for lateral fixing of the wafer in the carrier. However, the tilting mechanism is actuated in a direction perpendicular to this. Typically, it is provided that the carrier assembly be designed to be loaded from above, so that the wafer is inserted into the carrier assembly from above. In this case, it is also provided, among other things, that at least one support for the wafer be provided on the edge of the opening of the carrier, onto which edge the wafer can be placed during insertion. The exact positioning of the wafer within the carrier is then carried out by means of the positioning part, which positions the wafer laterally in the support planespanned by the at least one support such that its position is play-free. This correspondingly determines the position of the wafer in the carrier.

[0042] As already explained above, the positioning part is designed in particular as a clamping part, so that the wafer is clamped.

[0043] The tilting mechanism also ensures that both sides of the wafer - the bottom side and the top side - are fully accessible during processing. This allows the bottom side of the wafer to be treated, e.g., by irradiating it with ions, wherein cooling the wafer via the top side takes place simultaneously.

[0044] Furthermore, the actuating surface, in particular the entire actuating part, can be arranged above the carrier and / or the adapter ring in a plan view of the carrier assembly. In other words, the opening is not covered by the actuating part. The actuating part also does not protrude laterally. This results in a compact design of the entire carrier assembly.

[0045] The wafer can have a coated or uncoated semiconductor substrate, glass, and / or ceramic, or mixtures of the above materials.

[0046] Further advantages and features of the invention will become apparent from the following description and the drawings, to which reference is made. In the drawings:- Fig. 1 is a schematic representation of a system according to the invention,- Fig. 2 is a perspectival view of a carrier assembly according to the invention,- Fig. 3 is an exploded view of the carrier assembly according to the invention from Fig. 2,- Fig. 4 is a side view of the carrier assembly according to the invention from Fig. 2,- Fig. 5 is a plan view of the carrier assembly according to the invention from Fig. 2,- Fig. 6 is a sectional view along the line A-A of Fig. 5,- Fig. 7 is an enlarged representation of the sectional view of Fig. 6,- Fig. 8 shows the sectional view from Fig. 7 of an alternative embodiment of the carrier assembly according to the invention,- Fig. 9 shows a representation of the system according to the invention during loading of the carrier assembly according to the invention at a first point in time, and- Fig. 10 shows the system according to the invention from Fig. 9 during loading of the carrier assembly according to the invention at a second point in time.

[0047] Fig. 1 shows a system 10 that is configured to process, e.g., irradiate, multiple wafers simultaneously.

[0048] The system 10 comprises a loading station 12, an adjoining irradiation station 14, and a measuring station 16. The measuring station 16 can be followed by a removal station which substantially corresponds to that of the loading station 12. Furthermore, the system 10 can also comprise additional measuring stations.

[0049] In the loading station 12, a robot 18 is provided, which loads a multiple carrier 20 with several wafers 22, which are inserted into carrier assemblies 24, as will be explained in more detail below.

[0050] The multiple carrier 20 can therefore comprise several carrier assemblies 24, e.g., eight carrier assemblies 24, so that several wafers 22 can be irradiated simultaneously in the irradiation station 14. The more carrier assemblies 24 the individual multiple carrier 20 comprises, the greater the overall efficiency, since more wafers 22 can be processed simultaneously.

[0051] The system 10 therefore represents a process line that ensures that the wafers 22 can be processed in the desired manner. This is made possible by the carrier assembly 24 holding the corresponding wafer 22 in a positionallyaccurate manner during the process line. It is therefore not necessary for the wafer 22 to be removed from the carrier assembly 24 and positioned differently.

[0052] In addition, the carrier assembly 24 ensures repeatability, because the wafer 22 is positioned in the carrier assembly 24 in a play-free manner. The play-free positioning makes it possible that, when the wafer 22 is transported through the several stations of the system 10, no displacement or position shift of the wafer 22 occurs, which would have a negative influence on its processing.

[0053] As explained above, this is ensured by the carrier assembly 24, which is shown in detail in Fig. 2 to 7 according to a first embodiment, to which reference is made below.

[0054] The carrier assembly 24 comprises a carrier 26, which is accommodated as an insert in an adapter ring 28. For this purpose, the adapter ring 28 can have a support surface 29 on which the carrier 26 abuts.

[0055] The carrier 26 has an opening 30 through which the wafer 22 can be inserted into the carrier 26. At the edge of the opening 30, the carrier 26 also has at least one support 32 onto which the wafer 22 can be placed with an edge of the bottom side when the wafer 22 is inserted into the carrier 26. The at least one support 32 is therefore an inwardly projecting projection or collar on which the wafer 22 can be placed. The support 32 can protrude inwards up to 2 millimeters.

[0056] In addition, the carrier assembly 24 comprises a positioning part 34 which has a positioning surface 36, which is provided for laterally positioning the wafer 22 in the carrier 26.

[0057] The positioning part 34 is arranged in an inwardly facing recess 38 of the carrier 26, as can be seen, inter alia, from Fig. 3, 5, and 7.

[0058] The positioning part 34 can be actuated with a tilting mechanism 40, whereby the positioning part 34 can be tilted between a release position and a positioning position in which the wafer 22 is positioned between an edge of the opening 30 and the positioning surface 36. In other words, in the positioning position, the position of the wafer 22 in the carrier assembly 24 or in the carrier 26 is determined.

[0059] As can be seen from the figures, the support 32 is interrupted in the region of the positioning part 34 so that the positioning part 34 can tilt and contact the wafer 22 laterally.

[0060] In the embodiment shown, the tilting mechanism 40 comprises an actuating surface 42 which is formed on a top side of an actuating part 44 which is mechanically coupled to the positioning part 34. In this respect, the actuating part 44 and the positioning part 34 are two separate components that are connected to one another. The connection can be made directly or, as in the embodiment shown, by means of a spacer element 46.

[0061] In an alternative embodiment, it can also be provided that a one-piece component be provided on which both the positioning surface 36 and the actuating surface 42 are provided. This one-piece component would therefore have the function of the positioning part 34, the actuating part 44, and the spacer element 46 together.

[0062] The tilting mechanism 40 also comprises at least one bearing block 48, which defines a pivot point for the actuating part 44. The bearing block 48 has a receptacle 50 for a dowel pin 52, which in turn engages in a receptacle of the actuating part 44, thereby resulting in a pivot axis S for the actuating part 44. The actuating part 44 can be pivoted or tilted about the pivot axis S.

[0063] In the embodiment shown, the tilting mechanism 40 comprises two bearing blocks 48 which are designed in the same way.

[0064] The at least one bearing block 48 is mechanically connected to the adapter ring 28 by means of screws 54 and optional springs 56.

[0065] In addition, the tilting mechanism 40 comprises at least one spring 58 - for example, a compression spring. The spring 58 is provided for pretensioning the tilting mechanism 40 or the positioning part 34 into the positioning position.

[0066] For this purpose, the spring 58 in the embodiment shown is supported on the carrier 26 in order to press the associated end of the actuating part 44, whereby a pivoting movement about the pivot axis is initiated, which urges the positioning part 34 into the positioning position. In the embodiment shown, the spring 58 is accommodated in a receptacle 60 in the carrier 26 together with an optional cylindrical pin 62.

[0067] From Fig. 7, it can further be seen that the carrier 26 has an edge-side recess 64 through which the tilting mechanism 40 extends at least partially, in particular the spacer element 46.

[0068] The edge-side recess 64 is provided, among other things, on a collar 65 of the top side of the carrier 26, so that the spacer element 46 can extend between the carrier 26 and the adapter ring 28, as is clear from Fig. 7. This creates a compact tilting mechanism 40 that allows multiple carrier assemblies 24 to be arranged next to one another in the multiple carrier 20, thereby ensuring maximum space efficiency.

[0069] In principle, the carrier 26 can, via the collar 65, abut on the adapter ring 28, in particular the support surface 29.

[0070] Furthermore, this ensures that the tilting mechanism 40, in a plan view of the opening 30 in the carrier 26, is provided at a distance from the opening 30 such that a wafer 22 accommodated in the carrier 26 is (fully) accessible from two opposite sides, as is clear from the figures.

[0071] The wafer 22 can thus be irradiated from below and simultaneously cooled from above by inserting a cooling device into the carrier assembly 24.

[0072] The carrier 26 can have an abutting surface 66 for the cooling device, so that the cooling device is arranged in a defined manner with respect to the wafer 22 accommodated in the carrier 26. This ensures that the cooling device does not directly contact the wafer 22, in particular its upper side, but maintains a defined distance therefrom.

[0073] Fig. 8 shows an alternative embodiment which differs from the embodiment shown in Fig. 2 to 7 with respect to the tilting mechanism 40. Specifically, the embodiment of the carrier assembly 24 shown in Fig. 8 differs with regard to the positioning of the spring 58 in that the latter is supported on the adapter ring 28 and acts upon the spacer element 46 in such a way that the positioning part 34 is pre-tensioned into the positioning position.

[0074] Analogously to the first embodiment, an actuating part 44 is in turn provided which can be pivoted or tilted about the pivot axis S, which in the present case is defined by at least one knife edge 67, with which the actuating part 44 is supported on a component of the carrier assembly 24 - for example, the adapter ring 28.

[0075] In this respect, the same handling applies to the carrier assembly 24 shown in Fig. 8 as to the carrier assembly 24 shown in Fig. 2 to 7.

[0076] Fig. 9 and 10 further show that the system 10 comprises a gripping unit 68, which can be provided, for example, as an end effector of the robot 18 in the system 10 shown in Fig. 1.

[0077] The gripping unit 68 comprises, in addition to a suction device 70 with which the wafer 22 can be held, a trigger element 72 which is provided so as to be laterally spaced from the suction device 70, in particular on a flange 74.

[0078] The trigger element 72 is designed to be resilient and is provided for triggering or actuating the tilting mechanism 40, so that the trigger element 72 interacts with the actuating surface 42 when the wafer 22 is inserted into the carrier assembly 24, as shown in Fig. 9 and 10, or is removed from the carrier assembly 24.

[0079] During loading, the gripping unit 68 is moved along a loading direction R parallel to an actuation direction B of the tilting mechanism 40 until the trigger element 72 contacts the actuating surface 42 and is adjusted against the spring pre-tensioning of the spring 58, whereby the positioning part 34 is transferred from the positioning position into the release position.

[0080] The gripping unit 68 is moved further in the loading direction B, wherein the trigger element 72 is compressed, thereby resulting in an additional stroke for the gripping unit 68, which ensures that the wafer 22 can be placed on the at least one support 32 at the edge of the opening 30.

[0081] Subsequently, the suction device 70 is released by reducing the existing vacuum so that the suction device 70 releases the wafer 22. This now rests only on the support 32.

[0082] The gripping unit 68 is then moved to its starting position, wherein the suction device 70 no longer contacts the wafer 22. The compression of the resilient trigger element 72 is reduced when returning to the starting position.As of a defined travel distance, the trigger element 72 is no longer compressed, so that it detaches from the actuating surface 42 during further travel, such that the latter is also no longer in contact.

[0083] At the latest, this results in the tilting mechanism 40 being transferred to its pre-tensioned position in which the positioning part 34 is in its positioning position, and the positioning surface 36 positions the wafer 22 laterally, in order to determine the position of the wafer 22 in the carrier 26.

[0084] The tilting mechanism 40 is actuated or triggered in an analogous manner when a wafer 22 inserted into the carrier 26 is removed.

[0085] The gripping unit 68 is moved, in order to contact the wafer 22 by means of the suction device 70. In this case, the trigger element 72 first contacts the actuating surface 42, whereby the positioning part 34 is tilted from the positioning position into the release position. The gripping unit 68 is moved further in the direction of the wafer 22, whereby the trigger element 72 compresses, which allows the gripping unit 68 an additional stroke distance. The additional stroke distance ensures that the suction device 70 of the gripping unit 68 contacts the wafer 22 in a defined manner.

[0086] Subsequently, a vacuum is built up at the suction device 70 to hold the wafer 22. The gripping unit 68 can then be moved along the removal direction E, which is parallel to the actuation direction B of the tilting mechanism 40, whereby the wafer 22 is removed from the carrier 26.

[0087] First, the trigger element 72 is decompressed. Subsequently, the tilting mechanism 40, i.e. , the positioning part 34, is transferred into its positioning position due to the spring 58. However, this is only the case when the gripping unit 68 and the wafer 22 located on its suction device 70 are located outside the positioning surface 36.

[0088] The gripping unit 68 is moved further in the removal direction E, such that the wafer 22 is removed.

[0089] In principle, the tilting mechanism 40 can be designed such that the positioning part 34 acts as a clamping part 76, so that the positioning surface 36 is a clamping surface 78, via which the wafer 22 is held in a clamped manner in the carrier 26.

[0090] In addition, a clamping contour 80 can be formed on an inner side of the carrier 26, in particular opposite the clamping surface 78, so that the wafer 22 is clamped between the clamping surface 78 and the clamping contour 80, as is clear from Fig. 5. A three-point clamping can be formed thereby.

[0091] The tilting mechanism 40 can in general be designed to be symmetrical, so that two bearing blocks 48, two actuating surfaces 42, and at least two associated springs 58 are provided.

[0092] The actuating part 44 can be designed in the shape of a bow or boomerang, wherein the actuating surfaces 42 are assigned to the free ends of the actuating part 44. The positioning or clamping part 34, 76, on the other hand, is assigned to a center of the actuating part 44, which in turn results in the symmetry of the tilting mechanism 40.

[0093] As explained above, the carrier assembly 24, due to the tilting mechanism 40, provides a way to process both sides of the wafer 22 simultaneously, without removing the wafer 22 from the carrier 26. In addition, the tilting mechanism 40 provides a space-saving way for determining the position of the wafer 22 in the carrier 26, so that several carrier assemblies 24 can be provided next to one another in the multiple carrier 20, thereby increasing efficiency, since a large number of wafers 22 can be processed simultaneously.

[0094] The tilting mechanism 40 also ensures that automation is possible, since the tilting mechanism 40 can be actuated in an automated manner, in particular automatically when inserting or removing the wafer 22. This is possible because the actuation direction B of the tilting mechanism 40 is parallel to the loading direction R or removal direction E. Despite this actuation direction B, the wafer 22 is positioned or clamped laterally, whereby a maximum area of the wafer 22 can be processed, in particular in comparison to systems that work with hold-down devices or the like.

Claims

Claims1. Carrier assembly (24) for the play-free positioning of a wafer (22), having a carrier (26) for the wafer (22), a tilting mechanism (40), and a positioning part (34), wherein the carrier (26) has an opening (30) for accommodating the wafer (22), wherein the positioning part (34) has a positioning surface (36) for laterally positioning the wafer (22), and wherein the tilting mechanism (40) is configured to tilt the positioning part (34) between a release position and a positioning position in which the wafer (22) is positioned between an edge of the opening (30) and the positioning surface (36).

2. Carrier assembly (24) according to claim 1 , characterized in that the tilting mechanism (40) has at least one actuating surface (42) via which the tilting mechanism (40) can be actuated in order to tilt the positioning part (34) between the positioning position and the release position, wherein the actuating surface (42) in the positioning position of the positioning part (34) is perpendicular to the positioning surface (36).

3. Carrier assembly (24) according to claim 2, characterized in that the tilting mechanism (40) has an actuating part (44) which is mechanically connected to the positioning part (34), wherein the actuating surface (42) is formed on the actuating part (44).

4. Carrier assembly (24) according to claim 3, characterized in that the tilting mechanism (40) has at least one bearing block (48) which defines a pivot point for the actuating part (44).

5. Carrier assembly (24) according to any of the preceding claims, characterized in that the support (26) has an edge-side recess (64) through which the tilting mechanism (40) partially extends.

6. Carrier assembly (24) according to any of the preceding claims, characterized in that the tilting mechanism (40) is provided at a lateral distance from the opening (30) in a plan view of the opening (30) such that a wafer (22) accommodated in the carrier (26) is accessible from two opposite sides.

7. Carrier assembly (24) according to any of the preceding claims, characterized in that a spring (58) is provided which interacts with the tilting mechanism (40) in such a way that the positioning part (34) is pre-tensioned into the positioning position.

8. Carrier assembly (24) according to any of the preceding claims, characterized in that the positioning part (34) is a clamping part (76) which has a clamping surface (78) for laterally clamping the wafer (22), wherein the tilting mechanism (40) is configured to tilt the clamping part (76) between the release position and a clamping position, in which the wafer (22) is clamped between an edge of the opening (30) and the clamping surface (78), in particular wherein, on an inner side of the carrier (26), a clamping contour (80) is formed which is opposite the clamping surface (78).

9. Carrier assembly (24) according to any of the preceding claims, characterized in that at least one support (32) for an edge of the wafer (22) is provided on the edge of the opening (30), in particular wherein the at least one support (32) is interrupted in a region in which the positioning part (34) is arranged.

10. Carrier assembly (24) according to any of the preceding claims, characterized in that an adapter ring (28) is provided in which the support (26) is inserted.

11. System (10) having a gripping unit (68) and a carrier assembly (24) according to any of the preceding claims.

12. System (10) according to claim 11 , characterized in that the gripping unit (68) has a trigger element (72) which is configured to actuate the tilting mechanism (40), wherein the gripping unit (68) is movable at least along a loading and removal direction (R, E), wherein the loading and removal direction (R, E) is parallel to an actuation direction (B) of the tilting mechanism 40 of the carrier assembly (24), and wherein the trigger element (72), when loading the carrier (26) with the wafer (22) and when removing the wafer (22) from the carrier (26), actuates the tilting mechanism (40) in order to tilt the positioning part (34) into the release position.

13. System (10) according to claim 11 or 12, characterized in that the trigger element (72) is designed to be resilient.

14. Method for the play-free positioning of a wafer (22) in a carrier (26) for the wafer (22), having the steps of:- providing a carrier assembly (24) with the carrier (26) for the wafer (22),- actuating a tilting mechanism (40) of the carrier assembly (24) to tilt a positioning part (34), with a positioning surface (36) for laterally positioning the wafer (22) in the carrier (26), from a positioning position into a release position,- inserting the wafer (22) into the carrier (26), and- releasing the tilting mechanism (40) of the carrier assembly (24) so that the positioning part (34) returns from the release position to the positioning position, and the positioning surface (36) abuts laterally against the wafer (22) to position it in the carrier (26).

15. Method for removing a wafer (22) from a carrier (26) for the wafer (22), having the steps of:- providing a carrier assembly (24) with the carrier (26) for the wafer (22), wherein the wafer (22) is positioned in the carrier (26),- actuating a tilting mechanism (40) of the carrier assembly (24) to tilt a positioning part (34), with a positioning surface (36) for laterally positioning the wafer (22) in the carrier (26), from a positioning position, in which thepositioning surface (36) abuts laterally on the wafer (22), into a release position,- removing the wafer (22) from the carrier (26), and- releasing the tilting mechanism (40) of the carrier assembly (24) so that the positioning part (34) returns from the release position to the positioning position.

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