Processing device, preprocessing device, and mounting system

Abstract

The present invention provides: a processing device that makes it possible to prevent affixation of an adhesive sheet to a mask; and a mounting device. A processing device (plasma processing device 100) according to an embodiment comprises: a stage 20 on which is placed a component supply body TW that is obtained by affixing a wafer W to an adhesive sheet T; a chamber 11b, the inside of which can be reduced in pressure; a gas introduction port 30 which is for introducing a reaction gas into the chamber 11b; a plasma generator 40 which generates an active species by converting the reaction gas into plasma; a mask 50 which covers a ring R and a region of the adhesive sheet T that is between the wafer W and the ring R; and an ultraviolet irradiation unit 23 which irradiates the adhesive sheet T with ultraviolet rays so as to reduce the adhesive force of the adhesive sheet T between the ring R and the wafer W, prior to removing the mask 50 from the component supply body TW.

Description

Processing device, pre-processing device and mounting system

[0001] The present invention relates to a processing device, a preprocessing device, and a mounting system.

[0002] Direct bonding is a method for mounting electronic components such as semiconductor chips to a mounting substrate. Direct bonding is a method in which the connection terminals of the mounting substrate and electronic components are directly bonded to each other using solid-state bonding without using bonding materials (adhesives) such as solder bumps. This eliminates the need to consider the effects of bonding materials, allows for narrow connection terminal spacing, and enables high-density packaging. Semiconductor chips are electronic components formed by dividing wafers into individual pieces, and are sometimes supplied attached to an adhesive sheet attached to a ring. The component consisting of the sheet to which the wafer is attached and the ring is called a component supply. The wafer on which electronic components are mounted after being removed from the component supply is called a mounting substrate.

[0003] When electronic components are directly bonded to a mounting substrate, pretreatment is performed on the electronic components and mounting substrate before bonding. This pretreatment involves surface treatments such as activation and cleaning, as well as cleaning. Activation is a process in which the surfaces of the electronic components and mounting substrate are activated by active species such as ions and radicals generated by converting a reactive gas into plasma. Activation refers to breaking the chemical bonds of molecules on the surface. Cleaning is a process in which the surfaces of the electronic components and mounting substrate are cleaned by the generated active species such as ions and radicals. Cleaning refers to the removal of particles adhering to the surface by flicking them off or the decomposition and removal of organic matter. In the following description, this surface treatment may be referred to as plasma treatment. Cleaning is a process in which particles remaining on the surfaces of the electronic components and mounting substrate are removed.

[0004] Japanese Patent Application Laid-Open No. 2020-021966

[0005] When a component supply body is pre-treated with plasma, the exposed portions of the wafer, ring, and sheet to which the wafer is attached are exposed to the plasma. This can cause organic matter constituting the sheet, organic matter on the surface of the ring, and metal constituting the ring to be scattered by activated species and adhere to the wafer, potentially contaminating the electronic components. To address this issue, the exposed portions of the ring and sheet other than the ring and wafer are shielded from the activated species by covering them with a mask.

[0006] However, if there is a large gap between the mask and the sheet when it is covered with the mask, active species will enter through the gap, resulting in insufficient shielding. If the gap between the mask and the sheet is eliminated or narrowed, the sheet may stick to the mask, making it impossible to remove the component supply body.

[0007] An object of embodiments of the present invention is to provide a processing device, a preprocessing device, and a mounting system that can prevent a mask from sticking to an adhesive sheet.

[0008] The processing apparatus of the embodiment includes a stage on which a component supply body is placed, the component supply body having wafers diced into electronic components attached to an adhesive sheet attached to a ring, a chamber in which the stage is provided and the interior of which can be depressurized, a gas inlet for introducing a reactive gas into the depressurized chamber, a plasma generator for generating active species by plasmatizing the reactive gas, a mask for exposing the wafer and covering the ring and the area between the ring and the wafer on the adhesive sheet, and an ultraviolet irradiation unit for irradiating the adhesive sheet with ultraviolet light so as to reduce the adhesive force of the adhesive sheet between the ring and the wafer before removing the mask from the component supply body covered with the mask to expose the component supply body to the active species.

[0009] The processing apparatus of the embodiment includes a stage on which a component supply body is placed, which has wafers diced into electronic components attached to an adhesive sheet attached to a ring, a chamber in which the stage is provided and the interior can be depressurized, a gas inlet for introducing a reactive gas into the depressurized chamber, a plasma generator for generating active species by plasmatizing the reactive gas, and a mask that exposes the wafer and covers the area between the ring and the wafer on the ring and adhesive sheet, and the mask has a protrusion with a curved or flat tip on the part directly facing the adhesive sheet.

[0010] The pre-treatment device of the embodiment includes the treatment device, a load port on which a transport container containing the component supply body is mounted, a supply body cleaning section that cleans the component supply body, a mounting substrate cleaning section that cleans the mounting substrate, and a transport section that transports the component supply body.

[0011] The mounting system of the embodiment includes the pre-processing device, and a bonding section that detaches the electronic components from the component supply body that has been processed by the pre-processing device and mounts the electronic components on a mounting board.

[0012] The embodiment of the present invention can prevent the mask from sticking to the adhesive sheet.

[0013] 1 is an explanatory diagram showing the processing of each part of a mounting system according to an embodiment; FIG. 2 is a simplified perspective plan view showing the configuration of a mounting system according to an embodiment; FIG. 3 is a cross-sectional view showing a processing apparatus according to a first embodiment; FIG. 4 is a plan view (A) showing a component supply body being carried in and out of a plasma processing apparatus, a cross-sectional view (B) taken along the arrows a-a in FIG. 2A, and a cross-sectional view (C) taken along the arrows b-b in FIG. 3A; FIG. 4 is a cross-sectional view (A) showing a mounting substrate being raised relative to a stage when a mounting substrate is carried in and out of a plasma processing apparatus, and a cross-sectional view (B) showing the mounting substrate being placed on the stage; FIG. 5 is a cross-sectional view (A) showing a component supply body being received and delivered from a robot hand by a rod in a plasma processing apparatus, a cross-sectional view (B) showing the robot hand being retracted, a cross-sectional view (C) showing the mounting substrate being placed on a stage, and a cross-sectional view (D) showing the mask being lowered; FIG. 6 is a cross-sectional view showing a mask being biased by a biasing member when the mask is lowered; FIG. 7 is a simplified configuration diagram showing a supply body cleaning unit and a mounting substrate cleaning unit of a mounting apparatus; FIG. 8 is a flowchart showing an operation procedure according to an embodiment; and FIG. 9 is an explanatory diagram showing the flow of activated species. 16A and 16B are cross-sectional views showing a modified example in which an ultraviolet irradiation unit is provided on the mask during ultraviolet irradiation (A) and when the mask is lowered (B). A cross-sectional view showing a case in which the bottom surface of a hole is used as a mask stopper. A cross-sectional view showing a component supply body of a second embodiment in which an ultraviolet irradiation unit is provided on the gauging section during loading and unloading (A), during receiving and transferring (B), during placing the component supply body on a stage (C), and during ultraviolet irradiation (D). A plan view showing a component supply body before (A) and after (B) loading onto the ultraviolet irradiation unit and mask of the embodiment of FIG. 13. A cross-sectional view showing a component supply body of a third embodiment in which an ultraviolet irradiation unit is provided on the gauging section during loading. An explanatory diagram showing a procedure for ultraviolet irradiation by the ultraviolet irradiation unit following loading of the component supply body of the embodiment of FIG. 15. A cross-sectional view (A) and a plan view (B) showing a modified example in which an ultraviolet irradiation unit is provided on the gauging section during ultraviolet irradiation. An explanatory diagram showing a fourth embodiment in which an ultraviolet irradiation unit is provided in the adjustment processing section. 10A and 10B are enlarged cross-sectional views showing a mask of a fifth embodiment, in which protrusions with curved tips are provided on portions directly facing the adhesive sheet, when separated from the adhesive sheet (A) and when in contact with the adhesive sheet (B). 10B are enlarged cross-sectional views showing a mask of a modified embodiment, in which protrusions with flat tips are provided on portions directly facing the adhesive sheet, when separated from the adhesive sheet (A) and when in contact with the adhesive sheet (B).10A is a cross-sectional view showing a state in which a modified mask having an inclined surface provided in a portion directly facing the adhesive sheet is in contact with the adhesive sheet, and an enlarged cross-sectional view (B) of (A). FIG. 10B is an enlarged cross-sectional view (A) of a modified mask having an inclined surface provided in a portion directly facing the adhesive sheet, with the tip thereof flat, and an enlarged cross-sectional view (B) of the mask having an uneven tip. FIG. 10C is a cross-sectional view showing a fifth embodiment not having an ultraviolet irradiation unit.

[0014] Hereinafter, embodiments of the present invention will be described with reference to the drawings. Note that the drawings are schematic diagrams, and the size, proportions, etc. of each part are exaggerated for ease of understanding.

[0015] [First embodiment] [Overview] As shown in Figures 1 and 2, a mounting system 1 of this embodiment is an example of a system in which a pre-processing unit X pre-processes a component supply body TW and a mounting board BW, which are to be processed, and a mounting unit Y mounts electronic components E (semiconductor chips) picked up from the component supply body TW onto the mounting board BW.

[0016] As shown in FIG. 1 , the component supply TW is a wafer (semiconductor wafer) W attached to an adhesive sheet T attached to a ring R. At this time, the wafer W is singulated into electronic components E (semiconductor chips). The adhesive sheet T is a thin, stretchable member with an adhesive surface, and its adhesive strength can be reduced by irradiation with UV (ultraviolet) light. In the following description, processing of the component supply TW refers to processing of the electronic components E. The mounting substrate BW is the wafer (semiconductor wafer) W onto which the electronic components E detached from the component supply TW are bonded (mounted).

[0017] As shown in FIG. 2, the mounting system 1 of this embodiment is an apparatus that performs pre-processing (activation processing, cleaning processing, washing processing) on ​​component supplies TW and mounting boards BW that have been transported in multiple numbers in a transport container F such as a FOUP (Front Opening Unified Pod) or a FOSB (Front Opening Shipping Box) in the upstream process, and then mounts electronic components E on them.

[0018] The mounting system 1 is configured by arranging multiple chambers 11b, each housing various processing devices, around a box-shaped container base 11a according to the processing requirements. The base 11a is provided with a load port 11c on which a transport container F is mounted. A transport container F housing unprocessed component supplies TW and mounting boards BW is mounted on the load port 11c, and the component supplies TW and mounting boards BW are removed one by one from the transport container F by a transport unit 190, and are transported into each chamber 11b, processed, and transported out. The base 11a is also provided with a fan filter unit (FFU) (not shown) on the ceiling, which generates a downflow of clean air to maintain a clean atmosphere within the base 11a. Such an FFU may also be provided in the chamber 11b as needed.

[0019] The mounting system 1 of this embodiment has a pre-processing device which is a pre-processing unit X that performs pre-processing including activation processing, cleaning processing, and washing processing of electronic components E, a buffer device that temporarily stores component suppliers TW and mounting boards BW, and a bonding device which is a mounting unit Y that mounts electronic components E on mounting boards BW. Note that the buffer device can also be included in the pre-processing unit X.

[0020] More specifically, the mounting system 1 of this embodiment is a system including a plasma processing apparatus 100, a supply cleaning section 110, a mounting substrate cleaning section 120, an adjustment processing section 130, a gauging section 140, an alignment section 150, a supply buffer section 160, a mounting substrate buffer section 170, a bonding section 180, a transport section 190, and a control section 200.

[0021] The pre-processing device is made up of a plasma processing device (surface processing device) 100, a supply cleaning device 110, a mounting substrate cleaning device 120, an adjustment processing device 130, a gauging device 140, and an alignment device 150. The supply buffer device 160 and a mounting substrate buffer device 170 make up a buffer device. The bonding device is made up of a bonding device 180. A transport device, which is a transport device 190, transports component supply devices TW and mounting substrates BW to and from each device. Then, a control device 200 controls each device, and the mounting system 1 is made up. As described above, the buffer devices (supply buffer device 160, mounting substrate buffer device 170) can be included in the pre-processing device.

[0022] [Plasma Processing Apparatus] The plasma processing apparatus 100 is an apparatus (surface processing unit) that performs surface treatment of the component supply body TW and the mounting substrate BW. The surface treatment is a process that modifies (activates and cleans) the surfaces where the component supply body TW and the mounting substrate BW are bonded. This modification is performed by introducing a reactive gas into a depressurized chamber, applying electric power to the reactive gas to generate plasma, and irradiating the generated active species such as ions and radicals onto the surfaces where the component supply body TW and the mounting substrate BW are bonded. The plasma processing apparatus 100 can be considered as a processing apparatus.

[0023] 3, the plasma processing apparatus 100 of this embodiment includes a chamber 11b capable of reducing the pressure inside, which is provided with a stage 20, a gas inlet 30, a plasma generator 40, a mask 50, and an exhaust port 60. The chamber 11b is also provided with a loading / unloading port LN for loading / unloading a component supplier TW or a mounting substrate BW, and the loading / unloading port LN is configured to be openable and closable by a shutter SH. In FIG. 3, the loading / unloading port LN is indicated by a dotted line, and the shutter SH is indicated by a dashed line.

[0024] (Stage) The stage 20 is used to place the component supplier TW or the mounting board BW that has been carried into the chamber 11b through the loading / unloading port LN that is opened by opening the shutter SH. In this embodiment, the stage 20 is a placement area formed on the inner bottom surface of the chamber 11b. In the following description, the side of the component supplier TW that has electronic components E attached thereto is referred to as the top, and the opposite side is referred to as the bottom.

[0025] The stage 20 is provided with a driving unit 21 that raises and lowers the component supplier TW or the mounting board BW. The driving unit 21 has rods 21a, 21b, and a driving mechanism 21c. The rods 21a and 21b are vertical, bar-shaped members that airtightly penetrate the bottom of the chamber 11b and are capable of moving up and down. A plurality of rods 21a are arranged at positions where they can support the underside of the component supplier TW. More specifically, they support the underside of the ring R. The rods 21a are first rods on which the component supplier TW that is carried in and out of the chamber 11b is placed. A plurality of rods 21b are arranged at positions where they can support the underside of the mounting board BW. The rods 21b are second rods on which the mounting board BW that is carried in and out of the chamber 11b is placed.

[0026] In this embodiment, the mounting substrate BW is smaller than the component supplier TW. Therefore, the mounting substrate BW needs to be supported on the inside of the component supplier TW. For this reason, the rod 21b is positioned on the inside of the rod 21a. This allows the plasma processing apparatus 100 to process both the component supplier TW and the mounting substrate BW.

[0027] As shown in Figures 4(A) to 4(C), in this embodiment, three rods 21a are arranged at equal intervals along the inside of the outer circumferential circle of the component supplier TW. Also, as shown in Figures 4(A), 5(A), and 5(B), three rods 21b are arranged at equal intervals along the inside of the outer circumferential circle of the mounting board BW. Note that Figure 4(B) is a cross-sectional view taken along the arrow a-a in Figure 4(A), and Figure 4(C) is a cross-sectional view taken along the arrow b-b in Figure 4(A). Also, in Figures 3 to 7, 10 to 12, and 23, rods 21a and 21b, as well as rod 51a and support shaft 50a (described later) that do not appear in the actual cross section are shown to make the operation easier to understand.

[0028] The drive mechanism 21c moves the rods 21a and 21b up and down to raise and lower the component supplier TW and the mounting board BW. An air cylinder, for example, is used as the drive mechanism 21c. However, the drive mechanism 21c is not limited to this and may be any mechanism capable of moving the rods 21a and 21b, such as a hydraulic cylinder or a ball screw mechanism.

[0029] Furthermore, the stage 20 of this embodiment is provided with an ultraviolet ray irradiation unit 23, as shown in FIGS. 3 and 4C. The ultraviolet ray irradiation unit 23 irradiates the adhesive sheet T with UV light so as to reduce the adhesive force of the adhesive sheet T between the ring R and the wafer W. This irradiation is performed before removing the mask 50 from the component supply body TW, which is covered with the mask 50, in order to expose the component supply body TW to the activated species. The ultraviolet ray irradiation unit 23 has a plurality of light sources arranged along the ring-shaped portion between the ring R and the wafer W. As the light source, for example, an LED element that outputs UV light is used.

[0030] The ultraviolet irradiation unit 23 in this embodiment is configured by LED elements arranged in a ring shape and fitted under the stage 20, i.e., at the bottom of the chamber 11b, so as to face the underside of the adhesive sheet T to the ring-shaped portion between the ring R and the wafer W. The ultraviolet irradiation unit 23 is connected to the control unit 200, which will be described later, and the timing of light emission is controlled by the control unit 200. The ultraviolet irradiation unit 23 irradiates UV light onto the surface of the adhesive sheet T opposite the adhesive surface to which the wafer W is attached, but the UV light penetrates the adhesive sheet T to reach the adhesive surface, thereby reducing the adhesive strength.

[0031] (Gas Inlet) The gas inlet 30 is an opening for introducing a reaction gas into the reduced pressure chamber 11b. The gas inlet 30 is provided on the side of the chamber 11b so that the reaction gas can be introduced above the stage 20. A supply device 31 is connected to the gas inlet 30 via a pipe 31a. The supply device 31 supplies the reaction gas from the gas inlet 30 into the chamber 11b. The reaction gas may be, for example, N ２ The reactive gas may be a rare gas such as He, Ar, or Ne, or oxygen or hydrogen. Water vapor may also be added. By using these reactive gases, the surface of the object to be treated is cleaned to remove organic matter, and the surface of the object to be treated is cleaned to remove organic matter, for example, SiO ２ The surface can be activated by cutting the joints. In addition, hydroxyl groups can be added to the surface by adding water vapor. Hereinafter, the space into which the reaction gas is introduced is referred to as the gas space GA.

[0032] (Plasma Generator) The plasma generator 40 generates active species by converting a reactive gas into plasma. These active species are irradiated onto the joining surfaces of the component supply body TW and the mounting board BW, thereby activating and cleaning the respective surfaces. As shown in FIG. 3 , the plasma generator 40 includes an antenna 41, a power supply 42, and a matching box 43. The antenna 41 is provided outside the chamber 11b at a position corresponding to the upper part of the gas space GA. A window member 11d is provided in the chamber 11b between the antenna 41 and the gas space GA. The window member 11d is made of a dielectric material such as quartz. When a high-frequency voltage is applied to the antenna 41, the antenna 41 generates plasma P in the gas space GA through inductive coupling via the window member 11d.

[0033] The power supply 42 is connected to the antenna 41 and applies a high-frequency voltage to the antenna 41. The matching box 43 is a matching circuit connected between the power supply 42 and the antenna 41. The matching box 43 stabilizes the discharge of the plasma P by matching the impedance on the input side and the impedance on the output side.

[0034] 3 and 4, the mask 50 is provided in the chamber 11b, exposes the wafer W, and covers the ring R and a portion of the adhesive sheet T while being spaced apart from the adhesive sheet T. In FIG. 4A, the rods 21a and 21b are below the mask 50, but are shown by solid lines for ease of understanding. The mask 50 is disposed so as to surround the periphery of the wafer W attached to the center of the ring R. More specifically, the mask 50 is a ring-shaped member that covers the exposed surface of the adhesive sheet T other than the area where the wafer W is attached and the top surface of the ring R. The inner diameter of the mask 50 is preferably equal to or larger than the outer diameter of the wafer W so that the wafer W is exposed, and is large enough so that the exposed surface of the adhesive sheet T to which the wafer W is not attached is covered by the mask 50. It is preferable to prevent the mask 50 from becoming a source of contamination for the wafer W by making the mask 50 from a material such as quartz that has a low sputtering rate with the plasma P, or by applying a plasma-resistant surface treatment such as coating yttria to SUS.

[0035] Furthermore, if a misalignment occurs in the position of the wafer W, assuming that the inner diameter of the mask 50 is the same as the outer diameter of the wafer W, the outer edge of the wafer W will be covered in the direction of the misalignment, and the adhesive sheet T near the outer edge of the wafer W will not be covered in the opposite direction.

[0036] In such a case, in order to minimize the occurrence of a state in which the sheet T is not covered, it is conceivable to make the inner diameter of the mask 50 smaller than the outer diameter of the wafer W. In this case, it is necessary to pay attention to the influence on the processing of the electronic components E located on the peripheral portion of the wafer W. Of course, even if the sheet T is not covered, it is acceptable as long as the influence of exposure to activated species is within an acceptable range.

[0037] Therefore, the inner diameter of the mask 50 relative to the outer diameter of the wafer W may vary to some extent in consideration of the accuracy of attaching the wafer W to the ring R and the balance between plasma processing and particle suppression. In other words, the inner diameter of the mask 50 is not limited to being the same as the outer diameter of the wafer W.

[0038] 5, the mask 50 has a protruding portion 501 that protrudes toward the adhesive sheet T in a portion that directly faces the adhesive sheet T between the ring R and the wafer W. "Directly facing" means that the adhesive sheet T and the mask 50 face each other without any other member interposed between them. The protruding portion 501 is ring-shaped, and its inner diameter is larger than the outer diameter of the wafer W and smaller than the inner diameter of the ring R. The lower end surface of the protruding portion 501 forms an opposing surface 502 that faces the upper surface of the adhesive sheet T in parallel.

[0039] The mask 50 is movable between a cover position (see FIG. 3 ) where the mask 50 covers the ring R and the region of the adhesive sheet T between the ring R and the wafer W, and an exposure position (see FIG. 4B ) where the mask 50 exposes the region of the adhesive sheet T between the ring R and the wafer W. That is, the mask 50 is movable between a cover position (a masking position) and an uncovered position (an unmasking position where the region is exposed) where the mask 50 covers the ring R and a part of the component supplier TW. This movement is performed by a drive unit 51 raising and lowering the mask 50, as described below. When the mask 50 is in the cover position, the opposing surface 502 of the protrusion 501 is positioned between the wafer W and the ring R and approaches the adhesive sheet T. The exposure position is a position where the mask 50 is farther from the adhesive sheet T than the cover position, and the height position of the opposing surface 502 is higher than the top surfaces of the ring R and the wafer W.

[0040] A plurality of support shafts 50a protrude from the bottom of the mask 50 along the inside of the outer circumferential circle of the mask 50. The support shafts 50a are inserted into holes 11e provided in the bottom of the chamber 11b so as to be movable up and down. Stoppers 11f are provided on the upper edges of the holes 11e. The stoppers 11f are protrusions formed to restrict the descent of the mask 50 to a predetermined height position. In this embodiment, the stoppers 11f maintain the height of the mask 50 when the mounting board BW is placed on it at the same height as when the mask 50 covers the component supplier TW. As will be described later, the support shafts 50a in this embodiment are divided into three support shafts SA for lifting and three support shafts SB for downward biasing (see FIG. 4).

[0041] The mask 50 is provided so as to be able to move up and down by a driving unit 51. As shown in Fig. 4B, the driving unit 51 has a rod 51a and a driving mechanism 51b. The rod 51a is a vertical rod-shaped member that airtightly penetrates the bottom of the chamber 11b so as to be able to move up and down.

[0042] A plurality of rods 51a are arranged at positions capable of supporting the lower surface of the mask 50. In this embodiment, three rods 51a protrude through the holes 11e and come into contact with the three support shafts SA (50a), respectively.

[0043] 6A to 6D, the driving mechanism 51b moves the rod 51a up and down to raise and lower the mask 50. An air cylinder, for example, is used as the driving mechanism 51b. However, the driving mechanism 51b is not limited to this and may be any mechanism that can move the rod 51a, such as a hydraulic cylinder or a ball screw mechanism.

[0044] As shown in FIG. 7 , the support shaft SB (50a) is biased downward by a biasing member 11g provided in the hole 11e. FIG. 7 shows a state in which the support shaft SA (50a), not shown in FIG. 7 , has descended and the mask 50 is in contact with the ring R and is stationary. In FIG. 7 , the dashed-dotted line indicates a state in which the mask 50 is pushed up. In this embodiment, the biasing member 11g is a tension spring whose both ends are engaged with a spring post 11h provided in a through-hole formed in the support shaft 50a (SB) and a spring post 11i provided in the hole 11e of the chamber 11b, and which biases the mask 50 downward. The rod 51a does not contact the support shaft SB (50a), and the downward biasing of the support shaft SB (50a) presses the support shaft SA (50a) into contact with the rod 51a via the mask 50.

[0045] (Exhaust Port) As shown in FIG. 3, the exhaust port 60 is an opening for exhausting gas from the chamber 11b. In this embodiment, the exhaust port 60 is provided on the side surface of the chamber 11b. An exhaust device 61 is connected to the exhaust port 60 via a pipe 61a. The exhaust device 61 reduces the pressure inside the chamber 11b through the exhaust port 60. The exhaust device 61 also exhausts reaction gas from the chamber 11b (see FIG. 3).

[0046] [Supplier Cleaning Unit] The supplier cleaning unit 110 is a processing device that cleans the component supplier TW. The supplier cleaning unit 110 uses cleaning liquid L to clean particles remaining on the plasma-treated component supplier TW or particles generated by the plasma treatment. The cleaning targets are the surfaces of the electronic components E, the spaces between the electronic components E, and the surface of the adhesive sheet T, and particles adhering to these surfaces are cleaned and removed. As shown in FIG. 8 , the supplier cleaning unit 110 includes a cleaning chamber 111, which is a container in which the cleaning treatment is performed, a support unit 112 that supports the component supplier TW, a rotation mechanism 113 that rotates the support unit 112, a cup 114 that receives the scattering cleaning liquid L from around the component supplier TW, and a supply unit 115 that supplies the cleaning liquid L.

[0047] The cleaning chamber 111 is provided with an opening 111a through which the component supply TW is carried in and out, and the opening 111a is configured to be openable and closable by a shutter 111b. The component supply TW is carried in and out of the cleaning chamber 111 by the transport unit 190 through the opening 111a opened by opening the shutter 111b. At this time, the cup 114 is retracted by a lifting mechanism (not shown). The upper surface of the support unit 112 is provided with an eccentric pin that rotates and holds the outer periphery of the component supply TW. The supply unit 115 is provided with a nozzle 115a that drips cleaning liquid L and a movement mechanism 115b that moves the nozzle 115a.

[0048] The cleaning process is performed by supplying a cleaning liquid L from a nozzle 115a to the surface to be processed of the component supply body TW, which is held by an eccentric pin of the support part 112 and rotated by a rotation mechanism 113. The cleaning liquid L is, for example, DIW.

[0049] The rotation mechanism 113 of the supply cleaning unit 110 is equipped with an expansion unit (not shown) that stretches (expands) the adhesive sheet T of the supply cleaning unit 110 supported by the support unit 112 to widen the gap between the electronic components E and also clean any particles in that gap.

[0050] [Mounting Substrate Cleaning Unit] The mounting substrate cleaning unit 120 is a processing device that cleans the mounting substrate BW. The mounting substrate cleaning unit 120 uses cleaning liquid L to clean particles remaining on the plasma-treated mounting substrate BW or particles generated by the plasma processing. Similar to the supplier cleaning unit 110 shown in FIG. 8 , the mounting substrate cleaning unit 120 includes a cleaning chamber 111, which is a container in which the cleaning process is performed, a support unit 112 that supports the mounting substrate BW, a rotation mechanism 113 that rotates the support unit 112, a cup 114 that receives the scattering cleaning liquid L from around the mounting substrate BW, and a supply unit 115 that supplies the cleaning liquid L. When DIW, for example, is used as the cleaning liquid L, hydroxyl groups can be added to the surface of the mounting substrate BW in addition to the water cleaning.

[0051] [Adjustment Processing Unit] The adjustment processing unit 130 is a processing device that adjusts the adhesive sheet T of the component supply unit TW by irradiating it with UV light to reduce the adhesive strength of the adhesive sheet T. This is to allow the electronic components E to be easily detached from the component supply unit TW in order to mount the electronic components E on the mounting board BW. As shown in FIG. 1 , the adjustment processing unit 130 has an irradiation device 131 that irradiates the entire area below the accommodated component supply unit TW with UV light by scanning a UV light source.

[0052] [Gauging Unit] The gauging unit 140 is a processing device that positions the component supply unit TW. The gauging unit 140 is a contact-type centering device that adjusts the position by contacting the outer periphery of the component supply unit TW so that the center of the component supply unit TW coincides with a reference position set inside the gauging unit 140.

[0053] [Alignment Unit] The alignment unit 150 is a processing device that positions the mounting substrate BW. The alignment unit 150 is a non-contact (optical) centering device that adjusts the position of the mounting substrate BW so that the center of the mounting substrate BW coincides with a reference position provided inside.

[0054] [Supplier Buffer Section] The supplier buffer section 160 is a processing device that temporarily stores component suppliers TW before they are carried into the bonding section 180. As shown in FIG. 1 , the supplier buffer section 160 has a storage shed 161 that can store multiple component suppliers TW stacked at intervals.

[0055] [Mounting Board Buffer Section] The mounting board buffer section 170 is a processing device that temporarily stores mounting boards BW before they are carried into the bonding section 180. The mounting board buffer section 170 has a storage facility 171 that can store multiple mounting boards BW stacked at intervals.

[0056] [Bonding Section] The bonding section 180 is a processing chamber in which electronic components E are detached from the component supply body TW processed by the plasma processing apparatus 100 and mounted on a mounting substrate BW. The bonding section 180 includes a supply mechanism, a pickup mechanism, and a mounting mechanism (not shown), and the pickup mechanism picks up the electronic component E from the component supply body TW carried into the supply mechanism by the transport section 190, transfers it to the mounting mechanism, and the mounting mechanism mounts it on the mounting substrate BW carried into the mounting mechanism by the transport section 190. Note that the bonding section 180 of this embodiment inverts the picked-up electronic component E and mounts the pre-treated surface on the surface of the mounting substrate BW that has also been pre-treated, as shown in FIG.

[0057] [Transport Unit] The transport unit 190 transports component supply items TW and mounting substrates BW between the load port 11c and each chamber 11b, between each chamber 11b, and between the supply item buffer unit 160, the mounting substrate buffer unit 170, and the bonding unit 180. As shown in FIG. 2 , the transport unit 190 has a transport robot 191 and a movement mechanism 192. The transport robot 191 is of a double-arm type and has a pair of robot hands 191a. The pair of robot hands 191a can support the component supply items TW and mounting substrates BW, respectively. The movement mechanism 192 moves the transport robot 191 and positions it at the load port 11c, each chamber 11b, and the bonding unit 180. The robot hands 191a transport the component supply items TW and mounting substrates BW into and out of each transport container F, each chamber 11b, and the bonding unit 180.

[0058] [Control Unit] The control unit 200 is a computer that controls each unit of the mounting system 1. The control unit 200 has a processor that executes programs, a memory that stores various information such as the programs and operating conditions, and a drive circuit that drives each element. That is, the control unit 200 controls the plasma processing apparatus 100, the supply body cleaning unit 110, the mounting substrate cleaning unit 120, the adjustment processing unit 130, the gauging unit 140, the alignment unit 150, the supply body buffer unit 160, the mounting substrate buffer unit 170, the bonding unit 180, and the transport unit 190. The control unit 200 also controls the timing of light emission from the ultraviolet light irradiation unit 23, as will be described later.

[0059] [Operation] The operation of the mounting system 1 of this embodiment as described above will be described with reference to the flowchart in Fig. 9 and the explanatory diagram in Fig. 10 in addition to Figs. 1 to 8. A mounting method for mounting an electronic component E on a mounting board BW according to the following procedure is also one aspect of this embodiment. Note that the following description follows the flowchart in Fig. 9, but includes situations in which each process is performed simultaneously in parallel.

[0060] 2, a transport container F containing a component supply TW and a transport container F containing a mounting substrate BW are loaded on the load port 11c. The transport robot 191 receives the component supply TW from the transport container F loaded on the load port 11c and transports the component supply TW to the plasma processing apparatus 100.

[0061] The plasma processing apparatus 100 activates and cleans the surfaces of the electronic components E on the component supply body TW by plasma processing (supply body surface processing step: step S101). That is, as shown in FIGS. 4A to 4C, the shutter SH opens, and the robot hand 191a of the transport robot 191 supporting the component supply body TW is inserted through the loading / unloading port LN to position the component supply body TW above the rod 21a. Note that in FIG. 4A, the rods 21a and 21b are below the mask 50, but are shown with solid lines for ease of understanding. Also, in FIG. 4C, the loading / unloading port LN is shown with a dotted line, and the shutter SH is shown with a dashed line. At this point, the shutter SH moves downward, and the loading / unloading port LN is open.

[0062] Once the component supplier TW is positioned, as shown in Fig. 6(A), the drive mechanism 21c raises the rod 21a to lift the component supplier TW from the robot hand 191a, and the rod 21a receives the component supplier TW from the robot hand 191a. Next, as shown in Fig. 6(B), the robot hand 191a retracts, and the shutter SH closes as shown in Fig. 3. Then, the exhaust device 61 evacuates the chamber 11b to create a vacuum.

[0063] As shown in Figure 6(C), the driving mechanism 21c lowers the rod 21a to place the component supplier TW on the stage 20. At this time, the mask 50 is in the exposed position. In this state, the ultraviolet irradiation unit 23 starts irradiating the adhesive sheet T with UV light. The irradiation continues until the time required for the adhesive force to disappear has elapsed. This reduces the adhesive force in the area of ​​the adhesive sheet T between the ring R and the wafer W (the shaded area in the figure).

[0064] 6(D), the driving unit 51 lowers the rod 51a, and the mask 50 is lowered by the biasing force of the biasing member 11g, bringing the mask 50 into contact with the ring R and into a cover position that covers the ring R and the area of ​​the adhesive sheet T between the ring R and the wafer W. At this time, as shown in FIG. 7, the mask 50 is pressed against the ring R by the biasing force of the biasing member 11g and is stopped. Then, the rod 51a moves away from the support axis SA (50a) of the mask 50. Furthermore, the opposing surface 502 of the protrusion 501 enters between the wafer W and the ring R and approaches the portion where the adhesive strength of the adhesive sheet T has decreased (the shaded area in the figure).

[0065] In this state, as shown in Fig. 3, the supply device 31 supplies the reactive gas to the gas space GA, and the power supply 42 applies high-frequency power to the antenna 41, thereby generating plasma P in the gas space GA. The reactive gas is converted into plasma, generating active species such as ions and radicals, which activate and clean the surfaces of the electronic components E. The reactive gas is exhausted from the exhaust port 60 by the exhaust device 61. In Fig. 3, the release of the active species is indicated by arrows. The active species are released from the plasma P in all directions, but for ease of understanding, the illustration shows the active species directed toward the component supplier TW (as well as the mounting board BW).

[0066] 10, the active species that are heading toward the vicinity of the outer periphery of the wafer W, i.e., the vicinity between the ring R and the electronic component E (the region indicated by the dotted line in the figure), are blocked by the mask 50. In particular, by having the opposing surface 502 of the protruding portion 501 positioned between the wafer W and the ring R, the active species are prevented from coming into contact with the ring R and the exposed surface of the adhesive sheet T (the portion indicated by the thick L in the figure).

[0067] After the surface treatment of the component supply TW, as shown in FIG. 6(C), the drive unit 51 raises the rod 51a, raising the mask 50 against the biasing force of the biasing member 11g, and separating the mask 50 from the ring R (see FIG. 7). Next, as shown in FIG. 6(B), the drive mechanism 21c raises the rod 21a, thereby lifting the component supply TW. The shutter SH opens, and as shown in FIG. 6(A), the robot hand 191a is inserted through the loading / unloading opening LN. As shown in FIGS. 4(A) to 4(C), the drive mechanism 21c lowers the rod 21a, and the component supply TW is placed on the robot hand 191a and transferred. The robot hand 191a then carries the component supply TW out through the loading / unloading opening LN.

[0068] While the surface treatment of the component supply body TW is being performed, the transport robot 191 receives the mounting substrate BW from the transport container F. The transport robot 191 receives the component supply body TW whose surface treatment has been completed from the rod 21a of the plasma processing apparatus 100, and transfers the mounting substrate BW to the plasma processing apparatus 100. The plasma processing apparatus 100 activates and cleans the surface of the mounting substrate BW by plasma treatment (mounting substrate surface treatment process: step S102).

[0069] The procedure for plasma processing the mounting substrate BW is the same as that for the component supplier TW. However, as shown in Figures 5A and 5B, the mounting substrate BW is supported by rods 21b and moves up and down. The height of the mask 50 is maintained at a distance from the mounting substrate BW by stoppers 11f.

[0070] The transport robot 191 delivers the surface-treated component supply TW to the support unit 112 of the supply cleaning unit 110. The supply cleaning unit 110 rotates the component supply TW using the support unit 112 and the rotation mechanism 113 while supplying cleaning liquid L to clean it (supply cleaning process: step S103). At this time, the adhesive sheet T of the supply cleaning unit 110 is expanded by the expander, so that the electronic components E are cleaned with the spacing between them widened. After cleaning by supplying cleaning liquid L, the electronic components are then rotated at high speed to shake off the cleaning liquid L and dry, and then the expander releases the adhesive sheet T to contract it to its original state, restoring the spacing between the electronic components E to its original state.

[0071] After the surface treatment of the mounting substrate BW in the plasma processing apparatus 100 is completed, the transfer robot 191 receives the mounting substrate BW from the plasma processing apparatus 100 and transfers it to the mounting substrate cleaning unit 120. The mounting substrate cleaning unit 120 cleans the mounting substrate BW by supplying cleaning liquid L while rotating the mounting substrate BW (mounting substrate cleaning step: step S104). After cleaning by supplying cleaning liquid L, the mounting substrate BW is dried by rotating at high speed to shake off the cleaning liquid L. This mounting substrate cleaning step includes a state in which it is performed simultaneously with the supply body cleaning step. In other words, the time during which the component supply body TW is cleaned and the time during which the mounting substrate BW is cleaned overlap.

[0072] After the cleaning process of the component supply TW is completed, the transport robot 191 receives the component supply TW from the supply cleaning unit 110 and hands it over to the gauging unit 140. The gauging unit 140 aligns the component supply TW (positioning process: step S105). After the alignment is complete, the transport robot 191 receives the component supply TW from the gauging unit 140 and hands it over to the adjustment processing unit 130. The adjustment processing unit 130 performs an adjustment process to reduce the adhesive strength of the adhesive sheet T by irradiating the component supply TW from below with UV light (adjustment process: step S106). These positioning and adjustment processes overlap with the mounting substrate cleaning process.

[0073] After the cleaning process of the mounting substrate BW is completed, the transfer robot 191 receives the mounting substrate BW from the mounting substrate cleaning unit 120 and hands it over to the alignment unit 150. The alignment unit 150 aligns the mounting substrate BW (positioning step: step S107).

[0074] After the adjustment process is completed, the transport robot 191 receives the component supply TW from the adjustment processing unit 130 and hands it over to the supply buffer unit 160. After the alignment of the mounting board BW is completed, the transport robot 191 receives the mounting board BW from the alignment unit 150 and hands it over to the mounting board buffer unit 170.

[0075] In this way, the component supply items TW and the mounting boards BW are accommodated in the supply item buffer section 160 and the mounting board buffer section 170 (accommodation step: step S108), and when the bonding section 180 becomes ready to accept them, the transport robot 191 receives the component supply items TW and the mounting boards BW and hands them over to the bonding section 180. That is, in response to a signal from the bonding section 180 indicating that the processing is complete and the bonding section 180 is ready to accept them, the transport robot 191 removes the component supply items TW and the mounting boards BW from the supply item buffer section 160 and the mounting board buffer section 170 and carries them into the bonding section 180. In the bonding section 180, the electronic components E are picked up from the component supply items TW and mounted on the mounting boards BW (mounting step: step S109).

[0076] After mounting is complete, the component supply unit TW and the mounting board BW are handled as follows: First, the component supply unit TW from which all mountable electronic components E have been picked up, and the mounting board BW from which electronic components E have been mounted in all mounting areas, are both ejected outside the mounting system 1 by another transport robot (not shown). Alternatively, the component supply unit TW and the mounting board BW are returned to the supply unit buffer unit 160 and the mounting board buffer unit 170 by the transport unit 190. Alternatively, the component supply unit TW and the mounting board BW are directly transported by the transport unit 190 to the load port 11c and returned to each transport container F.

[0077] [Effects] (1) The processing apparatus (plasma processing apparatus 100) of this embodiment as described above includes a stage 20 on which a component supply body TW is placed, the component supply body TW having a wafer W diced into electronic components E attached to an adhesive sheet T attached to a ring R and having adhesive properties; a chamber 11b in which the stage 20 is provided and whose interior can be depressurized; a gas inlet 30 for introducing a reactive gas into the depressurized chamber 11b; a plasma generator 40 for generating active species by plasmatizing the reactive gas; a mask 50 for exposing the wafer W and covering the ring R and the area of ​​the adhesive sheet T between the ring R and the wafer W; and an ultraviolet irradiation unit 23 for irradiating ultraviolet light onto the adhesive sheet T so as to reduce the adhesive force of the adhesive sheet T between the ring R and the wafer W before removing the mask 50 from the component supply body TW covered with the mask 50 to expose the component supply body TW to the active species.

[0078] In this way, the adhesive force of the region of the adhesive sheet T between the ring R and the wafer W can be reduced, so that even if the mask 50 approaches the adhesive sheet T and comes into contact with the adhesive sheet T, the adhesive sheet T can be prevented from sticking to it. In particular, when the gap between the mask 50 and the adhesive sheet T is made very small, even if the mask 50 comes into contact with the adhesive sheet T due to deformation such as twisting of the ring R or deformation of the adhesive sheet T caused by temperature changes, or deformation of the adhesive sheet T that occurs during use of the component supplier TW in which mounting is stopped before all electronic components E are mounted and then started again, the adhesive sheet T can be prevented from sticking to the mask 50. Furthermore, even if the mask 50 is brought into contact with the adhesive sheet T to prevent the intrusion of active species, the adhesive sheet T can be prevented from sticking to the mask 50.

[0079] This prevents the mask 50 from sticking to the adhesive sheet T, making it impossible to carry out the component supply body TW. Furthermore, by bringing the mask 50 closer to the adhesive sheet T to reduce the gap between the mask 50 and the adhesive sheet T, or by bringing the mask 50 into contact with the adhesive sheet T, it becomes difficult for active species to penetrate into the region between the ring R and the wafer W, including the adhesive sheet T, and plasma processing of the exposed portion of the adhesive sheet T and the ring R is suppressed. This reduces contamination caused by organic matter constituting the adhesive sheet T, organic matter on the surface of the ring R, and metals constituting the ring R scattering and adhering to the wafer W.

[0080] (2) The mask 50 has a protruding portion 501 that protrudes toward the adhesive sheet T in a portion that directly faces the region of the adhesive sheet T between the ring R and the wafer W. Therefore, the protruding portion 501 of the mask 50 can be placed between the ring R and the wafer W and can be brought closer to the adhesive sheet T to cover it, making it more difficult for active species to penetrate, and contamination of the wafer W can be further reduced.

[0081] (3) The mask 50 is provided so as to be movable between a cover position that covers the ring R and the region of the adhesive sheet T between the ring R and the wafer W, and an exposure position that exposes the region of the adhesive sheet T between the ring R and the wafer W, and the ultraviolet light irradiation unit 23 irradiates the adhesive sheet T with UV light while the mask 50 is in the exposure position. Therefore, the adhesive force of the mask 50 can be reduced before it approaches the adhesive sheet T.

[0082] (4) The stage 20 is configured so that the component supply body TW and the mounting board BW on which the electronic components E are mounted can be selectively placed thereon. This allows the surface treatment of not only the component supply body TW but also the mounting board BW to be performed using the common plasma processing apparatus 100. This simplifies the mounting system 1. It also prevents the mounting system 1 from becoming too large.

[0083] 11A and 11B, the ultraviolet ray irradiation unit 23 may be provided on the mask 50 instead of the stage 20. The ultraviolet ray irradiation unit 23 has a plurality of light sources arranged along a ring-shaped portion between the ring R and the wafer W inside the mask 50.

[0084] The light source is an LED element, as described above. A plurality of LED elements are arranged in a row on the upper portion of the protruding portion 501 of the mask 50 so as to face the upper surface of the ring-shaped adhesive sheet T between the ring R and the wafer W, and emit UV light toward the facing surface 502. The LED elements are housed, for example, in holes formed inside the mask 50, which is divided into upper and lower halves, and are incorporated into the mask 50 by bonding the upper and lower masks 50 together. Alternatively, the LED elements may be incorporated into the mask 50 by housing a light source in a hole formed in the protruding portion 501 and closing it with a lid having the facing surface 502. The ultraviolet irradiation unit 23 is connected to the control unit 200, and the timing of light emission is controlled by the control unit 200.

[0085] Since the mask 50 is made of a material that transmits UV light, such as quartz, the UV light from the ultraviolet light irradiation unit 23 can pass through the opposing surface 502 and irradiate the adhesive surface of the adhesive sheet T with UV light, thereby reducing the adhesive strength of the adhesive surface. Note that the portion that transmits UV light may be only the portion where the UV light is irradiated toward the region between the ring R of the adhesive sheet T and the wafer W. For example, it may be only the protrusion 501. Alternatively, any space such as a hole or groove may be used as long as it can transmit UV light.

[0086] 11(A), when the driving unit 51 lowers the rod 51a, thereby lowering the mask 50 by the biasing force of the biasing member 11g, the ultraviolet light irradiation unit 23 irradiates the adhesive sheet T with UV light as indicated by the arrow below the opposing surface 502 in the figure. This reduces the adhesive force of the adhesive sheet T in the region between the ring R and the wafer W (the shaded region in the figure). Then, as shown in FIG. 11(B), the mask 50 comes into contact with the ring R, and the mask 50 is in the cover position.

[0087] This reduces the adhesive force of the adhesive sheet T between the ring R and the wafer W, thereby preventing the adhesive sheet T from sticking to the mask 50 that is close to the adhesive sheet T. Therefore, the same effect as that of the above aspect can be obtained.

[0088] (2) As described above, whether the ultraviolet irradiation unit 23 is provided on the stage 20 or on the mask 50, the ultraviolet irradiation unit 23 may start irradiating the adhesive sheet T with UV light while the mask 50 is in the cover position (see FIGS. 7 and 11(B)). In this case, irradiation is also continued until the time required for the adhesive force to disappear has elapsed. This reduces the adhesive force of the adhesive sheet T even if the mask 50 has once come into contact with the adhesive sheet T, making it easier to peel off.

[0089] In the above example, after the irradiation time required for adhesive force loss has elapsed at the exposed position, the mask 50 is moved to the covered position. Furthermore, UV light is irradiated at the covered position until the irradiation time required for adhesive force loss has elapsed. Furthermore, UV light irradiation to the adhesive sheet T may be started while the mask 50 is between the covered position and the exposed position. That is, the ultraviolet light irradiation unit 23 may irradiate UV light while the mask 50 is moving from the exposed position to the covered position. This allows the UV light irradiation time required for adhesive force loss to overlap with other operations, thereby shortening the takt time. As described above, UV light irradiation may be started at any time after the surface treatment (plasma treatment) is completed and before the mask 50 is raised.

[0090] (3) In the above embodiment, the plasma processing apparatus 100 performs surface processing on both the component supply body TW and the mounting board BW. When processing the component supply body TW, the mask 50 stops in contact with the ring R when in the cover position, as shown in FIG. 6D. When processing the mounting board BW, the mask 50 stops in contact with the stopper 11f when in the cover position, as shown in FIG. 5B. However, the present invention is not limited to this embodiment.

[0091] The lowered mask 50 may be stopped with a gap between it and the ring R, without contacting the ring R. This makes it possible to prevent particles from being generated when the mask 50 comes into contact with the ring R. In this case, the mask 50 is stopped by the stopper 11f or when the support shaft SA (50a) hits the bottom of the hole 11e, leaving a gap between the mask 50 and the ring R.

[0092] Similarly, the lowered mask 50 may be stopped with a gap between it and the stopper 11f or the stage 20, without contacting the stopper 11f or directly contacting the stage 20. This makes it possible to prevent particles from being generated when the mask 50 contacts the stopper 11f or the stage 20. In this case, the support shaft SA (50a) is set to stop when it hits the bottom of the hole 11e, leaving a gap between the mask 50 and the stage 20.

[0093] For example, as shown in Fig. 12, instead of the stopper 11f provided in the chamber 11b, the bottom surface of the hole 11e may function as the stopper. In this case, the mask 50 does not come into direct contact with the stage 20, so particles are not generated due to contact. Also, since the stopper 11f is not provided on the stage 20, a simple structure can be achieved. Note that while Fig. 12 shows the state in which a mounting board BW is processed, it can also be applied to the case in which a component supply TW is processed.

[0094] In the above embodiment, the ultraviolet irradiation unit 23 in the plasma processing apparatus 100 irradiates UV light to reduce adhesion. However, UV light irradiation may also be performed in the gauging unit 140 or the adjustment processing unit 130. Before plasma processing (surface treatment) is performed in the plasma processing unit (surface treatment unit) 100, the transport unit 190 may transport the component supply body TW to the gauging unit 140 or the adjustment processing unit 130, where UV light irradiation is performed. The transport unit 190 may then transport the UV-treated component supply body TW to the plasma processing unit (surface treatment unit) 100, where plasma processing (surface treatment) is performed. In this manner, an apparatus including the plasma processing apparatus 100 and another processing unit, such as the gauging unit 140 or the adjustment processing unit 130, is also referred to as a processing apparatus. In other words, even if an ultraviolet irradiation unit is provided in a processing unit other than the plasma processing apparatus 100, the processing apparatus may also include such an ultraviolet irradiation unit. Below, second to fourth embodiments will be described in which an ultraviolet irradiation unit is provided in a processing unit other than the plasma processing apparatus 100.

[0095] [Second Embodiment] [Configuration] The mounting system 1 of this embodiment has basically the same configuration as the first embodiment. However, in this embodiment, as shown in Figures 13(A) and 14(A), the ultraviolet irradiating unit 23 is not provided in the plasma processing apparatus 100, and an ultraviolet irradiating unit 142 is provided in the gauging unit 140. A light-shielding mask 143 is provided between the ultraviolet irradiating unit 142 and the adhesive sheet T to block UV light from reaching the area of ​​the adhesive sheet T to which the wafer W is attached.

[0096] That is, the gauging unit 140 of this embodiment has, within the chamber 11b, a stage 141, an ultraviolet ray irradiation unit 142, a light-shielding mask 143, a support member 144, and a positioning member 145. The chamber 11b is a container having an opening OP for carrying in and out the component supplier TW. The stage 141 is a platform on which the component supplier TW is placed via the ultraviolet ray irradiation unit 142 and the light-shielding mask 143, which will be described later. Being placed on the stage 141 also includes being placed with other members interposed between the component supplier TW and the stage 141.

[0097] The ultraviolet irradiation unit 142 is configured by arranging a plurality of rectangular plates, each having a plurality of light sources arranged in the long-side direction, parallel to the short-side direction. The outer shape of the ultraviolet irradiation unit 142 is larger than the inner diameter of the ring R. The light sources are the same as those in the first embodiment. The ultraviolet irradiation unit 142 is placed on a stage 141. The ultraviolet irradiation unit 142 may also be configured by light sources arranged in a ring shape around a light-shielding mask 143.

[0098] The light-shielding mask 143 is a circular member having the same diameter as the wafer W, and is made of or coated with a light-shielding material. The support member 144 is a rod that can be raised and lowered by a drive unit (not shown). The positioning member 145 is a rod that can be raised and lowered by a drive unit (not shown) and that can be moved toward and away from the outer periphery of the component supplier TW.

[0099] [Operation] The operation of this embodiment as described above is basically the same as that of the first embodiment, except that in this embodiment, in the gauging unit 140, the ultraviolet light irradiation unit 142 irradiates the area between the ring R on the adhesive sheet T and the wafer W from below the component supply body TW via a light-shielding mask 143.

[0100] That is, as shown in Fig. 13(A), the robot hand 191a supporting the component supplier TW enters the chamber 11b through the opening OP. As shown in Fig. 13(B), the component supplier TW arrives above the stage 141, and the raised support member 144 receives it from the robot hand 191a.

[0101] 13(C) and 14(B), after the robot hand 191a is retracted, the support member 144 is lowered, and the component supply TW is placed on the light-shielding mask 143 on the stage 141. As shown in Fig. 13(D), the positioning member 145 is raised and comes into contact with the outer periphery of the component supply TW to adjust its position, and the ultraviolet irradiation unit 142 irradiates UV light. As a result, the portion of the adhesive sheet T to which the wafer W is attached is shielded by the light-shielding mask 143, and the UV light is irradiated onto the region between the ring R and the wafer W, reducing the adhesive strength.

[0102] Thereafter, in the reverse order of the above, that is, the order of FIGS. 13(C) to 13(A), the component supply body TW is carried out of the chamber 11b by the robot hand 191a and carried into the plasma processing apparatus 100, where the surface processing is performed.

[0103] [Effect] In the processing apparatus (gauging unit 140) of this embodiment as described above, a light-shielding mask 143 that blocks UV light from reaching the area of ​​the adhesive sheet T where the wafer W is attached is provided between the ultraviolet irradiating unit 142 and the adhesive sheet T. Therefore, the ultraviolet irradiating unit 142 can reduce the adhesive strength of the area of ​​the adhesive sheet T between the ring R and the wafer W without reducing the adhesive strength of the adhesive sheet T in the area where the wafer W is attached.

[0104] This prevents the adhesive sheet T from sticking to the mask 50 in the plasma processing apparatus 100, thereby achieving the same effect as in the first embodiment. Furthermore, the ultraviolet irradiating unit 142 can be prevented from being affected by plasma, and the configuration of the plasma processing apparatus 100 can be simplified. Furthermore, the plasma processing in the plasma processing apparatus 100 and the irradiation of UV light by the ultraviolet irradiating unit 142 can be performed simultaneously in parallel, thereby improving productivity. Furthermore, a simple irradiation mechanism allows for simple irradiation control, and the adhesive sheet T can be treated with a single irradiation of UV light.

[0105] [Third Embodiment] [Configuration] The mounting system 1 of this embodiment has basically the same configuration as the first embodiment. However, in this embodiment, as shown in Fig. 15, the ultraviolet irradiating unit 23 is not provided in the plasma processing apparatus 100, and an ultraviolet irradiating unit 146 is provided in the gauging unit 140. As shown in Figs. 16(A) to 16(I), the ultraviolet irradiating unit 146 irradiates UV light from above the component supplier TW only to the portion of the adhesive sheet T that directly faces the mask 50, in accordance with the relative movement between the ultraviolet irradiating unit 146 and the component supplier TW.

[0106] That is, the gauging unit 140 has a stage 141, a support member 144, a positioning member 145, and an ultraviolet ray irradiation unit 146 inside the chamber 11b. The stage 141, the support member 144, and the positioning member 145 inside the chamber 11b are the same as those in the second embodiment. The ultraviolet ray irradiation unit 146 is provided above an opening OP inside the chamber 11b. The ultraviolet ray irradiation unit 146 has a plurality of light sources 146a arranged in a direction perpendicular to the traveling direction of the component supplier TW so as to be able to irradiate UV light toward the component supplier TW passing through the opening OP. The light sources 146a are the same as those in the second embodiment.

[0107] [Operation] The operation of this embodiment is basically the same as that of the second embodiment. However, in this embodiment, when the robot hand 191a supporting the component supplier TW enters the chamber 11b through the opening OP, the light source 146a that emits light is switched as the robot hand 191a passes through the ultraviolet irradiation unit 146. That is, as the component supplier TW moves below the ultraviolet irradiation unit 146, the light source 146a that emits light is switched from a non-emitting state as shown by the dotted light source 146a in FIG. 16(A) to a state in which UV light is irradiated only between the ring R and the wafer W as shown by the black light source 146a in FIGS. 16(B) to (H). This reduces the adhesive strength of the adhesive sheet T in the region between the ring R and the wafer W.

[0108] 16(I), when the component supplier TW passes under the ultraviolet irradiation unit 146, all of the light sources 146a stop lighting. After that, the component supplier TW arrives above the stage 141, and the raised support member 144 receives it from the robot hand 191a. Thereafter, as in the second embodiment, the position of the component supplier TW is adjusted, and the component supplier TW is carried out of the chamber 11b, and surface treatment is performed in the plasma treatment device 100.

[0109] [Effect] The processing device (gauging unit 140) of this embodiment as described above irradiates UV light only to the portion of the adhesive sheet T that directly faces the mask 50, in accordance with the relative movement between the ultraviolet irradiating unit 146 and the component supplier TW. Also, in this embodiment, the ultraviolet irradiating unit 146 has multiple light sources 146a, and the emitting light source 146a is switched in accordance with the relative movement between the ultraviolet irradiating unit 146 and the component supplier TW.

[0110] Therefore, the ultraviolet irradiation unit 146 can reduce the adhesive strength of the region of the adhesive sheet T between the ring R and the wafer W. This prevents the adhesive sheet T from sticking to the mask 50 in the plasma processing apparatus 100, and prevents the ultraviolet irradiation unit 146 from being affected by the plasma, thereby achieving the same effects as in the second embodiment. Furthermore, since the plasma processing in the plasma processing apparatus 100 and the irradiation of UV light by the ultraviolet irradiation unit 146 can be performed simultaneously in parallel, productivity can be improved. Furthermore, there is no need to provide a large irradiation unit or prepare a light-shielding mask to obtain a large irradiation area, and the mechanism can be simplified.

[0111] [Modification of the Third Embodiment] This embodiment is not limited to the above-described aspects. (1) As shown in FIGS. 17A and 17B, a rotation mechanism 147 may be provided that rotates the component supply TW relative to the ultraviolet irradiation unit 146. The rotation mechanism 147 is provided on the stage 141 and rotates the component supply TW placed on the upper surface using a drive source such as a motor. The ultraviolet irradiation unit 146 is disposed above the ring R and wafer W of the component supply TW placed on the rotation mechanism 147. As shown in FIGS. 17A and 17B, while the rotation mechanism 147 rotates the component supply TW, the ultraviolet irradiation unit 146 irradiates UV light onto the adhesive sheet T between the ring R and the wafer W, thereby reducing the adhesive strength of the adhesive sheet T in the region between the ring R and the wafer W. This achieves the same effect as described above. Furthermore, there is no need to provide an irradiation unit with multiple light sources, simplifying the configuration and eliminating the need for complex irradiation control.

[0112] (2) The ultraviolet ray irradiation unit 146 and the component supply body TW may move relative to each other. Therefore, the ultraviolet ray irradiation unit 146 may be configured to move linearly relative to the component supply body TW using an XY linear guide or to move in a circular direction using a ring guide. Furthermore, a swing mechanism or a galvanometer scanner may be used to perform circular irradiation and scanning. Note that the adhesive strength can also be reduced by collectively irradiating the area between the ring R and the wafer W on the adhesive sheet T with ultraviolet ray using the ultraviolet ray irradiation unit 146 (ring-shaped UV lamps) having multiple light sources arranged in a ring shape.

[0113] [Fourth Embodiment] A configuration similar to that of the second and third embodiments described above may be provided in the adjustment processing unit 130, rather than in the gauging unit 140. An embodiment in which the irradiation device 131 in the adjustment processing unit 130 is used as an ultraviolet irradiation unit will be described below with reference to Fig. 18. Fig. 18 shows the internal configuration of the adjustment processing unit 130, with the left side being a side view and the right side being a plan view in Figs. 18(A) to (D).

[0114] 18A, the adjustment processing section 130 is provided with a table 132 on which a component supplier TW is placed via a light-shielding mask 133. The top surface of the table 132 is made of a material that is transparent to ultraviolet light. An irradiation device 131 is provided inside the table 132. The irradiation device 131 is provided so as to be able to move back and forth horizontally within the table 132 by a drive mechanism (not shown). As in the third embodiment, the irradiation device 131 has multiple light sources 131a that are arranged in a direction perpendicular to the movement direction and irradiate UV light upward.

[0115] A plurality of lift pins 132a are provided on the table 132. The plurality of lift pins 132a are movable by a drive mechanism (not shown) between a support position where they rise to protrude from the upper surface of the table 132 and support the component supplier TW, and a standby position where they fall to be accommodated within the table 132.

[0116] The light-shielding mask 133 is formed by adhering a circular light-shielding film 133a having the same shape as the wafer W of the component supplier TW and a ring-shaped light-shielding film 133a having the same shape as the ring R to a UV-transmitting film 133b. In other words, the light-shielding mask 133 is configured to be interposed between the irradiation device 131 and the component supplier TW so that the UV light from the irradiation device 131 is blocked by the light-shielding film 133a from the areas of the wafer W and ring R, and is irradiated through the UV-transmitting film 133b to the area between the wafer W and ring R. The light-shielding mask 133 has holes 133c formed therein through which the lift pins 132a pass.

[0117] [Operation] In the present embodiment as described above, before plasma processing by the plasma processing apparatus 100, the light-shielding mask 133 is placed on the table 132 by a transport device (not shown) (see FIG. 18(A)). Next, as shown in FIG. 18(B), the component supply TW is carried in while being supported by the robot hand 191a, and as shown in FIG. 18(C), the lift pins 132a, which have risen to the support position, receive the component supply TW. The lift pins 132a are lowered to the standby position, whereby the component supply TW is placed on the light-shielding mask 133.

[0118] 18(D), the irradiation device 131 moves so as to pass under the component supplier TW, irradiating the entire component supplier TW with UV light. Because a light-shielding mask 133 is present between the component supplier TW and the light source 131a, the light-shielding film 133a prevents the UV light from being irradiated onto the area of ​​the wafer W and the ring R, and only the area of ​​the adhesive sheet T between the wafer W and the ring R is irradiated with UV light. This reduces the adhesive force of the adhesive sheet T between the ring R and the wafer W.

[0119] [Effect] As described above, in this embodiment, the adhesive force of the adhesive sheet T between the ring R and the wafer W can be reduced before plasma processing in the plasma processing apparatus 100, thereby achieving the same effect as described above.

[0120] Since UV light does not reach the portions of the adhesive sheet T stuck to the wafer W or ring R before the plasma treatment, the adhesive force of the adhesive sheet T does not decrease, and the electronic parts E or ring R do not peel off from the adhesive sheet T during transportation, cleaning treatment, etc. after the plasma treatment.

[0121] The adjustment processing unit 130, which is already equipped with the irradiation device 131 having a UV irradiation function, is used as a processing device that reduces the adhesive strength of the adhesive sheet T, so that the simple configuration can prevent the mask 50 from sticking. Furthermore, by using different light-shielding masks 133 in a common processing device, it can also be applied to adjusting the adhesive strength of the adhesive sheet T for mounting, so that the mask 50 can be prevented from sticking without increasing the system size.

[0122] [Modification of the Fourth Embodiment] This embodiment is not limited to the above-described configuration. The light-shielding mask 133 may be held with a gap between it and the light-shielding mask 133, as long as the gap is large enough to prevent peeling of the electronic components E and the ring R. As illustrated in Fig. 16, if a structure is adopted in which UV light can be selectively irradiated in accordance with the relative movement of the ultraviolet light irradiation unit 146 and the component supplier TW, the adhesive strength of the adhesive sheet T between the ring R and the wafer W can be reduced without using the light-shielding mask 133.

[0123] Fifth Embodiment [Configuration] The mounting system 1 of this embodiment has a configuration similar to that of the first embodiment. However, in this embodiment, the mask 50 has protrusions with curved tips on the portion directly facing the adhesive sheet T. Figures 19(A) and 19(B) show an example in which protrusions 502a are provided on the facing surface 502 (see Figure 4) of the protrusion 501. For example, the surface of the facing surface 502 is processed to form multiple protrusions 502a with rounded tips. This surface processing can be performed by roughening using sandblasting or microtexturing using a laser. Preferably, the height of the protrusions 502a is 10 μm or more, and the radius of the sphere formed by the curved surface is approximately 10 μm. The thickness of the adhesive layer AD provided on the surface of the substrate B of the adhesive sheet T is 10 to 20 μm.

[0124] [Effect] In the present embodiment as described above, when the mask 50 is in the cover position as shown in FIG. 11(B), the adhesive strength of the adhesive layer AD is reduced by irradiation with UV light, and further, as shown in FIG. 19(B), even if the opposing surface 502 comes into contact with the adhesive layer AD, the contact area is reduced by the protrusions 502a, making it difficult for the mask 500 to stick and easy for it to peel off.

[0125] [Modification of the Fifth Embodiment] This embodiment is not limited to the above-described aspects. (1) As shown in Figures 20(A) and (B), the tip of the protrusion 502a may be a flat surface. Even in this case, even if the facing surface 502 comes into contact with the adhesive layer AD, the contact area is reduced by the protrusion 502a, making it difficult for the facing surface 502 to adhere and easy for the facing surface 502 to peel off.

[0126] (2) The surface of the mask 50 directly facing the adhesive sheet T may have a height difference that increases as it moves from the wafer W side to the ring R side. For example, as shown in FIGS. 21A and 21B, the facing surface 502 may be an inclined surface (tapered surface) that increases in height from the wafer W side to the ring R side. The tip of the protrusion 501 forms a curved protrusion 502a. In this case, too, the contact area when it comes into contact with the adhesive layer AD is reduced, making it difficult for the protrusion 502a to adhere and easy to peel off. Furthermore, as shown in FIG. 22A, the tip of the protrusion 502a may be flat, or as shown in FIG. 22B, the tip of the protrusion 502a may have an uneven surface. The height difference is not limited to an inclined surface; for example, the height difference may be provided by a stepped structure.

[0127] (3) In this embodiment, the ultraviolet irradiating unit 23 may be provided on the stage 20 or on the mask 50. The ultraviolet irradiating unit 23 may irradiate ultraviolet rays when the mask 50 is in the exposed position or when the mask 50 is in the covered position (see FIGS. 7 and 10).

[0128] Sixth Embodiment It is also possible to configure a processing apparatus, pre-processing apparatus, or mounting system that does not have an ultraviolet irradiating unit 23 before the plasma processing as described above, and that has the protrusions exemplified in the fifth embodiment.

[0129] That is, as described above, a processing apparatus can also be configured that includes a stage 20 on which a component supply body TW is placed, in which wafers W, which have been singulated into electronic components E, are attached to a ring R of adhesive sheet T attached to the ring R, a chamber 11b in which the stage 20 is provided and the interior of which can be depressurized, a gas inlet 30 for introducing a reactive gas into the depressurized chamber 11b, a plasma generator 40 for generating active species by plasmatizing the reactive gas, and a mask 50 that exposes the wafer W and covers the ring R and the adhesive sheet T between the ring R and the wafer W, and the mask 50 has protrusions with curved or flat tips on the portion of the mask 50 that directly faces the adhesive sheet T. As a result, even if the facing surface 502 comes into contact with the adhesive layer AD, the contact area is reduced by the protrusions, making it difficult for the adhesive layer AD to stick and easy for it to peel off.

[0130] 23, in a plasma processing apparatus 100 that does not have an ultraviolet irradiation unit 23, as shown in FIGS. 19(A) and 19(B), a mask 50 has a protruding portion 501 that protrudes toward the adhesive sheet T in a portion that directly faces the region of the adhesive sheet T between the ring R and the wafer W, and the protruding portion 501 has a protrusion 502a with a curved tip. In addition, a height difference is provided on the surface of the mask 50 that directly faces the adhesive sheet T, such that the mask is separated from the adhesive sheet T as it moves from the wafer W side to the ring R side. Note that the modified examples shown in FIGS. 20 to 22 can also be applied to this embodiment.

[0131] With this configuration, even if the effect of reducing adhesive strength due to irradiation with UV light is not obtained, the effect of preventing the adhesive sheet T from sticking to the mask 50 can be obtained, as in the above-mentioned fifth embodiment and its modified example.

[0132] [Other Embodiments] While the embodiments of the present invention and modifications of each part have been described above, these embodiments and modifications of each part are presented as examples and are not intended to limit the scope of the invention. These novel embodiments described above can be embodied in various other forms, and various omissions, substitutions, modifications, and combinations can be made without departing from the spirit of the invention. These embodiments and modifications thereof are included within the scope and spirit of the invention, and are also included in the invention described in the claims.

[0133] 1 Mounting system 11a Base 11b Chamber 11c Load port 11d Window member 11e Hole 11f Stopper 11g Biasing member 11h, 11i Spring post 20 Stage 21 Drive unit 21a, 21b Rod 21c Drive mechanism 23 Ultraviolet irradiation unit 30 Gas inlet 31 Supply device 31a Pipe 40 Plasma generator 41 Antenna 42 Power supply 43 Matching box 50 Mask 50a Support shaft 51 Drive unit 51a Rod 51b Drive mechanism 60 Exhaust port 61 Exhaust device 61a Pipe 70 Partition wall 100 Plasma processing apparatus 110 Supply body cleaning unit 111 Cleaning chamber 111a Opening 111b Shutter 112 Support unit 113 Rotation mechanism 114 Cup 115 Supply unit 115a Nozzle 115b Moving mechanism 120 Mounting substrate cleaning unit 130 Adjustment processing unit 131 Irradiation device 131a Light source 132 Table 132a Lift pin 133 Light-shielding mask 133a Light-shielding film 133b UV-transmitting film 133c Hole 140 Gauging unit 141 Stage 142, 146 Ultraviolet irradiation unit 142a, 146a Light source 143 Light-shielding mask 144 Support member 145 Positioning member 147 Rotation mechanism 150 Alignment unit 160 Supply buffer unit 161 Storage 170 Mounting substrate buffer unit 171 Storage 180 Bonding unit 190 Transport unit 191 Transport robot 191a Robot hand 192 Moving mechanism 200 Control unit 501 Protrusion 502 Opposing surface 502a Protrusion TW Component supplier BW Mounting board

Claims

1. A processing apparatus comprising: a stage on which a component supply body is placed, the component supply body having a wafer diced into electronic components attached to an adhesive sheet attached to a ring; a chamber in which the stage is provided and the inside of which can be depressurized; a gas inlet for introducing a reactive gas into the depressurized chamber; a plasma generator for generating active species by turning the reactive gas into plasma; a mask for exposing the wafer and for covering the ring and the area of ​​the adhesive sheet between the ring and the wafer; and an ultraviolet irradiation unit for irradiating the adhesive sheet with ultraviolet light so as to reduce the adhesive force of the adhesive sheet between the ring and the wafer before removing the mask from the component supply body covered with the mask to expose the component supply body to the active species.

2. The processing apparatus according to claim 1, wherein said mask has a protrusion protruding toward said adhesive sheet at a portion directly facing said adhesive sheet between said ring and said wafer.

3. A processing apparatus according to claim 1 or 2, characterized in that the ultraviolet ray irradiation section is provided on the stage.

4. A processing apparatus according to claim 1 or 2, characterized in that the ultraviolet ray irradiation section is provided on the mask.

5. A processing apparatus as described in claim 1 or 2, characterized in that a light-shielding mask is provided between the ultraviolet ray irradiation section and the adhesive sheet to block ultraviolet rays from reaching the area of ​​the adhesive sheet to which the wafer is attached.

6. A processing apparatus as claimed in claim 1 or claim 2, characterized in that the ultraviolet irradiating section irradiates ultraviolet light only onto the portion of the adhesive sheet that directly faces the mask in accordance with the relative movement between the ultraviolet irradiating section and the component supply body.

7. The processing apparatus according to claim 6, wherein the ultraviolet ray irradiation unit has a plurality of light sources, and the light sources that emit light are switched according to the relative movement between the ultraviolet ray irradiation unit and the component supply body.

8. The processing apparatus according to claim 6, further comprising a rotation mechanism for rotating said component supply body to move it relatively to said ultraviolet ray irradiation section.

9. A processing apparatus as described in claim 1 or claim 2, characterized in that the mask is movable between a cover position that covers the ring and the area between the ring and the wafer on the adhesive sheet, and an exposure position that exposes the ring and the area between the ring and the wafer on the adhesive sheet, and the ultraviolet ray irradiation unit begins irradiating the adhesive sheet with ultraviolet rays when the mask is in the cover position.

10. A processing apparatus as described in claim 1 or claim 2, characterized in that the mask is movable between a cover position that covers the ring and the area between the ring and the wafer on the adhesive sheet, and an exposure position that exposes the ring and the area between the ring and the wafer on the adhesive sheet, and the ultraviolet irradiation unit begins irradiating the adhesive sheet with ultraviolet light when the mask is in the exposure position.

11. A processing apparatus as described in claim 1 or claim 2, characterized in that the mask is movable between a cover position that covers the ring and the area between the ring and the wafer on the adhesive sheet, and an exposure position that exposes the ring and the area between the ring and the wafer on the adhesive sheet, and the ultraviolet ray irradiation unit begins irradiating the adhesive sheet with ultraviolet rays when the mask is between the exposure position and the cover position.

12. The processing device according to claim 1 or 2, characterized in that the mask has a protrusion having a curved or flat tip on the portion directly facing the adhesive sheet.

13. A processing apparatus according to claim 1 or 2, characterized in that the surface of said mask directly facing said adhesive sheet is provided with a height difference that moves away from said adhesive sheet as it goes from said wafer side to said ring side.

14. The processing apparatus according to claim 1 or 2, characterized in that the stage is provided so that the component supply body and a mounting board on which the electronic components are to be mounted can be selectively placed on the stage.

15. A pre-processing device comprising: a processing device according to any one of claims 1 to 14; a load port on which a transport container containing the component supply is mounted; a supply cleaning section for cleaning the component supply; a mounting board cleaning section for cleaning the mounting board; and a transport section for transporting the component supply.

16. A mounting system comprising: a pre-processing device according to claim 15; and a bonding section which detaches the electronic components from the component supply which has been processed by the pre-processing device, and mounts the electronic components on a mounting board.

17. A mounting system comprising: a processing device according to any one of claims 1 to 14; and a bonding section which detaches the electronic components from the component supply body processed by the processing device and mounts them on a mounting board.

18. A processing apparatus comprising: a stage on which a component supply body is placed, the component supply body having wafers diced into electronic components attached to an adhesive sheet attached to a ring; a chamber in which the stage is provided and the interior of which can be depressurized; a gas inlet for introducing a reactive gas into the depressurized chamber; a plasma generator for generating active species by turning the reactive gas into plasma; and a mask for exposing the wafer and for covering the ring and the area of ​​the adhesive sheet between the ring and the wafer, the mask having a protrusion with a curved or flat tip on a portion of the mask directly facing the adhesive sheet.

19. The processing apparatus according to claim 18, characterized in that the mask has a protrusion that protrudes toward the adhesive sheet in a portion directly facing the area between the ring and the wafer on the adhesive sheet, and the protrusion is provided on the protrusion.

20. The processing apparatus according to claim 18, characterized in that the surface of said mask directly facing said adhesive sheet is provided with a height difference that increases from the wafer side to the ring side and away from said adhesive sheet.

21. The processing apparatus according to claim 18, wherein said stage is provided so that said component supply body and a mounting board on which said electronic components are to be mounted can be selectively placed on said stage.

22. A pre-processing device comprising: a processing device according to any one of claims 18 to 21; a load port on which a transport container containing the component supply is mounted; a supply cleaning section for cleaning the component supply; a mounting board cleaning section for cleaning the mounting board; and a transport section for transporting the component supply.

23. A mounting system comprising: a pre-processing device according to claim 22; and a bonding section which detaches the electronic components from the component supply which has been processed by the pre-processing device, and mounts the electronic components on a mounting board.

24. A mounting system comprising: a processing device according to any one of claims 18 to 21; and a bonding section which detaches the electronic components from the component supply body processed by the processing device and mounts them on a mounting board.

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