Power tool including a plurality of half-bridge semiconductor devices

Abstract

A power tool including a housing, a brushless motor supported within the housing, a battery pack interface configured to receive a battery pack, a half-bridge semiconductor device, and a controller. The half-bridge semiconductor device is for controlling power provided to the brushless motor. The half-bridge semiconductor device includes a first semiconductor switching device, a second semiconductor switching device, and a first gate driver that is configured to control a conductive state of the first semiconductor switching device and the second semiconductor switching device. The controller is connected to the half-bridge semiconductor device. The controller is configured to provide control signals to the half-bridge semiconductor device to control the half-bridge semiconductor device to provide power to the brushless motor.

Description

POWER TOOL INCLUDING A PLURALITY OF HALF-BRIDGE SEMICONDUCTOR DEVICESRELATED APPLICATIONS

[0001] This application claims the benefit of U.S. Provisional Patent Application No. 63 / 585,261, filed September 26, 2023, the entire content of which is hereby incorporated by reference.FIELD

[0002] Embodiments described herein relate to power tools.SUMMARY

[0001] Conventional power tools can include a brushless direct current (“BLDC”) motor. The power provided to the motor is conventionally controlled using, for example, a three-phase inverter bridge that includes a plurality of high-side switching elements and a plurality of low- side switching elements. Each of the switching elements in the inverter bridge is controlled by signals provided from a single dedicated gate driver. The gate driver receives control signals from a controller to control the gate driver and the inverter bridge accordingly. However, such conventional designs for power tool motor control are bulky and can be prohibitive to achieving more compact power tool designs.

[0002] Power tools described herein include a housing, a brushless motor supported within the housing, a battery pack interface configured to receive a battery pack, a plurality of halfbridge semiconductor devices for controlling power provided to the brushless motor, and a controller. The plurality of half-bridge semiconductor devices are for controlling power provided to the brushless motor. Each of the plurality of half-bridge semiconductor devices includes a first semiconductor switching device, a second semiconductor switching device, and a gate driver. The gate driver is configured to control a conductive state of the first semiconductor switching device and the second semiconductor switching device. The controller is connected to each of the plurality of half-bridge semiconductor devices. The controller is configured to provide a control signal to each of the plurality of half-bridge devices to control the plurality of half-bridge devices to provide power to the brushless motor.

[0003] In some aspects, each of the plurality of half-bridge semiconductor devices further includes a current sensor configured to sense a current through each of the plurality of halfbridge semiconductor devices.

[0004] In some aspects, each of the plurality of half-bridge semiconductor devices further includes a temperature sensor configured to sense a temperature associated with each of the plurality of half-bridge semiconductor devices.

[0005] In some aspects, each of the plurality of half-bridge semiconductor devices is configured to receive a plurality of control signals from the controller.

[0006] In some aspects, the plurality of control signals includes a first signal to turn ON the first semiconductor switching device and a second signal to turn ON the second semiconductor switching device.

[0007] In some aspects, the plurality of control signals includes a device enable signal for enabling operation of each of the plurality of half-bridge semiconductor devices.

[0008] In some aspects, each of the plurality of half-bridge semiconductor devices is configured to output a plurality of feedback signals to the controller.

[0009] In some aspects, the plurality of feedback signals includes at least one of a current feedback signal and a temperature feedback signal.

[0010] In some aspects, the plurality of feedback signals includes a fault feedback signal.

[0011] In some aspects, each of the plurality of half-bridge semiconductor devices is connected in parallel.

[0012] In some aspects, each of the plurality of half-bridge semiconductor device includes a housing and is packaged as a single integrated circuit.

[0013] Power tools described herein include a housing, a brushless motor supported within the housing, a battery pack interface configured to receive a battery pack, a first half-bridge semiconductor device and a second half-bridge semiconductor device for controlling power provided to the brushless motor, and a controller. The first half-bridge semiconductor device includes a first semiconductor switching device, a second semiconductor switching device, and a first gate driver that is configured to control a conductive state of the first semiconductorswitching device and the second semiconductor switching device. The second half-bridge semiconductor device is connected in parallel to the first half-bridge semiconductor device. The second half-bridge semiconductor device includes a third semiconductor switching device, a fourth semiconductor switching device, and a second gate driver that is configured to control a conductive state of the third semiconductor switching device and the fourth semiconductor switching device. The controller is connected to the first half-bridge semiconductor device and the second half-bridge semiconductor device. The controller is configured to provide a control signal to each of the first half-bridge semiconductor device and the second half-bridge semiconductor device to control the first half-bridge semiconductor device and the second halfbridge semiconductor device to provide power to the brushless motor.

[0014] In some aspects, the first half-bridge semiconductor device includes a first current sensor configured to sense a first current through the first half-bridge semiconductor device, and the second half-bridge semiconductor device includes a second current sensor configured to sense a second current through the second half-bridge semiconductor device.

[0015] In some aspects, the first half-bridge semiconductor device includes a first temperature sensor configured to sense a first temperature associated with the first half-bridge semiconductor device, and the second half-bridge semiconductor device includes a second temperature sensor configured to sense a second temperature associated with the second halfbridge semiconductor device.

[0016] In some aspects, the first half-bridge semiconductor device and the second half-bridge semiconductor device are each configured to receive a plurality of control signals from the controller.

[0017] In some aspects, the plurality of control signals includes a first signal to turn ON the first semiconductor switching device and a second signal to turn ON the second semiconductor switching device.

[0018] In some aspects, the plurality of control signals includes a device enable signal for enabling operation of each of the first half-bridge semiconductor device and the second halfbridge semiconductor device.

[0019] In some aspects, the first half-bridge semiconductor device and the second half-bridge semiconductor device are each configured to output a plurality of feedback signals to the controller.

[0020] In some aspects, the plurality of feedback signals includes at least one of a current feedback signal and a temperature feedback signal.

[0021] In some aspects, the plurality of feedback signals includes a fault feedback signal.

[0022] In some aspects, the first half-bridge semiconductor device and the second half-bridge semiconductor device each includes a housing and is packaged as a single integrated circuit.

[0023] Power tools described herein include a housing, a brushless motor supported within the housing, a battery pack interface configured to receive a battery pack, a half-bridge semiconductor device, and a controller. The half-bridge semiconductor device is for controlling power provided to the brushless motor. The half-bridge semiconductor device includes a first semiconductor switching device, a second semiconductor switching device, and a first gate driver that is configured to control a conductive state of the first semiconductor switching device and the second semiconductor switching device. The controller is connected to the half-bridge semiconductor device. The controller is configured to provide a control signal to the half-bridge semiconductor device to control the half-bridge semiconductor device to provide power to the brushless motor.

[0024] In some aspects, the half-bridge semiconductor device includes a current sensor configured to sense a current through the half-bridge semiconductor device.

[0025] In some aspects, the half-bridge semiconductor device includes a temperature sensor configured to sense a temperature associated with the half-bridge semiconductor device.

[0026] In some aspects, the half-bridge semiconductor device is configured to receive a plurality of control signals from the controller.

[0027] In some aspects, the plurality of control signals includes a first signal to turn ON the first semiconductor switching device and a second signal to turn ON the second semiconductor switching device.

[0028] In some aspects, the plurality of control signals includes a device enable signal for enabling operation of the half-bridge semiconductor device.

[0029] In some aspects, the half-bridge semiconductor device is configured to output a plurality of feedback signals to the controller.

[0030] In some aspects, the plurality of feedback signals includes at least one of a current feedback signal and a temperature feedback signal.

[0031] In some aspects, the plurality of feedback signals includes a fault feedback signal.

[0032] In some aspects, the half-bridge semiconductor device includes a housing and is packaged as a single integrated circuit.

[0033] Before any embodiments are explained in detail, it is to be understood that the embodiments are not limited in application to the details of the configurations and arrangements of components set forth in the following description or illustrated in the accompanying drawings. The embodiments are capable of being practiced or of being carried out in various ways. Also, it is to be understood that the phraseology and terminology used herein are for the purpose of description and should not be regarded as limiting. The use of “including,” “comprising,” or “having” and variations thereof are meant to encompass the items listed thereafter and equivalents thereof as well as additional items. Unless specified or limited otherwise, the terms “mounted,” “connected,” “supported,” and “coupled” and variations thereof are used broadly and encompass both direct and indirect mountings, connections, supports, and couplings.

[0034] Unless the context of their usage unambiguously indicates otherwise, the articles “a,” “an,” and “the” should not be interpreted as meaning “one” or “only one.” Rather these articles should be interpreted as meaning “at least one” or “one or more.” Likewise, when the terms “the” or “said” are used to refer to a noun previously introduced by the indefinite article “a” or “an,” “the” and “said” mean “at least one” or “one or more” unless the usage unambiguously indicates otherwise.

[0035] In addition, it should be understood that embodiments may include hardware, software, and electronic components or modules that, for purposes of discussion, may be illustrated and described as if the majority of the components were implemented solely in hardware. However, one of ordinary skill in the art, and based on a reading of this detailed description, would recognize that, in at least one embodiment, the electronic-based aspects maybe implemented in software (e.g., stored on non-transitory computer-readable medium) executable by one or more processing units, such as a microprocessor and / or application specific integrated circuits (“ASICs”). As such, it should be noted that a plurality of hardware and software based devices, as well as a plurality of different structural components, may be utilized to implement the embodiments. For example, “servers,” “computing devices,” “controllers,” “processors,” etc., described in the specification can include one or more processing units, one or more computer-readable medium modules, one or more input / output interfaces, and various connections (e.g., a system bus) connecting the components.

[0036] Relative terminology, such as, for example, “about,” “approximately,” “substantially,” etc., used in connection with a quantity or condition would be understood by those of ordinary skill to be inclusive of the stated value and has the meaning dictated by the context (e.g., the term includes at least the degree of error associated with the measurement accuracy, tolerances [e.g., manufacturing, assembly, use, etc.] associated with the particular value, etc.). Such terminology should also be considered as disclosing the range defined by the absolute values of the two endpoints. For example, the expression “from about 2 to about 4” also discloses the range “from 2 to 4”. The relative terminology may refer to plus or minus a percentage (e.g., 1%, 5%, 10%) of an indicated value.

[0037] It should be understood that although certain drawings illustrate hardware and software located within particular devices, these depictions are for illustrative purposes only. Functionality described herein as being performed by one component may be performed by multiple components in a distributed manner. Likewise, functionality performed by multiple components may be consolidated and performed by a single component. In some embodiments, the illustrated components may be combined or divided into separate software, firmware and / or hardware. For example, instead of being located within and performed by a single electronic processor, logic and processing may be distributed among multiple electronic processors. Regardless of how they are combined or divided, hardware and software components may be located on the same computing device or may be distributed among different computing devices connected by one or more networks or other suitable communication links. Similarly, a component described as performing particular functionality may also perform additional functionality not described herein. For example, a device or structure that is “configured” in acertain way is configured in at least that way but may also be configured in ways that are not explicitly listed.

[0003] Accordingly, in the claims, if an apparatus, method, or system is claimed, for example, as including a controller, control unit, electronic processor, computing device, logic element, module, memory module, communication channel or network, or other element configured in a certain manner, for example, to perform multiple functions, the claim or claim element should be interpreted as meaning one or more of such elements where any one of the one or more elements is configured as claimed, for example, to make any one or more of the recited multiple functions, such that the one or more elements, as a set, perform the multiple functions collectively.

[0004] Other aspects of the embodiments will become apparent by consideration of the detailed description and accompanying drawings.BRIEF DESCRIPTION OF THE DRAWINGS

[0005] FIG. 1 illustrates a power tool, according to some embodiments.

[0006] FIG. 2 illustrates a control system of the power tool of FIG. 1, according to some embodiments.

[0007] FIG. 3 illustrates a plurality of half-bridge semiconductor devices for controlling a motor of the power tool of FIG. 1, according to some embodiments.

[0008] FIG. 4 illustrates a half-bridge semiconductor device of FIG. 3, according to some embodiments.DETAILED DESCRIPTION

[0009] FIG. 1 illustrates a power tool 100 including a brushless direct current (“BLDC”) motor. The power tool 100 is, for example, a brushless hammer drill including a housing 102. The housing 102 includes a handle portion 104 and motor housing portion 106. The power tool 100 further includes an output driver 108 (illustrated as a chuck), a trigger 1 10, and a battery pack interface 112. The battery pack interface 112 is configured to mechanically and electrically connect to a power tool battery pack. Although FIG. 1 illustrates a hammer drill, in some embodiments, the components described herein are incorporated into other types of power tools including drill-drivers, impact drivers, impact wrenches, angle grinders, circular saws,reciprocating saws, string trimmers, leaf blowers, vacuums, and the like. In a brushless motor power tool, such as power tool 100, switching elements are selectively enabled and disabled by control signals to selectively apply power from a power source (e.g., a battery pack) to drive the brushless motor.

[0010] FIG. 2 illustrates a control system 200 for the power tool 100. The control system 200 includes a controller 202 (e.g., a primary controller). The controller 202 is electrically and / or communicatively connected to a variety of modules or components of the power tool 100. For example, the illustrated controller 202 is electrically connected to a motor 204, the battery pack interface 112, a trigger switch 208 (connected to the trigger 110), one or more sensors or 212 (also referred to as sensing circuits), one or more indicators 214, a user input module 216, one or more switching modules 220 (e.g., a plurality of half-bridge semiconductor devices). The controller 202 includes combinations of hardware and software that are operable to, among other things, control the operation of the power tool 100, monitor the operation of the power tool 100, activate the one or more indicators 214 (e.g., an LED), etc. In some embodiments, the sensors 212 measure or detect a current in the inverter or switching module 220 (e.g., a current of one or more phases of the inverter).

[0011] The controller 202 includes a plurality of electrical and electronic components that provide power, operational control, and protection to the components and modules within the controller 202 and / or the power tool 100. For example, the controller 202 includes, among other things, a processing unit 226 (e.g., a microprocessor, a microcontroller, an electronic controller, an electronic processor, or another suitable programmable device), a memory 228, input units 230, and output units 232. The processing unit 226 includes, among other things, a control unit 234, an arithmetic logic unit (“ALU”) 236, and a plurality of registers 238, and is implemented using a known computer architecture (e.g., a modified Harvard architecture, a von Neumann architecture, etc.). The processing unit 226, the memory 228, the input units 230, and the output units 232, as well as the various modules or circuits connected to the controller 202 are connected by one or more control and / or data buses (e.g., common bus 240). The control and / or data buses are shown generally in FIG. 2 for illustrative purposes. The use of one or more control and / or data buses for the interconnection between and communication among the various modules, circuits, and components would be known to a person skilled in the art in view of the invention described herein.

[0012] The memory 228 is a non-transitory computer readable medium and includes, for example, a program storage area and a data storage area. The program storage area and the data storage area can include combinations of different types of memory, such as a ROM, a RAM (e.g., DRAM, SDRAM, etc.), EEPROM, flash memory, a hard disk, an SD card, or other suitable magnetic, optical, physical, or electronic memory devices. The processing unit 226 is connected to the memory 228 and executes software instructions that are capable of being stored in a RAM of the memory 228 (e.g., during execution), a ROM of the memory 228 (e.g., on a generally permanent basis), or another non-transitory computer readable medium such as another memory or a disc. Software included in the implementation of the power tool 100 can be stored in the memory 228 of the controller 202. The software includes, for example, firmware, one or more applications, program data, filters, rules, one or more program modules, and other executable instructions. The controller 202 is configured to retrieve from the memory 228 and execute, among other things, instructions related to the control processes and methods described herein. In other constructions, the controller 202 includes additional, fewer, or different components.

[0013] The battery pack interface 112 includes a combination of mechanical components (e.g., rails, grooves, latches, etc.) and electrical components (e.g., one or more terminals) configured to and operable for interfacing (e.g., mechanically, electrically, and communicatively connecting) with a battery pack. The battery pack interface 112 supplies power to the switching modules 220 to selectively provide power to the motor 204.

[0014] The sensors 212 include one or more current sensors, one or more speed sensors, one or more Hall Effect sensors, one or more temperature sensors, etc. The indicators 214 include, for example, one or more light-emitting diodes (“LEDs”). The indicators 214 can be configured to display conditions of, or information associated with, the power tool 100. For example, the indicators 214 are configured to indicate measured electrical characteristics of the power tool 100, the status of the power tool, etc. The user input module 216 is operably coupled to the controller 202 to, for example, select a forward mode of operation or a reverse mode of operation, a torque and / or speed setting for the power tool 100 (e.g., using torque and / or speed switches), etc. In some embodiments, the user input module 216 includes a combination of digital and analog input or output devices required to achieve a desired level of operation for the power tool 100, such as one or more knobs, one or more dials, one or more switches, one or more buttons, etc.

[0015] FIG. 3 illustrates a circuit 300 for delivering power to the motor 204 of the power tool 100. The circuit 300 includes a power source or battery pack 305, a controller 310, a first halfbridge semiconductor device 315, a second half-bridge semiconductor device 320, a third halfbridge semiconductor device 325, and the motor 204. The first half-bridge semiconductor device 315, a second half-bridge semiconductor device 320, and the third half-bridge semiconductor device 325 correspond to the one or more switching modules 220 in FIG. 3. In some embodiments, one, two, or three or more half-bridge semiconductor devices can be included in the power tool 100. The motor 204 is, for example, a three-phase motor. Each of the first halfbridge semiconductor device 315, the second half-bridge semiconductor device 320, and the third half-bridge semiconductor device 325 is configured to provide power to one of a first phase 330, a second phase 335, or a third phase 340 of the motor 204. The controller 310 can be the controller 202 of FIG. 3. In some embodiments, the controller 310 also includes a wireless communication controller (e.g., a Bluetooth module) for the power tool 100 to be capable of wirelessly communicating with an external device (e.g., a computer, a smart phone, etc.).

[0016] FIG. 4 illustrates one of the first half-bridge semiconductor device 315, the second half-bridge semiconductor device 320, or the third half-bridge semiconductor device 325. In some embodiments, the first half-bridge semiconductor device 315, the second half-bridge semiconductor device 320, and the third half-bridge semiconductor device 325 are substantially the same and include the same components, inputs / outputs, etc. In other embodiments, the first half-bridge semiconductor device 315, the second half-bridge semiconductor device 320, or the third half-bridge semiconductor device 325 can vary with respect to components, input / outputs, etc.

[0017] The illustrated half-bridge semiconductor device 315, 320, 325 includes an input and protection logic unit 400, a gate driver 405, a thermal protection circuit or module 410, a current sensing circuit or module 415, a first semiconductor switching device 420 (e.g., a FET), and a second semiconductor switching device 425 (e.g., a FET). In some embodiments, the switching devices are Gallium Nitride switching devices or another type of material that provides for a wide band gap. The first semiconductor switching device 420 is connected between the positive DC bus power connection and a pole connection for the motor 204, which corresponds to one of the first phase 330, second phase 335, or third phase 340 of the motor 204. The second semiconductor switching device 425 is connected between the pole connection for the motor 204and the negative DC bus power connection. The first semiconductor switching device 420 is connected in series with the second semiconductor switching device 425 to form a half-bridge. In some embodiments, each of the half-bridge semiconductor devices 315, 320, 325 is connected in parallel with the other half-bridge semiconductor devices 315, 320, 325 between the positive DC bus power connection and the negative DC bus power connection.

[0018] The input and protection logic unit 400 is configured to interface with, for example, the controller 310. For example, the logic unit 400 is configured to receive one or more signals (e.g., control signals) from the controller 310 to selectively turn ON the first semiconductor switching device 420 and the second semiconductor switching device 425. The logic unit 400 is also configured to receive a device enable / disable signal from the controller 310 to selectively turn the half-bridge semiconductor device 315, 320, 325 itself ON and OFF. For example, when the half-bridge semiconductor device 315, 320, 325 is disabled, the half-bridge semiconductor device 315, 320, 325 would be in a low power or sleep state until an enable signal is received from the controller 310. Such a feature functions to reduce power consumption of the battery pack 305 and maximize battery life. The logic unit 400 is also configured to provide information or data to the controller 310. In some embodiments, the information or data provided to the controller 310 includes one or more output signals, such as a temperature feedback information or signal (e.g., based on the thermal protection module 410), current feedback information or signal (e.g., based on current sensing module 415), and fault feedback information or signal (e.g., related to any detected fault of the half-bridge semiconductor device 315, 320, 325). In some embodiments, the detected faults can also include overvoltage protection, undervoltage protection, etc., to prevent, for example, a shoot through command. In some embodiments, additional or different information, data, or signals can be received from the controller 310 or provided to the controller 310.

[0019] The gate driver 405 is configured to generate control signals for controlling the first semiconductor switching device 420 and the second semiconductor switching device 425. For example, the control signals can be provided to the gates of the first and second semiconductor switching devices 420, 425 to selectively turn the switches ON and OFF. The control signals are, for example, in response to one or more control signals received by the half-bridge semiconductor device 315, 320, 325 from the controller 310.

[0020] The thermal protection module 410 is configured to monitor a temperature or multiple temperatures associated with the half-bridge semiconductor device 315, 320, 325. For example, the thermal protection module 410 can use one or more temperature sensors to measure the temperature of the first semiconductor switching device 420 and / or the second semiconductor switching device 425. In some embodiments, the temperature of any component of the halfbridge semiconductor device 315, 320, 325 can be monitored. The measured temperatures can be compared to one or more temperature threshold values to determine whether a temperature fault is present in the half-bridge semiconductor device 315, 320, 325.

[0021] The current sensing module 415 is configured to monitor a current through the halfbridge semiconductor device 315, 320, 325. For example, the current sensing module 415 can monitor the current through half-bridge semiconductor device and at the pole connection for the motor 204. The measured currents can be compared to one or more current threshold values to determine whether a current fault is present in the half-bridge semiconductor device 315, 320, 325.

[0022] The half-bridge semiconductor device 315, 320, 325 can be packaged as a singular semiconductor device (e.g., a single integrated circuit) that includes the above-described components within a casing or a housing 430 of the half-bridge semiconductor device 315, 320, 325. As a result, the power tool 100 could, for example, include three individually packaged half-bridge semiconductor devices 315, 320, 325 to control the motor 204. In some embodiments, more or fewer half-bridge semiconductor devices can be implemented in the power tool 100. By packaging the half-bridge semiconductor devices in such a manner, the power tool 100 can be made more compact because the electronics require less space within the power tool 100. For example, such a configuration can be beneficial for power tools including smaller motors (e.g., motors with a diameter of less than 35 millimeters). In some embodiments, this electronics configuration can be used with an outer rotor motor (e.g., an outer rotor motor having a diameter of between 20 millimeters and 40 millimeters [e.g., 28 millimeters, 35 millimeters, 40 millimeters, or any discrete value therebetween],

[0023] Additionally, by packaging the half-bridge semiconductor devices as described herein as discrete components, the high and low side semiconductor switches can have symmetrical resistance such that power losses are balanced between the first semiconductor switch 420 andthe second semiconductor switch 425. Having asymmetrical resistances for the switches is undesirable in motor control applications such as power tools, where losses within the system should be minimized.REPRESENTATIVE FEATURES

[0110] Representative features are set out in the following clauses, which stand alone or may be combined, in any combination, with one or more features disclosed in the text and / or drawings of the specification.Clause 1. A power tool comprising: a housing; a brushless motor supported within the housing; a battery pack interface configured to receive a battery pack; a plurality of half-bridge semiconductor devices for controlling power provided to the brushless motor, each of the plurality of half-bridge semiconductor devices including a first semiconductor switching device, a second semiconductor switching device, and a gate driver that is configured to control a conductive state of the first semiconductor switching device and the second semiconductor switching device; and a controller connected to each of the plurality of half-bridge semiconductor devices, the controller configured to: provide a control signal to each of the plurality of half-bridge devices to control the plurality of half-bridge devices to provide power to the brushless motor.Clause 2. The power tool of clause 1, wherein each of the plurality of half-bridge semiconductor devices further includes a current sensor configured to sense a current through each of the plurality of half-bridge semiconductor devices.Clause 3. The power tool of any preceding clause, wherein each of the plurality of half-bridge semiconductor devices further includes a temperature sensor configured to sense a temperature associated with each of the plurality of half-bridge semiconductor devices.Clause 4. The power tool of any preceding clause, wherein each of the plurality of half-bridge semiconductor devices is configured to receive a plurality of control signals from the controller.Clause 5. The power tool of clause 4, wherein the plurality of control signals includes a first signal to turn ON the first semiconductor switching device and a second signal to turn ON the second semiconductor switching device.Clause 6. The power tool of clause 4, wherein the plurality of control signals includes a device enable signal for enabling operation of each of the plurality of half-bridge semiconductor devices.Clause 7. The power tool of any preceding clause, wherein each of the plurality of half-bridge semiconductor devices is configured to output a plurality of feedback signals to the controller.Clause 8. The power tool of clause 7, wherein the plurality of feedback signals includes at least one of a current feedback signal and a temperature feedback signal.Clause 9. The power tool of clause 7, wherein the plurality of feedback signals includes a fault feedback signal.Clause 10. The power tool of any preceding clause, wherein each of the plurality of half-bridge semiconductor devices is connected in parallel.Clause 11. The power tool of any preceding clause, wherein each of the plurality of half-bridge semiconductor device includes a housing and is packaged as a single integrated circuit.Clause 12. A power tool comprising: a housing; a brushless motor supported within the housing; a battery pack interface configured to receive a battery pack; a first half-bridge semiconductor device for controlling power provided to the brushless motor, the first half-bridge semiconductor device including a first semiconductor switching device, a second semiconductor switching device, and a first gate driver that is configured tocontrol a conductive state of the first semiconductor switching device and the second semiconductor switching device; a second half-bridge semiconductor device for controlling power provided to the brushless motor, the second half-bridge semiconductor device connected in parallel to the first half-bridge semiconductor device, the second half-bridge semiconductor device including a third semiconductor switching device, a fourth semiconductor switching device, and a second gate driver that is configured to control a conductive state of the third semiconductor switching device and the fourth semiconductor switching device; and a controller connected to the first half-bridge semiconductor device and the second halfbridge semiconductor device, the controller configured to: provide a control signal to each of the first half-bridge semiconductor device and the second half-bridge semiconductor device to control the first half-bridge semiconductor device and the second half-bridge semiconductor device to provide power to the brushless motor.Clause 13. The power tool of clause 12, wherein: the first half-bridge semiconductor device includes a first current sensor configured to sense a first current through the first half-bridge semiconductor device; and the second half-bridge semiconductor device includes a second current sensor configured to sense a second current through the second half-bridge semiconductor device.Clause 14. The power tool of any of clauses 12-13, wherein: the first half-bridge semiconductor device includes a first temperature sensor configured to sense a first temperature associated with the first half-bridge semiconductor device; and the second half-bridge semiconductor device includes a second temperature sensor configured to sense a second temperature associated with the second half-bridge semiconductor device.Clause 15. The power tool of any of clauses 12-14, wherein the first half-bridge semiconductor device and the second half-bridge semiconductor device are each configured to receive a plurality of control signals from the controller.Clause 16. The power tool of clause 15, wherein the plurality of control signals includes a first signal to turn ON the first semiconductor switching device and a second signal to turn ON the second semiconductor switching device.Clause 17. The power tool of clause 15, wherein the plurality of control signals includes a device enable signal for enabling operation of each of the first half-bridge semiconductor device and the second half-bridge semiconductor device.Clause 18. The power tool of any of clauses 12-17, wherein the first half-bridge semiconductor device and the second half-bridge semiconductor device are each configured to output a plurality of feedback signals to the controller.Clause 19. The power tool of clause 18, wherein the plurality of feedback signals includes at least one of a current feedback signal and a temperature feedback signal.Clause 20. The power tool of clause 18, wherein the plurality of feedback signals includes a fault feedback signal.Clause 21. The power tool of any of clauses 12-20, wherein the first half-bridge semiconductor device and the second half-bridge semiconductor device each includes a housing and is packaged as a single integrated circuit.Clause 22. A power tool comprising: a housing; a brushless motor supported within the housing; a battery pack interface configured to receive a battery pack; a half-bridge semiconductor device for controlling power provided to the brushless motor, the half-bridge semiconductor device including a first semiconductor switching device, a second semiconductor switching device, and a first gate driver that is configured to control a conductive state of the first semiconductor switching device and the second semiconductor switching device;a controller connected to the half-bridge semiconductor device, the controller configured to: provide a control signal to the half-bridge semiconductor device to control the half-bridge semiconductor device to provide power to the brushless motor.Clause 23. The power tool of clause 22, wherein the half-bridge semiconductor device includes a current sensor configured to sense a current through the half-bridge semiconductor device.Clause 24. The power tool of any of clauses 22-23, wherein the half-bridge semiconductor device includes a temperature sensor configured to sense a temperature associated with the halfbridge semiconductor device.Clause 25. The power tool of any of clauses 22-24, wherein the half-bridge semiconductor device is configured to receive a plurality of control signals from the controller.Clause 26. The power tool of clause 25, wherein the plurality of control signals includes a first signal to turn ON the first semiconductor switching device and a second signal to turn ON the second semiconductor switching device.Clause 27. The power tool of clause 25, wherein the plurality of control signals includes a device enable signal for enabling operation of the half-bridge semiconductor device.Clause 28. The power tool of any of clauses 22-27, wherein the half-bridge semiconductor device is configured to output a plurality of feedback signals to the controller.Clause 29. The power tool of clause 28, wherein the plurality of feedback signals includes at least one of a current feedback signal and a temperature feedback signal.Clause 30. The power tool of clause 28, wherein the plurality of feedback signals includes a fault feedback signal.Clause 31 . The power tool of any of clauses 22-30, wherein the half-bridge semiconductor device includes a housing and is packaged as a single integrated circuit.

[0038] Although aspects of the present disclosure have been described in detail with reference to certain embodiments, variations and modifications exist within the scope and spirit of one or more independent aspects as described. Various features and advantages are set forth in the following claims.

Claims

CLAIMSWhat is claimed is:

1. A power tool comprising: a housing; a brushless motor supported within the housing; a battery pack interface configured to receive a battery pack; a plurality of half-bridge semiconductor devices for controlling power provided to the brushless motor, each of the plurality of half-bridge semiconductor devices including a first semiconductor switching device, a second semiconductor switching device, and a gate driver that is configured to control a conductive state of the first semiconductor switching device and the second semiconductor switching device; and a controller connected to each of the plurality of half-bridge semiconductor devices, the controller configured to: provide a control signal to each of the plurality of half-bridge devices to control the plurality of half-bridge devices to provide power to the brushless motor.

2. The power tool of claim 1, wherein each of the plurality of half-bridge semiconductor devices further includes a current sensor configured to sense a current through each of the plurality of half-bridge semiconductor devices.

3. The power tool of claim 1, wherein each of the plurality of half-bridge semiconductor devices further includes a temperature sensor configured to sense a temperature associated with each of the plurality of half-bridge semiconductor devices.

4. The power tool of claim 1, wherein each of the plurality of half-bridge semiconductor devices is configured to receive a plurality of control signals from the controller.

5. The power tool of claim 4, wherein the plurality of control signals includes a first signal to turn ON the first semiconductor switching device and a second signal to turn ON the second semiconductor switching device.

6. The power tool of claim 4, wherein the plurality of control signals includes a device enable signal for enabling operation of each of the plurality of half-bridge semiconductor devices.

7. The power tool of claim 1, wherein each of the plurality of half-bridge semiconductor devices is configured to output a plurality of feedback signals to the controller.

8. The power tool of claim 7, wherein the plurality of feedback signals includes at least one of a current feedback signal and a temperature feedback signal.

9. The power tool of claim 7, wherein the plurality of feedback signals includes a fault feedback signal.

10. The power tool of claim 1, wherein each of the plurality of half-bridge semiconductor devices is connected in parallel.

11. The power tool of claim 1 , wherein each of the plurality of half-bridge semiconductor device includes a housing and is packaged as a single integrated circuit.

12. A power tool comprising: a housing; a brushless motor supported within the housing; a battery pack interface configured to receive a battery pack; a first half-bridge semiconductor device for controlling power provided to the brushless motor, the first half-bridge semiconductor device including a first semiconductor switching device, a second semiconductor switching device, and a first gate driver that is configured to control a conductive state of the first semiconductor switching device and the second semiconductor switching device; a second half-bridge semiconductor device for controlling power provided to the brushless motor, the second half-bridge semiconductor device connected in parallel to the first half-bridge semiconductor device, the second half-bridge semiconductor device including a thirdsemiconductor switching device, a fourth semiconductor switching device, and a second gate driver that is configured to control a conductive state of the third semiconductor switching device and the fourth semiconductor switching device; and a controller connected to the first half-bridge semiconductor device and the second halfbridge semiconductor device, the controller configured to: provide a control signal to each of the first half-bridge semiconductor device and the second half-bridge semiconductor device to control the first half-bridge semiconductor device and the second half-bridge semiconductor device to provide power to the brushless motor.

13. The power tool of claim 12, wherein: the first half-bridge semiconductor device includes a first current sensor configured to sense a first current through the first half-bridge semiconductor device; and the second half-bridge semiconductor device includes a second current sensor configured to sense a second current through the second half-bridge semiconductor device.

14. The power tool of claim 12, wherein: the first half-bridge semiconductor device includes a first temperature sensor configured to sense a first temperature associated with the first half-bridge semiconductor device; and the second half-bridge semiconductor device includes a second temperature sensor configured to sense a second temperature associated with the second half-bridge semiconductor device.

15. The power tool of claim 12, wherein the first half-bridge semiconductor device and the second half-bridge semiconductor device are each configured to receive a plurality of control signals from the controller.

16. The power tool of claim 15, wherein the plurality of control signals includes a first signal to turn ON the first semiconductor switching device and a second signal to turn ON the second semiconductor switching device.

17. The power tool of claim 15, wherein the plurality of control signals includes a device enable signal for enabling operation of each of the first half-bridge semiconductor device and the second half-bridge semiconductor device.

18. The power tool of claim 12, wherein the first half-bridge semiconductor device and the second half-bridge semiconductor device are each configured to output a plurality of feedback signals to the controller.

19. The power tool of claim 18, wherein the plurality of feedback signals includes at least one of a current feedback signal and a temperature feedback signal.

20. The power tool of claim 18, wherein the plurality of feedback signals includes a fault feedback signal.

21. The power tool of claim 12, wherein the first half-bridge semiconductor device and the second half-bridge semiconductor device each includes a housing and is packaged as a single integrated circuit.

22. A power tool comprising: a housing; a brushless motor supported within the housing; a battery pack interface configured to receive a battery pack; a half-bridge semiconductor device for controlling power provided to the brushless motor, the half-bridge semiconductor device including a first semiconductor switching device, a second semiconductor switching device, and a first gate driver that is configured to control a conductive state of the first semiconductor switching device and the second semiconductor switching device; a controller connected to the half-bridge semiconductor device, the controller configured to: provide a control signal to the half-bridge semiconductor device to control the half-bridge semiconductor device to provide power to the brushless motor.

23. The power tool of claim 22, wherein the half-bridge semiconductor device includes a current sensor configured to sense a current through the half-bridge semiconductor device.

24. The power tool of claim 22, wherein the half-bridge semiconductor device includes a temperature sensor configured to sense a temperature associated with the half-bridge semiconductor device.

25. The power tool of claim 22, wherein the half-bridge semiconductor device is configured to receive a plurality of control signals from the controller.

26. The power tool of claim 25, wherein the plurality of control signals includes a first signal to turn ON the first semiconductor switching device and a second signal to turn ON the second semiconductor switching device.

27. The power tool of claim 25, wherein the plurality of control signals includes a device enable signal for enabling operation of the half-bridge semiconductor device.

28. The power tool of claim 22, wherein the half-bridge semiconductor device is configured to output a plurality of feedback signals to the controller.

29. The power tool of claim 28, wherein the plurality of feedback signals includes at least one of a current feedback signal and a temperature feedback signal.

30. The power tool of claim 28, wherein the plurality of feedback signals includes a fault feedback signal.

31. The power tool of claim 22, wherein the half-bridge semiconductor device includes a housing and is packaged as a single integrated circuit.

Images