Camera module, optical image stabilization device and implementation method

Abstract

The present invention provides an optical image stabilization device, an implementation method and a camera module. The optical image stabilization device comprises: a stator and a rotor; the rotor comprises a carrier plate; and the carrier plate is provided with a hollow part, and at least part of an image sensor chip packaging member is arranged in the hollow part, so that the thickness of the optical image stabilization device can be reduced, and the heat dissipation effect of an image sensor chip can be enhanced.

Description

Camera module, optical image stabilization device and implementation method

[0001] This application claims priority to the Chinese patent application filed with the China Patent Office on October 7, 2023, with application number 202311289465.9 and invention name “Camera module, optical image stabilization device and implementation method”, the entire contents of which are incorporated by reference into this application. Technical Field

[0002] The invention relates to the technical field of camera modules, and in particular to an optical image stabilization device and an implementation method thereof, and a camera module. Background Art

[0003] When taking photos with a handheld portable smart device, the human body's physiological tremors are unavoidable and cannot be overcome through training. As a result, the handheld portable smart device will inevitably shake along with the human body when taking photos, resulting in a decrease in image quality. The most obvious manifestation is blurry and unclear images.

[0004] As consumers' requirements for mobile phone imaging quality increase and the number of photo-taking scenarios increases, more and more consumers will have the need to record or take photos while exercising, which puts higher demands on the anti-shake function of handheld portable smart devices when taking photos and videos.

[0005] Existing handheld portable smart devices use a lens assembly that can move in the XY axis direction in the camera module, so as to compensate for the physiological vibration of the human body and obtain high-quality images.

[0006] Existing image sensor jitter compensation devices suffer from insufficient stability and poor flatness control. Image sensors also suffer from poor heat dissipation during operation. The assembly of the optical jitter compensation device and the image sensor is complex.

[0007] Summary of the Invention

[0008] Based on the existing problems, the present invention provides a method for implementing an optical image stabilization device, which at least includes: providing an optical compensation assembly and an image sensor chip package; and electrically connecting the suspended end of the metal wire of the image sensor chip package to the solder pad of the optical compensation assembly, thereby forming the optical image stabilization device.

[0009] In some embodiments, the suspended end of the metal wire is electrically connected to the pad by bonding or welding with a conductive adhesive.

[0010] In some embodiments, the conductive adhesive bonding method is: gluing silver glue to the suspended end of the metal wire to electrically connect the suspended end of the metal wire to the pad; the welding method includes soldering, pressure welding, SMT or ultrasonic welding.

[0011] In some embodiments, providing the image sensor chip package includes: providing an image sensor chip and a support frame; bonding a first end of a metal wire to a pad of the image sensor chip, and suspending a second end of the metal wire above the image sensor chip; bonding the image sensor chip to the image sensor chip through an inner support structure of the support frame; and forming a glass cover and a filter on an inner step structure of the support frame to block external contaminants, thereby forming the image sensor chip package.

[0012] In some embodiments, the optical compensation assembly includes: a stator and a mover; the mover includes a carrier; the carrier has a hollow portion, and at least a portion of the image sensor chip package is disposed in the hollow portion to reduce the thickness of the optical image stabilization device and enhance the heat dissipation effect of the image sensor chip.

[0013] In some embodiments, the support frame is fixedly connected to the carrier board; and the photosensitive surface of the image sensor chip is lower than the upper surface of the carrier board.

[0014] In some embodiments, components of an optical image stabilization control circuit are disposed on the carrier board and surround the image sensor assembly.

[0015] In some embodiments, the stator includes an electrical connection assembly and a reinforcement structure located thereunder; the electrical connection assembly includes a moving part and a fixed part, and the moving part is connected to the mover.

[0016] In some embodiments, the lower surface of the electrical connection component is higher than the photosensitive surface of the image sensor chip, the lower surface of the electrical connection component is higher than the backlight surface of the image sensor chip, or the lower surface of the electrical connection component is lower than the backlight surface of the image sensor chip.

[0017] In some embodiments, the movable portion includes a plurality of conductive elastic wires, each conductive elastic wire including at least two conductive layers and at least one continuous insulating layer; the conductive elastic wires are arranged around at least two sides of the image sensor chip with the optical center as a reference.

[0018] In some embodiments, the optical compensation assembly also includes: a driving component; the driving component includes a memory alloy wire; the first end of the memory alloy wire is clamped by a first clamping member and fixed to the stator; the second end of the memory alloy wire is clamped by a second clamping member and fixed to the mover; the driving component drives the mover to move to achieve optical image stabilization compensation.

[0019] In some embodiments, the optical compensation assembly also includes: a limiting component; the limiting component includes a first limiting portion and a second limiting portion; the first limiting portion is fixed on the stator; the second limiting portion is fixed on the mover; a limiting space exists between the first limiting portion and the second limiting portion; the first limiting portion and the second limiting portion cooperate with each other to limit the planar movement range of the mover.

[0020] In some embodiments, the first clamping member, the second clamping member and the limiting assembly are integrally formed by a metal injection molding process.

[0021] In some embodiments, the optical image stabilization device also includes: an upper cover; the upper cover includes a main body bracket and a metal part embedded in the main body bracket through an injection molding process; a magnetic component and a rolling component are provided on the second limiting portion; the metal part and the magnetic part attract the carrier along the optical axis through magnetic attraction, so that the rolling component contacts the metal part, thereby allowing the image sensor chip package to move smoothly.

[0022] In some embodiments, the magnetic component is a magnet; the rolling component is a ball or a roller; and the surface of the rolling component has water-insoluble grease.

[0023] In some embodiments, the optical image stabilization device further includes: a base plate; a welding position is set between the upper cover and the base plate for completing assembly by welding.

[0024] In some embodiments, the conductive elastic wire is provided with a multi-layer conductive path, and the multi-layer conductive path is provided with multiple metal layers for respectively transmitting different signals; the conductive elastic wire includes a plurality of conductive holes; wherein the conductive holes are used to connect the metal layers of different layers of the multi-layer conductive path to transmit corresponding signals.

[0025] In some embodiments, the first metal layer in the multi-layer metal layer is used to transmit low-speed signals and provide mechanical support; the second metal layer in the multi-layer metal layer is used to transmit high-speed signals.

[0026] The present invention also provides an optical image stabilization device, comprising: a stator and a mover; the mover includes a carrier; the carrier has a hollow portion, and at least a portion of the image sensor chip package is arranged in the hollow portion to reduce the thickness of the optical image stabilization device and enhance the heat dissipation effect of the image sensor chip.

[0027] In some embodiments, the support frame is fixedly connected to the carrier board; and the photosensitive surface of the image sensor chip is lower than the upper surface of the carrier board.

[0028] In some embodiments, components of an optical image stabilization control circuit are disposed on the carrier board and surround the image sensor assembly.

[0029] In some embodiments, the stator includes an electrical connection assembly and a reinforcement structure located thereunder; the electrical connection assembly includes a moving part and a fixed part, and the moving part is connected to the mover.

[0030] In some embodiments, the lower surface of the electrical connection component is higher than the photosensitive surface of the image sensor chip, the lower surface of the electrical connection component is higher than the backlight surface of the image sensor chip, or the lower surface of the electrical connection component is lower than the backlight surface of the image sensor chip.

[0031] In some embodiments, the movable portion includes a plurality of conductive elastic wires, each conductive elastic wire including at least two conductive layers and at least one continuous insulating layer; the conductive elastic wires are arranged around at least two sides of the image sensor chip with the optical center as a reference.

[0032] In some embodiments, the optical image stabilization device also includes a driving component; the driving component includes a memory alloy wire; the first end of the memory alloy wire is clamped by a first clamping member and fixed to the stator; the second end of the memory alloy wire is clamped by a second clamping member and fixed to the mover; the driving component drives the mover to move to achieve optical image stabilization compensation.

[0033] In some embodiments, the optical image stabilization device further includes: a limiting assembly; the limiting assembly includes a first limiting portion and a second limiting portion; the first limiting portion is fixed on the stator; the second limiting portion is fixed on the mover; a limiting space exists between the first limiting portion and the second limiting portion; the first limiting portion and the second limiting portion cooperate with each other to limit the planar movement range of the mover.

[0034] In some embodiments, the first clamping member, the second clamping member and the limiting assembly are integrally formed by a metal injection molding process.

[0035] In some embodiments, the optical image stabilization device also includes: an upper cover; the upper cover includes a main body bracket and a metal part embedded in the main body bracket through an injection molding process; a magnetic component and a rolling component are provided on the second limiting portion; the metal part and the magnetic part attract the carrier along the optical axis through magnetic attraction, so that the rolling component contacts the metal part, thereby allowing the image sensor chip package to move smoothly.

[0036] In some embodiments, the magnetic component is a magnet; the rolling component is a ball or a roller; and the surface of the rolling component has water-insoluble grease.

[0037] In some embodiments, the optical image stabilization device further includes: a base plate; a welding position is set between the upper cover and the base plate for completing assembly by welding.

[0038] In some embodiments, the conductive elastic wire is provided with a multi-layer conductive path, and the multi-layer conductive path is provided with multiple metal layers for respectively transmitting different signals; the conductive elastic wire includes a plurality of conductive holes; wherein the conductive holes are used to connect the metal layers of different layers of the multi-layer conductive path to transmit corresponding signals.

[0039] In some embodiments, the first metal layer in the multi-layer metal layer is used to transmit low-speed signals and provide mechanical support; the second metal layer in the multi-layer metal layer is used to transmit high-speed signals.

[0040] The present invention also provides a camera module comprising the optical image stabilization device.

[0041] The carrier board provided in the embodiment of the present invention has a hollow portion, and at least a portion of the image sensor chip package can be disposed in the hollow portion, thereby reducing the thickness of the optical image stabilization device and enhancing the heat dissipation effect of the image sensor chip. BRIEF DESCRIPTION OF THE DRAWINGS

[0042] FIG1 is a front perspective structural diagram of an optical image stabilization device according to an embodiment of the present invention.

[0043] FIG. 2 is a schematic diagram of the back three-dimensional structure of an optical image stabilization device according to an embodiment of the present invention.

[0044] FIG. 3 is an exploded view of the structure of an optical image stabilization device according to an embodiment of the present invention.

[0045] FIG4 is a schematic structural diagram of an image sensor package according to an embodiment of the present invention.

[0046] FIG5 is a schematic structural diagram of a mover according to an embodiment of the present invention.

[0047] FIG6 is a schematic diagram of a partial structure of an image sensor package and a mover according to an embodiment of the present invention.

[0048] FIG7 is a schematic structural diagram of a stator according to an embodiment of the present invention.

[0049] FIG8 is a top view of the structure of the stator according to an embodiment of the present invention.

[0050] FIG9 is a cross-sectional view of a conductive elastic wire structure according to an embodiment of the present invention.

[0051] FIG10 is a cross-sectional view of the structure of another conductive elastic wire according to an embodiment of the present invention.

[0052] FIG. 11 is a top view of the structure of the driving assembly and the limiting assembly according to an embodiment of the present invention.

[0053] FIG12 is a schematic structural diagram of an upper cover according to an embodiment of the present invention.

[0054] FIG13 is an exploded view of the structure of the driving assembly and the limiting assembly according to an embodiment of the present invention.

[0055] FIG. 14 is a schematic diagram of a partial structure of an optical image stabilization device according to an embodiment of the present invention.

[0056] FIG. 15 is a cross-sectional schematic diagram of a partial structure of an optical image stabilization device according to an embodiment of the present invention. DETAILED DESCRIPTION

[0057] The following description sets forth numerous specific details to facilitate a thorough understanding of the present invention. However, the present invention can be implemented in many other ways than those described herein, and those skilled in the art can make similar generalizations without departing from the scope of the present invention. Therefore, the present invention is not limited to the specific embodiments disclosed below. Furthermore, the present invention is described in detail using schematic diagrams. When describing the embodiments of the present invention, these schematic diagrams are merely examples for ease of explanation and are not intended to limit the scope of the present invention.

[0058] In order to make the above-mentioned objects, features and beneficial effects of the embodiments of the present invention more obvious and easy to understand, the specific embodiments of the present invention are described in detail below with reference to the accompanying drawings.

[0059] FIG1 is a front perspective structural diagram of an optical image stabilization device 100 according to an embodiment of the present invention.

[0060] FIG. 2 is a schematic diagram of the back three-dimensional structure of an optical image stabilization device 100 according to an embodiment of the present invention.

[0061] FIG. 3 is an exploded view of the structure of an optical image stabilization device 100 according to an embodiment of the present invention.

[0062] As shown in Figure 3, the optical image stabilization device 100 includes a top cover 101, a drive assembly 102a and a stop assembly 102b, an image sensor package 103, a mover 104, a stator 105, and a base plate 106. The top cover 101 and base plate 106 are welded together to complete the assembly. The mover 104, driven by the drive assembly 102a, drives the image sensor package 103, thereby achieving the optical image stabilization effect.

[0063] As shown in FIG4 , image sensor chip package 103 includes an image sensor chip 1033 and a support frame 1031. A method for forming image sensor chip package 103 includes bonding a first end of a metal wire 1035 to a pad on image sensor chip 1033, leaving a second end of the metal wire 1035 suspended above image sensor chip 1033; bonding the image sensor chip 1033 to the image sensor chip 1033 via an inner support structure 1032 of support frame 1031; and forming a glass cover and a filter 1034 on the inner step structure of support frame 1031 to block external contaminants, thereby forming image sensor chip package 103.

[0064] As shown in Figure 5, the mover 104 includes a carrier board 104 for arranging electronic components, such as a circuit board. The carrier board 104 has a hollow portion 1041 located in the middle area.

[0065] As shown in Figure 6, the support frame 1031 is fixedly connected to the carrier 104. At least a portion of the image sensor chip package 103 can be disposed within the hollow portion 1041. The photosensitive surface of the image sensor chip 1033 is lower than the upper surface of the carrier 104 (the side away from the base plate 106). Components of the optical image stabilization control circuit (not shown) are disposed on the carrier 104 and surround the image sensor package 103.

[0066] As shown in Figure 7, stator 105 includes an electrical connection assembly 1051 and a reinforcement structure 1052 located below it. Electrical connection assembly 1051 is a multi-layer flexible structure that electrically connects to the bottom surface of carrier board 104 for electrical signal transmission. Electrical connection assembly 1051 can be manufactured using an integrated molding process. The upper layer of electrical connection assembly 1051 and the lower layer of reinforcement structure 1052 can be integrally formed by press-fitting. Reinforcement structure 1052 can be made of steel plate.

[0067] As shown in Figure 8, the electrical connection assembly 1051 includes a movable portion 1051a and a fixed portion 1051b. The movable portion 1051a is connected to the mover 104. The movable portion 1051a includes a plurality of flexible conductive elastic wires 110 and an inner ring movable structure 111. The inner ring movable structure 111 is connected to the fixed portion 1051b via the conductive elastic wires 110. The inner ring movable structure 111 is fixedly connected to the mover 104. In some embodiments, the lower surface of the electrical connection assembly 1051 (near the base plate 106) is higher than the photosensitive surface of the image sensor chip 1033. In some embodiments, the lower surface of the electrical connection assembly 1051 is higher than the backlight surface of the image sensor chip 1033. In some embodiments, the lower surface of the electrical connection assembly 1051 is lower than the backlight surface of the image sensor chip 1033.

[0068] The conductive elastic wire 110 includes at least two conductive layers and at least one continuous insulating layer; the conductive elastic wire 110 is set around at least two sides of the image sensor chip with the optical center as the reference. The present invention provides two embodiments of the conductive elastic wire 110

[0069] In one embodiment, as shown in Figure 9, the conductive elastic wire 110 includes a first conductive path with a first metal layer 203 and a second conductive path with a second metal layer 205. The first metal layer 203 can be made of an elastic metal substrate and is provided at the bottom layer to provide support for the conductive elastic wire 110. In this embodiment, the first metal layer 203 can provide certain electrical properties, thereby achieving a "double-layer electrical" effect. The conductive elastic wire 110 of this embodiment of the present invention achieves a double-layer electrical effect, which can reduce the number of conductive elastic wires and reduce stiffness in the X / Y directions. In this embodiment, the conductive elastic wire 110 also includes a plurality of conductive vias 204, which are used to connect different metal layers to transmit corresponding signals. The conductive vias 204 can be filled with conductive material. In this embodiment, multiple metal layers are wrapped with insulating material; the insulating material exposes at least a portion of the top surface of the second metal layer 205. Specifically, the conductive elastic wire 213 includes a first insulating layer 201 and a second insulating layer 202. The materials of the first insulating layer 201 and the second insulating layer 202 can be silicon oxide, aluminum oxide, ceramic, polyimide, polyester, solder mask ink, or a combination thereof. The first insulating layer 201 electrically isolates the first metal layer 203 from the second metal layer 205. The second insulating layer 202 protects the second metal layer 205. The first metal layer 203 in the multi-layer metal layer is used to transmit low-speed signals and provide mechanical support; the second metal layer 205 in the multi-layer metal layer is used to transmit high-speed signals.

[0070] In another embodiment, as shown in Figure 10, the conductive elastic wire 110 includes a first conductive path layer comprising a first metal layer 305, a second conductive path layer comprising a second metal layer 306, and a third conductive path layer comprising a third metal layer 307. The first metal layer 303 can be made of an elastic metal substrate, which is provided at the bottom layer to provide support for the conductive elastic wire 110. In this embodiment, the substrate provides certain electrical properties, thereby achieving a "multi-layer electrical" effect. Compared to a two-layer electrical elastic connection assembly, an elastic connection assembly with a multi-layer electrical effect can further reduce the number of conductive elastic wires and reduce stiffness in the X / Y directions. In this embodiment, the conductive elastic wire 110 also includes a plurality of conductive vias 308, which are used to connect different metal layers to transmit corresponding signals. The conductive vias 308 can be filled with conductive material. In this embodiment, the multiple metal layers are wrapped with an insulating material; the insulating material at least partially exposes the top surface of the third metal layer 307. Specifically, the conductive elastic filament 110 includes a first insulating layer 301, a second insulating layer 302, a third insulating layer 303, and a fourth insulating layer 304. The materials of the first insulating layer 301, the second insulating layer 302, the third insulating layer 303, and the fourth insulating layer 304 can be silicon oxide, aluminum oxide, ceramic, polyimide, polyester, solder resist ink, or a combination thereof. The first insulating layer 301 can electrically isolate the first metal layer 305 from the second metal layer 306. The second insulating layer can protect the second metal layer 306. The third insulating layer 303 can electrically isolate the second metal layer 306 from the third metal layer 307. The fourth insulating layer 304 can protect the third metal layer 307.

[0071] As shown in Figure 11, the drive assembly 102a includes a first clamping member 1021, a memory alloy wire 1022, and a second clamping member 1023. The first end of the memory alloy wire 1022 is clamped by the first clamping member 1021 and fixed to the stator 105. The second end of the memory alloy wire 1022 is clamped by the second clamping member 1023 and fixed to the mover 104. The drive assembly 102a drives the mover 104 to move to achieve optical image stabilization compensation. The limiting assembly 102b includes a first limiting portion 1024 and a second limiting portion 1025. The first limiting portion 1024 is fixed to the stator 105. The second limiting portion 1024 is fixed to the mover 104. A limiting space 1026 exists between the first limiting portion 102 and the second limiting portion 1025. The first limiting portion 1024 and the second limiting portion 1025 cooperate with each other to limit the planar movement range of the mover 104. The first clamping member 1021 , the second clamping member 1023 and the limiting assembly 102 b can be integrally formed by a metal injection molding process.

[0072] As shown in FIG12 , the upper cover 101 comprises a main frame 101 a and a metal member 101 b embedded in the main frame 101 a through an injection molding process.

[0073] As shown in Figures 13 and 14, a magnetic component 1028 and a rolling component 1027 are provided on the second limiting portion 1025. The magnetic component 1028 may be a magnet. The rolling component 1027 may be a ball or a roller. The surface of the rolling component 1027 is provided with water-insoluble grease.

[0074] As shown in FIG15 , the metal member 101 b and the magnetic member 1028 attract the mover 104 upward along the optical axis through magnetic attraction, causing the rolling member 1027 to contact the metal member 101 b , thereby allowing the image sensor chip package 103 to move smoothly.

[0075] For the above-mentioned optical image stabilization device, an embodiment of the present invention further provides an assembly implementation method, including providing an independent optical compensation assembly and an independent image sensor chip package; electrically connecting the suspended end of the metal wire of the image sensor chip package to the solder pad of the optical compensation assembly, thereby forming the optical image stabilization device. The optical compensation assembly may include the stator, mover, drive component and limit component described above. Specifically, the suspended end of the metal wire is electrically connected to the solder pad by bonding or welding with conductive glue. The conductive glue bonding method is: gluing silver glue to the suspended end of the metal wire, and electrically connecting the suspended end of the metal wire to the solder pad; the welding method includes soldering, pressure welding, SMT (Surface Mounted Technology) or ultrasonic welding.

[0076] The method for forming an image sensor chip package includes: providing an image sensor chip and a support frame; bonding a first end of a metal wire to a pad of the image sensor chip, with a second end of the metal wire suspended above the image sensor chip; bonding the image sensor chip to the image sensor chip through an internal support structure of the support frame; and forming a glass cover and a filter on an internal step structure of the support frame to block external contaminants, thereby forming the image sensor chip package.

[0077] It will be apparent to those skilled in the art that the present invention is not limited to the details of the exemplary embodiments described above and that the invention can be implemented in other specific forms without departing from the spirit or essential features of the invention. Therefore, the embodiments should be considered exemplary and non-restrictive in any manner. Furthermore, it is clear that the word "comprising" does not exclude other elements and steps, and the word "a" does not exclude pluralities. Multiple elements stated in a device claim may also be implemented by a single element. Terms such as first and second are used to indicate names and do not imply any particular order.

Claims

1. A method for implementing an optical image stabilization device, characterized in that: At least: Providing optical compensation assemblies and image sensor chip packages; The suspended end of the metal wire of the image sensor chip package is electrically connected to the pad of the optical compensation assembly to form the optical anti-shake device.

2. The method according to claim 1, characterized in that The suspended end of the metal wire is electrically connected to the pad by bonding or welding with conductive adhesive.

3. The method according to claim 2, characterized in that The conductive adhesive bonding method is: gluing the suspended end of the metal wire with silver adhesive to electrically connect the suspended end of the metal wire with the pad; The welding method includes soldering, pressure welding, SMT or ultrasonic welding.

4. The method according to claim 1, characterized in that Providing the image sensor chip package includes: Provide image sensor chips and support frames; Bonding a first end of the metal wire to a pad of the image sensor chip, and suspending a second end of the metal wire on the image sensor chip; The inner support structure of the support frame is bonded to the image sensor chip as a whole; A glass cover plate and a filter are formed on the inner step structure of the support frame to block external pollutants, thereby forming the image sensor chip package.

5. The method according to claim 4, characterized in that The optical compensation assembly comprises: A stator and a mover; the mover includes a carrier plate; The carrier has a hollow portion, and at least part of the image sensor chip package It is arranged in the hollow part to reduce the thickness of the optical image stabilization device and enhance the heat dissipation effect of the image sensor chip.

6. The method according to claim 5, characterized in that The support frame is fixedly connected to the carrier board; the photosensitive surface of the image sensor chip is lower than the upper surface of the carrier board.

7. The method according to claim 6, characterized in that Components of an optical image stabilization control circuit are arranged on the carrier board and surround the image sensor assembly.

8. The method according to claim 7, characterized in that The stator includes an electrical connection assembly and a reinforcement structure located below the stator; The electrical connection assembly comprises a moving part and a fixed part, and the moving part is connected to the mover.

9. The method according to claim 8, characterized in that The lower surface of the electrical connection component is higher than the photosensitive surface of the image sensor chip, the lower surface of the electrical connection component is higher than the backlight surface of the image sensor chip, or the lower surface of the electrical connection component is lower than the backlight surface of the image sensor chip.

10. The method according to claim 5, characterized in that The moving part includes a plurality of conductive elastic wires, each of which includes at least two conductive layers and at least one continuous insulating layer; the conductive elastic wires are arranged around at least two sides of the image sensor chip with the optical center as a reference.

11. The method according to claim 5, characterized in that The optical compensation assembly also includes: Drive components; The driving assembly includes a memory alloy wire; The first end of the memory alloy wire is clamped by a first clamping member and fixed on the stator; The second end of the memory alloy wire is clamped by a second clamping member and fixed on the mover; The driving assembly drives the mover to move to achieve optical image stabilization compensation.

12. The method according to claim 11, characterized in that The optical compensation assembly also includes: a limiting component; The limiting assembly includes a first limiting portion and a second limiting portion; The first limiting portion is fixed on the stator; The second limiting portion is fixed on the mover; There is a limiting space between the first limiting portion and the second limiting portion; The first limiting portion and the second limiting portion cooperate with each other to limit the planar movement range of the mover.

13. The method according to claim 12, characterized in that The first clamping member, the second clamping member and the limiting assembly are integrally formed by a metal injection molding process.

14. The method according to claim 5, characterized in that The optical image stabilization device further includes: an upper cover; The upper cover comprises a main frame and a metal part embedded in the main frame by an injection molding process; The second limiting part is provided with a magnetic component and a rolling component; The metal component and the magnetic component attract the carrier plate along the optical axis through magnetic attraction, so that the rolling component contacts the metal component, thereby allowing the image sensor chip package to move smoothly.

15. The method according to claim 14, characterized in that The magnetic component is a magnet; The rolling component is a ball or a roller; the surface of the rolling component has water-insoluble grease.

16. The method according to claim 5, characterized in that The optical image stabilization device further comprises: a bottom plate; a welding position is arranged between the upper cover and the bottom plate for completing assembly by welding.

17. The method according to claim 10, characterized in that The conductive elastic wire is provided with a multi-layer conductive path, and the multi-layer conductive path is provided with a multi-layer metal layer for transmitting different signals respectively; the conductive elastic wire includes a plurality of conductive holes; wherein the conductive holes are used to connect the metal layers of different layers of the multi-layer conductive path to transmit corresponding signals.

18. The method according to claim 17, characterized in that The first metal layer in the multi-layer metal layer is used to transmit low-speed signals and provide mechanical support; the second metal layer in the multi-layer metal layer is used to transmit high-speed signals.

19. An optical image stabilization device, characterized in that: include: A stator and a mover; the mover includes a carrier plate; The carrier board has a hollow portion, and at least a portion of the image sensor chip package is disposed in the hollow portion, so as to reduce the thickness of the optical image stabilization device and enhance the heat dissipation effect of the image sensor chip.

20. The optical image stabilization device according to claim 19, wherein: The support frame is fixedly connected to the carrier board; the photosensitive surface of the image sensor chip is lower than the upper surface of the carrier board.

21. The optical image stabilization device according to claim 20, wherein: Components of an optical image stabilization control circuit are arranged on the carrier board and surround the image sensor assembly.

22. The optical image stabilization device according to claim 21, wherein: The stator includes an electrical connection assembly and a reinforcement structure located below the stator; The electrical connection assembly comprises a moving part and a fixed part, and the moving part is connected to the mover.

23. The optical image stabilization device according to claim 22, wherein: The lower surface of the electrical connection component is higher than the photosensitive surface of the image sensor chip, the lower surface of the electrical connection component is higher than the backlight surface of the image sensor chip, or the lower surface of the electrical connection component is lower than the backlight surface of the image sensor chip.

24. The optical image stabilization device according to claim 22, wherein: The moving part includes a plurality of conductive elastic wires, each of which includes at least two conductive layers and at least one continuous insulating layer; the conductive elastic wires are arranged around at least two sides of the image sensor chip with the optical center as a reference.

25. The optical image stabilization device according to claim 19, wherein: Also included is a drive assembly; The driving assembly includes a memory alloy wire; The first end of the memory alloy wire is clamped by a first clamping member and fixed on the stator; The second end of the memory alloy wire is clamped by a second clamping member and fixed on the mover; The driving assembly drives the mover to move to achieve optical image stabilization compensation.

26. The optical image stabilization device according to claim 25, wherein: Also includes: Limiting components; The limiting assembly includes a first limiting portion and a second limiting portion; The first limiting portion is fixed on the stator; The second limiting portion is fixed on the mover; There is a limiting space between the first limiting portion and the second limiting portion; The first limiting portion and the second limiting portion cooperate with each other to limit the planar movement range of the mover.

27. The optical image stabilization device according to claim 26, wherein: The first clamping member, the second clamping member and the limiting assembly are formed by metal injection molding. One-piece molding process.

28. The optical image stabilization device according to claim 27, wherein: Also includes: Upper cover; The upper cover comprises a main frame and a metal part embedded in the main frame by an injection molding process; The second limiting part is provided with a magnetic component and a rolling component; The metal component and the magnetic component attract the carrier plate along the optical axis through magnetic attraction, so that the rolling component contacts the metal component, thereby allowing the image sensor chip package to move smoothly.

29. The optical image stabilization device according to claim 28, wherein: The magnetic component is a magnet; the rolling component is a ball or a roller; and the surface of the rolling component has water-insoluble grease.

30. The optical image stabilization device according to claim 19, wherein: Also includes: Base plate; the upper cover and the base plate are provided with welding positions for completing the assembly by welding.

31. The optical image stabilization device according to claim 24, wherein: The conductive elastic wire is provided with a multi-layer conductive path, and the multi-layer conductive path is provided with a multi-layer metal layer for transmitting different signals respectively; the conductive elastic wire includes a plurality of conductive holes; wherein the conductive holes are used to connect the metal layers of different layers of the multi-layer conductive path to transmit corresponding signals; the first metal layer in the multi-layer metal layer is used to transmit low-speed signals and provide mechanical support; the second metal layer in the multi-layer metal layer is used to transmit high-speed signals.

32. A camera module, characterized in that: Comprising the optical image stabilization device as claimed in any one of claims 19 to 31.

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