Resin film and packaging

Abstract

A resin film containing a thermoplastic resin, wherein the crystallite size of the thermoplastic resin is 90 Å or larger, and the softening point of the resin film is 140°C or lower.

Description

Resin film and packaging

[0001] The present invention relates to a resin film and a packaging material. This application claims priority to Japanese Patent Application No. 2023-172268, filed on October 3, 2023, the contents of which are incorporated herein by reference.

[0002] Blister packs (also known as press-through packages (PTPs)) are widely used for a variety of products, including everyday items. For example, blister packs, which are made by heat-sealing a base material with a recess and a sheet-like lid material, with the recess serving as a storage compartment, are used to package tablets.

[0003] In blister packs containing tablets, a transparent resin film is used as the base material, and an aluminum sheet is usually used as the lid material (see Patent Document 1).

[0004] Due to their high convenience, packaging materials made from resin films are mass-produced and consumed every day around the world, generating large amounts of waste after use. From the perspective of improving the global environment, waste generation is an important issue that needs to be resolved. In recent years, methods for reducing the amount of waste generated as well as methods for reusing (recycling) waste have been actively studied.

[0005] For example, in the case of a resin film consisting of multiple layers, if the multiple resin layers are made of the same main constituent material, it becomes unnecessary to separate and reuse each resin layer separately, and the entire resin film can be easily reused, which increases its usefulness. Therefore, the development of such multilayer resin films is being actively pursued.

[0006] Japanese Patent Application Publication No. 2016-124574

[0007] On the other hand, in terms of individual packages, in blister pack packages used for packaging tablets, by using a resin film containing the same type of resin as the resin contained in the base material as the main constituent material instead of the conventional aluminum sheet for the lid material, the lid material and the base material can be reused at the same time, which is extremely useful. In other words, blister pack packages with a resin-containing lid material are extremely useful.

[0008] However, when a lid material containing a resin is used, the seal strength between the lid material and the base material is low under conventional heat sealing conditions, and a blister pack package with a sufficiently strong seal between the lid material and the base material cannot be obtained.Furthermore, if the heat sealing temperature is raised too high in order to increase the seal strength between the lid material containing a resin and the base material, the lid material or the base material will stick to the heating means used during heat sealing.

[0009] An object of the present invention is to provide a resin film that can be used to produce a base material containing a resin for constituting a blister pack package, and that can be used to produce a blister pack package with sufficiently high sealing strength by heat sealing the base material with a lid material containing a resin.

[0010] In order to solve the above problems, the present invention employs the following configurations. [1] A resin film containing a thermoplastic resin, wherein the crystallite size of the thermoplastic resin is 90 Å or more and the softening point of the resin film is 140°C or less. [2] The resin film according to [1], wherein the thermoplastic resin includes a homopolypropylene and a polypropylene random copolymer. [3] The resin film according to [2], wherein the proportion of the content of the polypropylene random copolymer relative to the total content of the homopolypropylene and the polypropylene random copolymer is more than 0% by mass and less than 10% by mass, or more than 50% by mass and less than 100% by mass.

[0011] [4] The resin film according to any one of [1] to [3], wherein the resin film is for a base material of a blister pack package. [5] A package constructed using the resin film according to any one of [1] to [4]. [6] The package according to [5], wherein the package is a blister pack package constructed by sealing a lid material and a base material, the base material being a molded body of the resin film, and the lid material containing the same type of thermoplastic resin as the thermoplastic resin contained in the base material.

[0012] According to the present invention, a resin film is provided that can be used to produce a base material containing a resin for forming a blister pack packaging body, and that can be used to produce a blister pack packaging body with sufficiently high sealing strength by heat sealing the base material with a lid material containing a resin.

[0013] 1 is a cross-sectional view schematically showing an example of a resin film according to an embodiment of the present invention. 2 is a perspective view schematically showing an example of a packaging body according to an embodiment of the present invention. 3 is a cross-sectional view taken along line III-III of the packaging body shown in FIG.

[0014] <<Resin Film>> A resin film according to one embodiment of the present invention is a resin film containing a thermoplastic resin, wherein the thermoplastic resin has a crystallite size of 90 Å or more and a softening point of 140°C or less. The resin film of this embodiment contains a thermoplastic resin having a crystallite size (also known as crystallite diameter) within a specific range of 90 Å or more, and the softening point of the resin film itself is within the specific range of 140°C or less. Therefore, when a base material is manufactured using the resin film and the base material and a lid material containing a resin are heat-sealed, a blister pack package with sufficiently high seal strength can be manufactured without excessively high heat-sealing temperatures. In contrast, simply specifying either the crystallite size of the thermoplastic resin or the softening point of the resin film does not result in a sufficiently high seal strength.

[0015] The resin film of this embodiment can be heat-sealed with other resin films to form packages other than blister pack packages. Even in this case, a package with sufficiently high seal strength can be produced without excessively high heat-sealing temperatures. Thus, the resin film of this embodiment is suitable for forming packages by sealing with other resin films. Since the resin film has the above-described configuration, it has excellent formability, making it particularly suitable for use as a base material for blister pack packages.

[0016] In this specification, unless otherwise specified, the mere expression "resin film" refers to the resin film of this embodiment.

[0017] In the resin film of this embodiment, the ratio of the total content of one or more components contained in the resin film (described later) to the total mass of the resin film does not exceed 100 mass%. Similarly, in the resin composition (described later) for forming the resin film, the ratio of the total content of one or more components contained in the resin composition (described later) to the total mass of the resin composition does not exceed 100 mass%.

[0018] <Thermoplastic Resin> The thermoplastic resin contained in the resin film of the present embodiment is not particularly limited as long as it has a crystallite size of 90 Å or more.

[0019] The resin film may contain only one type of thermoplastic resin, or two or more types. When two or more types are contained, the combination and ratio thereof can be selected arbitrarily depending on the purpose.

[0020] In this embodiment, when the resin film contains only one thermoplastic resin, the crystallite size of the thermoplastic resin is 90 Å or more. When the resin film contains two or more thermoplastic resins, the crystallite size of the mixture (in other words, the mixed resin) containing all of these two or more thermoplastic resins in the same content ratio as the content ratio in the resin film is 90 Å or more. For example, as described below, when the resin film contains homopolypropylene, polypropylene random copolymer, and optionally other resins as thermoplastic resins, the crystallite size of the mixture (mixed resin) containing homopolypropylene, polypropylene random copolymer, and optionally other resins in the same content ratio as the content ratio in the resin film is 90 Å or more.

[0021] The thermoplastic resin contained in the resin film is preferably a propylene-based resin. The propylene-based resin is a resin having structural units derived from propylene, and may be homopolypropylene (hPP), which is a homopolymer of propylene, or a propylene-based copolymer having both structural units derived from propylene and structural units derived from a monomer other than propylene. Preferred examples of the propylene-based copolymer include polypropylene random copolymers (rPP, propylene random copolymers) such as propylene-ethylene binary copolymers, propylene-1-butene-ethylene terpolymers, and propylene-1-butene binary copolymers; polypropylene block copolymers (bPP, propylene block copolymers); and the like.

[0022] The resin film preferably contains one or both of homopolypropylene and polypropylene random copolymer as the thermoplastic resin (propylene-based resin), and more preferably contains homopolypropylene and polypropylene random copolymer. In particular, the softening point of a resin film containing homopolypropylene and polypropylene random copolymer can be more easily adjusted. Furthermore, the crystallite size of a mixture of these propylene-based resins (thermoplastic resin) can be more easily adjusted.

[0023] More specifically, increasing the content of homopolypropylene in the resin film tends to easily increase the crystallite size of the thermoplastic resin (a mixture of homopolypropylene and polypropylene random copolymer). On the other hand, increasing the content of polypropylene random copolymer in the resin film tends to more easily lower the softening point of the resin film. However, in this embodiment, the method for adjusting the crystallite size of the thermoplastic resin and the softening point of the resin film is not limited to this.

[0024] The melt flow rate (sometimes referred to as "MFR" in this specification) of the homopolypropylene (hPP) is preferably 0.5 to 15 g / 10 min, and may be, for example, any of 0.5 to 6 g / 10 min, 4 to 11 g / 10 min, and 9 to 15 g / 10 min.

[0025] The melt flow rate (MFR) of the polypropylene random copolymer (rPP) is preferably 0.5 to 15 g / 10 min, and may be, for example, any of 0.5 to 6 g / 10 min, 4 to 11 g / 10 min, and 9 to 15 g / 10 min.

[0026] The melt flow rate (MFR) of the polypropylene block copolymer (bPP) is preferably 0.5 to 15 g / 10 min, and may be, for example, any of 0.5 to 6 g / 10 min, 4 to 11 g / 10 min, and 9 to 15 g / 10 min.

[0027] The melt flow rates of the homopolypropylene, polypropylene random copolymer and polypropylene block copolymer mentioned above are preferably values ​​obtained when the heating temperature of these resins is 230°C.

[0028] In this specification, unless otherwise specified, the melt flow rate (MFR) means a value obtained by measurement in accordance with JIS K 7210-1:2014.

[0029] When the resin film contains homopolypropylene and polypropylene random copolymer, the ratio of the content of the polypropylene random copolymer to the total content of the homopolypropylene and polypropylene random copolymer in the resin film ([Content of polypropylene random copolymer in resin film (parts by mass)] / ([Content of homopolypropylene in resin film (parts by mass)] + [Content of polypropylene random copolymer in resin film (parts by mass)]) × 100) is preferably more than 0% by mass and less than 10% by mass, or more than 50% by mass and less than 100% by mass. When the ratio is in this range, the crystallite size of the thermoplastic resin (a mixture of homopolypropylene and polypropylene random copolymer) can be more easily increased, and the softening point of the resin film can be more easily lowered. This ratio is usually the same as the ratio of the content of the polypropylene random copolymer to the total content of the homopolypropylene and polypropylene random copolymer in a resin composition described below ([Content of polypropylene random copolymer in resin composition (parts by mass)] / ([Content of homopolypropylene in resin composition (parts by mass)] + [Content of polypropylene random copolymer in resin composition (parts by mass)]) × 100). In other words, in the resin film, the ratio of the homopolypropylene content to the total content of the homopolypropylene and polypropylene random copolymer ([homopolypropylene content in resin film (parts by mass)] / ([homopolypropylene content in resin film (parts by mass)]+[polypropylene random copolymer content in resin film (parts by mass)])×100) is preferably 10 to 50% by mass.

[0030] In the resin film, the ratio of the content of the polypropylene random copolymer to the total content of the homopolypropylene and the polypropylene random copolymer may be, for example, any one of 1 to 9 mass%, 1 to 6.5 mass%, 3.5 to 9 mass%, and 3.5 to 6.5 mass%, or any one of 51 to 99 mass%, 51 to 85 mass%, 51 to 75 mass%, 65 to 99 mass%, 75 to 99 mass%, and 65 to 85 mass%, although these are just examples of the ratios.

[0031] When the resin film contains a propylene-based resin, the ratio of the propylene-based resin content to the thermoplastic resin content in the resin film ([propylene-based resin content (parts by mass) of the resin film] / [thermoplastic resin content (parts by mass) of the resin film] × 100) is preferably 80% by mass or more, and may be, for example, 85% by mass or more, 90% by mass or more, 95% by mass or more, 97% by mass or more, or 99% by mass or more. When this ratio is equal to or greater than the lower limit, the softening point of the resin film can be more easily lowered. On the other hand, this ratio is 100% by mass or less. This ratio is usually the same as the ratio of the propylene-based resin content to the thermoplastic resin content (parts by mass) in a resin composition described below ([propylene-based resin content (parts by mass) of the resin composition] / [thermoplastic resin content (parts by mass) of the resin composition] × 100).

[0032] <Other Components> The resin film of the present embodiment may or may not contain other components in addition to the thermoplastic resin, as long as the effects of the present invention are not impaired. The other components may be either resin components (sometimes referred to as "other resin components" in this specification) or non-resin components (sometimes referred to as "other non-resin components" in this specification).

[0033] Examples of the other non-resin components include additives known in the art, such as antifogging agents, antiblocking agents, antioxidants, antistatic agents, crystal nucleating agents, inorganic particles, viscosity reducers, thickeners, heat stabilizers, lubricants, infrared absorbers, ultraviolet absorbers, and colorants (e.g., dyes, pigments, etc.).

[0034] The resin film may contain only one type of other component, or two or more types. When two or more types are contained, the combination and ratio thereof can be selected arbitrarily depending on the purpose.

[0035] In the resin film, the ratio of the thermoplastic resin content to the total mass of the resin film ([thermoplastic resin content of the resin film (parts by mass)] / [total mass of the resin film (parts by mass)]×100) is preferably 80% by mass or more, and may be, for example, any of 85% by mass or more, 90% by mass or more, 95% by mass or more, 97% by mass or more, and 99% by mass or more. When this ratio is equal to or greater than the lower limit, the properties of the resin film as a resin film that can be used to form a package (for example, a base material that can form a blister pack package) are improved. On the other hand, this ratio is 100% by mass or less. This ratio is usually the same as the ratio of the thermoplastic resin content to the total content (parts by mass) of components that do not vaporize at room temperature in the resin composition described below ([thermoplastic resin content of the resin composition (parts by mass)] / [total content (parts by mass) of components that do not vaporize at room temperature in the resin composition]×100). In other words, in the resin film, the ratio of the content of the other components to the total mass of the resin film ([content of other components of the resin film (parts by mass)] / [total mass of the resin film (parts by mass)]×100) is preferably 20% by mass or less, and may be, for example, 15% by mass or less, 10% by mass or less, 5% by mass or less, 3% by mass or less, or 1% by mass or less. On the other hand, the ratio of the content of the other components is 0% by mass or more.

[0036] In this specification, "room temperature" means a temperature that is neither particularly cold nor hot, that is, an ordinary temperature, and examples thereof include temperatures of 15 to 25°C.

[0037] A resin film containing a propylene-based resin may or may not contain, as a component other than the propylene-based resin, one or more components selected from the group consisting of a thermoplastic resin not corresponding to a propylene-based resin, the other resin component, and the other non-resin component. When the resin film contains a component other than the propylene-based resin, the thermoplastic resin not corresponding to a propylene-based resin, the other resin component, and the other non-resin component contained in the resin film may each be only one type or two or more types, and when there are two or more types, the combination and ratio thereof can be selected as desired depending on the purpose.

[0038] Examples of the resin component that falls into either the thermoplastic resin that does not fall under the category of propylene-based resin or the other resin component include petroleum resin, styrene-isobutylene-styrene block copolymer, and the like.

[0039] <Crystallite size of thermoplastic resin> The crystallite size of the thermoplastic resin contained in the resin film is 90 Å or more. When a base material is produced using such a resin film and the base material is heat-sealed to a lid material containing a resin, a blister pack package with sufficiently high seal strength can be produced. The reason for this is unclear, but is presumed to be as follows. That is, when the base material and the lid material are heat-sealed, under heating conditions, the thermoplastic resin in the base material and the resin (thermoplastic resin) in the lid material melt and interdiffuse to mix, and then, when the resulting sealed body is cooled, these resins harden while remaining in a mixed state. In this case, because the crystallite size of the thermoplastic resin in the base material (derived from the resin film) is large, aggregates of at least a portion of the thermoplastic resin derived from the base material maintain a relatively large size at the sealed region, and even when an external force is applied to peel the base material and the lid material at the sealed region, the thermoplastic resin derived from the base material tends to remain surrounded by the resin derived from the lid material, presumably resulting in a sufficiently high seal strength between the base material and the lid material. This effect is manifested not only in blister pack packages, but also in packages other than blister pack packages that are formed by heat-sealing the resin film and the other resin film.

[0040] In order to further enhance the above-mentioned effects, the crystallite size of the thermoplastic resin is preferably 90 to 205 Å, and may be, for example, any one of 90 to 190 Å, 90 to 160 Å, and 90 to 130 Å, any one of 105 to 205 Å, 135 to 205 Å, and 165 to 205 Å, or 105 to 190 Å. However, these are examples of the crystallite size of the thermoplastic resin.

[0041] The crystallite size of the thermoplastic resin can be determined by a known method. For example, a film containing a thermoplastic resin can be analyzed by X-ray diffraction (X-ray diffraction) and the crystallite size can be calculated using Scherrer's formula: D = Kλ / (β cos θ) (where D is the crystallite size; β is the peak half-width of the measurement surface; λ is the wavelength of the X-ray; θ is the Bragg angle of the measurement surface; K is Scherrer's constant). The film containing the thermoplastic resin to be analyzed by X-ray diffraction preferably has a higher content of thermoplastic resin, and more preferably is made of (or contains only) a thermoplastic resin. The resin film of this embodiment itself may be subjected to analysis.

[0042] The crystallite size of a thermoplastic resin can be adjusted by, for example, adjusting the molecular weight, molecular branching degree, or copolymerization ratio of the monomer of the thermoplastic resin; adding a nucleating agent to the thermoplastic resin; or adjusting the thermal history such as the cooling rate when cooling the thermoplastic resin from a molten state, the temperature at the end of cooling, or the holding time of any temperature during cooling.

[0043] <Softening Point of Resin Film> The softening point (also referred to as softening temperature) of the resin film is 140°C or lower. When a base material is produced using such a resin film and the base material is heat-sealed to a lid material containing a resin, a blister pack package with sufficiently high seal strength can be produced. The reason for this is that, because the softening point of the resin film is below this specific value, the base material melts well to an appropriate extent when the base material and the lid material are heat-sealed, and the thermoplastic resin in the base material and the resin (thermoplastic resin) in the lid material are well mixed. This effect is not only exhibited in blister pack packages, but also in packages other than blister pack packages that are formed by heat-sealing the resin film with another resin film.

[0044] In terms of further enhancing the above-mentioned effects, the softening point of the resin film is preferably 70 to 140° C., and may be, for example, any of 70 to 125° C. and 70 to 110° C., any of 90 to 140° C., 105 to 140° C. and 120 to 140° C., or 90 to 125° C. However, these are just examples of the softening point of the resin film.

[0045] The softening point of the resin film can be adjusted by adjusting the type of thermoplastic resin contained in the resin film and the content of the thermoplastic resin in the resin film. In particular, the softening point of the resin film can be easily lowered by increasing the content of a low-density thermoplastic resin, a copolymer, or an elastomer component.

[0046] <Other Configurations of Resin Film> The resin film may be composed of one layer (single layer) or two or more layers. When the resin film is composed of multiple layers, these multiple layers may be the same or different from each other, and the combination of these multiple layers is not particularly limited as long as it does not impair the effects of the present invention.

[0047] In this specification, not limited to the case of a resin film, "multiple layers may be the same or different" means "all layers may be the same, all layers may be different, or only some layers may be the same." Furthermore, "multiple layers are different" means "at least one of the constituent materials and thicknesses of the layers is different from one another."

[0048] The thickness of the resin film is not particularly limited, but is preferably 100 to 400 μm, and may be, for example, any of 200 to 400 μm and 250 to 400 μm, any of 100 to 350 μm and 100 to 300 μm, or any of 200 to 350 μm and 250 to 300 μm. Here, the "thickness of the resin film" means the thickness of the entire resin film, and for example, the thickness of a resin film consisting of multiple layers means the total thickness of all layers constituting the resin film.

[0049] The resin film of this embodiment may or may not have other layers or films that do not fall under the category of the resin film on one or both sides thereof, as long as the effects of the present invention are not impaired. The other layers or films in the resin film can be selected arbitrarily depending on the purpose, and are not particularly limited, as long as they are not metal sheets. The thickness of the other layers or films in the resin film can also be selected arbitrarily depending on the purpose, and is not particularly limited.

[0050] In this specification, unless otherwise specified, the term "metal sheet" refers to a sheet whose main component is metal, and whose metal content is 90 to 100 mass % relative to the total mass of the metal sheet. The metal constituting the metal sheet may be a single metal such as aluminum, or an alloy of two or more metals.

[0051] The other layer or film may be provided over the entire surface of one or both sides of the resin film, or may be provided only in a partial region. Whether the other layer or film is provided over the entire surface of the resin film relative to the surface to be formed can be selected arbitrarily depending on the type of the other layer or film.

[0052] The other layer or film provided on only a partial area of ​​one or both sides of the resin film may, for example, be patterned or unpatterned, and may, for example, form letters.

[0053] A preferred example of the other layer in the resin film is a printed layer.

[0054] The other layer or film in the resin film may consist of one layer (single layer) or two or more layers. When the other layer or film consists of multiple layers, these multiple layers may be the same or different from each other, and the combination of these multiple layers is not particularly limited as long as it does not impair the effects of the present invention.

[0055] Of the surfaces of the resin film that will be heat-sealed to another resin film (e.g., a lid material) described below, at least the heat-sealed portion preferably does not include the other layer or film. More preferably, the entire surface of the resin film that will be the heat-sealed surface does not include the other layer or film. That is, it is more preferable that at least one surface of the resin film does not include the other layer or film.

[0056] The resin film is preferably a non-stretched film, since a non-stretched resin film has higher formability.

[0057] <Example of Resin Film> An example of a preferable resin film of the present embodiment is a resin film containing a thermoplastic resin, wherein the crystallite size of the thermoplastic resin is 90 Å or more, the softening point of the resin film is 140°C or less, the resin film contains a propylene-based resin as the thermoplastic resin, and the content of the thermoplastic resin relative to the total mass of the resin film is 80 mass% or more, and the content of the propylene-based resin relative to the content of the thermoplastic resin is 80 mass% or more.

[0058] An example of a more preferred resin film of this embodiment is a resin film containing a thermoplastic resin, wherein the crystallite size of the thermoplastic resin is 90 Å or more, and the softening point of the resin film is 140°C or less, the resin film contains homopolypropylene and polypropylene random copolymer as the thermoplastic resin, and the proportion of the content of the thermoplastic resin with respect to the total mass of the resin film is 80 mass% or more, and the proportion of the total content of the homopolypropylene and polypropylene random copolymer with respect to the thermoplastic resin content (([content of homopolypropylene in resin film (parts by mass)] + [content of polypropylene random copolymer in resin film (parts by mass)]) / [content of thermoplastic resin in resin film (parts by mass)] × 100) is 80 mass% or more, and the proportion of the content of the polypropylene random copolymer with respect to the total content of the homopolypropylene and polypropylene random copolymer with respect to the total content of the

[0059] The present invention will be described below with reference to the drawings. In the drawings used in the following description, for the sake of convenience, the essential parts may be shown enlarged to make the features of the present invention easier to understand, and the dimensional proportions of the components may not necessarily be the same as those in reality.

[0060] Fig. 1 is a cross-sectional view schematically illustrating an example of a resin film according to this embodiment. The resin film 1 shown here contains a thermoplastic resin having a crystallite size of 90 Å or more. The softening point of the resin film 1 is 140°C or less. One of the surfaces 1a (sometimes referred to herein as the "first surface") of the resin film 1 and the other surface 1b (sometimes referred to herein as the "second surface") is a heat-seal surface with another resin film (e.g., a lid material for forming a blister pack package).

[0061] <<Method for Producing Resin Film>> Of the resin films of this embodiment, a resin film consisting of a single layer can be produced, for example, by extrusion molding a resin or a resin composition or the like that is the forming material thereof.

[0062] The resin composition may be produced by adjusting the types and contents of the components contained therein so that the resin film to be formed contains the desired components in the desired amounts. For example, the ratio of the contents of the components that do not vaporize at room temperature in the resin composition is usually the same as the ratio of the contents of the components in the resin film formed from this resin composition.

[0063] When the resin composition is used, for example, a blend (dry blend, non-kneaded product) of two or more components may be directly fed into the extruder as the resin composition, or a pre-kneaded product in which two or more components are kneaded in advance may be fed into the extruder as the resin composition. The pre-kneaded product can be obtained, for example, by melt-kneading two or more components using an apparatus such as a twin-screw extruder or a Banbury mixer.

[0064] The resin composition may be, for example, a resin composition containing the thermoplastic resin and, if necessary, other components. The other components are the components described above. A preferred resin composition may be, for example, a resin composition containing a propylene-based resin, if necessary, a thermoplastic resin other than a propylene-based resin, if necessary, the other resin component, and if necessary, the other non-resin component.

[0065] Among the resin films of this embodiment, a resin film consisting of multiple layers can be produced, for example, by a feed block method in which resins or resin compositions, etc., which are materials for forming each layer, are melt-extruded using several extruders, a co-extrusion T-die method such as a multi-manifold method, or an air-cooled or water-cooled co-extrusion inflation method.

[0066] When producing a resin film consisting of multiple layers, the resin composition can be prepared and handled in the same manner as when producing a resin film consisting of a single layer.

[0067] A resin film consisting of multiple layers can also be produced by separately preparing two or more single-layer films to constitute any two or more of the layers in advance, laminating these single-layer films together using a thermal lamination method or the like without using an adhesive, and further laminating other films, if necessary, to achieve the desired arrangement.

[0068] <<Package>> A package according to one embodiment of the present invention is constructed using the resin film according to one embodiment of the present invention described above. The package according to this embodiment is constructed using the resin film and by heat-sealing it to another resin film, and therefore has sufficiently high seal strength. Furthermore, by using the resin film, it is not necessary to excessively increase the heat-sealing temperature during the production of the package, and therefore, for example, problems such as the resin film or another resin film sticking to the heating means during heat-sealing can be suppressed.

[0069] In the packaging body of this embodiment, the resin film may or may not be further shaped after its production, but is preferably shaped. The thickness of the shaped resin film may be, for example, the same as the thickness of the resin film described above.

[0070] In the other resin film, the ratio of the total content of one or more later-described components contained in the other resin film to the total mass of the other resin film does not exceed 100 mass%. Similarly, in the other resin composition described later for forming the other resin film, the ratio of the total content of one or more later-described components contained in the other resin composition to the total mass of the other resin composition does not exceed 100 mass%.

[0071] The other resin film contains a thermoplastic resin. Examples of the thermoplastic resin contained in the other resin film include the same thermoplastic resins as those contained in the resin film. More specifically, the thermoplastic resin contained in the other resin film is preferably a propylene-based resin, and the propylene-based resin may be homopolypropylene (hPP), or a propylene-based copolymer such as a polypropylene random copolymer (rPP, propylene random copolymer) such as a propylene-ethylene binary copolymer, a propylene-1-butene-ethylene terpolymer, or a propylene-1-butene binary copolymer, or a polypropylene block copolymer (bPP, propylene block copolymer). The thermoplastic resin contained in the other resin film may be the same as or different from the thermoplastic resin contained in the resin film.

[0072] The thermoplastic resin contained in the other resin film may be one kind or two or more kinds, and when two or more kinds are contained, the combination and ratio thereof can be selected arbitrarily depending on the purpose.

[0073] The other resin film may or may not contain other components in addition to the thermoplastic resin, as long as the effects of the present invention are not impaired. The other components contained in the other resin film may be either a resin component (sometimes referred to as "other resin components" in this specification) or a non-resin component (sometimes referred to as "other non-resin components" in this specification).

[0074] The other resin component and the other non-resin component contained in the other resin film may be the same as the other resin component and the other non-resin component contained in the resin film, respectively.

[0075] The other component contained in the other resin film may be one kind or two or more kinds, and when there are two or more kinds, the combination and ratio thereof can be selected arbitrarily depending on the purpose.

[0076] In the other resin film, the ratio of the thermoplastic resin content to the total mass of the other resin film ([thermoplastic resin content (parts by mass) of the other resin film] / [total mass (parts by mass) of the other resin film]×100) is preferably 80% by mass or more, and may be, for example, any of 85% by mass or more, 90% by mass or more, 95% by mass or more, 97% by mass or more, and 99% by mass or more. When the ratio is equal to or greater than the lower limit, the properties of the other resin film that can be used to form a package (e.g., a lid material that can form a blister pack package) are improved. On the other hand, the ratio is 100% by mass or less. The ratio is usually the same as the ratio of the thermoplastic resin content to the total content (parts by mass) of components that do not vaporize at room temperature in the other resin composition described below ([thermoplastic resin content (parts by mass) of the other resin composition] / [total content (parts by mass) of components that do not vaporize at room temperature in the other resin composition]×100). In other words, in the other resin film, the ratio of the content of the other component to the total mass of the other resin film ([content of the other component in the other resin film (parts by mass)] / [total mass of the other resin film (parts by mass)]×100) is preferably 20% by mass or less, and may be, for example, 15% by mass or less, 10% by mass or less, 5% by mass or less, 3% by mass or less, or 1% by mass or less. On the other hand, the ratio of the content of the other component is 0% by mass or more.

[0077] When the other resin film contains a propylene-based resin, the ratio of the propylene-based resin content to the thermoplastic resin content in the other resin film ([Propylene-based resin content (parts by mass) of the other resin film] / [Thermoplastic resin content (parts by mass) of the other resin film]×100) is preferably 80% by mass or more, and may be, for example, 85% by mass or more, 90% by mass or more, 95% by mass or more, 97% by mass or more, or 99% by mass or more. On the other hand, the ratio is 100% by mass or less. The ratio is usually the same as the ratio of the propylene-based resin content to the thermoplastic resin content (parts by mass) in the other resin composition described below ([Propylene-based resin content (parts by mass) of the other resin composition] / [Thermoplastic resin content (parts by mass) of the other resin composition]×100).

[0078] The other resin film is preferably a biaxially stretched film. By using the other resin film that is a biaxially stretched film, a package having high moisture resistance and a high effect of suppressing deterioration of the contents can be constructed. In addition, since the other resin film has higher heat resistance, the effect of suppressing the other resin film from sticking to a heating means such as a sealing roll during heat sealing with the resin film is further enhanced. Furthermore, since the tear strength of the other resin film is low within an appropriate range, when a blister pack package is constructed, it is easy to control the ease of removing tablets from the blister pack package.

[0079] In the packaging body of this embodiment, the other resin film may or may not be further shaped after its production.

[0080] The other resin film may be composed of one layer (single layer) or two or more layers. When the other resin film is composed of multiple layers, these multiple layers may be the same or different from each other, and the combination of these multiple layers is not particularly limited as long as it does not impair the effects of the present invention.

[0081] The thickness of the other resin film is not particularly limited, but is preferably, for example, 10 to 100 μm. Here, the "thickness of the other resin film" means the thickness of the entire other resin film, and for example, the thickness of the other resin film consisting of multiple layers means the total thickness of all layers constituting the other resin film.

[0082] In the packaging body of this embodiment, it is preferable that the resin film and the other resin film contain the same type of thermoplastic resin. In such a packaging body, the seal strength between the resin film and the other resin film is sufficiently high. Furthermore, since the resin film and the other resin film contain the same type of resin as their main constituent material, these resin films can be reused simultaneously, and the usefulness of such a packaging body is extremely high.

[0083] In the packaging body of this embodiment, "same type of resin" is not limited to the case of thermoplastic resins, but means that when comparing resins having common structural units, the ratio of the amount (moles) of the common structural units to the total amount (moles) of the structural units in both resins is 20 mol% or more. For example, in the case of polyolefin-based resins (resins having structural units derived from olefins), low-density polyethylene (LDPE), linear low-density polyethylene (LLDPE), metallocene-catalyzed linear low-density polyethylene (mLLDPE), high-density polyethylene (HDPE), ethylene-methyl acrylate copolymer (EMA), ethylene-methyl methacrylate copolymer (EMMA), ethylene-ethyl acrylate copolymer (EEA), ethylene-acrylic acid copolymer (EAA), ethylene-methacrylic acid copolymer (EMAA), ethylene-ethyl acrylate-maleic anhydride copolymer (E-EA-MAH), ethylene-vinyl alcohol copolymer (EVOH), ethylene-vinyl acetate copolymer (EVA), ethylene-vinyl alcohol-vinyl acetate copolymer (partially saponified EVA), etc., are all considered to be of the same type, since the ratio (by mole) of structural units derived from ethylene to the total amount (by mole) of structural units is 20 mol % or more. On the other hand, for example, among polypropylene random copolymers (rPP) and polypropylene block copolymers (bPP), those in which the ratio of the amount (moles) of structural units derived from ethylene to the total amount (moles) of structural units is less than 20 mol% are not considered to be of the same type as the above-mentioned low-density polyethylene, etc. For example, homopolypropylene (hPP), propylene-ethylene binary copolymer, propylene-1-butene-ethylene terpolymer, propylene-1-butene binary copolymer, and polypropylene block copolymer are all considered to be of the same type because the ratio of the amount (moles) of structural units derived from propylene to the total amount (moles) of structural units is 20 mol% or more.

[0084] In this embodiment, the ratio of the amount (moles) of common structural units to the total amount (moles) of structural units in both resins of the same type is preferably 30 mol% or more, more preferably 40 mol% or more, and even more preferably 50 mol% or more, and may be, for example, 60 mol% or more, 70 mol% or more, or 80 mol% or more. And, in both resins of the same type, this ratio is 100 mol% or less.

[0085] The other resin film may or may not have another layer or film that does not fall under the category of the other resin film on one or both sides thereof, as long as the effects of the present invention are not impaired. The other layer or film in the other resin film can be selected arbitrarily depending on the purpose, and is not particularly limited, as long as it is not a metal sheet. The thickness of the other layer or film in the other resin film can also be selected arbitrarily depending on the purpose, and is not particularly limited.

[0086] The other layer or film may be provided over the entire surface of one or both sides of the other resin film, or may be provided only in a partial region. Whether the other layer or film is provided over the entire surface of the other resin film relative to the surface on which it is to be formed can be freely selected depending on the type of the other layer or film.

[0087] The other layer or film provided on only a partial area of ​​one or both sides of the other resin film may, for example, be patterned or unpatterned, and may, for example, form letters.

[0088] The other layer or film provided on the other resin film may be the same as the other layer or film provided on the resin film described above. A preferred example of the other layer on the other resin film is a printed layer.

[0089] The other layer or film in the other resin film may consist of one layer (single layer) or two or more layers. When the other layer or film consists of multiple layers, these multiple layers may be the same or different from each other, and the combination of these multiple layers is not particularly limited as long as it does not impair the effects of the present invention.

[0090] Of the surfaces of the other resin film that will be heat-sealed to the resin film (for example, the base material) described below, at least the heat-sealed portion is preferably free of the other layer or film.

[0091] In the resin film, the content of the same type of thermoplastic resin as the thermoplastic resin contained in the other resin film relative to the total mass of the resin film is preferably 80 to 100 mass%, more preferably 90 to 100 mass%, and may be, for example, either 95 to 100 mass% or 99 to 100 mass%. When the content is equal to or greater than the lower limit, the reusability of the packaging body is further improved.

[0092] In the other resin film, the content of the same type of thermoplastic resin as the thermoplastic resin contained in the other resin film relative to the total mass of the other resin film is preferably 80 to 100 mass%, more preferably 90 to 100 mass%, and may be, for example, either 95 to 100 mass% or 99 to 100 mass%. When the content is equal to or greater than the lower limit, the reusability of the packaging body is further improved.

[0093] The seal strength of the packaging body of this embodiment can be determined, for example, by the peel strength of a test piece prepared by heat-sealing the resin film and the other resin film. For example, the resin film and the other resin film are heat-sealed at a sealing temperature of 140°C, a sealing time of 0.5 seconds, and a sealing pressure of 0.45 MPa (4.6 kgf / cm ２) is used, and the other resin film is peeled from the resin film at a peeling speed of 200 mm / min so that the sealing surfaces of the resin film and the other resin film form an angle of 180° (i.e., 180° peeling is performed), and the peel strength at this time is measured.The peel strength is preferably 7 N / 15 mm or more, and may be, for example, 12 N / 15 mm or more or 17 N / 15 mm or more.On the other hand, a package having a peel strength of 25 N / 15 mm or less can be more easily realized.

[0094] The package of this embodiment is preferably a blister pack package. A more preferred package of this embodiment is, for example, a blister pack package formed by sealing a lid material and a base material, and the base material is a molded product of the resin film.

[0095] The lid material in conventional blister packs is usually an aluminum sheet, but in this embodiment, by using a base material that contains the thermoplastic resin and does not have a metal sheet, and a lid material that contains the thermoplastic resin and does not have a metal sheet, the recyclability of the manufactured blister pack can be improved.

[0096] Among these, a more preferred package of this embodiment is a blister pack package formed by sealing a lid material and a base material, in which the base material is a molded product of the resin film, and the lid material contains the same type of thermoplastic resin as the thermoplastic resin contained in the base material. In such a blister pack package, the seal strength between the base material and the lid material is sufficiently high. Furthermore, because the base material and the lid material contain the same type of resin as their main constituent materials, the base material and the lid material can be reused simultaneously, making such a blister pack package extremely useful.

[0097] Hereinafter, as an example of a package formed by heat-sealing the resin film and the other resin film, a blister pack package formed by heat-sealing the above-mentioned base material (corresponding to the molded body of the resin film) and the lid material (corresponding to the other resin film) will be used to describe this blister pack package in more detail.

[0098] The thermoplastic resin and the other components other than the thermoplastic resin contained in the base material are the same as the thermoplastic resin and the other components other than the thermoplastic resin contained in the resin film, respectively. An embodiment in which the base material contains a thermoplastic resin and the other components is the same as an embodiment in which the resin film contains a thermoplastic resin and the other components.

[0099] In the base material, the ratio of the thermoplastic resin content (the total content of the thermoplastic resin of the same type as the thermoplastic resin contained in the lid material and the thermoplastic resin of a different type from the thermoplastic resin contained in the lid material) to the total mass of the base material is the same as the ratio of the thermoplastic resin content to the total mass of the resin film in the resin film described above.

[0100] In the base material, the ratio of the content of the same type of thermoplastic resin as the thermoplastic resin contained in the lid material to the total mass of the base material is the same as the ratio of the content of the same type of thermoplastic resin as the thermoplastic resin contained in the other resin film to the total mass of the resin film, as described above.

[0101] The thickness of the base material is the same as the thickness of the resin film described above.

[0102] The thermoplastic resin and the other components other than the thermoplastic resin contained in the lid material are the same as the thermoplastic resin and the other components other than the thermoplastic resin contained in the other resin film, respectively. The embodiment in which the lid material contains a thermoplastic resin and the other components is the same as the embodiment in which the other resin film contains a thermoplastic resin and the other components.

[0103] In the lid material, the ratio of the thermoplastic resin content (the total content of the thermoplastic resin of the same type as the thermoplastic resin contained in the base material and the thermoplastic resin of a different type than the thermoplastic resin contained in the base material) to the total mass of the lid material is the same as the ratio of the thermoplastic resin content to the total mass of the other resin film in the other resin film described above.

[0104] In the lid material, the ratio of the content of the same type of thermoplastic resin as the thermoplastic resin contained in the base material to the total mass of the lid material is the same as the ratio of the content of the same type of thermoplastic resin as the thermoplastic resin contained in the resin film to the total mass of the other resin film, as described above.

[0105] The thickness of the lid material is not particularly limited, but is preferably 10 to 100 μm, and may be, for example, any of 10 to 70 μm and 10 to 40 μm, any of 20 to 100 μm and 50 to 100 μm, or any of 20 to 70 μm and 20 to 40 μm.

[0106] The seal strength of the blister pack packaging body of this embodiment can be determined by the peel strength of the test piece, in the same manner as in the seal strength of the packaging body described above.

[0107] Fig. 2 is a perspective view schematically showing an example of a blister pack package according to this embodiment. Fig. 3 is a cross-sectional view of the blister pack package shown in Fig. 2 taken along line III-III. In Fig. 2 and subsequent figures, components that are the same as those shown in figures that have already been described are designated by the same reference numerals as in those figures, and detailed description thereof will be omitted.

[0108] The blister pack 101 shown here is configured to include a lid material 11 and a base material 12. Both the lid material 11 and the base material 12 contain a thermoplastic resin. The base material 12 is a molded product of the resin film according to one embodiment of the present invention described above, and may be, for example, a molded product of the resin film 1 shown in FIG.

[0109] The crystallite size of the thermoplastic resin contained in the base material 12 is 90 Å or more. The softening point of the base material 12 is 140° C. or less. The blister pack 101 having these properties has a sufficiently high seal strength.

[0110] Base material 12 has a plurality of recesses 121 formed therein, each protruding from one surface 12a (sometimes referred to herein as the "first surface") and having an opening on its other surface 12b (sometimes referred to herein as the "second surface"). In blister pack packaging 101, base material 12 is disposed with its second surface 12b facing lid material 11, and its first surface 12a forms one outermost surface of blister pack packaging 101.

[0111] On the other hand, one surface 11a of the lid material 11 (sometimes referred to as the "first surface" in this specification) is the other outermost surface of the blister pack packaging body 101, and in the blister pack packaging body 101, the lid material 11 is positioned with its other surface 11b (sometimes referred to as the "second surface" in this specification) facing the base material 12.

[0112] In blister pack packaging 101, second surface 11b of lid material 11 and an area of ​​second surface 12b of base material 12 where recess 121 is not provided are sealed, and an area of ​​second surface 12b of base material 12 where recess 121 is provided is not sealed with second surface 11b of lid material 11, and in this area, second surface 12b of base material 12 and second surface 11b of lid material 11 form storage section 19. Storage section 19 of blister pack packaging 101 hermetically stores item 8 to be stored.

[0113] In this specification, the area of ​​the base material that forms the storage section of the blister pack package (storage section 19 in the case of blister pack package 101) may be referred to as a "recess" when viewed from the second surface side of the base material (second surface 12b side in the case of base material 12), and may be referred to as a "protrusion" when viewed from the first surface side of the base material (first surface 12a side in the case of base material 12).

[0114] Slits 129 are formed on the first surface 12a side of base material 12. More specifically, a plurality of slits 129 are formed in base material 12 in parallel to one another in the width direction of blister pack packaging body 101. Each slit 129 is formed across the entire width direction of blister pack packaging body 101. The formation of slits 129 makes blister pack packaging body 101 easily separable into a specific number of storage sections 19, making blister pack packaging body 101 more convenient.

[0115] As explained above, the components contained in the lid material 11 and the base material 12 are as follows. When the lid material 11 and the base material 12 contain the same type of thermoplastic resin, the blister pack 101 is highly suitable for reuse.

[0116] <Example of Package> A preferred example of the package of this embodiment is a blister pack package formed by sealing a lid material and a base material, wherein the base material is a molded resin film, the resin film contains a thermoplastic resin, the crystallite size of the thermoplastic resin is 90 Å or more, and the softening point of the resin film is 140°C or less, the resin film contains a propylene-based resin as the thermoplastic resin, the content of the thermoplastic resin in the resin film is 80% by mass or more relative to the total mass of the resin film, the content of the propylene-based resin in the resin film is 80% by mass or more relative to the content of the thermoplastic resin, the lid material contains a thermoplastic resin, the lid material contains a propylene-based resin as the thermoplastic resin, and the lid material contains the same thermoplastic resin as the thermoplastic resin contained in the base material. In such a package, it is preferable that the thermoplastic resin contained in the lid material is the same thermoplastic resin as the thermoplastic resin contained in the base material is the propylene-based resin.

[0117] A more preferred example of the packaging body of this embodiment is a blister pack packaging body formed by sealing a lid material and a base material, wherein the base material is a molded body of a resin film, the resin film contains a thermoplastic resin, and the crystallite size of the thermoplastic resin is 90 Å or more, and the softening point of the resin film is 140°C or less, the resin film contains a propylene-based resin as the thermoplastic resin, and in the resin film, the proportion of the content of the thermoplastic resin relative to the total mass of the resin film is 80 mass% or more, and in the resin film, the proportion of the content of the propylene-based resin relative to the content of the thermoplastic resin is 80 mass% or more, the lid material contains a thermoplastic resin, and the lid material contains a propylene-based resin as the thermoplastic resin, and the lid material contains the same type of thermoplastic resin as the thermoplastic resin contained in the base material, and in the base material, the proportion of the content of the thermoplastic resin relative to the total mass of the base material is 80 to 100 mass%, In one example of a package, the content of the thermoplastic resin contained in the lid material is 80 to 100 mass % relative to the total mass of the lid material. In such a package, the thermoplastic resin contained in the lid material is preferably the propylene-based resin.

[0118] <<Method for Manufacturing Package>> The package of this embodiment can be manufactured by the same method as that for known packages, except that the resin film according to one embodiment of the present invention described above is used. For example, the package of this embodiment can be manufactured by heat-sealing the resin film and the other resin film while storing an object to be stored. Either one or both of the resin film and the other resin film may or may not be further shaped after production, and a package with sufficiently high seal strength can be obtained even if the heat-sealing temperature is not excessively high.

[0119] The heat-sealing temperature can be selected arbitrarily depending on the type of resin (thermoplastic resin) contained in the resin film and the other resin film, and is not particularly limited. Even if the heat-sealing temperature is not high, the effect of the present invention, that is, sufficiently high seal strength, can be remarkably obtained. Furthermore, in terms of enhancing the effect of suppressing defects due to melting of the resin film or the other resin film, the heat-sealing temperature is preferably less than 160°C, more preferably 155°C or less, and may be, for example, 150°C or less or 145°C or less. On the other hand, in terms of enhancing seal strength, the heat-sealing temperature is preferably 110°C or more. In one embodiment, the heat-sealing temperature may be, for example, 110°C or more but less than 160°C, 110 to 155°C, 110 to 150°C, or 110 to 145°C. However, these are only examples of heat-sealing temperatures. The heat-sealing temperatures shown here are particularly suitable, for example, when the thermoplastic resins contained in the resin film and the other resin film are both propylene-based resins.

[0120] The heat-sealing time can be adjusted appropriately depending on the heat-sealing temperature, and is not particularly limited. The heat-sealing time is preferably, for example, 0.3 to 5 seconds.

[0121] The sealing pressure during heat sealing is preferably 0.1 to 0.5 MPa.

[0122] The other resin film can be manufactured by using another resin or another resin composition as its forming material. The other resin or other resin composition is the same as the resin or resin composition as the forming material of the resin film described above, except that the types and contents of the contained components may differ. The other resin film can be manufactured by the same method as the resin film, except that the other resin or other resin composition is used instead of the resin or resin composition. The other resin film can be molded by the same method as the resin film.

[0123] Among the packages, blister pack packages can be manufactured using a known PTP packaging machine. More specifically, a base material is produced by forming a recess (or protrusion) that will become a storage section in a resin film using, for example, plug forming, air-assisted plug forming, pressure forming, plug-assisted pressure forming, vacuum forming, or the like. Then, the storage section of the base material is filled with the object to be stored, and the lid material and base material are heat-sealed to obtain a blister pack package.

[0124] When providing a slit in the base material (for example, slit 129 in the case of base material 12 shown in Figures 2 and 3), the slit can be formed in the base material by a known method using a perforation blade or a half-cut blade.

[0125] The present invention will be described in more detail below with reference to specific examples, although the present invention is not limited to the examples shown below.

[0126] The resins used in each example or comparative example are as follows: hPP: homopolypropylene (Sumitomo Noblen (registered trademark) FS2011DG2 manufactured by Sumitomo Chemical Co., Ltd., melting point 158°C, melt flow rate (230°C) 2.5 g / 10 min) rPP (1): polypropylene random copolymer (propylene-ethylene binary copolymer, Prime Polymer Co., Ltd., J242WB, melting point 140°C, melt flow rate (230°C) 1.3 g / 10 min) rPP (2): polypropylene random copolymer (propylene-ethylene binary copolymer, Mitsui Chemicals, Inc., X7080, melting point 83°C, melt flow rate (230°C) 7 g / 10 min)

[0127] [Example 1] <<Production of resin film for base material>> <Production of resin composition> Resin composition (1) was produced by mixing the hPP (10 parts by mass) and the rPP (1) (90 parts by mass) at room temperature.

[0128] <Production of Resin Film for Sole Material> The resin composition (1) was extrusion-molded to produce an unstretched long resin film for sole material (thickness: 300 μm).

[0129] <Evaluation of Resin Film for Base Material> Using an X-ray diffractometer ("Ultima IV" manufactured by Rigaku Corporation), X-ray diffraction measurement was carried out on the resin film for base material obtained above under the following measurement conditions. Then, the crystallite size was calculated based on the above-mentioned Scherrer formula. The results are shown in Table 1. (Measurement conditions) Radiation source: CuKα Tube voltage: 40 kV Tube current: 40 mA Measurement range: 5°≦2θ≦40° Scanning axis: 2θ / θ Measurement method: FT Counting unit: Counts Step width: 0.01° Counting time: 3 seconds Divergence slit: 2 / 3° Divergence vertical limiting slit: 10 mm Scattering slit: 2 / 3° Receiving slit: 0.5 mm Monochrome receiving slit: 0.5 mm

[0130] <<Manufacturing of Blister Pack Packages>> A base material was produced by forming a large number of recesses in the long base material resin film obtained above under the following molding conditions: (Molding Conditions) Mold: Lens-shaped, size (opening diameter) φ10, pocket depth 5.0 mm Heating plate: Pinpoint heating plate Heating plate temperature: 138°C Plug temperature: 20°C Mold blow pressure: 0.45 MPa

[0131] A long biaxially oriented polypropylene random copolymer (rPP) film (Futamura Chemical Co., Ltd., "FOH-L", thickness 25 μm) was prepared as the resin film for the lid material. The melting point of the rPP contained in this resin film for the lid material was 166°C. The base material obtained above and the resin film for the lid material were sealed at a sealing temperature of 140°C, a sealing time of 0.5 seconds, and a sealing pressure of 0.45 MPa (4.6 kgf / cm ２ ) and heat-sealed under the conditions of 100°C / 200°F. At this time, the surface of the base material on which the recesses were open was sealed with the resin film for lid material. In this way, a blister pack package was produced in which many recesses in the base material were sealed with the lid material.

[0132] <<Evaluation of Resin Film for Base Material>> <Measurement of Softening Point> The softening point of the resin film for base material obtained above was measured under the following conditions using a thermomechanical analyzer ("TMA7100" manufactured by Hitachi High-Technologies Corporation). The results are shown in Table 1. (Measurement conditions) Measurement mode: Penetration mode Tip diameter of TMA penetration probe: 1 mm Measurement temperature range: 25 to 200°C Heating rate: 5°C / min

[0133] <Evaluation of Seal Strength (1) (Measurement of Peel Strength)> The resin film for base material obtained above and the resin film for lid material were sealed using an automatic cup sealer ("EPK-Semi-Automatic OLL" manufactured by Eishin Pack Kogyo Co., Ltd.) at a sealing temperature of 140°C, a sealing time of 0.5 seconds, and a sealing pressure of 0.45 MPa (4.6 kgf / cm ２ ) and heat-sealed under the conditions. A test piece having a width of 15 mm was cut out from the obtained sealed body. Using a tensile tester ("TENSILON RTG-1310" manufactured by A&D Co., Ltd.), the lid material resin film was peeled from the base material resin film at a peeling rate of 200 mm / min so that the sealing surfaces of the base material resin film and the lid material resin film formed an angle of 180°. The peel strength at this time was then measured. The results are shown in the column "Peel strength of base material resin film (N / 15 mm)" in Table 1.

[0134] <Evaluation of Seal Strength (2) (Evaluation of Adhesion Between Lid Material and Base Material)> Sixteen test pieces were cut from the blister pack package obtained above, each large enough to accommodate two rows and five columns of recesses (10 recesses in total) in the base material. Water dyed with a small amount of blue dye (hereinafter referred to as "dyed water") was poured into a water tank, leaving a gap at the top of the aqueous layer. The 16 test pieces, each with a weight attached, were submerged in the dyed water within the aqueous layer. The aqueous layer was then sealed in this state. A connection port was provided at the top of the sealed aqueous layer to connect a vacuum pump for reducing the pressure within the aqueous layer, and a pressure gauge was also provided to measure the pressure within the aqueous layer. After sealing, a vacuum pump was connected to the connection port and operated to reduce the pressure within the gaps in the aqueous layer to 0.05 MPa. This reduced pressure state was then maintained for 10 minutes. Next, the reduced pressure was released, the aqueous layer was opened, and all the test pieces were pulled out of the dyed water. All of these test pieces were visually observed to check for infiltration of dyed water into the recesses, and the adhesion between the lid material and the base material was evaluated according to the following criteria. The results are shown in the column "Adhesion between lid material and base material in package" in Table 1. [Evaluation criteria] A: In all 160 recesses, no infiltration of dyed water was observed, indicating high adhesion between the lid material and the base material. B: Infiltration of dyed water was observed into at least one recess, indicating insufficient adhesion between the lid material and the base material.

[0135] <<Production of a resin film for base material, production of a blister pack packaging, and evaluation of the resin film for base material>> [Example 2] Resin composition (2) was produced by mixing the hPP (20 parts by mass) and the rPP (1) (80 parts by mass) at room temperature. Then, a resin film for base material (thickness 300 μm) and a blister pack packaging were produced in the same manner as in Example 1, except that resin composition (2) was used instead of resin composition (1), and the resin film for base material was evaluated. The results are shown in Table 1.

[0136] [Example 3] Resin composition (3) was produced by mixing the hPP (30 parts by mass) and the rPP (1) (70 parts by mass) at room temperature. Then, a resin film for base material (thickness 300 μm) and a blister pack package were produced in the same manner as in Example 1, except that resin composition (3) was used instead of resin composition (1), and the resin film for base material was evaluated. The results are shown in Table 1.

[0137] [Example 4] Resin composition (4) was produced by mixing the hPP (40 parts by mass) and the rPP (1) (60 parts by mass) at room temperature. A resin film for base material (thickness 300 μm) and a blister pack package were produced in the same manner as in Example 1, except that resin composition (4) was used instead of resin composition (1), and the resin film for base material was evaluated. The results are shown in Table 1.

[0138] [Example 5] Resin composition (5) was produced by mixing the hPP (49 parts by mass) and the rPP (1) (51 parts by mass) at room temperature. Then, a resin film for base material (thickness 300 μm) and a blister pack package were produced in the same manner as in Example 1, except that resin composition (5) was used instead of resin composition (1), and the resin film for base material was evaluated. The results are shown in Table 1.

[0139] [Example 6] Resin composition (6) was produced by mixing the hPP (10 parts by mass) and the rPP (2) (90 parts by mass) at room temperature. Then, a resin film for base material (thickness 300 μm) and a blister pack package were produced in the same manner as in Example 1, except that resin composition (6) was used instead of resin composition (1), and the resin film for base material was evaluated. The results are shown in Table 1.

[0140] [Example 7] Resin composition (7) was produced by mixing the hPP (20 parts by mass) and the rPP (2) (80 parts by mass) at room temperature. A resin film for base material (thickness: 300 μm) and a blister pack package were produced in the same manner as in Example 1, except that resin composition (7) was used instead of resin composition (1), and the resin film for base material was evaluated. The results are shown in Table 1.

[0141] [Example 8] Resin composition (8) was produced by mixing the hPP (30 parts by mass) and the rPP (2) (70 parts by mass) at room temperature. Then, a resin film for base material (thickness 300 μm) and a blister pack package were produced in the same manner as in Example 1, except that resin composition (8) was used instead of resin composition (1), and the resin film for base material was evaluated. The results are shown in Table 2.

[0142] [Example 9] Resin composition (9) was produced by mixing the hPP (40 parts by mass) and the rPP (2) (60 parts by mass) at room temperature. Then, a resin film for base material (thickness 300 μm) and a blister pack package were produced in the same manner as in Example 1, except that resin composition (9) was used instead of resin composition (1), and the resin film for base material was evaluated. The results are shown in Table 2.

[0143] [Example 10] Resin composition (10) was produced by mixing the hPP (49 parts by mass) and the rPP (2) (51 parts by mass) at room temperature. Then, a resin film for base material (thickness 300 μm) and a blister pack package were produced in the same manner as in Example 1, except that resin composition (10) was used instead of resin composition (1), and the resin film for base material was evaluated. The results are shown in Table 2.

[0144] [Example 11] A resin film for a base material (thickness: 300 μm) and a blister pack package were produced in the same manner as in Example 1, except that the rPP (1) was used instead of the resin composition (1), and the resin film for a base material was evaluated. The results are shown in Table 2.

[0145] [Example 12] A resin film for a base material (thickness: 300 µm) and a blister pack package were produced in the same manner as in Example 1, except that the rPP (2) was used instead of the resin composition (1), and the resin film for a base material was evaluated. The results are shown in Table 2.

[0146] [Comparative Example 1] A resin film for a base material (thickness: 300 µm) and a blister pack were produced in the same manner as in Example 1, except that the resin composition (1) was replaced with the hPP, and the resin film for a base material was evaluated. The results are shown in Table 2.

[0147] [Comparative Example 2] Resin composition (11) was produced by mixing the hPP (75 parts by mass) and the rPP (1) (25 parts by mass) at room temperature. Then, a resin film for base material (thickness 300 μm) and a blister pack package were produced in the same manner as in Example 1, except that resin composition (11) was used instead of resin composition (1), and the resin film for base material was evaluated. The results are shown in Table 2.

[0148] The resin films for base materials produced in Examples 2 to 12 and Comparative Examples 1 and 2 were all unstretched resin films.

[0149] In Tables 1 and 2, the notation "-" in the "Components (content (parts by mass))" column of "Resin film for base material" means that the resin film for base material does not contain that component.

[0150]

[0151]

[0152] As is clear from the above results, the peel strength of the base resin film was 7.5 N / 15 mm or more (7.5 to 23.1 N / 15 mm) in Examples 1 to 12, and the seal strength was sufficiently high. Furthermore, in Examples 1 to 12, the adhesion between the lid material and the base material in the package was high, and this also confirmed that the seal strength was sufficiently high.

[0153] In Examples 1 to 12, the crystallite size of the thermoplastic resin contained in the resin film for base material was 90 Å or more (90 to 202 Å), and the softening point of the resin film for base material was 135° C. or less (72 to 135° C.). Here, the thermoplastic resin was a mixture of hPP and rPP(1) in Examples 1 to 5, a mixture of hPP and rPP(2) in Examples 6 to 10, rPP(1) in Example 11, and rPP(2) in Example 12.

[0154] In the resin film for base material, the ratio of the content of the polypropylene random copolymer to the total content of homopolypropylene (hPP) and polypropylene random copolymer (rPP) was 51 to 90 mass% in Examples 1 to 10, and 100 mass% in Examples 11 and 12.

[0155] In contrast, in Comparative Examples 1 and 2, the peel strength of the base resin film was 6.1 N / 15 mm or less (5.6 to 6.1 N / 15 mm), and the seal strength was insufficient. Furthermore, in Comparative Examples 1 and 2, the adhesion between the lid material and the base material in the package was insufficient, which also confirmed the insufficient seal strength. In Comparative Examples 1 and 2, the crystallite size of the thermoplastic resin contained in the base resin film was 188 Å or more (188 to 211 Å), but the softening point of the base resin film was 142°C or more (142 to 152°C).

[0156] The present invention can be used to manufacture blister pack packages, and is particularly suitable for use in manufacturing blister pack packages that are highly reusable.

[0157] DESCRIPTION OF SYMBOLS 1: Resin film 101: Blister pack packaging body 11: Lid material, 11a: One side (first side) of the lid material, 11b: Other side (second side) of the lid material 12: Base material, 12a: One side (first side) of the base material, 12b: Other side (second side) of the base material, 121: Recess of the base material 19: Storage section of the blister pack packaging body

Claims

1. A resin film comprising a thermoplastic resin, wherein the crystallite size of the thermoplastic resin is 90 Å or more, and the softening point of the resin film is 140° C. or less.

2. The resin film according to claim 1, wherein the resin film contains homopolypropylene and polypropylene random copolymer as the thermoplastic resin.

3. The resin film described in claim 2, wherein the ratio of the content of the polypropylene random copolymer to the total content of the homopolypropylene and the polypropylene random copolymer in the resin film is more than 0 mass% and less than 10 mass%, or more than 50 mass% and less than 100 mass%.

4. The resin film according to any one of claims 1 to 3, which is used as a base material for a blister pack package.

5. A packaging material constructed using the resin film according to any one of claims 1 to 3.

6. The packaging body according to claim 5, which is a blister pack packaging body formed by sealing a lid material and a base material, said base material being a molded body of said resin film, and said lid material containing the same type of thermoplastic resin as the thermoplastic resin contained in said base material.

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