Substrate for assembling semiconductor light-emitting device for display pixel, and display device comprising same

Abstract

The substrate for assembling a semiconductor light-emitting device for a display pixel according to an embodiment may comprise: a substrate; a plurality of assembly wirings disposed on the substrate; a partition wall disposed on the plurality of assembly wirings and having an assembly hole; and a partition wall passage disposed adjacent to the assembly hole.

Description

Substrate for assembling semiconductor light-emitting elements for display pixels and display device including the same

[0001] The present invention relates to a substrate for assembling a semiconductor light-emitting element for a display pixel and a display device including the same.

[0002] Large-area displays include liquid crystal displays (LCDs), OLED displays, and micro-LED displays.

[0003] A micro-LED display is a display that uses micro-LEDs, which are semiconductor light-emitting elements with a diameter or cross-sectional area of ​​100㎛ or less, as display elements.

[0004] Micro-LED displays use semiconductor light-emitting diodes (micro-LEDs) as display elements, so they have superior performance in many characteristics, including contrast ratio, response speed, color reproducibility, viewing angle, brightness, resolution, lifespan, luminous efficiency, and brightness.

[0005] In particular, micro-LED displays have the advantage of being able to freely adjust the size and resolution by separating and combining the screen in a modular manner, and of being able to implement a flexible display.

[0006]

[0007] However, large-scale micro-LED displays require millions or more micro-LEDs, which poses a technical challenge in quickly and accurately transferring micro-LEDs to the display panel.

[0008] Recently developed transfer technologies include the pick and place process, the laser lift-off method, and the self-assembly method.

[0009] Among these, the self-assembly method is advantageous for implementing large-screen display devices, as it is a method in which semiconductor light-emitting elements find their own assembly positions within a fluid.

[0010] Recently, U.S. Patent No. 9,825,202 presented a micro-LED structure suitable for self-assembly, but research on the technology for manufacturing displays through self-assembly of micro-LEDs is still insufficient.

[0011] In particular, in the case of rapidly transferring millions or more semiconductor light-emitting elements to a large display in the prior art, although the transfer speed can be improved, there is a technical problem in that the transfer error rate can increase, resulting in a lower transfer yield.

[0012] Meanwhile, a self-assembly transfer process using dielectrophoresis (DEP) is being attempted in related technologies, but there is a problem of low self-assembly rate due to non-uniformity of DEP force.

[0013] In addition, when assembling semiconductor light-emitting devices, color mixing may occur if they are assembled sequentially, and there is a problem that the assembly time increases.

[0014] One of the technical challenges of the embodiment is to realize simultaneous assembly of semiconductor light-emitting devices.

[0015] Additionally, one of the technical challenges of the embodiment is to improve the assembly rate of semiconductor light-emitting devices.

[0016] Additionally, one of the technical challenges of the embodiment is to prevent color mixing in the assembly substrate and display device.

[0017] Additionally, one of the technical challenges of the embodiment is to facilitate the collection of unassembled chips.

[0018] Additionally, one of the technical challenges of the embodiment is to reduce the assembly time of a semiconductor light-emitting device.

[0019] The technical tasks of the embodiment are not limited to those described in this article, but include those that can be understood through the description of the invention.

[0020] An assembly substrate for a semiconductor light-emitting device for a display pixel according to an embodiment may include: a substrate; a plurality of assembly wires arranged on the substrate; a partition wall arranged on the plurality of assembly wires and having an assembly hole; and a partition wall passage arranged adjacent to the assembly hole.

[0021] Additionally, in the embodiment, the assembly hole may include a first assembly hole in which a first semiconductor light-emitting element is assembled and a second assembly hole in which a second semiconductor light-emitting element is assembled, and the partition wall passage may include a first partition wall passage adjacent to the first assembly hole and a second partition wall passage adjacent to the second assembly hole.

[0022] Additionally, in the embodiment, the width of the first bulkhead passage may be smaller than the diameter of the first assembly hole.

[0023] Additionally, in the embodiment, the width of the first bulkhead passage may be smaller than the diameter of the first semiconductor light-emitting element and larger than the diameter of the second semiconductor light-emitting element.

[0024] Additionally, in the embodiment, the width of the first bulkhead passage may be greater than the height of the second semiconductor light-emitting element.

[0025] Additionally, in the embodiment, the assembly holes include a plurality of them, and the bulkhead passage can be formed integrally with the plurality of assembly holes.

[0026] Additionally, in the embodiment, the assembly holes include a plurality of assembly holes, and further include a first region disposed between the plurality of assembly holes and connected to the bulkhead passage, and a width of the first region may be greater than a width of the bulkhead passage.

[0027] Additionally, in an embodiment, the bulkhead passage may be arranged to vertically overlap any one of the plurality of assembly wires.

[0028] Additionally, in an embodiment, the height of the partition wall may be positioned higher than the center of gravity of the semiconductor light-emitting element.

[0029] Additionally, in an embodiment, the height of the partition wall may be less than half the diameter of the semiconductor light emitting element.

[0030] A substrate for assembling a semiconductor light-emitting element for a display pixel according to an embodiment and a display device including the same have a technical effect of preventing color mixing of the semiconductor light-emitting element.

[0031] For example, in the embodiment, semiconductor light emitting elements emitting different colors can escape through the partition passage, thereby preventing color mixing.

[0032] In addition, the embodiment has a technical effect of implementing simultaneous assembly of semiconductor light-emitting devices.

[0033] For example, the embodiment can simultaneously assemble semiconductor light-emitting devices of different sizes by distinguishing them using a bulkhead passage.

[0034] In addition, the embodiment has a technical effect of reducing the assembly time of a semiconductor light-emitting device.

[0035] For example, the embodiment can significantly reduce assembly time through simultaneous assembly.

[0036] In addition, the embodiment has a technical effect that allows for easy collection of unassembled chips.

[0037] For example, the embodiment may form a collection area in an area adjacent to the bulkhead passage to collect unassembled chips.

[0038] In addition, the embodiment has a technical effect that can improve the assembly rate of a semiconductor light-emitting device.

[0039] For example, the embodiment can improve the assembly rate by designing the height of the bulkhead to take into account the diameter and center of gravity of the semiconductor light-emitting element.

[0040] The technical effects of the embodiments are not limited to those described in this article, but include those that can be understood through the description of the invention.

[0041] Figure 1 is an exemplary diagram of a living room of a house in which a display device according to an embodiment is placed.

[0042] Figure 2 is an enlarged view of the first panel area in the display device of Figure 1.

[0043] Fig. 3 is a cross-sectional view along line B1-B2 of area A2 of Fig. 2.

[0044] Fig. 4 is an exemplary diagram showing a light-emitting element for a display pixel according to an embodiment being assembled on a substrate by a self-assembly method.

[0045] Figure 5 is a plan view of an assembly board studied in internal technology.

[0046] Fig. 6 is a conceptual diagram of a substrate for assembling a semiconductor light-emitting element for a display pixel according to the first embodiment.

[0047] Fig. 7 is a conceptual diagram of a substrate for assembling a semiconductor light-emitting element for a display pixel according to a second embodiment.

[0048] Fig. 8 is a conceptual diagram of a substrate for assembling a semiconductor light-emitting element for a display pixel according to a third embodiment.

[0049] Fig. 9 is a conceptual diagram of a substrate for assembling a semiconductor light-emitting element for a display pixel according to the fourth embodiment.

[0050] Fig. 10 is a conceptual diagram of a substrate for assembling a semiconductor light-emitting element for a display pixel according to the fifth embodiment.

[0051] Fig. 11 is a conceptual diagram of a substrate for assembling a semiconductor light-emitting element for a display pixel according to the sixth embodiment.

[0052] Hereinafter, embodiments disclosed in the present specification will be described in detail with reference to the attached drawings. The suffixes "module" and "part" used in the following description for components are given or used interchangeably for the sake of ease of writing the specification, and do not in themselves have distinct meanings or roles. In addition, the attached drawings are intended to facilitate easy understanding of the embodiments disclosed in the present specification, and the technical ideas disclosed in the present specification are not limited by the attached drawings. In addition, when an element such as a layer, region, or substrate is referred to as existing "on" another element, this includes that it may be directly on the other element, or that other intermediate elements may exist therebetween.

[0053] The display devices described in this specification may include digital TVs, mobile phones, smart phones, laptop computers, digital broadcasting terminals, personal digital assistants (PDAs), portable multimedia players (PMPs), navigation devices, slate PCs, tablet PCs, Ultra-Books, desktop computers, and the like. However, the configuration according to the embodiments described in this specification may also be applied to devices capable of displaying, even if they are new product types developed in the future.

[0054]

[0055] A light-emitting element and a display device including the same according to the following embodiments are described.

[0056] FIG. 1 illustrates a living room of a house in which a display device (100) according to an embodiment is placed.

[0057] The display device (100) of the embodiment can display the status of various electronic products such as a washing machine (101), a robot vacuum cleaner (102), and an air purifier (103), and can communicate with each electronic product based on IOT and control each electronic product based on user setting data.

[0058] A display device (100) according to an embodiment may include a flexible display manufactured on a thin and flexible substrate. The flexible display can be bent or rolled like paper while maintaining the characteristics of a conventional flat panel display.

[0059] In a flexible display, visual information can be realized by independently controlling the emission of unit pixels arranged in a matrix form. A unit pixel refers to the smallest unit for realizing a single color. The unit pixels of a flexible display can be realized by light-emitting elements. In an embodiment, the light-emitting elements may be micro-LEDs or nano-LEDs, but are not limited thereto.

[0060]

[0061] Fig. 2 is an enlarged view of the first panel area (A) in the display device of Fig. 1.

[0062] According to FIG. 2, the display device (100) of the embodiment can be manufactured by mechanically and electrically connecting a plurality of panel areas, such as the first panel area (A), through tiling.

[0063] The first panel area (A) may include a plurality of light-emitting elements (150) arranged for each unit pixel (PX of FIG. 2).

[0064] For example, a unit pixel (PX) may include a first sub-pixel (PX1), a second sub-pixel (PX2), and a third sub-pixel (PX3). For example, a plurality of red light-emitting elements (150R) may be arranged in the first sub-pixel (PX1), a plurality of green light-emitting elements (150G) may be arranged in the second sub-pixel (PX2), and a plurality of blue light-emitting elements (150B) may be arranged in the third sub-pixel (PX3). The unit pixel (PX) may further include a fourth sub-pixel in which no light-emitting element is arranged, but this is not limited thereto. Meanwhile, the light-emitting element (150) may be a semiconductor light-emitting element.

[0065]

[0066] Next, Fig. 3 is a cross-sectional view along line B1-B2 of area B of Fig. 2.

[0067] Referring to FIG. 3, the display device (100) of the embodiment may include a substrate (200), assembly wiring (201, 202), a first insulating layer (211a), a second insulating layer (211b), a third insulating layer (206), and a plurality of light-emitting elements (150).

[0068] The assembly wiring may include a first assembly wiring (201) and a second assembly wiring (202) that are spaced apart from each other. The first assembly wiring (201) and the second assembly wiring (202) may be provided to generate a dielectrophoretic force for assembling the light emitting element (150). In addition, the first assembly wiring (201) and the second assembly wiring (202) may be electrically connected to electrodes of the light emitting element to function as electrodes of the display panel.

[0069] The assembly wiring (201, 202) may be formed of a light-transmitting electrode (ITO) or may include a metal material with excellent electrical conductivity. For example, the assembly wiring (201, 202) may be formed of at least one of titanium (Ti), chromium (Cr), nickel (Ni), aluminum (Al), platinum (Pt), gold (Au), tungsten (W), molybdenum (Mo), or an alloy thereof.

[0070] A first insulating layer (211a) may be disposed between the first assembly wiring (201) and the second assembly wiring (202), and a second insulating layer (211b) may be disposed on the first assembly wiring (201) and the second assembly wiring (202). The first insulating layer (211a) and the second insulating layer (211b) may be an oxide film, a nitride film, or the like, but are not limited thereto.

[0071]

[0072] The light-emitting element (150) may include a red light-emitting element (150), a green light-emitting element (150G), and a blue light-emitting element (150B0) to form a unit pixel (sub-pixel), but is not limited thereto, and may also include a red phosphor and a green phosphor to implement red and green, respectively.

[0073] The substrate (200) may be formed of glass or polyimide. In addition, the substrate (200) may include a flexible material such as polyethylene naphthalate (PEN) or polyethylene terephthalate (PET). In addition, the substrate (200) may be a transparent material, but is not limited thereto.

[0074] The third insulating layer (206) may include an insulating and flexible material such as polyimide, PEN, PET, etc., and may be formed integrally with the substrate (200) to form a single substrate.

[0075] The third insulating layer (206) may be a conductive adhesive layer having adhesive properties and conductivity, and the conductive adhesive layer may be flexible to enable a flexible function of the display device. For example, the third insulating layer (206) may be a conductive adhesive layer such as an anisotropic conductive film (ACF) or an anisotropic conductive medium, a solution containing conductive particles, etc. The conductive adhesive layer may be a layer that is electrically conductive in a direction vertical to the thickness, but electrically insulating in a direction horizontal to the thickness.

[0076] The third insulating layer (206) may include an assembly hole (203) into which a light-emitting element (150) is inserted. Therefore, during self-assembly, the light-emitting element (150) can be easily inserted into the assembly hole (203) of the third insulating layer (206). The assembly hole (203) may be referred to as an insertion hole, a fixing hole, an alignment hole, or the like.

[0077] The gap between the assembly wiring (201, 202) is formed to be smaller than the width of the light emitting element (150) and the width of the assembly hole (203), so that the assembly position of the light emitting element (150) can be fixed more precisely using an electric field.

[0078] A third insulating layer (206) is formed on the assembly wiring (201, 202) to protect the assembly wiring (201, 202) from the fluid (1200) and prevent leakage of current flowing in the assembly wiring (201, 202). The third insulating layer (206) may be formed as a single layer or multiple layers of an inorganic insulator such as silica or alumina or an organic insulator.

[0079] Additionally, the third insulating layer (206) may include an insulating and flexible material such as polyimide, PEN, PET, etc., and may be formed integrally with the substrate (200) to form a single substrate.

[0080] The third insulating layer (206) may be an adhesive insulating layer or a conductive adhesive layer having conductivity. The third insulating layer (206) may be flexible, thereby enabling a flexible function of the display device.

[0081] The third insulating layer (206) has a partition wall, and an assembly hole (203) can be formed by this partition wall. For example, when forming the substrate (200), a part of the third insulating layer (206) is removed, so that each of the light emitting elements (150) can be assembled into the assembly hole (203) of the third insulating layer (206).

[0082] An assembly hole (203) is formed in the substrate (200) to which light-emitting elements (150) are coupled, and the surface where the assembly hole (203) is formed can come into contact with a fluid (1200). The assembly hole (203) can guide the exact assembly position of the light-emitting elements (150).

[0083] Meanwhile, the assembly hole (203) may have a shape and size corresponding to the shape of the light-emitting element (150) to be assembled at the corresponding position. Accordingly, it is possible to prevent another light-emitting element from being assembled in the assembly hole (203) or multiple light-emitting elements from being assembled.

[0084]

[0085] FIG. 4 is a drawing showing an example in which a light-emitting element according to an embodiment is assembled on a substrate by a self-assembly method, and the self-assembly method of the light-emitting element is explained with reference to the drawings.

[0086] The substrate (200) may be a panel substrate of a display device. In the following description, the substrate (200) is described as a panel substrate of a display device, but the embodiment is not limited thereto.

[0087] Referring to FIG. 4, a plurality of light-emitting elements (150) may be placed in a chamber (1300) filled with a fluid (1200). The fluid (1200) may be, but is not limited to, water such as ultrapure water. The chamber may be referred to as a tank, a container, a vessel, or the like.

[0088] After this, the substrate (200) can be placed on the chamber (1300). Depending on the embodiment, the substrate (200) can also be introduced into the chamber (1300).

[0089] As shown in FIG. 3, a pair of assembly wirings (201, 202) corresponding to each light emitting element (150) to be assembled can be arranged on the substrate (200).

[0090] Referring to FIG. 4, after the substrate (200) is placed, an assembly device (1100) including a magnetic body can move along the substrate (200). For example, a magnet or an electromagnet can be used as the magnetic body. The assembly device (1100) can move in contact with the substrate (200) to maximize the area affected by the magnetic field within the fluid (1200). Depending on the embodiment, the assembly device (1100) may include a plurality of magnetic bodies or may include magnetic bodies of a size corresponding to that of the substrate (200). In this case, the movement distance of the assembly device (1100) may be limited within a predetermined range.

[0091] By the magnetic field generated by the assembly device (1100), the light emitting element (150) within the chamber (1300) can move toward the assembly device (1100).

[0092] The light emitting element (150) may move toward the assembly device (1100) and enter the assembly hole (203) by the dielectric electrophoretic force (DEP force) to come into contact with the substrate (200).

[0093] Specifically, the assembly wiring (201, 202) forms an electric field by an externally supplied power source, and a dielectric force can be formed between the assembly wiring (201, 202) by this electric field. The light-emitting element (150) can be fixed to the assembly hole (203) on the substrate (200) by this dielectric force.

[0094] The light emitting element (150) in contact with the substrate (200) can be prevented from being detached by the movement of the assembly device (1100) due to the electric field applied by the assembly wiring (201, 202) formed on the substrate (200). According to an embodiment, the time required for each of the light emitting elements (150) to be assembled on the substrate (200) can be drastically shortened by the self-assembly method using the electromagnetic field described above, so that a large-area, high-pixel display can be implemented more quickly and economically.

[0095] At this time, a predetermined solder layer (not shown) is formed between the light-emitting element (150) assembled on the assembly hole (203) of the substrate (200) and the assembly electrode, thereby improving the bonding strength of the light-emitting element (150).

[0096] Next, a molding layer (not shown) may be formed in the assembly hole (203) of the substrate (200). The molding layer may be a light-transmitting resin or a resin containing a reflective material or a scattering material.

[0097]

[0098] Fig. 5 is a conceptual diagram of an assembly substrate on which semiconductor light-emitting devices being internally studied are assembled. Referring to Fig. 5, a plurality of assembly wires (20) may be arranged on a substrate (not shown), and an insulating film and a partition wall may be arranged on the plurality of assembly wires (20). In addition, the partition wall may have a first assembly hole (41H) into which a first semiconductor light-emitting device is assembled. Meanwhile, the semiconductor light-emitting devices may have different sizes depending on the color they emit light, for simultaneous assembly. In addition, the size of the assembly hole may correspond thereto. The first semiconductor light-emitting device (51) may be larger than the second semiconductor light-emitting device (52), and the second semiconductor light-emitting device (52) may be larger than the third semiconductor light-emitting device (53). In addition, the first semiconductor light-emitting device (51), the second semiconductor light-emitting device (52), and the third semiconductor light-emitting device (53) may emit light of different colors.

[0099] Meanwhile, if the chips are assembled in order of size during assembly, the assembly time increases, and since the second semiconductor light-emitting element (52) and the third semiconductor light-emitting element (53) are smaller than the first assembly hole (41H), there is a problem that the second semiconductor light-emitting element (52) and the third semiconductor light-emitting element (53) are assembled within the first assembly hole (41H) and cannot escape, resulting in color mixing.

[0100] Additionally, as the size of the chip gets smaller, it becomes difficult to secure the beta properties of the R, G, and B chips.

[0101]

[0102] Hereinafter, an embodiment for solving the above problem will be described.

[0103] Fig. 6 is a conceptual diagram of a substrate for assembling a semiconductor light-emitting element for a display pixel according to a first embodiment. Referring to Fig. 6, the first embodiment may include a plurality of assembly wires (120), a partition wall (160) arranged on the plurality of assembly wires (120), an assembly hole (140H) provided in the partition wall, and a semiconductor light-emitting element (150) assembled in the assembly hole (140H).

[0104] The above plurality of assembly wires (120) may include a first assembly wire (121) and a second assembly wire (122). The first assembly wire (121) and the second assembly wire (122) are arranged spaced apart from each other, and opposite power sources are applied as alternating current to generate a DEP force to assemble a semiconductor light-emitting element.

[0105] The above-mentioned partition wall (160) may include a first partition wall (161) and a second partition wall (162) that are spaced apart from each other. The first partition wall (161) may be positioned on the first assembly wiring (121), and the second partition wall (162) may be positioned on the second assembly wiring (122). In addition, the partition wall (160) may have an assembly hole (140H). The assembly hole (140H) may vertically overlap a plurality of assembly wirings (120).

[0106] At this time, the partition wall (160) may form a partition wall passage (165) as the first partition wall (161) and the second partition wall (162) are spaced apart. The width (W) of the partition wall passage (165) may be the distance between the first partition wall (161) and the second partition wall (162). Meanwhile, the diameter of the assembly hole (140H) may be larger than the diameter of the semiconductor light-emitting device (150). In addition, the width (W) of the partition wall passage (165) may be smaller than the diameter of the semiconductor light-emitting device (150). In addition, the width (W) of the partition wall passage (165) may be larger than the diameter of a semiconductor light-emitting device that emits a different color from the semiconductor light-emitting device (150).

[0107] Accordingly, if a semiconductor light-emitting element of a size other than the semiconductor light-emitting element (150) corresponding to the assembly hole (140H) is incorrectly assembled, it can escape through the partition passage (165) by the magnet. Therefore, the embodiment can prevent incorrect assembly during self-assembly, thereby preventing color mixing, and has the technical effect of being able to significantly reduce the assembly time by simultaneously assembling semiconductor light-emitting elements of R, G, and B colors.

[0108]

[0109] Fig. 7 is a plan view of a substrate for assembling a semiconductor light-emitting element for a display pixel according to a second embodiment. Referring to Fig. 7, the second embodiment may include a first assembly area (131) in which a first semiconductor light-emitting element (151) is assembled, a second assembly area (132) in which a second semiconductor light-emitting element (152) is assembled, and a third assembly area (133) in which a third semiconductor light-emitting element (153) is assembled. The first semiconductor light-emitting element (151), the second semiconductor light-emitting element (152), and the third semiconductor light-emitting element (153) may emit light of different colors. For example, the first semiconductor light-emitting element (151) may emit light of red color, the second semiconductor light-emitting element (152) may emit light of green color, and the third semiconductor light-emitting element (153) may emit light of blue color, but is not limited thereto. In addition, the diameter of the first semiconductor light-emitting element (151) is larger than the diameter of the second semiconductor light-emitting element (152), and the diameter of the second semiconductor light-emitting element (152) may be larger than the diameter of the third semiconductor light-emitting element (153). In addition, the assembly voltage of the third semiconductor light-emitting element (153) may be larger than the assembly voltage of the second semiconductor light-emitting element (152), and the assembly voltage of the second semiconductor light-emitting element (152) may be larger than the assembly voltage of the first semiconductor light-emitting element (151).

[0110] First, in the first assembly area (131), a plurality of first assembly wiring portions (120a) may include a first-first assembly wiring portion (121a) and a first-second assembly wiring portion (122a). In addition, a first partition wall (160a) may be disposed on the first assembly wiring portion (120a). The first partition wall (160a) may include a first-first partition wall (161a) disposed on the first-first assembly wiring portion (121a) and a first-second partition wall (162a) disposed on the first-second assembly wiring portion (122a). The first-first partition wall (161a) and the first-second partition wall (162a) may be disposed to be spaced apart from each other.

[0111] The first partition wall (160a) has a first assembly hole (141H), and a first semiconductor light-emitting element (151) can be assembled into the first assembly hole (141H). The diameter of the first assembly hole (141H) can be larger than the diameter of the first semiconductor light-emitting element (151).

[0112] In addition, in the first assembly area (131), the first-first partition wall (161a) and the first-second partition wall (162a) may be spaced apart from each other, thereby forming a first partition wall passage (165a). The width (W1) of the first partition wall passage (165a) may be smaller than the diameter of the first assembly hole (141H). In addition, the width (W1) of the first partition wall passage (165a) may be smaller than the diameter of the first semiconductor light-emitting element (151).

[0113] Additionally, the width (W1) of the first partition wall passage (165a) may be larger than the diameter of the second semiconductor light-emitting element (152). The width (W1) of the first partition wall passage (165a) may be larger than the diameter of the third semiconductor light-emitting element (153).

[0114] Meanwhile, in the first semiconductor light-emitting device (151), the assembly force of the first assembly wiring portion (120a) may be greater than the magnetic force of the assembly magnet. On the other hand, in the second semiconductor light-emitting device (152) and the third semiconductor light-emitting device (153), the magnetic force of the assembly magnet may be greater than the assembly force of the first assembly wiring portion (120a).

[0115] Accordingly, the second embodiment has a technical effect in that even if a second semiconductor light-emitting element (152) or a third semiconductor light-emitting element (153) is assembled in the first assembly hole (141H), the incorrectly assembled chip can escape through the first bulkhead passage (165a) by the assembly magnet.

[0116]

[0117] In addition, a second assembly wiring portion (120b) may be arranged in the second assembly area (132), and a second partition wall (160b) may be arranged on the second assembly wiring portion (120b). The second partition wall (160b) has a second assembly hole (142H), and a second semiconductor light-emitting element may be assembled into the second assembly hole (142H). The diameter of the second assembly hole (142H) is smaller than the diameter of the first semiconductor light-emitting element (151), so that the first semiconductor light-emitting element (151) cannot be assembled.

[0118] The second partition wall (160b) may include a second-first partition wall (161b) and a second-second partition wall (162b) that are spaced apart from each other. In addition, the second assembly area (132) may form a second partition wall passage (165b) as the second-first partition wall (161b) and the second-second partition wall (162b) are spaced apart from each other. The width (W2) of the second partition wall passage (165b) may be smaller than the diameter of the second assembly hole (142H). In addition, the width (W2) of the second partition wall passage (165b) may be smaller than the diameter of the second semiconductor light-emitting element (152). In addition, the width (W2) of the second partition wall passage (165b) may be larger than the diameter of the third semiconductor light-emitting element (153).

[0119] Accordingly, the second embodiment has a technical effect in that even if the third semiconductor light-emitting element (153) is assembled in the second assembly hole (142H), the incorrectly assembled chip can escape through the second bulkhead passage (165b) by the assembly magnet.

[0120]

[0121] In addition, the third partition wall (160c) disposed on the third assembly wiring portion (120c) in the third assembly area (133) may have a third assembly hole (143H), and a third semiconductor light-emitting element (153) may be assembled within the third assembly hole (143H). The diameter of the third assembly hole (143H) may be smaller than the diameter of the second semiconductor light-emitting element (152) and larger than the diameter of the third semiconductor light-emitting element (153). In addition, the third partition wall (160c) may not have a partition wall passage.

[0122]

[0123] Therefore, the second embodiment has the technical effect of significantly reducing the assembly process time by enabling the simultaneous assembly of R, G, and B color semiconductor light-emitting elements. In addition, it has the technical effect of preventing color mixing by allowing incorrectly assembled chips to escape through the barrier passage.

[0124]

[0125] FIG. 8 is a plan view of a substrate for assembling a semiconductor light-emitting device for a display pixel according to a third embodiment. Referring to FIG. 8, a partition wall (160) may be arranged on a plurality of assembly wires (120). The partition wall (160) may vertically overlap the assembly wires (120). In addition, the partition wall (160) may have an assembly hole (140H). A semiconductor light-emitting device (150) may be arranged in the assembly hole (140H). Meanwhile, in the third embodiment, since the partition walls are arranged to be spaced apart from each other, a partition wall passage (165) may be provided. In addition, the partition wall passage (165) may have a first width (W3) in the assembly area, but may be connected to a first area (170) outside the assembly area. The width (W4) of the first area (170) may be greater than the first width (W3) of the partition wall passage (165). The above first region (170) may not vertically overlap with the assembly wiring (120).

[0126] Meanwhile, the first region (170) may be an region for collecting chips that have not been assembled and have escaped through the bulkhead passage (165).

[0127] Accordingly, the third embodiment can assemble R, G, and B chips simultaneously, and the partition wall has a first region between the assembled semiconductor light-emitting elements, and has a technical effect that facilitates the movement of unassembled chips to the first region and their collection.

[0128]

[0129] Fig. 9 is a plan view of a substrate for assembling a semiconductor light-emitting element for a display pixel according to a fourth embodiment. Referring to Fig. 9, an assembly hole (141H) may be positioned to vertically overlap a plurality of assembly wires (120). At this time, the assembly hole (141H) may be arranged to be biased on one side between the plurality of assembly wires (120). When opposite voltages are applied to the plurality of assembly wires (120) as an alternating current to generate a DEP force and when assembling a semiconductor light-emitting element (151), the DEP force may be strongest in the area between the plurality of assembly wires (120). In addition, only a portion of the bottom surface of the semiconductor light-emitting element (151) may vertically overlap the plurality of assembly wires (120). Accordingly, when the assembly hole (141H) is formed biasedly on one side between a plurality of assembly wires (120), the semiconductor light-emitting element can be assembled between a plurality of assembly wires (120) having the strongest DEP force, and there is a technical effect of reducing the tolerance of the semiconductor light-emitting element assembled in each assembly hole (141H).

[0130]

[0131] Fig. 10 is a plan view of a substrate for assembling a semiconductor light-emitting element for a display pixel according to a fifth embodiment. Referring to Fig. 10, in the fifth embodiment, a partition wall (160) may have an assembly hole (140H) on a plurality of assembly wires (120). The assembly hole (140H) may vertically overlap with a first assembly wire (121) and a second assembly wire (122). In addition, the partition wall (160) may have a partition wall passage (165) disposed on the assembly wire (120). The partition wall passage (165) may be in contact with the assembly hole (140H). The partition wall passage (165) may be arranged symmetrically with respect to the semiconductor light-emitting element (150). Meanwhile, the partition wall passage (165) may vertically overlap with either the first assembly wire (121) or the second assembly wire (122). The above bulkhead passage (165) vertically overlaps only one of the plurality of assembly wires (120), and accordingly, the DEF force may not be formed in the bulkhead passage (165) or may be weak.

[0132] Accordingly, chips located in the bulkhead passage (165) may not be assembled. Accordingly, chips not assembled in the assembly hole (140H) move to the bulkhead passage (165) and can be collected.

[0133] In addition, the bulkhead passage (165) may include a first bulkhead passage (165a), a second bulkhead passage (165b), and a third bulkhead passage (165c). The first bulkhead passage (165a) may have a square shape. In addition, the second bulkhead passage (165b) may have a trapezoidal shape. In addition, the third bulkhead passage (165c) may have a circular or oval shape.

[0134] Accordingly, the fifth embodiment has the technical effect that the bulkhead passage vertically overlaps one of the plurality of assembly wires, and the bulkhead passage is not subject to assembly force, so that chips located in the bulkhead passage are not assembled and can be collected. In addition, the bulkhead passage may have a shape such as a square, trapezoidal, circular, or oval.

[0135]

[0136] Fig. 11 is a cross-sectional view of a substrate for assembling a semiconductor light-emitting element for a display pixel according to a sixth embodiment. Referring to Fig. 11, a plurality of assembly wires (120) may be arranged on a substrate (110), and an insulating layer (115) may be arranged to cover the plurality of assembly wires (120). In addition, a partition wall having an assembly hole may be arranged on the insulating layer (115). In addition, a semiconductor light-emitting element (150) may be arranged within the assembly hole.

[0137] At this time, the height of the partition wall (160) may be higher than the center of gravity (E) of the semiconductor light-emitting device (150). The upper surface of the partition wall (160) may be positioned higher than the center of gravity (E) of the semiconductor light-emitting device (150). Accordingly, when the semiconductor light-emitting device (150) is properly assembled, the problem of it being detached from the assembly hole due to collision with another chip can be prevented.

[0138] In addition, the thickness (T1) of the partition wall (160) may be smaller than the diameter (T2) of the semiconductor light-emitting device (150). In detail, the thickness (T1) of the partition wall (160) may be smaller than half the diameter (T2) of the semiconductor light-emitting device (150). Accordingly, there is a technical effect that the semiconductor light-emitting device (150) may be detached from the assembly hole due to collision with another chip when tilted and incorrectly assembled. Accordingly, the embodiment has a technical effect that can improve the correct assembly rate of the semiconductor light-emitting device.

[0139]

[0140] A substrate for assembling a semiconductor light-emitting element for a display pixel according to an embodiment and a display device including the same have a technical effect of preventing color mixing of the semiconductor light-emitting element.

[0141] For example, in the embodiment, semiconductor light emitting elements emitting different colors can escape through the partition passage, thereby preventing color mixing.

[0142] In addition, the embodiment has a technical effect of implementing simultaneous assembly of semiconductor light-emitting devices.

[0143] For example, the embodiment can simultaneously assemble semiconductor light-emitting devices of different sizes by distinguishing them using a bulkhead passage.

[0144] In addition, the embodiment has a technical effect of reducing the assembly time of a semiconductor light-emitting device.

[0145] For example, the embodiment can significantly reduce assembly time through simultaneous assembly.

[0146] In addition, the embodiment has a technical effect that allows for easy collection of unassembled chips.

[0147] For example, the embodiment may form a collection area in an area adjacent to the bulkhead passage to collect unassembled chips.

[0148] In addition, the embodiment has a technical effect that can improve the assembly rate of a semiconductor light-emitting device.

[0149] For example, the embodiment can improve the assembly rate by designing the height of the bulkhead to take into account the diameter and center of gravity of the semiconductor light-emitting element.

[0150]

[0151] Although the present invention has been described above with reference to embodiments thereof, it will be readily understood by those skilled in the art that various modifications and changes to the present invention can be made without departing from the spirit and scope of the present invention as set forth in the claims below.

[0152] The embodiment can be adopted in the field of displays that display images or information.

[0153] The embodiment can be adopted in the field of displays that display images or information using semiconductor light-emitting elements.

[0154] The embodiment can be adopted in the display field that displays images or information using micro- or nano-level semiconductor light-emitting elements.

Claims

1. Substrate; A plurality of assembly wirings arranged on the above substrate; A bulkhead arranged on the above plurality of assembly wirings and having an assembly hole; and An assembly substrate for a semiconductor light-emitting element for a display pixel, comprising a bulkhead passage arranged adjacent to the above assembly hole.

2. In paragraph 1, The above assembly hole includes a first assembly hole in which a first semiconductor light-emitting element is assembled and a second assembly hole in which a second semiconductor light-emitting element is assembled. An assembly substrate for a semiconductor light-emitting element for a display pixel, wherein the partition wall passage includes a first partition wall passage adjacent to the first assembly hole and a second partition wall passage adjacent to the second assembly hole.

3. In paragraph 2, An assembly substrate for a semiconductor light-emitting element for a display pixel, wherein the width of the first bulkhead passage is smaller than the diameter of the first assembly hole.

4. In paragraph 2, A substrate for assembling a semiconductor light-emitting element for a display pixel, wherein the width of the first bulkhead passage is smaller than the diameter of the first semiconductor light-emitting element and larger than the diameter of the second semiconductor light-emitting element.

5. In paragraph 4, An assembly substrate for a semiconductor light-emitting element for a display pixel, wherein the width of the first bulkhead passage is greater than the height of the second semiconductor light-emitting element.

6. In paragraph 1, The above assembly hole includes a plurality of The above bulkhead passage is formed integrally with the plurality of assembly holes, and is an assembly substrate for a semiconductor light-emitting element for a display pixel.

7. In paragraph 1, The above assembly hole includes a plurality of It further includes a first region disposed between the plurality of assembly holes and connected to the bulkhead passage, A substrate for assembling a semiconductor light-emitting element for a display pixel, wherein the width of the first region is greater than the width of the partition passage.

8. In paragraph 1, An assembly substrate for a semiconductor light-emitting element for a display pixel, wherein the above-mentioned bulkhead passage is arranged to vertically overlap with any one of the above-mentioned plurality of assembly wires.

9. In paragraph 1, An assembly substrate for a semiconductor light-emitting device for a display pixel, wherein the height of the above-mentioned partition is positioned higher than the center of gravity of the semiconductor light-emitting device.

10. In paragraph 1, An assembly substrate for a semiconductor light-emitting element for a display pixel, wherein the height of the above-mentioned partition is smaller than half the diameter of the semiconductor light-emitting element.

11. A display device including an assembly substrate for a semiconductor light-emitting element for a display pixel according to any one of claims 1 to 10.

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