Loading and unloading cycle for a CVD reactor system

Abstract

The invention relates to a device and a method for simultaneously coating a plurality of substrates (1, 9) in at least one process chamber (4) of a process chamber arrangement (21). It is essential, first, that after the coating the processed substrates (9) are alternately exchanged for unprocessed substrates in the process chamber. The subsequent coating process then occurs without prior cleaning of the process chamber. Three sets of the substrate carriers (2, 8) can be used simultaneously, such that, while a first set of the plurality of sets of the substrate carriers (2) is treated in at least one process chamber (4), a second set of the plurality of sets which contains unprocessed substrate carriers (2, 8) carrying unprocessed substrates (1) is disposed in at least one storage chamber (6, 7) of a storage chamber arrangement (19, 20) and a third set of the plurality of sets which contains processed substrate carriers (2, 8) carrying no substrates (1, 9) is disposed in the same or another storage chamber arrangement (19, 20) having at least one storage chamber (6, 7).

Description

Description Loading and unloading cycle for a CVD reactor system field of technology

[0001] The invention relates to a method for the simultaneous treatment of several substrates in at least one process chamber of a process chamber arrangement, wherein several sets, each having a number n of substrate carriers, which are each configured to carry at least one substrate, are used, wherein the several sets of substrate carriers are used cyclically and in the process, unprocessed substrate carriers are loaded one after the other with substrates to be processed, into which at least one process chamber of the process chamber arrangement is brought, in which at least one process chamber is treated at a first elevated temperature, wherein the unprocessed substrates are processed into processed substrates and the unprocessed substrate carriers become processed substrate carriers, are removed from the process chamber at a second elevated temperature,cooled to a reduced temperature and separated from the processed substrates, and an apparatus for carrying out such a method. State of the art

[0002] US 2020 / 0354828 A1 describes an apparatus and a method for depositing semiconductor layers on substrates supported by substrate carriers in at least one process chamber of an MOCVD reactor. A cleaning chamber is provided in which the substrate carriers can be cleaned before the deposition process. Cleaned and processed substrate carriers, as well as unprocessed and processed substrates, are stored separately in different storage chambers, and the storage chamber for cleaned substrate carriers can also be cooled.

[0003] US 2022 / 0333271 A1 discloses a device for treating substrates mounted on annular substrate carriers in a process chamber, in particular for the deposition of SiC. The unprocessed and processed substrates can be stored together outside the process chamber in one storage chamber or separately in two storage chambers. Furthermore, a third storage chamber is provided in which substrates with substrate carriers can be stored in the event of an abnormal situation. After a deposition process, a substrate carrier with one or more substrates can be cooled in a cooling device.

[0004] US 10,790,174 B2 describes a device for transporting substrates, which has a first storage chamber in which unprocessed substrates are stored and a second storage chamber into which the processed substrates are brought from a process chamber.

[0005] US 2022 / 0076976 A1 describes an automated process for the deposition of thin films. To increase throughput, the heating, processing, and cooling of the substrates are decoupled. A heating chamber, a processing chamber, and a cooling chamber are used, each of which can simultaneously process a substrate carrier loaded with substrates.

[0006] US 2005 / 0187647 A1 discloses the use of two sets of substrate carriers that are coated in temporally overlapping deposition processes.

[0007] The invention particularly addresses the problem that existing processes for the simultaneous treatment of several substrates carried by substrate carriers in a process chamber of a CVD reactor result in long downtimes. In existing CVD systems, Treatment of the substrates In a first step, the substrate carriers together with the substrates are removed individually from the process chamber. Removal takes place at temperatures of several hundred degrees Celsius. At these temperatures, a separate cooling step is necessary for each substrate to enable further processing of the substrates. This can take place before the substrate is separated from the substrate carrier or after separation. Therefore, after each removal of a substrate-substrate carrier pair, the pair must first be separated and then the substrate must be cooled in a designated cooling station. This results in long cooling times, particularly for substrates with a high heat capacity, such as sapphire. After cooling, the substrate is placed in a storage chamber and the substrate carrier is returned to the process chamber. These process steps are repeated until all processed substrates are stored in the storage chamber and all processed substrate carriers are stored in the process chamber. Following this, the processed substrate carriers, which, if the treatment includes the deposition of a layer, have a parasitic coating, are cleaned in the CVD process chamber. For subsequent treatment, the cleaned substrate carriers are individually removed from the process chamber and loaded with an unprocessed substrate, before being returned to the process chamber. During the cooling phase when unloading the reactor and during the loading of cleaned substrate carriers with unprocessed substrates, the CVD reactor is unproductive. The time the CVD reactor is unproductive multiplies by the number of substrates. In practice, this leads to considerable downtime, which significantly reduces the overall productivity of the CVD reactor. Summary of the invention

[0008] The invention is based on the object of providing a method which minimizes the effort of simultaneously treating several substrates in a CVD reactor arrangement and maximizes the temporal utilization of the CVD reactor, as well as to provide a device for implementing such a method.

[0009] The problem is solved by the invention specified in the claims, wherein the subclaims represent not only advantageous developments of the invention claimed in the subordinate claims, but also independent solutions to the problem.

[0010] First and foremost, a process chamber arrangement, preferably a CVD system, is provided, which has at least one process chamber and a total of n storage locations for storing one substrate carrier each, where n is a natural number. Each substrate carrier is configured to support at least one substrate. The unprocessed substrate carriers are loaded successively with unprocessed substrates until n substrate carriers are each loaded with one unprocessed substrate.

[0011] Loading can take place in a first separation device. After loading, the unprocessed substrate carriers carrying unprocessed substrates are brought one after the other into the process chamber arrangement. Following this, the substrates are treated in the process chamber at a first elevated temperature. During this thermal treatment, the unprocessed substrates are processed into processed substrates, and the unprocessed substrate carriers are processed into processed substrate carriers. One or more layers can be deposited on the substrates. The deposition process is preferably a MOCVD process, in which III-V layers are deposited on the substrate using starting materials from main groups III and V. However, II-VL and / or IV-IV layers, such as SiC layers, can also be deposited.

[0012] After thermal treatment, the processed substrate carriers carrying the processed substrates are removed from the process chamber one after another at a second elevated temperature. After removal, the processed substrate carriers carrying the processed substrates are cooled to a reduced temperature and separated from the processed substrates.

[0013] A second separation device can be used to separate the substrates from the substrate carriers. The same separation device can also be used for loading the substrate carriers with substrates and separating the substrate carriers and substrates. The separation devices can be arranged in a transfer chamber connected to the process chamber arrangement or connected to it. The separation of the substrate carriers and substrates preferably takes place after cooling.

[0014] After thermal treatment and their removal from the process chamber arrangement, the substrate carriers carrying the processed substrates can be brought into a storage chamber arrangement and cooled there to the reduced temperature. Two storage chamber arrangements can be used, each having one or more storage chambers. The storage chamber arrangements can be arranged in the transfer chamber or connected to it. In the storage chambers of a first storage In a storage chamber arrangement with ml storage spaces, only unprocessed substrate carriers, with or without unprocessed substrates, can be stored. In the storage chambers of a second storage chamber with m2 storage spaces, only processed substrate carriers, with or without substrates, can be stored.

[0015] The cooling down of the processed substrate carriers carrying the processed substrates in the second storage chamber arrangement or of the cleaned substrate carriers in the first storage chamber arrangement can be carried out actively by a cooling element arranged in each of the second storage chamber arrangements or passively by a storage chamber kept at ambient temperature.

[0016] The first and / or second storage chamber arrangement may contain an inert gas atmosphere, for example, a nitrogen atmosphere. The pressure in the first and / or second storage chamber arrangement can be varied between vacuum and atmospheric pressure.

[0017] The processed and unprocessed substrate carriers, with and without substrate, can be stored in the same storage chamber arrangement in one storage chamber or in separate storage chambers. Separate storage of unprocessed and processed substrate carriers prevents contamination of unprocessed components.

[0018] After cooling the processed substrate carriers carrying the processed substrates in the storage chamber arrangement, the processed substrates can be separated from the processed substrate carriers in the separation device. After separation, the processed substrate carriers can be returned to the storage chamber arrangement. The resulting The processed substrates taken can be transported out of the system individually or in groups in a first carrier element, for example a front opening universal pod.

[0019] Before loading the unprocessed substrate carriers with unprocessed substrates, the unprocessed substrates can be transported individually or in groups into the CVD system in a second carrier element, for example, a front-opening universal pod. For loading, the unprocessed substrates are removed one by one from the second carrier element and loaded onto the unprocessed substrate carriers in the first separation device. These are previously removed one by one from the storage chamber arrangement and placed in the first separation device. After loading the unprocessed substrate carriers with unprocessed substrates, the unprocessed substrate carriers carrying the unprocessed substrates can be returned to the storage chamber.

[0020] After removing the processed substrate carriers carrying the processed substrates, a cleaning step can be performed in the at least one process chamber of the process chamber arrangement, in which processed substrate carriers are located in the process chamber without the substrate. During this cleaning step, the processed substrate carriers are cleaned to form unprocessed substrate carriers.

[0021] After the cleaning step, the unprocessed substrate carriers can be removed from the process chamber and placed in the first storage chamber arrangement.

[0022] The decoupling of the cooling and separation of the substrates and substrate carriers from the treatment step in the process chamber increases the Productivity of the system, since during these intermediate steps the process chamber arrangement can already carry out the next treatment step or a cleaning step.

[0023] Loading the unprocessed substrate carriers with unprocessed substrates and separating the processed substrate carriers and processed substrates preferably occurs during the treatment step or the cleaning step. The order of loading and separating can be reversed.

[0024] Loading and unloading can be performed using a gripper. The gripper has a capacity that allows it to transport one or more substrate carriers simultaneously. Preferably, the gripper has a capacity that allows it to carry exactly one substrate carrier.

[0025] In a first variant of the invention, the simultaneous use of at least, but preferably exactly three sets of substrate carriers is provided. Each substrate carrier set can have a number n of substrate carriers. In this case, a first set of the multiple sets of substrate carriers can be processed in the at least one process chamber of the process chamber arrangement. A second set, which comprises unprocessed substrates carrying unprocessed substrates, can be arranged in at least one of the storage chamber arrangements. A third set, which comprises processed substrate carriers not carrying substrates, can be arranged in the same or a different storage chamber arrangement. The multiple sets of substrate carriers can be used cyclically.

[0026] After the thermal treatment of the first set and the removal of the first set from the process chamber, the first set can be brought into the storage chamber arrangement and stored there together with the processed Substrates are cooled to the reduced temperature. After the first set is removed from the process chamber, the third set of processed substrate carriers can be cleaned in the process chamber.

[0027] In a second variant of the invention, it is provided that unprocessed substrate carriers carrying unprocessed substrates are stored in the first storage chamber arrangement before the thermal treatment, and unprocessed substrate carriers without a substrate are stored after cleaning. Furthermore, it is provided that in the second storage chamber arrangement, after the thermal treatment, processed substrate carriers carrying processed substrates are cooled from the second elevated temperature to the reduced temperature, and before cleaning, processed substrate carriers are stored without a substrate. The cooling of the processed substrate carriers carrying processed substrates in the second storage chamber arrangement can take place during a thermal treatment of unprocessed substrate carriers carrying unprocessed substrates.

[0028] In a third variant of the invention, it is provided that the number of storage locations ml in the first storage chamber arrangement and the number m2 of storage locations in the second storage chamber arrangement is greater than the number n. Furthermore, it is provided that the substrate carriers removed from the process chamber are brought directly to free storage locations in the first and second storage chamber arrangement. Due to the excess of storage locations mi, m2 in the storage chambers compared to the substrate storage locations n in the process chamber arrangement, after cleaning in the process chamber arrangement, the unprocessed substrate carriers carrying the unprocessed substrates can be removed from the first storage chamber arrangement alternately with the cleaned substrate carriers and brought into the process chamber arrangement. Analogously, after the thermal treatment The processed substrate carriers without substrates are removed from the second storage chamber arrangement and brought into the process chamber arrangement in alternation with the processed substrate carriers carrying the processed substrates.

[0029] In all variants of the invention, substrate carriers removed from the process chamber can first be temporarily stored in an intermediate storage location before being transferred to the one or more storage chamber arrangements.

[0030] The method according to the invention can be carried out using a device which has a process chamber arrangement comprising at least one process chamber but optionally also a plurality of process chambers in which n substrates stored on substrate carriers can be treated. The substrate carriers can be arranged on a susceptor. The process chamber can be connected to a gas-tight transfer chamber. The transfer chamber can each be connected to further chambers which are gas-tight sealed against the environment. In a first storage chamber arrangement with ml storage spaces for storing one substrate carrier each, unprocessed substrate carriers with and / or without unprocessed substrate can be stored, and in a second storage chamber arrangement with m2 storage spaces, processed substrate carriers with and / or without processed substrates can be stored.In one embodiment of the invention, the first and second storage chamber arrangements can each comprise a storage chamber. However, the storage chamber arrangements can also each comprise multiple storage chambers. To minimize storage space, the substrate carriers in the storage chambers can be arranged vertically one above the other. For the alternating loading and unloading of the storage chamber arrangement, it is necessary for the storage chamber arrangement to have at least, preferably exactly one, more substrate carrier storage space than the process chamber arrangements. The number of... Storage locations of the first storage chamber arrangement and the number m2 of the second storage chamber arrangement can be greater than the number n of substrate storage locations in the process chamber arrangement. At least three sets of substrate carriers, each with n substrate carriers, can be used. Each substrate carrier is designed to carry at least one substrate. If the process chamber arrangement comprises more than one process chamber, the substrate carrier storage space capacity of the individual process chambers can be the same or different. The use of at least three substrate carrier sets extends their service life, i.e. the time until the substrate carrier sets in use have to be replaced with new substrate carrier sets. The substrate carriers can carry one or more, for example even three, substrates.

[0031] The device further comprises a loading and unloading lock that can be purged and evacuated with a high-purity gas. Through this, objects such as substrates and / or substrate carriers can be transferred into and out of the system. A handling device is arranged, preferably centrally, in the transfer chamber. This comprises a gripping element with one or more gripping heads for gripping objects such as substrates and substrate carriers or other objects used in the treatment of substrates. The gripping element can be mounted with an arm pivotable about an axis. By vertically displacing the gripping element, the gripping head can grip the substrate carriers and / or substrates arranged vertically one above the other in the storage chambers. For this purpose, the storage chambers have openings that can be closed with gates.With the gripping element, the substrate carriers of one of the sets can be removed from the process chamber one after the other and, after each removal of one of the substrate carriers, a substrate carrier of another set can be brought into the process chamber.

[0032] The device has one or more loading and / or separation devices in which substrates and substrate carriers can be separated and / or combined. A first separation device can be used for separating unprocessed substrates and unprocessed substrate carriers. A second separation device can be used for separating processed substrates and processed substrate carriers. However, the same separation device can also be used for separating unprocessed and processed substrates and substrate carriers.

[0033] In addition, the device may comprise an alignment device that aligns unprocessed or processed substrates into a predetermined position.

[0034] To automate the method according to the invention, a programmed or programmable electronic controller is provided. This can, in particular, control the gripping elements and the gates.

[0035] In a further embodiment, the device can have a process chamber arrangement comprising a plurality of process chambers that are connected to a common transfer chamber. With such a device, a plurality of processes can be carried out in parallel, for example, in a plurality of process chambers, each of which is assigned in particular to a CVD reactor, a treatment step can be carried out or a cleaning step can be carried out. However, it is also possible to alternately carry out a cleaning step and a treatment step with an even number of process chambers, each of which is assigned in particular to a CVD reactor. In such a method, the changes can take place simultaneously. However, it can also be provided that the treatment steps and / or the cleaning steps are phase-shifted relative to one another. carried out so that the changes of the cleaned substrate carriers or the changes of the coated substrate carriers take place at different times. Furthermore, it can be provided that one substrate carrier carries several substrates. A substrate carrier that carries only one substrate can have the known ring shape so that a fork-like gripper arm can grip under an annular projection of the substrate carrier. However, it can also be provided that an overall ring-shaped substrate carrier has three or more openings, which have an opening edge, on which the edge of a substrate rests in each case. It is also possible to use several gripper arms. This is particularly advantageous when, during operation with a process chamber arrangement comprising two process chambers, the step-by-step exchange of the coated substrate carriers and the cleaned substrate carriers is to take place simultaneously. Short description of the drawings

[0036] Embodiments of the invention are explained below with reference to the accompanying drawings. They show: Fig. 1 schematically in the form of a plan view or a cross-section through a device for the simultaneous treatment of several substrates 1, 9 in a process chamber 4 of a CVD reactor 3 with a first storage chamber 6 for unprocessed substrate carriers 2 with and without unprocessed substrates 1 and a second storage chamber 7 for processed substrate carriers 8 with and without processed substrates 9, Fig. 2 shows a second embodiment according to Fig. 1 with two process chambers 4, Fig. 3 shows a third embodiment according to Fig. 1 with three process chambers 4 and two transfer chambers 15, 15', Fig. 4 is a schematic representation of an embodiment of the method according to the invention and of the essential elements of the device according to the invention, wherein the first storage chamber arrangement 19 has a first storage chamber 6 and the second storage chamber arrangement 20 has a second storage chamber 7 with a total substrate carrier storage capacity of mi=9 or m2=9. Fig. 5 is a schematic representation according to Figure 4, wherein the substrate carrier storage capacity of the first storage chamber arrangement 19 is m2=10 and the substrate carrier storage capacity of the second storage chamber arrangement 20 is m2=11. Fig. 6 is a schematic representation according to Figure 4, wherein the process chamber arrangement 21 comprises two process chambers 4 and the second storage chamber arrangement 20 comprises two storage chambers 7, 7' with a total of m2=17 substrate carrier storage locations. Fig. 7 is a schematic representation according to Figure 4, wherein the process chamber arrangement 21 comprises three process chambers 4 and the first bearing chamber arrangement 19 and the second bearing chamber arrangement 20 each comprise three bearing chambers 6, 6', 6", 7, 7', 7", which are arranged in a bearing housing 29. Fig. 8 is a schematic representation of an embodiment of the method according to the invention and the Device with three cyclically used substrate carrier sets, wherein a status within a process cycle is shown in which processed substrate carriers 8 loaded with processed substrates 9 from the second storage chamber 7 are separated from one another in a separation device 13 arranged in the transfer chamber 15, while processed substrate carriers 8 in the process chamber 4 are cleaned. Fig. 9 is a schematic representation according to Fig. 8, wherein a status within a process cycle during the cleaning step is shown, in which cleaned substrate carriers 2 stored in the first storage chamber 6 are loaded with unprocessed substrates 1 from a carrier element 26 in the separation device 13. Fig. 10 is a schematic representation according to Figure 8, wherein a status within a process cycle after the cleaning step is shown, in which the cleaned substrate carriers 2 are brought from the process chamber 4 into the first storage chamber 6 and the unprocessed substrate carriers 2 loaded with unprocessed substrates 1 are transferred from the first storage chamber into the process chamber 4. Fig. 11 is a schematic representation according to Figure 8, wherein a status within a process cycle after a coating process in the process chamber 4 is shown, in which processed substrate carriers 8 carrying processed substrates 9 stored in the process chamber 4 are brought into the second storage chamber 7 and processed substrates 9 to be coated stored in the second storage chamber 7 are brought into the second storage chamber 7. cleaning substrate carrier 8 is brought into the process chamber 4. Description of the embodiments

[0037] Fig. 1 shows a floor plan of an embodiment of the device according to the invention with a process chamber 4 arranged in a CVD reactor 3, into which reactive gases can be fed in order to deposit a layer on a substrate 1. The CVD reactor 3 is connected to a transfer chamber 15 via a loading and unloading opening 12, which can be brought from an open state to a closed state. The transfer chamber 15 can contain a water-free and oxygen-free atmosphere. The pressure in the transfer chamber can be in a range between vacuum (50 mbar and less) and atmospheric pressure (1000 mbar). Within the transfer chamber 15 there is a gripping element 10 having a gripper 11 with which a substrate carrier 2, 8 and / or a substrate 1, 9 can be transported. A susceptor 5, which can be heated by a heating device, can be arranged in the process chamber 4.On this susceptor 5, a substrate carrier 2, 8 with / without a substrate 1, 9 can be placed on the susceptor 5 through the loading and unloading opening 12 using the gripping element 10.

[0038] A first storage chamber 6 and a second storage chamber 7 are connected to the transfer chamber 15 via a loading and unloading opening 12. In the first storage chamber 6, the cleaned substrate carriers 2 with and / or without unprocessed substrate 1 can be stored vertically one above the other. In the second storage chamber 7, processed substrate carriers 8 with and / or without processed substrate 9 can be stored. With the aid of the gripping element 10, the substrate carriers 2, 8 with and without substrates 1, 9 can be individually moved out of the storage chambers 6, 7 or into the storage chambers 6, 7.

[0039] To separate the processed substrates 9 from the processed substrate carriers 8 and to load the cleaned substrate carriers 2 with unprocessed substrates 1, the substrates or substrate carriers are brought into a separation module 13 connected to the transfer chamber 15 via a loading and unloading opening 12 using the gripping element 10. Several separation modules 13, 13' can also be connected to a transfer chamber 15. When loading the cleaned substrate carriers 2, the unprocessed substrates 1 can be aligned on the cleaned substrate carriers 2 in a predetermined position.

[0040] The substrates 1, 9 and substrate carriers 2, 8 can be brought into the transfer chamber 15 from the outside or removed from the system by means of a loading and unloading lock 27 connected to the transfer chamber 15.

[0041] A controller 17, which includes a control computer and a memory 18, can control all components of the device. The controller 17 is capable of controlling the gripping element 10, which has a gripper 11, or the gates used to open or close the loading and unloading openings 12. A program is stored in the memory 18, according to which the control computer automatically carries out a treatment process for one or more substrates 1 or a cleaning process for one or more processed substrate carriers 8. The cleaning of the processed substrate carriers 8 takes place in the process chamber 4.

[0042] Before a treatment process, the process chamber 4 is to be loaded with substrate carriers 2 that have previously been cleaned in the process chamber 4. These are individually brought from the process chamber 4 into the first storage chamber 6 by means of the gripping element 10. Following the removal of a cleaned substrate carrier 2 from the process chamber, an unprocessed substrate 1 The cleaned substrate carrier 2 carrying the unprocessed substrate 1 is transferred from the first storage chamber 6 to the process chamber 4. Loading and unloading of the process chamber 4 occurs alternately until the process chamber 4 is completely loaded with the cleaned substrate carriers 2 carrying the unprocessed substrates 1 from the first storage chamber 6. Subsequently, the treatment of the substrates 1 takes place in the process chamber 4.

[0043] The treatment of the substrates 1 can be a coating of the substrates 1 with at least one semiconductor layer, for which purpose process gases are fed into the process chamber 4. The process chamber 4 is heated to a process temperature at which a chemical reaction takes place within a gas phase in the process chamber 4 or on the surface of the substrates 1, resulting in the deposition of a layer, in particular a monocrystalline layer, on the surface of the substrate 1. Along with this, the substrate carriers 2 and other surfaces in the process chamber 4 are also coated. These coatings are parasitic and therefore undesirable.

[0044] During treatment, the cleaned substrate carriers 2 are individually transported from the first storage chamber 6 to the separation module 13. There, the substrate carriers 2 are loaded with unprocessed substrates 1 and subsequently returned to the first storage chamber 6. The annular substrate carriers 2 essentially serve as support elements for handling the substrates 1 with the gripping elements 10 without damage. Such a ring is described, for example, in DE 10 2018 113400 A1. A device for separating substrates and substrate carriers or for loading a substrate carrier with substrates is described in DE 102012 111 167 A1.

[0045] After a treatment process, the processed substrate carriers 8 carrying the processed substrates 9 are brought individually from the process chamber 4 into the second storage chamber 7 by means of the gripping element 10. Subsequently, a processed substrate carrier 8 without a substrate is brought from the second storage chamber 7 into the process chamber 4 by means of the gripping element 10. This is repeated until the process chamber 4 is completely filled with processed substrate carriers 8 from the second storage chamber 7. The processed substrate carriers 8 are then cleaned in the process chamber 4. During this process, a chlorine-containing gas is fed in at an elevated temperature, with which coatings remaining on the surface of the substrate carriers 8 and the process chamber 4, in the case of coating steps previously carried out there, are removed.

[0046] During cleaning, the substrate carriers 8 carrying the processed substrates 9 are individually transported from the second storage chamber 7 by the gripping element 10 into the separation module 13, where they are separated. The processed substrates 9 are then removed from the system through the loading and unloading lock 27. The processed substrate carriers are returned to the second storage chamber 7.

[0047] After cleaning, the cleaning gas is discharged from the process chamber 4, and after one or more flushings of the process chamber 4, the cleaned substrate carriers 2 are individually moved from the process chamber 4 into the first storage chamber 6 using the gripping element 10. This is followed by the previously described alternating loading and unloading of the process chamber 4 with cleaned substrate carriers 2 carrying unprocessed substrates 1 and the cleaned substrate carriers 2.

[0048] The embodiment shown in Figure 2 differs from the embodiment shown in Figure 1 essentially in that two CVD reactors 3 are connected to the transfer chamber 15, each CVD reactor 3 having a process chamber 4, each of which has a susceptor 5. However, a CVD reactor 3 can also have multiple process chambers 4. Different treatment processes can be carried out simultaneously in the CVD reactors 3. In addition, the second storage chamber arrangement 20 comprises two second storage chambers 7', which are arranged in different storage housings 29, 29' and are each connected to the transfer chamber 15. The storage capacity can also be increased by vertically arranging multiple storage chambers 7, 7' within a storage housing 29. By arranging separate storage chambers 7, 7' within a storage chamber arrangement 20, processed substrate carriers 8 with and without processed substrate 9 from the various process chambers 4 can be stored separately from one another.This prevents unwanted contamination, for example, during different coating processes with different materials. In Figure 2, the separation module 13 is arranged in the transfer chamber 15, in contrast to the embodiment shown in Figure 1.

[0049] In the embodiment shown in Figure 3, three CVD reactors 3 are provided, each connected to a transfer chamber 15. A further transfer chamber 15' is connected to this transfer chamber 15 via a connecting opening 16. Four storage chambers 6, 6', 7, 7' are provided, with two storage chambers 6, 6' storing the cleaned substrate carriers 2 with and without unprocessed substrates 1, and two storage chambers 7, 7' storing the processed substrate carriers 8 with and without processed substrates 9. The separation module 13, like the storage chambers 6, 6', 7, 7', is connected to the second transfer chamber 15' via a loading and unloading opening 12.

[0050] Figures 4 to 11 schematically show the method according to the invention and the essential elements of the device according to the invention in various exemplary embodiments. The substrate carriers 2, 8 are annular here. However, they can also be circular disk-shaped.

[0051] The embodiment shown in Figure 4 comprises a process chamber arrangement 21 with a process chamber 4 having n=8 substrate carrier storage locations 22, a first storage chamber arrangement 19 with a first storage chamber 6 and a second storage chamber arrangement 20 with a second storage chamber 7. Both storage chamber arrangements 19, 20 have the same storage chamber arrangement capacity of m ni2=9.

[0052] During unloading and loading of the first storage chamber 6, a cleaned substrate carrier 2 is brought from the process chamber into the first storage chamber 6, and subsequently, a cleaned substrate carrier 2 carrying an unprocessed substrate 1 is brought from the first storage chamber 6 into the process chamber 4. This step is repeated until the process chamber 4 is completely loaded with substrate carriers 2 carrying unprocessed substrates 1 and all cleaned substrate carriers 2 have been transferred from the process chamber 4 to the first storage chamber 6. The first storage chamber 6 has eight substrate storage locations 23, which are loaded with the cleaned substrate carriers 2, each carrying a substrate 1. Another substrate carrier storage location 23' is empty.

[0053] The gripper (not shown in Figure 4) places the cleaned substrate carrier 2, which was previously removed from the process chamber 4, onto the empty substrate carrier storage location 23'. The gripper, which no longer carries a substrate carrier, can then grip one of the substrate carriers 2 lying on one of the substrate carrier storage locations 23 and carrying a substrate 1 to be processed, in order to place it in to place the process chamber 4 on the substrate carrier storage location 22 that has become vacant there.

[0054] During unloading and loading of the second storage chamber 7, a processed substrate carrier 8 carrying a processed substrate 9 is transferred from the process chamber 4 into the second storage chamber 7, and subsequently a processed substrate carrier 8 is brought from the second storage chamber 7 into the process chamber 4. Analogous to the unloading and loading of the first storage chamber, this step is repeated until all processed substrate carriers 8 carrying processed substrates 9 have been transferred from the process chamber 4 to the second storage chamber 7, or the process chamber 4 is completely loaded with processed substrate carriers 8 to be cleaned.

[0055] Here, too, all n=8 substrate carrier storage locations 22 of the process chamber 4, for example, substrate carrier storage locations 22 arranged on a susceptor 5, are each occupied by a substrate carrier 8 carrying a processed substrate 9. Using the gripper (not shown), one of these processed substrate carriers 8 carrying a processed substrate 9 is removed from its substrate carrier storage location 22 and placed on the free substrate carrier storage location 24' of the second storage chamber arrangement 20 or the second storage chamber 7. The then free gripper can grasp a substrate carrier 8 to be cleaned from one of the substrate carrier storage locations 24 in order to place it on the now free substrate carrier storage location 22 in the process chamber 4.

[0056] The embodiment shown in Figure 5 also has a process chamber arrangement 21 with a process chamber 4 with a total of n=8 substrate carrier storage locations, which is alternately unloaded and loaded by two storage chambers 6, 7, wherein the transport capacity of the gripping element 10 (not shown) during unloading and loading of the first storage chamber 6 two substrate carriers 2, 8 and when unloading and loading the second storage chamber 7 corresponds to three substrate carriers 2, 8.

[0057] In this embodiment, two grippers with different gripping capacities are used. A first gripper (not shown) loads and unloads the first storage chamber 6, with two cleaned substrate carriers 2 being simultaneously removed from the process chamber 4 and placed on the two free substrate carrier storage locations 23' of the storage chamber 6. The then free gripper can grip two substrate carriers 2, each carrying an unprocessed substrate 1, from the substrate carrier storage locations 23 and place them on the two free substrate carrier storage locations 22 of the process chamber 4.

[0058] The second gripper, used to load and unload the second storage chamber 7, has a gripper capacity of three. The gripper can transport three processed substrate carriers 8 simultaneously from the process chamber 4 to the second storage chamber 7 and deposit the processed substrate carriers 8 there in the free substrate carrier storage locations 24'. It can then remove three substrate carriers 2 to be cleaned from the storage locations 24 and transport them to the three free storage locations 22 of the process chamber 4.

[0059] In the embodiment shown in Figure 6, the CVD reactor arrangement 3 has a process chamber arrangement 21 with two process chambers 4 and a total of n=16 substrate carrier storage locations. Unlike the embodiment shown in Figure 2, the second storage chamber arrangement 20 has two second storage chambers 7, 7' arranged vertically one above the other with a total of m2=17 substrate carrier storage locations, whereas the first storage chamber arrangement 19, as in the previous embodiments, has only a first storage chamber 6 with a total of m2=17. The transport capacity of the gripping element 10 (not shown) is the same when unloading and loading the first and second storage chamber arrangements (m2 / 2=1). The Two process chambers 4, on the other hand, are both loaded with cleaned substrate carriers 2 carrying unprocessed substrates 1 from the one first storage chamber 6 of the first storage chamber arrangement 19. The cleaned substrate carriers 2 from both process chambers 4 are also stored in the one first storage chamber 6.

[0060] Figure 7 shows a further embodiment with a process chamber arrangement 21 comprising three process chambers 4 with a total of n=24 substrate carrier storage locations. Unlike in the previous embodiments, the first storage chamber arrangement 19 and the second storage chamber arrangement 20 are arranged together in a storage housing 29. The storage chamber arrangements 19, 20 each have a total of mi=m2=25 substrate carrier storage locations, with one free substrate carrier storage location 23', 24' being present in each of the two storage chamber arrangements 19, 20.

[0061] The exemplary embodiments show the use of first storage chambers 6 and second storage chambers 7, wherein one or more first storage chambers 6 form a first storage chamber arrangement 19 and one or more second storage chambers 7 form a second storage chamber arrangement 20. One or more process chambers 4 form a process chamber arrangement 21.

[0062] The process chamber arrangement 21 has a predetermined number of n substrate carrier storage locations, which are each completely filled with substrate carriers 2, 8 during cleaning or processing.

[0063] The first storage chamber arrangement 19 and the second storage chamber arrangement 20 have a number of occupied substrate carrier storage locations 23, 24 corresponding to the total number of substrate carrier storage locations 22 of the process chamber arrangement 21.

[0064] There are thus 3 • n substrate carriers present, with n substrate carriers being arranged in the process chamber arrangement 21, n substrate carriers in the first storage chamber arrangement 19 and a further n substrate carriers in the second storage chamber arrangement 20.

[0065] In addition to the n substrate carrier storage locations 23, 24 each equipped with substrate carriers 2, 8, the first storage chamber arrangement 19 and the second storage chamber arrangement 20 have additional free substrate carrier storage locations 23', 24'. Their number corresponds to the number of substrate carriers that can be transported simultaneously with a gripper.

[0066] The invention particularly relates to a device and a method for depositing a layer sequence, wherein the layer sequence may in particular be a sequence of III.-V. layers, wherein the layer sequence is a transistor structure, a laser diode, a light-emitting diode or another diode structure. The invention further relates to a device and a method for depositing a II.-VL layer or a II.-VI. structure, wherein the II.-VL structure may be a two-dimensional structure. To carry out the method, either reactive gases containing elements of main groups III and V or reactive gases containing elements of main groups II and VI are used.

[0067] Compared to the prior art, the following features are considered particularly advantageous: Two storage chambers 6, 7 are provided, which differ in that only cleaned substrate carriers 2 with and without substrates 1 are arranged in one storage chamber 6, and only processed substrate carriers 8 with and without substrates 9 are arranged in the other storage chamber 7. The number m1, m2 of the storage spaces 23, 23', 24, 24' provided in the storage chambers 6, 7 only needs to be one greater. than the capacity of the process chamber 4 of the CVD reactor 3. A device complex consists of a CVD reactor 3 and two storage chambers. An additional process chamber 4 can be provided. In the two process chambers 4, the coating or cleaning preferably takes place simultaneously. This second process chamber 4 can, however, be used alternately with the first process chamber 4 either for coating or for cleaning the substrate carriers 2, 8. In this case, the substrates 1 can be treated alternately in the first process chamber 4 and the processed substrate carriers 8 can be cleaned in the second process chamber 4 simultaneously or with a phase shift. For the intermediate storage of the processed substrate carriers 8 and for the intermediate storage of the cleaned substrate carriers 2, the same different storage chambers 6, 7 or different different storage chambers 6', 7' can be used.Intermediate storage of the substrate carriers 2, 8 with or without substrate 1, 9 can also take place in an intermediate storage location 28. The intermediate storage location 28 can be arranged in the transfer chamber 15, 15' (see Figures 8 to 11).

[0068] Each process chamber 4 is preferably assigned three substrate carrier sets. When only one process chamber 4 is used, almost the entire cycle time is available for separating the processed substrates 9 from the processed substrate carriers 8 or for loading the unprocessed / cleaned substrate carriers 2 with unprocessed substrates 1. When two process chambers 4 and one gripping element 10 are used, this time is reduced accordingly by the time required for separating the processed substrates 2 from the processed substrate carriers 8 or for loading the unprocessed substrate carriers 2 with unprocessed substrates 1 from the second process chamber 4. In such a method, which is carried out, for example, with an arrangement according to Figure 2, in one of the process chambers 4 a coating process is carried out in one process chamber 4 and a cleaning process is carried out in the other process chamber 4. The device only needs to have a first storage chamber 6 for the cleaned substrate carriers 2 and only a second storage chamber 7 for the processed substrate carriers 8. While the cleaned substrate carriers 2 of one process chamber 4 are exchanged for cleaned substrate carriers 2 carrying uncoated substrates 1, the processed substrate carriers 8 of the other process chamber 4 loaded with processed substrates 9 are exchanged for processed substrate carriers 8 without substrate 9. After simultaneous coating and cleaning or simultaneous coating or simultaneous cleaning in the various process chambers 4, the method continues in the same way. In the drawings, each substrate carrier 2, 8 can only be loaded with one substrate 1, 9.In embodiments not shown, each substrate carrier 2, 8 can also carry several substrates 1, 9.

[0069] Figures 8 to 11 illustrate a further embodiment, wherein the device for the simultaneous treatment of multiple substrates 1 is located in a process chamber 4 of a CVD reactor 3, for example, having n=8 storage locations, using three substrate carrier sets in various stages of a process cycle, comprising a cleaning and coating process. A transfer chamber 15 is connected to the reactor chamber 4. Adjacent to the transfer chamber 15 are a first storage chamber 6 arranged in a storage housing 29 and a second storage chamber 7 for storing unprocessed substrate carriers 2 and processed substrate carriers 8 with and without substrates 1, 9. For storing unprocessed substrates 1 and processed substrates 9, carrier elements 26, 26' are each connected to the transfer chamber 15. Two separation devices 13, 13' are arranged within the transfer chamber 15.A first separation device 13 is used to load unprocessed substrate carriers 2 with unprocessed substrates 1. A second separation device 13' is used to. Separation of processed substrates 9 and processed substrate carriers 8. The separation devices 13, 13' are also used as an intermediate storage location for processed substrate carriers 8 carrying processed substrates 9 removed from the reactor chamber 4, and cleaned substrate carriers 2.

[0070] In the following, an example process cycle is explained using Figures 8 to 11.

[0071] Starting from an initial situation in which the process chamber 4 is loaded with, for example, n = 8 processed substrate carriers 8 to be cleaned and in the first storage chamber 6 unprocessed / cleaned substrate carriers 2 without unprocessed substrates 1 and in the second storage chamber 7 processed substrate carriers 8 without substrate 9 are stored, a cleaning process is started.

[0072] During the cleaning process, the processed substrates 9 stored in the second storage chamber 7 on the processed substrate carriers 8 are separated from the substrate carriers 8 and brought into the carrier element 26'. First, a processed substrate carrier 8 loaded with a processed substrate 9 is brought from the second storage chamber 7 into the separation device 13, where the processed substrate 9 is separated from the processed substrate carrier 8. The processed substrate 9 is then brought into the alignment element 14. This status within the process cycle is schematically illustrated in Figure 8. From there, the processed substrate 9 is brought to an intermediate storage location 28, where the substrate 9 cools. While the substrate 9 cools, the unprocessed substrate carrier 8 is removed from the separation device 13 and brought back into the second storage chamber 7. Subsequently, the cooled processed substrate strat 9 is transferred into the carrier element 26'. These steps are repeated until all processed substrates 9 from the second storage chamber 7 are stored in the carrier element 26' and the associated processed substrate carriers 8 are stored in the second storage chamber 7.

[0073] Following the unloading of the processed substrates 9, the unprocessed substrate carriers 2 stored in the first storage chamber 6 are also loaded with unprocessed substrates 1 stored in the carrier element 26 during the cleaning step. First, a cleaned substrate carrier 2 is brought from the first storage chamber 6 into the separation device 13 by means of the gripping element 10. Subsequently, an unprocessed substrate 1 is removed from the carrier element 26 and transferred to the alignment element 14, where the substrate 1 is brought into a predetermined position. The unprocessed substrate carrier 2 is then loaded with this aligned substrate 1 in the separation device 13. This status within the process cycle is schematically illustrated in Figure 9. Subsequently, the unprocessed substrate carrier 2 loaded with the unprocessed, aligned substrate 1 is brought back into the first storage chamber 6.These steps are repeated until all unprocessed substrate carriers 2 stored in the first storage chamber 6 are loaded with the unprocessed substrates 1 stored in the carrier element 26.

[0074] After completion of the cleaning step in the process chamber 4, the cleaned substrate carriers 2 from the process chamber 4 are exchanged for the unprocessed substrate carriers 2 loaded with unprocessed substrates 1 from the first storage chamber 6. First, a cleaned substrate carrier 2 is brought from the process chamber 4 into the separation device 13'. Then, an unprocessed substrate carrier 2 loaded with an unprocessed substrate 1 is loaded from the first storage chamber 6 into the process chamber 4 onto the vacated storage location 22. This status within The process cycle is schematically illustrated in Figure 10. Subsequently, the cleaned substrate carrier 2 is brought from the separation device 13' into the first storage chamber 6. These steps are repeated until all cleaned substrate carriers 2 are stored in the first storage chamber 6 and the process chamber 4 is completely loaded with unprocessed substrates 1 from the first storage chamber 6.

[0075] Following the loading of the process chamber 4 with unprocessed substrates 1 stored on the unprocessed substrate carriers 2, a coating process is started.

[0076] During the coating process, the carrier element 26 can be loaded with new unprocessed substrates 1 or exchanged for another carrier element 26 loaded with unprocessed substrates 1. The carrier element 29' loaded with the processed substrates 9 can also be exchanged for another unloaded carrier element 26' during the coating process, or the processed substrates 9 can be removed from the carrier element 26'.

[0077] Following the coating process, the substrates 9 coated in the process chamber are stored on the processed substrate carriers 8 and brought into the second storage chamber 7, and the process chamber 4 is loaded with the processed substrate carriers 9 stored in the second storage chamber 7. First, a processed substrate 9 stored on a processed substrate carrier 8 is brought from the reactor chamber into the separation device 13'. This status within the process cycle is schematically illustrated in Figure 11. After that, a processed substrate carrier 8 is brought from the second storage chamber 7 into the process chamber 4 to the vacated storage location 22. Subsequently, the substrate 9 stored in the separation device 13' stored, the processed substrate carrier 8 loaded with a processed substrate 9 is transferred to the second storage chamber 7. These steps are repeated until the process chamber 4 is completely loaded with the processed substrate carriers 8 from the second storage chamber 7 and all processed substrate carriers 8 loaded with processed substrates 9 have been brought from the process chamber 4 into the storage chamber 7.

[0078] The above statements serve to explain the inventions covered by the application as a whole, which may also be claimed separately if necessary, in particular in divisional applications, and which each independently develop the state of the art by at least the following combinations of features, whereby two, several or all of these combinations of features may also be combined, namely:

[0079] Method for the simultaneous treatment of several substrates 1, 9 in at least one process chamber 4 of a process chamber arrangement 21, wherein several sets, each having a number n of substrate carriers 2, 8, each configured to carry at least one substrate 1, 9, are used, wherein the several sets of substrate carriers 2 are used cyclically and, in the process, unprocessed substrate carriers 2 are loaded one after the other with substrates 1 to be processed, into which at least one process chamber 4 of the process chamber arrangement 21 is brought, in which at least one process chamber 4 is treated at a first elevated temperature, wherein the unprocessed substrates 1 are processed into processed substrates 9 and the unprocessed substrate carriers 2 become processed substrate carriers 8, are removed from the process chamber 4 at a second elevated temperature,cooled to a reduced temperature and separated from the processed substrates 9.,

[0080] A method characterized in that at least three sets of substrate carriers 2, 8 are used simultaneously, wherein while a first set of the plurality of sets of substrate carriers 2 is treated in the at least one process chamber 4 of the process chamber arrangement, a second set of the plurality of sets, which includes unprocessed substrate carriers 2 carrying unprocessed substrates 1, is arranged in at least one storage chamber 6 of a storage chamber arrangement 19, and a third set of the plurality of sets, which includes processed substrate carriers 8 not carrying any substrates 9, is arranged in the same or another storage chamber arrangement 20 having at least one storage chamber 7.

[0081] A method which is characterized in that the substrate carriers 2, 8 of the first set of the plurality of sets are brought into the storage chamber 6, 7 after the processing of the substrates 1, 9 carrying them and their removal from the at least one process chamber 4 and are cooled there together with the processed substrates 9 to the reduced temperature.

[0082] A method characterized in that the processed substrates 9 are removed from the cooled processed substrate carriers 8 outside the storage chamber 7 and the processed substrate carriers 8 are returned to the storage chamber 7.

[0083] A method which is characterized in that after the removal of the processed substrate carriers 8 carrying the processed substrates 9 in the at least one process chamber 4 of the process chamber arrangement 21, a cleaning step is carried out in which the third set of processed substrate carriers 8 is located in the process chamber 4, wherein the processed substrate carriers 8 are cleaned to form unprocessed substrate carriers 2.

[0084] A method which is characterized in that by means of a gripping element 10 during loading of the at least one process chamber 4 of the process chamber arrangement 21, one substrate carrier 2, 8 of the set of substrate carriers 2, 8 located in the process chamber 4 is removed one after the other from a storage location 22 of a susceptor 5 and subsequently a substrate carrier 2, 8 of another set of substrate carriers 2, 8 is brought from the storage chamber 6, 7 to the storage location 22.

[0085] A method which is characterized in that the substrate carrier 2, 8 removed from the process chamber 4 is first stored in an intermediate storage location.

[0086] A method which is characterized in that the storage chamber 6, 7 has storage locations 22 whose number is greater than the number n and the substrate carrier 2, 8 removed from the process chamber 4 is brought directly to a free storage location of the storage chamber 6, 7.

[0087] A method which is characterized in that two storage chamber arrangements 19, 20 are used, each having at least one storage chamber 6, 7, wherein in the storage chambers 6 of a first storage chamber arrangement 19 exclusively unprocessed substrate carriers 2 with or without unprocessed substrates 1 are stored and in the storage chambers 7 of a second storage chamber arrangement 20 exclusively processed substrate carriers 8 with or without processed substrates 9 are stored.

[0088] A device for carrying out a method with at least one process chamber arrangement 21 having a process chamber 4, with three sets of a number n of substrate carriers 2, 8, each of the substrate carriers 2, 8 being designed to carry at least one substrate 1, 9, wherein the at least one process chamber 4 has a total number of storage locations 22 which corresponds to the number n, with at least one storage chamber arrangement 19, 20 having one or more storage chambers 6, 7 with storage locations 22 for the first and the second set of substrate carriers 2, 8 and with a gripping element 10 with which the substrate carriers 2, 8 of one of the sets can be removed one after the other from the process chamber 4 and, after each removal of one of the substrate carriers 2, 8, a substrate carrier 2, 8 of another set can be brought into the process chamber 4.

[0089] Method for the simultaneous treatment of a plurality of substrates 1, 9 in at least one process chamber 4 of a process chamber arrangement 21, wherein a number n of unprocessed substrate carriers 2 are successively loaded with unprocessed substrates 1, are brought into the at least one process chamber 4, are treated in the at least one process chamber 4 at a first elevated temperature, wherein the unprocessed substrates 1 are processed into processed substrates 9 and the unprocessed substrate carriers 2 are processed into processed substrate carriers 8, are removed from the at least one process chamber 4 at a second elevated temperature, are cooled to a reduced temperature, are separated from the processed substrates 9, are returned to the at least one process chamber 4 without substrates 9 and are cleaned in the at least one process chamber 4,wherein a first storage chamber arrangement 19 with one or more first storage chambers 6 and a second storage chamber arrangement 20 with second storage chambers 7 are used for storing the substrates 1, 9 and substrate carriers 2, 8.

[0090] A method which is characterized in that in the one or more first storage chambers 6 of the first storage chamber arrangement, unprocessed substrates 1 are stored prior to the thermal treatment, which substrates are unprocessed. ized substrate carriers 2 and, after cleaning, store unprocessed substrate carriers 2 which do not carry substrates 1, 14, and in the one or more second storage chambers 7 of the second storage chamber arrangement, after the thermal treatment, processed substrates 14 are carried by processed substrate carriers 8, are cooled from the second elevated temperature to the reduced temperature, and, before cleaning, store processed substrate carriers 8 which do not carry substrates 14.

[0091] A method which is characterized in that after cleaning, the unprocessed substrate carriers 2 carrying the unprocessed substrates 1 are removed from the one or more first storage chambers 6 alternately with the cleaned substrate carriers 2 and brought into the at least one process chamber 4.

[0092] A method which is characterized in that after the thermal treatment, the processed substrate carriers 8 which do not carry substrates 14 are removed from the one or more second storage chambers 7 in alternation with the processed substrate carriers 8 and brought into the at least one process chamber 4.

[0093] A method characterized in that during the treatment of other substrate carriers 2 carrying unprocessed substrates 1 or during the cleaning of other processed substrate carriers 8 carrying no substrates, the processed substrates 9 are removed from the processed substrate carriers 8 cooled to the reduced temperature.

[0094] A method which is characterized in that during the treatment of other unprocessed substrate carriers 2, the unprocessed sub- strate 1, or during the cleaning of other processed substrate carriers 8, the unprocessed substrate carriers 2 are loaded with unprocessed substrates 1.

[0095] A method which is characterized in that the substrate carrier 2 removed from the at least one process chamber 4 is first stored temporarily in an intermediate storage location.

[0096] A method which is characterized in that the one or more storage chambers 6, 7 of the storage chamber arrangements 19, 20 have storage locations 23, 24 whose number is greater than the number n, and the substrate carrier 2, 8 removed from the at least one process chamber 4 is brought directly to a free storage location 23', 24' of one of the storage chambers 6, 7 of the storage chamber arrangement 19, 20.

[0097] A method which is characterized in that in one or more storage chambers 6 of the first storage chamber arrangement 19 exclusively unprocessed substrate carriers 2 with and without unprocessed substrates 1 are stored and in one or more storage chambers 7 of the second storage chamber arrangement 20 exclusively processed substrate carriers 8 with or without processed substrates 9 are stored.

[0098] A device for carrying out a method with at least one process chamber arrangement 21 having a process chamber 4, with a plurality of substrate carriers 2, 8, wherein each of the substrate carriers 2, 8 is designed to carry at least one substrate 1, 9, wherein the process chamber 4 has storage locations 22 for a number n of substrate carriers 2, 8, with one or more first storage chambers 6, in which a total of either unprocessed substrates 1 carried by unprocessed substrate carriers 2 or no substrates 2 are carried- unprocessed substrate carriers 2 are arranged, and with one or more second storage chambers 7, in which either processed substrates 9 carried by processed substrate carriers 8 or processed substrate carriers 8 not carrying any substrates 9 are arranged.

[0099] A method for the simultaneous treatment of several substrates 1, 9 in at least one process chamber 4 of a process chamber arrangement 21, which has a total of n storage locations 22 for storing one substrate carrier 2, 8 each, where n is a natural number, where each substrate carrier 2, 8 is configured to be able to carry at least one substrate 1, 9, where a number of unprocessed substrate carriers 2 corresponding to the number n are successively loaded with unprocessed substrates 1, are brought into at least one process chamber 4, in which at least one process chamber 4 is treated at a first elevated temperature, where the unprocessed substrates 1 are processed into processed substrates 9 and the unprocessed substrate carriers 2 become processed substrate carriers 8, are cooled to a reduced temperature, are separated from the processed substrates 9,wherein in one or more first storage chambers 6 of a first storage chamber arrangement 19, which has a number of ml storage spaces, a total of a plurality of unprocessed substrate carriers 2 carrying unprocessed substrates 1 corresponding to the number n are stored before the thermal treatment, and wherein in one or more second storage chambers 7 of a second storage chamber arrangement 20, which has a number m2 storage spaces, a total of a plurality of processed substrate carriers 8 carrying processed substrates 9 corresponding to the number n are stored after the thermal treatment.

[0100] A method which is characterized in that the number ml and the number m2 is greater than the number n and that the substrate carriers 2, 8 removed from the process chamber 4 are brought directly into free storage locations of the first and second storage chamber arrangements.

[0101] A method which is characterized in that after cleaning, the unprocessed substrate carriers 2 carrying the unprocessed substrates 1 are removed from the one or more first storage chambers 6 alternately with the cleaned substrate carriers 2 and brought into the at least one process chamber 4.

[0102] A method which is characterized in that after the thermal treatment, the processed substrate carriers 8 which do not carry substrates 9 are removed from the one or more second storage chambers 7 in alternation with the processed substrate carriers 8 and brought into the at least one process chamber 4.

[0103] A method characterized in that during the treatment of other substrate carriers 2 carrying unprocessed substrates 1 or during the cleaning of other processed substrate carriers 8 carrying no substrates 9, the processed substrates 9 are removed from the processed substrate carriers 8 cooled to the reduced temperature.

[0104] A method characterized in that during the treatment of other unprocessed substrate carriers 2 carrying unprocessed substrates 1 or during the cleaning of other processed substrate carriers 8, the unprocessed substrate carriers 2 are loaded with unprocessed substrates 1.

[0105] A method which is characterized in that in the one or more storage chambers 6 of the first storage chamber arrangement 19 exclusively unprocessed substrate carriers 2 with and without unprocessed substrates 1 are stored and in the one or more storage chambers 7 of the second storage chamber arrangement 20 exclusively processed substrate carriers 8 with or without processed substrates 9 are stored.

[0106] A device for carrying out a method according to one of the preceding claims, with at least one process chamber arrangement 21 having a process chamber 4, which has a total of n storage locations 22 for storing a respective substrate carrier 2, 8, where n is a natural number, with a plurality of substrate carriers 2, 8, each of the substrate carriers 2, 8 being designed to carry at least one substrate 1, 14, with a first storage chamber arrangement 19 having one or more first storage chambers 6 and a total of ml storage locations, and with a second storage chamber arrangement 20 having one or more second storage chambers 7, which has a total of m2 storage locations.

[0107] A device characterized in that the numbers ml and m2 are each greater than the number nl. All disclosed features are essential to the invention (individually, but also in combination with one another). The disclosure of the application hereby fully incorporates the disclosure content of the associated / attached priority documents (copy of the prior application), also for the purpose of incorporating features of these documents into claims of the present application. The subclaims, even without the features of a referenced claim, characterize independent inventive developments of the prior art with their features, in particular for filing divisional applications based on these claims. The invention specified in each claim may additionally comprise one or more of the features provided in the above description, in particular with reference numerals, and / or specified in the list of reference numerals.The invention also relates to designs in which individual features mentioned in the above description are not implemented, in particular insofar as they are clearly unnecessary for the respective intended use or can be replaced by other technically equivalent means. List of reference symbols 1 unprocessed substrate 19 first storage chamber arrangement 2 cleaned / unprocessed 20 second storage chamber arrangement substrate carrier 3 CVD reactor 21 Process chamber arrangement 4 Process chamber 22 Substrate carrier storage area 5 Susceptor 23 Substrate carrier storage area 6 first storage chamber 23' substrate carrier storage space 6' first storage chamber 24 substrate carrier storage space 6" first storage chamber 24' substrate carrier storage space 7 second storage chamber 25 substrate storage space 7' second storage chamber 26 support element 7" second storage chamber 26' support element 8 processed substrate carriers 27 loading and unloading locks 9 processed substrate 28 intermediate storage space 10 Gripping element 29 Bearing housing 11 Gripper 29' bearing housing 12 Loading and unloading opening 29" bearing housing 13 Separation device 29'" bearing housing 13' separation device 14 Alignment element 15 Transfer chamber 15' transfer chamber 16 Connection opening 17 Control 18 storage

Claims

Claims 1. A method for the simultaneous treatment of several substrates (1, 9) in at least one process chamber (4) of a process chamber arrangement (21), wherein a susceptor (5) is arranged in the process chamber (4), which has a number (n) greater than 1, storage locations (22) for storing a respective substrate carrier (2, 8), wherein each substrate carrier (2, 8) is annular and carries a substrate (1), wherein a transfer chamber (15) with a gripper (11) is adjacent to the process chamber (4) and at least one storage chamber (6, 7) has substrate storage locations (23, 24), which can each be loaded with a substrate carrier (2, 3), and with an intermediate storage location (28) which can be loaded with a substrate carrier (8), characterized in that after coating, the substrate carriers (8), each carrying a processed substrate (9), are successively moved in successive steps against a substrate carrier (1) carrying an unprocessed substrate (1). Substrate carrier (2) must be replaced,wherein, in each step, an individual substrate carrier (8) carrying a processed substrate (9) is gripped by the gripper (11) at its assigned storage location (22) and, if appropriate, after intermediate storage at the intermediate storage location (28), is brought into the storage chamber (6, 7) and deposited there on one of the substrate storage locations (24), and a substrate carrier (2) carrying an unprocessed substrate (1) is gripped by the gripper (11) from one of the substrate storage locations (23, 24) of the storage chamber (6, 7) and, if appropriate, after intermediate storage at the intermediate storage location (28), is deposited on the previously vacated storage location (22).

2. Method according to claim 1, characterized in that in the first step either a substrate carrier (8) carrying a processed substrate (9) is placed on the intermediate storage location (28) or an unprocessed The substrate carrier (2) carrying the separated substrate (1) is placed on the intermediate storage location (28), the intermediate storage location (28) being cleared before each further step or after the last step.

3. Method according to one of the preceding claims, characterized in that the substrate carriers (8) carrying the processed substrates (9) are brought into the same storage chamber (6, 7) from which a substrate carrier (2) carrying an unprocessed substrate (1) has previously been removed.

4. Method according to one of the preceding claims, characterized in that during the time in which the unprocessed substrates (1) located in the process chamber (4) are coated, the substrate carriers (8) carrying the processed substrates (9) are removed from the storage chamber (6, 7), the processed substrates (9) are separated from the substrate carriers (8), unprocessed substrates (1) are placed on the substrate carriers (8) and the substrate carriers, each carrying an unprocessed substrate (1), are then brought back into the storage chamber (6, 7).

5. Method for the simultaneous treatment of several substrates (1, 9) in at least one process chamber (4) of a process chamber arrangement (21), wherein several sets, each having a number n of substrate carriers (2, 8), each of which is configured to be able to carry at least one substrate (1, 9), are used, wherein the several sets of substrate carriers (2) are used cyclically and in the process unprocessed substrate carriers (2) are loaded one after the other with substrates (1) to be processed, into which at least one process chamber (4) of the process chamber arrangement (21) is brought, in which at least one process chamber (4) is treated at a first elevated temperature, wherein the unprocessed Substrates (1) are processed into processed substrates (9) and the unprocessed substrate carriers (2) become processed substrate carriers (8), are removed from the process chamber (4) at a second elevated temperature, are cooled to a reduced temperature and are separated from the processed substrates (9), wherein at least three sets of substrate carriers (2, 8) are used simultaneously, wherein while a first set of the plurality of sets of substrate carriers (2) is treated in the at least one process chamber (4) of the process chamber arrangement (21), a second set of the plurality of sets, which includes unprocessed substrate carriers (2, 8) carrying unprocessed substrates (1), is arranged in at least one storage chamber (6, 7) of a storage chamber arrangement (19, 20), and a third set of the plurality of sets, which includes processed substrate carriers (8) not carrying any substrates (1, 9), is arranged in the same or another at least one storage chamber (6,7) having a storage chamber arrangement (19, 20), wherein after the removal of the processed substrate carriers (8) carrying the processed substrates (9) from the at least one process chamber (4), a cleaning step is carried out in which the processed substrate carriers (8) are cleaned to form unprocessed substrate carriers (2), characterized in that the cleaning step is carried out in the at least one process chamber (4) of the process chamber arrangement (21).

6. Method according to claim 5, characterized in that the substrate carriers (2, 8) of the first set of the plurality of sets are brought into the storage chamber (6, 7) after the processing of the substrates (1, 9) carrying them and their removal from the at least one process chamber (4) and are cooled there together with the processed substrates (9) to the reduced temperature.

7. The method according to claim 6, characterized in that the processed substrates (9) are removed from the cooled processed substrate carriers (2, 8) outside the storage chamber (6) and the processed substrate carriers (8) are returned to the storage chamber (6, 7).

8. Method according to one of the preceding claims, characterized in that by means of a gripping element (10) during loading of the at least one process chamber (4) of the process chamber arrangement (21) one substrate carrier (2, 8) of the set of substrate carriers (2, 8) located in the process chamber (4) is removed one after the other from a storage location (22) of a susceptor (5) and subsequently a substrate carrier (2, 8) of another set of substrate carriers (2, 8) is brought from the storage chamber (6, 7) to the storage location (22).

9. The method according to claim 8, characterized in that the substrate carrier (2, 8) removed from the process chamber (4) is first stored in an intermediate storage location.

10. The method according to claim 8 or 9, characterized in that the storage chamber (6, 7) has storage locations (23, 24) whose number is greater than the number n and the substrate carrier (2, 8) removed from the process chamber (4) is brought directly to a free storage location of the storage chamber (6, 7).

11. Method according to one of the preceding claims, characterized in that two storage chamber arrangements (19, 20) are used, each having at least one storage chamber (6, 7), wherein in the storage chambers (6) of a first storage chamber arrangement (19) exclusively unprocessed substrate carriers (2) with or without unprocessed Substrates (1) are stored and in the storage chambers (7) of a second storage chamber arrangement (20) exclusively processed substrate carriers (8) with or without processed substrates (9) are stored.

12. Apparatus for carrying out a method according to one of the preceding claims, with at least one process chamber arrangement (21) having a process chamber (4), with three sets of a number n of substrate carriers (2, 8), each of the substrate carriers (2, 8) being designed to carry at least one substrate (1, 9), the at least one process chamber (4) having a total number of storage locations 23, 24 corresponding to the number n, with at least one storage chamber arrangement (19, 20) having one or more storage chambers (6, 7), the number of storage locations m1, m2 in the storage chamber arrangement (19, 20) being greater than the number n of storage locations in the process chamber arrangement (21), and with a gripping element (10) with which the substrate carriers (2, 8) of one of the sets can be removed one after the other from the process chamber (4) and, after each removal of one of the substrate carriers (2, 8), a substrate carrier (2,8) of another set can be brought into the process chamber (4).

13. Method for the simultaneous treatment of several substrates (1, 9) in at least one process chamber (4) of a process chamber arrangement (21), wherein a number n of unprocessed substrate carriers (2) are loaded one after the other with unprocessed substrates (1), into which at least one process chamber (4) is brought, in which at least one process chamber (4) is treated at a first elevated temperature, wherein the unprocessed substrates (1) are processed to form processed substrates (9) and the unprocessed substrate carriers (2) are processed to form substrate carriers (8), at a second elevated temperature from the are removed from at least one process chamber (4), cooled to a reduced temperature, separated from the processed substrates (9), returned to the at least one process chamber (4) without substrates (1, 9) and cleaned in the at least one process chamber (4), wherein a first storage chamber arrangement (19) with one or more first storage chambers (6) and a second storage chamber arrangement (20) with second storage chambers (7) are used to store the substrates (1, 9) and substrate carriers (2, 8), characterized in that in the one or more first storage chambers (6) of the first storage chamber arrangement (19), unprocessed substrates (1) are stored before the thermal treatment, which are carried by unprocessed substrate carriers (2), and after cleaning, unprocessed substrate carriers (2) are stored which do not carry any substrates (1, 9),and in the one or more second storage chambers (7) of the second storage chamber arrangement (20), after the thermal treatment, processed substrates (9) are carried by processed substrate carriers (8), are cooled from the second elevated temperature to the reduced temperature, and before cleaning, processed substrate carriers (8) are stored which do not carry any substrates (9).

14. Method for the simultaneous treatment of several substrates (1, 9) in at least one process chamber (4) of a process chamber arrangement (21), which has a total of a number n of storage locations (22) for storing a respective substrate carrier (2, 8), where n is a natural number, where each substrate carrier (2, 8) is designed to be able to carry at least one substrate (1, 9), where a number (n) corresponding to the number of unprocessed substrate carriers (2) are successively loaded with unprocessed substrates (1), are brought into at least one process chamber (4), in which at least one process chamber (4) at a first increased temperature, wherein the unprocessed substrates (1) are processed into processed substrates (9) and the unprocessed substrate carriers (2) become processed substrate carriers (8), are cooled to a reduced temperature, and are separated from the processed substrates (9), wherein in one or more first storage chambers (6) of a first storage chamber arrangement (19), which has a number of ml storage spaces, a total of a plurality of unprocessed substrate carriers (2) carrying unprocessed substrates (1) corresponding to the number n are stored before the thermal treatment, and wherein in one or more second storage chambers (7) of a second storage chamber arrangement (20), which has a number m2 storage spaces, a total of a plurality of processed substrate carriers (8) carrying processed substrates (9) corresponding to the number n are stored after the thermal treatment, characterized in that the number ml and the number m2 are greater,than the number n and that the substrate carriers (2, 8) removed from the process chamber (4) are brought directly into free storage locations (23', 24') of the first and second storage chamber arrangements (19, 20)., 15. Method according to one of the preceding claims, characterized in that after cleaning, the unprocessed substrate carriers (2) carrying the unprocessed substrates (1) are removed from the one or more first storage chambers (6) alternately with the cleaned substrate carriers (2) and brought into the at least one process chamber (4).

16. Method according to one of the preceding claims, characterized in that after the thermal treatment, the processed substrate carriers (8) which do not carry any substrates (9) are alternately replaced by the pro- The separated substrate carrier (8) is removed from the one or more second storage chambers (7) and brought into the at least one process chamber (4).

17. Method according to one of the preceding claims, characterized in that during the treatment of other substrate carriers (2) carrying unprocessed substrates (1) or during the cleaning of other processed substrate carriers (8) carrying no substrates (9), the processed substrates (9) are removed from the processed substrate carriers (8) cooled to the reduced temperature.

18. Method according to one of the preceding claims, characterized in that during the treatment of other unprocessed substrate carriers (2) carrying unprocessed substrates (1) or during the cleaning of other processed substrate carriers (9), the unprocessed substrate carriers (2) are loaded with unprocessed substrates (1).

19. Method according to one of the preceding claims, characterized in that the substrate carrier (2) removed from the at least one process chamber (4) is first stored temporarily in an intermediate storage location.

20. Method according to one of the preceding claims, characterized in that the one or more storage chambers (6, 8) of the storage chamber arrangements (19, 20) have storage locations (23, 24) whose number is greater than the number n, and the substrate carrier (2, 8) removed from the at least one process chamber (4) is brought directly to a free storage location (23', 24') of one of the storage chambers (6, 7) of the storage chamber arrangement (19, 20).

21. Method according to one of the preceding claims, characterized in that in the one or more storage chambers (6) of the first storage chamber arrangement (19) exclusively unprocessed substrate carriers (2) with and without unprocessed substrates (1) are stored and in the one or more storage chambers (7) of the second storage chamber arrangement (20) exclusively processed substrate carriers (8) with or without processed substrates (9) are stored.

22. Apparatus for carrying out a method according to one of the preceding claims, with at least one process chamber arrangement (21) having a process chamber (4), with a plurality of substrate carriers (2, 8), each of the substrate carriers (2, 8) being designed to carry at least one substrate (1, 9), the process chamber (4) having storage locations (22) for a number n of substrate carriers (2, 8), with one or more first storage chambers (6) in which a total of either unprocessed substrates (1) carried by unprocessed substrate carriers (2) or unprocessed substrate carriers (2) not carrying any substrates (1) are arranged, and with one or more second storage chambers (7) in which a total of either processed substrates (9) carried by processed substrate carriers (8) or processed substrate carriers (8) not carrying any substrates (9) are arranged.

23. Device for carrying out a method according to one of the preceding claims, with at least one process chamber arrangement (21) having a process chamber (4), which has a total of n storage locations (22) for storing a respective substrate carrier (2, 8), where n is a natural number, with a plurality of substrate carriers (2, 8), where each of the substrate carriers (2, 8) is designed to carry at least one substrate (1, 14), with a first storage chamber arrangement (19) having one or more first storage chambers (6) and a total of ml storage locations and with a second storage chamber arrangement (20) with one or more second storage chambers (7), which has a total of m2 storage spaces, characterized in that the numbers m1 and m2 are each greater than the number n.

24. Method or device, characterized by one or more of the characterizing features of one of the preceding claims.

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