Packaging device, manufacturing method therefor and electronic apparatus

Abstract

A packaging device, a preparation method therefor and an electronic apparatus. The packaging device comprises a circuit board, a heat conduction block and an electronic element. The circuit board comprises a first surface and a second surface which are oppositely arranged in a first direction, and the circuit board is provided with a through slot passing through the first surface and the second surface. The heat conduction block is fixed on the circuit board and is at least partially located in the through slot. The heat conduction block comprises a third surface and a fourth surface which are oppositely arranged in the first direction, and the third surface is exposed out of the opening of the through slot at the first surface. The electronic element is fixed on the third surface. The electronic element comprises a central region and an edge region arranged around the central region. Viewed from the first direction, the third surface overlaps with the central region. The present application can improve the heat dissipation efficiency and the temperature uniformity of the surface of the electronic element.

Description

Packaging device, preparation method thereof and electronic equipment Technical Field

[0001] The present application relates to the field of packaging, and in particular to a packaging device, a method for preparing the packaging device, and an electronic device using the packaging device. Background Art

[0002] Packaged devices typically include a circuit board and electronic components mounted on it. To meet increasing power demands, electronic components are increasingly moving towards higher power densities, placing increasing demands on heat dissipation for these packaged devices.

[0003] In related technologies, heat generated by electronic components is typically dissipated through vias in the circuit board, resulting in poor heat dissipation. Heat that is not dissipated in time tends to accumulate in the electronic components, reducing product lifespan and safety. Furthermore, large electronic components can lead to poor surface temperature uniformity.

[0004] Summary of the Invention

[0005] In view of this, in order to solve at least one of the above defects, it is necessary to provide a packaging device with high heat dissipation capability and surface temperature uniformity.

[0006] In addition, it is also necessary to provide a method for preparing the packaged device.

[0007] In addition, it is also necessary to provide an electronic device using the packaging device.

[0008] In a first aspect, the present application provides a packaging device, comprising a circuit board, a heat-conducting block, and an electronic component. The circuit board comprises a first surface and a second surface arranged opposite to each other in a first direction, and the circuit board is provided with a through groove running through the first surface and the second surface. The heat-conducting block is fixed to the circuit board and is at least partially located in the through groove. The heat-conducting block comprises a third surface and a fourth surface arranged opposite to each other in the first direction, and the third surface is exposed from the opening of the through groove on the first surface. The electronic component is fixed to the third surface. The electronic component comprises a central area and an edge area arranged around the central area, and the third surface overlaps with the central area when viewed from the first direction.

[0009] Based on the first aspect, in some possible implementations, the packaging device further includes a first adhesive layer provided between the electronic component and the third surface, and the first adhesive layer is used to adhere the electronic component to the third surface.

[0010] Based on the first aspect, in some possible implementations, the first adhesive layer includes thermally conductive adhesive.

[0011] Based on the first aspect, in some possible implementations, the third surface is flush with the first surface, the first surface includes a first area arranged around the through slot, and the electronic component is also fixed to the first area.

[0012] Based on the first aspect, in some possible implementations, the heat conducting block includes a first heat conducting portion and a second heat conducting portion connected to each other, wherein in a second direction perpendicular to the first direction, the width of the second heat conducting portion is greater than the width of the first heat conducting portion. The first heat conducting portion is disposed within the through-slot, and a surface of the first heat conducting portion facing away from the second heat conducting portion is the third surface. The second heat conducting portion is protruding from the second surface, and a surface of the second heat conducting portion facing away from the first heat conducting portion is the fourth surface.

[0013] Based on the first aspect, in some possible implementations, the packaged device further includes a second adhesive layer provided between the second heat conducting portion and the second surface, and the second adhesive layer is used to bond the second heat conducting portion and the second surface.

[0014] Based on the first aspect, in some possible implementations, the circuit board includes a second circuit substrate, a first circuit substrate, and a third circuit substrate stacked in sequence in the first direction, the surface of the second circuit substrate facing away from the first circuit substrate being the first surface, and the surface of the third circuit substrate facing away from the first circuit substrate being the second surface. The first circuit substrate is provided with a first groove, the second circuit substrate is provided with a plurality of second grooves communicating with the first groove, and the third circuit substrate is provided with a plurality of third grooves communicating with the first groove, the first groove, the plurality of second grooves, and the plurality of third grooves collectively forming the through groove. The heat conductive block includes a third heat conductive portion disposed in the first groove, a plurality of fourth heat conductive portions disposed in the plurality of second grooves, and a plurality of fifth heat conductive portions disposed in the plurality of third grooves, the surfaces of the plurality of fourth heat conductive portions facing away from the third heat conductive portion being the third surface, and the surfaces of the plurality of fifth heat conductive portions facing away from the third heat conductive portion being the fourth surface.

[0015] Based on the first aspect, in some possible implementations, the circuit board further includes a first electrical connection portion provided on the first surface, and the electronic component includes a second electrical connection portion, and the second electrical connection portion is electrically connected to the first electrical connection portion through a wire.

[0016] Based on the first aspect, in some possible implementations, the packaging device further includes a packaging body, which packages the wire therein.

[0017] Based on the first aspect, in some possible implementations, an area of ​​the third surface accounts for 70% to 80% of the total area of ​​the central area and the edge area of ​​the electronic component.

[0018] A second aspect of the present application provides a method for preparing a packaged device, characterized in that it includes the following steps: arranging a heat-conducting block in a circuit board, the circuit board including a first surface and a second surface arranged opposite to each other in a first direction, the circuit board having a through groove running through the first surface and the second surface, the heat-conducting block being at least partially located in the through groove, the heat-conducting block including a third surface and a fourth surface arranged opposite to each other in the first direction, the third surface being exposed from an opening of the through groove on the first surface; fixing an electronic component on the third surface, and electrically connecting the electronic component to the circuit board, the electronic component including a central area and an edge area arranged around the central area, and the third surface overlapping with the central area when viewed from the first direction.

[0019] Based on the second aspect, in some possible implementations, the thermally conductive block includes a first thermally conductive portion and a second thermally conductive portion connected to each other, wherein the width of the second thermally conductive portion is greater than the width of the first thermally conductive portion in a second direction perpendicular to the first direction. Installing the thermally conductive block within the circuit board specifically includes placing the first thermally conductive portion of the thermally conductive block within the through-slot and securing the second thermally conductive portion to the second surface.

[0020] Based on the second aspect, in some possible implementations, the second heat conducting portion is fixed to the second surface via a second adhesive layer.

[0021] Based on the second aspect, in some possible implementations, the circuit board includes a second circuit substrate, a first circuit substrate, and a third circuit substrate stacked in sequence, and the heat-conducting block includes a third heat-conducting portion. Arranging the heat-conducting block in the circuit board specifically includes: opening a first groove in the first circuit substrate and placing the third heat-conducting portion in the first groove; opening a plurality of second grooves in the second circuit substrate, forming a plurality of fourth heat-conducting portions in the plurality of second grooves; opening a plurality of third grooves in the third circuit substrate, forming a plurality of fifth heat-conducting portions in the plurality of third grooves; and pressing the second circuit substrate, the first circuit substrate, and the third circuit substrate together so that the first groove is connected to the plurality of second grooves and the plurality of third grooves to form the through groove, and the third heat-conducting portion is in contact with the plurality of fourth heat-conducting portions and the plurality of fifth heat-conducting portions to form the heat-conducting block.

[0022] Based on the second aspect, in some possible implementations, the fourth heat conducting portion and the fifth heat conducting portion are formed by electroplating or chemical plating.

[0023] Based on the second aspect, in some possible implementations, before pressing the second circuit substrate, the first circuit substrate, and the third circuit substrate together, the preparation method further includes: polishing the surface of at least one of the fourth heat conducting part and the fifth heat conducting part.

[0024] Based on the second aspect, in some possible implementations, the electronic components are mounted using chip-on-board packaging technology.

[0025] In a third aspect, the present application provides an electronic device comprising a housing and a packaging device located within the housing, wherein the packaging device is the packaging device described above, or is a packaging device manufactured by the packaging device manufacturing method described above.

[0026] In this application, due to the thermal conductivity of the heat-conducting block, heat generated by the electronic component can be dissipated through the heat-conducting block, thereby improving the heat dissipation performance of the packaged device. Furthermore, because the third surface overlaps with the central region when viewed from the first direction, the heat dissipation rate in the central region of the electronic component is greater than that in the edge regions, thereby improving the uniformity of the surface temperature of the electronic component. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] FIG1 is a top view of a packaging device provided in accordance with an embodiment of the present application.

[0028] FIG. 2 is a cross-sectional view of the packaged device shown in FIG. 1 along the cutting line II-II in some embodiments.

[0029] FIG. 3 is a cross-sectional view of the packaged device shown in FIG. 1 along the cutting line II-II in some other embodiments.

[0030] FIG4 is a flow chart of a method for preparing a packaged device according to an embodiment of the present application.

[0031] FIG5 is a schematic structural diagram of an electronic device provided in one embodiment of the present application.

[0032] Description of Main Component Symbols Electronic device 1 Circuit board 10 First surface 10a First area 10a1 First electrical connection portion 10a2 Second surface 10b First circuit substrate 11 Second circuit substrate 12 Third circuit substrate 13 Electronic component 20 Central area 21 Edge area 22 Second electrical connection portion 23 Heat conducting block 30 Third surface 30a Fourth surface 30b First heat conducting portion 31 Second heat conducting portion 32 Third heat conducting portion 33 Fourth heat conducting portion 34 Fifth heat conducting portion 35 Wire 40 First adhesive layer 50 Second adhesive layer 60 Package body 70 Package device 100 Housing 101 First slot 110 Second slot 120 Third slot 130 Through slot G First direction X Second direction Y

[0033] The following specific implementation methods will further illustrate the present application in conjunction with the above-mentioned drawings. DETAILED DESCRIPTION

[0034] In order to more clearly understand the above-mentioned objects, features and advantages of the present application, the present application is described in detail below in conjunction with the accompanying drawings and specific embodiments. It should be noted that, in the absence of conflict, the embodiments of the present application and the features in the embodiments can be combined with each other. In the following description, many specific details are set forth to facilitate a full understanding of the present application. The embodiments described are only a part of the embodiments of the present application, rather than all of the embodiments.

[0035] It should be noted that when a component is referred to as being "fixed to" or "mounted on" another component, it may be directly on the other component or there may be a central component. When a component is referred to as being "disposed on" another component, it may be directly on the other component or there may be a central component. As used herein, the term "and / or" includes all and any combinations of one or more of the relevant listed items.

[0036] It should be noted that, although a logical order is shown in the flowchart, in some cases, the steps shown or described may be performed in an order different from that in the flowchart. The method disclosed in the embodiments of the present application includes one or more steps or actions for implementing the method. The method steps and / or actions may be interchangeable with each other without departing from the scope of the claims. Unless a specific order of steps or actions is specified, the order and / or use of specific steps and / or actions may be modified without departing from the scope of the claims.

[0037] 1 and 2 , an embodiment of the present application provides a packaging device 100 , including a circuit board 10 , an electronic component 20 , and a heat conducting block 30 .

[0038] The circuit board 10 includes a first surface 10a and a second surface 10b opposite to each other in a first direction X. The circuit board 10 defines a through slot G penetrating the first surface 10a and the second surface 10b. The through slot G can avoid conductive traces (not shown) of the circuit board 10 .

[0039] The thermally conductive block 30 is at least partially located within the through groove G. The thermally conductive block 30 includes a third surface 30a and a fourth surface 30b disposed opposite each other in the first direction X. The third surface 30a is exposed through an opening of the through groove G on the first surface 10a. The thermally conductive block 30 is made of a material with excellent thermal conductivity. In some embodiments, the material of the thermally conductive block 30 includes at least one metal such as copper, aluminum, nickel, iron, titanium, or an alloy thereof.

[0040] The electronic component 20 is fixedly mounted on the third surface 30a, and the thermally conductive block 30 serves to support the electronic component 20. The electronic component 20 is electrically connected to the circuit board 10. The electronic component 20 includes a central region 21 and an edge region 22 disposed around the central region 21. When viewed from the first direction X, the third surface 30a overlaps the central region 21. That is, the orthogonal projection of the third surface 30a on the electronic component 20 overlaps with the central region 21. The third surface 30a may be in direct or indirect contact with the central region 21. The shapes of the central region 21 and the edge region 22 depend on the shape of the electronic component 20. For example, if the electronic component 20 is square, the central region 21 is square and the edge region 22 is box-shaped; if the electronic component 20 is circular, the central region 21 is circular and the edge region 22 is annular. In some embodiments, the first surface 10a includes a first region 10a1 disposed around the through-slot G, and the circuit board 10 further includes a first electrical connection portion 10a2 disposed on the first region 10a1. The electronic component 20 includes a second electrical connection portion 23, which may be located in the edge region 22 of the electronic component 20. The second electrical connection portion 23 is electrically connected to the first electrical connection portion 10a2 via a wire 40, thereby electrically connecting the electronic component 20 to the circuit board 10. Thus, the electronic component 20 can transmit electrical signals to an external device (not shown) via the circuit board 10. The first electrical connection portion 10a2 may be a gold finger of the circuit board 10, and the second electrical connection portion 23 may be a pin or electrode of the electronic component 20. The material of the wire 40 may be at least one metal such as gold, aluminum, copper, or an alloy thereof. The electronic component 20 may be an active device, such as an active chip, including but not limited to a biosensor chip, a power chip, a digital chip, a radio frequency chip, etc. The electronic component 20 may also be a passive device, such as a resistor, a capacitor, an inductor, a filter, a coupler, etc.

[0041] During the operation of the packaged device 100, the electronic component 20 generates heat. In the present application, since the heat-conducting block 30 has thermal conductivity, the above-mentioned heat can be dissipated through the heat-conducting block 30, which is beneficial to improving the heat dissipation performance of the packaged device 100. Moreover, since the central area 21 of the electronic component 20 is more prone to heat accumulation, the present application sets the third surface 30a to overlap with the central area 21 when observed from the first direction X. Therefore, the heat dissipation rate of the central area 21 of the electronic component 20 is greater than the heat dissipation rate of the edge area 22, thereby improving the uniformity of the surface temperature of the electronic component 20 (temperature difference <1°C). Therefore, the present application can adopt large electronic components (such as chips with a length and width greater than 10mm). Through thermal simulation verification, the third surface 30a of the heat-conducting block 30 of the present application only overlaps with the central area 21. Compared with using a heat-conducting block with the same area as the chip, the surface temperature difference of the chip of the present application is reduced from 1.7°C to 0.8°C, meeting the requirements of chip temperature uniformity.

[0042] In some embodiments, the area of ​​the third surface 30a accounts for 70% to 80% of the total area of ​​the central region 21 and the edge region 22 of the electronic component 20, thereby achieving better temperature uniformity. For example, the area of ​​the third surface 30a can account for 70%, 72%, 74%, 76%, 78%, 80% of the total area, or any value within a range between any two of the foregoing values. Alternatively, the area of ​​the third surface 30a can account for 76% of the total area, thereby further improving temperature uniformity.

[0043] In some embodiments, a first adhesive layer 50 is provided between the electronic component 20 and the third surface 30a. The first adhesive layer 50 is used to adhere the electronic component 20 to the third surface 30a. Furthermore, the first adhesive layer 50 includes a thermally conductive adhesive. In addition to the bonding function, the first adhesive layer 50 can also quickly conduct heat generated by the electronic component 20 to the thermal block 30. The thermally conductive adhesive can specifically be silver adhesive, such as epoxy resin silver adhesive or sintered silver adhesive. Optionally, the thermally conductive adhesive uses sintered silver adhesive with high thermal conductivity. The thermally conductive adhesive is made by bonding silver powder particles to a resin substrate through a high-temperature sintering process, and the thermal conductivity is generally greater than 100 W / (mK).

[0044] In some embodiments, the third surface 30a is substantially flush with the first surface 10a, and the electronic component 20 is fixedly mounted on the first area 10a1 of the first surface 10a and the third surface 30a, that is, the circuit board 10 and the heat-conducting block 30 jointly serve to support the electronic component 20. By setting the third surface 30a and the first surface 10a to be substantially flush, the flatness of the installation interface when the electronic component 20 is installed can be improved. In this case, the first adhesive layer 50 can be simultaneously provided on the first area 10a1 of the first surface 10a and the third surface 30a. In other embodiments, the heat-conducting block 30 can protrude from the first surface 10a, so that the third surface 30a is higher than the first surface 10a, and the electronic component 20 is fixedly mounted on the third surface 30a. In this case, the first adhesive layer 50 can be provided only on the third surface 30a.

[0045] In some embodiments, the heat-conducting block 30 includes a first heat-conducting portion 31 and a second heat-conducting portion 32 connected to each other. In a second direction Y perpendicular to the first direction X, the width of the second heat-conducting portion 32 is greater than the width of the first heat-conducting portion 31. For example, the heat-conducting block 30 may be roughly T-shaped. The first heat-conducting portion 31 is disposed in the through groove G and may contact the inner wall of the through groove G. The surface of the first heat-conducting portion 31 facing away from the second heat-conducting portion 32 is the third surface 30a. The second heat-conducting portion 32 is protruding from the second surface 10b, and the surface of the second heat-conducting portion 32 facing away from the first heat-conducting portion 31 is the fourth surface 30b. During operation, the heat generated by the electronic component 20 can first be conducted to the first heat-conducting portion 31, and then further conducted to the second heat-conducting portion 32 and dissipated outward. Since the second heat-conducting portion 32 is wider, the heat dissipation area of ​​the heat-conducting block 30 can be increased, thereby further improving the heat dissipation efficiency.

[0046] Furthermore, a second adhesive layer 60 may be provided between the second heat conducting portion 32 and the second surface 10b. The second adhesive layer 60 is used to bond the second heat conducting portion 32 and the second surface 10b, thereby securing the thermally conductive block 30 to the circuit board 10. The second adhesive layer 60 may be made of at least one of epoxy resin glue, polyurethane glue, and polyacrylic glue. In other embodiments, the thermally conductive block 30 may be secured to the circuit board 10 by fastening.

[0047] As shown in FIG3 , in other embodiments, the second adhesive layer 60 may be omitted. The circuit board 10 includes a first circuit substrate 11, a second circuit substrate 12, and a third circuit substrate 13. The first circuit substrate 11 is disposed between the second circuit substrate 12 and the third circuit substrate 13 in a first direction X. The surface of the second circuit substrate 12 facing away from the first circuit substrate 11 is a first surface 10a, and the surface of the third circuit substrate 13 facing away from the second circuit substrate 12 is a second surface 10b. The first circuit substrate 11 is provided with a first groove 110, the second circuit substrate 12 is provided with a plurality of second grooves 120 communicating with the first groove 110, and the third circuit substrate 13 is provided with a plurality of third grooves 130 communicating with the first groove 110. The first groove 110, the plurality of second grooves 120, and the plurality of third grooves 130 collectively form the aforementioned through groove G.

[0048] The heat conducting block 30 includes a third heat conducting portion 33, multiple fourth heat conducting portions 34, and multiple fifth heat conducting portions 35. The third heat conducting portion 33 is disposed within the first slot 110 and may contact the inner wall of the first slot 110. The multiple fourth heat conducting portions 34 are disposed within the multiple second slots 120 and in contact with the third heat conducting portion 33. The surfaces of the multiple fourth heat conducting portions 34 facing away from the third heat conducting portion 33 are third surfaces 30a. The multiple fifth heat conducting portions 35 are disposed within the multiple third slots 130 and in contact with the third heat conducting portion 33. The surfaces of the multiple fifth heat conducting portions 35 facing away from the third heat conducting portion 33 are fourth surfaces 30b. During operation, heat generated by the electronic component 20 is first transferred to the multiple fourth heat conducting portions 34, then further to the third heat conducting portion 33, and then further to the multiple fifth heat conducting portions 35 for dissipation. The arrangement of the second circuit substrate 12 and the third circuit substrate 13 allows the heat conducting block 30 to be supported and fixed within the circuit board 10. The materials of the third heat conducting part 33 , the fourth heat conducting part 34 and the fifth heat conducting part 35 may be the same or different.

[0049] As shown in Figures 2 and 3, in some embodiments, the packaged device 100 further includes a package body 70. The package body 70 encapsulates the wire 40, the first electrical connection portion 10a2, and the second electrical connection portion 23, thereby protecting the wire 40 from mechanical stress and other factors. The central region 21 of the electronic component 20 is exposed to the package body 70. The package body 70 can be made of an insulating resin, such as at least one of epoxy resin, polyphenylene ether, polyimide, polyethylene terephthalate, and polyethylene naphthalate.

[0050] One embodiment of the present application also provides a method for preparing the packaged device 100. FIG4 is a flow chart of the method for preparing the packaged device 100 provided in the present application. The order of the steps of the method may be changed according to different requirements, and some steps may be omitted or combined. The method comprises the following steps:

[0051] Step S1: A thermally conductive block 30 is disposed within the circuit board 10. The circuit board 10 includes a first surface 10a and a second surface 10b disposed opposite each other in a first direction X. A through-slot G is defined in the circuit board 10, extending through the first and second surfaces 10a, 10b. The thermally conductive block 30 is at least partially disposed within the through-slot G. The thermally conductive block 30 includes a third surface 30a and a fourth surface 30b disposed opposite each other in the first direction X. The third surface 30a is exposed through an opening of the through-slot G on the first surface 10a.

[0052] As shown in FIG2 , in some embodiments, the heat conducting block 30 includes a first heat conducting portion 31 and a second heat conducting portion 32 connected to each other. In the second direction Y, the width of the second heat conducting portion 32 is greater than the width of the first heat conducting portion 31. For example, the heat conducting block 30 may be substantially T-shaped. The heat conducting block 30 may be disposed in the following manner: the first heat conducting portion 31 of the heat conducting block 30 is placed within the through groove G, and the second heat conducting portion 32 is secured to the second surface 10 b via the second adhesive layer 60.

[0053] In these embodiments, the through groove G can be formed by laser drilling or mechanical drilling.

[0054] As shown in FIG3 , in some other embodiments, the heat conducting block 30 may be provided in the following manner: providing a first circuit substrate 11, a second circuit substrate 12, and a third circuit substrate 13; defining a first groove 110 in the first circuit substrate 11; and disposing the third heat conducting portion 33 in the first groove 110; then defining a plurality of second grooves 120 in the second circuit substrate 12, and forming a plurality of fourth heat conducting portions 34 in the plurality of second grooves 120; then defining a plurality of third grooves 130 in the third circuit substrate 13, and forming a plurality of fifth heat conducting portions 35 in the plurality of third grooves 130; and pressing the second circuit substrate 12, the first circuit substrate 11, and the third circuit substrate 13 together (e.g., by pressing together with an adhesive layer), such that the first circuit substrate 11 is disposed between the second circuit substrate 12 and the third circuit substrate 13 in the first direction X. The plurality of second grooves 120 communicate with one side of the first groove 110, and the plurality of third grooves 130 communicate with the other side of the first groove 110. The first groove 110, the plurality of second grooves 120, and the plurality of third grooves 130 collectively form the aforementioned through groove G. Furthermore, the plurality of fourth heat conducting portions 34 contact one side of the third heat conducting portion 33, and the plurality of fifth heat conducting portions 35 contact the other side of the third heat conducting portion 33. The third heat conducting portion 33, the plurality of fourth heat conducting portions 34, and the plurality of fifth heat conducting portions 35 collectively form the heat conducting block 30. Furthermore, in some embodiments, before the second circuit substrate 12, the first circuit substrate 11, and the third circuit substrate 13 are pressed together, the surfaces of the plurality of fourth heat conducting portions 34 and / or the surfaces of the plurality of fifth heat conducting portions 35 may be polished to improve their surface flatness. This facilitates full contact between the third heat conducting portion 33, the fourth heat conducting portion 34, and / or the fifth heat conducting portion 35 after pressing together, facilitating heat conduction.

[0055] In these embodiments, the first groove 110 can be formed by laser drilling or mechanical drilling, and the second groove 120 can be formed by laser drilling or exposure and development, etc. The fourth heat conducting portion 34 and the fifth heat conducting portion 35 can be formed by electroplating or chemical plating.

[0056] Step S2: The electronic component 20 is fixedly mounted on the third surface 30a and electrically connected to the circuit board 10. The electronic component 20 includes a central region 21 and an edge region 22 disposed around the central region 21. When viewed from the first direction X, the third surface 30a overlaps with the central region 21.

[0057] In some embodiments, the electronic component 20 may be mounted using chip on board (COB) packaging technology.

[0058] Referring to Figure 5 , one embodiment of the present application further provides an electronic device 1 comprising a housing 101 and the aforementioned packaged device 100 located within the housing. The electronic device 1 may be a sequencing device, or a terminal device such as a mobile phone, television, monitor, tablet computer, or vehicle-mounted computer, or a smart display wearable device such as a smartwatch or smart bracelet, or a communication device such as a server, storage device, or base station, or a smart car, etc. The embodiments of this application do not impose any particular restrictions on the specific form of the electronic devices described above.

[0059] In the present application, since the heat conductive block 30 has thermal conductivity, the heat generated by the electronic component 20 during operation can be dissipated through the heat conductive block 30, thereby improving the heat dissipation performance of the packaged device 100. Furthermore, since the central region 21 of the electronic component 20 is more prone to heat accumulation, the present application arranges that the third surface 30a overlaps with the central region 21 when viewed from the first direction X. As a result, the heat dissipation rate of the central region 21 of the electronic component 20 is greater than the heat dissipation rate of the edge region 22, thereby improving the uniformity of the surface temperature of the electronic component 20.

[0060] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present application and are not intended to limit the present application. Although the present application has been described in detail with reference to the preferred embodiments, those skilled in the art should understand that the technical solutions of the present application may be modified or replaced by equivalents without departing from the spirit and scope of the technical solutions of the present application.

Claims

1. A packaging device, characterized in that: include: The circuit board comprises a first surface and a second surface arranged opposite to each other in a first direction, wherein the circuit board is provided with a through slot penetrating the first surface and the second surface; a heat-conducting block fixed to the circuit board and at least partially located in the through slot, the heat-conducting block comprising a third surface and a fourth surface arranged opposite to each other in the first direction, the third surface being exposed from an opening of the through slot on the first surface; as well as An electronic component is fixed on the third surface, wherein the electronic component includes a central area and an edge area arranged around the central area, and when viewed from the first direction, the third surface overlaps with the central area.

2. The packaged device according to claim 1, characterized in that: It also includes a first adhesive layer disposed between the electronic component and the third surface, wherein the first adhesive layer is used to adhere the electronic component to the third surface.

3. The packaged device according to claim 2, characterized in that: The first adhesive layer includes thermally conductive adhesive.

4. The packaged device according to claim 1, characterized in that: The third surface is flush with the first surface, the first surface includes a first area arranged around the through slot, and the electronic component is also fixed to the first area.

5. The packaged device according to claim 1, characterized in that: The heat-conducting block includes a first heat-conducting portion and a second heat-conducting portion connected to each other. In a second direction perpendicular to the first direction, the width of the second heat-conducting portion is greater than the width of the first heat-conducting portion. The first heat-conducting portion is arranged in the through groove, and the surface of the first heat-conducting portion facing away from the second heat-conducting portion is the third surface. The second heat-conducting portion is convexly arranged on the second surface, and the surface of the second heat-conducting portion facing away from the first heat-conducting portion is the fourth surface.

6. The packaged device according to claim 5, characterized in that: It also includes a second adhesive layer disposed between the second heat conducting part and the second surface, wherein the second adhesive layer is used for bonding the second heat conducting part and the second surface.

7. The packaged device according to claim 1, characterized in that: The circuit board comprises a second circuit substrate, a first circuit substrate and a third circuit substrate stacked in sequence in the first direction, the surface of the second circuit substrate facing away from the first circuit substrate is the first surface, and the surface of the third circuit substrate facing away from the first circuit substrate is the second surface; the first circuit substrate is provided with a first groove, the second circuit substrate is provided with a plurality of second grooves connected to the first groove, the third circuit substrate is provided with a plurality of third grooves connected to the first groove, and the first groove, the plurality of the second grooves and the plurality of the third grooves together form the through groove; The heat-conducting block includes a third heat-conducting portion arranged in the first groove, a plurality of fourth heat-conducting portions arranged in a plurality of the second grooves, and a plurality of fifth heat-conducting portions arranged in a plurality of the third grooves, the surfaces of the plurality of fourth heat-conducting portions facing away from the third heat-conducting portions being the third surfaces, and the surfaces of the plurality of fifth heat-conducting portions facing away from the third heat-conducting portions being the fourth surfaces.

8. The packaged device according to claim 1, characterized in that: The circuit board further includes a first electrical connection portion disposed on the first surface, and the electronic component includes a second electrical connection portion, which is electrically connected to the first electrical connection portion through a wire.

9. The packaged device according to claim 8, characterized in that: A packaging body is also included, wherein the packaging body packages the wire therein.

10. The packaged device according to claim 1, characterized in that: The area of ​​the third surface accounts for 70% to 80% of the total area of ​​the central area and the edge area of ​​the electronic component.

11. A method for preparing a packaged device, characterized in that: The steps include: A heat conducting block is arranged in the circuit board, the circuit board comprises a first surface and a second surface arranged opposite to each other in a first direction, the circuit board is provided with a through slot penetrating the first surface and the second surface, the heat conducting block is at least partially located in the through slot, the heat conducting block comprises a third surface and a fourth surface arranged opposite to each other in the first direction, the third surface is exposed from an opening of the through slot on the first surface; as well as An electronic component is fixedly mounted on the third surface and electrically connected to the circuit board. The electronic component includes a central area and an edge area arranged around the central area. When viewed from the first direction, the third surface overlaps with the central area.

12. The method for preparing a packaged device according to claim 11, characterized in that: The heat conducting block includes a first heat conducting portion and a second heat conducting portion connected to each other, and in a second direction perpendicular to the first direction, a width of the second heat conducting portion is greater than a width of the first heat conducting portion. Arranging the heat conducting block in the circuit board specifically includes: The first heat conducting portion of the heat conducting block is placed in the through groove, and the second heat conducting portion is fixed to the second surface.

13. The method for preparing a packaged device according to claim 12, characterized in that: The second heat conducting portion is fixed to the second surface through a second adhesive layer.

14. The method for preparing a packaged device according to claim 11, characterized in that: The circuit board includes a second circuit substrate, a first circuit substrate and a third circuit substrate stacked in sequence, the heat conducting block includes a third heat conducting portion, and the heat conducting block is arranged in the circuit board specifically including: A first groove is formed in the first circuit substrate, and the third heat conducting part is disposed in the first groove; A plurality of second grooves are provided in the second circuit substrate, a plurality of fourth heat conducting parts are formed in the plurality of second grooves, a plurality of third grooves are provided in the third circuit substrate, a plurality of fifth heat conducting parts are formed in the plurality of third grooves; and The second circuit substrate, the first circuit substrate and the third circuit substrate are pressed together so that the first groove is respectively connected with the plurality of the second grooves and the plurality of the third grooves to jointly form the through groove, and the third heat conducting portion is respectively in contact with the plurality of the fourth heat conducting portions and the plurality of the fifth heat conducting portions to jointly form the heat conducting block.

15. The method for preparing a packaged device according to claim 14, characterized in that: The fourth heat conducting portion and the fifth heat conducting portion are formed by electroplating or chemical plating.

16. The method for preparing a packaged device according to claim 15, characterized in that: Before laminating the second circuit substrate, the first circuit substrate and the third circuit substrate, the preparation method further includes: A surface of at least one of the fourth heat conducting portion and the fifth heat conducting portion is polished.

17. The method for preparing a packaged device according to claim 11, characterized in that: The electronic components are mounted by chip-on-board packaging technology.

18. An electronic device, comprising a housing and a packaging device located in the housing, characterized in that: The packaging device is the packaging device according to any one of claims 1 to 10, or is a packaging device manufactured by the method for manufacturing a packaging device according to any one of claims 11 to 17.

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