Display module and display device

Abstract

A display module (100) and a display device (1000). The display module (100) comprises a display panel (10) and a supporting pad (20). The display panel (10) comprises a body portion (11), a binding portion (13), and a bending portion (12) located between the body portion (11) and the binding portion (13). The bending portion (12) is bent along a bending axis extending in a first direction (X) towards a non-display side (11B) of the body portion (11), so that the binding portion (13) is bent to the non-display side (11B) of the body portion (11). The supporting pad (20) is located between the body portion (11) and the binding portion (13); the supporting pad (20) comprises a first sub-portion (21) and a second sub-portion (22); along the first direction (X), the second sub-portion (22) is located on at least one side of the first sub-portion (21); and two ends of the first sub-portion (21) are flush with two ends of the supporting pad (20). The first sub-portion (21) is configured such that there is no adhesive force between the first sub-portion (21) and an adhesion jig when the first sub-portion (21) is separated from the adhesion jig.

Description

Display module and display device

[0001] This application claims priority to Chinese patent application No. 202311424650.4, filed on October 30, 2023, the entire contents of which are incorporated by reference into this application. Technical Field

[0002] The present disclosure relates to the field of display technology, and in particular to a display module and a display device. Background Art

[0003] Organic light-emitting diodes (OLEDs) have been widely used in the display field due to their advantages, including self-luminescence, low driving voltage, high luminous efficiency, fast response speed, and flexible display. With the rapid development of display technology, display technologies such as liquid crystal displays (LCDs), organic light-emitting displays (OLEDs), quantum dot light-emitting displays (QLEDs), and mini / micro light-emitting displays (MLEDs) have become widely integrated into people's daily lives. For example, they are now commonplace in smartphones, wearable watches, televisions, laptops, and in-car displays.

[0004] Summary of the Invention

[0005] On the one hand, a display module is provided. The display module includes a display panel and a support pad. The display panel includes a main body, a binding part, and a bending part located between the main body and the binding part. The main body has a display side and a non-display side that are relatively arranged, and the bending part is bent along a bending axis extending in a first direction toward the non-display side of the main body so that the binding part is bent to the non-display side of the main body. The support pad is located between the main body and the binding part; the support pad includes a first sub-part and a second sub-part along the first direction, the second sub-part is located on at least one side of the first sub-part, and the two ends of the first sub-part are flush with the two ends of the support pad. Wherein, the first sub-part is configured so that when separated from the adsorption jig, there is no adhesive force between the first sub-part and the adsorption jig.

[0006] In some embodiments, the support pad includes a first support layer, a support portion, and a first adhesive layer. Along the first direction, the ends of the first support layer extend beyond the ends of the binding portion. A receiving groove is provided on the surface of the first support layer near the binding portion; the orthographic projection of the receiving groove on the main body is within the range of the orthographic projection of the binding portion on the main body. The support portion is located within the receiving groove; the first support layer and the binding portion are connected via the support portion. The first adhesive layer is located on the side of the first support layer away from the binding portion and overlaps with the first support layer.

[0007] In some embodiments, the support portion includes a second adhesive layer, a second supporting layer, and a third adhesive layer. The second supporting layer is located on a side of the second adhesive layer away from the binding portion. The third adhesive layer is located on a side of the second supporting layer away from the binding portion.

[0008] In some embodiments, a surface of the supporting portion close to the binding portion is flush with a surface of the first supporting layer close to the binding portion.

[0009] In some embodiments, a space is provided between a boundary of an orthographic projection of the support portion on the main body and an outer boundary of an orthographic projection of the receiving groove on the main body.

[0010] In some embodiments, along the first direction, a distance between a boundary of an orthographic projection of the binding portion on the main body and an outer boundary of an orthographic projection of the receiving groove on the main body is 1.7 mm to 2.9 mm.

[0011] In some embodiments, the support pad includes a first support layer, a fourth adhesive layer, and the first adhesive layer. Along the first direction, both ends of the first support layer extend beyond both ends of the binding portion. The fourth adhesive layer is located on a side of the first support layer close to the binding portion and overlaps with the first support layer. The first adhesive layer is located on a side of the first support layer away from the binding portion and overlaps with the first support layer.

[0012] In some embodiments, the fourth adhesive layer is made of a UV-curable adhesive layer.

[0013] In some embodiments, along the first direction, a distance between a boundary of an orthographic projection of the first supporting layer on the main body and a boundary of an orthographic projection of the binding portion on the main body is 150 μm to 250 μm.

[0014] In another aspect, a display device is provided. The display device comprises: a display module as described in any of the above embodiments and a middle frame. The middle frame comprises a bottom plate and a frame disposed around the bottom plate. The bottom plate is disposed on a side of the binding portion of the display module away from the main body, and the frame is disposed around the periphery of the display panel.

[0015] In some embodiments, the display device includes a first fixing portion and a second fixing portion. The first fixing portion covers a side of the bent portion away from the frame and extends to the main body and the binding portion. The second fixing portion covers a side of the bent portion closer to the frame and extends to the main body and the binding portion. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] To more clearly illustrate the technical solutions of the present disclosure, the following briefly introduces the drawings required for use in some embodiments of the present disclosure. Obviously, the drawings described below are only drawings of some embodiments of the present disclosure, and those skilled in the art can also derive other drawings based on these drawings. Furthermore, the drawings described below are schematic diagrams and are not intended to limit the actual dimensions of the products, actual processes of the methods, actual timing of signals, and the like involved in the embodiments of the present disclosure.

[0017] FIG1 is a structural diagram of a display device according to some embodiments;

[0018] FIG2 is a structural diagram of a display device in a flat state according to some embodiments;

[0019] FIG3 is a cross-sectional view along section line AA in FIG1 ;

[0020] FIG4 is a structural diagram of a display panel according to some embodiments;

[0021] FIG5 is another cross-sectional view along section line AA in FIG1 ;

[0022] FIG6 is a structural diagram of a display module according to some embodiments;

[0023] FIG7 is a cross-sectional view along section line BB in FIG1 ;

[0024] FIG8 is another cross-sectional view along section line BB in FIG1 ;

[0025] FIG9 is another cross-sectional view along section line BB in FIG1 ;

[0026] FIG. 10 is a block diagram illustrating the positions of a circuit board and a binding portion according to some embodiments. DETAILED DESCRIPTION

[0027] The following will be combined with the accompanying drawings to clearly and completely describe the technical solutions in some embodiments of the present disclosure. Obviously, the embodiments described are only some embodiments of the present disclosure, not all embodiments. Based on the embodiments provided by the present disclosure, all other embodiments obtained by ordinary technicians in this field are within the scope of protection of the present disclosure.

[0028] Unless the context requires otherwise, throughout the specification and claims, the term "comprise" and its other forms, such as the third person singular form "comprises" and the present participle form "comprising", are to be interpreted as open and inclusive, that is, "including, but not limited to". In the description of the specification, the terms "one embodiment", "some embodiments", "exemplary embodiments", "example", "specific example" or "some examples" are intended to indicate that the particular features, structures, materials or characteristics associated with the embodiment or example are included in at least one embodiment or example of the present disclosure. The schematic representation of the above terms does not necessarily refer to the same embodiment or example. In addition, the particular features, structures, materials or characteristics may be included in any one or more embodiments or examples in any appropriate manner.

[0029] In the following, the terms "first" and "second" are used for descriptive purposes only and should not be understood to indicate or imply relative importance or implicitly specify the number of the technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of the embodiments of the present disclosure, unless otherwise specified, "plurality" means two or more.

[0030] When describing some embodiments, the expressions "coupled" and "connected" and their derivatives may be used. The term "connected" should be understood in a broad sense. For example, "connection" can be a fixed connection, a detachable connection, or an integral connection; it can be directly connected or indirectly connected through an intermediate medium. The term "coupled" indicates, for example, that two or more components are in direct physical or electrical contact. The term "coupled" or "communicatively coupled" may also refer to two or more components that are not in direct contact with each other, but still cooperate or interact with each other. The embodiments disclosed herein are not necessarily limited to the contents of this document.

[0031] “At least one of A, B and C” has the same meaning as “at least one of A, B or C” and both include the following combinations of A, B and C: A only, B only, C only, the combination of A and B, the combination of A and C, the combination of B and C, and the combination of A, B and C.

[0032] “A and / or B” includes the following three combinations: A only, B only, and a combination of A and B.

[0033] As used herein, the term "if" is optionally interpreted to mean "when" or "upon" or "in response to determining" or "in response to detecting," depending on the context. Similarly, the phrases "if it is determined that" or "if [stated condition or event] is detected" are optionally interpreted to mean "upon determining" or "in response to determining" or "upon detecting [stated condition or event]" or "in response to detecting [stated condition or event]," depending on the context.

[0034] The use of "adapted to" or "configured to" herein is intended to be open and inclusive language that does not exclude devices adapted or configured to perform additional tasks or steps.

[0035] Additionally, the use of “based on” is meant to be open and inclusive, as a process, step, calculation, or other action “based on” one or more stated conditions or values ​​may, in practice, be based on additional conditions or values ​​beyond those stated.

[0036] As used herein, "about," "substantially," or "approximately" includes the stated value and an average value that is within an acceptable range of deviation from the particular value as determined by one of ordinary skill in the art taking into account the measurements in question and the errors associated with the measurement of the particular quantity (i.e., the limitations of the measurement system).

[0037] As used herein, "parallel", "perpendicular", and "equal" include the situations described and situations similar to the situations described, and the range of the similar situations is within an acceptable deviation range, wherein the acceptable deviation range is as determined by a person of ordinary skill in the art taking into account the measurement in question and the errors associated with the measurement of the specific quantity (i.e., the limitations of the measurement system). For example, "parallel" includes absolute parallelism and approximate parallelism, wherein the acceptable deviation range of approximate parallelism can be, for example, a deviation within 5°; "perpendicular" includes absolute perpendicularity and approximate perpendicularity, wherein the acceptable deviation range of approximate perpendicularity can also be, for example, a deviation within 5°. "Equal" includes absolute equality and approximate equality, wherein the acceptable deviation range of approximate equality can be, for example, that the difference between the two equals is less than or equal to 5% of either one.

[0038] It will be understood that when a layer or element is referred to as being on another layer or substrate, it can be directly on the other layer or substrate, or intervening layers may be present therebetween.

[0039] Exemplary embodiments are described herein with reference to cross-sectional and / or plan views that are idealized exemplary drawings. In the drawings, the thickness of layers and the area of ​​regions are exaggerated for clarity. Therefore, variations in shape relative to the drawings due to, for example, manufacturing techniques and / or tolerances are contemplated. Therefore, the exemplary embodiments should not be construed as limited to the shapes of the regions shown herein, but rather include deviations in shape due to, for example, manufacturing. For example, an etched region shown as a rectangle will typically have curved features. Therefore, the regions shown in the drawings are schematic in nature, and their shapes are not intended to illustrate the actual shape of regions of the device and are not intended to limit the scope of the exemplary embodiments.

[0040] As shown in FIG. 1 , some embodiments of the present disclosure provide a display device 1000 , which may be any device that displays anything, whether in motion (eg, video) or stationary (eg, still image), and whether text or images.

[0041] For example, as shown in FIG1 , the display device 1000 can be any product or component with a display function, such as a television, a laptop computer, a tablet computer, a mobile phone, a personal digital assistant (PDA), a navigator, a vehicle display, a flight display, a wearable device, a virtual reality (VR) device, or the like.

[0042] 2 and 3 , a display device 1000 includes a display module 100 . The display module 100 includes a display panel 10 and a support pad 20 .

[0043] The display panel 10 may be: an organic light emitting diode display panel, a quantum dot light emitting diode display panel, a micro light emitting diode display panel, a liquid crystal display panel, a plasma display panel, a field emission display panel, an electrowetting display panel or an electrophoretic display panel, etc., and the embodiments of the present disclosure do not specifically limit this.

[0044] The following uses the above-mentioned display panel 10 as an organic light-emitting diode display panel as an example to schematically illustrate some embodiments of the present disclosure, but the implementation of the present disclosure is not limited to this, and any other display panel can also be considered as long as the same technical concept is applied.

[0045] In some embodiments, as shown in FIG2 , the display panel 10 includes a main body 11, a bent portion 12, and a binding portion 13, which are sequentially connected. The bent portion 12 is located on one side of the main body 11, and the binding portion 13 is located on a side of the bent portion 12 away from the main body 11, that is, the bent portion 12 is located between the main body 11 and the binding portion 13.

[0046] As shown in FIG3 , the main body 11 may be the portion of the display panel 10 used to display images, that is, the main body 11 includes a display area A. The main body 11 may also include a peripheral area B disposed on at least one side of the display area A. FIG4 illustrates an example in which the peripheral area B surrounds the display area A.

[0047] For example, as shown in FIG4 , the shape of the display area A is roughly any one of a circle, an ellipse, a rectangle, etc., which is not specifically limited in the embodiment of the present disclosure.

[0048] In this article, "substantially circular or elliptical" means that the shape is circular or elliptical as a whole, but is not limited to a standard circular or elliptical shape. That is, the "circular or elliptical" here includes not only a substantially circular or elliptical shape, but also a shape similar to a circular or elliptical shape.

[0049] In this document, "substantially rectangular" means that the overall shape is rectangular, but is not limited to a standard rectangle. That is, "rectangular" here includes not only basic rectangular shapes but also shapes similar to rectangles. For example, if the long and short sides of a rectangle are curved at each intersection (i.e., at the corners), the corners are smooth, resulting in a rounded rectangular shape. The following description uses the example of a display area that is substantially rectangular with rounded corners.

[0050] As shown in FIG2 , the main body 11 has a display side 11A and a non-display side 11B that are disposed opposite each other. It should be noted that the display side 11A refers to the side of the main body 11 that displays images (the upper side of the main body 11 in FIG2 ), and the non-display side 11B refers to the side opposite the display side 11A (the lower side of the main body 11 in FIG2 ).

[0051] As shown in FIG2 , the binding portion 13 may be the portion of the display panel 10 used to bind and connect to the circuit board 30. As shown in FIG3 , through a bending process, the bending portion 12 can be bent along a bending axis extending in the first direction X toward the non-display side 11B of the main body 11 of the display panel 10, bending the binding portion 13 to the non-display side 11B of the main body 11, thereby reducing the bezel of the display device 1000. The bending axis is not an actual structure in the display panel 10; it is merely a concept proposed to illustrate the bending process of the display panel 10.

[0052] As shown in Figure 3 , after the binding portion 13 is bent, the circuit board 30 can be bent along with the display panel 10 to the non-display side 11B of the main body 11, thereby reducing the bezel of the display device 1000. A portion of the circuit board 30 is located on the side of the main body 11 close to the binding portion 13 and bonded to the main body 11, while a portion is located on the side of the binding portion 13 away from the main body 11 and bonded to the binding portion 13.

[0053] It should be noted that the bending radius of the bending portion 12 may be 0.1 mm to 0.5 mm. For example, the bending radius of the bending portion 12 may be any one of 0.1 mm, 0.2 mm, 0.3 mm, 0.35 mm, 0.4 mm and 0.5 mm.

[0054] It should be understood that the smaller the bending radius of the bent portion 12, the narrower the frame of the display device 1000 corresponding to the bent portion 12 can be designed, which is more conducive to the narrow frame design of the display device 1000. For example, the bending radius of the bent portion 12 can be 0.1 mm to 0.2 mm. For example, the bending radius of the bent portion 12 can be any one of 0.12 mm, 0.15 mm, and 0.18 mm, so that the frame of the display device 1000 corresponding to the bent portion 12 can be made narrower.

[0055] As shown in FIG. 3 , the support pad 20 is located between the main body 11 and the binding portion 13 , and the main body 11 and the binding portion 13 are bonded together by the support pad 20 .

[0056] Based on the above structure, the bending process can be described as follows: Step 1, a support pad 20 is set on the non-display side 11B of the main body 11. Step 2, an adsorption jig is used to contact the surface of the binding part 13 close to the circuit board 30 to adsorb the binding part 13. Step 3, the binding part 13 is bent toward the non-display side 11B of the main body 11 of the display panel 10, so that the binding part 13 is located on the side of the support pad 20 away from the main body 11, and there is a gap between the binding part 13 and the support pad 20. Step 4, the adsorption jig moves the binding part 13 in a direction close to the main body 11 so that the binding part 13 and the support pad 20 are bonded. Step 5, the adsorption jig is removed.

[0057] As shown in Figure 5, the display device 1000 also includes a middle frame 200. The middle frame 200 includes a bottom plate 210 and a frame 220 arranged around the bottom plate 210. The bottom plate 210 is arranged on the side of the binding portion 13 of the display panel 10 away from the main body 11, and the orthographic projection on the plane where the main body 11 is located is located outside the display area A. The frame 220 is arranged around the circumference of the display panel 10. The middle frame 200 and the display module 100 can be connected by edge injection molding (English: Insert Molding) technology. That is, the fixing portion 300 is formed by edge injection molding technology, and the fixing portion 300 connects the middle frame 200 and the display module 100. The orthographic projection of the fixing portion 300 on the plane where the main body 11 is located is located outside the display area A. Arranged in this way, the frame of the display device 1000 can be reduced.

[0058] For example, as shown in FIG5 , the fixing portion 300 includes a first fixing portion 310 and a second fixing portion 320. The first fixing portion 310 covers the side of the bent portion 12 away from the frame 220 and extends to the main portion 11 and the binding portion 13. The second fixing portion 320 covers the side of the bent portion 12 close to the frame 220 and extends to the main portion 11 and the binding portion 13.

[0059] In some related technologies, along a first direction, the ends of the support pad extend beyond the ends of the binding portion. During the bending process, the adsorption jig will adhere to the support pad. When the adsorption jig is removed from the binding portion, the adsorption jig will drive the main body of the support pad to detach. In other related technologies, along the first direction, the ends of the support pad are retracted relative to the ends of the binding portion. The retracted portion of the support pad relative to the binding portion, the portion of the binding portion extending beyond the support pad, and the injection mold form a first overflow glue channel. During the edge injection molding process, the injected glue flows through the first overflow glue channel to other parts of the display module, such as the display area, thereby causing abnormal display of the display module.

[0060] To address the above technical issues, as shown in Figures 6 to 10 , some embodiments of the present disclosure provide a support pad 20 comprising a first sub-portion 21 and a second sub-portion 22. Along a first direction X, the second sub-portion 22 is located on at least one side of the first sub-portion 21, and both ends of the first sub-portion 21 are flush with both ends of the support pad 20. In other words, along the first direction X, one end of the support pad 20 extends beyond the binding portion 13, while the other end is flush with the binding portion 13. Alternatively, both ends of the support pad 20 extend beyond both ends of the binding portion 13.

[0061] As shown in Figure 6, during the edge injection molding process, the part of the support pad 20 that extends beyond the binding part 13, namely the second sub-part 22, contacts the injection mold 1, which can avoid the generation of the first overflow glue channel in the related technology, thereby preventing the injected glue from flowing through the first overflow glue channel to other parts of the display module 100, thereby improving the display effect of the display module 100.

[0062] The first sub-section 21 is configured so that when separated from the adsorption jig, there is no adhesion between the first sub-section 21 and the adsorption jig. This configuration can alleviate the problem of the adsorption jig and the first sub-section 21 adhering to each other, causing the support pad 20 to separate from the main body 11.

[0063] The specific structure of the support pad 20 is described below with examples.

[0064] In some embodiments, as shown in Figures 7 and 8, the support pad 20 includes a first support layer 201, a support portion 202, and a first adhesive layer 203. Along the first direction X, the two ends of the first support layer 201 extend beyond the two ends of the binding portion 13. A receiving groove 2011 is provided on the surface of the first support layer 201 near the binding portion 13. The orthographic projection of the receiving groove 2011 on the reference surface is located within the range of the orthographic projection of the binding portion 13 on the reference surface. The support portion 202 is located in the receiving groove 2011, and the first support layer 201 and the binding portion 13 are connected by the support portion 202. The first adhesive layer 203 is located on the side of the first support layer 201 away from the binding portion 13 and overlaps with the first support layer 201.

[0065] That is to say, along the first direction X, the part of the first supporting layer 201 that does not extend beyond the binding part 13, the part of the supporting part 202 and the first adhesive layer 203 that does not extend beyond the binding part 13 form a first sub-part 21, the part of the first supporting layer 201 that extends beyond the binding part 13 and the part of the first adhesive layer 203 that extends beyond the binding part 13 form a second sub-part 22, and, along the first direction X, the second sub-part 22 is located on both sides of the first sub-part 21.

[0066] Arranged in this manner, on the one hand, the second sub-sections 22 located on either side of the first sub-section 21 can avoid the generation of the first glue overflow channel in the related art, thereby improving the problem of the injected glue flowing to other parts of the display module 100, thereby affecting the normal display of the display module 100. On the other hand, during the bending process, the portion of the first supporting layer 201 that extends beyond the binding portion 13 comes into direct contact with the adsorption jig. In other words, there is no adhesive layer between the first supporting layer 201 and the adsorption jig, that is, there is no adhesive force between the first adhesive layer 203 and the adsorption jig, thereby improving the problem of the adsorption jig and the second sub-section 22 adhering to each other, causing the support pad 20 to detach from the main body 11.

[0067] The material of the first supporting layer 201 may include polyethylene terephthalate (PET) and polyimide (PI), and the material of the first adhesive layer 203 may include pressure sensitive adhesive (PSA).

[0068] The specific structure of the support portion 202 is described below with examples.

[0069] In some examples, as shown in FIG7 , the support portion 202 includes a second adhesive layer 2021 . The second adhesive layer 2021 may be made of a pressure-sensitive adhesive. The first support layer 201 and the binding portion 13 are bonded together by the second adhesive layer 2021 .

[0070] In other examples, as shown in FIG. 8 , the support portion 202 includes a second adhesive layer 2021 , a second support layer 2022 , and a third adhesive layer 2023 .

[0071] The second support layer 2022 is located on a side of the second adhesive layer 2021 away from the binding portion 13 and overlaps with the second adhesive layer 2021. The second support layer 2022 is used to provide support to enhance the rigidity of the support pad 20, thereby enabling the support pad 20 to better support the binding portion 13. The second support layer 2022 can be a single-layer structure or a multi-layer structure, which is not specifically limited in the present embodiment.

[0072] It should be noted that the material of the second supporting layer 2022 may include polyethylene terephthalate and polyimide.

[0073] The third adhesive layer 2023 is located on a side of the second supporting layer 2022 away from the binding portion 13 and overlaps with the second supporting layer 2022. The third adhesive layer 2023 may be made of a pressure-sensitive adhesive. The third adhesive layer 2023 may be made of the same material as the second adhesive layer 2021. For example, both the third adhesive layer 2023 and the second adhesive layer 2021 may be made of a pressure-sensitive adhesive.

[0074] In some examples, as shown in FIG. 7 and FIG. 8 , a surface of the support portion 202 close to the binding portion 13 is flush with a surface of the first support layer 201 close to the binding portion 13 .

[0075] Arranged in this manner, the surface of the first supporting layer 201 close to the binding portion 13 can be in direct contact with the binding portion 13, which can improve the problem of a second glue overflow channel formed by a gap between the surface of the first supporting layer 201 close to the binding portion 13 and the binding portion 13, thereby avoiding the risk of the injected glue flowing to other parts of the display module 100 (such as the display area A) through the second glue overflow channel, thereby improving the display effect of the display module 100.

[0076] 7 and 8 , there is a gap between the boundary of the orthographic projection of the support portion 202 on the main body 11 and the outer boundary of the orthographic projection of the receiving groove 2011 on the main body 11. This arrangement enables the support portion 202 to be located within the receiving groove 2011.

[0077] Exemplarily, as shown in FIG7 and FIG8 , the distance between the boundary of the orthographic projection of the support portion 202 on the main body 11 and the outer boundary of the orthographic projection of the receiving groove 2011 on the main body 11 is 0.3 mm to 0.5 mm.

[0078] For example, the distance between the boundary of the orthographic projection of the support portion 202 on the main body 11 and the outer boundary of the orthographic projection of the accommodating groove 2011 on the main body 11 is 0.3 mm, 0.32 mm, 0.35 mm, 0.36 mm, 0.39 mm, 0.40 mm, 0.44 mm, 0.47 mm or 0.5 mm, which are not listed one by one in the embodiments of the present disclosure.

[0079] In some embodiments, as shown in FIG. 7 and FIG. 8 , along the first direction X, a distance between a boundary of an orthographic projection of the binding portion 13 on the main body 11 and an outer boundary of an orthographic projection of the accommodating groove 2011 on the main body 11 is 1.7 mm to 2.9 mm.

[0080] For example, the distance between the boundary of the orthographic projection of the binding portion 13 on the main body 11 and the outer boundary of the orthographic projection of the accommodating groove 2011 on the main body 11 is 1.7 mm, 1.71 mm, 1.75 mm, 1.79 mm, 1.8 mm, 1.83 mm, 1.86 mm, 1.9 mm, 2 mm, 2.3 mm, 2.4 mm, 2.6 mm, 2.8 mm or 2.9 mm, which are not listed one by one in the embodiments of the present disclosure.

[0081] Arranged in this manner, the accommodating groove 2011 can be made larger, thereby making the supporting portion 202 larger, and the contact area between the supporting portion 202 and the binding portion 13 larger, thereby increasing the connection firmness between the supporting portion 202 and the binding portion 13.

[0082] 7 and 8 , along the first direction X, a distance between an outer boundary of an orthographic projection of the support portion 202 on the main body 11 and an outer boundary of an orthographic projection of the receiving groove 2011 on the main body 11 is 2 mm to 3 mm.

[0083] For example, the distance between the outer boundary of the orthographic projection of the support portion 202 on the main body 11 and the outer boundary of the orthographic projection of the accommodating groove 2011 on the main body 11 is 2 mm, 2.1 mm, 2.2 mm, 2.4 mm, 2.5 mm, 2.7 mm, 2.9 mm or 3 mm, which are not listed one by one in the embodiments of the present disclosure.

[0084] As shown in FIG7 and FIG8 , along the first direction X, the distance between the outer boundary of the orthographic projection of the support portion 202 on the main body 11 and the boundary of the orthographic projection of the binding portion 13 on the main body 11 is 150 μm to 250 μm.

[0085] For example, the distance between the outer boundary of the orthographic projection of the supporting portion 202 on the main body 11 and the boundary of the orthographic projection of the binding portion 13 on the main body 11 is 150μm, 160μm, 180μm, 190μm, 200μm, 205μm, 213μm, 220μm, 225μm, 233μm, 240μm, 245μm or 250μm, which are not listed one by one in the embodiments of the present disclosure.

[0086] In other embodiments, as shown in FIG9 , the support pad 20 includes a first support layer 201, a fourth adhesive layer 204, and a first adhesive layer 203. Along the first direction X, both ends of the first support layer 201 extend beyond both ends of the binding portion 13. The fourth adhesive layer 204 is located on the side of the first support layer 201 that is closer to the binding portion 13 and overlaps with the first support layer 201. The first adhesive layer 203 is located on the side of the first support layer 201 that is farther from the binding portion 13 and overlaps with the first support layer 201.

[0087] That is, along the first direction X, the portion of the first supporting layer 201 that does not extend beyond the binding portion 13, the portion of the fourth adhesive layer 204 that does not extend beyond the binding portion 13, and the portion of the first adhesive layer 203 that does not extend beyond the binding portion 13 form a first sub-portion 21. The portion of the first supporting layer 201 that extends beyond the binding portion 13, the portion of the fourth adhesive layer 204 that extends beyond the binding portion 13, and the portion of the first adhesive layer 203 that does not extend beyond the binding portion 13 form a second sub-portion 22, and, along the first direction X, the second sub-portion 22 is located on both sides of the first sub-portion 21.

[0088] Arranged in this manner, on the one hand, the second sub-sections 22 located on both sides of the first sub-section 21 can avoid the generation of the first glue overflow channel in the related art, thereby improving the problem of the injected glue flowing to other parts of the display module 100, thereby affecting the normal display of the display module 100. On the other hand, during the bending process, the portion of the first adhesive layer 203 that extends beyond the binding portion 13 directly contacts the adsorption jig, and the portion of the first adhesive layer 203 that extends beyond the binding portion 13 is non-sticky. In other words, there is no adhesive force between the first adhesive layer 203 and the adsorption jig, thereby improving the problem of the support pad 20 being detached from the main body 11 due to the adhesion between the adsorption jig and the second sub-section 22.

[0089] The material of the fourth adhesive layer 204 is described below with examples.

[0090] In some examples, the fourth adhesive layer 204 is made of a light-curing adhesive layer. The portion of the fourth adhesive layer 204 that overlaps the binding portion 13 is not exposed to ultraviolet light, but remains adhesive. The portion of the fourth adhesive layer 204 that overlaps the binding portion 13 can bond the first support layer 201 to the binding portion 13. The portion of the fourth adhesive layer 204 that extends beyond the binding portion 13 is exposed to ultraviolet light, but remains non-adhesive. This eliminates adhesion between the first adhesive layer 203 and the adsorption jig, thereby improving the problem of the adsorption jig and the second sub-portion 22 adhering to each other, causing the support pad 20 to detach from the main body 11.

[0091] For example, as shown in Figures 9 and 10, between bending the binding portion 13 and bonding the main body 11 to the binding portion 13, the bending process further includes: irradiating the fourth adhesive layer 204 vertically with ultraviolet light from the side of the binding portion 13 facing away from the main body 11. The ultraviolet light cannot pass through the binding portion 13, and the portion of the fourth adhesive layer 204 overlapping the binding portion 13 is not exposed to the ultraviolet light, thus maintaining adhesion. The portion of the fourth adhesive layer 204 extending beyond the binding portion 13 is not obstructed by any object on the side adjacent to the binding portion 13, and the portion of the fourth adhesive layer 204 extending beyond the binding portion 13 is exposed to the ultraviolet light and lacks adhesion.

[0092] In some examples, as shown in FIG. 9 , along the first direction X, a distance between an outer boundary of an orthographic projection of the support portion 202 on the main body 11 and a boundary of an orthographic projection of the binding portion 13 on the main body 11 is 150 μm to 250 μm.

[0093] For example, the distance between the outer boundary of the orthographic projection of the supporting portion 202 on the main body 11 and the boundary of the orthographic projection of the binding portion 13 on the main body 11 is 150μm, 160μm, 180μm, 190μm, 200μm, 205μm, 213μm, 220μm, 225μm, 233μm, 240μm, 245μm or 250μm, which are not listed one by one in the embodiments of the present disclosure.

[0094] In some embodiments, as shown in FIG. 2 and FIG. 3 , the display module 100 further includes a driver chip 40 . The driver chip 40 is configured to provide the display panel 10 with data signals required for displaying images.

[0095] As shown in FIG2 and FIG3, the driver chip 40 can be set on the binding portion 13, so that the driver chip 40 can provide the data signal required for displaying the screen to the main body 11 through the binding portion 13 and the bending portion 12 to control the display panel 10 to display the image.

[0096] Here, the driver chip 40 includes at least one of microchips such as a source driver chip, a touch control chip, a timing controller, and a gamma circuit, which is not specifically limited in the embodiment of the present disclosure.

[0097] In some embodiments, as shown in FIG. 2 and FIG. 3 , the display module 100 further includes a back film 50 . The back film 50 is located on the non-display side 11B of the display panel 10 .

[0098] In some examples, as shown in FIG. 2 and FIG. 3 , the back film 50 may include, for example, a first sub-back film 501 and a second sub-back film 502 , and the first sub-back film 501 and the second sub-back film 502 are disconnected at the bending portion 12 .

[0099] The first sub-back film 501 at least partially overlaps the main body 11 in a direction perpendicular to the main body 11. The second sub-back film 502 at least partially overlaps the binding portion 13 and can be bent along the binding portion 13 to the non-display side 11B of the main body 11 of the display panel 10.

[0100] In this case, the back film 50 exposes the bending portion 12 of the display panel 10, which can reduce the bending resistance of the bending portion 12 of the display panel 10 and change the position of the force-neutral layer of the bending portion 12 of the display panel 10 during the bending process, thereby reducing the risk of damage to the display panel 10.

[0101] In some examples, as shown in Figures 2 and 3, the orthographic projection of the boundary of the main body portion 11 on the reference surface is within the range of the orthographic projection of the boundary of the first sub-back film 501 on the reference surface, that is, the first sub-back film 501 covers the main body portion 11, and the side of the first sub-back film 501 close to the second sub-back film 502 extends to the bend 12. The orthographic projection of the boundary of the binding portion 13 on the reference surface is within the range of the orthographic projection of the boundary of the second sub-back film 502 on the reference surface, that is, the second sub-back film 502 covers the binding portion 13, and the side of the second sub-back film 502 close to the first sub-back film 501 extends to the bend 12.

[0102] In this case, during the bending process of the display panel 10, stress concentration at the junction of the main body 11, the bending portion 12 and the binding portion 13 can be avoided, thereby reducing the risk of cracks or breakage of the display panel 10 at the junction of the main body 11, the bending portion 12 and the binding portion 13.

[0103] In some embodiments, as shown in FIG. 5 , the display module 100 further includes a cover plate 60 , a fifth adhesive layer 70 , a circular polarizer 80 , and a buffer layer 90 .

[0104] As shown in Figure 5, the cover plate 60 is located on a side of the main body 11 away from the binding portion 13. In this way, the cover plate 60 can reduce the risk of the main body 11 being scratched.

[0105] The fifth adhesive layer 70 is located between the cover plate 60 and the main body 11. The material of the fifth adhesive layer 70 can include an adhesive material with high light transmittance (e.g., a light transmittance greater than or equal to 85%), such as an optically clear adhesive (OCA) or a pressure-sensitive adhesive (PSA). For example, the material of the fifth adhesive layer 70 includes optical adhesive.

[0106] The circular polarizer 80 is located between the fifth adhesive layer 70 and the main body 11 and covers at least the display area A. The circular polarizer 80 can reduce the reflection of ambient light by the main body 11 .

[0107] The buffer layer 90 is located between the main body 11 and the support pad 20 and covers at least the display area A. The buffer layer 90 primarily provides shock absorption and improves the impact resistance of the display module 100. The buffer layer 90 is made of a super clean foam composite film (SCF).

[0108] In the description of this specification, specific features, structures, materials or characteristics may be combined in an appropriate manner in any one or more embodiments or examples.

[0109] The above description is merely a specific embodiment of the present disclosure, but the scope of protection of the present disclosure is not limited thereto. Any changes or substitutions that a person skilled in the art can conceive within the technical scope disclosed in the present disclosure should be included within the scope of protection of the present disclosure. Therefore, the scope of protection of the present disclosure should be based on the scope of protection of the claims.

Claims

1. A display module, comprising: The display panel comprises a main body, a binding portion and a bending portion between the main body and the binding portion; The main body has a display side and a non-display side that are opposite to each other, and the bending axis of the bending portion extending along the first direction is bent toward the non-display side of the main body, so that the binding portion is bent to the non-display side of the main body; A support pad is located between the main body and the binding portion; the support pad comprises a first sub-portion and a second sub-portion; along the first direction, the second sub-portion is located on at least one side of the first sub-portion, and two ends of the first sub-portion are flush with two ends of the support pad; The first sub-section is configured such that, when separated from the adsorption jig, there is no adhesive force between the first sub-section and the adsorption jig.

2. The display module according to claim 1, wherein: The support pad comprises: a first supporting layer; along the first direction, two ends of the first supporting layer extend beyond two ends of the binding portion, and a receiving groove is provided on a surface of the first supporting layer close to the binding portion; an orthographic projection of the receiving groove on the main body is located within the range of an orthographic projection of the binding portion on the main body; A supporting portion, located in the receiving groove; the first supporting layer and the binding portion are connected via the supporting portion; The first adhesive layer is located on a side of the first supporting layer away from the binding portion and overlaps with the first supporting layer.

3. The display module according to claim 2, wherein: The support portion comprises: a second adhesive layer; a second supporting layer, located on a side of the second adhesive layer away from the binding portion; The third adhesive layer is located on a side of the second supporting layer away from the binding portion.

4. The display module according to claim 2, wherein: A surface of the supporting portion close to the binding portion is flush with a surface of the first supporting layer close to the binding portion.

5. The display module according to claim 2, wherein: There is a gap between a boundary of an orthographic projection of the support portion on the main body and an outer boundary of an orthographic projection of the accommodation groove on the main body.

6. The display module according to claim 2, wherein: Along the first direction, a distance between a boundary of an orthographic projection of the binding portion on the main body and an outer boundary of an orthographic projection of the accommodating groove on the main body is 1.7 mm to 2.9 mm.

7. The display module according to claim 1, wherein: The support pad comprises: A first supporting layer; along the first direction, two ends of the first supporting layer extend beyond two ends of the binding portion; a fourth adhesive layer, located on a side of the first supporting layer close to the binding portion and overlapping with the first supporting layer; The first adhesive layer is located on a side of the first supporting layer away from the binding portion and overlaps with the first supporting layer.

8. The display module according to claim 7, wherein: The material of the fourth adhesive layer is a photocurable adhesive layer.

9. The display module according to claim 7, wherein: Along the first direction, a distance between a boundary of an orthographic projection of the first supporting layer on the main body and a boundary of an orthographic projection of the binding portion on the main body is 150 μm to 250 μm.

10. A display device, comprising the display module according to any one of claims 1 to 9; The middle frame includes a bottom plate and a frame arranged around the bottom plate; the bottom plate is arranged on a side of the binding part of the display module away from the main body, and the frame is arranged around the peripheral side of the display panel.

11. The display device according to claim 10, further comprising A first fixing portion covers a side of the bending portion away from the frame and extends to the main body portion and the binding portion; The second fixing portion covers a side of the bending portion close to the frame and extends to the main body portion and the binding portion.

Images