Power module and power device

Abstract

A power module and a power device. The power module comprises: a circuit board comprising an upper surface layer and a lower surface layer; at least one switch circuit arranged on the upper surface layer of the circuit board, wherein the switch circuit comprises a first switch unit, a second switch unit, and a first capacitor unit, and the first switch unit, the second switch unit, and the first capacitor unit are electrically connected to form commutation loops which are located on the upper surface layer or pass through the upper surface layer; and a metal plate arranged above the first switch unit, the second switch unit, and the first capacitor unit.

Description

Power modules and power equipment

[0001] Related applications

[0002] This application claims priority to Chinese patent application number 202311458870.9, filed on November 3, 2023, entitled “Power Module and Power Equipment,” the entire text of which is hereby incorporated by reference. Technical Field

[0003] The present application relates to the field of power equipment, and in particular to a power module and power equipment. Background Art

[0004] Lightweight, miniaturization, high frequency, high efficiency, and high power density are the development trends of power electronic modules. Increasing the switching frequency of power electronic modules can effectively reduce the size of filter capacitors, filter inductors, and transformers, thereby effectively reducing volume and weight. However, increasing the switching frequency will increase the losses of the power electronic modules, which poses a challenge for heat dissipation. One way to solve this heat dissipation problem is to increase the switching speed to reduce switching losses at the source. However, this increase in switching speed brings a new problem: more severe EMI (electromagnetic interference).

[0005] It is difficult for related technologies to achieve a good balance between increasing switching frequency, EMI and heat dissipation, so as to achieve lightweight, miniaturization, high frequency, high efficiency and high power density of power electronic power modules while solving the EMI and heat dissipation problems well. Especially when the casing is a plastic casing, due to the lack of a traditional metal casing, Y capacitors cannot be placed to filter out common-mode noise, making it more difficult to solve the EMI and heat dissipation problems.

[0006] Summary of the Invention

[0007] According to various embodiments of the present application, a power module and a power device are provided.

[0008] In a first aspect, an embodiment of the present application provides a power module, comprising:

[0009] A circuit board, comprising an upper surface layer and a lower surface layer;

[0010] at least one switching circuit provided on an upper surface layer of the circuit board, the switching circuit comprising a first switching unit, a second switching unit, and a first capacitor unit, the first switching unit, the second switching unit, and the first capacitor unit being electrically connected to form a commutation loop located on or passing through the upper surface layer;

[0011] A metal plate is provided above the first switch unit, the second switch unit and the first capacitor unit.

[0012] In one embodiment, the first capacitor unit is disposed on the same side of the first switch unit and the second switch unit, or is disposed between the first switch unit and the second switch unit.

[0013] In one embodiment, the circuit board further comprises at least one inner layer provided between the upper surface layer and the lower surface layer, the upper surface layer being provided with a first through hole and a second through hole electrically connected to the at least one inner layer;

[0014] The first through hole and the second through hole are electrically connected to the first capacitor unit and the second switch unit, respectively; a first electrical connection path between the first switch unit and the first capacitor unit and the second switch unit is provided on the upper surface layer; and a second electrical connection path between the first capacitor unit and the second switch unit passes through the first through hole, the inner layer, and the second through hole; or

[0015] The first through hole and the second through hole are electrically connected to the first switch unit and the second switch unit respectively, a first electrical connection path between the first capacitor unit and the first switch unit and the second switch unit is provided on the upper surface layer, and a second electrical connection path between the first switch unit and the second switch unit passes through the first through hole, the inner layer and the second through hole;

[0016] The first electrical connection path and the second electrical connection path form the commutation loop.

[0017] In one embodiment, the second electrical connection path is located directly below the first electrical connection path.

[0018] In one embodiment, the second electrical connection path passes through an inner layer closest to the upper surface layer.

[0019] In one embodiment, a metal layer is applied on the upper surface of the inner layer closest to the upper surface layer at positions corresponding to the first switch unit, the second switch unit, and the first capacitor unit.

[0020] In one embodiment, the power module includes two switching circuits, which are arranged side by side or along a straight line, and the current directions of the commutation circuits corresponding to the two switching circuits are opposite.

[0021] In one embodiment, the power module further includes a plurality of second capacitor units provided on the circuit board, the input end and the output end of the power module are electrically connected to the metal plate through corresponding second capacitor units, and the metal plate serves as a virtual ground.

[0022] In one embodiment, the metal plate is fixedly connected to the circuit board via at least one metal connector.

[0023] In one embodiment, the switching circuit further includes a third capacitor unit provided on the upper surface or lower surface of the circuit board and connected in parallel with the first capacitor unit, wherein the third capacitor unit is connected to the first capacitor unit via metal wiring on the upper surface and / or a third through hole passing through the circuit board, wherein the capacitance of the third capacitor unit is greater than the capacitance of the first capacitor unit.

[0024] In one embodiment, the first switch unit and the second switch unit each include at least one switch tube.

[0025] In one embodiment, the first capacitor unit includes at least one capacitor.

[0026] In one embodiment, an insulating heat-conducting medium is filled between the circuit board and the metal plate.

[0027] In one embodiment, the switching circuit is a part of a DC (Direct Current)-DC converter or a DC-AC (Alternating Current) converter.

[0028] In a second aspect, an embodiment of the present application provides an electric power device, comprising the power module as described in the first aspect.

[0029] In one embodiment, the power device further includes a plastic housing, and the power module is located in the plastic housing.

[0030] In one embodiment, the power device is a power optimizer or an inverter.

[0031] The details of one or more embodiments of the present application are set forth in the following drawings and description to make other features, objects, and advantages of the present application more readily apparent. BRIEF DESCRIPTION OF THE DRAWINGS

[0032] In order to more clearly illustrate the technical solutions in the embodiments of the present application or related technologies, the following briefly introduces the drawings required for use in the embodiments or related technical descriptions. Obviously, the drawings described below are merely embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on the disclosed drawings without any creative work.

[0033] FIG1 is a circuit diagram of a switch circuit in an embodiment provided by the present application.

[0034] FIG2 is a schematic cross-sectional view of a power module in the first embodiment provided in this application.

[0035] FIG3 is a schematic cross-sectional view of a power module in a second embodiment provided in this application.

[0036] FIG4 is a schematic cross-sectional view of a power module in a third embodiment provided in this application.

[0037] FIG5 is a schematic top view of a power module in a third embodiment provided in this application.

[0038] FIG6 is a schematic cross-sectional view of a power module according to a fourth embodiment of the present application.

[0039] FIG7 is a schematic top view of a power module according to a fifth embodiment of the present application.

[0040] FIG8 is a schematic diagram of a commutation circuit of a power module in a fifth embodiment provided by the present application.

[0041] FIG9 is a schematic topological diagram of a main circuit of a DC-DC converter provided in the present application.

[0042] FIG10 is a schematic cross-sectional view of a power module according to a sixth embodiment of the present application.

[0043] FIG11 is a schematic bottom view of a power module according to a seventh embodiment of the present application.

[0044] FIG12 is a schematic topological diagram of a main circuit of a DC-AC converter provided in this application.

[0045] FIG13 is a schematic cross-sectional view of a power module according to an eighth embodiment of the present application. DETAILED DESCRIPTION

[0046] In order to make the purpose, technical solutions and advantages of the present application clearer, the present application is described and illustrated below in conjunction with the accompanying drawings and examples. It should be understood that the specific embodiments described herein are only used to explain the present application and are not intended to limit the present application. Based on the embodiments provided in the present application, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the present application. In addition, it can also be understood that although the efforts made in this development process may be complex and lengthy, for ordinary technicians in the field related to the contents disclosed in the present application, some changes such as design, manufacturing or production based on the technical contents disclosed in the present application are only conventional technical means and should not be understood as the contents disclosed in the present application being insufficient.

[0047] References to "embodiments" in this application mean that a particular feature, structure, or characteristic described in connection with the embodiment may be included in at least one embodiment of the application. The appearance of this phrase in various places in the specification does not necessarily refer to the same embodiment, nor does it refer to independent or alternative embodiments that are mutually exclusive of other embodiments. It is understood, both explicitly and implicitly, by those skilled in the art that the embodiments described in this application may be combined with other embodiments unless there is a conflict.

[0048] Unless otherwise defined, the technical or scientific terms used in this application should have the ordinary meaning understood by a person of ordinary skill in the technical field to which this application belongs. The words "one", "a", "the" and the like used in this application do not indicate a limit on quantity and may indicate the singular or plural. The terms "include", "comprise", "have" and any variations thereof used in this application are intended to cover non-exclusive inclusions; for example, a process, method, system, product or device that includes a series of steps or modules (units) is not limited to the listed steps or units, but may also include steps or units that are not listed, or may also include other steps or units that are inherent to these processes, methods, products or devices. The words "connect", "connected", "coupled" and the like used in this application are not limited to physical or mechanical connections, but may include electrical connections, whether direct or indirect. The word "multiple" used in this application means greater than or equal to two. "And / or" describes the association relationship of associated objects, indicating that three relationships can exist. For example, "A and / or B" can mean: A exists alone, A and B exist at the same time, and B exists alone. The terms "first", "second", "third" and the like involved in this application are merely used to distinguish similar objects and do not represent a specific ordering of the objects.

[0049] An embodiment of the present application proposes a power module, comprising: a circuit board, the circuit board comprising an upper surface layer and a lower surface layer; at least one switching circuit arranged on the upper surface layer of the circuit board, the switching circuit comprising a first switching unit, a second switching unit and a first capacitor unit, the first switching unit, the second switching unit and the first capacitor unit being electrically connected to form a commutation circuit located on the upper surface layer or passing through the upper surface layer; and a metal plate, the metal plate being arranged above the first switching unit, the second switch unit and the first capacitor unit.

[0050] In this embodiment, by closely arranging the first switch unit, the second switch unit, and the first capacitor unit in the power module and optimizing the layout of the resulting commutation loop, smaller parasitic inductance and a smaller commutation loop can be achieved. On the one hand, smaller parasitic inductance can achieve a higher switching frequency, making the power module lightweight, miniaturized, high-frequency, efficient, and high-power-density; on the other hand, a smaller commutation loop can reduce EMI from the source. By providing a metal plate above the circuit board, the metal plate has an electromagnetic shielding effect to prevent electromagnetic interference, and can conduct heat from the circuit board to the entire metal plate, and then transfer the heat away through other means. This can simultaneously solve both the EMI problem caused by increasing the switching frequency and the heat dissipation problem. Therefore, this application achieves lightweight, miniaturized, high-frequency, high-efficiency, and high-power-density power modules, while simultaneously solving the EMI problem and heat dissipation problem caused by increasing the switching frequency.

[0051] The switching circuit may be a part of a DC-DC conversion circuit or a DC-AC conversion circuit.

[0052] The first switch unit and the second switch unit each include at least one switch transistor, and the first capacitor unit includes at least one capacitor. Figure 1 is a circuit diagram of a switch circuit according to an embodiment of the present application. In this switch circuit, the first switch unit includes a switch transistor S1, the second switch unit includes a switch transistor S2, and the first capacitor unit includes a capacitor C1.

[0053] The following embodiments of the present application are described by taking the example that the first switch unit and the second switch unit include a switch tube, and the first capacitor unit includes at least one capacitor.

[0054] Figure 2 is a schematic cross-sectional view of a power module according to the first embodiment of the present application. In this embodiment, the circuit board 10 includes an upper surface layer 101, a lower surface layer 102, and at least one inner layer 103 disposed between the upper surface layer 101 and the lower surface layer 102. A first switch unit 202 (corresponding to the switch transistor S1 in Figure 1), a second switch unit 203 (corresponding to the switch transistor S2 in Figure 1), and a first capacitor unit 201 (corresponding to the capacitor C1 in Figure 1) are electrically connected to form a commutation circuit 40 passing through the upper surface layer 101. The upper surface layer 101 is provided with a first through hole 104 and a second through hole 105 that extend to the at least one inner layer 103 for electrical connection. The first capacitor unit 201 is disposed on the same side of the first switch unit 202 and the second switch unit 203. The first through hole 104 and the second through hole 105 are respectively located below the first capacitor unit 201 and the second switch unit 203, and the first through hole 104 and the second through hole 105 are respectively electrically connected to the first capacitor unit 201 and the second switch unit 203. The first electrical connection path between the first switch unit 202 and the first capacitor unit 201 and the second switch unit 203 is provided on the upper surface layer 101, and the second electrical connection path between the first capacitor unit 201 and the second switch unit 203 passes through the first through hole 104, the inner layer 103 and the second through hole 105. The first electrical connection path and the second electrical connection path form a commutation circuit 40.

[0055] Specifically, the first capacitor unit 201, the first switch unit 202, and the second switch unit 203 are arranged on the upper surface layer 101 and closely aligned. The first capacitor unit 201, the first switch unit 202, and the second switch unit 203 are connected by metal wiring in the upper surface layer 101, forming a first electrical connection path. The commutation loop 40 starts from the second end of the first capacitor unit 201, passes through the first end of the first switch unit 202, and reaches the second end of the first switch unit 202. The second end of the first switch unit 202 is simultaneously connected to the first end of the second switch unit 203, passes through the first end of the second switch unit 203, reaches the second end of the second switch unit 203, and then reaches the inner layer 103 adjacent to the upper surface layer 101 through the second through-hole 105. From the inner layer 103, it returns to the first end of the first capacitor unit 201 through the first through-hole 104. At this point, the second electrical connection path is located directly below the first electrical connection path.

[0056] The first through hole 104 and the second through hole 105 may penetrate the circuit board 10 , or may be blind holes and do not need to penetrate the circuit board 10 .

[0057] Among them, the upper surface layer 101 and the inner layer 103 are made as thin as possible to minimize the area of ​​the commutation circuit. At the same time, the components are arranged as closely as possible, and the metal wiring is short and wide to minimize the parasitic inductance of the commutation circuit. Electromagnetic radiation will be greatly reduced and EMI will be greatly improved.

[0058] Furthermore, a metal layer is applied on the upper surface of the inner layer 103 closest to the upper surface layer 101 at positions corresponding to the first switch unit 202 , the second switch unit 203 and the first capacitor unit 201 , forming a conductor plane that can partially shield EMI.

[0059] The metal plate 30 is arranged above the first capacitor unit 201, the first switch unit 202 and the second switch unit 203, and has an electromagnetic shielding effect to prevent electromagnetic interference. As shown in Figure 2, the metal plate 30 is fixedly connected to the circuit board 10 by at least one metal connector 50. The metal connector 50 is, for example, a screw, and corresponding threaded holes are provided on the metal plate 30 and the circuit board 10 (the screw holes may or may not penetrate the circuit board 10). The metal plate 30 is fixedly connected to the circuit board 10 by the screws. The area of ​​the metal plate 30 can be adapted to the size of the area occupied by the switch circuit, or it can be consistent with the area of ​​the circuit board 10. In some other embodiments, pins can be provided on the metal plate 30 to connect to the circuit board 10 by welding.

[0060] The distance between the metal plate 30 and the upper surface 101 of the circuit board 10 (e.g., 1.3mm-1.7mm) is minimized while ensuring functional insulation, ensuring that the distance minimizes the thermal resistance between the metal plate 30 and the heating element (e.g., the first switch unit 202 and the second switch unit 203) while meeting insulation requirements. An insulating thermally conductive medium can be filled in between, so that the heat generated by the first switch unit 202 and the second switch unit 203 during operation is transferred from the body to the metal plate 30 via the thermally conductive medium. The heat on the metal plate 30 is then transferred to the outside via other means. The insulating thermally conductive medium can be a thermal pad, thermally conductive gel, or other insulating element such as tape or other thermally conductive fillers.

[0061] It should be noted that the first capacitor unit 201 can also be provided between the first switch unit 202 and the second switch unit 203. As shown in FIG3 , the first through-hole 104 and the second through-hole 105 are electrically connected to the first switch unit 202 and the second switch unit 203, respectively. The first through-hole 104 and the second through-hole 105 are respectively located below the first switch unit 202 and the second switch unit 203. The first capacitor unit 201 is connected to the first switch unit 202 and the second switch unit 203 via metal wiring on the upper surface layer 101, forming a first electrical connection path. The second electrical connection path between the first switch unit 202 and the second switch unit 203 passes through the first through-hole 104, the inner layer 103, and the second through-hole 105. The first electrical connection path and the second electrical connection path form the commutation circuit 40.

[0062] Specifically, the commutation circuit 40 starts from the second end of the first capacitor unit 201 and reaches the second end of the first switch unit 202 through the first end of the first switch unit 202. The second end of the first switch unit 202 reaches the inner layer 103 adjacent to the upper surface layer 101 through the first through hole 104, and reaches the first end of the second switch unit 203 from the inner layer 103 through the second through hole 105. It reaches the second end of the second switch unit 203 through the first end of the second switch unit 203 and returns to the first end of the first capacitor unit 201 through the second end of the second switch unit 203.

[0063] In order to ensure that the area of ​​the commutation loop is as small as possible, the present application provides two exemplary device layout methods that minimize the area of ​​the commutation loop according to the type of switching devices in the switching unit: for devices in which the two terminals of the switching device (such as the source and the drain) are located on both sides of the package, the layout method can be as shown in Figures 2 and 3, using the inner layer 103 adjacent to the device as the return path; and for devices in which the two terminals of the switching device are located on a single side of the package, for example, when the switching devices in the first switching unit 202 and the second switching unit 203 are GaN transistors, the first capacitor unit 201 is arranged between the first switching unit 202 and the second switching unit 203, and the commutation loop is located on the upper surface layer 101.

[0064] In the corresponding embodiment, a schematic cross-sectional view of the power module is shown in FIG4 . The difference from the above embodiment is that the commutation loop formed by the electrical connection of the first switch unit 202, the second switch unit 203, and the first capacitor unit 201 is located in the upper surface layer 101 (not shown in FIG4 ). A current is generated from one end of the first capacitor unit 201 through a drain of the first switch unit 202 to a source of the first switch unit 202, through metal wiring to a drain of the second switch unit 203, through a drain of the second switch unit 203 to a source of the second switch unit 203, and finally through metal wiring to the other end of the first capacitor unit 201.

[0065] A schematic top view of the power module is shown in Figure 5. The first capacitor unit includes two capacitors, which form two commutation loops 40 with the first switch unit 202 and the second switch unit 203. The electrical connection between the first switch unit 202, the second switch unit 203, and the first capacitor unit 201 is located on the upper surface layer 101. The first switch unit 202 and the first capacitor unit 201, as well as the second switch unit 203 and the first capacitor unit 201, are connected via metal wiring.

[0066] Specifically, one commutation loop 40 starts from one end of a capacitor, passes through a drain of the first switch unit 202, reaches a source of the first switch unit 202, passes through metal wiring, reaches a drain of the second switch unit 203, passes through a drain of the second switch unit 203, reaches a source of the second switch unit 203, and finally reaches the other end of the capacitor through metal wiring. The connections of the other commutation loop are similar and will not be repeated here.

[0067] It should be noted that, in some embodiments, the power module may include two or more switching circuits.

[0068] Figure 6 is a schematic cross-sectional view of a power module according to a fourth embodiment of the present application. As shown in Figure 6, the power module includes two switching circuits arranged closely along a straight line. The current directions of the corresponding commutation circuits of the two switching circuits are opposite, and both corresponding commutation circuits pass through the upper surface layer 101. One switching circuit includes a first capacitor unit 201, a first switch unit 202, and a second switch unit 203 arranged along a straight line; the other switching circuit includes a second switch unit 203, a first switch unit 202, and a first capacitor unit 201 arranged along the same straight line. Other similarities with the previous embodiments are not repeated here.

[0069] Since the magnetic fields of the two commutation circuits are in opposite directions, their magnetic fields can be partially offset at this time, which is more conducive to solving the EMI problem.

[0070] When the two commutation loops 40 do not share a common ground, the copper-clad planes on the inner layer 103 adjacent to the upper surface layer 101 are two separate ground planes.

[0071] In some other embodiments, as shown in Figures 7 and 8, two switching circuits are arranged side by side, and the current directions of the commutation loops 40 corresponding to the two switching circuits are opposite. Both corresponding commutation loops 40 pass through the upper surface layer 101. One switching circuit includes a first capacitor unit 201, a first switch unit 202, and a second switch unit 203 arranged in sequence along a straight line. The magnetic field generated by the commutation loop 40 formed by this switching circuit is inward within the commutation loop. The other switching circuit is arranged side by side with the first switching circuit and includes a second switch unit 203, a first switch unit 202, and a first capacitor unit 201 arranged in sequence along a straight line. The magnetic field generated by the commutation loop 40 formed by this switching circuit is outward within the commutation loop. Because the magnetic fields of the two commutation loops 40 have opposite directions and are arranged close together, their magnetic fields can be largely or even completely canceled out, which is more conducive to solving EMI problems than the above-mentioned embodiments.

[0072] It should be noted that two or more commutation loops 40 may also be located on the upper surface layer 101 , that is, the commutation loops 40 are parallel to the circuit board 10 .

[0073] The switching circuits in the above embodiments may be part of a DC-DC conversion circuit such as a buck type, a boost type, a buck-boost type, a dual active bridge resonant type, or may also be part of a DC-AC conversion circuit.

[0074] The power module of the embodiment of the present application can be used for DC-DC converter. Figure 9 is a schematic topological diagram of the main circuit of a DC-DC converter. As shown in Figure 9, taking the buck type topology as an example, it includes switch tubes S1, S2, capacitors C1, C2, C3, C4, C5, C6, C7 and inductor L1. Among them, the switch tubes S1, S2 and capacitor C1 are connected to form a switching circuit. Capacitor C2 and capacitor C1 are connected in parallel to the input end of the DC-DC converter. Capacitor C5 is connected in parallel to the output end of the DC-DC converter, and inductor L1 is connected in series with capacitor C5 and then connected in parallel with switch tube S2. Capacitor C3 is connected between the positive input terminal of the DC-DC converter and ground, and capacitor C4 is connected between the negative input terminal of the DC-DC converter and ground. Capacitor C6 is connected between the positive output terminal of the DC-DC converter and ground, and capacitor C7 is connected between the negative output terminal of the DC-DC converter and ground.

[0075] The capacitor C2 is used to reduce the input voltage ripple, and the capacitors C3 and C4 and the capacitors C6 and C7 are used to filter out the common mode noise between the input and output ends of the DC-DC converter and the ground respectively.

[0076] In practical applications, in one embodiment, the power module further includes a third capacitor unit 60 (corresponding to capacitor C2 in FIG. 9 ) disposed on the upper or lower surface of the circuit board 10 and connected in parallel with the first capacitor unit 201. The third capacitor unit 60 includes at least one large-capacity capacitor. As shown in FIG. 10 , the third capacitor unit 60 is connected to the first capacitor unit 201 via metal wiring on the upper surface layer 101 and / or a third through-hole 106 extending through the circuit board 10. The capacitance of the third capacitor unit 60 is greater than that of the first capacitor unit 201. Because the commutation loop 40 formed by the first capacitor unit 201, the first switch unit 202, and the second switch unit 203 is much smaller than the commutation loop 70 formed by the third capacitor unit 60, the first switch unit 202, and the second switch unit 203, the current passing through the third capacitor unit 60 is much smaller than the current passing through the first capacitor unit 201.

[0077] Furthermore, in one embodiment, as shown in FIG11 , the power module further includes a plurality of second capacitor units 80 provided on the lower surface 102 of the circuit board 10. Optionally, the second capacitor unit 80 may also be placed on the upper surface 101 of the circuit board 10. Taking the power module including a switching circuit as an example, the power module further includes an input end (e.g., corresponding to the input end of the DC-DC converter) and an output end (e.g., corresponding to the output end of the DC-DC converter), the input end including a positive input terminal IN+ and a negative input terminal IN-, the output end including a positive output terminal OUT+ and a negative output terminal OUT-, the positive input terminal IN+, the negative input terminal IN-, the positive output terminal OUT+, and the negative output terminal OUT- are electrically connected to the metal plate 30 through corresponding second capacitor units 80 (corresponding to capacitors C3, C4, C6, and C7 in FIG9 , respectively). The metal plate 30 serves as a virtual ground, thereby providing a return path for high-frequency common-mode current to reduce high-frequency radiation to the outside through the cables at the input and output ends, thereby meeting radio frequency requirements.

[0078] One end of the second capacitor unit 80 is electrically connected to the corresponding terminal, and the other end is electrically connected to the screw hole. The left and right screw holes of the power module are electrically connected to the metal plate 30 through metal connectors 50 respectively. This metal plate 30 not only acts as a virtual ground for EMI filtering, but also, because the metal plate 30 is placed on one side of the commutation circuit, it can partially shield EMI.

[0079] The power module of the embodiments of the present application can also be used in a DC-AC converter. FIG12 shows a schematic topology diagram of the main circuit of a DC-AC power converter, including switches S3, S4, S5, and S6, capacitors C8, C9, C10, C11, C12, C13, and C14, and element T. Switches S3 and S4 and capacitor C8 are connected to form one switching circuit, corresponding to one commutation loop 40. Switches S5 and S6 and capacitor C9 are connected to form another switching circuit, corresponding to another commutation loop 40. Capacitors C10 and C9 are connected in parallel to the input of the DC-AC converter. Capacitor C11 is connected between the positive input terminal of the DC-AC converter and ground, and capacitor C12 is connected between the negative input terminal of the DC-AC converter and ground. Element T connects the midpoint between the two switching transistors of the two switching circuits. Capacitor C13 is connected between the positive output terminal of the DC-AC converter and ground, and capacitor C14 is connected between the negative output terminal of the DC-AC converter and ground.

[0080] The form of element T can be selected based on the actual topology. Element T can be a transformer, an inductor, or another electrical component or combination of electrical components that provides a certain impedance. Element T can be connected to a rectifier circuit such as a diode rectifier bridge, a synchronous rectifier bridge, a bidirectional rectifier bridge, or a full-wave rectifier bridge after the stage.

[0081] Correspondingly, Figure 13 is a schematic cross-sectional view of the power module of the eighth embodiment of the present application. As shown in Figure 13, the power module includes a circuit board 10, two switching circuits and a metal plate 30. One of the switching circuits includes a closely arranged first switching unit 202 (corresponding to the switch tube S3 in Figure 12), a second switching unit 203 (corresponding to the switch tube S4 in Figure 12) and a first capacitor unit 201 (corresponding to the capacitor C8 in Figure 12), and the other switching circuit is not shown. The first switching unit 202, the second switching unit 203 and the first capacitor unit 201 are electrically connected through the first through hole 104 and the second through hole 105 to form a commutation circuit 40 passing through the upper surface layer.

[0082] The power module also includes a third capacitor unit (not shown in the figure, corresponding to capacitor C10 in Figure 12) provided on the circuit board 10 and multiple second capacitor units 80 (corresponding to capacitors C11, C12, C13, and C14 in Figure 12) provided on the upper surface layer 101 of the circuit board 10. The multiple second capacitor units 80 are respectively connected to the metal plate 30 at the input terminal and output terminal of the power module via metal connectors 50. Specifically, one end of the second capacitor unit 80 is electrically connected to an input terminal or an output terminal, and the other end is electrically connected to the metal connector 50.

[0083] An embodiment of the present application further provides an electric power device, comprising the power module in the above embodiment.

[0084] In one embodiment, the power device further includes a plastic housing, and the power module is located in the plastic housing.

[0085] In one embodiment, the power device is a power optimizer or an inverter.

[0086] Since the power equipment all include the power modules in the above embodiments, they can solve the same technical problems and achieve the same technical effects, which will not be described in detail here.

[0087] The technical features of the above embodiments can be combined arbitrarily. In order to make the description concise, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0088] The above embodiments merely illustrate several implementation methods of the present application. While the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent application. It should be noted that a person of ordinary skill in the art may make various modifications and improvements without departing from the spirit of the present application, all of which fall within the scope of protection of the present application. Therefore, the scope of protection of the present patent application shall be determined by the appended claims.

Claims

1. A power module, characterized in that: include: A circuit board, the circuit board comprising an upper surface layer and a lower surface layer; At least one switch circuit is provided on the upper surface layer of the circuit board, the switch circuit comprises a first switch unit, a second switch unit and a first capacitor unit, the first switch unit, the second switch unit and the first capacitor unit are electrically connected to form a commutation loop located on the upper surface layer or passing through the upper surface layer; A metal plate is disposed above the first switch unit, the second switch unit and the first capacitor unit.

2. The power module according to claim 1, wherein: The first capacitor unit is disposed on the same side of the first switch unit and the second switch unit, or is disposed between the first switch unit and the second switch unit.

3. The power module according to claim 2, wherein: The circuit board further comprises at least one inner layer disposed between the upper surface layer and the lower surface layer, the upper surface layer being provided with a first through hole and a second through hole electrically connected to the at least one inner layer; The first through hole and the second through hole are electrically connected to the first capacitor unit and the second switch unit respectively, a first electrical connection path between the first switch unit and the first capacitor unit and the second switch unit is provided on the upper surface layer, and a second electrical connection path between the first capacitor unit and the second switch unit passes through the first through hole, the inner layer and the second through hole; or The first through hole and the second through hole are electrically connected to the first switch unit and the second switch unit respectively, a first electrical connection path between the first capacitor unit and the first switch unit and the second switch unit is provided on the upper surface layer, and a second electrical connection path between the first switch unit and the second switch unit passes through the first through hole, the inner layer and the second through hole; The first electrical connection path and the second electrical connection path form the commutation loop.

4. The power module according to claim 3, wherein: The second electrical connection path is located directly below the first electrical connection path.

5. The power module according to claim 3, wherein: The second electrical connection path passes through the inner layer that is most adjacent to the upper surface layer.

6. The power module according to claim 3, wherein: A metal layer is applied at positions on the upper surface of the inner layer closest to the upper surface layer corresponding to the first switch unit, the second switch unit and the first capacitor unit.

7. The power module according to claim 1, wherein: The power module comprises two switch circuits, the two switch circuits are arranged side by side or along a straight line, and the current directions of the commutation circuits corresponding to the two switch circuits are opposite.

8. The power module according to claim 1, wherein: It also includes a plurality of second capacitor units arranged on the circuit board, the input end and the output end of the power module are electrically connected to the metal plate through the corresponding second capacitor units, and the metal plate serves as a virtual ground.

9. The power module according to claim 1 or 8, wherein: The metal plate is fixedly connected to the circuit board via at least one metal connecting piece.

10. The power module according to claim 1, wherein: The switching circuit also includes a third capacitor unit disposed on the upper surface or lower surface of the circuit board and connected in parallel with the first capacitor unit, the third capacitor unit being connected to the first capacitor unit via metal wiring on the upper surface and / or a third through hole passing through the circuit board, wherein the capacitance of the third capacitor unit is greater than the capacitance of the first capacitor unit.

11. The power module according to claim 1, wherein: The first switch unit and the second switch unit respectively include at least one switch tube.

12. The power module according to claim 1, wherein: The first capacitor unit includes at least one capacitor.

13. The power module according to claim 1, wherein: An insulating heat-conducting medium is filled between the circuit board and the metal plate.

14. The power module according to claim 1, wherein: The switching circuit is a part of a DC-DC converter or a DC-AC converter.

15. An electric power device, characterized in that: Comprising a power module as claimed in any one of claims 1 to 14.

16. The electric power device according to claim 15, wherein: It also includes a plastic shell, in which the power module is located.

17. The electric power device according to claim 15, wherein: The electric power equipment is a power optimizer or an inverter.

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