Semiconductor device manufacturing system, server, and semiconductor device manufacturing method

Abstract

The purpose of the present invention is to provide a semiconductor manufacturing system capable of generating a recipe that can be processed by a semiconductor manufacturing device at another base even when the device specifications are different. In this semiconductor device manufacturing system, in which a manufacturing condition of a first semiconductor manufacturing device (101) at a first base (A) is transmitted to a second semiconductor manufacturing device (111) at a second base (B) and a sample is processed by the second semiconductor manufacturing device (111), when the specifications of the first semiconductor manufacturing device (101) and the specifications of the second semiconductor manufacturing device (111) are different and the manufacturing conditions of the first semiconductor manufacturing device (101) are transmitted to the second semiconductor manufacturing device (111), manufacturing conditions generated by adapting parameter items in the manufacturing conditions of the first semiconductor manufacturing device (101) to parameter items in the manufacturing conditions of the second semiconductor manufacturing device (111) are transmitted to the second semiconductor manufacturing device (111).

Description

Semiconductor device manufacturing system, server, and semiconductor device manufacturing method

[0001] The present invention relates to a semiconductor device manufacturing system, a server, and a semiconductor device manufacturing method.

[0002] Recipes for semiconductor manufacturing equipment vary depending on the equipment's specifications. For this reason, when preparing a recipe for semiconductor manufacturing equipment, it is basically necessary to send documents describing the recipe and exchange evaluation results and recipe information over the phone or in meetings. Recipes consist of multiple steps, and parameter conversions are required depending on the equipment specifications. Previously, different people would check the equipment specification differences from the specifications and create a processable recipe by rewriting the parameters that needed to be converted depending on the specification differences.

[0003] On the other hand, Patent Document 1 discloses a technology for automatically converting a recipe (parameter file) for another exposure tool into a recipe that is compatible with the exposure tool itself. Specifically, the recipe is changed to a parameter configuration that is compatible with the destination tool, parameters and their values ​​are obtained from the configuration file, and the values ​​of each parameter of the converted recipe are changed based on the parameters and stored in memory.

[0004] Japanese Patent Application Laid-Open No. 2003-37051

[0005] As mentioned above, the traditional method of preparing recipes involves sending documents containing the recipes and exchanging information about the evaluation results and recipes via telephone or meetings. This creates a time lag between receiving an evaluation request via telephone or meeting and the start of the evaluation, which makes recipe preparation time-consuming.

[0006] Furthermore, if there are differences in equipment specifications between pieces of equipment, recipe parameter conversion is required. This parameter conversion is performed manually, so conversion errors can cause equipment problems or breakdowns. Recipe confirmation requires checking parameter conversion items due to differences in equipment specifications for every step, which takes a huge amount of work time.

[0007] On the other hand, the system in Patent Document 1 converts a recipe for another exposure tool so that it produces equivalent results when transferred to another exposure tool. Therefore, if the specifications and configuration of the tool are different, the conversion cannot be performed.

[0008] In view of the above problems, the present invention aims to provide a semiconductor device manufacturing system, a server, and a semiconductor device manufacturing method that can generate a recipe that can be used in semiconductor manufacturing equipment at other sites even if the equipment specifications are different.

[0009] In order to achieve the above-mentioned object, one representative semiconductor manufacturing system of the present invention is a semiconductor device manufacturing system in which manufacturing conditions of a first semiconductor manufacturing apparatus at a first site are transferred to a second semiconductor manufacturing apparatus at a second site and a sample is processed by the second semiconductor manufacturing apparatus, wherein, when the specifications of the first semiconductor manufacturing apparatus and the specifications of the second semiconductor manufacturing apparatus differ and the manufacturing conditions of the first semiconductor manufacturing apparatus are transferred to the second semiconductor manufacturing apparatus, manufacturing conditions generated by adapting parameter items in the manufacturing conditions of the first semiconductor manufacturing apparatus to parameter items in the manufacturing conditions of the second semiconductor manufacturing apparatus are transferred to the second semiconductor manufacturing apparatus.

[0010] Furthermore, one of the semiconductor manufacturing methods of the present invention is a semiconductor device manufacturing method in which manufacturing conditions of a first semiconductor manufacturing apparatus at a first site are transferred to a second semiconductor manufacturing apparatus at a second site and a sample is processed by the second semiconductor manufacturing apparatus, wherein, when specifications of the first semiconductor manufacturing apparatus and the second semiconductor manufacturing apparatus differ and the manufacturing conditions of the first semiconductor manufacturing apparatus are transferred to the second semiconductor manufacturing apparatus, manufacturing conditions generated by adapting parameter items in the manufacturing conditions of the first semiconductor manufacturing apparatus to parameter items in the manufacturing conditions of the second semiconductor manufacturing apparatus are transferred to the second semiconductor manufacturing apparatus.

[0011] According to the present invention, it is possible to generate a recipe that can be used in a semiconductor manufacturing device at another site even if the device specifications are different. Problems, configurations, and effects other than those described above will become apparent from the following embodiments.

[0012] Fig. 1 is a block diagram of a computer system for implementing aspects according to an embodiment of the present disclosure. Fig. 2 is a system configuration diagram showing an embodiment of a semiconductor device manufacturing system of the present invention. Fig. 3 is a diagram showing an example of a process flow from selecting a recipe to be evaluated to transferring the evaluation results in the present invention. Fig. 4 is a diagram showing an example of a process flow for generating a recipe in the present invention.

[0013] An embodiment of the present invention will be described.

[0014] 1 is a block diagram of a computer system 1 for implementing aspects according to embodiments of the present disclosure. The mechanisms and devices of various embodiments disclosed herein may be applied to any suitable computing system. Major components of the computer system 1 include one or more processors 2, memory 4, a terminal interface 12, a storage interface 14, an I / O (input / output) device interface 16, and a network interface 18. These components may be interconnected via a memory bus 6, an I / O bus 8, a bus interface unit 9, and an I / O bus interface unit 10.

[0015] Computer system 1 may include one or more processing devices 2A and 2B, collectively referred to as processors 2. Each processor 2 executes instructions stored in memory 4 and may include an on-board cache. In some embodiments, computer system 1 may include multiple processors, while in other embodiments, computer system 1 may be a single processing device. Possible processing devices include a central processing unit (CPU), a field-programmable gate array (FPGA), a graphics processing unit (GPU), a digital signal processor (DSP), and the like.

[0016] In some embodiments, memory 4 may include random-access semiconductor memory, storage devices, or storage media (either volatile or non-volatile) for storing data and programs. In some embodiments, memory 4 represents the entire virtual memory of computer system 1, and may include the virtual memories of other computer systems connected to computer system 1 via a network. While memory 4 may be conceptually considered a single entity, in other embodiments, memory 4 may be a more complex organization, such as a hierarchy of caches and other memory devices. For example, memory may exist as multiple levels of caches, and these caches may be divided by function. As a result, one cache may hold instructions, while other caches hold non-instruction data used by the processor. Memory may also be distributed and associated with various different processing units, such as in a so-called NUMA (Non-Uniform Memory Access) computer architecture.

[0017] Memory 4 may store all or part of the programs, modules, and data structures that implement the functions described herein. For example, memory 4 may store latent factor identification application 50. In some embodiments, latent factor identification application 50 may include instructions or descriptions that execute the functions described below on processor 2, or may include instructions or descriptions that are interpreted by other instructions or descriptions. In some embodiments, latent factor identification application 50 may be implemented in hardware via semiconductor devices, chips, logic gates, circuits, circuit cards, and / or other physical hardware devices instead of or in addition to a processor-based system. In some embodiments, latent factor identification application 50 may include data other than instructions or descriptions. In some embodiments, a camera, sensor, or other data input device (not shown) may be provided to communicate directly with bus interface unit 9, processor 2, or other hardware in computer system 1. Such a configuration may reduce the need for processor 2 to access memory 4 and the latent factor identification application.

[0018] Computer system 1 may include a bus interface unit 9 that facilitates communication between processor 2, memory 4, display system 24, and I / O bus interface unit 10. I / O bus interface unit 10 may couple to an I / O bus 8 for transferring data to and from various I / O units. I / O bus interface unit 10 may communicate with multiple I / O interface units 12, 14, 16, and 18, also known as I / O processors (IOPs) or I / O adapters (IOAs), via I / O bus 8. Display system 24 may include a display controller, a display memory, or both. The display controller may provide video, audio, or both data to a display device 26. Computer system 1 may also include one or more sensors or other devices configured to collect data and provide it to processor 2. Display memory may be dedicated memory for buffering video data. Display system 24 may be connected to a display device 26, such as a standalone display screen, a television, a tablet, or a handheld device. In some embodiments, the display device 26 may include a speaker for rendering audio. Alternatively, the speaker for rendering audio may be connected to the I / O interface unit. In other embodiments, the functionality provided by the display system 24 may be implemented by an integrated circuit including the processor 2. Similarly, the functionality provided by the bus interface unit 9 may be implemented by an integrated circuit including the processor 2.

[0019] The I / O interface unit is capable of communicating with various storage or I / O devices. For example, the terminal interface unit 12 may be attached to user I / O devices 20, such as user output devices such as a video display, a television with speakers, and user input devices such as a keyboard, a mouse, a keypad, a touchpad, a trackball, buttons, a light pen, or other pointing device. A user may use a user interface to enter input data or instructions into the user I / O devices 20 and the computer system 1 and receive output data from the computer system 1 by operating the user input devices. The user interface may be displayed on a display, played through speakers, or printed via a printer via the user I / O devices 20, for example.

[0020] The storage interface 14 may be attached to one or more disk drives or direct access storage devices 22 (typically magnetic disk drive storage devices, but may also be an array of disk drives or other storage devices configured to appear as a single disk drive). In some embodiments, the storage devices 22 may be implemented as any secondary storage device. The contents of the memory 4 may be stored in the storage devices 22 and retrieved from the storage devices 22 as needed. The network interface 18 may provide a communications path that allows the computer system 1 and other devices to communicate with each other. This communications path may be, for example, a network 30.

[0021] While computer system 1 shown in FIG. 1 includes a bus structure providing direct communication paths between processor 2, memory 4, bus interface 9, display system 24, and I / O bus interface unit 10, in other embodiments, computer system 1 may include point-to-point links, multiple hierarchical buses, parallel or redundant communication paths in a hierarchical, star, or web configuration. Furthermore, while I / O bus interface unit 10 and I / O bus 8 are shown as a single unit, computer system 1 may actually include multiple I / O bus interface units 10 or multiple I / O buses 8. Additionally, while multiple I / O interface units are shown isolating I / O bus 8 from various communication paths leading to various I / O devices, in other embodiments, some or all of the I / O devices may be directly connected to a single system I / O bus.

[0022] In some embodiments, computer system 1 may be a device that receives requests from other computer systems (clients) without a direct user interface, such as a multi-user mainframe computer system, a single-user system, or a server computer. In other embodiments, computer system 1 may be a desktop computer, a portable computer, a laptop, a tablet computer, a pocket computer, a telephone, a smartphone, or any other suitable electronic device.

[0023] <System Configuration Diagram> FIG. 2 is a system configuration diagram showing an embodiment of a semiconductor device manufacturing system according to the present invention.

[0024] FIG. 2 illustrates a case where there are three bases: base A, base B, and base C. Here, a base is a location where a specific activity is carried out, and information can be exchanged within the base through an independent network within the base. Specific examples of bases include a company's business office, research institute, production factory, etc. For example, a "production base" refers to a location where production equipment and other facilities are located and where production and related activities can be carried out.

[0025] Base A is equipped with a group of semiconductor manufacturing line PCs 101, an in-base PC 100, a gateway PC 102, a data path setting PC 103, and a server 104. The gateway PC 102, the data path setting PC 103, and the server 104 are provided on an integrated platform 108 provided at base A. Base A is configured to be able to exchange information via the Internet 107 with external PCs 121 used by other bases and telecommuters, and remote monitors 106.

[0026] Base B is equipped with a group of semiconductor manufacturing line PCs 111, an in-base PC 110, and a server 114. The server 114 is provided on an integrated platform 118 provided at base B. Base B is configured to be able to exchange information with other bases, an external PC 121, and a remote monitor 106 via the Internet 117.

[0027] Base C is equipped with an in-base PC 120 and a server 124. The server 124 is provided on an integrated platform 128 provided at base C. Base C is configured to be able to exchange information with other bases, external PCs 121, and remote monitors 106 via the Internet 127.

[0028] Sites A and B are equipped with semiconductor manufacturing equipment and can process samples, etc. Sites A and B are also equipped with evaluation equipment such as semiconductor inspection equipment, semiconductor analysis equipment, and semiconductor analysis equipment. Semiconductor manufacturing equipment may include, in addition to etching equipment, plasma CVD equipment, ashing equipment, surface modification equipment, etc. Sites A and B can be assumed to be semiconductor manufacturing factories, but are not limited to this. For example, they may be development lines or prototype lines. The semiconductor inspection equipment, semiconductor analysis equipment, and semiconductor analysis equipment inspect, analyze, and evaluate the evaluation objects processed in the semiconductor manufacturing equipment. Sites may be equipped with at least one semiconductor inspection equipment, semiconductor analysis equipment, and semiconductor analysis equipment. On the other hand, site C shows an example in which no semiconductor manufacturing equipment is provided.

[0029] The integrated platforms 108, 118, and 128 can be used as a common platform on which a gateway PC, a data path setting PC, and a server can be arranged. However, in the example shown, the gateway PC and the data path setting PC are not arranged at sites B and C.

[0030] The semiconductor production line PC group 101 controls the semiconductor production equipment and the like that make up the production line at site A. The semiconductor production line PC group 101 controls the semiconductor production equipment at site A based on a processing recipe related to process sequences and control parameters, and acquires data indicating the results of processing performed by the semiconductor production equipment. The acquired data is sent to server 104 via gateway PC 102. The semiconductor production line PC group 101 is also composed of multiple computers. It can also be composed of a single computer. Similarly, the semiconductor production line PC group 101 can also control the semiconductor inspection equipment, semiconductor analysis equipment, and semiconductor analysis equipment at site A.

[0031] The semiconductor production line PC group 111 controls the semiconductor production equipment and the like that make up the production line at site B. The semiconductor production line PC group 111 controls the semiconductor production equipment at site B based on a processing recipe related to the process sequence and control parameters, and acquires data indicating the results of processing performed by the semiconductor production equipment. The acquired data is sent to server 114. The semiconductor production line PC group 111 is also composed of multiple computers. It can also be composed of a single computer. Similarly, the semiconductor production line PC group 111 can also control the semiconductor inspection equipment, semiconductor analysis equipment, and semiconductor analysis equipment at site B.

[0032] Servers 104 and 114 store the specifications of semiconductor manufacturing equipment at their own sites. Servers 104, 114, and 124 can also store the specifications of semiconductor manufacturing equipment at other sites. Specifications of semiconductor manufacturing equipment may also be acquired from other sites. Servers 104, 114, and 124 also store recipes and specifications of semiconductor manufacturing equipment at their own sites or at other sites that have been previously evaluated. A recipe is a set of conditions for processing (e.g., machining) an evaluation target using the semiconductor manufacturing equipment. For example, it may include conditions for etching using an etching equipment, which is a type of semiconductor manufacturing equipment. Furthermore, a recipe may include recipes for inspection, analysis, and analytical processing using a semiconductor inspection equipment, semiconductor analysis equipment, or semiconductor analysis equipment. Equipment specifications are specifications for operating the corresponding semiconductor manufacturing equipment, and include various parameter items, as described below in FIG. 4. The range of each parameter is determined by the equipment specifications, and a recipe defines these parameters.

[0033] The on-site PC 100 at site A can access the semiconductor manufacturing line PC group 101, the integrated platform 108, and the server 104. The on-site PC 110 at site B can access the semiconductor manufacturing line PC group 111, the integrated platform 118, and the server 114. The on-site PC 120 at site C can access the integrated platform 128 and the server 124. Furthermore, the on-site PCs 100, 110, and 120 can access the integrated platforms and servers of other sites through authentication, which will be described later. Furthermore, the external PC 121 and the remote monitor 106 can access the integrated platforms and servers of each site through authentication, which will be described later.

[0034] At site A, for example, a processing recipe for performing an etching process in a semiconductor manufacturing device is input to and executed by semiconductor manufacturing line PC group 101. After execution, the etching device transmits instruction values ​​according to the recipe contents to each device in the etching device, and the etching process is performed. The recipe used for the processing is saved in semiconductor manufacturing line PC group 101.

[0035] The etched wafer is transported to a semiconductor inspection device, a semiconductor analysis device, or a semiconductor analyzer at site A. Then, each measurement recipe is input into semiconductor production line PC group 101, and the specified measurements are performed. The measurement results are stored in semiconductor production line PC group 101.

[0036] The data path setting PC 103 determines whether access is permitted and regulates the data flow. The semiconductor production line PC group 101 assigns an equipment ID (identification information) to each semiconductor production device, which is stored and managed as an equipment master together with the file extension of the output data to be stored, and transmits and saves it as the equipment master to the server 104. Specifically, the semiconductor production line PC group 101 assigns an equipment ID to each semiconductor production device, associates the file extension of the output data output from the semiconductor production device with each equipment ID, manages it, and stores it as the equipment master on the server 104. Examples of file extensions include ".txt" for text data, ".gif" for image data, and ".csv" for CSV files.

[0037] When accessing the semiconductor manufacturing line PC group 101, the device master of the device ID and file extension is referenced and only data that matches the device master is collected. Such a program is installed in the gateway PC 102. The data collection program built into the gateway PC 102 accesses the semiconductor manufacturing line PC group 101 and collects data according to the data flow specified above. The collected data is stored in the base server 104.

[0038] The server 104 may manage data by dividing it into data that is permitted to be made public and data that is prohibited from being made public on an external network. In this case, the management method may be to manage the data by dividing it into categories or levels within a database. For example, data that is permitted to be made public may be permitted to communicate with other locations, while data that is prohibited from being made public may be prohibited from communicating with other locations. Such a rule is defined by the data path setting PC 103.

[0039] Sites B and C do not have a gateway PC 102 or a data path setting PC 103. Even at these sites, the data collection program of the gateway PC 102 can be substituted. For example, at site B, a system can be constructed in which data is collected and stored by operating the site PC 110, or a system can be constructed in which data is collected from the semiconductor manufacturing line PC group 111 and stored in the server 114 without user operation. At site C, a system can be constructed in which data is collected from other sites by operating the site PC 120 and stored. Furthermore, as a substitute for the data path setting PC 103, access permission and data flow regulations can be set by enabling or disabling disclosure depending on the storage location. This allows a system similar to the gateway PC 102 or the data path setting PC 103 to be operated without the gateway PC 102 or the data path setting PC 103.

[0040] Authentication information is registered to log in to the integrated platform 108 at site A. This registration can be performed on the site PC 100 or the external PC 121. A user ID and password are registered as authentication information, and authentication is performed at the time of login. The user logs in to the integrated platform 108 from the site PC 100 or the external PC 121 based on the authentication information. The user then registers a device master in the integrated platform 108. Using the integrated platform 108 makes it possible to send and receive data to and from other sites.

[0041] For example, when transmitting data from the server 104 at site A to the integrated platform 118 at site B, the user ID and password registered in the integrated platform 108 at site A must also be registered in the integrated platform 118. This makes it possible to prevent unauthorized access to data within the integrated platform from external networks. Furthermore, authentication of the integrated platform at another site may be set to allow only data transfer, preventing viewing or editing of the database. This makes it possible to prevent confidential information from leaking to other sites. On the other hand, providing a function to allow reception of data transmitted from other sites makes it possible to share information at other sites.

[0042] For example, a case will be described where data is transferred from base B to base A. In this case, the user ID and password are registered in the integrated platform 108 of base A and the integrated platform 118 of base B. First, the user selects data stored in the database of the server 114 of base B as data to be transferred to base A. This selection can be made using the in-base PC 110 or the external PC 121. Then, the in-base PC 110 or the external PC 121 of base B passes authentication by the integrated platform 118 via the Internet 117 and accesses the server 114 of base B. Then, the initially selected data of base B passes authentication by the integrated platform 108 of base A and is transferred to and stored in the server 104.

[0043] Although etching processing cannot be performed at site C, which does not have semiconductor manufacturing equipment, it is possible to transfer the recipe to another site. This makes it possible to perform etching processing by requesting evaluation from another site that has semiconductor manufacturing equipment. Furthermore, when transferring a recipe for semiconductor manufacturing equipment, the recipe is converted so that it can be processed by the semiconductor manufacturing equipment at the transfer destination, and then transferred.

[0044] 1 may be applied to the semiconductor manufacturing line PC groups 101 and 111, the in-site PCs 100 and 110, the gateway PC 102, the data path setting PC 103, and the servers 104, 114, and 124 in FIG. 2. These may also be equipped with a GUI (Graphical User Interface) for users to input parameter values. The semiconductor manufacturing line PC groups 101 and 111 may also be semiconductor manufacturing equipment (a configuration including a computer within the semiconductor manufacturing equipment).

[0045] <Processing Flow> Fig. 3 is a diagram showing an example of the processing flow from selection of a recipe to be requested for evaluation to transfer of the evaluation results in the present invention. Fig. 3 illustrates the processing flow from the evaluation request to transfer of the evaluation results, taking as an example a case where a recipe for a semiconductor manufacturing device such as an etching device is transferred from site C to site B.

[0046] In step S1, a recipe and a destination device are selected. The user selects the recipe for the semiconductor manufacturing equipment to be evaluated and the semiconductor manufacturing equipment to which the recipe is to be transferred from a database stored in the server 124 at site C. In this case, the server 124 at site C does not have recipe information for the destination semiconductor manufacturing equipment for the current evaluation target. The user selects a recipe for the semiconductor manufacturing equipment stored in the server 124 at site C that is most suitable for the manufacturing of the evaluation target. This selection is made using the in-site PC 120 at site C or an external PC 121 used by a telecommuter, etc. In the case of the in-site PC 120, the selection is made within site C, and in the case of the external PC 121, the selection is made via the Internet 127 and authentication by the integrated platform 128 is passed. When transferring a recipe from the server 124, the user links the recipe with the equipment ID of the semiconductor manufacturing equipment to be used and registers it in the server 124 at their own site, site C.

[0047] Next, in step S2, differences in equipment specifications are confirmed. This process is performed by the server 124. Specifically, the specifications of the semiconductor manufacturing equipment linked to the recipe selected in step S1 are compared with the specifications of the semiconductor manufacturing equipment at the transfer destination. These equipment specifications are stored in the server 124 at site C. The equipment is identified based on the equipment ID assigned to each piece of equipment stored in the server 124 at site C. From the confirmed differences in equipment specifications, it is determined whether or not conversion of each parameter used in the equipment specifications is necessary. If it is determined that parameter conversion is necessary, the process proceeds to step S3. On the other hand, if it is determined that parameter conversion is not necessary, steps S3 and S4 are skipped and the process proceeds to step S5.

[0048] The equipment specifications define the parameters required for the recipe. The differences in equipment specifications in step S2 include, for example, the type of power supply, the presence or absence of hardware functions, the presence or absence of software functions, differences in parameter control ranges, the presence or absence of connected gas, etc.

[0049] In step S3, the recipe is converted and the converted recipe is saved. This process is performed by the server 124. If it is determined that parameter conversion is necessary due to differences in equipment specifications, the parameters are converted based on the parameter conversion items so as to match the parameter items of the destination semiconductor manufacturing equipment. This generates a recipe that can be processed by the destination semiconductor manufacturing equipment. The generated recipe is linked to the equipment ID of the destination semiconductor manufacturing equipment and saved in the server 124 at site C. The recipe is saved as a new recipe rather than overwriting the existing recipe saved in the server 124.

[0050] Next, in step S4, the converted portions of the recipe and their consistency are confirmed and notified. This process is performed by the server 124. The recipe consistency is checked to confirm whether the recipe after parameter conversion can be processed by the semiconductor manufacturing equipment at the transfer destination. Specifically, the recipe consistency check items in the equipment specifications of the semiconductor manufacturing equipment at the transfer destination are read to confirm whether the recipe can be processed. If the recipe consistency check determines that the recipe can be processed, the parameter conversion items are saved in the server 124 at site C. At this time, the on-site PC 120, the external PC 121, and the remote monitor 106 are notified that the recipe conversion has been successfully completed. If the consistency check determines that the recipe cannot be processed, the server 124 at site C records and notifies the parameter items that were problematic in the consistency check, the parameter conversion items, and the equipment specification differences. In this case, the notification is sent to the on-site PC 120 and the external PC 121. In this case, the user can modify the recipe and generate a recipe that can be processed by the semiconductor manufacturing equipment at the transfer destination by performing input operations based on the notified and recorded information via the on-site PC 120 or the external PC 121.

[0051] Next, in step S5, the recipe is transferred to the destination server. In this process, the transfer process is performed by server 124 and the recipe is saved in server 114. Specifically, the recipe to be transferred is transferred to site B via integrated platform 128 at site C and integrated platform 118 at site B. This transfer is performed via Internet 127 and Internet 117. The transferred recipe is saved in a database held by server 114 at site B.

[0052] Next, in step S6, the evaluation results are stored in the server. The recipe requesting evaluation, transferred to the server 114 at site B, is loaded from the server 114 at site B into the semiconductor production line PC group 111 at site B. The evaluation is then performed on the semiconductor manufacturing equipment at site B. The processed evaluation target is evaluated using at least one of the semiconductor inspection equipment, semiconductor analysis equipment, and semiconductor analysis equipment at site B. The evaluation results can be calculated by the semiconductor production line PC group 111. The evaluation involves checking whether the evaluation target is approaching the desired shape, the amount of removal, the degree of processing, etc. Transport from the semiconductor manufacturing equipment to the semiconductor inspection equipment, semiconductor analysis equipment, or semiconductor analysis equipment may be automated under the control of the semiconductor production line PC group 111. In this way, the data obtained from the evaluation is collected in a database on the server 114 at site B. Data collection can be performed using a system substituting the gateway PC described in FIG. 2 . Alternatively, data may be registered in the server 114 by a user operating the on-site PCs 110 and 120 or the external PC 121.

[0053] Next, in step S7, the evaluation results are sent to the requesting server. Specifically, the evaluation results obtained in step S6 are transferred from server 114 at site B to server 124 at site C via the Internet 117, 127. At this time, the evaluation result data passes through integrated platform 118 at site B and integrated platform 118 at site C. This makes it possible to share the evaluation results with other sites.

[0054] It is also possible to request an evaluation through additional processing based on the evaluation results of site B. By registering the recipe for which evaluation is requested in the database in the server 124 of site C and transferring the recipe, it is also possible to continue evaluation using sites other than site B.

[0055] <Specific Example of Recipe Conversion Processing> In steps S3 and S4 of FIG. 3, a recipe is converted and it is determined whether the converted recipe can be processed. A specific example of this will be described.

[0056] For example, if the output before conversion cannot be used due to differences in the power supply of the semiconductor manufacturing equipment, it is changed to the upper limit of the power supply of the equipment specifications of the destination equipment. If the upper limit can be changed to match the power supply of the equipment specifications of the destination equipment, a consistency check determines that the converted recipe can be processed, and a notification is sent that the recipe conversion has been completed successfully. This makes it possible to use the power supply with the semiconductor manufacturing equipment of the destination equipment. If it is not compatible, the consistency check determines that it cannot be processed, and the result is notified and recorded. In this case, the upper limit of the power supply becomes a parameter item.

[0057] For example, if a parameter that did not originally exist is generated due to an increase in a stage temperature control item in the destination equipment specifications, a new parameter item is set. In this case, the temperature of the new parameter can be calculated based on a conversion table prepared in advance, and the new parameter item can be calculated by the server 124. At this time, it is expected that the stage cooling water temperature setting will also be affected. In this case, the recipe value is changed so that both the stage temperature and the cooling water temperature are within the control range. If the new parameter item can be changed to conform to the stage temperature control of the destination equipment specifications, a consistency check determines that the converted recipe can be processed, and a notification is sent that the recipe conversion has been successfully completed. If the new parameter item cannot be changed, the consistency check determines that processing is not possible, and the result is notified and recorded.

[0058] For example, if the etching gas to be used is not installed in the transfer destination equipment, it may be necessary to change to an alternative etching gas. In this case, the user is notified that the recipe needs to be corrected by input.

[0059] <Process for Generating Recipe> Fig. 4 is a diagram showing an example of the flow of the process for generating a recipe in the present invention. In step S3 of Fig. 3, parameters are converted to generate a recipe, and here an example of parameter conversion will be described.

[0060] When creating a recipe, if there are differences in the device specifications, it is necessary to convert parameters, add parameters, or delete unnecessary parameters so that the recipe matches the parameter items of the destination device specifications. A simplified example will be explained using Figure 4.

[0061] Recipe 301 of equipment specification A is stored in server 331, and parameters 1 to 4 shown in recipe 301 are set. When transferring a recipe of equipment specification A to an equipment of equipment specification B, differences in equipment specifications are checked before the recipe is transferred. Equipment specification differences are determined by comparing the equipment specifications based on the equipment ID assigned to each equipment stored in server 331. If there are differences in equipment specifications, parameters that need to be converted are determined based on a parameter conversion table. If it is determined that parameter conversion is necessary, the recipe is converted based on the parameter conversion table so that it becomes recipe 303 that can be processed by an equipment of equipment specification B. This recipe conversion involves deleting unnecessary parameters, adding new parameters, and converting existing parameters.

[0062] After the recipe conversion, the conversion details and the changed recipe are saved in the database of the server 331. Specifically, the differences in device specifications between device specifications A and B, the parameter conversions as recipe conversions, and the added and deleted items are recorded as information on the server. The converted recipe items are then notified to the user, allowing the user to confirm the parameter changes.

[0063] For example, in device specification A, it is assumed that temperature control parameters are controlled using parameter 3 and parameter 4. On the other hand, in device specification B, temperature is controlled using only parameter 3, so parameter 4 is unnecessary and is subject to deletion. Furthermore, parameter 5 does not exist in device specification A, but parameter 5 does exist in device specification B. In this case, parameter 5 is added. For the new parameter to be added, the parameter value can be calculated from other parameters based on the conversion parameter as described above, or an initial value can be input. Furthermore, the numerical value of parameter 2 has been converted from "100" to "110." This allows the value to be changed using a conversion formula, etc., previously defined in a parameter conversion table, etc., based on differences in device specifications.

[0064] For example, if the temperature control range is increased from three to four, the fourth parameter can be set based on the data for the remaining three so that the same temperature control is achieved. The setting method involves preparing a calculation formula in advance and generating the fourth parameter through processing by the server 331. For newly required parameters, such as parameter 5 in FIG. 4, a default parameter value can be entered. For device specification B, if the default value is 5, enter the value 5. This default value can be recorded in advance in the parameter conversion item of the server 331. This default value can also be entered by the server 331.

[0065] Furthermore, an error may occur due to a defect, such as parameter 1 in recipe 302 after conversion to device specification B. In recipe 302, an error is recorded, such as "parameter 1 = 4 (error)." In such a case, the recipe must be changed by user input.

[0066] Examples of error causes include the following: The first is when conversion parameter items are not registered. The second is when information about the latest software is not registered or when problems occur due to data updates. The third is a user-caused problem caused by user-specific parameter settings. For example, when the parameters set by the user are not within the allowable range. The fourth is a problem with the equipment, such as when the etching gas to be used is not connected.

[0067] If an error occurs, the error is notified when the consistency of the recipe conversion is notified. In the example of FIG. 3 , this corresponds to step S4, and the error is notified to the on-site PC 120, the external PC 121, and the remote monitor 106. The user can understand the cause of the error by checking the notified error content and conversion items. Furthermore, the user performs a process to eliminate the error based on the cause of the error using the recipe editor 313 (inputting "0" for parameter 1) in the example of FIG. 4 . Examples of the process to eliminate the error include changing the problematic conversion parameter items or updating software data. As a result, the user uses the recipe editor 313 to change the parameters so that processing according to device specification B is possible. The created recipe is linked to the device ID of the device specification B of the transfer destination and saved in the server 331, and the changed items are kept as a history.

[0068] 4 corresponds to the server 124 in the example of FIG. 3, and the recipe editor 313 in FIG. 4 corresponds to the in-site PC 120 or the external PC 121 in the example of FIG.

[0069] <Effects> The above-described embodiment enables the transfer of semiconductor manufacturing recipes between different sites. It also enables transfer and evaluation from sites without semiconductor manufacturing equipment. In this case, recipes can be appropriately modified and applied even when the specifications of the corresponding semiconductor manufacturing equipment differ. In particular, by adapting recipes by modifying, deleting, or adding parameters to match the equipment specifications, they can be effectively applied when the equipment specifications differ. This shortens the time it takes to transfer recipes to semiconductor manufacturing equipment at other sites and begin evaluation. Furthermore, data can be sent and received between the integrated platforms at each site, facilitating information sharing between sites. This reduces the manual work of recipe conversion and confirmation, prevents equipment problems due to operational errors, and shortens work time. Furthermore, requiring authentication of the integrated platform when a server at a site sends data enhances security. Furthermore, by notifying the user if an error occurs when modifying a recipe and allowing the user to input the information, versatility is enhanced.

[0070] The present invention is not limited to the above-described embodiments, but includes various modifications. For example, the above-described embodiments have been described in detail to clearly explain the present invention, and the present invention is not necessarily limited to those including all of the described configurations. Furthermore, it is possible to replace part of the configuration of one embodiment with the configuration of another embodiment, or to add the configuration of another embodiment to the configuration of one embodiment. Furthermore, it is possible to add, delete, or replace part of the configuration of each embodiment with other configurations.

[0071] For example, while Figure 2 shows an example of three bases, A, B, and C, there may be any number of bases, and there may even be three or more. Furthermore, whether or not to provide a gateway PC, a data path setting PC, and a group of semiconductor manufacturing line PCs can be determined depending on each base.

[0072] Furthermore, the "PC" in the semiconductor manufacturing line PCs 101, 111, the on-site PCs 100, 110, the gateway PC 102, and the data path setting PC 103 refers to a small computer such as a personal computer, but is not limited to this and can be a general computer. For example, instead of a PC terminal, a virtual area, a server, or a mobile terminal can also be used. Furthermore, various communication methods can be used. For example, not only SMB (Server Message Block) communication but also FTP (File Transfer Protocol) communication or NFS (Network File System) communication can be used, and conversely, the remote monitor 106 can be a PC with the same effect.

[0073] 3 has been described as a recipe transfer flow from site C to site B, but this is not limiting. For example, recipe transfer flows from site C to site A, from site B to site A, and from site A to site B can be similarly applied. For example, when transferring a recipe from site A to site B, the recipe for the semiconductor manufacturing equipment at site A can be adapted to the recipe for the semiconductor manufacturing equipment at site B before transfer.

[0074] 2 to 4, the device specifications and recipes for semiconductor manufacturing devices have been described, but the present invention can also be applied to devices for evaluation such as semiconductor inspection devices, semiconductor analysis devices, and semiconductor analytical devices.

[0075] This specification also includes the disclosure of the following aspects: (Aspect 1) A semiconductor device manufacturing system that transfers manufacturing conditions of a first semiconductor manufacturing apparatus at a first site to a second semiconductor manufacturing apparatus at a second site and processes a sample using the second semiconductor manufacturing apparatus, wherein, when specifications of the first semiconductor manufacturing apparatus and the second semiconductor manufacturing apparatus differ and the manufacturing conditions of the first semiconductor manufacturing apparatus are to be transferred to the second semiconductor manufacturing apparatus, the system transfers manufacturing conditions to the second semiconductor manufacturing apparatus that have been generated by adapting parameter items in the manufacturing conditions of the first semiconductor manufacturing apparatus to parameter items in the manufacturing conditions of the second semiconductor manufacturing apparatus.

[0076] (Aspect 2) In the semiconductor manufacturing system according to aspect 1, the adapting of a parameter item in the manufacturing conditions of the first semiconductor manufacturing equipment to a parameter item in the manufacturing conditions of the second semiconductor manufacturing equipment includes deleting, converting, or adding the parameter.

[0077] (Aspect 3) In the semiconductor device manufacturing system according to aspect 2, the parameter deletion is a process of deleting parameters that are not used by the second semiconductor manufacturing equipment.

[0078] (Aspect 4) In the semiconductor manufacturing system according to aspect 2 or 3, the parameter conversion is a process of converting the parameters so as to satisfy a parameter range defined by the specifications of the second semiconductor manufacturing equipment.

[0079] (Aspect 5) In the semiconductor manufacturing system according to any one of Aspects 2 to 4, the addition of the parameter is a process of adding a new parameter when a new parameter is required for the second semiconductor manufacturing equipment.

[0080] (Aspect 6) The semiconductor device manufacturing system according to aspect 5, wherein the value of the new parameter is a preset initial value or a value calculated from another parameter.

[0081] (Aspect 7) The semiconductor device manufacturing system according to any one of aspects 1 to 6, further comprising a GUI for a user to input a parameter value when an incompatible parameter exists.

[0082] (Aspect 8) A semiconductor device manufacturing system according to any one of aspects 1 to 7, further comprising a platform on which an application is implemented, wherein the application transfers manufacturing conditions of the first semiconductor manufacturing equipment at the first site to the second semiconductor manufacturing equipment at the second site.

[0083] (Aspect 9) A server that transfers manufacturing conditions of a first semiconductor manufacturing device at a first site to a second semiconductor manufacturing device at a second site and processes a sample using the second semiconductor manufacturing device, wherein, when the specifications of the first semiconductor manufacturing device and the specifications of the second semiconductor manufacturing device are different and the manufacturing conditions of the first semiconductor manufacturing device are to be transferred to the second semiconductor manufacturing device, the server transfers manufacturing conditions generated by adapting parameter items in the manufacturing conditions of the first semiconductor manufacturing device to parameter items in the manufacturing conditions of the second semiconductor manufacturing device to the second semiconductor manufacturing device.

[0084] (Aspect 10) A semiconductor device manufacturing method in which manufacturing conditions of a first semiconductor manufacturing apparatus at a first site are transferred to a second semiconductor manufacturing apparatus at a second site and a sample is processed by the second semiconductor manufacturing apparatus, wherein, when specifications of the first semiconductor manufacturing apparatus and the second semiconductor manufacturing apparatus are different and the manufacturing conditions of the first semiconductor manufacturing apparatus are transferred to the second semiconductor manufacturing apparatus, the semiconductor device manufacturing method is characterized in that manufacturing conditions generated by adapting parameter items in the manufacturing conditions of the first semiconductor manufacturing apparatus to parameter items in the manufacturing conditions of the second semiconductor manufacturing apparatus are transferred to the second semiconductor manufacturing apparatus.

[0085] 1...computer system, 2...processor, 2A, 2B...processing device, 4...memory, 6...memory bus, 8...I / O bus, 9...bus interface unit, 10...I / O bus interface unit, 12...terminal interface unit, 14...storage interface, 16...I / O device interface, 18...network interface, 20...user I / O device, 22...storage device, 24...display system, 26...display device, 30...network, 50...latent factor identification application, 100...base PC, 101 ...semiconductor manufacturing line PC group, 102...gateway PC, 103...data path setting PC, 104...server, 106...remote monitor, 107...internet, 108...integrated platform, 110...site PC, 111...semiconductor manufacturing line PC group, 114...server, 117...internet, 118...integrated platform, 120...site PC, 121...external PC, 124...server, 127...internet, 128...integrated platform, 301...recipe, 302...recipe, 303...recipe, 313...recipe editor, 331...server

Claims

1. A semiconductor device manufacturing system in which manufacturing conditions of a first semiconductor manufacturing equipment at a first site are transferred to a second semiconductor manufacturing equipment at a second site and samples are processed by the second semiconductor manufacturing equipment, wherein when the specifications of the first semiconductor manufacturing equipment and the specifications of the second semiconductor manufacturing equipment are different and the manufacturing conditions of the first semiconductor manufacturing equipment are transferred to the second semiconductor manufacturing equipment, the system transfers to the second semiconductor manufacturing equipment manufacturing conditions generated by adapting parameter items in the manufacturing conditions of the first semiconductor manufacturing equipment to parameter items in the manufacturing conditions of the second semiconductor manufacturing equipment.

2. A semiconductor device manufacturing system as claimed in claim 1, characterized in that adapting a parameter item in the manufacturing conditions of the first semiconductor manufacturing equipment to a parameter item in the manufacturing conditions of the second semiconductor manufacturing equipment includes deleting, converting or adding the parameter.

3. A semiconductor device manufacturing system according to claim 2, wherein the parameter deletion is a process of deleting parameters that are not used by the second semiconductor manufacturing equipment.

4. A semiconductor device manufacturing system according to claim 2, wherein the parameter conversion is a process of converting the parameters so as to satisfy a parameter range defined by the specifications of the second semiconductor manufacturing equipment.

5. A semiconductor device manufacturing system according to claim 2, wherein the parameter addition is a process of adding a new parameter when a new parameter is required for the second semiconductor manufacturing equipment.

6. A semiconductor device manufacturing system according to claim 5, wherein the value of the new parameter is a preset initial value or a value calculated from another parameter.

7. A semiconductor device manufacturing system according to claim 1, further comprising a GUI for allowing a user to input parameter values ​​when an incompatible parameter exists.

8. A semiconductor device manufacturing system as described in claim 1, comprising a platform on which an application is implemented, and characterized in that the application transfers manufacturing conditions of the first semiconductor manufacturing equipment at the first site to the second semiconductor manufacturing equipment at the second site.

9. A server that transfers manufacturing conditions of a first semiconductor manufacturing equipment at a first site to a second semiconductor manufacturing equipment at a second site and processes a sample using the second semiconductor manufacturing equipment, wherein when the specifications of the first semiconductor manufacturing equipment and the specifications of the second semiconductor manufacturing equipment are different and the manufacturing conditions of the first semiconductor manufacturing equipment are to be transferred to the second semiconductor manufacturing equipment, the server transfers to the second semiconductor manufacturing equipment manufacturing conditions that have been generated by adapting parameter items in the manufacturing conditions of the first semiconductor manufacturing equipment to parameter items in the manufacturing conditions of the second semiconductor manufacturing equipment.

10. A semiconductor device manufacturing method in which manufacturing conditions of a first semiconductor manufacturing equipment at a first site are transferred to a second semiconductor manufacturing equipment at a second site and a sample is processed by the second semiconductor manufacturing equipment, wherein when the specifications of the first semiconductor manufacturing equipment and the specifications of the second semiconductor manufacturing equipment are different and the manufacturing conditions of the first semiconductor manufacturing equipment are transferred to the second semiconductor manufacturing equipment, the manufacturing conditions are generated by adapting parameter items in the manufacturing conditions of the first semiconductor manufacturing equipment to parameter items in the manufacturing conditions of the second semiconductor manufacturing equipment, and the manufacturing conditions are transferred to the second semiconductor manufacturing equipment.

Images