Display module including molding structure, and electronic device comprising same

Abstract

In one embodiment, an electronic device comprises: a display module including a first housing, a second housing, a front part disposed to face a first direction, a first extension part that extends from one end of the front part so as to be bent in a second direction opposite to the first direction, and a second extension part that extends from the first extension part so as to be positioned in the rear direction of the front part; a molding structure encompassing at least the first extension part of the display module and including a conductive material; and a conductive member electrically connecting the molding structure to the first housing or the second housing. The surface of the molding structure in the first direction can be positioned at the same height as or higher than the outermost layer of the front part of the display module in the first direction.

Description

Display module including a molding structure and electronic device including the same

[0001] One embodiment of the present document relates to a display module including a molding structure and an electronic device including the same.

[0002] With the advancement of display-related technology, electronic devices equipped with flexible displays are being developed. Flexible displays can be used not only in a flat form but also in a specific form. For example, an electronic device including a flexible display can be implemented in a foldable form, capable of folding or unfolding along at least one folding axis.

[0003] In one embodiment, an electronic device may include a display module including a first housing and a second housing that are foldably connected to each other, a front portion disposed in the first housing and the second housing and facing a first direction, a first extension portion extending from one end of the front portion and bending in a second direction opposite to the first direction, and a second extension portion extending from the first extension portion and positioned toward a rear surface of the front portion, a molding structure formed to surround at least the first extension portion of the display module and including a conductive material, and a conductive member electrically connecting the molding structure to the first housing or the second housing. A surface of the molding structure in the first direction may be positioned at the same height as or higher than an outermost layer of the front portion of the display module in the first direction.

[0004] In one embodiment, a display module applied to an electronic device may include a front portion arranged to face a first direction, a first extension portion extending from one end of the front portion and bending toward a second direction opposite to the first direction, a second extension portion extending from the first extension portion and positioned toward a rear surface of the front portion, and a molding structure formed to surround at least the first extension portion of the display module and including a conductive material. A surface of the molding structure in the first direction may be positioned at the same height as or higher than an outermost layer of the front portion of the display module in the first direction.

[0005] In one embodiment, an electronic device may include a display module including a first housing and a second housing that are foldably connected to each other, a front portion disposed in the first housing and the second housing and facing a first direction, a first extension portion extending from one end of the front portion and bending in a second direction opposite to the first direction, and a second extension portion extending from the first extension portion and positioned toward a rear surface of the front portion, a molding structure formed to surround at least the first extension portion of the display module and including a conductive material, and a conductive member electrically connecting the molding structure to the first housing or the second housing. A surface of the molding structure in the first direction may be positioned at the same height as or higher than an outermost layer of the front portion of the display module in the first direction. The molding structure may be formed through a molding process using a mold having a shape that surrounds the first extension portion of the display module. The molding structure may be elastically deformable during the process of folding the electronic device from an unfolded state. The width of the surface of the molding structure in the first direction may be smaller than the width of the surface in the second direction. When static electricity is generated in the border area of ​​the display module, the static electricity may be discharged to the first housing or the second housing through the display module, the molding structure, and the conductive member.

[0006] In one embodiment, when static electricity is generated in the border area of ​​the display module, the static electricity can be discharged to the first housing or the second housing through the display module, the molding structure, and the conductive member.

[0007] In one embodiment, the molding structure may protect the side of the display module.

[0008] The effects of a display module including a molding structure according to one embodiment and an electronic device including the same are not limited to those mentioned above, and other effects not mentioned will be clearly understood by those skilled in the art from the description below.

[0009] The above and other aspects, features and advantages of specific embodiments of the present invention will become more apparent from the following detailed description taken in conjunction with the accompanying drawings, in which:

[0010] FIG. 1 is a block diagram of an electronic device within a network environment according to one embodiment.

[0011] FIG. 2A is a diagram illustrating an unfolded state of an electronic device according to an embodiment of the present disclosure.

[0012] FIG. 2b is a diagram illustrating a folded state of an electronic device according to an embodiment of the present disclosure.

[0013] FIG. 2c is an exploded perspective view of a portion of an electronic device according to one embodiment.

[0014] Figure 3 is a rear view of a display module according to one embodiment.

[0015] FIG. 4 is a cross-sectional view taken along line II of FIG. 2a of an electronic device in an unfolded state according to one embodiment.

[0016] FIG. 5 is a cross-sectional view of a position corresponding to FIG. 4 in a folded state of an electronic device according to one embodiment.

[0017] Figure 6 is a cross-sectional view of an electronic device according to one embodiment.

[0018] Figure 7 is a cross-sectional view of an electronic device according to one embodiment.

[0019] Hereinafter, embodiments will be described in detail with reference to the attached drawings. In the description with reference to the attached drawings, identical components are assigned the same reference numerals regardless of the drawing numbers, and redundant descriptions thereof will be omitted.

[0020] FIG. 1 is a block diagram of an electronic device (101) within a network environment (100) according to an embodiment. Referring to FIG. 1, in the network environment (100), the electronic device (101) may communicate with the electronic device (102) via a first network (198) (e.g., a short-range wireless communication network), or may communicate with at least one of the electronic device (104) or the server (108) via a second network (199) (e.g., a long-range wireless communication network). According to an embodiment, the electronic device (101) may communicate with the electronic device (104) via the server (108). According to one embodiment, the electronic device (101) may include a processor (120), a memory (130), an input module (150), an audio output module (155), a display module (160), an audio module (170), a sensor module (176), an interface (177), a connection terminal (178), a haptic module (179), a camera module (180), a power management module (188), a battery (189), a communication module (190), a subscriber identification module (196), or an antenna module (197). In one embodiment, the electronic device (101) may have at least one of these components (e.g., the connection terminal (178)) omitted, or one or more other components added. In one embodiment, some of these components (e.g., the sensor module (176), the camera module (180), or the antenna module (197)) may be integrated into one component (e.g., the display module (160)).

[0021] The processor (120) may control at least one other component (e.g., a hardware or software component) of the electronic device (101) connected to the processor (120) by executing, for example, software (e.g., a program (140)), and may perform various data processing or calculations. According to one embodiment, as at least a part of the data processing or calculation, the processor (120) may store a command or data received from another component (e.g., a sensor module (176) or a communication module (190)) in a volatile memory (132), process the command or data stored in the volatile memory (132), and store the resulting data in a non-volatile memory (134). According to one embodiment, the processor (120) may include a main processor (121) (e.g., a central processing unit or an application processor) or a secondary processor (123) (e.g., a graphics processing unit, a neural processing unit (NPU), an image signal processor, a sensor hub processor, or a communication processor) that can operate independently or together therewith. For example, if the electronic device (101) includes a main processor (121) and a secondary processor (123), the secondary processor (123) may be configured to use less power than the main processor (121) or to be specialized for a specified function. The secondary processor (123) may be implemented separately from the main processor (121) or as a part thereof.

[0022] The auxiliary processor (123) may control at least a part of functions or states associated with at least one component (e.g., a display module (160), a sensor module (176), or a communication module (190)) of the electronic device (101), for example, on behalf of the main processor (121) while the main processor (121) is in an inactive (e.g., sleep) state, or together with the main processor (121) while the main processor (121) is in an active (e.g., application execution) state. In one embodiment, the auxiliary processor (123) (e.g., an image signal processor or a communication processor) may be implemented as a part of another functionally related component (e.g., a camera module (180) or a communication module (190)). In one embodiment, the auxiliary processor (123) (e.g., a neural network processing unit) may include a hardware structure specialized for processing artificial intelligence models. The artificial intelligence models may be generated through machine learning. This learning can be performed, for example, on the electronic device (101) itself where the artificial intelligence model is executed, or can be performed through a separate server (e.g., server (108)). The learning algorithm can include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but is not limited to the examples described above. The artificial intelligence model can include multiple artificial neural network layers.The artificial neural network may be one of a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), a deep Q-network, or a combination of two or more of the above, but is not limited to the examples described above. In addition to, or alternatively to, a hardware structure, an artificial intelligence model may include a software structure.

[0023] The memory (130) can store various data used by at least one component (e.g., processor (120) or sensor module (176)) of the electronic device (101). The data can include, for example, software (e.g., program (140)) and input data or output data for commands related thereto. The memory (130) can include volatile memory (132) or non-volatile memory (134).

[0024] The program (140) may be stored as software in the memory (130) and may include, for example, an operating system (142), middleware (144), or an application (146).

[0025] The input module (150) can receive commands or data to be used in a component of the electronic device (101) (e.g., a processor (120)) from an external source (e.g., a user) of the electronic device (101). The input module (150) can include, for example, a microphone, a mouse, a keyboard, a key (e.g., a button), or a digital pen (e.g., a stylus pen).

[0026] The audio output module (155) can output audio signals to the outside of the electronic device (101). The audio output module (155) can include, for example, a speaker or a receiver. The speaker can be used for general purposes, such as multimedia playback or recording playback. The receiver can be used to receive incoming calls. According to one embodiment, the receiver can be implemented separately from the speaker or as part of the speaker.

[0027] The display module (160) can visually provide information to an external party (e.g., a user) of the electronic device (101). The display module (160) may include, for example, a display, a holographic device, or a projector and a control circuit for controlling the device. According to one embodiment, the display module (160) may include a touch sensor configured to detect a touch, or a pressure sensor configured to measure the intensity of a force generated by the touch.

[0028] The audio module (170) can convert sound into an electrical signal, or vice versa, convert an electrical signal into sound. According to one embodiment, the audio module (170) can acquire sound through the input module (150), output sound through the sound output module (155), or an external electronic device (e.g., electronic device (102)) (e.g., speaker or headphone) directly or wirelessly connected to the electronic device (101).

[0029] The sensor module (176) can detect the operating status (e.g., power or temperature) of the electronic device (101) or the external environmental status (e.g., user status) and generate an electrical signal or data value corresponding to the detected status. According to one embodiment, the sensor module (176) can include, for example, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0030] The interface (177) may support one or more designated protocols that may be used to directly or wirelessly connect the electronic device (101) with an external electronic device (e.g., the electronic device (102)). In one embodiment, the interface (177) may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

[0031] The connection terminal (178) may include a connector through which the electronic device (101) may be physically connected to an external electronic device (e.g., electronic device (102)). According to one embodiment, the connection terminal (178) may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0032] A haptic module (179) can convert electrical signals into mechanical stimuli (e.g., vibration or movement) or electrical stimuli that a user can perceive through tactile or kinesthetic sensations. According to one embodiment, the haptic module (179) can include, for example, a motor, a piezoelectric element, or an electrical stimulation device.

[0033] The camera module (180) can capture still images and videos. According to one embodiment, the camera module (180) may include one or more lenses, image sensors, image signal processors, or flashes.

[0034] The power management module (188) can manage power supplied to the electronic device (101). According to one embodiment, the power management module (188) can be implemented as, for example, at least a part of a power management integrated circuit (PMIC).

[0035] A battery (189) may power at least one component of the electronic device (101). In one embodiment, the battery (189) may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

[0036] The communication module (190) may support the establishment of a direct (e.g., wired) communication channel or a wireless communication channel between the electronic device (101) and an external electronic device (e.g., electronic device (102), electronic device (104), or server (108)), and the performance of communication through the established communication channel. The communication module (190) may operate independently from the processor (120) (e.g., application processor) and may include one or more communication processors that support direct (e.g., wired) communication or wireless communication. According to one embodiment, the communication module (190) may include a wireless communication module (192) (e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module (194) (e.g., a local area network (LAN) communication module, or a power line communication module). Among these communication modules, the corresponding communication module can communicate with an external electronic device (104) via a first network (198) (e.g., a short-range communication network such as Bluetooth, wireless fidelity (WiFi) direct, or infrared data association (IrDA)) or a second network (199) (e.g., a long-range communication network such as a legacy cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., a LAN or WAN)). These various types of communication modules can be integrated into a single component (e.g., a single chip) or implemented as multiple separate components (e.g., multiple chips). The wireless communication module (192) can verify or authenticate the electronic device (101) within a communication network such as the first network (198) or the second network (199) by using subscriber information (e.g., an international mobile subscriber identity (IMSI)) stored in the subscriber identification module (196).

[0037] The wireless communication module (192) can support 5G networks and next-generation communication technologies following the 4G network, such as NR access technology (new radio access technology). The NR access technology can support high-speed transmission of high-capacity data (eMBB (enhanced mobile broadband)), minimization of terminal power and connection of multiple terminals (mMTC (massive machine type communications)), or high reliability and low latency (URLLC (ultra-reliable and low-latency communications)). The wireless communication module (192) can support, for example, a high-frequency band (e.g., mmWave band) to achieve a high data transmission rate. The wireless communication module (192) can support various technologies for securing performance in a high-frequency band, such as beamforming, massive multiple-input and multiple-output (MIMO), full dimensional MIMO (FD-MIMO), array antenna, analog beam-forming, or large scale antenna. The wireless communication module (192) can support various requirements specified in the electronic device (101), an external electronic device (e.g., the electronic device (104)), or a network system (e.g., the second network (199)). According to one embodiment, the wireless communication module (192) may support a peak data rate (e.g., 20 Gbps or more) for eMBB realization, a loss coverage (e.g., 164 dB or less) for mMTC realization, or a U-plane latency (e.g., 0.5 ms or less for downlink (DL) and uplink (UL), or 1 ms or less for round trip) for URLLC realization.

[0038] The antenna module (197) can transmit or receive signals or power to or from an external device (e.g., an external electronic device). According to one embodiment, the antenna module (197) may include an antenna including a radiator formed of a conductor or a conductive pattern formed on a substrate (e.g., a PCB). According to one embodiment, the antenna module (197) may include a plurality of antennas (e.g., an array antenna). In this case, at least one antenna suitable for a communication method used in a communication network, such as the first network (198) or the second network (199), may be selected from the plurality of antennas, for example, by the communication module (190). A signal or power may be transmitted or received between the communication module (190) and an external electronic device via the selected at least one antenna. According to one embodiment, in addition to the radiator, another component (e.g., a radio frequency integrated circuit (RFIC)) may be additionally formed as a part of the antenna module (197).

[0039] In one embodiment, the antenna module (197) may form a mmWave antenna module. In one embodiment, the mmWave antenna module may include a printed circuit board, an RFIC disposed on or adjacent a first side (e.g., a bottom side) of the printed circuit board and capable of supporting a designated high-frequency band (e.g., a mmWave band), and a plurality of antennas (e.g., an array antenna) disposed on or adjacent a second side (e.g., a top side or a side side) of the printed circuit board and capable of transmitting or receiving signals in the designated high-frequency band.

[0040] At least some of the above components can be interconnected and exchange signals (e.g., commands or data) with each other via a communication method between peripheral devices (e.g., a bus, GPIO (general purpose input and output), SPI (serial peripheral interface), or MIPI (mobile industry processor interface)).

[0041] According to one embodiment, commands or data may be transmitted or received between the electronic device (101) and an external electronic device (104) via a server (108) connected to a second network (199). Each of the external electronic devices (102 or 104) may be the same or a different type of device as the electronic device (101). According to one embodiment, all or part of the operations executed in the electronic device (101) may be executed in one or more of the external electronic devices (102, 104, or 108). For example, when the electronic device (101) is to perform a certain function or service automatically or in response to a request from a user or another device, the electronic device (101) may, instead of or in addition to executing the function or service itself, request one or more external electronic devices to perform the function or at least a part of the service. One or more external electronic devices that receive the request may execute at least a portion of the requested function or service, or an additional function or service related to the request, and transmit the result of the execution to the electronic device (101). The electronic device (101) may process the result as is or additionally and provide it as at least a portion of a response to the request. For this purpose, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology may be used, for example. The electronic device (101) may provide an ultra-low latency service by using distributed computing or mobile edge computing, for example. In another embodiment, the external electronic device (104) may include an Internet of Things (IoT) device. The server (108) may be an intelligent server utilizing machine learning and / or a neural network. According to one embodiment, the external electronic device (104) or the server (108) may be included in the second network (199).The electronic device (101) can be applied to intelligent services (e.g., smart home, smart city, smart car, or healthcare) based on 5G communication technology and IoT-related technology.

[0042] Electronic devices according to embodiments disclosed herein may take various forms. Electronic devices may include, for example, portable communication devices (e.g., smartphones), computer devices, portable multimedia devices, portable medical devices, cameras, wearable devices, or home appliances. Electronic devices according to embodiments disclosed herein are not limited to the aforementioned devices.

[0043] The embodiments of this document and the terminology used herein are not intended to limit the technical features described in this document to specific embodiments, but should be understood to include various modifications, equivalents, or substitutes of the embodiments. In connection with the description of the drawings, similar reference numerals may be used for similar or related components. The singular form of a noun corresponding to an item may include one or more of the items, unless the context clearly indicates otherwise. In this document, each of the phrases "A or B", "at least one of A and B", "at least one of A or B", "A, B, or C", "at least one of A, B, and C", and "at least one of A, B, or C" can include any one of the items listed together in the corresponding phrase among those phrases, or all possible combinations thereof. Terms such as "first," "second," or "first" or "second" may be used merely to distinguish one component from another, and do not limit the components in any other respect (e.g., importance or order). When a component (e.g., a first component) is referred to as "coupled" or "connected" to another (e.g., a second component), with or without the terms "functionally" or "communicatively," it means that the component can be connected to the other component directly (e.g., wired), wirelessly, or through a third component.

[0044] The term "module" used in one embodiment of this document may include a unit implemented in hardware, software, or firmware, and may be used interchangeably with terms such as logic, logic block, component, or circuit. A module may be an integral component, or a minimum unit or part of such a component that performs one or more functions. For example, according to one embodiment, a module may be implemented in the form of an application-specific integrated circuit (ASIC).

[0045] An embodiment of the present document may be implemented as software (e.g., a program (140)) including one or more instructions stored in a storage medium (e.g., an internal memory (136) or an external memory (138)) readable by a machine (e.g., an electronic device (101)). For example, a processor (e.g., a processor (120)) of the machine (e.g., an electronic device (101)) may call at least one instruction among the one or more instructions stored from the storage medium and execute it. This enables the machine to operate to perform at least one function according to the at least one called instruction. The one or more instructions may include code generated by a compiler or code executable by an interpreter. The machine-readable storage medium may be provided in the form of a non-transitory storage medium. Here, 'non-transitory' simply means that the storage medium is a tangible device and does not contain signals (e.g., electromagnetic waves), and the term does not distinguish between cases where data is stored semi-permanently or temporarily on the storage medium.

[0046] According to one embodiment, the method according to one embodiment disclosed in the present document may be provided as included in a computer program product. The computer program product may be traded as a product between a seller and a buyer. The computer program product may be distributed in the form of a machine-readable storage medium (e.g., compact disc read only memory (CD-ROM)), or may be distributed online (e.g., downloaded or uploaded) via an application store (e.g., Play Store™) or directly between two user devices (e.g., smart phones). In the case of online distribution, at least a portion of the computer program product may be temporarily stored or temporarily generated in a machine-readable storage medium, such as the memory of a manufacturer's server, an application store's server, or an intermediary server.

[0047] According to one embodiment, each component (e.g., a module or a program) of the above-described components may include one or more entities, and some of the entities may be separated and placed in other components. According to one embodiment, one or more components or operations of the aforementioned components may be omitted, or one or more other components or operations may be added. Alternatively or additionally, a plurality of components (e.g., a module or a program) may be integrated into a single component. In such a case, the integrated component may perform one or more functions of each of the plurality of components identically or similarly to those performed by the corresponding component among the plurality of components prior to the integration. According to one embodiment, the operations performed by a module, program, or other component may be executed sequentially, in parallel, iteratively, or heuristically, or one or more of the operations may be executed in a different order, omitted, or one or more other operations may be added.

[0048] FIG. 2A is a diagram illustrating an unfolded state of an electronic device according to an embodiment of the present disclosure. FIG. 2B is a diagram illustrating a folded state of an electronic device according to an embodiment of the present disclosure. FIG. 2C is a partially exploded perspective view of an electronic device according to an embodiment.

[0049] The electronic device (200) of FIGS. 2A to 2C may be a foldable or bendable electronic device, as an example of the electronic device (101) illustrated in FIG. 1.

[0050] Referring to FIGS. 2A to 2C , in one embodiment, the electronic device (200) may include a foldable housing (201), a frame (240), and / or a display module (250) (e.g., the display module (160) of FIG. 1 ). The display module (250) may include a flexible or foldable display panel disposed within a space formed by the foldable housing (201). According to one embodiment, a surface on which the display module (250) is disposed (or a surface on which the display module (250) is visible from the outside of the electronic device (200)) may be defined as a front surface of the electronic device (200). And, a surface opposite to the front surface may be defined as a rear surface of the electronic device (200). In addition, a surface surrounding the space between the front surface and the rear surface may be defined as a side surface of the electronic device (200).

[0051] In one embodiment, the foldable housing (201) may include a first housing (210), a second housing (220), a first rear cover (215), a second rear cover (225), and / or a hinge structure (230). For example, the hinge structure (230) may include a hinge cover that covers a foldable portion of the foldable housing (201). The foldable housing (201) of the electronic device (200) is not limited to the shape and combination shown in FIGS. 2A and 2B, and may be implemented by a combination and / or combination of other shapes or parts. For example, in one embodiment, the first housing (210) and the first rear cover (215) may be formed integrally, and the second housing (220) and the second rear cover (225) may be formed integrally.

[0052] In one embodiment, the first housing (210) is connected to the hinge structure (230) and may include a first side facing a first direction and a second side facing a second direction opposite to the first direction. The second housing (220) is connected to the hinge structure (230) and may include a third side facing a third direction and a fourth side facing a fourth direction opposite to the third direction. The second housing (220) may rotate relative to the first housing (210) about the hinge structure (230). The electronic device (200) may be variable between a folded state and an unfolded state.

[0053] In one embodiment, the electronic device (200) may have the first side facing the third side in a fully folded state, and the third direction may be substantially the same as the first direction in a fully unfolded state.

[0054] In one embodiment, the first housing (210) and the second housing (220) may be foldably connected to each other. The first housing (210) and the second housing (220) may be arranged on both sides with respect to the folding axis (A) as the center, and may have an overall symmetrical shape with respect to the folding axis (A). As described below, the angle or distance between the first housing (210) and the second housing (220) may vary depending on whether the electronic device (200) is in an unfolded state, a folded state, or a partially unfolded (or partially folded) intermediate state. According to one embodiment, the second housing (220) may include a sensor area (222) in which various sensors are arranged. For example, the various sensors may be located on the back of the display module (250) in the sensor area (222). According to one embodiment, the first housing (210) may include a sensor area (not shown) in which at least one sensor is arranged.

[0055] In one embodiment, the first housing (210) and the second housing (220) may form a recess for accommodating the display module (250). In one embodiment, components for performing various functions built into the electronic device (200) may be exposed to the front of the electronic device (200) through the sensor area (222) or through one or more openings provided in the sensor area (222). In one embodiment, the components may include various types of sensors. The sensors may include, for example, at least one of a front camera, a receiver, or a proximity sensor. According to one embodiment, the sensor area (222) in the second housing (220) may be omitted or formed in a different location than that shown in the drawing.

[0056] In one embodiment, at least a portion of the first housing (210) and the second housing (220) may include a metallic or non-metallic material having a rigidity of a size selected to support the display module (250). For example, at least a portion formed of the metallic material may provide a ground plane of the electronic device (200) and may be electrically connected to a ground line formed on a printed circuit board disposed inside the foldable housing (201).

[0057] In one embodiment, the first rear cover (215) may be disposed on one side of the folding axis (A) on the rear of the electronic device (200). For example, the first rear cover (215) may have a substantially rectangular periphery, and the periphery may be wrapped by the first housing (210). For example, the second rear cover (225) may be disposed on the other side of the folding axis (A) on the rear of the electronic device (200). For example, the periphery of the second rear cover (225) may be wrapped by the second housing (220).

[0058] In one embodiment, the first rear cover (215) and the second rear cover (225) may have substantially symmetrical shapes with respect to the folding axis (A). However, the first rear cover (215) and the second rear cover (225) do not necessarily have mutually symmetrical shapes, and in one embodiment, the electronic device (200) may include the first rear cover (215) and the second rear cover (225) of various shapes. In one embodiment, the first rear cover (215) may be formed integrally with the first housing (210), and the second rear cover (225) may be formed integrally with the second housing (220).

[0059] In one embodiment, the first rear cover (215), the second rear cover (225), the first housing (210), and the second housing (220) may form a space in which various components of the electronic device (200) (e.g., a printed circuit board or a battery) may be placed. According to one embodiment, one or more components may be placed or visually exposed on the rear surface of the electronic device (200). For example, at least a portion of the sub-display may be visually exposed through the first rear area (216) of the first rear cover (215). In one embodiment, one or more components or sensors may be visually exposed through the second rear area (226) of the second rear cover (225). In one embodiment, the sensors may include a proximity sensor and / or a rear camera.

[0060] In one embodiment, a front camera visually exposed to the front of the electronic device (200) through one or more openings provided in the sensor area (222) or a rear camera visually exposed through the second rear area (226) of the second rear cover (225) may include one or more lenses, an image sensor, and / or an image signal processor. A flash may include, for example, a light emitting diode or a xenon lamp. In some embodiments, two or more lenses (infrared camera, wide-angle and telephoto lenses) and image sensors may be arranged on one side of the electronic device (200).

[0061] In one embodiment, referring to FIG. 2B, the hinge cover may be configured to be disposed between the first housing (210) and the second housing (220) so as to cover an internal component (e.g., a hinge structure (230)). According to one embodiment, the hinge structure (230) may be covered by a portion of the first housing (210) and the second housing (220) or exposed to the outside, depending on the state of the electronic device (200) (an unfolded state, an intermediate state, or a folded state).

[0062] In one embodiment, as illustrated in FIG. 2A, when the electronic device (200) is in an unfolded state (e.g., a fully unfolded state), the hinge structure (230) may not be exposed because it is covered by the first housing (210) and the second housing (220). In one embodiment, as illustrated in FIG. 2B, when the electronic device (200) is in a folded state (e.g., a fully folded state), the hinge structure (230) may be exposed to the outside between the first housing (210) and the second housing (220). In one embodiment, when the first housing (210) and the second housing (220) are in an intermediate state where they are folded with a certain angle, the hinge structure (230) may be partially exposed to the outside between the first housing (210) and the second housing (220). However, in this case, the exposed area may be less than in a fully folded state. In one embodiment, the hinge structure (230) may include a curved surface.

[0063] In one embodiment, the border frame (240) may be connected to the foldable housing (201) to surround at least a portion of the border area of ​​the display module (250). For example, the border frame (240) may surround the front and / or side of the border area of ​​the display module (250). For example, the border frame (240) may include a first border frame (241) and a second border frame (242). The first border frame (241) and the second border frame (242) may be connected to the first housing (210) and the second housing (220), respectively, to surround at least a portion of the border area of ​​the display module (250). However, this is exemplary, and the first border frame (241) and the second border frame (242) may be formed integrally with the first housing (210) and the second housing (220), respectively.

[0064] In one embodiment, the display module (250) may be placed on a space formed by the foldable housing (201). For example, the display module (250) may be mounted on a recess formed by the foldable housing (201) and may be visible from the outside through the front of the electronic device (200). For example, the display module (250) may form most of the front of the electronic device (200). For example, the front of the electronic device (200) may include the display module (250) and a portion of the first housing (210) adjacent to the display module (250) and a portion of the second housing (220). For example, the back of the electronic device (200) may include a first back cover (215), a portion of a first housing (210) adjacent to the first back cover (215), a second back cover (225), and a portion of a second housing (220) adjacent to the second back cover (225).

[0065] In one embodiment, the display module (250) may refer to a display in which at least a portion of the display can be transformed into a flat or curved surface. According to one embodiment, the display module (250) may include a folding area (253), a first area (251) disposed on one side (e.g., the left side of the folding area (253) illustrated in FIG. 2A) with respect to the folding area (253), and a second area (252) disposed on the other side (e.g., the right side of the folding area (253) illustrated in FIG. 2A). However, the division of areas of the display module (250) illustrated in FIG. 2A is exemplary, and the display module (250) may be divided into a plurality of areas (e.g., four or more or two) depending on the structure or function. For example, in the embodiment illustrated in FIG. 2A, the regions of the display module (250) may be divided by a folding region (253) extending parallel to the folding axis (A), but in one embodiment, the regions may also be divided based on another folding axis of the display module (250) (e.g., a folding axis parallel to the width direction of the electronic device).

[0066] In one embodiment, the display module (250) may be coupled with or disposed adjacent to a touch panel equipped with a touch detection circuit and a pressure sensor capable of measuring the intensity (pressure) of a touch. For example, the display module (250) may be coupled with or disposed adjacent to a touch panel that detects an electromagnetic resonance (EMR) stylus pen, as an example of a touch panel.

[0067] In one embodiment, the first region (251) and the second region (252) may have an overall symmetrical shape centered on the folding region (253). However, unlike the first region (251), the second region (252) may include a cut notch depending on the presence of the sensor region (222), but may have a shape symmetrical with respect to the first region (251) in other regions. For example, the first region (251) and the second region (252) may include a portion having a symmetrical shape and a portion having an asymmetrical shape.

[0068] In one embodiment, the edge thicknesses of the first region (251) and the second region (252) may be formed to be different from the edge thickness of the folding region (253). The edge thickness of the folding region (253) may be formed to be thinner than the thicknesses of the first region (251) and the second region (252). In terms of thickness, the first region (251) and the second region (252) may have an asymmetrical shape when the first region (251) and the second region (252) are viewed in cross-section. For example, the edge of the first region (251) may be formed to have a first radius of curvature, and the edge of the second region (252) may be formed to have a second radius of curvature that is different from the first radius of curvature. In one embodiment, in terms of thickness, the first region (251) and the second region (252) may have a symmetrical shape when the first region (251) and the second region (252) are viewed in cross section.

[0069] Hereinafter, the operation of the first housing (210) and the second housing (220) and each area of ​​the display module (250) according to the state of the electronic device (200) (e.g., folded state, unfolded state, or intermediate state) will be described.

[0070] In one embodiment, when the electronic device (200) is in an unfolded state (e.g., FIG. 2a), the first housing (210) and the second housing (220) may be arranged to face the same direction at an angle of about 180 degrees. The surface of the first region (251) and the surface of the second region (252) of the display module (250) may form an angle of 180 degrees with each other and face the same direction (e.g., toward the front of the electronic device). The folding region (253) may form the same plane as the first region (251) and the second region (252).

[0071] In one embodiment, when the electronic device (200) is in a folded state (e.g., FIG. 2b), the first housing (210) and the second housing (220) may be arranged to face each other. The surface of the first region (251) and the surface of the second region (252) of the display module (250) may form a narrow angle (e.g., between 0 and 10 degrees) with each other and may face each other. The folding region (253) may be formed as a curved surface having at least a portion of a predetermined curvature.

[0072] In one embodiment, when the electronic device (200) is in an intermediate state, the first housing (210) and the second housing (220) may be arranged at a certain angle with respect to each other. The surface of the first region (251) and the surface of the second region (252) of the display module (250) may form an angle that is larger than the angle in the folded state and smaller than the angle in the unfolded state. The folding region (253) may be formed as a curved surface having at least a portion of a certain curvature, and the curvature at this time may be smaller than that in the folded state.

[0073] FIG. 3 is a rear view of a display module according to one embodiment. FIG. 4 is a cross-sectional view taken along line II of FIG. 2A in an unfolded state of an electronic device according to one embodiment. FIG. 5 is a cross-sectional view of a position corresponding to FIG. 4 in a folded state of an electronic device according to one embodiment.

[0074] Referring to FIGS. 3 to 5, in one embodiment, the display module (250) may include various layers that are stacked on top of each other and / or various electrical elements that are electrically connected to each other. The display module (250) may include a front portion (254), a first extension portion (255), and a second extension portion (256). The front portion (254) may refer to a portion that is arranged to face a first direction (e.g., +Z direction). For example, a window layer (310), a polarizing layer (320), a portion of a display panel (330), and / or a third protective layer (340) described below may be arranged on the front portion (254). The first extension portion (255) may be a portion that extends from one end (e.g., -X direction end) of the front portion (254) and bends toward a second direction (e.g., -Z direction) opposite to the first direction (e.g., +Z direction). For example, the first extension portion (255) may be positioned substantially oriented in the lateral direction (e.g., the -X direction) of the electronic device (e.g., the electronic device (200) of FIG. 2C). For example, a portion of a display panel (330), a bending protection member (410), and / or a molding structure (430) described below may be positioned on the first extension portion (255). The second extension portion (256) may be positioned extending from the first extension portion (255) in the rear direction (e.g., the -Z direction) of the front portion (254). For example, the second extension portion (256) may be positioned substantially parallel to the front portion (254) in the rear direction (e.g., the -Z direction) of the front portion (254). For example, the fourth protection layer (370), a portion of the display panel (330), and / or a cover member (420) described below may be positioned on the second extension portion (256). The second extension portion (256) of the display module (250) may be electrically connected to a flexible printed circuit board (610). For example, a control circuit (620) may be arranged in the second extension portion (256).For example, the control circuit (620) may be arranged in the second extension (256) in a COP (chip on panel or chip on plastic) manner. For example, the control circuit (620) may include a DDI (display driver IC) or a TDDI (touch display driver IC).

[0075] In one embodiment, the display module (250) may include a window layer (310), a polarizing layer (320), a display panel (330), a third protective layer (340), a composite sheet (350), a conductive plate (360), a fourth protective layer (370), a spacer (380), a bending protective member (410), a cover member (420), a flexible printed circuit board (610), a control circuit (620), a molding structure (430), and / or a conductive member (440).

[0076] In one embodiment, the window layer (310) may include a first protective layer (311) and a second protective layer (312). For example, the first protective layer (311) may include a polymer layer. For example, the first protective layer (311) may include a PET or polyimide material. For example, the second protective layer (312) may include a glass layer. For example, the second protective layer (312) may include ultra thin glass (UTG). For example, the second protective layer (312) may be laminated on the back surface (e.g., the surface in the -Z direction) of the first protective layer (311) by the first adhesive layer (391).

[0077] In one embodiment, the polarizing layer (320) may be laminated on the back surface (e.g., the -Z direction side) of the window layer (310). For example, the polarizing layer (320) may be laminated on the back surface (e.g., the -Z direction side) of the second protective layer (312) by a second adhesive layer (392). For example, the polarizing layer (320) may include a polarizing film.

[0078] In one embodiment, the display panel (330) may be configured to visually display information. The display panel (330) may be laminated on the back surface (e.g., the -Z direction surface) of the polarizing layer (320). The display panel (330) may be positioned across the front portion (254), the first extension portion (255), and the second extension portion (256). For example, the display panel (330) positioned on the front portion (254) may be positioned to face a first direction (e.g., the +Z direction). The display panel (330) positioned on the first extension portion (255) may extend from one end (e.g., the -X direction end) of the front portion (254) and bend toward a second direction (e.g., the -Z direction) opposite to the first direction (e.g., the +Z direction). For example, the display panel (330) positioned in the first extension portion (255) may be positioned to substantially face the side direction (e.g., -X direction) of the electronic device (e.g., electronic device (200) of FIG. 2C). The display panel (330) positioned in the second extension portion (256) may be positioned in the back direction (e.g., -Z direction) of the front portion (254) by extending from the first extension portion (255). For example, the display panel (330) positioned in the second extension portion (256) may be positioned to be substantially parallel to the display panel (330) positioned in the front portion (254).

[0079] In one embodiment, the third protective layer (340) may be attached to at least a portion of the display panel (330). For example, the third protective layer (340) may be laminated on the back surface (e.g., the surface in the -Z direction) of the front surface (254) of the display panel (330). For example, the third protective layer (340) may be configured to protect a plurality of elements (e.g., a TFT (thin film transistor)) of the display panel (330). For example, the third protective layer (340) may be configured to fix and / or protect the display panel (330) during a process of forming an OLED.

[0080] In one embodiment, the composite sheet (350) can be laminated on the back surface (e.g., the -Z direction surface) of the third protective layer (340). For example, the composite sheet (350) can include at least one polymer layer (e.g., a light-shielding layer and / or a buffer layer) and / or at least one functional member (e.g., a heat-dissipating sheet).

[0081] In one embodiment, the conductive plate (360) can be laminated on the back surface (e.g., the surface in the -Z direction) of the composite sheet (350). The conductive plate (360) can improve the rigidity of the display panel (330). The conductive plate (360) can shield surrounding noise. The conductive plate (360) can release and / or disperse heat generated in the surroundings. For example, the conductive plate (360) can include at least one of SUS (steel use stainless) (e.g., STS (stainless steel)), Cu, Al, or CLAD (e.g., a laminated member in which SUS and Al are alternately arranged). However, this is exemplary, and the conductive plate (360) may also include other alloy materials. The conductive plate (360) may include a lattice including a plurality of openings and / or slits at positions corresponding to a hinge structure (e.g., hinge structure (230) of FIG. 2B) for bending motion of the display module (250).

[0082] In one embodiment, the fourth protective layer (370) may be attached to at least a portion of the display panel (330). For example, the fourth protective layer (370) may be laminated on the back surface (e.g., the surface in the +Z direction) of the second extension portion (256) of the display panel (330). For example, the fourth protective layer (370) may be configured to protect a plurality of elements (e.g., a TFT (thin film transistor)) of the display panel (330). For example, the fourth protective layer (370) may be configured to fix and / or protect the display panel (330) in a process of forming an OLED.

[0083] In one embodiment, the spacer (380) may be disposed between the conductive plate (360) and the fourth protective layer (370). For example, the spacer (380) may be bonded to a second direction-facing side of the conductive plate (360) (e.g., a -Z direction side) and a first direction-facing side of the fourth protective layer (370) (e.g., a +Z direction side). For example, the spacer (380) may include a polymer material.

[0084] In one embodiment, the bending protection member (410) may be configured to cover an outer surface of the first extension portion (255). For example, the bending protection member (410) may cover at least a portion of the display panel (330) positioned on the first extension portion (255) from the outer side. The bending protection member (410) may be positioned substantially across the front portion (254), the first extension portion (255), and the second extension portion (256). For example, one end of the bending protection member (410) may extend to the front portion (254), and the other end of the bending protection member (410) may extend to the second extension portion (256).

[0085] In one embodiment, the cover member (420) can cover the configuration positioned in the second extension portion (256) in the back direction (e.g., -Z direction). For example, the cover member (420) can cover the bending protection member (410) positioned in the second extension portion (256) and the display panel (330) positioned in the second extension portion (256) in the back direction (e.g., -Z direction).

[0086] In one embodiment, the display module (250) may be configured such that each layer is relatively slippable so as to conform to the folding operation of the electronic device (e.g., the electronic device (200) of FIGS. 2A and 2B). For example, comparing FIG. 4, where the electronic device (200) is unfolded, with FIG. 5, where the electronic device (200) is folded, each layer of the display module (250) may slip more in the outward width direction (e.g., the -X direction) as the layer is positioned in the front direction (e.g., the +Z direction). For example, in the process of folding the electronic device (200) from the unfolded state, a layer positioned relatively in the front direction (e.g., the +Z direction) of the display module (250) may have an end portion protrude further outward (e.g., the -X direction) than a layer positioned relatively in the back direction (e.g., the -Z direction).

[0087] Meanwhile, the structure of the display module (250) described above is exemplary, and the structure of the display module (250) is not limited. For example, the order in which each component of the display module (250) is stacked is not limited to the order described above, and the components may be stacked in a different order. For example, the display module (250) according to one embodiment may not include some of the components described above. For example, the display module (250) according to one embodiment may further include various components in addition to the components described above.

[0088] Hereinafter, a molding structure (430) and a conductive member (440) according to one embodiment will be described with reference to FIGS. 3 to 5.

[0089] In one embodiment, the molding structure (430) may be formed to surround at least a portion of the display module (250). For example, the molding structure (430) may be formed to surround at least the first extension portion (255) of the display module (250). The molding structure (430) may be formed through a molding process and / or a laser direct structuring (LDS) process. For example, the molding structure (430) may be formed using a mold having a shape that surrounds at least the first extension portion (255) of the display module (250). The molding structure (430) may be formed through the molding process to fill a space adjacent to the first extension portion (255) of the display module (250). For example, the molding structure (430) may surround the first extension portion (255) of the display module (250), and may surround the portion where the first extension portion (255) and the front portion (254) are connected and / or the portion where the first extension portion (255) and the second extension portion (256) are connected.

[0090] In one embodiment, the first side (431) of the molding structure (430) in the first direction (e.g., +Z direction) may be positioned at the same height as or higher than the outermost layer in the first direction (e.g., +Z direction) of the front portion (254) of the display module (250). For example, as shown in FIG. 4, the first side (431) of the molding structure (430) in the first direction (e.g., +Z direction) may be positioned on substantially the same plane as the outermost layer in the first direction (e.g., +Z direction) of the front portion (254) of the display module (250). The outermost layer in the first direction (e.g., +Z direction) of the front portion (254) of the display module (250) may mean, for example, the first protective layer (311). However, this is exemplary and the outermost layer in the first direction (e.g., +Z direction) of the front side (254) of the display module (250) is not limited thereto.

[0091] In one embodiment, the thickness (e.g., the Z-direction thickness) of the molding structure (430) may be greater than the thickness (e.g., the Z-direction thickness) of the first extension (255) of the display module (250). For example, a first surface (431) of the molding structure (430) in the first direction (e.g., the +Z-direction) may be positioned substantially on the same plane as an outermost layer (e.g., the first protective layer (311)) of the front portion (254) of the display module (250) in the first direction (e.g., the +Z-direction), and a second surface (432) of the molding structure (430) in the second direction (e.g., the -Z-direction) may be positioned to protrude further in the second direction (e.g., the -Z-direction) than an outermost layer (e.g., the cover member (420)) of the second extension (256) of the display module (250) in the second direction (e.g., the -Z-direction).

[0092] In one embodiment, the cross-section of the molding structure (430) may include a trapezoidal or parallelogram shape. For example, when the electronic device (200) (or the display module (250)) is unfolded, the width of the first side (431) of the molding structure (430) in the first direction (e.g., +Z direction) may be smaller than the width of the second side (432) of the molding structure (430) in the second direction (e.g., -Z direction). For example, as shown in FIG. 4, when the electronic device (200) is unfolded, one side (e.g., -X direction side) (433) of the molding structure (430) may be inclined with respect to the first direction (e.g., +Z direction). For example, when the electronic device (200) is unfolded, one side (433) of the molding structure (430) may be inclined so as to face more inward (e.g., toward the +X direction) as it faces the first direction (e.g., toward the +Z direction). However, the shape of the molding structure (430) described above is exemplary and is not limited thereto. The shape of the molding structure (430) described above may also be understood as the shape of a mold for forming the molding structure (430).

[0093] In one embodiment, the molding structure (430) may include an elastically deformable material. For example, the molding structure (430) may be elastically deformable. The molding structure (430) may be conductive. For example, the molding structure (430) may include a conductive material. For example, the molding structure (430) may be formed using a molding material (e.g., a material including urethane and / or acrylic) to which a conductive additive is added. However, this is merely exemplary, and the material of the molding structure (430) is not limited thereto.

[0094] In one embodiment, the conductive member (440) can electrically connect the molding structure (430) to the first housing (210) (or the second housing (220)). For example, the conductive member (440) can include a conductive adhesive tape and / or a conductive gasket. The conductive member (440) can be attached to a second side (432) of the molding structure (430) in a second direction (e.g., in the -Z direction). For example, the conductive member (440) can bond the second side (432) of the molding structure (430) in the second direction (e.g., in the -Z direction) and the side of the first housing (210) (or the second housing (220)) in the first direction (e.g., in the +Z direction) to each other. For example, the conductive member (440) can have an outer shell made of a conductive fiber or a metal foil. For example, the conductive member (440) may be formed of an elastically deformable material. However, this is merely exemplary, and the type and / or location of the conductive member (440) is not limited thereto.

[0095] In one embodiment, when static electricity (E) is generated in the border area of ​​the display module (250), the static electricity (E) can be discharged to the first housing (210) (or the second housing (220)) through the display module (250), the molding structure (430), and the conductive member (440). With this structure, the static electricity (E) can be discharged to the first housing (210) (or the second housing (220)) without staying in the display module (250), thereby protecting the display module (250) from the static electricity (E).

[0096] In one embodiment, the molding structure (430) may be elastically deformable during the process of folding the electronic device (200) from an unfolded state. For example, during the process of folding the electronic device (200) from an unfolded state, the molding structure (430) may be elastically deformed in accordance with the slip motion of the display module (250). For example, when the electronic device (200) is unfolded, one side (433) of the molding structure (430) may be positioned to be inclined with respect to a first direction (e.g., +Z direction), and when the electronic device (200) is folded, one side (433) of the molding structure (430) may be elastically deformed to be substantially parallel to the first direction (e.g., +Z direction). For example, when the electronic device (200) is folded, the width distance (D1) between the end portion in the first direction (e.g., +Z direction) of one side (433) of the molding structure (430) and the first edge frame (241) may be smaller than the width distance (D2) between the end portion in the first direction (e.g., +Z direction) of one side (433) of the molding structure (430) and the first edge frame (241) when the electronic device (200) is unfolded.

[0097] In one embodiment, according to the structure of the molding structure (430) and the conductive member (440) described above, static electricity (E) generated in the display module (250) can be discharged to the first housing (210) (or the second housing (220)), thereby preventing or reducing damage to the display module (250) caused by static electricity (E). Since the molding structure (430) surrounds the outer area of ​​the display module (250), the display module (250) can be buffered and protected from external impact by the molding structure (430). Due to the cushioning of the molding structure (430), even if the distance between the display module (250) and the first frame (241) (or the second frame (242)) is designed to be closer, the display module (250) can be prevented or reduced from being damaged due to external impact when the display module (250) comes into contact with the first frame frame (241) (or the second frame frame (242)). Since the first surface (431) of the molding structure (430) in the first direction (e.g., +Z direction) is positioned on substantially the same plane as the outermost layer (e.g., the first protective layer (311)) of the front part (254) of the display module (250) in the first direction (e.g., +Z direction), the gap in the thickness direction (e.g., Z direction) between the display module (250) and the first frame frame (241) can be reduced.

[0098] Meanwhile, although the molding structure (430) and the conductive member (440) have been described as being positioned adjacent to the first housing (210) and the first border frame (241), this is exemplary, and it will be apparent to those skilled in the art that the molding structure (430) and the conductive member (440) may also be positioned adjacent to the second housing (220) and the second border frame (242). For example, in one embodiment, when the first extension portion (255) of the display module (250) is positioned toward the second housing (220), the molding structure (430) and the conductive member (440) may be positioned adjacent to the second housing (220) and the second border frame (242).

[0099] Figure 6 is a cross-sectional view of an electronic device according to one embodiment.

[0100] Referring to FIG. 6, in one embodiment, the display module (250) may include a front portion (254), a first extension portion (255), and a second extension portion (256). The display module (250) may include a first protective layer (311), a second protective layer (312), a polarizing layer (320), a display panel (330), a third protective layer (340), a composite sheet (350), a conductive plate (360), a fourth protective layer (370), a spacer (380), a bending protection member (410), a cover member (420), a flexible printed circuit board (610), a control circuit (620), a molding structure (430), a conductive member (440), and / or a bonding member (450). In describing the electronic device according to FIG. 6, a detailed description of a configuration that is substantially the same as the configuration described with reference to FIGS. 3 to 5 will be omitted.

[0101] In one embodiment, the bonding member (450) can fill the space between the front portion (254) and the first extension portion (255) of the display module (250). After the bonding member (450) fills the space between the front portion (254) and the first extension portion (255) of the display module (250), a molding process for forming a molding structure (430) can be performed. The bonding member (450) can be non-conductive. For example, the bonding member (450) can include a non-conductive material. When static electricity (E) is generated in the edge area of ​​the display module (250), the static electricity (E) can be discharged to the first housing (210) (or the second housing (e.g., the second housing (220) of FIG. 2C)) through the display module (250), the molding structure (430), and the conductive member (440). In the process of discharging static electricity (E), since a non-conductive bonding member (450) is filled between the front part (254) and the first extension part (255) of the display module (250), static electricity (E) can be prevented or reduced from flowing back into the display module (250).

[0102] Figure 7 is a cross-sectional view of an electronic device according to one embodiment.

[0103] Referring to FIG. 7, in one embodiment, the display module (250) may include a front portion (254), a first extension portion (255), and a second extension portion (256). The display module (250) may include a first protective layer (311), a second protective layer (312), a polarizing layer (320), a display panel (330), a third protective layer (340), a composite sheet (350), a conductive plate (360), a fourth protective layer (370), a spacer (380), a bending protection member (410), a cover member (420), a flexible printed circuit board (610), a control circuit (620), a molding structure (430), and / or a conductive member (440). In describing the electronic device according to FIG. 7, a detailed description of a configuration that is substantially the same as the configuration described with reference to FIGS. 3 to 5 will be omitted.

[0104] In one embodiment, the molding structure (430) may include a molding body (434) and a conductive coating (435). The molding body (434) may be a part formed through a molding process and / or a laser direct structuring (LDS) process. The molding body (434) may be non-conductive. For example, the molding body (434) may include a non-conductive material. For example, the molding body (434) may be formed using a non-conductive molding material. The conductive coating (435) may be coated or plated on an outer surface of the molding body (434). The conductive coating (435) may be conductive. For example, the conductive coating (435) may be formed on a surface facing a first direction (e.g., +Z direction), a side surface, and a surface facing a second direction (e.g., -Z direction) of the molding body (434). When static electricity (E) is generated in the border area of ​​the display module (250), the static electricity (E) can be discharged to the first housing (210) (or the second housing (e.g., the second housing (220) of FIG. 2C)) through the display module (250), the conductive coating (435) of the molding structure (430), and the conductive member (440). In the process of discharging the static electricity (E), since the molding body (434) is non-conductive, the static electricity (E) can be discharged along the outer surface of the molding structure (430) along the conductive coating (435) to the first housing (210) (or the second housing (e.g., the second housing (220) of FIG. 2C)). In this discharging process, since the molding body (434) is non-conductive, the static electricity (E) can be prevented or reduced from flowing back into the display module (250).

[0105] In one embodiment, the electronic device (200) includes a display module (250) including a first housing (210) and a second housing (220) that are foldably connected to each other, a front portion (254) disposed in the first housing (210) and the second housing (220) and facing a first direction, a first extension portion (255) extending from one end of the front portion (254) and bending toward a second direction opposite to the first direction, and a second extension portion (256) extending from the first extension portion (255) and positioned in a rear direction of the front portion (254), a molding structure (430) formed to surround at least the first extension portion (255) of the display module (250) and including a conductive material, and a conductive member (440) electrically connecting the molding structure (430) to the first housing (210) or the second housing (220). The surface of the molding structure (430) in the first direction may be positioned at the same height as or higher than the outermost layer in the first direction of the front portion (254) of the display module (250).

[0106] In one embodiment, the molding structure (430) may be formed to fill a space adjacent to the first extension (255) of the display module (250).

[0107] In one embodiment, the molding structure (430) may be formed through a molding process using a mold having a shape that surrounds the first extension portion (255) of the display module (250).

[0108] In one embodiment, the molding structure (430) may be elastically deformable during the process of folding the electronic device (200) from an unfolded state.

[0109] In one embodiment, when the electronic device (200) is unfolded, the width of the first direction side of the molding structure (430) may be smaller than the width of the second direction side.

[0110] In one embodiment, the display module (250) may further include a first border frame (241) and a second border frame (242) connected to the first housing (210) and the second housing (220), respectively, to surround at least a portion of the border area of ​​the display module (250).

[0111] In one embodiment, the widthwise distance between the end portion in the first direction of one side (433) of the molding structure (430) and the first edge frame (241) when the electronic device (200) is folded may be smaller than the widthwise distance between the end portion in the first direction of the one side (433) of the molding structure (430) and the first edge frame (241) when the electronic device (200) is unfolded.

[0112] In one embodiment, when the electronic device (200) is unfolded, one side (433) of the molding structure (430) may be inclined with respect to the first direction, and when the electronic device (200) is folded, one side (433) of the molding structure (430) may be parallel to the first direction.

[0113] In one embodiment, when static electricity is generated in the border area of ​​the display module (250), the static electricity can be discharged to the first housing (210) or the second housing (220) through the display module (250), the molding structure (430), and the conductive member (440).

[0114] In one embodiment, the conductive member (440) may be attached to the second direction surface of the molding structure (430).

[0115] In one embodiment, the display module (250) may further include a bonding member (450) that fills the space between the front portion (254) and the first extension portion (255) and includes a non-conductive material.

[0116] In one embodiment, the molding structure (430) may include a molding body (434) including a non-conductive material and a conductive coating (435) coated on the outer surface of the molding body (434).

[0117] In one embodiment, the first direction side of the molding structure (430) may be positioned on the same plane as the outermost layer in the first direction of the front portion (254) of the display module (250).

[0118] In one embodiment, the cross-section of the molding structure (430) may include a trapezoidal or parallelogram shape.

[0119] In one embodiment, the thickness of the molding structure (430) may be greater than the thickness of the first extension (255) of the display module (250).

[0120] In one embodiment, a display module (250) applied to an electronic device (200) may include a front portion (254) arranged to face a first direction, a first extension portion (255) extending from one end of the front portion (254) and bending toward a second direction opposite to the first direction, a second extension portion (256) extending from the first extension portion (255) and positioned in a rear direction of the front portion (254), and a molding structure (430) formed to surround at least the first extension portion (255) of the display module (250) and including a conductive material. A surface of the molding structure (430) in the first direction may be positioned at the same height as or higher than an outermost layer of the front portion (254) of the display module (250) in the first direction.

[0121] In one embodiment, the molding structure (430) may be formed through a molding process using a mold having a shape that surrounds the first extension portion (255) of the display module (250).

[0122] In one embodiment, the molding structure (430) may be elastically deformable.

[0123] In one embodiment, when the display module (250) is unfolded, the width of the first direction side of the molding structure (430) may be smaller than the width of the second direction side.

[0124] In one embodiment, the electronic device (200) includes a display module (250) including a first housing (210) and a second housing (220) that are foldably connected to each other, a front portion (254) disposed in the first housing (210) and the second housing (220) and facing a first direction, a first extension portion (255) extending from one end of the front portion (254) and bending toward a second direction opposite to the first direction, and a second extension portion (256) extending from the first extension portion (255) and positioned in a rear direction of the front portion (254), a molding structure (430) formed to surround at least the first extension portion (255) of the display module (250) and including a conductive material, and a conductive member (440) electrically connecting the molding structure (430) to the first housing (210) or the second housing (220). can be. The surface of the molding structure (430) in the first direction may be positioned at the same height as or higher than the outermost layer of the front portion (254) of the display module (250) in the first direction. The molding structure (430) may be formed through a molding process using a mold having a shape that surrounds the first extension portion (255) of the display module (250). The molding structure (430) may be elastically deformable during the process of folding the electronic device (200) from an unfolded state. The width of the surface of the molding structure (430) in the first direction may be smaller than the width of the surface in the second direction. When static electricity is generated in the border area of ​​the display module (250), the static electricity can be discharged to the first housing (210) or the second housing (220) through the display module (250), the molding structure (430), and the conductive member (440).

Claims

1. In an electronic device (200), A first housing (210) and a second housing (220) which are foldably connected to each other; A display module (250) including a front portion (254) disposed in the first housing (210) and the second housing (220) and arranged to face a first direction, a first extension portion (255) extending from one end of the front portion (254) and bending toward a second direction opposite to the first direction, and a second extension portion (256) extending from the first extension portion (255) and positioned in the rear direction of the front portion (254); A molding structure (430) formed to surround at least the first extension portion (255) of the display module (250) and including a conductive material; and It includes a conductive member (440) that electrically connects the molding structure (430) to the first housing (210) or the second housing (220), An electronic device (200), wherein the first direction surface (431) of the molding structure (430) is positioned at the same height as or higher than the outermost layer in the first direction of the front portion (254) of the display module (250).

2. In paragraph 1, An electronic device (200) in which the molding structure (430) is formed to fill a space adjacent to the first extension portion (255) of the display module (250).

3. In paragraph 1 or 2, The above molding structure (430) is an electronic device (200) formed through a molding process using a mold having a shape that surrounds the first extension portion (255) of the display module (250).

4. In any one of paragraphs 1 to 3, An electronic device (200) in which the molding structure (430) is elastically deformable during the process of folding the electronic device (200) in an unfolded state.

5. In any one of paragraphs 1 to 4, An electronic device (200), wherein, when the electronic device (200) is unfolded, the width of the first direction surface (431) of the molding structure (430) is smaller than the width of the second direction surface (432).

6. In any one of paragraphs 1 to 5, An electronic device (200) further comprising a first border frame (241) and a second border frame (242) each connected to the first housing (210) and the second housing (220) so as to surround at least a portion of a border area of ​​the display module (250).

7. In any one of paragraphs 1 to 6, An electronic device (200), wherein a widthwise distance between the end portion of the first direction of one side (433) of the molding structure (430) and the first edge frame (241) in a folded state of the electronic device (200) is smaller than a widthwise distance between the end portion of the first direction of the one side (433) of the molding structure (430) and the first edge frame (241) in an unfolded state of the electronic device (200).

8. In any one of paragraphs 1 to 7, An electronic device (200), wherein when the electronic device (200) is unfolded, one side (433) of the molding structure (430) is inclined with respect to the first direction, and when the electronic device (200) is folded, one side (433) of the molding structure (430) is parallel to the first direction.

9. In any one of paragraphs 1 to 8, An electronic device (200), wherein when static electricity is generated in the border area of ​​the display module (250), the static electricity is discharged to the first housing (210) or the second housing (220) through the display module (250), the molding structure (430) and the conductive member (440).

10. In any one of paragraphs 1 to 9, An electronic device (200) in which the conductive member (440) is attached to the second direction surface (432) of the molding structure (430).

11. In any one of paragraphs 1 to 10, An electronic device (200) further comprising a bonding member (450) that fills the space between the front portion (254) and the first extension portion (255) of the display module (250) and includes a non-conductive material.

12. In any one of paragraphs 1 to 11, The above molding structure (430) is an electronic device (200) including a molding body (434) including a non-conductive material and a conductive coating (435) coated on the outer surface of the molding body (434).

13. In any one of paragraphs 1 to 12, An electronic device (200) in which the first direction surface (431) of the molding structure (430) is positioned on the same plane as the outermost layer in the first direction of the front portion (254) of the display module (250).

14. In any one of paragraphs 1 to 13, An electronic device (200) wherein the cross-section of the molding structure (430) includes a trapezoidal or parallelogram shape.

15. In any one of paragraphs 1 to 14, An electronic device (200) wherein the thickness of the molding structure (430) is greater than the thickness of the first extension portion (255) of the display module (250).

Images