Display panel comprising insulating member disposed between pixels

Abstract

A display panel is disclosed. The display panel comprises: a substrate; a switching circuit; a first conductive pad and a second conductive pad connected to the switching circuit; a first electrode connected to the first conductive pad; a first LED including a light-emitting element disposed on the first electrode and a second electrode disposed on the light-emitting element; a second LED including a second electrode connected to the second conductive pad, a light-emitting element disposed on the second electrode, and a second electrode disposed on the light-emitting element; and an insulating member disposed between the first LED and the second LED. The height of the insulating member may be higher than the height of the first conductive pad and lower than the height of the first LED coupled to the first conductive pad. Various other embodiments are possible.

Description

A display panel including an insulating member disposed between pixels

[0001] The present disclosure relates to a display panel including an insulating member disposed between pixels.

[0002] Display panels can have chips (or diodes) that make up pixels mounted on a substrate. To inspect whether the mounted chips emit light, automatic optical inspection (AOI), photoluminescence (PL), and electroluminescence (EL) methods can be used.

[0003] The above information may be provided as background art to aid in understanding the present disclosure. No claim or determination is made as to whether any of the above-described matters constitute prior art related to the present disclosure.

[0004] In one embodiment, a display panel may include a substrate. The display panel may include a switching circuit and a first conductive pad and a second conductive pad connected to the switching circuit. The switching circuit may be formed on the substrate. The first conductive pad and the second conductive pad may be formed on the substrate. The display panel may include a first LED and a second LED. The first LED may include a first electrode connected to the first conductive pad, a light-emitting element disposed on the first electrode, and a second electrode disposed on the light-emitting element. The second LED may include a second electrode connected to the second conductive pad, a light-emitting element disposed on the second electrode, and a second electrode disposed on the light-emitting element. The display panel may include an insulating member. The insulating member may be disposed between the first LED and the second LED. A height of the insulating member may be greater than a height of the first conductive pad. The height of the insulating member may be lower than the height of the first LED coupled to the first conductive pad (402).

[0005] In one embodiment, a display panel may include a substrate. The display panel may include a switching circuit and a conductive pad connected to the switching circuit. The switching circuit may be formed on the substrate. The conductive pad may be formed on the substrate. The display panel may include an LED. The LED may include a first electrode connected to the conductive pad, a light-emitting element disposed on the first electrode, and a second electrode disposed on the light-emitting element. The conductive pad may include partial pads spaced apart from each other. The conductive pad may be coupled to the first electrode by a conductive material disposed between the partial pads.

[0006] A display panel may include a substrate. The display panel may include a switching circuit and a conductive pad connected to the switching circuit. The switching circuit may be formed on the substrate. The conductive pad may be formed on the substrate. The display panel may include an LED. The LED may include a first electrode connected to the conductive pad, a light-emitting element disposed on the first electrode, and a second electrode disposed on the light-emitting element. The electronic device may further include a non-conductive layer covering a side surface of the first conductive pad and a portion of an upper surface of the first conductive pad.

[0007] FIG. 1 is a drawing showing an electronic device according to one embodiment.

[0008] Figure 2 is an exploded perspective view of an electronic device according to one embodiment.

[0009] Figures 3a to 3e illustrate examples of some pixels of an exemplary display device.

[0010] Figure 4 shows a cross-sectional view of a portion of an exemplary display device.

[0011] Fig. 5 is a drawing exemplarily showing one of the assembly processes of an exemplary display device.

[0012] Fig. 6 is a drawing exemplarily showing a process of mounting an LED element during the assembly process of an exemplary display device.

[0013] Fig. 7 is a drawing exemplarily showing a process of mounting an LED element having a protruding electrode during the assembly process of an exemplary display device.

[0014] Fig. 8 is a drawing exemplarily showing a process of performing a lighting inspection during the assembly process of an exemplary display device.

[0015] FIG. 9 is a drawing showing an exemplary display device including a patterned pad connected to a switching circuit.

[0016] Figure 10 is a drawing showing an exemplary pattern pad and a welding process.

[0017] Figure 11 shows the arrangement of a pattern protruding from a jig for lighting inspection inserted between exemplary patterned pads.

[0018] FIG. 12 is a drawing exemplarily showing a process of performing a lighting inspection during assembly of a display device including an exemplary pattern-type pad.

[0019] FIG. 13 is a drawing exemplarily showing a process of performing a lighting inspection during assembly of a display device including a substrate having an exemplary insulating portion.

[0020] Fig. 14 is a drawing exemplarily showing a process of performing a lighting inspection during assembly of a display device using a jig having an exemplary insulating portion.

[0021] Figure 15 is a drawing showing the assembly process of a display device using an exemplary insulating part.

[0022] Fig. 16a is a drawing showing the arrangement of an exemplary insulating part of a display device.

[0023] FIG. 16b is a drawing showing an assembled state of a display device using an additional insulating portion placed on an exemplary insulating portion.

[0024] FIG. 17 is a block diagram of an electronic device within a network environment according to various embodiments.

[0025] FIG. 18 is a block diagram of a display module according to various embodiments.

[0026] FIG. 19A illustrates an example of a perspective view of a wearable device according to one embodiment.

[0027] FIG. 19b illustrates an example of one or more hardware elements disposed within a wearable device, according to one embodiment.

[0028] FIGS. 20A and 20B illustrate an example of an appearance of a wearable device according to one embodiment.

[0029] FIG. 1 is a drawing showing an electronic device according to one embodiment.

[0030] Referring to FIG. 1, an electronic device (100) according to one embodiment may include a housing (110) forming an exterior of the electronic device (100). For example, the housing (110) may include a first side (or front side) (100A), a second side (or back side) (100B), and a third side (or side surface) (100C) surrounding a space between the first side (100A) and the second side (100B). In one embodiment, the housing (110) may also refer to a structure (e.g., a frame structure (140) of FIG. 2) forming at least a portion of the first side (100A), the second side (100B), and / or the third side (100C).

[0031] An electronic device (100) according to one embodiment may include a substantially transparent front plate (102). In one embodiment, the front plate (102) may form at least a portion of the first surface (100A). In one embodiment, the front plate (102) may include, but is not limited to, a glass plate or a polymer plate including various coating layers, for example.

[0032] An electronic device (100) according to one embodiment may include a substantially opaque back plate (111). In one embodiment, the back plate (111) may form at least a portion of the second surface (100B). In one embodiment, the back plate (111) may be formed of a coated or colored glass, ceramic, polymer, metal (e.g., aluminum, stainless steel (STS), or magnesium), or a combination of at least two of the foregoing materials.

[0033] An electronic device (100) according to one embodiment may include a side bezel structure (or side member) (118) (e.g., a side wall (141) of a frame structure (140) of FIG. 2). In one embodiment, the side bezel structure (118) may be combined with a front plate (102) and / or a rear plate (111) to form at least a portion of a third side (100C) of the electronic device (100). For example, the side bezel structure (118) may form the entire third side (100C) of the electronic device (100), or, for another example, the side bezel structure (118) may form the third side (100C) of the electronic device (100) together with the front plate (102) and / or the rear plate (111).

[0034] Unlike the illustrated embodiment, when the third side (100C) of the electronic device (100) is partially formed by the front plate (102) and / or the rear plate (111), the front plate (102) and / or the rear plate (111) may include a region that extends seamlessly from its edge toward the rear plate (111) and / or the front plate (102). The extending region of the front plate (102) and / or the rear plate (111) may be located at both ends of a long edge of the electronic device (100), for example, but is not limited to the above-described example.

[0035] In one embodiment, the side bezel structure (118) may comprise a metal and / or a polymer. In one embodiment, the back plate (111) and the side bezel structure (118) may be formed integrally and may comprise the same material (e.g., a metal material such as aluminum), but is not limited thereto. For example, the back plate (111) and the side bezel structure (118) may be formed as separate components and / or may comprise different materials.

[0036] In one embodiment, the electronic device (100) may include at least one of a display (101), an audio module (103, 104, 107), a sensor module (not shown), a camera module (105, 112, 113), a key input device (117), a light emitting element (not shown), and / or a connector hole (103). In another embodiment, the electronic device (100) may omit at least one of the above components (e.g., the key input device (117) or the light emitting element (not shown)) or may additionally include other components.

[0037] In one embodiment, the display (101) (e.g., the display module (1760) of FIG. 17) may be visually exposed through a substantial portion of the front plate (102). For example, at least a portion of the display (101) may be visible through the front plate (102) forming the first surface (100A). In one embodiment, the display (101) may be disposed on the back surface of the front plate (102).

[0038] In one embodiment, the outer shape of the display (101) may be formed to be substantially the same as the outer shape of the front plate (102) adjacent to the display (101). In one embodiment, in order to expand the area where the display (101) is visually exposed, the gap between the outer shape of the display (101) and the outer shape of the front plate (102) may be formed to be substantially the same.

[0039] In one embodiment, the display (101) (or the first surface (100A) of the electronic device (100)) may include a screen display area (101A). In one embodiment, the display (101) may provide visual information to a user through the screen display area (101A). In the illustrated embodiment, when the first surface (100A) is viewed from the front, the screen display area (101A) is depicted as being positioned on the inside of the first surface (100A) and spaced apart from the outer edge of the first surface (100A), but is not limited thereto. In another embodiment, when the first surface (100A) is viewed from the front, at least a portion of an edge of the screen display area (101A) may substantially coincide with an edge of the first surface (100A) (or the front plate (102)).

[0040] In one embodiment, the screen display area (101A) may include a sensing area (101B) configured to acquire a user's biometric information. Here, the meaning of "the screen display area (101A) includes the sensing area (101B)" may be understood to mean that at least a portion of the sensing area (101B) may overlap the screen display area (101A). For example, the sensing area (101B) may be an area capable of displaying visual information by the display (101), similar to other areas of the screen display area (101A), and additionally capable of acquiring the user's biometric information (e.g., a fingerprint). In another embodiment, the sensing area (101B) may be formed in the key input device (117).

[0041] In one embodiment, the display (101) may include an area where a first camera module (105) (e.g., camera module (1780) of FIG. 17) is positioned. In one embodiment, an opening is formed in the area of ​​the display (101), and the first camera module (105) (e.g., a punch hole camera) may be at least partially positioned within the opening so as to face the first surface (100A). In this case, the screen display area (101A) may surround at least a portion of an edge of the opening. In another embodiment, the first camera module (105) (e.g., an under display camera (UDC)) may be positioned under the display (101) so as to overlap the area of ​​the display (101). In this case, the display (101) can provide visual information to the user through the above area, and additionally, the first camera module (105) can obtain an image corresponding to the direction toward the first surface (100A) through the above area of ​​the display (101).

[0042] In one embodiment, the display (101) may be coupled to or disposed adjacent to a touch sensing circuit, a pressure sensor capable of measuring the intensity (pressure) of a touch, and / or a digitizer capable of detecting a magnetic field-type stylus pen.

[0043] In one embodiment, an audio module (103, 104, 107) (e.g., audio module (1770) of FIG. 17) may include a microphone hole (103, 104) and a speaker hole (107).

[0044] In one embodiment, the microphone holes (103, 104) may include a first microphone hole (103) formed in a portion of the third surface (100C) and a second microphone hole (104) formed in a portion of the second surface (100B). A microphone (not shown) for acquiring external sound may be placed inside the microphone holes (103, 104). The microphone may include multiple microphones to detect the direction of the sound.

[0045] In one embodiment, a second microphone hole (104) formed in a portion of the second surface (100B) may be positioned adjacent to a camera module (105, 112, 113). For example, the second microphone hole (104) may acquire sound according to the operation of the camera module (105, 112, 113). However, the present invention is not limited thereto.

[0046] In one embodiment, the speaker hole (107) may include an external speaker hole (107) and a call receiver hole (not shown). The external speaker hole (107) may be formed in a part of the third surface (100C) of the electronic device (100). In another embodiment, the external speaker hole (107) may be implemented as a single hole with the microphone hole (103). Although not shown, the call receiver hole (not shown) may be formed in another part of the third surface (100C). For example, the call receiver hole may be formed on the opposite side of the external speaker hole (107) on the third surface (100C). For example, based on the city of FIG. 1, the external speaker hole (107) may be formed on the third surface (100C) corresponding to the lower portion of the electronic device (100), and the call receiver hole may be formed on the third surface (100C) corresponding to the upper portion of the electronic device (100). However, this is not limited thereto, and in another embodiment, the call receiver hole may be formed at a location other than the third surface (100C). For example, the call receiver hole may be formed by a spaced space between the front plate (102) (or, display (101)) and the side bezel structure (118).

[0047] In one embodiment, the electronic device (100) may include at least one speaker (not shown) configured to output sound to the outside of the housing (110) through an external speaker hole (107) and / or a call receiver hole (not shown).

[0048] In one embodiment, a sensor module (not shown) (e.g., sensor module (1776) of FIG. 17) may generate an electrical signal or data value corresponding to an internal operating state of the electronic device (100) or an external environmental state. For example, the sensor module may include at least one of a proximity sensor, an HRM sensor, a fingerprint sensor, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0049] In one embodiment, a camera module (105, 112, 113) (e.g., camera module (1780) of FIG. 17) may include a first camera module (105) positioned to face a first side (100A) of the electronic device (100), a second camera module (112) positioned to face a second side (100B), and a flash (113).

[0050] In one embodiment, the second camera module (112) may include multiple cameras (e.g., dual cameras, triple cameras, or quad cameras). However, the second camera module (112) is not necessarily limited to including multiple cameras and may include a single camera.

[0051] In one embodiment, the first camera module (105) and the second camera module (112) may include one or more lenses, image sensors, and / or image signal processors.

[0052] In one embodiment, the flash (113) may include, for example, a light-emitting diode or a xenon lamp. In another embodiment, two or more lenses (infrared camera, wide-angle and telephoto lenses) and image sensors may be arranged on one side of the electronic device (100).

[0053] In one embodiment, the key input device (117) (e.g., the input module (1750) of FIG. 17) may be positioned on the third side (100C) of the electronic device (100). In another embodiment, the electronic device (100) may not include some or all of the key input devices (117), and the key input devices (117) that are not included may be implemented in another form, such as soft keys, on the display (101).

[0054] In one embodiment, a connector hole (103) may be formed on the third surface (100C) of the electronic device (100) so that a connector of an external device can be accommodated. A connection terminal (e.g., a connection terminal (1778) of FIG. 17) electrically connected to the connector of the external device may be arranged within the connector hole (103). The electronic device (100) according to one embodiment may include an interface module (e.g., an interface (1777) of FIG. 17) for processing electrical signals transmitted and received through the connection terminal.

[0055] In one embodiment, the electronic device (100) may include a light-emitting element (not shown). For example, the light-emitting element (not shown) may be disposed on a first surface (100A) of the housing (110). The light-emitting element (not shown) may provide status information of the electronic device (100) in the form of light. In another embodiment, the light-emitting element (not shown) may provide a light source that is linked to the operation of the first camera module (105). For example, the light-emitting element (not shown) may include an LED, an IR LED, and / or a xenon lamp.

[0056] Figure 2 is an exploded perspective view of an electronic device according to one embodiment.

[0057] In the following, redundant descriptions of configurations having the same reference numerals as the configurations described above are omitted.

[0058] Referring to FIG. 2, an electronic device (100) according to one embodiment may include a frame structure (140), a first printed circuit board (150), a second printed circuit board (152), a cover plate (160), and a battery (170).

[0059] In one embodiment, the frame structure (140) may include a side wall (141) forming an exterior of the electronic device (100) (e.g., the third side (100C) of FIG. 2) and a support portion (143) extending inwardly from the side wall (141). In one embodiment, the frame structure (140) may be disposed between the display (101) and the back plate (111). In one embodiment, the side wall (141) of the frame structure (140) may surround a space between the back plate (111) and the front plate (102) (and / or the display (101)), and the support portion (143) of the frame structure (140) may extend from the side wall (141) within the space. According to one embodiment, a side wall (141) forming a side surface of an electronic device (100) (e.g., side surface (100C) of FIG. 2) may include a speaker hole (107) connecting the inside and the outside of the electronic device (100). The speaker hole (107) may penetrate the side wall (141).

[0060] In one embodiment, the frame structure (140) may support or accommodate other components included in the electronic device (100). For example, a display (101) may be disposed on one side of the frame structure (140) facing one direction (e.g., +z direction), and the display (101) may be supported by a support portion (143) of the frame structure (140). For another example, a first printed circuit board (150), a second printed circuit board (152), a battery (170), and a second camera module (112) may be disposed on the other side of the frame structure (140) facing the opposite direction (e.g., -z direction). The first printed circuit board (150), the second printed circuit board (152), the battery (170), and the second camera module (112) can each be mounted in a recess defined by a side wall (141) and / or a support portion (143) of the frame structure (140).

[0061] In one embodiment, the first printed circuit board (150), the second printed circuit board (152), and the battery (170) may be respectively coupled to the frame structure (140). For example, the first printed circuit board (150) and the second printed circuit board (152) may be fixedly disposed to the frame structure (140) via a coupling member such as a screw. For example, the battery (170) may be fixedly disposed to the frame structure (140) via an adhesive member (e.g., double-sided tape). However, the present invention is not limited to the above-described examples.

[0062] In one embodiment, the cover plate (160) may be disposed between the first printed circuit board (150) and the back plate (111). In one embodiment, the cover plate (160) may be disposed on the first printed circuit board (150). For example, the cover plate (160) may be disposed on a surface of the first printed circuit board (150) facing the -z direction.

[0063] In one embodiment, the cover plate (160) may at least partially overlap the first printed circuit board (150) with respect to the z-axis. In one embodiment, the cover plate (160) may cover at least a portion of the first printed circuit board (150). In this way, the cover plate (160) may protect the first printed circuit board (150) from physical impact or prevent detachment of a connector coupled to the first printed circuit board (150).

[0064] In one embodiment, the cover plate (160) may be fixedly positioned on the first printed circuit board (150) via a joining member (e.g., a screw), or may be joined to the frame structure (140) together with the first printed circuit board (150) via the joining member.

[0065] In one embodiment, the display (101) may be positioned between a frame structure (140) and a front plate (102). For example, the front plate (102) may be positioned on one side (e.g., in the +z direction) of the display (101), and the frame structure (140) may be positioned on the other side (e.g., in the -z direction).

[0066] In one embodiment, the front plate (102) may be coupled with the display (101). For example, the front plate (102) and the display (101) may be bonded to each other via an optically clear adhesive (e.g., optically clear adhesive (OCA) or optically clear resin (OCR)) interposed therebetween.

[0067] In one embodiment, the front plate (102) may be coupled with a frame structure (140). For example, the front plate (102) may include an outer portion extending outside the display (101) when viewed in the z-axis direction, and may be adhered to the frame structure (140) through an adhesive member (e.g., double-sided tape) disposed between the outer portion of the front plate (102) and the frame structure (140) (e.g., side wall (141)). However, the present invention is not limited to the above-described example.

[0068] In one embodiment, the first printed circuit board (150) and / or the second printed circuit board (152) may be equipped with a processor (e.g., processor 1720 of FIG. 17), memory (e.g., memory 1730 of FIG. 17), and / or an interface (e.g., interface 1777 of FIG. 17). The processor may include, for example, one or more of a central processing unit, an application processor, a graphics processing unit, an image signal processor, a sensor hub processor, or a communication processor. The memory may include, for example, volatile memory or non-volatile memory. The interface may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, and / or an audio interface. The interface may electrically or physically connect the electronic device (100) to an external electronic device, and may include a USB connector, an SD card / MMC connector, or an audio connector. In one embodiment, the first printed circuit board (150) and the second printed circuit board (152) may be operatively or electrically connected to each other via a connecting member (e.g., a flexible printed circuit board).

[0069] In one embodiment, a battery (170) (e.g., battery (1789) of FIG. 17) may power at least one component of the electronic device (100). For example, the battery (170) may include a rechargeable secondary battery or a fuel cell. At least a portion of the battery (170) may be disposed substantially coplanar with the first printed circuit board (150) and / or the second printed circuit board (152).

[0070] An electronic device (100) according to one embodiment may include an antenna module (not shown) (e.g., antenna module (1797) of FIG. 17). In one embodiment, the antenna module may be disposed between the rear plate (111) and the battery (170). The antenna module may include, for example, a near field communication (NFC) antenna, a wireless charging antenna, and / or a magnetic secure transmission (MST) antenna. The antenna module may, for example, perform short-range communication with an external device or wirelessly transmit and receive power with an external device.

[0071] In one embodiment, a first camera module (105) (e.g., a front camera) may be positioned on at least a portion of a frame structure (140) (e.g., a support portion (143)) such that the lens can receive external light through a portion of the front plate (102) (e.g., the front (100A) of FIG. 2).

[0072] In one embodiment, a second camera module (112) (e.g., a rear camera) may be disposed between the frame structure (140) and the rear plate (111). In one embodiment, the second camera module (112) may be electrically connected to the first printed circuit board (150) via a connecting member (e.g., a connector). In one embodiment, the second camera module (112) may be disposed such that the lens can receive external light through the camera area (184) of the rear plate (111) of the electronic device (100).

[0073] In one embodiment, the camera area (184) may be formed on a surface of the rear plate (111) (e.g., the rear surface (100B) of FIG. 2). In one embodiment, the camera area (184) may be formed to be at least partially transparent so that external light may be incident on the lens of the second camera module (112). In one embodiment, at least a portion of the camera area (184) may protrude from the surface of the rear plate (111) by a predetermined height. However, the present invention is not limited thereto, and in another embodiment, the camera area (184) may form a plane substantially coextensive with the surface of the rear plate (111).

[0074] In one embodiment, the housing (110) of the electronic device (100) may refer to a configuration or structure that forms at least a portion of the exterior of the electronic device (100). In this respect, at least a portion of the front plate (102), the frame structure (140), and / or the rear plate (111) that form the exterior of the electronic device (100) may be referred to as the housing (110) of the electronic device (100).

[0075] Figures 3a to 3e illustrate examples of some pixels of an exemplary display device.

[0076] Referring to FIGS. 3A, 3B, 3C, 3D, and 3E, a display device (300) may include a display panel (301) including pixels (P) and a display driving circuit (390). The display device (300) may be referred to as a display module. A pixel (P) may be a unit that emits light.

[0077] Referring to FIG. 3A, each of the pixels (311, 312, 313, 314) may include a plurality of sub-pixels (310-1, 310-2, 310-3). Each of the plurality of sub-pixels (310-1, 310-2, 310-3) may provide a specified color. For example, a first sub-pixel (310-1) among each of the pixels (310) may provide red light, a second sub-pixel (310-2) among each of the pixels (310) may provide blue light, and a third sub-pixel (310-3) among each of the pixels (310) may provide green light. The arrangement of the pixels may be an RGB arrangement. The RGB arrangement may be a method of arranging one red, one green, and one blue sub-pixel. The sizes of the first sub-pixel (310-1), the second sub-pixel (310-2), and the third sub-pixel (310-3) may be the same or similar. The arrangement of each sub-pixel within the pixel (P) may be arranged in the order of the first sub-pixel (310-1), the second sub-pixel (310-3), and the third sub-pixel (310-4). However, the arrangement is not limited thereto, and the sub-pixels may be arranged in a different arrangement. For example, the arrangement may be in the order of the first sub-pixel (310-1) emitting red light, the third sub-pixel (310-3) emitting green light, and the second sub-pixel (310-2) emitting blue light. The plurality of sub-pixels (310-1, 310-2, 310-3) may be distinguished by a pixel defining member or a light-blocking member formed inside the display device (300). The pixels (311, 312, 313, 314) and the pixels arranged on one panel may have a sub-pixel arrangement structure substantially identical to the structure described above.

[0078] An electronic device (100) (e.g., the electronic device (100) of FIG. 1) can provide visual information through a display device (300). The visual information can include still images and / or moving images. The electronic device (100) can display broadcast content, multimedia content, or documents or photos stored in the electronic device (100) on the display device (300). The display device (300) can display an image based on an image signal received from a processor through a display driving circuit (390). For example, the display driving circuit (390) can generate a driving signal for the sub-pixels (310-1, 310-2, 310-3) based on the image signal. The display driving circuit (390) can control the light emission of the sub-pixels (310-1, 310-2, 310-3) based on the driving signal. The display driving circuit (390) can display visual information on the display device (300) by controlling the light emission.

[0079] Referring to FIGS. 3b, 3c and 3d, the arrangement of sub-pixels within a pixel (P) may vary.

[0080] The efficiency of blue light emitted through the second sub-pixel (320-2; 330-2; 340-2) is higher than the efficiency of light emitted through other sub-pixels, and the emitted light can be stable. Based on the high efficiency and stability of the second sub-pixel (320-2; 330-2; 340-2) emitting blue light, the second sub-pixel (320-2; 330-2; 340-2) emitting blue light among the sub-pixels can have a smaller area than the other sub-pixels.

[0081] Referring to FIG. 3B, the first sub-pixel (320-1), the second sub-pixel (320-2), and the third sub-pixel (320-3) may be sequentially arranged. The areas of the first sub-pixel (320-1) that emits red light and the third sub-pixel (320-3) that emits green light may be substantially the same, and may be larger than the area of ​​the second sub-pixel (320-2).

[0082] Referring to FIGS. 3C and 3D , the first sub-pixel (330-1; 340-1), the second sub-pixel (330-2; 340-2), and the third sub-pixel (330-3; 340-3) may occupy regions having different areas within the pixel P. The second sub-pixel (330-2; 340-2) emitting blue light may be arranged in the region having the smallest area, and the first sub-pixel (330-1; 340-1) emitting red light or the third sub-pixel (330-2; 340-2) emitting green light may be arranged in regions having different areas.

[0083] Referring to FIG. 3E, a pixel (P) may include a plurality of sub-pixels (350-1, 350-2, 350-3, 350-4). Each of the plurality of sub-pixels (350-1, 350-2, 350-3, 350-4) may provide a specified color. For example, among the pixels (350), the first sub-pixel (350-1) may provide red light, the second sub-pixel (350-2) and the third sub-pixel (350-3) may provide green light, and the fourth sub-pixel (350-4) may provide blue light. The arrangement of the pixels may be a pentile RGBG arrangement. The pentile RGBG arrangement may be a arrangement in which the numbers of red, green, and blue sub-pixels are arranged in a ratio of 1:2:1. The sizes of the first sub-pixel (350-1) and the fourth sub-pixel (350-4) may be the same or similar. The second sub-pixel (350-2) and the third sub-pixel (350-3) may be smaller than the sizes of the first sub-pixel (350-1) and the fourth sub-pixel (350-4). The arrangement of each sub-pixel within the pixels (350) may be arranged in the order of the first sub-pixel (350-1), the third sub-pixel (350-3), the fourth sub-pixel (350-4), and the second sub-pixel (350-2) in a clockwise direction.

[0084] Figure 4 shows a cross-sectional view of a portion of an exemplary display panel.

[0085] Referring to FIG. 4, the display panel (410) may include a substrate (401), an LED (420), and / or an insulating member (440). The display panel (410) in a display device (e.g., the display device (300) of FIG. 3A) may include a substrate (401) and a plurality of sub-pixels (310-1, 310-2, 310-3) arranged on the substrate (401). The display panel (410) is described based on a cross-section taken along line A-A' of the display device (300) of FIG. 3A.

[0086] The substrate (401) may include a transparent material or a translucent material. The substrate (401) may include a glass material or a polymer material. The polymer may include PI (polyimide), PET (polyethylene terephthalate), or PC (polycarbonate).

[0087] The substrate (401) may include a switching circuit (e.g., a TFT (thin film transistor)) (491, ). The TFT may include an LTPS TFT, an oxide TFT, an a-Si TFT, an organic TFT, or a graphene TFT.

[0088] Sub-pixels (310-1, 310-2, 310-3) may be arranged on a substrate (401). Each of the sub-pixels (310-1, 310-2, 310-3) may include a light emitting diode (LED) (420). The LED (420) may include a first electrode (421), a second electrode (422), and a light emitting element (423).

[0089] The first electrode (421) may be bonded to a conductive pad (402) exposed from the substrate (401). The light-emitting element (423) may be disposed on the first electrode (421). The second electrode (422) may be disposed on the light-emitting element (423). The LED (420) may be referred to as a vertical LED or a vertical LED chip in terms of the electrodes being disposed vertically.

[0090] The first electrode (421) may be connected to the switching circuit (491) through bonding with the conductive pad (402). The second electrode (422) may be connected to the switching circuit (491). The second electrode (422) may be in contact with a conductive line (431) that is connected to the second electrode (422) and extends along the side of the light emitting element (423) to the switching circuit (491). The conductive line (431) may be insulated except for the portion in contact with the second electrode (422). The second electrode (422) may be electrically connected to the switching circuit (491) through the conductive line (431). However, the present invention is not limited thereto, and the second electrode (422) may be connected to the switching circuit (491) through a wire or other conductive material. The conductive line (431) may be directly connected to an exposed portion of the switching circuit (491) or may be bonded to a conductive pad connected to the switching circuit (491).

[0091] The display panel (410) may include an insulating member (440) surrounding each of the sub-pixels (310-1, 310-3). The insulating member (440) may be a partition wall extending apart from each of the sub-pixels (310-1, 301-3). The insulating member (440) may be disposed on the substrate (401) and may form a grid. The insulating member (440) forming the grid may define a plurality of cells. The cells formed on the substrate (401) by the insulating member (440) may be regions where each of the pixels (310-1, 301-2, 301-3, 301-4) is disposed. The insulating member (440) may be referred to as a pixel definition layer (PDL) in that it defines an area where pixels (310-1, 310-2, 310-3, 310-4) are arranged. The insulating member (440) includes an insulating material and may include a light-blocking material.

[0092] An LED (420) may be placed in each of the cells separated by an insulating member (440). The process of placing the insulating member (440) may be such that the insulating member (440) surrounds the LED (420) after the LED (420) is mounted. However, the present invention is not limited thereto, and the insulating member (440) may be first placed on the substrate (401), and the LED (420) may be mounted within the cell. A color conversion material (451, 452, 453) may be filled within the cell in which the LED (420) is mounted. The insulating member (440) surrounds the pixels (310-1, 310-2, 310-3) and may be referred to as a dam or a bank in terms of accommodating the color conversion material (451, 452, 453). The color conversion material (451, 452, 453) can convert the color of light emitted from the LED (420). The first color conversion material (451) can surround the LED (420) included in the first sub-pixel (310-1). The energy level of the first color conversion material (451) can be increased to an excited state by light energy emitted from the light-emitting element (423) in the first sub-pixel (310-1). The first color conversion material (451) can include a material that emits light in a red wavelength band when in an excited state. The first sub-pixel (310-1) can emit red light to the outside.

[0093] The transparent material (452) can surround the LED (420) included in the second sub-pixel (310-2). The second sub-pixel (310-2) can include the transparent material (452) to emit blue light to the outside. Light in the blue wavelength band emitted from the LED of the second sub-pixel (310-2) can transmit through the transparent material (452) including the transparent material and be emitted to the outside.

[0094] The second color conversion material (453) may surround the LED (420) included in the third sub-pixel (310-3). The second color conversion material (453) may include a material that emits light in a green wavelength band when excited by light energy.

[0095] The light-emitting elements disposed in each of the sub-pixels (310-1, 310-2, 310-3) may emit light in a blue wavelength band. Although the light-emitting elements disposed in the sub-pixels (310-1, 310-2, 310-3) have been described as blue light-emitting elements, they are not limited thereto. For example, the light-emitting element disposed in the first sub-pixel (310-1) may emit light in a red band, and the first color conversion material (451) may include a transparent material. The light-emitting element disposed in the second sub-pixel (310-2) may emit light in a blue band, and may include a transparent material (452) filling the second sub-pixel (310-2). The light-emitting element disposed in the third sub-pixel (310-3) may emit light in a green band, and the second color conversion material (453) filling the third sub-pixel (310-3) may include a transparent material.

[0096] The light-emitting element (423) may include a p-type semiconductor layer (423a), an n-type semiconductor layer (423b), and a light-emitting layer (423c). The p-type semiconductor layer (423a) may be in contact with the first electrode (421), and the n-type semiconductor layer (432b) may be in contact with the second electrode (422). The p-type semiconductor layer (423a) may include one of GaN, AlGaN, InGaN, InAlGaN, AlN, InN, AlInN, and may be doped with a p-type dopant such as Mg, Zn, Ca, Sr, and Ba. The n-type semiconductor layer (432b) may include one of GaN, AlGaN, InGaN, InAlGaN, AlN, InN, AlInN, and may be doped with an n-type dopant such as Si, Ge, and Sn. Holes and electrons may move through the semiconductor layers (423a, 423b), and light may be generated by combining holes and electrons in the light-emitting layer (423c). The emitted light may be transmitted toward the color conversion material (451, 452, 453). The conductive material in the second electrode (422) and the conductive line (431) may be configured to transmit light emitted from the light-emitting element (423). In order for the light emitted from the light-emitting layer (423c) not to be obstructed by the second electrode (422), the second electrode (422) may include a transparent electrode. The transparent electrode may include a thin film that is transparent to visible light and electrically conductive. The transparent electrode may include indium tin oxide (ITO). For example, the transparent electrode may be an electrode in which indium oxide (In2O3) or tin oxide (SnO2) is deposited on PET, which is a polymer material.

[0097] The display panel (410) may further include an encapsulation layer (470) disposed on the color conversion materials (451, 452, 453). The encapsulation layer (470) may include a multilayer structure including one or more inorganic layers and organic layers. The encapsulation layer (470) may protect the sub-pixels (310-1, 310-2, 310-3) from external impact. The encapsulation layer (470) may prevent the internal components of the display panel (410) from being oxidized. The encapsulation layer (470) may transmit light emitted from the sub-pixels (310-1, 310-2, 310-3). The encapsulation layer (470) may be a material that can minimize the influence of light transmittance, reflectance, or refractive index. The display panel (410) may further include a transparent layer and / or a window on the encapsulating layer (470). The transparent layer or window may protect the display panel (410) from impact applied from the outside.

[0098] The display panel (410) may further include color filters (481, 482, 483). The color filters (481, 482, 483) may be arranged in a layer form. The color filters (481, 482, 483) may improve the color clarity and color reproducibility of images provided through the display panel (410). The color filters (481, 482, 483) may cover the first sub-pixel (310-1), the second sub-pixel (310-2), the third sub-pixel (310-3) and a portion of the insulating member (440). The color filters (481, 482, 483) may be arranged on the sealing layer (470). The color filters (481, 482, 483) may be disposed on a window or transparent layer disposed on the sealing layer (470). The color filters (481, 482, 483) may be composed of filters corresponding to the color conversion materials (451, 453) and the transparent material (452). For example, the first color filter (481) selectively transmits red light emitted through the first color conversion material (451), and the second color filter (482) selectively transmits blue light emitted from the light-emitting element (423) of the second sub-pixel (310-2) and transmitted by transmitting through the transparent material (452), and selectively transmits green light emitted through the second color conversion material (453).

[0099] A display device including a display panel (410) (e.g., a display device (300) of FIG. 3A) may be referred to as an LED display panel or a micro LED display panel in terms of including an LED or a micro LED. The micro LED display panel can integrate a large number of LED elements in a small area, and thus can be applied to a display of a wearable device for augmented reality (AR) or virtual reality (VR) that requires a display with a high integration ratio (a wearable device (1900) of FIG. 19A or FIG. 19B or a wearable device (2000) of FIG. 20A or FIG. 20B, which will be described later). The micro LED display panel can satisfy the high brightness required for AR or VR. The micro LED display panel can provide the effect of improving the portability and increasing the usage time of an electronic device with low power consumption.

[0100] Fig. 5 is a drawing exemplarily showing one of the assembly processes of an exemplary display device.

[0101] Referring to FIG. 5, for lighting inspection of a display panel having an LED (420) disposed on a substrate (401), a conductive jig (501) may be disposed on the LED (420). The conductive jig (501) may be disposed so as to be in contact with the second electrode (422) of the LED (420). For example, during the lighting inspection, the conductive jig (501) may be supported by the LED (420). The conductive jig (501) may be in contact with the second electrode (422) of the LED (420) and apply voltage to the first electrode (421) and the second electrode (422). Based on the voltage applied to the first electrode (421) and the second electrode (422), the light-emitting element (423) may emit light. The conductive jig (501) may include a transparent conductive material for the lighting inspection. The material of the conductive jig (501) may be the same as or similar to the material of the second electrode (422). The conductive jig (501) may include ITO (indium tin oxide). For example, the conductive jig (501) may be an electrode in which indium oxide (In2O3) or tin oxide (SnO2) is deposited on PET, which is a polymer material. The conductive jig (501) may include a plate made of a metal material formed in a mesh shape. The conductive jig (501) having an opaque metal material in a mesh shape or including a transparent conductive material can transmit light emitted from the LED (420). Based on the transmitted light, a defect inspection of the display panel (410) can be performed.

[0102] The height of the LED (420) may be several micrometers, and the width of the LED (420) may be within 100 micrometers. In terms of the size of the LED (420) being in micrometers, it may be referred to as a micro LED.

[0103] The LED (420) can be individually transferred onto the substrate (401), so that the LED (420) can be bonded to the conductive pad (402). The LED (420) for which bonding is not completed can be detached from the conductive pad (402) on the substrate (401). The detached conductive pad (403) can be visually exposed to the outside. For example, the LED (420) of the first sub-pixel (310-1) and the third sub-pixel (310-3) are arranged on the substrate (401), but the LED (420) of the second sub-pixel (310-2) can be detached and visually exposed to the outside. By means of the conductive jig (501), the inspector can determine that the LEDs (420) constituting the first sub-pixel (310-1) and the third sub-pixel (310-3) are normally transferred through the light emitted from the area where the LEDs (420) of the first sub-pixel (310-1) and the LEDs (420) of the third sub-pixel (310-3) are arranged. By means of the fact that no light is emitted from the area where the second sub-pixel (310-2) is arranged, it can be determined that the LEDs (420) are not transferred or are detached from the area.

[0104] The conductive jig (501) has rigidity to ensure flatness, but may include a buffer material to prevent damage to the LED (420) when the conductive jig (501) comes into contact with the LED (420) for a lighting test. The conductive jig (501) having a thickness in micrometers may deflect due to the force applied to maintain contact with the LED (420) during the lighting test. If the conductive jig (501) supported by the LED (420) deflects, it may come into contact with the visually exposed conductive pad (403). When power is applied to the conductive jig (501) that comes into contact with the conductive pad (402), a short circuit may occur in the conductive pad (403) that comes into direct contact with the conductive jig (501). The occurrence of a short circuit may cause damage to the display device (300).

[0105] The structure and method for preventing a short circuit occurring during a lighting inspection process are described below through Figs. 6 to 15.

[0106] Fig. 6 is a drawing exemplarily showing a process of mounting an LED element during the assembly process of an exemplary display device.

[0107] Referring to FIG. 6, a substrate (e.g., substrate (401) of FIG. 4) including a conductive pad (402) may be prepared. The substrate (401) may include an insulating layer (611) applied on the conductive pad (402). The substrate (401) may further include, in addition to the conductive pad (402), an insulated wiring (610) connected to the conductive pad (402).

[0108] The insulating layer (611) and the insulated wiring (610) may include an oxide film. The insulating layer (611) may reduce oxidation of the conductive pad (402). The insulating layer (611) may include a thermoplastic material so that it can be removed under pressure or at high temperature. The insulating layer (611) including the thermoplastic material may be removed from the contact surface with the first electrode (421) during the bonding process between the first electrode of the LED (420) (e.g., the first electrode (421) of FIG. 4) and the conductive pad (402). For example, during the bonding process, a portion of the insulating layer (611) corresponding to one surface of the first electrode (421) may be removed.

[0109] The insulating layer (611) may be disposed along the side of the first electrode (421) disposed on the conductive pad (402) (or along the edge of the LED (420)). The insulating layer (611) may be in contact with the side of the first electrode (421). The insulating layer (611) may prevent the conductive pad (402) from being visually exposed to the outside even after the bonding process. The insulating layer (611) may prevent the conductive pad (402) from being oxidized before and after the bonding process.

[0110] Fig. 7 is a drawing exemplarily showing a process of mounting an LED element having a protruding electrode during the assembly process of an exemplary display device.

[0111] Referring to FIG. 7, an LED (420) may be placed on a substrate including a conductive pad (402) covered by an insulating layer (711). The LED (420) may include a first electrode (721) facing the substrate (401) (e.g., the first electrode (421) of FIG. 4). The first electrode (721) may have a protruding shape. Among the protruding shapes of the first electrode (721), a protrusion may be formed in a sawtooth shape. The sawtooth-shaped protrusion of the first electrode (721) may penetrate the insulating layer (711). The sawtooth-shaped protrusion of the first electrode (721) may penetrate a part of the pad (402) or come into contact with the pad (402) after passing through the insulating layer (711).

[0112] The LED (420) can be electrically connected to the conductive pad (402) through a first electrode (721) penetrating the insulating layer (711). The insulating layer (711) can include a through hole capable of accommodating at least a portion of the first electrode (721). For example, the insulating layer (711) can include a through hole for accommodating a protrusion of the first electrode (721).

[0113] The LED (420) of FIGS. 6 and 7 can be electrically connected to the conductive pad (402) by removing at least a portion of the insulating layer (611, 711) surrounding the conductive pad (402). The portion of the conductive pad (402) where the LED (420) is not mounted can be surrounded by the insulating layer (611, 711).

[0114] Fig. 8 is a drawing exemplarily showing a process of performing a lighting inspection during the assembly process of an exemplary display device.

[0115] Referring to FIG. 8, in order to inspect the lighting of a display panel in which an LED (420) is placed on a substrate (401), a conductive jig (501) may be placed on the LED (420). The conductive jig (501) may be placed so as to be in contact with the second electrode (422) of the LED (420). The conductive jig (501) may be in contact with the second electrode (422) of the LED (420) and may apply voltage to the first electrode (421) and the second electrode (422). Based on the voltage applied to the first electrode (421) and the second electrode (422), the light-emitting element (423) may emit light.

[0116] The LED (420) can be individually transferred onto the substrate (401) so that the LED (420) can be bonded to the conductive pad (402). The LED (420) for which bonding is not completed can be detached from the conductive pad (402') on the substrate (401). The detached conductive pad (402) can visually expose the conductive pad (402') to the outside.

[0117] A conductive jig (501) supported on a micrometer-sized LED (420) is formed of a thin conductive film, and can come into contact with the visually exposed conductive pad (402') when sagging occurs. The visually exposed conductive pad (402') can be wrapped with an insulating layer (711). The conductive pad (402') wrapped by the insulating layer (711) can be prevented from directly contacting the conductive jig (501). The conductive pad (402') not wrapped by the insulating layer (711) can reduce damage to the display device (300) due to a short circuit between the conductive jig (501) and the conductive pad (402) during a lighting test.

[0118] FIG. 9 is a drawing showing an exemplary display device including a patterned pad connected to a switching circuit.

[0119] Referring to FIG. 9, the display panel (410) may include a substrate (401), an LED (420), and / or an insulating member (440). The display panel (410) may be substantially identical to the display panel of FIG. 4, except for the conductive pad (902) exposed from (or disposed on) the substrate (401). Description of a configuration identical or similar to that of FIG. 4 will be omitted. The term “substantially identical” may include not only the same shape or size, but also a modified ratio or some form.

[0120] The substrate (401) may include a polymer or glass of a transparent or translucent material.

[0121] The substrate (401) may include switching circuits (491).

[0122] Sub-pixels (310-1, 310-3) may be arranged on a substrate (401). Each of the sub-pixels (310-1, 310-3) may include an LED (420). The LED (420) may include a first electrode (421), a second electrode (422), and a light-emitting element (423).

[0123] The first electrode (421) may be bonded to a conductive pad (902) exposed from the substrate (401). The light-emitting element (423) may be disposed on the first electrode (421). The second electrode (422) may be disposed on the light-emitting element (423). The LED (420) may be referred to as a vertical LED or a vertical LED chip in terms of the electrodes being disposed vertically.

[0124] The first electrode (421) can be connected to the first switching circuit (491) through bonding with the conductive pad (902).

[0125] The conductive pad (902) may have a pattern different from the conductive pad (402) of Fig. 4. The shape of the pattern will be described in detail in Figs. 10 and 11.

[0126] Figure 10 is a drawing illustrating a welding process with an exemplary patterned pad. Figure 11 illustrates the arrangement of a pattern protruding from a jig for lighting inspection inserted between exemplary patterned pads. Figure 12 is a drawing illustrating a lighting inspection process during assembly of a display device including an exemplary patterned pad.

[0127] Referring to FIGS. 10, 11, and 12, the conductive pad (902) may include a plurality of pads (1001) separated along a grid pattern. The plurality of pads (1001) may be separated from each other. For example, the plurality of pads (1001) may be arranged to be spaced apart from each other. One of the plurality of spaced-apart pads (1001) may be connected to a wiring (1011).

[0128] If a pad connected to the wiring (1011) among the plurality of pads (1001) and the conductive jig (e.g., the conductive jig (501) of FIG. 5) do not come into contact, a short circuit between the plurality of pads (1001) and the conductive jig can be reduced.

[0129] A plurality of separated pads (1001) of conductive pads (902) can be formed into an integral pad by a molten metal (1010) (e.g., solder) disposed between the pads (1001). The metal (1010) can have a melting point lower than the melting point of the conductive pad (902). The conductive pad (1002) formed integrally by the molten metal (1010) can electrically connect an LED (e.g., an LED (420) of FIG. 4 or FIG. 9) and a switching circuit (e.g., a switching circuit (491) of FIG. 9).

[0130] Referring to Fig. 11, a conductive jig for lighting inspection (e.g., the conductive jig (501) of Fig. 5) may include a mesh pattern (1010'). The mesh pattern (1010') may be inserted into a space between a plurality of pads (1001) of the conductive pad (901) during the lighting inspection so as to be electrically connected to the conductive pad (901). The mesh pattern (1010') of the conductive jig (501) that is not inserted may be electrically isolated from the conductive pad (901) and electrically connected only to the second electrode (422) of the LED (420). By reducing the electrical connection with the conductive pad (901) on which the LED (420) is not installed by the mesh pattern (1010'), a short circuit between the conductive pad (901) and the conductive jig (501) may be reduced.

[0131] The segmented conductive pad (902) according to the above-described embodiment can reduce the possibility of a short circuit by the conductive jig (501) by including a plurality of pads (1001). The conductive jig (501) can include a transparent material for lighting inspection. In order to connect the LED (420) and the switching circuit (e.g., the switching circuit (491) of FIG. 4), a minimum voltage for lighting the LED (420) can be applied to the electrodes (421, 422) of the LED (420). If the contact area between the conductive jig (501) connected to the switching circuit and the conductive pad (902) is reduced, the resistance can increase due to the reduced contact area. As the resistance increases, current can flow to the conductive pad (402) on which the LED (420) is installed, rather than to the segmented conductive pad (902) on which the LED (420) is not installed. By preventing current from flowing to the segmented conductive pad (902) where the LED (420) is not installed, a short circuit caused by contact between the segmented conductive pad (902) and the conductive jig (501) due to sagging of the conductive jig (501) can be reduced.

[0132] Fig. 13 is a drawing exemplarily illustrating a process for performing a lighting inspection during assembly of a display device including a substrate having an exemplary insulating portion. Fig. 14 is a drawing exemplarily illustrating a process for performing a lighting inspection during assembly of a display device using a jig having an exemplary insulating portion.

[0133] Referring to FIGS. 13 and 14, an insulating member (1310; 1410) may be included to prevent contact between the conductive jig (501) and the conductive pad (402') on which the LED (420) is not installed during the lighting test.

[0134] An insulating member (1310) may be placed between pixels. For example, the insulating member (1310) may be placed between LEDs (420). The insulating member (1310) may include a polymer material including a non-conductive material. The polymer material may include a polymer foam.

[0135] The insulating member (1310) can reduce contact between the conductive pad (402') on which the LED (420) is not installed and the conductive jig (501) due to sagging of the conductive jig (501) installed on top of the LED (420) during a lighting test. The insulating member (1310) is disposed on the substrate (401), and may have a thickness that is thicker than the thickness (t2) of the pad (402; 402') and thinner than the sum of the thickness (t1) of the LED (420) and the thickness (t2) of the pad (402; 402'). For example, the height of the insulating member (1310) may be lower than the height of the pad (402; 402'), and may be higher than the combined height of the LED (420) and the pad (402; 402'). If the thickness of the insulating member (1310) is thinner than the thickness (t2) of the pad (402; 402'), a short circuit may occur in the conductive pad (402') on which the LED (420) is not installed due to sagging of the conductive jig (501). To reduce the occurrence of a short circuit, the insulating member (1310) may be formed to be thicker than the thickness of the pad.

[0136] The conductive jig (501) may include an insulating member (1410) disposed on a surface facing the substrate (401) of the display panel (410). The insulating member (1410) disposed on the conductive jig (501) may reduce sagging of the conductive jig (501). The insulating member (1410) may contact the surface of the substrate (401) to support the conductive jig (501). The insulating member (1410) supporting the conductive jig (501) may reduce sagging of the conductive jig (501) and thus reduce the possibility of contact between the conductive jig (501) and the conductive pad (402; 402).

[0137] According to the above-described embodiment, the insulating member (1310) installed on the substrate (401) can be physically removed, chemically washed, or removed by reaction after completion of the lighting test.

[0138] Figure 15 is a drawing illustrating the assembly process of a display device using an exemplary insulating portion. Figure 16a is a drawing illustrating the arrangement of an exemplary insulating portion of a display device. Figure 16b is a drawing illustrating a state during assembly of a display device using an additional insulating portion arranged on an exemplary insulating portion.

[0139] Referring to FIG. 15, the display panel (410) may include an insulating member (e.g., an insulating member (1310) of FIG. 13) disposed between pixels (or LEDs (420)) as in FIG. 13. Among the insulating members (1310), an insulating member (1501) may be first applied on the substrate (401). The insulating member (1501) may be thicker than the thickness of the conductive pad (402; 402').

[0140] When performing a lighting test, the insulating member (1501) has a thickness thicker than that of the pad (402; 402'), thereby reducing the occurrence of a short circuit in the conductive pad (402') where the LED (420) is not installed due to sagging of the conductive jig (501).

[0141] Referring to FIG. 16A, the display panel (410) may include a substrate (401). The substrate (401) may be a base that maintains the shape of the display panel (410). The substrate (401) may be formed of a glass material or a polymer material. The display panel (410) may include a switching circuit (491). The switching circuit (491) may be formed on the substrate (401). The switching circuit (491) may selectively provide an electrical path for the operation of each of the pixels (310-1, 310-2).

[0142] The display panel (410) may further include a first conductive pad (402) and a second conductive pad (402-3). The first conductive pad (402) and the second conductive pad (402-3) may be connected to the switching circuit (491). The first conductive pad (402) and the second conductive pad (402-3) may be configured to be disposed on the substrate (401) and connected to the switching circuit (491). The display panel (410) may further include a first LED (420) and a second LED (420-3). The first LED (420) may include a first electrode (421), a second electrode (422), and a light-emitting element (423). The first electrode (421) may be connected to the first conductive pad (402). The light-emitting element (423) may be placed on the first electrode (421). The second electrode (422) may be placed on the light-emitting element (423). The substrate (401), the switching circuit (491), the first conductive pad (402), and the first LED (420) of FIG. 16A or FIG. 16B may be identical or similar to the substrate (401), the switching circuit (491), the first conductive pad (402), and the LED (420) of FIG. 4. Descriptions of configurations similar to those of FIG. 4 are omitted.

[0143] The second LED (420-3) may include a third electrode (421-3), a fourth electrode (422-3), and a light-emitting element (423-3). The third electrode (421-3) may be connected to the second conductive pad (402-3). The light-emitting element (423-3) may be disposed on the third electrode (421-3). The fourth electrode (422-3) may be disposed on the light-emitting element (423-3). The configuration of the second LED (420-3) may be substantially the same as the configuration of the first LED (420). The second LED (420-3) may be disposed adjacent to the first LED (420). Here, the meaning of being disposed adjacently may mean being disposed right next to. For example, a second LED (420-3) positioned adjacent to a first LED (420) among a plurality of LEDs may be positioned next to the first LED (420). No other LED may be positioned between the first LED (420) and the second LED (420-3).

[0144] The display panel (410) may further include an insulating member (1501). The insulating member (1501) may be placed between the first LED (420) and the second LED (420).

[0145] The height (h1) of the insulating member (1501) may be higher than the height (h2) of the first conductive pad (402), and the height (h1) of the insulating member (1501) may be lower than the height (h3) of the first LED (420) or the second LED (420-3) coupled to the first conductive pad (402). The height (h1) of the insulating member (1501) may refer to a distance from one side of the insulating member (1501) in contact with the substrate (401) to the other side of the insulating member (1501). The other side of the insulating member (1501) may be a side opposite to the one side of the insulating member (1501). The height (h2) of the conductive pad (402) may refer to a distance from one side of the conductive pad (402) in contact with the substrate (401) to the other side of the conductive pad (402). The other side of the conductive pad (402) may be a side opposite to one side of the conductive pad (402). The height (h3) of the first LED (420) or the second LED (420-3) coupled to the conductive pad (402) may mean the distance from one side of the conductive pad (402) that contacts the substrate (401) to the other side opposite to one side of the first LED (420) or the second LED (420-3) that contacts the conductive pad. The height (h3) of the first LED (420) or the second LED (420-3) coupled to the conductive pad (402) may mean the distance from the substrate (401) to the upper surface of the first LED (420) or the second LED (420-3) (e.g., the other side of the first LED (420) or the second LED (420-3)). The height (h3) of the first LED (420) or the second LED (420-3) coupled to the conductive pad (402) may mean the sum of the thickness of the conductive pad (402) and the thickness of the first LED (420) or the second LED (420-3).The thickness of the insulating member (1501), which is the height (h1) of the insulating member (1501), may be thicker than the thickness of the first conductive pad (402), and may be thinner than the sum of the thickness of the conductive pad (402) and the thickness of the first LED (420) or the sum of the thickness of the conductive pad (402) and the thickness of the second LED (420-3).

[0146] Referring to FIGS. 16A and 16B, the insulating member (1501) may be used as a part of a dam (1610). The display panel (410) may include a dam (1610) that surrounds each of the sub-pixels (310-1, 310-3). The dam (1610) may be a partition wall that is spaced apart from each of the sub-pixels (310-1, 301-3) and extends to surround each of the sub-pixels (310-1, 310-3). The dam (1610) may be disposed on the substrate (401) and may form a grid. The dam (1610) that forms the grid may form a plurality of cells. The cells formed on the substrate (401) by the dam (1610) may be regions where each of the pixels (310-1, 301-2, 301-3, 301-4) is arranged. An LED (420) may be mounted in each of the cells separated by the dam (1610). A color conversion material may be filled in the cell where the LED (420) is mounted.

[0147] The dam (1610) may be formed of an insulating material and may include a light-blocking material. The dam (1610) may be formed thicker than the LED (420). Since the thickness of the insulating member (1501) is formed thicker than the conductive pad (402) and thinner than the LED (420), the thickness of the dam (1610) may be compensated for by adding an additional insulating member (1602). The height of the dam (1610), i.e., the sum of the heights of the insulating member (1501) and the additional insulating member (1602), may be greater than the sum of the heights of the first LED (420) coupled to the conductive pad (402) and the height of the conductive pad (402). When the conductive pad (402) is attached to the outside of the substrate (401), the height of the dam (1610) may be greater than the sum of the height of the conductive pad (402) and the height of the first LED (420).

[0148] An additional insulating member (1602) may be placed on the insulating member (1501). The additional insulating member (1602) may be formed of substantially the same material as the insulating member (1501). However, the present invention is not limited thereto and may include a different material from the insulating member (1501).

[0149] Color conversion materials (451, 453) and transparent materials (452) may be placed within a space surrounded by an insulating member (1501) and an additional insulating member (1602). The color conversion materials (451, 453) may be identical to or similar to the color conversion materials (451, 453) and transparent materials (452) of FIG. 4.

[0150] The display panel (410) according to the above-described embodiment utilizes an insulating member (1501) as part of a dam (1610) to prevent a short circuit between a conductive pad (402) and a jig during a lighting test, so that the insulating member (1501) can be utilized as one of the components of the display panel (410) without being removed. The insulating member (1501) utilized as a component of the completed display panel (410) can reduce the manufacturing cost of the display panel (410).

[0151] Above, the structure of the jig for the configuration and lighting inspection of the display device has been specifically described. Below, a method for manufacturing the display device will be described based on the drawings.

[0152] Referring to FIGS. 6 and 7, the LED (420) may be mounted on the conductive pad (402). By being mounted on the conductive pad (402), the LED (420) may be electrically connected to the LED (420) and a switching circuit (e.g., the switching circuit (491) of FIG. 4). In order to electrically connect the first electrode (421) of the LED (420) to the conductive pad (402), a portion of the insulating layer (611) surrounding the conductive pad (402) may be removed. The insulating layer (611) including a thermoplastic material may be removed by high temperature and high pressure when the LED (420) is bonded. The removed portion of the insulating layer (611) may correspond to the first electrode (421). For example, the removed portion of the insulating layer (611) may be substantially the same area as the first electrode (421). The insulating layer (611) is arranged along the side of the first electrode (421) and can be in contact with the side of the first electrode (421).

[0153] As shown in Fig. 6, a portion of the insulating layer (611) can be removed chemically using high temperature and high pressure, but as shown in Fig. 7, a portion of the insulating layer (711) can be removed physically.

[0154] The insulating layer (711) may be removed by removing a portion of the insulating layer (611) that surrounds the conductive pad (402) by the sawtooth-shaped first electrode (721) while the LED (420) is connected to the conductive pad (402) on the substrate (401).

[0155] The LED (420) can be electrically connected to the conductive pad (402) through the first electrode (421, 721) that penetrates a portion of the above insulating layer (611; 711). After the LED (420) is mounted, a lighting test can be performed using a conductive jig (501).

[0156] Referring to Fig. 8, the lighting test may be a test to confirm the light emission of the LED (420) before the connection of the second electrode (422). For the lighting test, the conductive jig (501) may be placed so as to contact the second electrode (422) of the LED (420) mounted on the substrate (401). Even if the conductive jig (501) sags, a short circuit can be prevented through the insulating layer (711) that surrounds the pad (402') on which the LED (420) is not mounted.

[0157] Referring to FIG. 12, during a lighting inspection, even if the conductive jig (501) comes into contact with some of the plurality of segmented pads (1001), it can come into contact with a pad that is not connected to the wiring (1011), thereby preventing a short circuit. Even if the conductive jig (501) comes into contact with a pad connected to the wiring (1011) among the plurality of segmented pads (1001), the increased resistance reduces the current flowing to the wiring (1011), thereby preventing a short circuit between the conductive pad (402') and the conductive jig (501).

[0158] Referring to FIGS. 13, 14, and 15, a substrate (401) including a structure for preventing a conductive jig (501) from contacting a conductive pad (402') on which an LED (420) is not installed during a lighting test can be prepared. The structure can be utilized as a component constituting a display panel after the lighting test. For example, after the lighting test of the substrate (401) including the insulating member (1501) is completed, an additional insulating member (1602) can be placed on the insulating member (1501) to form a dam (1610). The dam (1610) forms a cell surrounding the LED, and a color conversion material can be filled within the cell.

[0159] According to the above-described embodiment, the display device includes a vertical LED structure, and thus, a conductive jig can be used to perform a lighting test of the LED before connecting the upper electrode (e.g., the second electrode (422) of FIG. 4) after bonding the LED to the substrate. When using a conductive jig, a method for resolving a short between the conductive jig and the conductive pad arranged on the substrate is required.

[0160] The technical tasks to be achieved in this document are not limited to the technical tasks mentioned above, and other technical tasks not mentioned will be clearly understood by those with ordinary knowledge in the technical field to which this document pertains.

[0161] According to the above-described embodiment, a display panel (e.g., a display panel (410) of FIG. 4) may include a substrate (401), a switching circuit (e.g., a switching circuit (491) of FIG. 4) disposed on the substrate, and a first conductive pad (402) (e.g., a conductive pad (402) of FIG. 4) and a second conductive pad (402) (e.g., a conductive pad (402) of FIG. 4) connected to the switching circuit. The display panel (410) may include a first LED (e.g., LED (420) of FIG. 4) including a first electrode (421) connected to the first conductive pad (402), a light emitting element (423) disposed on the first electrode (421), and a second electrode (422) disposed on the light emitting element (423), a second LED (420) (e.g., LED (420) of FIG. 4) including a third electrode connected to the second conductive pad (402'), a light emitting element (423) disposed on the third electrode, and a fourth electrode disposed on the light emitting element (423).

[0162] The display panel (410) may include an insulating member (e.g., an insulating member (440) of FIG. 4 or a dam (1610) of FIG. 16a) disposed between the first LED (420) and the second LED (420).

[0163] The height of the insulating member (1501) may be greater than the height of the first conductive pad (402). The height of the insulating member (1501) may be less than the height of the first LED coupled to the first conductive pad (402).

[0164] The above insulating member (440, 1501, 1610) may be thicker than the thickness of the first conductive pad (402).

[0165] According to one embodiment, the display panel may include an additional insulating member (1602) disposed on the insulating member (1501).

[0166] In one embodiment, the sum of the height of the insulating member and the height of the additional insulating member may be thicker than the height of the first LED (420) coupled to the first conductive pad.

[0167] In one embodiment, the insulating member and the additional insulating member can surround the first LED (420) along a side of the first LED (420).

[0168] According to one embodiment, the insulating member (440; 1610) may further include a color conversion material (e.g., color conversion material (451, 452, 453) of FIG. 4) disposed within the space surrounding the insulating member (440; 1610).

[0169] According to one embodiment, the colors of light emitted from the first LED (420) and the second LED (420) may be the same.

[0170] According to one embodiment, the insulating member (440; 1610) has a rough shape and can be spaced apart from the first LED (420) and the second LED (420).

[0171] In one embodiment, the first LED may be positioned adjacent to the second LED.

[0172] According to one embodiment, the second electrode and the fourth electrode may include a transparent material to transmit light emitted from each of the light-emitting elements of the first LED and the light-emitting elements of the second LED.

[0173] According to one embodiment, the device may further include an additional transparent substrate disposed on the second electrode and the fourth electrode and configured to connect each of the second electrode and the fourth electrode to a switching circuit.

[0174] According to one embodiment, the display panel (410) includes a substrate (401), a switching circuit (491) formed on the substrate, a conductive pad formed on the substrate and connected to the switching circuit (491), a first electrode (421) connected to the conductive pad (402), a light-emitting element (423) disposed on the first electrode (421), and a second electrode (422) disposed on the light-emitting element (423). The conductive pad (402) includes partial pads spaced apart from each other, and the conductive pad (402) can be coupled to the first electrode by a conductive material disposed between the partial pads.

[0175] According to one embodiment, the display panel (410) may include a non-conductive layer surrounding a side surface of the first conductive pad (402) and a portion of the top surface of the first conductive pad (402).

[0176] According to one embodiment, the surface of the first electrode (421) may be in contact with one side of the first conductive pad (402).

[0177] According to one embodiment, the non-conductive layer may contact a side surface of the first electrode (421) along an edge of an area corresponding to the surface of the first electrode (421) on the first conductive pad (402).

[0178] According to one embodiment, the area of ​​the upper surface of the first conductive pad (402) exposed by the non-conductive layer may be equal to the area of ​​the first electrode (421).

[0179] According to one embodiment, the first conductive pad (402) may include partial pads spaced apart from each other and a conductive material disposed between the partial pads.

[0180] In one embodiment, the melting point of the conductive material may be lower than the melting point of the first conductive pad (402).

[0181] According to one embodiment, the first electrode (421) may include a protrusion facing the first conductive pad (402).

[0182] According to one embodiment, the device may further include a non-conductive layer disposed on the first conductive pad (402).

[0183] In one embodiment, the non-conductive layer may include a hole into which the protrusion is inserted.

[0184] According to one embodiment, the display panel may include a third conductive pad disposed on the substrate and a non-conductive layer surrounding the third conductive pad.

[0185] The display panel (410) may include a substrate, a switching circuit disposed on the substrate, and a conductive pad connected to the switching circuit. The display panel (410) may include an LED (420) including a first electrode (421) connected to the conductive pad and including a protrusion facing the conductive pad, a light-emitting element (423) disposed on the first electrode (421), and a second electrode (422) disposed on the light-emitting element (423). The display panel (410) may further include a non-conductive layer covering a portion of an upper surface of the first conductive pad (402).

[0186] According to one embodiment, the surface of the first electrode may be in contact with one side of the first conductive pad, and the non-conductive layer may be disposed along the side of the first electrode on the first conductive pad.

[0187] According to one embodiment, the area of ​​the upper surface of the first conductive pad exposed through the non-conductive layer may be equal to the area of ​​the first electrode in contact with the upper surface of the first conductive pad.

[0188] According to one embodiment, the insulating member (1501) may be thicker than the thickness of the conductive pad.

[0189] In one embodiment, the insulating member (440; 1610) may be thicker than the LED (420).

[0190] According to one embodiment, the insulating member (440; 1610) can surround the LED (420) along a side of the LED (420).

[0191] According to one embodiment, the display panel (410) may further include a color conversion material disposed within a space surrounded by the insulating member (440; 1610).

[0192] According to one embodiment, the first electrode may include a protrusion protruding toward the conductive pad and in contact with the conductive pad, and the non-conductive layer may include a hole into which the protrusion is inserted.

[0193] In one embodiment, the conductive pad may include a groove that receives the protrusion and is continuous with the hole.

[0194] FIG. 17 is a block diagram of an electronic device within a network environment according to various embodiments.

[0195] Referring to FIG. 17, in a network environment (1700), an electronic device (1701) may communicate with an electronic device (1702) via a first network (1798) (e.g., a short-range wireless communication network), or may communicate with at least one of an electronic device (1704) or a server (1708) via a second network (1799) (e.g., a long-range wireless communication network). In one embodiment, the electronic device (1701) may communicate with the electronic device (1704) via the server (1708). According to one embodiment, the electronic device (1701) may include a processor (1720), a memory (1730), an input module (1750), an audio output module (1755), a display module (1760), an audio module (1770), a sensor module (1776), an interface (1777), a connection terminal (1778), a haptic module (1779), a camera module (1780), a power management module (1788), a battery (1789), a communication module (1790), a subscriber identification module (1796), or an antenna module (1797). In some embodiments, the electronic device (1701) may omit at least one of these components (e.g., the connection terminal (1778)), or may have one or more other components added. In some embodiments, some of these components (e.g., sensor module (1776), camera module (1780), or antenna module (1797)) may be integrated into a single component (e.g., display module (1760)).

[0196] The processor (1720) may, for example, execute software (e.g., a program (1740)) to control at least one other component (e.g., a hardware or software component) of the electronic device (1701) connected to the processor (1720) and perform various data processing or operations. According to one embodiment, as at least a part of the data processing or operations, the processor (1720) may store commands or data received from other components (e.g., a sensor module (1776) or a communication module (1790)) in a volatile memory (1732), process the commands or data stored in the volatile memory (1732), and store result data in a non-volatile memory (1734). According to one embodiment, the processor (1720) may include a main processor (1721) (e.g., a central processing unit or an application processor) or an auxiliary processor (1723) (e.g., a graphics processing unit, a neural processing unit (NPU), an image signal processor, a sensor hub processor, or a communication processor) that can operate independently or together with the main processor (1721). For example, when the electronic device (1701) includes the main processor (1721) and the auxiliary processor (1723), the auxiliary processor (1723) may be configured to use less power than the main processor (1721) or to be specialized for a given function. The auxiliary processor (1723) may be implemented separately from the main processor (1721) or as a part thereof.

[0197] The auxiliary processor (1723) may control at least a portion of functions or states associated with at least one component (e.g., a display module (1760), a sensor module (1776), or a communication module (1790)) of the electronic device (1701), for example, on behalf of the main processor (1721) while the main processor (1721) is in an inactive (e.g., sleep) state, or together with the main processor (1721) while the main processor (1721) is in an active (e.g., application execution) state. In one embodiment, the auxiliary processor (1723) (e.g., an image signal processor or a communication processor) may be implemented as a part of another functionally related component (e.g., a camera module (1780) or a communication module (1790)). In one embodiment, the auxiliary processor (1723) (e.g., a neural network processing unit) may include a hardware structure specialized for processing artificial intelligence models. The artificial intelligence models may be generated through machine learning. This learning can be performed, for example, on the electronic device (1701) where the artificial intelligence model is executed, or can be performed through a separate server (e.g., server (1708)). The learning algorithm can include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but is not limited to the examples described above. The artificial intelligence model can include multiple artificial neural network layers.The artificial neural network may be one of a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), a deep Q-network, or a combination of two or more of the above, but is not limited to the examples described above. In addition to, or alternatively to, a hardware structure, an artificial intelligence model may include a software structure.

[0198] The memory (1730) can store various data used by at least one component (e.g., the processor (1720) or the sensor module (1776)) of the electronic device (1701). The data can include, for example, software (e.g., the program (1740)) and input data or output data for commands related thereto. The memory (1730) can include volatile memory (1732) or non-volatile memory (1734).

[0199] The program (1740) may be stored as software in memory (1730) and may include, for example, an operating system (1742), middleware (1744), or an application (1746).

[0200] The input module (1750) can receive commands or data to be used in a component of the electronic device (1701) (e.g., a processor (1720)) from an external source (e.g., a user) of the electronic device (1701). The input module (1750) can include, for example, a microphone, a mouse, a keyboard, a key (e.g., a button), or a digital pen (e.g., a stylus pen).

[0201] The audio output module (1755) can output audio signals to the outside of the electronic device (1701). The audio output module (1755) can include, for example, a speaker or a receiver. The speaker can be used for general purposes, such as multimedia playback or recording playback. The receiver can be used to receive incoming calls. In one embodiment, the receiver can be implemented separately from the speaker or as part of the speaker.

[0202] The display module (1760) can visually provide information to an external party (e.g., a user) of the electronic device (1701). The display module (1760) may include, for example, a display, a holographic device, or a projector, and a control circuit for controlling the device. In one embodiment, the display module (1760) may include a touch sensor configured to detect a touch, or a pressure sensor configured to measure the intensity of a force generated by the touch.

[0203] The audio module (1770) can convert sound into an electrical signal, or vice versa. According to one embodiment, the audio module (1770) can acquire sound through the input module (1750), output sound through the sound output module (1755), or an external electronic device (e.g., electronic device (1702)) (e.g., speaker or headphone) directly or wirelessly connected to the electronic device (1701).

[0204] The sensor module (1776) can detect the operating status (e.g., power or temperature) of the electronic device (1701) or the external environmental status (e.g., user status) and generate an electrical signal or data value corresponding to the detected status. According to one embodiment, the sensor module (1776) can include, for example, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0205] The interface (1777) may support one or more designated protocols that may be used to directly or wirelessly connect the electronic device (1701) with an external electronic device (e.g., the electronic device (1702)). In one embodiment, the interface (1777) may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

[0206] The connection terminal (1778) may include a connector through which the electronic device (1701) may be physically connected to an external electronic device (e.g., the electronic device (1702)). In one embodiment, the connection terminal (1778) may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0207] The haptic module (1779) can convert electrical signals into mechanical stimuli (e.g., vibration or movement) or electrical stimuli that a user can perceive through tactile or kinesthetic sensations. In one embodiment, the haptic module (1779) may include, for example, a motor, a piezoelectric element, or an electrical stimulation device.

[0208] The camera module (1780) can capture still images and videos. In one embodiment, the camera module (1780) may include one or more lenses, image sensors, image signal processors, or flashes.

[0209] The power management module (1788) can manage the power supplied to the electronic device (1701). According to one embodiment, the power management module (1788) can be implemented as, for example, at least a part of a power management integrated circuit (PMIC).

[0210] A battery (1789) may power at least one component of the electronic device (1701). In one embodiment, the battery (1789) may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

[0211] The communication module (1790) may support the establishment of a direct (e.g., wired) communication channel or a wireless communication channel between the electronic device (1701) and an external electronic device (e.g., electronic device (1702), electronic device (1704), or server (1708)), and the performance of communication through the established communication channel. The communication module (1790) may operate independently from the processor (1720) (e.g., application processor) and may include one or more communication processors that support direct (e.g., wired) communication or wireless communication. According to one embodiment, the communication module (1790) may include a wireless communication module (1792) (e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module (1794) (e.g., a local area network (LAN) communication module, or a power line communication module). Any of these communication modules may communicate with an external electronic device (1704) via a first network (1798) (e.g., a short-range communication network such as Bluetooth, wireless fidelity (WiFi) direct, or infrared data association (IrDA)) or a second network (1799) (e.g., a long-range communication network such as a legacy cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., a local area network or a wide area network)). These various types of communication modules may be integrated into a single component (e.g., a single chip) or implemented as multiple separate components (e.g., multiple chips). The wireless communication module (1792) may use subscriber information (e.g., an international mobile subscriber identity (IMSI)) stored in the subscriber identification module (1796) to identify or authenticate the electronic device (1701) within a communication network such as the first network (1798) or the second network (1799).

[0212] The wireless communication module (1792) can support 5G networks and next-generation communication technologies following the 4G network, such as NR access technology (new radio access technology). The NR access technology can support high-speed transmission of high-capacity data (eMBB (enhanced mobile broadband)), minimization of terminal power and connection of multiple terminals (mMTC (massive machine type communications)), or high reliability and low latency communications (URLLC (ultra-reliable and low-latency communications)). The wireless communication module (1792) can support, for example, a high-frequency band (e.g., mmWave band) to achieve a high data transmission rate. The wireless communication module (1792) may support various technologies for securing performance in high-frequency bands, such as beamforming, massive multiple-input and multiple-output (MIMO), full dimensional MIMO (FD-MIMO), array antenna, analog beam-forming, or large scale antenna. The wireless communication module (1792) may support various requirements specified in the electronic device (1701), an external electronic device (e.g., the electronic device (1704)), or a network system (e.g., the second network (1799)). According to one embodiment, the wireless communication module (1792) can support a peak data rate (e.g., 20 Gbps or more) for eMBB realization, a loss coverage (e.g., 164 dB or less) for mMTC realization, or a U-plane latency (e.g., 0.5 ms or less for downlink (DL) and uplink (UL), or 1 ms or less for round trip) for URLLC realization.

[0213] The antenna module (1797) can transmit or receive signals or power to or from an external device (e.g., an external electronic device). In one embodiment, the antenna module (1797) may include an antenna including a radiator formed of a conductor or a conductive pattern formed on a substrate (e.g., a PCB). In one embodiment, the antenna module (1797) may include a plurality of antennas (e.g., an array antenna). In this case, at least one antenna suitable for a communication method used in a communication network, such as the first network (1798) or the second network (1799), may be selected from the plurality of antennas by, for example, the communication module (1790). A signal or power may be transmitted or received between the communication module (1790) and the external electronic device via the at least one selected antenna. In some embodiments, in addition to the radiator, another component (e.g., a radio frequency integrated circuit (RFIC)) may be additionally formed as a part of the antenna module (1797).

[0214] According to various embodiments, the antenna module (1797) may form a mmWave antenna module. In one embodiment, the mmWave antenna module may include a printed circuit board, an RFIC disposed on or adjacent a first side (e.g., a bottom side) of the printed circuit board and capable of supporting a designated high frequency band (e.g., a mmWave band), and a plurality of antennas (e.g., an array antenna) disposed on or adjacent a second side (e.g., a top side or a side side) of the printed circuit board and capable of transmitting or receiving signals in the designated high frequency band.

[0215] At least some of the above components can be interconnected and exchange signals (e.g., commands or data) with each other via a communication method between peripheral devices (e.g., a bus, GPIO (general purpose input and output), SPI (serial peripheral interface), or MIPI (mobile industry processor interface)).

[0216] According to one embodiment, commands or data may be transmitted or received between the electronic device (1701) and an external electronic device (1704) via a server (1708) connected to a second network (1799). Each of the external electronic devices (1702 or 1704) may be the same or a different type of device as the electronic device (1701). According to one embodiment, all or part of the operations executed in the electronic device (1701) may be executed in one or more of the external electronic devices (1702, 1704, or 1708). For example, when the electronic device (1701) is to perform a certain function or service automatically or in response to a request from a user or another device, the electronic device (1701) may, instead of or in addition to executing the function or service itself, request one or more external electronic devices to perform the function or at least a part of the service. One or more external electronic devices that receive the request may execute at least a portion of the requested function or service, or an additional function or service related to the request, and transmit the result of the execution to the electronic device (1701). The electronic device (1701) may process the result as is or additionally and provide it as at least a portion of a response to the request. For this purpose, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology may be used, for example. The electronic device (1701) may provide an ultra-low latency service using, for example, distributed computing or mobile edge computing. In another embodiment, the external electronic device (1704) may include an Internet of Things (IoT) device. The server (1708) may be an intelligent server utilizing machine learning and / or a neural network.According to one embodiment, an external electronic device (1704) or server (1708) may be included in the second network (1799). The electronic device (1701) may be applied to intelligent services (e.g., smart home, smart city, smart car, or healthcare) based on 5G communication technology and IoT-related technology. Each of the external electronic device (1702) and the external electronic device (1704) may be the same or a different type of electronic device as the electronic device (1701). All or part of the operations executed in the electronic device (1701) may be executed in one or more of the external electronic devices (1702, 1704) or the server (1708). For example, when an electronic device (1701) needs to perform a function or service automatically or in response to a request from a user or another device, the electronic device (1701) may, instead of or in addition to executing the function or service on its own, request one or more external electronic devices to perform at least a portion of the function or service. One or more external electronic devices (1702, 1704) or a server (1708) that receive the request may execute at least a portion of the requested function or service, or an additional function or service related to the request, and transmit the result of the execution to the electronic device (1701). The electronic device (1701) may process the result as is or additionally and provide it as at least a portion of a response to the request. For example, the external electronic device (1702) may render content data executed in an application and then transmit it to the electronic device (1701), and the electronic device (1701) that receives the data may output the content data to a display module.If the electronic device (1701) detects user movement through a sensor module (1776) (e.g., an IMU (inertial measurement unit) sensor), the processor of the electronic device (1701) may correct the rendering data received from the external electronic device (1702) based on the movement information and output it to the display module (1760). Alternatively, the processor may transmit the movement information to the external electronic device (1702) to request rendering so that the screen data is updated accordingly. According to various embodiments, the external electronic device (1702) may be a variety of devices, such as a smartphone or a case device that can store and charge the electronic device (1701).

[0217] FIG. 18 is a block diagram (1800) of a display module (1760) according to various embodiments.

[0218] Referring to FIG. 18, the display module (1760) may include a display (1810) and a display driver IC (DDI) (1830) for controlling the display (1810). The DDI (1830) may include an interface module (1831), a memory (1833) (e.g., a buffer memory), an image processing module (1835), or a mapping module (1837). The DDI (1830) may receive image information including, for example, image data or an image control signal corresponding to a command for controlling the image data, from another component of the electronic device 1701 through the interface module (1831). For example, according to one embodiment, image information may be received from a processor (1720) (e.g., a main processor (1721) (e.g., an application processor) or an auxiliary processor (1723) (e.g., a graphics processing unit) that operates independently of the function of the main processor (1721). The DDI (1830) may communicate with a touch circuit (1850) or a sensor module (1776) through the interface module (1831). In addition, the DDI (1830) may store at least a part of the received image information in the memory (1833), for example, in units of frames. The image processing module (1835) may, for example, perform preprocessing or postprocessing (e.g., resolution, brightness, or size adjustment) on at least a part of the image data based on at least a characteristic of the image data or a characteristic of the display (1810). The mapping module (1837) may output a voltage value or a value corresponding to the image data preprocessed or postprocessed through the image processing module (1735). A current value can be generated. In one embodiment, the generation of the voltage value or current value can be performed at least in part based on the properties of the pixels of the display (1810), for example, the arrangement of the pixels (e.g., an RGB stripe or pentile structure), or the size of each sub-pixel.At least some pixels of the display (1810) may be driven based at least in part on, for example, the voltage value or current value, so that visual information (e.g., text, an image, or an icon) corresponding to the image data may be displayed through the display (1810).

[0219] According to one embodiment, the display module (1760) may further include a touch circuit (1850). The touch circuit (1850) may include a touch sensor (1851) and a touch sensor IC (1853) for controlling the touch sensor (1851). The touch sensor IC (1853) may control the touch sensor (1851) to detect, for example, a touch input or a hovering input for a specific location of the display (1810). For example, the touch sensor IC (1853) may detect the touch input or the hovering input by measuring a change in a signal (e.g., voltage, light quantity, resistance, or charge quantity) for a specific location of the display (1810). The touch sensor IC (1853) may provide information (e.g., location, area, pressure, or time) regarding the detected touch input or hovering input to the processor (1720). According to one embodiment, at least a portion of the touch circuit (1850) (e.g., touch sensor IC (1853)) may be included as part of the display driver IC (1830), or as part of the display (1810), or as part of another component (e.g., coprocessor (1723)) disposed external to the display module (1760).

[0220] According to one embodiment, the display module (1760) may further include at least one sensor (e.g., a fingerprint sensor, an iris sensor, a pressure sensor, or an illuminance sensor) of the sensor module (1776), or a control circuit therefor. In this case, the at least one sensor or the control circuit therefor may be embedded in a part of the display module (1760) (e.g., the display (1810) or the DDI (1830)) or a part of the touch circuit (1850). For example, when the sensor module (1776) embedded in the display module (1760) includes a biometric sensor (e.g., a fingerprint sensor), the biometric sensor may obtain biometric information (e.g., a fingerprint image) associated with a touch input through a part of the display (1810). For another example, if the sensor module (1776) embedded in the display module (1760) includes a pressure sensor, the pressure sensor may obtain pressure information associated with a touch input through a portion or the entire area of ​​the display (1810). According to one embodiment, the touch sensor (1851) or the sensor module (1776) may be positioned between pixels of a pixel layer of the display (1810), or above or below the pixel layer.

[0221] Referring to FIGS. 19A and 19B , a wearable device (1900) according to one embodiment may have the form of glasses that are wearable on a body part of a user (e.g., a head). The wearable device (1900) may include a head-mounted display (HMD). For example, the housing of the wearable device (1900) may include a flexible material, such as rubber and / or silicone, that is configured to fit closely to a portion of the user's head (e.g., a portion of the face surrounding both eyes). For example, the housing of the wearable device (1900) may include one or more straps that are capable of being twined around the user's head, and / or one or more temples that are detachably attachable to an ear of the head.

[0222] Referring to FIG. 19A, according to one embodiment, a wearable device (1900) may include at least one display (1950) and a frame supporting at least one display (1950).

[0223] According to one embodiment, a wearable device (1900) can be worn on a part of a user's body. The wearable device (1900) can provide augmented reality (AR), virtual reality (VR), or mixed reality (MR) that combines augmented reality and virtual reality to a user wearing the wearable device (1900). For example, the wearable device (1900) can display a virtual reality image provided from at least one optical device (1982, 1984) of FIG. 19B on at least one display (1950) in response to a user's designated gesture acquired through the motion recognition cameras (1960-2, 1960-3) of FIG. 19B.

[0224] According to one embodiment, at least one display (1950) may provide visual information to a user. For example, at least one display (1950) may include a transparent or translucent lens. At least one display (1950) may include a first display (1950-1) and / or a second display (1950-2) spaced apart from the first display (1950-1). For example, the first display (1950-1) and the second display (1950-2) may be positioned at positions corresponding to the user's left and right eyes, respectively.

[0225] Referring to FIG. 19B, at least one display (1950) can provide a user with visual information transmitted from external light and other visual information distinct from the visual information through a lens included in the at least one display (1950). The lens can be formed based on at least one of a Fresnel lens, a pancake lens, or a multi-channel lens. For example, the at least one display (1950) can include a first surface (1931) and a second surface (1932) opposite the first surface (1931). A display area can be formed on the second surface (1932) of the at least one display (1950). When a user wears the wearable device (1900), external light can be transmitted to the user by being incident on the first surface (1931) and transmitted through the second surface (1932). As another example, at least one display (1950) can display an augmented reality image combined with a virtual reality image provided from at least one optical device (1982, 1984) on a real screen transmitted through external light, in a display area formed on the second surface (1932).

[0226] In one embodiment, at least one display (1950) may include at least one waveguide (1933, 1934) that diffracts light emitted from at least one optical device (1982, 1984) and transmits the diffracted light to a user. The at least one waveguide (1933, 1934) may be formed based on at least one of glass, plastic, or polymer. A nanopattern may be formed on at least a portion of the exterior or interior of the at least one waveguide (1933, 1934). The nanopattern may be formed based on a grating structure having a polygonal and / or curved shape. Light incident on one end of the at least one waveguide (1933, 1934) may be propagated to the other end of the at least one waveguide (1933, 1934) by the nanopattern. At least one waveguide (1933, 1934) may include at least one diffractive element (e.g., a diffractive optical element (DOE), a holographic optical element (HOE)), or at least one reflective element (e.g., a reflective mirror). For example, at least one waveguide (1933, 1934) may be positioned within the wearable device (1900) to guide a screen displayed by at least one display (1950) to the user's eyes. For example, the screen may be transmitted to the user's eyes based on total internal reflection (TIR) ​​occurring within the at least one waveguide (1933, 1934).

[0227] The wearable device (1900) can analyze an object included in a real-world image collected through a camera (1960-4), combine a virtual object corresponding to an object to be provided with augmented reality among the analyzed objects, and display the virtual object on at least one display (1950). The virtual object can include at least one of text and an image regarding various information related to the object included in the real-world image. The wearable device (1900) can analyze the object based on a multi-camera, such as a stereo camera. For the object analysis, the wearable device (1900) can perform spatial recognition (e.g., simultaneous localization and mapping (SLAM)) using the multi-camera and / or time-of-flight (ToF). A user wearing the wearable device (1900) can view an image displayed on at least one display (1950).

[0228] According to one embodiment, the frame may be formed as a physical structure that allows the wearable device (1900) to be worn on the user's body. According to one embodiment, the frame may be configured so that, when the user wears the wearable device (1900), the first display (1950-1) and the second display (1950-2) can be positioned corresponding to the user's left and right eyes. The frame may support at least one display (1950). For example, the frame may support the first display (1950-1) and the second display (1950-2) to be positioned corresponding to the user's left and right eyes.

[0229] Referring to FIG. 19A, the frame may include a region (1920) that at least partially contacts a portion of the user's body when the user wears the wearable device (1900). For example, the region (1920) of the frame that contacts a portion of the user's body may include a region that contacts a portion of the user's nose, a portion of the user's ear, and a portion of the side of the user's face that the wearable device (1900) makes contact with. According to one embodiment, the frame may include a nose pad (1910) that contacts a portion of the user's body. When the wearable device (1900) is worn by the user, the nose pad (1910) may contact a portion of the user's nose. The frame may include a first temple (1904) and a second temple (1905) that contact another portion of the user's body that is distinct from the portion of the user's body.

[0230] For example, the frame may include a first rim (1901) surrounding at least a portion of a first display (1950-1), a second rim (1902) surrounding at least a portion of a second display (1950-2), a bridge (1903) disposed between the first rim (1901) and the second rim (1902), a first pad (1911) disposed along a portion of an edge of the first rim (1901) from one end of the bridge (1903), a second pad (1912) disposed along a portion of an edge of the second rim (1902) from the other end of the bridge (1903), a first temple (1904) extending from the first rim (1901) and secured to a portion of an ear of the wearer, and a second temple (1905) extending from the second rim (1902) and secured to a portion of an ear opposite the ear. The first pad (1911) and the second pad (1912) may be in contact with a portion of the user's nose, and the first temple (1904) and the second temple (1905) may be in contact with a portion of the user's face and a portion of the user's ear. The temples (1904, 1905) may be rotatably connected to the rim through the hinge units (1906, 1907) of FIG. 19B. The first temple (1904) may be rotatably connected to the first rim (1901) through the first hinge unit (1906) disposed between the first rim (1901) and the first temple (1904). The second temple (1905) can be rotatably connected to the second rim (1902) via a second hinge unit (1907) disposed between the second rim (1902) and the second temple (1905). In one embodiment, the wearable device (1900) can identify an external object (e.g., a user's fingertip) touching the frame and / or a gesture performed by the external object by using a touch sensor, a grip sensor, and / or a proximity sensor formed on at least a portion of a surface of the frame.

[0231] According to one embodiment, the wearable device (1900) may include hardwares (e.g., hardwares described above based on the block diagram of FIG. 17) that perform various functions. For example, the hardwares may include a battery module (1970), an antenna module (1975), at least one optical device (1982, 1984), speakers (e.g., speakers 1955-1, 1955-2), a microphone (e.g., microphones 1965-1, 1965-2, 1965-3), a light-emitting module, and / or a printed circuit board (PCB) (1990) (e.g., a printed circuit board). The various hardware components may be arranged within a frame.

[0232] According to one embodiment, microphones (e.g., microphones 1965-1, 1965-2, 1965-3) of the wearable device (1900) may be disposed on at least a portion of the frame to acquire sound signals. A first microphone (1965-1) disposed on the bridge (1903), a second microphone (1965-2) disposed on the second rim (1902), and a third microphone (1965-3) disposed on the first rim (1901) are illustrated in FIG. 19B , but the number and arrangement of the microphones (1965) are not limited to the embodiment of FIG. 19B . When the number of microphones (1965) included in the wearable device (1900) is two or more, the wearable device (1900) may use multiple microphones disposed on different portions of the frame to identify the direction of the sound signal.

[0233] According to one embodiment, at least one optical device (1982, 1984) may project a virtual object onto at least one display (1950) to provide various image information to a user. For example, at least one optical device (1982, 1984) may be a projector. At least one optical device (1982, 1984) may be positioned adjacent to at least one display (1950) or may be included within at least one display (1950) as a part of at least one display (1950). According to one embodiment, the wearable device (1900) may include a first optical device (1982) corresponding to a first display (1950-1) and a second optical device (1984) corresponding to a second display (1950-2). For example, at least one optical device (1982, 1984) may include a first optical device (1982) positioned at an edge of a first display (1950-1) and a second optical device (1984) positioned at an edge of a second display (1950-2). The first optical device (1982) may transmit light to a first waveguide (1933) positioned on the first display (1950-1), and the second optical device (1984) may transmit light to a second waveguide (1934) positioned on the second display (1950-2).

[0234] In one embodiment, the camera (1960) may include a recording camera (1960-4), an eye tracking camera (ET CAM) (1960-1), and / or a motion recognition camera (1960-2, 1960-3). The recording camera (1960-4), the eye tracking camera (1960-1), and the motion recognition cameras (1960-2, 1960-3) may be positioned at different locations on the frame and may perform different functions. The eye tracking camera (1960-1) may output data indicating the position or gaze of the eyes of a user wearing the wearable device (1900). For example, the wearable device (1900) may detect the gaze from an image including the user's pupils obtained through the eye tracking camera (1960-1).

[0235] The wearable device (1900) can identify an object (e.g., a real object and / or a virtual object) focused on by the user using the user's gaze acquired through the gaze tracking camera (1960-1). The wearable device (1900) that has identified the focused object can execute a function (e.g., gaze interaction) for interaction between the user and the focused object. The wearable device (1900) can express a part corresponding to the eye of an avatar representing the user in a virtual space using the user's gaze acquired through the gaze tracking camera (1960-1). The wearable device (1900) can render an image (or screen) displayed on at least one display (1950) based on the position of the user's eyes.

[0236] For example, the visual quality of a first region related to the gaze within an image and the visual quality (e.g., resolution, brightness, saturation, grayscale, PPI (pixels per inch)) of a second region distinct from the first region may be different from each other. The wearable device (1900) may obtain an image having the visual quality of the first region matching the user's gaze and the visual quality of the second region using foveated rendering. For example, if the wearable device (1900) supports an iris recognition function, user authentication may be performed based on iris information obtained using a gaze tracking camera (1960-1). Although an example in which the gaze tracking camera (1960-1) is positioned toward the user's right eye is illustrated in FIG. 19B, the embodiment is not limited thereto, and the gaze tracking camera (1960-1) may be positioned solely toward the user's left eye, or toward both eyes.

[0237] In one embodiment, the capturing camera (1960-4) can capture an actual image or background to be aligned with a virtual image to implement augmented reality or mixed reality content. The capturing camera (1960-4) can be used to obtain a high-resolution image based on HR (high resolution) or PV (photo video). The capturing camera (1960-4) can capture an image of a specific object existing at a location viewed by the user and provide the image to at least one display (1950). The at least one display (1950) can display a single image in which information about an actual image or background including an image of the specific object obtained using the capturing camera (1960-4) and a virtual image provided through at least one optical device (1982, 1984) are superimposed. The wearable device (1900) can compensate for depth information (e.g., the distance between the wearable device (1900) and an external object acquired through a depth sensor) using an image acquired through the capture camera (1960-4). The wearable device (1900) can perform object recognition using an image acquired through the capture camera (1960-4). The wearable device (1900) can perform a function of focusing on an object (or subject) in an image (e.g., auto focus) and / or an optical image stabilization (OIS) function (e.g., anti-shake function) using the capture camera (1960-4). The wearable device (1900) can perform a pass-through function to display an image acquired through the capture camera (1960-4) by overlapping at least a portion of a screen representing a virtual space on at least one display (1950) while displaying a screen. In one embodiment, the camera (1960-4) may be positioned on a bridge (1903) positioned between the first rim (1901) and the second rim (1902).

[0238] The gaze tracking camera (1960-1) can implement more realistic augmented reality by tracking the gaze of a user wearing a wearable device (1900) and matching the user's gaze with visual information provided to at least one display (1950). For example, when the wearable device (1900) looks straight ahead, the wearable device (1900) can naturally display environmental information related to the user's front at a location where the user is located on at least one display (1950). The gaze tracking camera (1960-1) can be configured to capture an image of the user's pupil to determine the user's gaze. For example, the gaze tracking camera (1960-1) can receive gaze detection light reflected from the user's pupil and track the user's gaze based on the position and movement of the received gaze detection light. In one embodiment, the gaze tracking camera (1960-1) can be positioned at positions corresponding to the user's left and right eyes. For example, the gaze tracking camera (1960-1) may be positioned within the first rim (1901) and / or the second rim (1902) to face the direction in which the user wearing the wearable device (1900) is positioned.

[0239] The gesture recognition camera (1960-2, 1960-3) can provide a specific event on a screen provided on at least one display (1950) by recognizing the movement of the user's entire body, such as the user's torso, hand, or face, or a part of the body. The gesture recognition camera (1960-2, 1960-3) can recognize the user's gesture, obtain a signal corresponding to the gesture, and provide a display corresponding to the signal on at least one display (1950). The processor can identify the signal corresponding to the gesture and perform a designated function based on the identification. The gesture recognition camera (1960-2, 1960-3) can be used to perform a spatial recognition function using SLAM and / or a depth map for 6 degrees of freedom pose (6 dof pose). The processor may perform gesture recognition and / or object tracking functions using the motion recognition cameras (1960-2, 1960-3). In one embodiment, the motion recognition cameras (1960-2, 1960-3) may be positioned on the first rim (1901) and / or the second rim (1902).

[0240] The camera (1960) included in the wearable device (1900) is not limited to the above-described gaze tracking camera (1960-1) and motion recognition cameras (1960-2, 1960-3). For example, the wearable device (1900) can identify an external object included in the FoV using a camera positioned toward the user's FoV. The wearable device (1900) can identify an external object based on a sensor for identifying the distance between the wearable device (1900) and the external object, such as a depth sensor and / or a time of flight (ToF) sensor. The camera (1960) positioned toward the FoV can support an autofocus function and / or an optical image stabilization (OIS) function. For example, the wearable device (1900) may include a camera (1960) (e.g., a face tracking (FT) camera) positioned toward the face to obtain an image including the face of a user wearing the wearable device (1900).

[0241] Although not shown, in one embodiment, the wearable device (1900) may further include a light source (e.g., an LED) that emits light toward a subject (e.g., a user's eyes, face, and / or an external object within the FoV) being captured using the camera (1960). The light source may include an infrared wavelength LED. The light source may be disposed on at least one of the frame and hinge units (1906, 1907).

[0242] In one embodiment, the battery module (1970) may supply power to the electronic components of the wearable device (1900). In one embodiment, the battery module (1970) may be disposed within the first temple (1904) and / or the second temple (1905). For example, the battery module (1970) may be a plurality of battery modules (1970). The plurality of battery modules (1970) may be disposed within each of the first temple (1904) and the second temple (1905). In one embodiment, the battery module (1970) may be disposed at an end of the first temple (1904) and / or the second temple (1905).

[0243] The antenna module (1975) can transmit signals or power to the outside of the wearable device (1900), or receive signals or power from the outside. In one embodiment, the antenna module (1975) can be positioned within the first temple (1904) and / or the second temple (1905). For example, the antenna module (1975) can be positioned close to one surface of the first temple (1904) and / or the second temple (1905).

[0244] The speaker (1955) can output an audio signal to the outside of the wearable device (1900). The audio output module may be referred to as a speaker. In one embodiment, the speaker (1955) may be positioned within the first temple (1904) and / or the second temple (1905) so as to be positioned adjacent to the ear of a user wearing the wearable device (1900). For example, the speaker (1955) may include a second speaker (1955-2) positioned within the first temple (1904) and thus adjacent to the user's left ear, and a first speaker (1955-1) positioned within the second temple (1905) and thus adjacent to the user's right ear.

[0245] The light-emitting module (not shown) may include at least one light-emitting element. The light-emitting module may emit light of a color corresponding to a specific state or emit light with an action corresponding to a specific state to visually provide information regarding a specific state of the wearable device (1900) to the user. For example, when the wearable device (1900) requires charging, it may emit red light at a regular cycle. In one embodiment, the light-emitting module may be disposed on the first rim (1901) and / or the second rim (1902).

[0246] Referring to FIG. 19B, according to one embodiment, a wearable device (1900) may include a printed circuit board (PCB) (1990). The PCB (1990) may be included in at least one of a first temple (1904) or a second temple (1905). The PCB (1990) may include an interposer positioned between at least two sub-PCBs. One or more hardwares included in the wearable device (1900) (e.g., hardwares illustrated by different blocks in FIG. 2) may be positioned on the PCB (1990). The wearable device (1900) may include a flexible PCB (FPCB) for interconnecting the hardwares.

[0247] According to one embodiment, a wearable device (1900) may include at least one of a gyro sensor, a gravity sensor, and / or an acceleration sensor for detecting a posture of the wearable device (1900) and / or a posture of a body part (e.g., a head) of a user wearing the wearable device (1900). Each of the gravity sensor and the acceleration sensor may measure gravitational acceleration and / or acceleration based on mutually perpendicular designated three-dimensional axes (e.g., an x-axis, a y-axis, and a z-axis). The gyro sensor may measure an angular velocity of each of the designated three-dimensional axes (e.g., an x-axis, a y-axis, and a z-axis). At least one of the gravity sensor, the acceleration sensor, and the gyro sensor may be referred to as an inertial measurement unit (IMU). In one embodiment, the wearable device (1900) may identify a user's motion and / or gesture performed to execute or terminate a specific function of the wearable device (1900) based on the IMU.

[0248] FIGS. 20A and 20B illustrate an example of an exterior appearance of a wearable device according to one embodiment. The wearable device (2000) of FIGS. 20A and 20B may include at least a portion of the hardware of the wearable device (1900) described with reference to FIGS. 19A and / or 19B . An example of an exterior appearance of a first side (2010) of a housing of the wearable device (2000) according to one embodiment is illustrated in FIG. 20A , and an example of an exterior appearance of a second side (2020) opposite to the first side (2010) may be illustrated in FIG. 20B .

[0249] Referring to FIG. 20A, according to one embodiment, a first surface (2010) of a wearable device (2000) may have a form attachable to a body part of a user (e.g., the face of the user). Although not shown, the wearable device (2000) may further include a strap for fixing to a body part of a user, and / or one or more temples (e.g., the first temple (1904) and / or the second temple (1905) of FIGS. 19A and 19B). A first display (1950-1) for outputting an image to a left eye among the user's two eyes, and a second display (1950-2) for outputting an image to a right eye among the two eyes, may be disposed on the first surface (2010). The wearable device (2000) may be formed on the first surface (2010) and may further include a rubber or silicone packing to prevent interference from light (e.g., ambient light) different from the light emitted from the first display (1950-1) and the second display (1950-2).

[0250] According to one embodiment, a wearable device (2000) may include cameras (1960-1) for photographing and / or tracking both eyes of a user adjacent to each of the first display (1950-1) and the second display (1950-2). The cameras (1960-1) may be referred to as the gaze tracking camera (1960-1) of FIG. 19B. According to one embodiment, a wearable device (2000) may include cameras (1960-5, 1960-6) for photographing and / or recognizing a face of a user. The cameras (1960-5, 1960-6) may be referred to as FT cameras. The wearable device (2000) can control an avatar representing the user in a virtual space based on the motion of the user's face identified using the cameras (1960-5, 1960-6). For example, the wearable device (2000) can change the texture and / or shape of a portion of the avatar (e.g., a portion of the avatar representing a human face) using information obtained by the cameras (1960-5, 1960-6) (e.g., an FT camera) and representing the facial expression of the user wearing the wearable device (2000).

[0251] Referring to FIG. 20b, a camera (e.g., cameras 1960-7, 1960-8, 1960-9, 1960-10, 1960-11, 1960-12)) and / or a sensor (e.g., a depth sensor 2030) may be disposed on a second surface (2020) opposite to the first surface (2010) of FIG. 20a to obtain information related to the external environment of the wearable device (2000). For example, the cameras (1960-7, 1960-8, 1960-9, 1960-10) may be disposed on the second surface (2020) to recognize external objects. The cameras (1960-7, 1960-8, 1960-9, 1960-10) of FIG. 20b can correspond to the motion recognition cameras (1960-2, 1960-3) of FIG. 19b.

[0252] For example, using cameras (1960-11, 1960-12), the wearable device (2000) can acquire images and / or videos to be transmitted to each of the user's eyes. The camera (1960-11) can be positioned on the second face (2020) of the wearable device (2000) to acquire an image to be displayed through the second display (1950-2) corresponding to the right eye among the two eyes. The camera (1960-12) can be positioned on the second face (2020) of the wearable device (2000) to acquire an image to be displayed through the first display (1950-1) corresponding to the left eye among the two eyes. The cameras (1960-11, 1960-12) can correspond to the shooting camera (1960-4) of FIG. 19B.

[0253] According to one embodiment, the wearable device (2000) may include a depth sensor (2030) disposed on a second face (2020) to identify a distance between the wearable device (2000) and an external object. Using the depth sensor (2030), the wearable device (2000) may obtain spatial information (e.g., a depth map) for at least a portion of the FoV of a user wearing the wearable device (2000). Although not shown, a microphone may be disposed on the second face (2020) of the wearable device (2000) to obtain a sound output from an external object. The number of microphones may be one or more, depending on the embodiment.

[0254] Electronic devices according to the various embodiments disclosed in this document may take various forms. Electronic devices may include, for example, portable communication devices (e.g., smartphones), computer devices, portable multimedia devices, portable medical devices, cameras, wearable devices, or home appliances. Electronic devices according to the embodiments of this document are not limited to the aforementioned devices.

[0255] The various embodiments of this document and the terminology used therein are not intended to limit the technical features described in this document to specific embodiments, but should be understood to include various modifications, equivalents, or substitutes of the embodiments. In connection with the description of the drawings, similar reference numerals may be used for similar or related components. The singular form of a noun corresponding to an item may include one or more of the items, unless the context clearly indicates otherwise. In this document, each of the phrases "A or B", "at least one of A and B", "at least one of A or B", "A, B, or C", "at least one of A, B, and C", and "at least one of A, B, or C" can include any one of the items listed together in the corresponding phrase among those phrases, or all possible combinations thereof. Terms such as "first," "second," or "first" or "second" may be used merely to distinguish one component from another, and do not limit the components in any other respect (e.g., importance or order). When a component (e.g., a first component) is referred to as "coupled" or "connected" to another (e.g., a second component), with or without the terms "functionally" or "communicatively," it means that the component can be connected to the other component directly (e.g., wired), wirelessly, or through a third component.

[0256] The term "module" used in various embodiments of this document may include a unit implemented in hardware, software, or firmware, and may be used interchangeably with terms such as logic, logic block, component, or circuit. A module may be an integral component, or a minimum unit or part of such a component that performs one or more functions. For example, according to one embodiment, a module may be implemented in the form of an application-specific integrated circuit (ASIC).

[0257] Various embodiments of the present document may be implemented as software (e.g., a program (1740)) including one or more instructions stored in a storage medium (e.g., an internal memory (1736) or an external memory (1738)) readable by a machine (e.g., an electronic device (1701)). For example, a processor (e.g., a processor (1720)) of the machine (e.g., an electronic device (1701)) may call at least one instruction among the one or more instructions stored from the storage medium and execute it. This enables the machine to operate to perform at least one function according to the at least one called instruction. The one or more instructions may include code generated by a compiler or code executable by an interpreter. The machine-readable storage medium may be provided in the form of a non-transitory storage medium. Here, 'non-transitory' simply means that the storage medium is a tangible device and does not contain signals (e.g., electromagnetic waves), and the term does not distinguish between cases where data is stored semi-permanently or temporarily on the storage medium.

[0258] According to one embodiment, the method according to various embodiments disclosed in this document may be provided as included in a computer program product. The computer program product may be traded as a commodity between a seller and a buyer. The computer program product may be distributed in the form of a machine-readable storage medium (e.g., compact disc read-only memory (CD-ROM)), or may be distributed online (e.g., downloaded or uploaded) via an application store (e.g., Play Store™) or directly between two user devices (e.g., smart phones). In the case of online distribution, at least a portion of the computer program product may be temporarily stored or temporarily generated in a machine-readable storage medium, such as the memory of a manufacturer's server, an application store's server, or an intermediary server.

[0259] According to various embodiments, each component (e.g., a module or a program) of the above-described components may include one or more entities, and some of the entities may be separated and placed in other components. According to various embodiments, one or more components or operations of the aforementioned components may be omitted, or one or more other components or operations may be added. Alternatively or additionally, a plurality of components (e.g., a module or a program) may be integrated into a single component. In such a case, the integrated component may perform one or more functions of each of the plurality of components identically or similarly to those performed by the corresponding component among the plurality of components prior to the integration. According to various embodiments, the operations performed by a module, program, or other component may be executed sequentially, in parallel, iteratively, or heuristically, or one or more of the operations may be executed in a different order, omitted, or one or more other operations may be added.

Claims

1. In the display panel (410), substrate (401); A switching circuit (491) formed on the above substrate (401); A first conductive pad (402) and a second conductive pad (402-3) formed on the substrate and connected to the above switching circuit (491); A first LED (420) (light emitting diode) including a first electrode (421) connected to the first conductive pad (402), a light emitting element (423) disposed on the first electrode (421), and a second electrode (422) disposed on the light emitting element (423); A second LED (420) including a third electrode (421-3) connected to the second conductive pad (402-3), a light-emitting element (423-3) disposed on the third electrode (421-3), and a fourth electrode (423-4) disposed on the light-emitting element (423-3); and Including an insulating member (1310, 1501) placed between the first LED (420) and the second LED (420); The height of the insulating member (1310, 1501) is higher than the height of the first conductive pad (402), and the height of the insulating member (1310, 1501) is lower than the height of the first LED coupled to the first conductive pad (402). Display panel (410).

2. In paragraph 1, Including an additional insulating member (1602) disposed on the insulating member disposed on the substrate. Display panel (410).

3. In paragraph 2, The sum of the height of the insulating member and the height of the additional insulating member is greater than the height of the first LED (420) coupled to the first conductive pad. Display panel (410).

4. In any one of paragraphs 2 to 3, The above insulating member (1310, 1501) and the additional insulating member, Along the side of the first LED (420), surrounding the first LED (420), Display panel (410).

5. In paragraph 4, Further comprising a color conversion material, which is placed within a space surrounded by the insulating member (1310, 1501). Display panel (410).

6. In any one of paragraphs 1 to 5, The colors of light emitted from the first LED (420) and the second LED (420) are the same. Display panel (410).

7. In any one of paragraphs 1 to 6, The above insulating member (1310, 1501) is Having a rough shape and spaced apart from the first LED (420) and the second LED (420), Display panel (410).

8. In any one of paragraphs 1 to 7, The first LED is positioned adjacent to the second LED, Display panel (410).

9. In any one of paragraphs 1 to 8, The second electrode and the fourth electrode include a transparent material that transmits light emitted from the light-emitting element of the first LED and the light-emitting element of the second LED, respectively. Display panel (410).

10. In any one of paragraphs 1 to 9, Further comprising an additional transparent substrate disposed on the second electrode and the fourth electrode and configured to connect each of the second electrode and the fourth electrode to a switching circuit. Display panel (410).

11. In the display panel (410), substrate (401); A switching circuit (491) formed on the above substrate; A conductive pad formed on the substrate and connected to the above switching circuit (491); and An LED (420) including a first electrode (421) connected to the conductive pad (402), a light-emitting element (423) disposed on the first electrode (421), and a second electrode (422) disposed on the light-emitting element (423); The above challenge pad (402) is Contains spaced apart section pads, The above conductive pad (402) is coupled to the first electrode by a conductive material placed between the partial pads. Display panel (410).

12. In paragraph 11, The melting point of the above challenging material is Lower than the melting point of the above-mentioned partial pads of the above-mentioned challenging pad (402), Display panel (410).

13. In paragraph 11 or 12, One of the above partial pads is connected to a wiring that is connected to the switching circuit. Display panel (410).

14. In any one of paragraphs 11 to 13, A transparent conductive layer disposed on the second electrode and configured to electrically connect the switching circuit and the second electrode, Display panel (410).

15. In any one of paragraphs 11 to 14, The second electrode comprises a transparent material to transmit light emitted from the light-emitting element to the outside. Display panel (410).

Images