Deposition system

Abstract

Embodiments disclosed in the present document relate to a deposition system and, more specifically, to a deposition system including an optical module mounting unit. According to an embodiment, the deposition system comprises: a chamber configured to have a deposition source disposed therein; a substrate stage including a substrate holder configured to support a substrate and disposed inside the chamber; a mask holder configured to support a mask and disposed inside the chamber; an optical module disposed inside the chamber and configured to identify the alignment between the substrate and the mask; and an optical module mounting unit configured to move the optical module.

Description

Deposition system

[0001] Embodiments disclosed in this document relate to a deposition system, and more particularly to a deposition system including an optical module holder.

[0002] A deposition system is a system that performs a deposition process, depositing various materials on the surface of a substrate (e.g., a wafer) in the form of a thin film or coating. Deposition processes are widely used in electronics, semiconductors, displays, solar cells, and other industries. Deposition processes are used to improve surface properties, such as corrosion prevention, improved wear resistance, and improved optical properties, or to incorporate functional materials for the electrical properties of semiconductor devices.

[0003] Deposition systems are broadly categorized into physical vapor deposition (PVD) and chemical vapor deposition (CVD). Physical vapor deposition includes sputtering and vapor deposition, while chemical vapor deposition includes LPCVD (low-pressure CVD) and PECVD (plasma-enhanced CVD).

[0004] In this regard, Korean Patent No. 0746579, “Continuous Deposition System,” discloses a deposition system for a glass substrate, but does not disclose an optical module holder.

[0005] Meanwhile, the background technology described above is technical information that the inventor possessed for the purpose of deriving the present invention or acquired during the process of deriving the present invention, and cannot necessarily be said to be publicly known technology disclosed to the general public prior to the application for the present invention.

[0006] The problem the present invention seeks to solve is that conventional deposition systems include an optical module holder to ensure precise alignment between the substrate and the mask. However, existing optical module holders and alignment methods have limitations in terms of accuracy and efficiency, requiring improvement.

[0007] According to embodiments disclosed in this document, it is intended to provide a deposition system including an optical module holder using an optical module by improving a general optical module holder.

[0008] The tasks of the present invention are not limited to the tasks mentioned above, and other tasks not mentioned will be clearly understood by those skilled in the art from the description below.

[0009] According to one embodiment of the present invention for solving the above-described problem, a deposition system may include a chamber in which a deposition source is placed, a substrate holder for supporting a substrate, a substrate stage placed inside the chamber, a mask holder configured to support a mask and placed inside the chamber, an optical module placed inside the chamber for checking alignment of the substrate and the mask, and an optical module holder for supporting and moving the optical module.

[0010] According to one embodiment of the present invention, the optical module holder may include a support structure disposed outside the chamber, a shaft extending from the support structure into the chamber, and an optical module moving device supported by the shaft.

[0011] According to one embodiment of the present invention, the optical module holder may further include a bellows coupled to at least a portion of the shaft to maintain a vacuum atmosphere in the chamber.

[0012] According to one embodiment of the present invention, the chamber may have a recessed portion formed on the side thereof toward the inside of the chamber, and the optical module holder may be positioned inside or outside the recessed portion.

[0013] According to one embodiment of the present invention, the optical module moving device may include a linear driving module connected to a shaft and a moving plate that supports the optical module and is moved by the linear driving module.

[0014] According to one embodiment of the present invention, the optical module holder may include a precision position adjustment module including at least one of a piezoelectric element, a linear module of one or more axes, and a six-axis multi-joint module.

[0015] According to one embodiment of the present invention, the precision position adjustment module can perform additional position adjustment after position adjustment of the optical module by the optical module moving device.

[0016] According to one embodiment of the present invention, the optical module holder may include a precision position adjustment module that controls the position of the optical module along the same axis as the axis along which the optical module moves.

[0017] According to one embodiment of the present invention, the optical modules may be provided in plurality, and the precision position adjustment modules may be provided in plurality corresponding to the number of optical modules.

[0018] According to one embodiment of the present invention, a plurality of optical modules and a plurality of precision position adjustment modules are provided on one moving plate, so that the plurality of optical modules and the plurality of precision position adjustment modules can be moved simultaneously by an optical module moving device.

[0019] According to one embodiment of the present invention, the optical module holder may further include a protective box that at least partially surrounds the optical module and blocks the atmosphere of the chamber.

[0020] According to one embodiment of the present invention, an at least partially transparent area or an open area is formed on one side of the protective box, and the optical module can be arranged such that its optical axis is aligned with the transparent area or the open area.

[0021] According to the embodiments disclosed in this document, a deposition system including an optical module holder using an optical module can be provided by improving a general optical module holder.

[0022] The effects that can be obtained from the present invention are not limited to the effects mentioned above, and other effects not mentioned can be clearly understood by a person having ordinary skill in the art to which the present invention belongs from the description below.

[0023] FIG. 1 is a cross-sectional view schematically illustrating a deposition system according to one embodiment.

[0024] FIG. 2 is a cross-sectional view schematically illustrating a deposition system according to one embodiment.

[0025] FIG. 3 is a cross-sectional view schematically illustrating a deposition system according to one embodiment.

[0026] FIG. 4 is a cross-sectional view illustrating a deposition system according to various embodiments.

[0027] FIG. 5 is a diagram illustrating a deposition system according to one embodiment.

[0028] FIG. 6 is a drawing illustrating various examples of an optical module holder of a deposition system according to one embodiment.

[0029] FIG. 7 is a drawing illustrating various examples of an optical module holder of a deposition system according to one embodiment.

[0030] FIG. 8 is a drawing illustrating various examples of an optical module holder of a deposition system according to one embodiment.

[0031] Figure 9 is a block diagram of a deposition system according to one embodiment.

[0032] FIG. 10 is a diagram illustrating some steps of a method of depositing a substrate using an optical module according to various embodiments.

[0033] Figures 11 and 12 are flowcharts of a deposition method according to one embodiment.

[0034] In connection with the description of the drawings, the same or similar reference numerals may be used for identical or similar components.

[0035] The advantages and features of the present invention, as well as the methods for achieving them, will become clearer with reference to the embodiments described in detail below, along with the accompanying drawings. However, the present invention is not limited to the embodiments disclosed below and may be implemented in various different forms. These embodiments are provided solely to ensure that the disclosure of the present invention is complete and to fully inform those skilled in the art of the scope of the invention. In other words, the present invention is defined solely by the scope of the claims.

[0036] The shapes, sizes, ratios, angles, numbers, etc. disclosed in the drawings for explaining embodiments of the present invention are exemplary, and therefore the present invention is not limited to the matters illustrated. In addition, in describing the present invention, if it is determined that a detailed description of a related known technology may unnecessarily obscure the gist of the present invention, the detailed description thereof will be omitted. When the terms “includes,” “has,” and “consists of” are used in this specification, other parts may be added unless “only” is used. When a component is expressed in the singular, it includes a case where the plural is included unless there is a special explicit description. In addition, when interpreting a component, it is interpreted to include a range of error even if there is no separate explicit description.

[0037] Although terms like "first" and "second" are used to describe various components, these components are not limited by these terms. These terms are used merely to distinguish one component from another. Therefore, a "first" component referred to below may also be a "second" component within the technical scope of the present invention.

[0038] Unless otherwise specified, the same reference numerals refer to the same components throughout the specification.

[0039] The individual features of the various embodiments of the present invention can be partially or wholly combined or combined with each other, and as can be fully understood by those skilled in the art, various technical connections and operations are possible, and each embodiment can be implemented independently of each other or can be implemented together in a related relationship.

[0040] Meanwhile, the tentative effects that can be expected by the technical features of the present invention that are not specifically mentioned in the specification of the present invention are treated as described in the specification, and the present embodiment is provided to more completely explain the present invention to a person having average knowledge in the art, and the contents shown in the drawings may be expressed exaggeratedly compared to the actual implementation of the invention, and a detailed description of a configuration that is judged to unnecessarily obscure the gist of the present invention is omitted or briefly described.

[0041] Hereinafter, the present invention will be described in detail with reference to the attached drawings. However, it should be understood that this is not intended to limit the present invention to specific embodiments, but rather includes various modifications, equivalents, and / or alternatives of the embodiments of the present invention.

[0042] FIG. 1 is a cross-sectional view schematically illustrating a deposition system (100) according to one embodiment, which is a cross-sectional view viewed from the front. FIG. 2 is a cross-sectional view schematically illustrating a deposition system (100) according to one embodiment, which is a cross-sectional view viewed from the top. FIG. 3 is a cross-sectional view schematically illustrating a deposition system (100) according to one embodiment, which is a cross-sectional view viewed from the side.

[0043] A deposition system (100) according to one embodiment may include a chamber (101), a substrate stage (110), a mask holder (130), an optical module (147), and an optical module holder (140).

[0044] In one embodiment, referring to FIGS. 1 to 3, the chamber (101) may provide a space in which a deposition process is performed. A deposition source (S), a substrate (W), a magnet (122), a cooling plate (121), a substrate stage (110), a mask (M), a mask holder (130), an optical module (147), and a portion of an optical module holder (140) may be disposed in the internal space of the chamber (101). Referring to FIG. 1, the internal space of the chamber (101) may be defined as a deposition space (A), which is a space between the substrate (W) or the mask (M) and the deposition source (S), and the remaining space. The deposition space (A) may be defined as a space in which a deposition process is performed. The deposition sources (S) are disposed on the bottom surface of the chamber (101) and may be formed in plurality, as illustrated in FIG. 2. In one embodiment, the chamber (101) may be formed in a hexahedral shape. However, the shape of the chamber (101) is not limited to that shown in the drawing, and may be provided in various shapes (e.g., FIG. 6, FIG. 7).

[0045] In the illustrated embodiment, the deposition surface of the substrate (W) may be arranged to face the mask (M), and may be brought into contact with or brought into proximity with a predetermined distance for deposition. According to an embodiment, the substrate (W) may be arranged between the mask (M) and the magnet (122). The mask (M) may be arranged below the substrate (W). An attractive force may be formed on the mask (M) by the magnet (122). The magnet (122) may provide stable contact between the mask (M) and the substrate (W), but this is only one embodiment, and the substrate (W) and the mask (M) may be joined together through adsorption by an adsorbent, adhesion by an adhesive material, or the like. The cooling plate (121) may be brought into contact with an upper surface of the substrate (W) (e.g., an opposite surface of the deposition surface). The cooling plate (121) may be provided to cool the substrate (W) during a high-temperature deposition process.

[0046] In one embodiment, the substrate stage (110) may include a substrate holder (112) configured to support a substrate (W), and a first driving module (111) configured to move the substrate (W) up and down. The substrate holder (112) may be provided to contact an area of ​​a deposition surface of the substrate (W) where deposition is not performed. For example, the substrate holder (112) may contact an edge of the deposition surface of the substrate (W). In one embodiment, the substrate holder (112) may be moved in an up and down direction (e.g., in the Z-axis direction) by the first driving module (111). For example, the first driving module (111) may cause the substrate holder (112) on which the substrate (W) is mounted to be lowered (e.g., moved in the -Z-axis direction), thereby causing the substrate (W) and the mask (M) to come into contact with each other or to be spaced apart from each other by a predetermined distance. In addition, the first drive module (111) can separate the substrate (W) and the mask (M) by elevating (e.g., moving in the +Z-axis direction) the substrate holder (112) on which the substrate (W) is mounted after the deposition process is completed.

[0047] In one embodiment, the substrate stage (110) can move the substrate (W) on the XY plane. For example, the substrate stage (110) can move the substrate (W) on the XY plane by moving the substrate holder (112) on which the substrate (W) is mounted in the X-axis direction or the Y-axis direction. In one embodiment, the substrate stage (110) can align the substrate (W) and the mask (M) by moving the substrate holder (112).

[0048] In one embodiment, the deposition system (100) may further include a second driving module (e.g., the second driving module (123) of FIG. 9) configured to move the magnet (122) and / or the cooling plate (121) up and down. For example, the second driving module (123) may adjust the size of the attractive force applied to the mask (M) by adjusting the gap between the magnet (122) and the mask (M). That is, the second driving module (123) may stably bring the mask (M) and the substrate (W) into contact with or close to each other. For example, the second driving module (123) may bring the substrate (W) and the cooling plate (121) into contact with or close to each other by lowering the cooling plate (121) (e.g., moving in the -Z-axis direction). In addition, the second driving module (123) can separate the substrate (W) and the cooling plate (121) by elevating the cooling plate (121) (e.g., moving in the +Z-axis direction) after the deposition process is completed.

[0049] Referring to FIGS. 1 to 3, in one embodiment, the optical module holder (140) may include a support structure (141) disposed outside the chamber to support and adjust the position of the optical module (147), a shaft (142) extending from the support structure (141) to the internal space of the chamber (101), and an optical module moving device disposed on the shaft (142) to adjust the position of the optical module (147). According to an embodiment, the optical module moving device may include a linear driving module (144), and a moving plate (145) configured to move by the linear driving module (144), and at this time, the optical module (147) may be disposed on the moving plate (145).

[0050] In an embodiment, the support structure (141) may include a material that is less susceptible to thermal deformation. For example, the support structure (141) may be formed of at least one of granite, cast iron, or cast steel. For example, the support structure (141) may be provided as a granite-based stone slab.

[0051] In one embodiment, the optical module holder (140) may be configured as an optical module driving device, for example, using a linear driving module (144), to move the optical module (147) outside the deposition space (A) before the deposition process starts, and to move the optical module (147) inside the deposition space (A) after the deposition process is completed. For example, the optical module holder (140) may move the optical module (147) inside the deposition space (A) so that the optical axis (OA) of the optical module (147) is aligned with the first marker. Through this, the optical module holder (140) may prevent the optical module (147) from interfering with the deposition.

[0052] Additionally, as described below, the optical module holder (140) may move the optical module (147) to the outside of the deposition space (A) so that the optical axis (OA) of the optical module (147) is aligned with the second marker (107) located outside the deposition space (A).

[0053] In one embodiment, the optical module holder (140) may further include a bellows (143) coupled to at least a portion of the shaft (142) to maintain a vacuum atmosphere in the chamber (101). The bellows (143) may be formed to surround a portion of the shaft (142) that extends inside the chamber (101). Additionally, the bellows (143) may be formed to surround a portion of the shaft (142) that extends outside the chamber (101). The internal space of the chamber (101) may be sealed by the bellows (143), and process conditions within the chamber (101) for a deposition process may be maintained.

[0054] In one embodiment, the optical module holder (140) may further include a protective box (149) for protecting the optical module (147). The protective box (149) is disposed on the moving plate (145) and may at least partially surround the optical module (147). The protective box (149) may block the vacuum atmosphere of the chamber (101) and maintain an internal pressure state equal to or similar to atmospheric pressure, thereby preserving the function of the optical module (147). In addition, the protective box (149) may include an at least partially transparent area or an open area to enable optical interaction between the optical module (147) and optical markers (e.g., the first marker, the second marker (107)). For example, the upper surface of the protective box (149) may be at least partially transparent or open.

[0055] And the optical module holder (140) may include a precision position adjustment module (146) for precisely adjusting the position of the optical module (147). In this case, the precision position adjustment module (146) is provided on the upper side of the moving plate (145), and the optical module (147) is provided on the upper side of the precision position adjustment module (146), so that the optical module (147) and the precision position adjustment module (147) can be moved simultaneously by the movement of the optical module moving device. According to an embodiment, the precision position adjustment module (146) can precisely adjust the position of the optical module (147) according to the recognition of the optical marker of the optical module (147). For example, the precision position adjustment module (146) can control the position of the optical module (147) along the same axis as the axis along which the optical module (147) moves by the optical module moving device. In addition, by recognizing the optical marker in three dimensions, it is possible to precisely adjust not only the position on the XY plane of the optical module (147) but also the position or angle on the Z axis. For example, the precision position adjustment module (146) may be configured as a linear module, a six-axis multi-joint module, or a piezoelectric element including a piezoelectric element that can adjust the position of the optical module (147) in at least one axis. When a plurality of optical modules (147) are provided according to an embodiment, a plurality of precision position adjustment modules (146) may be provided correspondingly.

[0056] In various embodiments, the optical module (147) and the optical module holder (140) may each be provided in one or more configurations. For example, referring to FIG. 2, the optical module (147) may include a first optical module (147a), a second optical module (147b), a third optical module (147c), and a fourth optical module (147d). At this time, two or more optical modules may be arranged in one optical module holder (140). For example, referring to FIG. 2, the first optical module (147a) and the third optical module (147c) may be arranged in the optical module holder (140) on the left side of the drawing, and the second optical module (147b) and the fourth optical module (147d) may be arranged in the optical module holder on the right side. Depending on the embodiment, two or more optical modules may be arranged in the optical module moving device. However, the number and / or arrangement of the optical modules (147) and the optical module holder (140) are not limited to those shown in the drawing.

[0057] In one embodiment, the optical module (147) may be disposed inside the chamber (101) and configured to verify the alignment of the substrate (W) and the mask (M). As described above, the optical module (147) may be moved inside the chamber (101) by the optical module holder (140). For example, the optical module (147) may be disposed on a moving plate (145) of the optical module holder (140) and may be moved by a linear driving module (144) of the optical module holder (140). For example, the optical module (147) may be introduced into or removed from the deposition space (A). In one embodiment, the optical module (147) may have an optical axis (OA) defined therein. The optical axis (OA) may be parallel to the Z-axis direction. In various embodiments, the optical module (147) may be at least partially disposed inside a protective box (149) included in the optical module holder (140).

[0058] In various embodiments (not shown), the optical module (147) may include a light emitting unit configured to emit light, and a light receiving unit configured to receive reflected light reflected from an optical marker (e.g., a first marker (not shown), a second marker (107)).

[0059] In one embodiment, the optical module (147) may be configured to optically interact with a first marker formed on the substrate (W). For example, the optical module (147) may verify the alignment of the substrate (W) and the mask (M) through the first marker formed on the substrate (W) or the mask (M). Hereinafter, an alignment mechanism through the optical module (147) and the first marker will be described.

[0060] In one embodiment, the first marker may be provided as a material that reflects light irradiated from the light emitting unit of the optical module (147). In one embodiment, the first marker may be formed in an edge region of the substrate (W). For example, the first marker may be formed in an edge region excluding an area where the substrate holder (112) comes into contact. In one embodiment, an opening may be formed in the mask (M). At this time, the opening formed in the mask (M) may be formed at a position aligned with the first marker in the optical axis (OA) direction (or Z-axis direction) when the substrate (W) and the mask (M) are completely aligned. For example, the opening of the mask (M) may be formed in an edge region of the mask (M). That is, when the substrate (W) and the mask (M) are completely aligned, the first marker of the substrate (W) may be exposed through the opening of the mask (M). In this way, when the substrate (W) and the mask (M) are completely aligned, the optical module (147) can receive light reflected from the first marker, thereby confirming the alignment status of the substrate (W) and the mask (M).

[0061] FIG. 4 is a plan view illustrating a deposition system (100) according to various embodiments.

[0062] According to the embodiment illustrated in FIG. 4, the deposition system (100) may include a number of optical module holders (140) corresponding to the number of optical modules (147). For example, a first optical module (147a) may be placed in a first optical module holder (140a), a second optical module (147b) may be placed in a second optical module holder (140b), a third optical module (147c) may be placed in a third optical module holder (140c), and a fourth optical module (147d) may be placed in a fourth optical module holder (140d). At this time, the first optical module holder (140a) and the third optical module holder (140c) may be provided to share one support structure (141), and the second optical module holder (140b) and the fourth optical module holder (140d) may be provided to share another support structure (141), and each of the first optical module (147a), the second optical module (147b), the third optical module (147c), and the fourth optical module holder (140d) may be moved by separately separated moving plates (145). However, the optical module holders (140) illustrated in FIGS. 2 and 4 are merely examples, and the number and / or arrangement of the optical module holders (140) are not limited to those illustrated in the drawings.

[0063] FIG. 5 is a drawing illustrating a deposition system (100) according to one embodiment.

[0064] The deposition system (100) illustrated in FIG. 5 can be understood as the deposition system (100) illustrated in FIG. 1 with the addition of a second marker (107) and an operating mechanism of an optical module (147) using the second marker (107). In describing FIG. 5, the contents described in FIGS. 1 to 4 are omitted.

[0065] Referring to FIG. 5, a second marker (107) may be placed inside the chamber (101). The second marker (107), like the first marker, may be provided with a material that reflects light emitted from the light emitting unit of the optical module (147). The second marker (107) may be utilized as a guide for the position of the optical module (147). For example, the second marker (107) may be utilized to determine the position of the optical module (147) before starting the deposition process after confirming the alignment of the substrate (W) and the mask (M).

[0066] In one embodiment, the second marker (107) may be positioned in an external space of the deposition space (A) within the internal space of the chamber (101). Referring to FIG. 5, the second marker (107) is illustrated as being positioned adjacent to the substrate stage (110), but is not necessarily limited thereto and may be positioned in various locations.

[0067] In one embodiment, the optical module holder (140) can move the optical module (147) out of the deposition space (A) using the linear drive module (144) so ​​that the optical axis (OA) of the optical module (147) is aligned with the second marker (107) before the deposition process starts after the alignment of the substrate (W) and the mask (M) is confirmed. In various embodiments, the optical module holder (140) can detect and store the movement distance of the optical module (147).

[0068] In various embodiments, the optical module holder (140) can move the optical module (147) by the stored movement distance after the deposition process is completed. Through this, the optical module (147) can be moved to a designated position within the deposition space (A) even after the deposition process is completed. For example, the first marker formed on the substrate (W) may lose its function due to being covered by the deposition material or deformed by high temperature during the deposition process. The illustrated deposition system (100) can position the optical module (147) at a desired position after the deposition process is completed by defining the absolute position through the second marker (107) and the movement distance of the optical module (147), and can prepare for an additional deposition process for another substrate.

[0069] FIG. 6 is a drawing illustrating various examples of an optical module holder (140) of a deposition system (100) according to one embodiment. FIG. 7 is a drawing illustrating various examples of an optical module holder (140) of a deposition system (100) according to one embodiment. FIG. 8 is a drawing illustrating various examples of an optical module holder (140) of a deposition system (100) according to one embodiment.

[0070] Referring to FIGS. 6 to 8, the deposition system (100) may include various types of chambers (101) and optical module holders (140). In describing FIGS. 6 to 8, the same content as in FIGS. 1 to 5 is omitted.

[0071] Referring to FIG. 6, a recessed portion (103) is formed on the side of the chamber (101) toward the internal space, and at least a portion of the support structure (141) of the optical module holder (140) can be fixed to the inside and outside of the recessed portion (103). At this time, the shaft (142) of the optical module holder (140) can extend from the upper surface of the support structure (141) into the internal space of the chamber (101).

[0072] Referring to FIG. 7, a recessed portion (103) is formed on the side of the chamber (101) toward the internal space, and at least a portion of the support structure (141) of the optical module holder (140) may be placed inside the recessed portion (103). At this time, the shaft (142) of the optical module holder (140) may extend from the lower surface (141b) of the support structure (141) to the internal space of the chamber (101). The deposition system (100) illustrated in FIG. 7 may be configured so that the optical module (147) moves to the lower space of the recessed portion (103). This structure may be advantageous for protecting the optical module (147). In addition, in this case, the second marker (107) may be placed in the lower space of the recessed portion (103).

[0073] Referring to FIG. 8, the optical module moving device may be placed on the side of the support structure (141). At this time, the shaft (142) may be formed to extend to the side of the support structure (141) to support the optical module moving device. That is, in the optical module holder (140), the direction in which other components other than the support structure (141) are placed with respect to the support structure (141) is not limited to a specific direction, and may be placed and supported in an appropriate direction according to an embodiment.

[0074] Figure 9 is a block diagram of a deposition system (100) according to one embodiment.

[0075] In one embodiment, the deposition system (100) may further include a control module (900). The control module (900) may be configured to control an optical module (147), a linear drive module (144) included in an optical module moving device (150), a precision position adjustment module (146), a first drive module (111) for moving a substrate (W) up and down, a second drive module (123) for moving a magnet (122) or a cooling plate (121) up and down, and a substrate stage (110) for moving the substrate (W) on an XY plane.

[0076] In one embodiment, the control module (900) can use the optical module (147) to determine whether the substrate (W) and the mask (M) are aligned, and can use the substrate stage (110) to align the mask (M) and the substrate (W). For example, the control module (900) can control the light emitting unit of the optical module (147) to irradiate light toward the substrate (W). In addition, the control module (900) can determine whether the mask (M) and the substrate (W) are aligned based on whether the receiving unit of the optical module (147) has received light reflected from the first marker and the intensity of the reflected light. For example, if the optical module (147) receives reflected light having an intensity greater than a specified intensity, the control module (900) can determine that the substrate (W) and the mask (M) are completely aligned.

[0077] If the optical module (147) does not receive reflected light or the received reflected light does not reach a specified intensity, the control module (900) determines that the substrate (W) and the mask (M) are not aligned and can adjust the position of the substrate (W) using the substrate stage (110). That is, the substrate stage (110) can adjust the position of the substrate (W) based on the alignment state of the substrate (W) and the mask (M) confirmed by the optical module (147).

[0078] In one embodiment, the control module (900) can control the first drive module (111) so that the substrate (W) descends toward the mask (M) and the deposition surface of the substrate (W) contacts or approaches the mask (M) when the mask (M) and the substrate (W) are completely aligned. In various embodiments, after the substrate (W) and the mask (M) come into contact, the control module (900) can re-check the alignment state of the substrate (W) and the mask (M) using the optical module (147).

[0079] In one embodiment, the control module (900) can lower the cooling plate (121) using the second driving module (123) when the substrate (W) and the mask (M) are completely aligned and in contact or come within a predetermined distance. At this time, the control module (900) can control the second driving module (123) so that the cooling plate (121) comes into contact with the upper surface of the substrate (W). In addition, the control module (900) can adjust the gap between the magnet (122) and the mask (M) to adjust the attractive force applied to the mask (M) by the magnet (122). Through this, the degree of adhesion between the substrate (W) and the mask (M) can be improved. At this time, the gap between the mask (M) and the magnet (122) can vary depending on the physical properties (e.g., thickness) of the mask (M).

[0080] In one embodiment, the control module (900) may control the linear drive module (144) of the optical module moving device (150) to move the optical module (147) outside the deposition space (A) before the start of the deposition process after the control of the cooling plate (121) and the magnet (122) is completed. At this time, the control module (900) may control the linear drive module (144) to move the optical module (147) to a position aligned with the second marker (107). For example, the control module (900) may control the linear drive module (144) to move the optical module (147) until the light reflected by the second marker (107) is received with sufficient intensity by the receiving unit of the optical module (147). In one embodiment, the control module (900) may store the movement distance of the optical module (147).

[0081] In one embodiment, the control module (900) may cause the optical module (147) to re-enter the deposition space (A) after the deposition process is completed. For example, the control module (900) may control the linear control module (900) so that the optical module (147) is placed at a position aligned with the first marker. At this time, the first marker may be a marker formed on the substrate (W) on which deposition is completed, or a marker formed on another substrate on which deposition is not performed. For another example, the control module (900) may move the optical module (147) based on a previously stored movement distance of the optical module (147). For another example, the control module (900) may store the position of the optical module (147) when the substrate (W) and the mask (M) are completely aligned before the deposition revolution, and may move the optical module (147) to the stored position after the deposition process is completed.

[0082] In various embodiments, the control module (900) may control a robot arm (102) configured to input a substrate (W) into the chamber (101) or to take out a substrate (W) on which deposition is completed from the chamber (101). For example, the control module (900) may use the robot arm (102) to take out the substrate (W) on which deposition is completed after the deposition process is completed and place a new substrate (W) on the substrate holder (112). At this time, taking out the substrate (W) on which deposition is completed may be performed before moving the optical module (147) into the deposition space (A), after moving it into the deposition space (A), or simultaneously.

[0083] The control module (900) described in FIG. 9 is not necessarily limited to one integrated controller, and may include at least some of the sub-controllers included in each configuration (e.g., optical module (147), optical module moving device (150), first driving module (111), second driving module (123), robot arm (102), substrate stage (110)).

[0084] FIG. 10 is a diagram illustrating a portion of a method for depositing a substrate using an optical module according to various embodiments. In addition, FIGS. 11 and 12 are flowcharts of a method for depositing a substrate using an optical module according to various embodiments.

[0085] According to an embodiment, the substrate deposition method of FIGS. 11 and 12 can be performed through the deposition system (100) illustrated in FIGS. 1 to 9.

[0086] Referring to FIG. 11, the deposition system (100) can receive a substrate from a transfer robot (S1101) and align the received substrate (W) on a substrate stage (S1102).

[0087] According to an embodiment, the deposition system (100) may transfer the substrate (W) into the chamber (101) using a robot arm (102) and place the substrate (W) on a substrate holder (112). At this time, the substrate holder (112) may support an area (e.g., an edge area) of the substrate (W) where deposition does not occur. In addition, a first marker may be formed on the substrate (W), and an opening may be formed on the mask (M). The first marker of the substrate (W) and the opening of the mask (M) may be aligned with each other in the direction of the optical axis (OA) of the optical module (147) in a state where the substrate (W) and the mask (M) are completely aligned.

[0088] Additionally, the deposition system (100) can confirm the alignment of the substrate (W) and the mask (M) using the optical module (147) (S1103). For example, the alignment of the substrate (W) and the mask (M) can be confirmed based on the first marker formed on the substrate (W).

[0089] For example, referring to FIG. 10(a), the deposition system (100) may include a step of determining whether the reflected light reflected from the first marker formed on the substrate (W) is received by the receiving unit of the optical module (147). That is, when the substrate (W) and the mask (M) are completely aligned, the first marker may be exposed downward through the opening and reflect the light irradiated from the optical module (147). Through this, the deposition system (100) may determine whether the first marker formed on the substrate (W) and the opening formed on the mask (M) are aligned with the optical axis (OA) of the optical module (147).

[0090] In one embodiment, referring to (a) of FIG. 10, the receiving unit of the optical module (147) can check the alignment status of the mask (M) and the substrate (W) based on whether the reflected light reflected from the first marker is received and the intensity of the received light. For example, if the receiving unit does not receive the reflected light or receives it with an intensity lower than a specified intensity, it can be determined that the substrate (W) and the mask (M) are not completely aligned. At this time, if it is determined that the substrate (W) and the mask (M) are not aligned (S1104), the deposition system (100) can re-perform the step (S1102) of aligning the substrate (W) using the substrate stage.

[0091] And when the substrate (W) and the mask (M) are aligned (S1104), the deposition system (100) can perform a contact step of bringing the substrate (W) and the mask (M) into contact or proximity (S1105). Referring to (b) of FIG. 10, the lowering of the substrate (W) can be performed through the first driving module (111), and in various embodiments, the substrate (W) and the mask (M) can be brought into contact or proximity through at least one of an operation of raising and lowering the mask (M) and an operation of lowering the substrate (W).

[0092] According to an embodiment, the deposition system (100) can additionally check the alignment of the substrate (W) and the mask (M) in case the alignment of the mask (M) and the substrate (W) is misaligned during the process of the substrate (W) and the mask (M) coming into contact or proximity.

[0093] In various embodiments, the deposition system (100) may further include a step of contacting a cooling plate (121) to a substrate (W) and a step of adjusting a gap between a magnet (122) and a mask (M).

[0094] In various embodiments, the driving of the cooling plate (121) and the magnet (122) can be performed through the second driving module (123). In various embodiments, the deposition system (100) can adjust the size of the force applied to the mask (M) by adjusting the gap between the magnet (122) and the mask (M), and provide stable contact or proximity between the substrate (W) and the mask (M).

[0095] According to an embodiment, the deposition system (100) can obtain first relative position information through the optical module (147) (S1106).

[0096] Here, the first relative position information refers to information about the relative position of the optical module (147) based on the first marker formed on the substrate (W), and is information about the position to which the optical module (147) returns after avoidance. The first relative position information may include an image of the first marker, depending on the embodiment.

[0097] Next, the deposition system (100) can perform an avoidance step of moving the optical module (147) outside the deposition space (A) defined inside the chamber (S1107).

[0098] According to an embodiment, the deposition system (100) may include a step of moving an optical module (147) to a designated position outside the deposition space (A) using an optical module moving device including a linear drive module (144). Referring to (c) of FIG. 10, the optical module moving device may be driven in a direction perpendicular to the optical axis (OA) of the optical module (147).

[0099] At this time, the external designated location can be preset. For example, the optical module (147) can be preset to move a predetermined distance outside the deposition space (A).

[0100] According to another embodiment, the designated position may be a position where the optical module (147) is aligned with a second marker (107) located outside the deposition space (A). In other words, in the avoidance step (S1107), the deposition system (100) moves the optical module (147) to a position where the optical axis (OA) is aligned with the second marker (107), and can precisely adjust the position of the optical module (147) based on the second marker (107). Through this, it is possible to minimize variations in the position where the optical module (147) is placed to check the alignment of the substrate (W).

[0101] Additionally, the deposition system (100) can store the distance that the optical module (147) has moved. That is, the deposition system (100) can store the distance that the optical module (147) has moved to a designated location outside the deposition space (A) based on the second marker (107).

[0102] After the avoidance step (S1107), the deposition system (100) performs a deposition process on the substrate (W) (S1108), and when the deposition process is completed, it can perform an input step of moving the optical module (147) to a designated position inside the deposition space (A) (S1109).

[0103] At this time, the deposition system (100) can move the optical module (147) to a designated position inside the deposition space (A) using an optical module moving device.

[0104] In this regard, according to an embodiment, the deposition system (100) can preset a designated location within the deposition space (A) to which the optical module (147) will return. For example, the deposition system (100) can return the optical module (147) to the designated location within by moving it by a preset distance.

[0105] As another embodiment, the deposition system (100) can return the optical module (147) to a designated position inside by moving the optical module (147) by a distance corresponding to the movement distance of the optical module (147) saved in the avoidance step (S1107), for example, the distance the optical module (147) moves to align with the second marker (107).

[0106] And the deposition system (100) analyzes the error in the position of the optical module (147) based on the first relative position information, and according to the analysis result, readjusts the position of the optical module (147) or ends the deposition process for the substrate (W) and recovers the substrate (W) (S1110).

[0107] In this regard, referring to FIG. 12, when analyzing the error in the position of the optical module (147) (S1110), the deposition system (100) can obtain second relative position information for the first marker through the optical module (147) (S1201). In addition, the deposition system (100) can analyze the error in the position of the optical module (147) based on the first relative position information and the second relative position information (S1202).

[0108] According to an embodiment, the second relative position information may include an image of the first marker acquired through the optical module (147). At this time, the deposition system (100) may compare the image of the first marker included in the first relative position information and the image of the first marker included in the second relative position information, and may analyze an error in the position of the optical module (147) by, for example, comparing and analyzing at least one of the relative position, size, and symmetry state of the first marker in the image.

[0109] And the deposition system (100) determines whether the analyzed error is greater than a preset threshold (S1203), and if the error is greater than the threshold, the deposition system (100) can readjust the position of the optical module (147).

[0110] For example, it is determined whether the error is greater than a set threshold and greater than a preset standard (S1204), and if it is less than the standard, the deposition system (100) can readjust the position of the optical module (147) using a precision position adjustment module (S1205).

[0111] In this regard, according to an embodiment, the deposition system (100) may adjust the position of the optical module (147) to compensate for an error in the position of the optical module (147) derived by comparing and analyzing at least one of the relative position, size, and symmetry state of the first marker in the image of the first marker included in each of the first relative position information and the second relative position information. For example, the deposition system (100) may readjust the position of the optical module (147) in the XY axis direction or readjust the position of the optical module (147) in the Z axis direction, and may adjust the angle of the optical module (147) with respect to the XY plane.

[0112] In addition, if the error is greater than the set threshold and is greater than the reference value, the position of the optical module (147) can be readjusted using the optical module moving device (S1206). That is, the deposition system (100) according to the embodiment can readjust the position of the optical module (147) by selectively using either the precision position adjustment module or the optical module moving device depending on whether the error is greater than the reference value.

[0113] And after readjusting the position of the optical module (147), the deposition system (100) can return to the step (S1201) of obtaining second relative position information for the first marker through the optical module (147) and repeat the step (S1202) of analyzing the error in the position of the optical module (147). At this time, the deposition system (100) can readjust the position of the optical module (147) or retrieve the substrate (W) according to the error analysis result (S1207). The deposition system (100) can repeat the step of adjusting the position of the optical module (147) until the error in the position of the optical module (147) is analyzed to be less than a threshold value. If the error is analyzed to be less than a threshold value (S1203), the deposition system (100) can end the deposition process for the corresponding substrate (W) and retrieve the substrate (W) (S1207). Thereafter, the deposition system (100) can receive the next substrate (W) from the transfer robot and perform a deposition process. While the deposition system (100) continuously performs the deposition process for a plurality of substrates (W), the position of the optical module (147) for aligning the substrates (W) can be maintained without change.

[0114] The various embodiments of this document and the terminology used herein are not intended to limit the technology described in this document to a specific embodiment, but should be understood to include various modifications, equivalents, and / or substitutes of the embodiments. In connection with the description of the drawings, similar reference numerals may be used for similar components. The singular expressions may include plural expressions unless the context clearly indicates otherwise. In this document, expressions such as "A or B," "at least one of A and / or B," "A, B, or C," or "at least one of A, B, and / or C" may include all possible combinations of the items listed together. Expressions such as "first," "second," "first," or "second," may modify the corresponding components regardless of order or importance, and are only used to distinguish one component from another, but do not limit the corresponding components. When it is said that a component (e.g., a first component) is “(functionally or communicatively) connected” or “connected” to another component (e.g., a second component), the component may be directly connected to the other component, or may be connected via another component (e.g., a third component).

[0115] In this document, "adapted to or configured to" may be used interchangeably with, for example, "suitable for," "capable of," "modified to," "made to," "capable of," or "designed to," for example, hardware-wise or software-wise. In some contexts, the phrase "a device configured to" may mean that the device is "capable of" doing something together with other devices or components. For example, the phrase "a processor configured (or adapted) to perform A, B, and C" may mean a dedicated processor (e.g., an embedded processor) for performing those operations, or a general-purpose processor (e.g., a CPU or AP) that can perform those operations by executing one or more programs stored in a memory device (e.g., a memory).

[0116] The term "module" as used in this document includes a unit composed of hardware, software, or firmware, and may be used interchangeably with terms such as logic, logic block, component, or circuit. A "module" may be an integral component or a minimum unit or part thereof that performs one or more functions. A "module" may be implemented mechanically or electronically, and may include, for example, an application-specific integrated circuit (ASIC) chip, field-programmable gate array (FPGA), or programmable logic device, known or to be developed in the future, that performs certain operations.

[0117] At least a part of a device (e.g., modules or functions thereof) or a method (e.g., operations) according to various embodiments may be implemented as instructions stored in a computer-readable storage medium (e.g., memory) in the form of a program module. When the instructions are executed by a processor (e.g., a processor), the processor may perform a function corresponding to the instructions. The computer-readable recording medium may include a hard disk, a floppy disk, a magnetic medium (e.g., a magnetic tape), an optical recording medium (e.g., a CD-ROM, a DVD, a magneto-optical medium (e.g., a floptical disk), an internal memory, etc. The instructions may include code generated by a compiler or code executable by an interpreter.

[0118] Each component (e.g., a module or a program module) according to various embodiments may be composed of one or more entities, and some of the aforementioned sub-components may be omitted, or other sub-components may be further included. Alternatively or additionally, some components (e.g., a module or a program module) may be integrated into a single entity, which may perform the same or similar functions as those performed by each of the respective components prior to integration. Operations performed by a module, program module, or other component according to various embodiments may be executed sequentially, in parallel, iteratively, or heuristically, or at least some operations may be executed in a different order, omitted, or other operations may be added.

[0119] Although the embodiments of the present invention have been described in more detail with reference to the attached drawings, the present invention is not necessarily limited to these embodiments, and various modifications may be implemented without departing from the technical spirit of the present invention. Therefore, the embodiments disclosed in the present invention are not intended to limit the technical spirit of the present invention, but to explain it, and the scope of the technical spirit of the present invention is not limited by these embodiments. Therefore, it should be understood that the embodiments described above are illustrative in all aspects and not restrictive. The protection scope of the present invention should be interpreted by the following claims, and all technical ideas within a scope equivalent thereto should be interpreted as being included in the scope of the rights of the present invention.

Claims

1. A chamber in which a deposition source is placed; A substrate stage including a substrate holder supporting a substrate and disposed inside the chamber; A mask holder configured to support a mask and disposed inside the chamber; An optical module disposed inside the chamber and checking the alignment of the substrate and the mask; and A deposition system comprising an optical module holder that supports and moves the optical module.

2. In claim 1, The above optical module holder, A deposition system comprising a support structure disposed outside the chamber, a shaft extending from the support structure into the chamber, and an optical module moving device supported by the shaft.

3. In claim 2, The above optical module holder, A deposition system further comprising a bellows coupled to at least a portion of the shaft to maintain a vacuum atmosphere in the chamber.

4. In claim 2, A deposition system, wherein the chamber has a recessed portion formed on the side thereof toward the inside of the chamber, and the optical module holder is positioned inside and outside of the recessed portion.

5. In claim 2, The above optical module moving device, A deposition system comprising a linear drive module connected to the shaft and a moving plate that supports the optical module and is moved by the linear drive module.

6. In claim 2, The above optical module holder, A precision positioning module comprising a piezoelectric element, a linear module of one or more axes, and at least one of a six-axis multi-joint module, The above precision positioning module, A deposition system that performs additional position adjustment after position adjustment of the optical module by the optical module moving device.

7. In claim 2, The above optical module holder, A deposition system comprising a precision position adjustment module that controls the position of the optical module along the same axis as the axis along which the optical module moves.

8. In claim 7, The above optical modules are provided in multiples, A deposition system, wherein the above precision position adjustment module is provided in multiple numbers corresponding to the number of the above optical modules.

9. In claim 8, A deposition system in which a plurality of the optical modules and a plurality of the precision position adjustment modules are provided on a single moving plate, and the plurality of the optical modules and the plurality of the precision position adjustment modules are moved simultaneously by the optical module moving device.

10. In claim 2, The above optical module holder, A deposition system further comprising a protective box at least partially surrounding the optical module and blocking the atmosphere of the chamber.

11. In claim 10, On one side of the above protective box, an at least partially transparent area or an open area is formed, A deposition system wherein the optical module is positioned such that the optical axis is aligned with the transparent area or the open area.

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