Resistance trimming process for precision alloy resistor

Abstract

A resistance trimming process for a precision alloy resistor, the process comprising the following steps: obtaining a composite plate, wherein the composite plate has a panel A and a panel B arranged opposite each other; providing several first trenches in an X-axis direction of the panel A; filling the several first trenches with an insulating medium, and solidifying the insulating medium; providing several second trenches in an X-axis direction of the panel B, so that a plurality of rows of resistor strips spaced apart from each other are obtained; providing several third trenches in a Y-axis direction of the panel A, or providing several third trenches in a Y-axis direction of the panel B, or providing several third trenches in each of the Y-axis direction of the panel A and the Y-axis direction of the panel B, so that several resistor units are formed on each row of resistor strips; performing a resistance value test on the resistor units; filling the several third trenches with the insulating medium, and solidifying the insulating medium; and cutting the composite plate in the X-axis direction and the Y-axis direction to separate each resistor unit therefrom.

Description

A precision alloy resistor adjustment process Technical Field

[0001] The present invention relates to the technical field of precision alloy resistors, and in particular to a resistance adjustment process for precision alloy resistors. Background Art

[0002] Precision alloy resistors, also known as sampling resistors, shunts, etc., are mainly used to measure and monitor the current or voltage of the circuit in the feedback circuit to ensure safe and stable circuit operation. They are mainly used in white goods, new energy, automotive electronics, industrial control, energy storage, electricity and other fields that require monitoring, measurement, and early warning of circuit safety and stability. Technical issues

[0003] At present, there are several types of precision alloy resistor processing:

[0004] 1. Using vacuum electron beam welding technology, the copper leads and the resistor alloy strip are welded together, and then punched out to produce single pellets (as shown in Figure 1). This alloy resistor consists of a resistor body 11 and copper electrodes 12 welded to both ends of the resistor body 11, forming a weld 13 between the copper electrodes 12 and the resistor body 11. However, this process can only be used for products with package sizes greater than or equal to 1206, and is not suitable for products with package sizes of 0805 and below, thus limiting its application in the small package area. In addition, due to the need to consider the impact of punching process edges, material utilization is very low. The process generally involves welding the alloy strip to the copper strip, punching out the single pellets, resistance value sorting, resistance adjustment, surface treatment, and packaging.

[0005] 2. Resistor paste is coated / printed on a ceramic substrate, followed by surface encapsulation with insulating adhesive or ink. Electroplating is then used to form conductive leads on both sides. The ceramic is then cut to form individual resistors (as shown in Figure 2). This alloy resistor comprises a ceramic substrate 21 and a resistor body 22. An insulating adhesive layer 23 is formed between the resistor body 22 and the ceramic substrate 21. A protective solder mask 24 is applied to the other surface of the resistor body 22. This process can expand the package size of precision resistors to 0201 or even 01005. It also allows for simultaneous processing of multiple rows of products, reducing process overhead and achieving high material utilization. However, this process is suitable for processing ohms or higher resistance values, products with low power requirements, and products that cannot withstand high current surges. It is difficult to achieve milliohm-level resistance. The general process route involves ceramic processing, surface treatment, paste coating / printing, surface insulation coating, lead plating, cutting into individual resistors, resistance testing, and packaging.

[0006] 3. Another processing method, which has been developed in recent years, combines copper leads and resistor alloys through a rolling composite process to form a copper / resistor alloy or copper / resistor alloy / copper composite plate. The copper on one or both sides is then removed mechanically, chemically, or electrochemically. The gaps are then filled with insulating glue or ink. Single-particle molding is achieved using mechanical methods such as stamping, CNC, and laser cutting. The leads on both sides are then electroplated with nickel or electroplated. Finally, resistance testing and packaging are performed (as shown in Figure 3). This alloy resistor includes a resistor body 31 and copper electrodes 32 located at each end of the resistor body 31. Due to the good contact and conductivity between the upper and lower copper and the resistor alloy, the resistance adjustment of multiple rows of products interferes with each other. Therefore, single-row processing, single-particle adjustment, or no adjustment has been used. This results in low product yield, low material utilization, and high cost. The process route is: copper / resistance alloy or copper / resistance alloy / copper composite forming, copper removal, gap filling with insulating medium, single particle processing, electroplating pins, resistance testing, and packaging.

[0007] The main technical problem in the processing of the above-mentioned precision alloy resistors is that the closed size is limited. Technical Solutions

[0008] The object of the present invention is achieved through the following technical solutions:

[0009] A precision alloy resistor trimming process includes the following steps:

[0010] Obtaining a composite panel having two panels A and B disposed back to back;

[0011] A plurality of first grooves spaced apart from each other are provided along the X-axis direction of panel A;

[0012] filling the plurality of first grooves with an insulating medium and solidifying the insulating medium;

[0013] A plurality of second grooves corresponding to the plurality of first grooves are formed along the X-axis of panel B, wherein the depth of each second groove reaches the insulating medium of the corresponding first groove, thereby obtaining a plurality of rows of resistor strips spaced apart from each other;

[0014] A plurality of third grooves arranged at intervals from each other are provided along the Y-axis direction of panel A, or a plurality of third grooves arranged at intervals from each other are provided along the Y-axis direction of panel B, or a plurality of third grooves arranged at intervals from each other are provided along the Y-axis direction of panel A and along the Y-axis direction of panel B, so that a plurality of resistor units are formed on each row of the resistor strips;

[0015] Performing a resistance test on the resistor unit;

[0016] filling the plurality of third grooves with an insulating medium and solidifying the insulating medium;

[0017] The composite plate is cut along the X-axis direction and the Y-axis direction to separate each resistor monomer therefrom.

[0018] In one embodiment, an insulating medium is filled into the plurality of second trenches and solidified.

[0019] In one embodiment, the side surfaces of the resistor unit are coated with an electroplating layer.

[0020] In one embodiment,

[0021] The composite plate comprises a resistance alloy layer and a copper layer bonded to each other, wherein the surface of the resistance alloy layer is panel A, and the surface of the copper layer is panel B;

[0022] A plurality of third grooves spaced apart from each other are formed along the Y-axis direction of the surface of the copper layer.

[0023] In one embodiment, an insulating medium is coated on the surface of the resistance alloy layer.

[0024] In one embodiment,

[0025] The composite plate comprises a resistance alloy layer and a copper layer bonded to each other, wherein the surface of the copper layer is panel A, and the surface of the resistance alloy layer is panel B;

[0026] A plurality of third grooves spaced apart from each other are formed along the Y-axis direction of the surface of the copper layer.

[0027] In one embodiment, an insulating medium is coated on the surface of the resistance alloy layer.

[0028] In one embodiment,

[0029] The composite plate comprises a first copper layer, a resistance alloy layer, and a second copper layer laminated in sequence, wherein the surface of the first copper layer is panel A, and the surface of the second copper layer is panel B;

[0030] A plurality of third grooves spaced apart from each other are provided along the Y-axis direction of the surface of the first copper layer, and a plurality of third grooves spaced apart from each other are provided along the Y-axis direction of the surface of the second copper layer. Beneficial effects

[0031] The present invention uses a rolled composite copper / resistance alloy or copper / resistance alloy / copper composite process to process a composite plate strip. Then, through machining (CNC, numerically controlled machine tools, milling machines, and other machining equipment) or etching, grooves (a first groove, a second groove, and a third groove) are designed on the front and back sides of the composite plate. A multi-row structural layout is implemented for the product, and a common process edge design is achieved for the entire plate surface, thereby improving material utilization. Then, an insulating medium is filled in the first groove (the second groove can be freely filled with the insulating medium) to achieve a disconnected layout of the multiple rows of resistors. The resistance value of the multiple rows of non-conductive resistors on the entire plate is tested piece by piece or row by row using a resistance trimmer. According to the resistance value requirements, the thickness of the resistor alloy is removed by mechanical milling or laser stripping to adjust the resistance value from small to large, thereby improving the resistance qualification rate of the product. Then, an insulating medium is coated on the surface of the resistor alloy. Then, single-particle molding is achieved through machining or laser cutting. Then, the single product is subjected to copper plating, nickel plating, tin plating, and other processes. Finally, the resistance value is tested and the product is packaged.

[0032] This process enables customized design and processing of different packages (0201 / 0603 / 0805…) without being restricted by resistor package size. It achieves high power (taking 0805 as an example, it can reach 1.5W, and 0402 can reach 1W), low temperature drift (controllable within ±50PPM / ℃, or even within ±10PPM / ℃), and excellent surge resistance. Furthermore, it can ensure high power, pulse resistance, and low temperature drift while improving product utilization and yield. BRIEF DESCRIPTION OF THE DRAWINGS

[0033] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the following briefly introduces the drawings required for use in the embodiments. It should be understood that the following drawings only illustrate certain embodiments of the present invention and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other relevant drawings can be obtained based on these drawings without paying any creative work.

[0034] FIG1 is a schematic structural diagram of an alloy resistor according to a first embodiment of the prior art;

[0035] FIG2 is a schematic structural diagram of an alloy resistor according to a second embodiment of the prior art;

[0036] FIG3 is a schematic structural diagram of an alloy resistor according to a third embodiment of the prior art;

[0037] FIG4 is a schematic structural diagram of a composite coil according to a first embodiment of the present invention;

[0038] FIG5 is a schematic structural diagram of a composite coil according to a second embodiment of the present invention;

[0039] FIG6 is a three-dimensional structural diagram of a composite board of the present invention;

[0040] FIG7 is a schematic diagram of a first groove formed on panel A of the composite panel shown in FIG6 ;

[0041] FIG8 is a cross-sectional view taken along the AA direction in FIG7;

[0042] FIG9 is a schematic diagram of filling a plurality of first trenches with an insulating medium based on FIG8 ;

[0043] FIG10 is a schematic diagram of a second groove formed on panel B of the composite panel shown in FIG6 ;

[0044] FIG11 is a schematic diagram of filling a plurality of second trenches with an insulating medium based on FIG10 ;

[0045] FIG12 is a schematic diagram of preparing to open a third groove on the composite plate;

[0046] FIG13 is a schematic diagram showing a third groove formed on the composite plate;

[0047] FIG14 is a cross-sectional view taken along line BB of FIG13;

[0048] FIG15 is a schematic diagram of forming a third groove on a composite plate to obtain a plurality of resistor units;

[0049] FIG16 is a schematic diagram of filling a plurality of third trenches with an insulating medium based on FIG14 ;

[0050] FIG17 is a schematic diagram of a single resistor unit obtained by cutting the composite plate along the X-axis and the Y-axis;

[0051] FIG18 is a schematic diagram of the resistor monomer after electroplating based on FIG17;

[0052] FIG19 is a flow chart showing the steps of the precision alloy resistor trimming process of the present invention. Modes for Carrying Out the Invention

[0053] To facilitate understanding of the present invention, the present invention will be described more fully below with reference to the accompanying drawings. The accompanying drawings illustrate preferred embodiments of the present invention. However, the present invention may be implemented in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided to provide a more thorough and comprehensive understanding of the present disclosure.

[0054] It should be noted that when an element is referred to as being "fixed to" another element, it may be directly attached to the other element or there may be an intermediate element. When an element is referred to as being "connected to" another element, it may be directly connected to the other element or there may be an intermediate element. The terms "vertical," "horizontal," "left," "right," and similar expressions used herein are for illustrative purposes only and do not represent the only implementation methods.

[0055] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by those skilled in the art to which this invention pertains. The terms used in this specification of the present invention are for the purpose of describing specific embodiments only and are not intended to limit the present invention. The term "and / or" as used herein includes any and all combinations of one or more of the associated listed items.

[0056] The present invention discloses a precision alloy resistor trimming process (please also refer to FIG. 19 ), comprising the following steps:

[0057] [Step 1: Using a rolling process to obtain an infinitely extended composite coil;]

[0058] The composite coils have the following two specifications: as shown in FIG4 , one composite coil 40 includes a resistance alloy layer 41 and a copper layer 42 laminated to each other; as shown in FIG5 , the other composite coil 50 includes a first copper layer 51, a resistance alloy layer 52, and a second copper layer 53 laminated to each other, i.e., copper is laminated to both sides of the resistance alloy in the middle;

[0059] [Step 2: Obtain a composite panel having two panels A and B disposed back to back (as shown in FIG6 );]

[0060] According to the design requirements, the composite coil is cut to obtain the required length of the plate, and then the obtained plate is leveled by a leveling machine to ensure that the plate surface is flat and free of warping, bending, etc., thereby obtaining the required composite plate (as shown in Figure 6);

[0061] The composite plate includes the following two forms: as shown in FIG4 , one composite plate includes a resistance alloy layer 41 and a copper layer 42 bonded to each other; as shown in FIG5 , the other composite plate includes a first copper layer 51, a resistance alloy layer 52, and a second copper layer 53 bonded to each other in sequence, i.e., copper is bonded to both sides of the resistance alloy in the middle;

[0062] As shown in FIG6 , since the composite panel has the two aforementioned specifications, for a clearer and more organized description, the two oppositely disposed panels of the composite panel are designated Panel A and Panel B. Furthermore, for ease of description, the concept of a plane rectangular coordinate system is introduced. The plane rectangular coordinate system has mutually perpendicular X- and Y-axes, with the X-axis parallel to one side of the composite panel and the Y-axis parallel to the other side of the composite panel.

[0063] Step 3: Create a plurality of first grooves 100 spaced apart from each other along the X-axis of panel A (as shown in FIG. 7 ).

[0064] According to the product packaging specifications, a plurality of first grooves 100 spaced apart from each other are formed along the X-axis direction of the A panel by machining (CNC, numerically controlled machine tools, milling machines, etc.), laser or etching processes. Generally, the depth of the first grooves is required to be greater than 1 / 2 of the total thickness of the composite panel. Of course, the depth of the first grooves can be freely selected according to actual conditions. In principle, the composite panel cannot be cut through.

[0065] The spacing between the first grooves can be adjusted to any size and quantity, achieving ultra-high compatibility of package size, quantity and efficiency, and achieving effects that cannot be achieved by other methods such as molds;

[0066] As shown in FIG8 , a composite plate including a resistive alloy layer 41 and a copper layer 42 bonded to each other is used as an example. In this embodiment, the surface of the resistive alloy layer 41 is panel A, and the first groove 100 is formed on the resistive alloy layer 41. Of course, in other embodiments, the surface of the copper layer 42 can also be panel A, and the first groove 100 can be formed on the copper layer 42. It can also be understood that whether the first groove 100 is formed first on panel A or panel B, the same effect can be achieved in the end.

[0067] [Step 4: Fill the first trenches 100 with an insulating medium 60 and allow the insulating medium to solidify;]

[0068] As shown in FIG9 , the first groove 100 is filled with an insulating medium 60 (e.g., conventional epoxy resin material) using a dispensing machine or a glue injection process. The insulating medium is required to have sufficient bonding strength and rigidity and solidify at room temperature or under heating and pressurizing conditions. It is generally required that the insulating medium completely fills the first groove and is flush with the two side surfaces of the first groove.

[0069] Step 5: A plurality of second grooves 200 are formed along the X-axis of panel B, corresponding to the plurality of first grooves (as shown in FIG. 10 ). The depth of each second groove reaches the insulating medium of the corresponding first groove, thereby forming a plurality of rows of spaced-apart resistor strips 70 (as shown in FIG. 12 ).

[0070] In this step, whether to fill the second grooves with an insulating medium can be determined based on actual conditions, while filling the first grooves with an insulating medium is required (as shown in FIG10 ). Since the first grooves and the second grooves are interconnected, multiple rows of spaced-apart resistor bars are obtained. The insulating medium in the first grooves ensures that the interconnected rows of spaced-apart resistor bars are not prone to shaking. The multiple rows of spaced-apart resistor bars are stably connected by the insulating medium, which plays an important role in the stability of subsequent processing.

[0071] It should be noted that if the second groove needs to be filled with an insulating medium, the operation method is the same as the operation method for filling the first groove with the insulating medium described above. For example, a dispensing machine or a glue injection process is used to fill the second groove with an insulating medium 60 (as shown in FIG. 11 ). The insulating medium is required to have sufficient bonding strength and rigidity and solidify at room temperature or under heating and pressurizing conditions. It is generally required that the insulating medium completely fills the second groove and is flush with the two side surfaces of the second groove.

[0072] This also confirms what was said above, that is, no matter whether the first groove 100 is opened on panel A first or the first groove 100 is opened on panel B first, the same effect can be obtained in the end, and the first groove and the second groove realize the mutual spacing of multiple rows of resistor strips.

[0073] Step 6: A plurality of third trenches 300 are formed along the Y-axis of panel A, or a plurality of third trenches are formed along the Y-axis of panel B, or a plurality of third trenches are formed along the Y-axis of panel A and the Y-axis of panel B, respectively, so that a plurality of resistor units are formed on each row of resistor strips.

[0074] As shown in Figures 12, 13 and 14, if the composite plate includes a resistance alloy layer 41 and a copper layer 42 bonded to each other, the surface of the resistance alloy layer 41 is panel A, and the surface of the copper layer 42 is panel B, then a plurality of third grooves 300 spaced apart from each other are provided along the Y-axis direction of the surface of the copper layer 42. It should be noted that in order to clearly understand how the third grooves 300 are provided, the third grooves 300 are separated from the composite plate in Figure 12. In this way, by viewing Figure 13, it is possible to more clearly and intuitively understand how the third grooves 300 (shown by thick lines) are provided.

[0075] Similarly, if the composite plate includes a resistance alloy layer and a copper layer bonded to each other, the surface of the copper layer is panel A, and the surface of the resistance alloy layer is panel B, then a plurality of third grooves spaced apart from each other are provided along the Y-axis direction of the surface of the copper layer;

[0076] If the composite plate includes a first copper layer, a resistance alloy layer, and a second copper layer laminated in sequence, with the surface of the first copper layer being panel A and the surface of the second copper layer being panel B, then a plurality of the third grooves spaced apart from each other are provided along the Y-axis direction of the surface of the first copper layer, and a plurality of the third grooves spaced apart from each other are provided along the Y-axis direction of the surface of the second copper layer;

[0077] It can be seen from this that no matter what specifications or forms the composite plate has, the third groove is always opened on the copper layer.

[0078] [Step 7: Test the resistance of the resistor unit;]

[0079] After the third trench is formed, a plurality of resistor units 80 are formed (as shown in the dotted box of FIG. 15 );

[0080] Use a resistance trimmer to test the resistance of individual resistors. Based on the resistance requirements, use mechanical milling or laser stripping to remove the thickness of the resistor alloy to adjust the resistance from small to large, thereby improving the resistance qualification rate of the product.

[0081] [Step 8: Fill the third trenches with an insulating medium and allow it to solidify;]

[0082] The third groove is filled with an insulating medium 60 (as shown in FIG16 ) by a process such as silk screen printing, spray coating, or glue injection. The insulating medium is required to have sufficient bonding strength and rigidity. The insulating medium is then solidified at room temperature or under heating and pressurizing conditions. The insulating medium is required to be flush with or lower than the copper surfaces on both sides of the third groove to form a solder resist surface.

[0083] [Step 9. If the composite plate includes a resistance alloy layer 41 and a copper layer 42 laminated together, an insulating medium 60 is applied to the surface of the resistance alloy layer 41 by spraying, screen printing, or other processes (as shown in FIG. 16 ) to ensure surface insulation. It will be appreciated that if the composite plate includes a first copper layer, a resistance alloy layer, and a second copper layer laminated together in sequence, it is not necessary to apply an insulating medium to the surface of the resistance alloy layer.]

[0084] Step 10: Cut the composite board along the X-axis and the Y-axis to separate each resistor unit 80 (as shown in FIG. 15 and FIG. 17 );

[0085] When cutting the composite board along the X-axis and the Y-axis, it is preferred to retain the insulating medium on the side of the resistor unit (the insulating medium here refers to the first groove or the second groove filled) to achieve a better solder resist effect;

[0086] Step 11: Electroplating the side surfaces of the single resistor unit, such as copper plating, nickel plating, and tin plating, so that the side surfaces of the resistor unit are coated with an electroplating layer 90 (as shown in FIG. 18 );

[0087] [Step 12: Test the resistance of a single resistor.]

[0088]

Step 13: Packaging.

[0089] It should be noted that the order of steps 5 and 6 can be reversed. For example, after the first groove is formed, the third groove can be formed immediately. After the third groove is formed, the second groove can be formed. It can be seen that after the second groove is formed, multiple rows of spaced resistor strips are obtained. Since the third groove has been formed, a number of resistor cells are formed in each row of resistor strips. The resistance value of each resistor cell is then tested and subsequent operations are performed.

[0090] It should be noted that since the purpose of providing the first and second grooves is to form a number of spaced-apart resistor strips, the width of the first and second grooves should be as small as possible to maximize material utilization. The spacing between the first grooves (and the spacing between the second grooves) must be sufficient to accommodate a single resistor. In other words, the spacing between the first grooves or the second grooves needs to be adjusted based on the actual size of the resistor. The width and depth of the third grooves, as well as the spacing between the third grooves, are determined based on the product's package size and resistance value. Industrial Applicability

[0091] The present invention uses a rolled composite copper / resistance alloy or copper / resistance alloy / copper composite process to process a composite plate strip. Then, through machining (CNC, numerically controlled machine tools, milling machines, and other machining equipment) or etching, grooves (a first groove, a second groove, and a third groove) are designed on the front and back sides of the composite plate. A multi-row structural layout is implemented for the product, and a common process edge design is achieved for the entire plate surface, thereby improving material utilization. Then, an insulating medium is filled in the first groove (the second groove can be freely filled with the insulating medium) to achieve a disconnected layout of the multiple rows of resistors. The resistance value of the multiple rows of non-conductive resistors on the entire plate is tested piece by piece or row by row using a resistance trimmer. According to the resistance value requirements, the thickness of the resistor alloy is removed by mechanical milling or laser stripping to adjust the resistance value from small to large, thereby improving the resistance qualification rate of the product. Then, an insulating medium is coated on the surface of the resistor alloy. Then, single-particle molding is achieved through machining or laser cutting. Then, the single product is subjected to copper plating, nickel plating, tin plating, and other processes. Finally, the resistance value is tested and the product is packaged.

[0092] This process enables customized design and processing of different packages (0201 / 0603 / 0805…) without being restricted by resistor package size. It achieves high power (taking 0805 as an example, it can reach 1.5W, and 0402 can reach 1W), low temperature drift (controllable within ±50PPM / ℃, or even within ±10PPM / ℃), and excellent surge resistance. Furthermore, it can ensure high power, pulse resistance, and low temperature drift while improving product utilization and yield.

Claims

1. A precision alloy resistor adjustment process, characterized in that: The steps include: Obtaining a composite panel having two panels A and B disposed back to back; A plurality of first grooves arranged in an interval manner are provided along the X-axis direction of the A panel; Filling the insulating medium into the first grooves and solidifying the insulating medium; A plurality of second grooves corresponding to the plurality of first grooves are formed along the X-axis direction of the B panel, wherein the depth of each of the second grooves reaches the insulating medium of the corresponding first groove, thereby obtaining a plurality of rows of resistor strips spaced apart from each other; A plurality of third grooves arranged at intervals are provided along the Y-axis direction of the A panel, or a plurality of third grooves arranged at intervals are provided along the Y-axis direction of the B panel, or a plurality of third grooves arranged at intervals are provided along the Y-axis direction of the A panel and along the Y-axis direction of the B panel, so that a plurality of resistor monomers are formed on each row of the resistor strips; Performing a resistance test on the resistor monomer; Filling the insulating medium into the plurality of third grooves and solidifying the insulating medium; The composite board is cut along the X-axis direction and the Y-axis direction to separate each resistor monomer therefrom.

2. The precision alloy resistor trimming process according to claim 1, characterized in that: An insulating medium is filled into the plurality of the second grooves and solidified.

3. The precision alloy resistor trimming process according to claim 1, characterized in that: The side surfaces of the resistor monomer are coated with an electroplating layer.

4. The precision alloy resistor trimming process according to claim 1, characterized in that: The composite plate comprises a resistance alloy layer and a copper layer bonded to each other, wherein the surface of the resistance alloy layer is panel A, and the surface of the copper layer is panel B; A plurality of third grooves arranged at intervals from each other are formed along the Y-axis direction of the surface of the copper layer.

5. The precision alloy resistor trimming process according to claim 4, characterized in that: An insulating medium is coated on the surface of the resistance alloy layer.

6. The precision alloy resistor trimming process according to claim 1, characterized in that: The composite plate comprises a resistance alloy layer and a copper layer bonded to each other, the surface of the copper layer is panel A, and the surface of the resistance alloy layer is panel B; A plurality of third grooves arranged at intervals from each other are formed along the Y-axis direction of the surface of the copper layer.

7. The precision alloy resistor trimming process according to claim 6, characterized in that: An insulating medium is coated on the surface of the resistance alloy layer.

8. The precision alloy resistor trimming process according to claim 1, characterized in that: The composite plate comprises a first copper layer, a resistance alloy layer, and a second copper layer which are laminated in sequence, wherein the surface of the first copper layer is panel A, and the surface of the second copper layer is panel B; A plurality of the third grooves arranged at intervals from each other are opened along the Y-axis direction of the surface of the first copper layer, and a plurality of the third grooves arranged at intervals from each other are opened along the Y-axis direction of the surface of the second copper layer.

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