Selective surface processing device and selective surface processing method

Abstract

The present invention relates to a selective surface processing device and a selective surface processing method. The selective surface processing device may include: an upper mold having an upper contact part formed thereon to press a material to be processed, a groove-shaped upper surface processing space formed therein, and an upper fluid channel part formed therein as a fluid channel; a lower mold having a lower seat part formed thereon to allow the material to be processed to be seated thereon, a groove-shaped lower surface processing space formed therein, and a lower fluid channel part formed therein as a fluid channel, the lower mold being combined with the upper mold; and an electrically conductive member which comes into contact with the material to be processed so as to press same and is formed at the upper mold to allow a current applied from a power supply part to conduct through at least a part of the material to be processed.

Description

Selective surface treatment device and selective surface treatment method

[0001] The present invention relates to a surface treatment device, and more particularly, to a selective surface treatment device and a selective surface treatment method for selectively surface-treating an area for bonding an electrode portion used in a secondary battery.

[0002] Secondary batteries, which are generally used in electric vehicles and hybrid vehicles that consume a lot of power, require long-term operation and high-power operation. Accordingly, they are used in the form of battery modules in which multiple batteries are electrically connected using bus bars and bundled into one unit. In addition, they can be used in the form of a single battery depending on the type of external device to which they are applied, such as mobile devices and uninterruptible power supplies.

[0003] Fuel cells used in electric vehicles, hybrid vehicles, etc. are preferred as battery modules due to issues with output and capacity, and battery modules can increase output voltage or output current depending on the number of built-in batteries.

[0004] Secondary batteries have electrode terminals installed through the cap plate, and at this time, there is a problem that a lot of loss occurs at the joint surface between the cap plate and the electrode terminal.

[0005] Therefore, the bonding between the cap plate and the electrode terminal is not easy to bond, the process is complex, and the resistance value is high even after bonding, resulting in a problem of low efficiency in transmitting power inside the secondary battery to the outside.

[0006] Accordingly, various bonding and surface treatment methods are being developed to prevent current loss at the joint surface, but the immersion method of immersing the material to be treated in a plating bath and treating the surface has problems such as difficulty in effectively reducing the current flow loss, which reduces the reliability of the surface-treated product, and is uneconomical due to the structure using excessive surface treatment liquid, and poor workability due to harmful gases generated during surface treatment in an open structure.

[0007] The present invention aims to solve various problems including the above-mentioned problems, and provides a selective surface treatment device and a selective surface treatment method that can increase power transmission efficiency by lowering resistance and current loss rate at the contact surface of a cap plate and an electrode terminal, and can reduce the consumption of surface treatment liquid during surface treatment, thereby reducing harmful gases and treatment processes. However, these tasks are exemplary and the scope of the present invention is not limited thereby.

[0008] According to one embodiment of the present invention, a selective surface treatment device is provided. The selective surface treatment device may include: an upper mold having an upper contact portion for pressing a material to be treated, an upper surface treatment space in a groove shape so that a surface treatment solution can be received in a region of the material to be treated, and an upper flow path portion formed therein as a flow path so that the surface treatment solution can flow through the upper surface treatment space; a lower mold having a lower mounting portion for receiving the material to be treated, a lower surface treatment space in a groove shape so that a surface treatment solution can be received in a region of the material to be treated, and a lower flow path portion formed therein as a flow path so that the surface treatment solution can flow through the lower surface treatment space; and a conductive member formed in the upper mold for pressing the material to be treated and contacting the material to be treated so as to allow current applied from a power source to pass through at least a portion of the material to be treated.

[0009] According to one embodiment of the present invention, the upper mold may include an electrode insertion portion formed to penetrate at least a portion of the upper mold so that an individual pressurizing portion that directly contacts and presses the material to be treated among the conductive members is inserted; an upper flow path portion formed to extend from the upper surface treatment space to the outside of the upper mold so that the surface treatment solution can be discharged from the upper surface treatment space; and a solution discharge portion connected to the upper flow path portion and formed on the outside of the upper mold to discharge the surface treatment solution.

[0010] According to one embodiment of the present invention, the upper mold is formed with a plurality of upper contact portions and upper surface treatment spaces so as to be able to treat a plurality of the materials to be treated, and the upper flow path portion is connected to each of the plurality of upper surface treatment spaces and can be connected to the solution discharge portion by being combined into a single flow path inside the upper mold.

[0011] According to one embodiment of the present invention, the upper mold may include an upper insulating module formed separately from the upper mold, the upper contact portion being formed so as to cover the material to be treated and pressurizing the material to be treated, and the upper insulating module may include an electrode penetration portion formed so as to allow the conductive member protruding from the upper mold to contact the material to be treated; and an upper solution receiving portion formed so as to have the upper surface treatment space formed and having a position corresponding to the upper flow path portion penetrated so as to allow the surface treatment solution to flow into the upper flow path portion.

[0012] According to one embodiment of the present invention, the lower mold may include: a lower flow path formed to extend from the outside of the lower mold to the lower surface treatment space so that the surface treatment solution can be supplied to the lower surface treatment space; and a solution inlet formed on the outside of the lower mold and connected to the lower flow path to receive the surface treatment solution from the solution supply portion.

[0013] According to one embodiment of the present invention, the lower mold includes a lower mounting portion where the material to be treated is mounted, and a lower insulation module formed separately from the lower mold; and the lower insulation module may include a lower solution receiving portion where the lower surface treatment space is formed and a position corresponding to the lower channel portion is formed through which the surface treatment solution can flow from the lower channel portion.

[0014] According to one embodiment of the present invention, the lower mold is formed with a plurality of lower mounting portions and a plurality of lower surface treatment spaces so as to be able to treat a plurality of the materials to be treated, and the lower flow path portion extends from the solution inlet portion and branches into a plurality of flow paths inside the lower mold, so as to be connected to a plurality of the lower surface treatment spaces, respectively.

[0015] According to one embodiment of the present invention, the conductive member may be formed such that a plurality of individual pressurizing portions are formed to pressurize both sides of the material to be treated by directly contacting the material to be treated.

[0016] According to one embodiment of the present invention, the conductive member may be configured such that power is applied to at least one of the individual pressure portions formed in a plurality from the power portion, and polarity may be applied to the material to be treated through the individual pressure portion to which power is applied.

[0017] According to one embodiment of the present invention, the conductive member may include: an electrode portion connected to the power supply portion; a plurality of individual pressure portions connected to the electrode portion and formed to directly contact and pressurize the material to be processed; and an electrode distribution portion that transmits current to the plurality of individual pressure portions formed in the electrode portion.

[0018] According to one embodiment of the present invention, the conductive member may include an elastic member formed to support an individual pressurizing portion formed to directly contact and pressurize the material to be processed, and formed to be compressed according to the thickness of the material to be processed so that the individual pressurizing portion can be raised and lowered relative to the upper mold.

[0019] According to one embodiment of the present invention, the conductive member may include a height adjusting member that is connected to the individual pressing member to adjust the height of the individual pressing member formed to pressurize the material to be processed by directly contacting the individual pressing member, and is threadedly connected within the conductive member to adjust the height of the individual pressing member by rotation.

[0020] According to one embodiment of the present invention, a method for selective surface treatment is provided. The selective surface treatment method comprises: an upper mold having an upper contact portion for pressurizing a material to be treated, an upper surface treatment space in a groove shape so that a surface treatment solution can be received in an area of ​​the material to be treated, and an upper channel portion formed therein as a channel so that the surface treatment solution can flow through the upper surface treatment space; a lower mold having a lower mounting portion for receiving the material to be treated, a lower surface treatment space in a groove shape so that a surface treatment solution can be received in an area of ​​the material to be treated, and a lower channel portion formed therein as a channel so that the surface treatment solution can flow through the lower surface treatment space; a lower mold that is joined to the upper mold; and a conductive member formed in the upper mold so as to contact the material to be treated so as to pressurize the material to be treated and to allow current applied from a power source to pass through at least a portion of the material to be treated, the method comprising the steps of: (a) preparing the material to be treated between the upper mold and the lower mold; (b) a step of filling the upper surface treatment space and the lower surface treatment space with the surface treatment solution; (c) a step of applying power to surface treat the material to be treated; and (d) a step of discharging the surface treatment solution.

[0021] According to one embodiment of the present invention, the step (a) may include: (a-1) a step of forming the lower mounting portion on which the material to be processed is mounted, and joining a lower insulating module formed separately from the lower mold to the lower mold; (a-2) a step of mounting the material to be processed to the lower mounting portion of the lower insulating module; and (a-3) a step of lowering the upper mold and joining it with the lower mold so that the upper insulating module formed separately from the upper mold, and forming the upper contact portion for pressing the material to be processed, covers the material to be processed.

[0022] According to one embodiment of the present invention, the step (b) may include: (b-1) filling the lower surface treatment space with the surface treatment solution that flows through the lower flow path formed by extending from the solution inlet formed on the outside of the lower mold to the lower surface treatment space; and (b-2) filling the upper surface treatment space with the surface treatment solution that passes through the material to be treated.

[0023] According to one embodiment of the present invention, the step (c) may include: (c-1) applying power to the conductive member and the lower mold through individual pressurizing portions formed to directly contact the material to be treated, such that the material to be treated becomes positive and the lower mold becomes negative; and (c-2) forming an oxide film on the surface of the material to be treated that has come into contact with the solution to be treated.

[0024] According to one embodiment of the present invention, in the step (d), the surface treatment solution can be discharged from the upper surface treatment space through the upper flow path formed by extending from the upper surface treatment space to the solution discharge portion formed on the outside of the upper mold.

[0025] According to one embodiment of the present invention as described above, the consumption of surface treatment solution during surface treatment can be reduced, the generation of harmful gases, etc. can be suppressed with a sealed structure, and the cost can be reduced due to a reduction in the process and time for surface treatment.

[0026] Furthermore, a selective surface treatment device and method can be implemented that can perform surface treatment only on a desired area, lower resistance at the contact surface between the cap plate and the electrode terminal, reduce current loss, and thereby increase power transmission efficiency, improve production efficiency, and reduce process costs due to maintenance. Of course, the scope of the present invention is not limited by these effects.

[0027] FIG. 1 is a perspective view showing an optional surface treatment device according to one embodiment of the present invention.

[0028] FIG. 2 is a partially cut perspective view showing the upper mold and lower mold of a selective surface treatment device according to one embodiment of the present invention separated.

[0029] Figure 3 is a plan view showing the lower surface of an upper mold according to one embodiment of the present invention.

[0030] Figure 4 is a perspective view showing an upper insulation module of an upper mold according to one embodiment of the present invention.

[0031] Fig. 5 is a plan view showing the upper surface of a lower mold according to one embodiment of the present invention.

[0032] Figure 6 is a perspective view showing a lower insulation module of a lower mold according to one embodiment of the present invention.

[0033] Fig. 7 is a cutaway perspective view showing a cross-section taken along line A-A' of Fig. 1.

[0034] Fig. 8 is a cross-sectional view specifically showing the cross-section A-A' of Fig. 1.

[0035] Fig. 9 is a cross-sectional view specifically showing the cross-section of B-B' of Fig. 1.

[0036] Fig. 10 is a cutaway perspective view showing a cross-section taken along line C-C' of Fig. 1.

[0037] Fig. 11 is a cross-sectional view specifically showing the cross-section of C-C' in Fig. 1.

[0038] Fig. 12 is a cross-sectional view specifically showing the cut surface of D-D' of Fig. 1.

[0039] Figure 13 is a flowchart showing a selective surface treatment method according to one embodiment of the present invention.

[0040] Figures 14 to 16 are flowcharts specifically showing steps (a), (b), and (c) of Figure 13, respectively.

[0041] Hereinafter, various preferred embodiments of the present invention will be described in detail with reference to the attached drawings.

[0042] The embodiments of the present invention are provided to more fully explain the present invention to those skilled in the art. The following embodiments may be modified in various ways, and the scope of the present invention is not limited to the following embodiments. Rather, these embodiments are provided to more faithfully and completely explain the present disclosure and to fully convey the spirit of the present invention to those skilled in the art. In addition, the thickness and size of each layer in the drawings are exaggerated for convenience and clarity of explanation.

[0043] Hereinafter, embodiments of the present invention will be described with reference to drawings schematically illustrating ideal embodiments of the present invention. In the drawings, variations in the shapes depicted may be expected, for example, depending on manufacturing techniques and / or tolerances. Therefore, embodiments of the present invention should not be construed as limited to the specific shapes of the regions depicted herein, but should include, for example, variations in shapes resulting from manufacturing processes.

[0044] FIG. 1 is a perspective view showing a selective surface treatment device according to one embodiment of the present invention, FIG. 2 is a partially cut perspective view showing that the upper mold (100) and the lower mold (200) of the selective surface treatment device (1000) are separated, FIG. 3 is a plan view showing the lower surface of the upper mold (100), FIG. 4 is a perspective view showing the upper insulation module (150) of the present invention, FIG. 5 is a plan view showing the upper surface of the lower mold (200), FIG. 6 is a perspective view showing the lower insulation module (250), FIGS. 7 and 8 are cut perspective views showing the cut section taken along line A-A' of FIG. 1, FIG. 9 is a cross-sectional view specifically showing the cut section taken along line B-B' of FIG. 1, FIGS. 10 and 11 are cut perspective views showing the cut section taken along line C-C' of FIG. 1, and FIG. 12 is a cross-sectional view specifically showing the cut section taken along line D-D' of FIG. 1.

[0045] First, a selective surface treatment device (1000) according to one embodiment of the present invention may largely include an upper mold (100), a lower mold (200), and a conductive member (300), as illustrated in FIG. 1.

[0046] As illustrated in Fig. 2, the upper mold (100) can pressurize and restrain the upper and lower surfaces of the material to be processed (P) together with the lower mold (200). For example, the upper mold (100) can be driven up and down so as to cover the material to be processed (P) from above the lower mold (200).

[0047] The upper mold (100) may be formed with an upper contact portion (151) that pressurizes the material to be treated (P). For example, as illustrated in FIG. 3, the upper contact portion (151) is formed in a shape corresponding to the material to be treated (P) and is formed so as to cover the material to be treated (P), and as the upper mold (100) is lowered, the upper contact portion (151) may pressurize the material to be treated (P). More specifically, the upper contact portion (151) may pressurize an unprocessed area of ​​the material to be treated (P) that is not subjected to surface treatment.

[0048] At this time, the upper contact portion (151) may be formed with a step-shaped or inclined guide so that the material to be processed (P) can be aligned to the upper contact portion (151).

[0049] The upper mold (100) may include an upper insulating module (150) formed of a non-conductive material so that the material to be processed (P) does not conduct electricity with the upper mold (100), and having an upper contact portion (151) formed therein. The upper insulating module (150) is formed below the upper mold (100), and may space the material to be processed (P) from the upper mold (100) by a predetermined distance.

[0050] As shown in Fig. 8, the upper mold (100) may have a groove-shaped upper surface treatment space (101) formed so that a surface treatment solution can be received in the area of ​​the material to be treated (P) to be surface treated.

[0051] Specifically, the upper mold (100) may be formed with a space that accommodates a surface treatment solution so that a surface treatment area among the material to be treated (P) can be immersed in the solution for surface treatment. For example, a non-treated area among the material to be treated (P) is pressed by contacting the upper contact portion (151), and a surface treatment area among the material to be treated (P) is positioned in the upper surface treatment space (101) so that it can be immersed in the surface treatment solution when the surface treatment solution is supplied. For example, in order to surface treat an area for bonding with an electrode in a cap plate coupled to a fuel cell, an area that comes into contact with the electrode can be immersed in the surface treatment solution.

[0052] The material to be treated (P) can be formed of a material including aluminum, copper, zinc, magnesium, titanium, niobium, nickel, cadmium, etc.

[0053] The surface treatment solution may be an acidic solution such as sulfuric acid or chromic acid, and may also include an electrolyte solution capable of anodic oxidation.

[0054] As shown in Fig. 10, the upper mold (100) may be formed with an upper flow path (120) formed inside the upper mold (100) so that the upper surface treatment space (101) is connected to the upper surface treatment space and the surface treatment solution can flow.

[0055] Specifically, an upper flow path (120) may be formed that extends in a tubular shape from the outside of the upper mold (100) to the upper surface treatment space (101) formed at the bottom of the upper mold (100) so that the surface treatment solution contained in the upper surface treatment space (101) formed in the upper mold (100) can be introduced or discharged from the outside of the upper mold (100).

[0056] For example, the upper euro portion (120) may be formed to extend from the upper surface treatment space (101) to the outside of the upper mold (100) so that the surface treatment solution can be discharged from the upper surface treatment space (101).

[0057] At this time, the upper mold (100) is connected to the upper flow path (120), and a solution discharge portion (110) formed on the outside of the upper mold (100) to discharge the surface treatment solution can be formed.

[0058] As shown in FIGS. 7 and 8, the upper mold (100) may be formed with an electrode insertion portion (130) formed through at least a portion of the upper mold (100) so that an individual pressing portion (330) that directly contacts and presses the material to be processed (P) among the conductive members (300) can be inserted.

[0059] Specifically, a conductive member (300) may be coupled to the upper portion of the upper mold (100), and at least a portion of the conductive member (300) may be formed to penetrate the upper mold (100) and contact the material to be processed (P). At this time, an electrode insertion portion (130) may be formed in the upper mold (100) so that an individual pressurizing portion (330), which is at least a portion of the conductive member (300), may be inserted therein.

[0060] When the upper mold (100) is combined with the lower mold (200), the upper mold (100) can be combined in a shape in which the upper mold (100) is inserted into the flange-shaped outer diameter of the lower mold (200), as shown in Fig. 7. At this time, a seal can be provided between the upper mold (100) and the lower mold (100) to block the exterior of the combined selective surface treatment device (1000) and the interior where the material to be treated (P) is located, so that the interior of the selective surface treatment device (1000) can be sealed.

[0061] According to some embodiments of the present invention, the upper mold (100) of the selective surface treatment device (1000) may not be in direct contact with the lower mold (200) so as to be electrically insulated from the lower mold (200). For example, a sealing portion may be formed between the upper mold (100) and the lower mold (200) so that the upper mold (100) and the lower mold (200) do not contact each other, or the upper mold (100) and the lower mold (200) may be formed in a shape in which they only pressurize the upper and lower portions centered on the material to be treated (P) and do not contact each other.

[0062] Thus, the conductive member (300) and the lower mold (200) combined with the upper mold (100) can be electrically conductive through the material to be treated (P) and the surface treatment solution.

[0063] The upper mold (100) is formed so as to cover the material to be processed (P), and the upper contact portion (151) that pressurizes the material to be processed (P) can be formed as a separate structure from the upper mold (100). For example, the upper contact portion (151) can be formed in an upper insulation module (150) that is formed separately from the upper mold (100).

[0064] Specifically, as illustrated in FIG. 3, the upper mold (100) may include an upper insulation module (150) having an upper contact portion (151) formed therein so that the material to be processed (P) does not conduct electricity with the upper mold (100). At this time, the upper insulation module (150) may be formed as a separate structure that can be separated and combined with the upper mold (100).

[0065] More specifically, as illustrated in FIG. 4, the upper insulation module (150) may include an upper contact portion (151), an electrode penetration portion (152), and an upper solution receiving portion (153).

[0066] The electrode penetration portion (152) can be penetrated so that the conductive member (300) protruding from the upper mold (100) can contact the material to be treated. Specifically, as illustrated in FIG. 7, the individual pressurizing portion (330) of the conductive member (300) can penetrate the upper insulating module (150) and contact the material to be treated (P).

[0067] At this time, the electrode penetration portions (152-1, 152-2) can be formed at positions corresponding to both sides of the material to be treated (P) so that the conductive member (300) can pressurize the material to be treated (P) from both sides.

[0068] The upper solution receiving portion (153) may be formed by forming an upper surface treatment space (101) and penetrating a position corresponding to the upper flow path portion (120) so that the surface treatment solution can flow to the upper flow path portion (120).

[0069] Specifically, the upper solution receiving portion (153) has a portion corresponding to the surface treatment area of ​​the material to be treated (P) penetrated so that the surface treatment solution can be received.

[0070] For example, as illustrated in FIGS. 4 and 7, the upper insulation module (150) is formed with a groove shape in a portion corresponding to the surface treatment area of ​​the material to be treated (P) to form an upper surface treatment space (101), and at least a portion of the groove shape can be penetrated. That is, the upper surface treatment space (101) is formed in the upper insulation module (150) of the upper mold (100), and can be formed so that the surface treatment area of ​​the material to be treated (P) can be exposed to the upper surface treatment space (101) of the upper insulation module (150).

[0071] In another embodiment, as illustrated in FIG. 8, the upper insulation module (150) may be formed such that a portion corresponding to the surface treatment area of ​​the material to be treated (P) is penetrated, so that the surface treatment area of ​​the material to be treated (P) can be exposed to the upper surface treatment space (101) of the upper mold (100).

[0072] The upper insulation module (150) is made of a material that is easy to flexibly and tightly adhere to the material to be treated (P), and various materials including resin materials can be applied as such materials.

[0073] The upper mold (100) may be formed with a plurality of upper contact portions (151) and upper surface treatment spaces (101) so as to be able to process a plurality of materials to be processed (P).

[0074] For example, as shown in FIG. 10, in order to process a plurality of materials to be processed (P) in a selective surface treatment device (1000), a plurality of upper insulating modules (150) each having an upper contact portion (151) formed thereon may be formed in the upper mold (100), and a plurality of upper surface treatment spaces (101) may be formed, or an upper insulating module (150) having a plurality of upper contact portions (151) formed thereon may be formed in the upper mold (100).

[0075] At this time, the upper flow path (120) is formed so that a plurality of upper surface treatment spaces (101) are connected to each other, and can be connected to a solution discharge unit (110) by being combined into a single flow path inside the upper mold (100). Accordingly, the surface treatment solution of each upper surface treatment space (101) can be discharged to the outside of the upper mold (100) through the solution discharge unit (110).

[0076] As illustrated in Fig. 2, the lower mold (200) can be combined with the upper mold (100) by applying pressure to the upper and lower surfaces of the material to be processed (P). For example, the lower mold (200) can secure the material to be processed (P) below the upper mold (200) and pressurize the material to be processed (P) in a fixed manner according to the elevation and lowering of the upper mold (100).

[0077] The lower mold (200) may be formed with a lower mounting portion (251) on which the treatment material (P) is mounted. For example, as illustrated in FIG. 5, the lower mounting portion (251) is formed in a shape corresponding to the treatment material (P) so that the treatment material (P) can be mounted, and as the upper mold (100) is lowered, the upper contact portion (151) can press the treatment material (P). At this time, the lower mounting portion (251) can contact an untreated area of ​​the treatment material (P) that is not surface-treated to mount the treatment material (P).

[0078] The lower mounting portion (251) may be formed with a step-shaped or inclined guide so that the material to be processed (P) can be aligned to the lower mounting portion (251).

[0079] The lower mold (200) may include a lower insulating module (250) formed of a non-conductive material and having a lower mounting portion (251) formed therein so that the material to be processed (P) does not conduct electricity with the lower mold (200). The lower insulating module (250) is formed above the lower mold (200) so as to space the material to be processed (P) from the lower mold (200) by a predetermined distance.

[0080] As shown in Fig. 8, the lower mold (200) can have a groove-shaped lower surface treatment space (201) formed so that a surface treatment solution can be received on the surface area of ​​the material to be treated (P).

[0081] Specifically, the lower mold (200) may be formed with a space that accommodates a surface treatment solution so that the surface treatment area of ​​the material to be treated (P) can be immersed in the solution for surface treatment. For example, the non-treatment area of ​​the material to be treated (P) is placed in contact with the lower mounting portion (251) and is mounted, and the surface treatment area of ​​the material to be treated (P) is positioned in the lower surface treatment space (201) so that it can be immersed in the surface treatment solution when the surface treatment solution is supplied. For example, in order to surface treat an area for joining with an electrode in a cap plate coupled to a fuel cell, an area that comes into contact with the electrode can be immersed in the surface treatment solution.

[0082] As shown in Fig. 9, the lower mold (200) may be formed with a lower flow path (220) formed inside the lower mold (200) to communicate with the lower surface treatment space (201) so that the surface treatment solution can flow.

[0083] Specifically, a lower flow path (220) may be formed that extends in a tubular shape from the outside of the lower mold (200) to the lower surface treatment space (201) formed on the upper portion of the lower mold (200) so that the surface treatment solution contained in the lower surface treatment space (201) formed in the lower mold (200) can be introduced or discharged from the outside of the lower mold (200).

[0084] For example, the lower euro portion (220) can be formed to extend from the outside of the lower mold (200) to the lower surface treatment space (201) so that the surface treatment solution can be supplied to the lower surface treatment space (201).

[0085] At this time, the lower mold (200) is connected to the lower flow path (220) and formed on the outside of the lower mold (200), and a solution inlet (210) that receives a surface treatment solution from a solution supply unit (not shown) can be formed.

[0086] The lower mold (200) is formed with a lower mounting portion (251) to allow the material to be processed (P) to be mounted thereon, and the lower mounting portion (251) may be formed as a separate structure from the lower mold (200). For example, the lower mounting portion (251) may be formed in a lower insulating module (250) that is formed separately from the lower mold (200).

[0087] Specifically, as illustrated in FIG. 5, the lower mold (200) may include a lower insulation module (250) having a lower mounting portion (251) formed therein so that the material to be processed (P) does not conduct electricity with the lower mold (200). At this time, the lower insulation module (250) may be formed as a separate structure that can be separated and combined with the lower mold (200).

[0088] More specifically, as shown in FIG. 6, the lower insulation module (250) can be formed with a lower mounting portion (251) and a lower solution receiving portion (253).

[0089] The lower solution receiving portion (253) may be formed by forming a lower surface treatment space (201) and penetrating a position corresponding to the lower flow path portion (220) so that the surface treatment solution can flow from the lower flow path portion (220).

[0090] Specifically, the lower solution receiving portion (253) has a portion corresponding to the surface treatment area of ​​the material to be treated (P) penetrated so that the surface treatment solution can be received.

[0091] For example, as shown in FIGS. 6 to 8, the lower insulation module (250) may be formed so that a portion corresponding to the surface treatment area of ​​the material to be treated (P) is penetrated, so that the surface treatment area of ​​the material to be treated (P) can be exposed to the lower surface treatment space (201) of the lower mold (200).

[0092] In another embodiment, although not shown, the lower insulation module (250) may be formed with a groove shape in a portion corresponding to the surface treatment area of ​​the material to be treated (P) to form a lower surface treatment space (201), and at least a portion of the groove shape may be penetrated. That is, the lower surface treatment space (201) may be formed in the lower insulation module (250) of the lower mold (100), and may be formed so that the surface treatment area of ​​the material to be treated (P) may be exposed to the lower surface treatment space (201) of the lower insulation module (250).

[0093] The lower insulation module (250) is made of a material that is easy to flexibly and tightly adhere to the material to be treated (P), and various materials including resin materials can be applied as such materials.

[0094] Although not shown, the optional surface treatment device (1000) of the present invention may further include a pressurizing mechanism that is connected to the upper mold (100) and the lower mold (200) to slide the upper mold (100) and the lower mold (200) in the up-and-down direction, respectively.

[0095] The above pressurizing mechanism allows the upper mold (100) and the lower mold (200) to slide and move in conjunction with each other at the same timing, and applies similar pressures to the upper mold (100) and the lower mold (200). This pressurizing mechanism may utilize a hydraulic press using oil or air, and any other mechanism that can achieve the above-mentioned purpose may be applied.

[0096] The lower mold (200) may be formed with a plurality of lower mounting portions (251) and lower surface treatment spaces (201) so as to be able to process a plurality of materials to be processed (P).

[0097] For example, as shown in FIG. 10, in order to process a plurality of materials to be processed (P) in a selective surface treatment device (1000), a plurality of lower insulating modules (250) each having a lower mounting portion (251) formed thereon may be formed in the lower mold (200), and a plurality of lower surface treatment spaces (201) may be formed, or a lower insulating module (250) having a plurality of lower mounting portions (251) formed thereon may be formed in the lower mold (200).

[0098] At this time, the lower flow path (220) extends from the solution inlet (210) and branches into multiple flow paths inside the lower mold, and can be connected to multiple lower surface treatment spaces (201), respectively. Accordingly, the surface treatment solution can be introduced into the lower mold (100) through the solution inlet (210) and received into each lower surface treatment space (201) through the lower flow path (220).

[0099] As illustrated in FIG. 2, the conductive member (300) can be formed in the upper mold (100) so as to contact the material to be treated (P) to pressurize it, thereby allowing current applied from the power source to pass through at least a portion of the material to be treated (P).

[0100] Specifically, the conductive member (300) is formed by being bonded to at least a portion of the upper mold (100) using a conductive material, is electrically connected to the power supply unit, has bipolarity, and can serve to conduct current to the material to be processed (P). At this time, at least a portion of the conductive member (300) to which current is applied can be formed of a material with good corrosion resistance and durability.

[0101] The above power supply unit is connected to the lower mold (200) and the conductive member (300), and the positive electrode is connected to the material to be treated (P), and the negative electrode is connected to the lower mold (200), so that current can flow through the surface treatment solution. A detailed description of this power supply unit is omitted because it is substantially similar to the power supply unit of a known surface treatment device.

[0102] As illustrated in FIG. 12, the conductive member (300) can be formed by combining one or more of an electrode portion (310), an electrode distribution portion (320), an individual pressure portion (330), an elastic portion (340), and a height adjustment portion (350).

[0103] The electrode unit (310) is an electrode device that is connected to the upper mold (100) from the outside of the upper mold (100) and is connected to the power supply unit to receive current.

[0104] The electrode distribution unit (320) is coupled to the upper mold (100) and can transmit the current applied from the electrode unit (310) to a plurality of individual pressurizing units (330).

[0105] The individual pressurizing portion (330) is connected to the electrode portion (310) or the electrode distribution portion (320), and may be formed in multiple pieces so as to directly contact and pressurize the material to be processed (P).

[0106] The elastic member (340) is formed to support the individual pressurized member (330), and can be formed to be compressed according to the thickness of the material to be processed (P), so that the individual pressurized member (330) can be raised and lowered based on the upper mold (100).

[0107] Specifically, for example, the individual pressurizing portion (330) receives current through the electrode portion (310) coupled to the upper mold (100), and can apply current to each of the plurality of materials to be processed (P) through the electrode distribution portion (320). Subsequently, the individual pressurizing portion (330) can come into contact with the materials to be processed (P) as the upper mold (100) descends, and the upper mold (100) can be pressurized until the surface treatment area of ​​the materials to be processed (P) is sealed.

[0108] At this time, the individual pressurizing portion (330) protrudes beyond the surface of the upper mold (100) and comes into contact with the material to be processed (P) first, and even if the upper mold (100) is lowered further, the material to be processed (P) is restrained by the elastic portion (340) supporting it at the rear end, so that it does not pressurize more than a certain load.

[0109] The height adjustment unit (350) is connected to the individual pressure unit (330) to adjust the height of the individual pressure unit (330) formed to directly contact and pressurize the material to be processed (P), and is connected with a screw thread (351) inside the conductive member (300) so that the height of the individual pressure unit (330) can be adjusted through rotation.

[0110] Each individual pressurizing portion (330) may have different positions depending on environmental factors when it comes into contact with a plurality of materials to be processed (P) by pressing them. Accordingly, each individual pressurizing portion (330) can adjust the height at which it protrudes from the surface of the upper mold (100) through a height adjusting portion (350) formed above the individual pressurizing portion (330).

[0111] The height adjustment part (350) is formed with a screw thread (351), so that the height can change with respect to the upper mold (100) as the height adjustment part (350) rotates, and the height of the individual pressure part (330) connected to the height adjustment part (350) can also change.

[0112] The conductive member (300) may be formed so that individual pressurizing portions (330) pressurize both sides of the material to be treated (P). For example, as illustrated in FIG. 8, when surface-treating one material to be treated (P), two individual pressurizing portions (330) may be used to pressurize both sides of the material to be treated (P). Accordingly, the pressure applied to the material to be treated (P) may be the same on both sides, the sealing of the surface-treated area of ​​the material to be treated (P) may be firmly secured, and all surfaces of the surface-treated area of ​​the material to be treated (P) may be uniformly treated.

[0113] Power is applied to at least one of the individual pressurizing units (330) that pressurize both sides of the material to be treated (P), so that polarity can be applied to the material to be treated (P) through the individual pressurizing unit (330) to which power is applied.

[0114] The joining of the upper mold (100) and the lower mold (200) of the present invention has been described in the example where the upper mold (100) is raised and lowered, but the lower mold (200) can also be raised and lowered, and at least one of the upper mold (100) and the lower mold (200) can be joined by being raised and lowered.

[0115] Meanwhile, the selective surface treatment device (1000) includes a selective surface treatment device that applies an anode to the material to be treated (P) and a cathode to the lower mold (200) to surface-treat the area of ​​the cap plate, which is the material to be treated (P), to be bonded to the electrode portion, and treats the surface treatment area of ​​the material to be treated (P). This is applicable not only to the structure of the cap plate for joining the electrode portion of the fuel cell as an example, but also to all devices that can maintain airtightness during the surface treatment space, and this example is applicable not only to surface treatment devices that include an oxide film such as anodizing, anodizing, etc., electrolytic plating, etching, etc., but also to all devices that perform surface treatment using a surface treatment solution.

[0116] Hereinafter, a selective surface treatment method according to embodiments of the present invention will be described with reference to a selective surface treatment device. While the selective surface treatment method below is described with reference to a selective surface treatment device for convenience of explanation, its scope is not limited to such a selective surface treatment device.

[0117] Fig. 13 is a flowchart showing a selective surface treatment method according to one embodiment of the present invention, and Figs. 14 to 16 are flowcharts specifically showing steps (a), (b), and (c) of Fig. 13, respectively.

[0118] A selective surface treatment method according to one embodiment of the present invention may include, as illustrated in FIG. 13, (a) a step of preparing a material to be treated (P), (b) a step of filling a surface treatment solution, (c) a step of performing surface treatment, and (d) a step of discharging the surface treatment solution.

[0119] The above step (a) is a step of preparing a material to be processed (P) between the upper mold (100) and the lower mold (200).

[0120] In the above step (a), the processing material (P) is placed on the lower mounting portion (251) formed on the lower insulating portion (250) of the lower mold (200), and the upper mold (100) in which the upper contact portion (151) for pressing the processing material (P) is formed is lowered so that the processing material (P) is positioned between the upper contact portion (151) and the lower mounting portion (251).

[0121] Specifically, as illustrated in FIG. 14, the step (a) may include (a-1) a step of joining the lower insulation module (250) to the lower mold (200), (a-2) a step of settling the material to be processed (P) to the lower mounting portion (251), and (a-3) a step of forming.

[0122] The above step (a-1) is a step in which a lower mounting portion (251) on which a material to be processed (P) is mounted is formed, and a lower insulating module (250) formed by separating from a lower mold (200) is joined to the lower mold (200).

[0123] In the above step (a-1), an insulating module (250) formed of a non-conductive material can be formed in the lower mold (200) so that the material to be treated (P) does not conduct electricity with the lower mold (200). At this time, the insulating module (250) can be formed of a different material from the lower mold (200) formed of a metal material, and the insulating module (250) can be formed by being combined with the lower mold (200), or can be formed in a separate structure and individually combined during each surface treatment process.

[0124] The above step (a-2) is a step of settling the material to be treated (P) on the lower mounting portion (251) of the lower insulation module (250).

[0125] In the above step (a-2), the material to be treated (P) is placed on the lower mounting portion (251) of the lower insulation module (250). At this time, the lower mounting portion (251) can be placed in the correct position along the step-shaped or inclined guide formed on the lower mounting portion (251).

[0126] The above step (a-3) is a step in which an upper contact portion (151) for pressurizing the material to be treated (P) is formed, and the upper mold (100) is lowered and combined with the lower mold (200) to cover the material to be treated with an upper insulating module (150) formed separately from the upper mold (100).

[0127] In the above step (a-3), the upper mold (100) is lowered and combined with the lower mold (200), and an upper contact portion (151) can be combined with the upper portion of the material to be treated (P) inside the selective surface treatment device (1000). At this time, the upper contact portion (151) can be positioned in the correct position along a step-shaped or inclined guide formed on the upper contact portion (251) of the material to be treated (P).

[0128] In the above step (a-3), the individual pressurizing portion (330) protrudes beyond the surface of the upper mold (100) and first comes into contact with the material to be treated (P), and the upper mold (100) is lowered further so that the surface treatment area of ​​the material to be treated (P) can be sealed. At this time, the individual pressurizing portion (330) does not pressurize the material to be treated (P) above a certain load while restraining the material to be treated (P) due to the elastic portion (340) supporting it at the rear end.

[0129] In the above step (a-3), at least a portion of the upper surface of the non-processing area of ​​the material to be processed (P) may be in contact with the upper contact portion (151), and at least another portion may be in contact with the individual pressurizing portion (330). In addition, the lower surface of the non-processing area of ​​the material to be processed (P) may be seated on the lower seating portion (251).

[0130] In the above step (a-3), the upper surface of the surface treatment area of ​​the material to be treated (P) may be exposed to the upper surface treatment space (101), and the lower surface of the surface treatment area of ​​the material to be treated (P) may be exposed to the lower surface treatment space (201).

[0131] The above step (b) is a step of filling the upper surface treatment space (101) and the lower surface treatment space (201) with a surface treatment solution.

[0132] As illustrated in FIG. 15, the step (b) may include a step of (b-1) filling the lower surface treatment space (201) and a step of (b-2) filling the upper surface treatment space (101).

[0133] The above step (b-1) is a step of filling the lower surface treatment space (201) with a surface treatment solution that flows through a lower flow path (220) formed by extending from a solution inlet (210) formed on the outside of the lower mold (200) to the lower surface treatment space (201).

[0134] In the above step (b-1), the surface treatment solution supplied from the solution supply unit can be introduced into the solution inlet unit (210). The introduced surface treatment solution flows into the lower surface treatment space (201) through the lower flow path unit (220), and the lower surface treatment space (201) can be filled with the continuously supplied surface treatment solution.

[0135] When treating multiple materials (P), the surface treatment solution is distributed and flows to each lower surface treatment space (201) through the lower passage (220), and can fill each lower surface treatment space (201).

[0136] Accordingly, the lower surface of the surface treatment area of ​​the material to be treated (P) can be immersed in the surface treatment solution in the lower surface treatment space (201).

[0137] The above step (b-2) is a step in which the surface treatment solution passes through the material to be treated (P) and fills the upper surface treatment space (101).

[0138] The surface treatment solution continuously supplied in the above step (b-2) can flow to the upper surface treatment space (101) through the upper and lower perforated areas of the surface treatment area of ​​the material to be treated (P).

[0139] Accordingly, the upper surface of the surface treatment area of ​​the material to be treated (P) can be immersed in the surface treatment solution in the upper surface treatment space (101). The introduced surface treatment solution fills the upper surface treatment space (101) and, if necessary, can fill up to the upper flow path section (120).

[0140] The above step (c) is a step of applying power to the surface of the material to be treated (P).

[0141] As illustrated in Fig. 16, the step (c) is a step of applying power (c-1) and a step of forming an oxide film (c-2).

[0142] The above step (c-1) is a step of applying power to the conductive member (300) and the lower mold (200) through the individual pressurizing portion (330) formed to directly contact the material to be treated (P) so that the material to be treated (P) becomes positive and the lower mold (200) becomes negative.

[0143] In the above step (c-1), by turning on the power supply to the energizing member (300) from the power supply unit, for example, by applying a positive electrode, current can be applied to the electrode unit (310) of the energizing member (300). The current applied to the electrode unit (310) is transmitted to one or more individual pressurizing units (330) through the electrode distribution unit (320), and the current can be applied to the material to be processed (P) with which the individual pressurizing units (330) are in pressurized contact.

[0144] In the above step (c-1), by applying power to at least a portion of the lower mold (200) from the power supply unit, for example, a cathode may be applied so that at least a portion of the lower mold (200) may have a negative polarity. At least a portion of the lower mold (200) having a negative polarity may be electrically connected to the surface treatment solution contained in the lower surface treatment space (201).

[0145] The above step (c-2) is a step of forming an oxide film on the surface of the treatment material (P) that has come into contact with the treatment solution.

[0146] In the above step (c-2), the current applied from the power supply is transmitted to the individual pressurized portion (330) of the conductive member (300), so that the material to be treated (P) has a positive polarity, and at least a portion of the lower mold (200) has a negative polarity, and the surface treatment solution accommodated in the lower surface treatment space (201) and the upper surface treatment space (101) can be electrolyzed.

[0147] The surface treatment solution contained in the lower surface treatment space (201) and the upper surface treatment space (101) is decomposed into cations and anions, and the metal cations of the material to be treated (P) having a positive polarity are separated, and the anions are combined to form an oxide film.

[0148] The above step (d) is a step of discharging a surface treatment solution.

[0149] In the above step (d), the surface treatment solution can be discharged from the upper surface treatment space (101) through the upper flow path (120) formed by extending from the upper surface treatment space (101) to the solution discharge portion (110) formed on the outside of the upper mold (100).

[0150] According to another embodiment, the surface treatment solution contained in the lower surface treatment space (201) and the upper surface treatment space (101) can be discharged through the solution inlet (210) formed in the lower mold (100) in the step (d).

[0151] According to an embodiment of the present invention, a selective surface treatment device and method maintain a surface treatment area of ​​a material to be treated (P) in a sealed state during surface treatment, and thus, perform surface treatment by allowing the surface treatment solution to flow into the upper surface treatment space (101) and the lower surface treatment space (201), so that the use of excessive surface treatment solution can be reduced, and since the surface treatment solution can be selectively supplied and discharged according to the material to be treated (P) to be surface treated without having to change the overall configuration in which the surface treatment solution is supplied and discharged through the solution inlet (210) and the solution discharge unit (110), the workability and productivity of surface treatment can be improved, and since the surface treatment solution is structured to circulate, the usability of the surface treatment solution can be improved.

[0152] While the present invention has been described with reference to the embodiments illustrated in the drawings, these are merely exemplary, and those skilled in the art will appreciate that various modifications and equivalent alternative embodiments are possible. Therefore, the true scope of technical protection of the present invention should be determined by the technical spirit of the appended claims.

Claims

1. An upper mold having an upper contact portion that pressurizes a material to be treated, an upper surface treatment space in the shape of a groove so that a surface treatment solution can be received in an area of ​​the material to be treated, and an upper channel portion formed as a channel inside so that the surface treatment solution can flow by being connected to the upper surface treatment space; A lower mounting portion is formed where the material to be treated is mounted, a lower surface treatment space in the shape of a groove is formed so that a surface treatment solution can be received in an area of ​​the material to be treated where the surface treatment is to be performed, a lower channel portion is formed inside so that the surface treatment solution can flow by communicating with the lower surface treatment space, and a lower mold is combined with the upper mold; and A conductive member formed on the upper mold so as to contact the material to be treated so as to pressurize the material to be treated and to allow current applied from the power supply to pass through at least a portion of the material to be treated; An optional surface treatment device comprising:

2. In paragraph 1, The above upper mold is, An electrode insertion portion formed by penetrating at least a portion of the upper mold so that an individual pressurizing portion that directly contacts and presses the material to be processed among the above conductive members is inserted; The upper channel portion is formed by extending from the upper surface treatment space to the outside of the upper mold so that the surface treatment solution can be discharged from the upper surface treatment space; and A solution discharge unit connected to the upper portion and formed on the outside of the upper mold to discharge the surface treatment solution; An optional surface treatment device comprising:

3. In paragraph 1, The above upper mold is, The upper contact portion and the upper surface treatment space are formed in multiple numbers so that a plurality of the above-mentioned treatment materials can be processed, The upper euro part above, An optional surface treatment device, each connected to a plurality of the upper surface treatment spaces, and connected to the solution discharge portion by a single path inside the upper mold.

4. In paragraph 1, The above upper mold is, An upper insulating module formed by separating from the upper mold, wherein the upper contact portion is formed so as to cover the above-mentioned material to be processed and pressurizes the above-mentioned material; Including, The above upper insulation module, An electrode penetration portion through which the conductive member protruding from the upper mold is made to contact the material to be processed; and An upper solution receiving section formed by penetrating a position corresponding to the upper passage section so that the upper surface treatment space is formed and the surface treatment solution can flow into the upper passage section; An optional surface treatment device comprising:

5. In paragraph 1, The above lower mold is, The lower channel portion is formed by extending from the outside of the lower mold to the lower surface treatment space so that the surface treatment solution can be supplied to the lower surface treatment space; and A solution inlet connected to the lower flow path and formed on the outside of the lower mold to receive the surface treatment solution from the solution supply portion; An optional surface treatment device comprising:

6. In paragraph 1, The above lower mold is, A lower mounting portion is formed on which the above-mentioned material to be treated is mounted, and a lower insulating module is formed by being separated from the lower mold; Including, The above lower insulation module, A lower solution receiving section formed by penetrating a position corresponding to the lower passage section so that the lower surface treatment space is formed and the surface treatment solution can flow from the lower passage section; An optional surface treatment device comprising:

7. In paragraph 1, The above lower mold is, The lower mounting portion and the lower surface treatment space are formed in multiple numbers so that a plurality of the above-mentioned treatment materials can be processed, The above lower euro part, A selective surface treatment device extending from the above solution inlet portion and branching into a plurality of channels inside the lower mold, each connected to a plurality of the lower surface treatment spaces.

8. In paragraph 1, The above-mentioned power failure is, A selective surface treatment device, wherein a plurality of individual pressurizing sections are formed to pressurize both sides of the material to be treated by directly contacting the material to be treated.

9. In paragraph 8, The above-mentioned power failure is, A selective surface treatment device in which power is applied to at least one of the individual pressurizing units formed in a plurality from the power supply unit, and polarity is applied to the material to be treated through the individual pressurizing unit to which power is applied.

10. In paragraph 1, The above-mentioned power failure is, An electrode part connected to the above power supply part; Individual pressurizing parts formed in multiple pieces so as to be connected to the electrode part and pressurize the material to be processed by directly contacting it; and An electrode distribution unit that transmits current to the individual pressurizing units formed in multiple pieces in the electrode unit; An optional surface treatment device comprising:

11. In paragraph 1, The above-mentioned power failure is, An elastic member formed to support an individual pressurizing member formed to directly contact and pressurize the material to be treated, and formed to be compressed according to the thickness of the material to be treated so that the individual pressurizing member can be raised and lowered relative to the upper mold; An optional surface treatment device comprising:

12. In paragraph 1, The above-mentioned power failure is, A height adjusting member connected to the individual pressing member to adjust the height of the individual pressing member formed to directly contact and pressurize the material to be processed, and threadedly connected inside the conductive member to adjust the height of the individual pressing member through rotation; An optional surface treatment device comprising:

13. A selective surface treatment method using a selective surface treatment device including an upper mold having an upper contact portion that pressurizes a material to be treated, an upper surface treatment space in a groove shape so that a surface treatment solution can be received in an area of ​​the material to be treated, and an upper channel portion formed inside as a channel so that the surface treatment solution can flow through it while communicating with the upper surface treatment space, a lower mounting portion on which the material to be treated is settled, a lower surface treatment space in a groove shape so that a surface treatment solution can be received in an area of ​​the material to be treated, and a lower channel portion formed inside as a channel so that the surface treatment solution can flow through it while communicating with the lower surface treatment space, a lower mold that is joined with the upper mold, and a conductive member formed in the upper mold so that it contacts the material to be treated so as to pressurize it and allows current applied from a power source to pass through at least a portion of the material to be treated, (a) a step of preparing the material to be processed between the upper mold and the lower mold; (b) a step of filling the upper surface treatment space and the lower surface treatment space with the surface treatment solution; (c) a step of applying power to the surface of the material to be treated; and (d) a step of discharging the surface treatment solution; An optional surface treatment method comprising:

14. In paragraph 13, Step (a) above, (a-1) a step of forming the lower mounting portion on which the material to be processed is mounted, and combining the lower insulating module formed separately from the lower mold to the lower mold; (a-2) a step of mounting the above-mentioned material on the lower mounting portion of the lower insulation module; and (a-3) A step of lowering the upper mold and joining it with the lower mold so that the upper contact portion pressurizing the material to be processed is formed and the upper insulating module formed separately from the upper mold covers the material to be processed; An optional surface treatment method comprising:

15. In paragraph 13, Step (b) above, (b-1) a step of filling the lower surface treatment space with the surface treatment solution flowing through the lower flow path formed by extending from the solution inlet formed on the outside of the lower mold to the lower surface treatment space; and (b-2) a step of allowing the surface treatment solution to pass through the material to be treated and fill the upper surface treatment space; An optional surface treatment method comprising:

16. In paragraph 13, Step (c) above, (c-1) a step of applying power to the conductive member and the lower mold so that the material to be treated becomes positive and the lower mold becomes negative through a separate pressurizing section formed to directly contact the material to be treated; and (c-2) a step of forming an oxide film on the surface of the treatment material in contact with the treatment solution; An optional surface treatment method comprising:

17. In paragraph 13, In step (d) above, A selective surface treatment method for discharging the surface treatment solution from the upper surface treatment space through the upper flow path formed by extending from the upper surface treatment space to a solution discharge portion formed on the outside of the upper mold.

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