Optical module

Abstract

Provided in the present disclosure is an optical module, comprising: a lower housing, which is covered with an upper housing to form a cavity; a circuit board, which is located in the cavity; and a light-emitting component, which is located in the cavity, is electrically connected to the circuit board, and comprises a plurality of light-emitting chips and a multiplexing assembly, wherein the plurality of light-emitting chips are configured to emit different wavelength signal light, and the multiplexing assembly is located on a light-emergent side of the light-emitting chips; the multiplexing assembly comprises a plurality of filters, and the plurality of filters are configured to reflect and / or transmit the different wavelength signal light, so as to perform beam-combining processing on a plurality of pieces of different wavelength signal light; or the multiplexing assembly comprises a reflection assembly, and the reflection assembly is configured to reflect and / or transmit the different wavelength signal light, so as to perform beam-combining processing on a plurality of pieces of different wavelength signal light.

Description

optical modules

[0001] This application claims the priority of application number 202323186443.8 filed with the China Patent Office on November 23, 2023; the priority of application number 202323173880.6 filed with the China Patent Office on November 23, 2023; and the priority of application number 202323186404.8 filed with the China Patent Office on November 23, 2023; all of which are incorporated by reference into this application. Technical Field

[0002] The present disclosure relates to the field of optical fiber communication technology, and in particular to an optical module. Background Art

[0003] With the development of new services and applications such as cloud computing, mobile internet, and video, the advancement of optical communication technology has become increasingly important. In optical communication technology, optical modules are tools for converting optical and electrical signals, making them key components in optical communication equipment. Furthermore, with the advancement of optical communication technology, the transmission rates of optical modules are constantly increasing. Generally, high-speed optical modules have higher integration density than lower-speed modules. For example, multi-channel optical transceiver technology can be used to concentrate more optical transmission components and optical storage components within the module.

[0004] Summary of the Invention

[0005] An embodiment of the present disclosure provides an optical module, including:

[0006] Upper shell,

[0007] A lower shell, covering the upper shell to form a cavity;

[0008] A circuit board is located in the cavity.

[0009] a light emitting component located in the cavity and electrically connected to the circuit board, the light emitting component comprising a plurality of light emitting chips and a multiplexing component, the plurality of light emitting chips being configured to emit signal light of different wavelengths, the multiplexing component being located on a light emitting side of the light emitting chip;

[0010] The multiplexing component includes a plurality of filters, and the plurality of filters are configured to reflect and / or transmit signal lights of different wavelengths so as to combine the signal lights of multiple different wavelengths for beam combining;

[0011] Alternatively, the multiplexing component includes a reflection component, and the reflection component is configured to reflect and / or transmit signal lights of different wavelengths to combine multiple signal lights of different wavelengths for beam combining. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] In order to more clearly illustrate the technical solutions of the embodiments of the present disclosure, the following briefly introduces the drawings required for use in the embodiments or descriptions of the prior art. Obviously, the drawings described below are only some embodiments of the present disclosure. For ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.

[0013] FIG1 is a partial architecture diagram of an optical communication system provided according to some embodiments of the present disclosure;

[0014] FIG2 is a partial structural diagram of a host computer provided according to some embodiments of the present disclosure;

[0015] FIG3 is a schematic structural diagram of an optical module provided according to some embodiments of the present disclosure;

[0016] FIG4 is an exploded view of an optical module according to some embodiments of the present disclosure;

[0017] FIG5 is a schematic diagram of the internal structure of an optical module according to some embodiments of the present disclosure;

[0018] FIG6 is a schematic diagram of an exploded internal structure of an optical module according to some embodiments of the present disclosure;

[0019] FIG7 is a schematic structural diagram of a light emitting component according to some embodiments of the present disclosure;

[0020] FIG8 is a first exploded schematic diagram of a light emitting component according to some embodiments of the present disclosure;

[0021] FIG9 is a second exploded schematic diagram of a light emitting component according to some embodiments of the present disclosure;

[0022] FIG10 is a schematic diagram of a partial structure of a light emitting component according to some embodiments of the present disclosure;

[0023] FIG11 is a second schematic diagram of a partial structure of a light emitting component according to some embodiments of the present disclosure;

[0024] FIG12 is a third schematic diagram of a partial structure of another light emitting component provided according to some embodiments of the present disclosure;

[0025] FIG13 is a first schematic diagram of a multiplexing component provided according to some embodiments of the present disclosure;

[0026] FIG14 is a first schematic diagram of a decomposition of a multiplex component according to some embodiments of the present disclosure;

[0027] FIG15 is a second schematic diagram of a multiplexing component provided according to some embodiments of the present disclosure;

[0028] FIG16 is a schematic diagram of an optical path of a multiplexing component according to some embodiments of the present disclosure;

[0029] FIG17 is a third schematic diagram of a multiplexing component provided according to some embodiments of the present disclosure;

[0030] FIG18 is a schematic diagram of the internal structure of an optical module according to some embodiments of the present disclosure;

[0031] FIG19 is a cross-sectional view of a light emitting component according to some embodiments of the present disclosure;

[0032] FIG20 is an exploded schematic diagram of a light emitting device according to some embodiments of the present disclosure;

[0033] FIG21 is a partial schematic diagram 1 of a light emitting device according to some embodiments of the present disclosure;

[0034] FIG22 is a second partial schematic diagram of a light emitting device according to some embodiments of the present disclosure;

[0035] FIG23 is a schematic diagram of an optical path of a light emitting device according to some embodiments of the present disclosure;

[0036] FIG24 is a schematic diagram of an exploded view of a beam combiner according to some embodiments of the present disclosure. DETAILED DESCRIPTION

[0037] The following will be combined with the accompanying drawings to clearly and completely describe the technical solutions in some embodiments of the present disclosure. Obviously, the embodiments described are only some embodiments of the present disclosure, not all embodiments. Based on the embodiments provided by the present disclosure, all other embodiments obtained by ordinary technicians in this field are within the scope of protection of the present disclosure.

[0038] Unless the context requires otherwise, throughout the specification and claims, the term "comprise" and its other forms, such as the third person singular form "comprises" and the present participle form "comprising", are to be interpreted as open and inclusive, that is, "including, but not limited to". In the description of the specification, the terms "one embodiment", "some embodiments", "exemplary embodiments", "example", "specific example" or "some examples" are intended to indicate that the particular features, structures, materials or characteristics associated with the embodiment or example are included in at least one embodiment or example of the present disclosure. The schematic representation of the above terms does not necessarily refer to the same embodiment or example. In addition, the particular features, structures, materials or characteristics may be included in any one or more embodiments or examples in any appropriate manner.

[0039] In the following, the terms "first" and "second" are used for descriptive purposes only and should not be understood to indicate or imply relative importance or implicitly specify the number of the technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of the embodiments of the present disclosure, unless otherwise specified, "plurality" means two or more.

[0040] When describing some embodiments, the expressions "coupled" and "connected" and their derivatives may be used. For example, when describing some embodiments, the term "connected" may be used to indicate that two or more components are in direct physical or electrical contact with each other. For another example, when describing some embodiments, the term "coupled" may be used to indicate that two or more components are in direct physical or electrical contact. However, the term "coupled" or "communicatively coupled" may also refer to two or more components that are not in direct contact with each other, but still cooperate or interact with each other. The embodiments disclosed herein are not necessarily limited to the contents of this document.

[0041] “At least one of A, B and C” has the same meaning as “at least one of A, B or C” and both include the following combinations of A, B and C: A only, B only, C only, the combination of A and B, the combination of A and C, the combination of B and C, and the combination of A, B and C.

[0042] “A and / or B” includes the following three combinations: A only, B only, and a combination of A and B.

[0043] The use of "adapted to" or "configured to" herein is intended to be open and inclusive language that does not exclude devices adapted or configured to perform additional tasks or steps.

[0044] As used herein, "about," "substantially," or "approximately" includes the stated value and an average value that is within an acceptable range of deviation from the particular value as determined by one of ordinary skill in the art taking into account the measurements in question and the errors associated with the measurement of the particular quantity (i.e., the limitations of the measurement system).

[0045] In optical communication technology, to establish information transmission between information processing devices, it is necessary to load the information onto light and use the propagation of light to achieve information transmission. Here, the light loaded with information is an optical signal. When transmitting optical signals within information transmission equipment, they can reduce optical power loss, thereby enabling high-speed, long-distance, and low-cost information transmission. The signals that information processing equipment can recognize and process are electrical signals. Information processing equipment typically includes optical network units (ONUs), gateways, routers, switches, mobile phones, computers, servers, tablets, televisions, etc., and information transmission equipment typically includes optical fibers and optical waveguides.

[0046] Optical modules can convert optical signals into electrical signals between information processing devices and information transmission devices. For example, at least one of the optical signal input or output ends of an optical module is connected to an optical fiber, and at least one of the electrical signal input or output ends of the optical module is connected to an optical network terminal. A first optical signal from the optical fiber is transmitted to the optical module, which converts the first optical signal into a first electrical signal and transmits the first electrical signal to the optical network terminal. A second electrical signal from the optical network terminal is transmitted to the optical module, which converts the second electrical signal into a second optical signal and transmits the second optical signal to the optical fiber. Because multiple information processing devices can transmit information via electrical signals, at least one of the multiple information processing devices needs to be directly connected to the optical module, rather than all of them. Here, the information processing device directly connected to the optical module is referred to as the optical module's host computer. Furthermore, the optical signal input or output end of the optical module can be referred to as an optical port, and the electrical signal input or output end of the optical module can be referred to as an electrical port.

[0047] Figure 1 is a partial architecture diagram of an optical communication system according to some embodiments of the present disclosure. As shown in Figure 1, the optical communication system partially comprises a remote information processing device 1000, a local information processing device 2000, a host computer 100, an optical module 200, an optical fiber 101, and a network cable 103.

[0048] One end of optical fiber 101 extends toward remote information processing device 1000, and the other end connects to the optical interface of optical module 200. Optical signals can undergo total internal reflection within optical fiber 101, maintaining nearly their original optical power as they propagate in the direction of total internal reflection. Multiple total internal reflections within optical fiber 101 transmit optical signals from the direction of remote information processing device 1000 into optical module 200, or transmit light from optical module 200 toward remote information processing device 1000, enabling long-distance, low-power information transmission.

[0049] The number of optical fibers 101 may be one or more (two or more); the optical fiber 101 and the optical module 200 may be connected in a pluggable movable manner or in a fixed manner.

[0050] The host computer 100 has an optical module interface 102, which is configured to connect to the optical module 200, so that the host computer 100 establishes a unidirectional / bidirectional electrical signal connection with the optical module 200; the host computer 100 is configured to provide data signals to the optical module 200, or receive data signals from the optical module 200, or monitor and control the working status of the optical module 200.

[0051] The host computer 100 has an external electrical interface, such as a Universal Serial Bus (USB) interface and a network cable interface 104, which can be connected to an electrical signal network. For example, the network cable interface 104 is configured to connect to a network cable 103, thereby establishing a unidirectional / bidirectional electrical signal connection between the host computer 100 and the network cable 103.

[0052] Optical Network Unit (ONU), Optical Line Terminal (OLT), Optical Network Equipment (ONT) and data center servers are common host computers.

[0053] One end of the network cable 103 is connected to the local information processing device 2000 , and the other end is connected to the host computer 100 . The network cable 103 establishes an electrical signal connection between the local information processing device 2000 and the host computer 100 .

[0054] For example, the third electrical signal emitted by the local information processing device 2000 is transmitted to the host computer 100 through the network cable 103. The host computer 100 generates a second electrical signal based on the third electrical signal. The second electrical signal from the host computer 100 is transmitted into the optical module 200. The optical module 200 converts the second electrical signal into a second optical signal. The optical module 200 transmits the second optical signal into the optical fiber 101. The second optical signal is transmitted to the remote information processing device 1000 in the optical fiber 101.

[0055] For example, a first optical signal from the direction of the remote information processing device 1000 propagates through the optical fiber 101, and the first optical signal from the optical fiber 101 is transmitted into the optical module 200. The optical module 200 converts the first optical signal into a first electrical signal. The optical module 200 transmits the first electrical signal into the host computer 100. The host computer 100 generates a fourth electrical signal based on the first electrical signal, and the host computer 100 transmits the fourth electrical signal to the local information processing device 2000.

[0056] Optical modules are tools for converting optical signals into electrical signals. During this conversion process, the information remains unchanged, but the encoding and decoding methods of the information can change.

[0057] FIG2 is a partial structural diagram of a host computer provided according to some embodiments of the present disclosure. In order to clearly illustrate the connection relationship between the optical module 200 and the host computer 100, FIG2 only shows the structure of the host computer 100 related to the optical module 200. As shown in FIG2, the host computer 100 also includes a PCB circuit board 105 disposed within the housing, a cage 106 disposed on the surface of the PCB circuit board 105, a heat sink 107 disposed on the cage 106, and an electrical connector (not shown) disposed inside the cage 106. The heat sink 107 has a raised structure that increases the heat dissipation area. A fin-like structure is a common raised structure.

[0058] Optical module 200 is inserted into cage 106 of host computer 100. Cage 106 secures optical module 200, and heat generated by optical module 200 is transferred to cage 106 and then dissipated through heat sink 107. After optical module 200 is inserted into cage 106, the electrical interface of optical module 200 connects to the electrical connector inside cage 106.

[0059] Figure 3 is a structural diagram of an optical module provided according to some embodiments of the present disclosure, and Figure 4 is an exploded schematic diagram of an optical module provided according to some embodiments of the present disclosure. As shown in Figures 3 and 4, the optical module 200 includes a housing, a circuit board 300 disposed within the housing, a light emitting component 400, and an optical receiving component 500. However, the present disclosure is not limited thereto. In some embodiments, the optical module 200 includes either the light emitting component 400 or the optical receiving component 500.

[0060] The housing includes an upper housing 201 and a lower housing 202 . The upper housing 201 covers the lower housing 202 to form the housing with two openings. The outer contour of the housing is generally a square.

[0061] In some embodiments of the present disclosure, the lower shell 202 includes a base plate 2021 and two lower side plates 2022 located on both sides of the base plate 2021 and arranged perpendicular to the base plate 2021; the upper shell 201 includes a cover plate 2011, and the cover plate 2011 covers the two lower side plates 2022 of the lower shell 202 to form the above-mentioned shell.

[0062] In some embodiments, the lower shell 202 includes a base plate 2021 and two lower side plates 2022 located on both sides of the base plate 2021 and arranged perpendicularly to the base plate 2021; the upper shell 201 includes a cover plate 2011 and two upper side plates located on both sides of the cover plate 2011 and arranged perpendicularly to the cover plate 2011. The two upper side plates are combined with the two lower side plates 2022 to achieve the upper shell 201 covering the lower shell 202.

[0063] The direction of the line connecting the two openings 203 and 204 can be consistent with the length direction of the optical module 200, or it can be inconsistent with the length direction of the optical module 200. For example, the opening 203 is located at the end of the optical module 200 (the right end in FIG3 ), and the opening 204 is also located at the end of the optical module 200 (the left end in FIG3 ). Alternatively, the opening 203 is located at the end of the optical module 200, and the opening 204 is located on the side of the optical module 200. The opening 203 is an electrical port, from which the gold finger of the circuit board 300 extends and is inserted into the host computer (for example, the optical network terminal 100); the opening 204 is an optical port, which is configured to receive the optical fiber 101 so that the optical fiber 101 can connect to the optical emitting component 400 and / or the optical receiving component 500 in the optical module 200.

[0064] The combined assembly of the upper and lower housings 201 and 202 facilitates the installation of components such as the circuit board 300, the light-emitting component 400, and the optical receiving component 500 into the housing, with the upper and lower housings 201 and 202 providing encapsulation and protection for these components. Furthermore, during the assembly of the circuit board 300, the light-emitting component 400, and the optical receiving component 500, the positioning components, heat dissipation components, and electromagnetic shielding components of these components are easily arranged, facilitating automated production.

[0065] In some embodiments, the upper shell 201 and the lower shell 202 are generally made of metal materials, which are conducive to electromagnetic shielding and heat dissipation.

[0066] In some embodiments, the optical module 200 further includes an unlocking component 600 located outside its housing. The unlocking component 600 is configured to achieve a fixed connection between the optical module 200 and the host computer, or to release the fixed connection between the optical module 200 and the host computer.

[0067] Exemplarily, the unlocking component 600 is located at the end of the lower housing 202 and has a snap-fitting component that mates with the host computer cage (e.g., the cage 106 of the optical network terminal 100). When the optical module 200 is inserted into the host computer cage, the snap-fitting component of the unlocking component 600 secures the optical module 200 in the host computer cage. When the unlocking component 600 is pulled, it rotates, causing the snap-fitting component of the unlocking component 600 to move accordingly, thereby changing the connection between the snap-fitting component and the host computer, thereby releasing the snap-fitting relationship between the optical module 200 and the host computer, thereby allowing the optical module 200 to be removed from the host computer cage. In some embodiments, the unlocking component 600 is located on the outer walls of the two lower side panels 2022 of the lower housing 202 and has a snap-fitting component that mates with the host computer cage (e.g., the cage 106 of the optical network terminal 100).

[0068] The circuit board 300 includes circuit traces, electronic components, and chips. The circuit traces connect the electronic components and chips together according to the circuit design to achieve functions such as power supply, electrical signal transmission, and grounding. Electronic components include, for example, capacitors, resistors, transistors, and metal-oxide-semiconductor field-effect transistors (MOSFETs). Chips include, for example, microcontroller units (MCUs), laser driver chips, limiting amplifiers (LAs), clock and data recovery (CDR) chips, power management chips, and digital signal processing (DSP) chips.

[0069] The circuit board 300 is generally a rigid circuit board. Due to its relatively hard material, the rigid circuit board can also realize the bearing function. For example, the rigid circuit board can stably carry the above-mentioned electronic components and chips; the rigid circuit board can also be inserted into the electrical connector in the upper computer cage.

[0070] The circuit board 300 also includes gold fingers formed on its end surfaces. The gold fingers are composed of multiple independent pins. The circuit board 300 is inserted into the cage 106, and the gold fingers are electrically connected to the electrical connector inside the cage 106. The gold fingers can be provided only on one side of the circuit board 300 (for example, the upper surface shown in FIG4 ), or they can be provided on both the upper and lower surfaces of the circuit board 300 to accommodate applications requiring a large number of pins. The gold fingers are configured to establish an electrical connection with the host computer to achieve power supply, grounding, I2C signal transmission, data signal transmission, etc.

[0071] Of course, some optical modules also use flexible circuit boards. Flexible circuit boards are generally used in conjunction with rigid circuit boards to supplement the rigid circuit boards. For example, a flexible circuit board can be used to connect the rigid circuit board to the light emitting component 400.

[0072] In some embodiments of the present disclosure, the optical emitting component 400 is configured to transmit optical signals, and the optical receiving component 500 is configured to receive optical signals. For example, the optical emitting component 400 and the optical receiving component 500 are combined to form an integrated optical transceiver component. Of course, in embodiments of the present disclosure, the optical emitting component and the optical receiving component can also be separated, that is, the optical emitting component and the optical receiving component do not share a housing.

[0073] FIG5 is a schematic diagram of the internal structure of an optical module provided according to some embodiments of the present disclosure, and FIG6 is a schematic diagram of the exploded internal structure of an optical module provided according to some embodiments of the present disclosure. As shown in FIG5 and FIG6, one end of the optical receiving component 500 is connected to the optical fiber adapter 700, and the other end of the optical receiving component 500 is connected to the optical emitting component 400. The optical signal generated by the optical emitting component 400 is first transmitted to the optical receiving component 500, then transmitted to the optical fiber adapter 700 through the optical receiving component 500, and finally output through the optical fiber adapter 700; the external input optical signal is input to the optical receiving component 500 through the optical fiber adapter 700, so that the optical receiving component 500 and the optical emitting component 400 share the optical fiber adapter 700, and thus the uplink optical signal and the downlink optical signal of the optical module share the optical fiber 101.

[0074] In some embodiments of the present disclosure, the optical emitting component 400 can generate optical signals of multiple wavelengths, and the optical signals of multiple wavelengths can be combined into a single optical signal. The optical receiving component 500 can receive optical signals of multiple wavelengths. For example, the optical emitting component 400 generates optical signals of three wavelengths, and the optical receiving component 500 receives optical signals of three wavelengths.

[0075] As shown in Figures 5 and 6, the optical receiving component 500 includes a first housing 510 and a first upper cover that are connected to form a first cavity, and also includes a first light receiving component 520, a second light receiving component 530, and a third light receiving component 540. The first cavity formed by the first housing 510 and the first upper cover has an internal cavity for accommodating components. In some embodiments, the first housing 510 has an internal cavity, so that the first upper cover covers the first housing 510 to form the internal cavity.

[0076] In some embodiments, the first shell 510 connects the light emitting component 400, the first light receiving component 520, the second light receiving component 530 and the third light receiving component 540 to realize the packaging of the light emitting component 400, the first light receiving component 520, the second light receiving component 530 and the third light receiving component 540 through the first shell 510, and realize the optical connection between the light emitting component 400, the first light receiving component 520, the second light receiving component 530 and the third light receiving component 540 and the inside of the first cavity respectively.

[0077] In some embodiments, the optical module 200 is configured to receive a beam of optical signals including three wavelength ranges and to transmit a beam of optical signals including three wavelength ranges. For example, the optical transmitting component 400 is configured to output a beam of optical signals including a first wavelength, a second wavelength, and a third wavelength, the first optical receiving component 520 is configured to receive an optical signal at a fourth wavelength, the second optical receiving component 530 is configured to receive an optical signal at a fifth wavelength, and the third optical receiving component 540 is configured to receive an optical signal at a sixth wavelength.

[0078] In some embodiments, the light emitting component 400 is packaged in a micro-optical package, and the first light receiving component 520, the second light receiving component 530, and the third light receiving component 540 are packaged in a coaxial package. Exemplarily, the receiving optical axes of the first light receiving component 520, the second light receiving component 530, and the third light receiving component 540 are parallel to each other.

[0079] In some embodiments, the light emitting component 400 , the first light receiving component 520 , the second light receiving component 530 , and the third light receiving component 540 are electrically connected to the circuit board 300 through flexible circuit boards, respectively.

[0080] In some embodiments, the first side of the first housing 510 is connected to the fiber optic adapter 700, the second side of the first housing 510 is provided with the first light receiving component 520, the second light receiving component 530, and the third light receiving component 540, and the third side of the first housing 510 is provided with the light emitting component 400. For example, the first side of the first housing 510 is adjacent to the optical port of the optical module, the second side of the first housing 510 is adjacent to the lower side plate 2022 of the lower housing 202, and the third side of the first housing 510 is adjacent to the electrical port of the optical module.

[0081] In some embodiments, a first connection hole is provided on the first side of the first housing 510, a second connection hole is provided on the second side of the first housing 510, a third connection hole is provided on the third side of the first housing 510, and a fifth connection hole is provided on the third side of the first housing 510. The first, second, third, fourth, and fifth connection holes are respectively connected to the inner cavity of the first housing 510. The other end of the fiber optic adapter 700 is connected to the first connection hole; the first light receiving component 520 is connected to the second connection hole; the second light receiving component 530 is connected to the third connection hole; the third light receiving component 540 is connected to the fourth connection hole; and the light emitting component 400 is connected to the fifth connection hole. For example, the second, third, and fourth connection holes are arranged in sequence on the second side of the first housing 510.

[0082] Figure 7 is a schematic diagram of the structure of a light emitting component provided according to some embodiments of the present disclosure. Figure 8 is a first exploded schematic diagram of a light emitting component provided according to some embodiments of the present disclosure. As shown in Figures 7 and 8, the light emitting component 400 includes a second cavity 410, which includes a second shell 411 and a second upper cover 412. The second shell 411 forms an inner cavity, and the second upper cover 412 covers and connects to the second shell 411, forming a relatively sealed cavity structure with the second shell 411.

[0083] A connecting portion 4112 is provided on the side of the second cavity 410 , and the second cavity 410 is connected to the first shell 510 via the connecting portion 4112 , so that the connection between the second cavity 410 and the first shell 510 is conveniently achieved through the connecting portion 4112 .

[0084] As shown in Figure 8, a fixing surface 4111 is provided on the top of the second shell 411, and the second upper cover 412 is fixedly connected to the fixing surface 4111, for example, it can be fixedly connected by gluing; a first through hole 4113 is provided on the second shell 411, and the first through hole 4113 is connected to the inner cavity of the second shell 411, and the first through hole 4113 is connected to the connecting part 4112, and the first through hole 4113 is connected to the fifth connecting hole through the connecting part 4112, and the first through hole 4113 is used to output optical signals.

[0085] Figure 9 is a second exploded schematic diagram of an optical transmission component according to some embodiments of the present disclosure. As shown in Figure 9, in some embodiments, optical transmission component 400 includes an isolator 420. Exemplarily, isolator 420 is disposed in first through-hole 4113. Isolator 420 seals first through-hole 4113 and prevents optical signals output from the first cavity through the fifth connection hole from entering the second cavity 410.

[0086] In some embodiments, a transfer block 430 is disposed at the other end of the second housing 411. The transfer block 430 is used to electrically connect the electrical components within the second cavity 410 to the circuit board 300. Exemplarily, the transfer block 430 is embedded in the other end of the second housing 411, i.e., the end opposite the first through-hole 4113. Of course, the transfer block 430 can also be disposed on the side of the second housing 411 adjacent to the first through-hole 4113, without limitation. One end of the transfer block 430 extends into the second housing 411, while the other end of the transfer block 430 is located outside the second housing 411. The transfer block 430 is electrically connected to the circuit board 300 via the flexible printed circuit board.

[0087] In some embodiments, the transfer block 430 is formed of a ceramic substrate, but is not limited to a ceramic substrate.

[0088] As shown in FIG9 , the other end of the second housing 411 (the end opposite the first through hole 4113) is provided with an opening that passes through the other end of the second housing 411. One end of the adapter block 430 is embedded in the opening, that is, one end of the adapter block 430 passes through the opening and extends into the inner cavity of the second housing 411.

[0089] In some embodiments, a laser assembly is disposed within the interior of the second housing 411, positioned adjacent to one end of the adapter block 430 to facilitate electrical connection of the laser assembly to the adapter block 430. The laser assembly is configured to transmit multiple optical signals of varying wavelengths. Exemplarily, the laser assembly is connected to the adapter block 430 via bonding wires.

[0090] In some embodiments, a multiplexing component 460 is further provided in the inner cavity of the second housing 411 , and the multiplexing component 460 is used to combine multiple optical signals of different wavelengths emitted by the laser component into one transmitted optical signal.

[0091] In some embodiments, the light emitting component 400 further includes a collimating lens, which is disposed on the optical path from the laser component to the multiplexing component 460 , and is used to collimate the optical signal generated by the laser component and transmit it to the light input port of the multiplexing component 460 .

[0092] Figure 10 is a schematic diagram of a partial structure of an optical emitting component according to some embodiments of the present disclosure. In some embodiments, as shown in Figure 10 , the laser assembly includes a first laser assembly 451, a second laser assembly 452, and a third laser assembly 453. Second laser assembly 452 is located between first laser assembly 451 and third laser assembly 453. The light emission directions of first laser assembly 451, second laser assembly 452, and third laser assembly 453 are toward multiplexing assembly 460.

[0093] In some embodiments, the first laser assembly 451 emits a first wavelength optical signal, the second laser assembly 452 emits a second wavelength optical signal, and the third laser assembly 453 emits a third wavelength optical signal. The optical axes of the first, second, and third wavelength optical signals are parallel to the longitudinal extension direction of the second housing. For example, the wavelength of the first wavelength optical signal is in the range of 1340-1344 nm, such as 1342 nm; the wavelength of the second wavelength optical signal is in the range of 1480-1500 nm, such as 1490 nm; and the wavelength of the third wavelength optical signal is in the range of 1575-1580 nm, such as 1577 nm.

[0094] In some embodiments, the transmission rate of the first laser assembly 451 is greater than the transmission rate of the third laser assembly 453, and the transmission rate of the third laser assembly 453 is greater than the transmission rate of the second laser assembly 452. For example, the transmission rate of the first laser assembly 451 is 10G, the transmission rate of the second laser assembly 452 is 2.5G, and the transmission rate of the third laser assembly 453 is 50G.

[0095] In some embodiments, the light-emitting end faces of the first laser assembly 451 , the second laser assembly 452 , and the third laser assembly 453 are flush, that is, the light-emitting end faces of the first laser assembly 451 , the second laser assembly 452 , and the third laser assembly 453 are located on the same length surface of the second shell 411 .

[0096] In some embodiments, the light-emitting end faces of the first laser assembly 451 and the second laser assembly 452 are flush, that is, the light-emitting end faces of the first laser assembly 451 and the second laser assembly 452 are located on the same length plane of the second housing 411. The light-emitting end faces of the second laser assembly 452 and the third laser assembly 453 are not flush, that is, the light-emitting end faces of the third laser assembly 453 and the second laser assembly 452 are located on different length planes of the second housing 411.

[0097] In some embodiments, the light emitting component 400 further includes a thermoelectric cooler (TEC) 470 . The TEC 470 is disposed in the inner cavity of the second housing 411 and below the laser assembly. The TEC 470 is used to adjust the temperature of the laser assembly.

[0098] In some embodiments, the light emitting component 400 further includes a support plate 480 , the top of the TEC 470 is fixedly connected to the support plate 480 , and the first laser assembly 451 , the second laser assembly 452 and the third laser assembly 453 are disposed on the support plate 480 .

[0099] In some embodiments, the collimating lens 490 includes a first collimating lens 491, a second collimating lens 492 and a third collimating lens 493. The first collimating lens 491 is arranged on the transmission optical path from the first laser component 451 to the multiplexing component 460, the second collimating lens 492 is arranged on the transmission optical path from the second laser component 452 to the multiplexing component 460, and the third collimating lens 493 is arranged on the transmission optical path from the third laser component 453 to the multiplexing component 460.

[0100] In some embodiments, the first collimating lens 491, the second collimating lens 492 and the third collimating lens 493 are set on the support plate 480. Of course, the embodiments of the present disclosure are not limited to the first collimating lens 491, the second collimating lens 492 and the third collimating lens 493 being set on the support plate 480.

[0101] In some embodiments, the reusing assembly 460 is disposed on a support plate 480 .

[0102] FIG11 is a second schematic diagram of a partial structure of an optical transmission component provided according to some embodiments of the present disclosure. FIG11 is a schematic diagram from another angle of FIG10 . In some examples, as shown in FIG10 and FIG11 , the multiplexing component 460 includes: a first filter 461, a second filter 462, a third filter 463, and a fourth filter 464. The arrows in FIG11 indicate the direction of light. The first laser component 451 includes a first optical transmission chip 4511, which emits a first wavelength signal light. The first collimating lens 491 is located in the light output direction of the first optical transmission chip 4511, and the first collimating lens 491 collimates the first wavelength signal light emitted by the first optical transmission chip 4511. The first filter 461 is located on the other side of the first collimating lens 491 and reflects the first wavelength signal light.

[0103] For ease of description, the angle of the filter refers to the angle between the normal line of the filter and the propagation direction of the collimated first wavelength signal light. The propagation direction of the first wavelength signal light is the length direction of the light emitting component.

[0104] For example, the first filter reflects the signal light of the first wavelength, and the angle between the normal line of the first filter and the length direction of the light emitting component is 45°.

[0105] The second laser assembly 452 includes a second light emitting chip 4521, which emits signal light of a second wavelength. A second collimating lens 492 is located in the light-emitting direction of the second light emitting chip 4521 and collimates the signal light of the second wavelength emitted by the second light emitting chip 4521. A second filter 462 is located on the other side of the second collimating lens 492, and the signal light of the second wavelength is transmitted through the second filter. The second filter 462 is also arranged parallel to the first filter 461. After being reflected by the first filter, the signal light of the first wavelength is directed toward the second filter 462. The second filter reflects the signal light of the first wavelength.

[0106] For example, the second filter reflects the signal light of the first wavelength, and the angle between the normal line of the second filter and the length direction of the light emitting component is 45°. The second filter transmits the signal light of the second wavelength.

[0107] The third filter 463 is located on the light-emitting side of the second filter 462. The second wavelength signal light passes through the second filter and then passes through the third filter 463. The first wavelength signal light is reflected by the second filter and then passes through the third filter 463.

[0108] The third laser assembly 453 includes a third light emitting chip 4531, which emits signal light of a third wavelength. A third collimating lens 493 is located in the light-emitting direction of the third light emitting chip 4531 and collimates the signal light of the third wavelength emitted by the third light emitting chip 4531. A fourth filter 464 is located on the other side of the third collimating lens 493, and the signal light of the third wavelength is reflected by the fourth filter. The fourth filter 464 is also arranged parallel to the third filter 463. After being reflected by the fourth filter, the signal light of the third wavelength is directed toward the third filter 463.

[0109] The third filter 463 reflects the third wavelength signal light, and transmits the first wavelength signal light and the second wavelength signal light.

[0110] In some embodiments, the first wavelength signal light emitted by the first light emitting chip 4511 is collimated by the first collimating lens 491 , reflected by the first filter, reflected by the second filter, transmitted through the third filter, and then enters the first shell 510 from the second cavity 410 .

[0111] The second wavelength signal light emitted by the second light emitting chip 4521 is collimated by the second collimating lens 492 , passes through the second filter and the third filter, and enters the first housing 510 from the second cavity 410 .

[0112] The third wavelength signal light emitted by the third light emitting chip 4531 is collimated by the third collimating lens 493 , reflected by the fourth filter 464 , and then reflected by the third filter before entering the first housing 510 from the second cavity 410 .

[0113] In some embodiments, the angle between the second filter and the third filter is 90°.

[0114] The present application uses filters to combine lights of different wavelengths, which has a simple structure and low price, and can greatly reduce material costs.

[0115] In some embodiments, the third light emitting chip 4531 is an electrical absorption modulated laser (EML) and is packaged with a semiconductor laser amplifier. One end of the first high-frequency transmission line is connected to the positive electrode of the electro-absorption modulator of the EML by bonding.

[0116] In some embodiments, the third light emitting chip 4531 is tilted, but the direction of the third wavelength optical signal output by the third light emitting chip 4531 is parallel to the length direction of the second shell 411, effectively reducing the reflected light signal from entering the third light emitting chip 4531 and interfering with the light emission of the third light emitting chip 4531.

[0117] In some embodiments, the first light emitting chip 4511 is an EML, and one end of the second high-frequency transmission line is connected to the positive electrode of the electro-absorption modulator of the EML by bonding.

[0118] In some embodiments, the TEC 470 includes a first electrode and a second electrode, and the first electrode and the second electrode are located at the edge of the TEC 470 package. Exemplarily, the first electrode and the second electrode are disposed on a side of the third laser assembly 453 away from the second laser assembly 452 .

[0119] In some embodiments, the arrangement of the first laser assembly 451, the second laser assembly 452 and the third laser assembly 453, combined with the structural form of the adapter block 430, can make full use of the space of the second shell 411, facilitate the arrangement of the first laser assembly 451, the second laser assembly 452 and the third laser assembly 453 in the second shell 411, and realize the electrical connection between the first laser assembly 451, the second laser assembly 452 and the third laser assembly 453 and the circuit board 300.

[0120] Figure 12 is a third schematic diagram of the partial structure of another optical emission component provided according to some embodiments of the present disclosure. Figure 13 is a first schematic diagram of a multiplexing component provided according to some embodiments of the present disclosure. Figure 14 is a first schematic diagram of an exploded view of a multiplexing component provided according to some embodiments of the present disclosure. In some examples, as shown in Figures 12 and 13, multiplexing component 460 includes: a first prism 465, a second prism 466, a third prism 467, and a fourth prism 468. The oblique surface of the second prism 466 is connected to the first prism 465, a right-angled surface of the third prism is connected to the first prism 465, and the oblique surface of the third prism is connected to the fourth prism 468.

[0121] The first prism 465 is a rhombus-shaped prism. It includes a first side surface 4651, a second side surface 4652, a third side surface 4653, and a fourth side surface 4654. The first side surface 4651 is positioned opposite the fourth side surface 4654, while the second side surface 4652 is positioned opposite the third side surface 4653. The angle between the first side surface 4651 and the second side surface is 45°. The first side surface 4651 is perpendicular to the length of the light-emitting component.

[0122] The second prism 466 is a triangular prism, and includes a first right-angled surface 4661 , a second right-angled surface 4662 , and a first oblique side surface 4663 .

[0123] The first right-angled surface 4661 is parallel to the first side surface 4651. In some embodiments, the first right-angled surface 4661 and the first side surface 4651 are located in the same plane. The first right-angled surface 4661 and the first side surface 4651 are located at the same position along the length of the light emitting component, or the first right-angled surface 4661 and the first side surface 4651 can be located at different positions along the length of the light emitting component.

[0124] The first oblique side surface 4663 is connected to the third side surface 4653 , and an included angle between the first oblique side surface 4663 and the first right-angled surface 4661 is 45°.

[0125] In some embodiments, the first oblique side surface 4663 and the third side surface 4653 have the same shape and area to facilitate assembly.

[0126] The third prism 467 is a triangular prism. The third prism 467 includes a third right-angled surface 4671 , a fourth right-angled surface 4672 , and a second oblique side surface 4673 .

[0127] The third right-angled surface 4671 is parallel to the first side surface 4651. In some embodiments, the third right-angled surface 4671 is connected to the third side surface 4653.

[0128] FIG15 is a second schematic diagram of a multiplexing component according to some disclosed embodiments. As shown in FIG15 , the third right-angled surface 4671 and the third side surface 4653 can be separated.

[0129] The included angle between the second oblique side surface 4673 and the third right-angled surface 4671 is 45°. The included angle between the second oblique side surface 4673 and the first oblique side surface 4663 is 90°.

[0130] The fourth prism 468 is a rhombus-shaped prism. It includes a fifth side surface 4681, a sixth side surface 4682, a seventh side surface 4683, and an eighth side surface 4684. The fifth side surface 4681 is positioned opposite the eighth side surface 4684, while the sixth side surface 4682 is positioned opposite the seventh side surface 4683. The angle between the fifth side surface 4681 and the sixth side surface 4682 is 45°. The fifth side surface 4681 is perpendicular to the length of the light-emitting component.

[0131] The sixth side surface 4682 is connected to the second oblique side surface 4673. In some embodiments, the sixth side surface 4682 and the second oblique side surface 4673 have the same shape and area to facilitate assembly.

[0132] In some embodiments of the present application, the first prism 465 and the second prism 466 are connected to form a first lens group, and the third prism 467 and the fourth prism 468 are connected to form a second lens group. The first lens group and the second lens group can be connected or separated.

[0133] In some embodiments, the multiplexing component includes a reflective component configured to reflect and / or transmit light signals of different wavelengths to combine the light signals of different wavelengths. The reflective component includes a first reflective film, a second reflective film, a third reflective film, and a fourth reflective film.

[0134] Figure 16 is a schematic diagram of an optical path of a multiplexing assembly according to some embodiments of the present disclosure. As shown in Figure 16, in some embodiments, a third reflective film 4603 is disposed between the third side surface 4653 and the first oblique side surface 4663. The third reflective film 4603 reflects the first wavelength signal light and transmits the second wavelength signal light.

[0135] A fourth reflective film 4604 is disposed between the sixth side surface 4682 and the second oblique side surface 4673 . The fourth reflective film 4604 transmits the first wavelength signal light and the second wavelength signal light, and reflects the third wavelength signal light.

[0136] The second side surface 4652 is provided with a first reflective film 4602, which reflects the signal light of the first wavelength. The seventh side surface 4683 is provided with a second reflective film 4605, which reflects the signal light of the third wavelength.

[0137] The first laser assembly 451 includes a first light emitting chip 4511, which emits signal light of a first wavelength. A first collimating lens 491 is located in the light-emitting direction of the first light emitting chip 4511 and collimates the signal light of the first wavelength emitted by the first light emitting chip 4511. The signal light of the first wavelength enters the multiplexing assembly through the first side surface 4651, is reflected by the second side surface 4652, and then travels toward the third side surface 4653. After being reflected by the third reflective film 4603, it travels toward the fourth side surface 4654, passes through the fourth reflective film 4604, and is emitted from the eighth side surface 4684.

[0138] The second laser assembly 452 includes a second light emitting chip 4521, which emits signal light of a second wavelength. A second collimating lens 492 is located in the light-emitting direction of the second light emitting chip 4521. The second collimating lens 492 collimates the signal light of the second wavelength emitted by the second light emitting chip 4521. The signal light of the second wavelength sequentially passes through the second prism 466, the first prism, the third prism, and the fourth prism, and is emitted through the eighth side surface 4684.

[0139] The third laser assembly 453 includes a third light emitting chip 4531, which emits signal light of a third wavelength. A third collimating lens 493 is located in the light-emitting direction of the third light emitting chip 4531. The third collimating lens 493 collimates the signal light of the third wavelength emitted by the third light emitting chip 4531. The signal light of the third wavelength enters the fourth prism through the fifth side surface 4681, is reflected by the second reflective film 4605, and then is reflected by the fourth reflective film 4604 before being emitted through the eighth side surface 4684.

[0140] In some embodiments of the present application, the first, second, and third wavelength signal lights are combined into a single beam by using the first, third, second, and fourth reflective films in a multiplexing assembly. This results in a simple structure and low cost, significantly reducing material costs. Compared to the example filter, the first, third, second, and fourth reflective films are disposed on the prism surface at predetermined angles, eliminating the need for angular coupling between the first, third, second, and fourth reflective films during installation. During installation, only the length and angular position of the multiplexing assembly need to be determined based on the first side surface 4651.

[0141] It should be noted that, in order to increase the transmittance of signal light through each side, an anti-reflection film can be set on the side through which the signal light passes. The specific location of the setting can be set according to actual conditions and is not specifically limited here.

[0142] Figure 17 is a fourth schematic diagram of a multiplexing component according to some disclosed embodiments. As shown in Figure 19, the second prism 466 may also be a trapezoidal prism.

[0143] In some embodiments, the multiplexing assembly 460 includes a first prism 465, a second prism 466, a third prism 467, and a fourth prism 468. A right-angled surface of the third prism is connected to the first prism 465, and an inclined surface of the third prism is connected to the fourth prism 468. A third reflective film 4603 is provided on the third side surface 4653. The third reflective film 4603 reflects the first wavelength signal light and transmits the second wavelength signal light.

[0144] A fourth reflective film 4604 is disposed between the sixth side surface 4682 and the second oblique side surface 4673 . The fourth reflective film 4604 transmits the first wavelength signal light and the second wavelength signal light, and reflects the third wavelength signal light.

[0145] The second side surface 4652 is provided with a first reflective film 4602, which reflects the signal light of the first wavelength. The seventh side surface 4683 is provided with a second reflective film 4605, which reflects the signal light of the third wavelength.

[0146] The first laser assembly 451 includes a first light emitting chip 4511, which emits signal light of a first wavelength. A first collimating lens 491 is located in the light-emitting direction of the first light emitting chip 4511 and collimates the signal light of the first wavelength emitted by the first light emitting chip 4511. The signal light of the first wavelength enters the multiplexing assembly through the first side surface 4651, is reflected by the second side surface 4652, and then travels toward the third side surface 4653. After reflection by the third reflective film 4603, the reflected signal light travels toward the fourth side surface 4654, passes through the fourth side surface 4654, the fourth reflective film 4604, and the first oblique side surface 4663, and is emitted through the eighth side surface 4684.

[0147] The second laser assembly 452 includes a second light emitting chip 4521, which emits signal light of a second wavelength. A second collimating lens 492 is located in the light-emitting direction of the second light emitting chip 4521. The second collimating lens 492 collimates the signal light of the second wavelength emitted by the second light emitting chip 4521. The signal light of the second wavelength sequentially passes through the second prism, the first prism, the third prism, and the fourth prism, and is emitted through the eighth side surface 4684.

[0148] The third laser assembly 453 includes a third light emitting chip 4531, which emits signal light of a third wavelength. A third collimating lens 493 is located in the light-emitting direction of the third light emitting chip 4531. The third collimating lens 493 collimates the signal light of the third wavelength emitted by the third light emitting chip 4531. The signal light of the third wavelength enters the fourth prism through the fifth side surface 4681, is reflected by the second reflective film 4605, and then is reflected by the fourth reflective film 4604 before being emitted through the eighth side surface 4684.

[0149] In some embodiments of the present application, the first, second, and third wavelength signal lights are combined into a single beam by using the first, third, second, and fourth reflective films in a multiplexing assembly. This results in a simple structure and low cost, significantly reducing material costs. Compared to the example filter, the first, third, second, and fourth reflective films are disposed on the prism surface at predetermined angles, eliminating the need for angular coupling between the first, third, second, and fourth reflective films during installation. During installation, only the length and angular position of the multiplexing assembly need to be determined based on the first side surface 4651.

[0150] The embodiment of the present disclosure also provides a structure of another optical emitting component in an optical module, in which a multiplexing component (also called a combiner 490) is also provided for combining the signal lights emitted by the two optical emitting components provided in the optical emitting component into one signal light beam.

[0151] FIG18 is a structural diagram of an optical emission component provided according to some embodiments of the present disclosure. FIG19 is a cross-sectional diagram of an optical emission component provided according to some embodiments of the present disclosure. FIG20 is a schematic diagram of an exploded view of an optical emission device provided according to some embodiments of the present disclosure. As shown in FIG18 , FIG19 and FIG20 , the optical emission component 400 provided in the present disclosure includes a tube base 410, a tube cap 420 and other components arranged in the tube cap 420 and the tube base 410. The tube cap 420 is covered at one end of the tube base 410. The tube base 410 includes a plurality of pins 430. The pins are used to realize the electrical connection between the flexible circuit board and other electrical components in the optical emission component, thereby realizing the electrical connection between the optical emission component 400 and the circuit board 300. This embodiment only takes the structure shown in FIG5 as an example.

[0152] In one embodiment, the tube cap is buckled onto the tube base 410 to form a light emitting space, and the first light emitting component 450, the second light emitting component 470, the first collimating lens 460, the second collimating lens 480, and the combiner 490 are arranged inside the light emitting space.

[0153] In one embodiment, the base 410 is used to support and carry the first optical transmission assembly 450, the second optical transmission assembly 470, the first collimating lens 460, the second collimating lens 480, and the beam combiner 490. The base 410 is provided with a plurality of through holes for fixing the pins.

[0154] To increase optical communication rates, an optical module is configured with multiple optical channels, each carrying a different signal. Multiple channels refers to at least two optical channels. Different optical channels carry different signals. Therefore, multiple optical receiving channels are configured within the optical receiving component to simultaneously receive multiple signal beams. In the embodiments of the present disclosure, the multiple signal beams include two signal beams.

[0155] In some embodiments of the present disclosure, a light window 421 is provided at the top of the tube cap 420 to facilitate the emission of the second optical signal emitted by the optical emitting component from within the optical emitting space. The second optical signal includes a first signal light and a second signal light, wherein the first signal light and the second signal light have different wavelengths, for example, the first signal light has a wavelength of λ1 and the second signal light has a wavelength of λ2.

[0156] Figure 21 is a partial schematic diagram of a light emitting device according to some embodiments of the present disclosure. Figure 22 is a partial schematic diagram of a light emitting device according to some embodiments of the present disclosure. Figure 23 is a schematic diagram of the optical path of a light emitting device according to some embodiments of the present disclosure. As shown in Figures 21, 22, and 23, in some embodiments, a semiconductor cooler 440 is provided within the light emitting space. The semiconductor cooler 440 is located on a tube base 410. A first substrate 411 is provided above the semiconductor cooler 440. The first substrate 411 is used to support a first light emitting assembly 450, a first collimating lens 460, and a second substrate 412.

[0157] The first optical transmission assembly 450 is positioned on the first substrate 411 and includes a first base plate 451 and a first COC structure 452. The first base plate 451 is positioned between the first COC structure 452 and the first substrate 411. The first base plate 451 is used to elevate the first COC structure 452 to facilitate coupling between the first optical transmission assembly and the first collimating lens 460. This ensures that the optical axis of the first signal light emitted by the first optical transmission assembly is aligned with the central axis of the first collimating lens 460. The first COC structure 452 emits the first signal light. The light emitted by the first COC structure 452 is divergent light.

[0158] The first collimating lens 460 is located at the light-emitting side of the first light emitting assembly 450 , and the first collimating lens 460 collimates the first signal light.

[0159] The second substrate 412 is located on the first substrate 411 and is used to support the beam combiner 490, the second collimating lens 480, and the second light emitting assembly 470. The second substrate is located on the first substrate 411 and provides a flat mounting platform for supporting the beam combiner 490, the second collimating lens 480, and the second light emitting assembly 470. The second substrate 412 is located on one side of the first collimating lens 460, and one end of the second substrate 412 extends outside the first substrate to increase the surface area of ​​the second substrate 412. TEC pins 432 are provided below the second substrate 412, and the upper surface of the TEC pins 432 is lower than the lower surface of the second substrate 412. The TEC pins are electrically connected to the semiconductor cooler to provide power to the semiconductor cooler.

[0160] A beam combiner 490 is located above the second substrate 412 and on the light-exiting side of the first collimating lens 460. The beam combiner 490 reflects the first signal light and changes its angle, shifting the propagation direction of the first signal light from parallel to the base to perpendicular to the base. After passing through the beam combiner 490, the first signal light is directed toward the light window 421.

[0161] A third substrate 413 is provided above the second substrate 412. The third substrate 413 is used to support the second collimating lens 480 and the second light emitting assembly 470. The second signal light emitted by the second light emitting assembly 470 is collimated by the second collimating lens 480 and then redirected by the beam combiner 490 toward the light window.

[0162] The beam combiner 490 is located between the first collimating lens and the second collimating lens, and combines the first signal light and the second signal light into one beam.

[0163] In some embodiments, the beam combiner 490 is provided with a first reflective layer 491 and a second reflective layer 492. The angle between the first reflective layer 491 and the second reflective layer 492 is 90°. The first signal light after passing through the first collimating lens 460 is located below the angle bisector between the first reflective layer 491 and the second reflective layer 492. The second signal light after passing through the second collimating lens 480 is located above the angle bisector between the first reflective layer 491 and the second reflective layer 492.

[0164] Therefore, the vertical distance between the second light emitting assembly and the first substrate is greater than the vertical distance between the first light emitting assembly and the first substrate.

[0165] After being reflected by the first reflective layer 491 , the first signal light is transmitted through the second reflective layer 492 , and is combined with the second signal light reflected by the second reflective layer 492 into one beam.

[0166] In some embodiments, to reduce the space occupied by the light emitting components, the height difference between the first light emitting assembly and the second light emitting assembly may be adjusted so that the channels of the combined first signal light and the second signal light overlap.

[0167] FIG24 is an exploded schematic diagram of a beam combiner provided according to some embodiments of the present disclosure. As shown in FIG24 , beam combiner 490 includes a first right-angle prism 4901, a second right-angle prism 4902, and a third right-angle prism 4903. One right-angle side of second right-angle prism 4902 is connected to the hypotenuse of first right-angle prism 4901, and the other right-angle side of second right-angle prism 4902 is connected to the hypotenuse of third right-angle prism 4903. First right-angle prism 4901 and second right-angle prism 4902 are connected by optical adhesive; third right-angle prism 4903 and second right-angle prism 4902 are also connected by optical adhesive.

[0168] The first reflective layer 491 (having the same principle as the reflective film in the above example) is located at the connection between the first right-angle prism 4901 and the second right-angle prism 4902 , and the first signal light is reflected by the first reflective layer 491 .

[0169] The second reflective layer 492 is located at the connection between the third right-angle prism 4903 and the second right-angle prism 4902 . The first signal light is transmitted through the second reflective layer 492 , and the second signal light is reflected by the second reflective layer 492 .

[0170] The first right-angle prism 4901 includes a first right-angled surface 4911, a second right-angled surface 4912, and a first inclined surface 4913. The second right-angled prism 4902 includes a third right-angled surface 4921, a fourth right-angled surface 4922, and a second inclined surface 4923. The third right-angled prism 4903 includes a fifth right-angled surface 4931, a sixth right-angled surface 4932, and a third inclined surface 4933. The first inclined surface 4913 is connected to the third right-angled surface 4921; the fourth right-angled surface 4922 is connected to the third inclined surface 4933. The second inclined surface 4923 is perpendicular to the first substrate and faces the first light emitting assembly.

[0171] In some embodiments, in order to improve the coupling efficiency of the first signal light, the second inclined surface is provided with a first anti-reflection film to increase the transmittance of the first signal light and reduce reflection.

[0172] In order to improve the coupling efficiency of the second signal light, a second anti-reflection film is provided on the fifth right-angled surface to increase the transmittance of the second signal light and reduce reflection.

[0173] The sixth right-angled surface is provided with a third anti-reflection film to increase the transmittance of the first signal light and the second signal light and reduce reflection.

[0174] In some embodiments of the present application, in order to shorten the bonding length between the pins and the light emitting component, a plurality of power supply pins 431 are further provided, and the upper surface of the power supply pins 431 is higher than the upper surface of the TEC pins 432 .

[0175] The present embodiment provides an optical transmitter component, including: a tube base 410, a tube cap 420, and other components disposed within the tube cap 420 and tube base 410. The tube base 410 includes a first substrate, which supports a first optical transmitter assembly and a second substrate. A beam combiner and a second optical transmitter assembly are disposed on the second substrate. The beam combiner is located between the first and second optical transmitter assemblies. The beam combiner changes the propagation directions of the first and second signal lights and combines them into a single beam. The beam combiner includes a first reflective layer 491 and a second reflective layer 492. The angle between the first and second reflective layers 491 and 492 is 90°. After passing through the first collimating lens 460, the first signal light is located below the angular bisector of the first and second reflective layers 491 and 492. After passing through the second collimating lens 480, the second signal light is located above the angular bisector of the first and second reflective layers 491 and 492.

[0176] One end of the second substrate extends beyond the first substrate to increase the surface area of ​​the second substrate 412. TEC pins 432 are located below the second substrate 412. The top surface of the TEC pins 432 is lower than the bottom surface of the second substrate 412. The TEC pins are electrically connected to the semiconductor cooler to provide power to the cooler.

[0177] In some embodiments, the first light emitting chip in the first light emitting assembly is an EML laser. The wavelength of the first signal light is 1577 nm. The second light emitting chip in the second light emitting assembly is a DFB laser. The wavelength of the first signal light is 1490 nm.

[0178] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present disclosure, rather than to limit them. Although the present disclosure has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein. However, these modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the various embodiments of the present disclosure.

Claims

1. An optical module, comprising: Upper shell, A lower shell body, which is covered with the upper shell body to form a cavity; A circuit board is located in the cavity. A light emitting component is located in the cavity and is electrically connected to the circuit board. The light emitting component includes a plurality of light emitting chips and a multiplexing component. The plurality of light emitting chips are configured to emit signal lights of different wavelengths. The multiplexing component is located at the light emitting side of the light emitting chip. The multiplexing component includes a plurality of filters, and the plurality of filters are configured to reflect and / or transmit signal lights of different wavelengths so as to combine the signal lights of multiple different wavelengths into a beam; Alternatively, the multiplexing component includes a reflection component, and the reflection component is configured to reflect and / or transmit signal lights of different wavelengths to perform beam combining processing on a plurality of signal lights of different wavelengths.

2. The optical module according to claim 1, wherein: Multiple optical transmitter chips include: A first optical transmission chip is configured to transmit a signal light of a first wavelength; A second optical transmission chip is configured to transmit a signal light of a second wavelength; The third optical transmission chip is configured to transmit signal light of a third wavelength.

3. The optical module according to claim 2, wherein: The multiplexing components include: A first filter, located on the light output path of the first light emitting chip, reflects the signal light of the first wavelength; a second filter, arranged in parallel with the first filter, reflecting the first wavelength signal light from the first filter and transmitting the second wavelength signal light; A third filter is located on one side of the second filter, the first wavelength signal light and the second wavelength signal light are transmitted through the third filter, and the third filter reflects the third wavelength signal light; The fourth filter is located in the light output path of the third light emitting chip, and reflects the third wavelength signal light to the third filter.

4. The optical module according to claim 2, wherein: The multiplexing component is configured as follows: the reflection component includes a first reflection film, a second reflection film, a third reflection film and a fourth reflection film; the first reflection film is provided on the second side of the multiplexing component, and the first reflection film reflects the first wavelength signal light; the third reflection film is provided on the fourth side, and the third reflection film reflects the first wavelength signal light, and the third reflection film transmits the second wavelength signal light; the second reflection film is provided on the third side, and the second reflection film reflects the third wavelength signal light to the first oblique side, the first oblique side is provided with the fourth reflection film, the first wavelength signal light and the second wavelength signal light transmit through the fourth reflection film, and the fourth reflection film reflects the third wavelength signal light.

5. The optical module according to claim 4, wherein: The multiplexing components include: A first prism, wherein the first side surface and the fourth side surface of the first prism are arranged opposite to each other, and the second side surface and the third side surface are arranged opposite to each other; and the angle between the first side surface and the second side surface is 45°; A second prism, wherein a first right-angled surface of the second prism is parallel to the first side surface, and a first oblique side surface is connected to a third side surface; A third prism comprises a third right-angled surface, a fourth right-angled surface, and a second oblique side surface; A fourth prism, wherein the fifth side surface of the fourth prism is arranged opposite to the eighth side surface, the sixth side surface and the seventh side surface are arranged opposite to each other, and the sixth side surface is connected to the second oblique side surface.

6. The optical module according to claim 5, characterized in that: The second prism is connected to the third prism; or, The second prism is disposed separately from the third prism.

7. The optical module according to claim 2, wherein: The light emitting component also includes: A first collimating lens, located between the first light emitting chip and the multiplexing component; A second collimating lens is located between the second light emitting chip and the multiplexing component; The third collimating lens is located between the third light emitting chip and the multiplexing component.

8. The optical module according to any one of claims 1 to 7, wherein: The light emitting component also includes: Second upper cover; A second shell, forming an inner cavity with the second upper cover; A transfer block is provided at one end of the second shell, one end of the transfer block is embedded in the inner cavity, one end of the transfer block is electrically connected to the first light emitting chip, the second light emitting chip, and the third light emitting chip; the other end of the transfer block is electrically connected to the circuit board.

9. The optical module according to claim 8, wherein: The light emitting component also includes: TEC, located in the inner cavity; A support plate is located above the TEC, and the first light emitting chip, the second light emitting chip and the third light emitting chip are located above the support plate.

10. The optical module according to any one of claims 1 to 7, wherein: The optical module further includes: Fiber optic adapters; An optical accommodating component, wherein the optical fiber adapter is connected to a first side of the optical accommodating component, and a first light receiving component, a second light receiving component and a third light receiving component are arranged on a second side of the optical accommodating component.

11. The optical module according to claim 10, wherein: The optical receiving component comprises: a first cavity formed by connecting a first shell and a first upper cover; The first side of the first housing is provided with a connection to the optical fiber adapter, and the second side is provided with a first light receiving component, a second light receiving component and a third light receiving component; The light emitting component is connected to the third side of the first housing.

12. The optical module according to claim 1, wherein: The plurality of light emitting chips include: a first light emitting component and a second light emitting component; Wherein, the first light emitting component is configured to emit a first signal light, and the second light emitting component is configured to emit a second signal light; The multiplexing component is located between the first optical emitting component and the second optical emitting component; The reflective component comprises: a first reflection layer, wherein the first signal light is reflected on the first reflection layer; a second reflection layer, wherein the second signal light is reflected on the second reflection layer, and the first signal light is transmitted through the second reflection layer; The first signal light and the second signal light are combined and processed by the multiplexing component.

13. The optical module according to claim 12, wherein: The optical module further includes: Pipe socket; A pipe cap, which is arranged above the pipe seat and is provided with a light window; A TEC, located above the tube holder; A first substrate, located above the TEC, the first substrate carrying the first light emitting component and a second substrate; The second substrate carries the multiplexing component and the second light emitting component; The first signal light and the second signal light are combined by the multiplexing component and then transmitted through the optical window.

14. The optical module according to claim 13, wherein: The first reflective layer is arranged vertically to the second reflective layer; The central axis of the first light emitting assembly is lower than the bisector of the angle between the first reflecting layer and the second reflecting layer; The central axis of the second light emitting assembly is higher than the bisector of the first reflecting layer and the second reflecting layer.

15. The optical module according to claim 13, wherein: The multiplexing component includes: a first right-angle prism, a second right-angle prism and a third right-angle prism; Wherein, the hypotenuse of the first right-angle prism is connected to a right-angle side of the second right-angle prism; The hypotenuse of the third right-angle prism is connected to the other right-angle side of the second right-angle prism; The hypotenuse of the second right-angle prism faces the first light emitting assembly; The first reflective layer is located between the first right-angle prism and the second right-angle prism; The second reflective layer is located between the second right-angle prism and the third right-angle prism.

16. The optical module according to claim 15, wherein: The first right-angle prism comprises a first right-angle surface, a second right-angle surface and a first inclined surface; The second right-angle prism includes a third right-angle surface, a fourth right-angle surface and a second inclined surface; The third right-angle prism comprises a fifth right-angle surface, a sixth right-angle surface and a third inclined surface; The first inclined surface is connected to the third right-angle surface; the fourth right-angle surface is connected to the third inclined surface; The second inclined surface is perpendicular to the first substrate, and faces the first light emitting component.

17. The optical module according to claim 16, wherein: The second inclined surface is provided with a first anti-reflection film, configured to increase the transmittance of the first signal light; The fifth right-angle surface is provided with a second anti-reflection film, which is configured to increase the transmittance of the second signal light; The sixth right-angle surface is provided with a third anti-reflection film, which is configured to increase the transmittance of the first signal light and the second signal light.

18. The optical module according to claim 13, wherein: The light emitting assembly further comprises: a TEC pin, wherein the TEC pin is located below the second substrate, and a top of the TEC pin is lower than a lower surface of the second substrate; The TEC pin is electrically connected to the TEC.

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