Waveguide communication apparatus and manufacturing method therefor

Abstract

The present invention provides a waveguide communication apparatus and a manufacturing method therefor. The waveguide communication apparatus comprises: a waveguide substrate, the waveguide substrate having an integrated surface supporting a microwave circuit element; and a waveguide post, the waveguide post comprising a hole channel arranged in the axial direction of the waveguide post, the hole channel being used to transmit a microwave signal. One end of the waveguide post is arranged on the integrated surface, and the hole channel of the waveguide post is used to correspond to the microwave circuit element. The waveguide post and the waveguide substrate are connected after each is manufactured.

Description

Waveguide communication device and manufacturing method thereof

[0001] CROSS-REFERENCE TO RELATED APPLICATIONS

[0002] This patent application claims priority to Chinese patent application 202311568049.2 filed with the State Intellectual Property Office of China on November 21, 2023, and the disclosure of this Chinese patent application is incorporated herein by reference in its entirety. Technical Field

[0003] The present invention relates to the field of microwave communication technology, and in particular to a waveguide communication device and a manufacturing method thereof. Background Art

[0004] Microwave communication uses electromagnetic waves (microwaves) with wavelengths between 0.1 mm and 1 m, corresponding to frequencies between 300 MHz and 3000 GHz.

[0005] Unlike modern communication networks like coaxial cable, fiber optic, and satellite, microwave communication uses microwaves directly as a medium, eliminating the need for solid media. Microwave transmission is possible when there are no obstacles within a straight-line distance between two points. Microwave communication boasts high capacity, high quality, and long-distance transmission, making it a crucial method for national communications networks and widely applicable to various specialized communication networks.

[0006] Waveguide substrates are typically used as platforms to support microwave circuit components. Microwave circuit components such as microstrip lines, RF components, and antennas can be fabricated and connected on waveguide substrates to form a complete microwave circuit. In addition to microwave circuit components, waveguide pillars are also used as signal transmission channels to guide and transmit microwave signals. To minimize transmission loss, waveguide pillars and waveguide substrates can be integrally formed using processes such as CNC lathes.

[0007] Summary of the Invention

[0008] The present invention aims to solve at least one of the technical problems existing in the prior art, and proposes a waveguide communication device and a manufacturing method thereof, wherein the waveguide column and the waveguide substrate are connected after being manufactured separately to assemble into a waveguide communication device, which has higher manufacturing flexibility and can adapt to different frequency requirements.

[0009] To achieve the above-mentioned objectives, an embodiment of the present invention provides a waveguide communication device, comprising: a waveguide substrate, the waveguide substrate having an integrated surface supporting microwave circuit elements; a waveguide post, the waveguide post including a channel arranged along its axial direction, the channel being used to transmit microwave signals; wherein one end of the waveguide post is arranged on the integrated surface, and the channel of the waveguide post is used to correspond to the microwave circuit element; the waveguide post and the waveguide substrate are connected after each is manufactured.

[0010] In some embodiments, the waveguide pillar and the waveguide substrate are connected by mechanical connection or bonding.

[0011] In some embodiments, the mechanical connection includes a threaded connection, a pin connection, a slot connection, or a welded connection.

[0012] In some embodiments, a connection groove with an opening located at the integrated surface is provided on the waveguide substrate, and the connection groove is used to connect the waveguide column.

[0013] In some embodiments, the fabrication of the waveguide pillar and the waveguide substrate includes material selection, molding, cutting, and surface treatment.

[0014] In some embodiments, the fabrication of the waveguide substrate includes a die-casting process and a machining process.

[0015] In some embodiments, the fabrication of the waveguide pillars includes a precision extrusion process.

[0016] In some embodiments, the fabrication of the waveguide post includes surface treatment of the channel during the fabrication process to improve its corrosion resistance.

[0017] In some embodiments, the material of the waveguide pillar is metal or alloy.

[0018] An embodiment of the present invention provides a method for manufacturing a waveguide communication device, comprising: manufacturing a waveguide column, including material selection, molding, cutting and surface treatment, wherein the waveguide column includes a channel arranged along its axial direction, and the channel is used to transmit microwave signals; manufacturing a waveguide substrate, including material selection, molding, cutting and surface treatment, wherein the waveguide substrate has an integrated surface supporting microwave circuit elements, one end of the waveguide column is arranged on the integrated surface, and the channel of the waveguide column is used to correspond to the microwave circuit element; and connecting the waveguide column to the integrated surface of the waveguide substrate.

[0019] Other objects and features of the present invention will become clear by reading the specification, claims and drawings of this application. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] The above and / or additional aspects and advantages of the present invention will become apparent and readily understood from the description of the embodiments with reference to the following drawings, in which:

[0021] FIG1 is a schematic structural diagram of a waveguide communication device according to an embodiment of the present invention.

[0022] FIG2 is a schematic structural diagram of a waveguide substrate of a waveguide communication device according to an embodiment of the present invention.

[0023] FIG3 is a schematic structural diagram of a waveguide column of a waveguide communication device according to an embodiment of the present invention. DETAILED DESCRIPTION

[0024] The embodiments of the present invention are described in detail below, examples of which are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and are not to be construed as limiting the present invention.

[0025] In the description of the present invention, it should be noted that, unless otherwise expressly specified or limited, the terms "mounted," "connected," and "connected" should be understood in a broad sense. For example, they may refer to fixed connections, detachable connections, or integral connections; mechanical connections, electrical connections, or mutual communication; direct connections or indirect connections through an intermediate medium; and internal communication between two components or interaction between two components. Those skilled in the art will understand the specific meanings of the above terms in the present invention based on specific circumstances.

[0026] The disclosure below provides many different embodiments or examples for realizing different structures of the present invention. In order to simplify the disclosure of the present invention, the components and settings of specific examples are described below. Of course, they are merely examples and are not intended to limit the present invention. In addition, the present invention may repeat reference numbers and / or reference letters in different examples. Such repetition is for the purpose of simplicity and clarity and does not in itself indicate the relationship between the various embodiments and / or settings discussed. In addition, the present invention provides examples of various specific processes and materials, but those skilled in the art will recognize the application of other processes and / or the use of other materials.

[0027] Throughout this specification, reference to terms such as "one embodiment," "certain embodiments," "illustrative embodiments," "examples," "specific examples," or "some examples" means that a specific feature, structure, material, or characteristic described in conjunction with an embodiment or example is included in at least one embodiment or example of the present invention. In this specification, illustrative descriptions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

[0028] Waveguide substrates are typically used as platforms to support microwave circuit components. Microwave circuit components such as microstrip lines, RF components, and antennas can be fabricated and connected on waveguide substrates to form a complete microwave circuit. In addition to microwave circuit components, waveguide pillars are also used as signal transmission channels to guide and transmit microwave signals. To minimize transmission loss, waveguide pillars and waveguide substrates can be integrally formed using processes such as CNC lathes.

[0029] However, as microwave product performance improves, frequencies continue to rise. As frequencies increase, waveguide pillar dimensions often need to be reduced to accommodate shorter wavelengths. This is crucial for microwave and millimeter-wave communication systems, which typically operate at high frequencies. Furthermore, high frequencies require even greater structural precision to ensure consistent waveguide pillar geometry and dimensions. Any deviation can result in signal loss and performance degradation.

[0030] However, the structure in which the waveguide column and the waveguide substrate are integrally formed cannot meet the requirements of higher frequencies for the waveguide column when manufacturing a waveguide communication device.

[0031] Therefore, proposing a waveguide communication device that can adapt to higher frequencies has become a technical problem that needs to be solved urgently.

[0032] Figure 1 is a schematic structural diagram of a waveguide communication device according to an embodiment of the present invention. The waveguide communication device 10 is a device for transmitting and processing microwave signals, and is typically used in radio frequency (RF) and microwave communication systems.

[0033] 1 , a waveguide communication device 10 according to an embodiment of the present invention includes a waveguide substrate 100 and a waveguide post 200 , wherein the waveguide post 200 is used to transmit microwave signals. The waveguide communication device 10 may include one or more waveguide posts 200 , and the number of waveguide posts 200 is not limited.

[0034] FIG2 is a schematic structural diagram of a waveguide substrate of a waveguide communication device according to an embodiment of the present invention.

[0035] Referring to Figure 2, the waveguide substrate 100 is a sheet-like structure. Microwave circuit components such as radio frequency amplifiers, mixers, filters and antennas are integrated on the waveguide substrate 100. These circuit components are used to process and modulate microwave signals. The waveguide substrate 100 has an integrated surface 110 that supports microwave circuit components. Microwave circuits generally operate in a high frequency range, typically ranging from 300 megahertz (MHz) to 300 gigahertz (GHz). Microwave circuits generally use high-frequency materials such as aluminum oxide, silicon nitride and various metals to ensure sufficient electromagnetic wave performance in the high frequency range. Microwave circuits include various devices and components, such as radio frequency amplifiers, mixers, filters, couplers, splitters, combiners, etc. These components are used for signal processing and modulation to meet the needs of specific applications.

[0036] FIG3 is a schematic structural diagram of a waveguide column of a waveguide communication device according to an embodiment of the present invention.

[0037] Referring to Figure 3 , the waveguide post 200 includes a channel 210 arranged along its axial direction. Channel 210 is used to transmit microwave signals. This channel 210 may have a unique cross-sectional structure, such as rounded or sharp corners, with the cross section perpendicular to the axial direction of the waveguide post 200. Specifically, the cross-sectional projection of channel 210 comprises four straight segments connected end to end, with each adjacent straight segment connected by a rounded or sharp corner structure to ensure efficient transmission of microwave signals. In particular, each adjacent straight segment forms a certain angle between them.

[0038] Referring again to Figure 1 , one end of a waveguide column 200 is positioned on the integration surface 110. A channel 210 in the waveguide column 200 is designed to correspond to a microwave circuit component. Microwave signals are transmitted from the microwave circuit component to the waveguide column 200. Within the waveguide column 200, the signal travels through the channel 210, guided and reflected by the waveguide. The waveguide's unique structure and dimensions allow microwave signals to be transmitted within the waveguide column 200 with low loss while maintaining signal integrity.

[0039] The waveguide pillar 200 and the waveguide substrate 100 are connected after they are manufactured. In some embodiments, the waveguide pillar 200 is generally connected to the waveguide substrate 100 by mechanical connection or bonding.

[0040] In the embodiment of the present disclosure, the waveguide communication device 10 is composed of a waveguide column 200 and a waveguide substrate 100, wherein the waveguide column 200 and the waveguide substrate 100 are connected after being manufactured separately to assemble into the waveguide communication device 10, which has higher manufacturing flexibility and can adapt to different frequency requirements.

[0041] It should be noted that the waveguide post 200 and the waveguide substrate 100 are connected by mechanical connection or bonding, which ensures effective coupling between the waveguide post 200 and the microwave circuit element, so as to achieve seamless signal transmission.

[0042] In some embodiments, the mechanical connection includes a threaded connection, a pin connection, a slot connection, or a welded connection.

[0043] It should be noted that the threaded connection between the waveguide post 200 and the waveguide substrate 100 is suitable for waveguide communication devices 10 with detachable and replaceable components for easy maintenance and repair. The threaded connection between the waveguide post 200 and the waveguide substrate 100 allows the waveguide post 200 to be quickly disassembled and connected, facilitating subsequent maintenance and replacement, and also provides good mechanical stability and connection tightness. The pin connection between the waveguide post 200 and the waveguide substrate 100 can achieve a strong connection between the two, thereby ensuring that the waveguide post 200 will not easily loosen. The pin connection between the waveguide post 200 and the waveguide substrate 100 can provide a reliable mechanical connection, making it suitable for high vibration and high shock environments. The pin connection generally does not require additional space, preventing the waveguide post 200 from interfering with other components. The slot connection between the waveguide post 200 and the waveguide substrate 100 can provide very precise mechanical alignment to ensure correct signal transmission and is suitable for high-frequency applications because the slot connection does not introduce unnecessary electromagnetic interference. The solder connection between the waveguide post 200 and the waveguide substrate 100 is typically used when a permanent connection is required. Soldering provides a strong mechanical connection, generally without concerns about loosening or corrosion, and is suitable for high-frequency applications because it does not introduce electromagnetic interference. Those skilled in the art may choose different connection methods based on different circumstances to ensure the performance and reliability of the waveguide communication device 10.

[0044] 1 and 2 , the waveguide substrate 100 is provided with a connection groove whose opening is located at the integration surface 110 , and the connection groove is used to connect the waveguide column 200 .

[0045] In this embodiment, a connection groove is provided on the waveguide substrate 100 , and the shape of the connection groove wall is adapted to the outer surface of the waveguide column 200 , so that the waveguide column 200 can be inserted into the connection groove to achieve connection between the waveguide column 200 and the waveguide substrate 100 .

[0046] In some embodiments, the fabrication of the waveguide pillar 200 and the waveguide substrate 100 includes material selection, molding, cutting, and surface treatment.

[0047] It should be noted that the manufacturing methods in the embodiments of the present invention may include material selection, molding, cutting, and surface treatment. These manufacturing processes are key steps in the manufacture of the waveguide communication device 10 and significantly impact the performance and reliability of the final product. It is understood that, depending on the specific design and application requirements, the manufacturing process of the waveguide pillar 200 and the waveguide substrate 100 may require other special processes and processing steps to ensure that the waveguide communication device 10 meets the performance requirements. These other steps and processing steps are not specifically limited herein.

[0048] Specifically, the material selection used in the fabrication method depends on the specific application and performance requirements of the waveguide communication device 10. Common materials include metals, metal alloys, ceramics, and insulating materials (e.g., alumina, silicon nitride, and PTFE). For the waveguide post 200, a metal or metal alloy with good electrical conductivity is typically used to ensure signal transmission within the waveguide post 200. Corrosion resistance and mechanical strength are also important considerations when selecting the material.

[0049] Specifically, cutting in the manufacturing method is the process of cutting raw materials into the desired size and shape. In the manufacture of the waveguide communication device 10, a cutting process is typically used to obtain the initial shape of the waveguide pillar 200 and the waveguide substrate 100. The cutting process can employ various tools and methods, such as mechanical cutting, laser cutting, or electrical discharge cutting, to ensure precise dimensions and a smooth surface.

[0050] Specifically, forming in the manufacturing method is the process of processing the cut material into the desired shape and structure. In the manufacture of the waveguide communication device 10, forming can include processes such as bending, stamping, folding, and welding. The purpose of forming is to establish the specific shape of the waveguide pillar 200, waveguide substrate 100, and other components to ensure that they meet the design requirements.

[0051] Specifically, surface treatment in the manufacturing method aims to improve the properties of the material surface and typically includes processes such as cleaning, polishing, plating, and coating. For the waveguide communication device 10, surface treatment may include treating the channel 210 during the manufacturing process of the waveguide column 200 to improve its corrosion resistance and signal transmission characteristics. Surface treatment can also be used to enhance the corrosion resistance and mechanical properties of connecting components.

[0052] In some embodiments, the waveguide substrate 100 is manufactured using a die-casting process and a machining process. The die-casting process is suitable for producing large quantities of parts, has high production efficiency, and provides the waveguide substrate 100 with good surface quality and dimensional accuracy. The machining process can produce high-precision parts, suitable for applications requiring dimensional accuracy, and is suitable for small-batch or single-piece production, without requiring a large number of molds.

[0053] The die-casting process is a manufacturing method in which molten metal or alloy is poured into a metal mold and then cooled into the desired shape using high pressure. This process is often suitable for manufacturing parts with complex geometries, including certain components in the waveguide communication device 10. The die-casting process can include the following steps: mold preparation → material melting → die casting → mold opening → post-processing. The mold preparation step includes: first, preparing a metal mold, usually made of steel. The design of the mold should match the geometry of the desired part. The material melting step includes: using a high-temperature furnace to heat the selected metal or alloy to a liquid state. The die-casting step includes: pouring molten metal into the mold and then using high pressure to rapidly cool and solidify the metal into the desired shape. This is usually completed within seconds. The mold opening step includes: once the part cools and solidifies, the mold separates and the finished part can be removed. The post-processing step includes: the finished part may need to undergo post-processing steps such as cleaning, deburring, grinding, and coating to improve surface quality and performance.

[0054] Machining is a method of manufacturing parts by cutting, cutting or shaping materials from blanks. For the waveguide communication device 10, machining is generally used to manufacture components that require high precision. The machining process may include the following steps: material preparation → design and programming → machining → inspection and quality control → post-processing. The material preparation step includes cutting blanks from raw materials, typically using metal materials such as aluminum, steel, copper, etc. The design and programming step includes using computer-aided design (CAD) and computer numerical control (CNC) programming to create detailed processes for manufacturing parts. The machining step includes using CNC machine tools (such as milling machines, lathes, and drill presses) to accurately cut, cut or shape parts according to the program. This can include operations such as drilling holes, cutting threads, and grinding surfaces. The inspection and quality control step includes inspecting and measuring the manufactured parts to ensure that they meet the design specifications. Post-processing: The parts may require further processing such as polishing, cleaning, coating, and assembly.

[0055] The fabrication of the waveguide post 200 involves a precision extrusion process, which is capable of producing high-precision, high-quality, elongated components suitable for the waveguide post 200 or waveguide tube in the waveguide communication device 10. This process eliminates the need for large-scale molds, making it suitable for small-batch or custom manufacturing. It can also achieve complex geometries without the need for additional processing steps. The precision extrusion process focuses on achieving high-precision and high-quality manufacturing by extruding a metal billet into the desired shape. The precision extrusion process can include the following steps: material selection → mold design → billet preparation → heating and extrusion → cooling and curing → post-processing → quality control. Regarding the material selection step, the precision extrusion process typically uses metal materials such as aluminum, copper, iron, and steel to meet the performance and corrosion resistance requirements of the waveguide communication device 10. The choice of material depends on the specific application and environment. Die design: A metal die is prepared for extrusion. The die design should match the geometry of the desired component and have a highly precise internal cavity to ensure the accuracy of the extrusion process. The billet preparation step includes preparing a metal billet, typically with a circular or square cross-section and dimensions that match the die cavity. The heating and extrusion steps include heating the metal billet to the appropriate temperature and then placing it into the die of the extruder. By applying high pressure, the billet is extruded into the desired shape. This process usually requires a high degree of precise control to ensure the consistency of the final shape and size. The cooling and solidification steps include: the extruded part needs to be cooled to stabilize the shape and ensure structural strength. Control of cooling rate and temperature is very important for the final performance. The post-processing steps include: post-processing of the manufactured parts, such as cutting, cleaning, deburring and surface treatment to improve quality and surface smoothness. The quality control steps include: inspecting and measuring the extruded parts to ensure that their size, shape and performance meet the design requirements. The success of the precision extrusion process depends on strict quality control.

[0056] The manufacture of the waveguide column 200 includes surface treatment of the channel 210 during the manufacture process to improve its corrosion resistance. During the manufacture of the waveguide column 200, it is very important to perform surface treatment to improve its corrosion resistance, especially when the waveguide communication device 10 will be used in a harsh environment, and the service life of the waveguide column 200 can be extended by improving the corrosion resistance of the waveguide column 200. In some embodiments, the surface treatment method may include electroplating, anodizing, spray coating, ceramic coating, sandblasting, chemical treatment, stainless steel selection, etc. The choice of surface treatment depends on the material, application environment, performance requirements and budget. Before performing the surface treatment, these factors must be carefully considered and it must be ensured that the selected method meets the needs of the waveguide communication device 10. In addition, quality control during the manufacturing process is also a key factor in ensuring the effectiveness and consistency of the surface treatment.

[0057] It should be noted that electroplating is the process of depositing a layer of metal on the surface of the waveguide column 200 to increase its corrosion resistance. Copper plating, nickel plating, chrome plating or other suitable metals are usually used for electroplating. These metals can provide a protective shell to reduce the corrosive effects of oxygen, moisture and chemicals on the waveguide column 200. Electroplating has the following advantages: (1) It can provide a uniform metal coating, which can significantly improve the corrosion resistance of the waveguide column 200. (2) Different types of metals can be selected for electroplating to meet different environmental requirements. (3) The coating thickness is controllable and can be adjusted as needed. (4) It can provide improvements in appearance, such as bright or chrome plating effects.

[0058] It should be noted that anodizing is a process that converts a metal surface into an oxide layer, which is commonly used for aluminum waveguide posts 200. This oxide layer has good corrosion resistance and mechanical strength, which can improve the durability of the waveguide posts 200. Anodizing has the following advantages: (1) It is suitable for aluminum waveguide posts 200 and can significantly improve their corrosion resistance and hardness. (2) It produces a stable oxide layer that prevents further corrosion. (3) It does not require additional coatings or coverings.

[0059] It should be noted that spray coating uses a special coating to coat the surface of the waveguide pillar 200 to prevent corrosion. These coatings can be organic coatings, ceramic coatings, or special anti-corrosion coatings, depending on the application and environment. Spray coating has the following advantages: (1) It provides a variety of coating options, with different chemical compositions that can be selected according to specific requirements. (2) It can be used on different materials, including metals and non-metals. (3) It can be applied to large or complex structures.

[0060] It should be noted that ceramic coating is suitable for use in some high-temperature and corrosive environments and can be used to protect the surface of the waveguide column 200. Ceramic coating can provide excellent corrosion resistance and high-temperature resistance. Ceramic coating has the following advantages: (1) It provides excellent corrosion resistance, especially in high-temperature and corrosive environments. (2) It has good mechanical strength and hardness. (3) It can be used to protect ceramic materials.

[0061] It should be noted that sandblasting is to remove surface dirt and oxides through high-pressure sandblasting, and then create a fine texture on the surface. This can increase adhesion and improve the corrosion resistance of the surface.

[0062] It should be noted that chemical treatment can improve corrosion resistance by immersing the waveguide rod 200 in a chemical bath to remove oxides and form a protective chemical layer on the surface. This generally requires precise chemical formulation and control. Chemical treatment has the following advantages: (1) It can form a protective oxide or chemical layer on the surface, improving corrosion resistance. (2) It is applicable to a variety of materials, including metals and non-metals. (3) It is relatively low cost and easy to mass produce.

[0063] It should be noted that if stainless steel is selected as the material when manufacturing the waveguide column 200, stainless steel itself has high corrosion resistance. However, depending on the specific application, different types of stainless steel, such as 316 stainless steel, can be selected to improve its corrosion resistance.

[0064] Microwave circuit components include radio frequency amplifiers, mixers, filters, and antennas. Radio frequency amplifiers are used to increase the amplitude of input signals to enhance their strength. Mixers are used to combine two signals of different frequencies to generate a new frequency component for modulation or demodulation. Filters are used to select signals within a specific frequency range and suppress interfering signals of other frequencies. Antennas are used to convert electromagnetic waves into electrical signals (transmission) or vice versa, enabling information to be transmitted and received over the air. Waveguide columns 200 are used to guide and transmit microwave signals.

[0065] The connection relationship between microwave circuit elements forms a complete microwave communication system, ensuring the transmission, processing and reception of signals. Each element has a specific function and role in the system, working together to achieve efficient microwave communication. In some embodiments, the input end of the RF amplifier is connected to the front-end element (such as an antenna or a mixer), and the output end is connected to the back-end element (such as a filter or a mixer). The mixer is typically connected to the RF amplifier, the filter and other signal processing components to perform signal processing operations. The filter is typically connected to the RF amplifier, the mixer and the antenna to ensure that only signals of the required frequency are transmitted or received. The antenna is typically connected to the RF amplifier and the filter to ensure that the signal is properly transmitted to or from the communication system. The waveguide column 200 is typically connected to other waveguide components (such as the waveguide substrate 100) to ensure that the signal is effectively transmitted in the system. The waveguide substrate 100 is typically connected to the waveguide column 200 and other microwave elements to build a complete waveguide communication system.

[0066] In some embodiments, the material of the waveguide pillar 200 is metal or alloy. The material selection of the waveguide pillar 200 is generally influenced by factors such as frequency range, application environment, cost, and performance requirements. Therefore, during the specific manufacturing process, it may be necessary to select the most suitable material based on the specific design and performance requirements.

[0067] Specifically, the waveguide column 200 may be made of metal materials, such as aluminum, copper, stainless steel, and niobium. These metals have good electrical conductivity and mechanical strength and are suitable for manufacturing the waveguide column 200.

[0068] Specifically, the waveguide column 200 sometimes requires higher corrosion resistance and mechanical properties, so an alloy such as aluminum alloy, titanium alloy or niobium-tin alloy may be selected.

[0069] Specifically, in some high frequency or special environments, ceramic materials such as aluminum oxide or silicon nitride can also be used to manufacture the waveguide column 200. They have good high temperature resistance and corrosion resistance.

[0070] In some embodiments, the material of the waveguide substrate 100 is metal or a metallic material.

[0071] The material selection of the waveguide substrate 100 is usually affected by factors such as frequency range, application environment, cost, and performance requirements. Therefore, in the specific manufacturing process, it may be necessary to select the most suitable material based on specific design and performance requirements. Optionally, the material of the waveguide substrate 100 can be an insulating material to ensure that the signal does not conduct electricity through the waveguide substrate 100, thereby avoiding signal loss. Commonly used insulating materials for the waveguide substrate 100 include: aluminum oxide, which has good insulating properties and high-temperature stability. Silicon nitride, which is used for high-frequency and high-temperature applications and has good insulating properties. Polytetrafluoroethylene, used in some microwave circuits, polytetrafluoroethylene has low dielectric constant and low loss characteristics. Glass fiber, in some special applications, glass fiber substrates can also be used in the manufacture of waveguide communication devices 10.

[0072] The method for manufacturing the waveguide communication device 10 can be used to manufacture the aforementioned waveguide communication device 10. The method for manufacturing the waveguide communication device 10 includes the following steps 1 to 3.

[0073] Step 1: Fabricate the waveguide column 200, including material selection, molding, cutting, and surface treatment.

[0074] Step 2: Fabricate the waveguide substrate 100, including material selection, molding, cutting and surface treatment.

[0075] Step 3: Connect the waveguide pillar 200 to the integration surface 110 of the waveguide substrate 100 .

[0076] Manufacturing the waveguide communication device 10 involves material selection, forming, cutting, and surface treatment. The waveguide pillar 200 may be manufactured using a precision extrusion process, with the channel 210 surface treated during fabrication to improve corrosion resistance. The waveguide substrate 100 is typically manufactured using die-casting and machining processes.

[0077] It will be understood that the above embodiments are merely exemplary embodiments for illustrating the principles of the present invention, and the present invention is not limited thereto. Those skilled in the art will appreciate that various modifications and improvements can be made without departing from the spirit and substance of the present invention, and such modifications and improvements are also considered to be within the scope of protection of the present invention.

Claims

1. A waveguide communication device, comprising: a waveguide substrate having an integrated surface supporting microwave circuit elements; A waveguide column, wherein the waveguide column comprises a hole arranged along its axial direction, and the hole is used to transmit microwave signals; Wherein, one end of the waveguide column is arranged on the integrated surface, and the hole of the waveguide column is used to correspond to the microwave circuit element; The waveguide column and the waveguide substrate are connected after they are manufactured.

2. The waveguide communication device according to claim 1, wherein: The waveguide column and the waveguide substrate are connected by mechanical connection or bonding.

3. The waveguide communication device according to claim 2, wherein: The mechanical connection includes a threaded connection, a pin connection, a slot connection or a welding connection.

4. The waveguide communication device according to claim 1, wherein: The waveguide substrate is provided with a connection groove whose opening is located at the integration surface, and the connection groove is used to connect the waveguide column.

5. The waveguide communication device according to claim 1, wherein: The production of the waveguide column and the waveguide substrate includes material selection, molding, cutting and surface treatment.

6. The waveguide communication device according to claim 1 or 5, wherein: The production of the waveguide substrate includes a die-casting process and a machining process.

7. The waveguide communication device according to claim 1 or 5, wherein: The production of the waveguide column includes a precision extrusion process.

8. The waveguide communication device according to claim 1, wherein: The manufacturing of the waveguide column includes performing surface treatment on the channel during the manufacturing process to improve its corrosion resistance.

9. The waveguide communication device according to claim 1, wherein: The material of the waveguide column is metal or alloy.

10. A method for manufacturing a waveguide communication device, comprising: Manufacturing a waveguide column, including material selection, molding, cutting and surface treatment, wherein the waveguide column includes a hole arranged along its axial direction, and the hole is used to transmit microwave signals; Manufacturing a waveguide substrate, including material selection, molding, cutting and surface treatment, wherein the waveguide substrate has an integrated surface supporting microwave circuit elements, one end of the waveguide column is arranged on the integrated surface, and the channel of the waveguide column is used to correspond to the microwave circuit element; The waveguide column is connected to the integration surface of the waveguide substrate.

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