Connector assembly

Abstract

The invention relates to a connector assembly for connecting to an electronic device, the connector assembly comprising: a support member provided with a ridge, and a flexible planar circuit with an entrance portion parallel to a longitudinal axis of the support member, and a connection portion The flexible planar circuit comprises a first dielectric layer provided with a first signal line in a first direction transverse to the ridge at a first side of the first dielectric layer directed away from the support member. The connection portion comprises a first portion of the signal line. The ridge is arranged to deform the connection portion of the planar flexible circuit at the ridge transverse to the entrance portion of the flexible planar circuit to connect the first portion of the first signal line to a first contact of the electronic device, when the connector assembly is connected to the electronic device.

Description

[0001] Connector assembly

[0002] Field of the invention

[0003] The invention relates to a connector assembly for connecting electronic devices.

[0004] Background

[0005] The known connector assembly can be applied for connecting an external electronic control device to a cryogenic electronic system. The cryogenic electronic system may comprise, for example, qubit devices, quantum processors, sensing and detector systems, quantum internet apparatus, medical devices, cryptographic devices, classical computing processors, and any other electronic devices.

[0006] However, there are many other applications using cryogenic electronic circuits, such as multipixel superconducting photon detectors used in astronomy and quantum communication applications.

[0007] Cryogenic cooling equipment is provided for maintaining the cryogenic electronic circuits at the required operating temperature of near zero Kelvin. This cryogenic cooling equipment is often built up from a stack of separate temperature stages, wherein each lower stage is cooled down to a lower temperature. Due to the fundamentals of thermodynamics, the power required to progressively cool down to lower temperatures increases exponentially. For example, a typical cryogenic cooling equipment consumes 20-30 kW for managing a thermal load of 12-18 pW at 100 mK.

[0008] The electronic control device is typically placed outside the cryogenic equipment to prevent their power dissipation from heating up the cryogenic equipment as a whole and thus the cryogenic circuits as well. Therefore, a communication path is required for exchanging signals between cryogenic circuits at the final stage of the cryogenic equipment, through the top of the cryogenic equipment to the outside control electronics. Such path is typically constructed from a cascade of semi rigid transmission lines, usually coax cables, to bridge the distance and to intercept mechanical tension and vibrations during the cooling down procedure and operation.

[0009] Cryogenic circuits, such as qubit devices, require communication with the external control device for controlling the qubits and signaling back an actual state of each qubit to be to the control device. This also requires high frequency, HF, analogue signals. Typically, this signal can be in the range from low frequencies or DC to ultrahigh frequencies up to the infrared or visible wavelength ranges. Recent cryogenic qubit devices have an increasing number of qubits. Each qubit requires individual communication to the control device outside the cryogenic device. This individual communication requires an increasing number of transmission lines for the qubits. For example, the qubit device can comprise 96 qubits and requires at least 288 individual transmission lines that should be guided through subsequent thermal stages to the outside. The transmission lines may comprise coax connectors, for example, for bridging the consecutive stages of the cryogenic equipment. So, when the number of transmission lines increases, the total number of coax connectors in the transmission lines to bridge each stage is also increasing and relatively more space in the subsequent stages is required to accommodate for this increased number of coax connectors and may become a limiting condition for a further increase in numbers of qubits. The coax cables can be replaced by a flexible planar circuit to reduce the volume of the connector. For example, eight coax cables can be replaced by a flexible planar circuit comprising a dielectric layer provided with eight channels or signal lines and a conducting layer or ground layer provided at one or opposite sides of the dielectric layer. The flexible planar circuit can be connected to the cryogenic device via known connectors, for example, SubMiniature version A, SubMiniature Push on, SMP, or SubMiniature Push on Micro, SMPM. A problem may occur in the dimensions of the connector having multiple SMA or SMPMs that increases as the number of channels or signal lines increases. Furthermore, reducing the dimensions of the connector may give rise to deterioration of the transmitted signals and crosstalk between signal lines. Another problem is that the characteristics of the signal lines may not be constant due to temperature changes of the connector assembly.

[0010] Summary of the invention

[0011] It is therefore an object of the invention to mitigate the above indicated problems. According to the invention this and other objects are achieved by a connector assembly for connecting to an electronic device comprising a support member provided with a ridge, a flexible planar circuit provided with an entrance portion arranged parallel to a longitudinal axis of the support member and a connection portion, and comprising a first dielectric layer, a first signal line arranged in a first direction transverse to the ridge at a first side of the first dielectric layer directed away from the support member; wherein the connection portion of the flexible planar circuit is provided with a first portion of the signal line and the ridge is arranged to deform the connection portion of the flexible planar circuit at the ridge transverse to the entrance portion of the flexible planar circuit to connect the first portion of the first signal line to a first contact of the electronic device, when the connector assembly is connected to the electronic device. This arrangement allows a compact, flexible, and robust connection between the first signal line and the electronic device. In this arrangement the ridge can be shaped such that the connecting portion of flexible planar circuit is folded around the ridge such that the first signal line is at the outer side of the flexible planar circuit with respect to the ridge and is connected to the first contact of the electronic device. This arrangement enables a perpendicular arrangement of the connector assembly with respect to a plane of the electronic device comprising the first contact. Furthermore, this arrangement enables a compact extension of the number of signal lines in the connector assembly when multiple flexible planar circuits are stacked and / or the flexible planar circuit comprises multiple first signal lines. For example, this connector assembly can be used to connect an 8x8 array of contacts of a 64 channel qubit device or a 32 x32 array of contacts for a Ik channel qubit device.

[0012] In an further embodiment of the connector assembly the flexible planar circuit further comprises a second dielectric layer at the first signal line and the first side of the first dielectric layer, wherein the flexible planar circuit is provided with a first opening at the connection portion through the second dielectric layer arranged to open the first portion of the first signal line. In this arrangement the first signal line is covered at both sides with the first dielectric layer and the second dielectric layer.

[0013] In a further embodiment of the connector assembly the first opening is provided with a first via arranged to connect the first portion to the first contact of the electronic device. In this arrangement the contact surfaces of the electronic device can be about the same height or level. The first via can be a so called buried via. An advantage of the use of the first via is that it prevents delamination of the flexible planar circuit.

[0014] In a further embodiment of the connector assembly the flexible planar circuit further comprises a first conducting layer at a first side of the second dielectric layer, directed away from the first dielectric layer, the ridge is arranged to connect the first conducting layer to a second contact of the electronic device, when the connector assembly is connected to the electronic device. In this arrangement the flexible planar circuit comprising a microstrip formed by the first conducting layer, and the first and / or second dielectric layer, enables transfer of high frequency signals up to the infrared and visible wavelength ranges. The connector assembly connects the microstrip to the electronic device and enables transfer of high frequency signals up to the infrared and visible wavelength ranges. In a further embodiment of the connector assembly, the flexible planar circuit comprises a second conducting layer at a second side of the first dielectric layer opposite to the first side and a second via through the first dielectric layer in the connection portion of the flexible planar circuit, the second via is arranged to connect the second conducting layer to the second contact of the electronic device, when the connector assembly is connected to the electronic device. In this arrangement the flexible planar circuit comprising a microstrip formed by the second conducting layer, the first and / or second dielectric layer, enables transfer of high frequency signals up to microwave frequencies.

[0015] Also, a strip line can be formed when the first and the second conducting layers are present. The stripline also enables transfer of high frequency signals up to the infrared and visible wavelength ranges. The stripline also enables improved transmission characteristics. The advantage of this second via is that this second via also reduces delamination of the flexible planar circuit.

[0016] In a further embodiment of the connector assembly, the first signal line is arranged in a first end portion of the first dielectric layer, the first portion of the first signal line is an end portion of the first signal line at the connection portion, a second signal line (15) is provided at the first side of the first dielectric layer in a second direction transverse to the ridge at another end portion of the first dielectric layer, opposite to the first end portion, an end portion of the second signal line is arranged in the connection portion, the end portion of the second signal line is separated at a distance d from the end portion of the first signal line, the ridge is further arranged to connect the end portion of the second signal line (15) to a third contact (16) of the electronic device, when the connector assembly is connected to the electronic device. In this arrangement the first signal line and the second signal lines start at opposite ends of the flexible planar circuit. In this arrangement the number of signal lines of the connector assembly can be further increased. In an embodiment the opening is arranged to open the end portion of the second signal line.

[0017] In a further embodiment the flexible planar circuit is provided with a third via in the second dielectric layer, the third via is connected to the end portion of the second signal line and the ridge is further arranged to connect the second signal line to the third contact of the electronic device through the third via, when the connector assembly is connected to the electronic device. The third via can also be a buried via.

[0018] In a further embodiment of the connector assembly the second via is located between the end portions of the first signal line and the second signal line. One or more second vias can be located between the end portions of the respective first and second signal line. The second vias can be located at a line perpendicular to a line between the end portions of the first and second signal lines.

[0019] This arrangement of second vias reduces electro- magnetic interference between the first signal line and second signal line.

[0020] In a further embodiment of the connector assembly, the ridge comprises a resilient member arranged between the ridge and the flexible planar circuit. The resilient member can be spring, for example a flat spring, a leaf spring or a spring-loaded pin or pogo pin. Advantageously, the ridge and the spring can be made of a metal, for example, a beryllium copper alloy.

[0021] In a further embodiment the connection portion of the flexible planar circuit is provided with two slots at lateral sides of the first portion of the first signal line, the ridge is provided with a slit , and the slit is arranged to receive the first portion of the signal line when the connector assembly is connected to the electronic device In this arrangement the lateral dimensions of the first portion matches the lateral dimension of the slit. An advantage of this arrangement is the first signal line is shielded from ingressing radiation.

[0022] In a still further embodiment, the flexible planar circuit is provided with a further signal line parallel to the first signal line. The connection portion comprises a second portion of the further signal line arranged besides the second slot. The connection portion is further provided with a third slot at another lateral side of the second portion of the further signal line. The other lateral side is the side not directed to the second slot. Furthermore, the ridge is provided with a second slit arranged parallel to the first slit and the second slit is further arranged to receive the second portion of the further signal line when the connector assembly is connected to the electronic device. In this arrangement the dimensions of the portion of the ridge between the two slits match the dimensions of the second slot. In an embodiment the flexible planar circuit is provided with multiple signal lines and the ridge is provided with multiple slits, wherein the number of slits correspond with the number of signal lines. An advantage of this arrangement is that the first signal lines is shielded from radiation from the other signal line and from ingressing radiation.

[0023] In a further embodiment of the connector assembly the connector assembly further comprises a shield comprising an absorbing material to absorb ingressing radiation from the outside from DC to beyond visible light frequencies. This arrangement reduces ingressing radiation that may enter the electronic device.

[0024] In a further embodiment of the connector assembly the connector assembly is provided with a light photon barrier arranged to reduce light photon transport through the flexible planar circuit. Light photons may enter an electronic circuit comprising the qubits through the flexible planar circuit. The transferred light photons may negatively influence the qubits in the electronic device. The light photon barrier reduces transferred light photons through the flexible planar circuit to the qubits in the electronic device and thus may increase the coherence time of the qubits. The light photon barrier may comprise a bent portion of the flexible planar substrate. The bent portion transfers only a portion of light photons through the planar flexible transmission line, multiple bents or arches further reduces the amount of transferred light photons. The connector assembly can be provided with a channel to bend the flexible planar circuit.

[0025] The invention further relates to an electronic device comprising the connector assembly. The electronic device may comprise an electronic control circuit and a cryogenic electronic circuit. The connector assembly can be applied for communication between the electronic control circuit and the cryogenic circuit.

[0026] These and other features and effects of the present invention will be explained in more detail below with reference to drawings in which preferred and illustrative embodiments of the invention are shown. The person skilled in the art will realize that other alternatives and equivalent embodiments of the invention can be conceived and reduced to practice without departing from the scope of the present invention.

[0027] Brief description of the drawings

[0028] Fig. 1 A shows a bottom view of a connector assembly according to an embodiment of this disclosure;

[0029] Fig. IB shows a cross-section of a connector assembly according to an embodiment of this disclosure;

[0030] Fig. 1C shows a cross-section of a connector assembly according to an embodiment of this disclosure;

[0031] Fig. ID shows a cross-section of a connector assembly according to an embodiment of this disclosure;

[0032] Fig. IE shows a diagrammatical view of the side of the connection portion of the flexible planar substrate facing the ridge according to an embodiment of this disclosure;

[0033] Fig. IF shows diagrammatically a view of the ridge of the support facing the connection portion of the flexible planar substrate according to the embodiment referred to in Fig IE; Fig. 2A shows a cross-section of a connector assembly according to an embodiment of this disclosure;

[0034] Fig. 2B shows a cross-section of a connector assembly according to an embodiment of this disclosure;

[0035] Fig. 2C shows a cross-section of a connector assembly according to an embodiment of this disclosure;

[0036] Fig. 3 A shows a cross-section of a connector assembly according to an embodiment of this disclosure;

[0037] Fig. 3B shows a cross-section of a connector assembly according to an embodiment of this disclosure;

[0038] Fig. 4A shows a cross-section of a connector assembly according to an embodiment of this disclosure;

[0039] Fig. 4B shows a cross-section of a connector assembly according to an embodiment of this disclosure;

[0040] Fig. 5 shows a cross-section of a connector assembly according to an embodiment of this disclosure;

[0041] Fig. 6 shows a cross-section of a connector assembly according to an embodiment of this disclosure;

[0042] Fig. 7 shows a cross-section of a connector assembly according to an embodiment of this disclosure; and

[0043] Fig. 8 shows a cross-section of a connector assembly according to an embodiment of this disclosure.

[0044] Detailed description of embodiments

[0045] In the figures like numerals refer to similar components. The invention is explained with reference to Figs. 1-8.

[0046] The connector assembly can be used for connection of a flexible planar circuit to a cryogenic device, for example, a cryogenic electronic circuit at a temperature of about 1 mK.

[0047] The cryogenic electronic circuit can be a qubit device or an astronomic electronic circuit or other scientific instruments. Fig. 1 A shows diagrammatically a bottom view of a connector assembly 1 according to an embodiment of this disclosure. The bottom view shows a support member 2, a ridge 3 and a flexible planar circuit 4 comprising a first dielectric layer 5 (not shown) provided with an entrance portion 41 and a connection portion 42 and a first signal line 6 of the connector assembly 1.

[0048] Fig IB diagrammatically shows a cross-section of the connector assembly in a plane along line A-A’ perpendicular to the ridge 3 in Fig. 1 A. The support member 2 can be made of a block of polyethene. In an embodiment the block of polyethene can be coated with a conductive layer. In an embodiment the support member can be made of metal, for example copper, Cu. In an embodiment the support member comprises a superconducting material, for example, Aluminum, Al. The dimensions of the support member can be for example, 4 x 1 x 0.2 cm, L x W x T. The ridge 3 can be machined on a short edge of the block. The support 2 has a longitudinal axis 21. The ridge can have a semi- circular or rectangular section and can be adapted to a convenient shape for assembly and sufficient electrical contact. In an embodiment the outer surface of the support member 2 and the ridge 3 can be provided with a metal layer, for example aluminum or silver. In an embodiment the support member can be made of metal, for example beryllium copper.

[0049] The first signal line 6 is provided at a first side of the first dielectric layer 5 in a first direction transverse to the ridge 3, for example, along a longitudinal axis of the flexible planar circuit directed away from the support member 2. The first signal line 6 has a width of e.g., 0.15 mm and a thickness of 0.002 mm. The first signal line 6 is made of silver Ag. Also, gold Au, copper Cu, Aluminum Al or platinum Pt can be applied. The first signal line can also comprise further layers such as an adhesion layer, a barrier layer, a binding layer or a surface finish layer.

[0050] The first signal line can also comprise superconducting material, for example Niobium Nb, Niobium Titanium NbTi, or NiobiumTitaniumnitride, NbTiN. Entrance portion 41 of the flexible planar circuit 4 is arranged at the support member 2 along the longitudinal axis 21. A connection portion 42 of the flexible planar circuit 4 is arranged at the ridge 3 in a direction perpendicular or transverse to the entrance portion 41 of the flexible planar circuit. In this embodiment connection portion 42 of the flexible planar circuit 4 is bent partially around the ridge 3, such that the first signal line 6 is facing away from the ridge 3 and transverse to the entrance portion 41 of the flexible planar circuit 4. In this disclosure the connecting portion is the portion of the flexible planar circuit that can be bent around the ridge 3 when the connector assembly is connected to the electronic device. In the connected state the ridge 3 connects the first portion of the first signal line 6 to the first contact 7 of the electronic device 8, when the connector assembly 1 is connected to the electronic device 8.

[0051] The skilled person in the field will understand that the electrical connection can be formed by capacitive, inductive, or galvanic coupling. In this embodiment the flexible planar circuit 4 is folded around the ridge 3.

[0052] In embodiments multiple first signal lines 6 can be arranged besides each other with a mutual distance in the range between 300 pm and 1 mm, for example, 350 pm on the first side of the first dielectric layer 5.

[0053] In an embodiment the flexible planar circuit 4 can be provided with a second dielectric layer 9. In this arrangement a first opening is provided through the second dielectric layer 9 at the connection portion 42. The first opening is arranged to open the first portion of the first signal line 6. The dimensions of the opening are such that that the first signal line 6 can be connected to the first contact 7 of the electronic device 8. Also, in this embodiment the connection portion 42 of the flexible planar circuit 4 is folded around the ridge 3 transverse to the entrance portion 41 of the flexible planar circuit.

[0054] Furthermore, in an embodiment the connector assembly comprises a shield (not shown) comprising absorbing material to absorb ingressing radiation from the outside from DC to beyond visible light frequencies.

[0055] In an embodiment the connector assembly can comprise a magnetic field shield (not shown) to shield a portion of the connector assembly. The magnetic field shield can comprise p- metal or a superconductor. The superconductor can be, for example Niobium Nb, Niobium Titanium NbTi, NiobiumTitaniumnitride, NbTiN, or Indium, In. The planar flexible circuit 4 can have rectangular geometry with a length of e.g., 100 mm or 200 mm or 500 mm and a width of e.g., 4 mm. The first dielectric layer 5 can for example be polyimide or Polytetrafluorethylene, PTFE, or Ethylene tetrafluoride ethylene, ETFE. The thickness of the first dielectric layer can be, for example, 0.15 mm.

[0056] Fig 1C shows diagrammatically a cross-section of a connector assembly of an embodiment like that as described with relation to Fig. IB. In addition, in this embodiment the ridge comprises a resilient member 31 arranged between the ridge and the flexible planar substrate to generate a dynamic force towards the flexible planar substrate 4 and the first contact 7. The resilient member 31 can be a spring, for example, a flat spring, a leaf spring, or spring loaded pin, or pogo pin arranged in the apex of the ridge 3 facing the planar flexible circuit 4. An advantage of the resilient member 31 is that it compensates mechanical stress between the first portion of the first signal line and the contact of the electronic device that may occur due different thermal expansion coefficients deteriorating a reliable connection when an external electronic device is operated at low temperature, for example 4K. Furthermore, the resilient member 31 compensates mechanical stress caused by assembly of the connector assembly to the external apparatus as well as to compensate for mechanical tolerances in manufacturing of the connector assembly. The person skilled in the art can dimension the resilient member depending on the specific application and occurring stresses. Advantageously, the ridge and the pogo pin can be made of metal. For example, a beryllium copper alloy.

[0057] Fig. ID shows diagrammatically a cross-section of the connector assembly in a plane along the line A- A’ perpendicular to the ridge 3 of Fig. IB according to an embodiment of this disclosure. In this embodiment the first opening is provided with a first via 12 in the connection portion 41 of the flexible planar circuit 4. In this embodiment the ridge 3 is arranged to deform the connection portion of the flexible planar circuit such that the connection portion 42 is folded along a line perpendicular to the entrance portion 41 of the flexible planar circuit and connecting the signal line 6 to the first contact 7 though the first via 12.

[0058] Fig. IE shows diagrammatically, a view of the side of the connection portion 42 of the flexible planar substrate 1 facing the ridge 3 according to an embodiment of this disclosure.

[0059] Fig IF shows diagrammatically a view of the ridge 3 of the support facing the connection portion 42 of the flexible planar substrate according to the embodiment referred to in Fig IE. In this embodiment the ridge is made of metal, for example copper, Cu. Furthermore, the connection portion of the flexible planar circuit is provided with two slots 60,60’ at lateral sides of the first signal line 6. The flexible planar circuit is further provided with a further signal line 6’ parallel to the first signal line 6 and a third slot 60” at another lateral side of the further signal line 6’ not directed to the second slot 60’.

[0060] Furthermore, the ridge 3 is provided with two parallel slits 60, 60’. The lateral dimension of the slits 61,61’ correspond to the lateral dimension of the signal lines 6,6 at the connection portion. The depths of the slits 60, 60’ are equal to the thickness of the first dielectric layer and the thickness of the first signal line 6’ or the further signal 6’. The slits 61, 61’are arranged to receive the connection portion of the flexible planar circuit comprising the first signal line 6 and the further signal line 6’, when the connector assembly is connected to the electronic device .An advantage of this embodiment is that the first signal line 6 and the further signal line 6’ are now shielded by the walls of the slits 60,61 against ingressing radiation. Fig. 2A shows diagrammatically a cross-section of the connector assembly in a plane along the line A- A’ perpendicular to the ridge 3 of Fig. IB according to an embodiment of this disclosure. In this embodiment the first dielectric layer 5 and the first signal line 6 of the flexible planar circuit 4 are like those of the flexible planar circuit as described with reference the fig. IB. Furthermore, the flexible planar circuit 4 is provided with a second dielectric layer 9 at the first signal line 6 and the first dielectric layer 5. The second dielectric layer 9 can be like the first dielectric layer 5. Furthermore, the flexible planar substrate is provided with a first conducting layer 10 at an opposite side of the second dielectric layer 9 facing away from the first side of the first dielectric layer 5. The first conducting layer 10 is made of silver Ag. Also, gold Au, copper Cu, Aluminum or platinum Pt can be applied. The thickness of the first conducting layer 10 is in the range from 100 nm to 18 pm, for example 2 pm for a silver- layer. In an embodiment the first conducting layer 10 comprises a superconductor, for example one of Niobium Nb, Niobium Titanium NbTi, NiobiumTitaniumnitride, NbTiN, and Indium, In. In an embodiment the first conducting layer comprises a resistive film, for example, one of Nichrome, NiCr, Carbon C and IndiumTinOxide, ITO. The first opening in the second dielectric layer 9 is not covered with the first conducting layer 10. In this embodiment the flexible planar circuit 4 is bent partially around the ridge 3 such that the connection portion 42 is transverse to the entrance portion 41 of the flexible planar circuit and the first signal line 6 and the first conducting layer 10 are faced away from the ridge when the connector assembly is connected to the electronic device. The ridge 3 of the connector assembly connects the first end portion 61 of the first signal line 6 to the first contact 7 of the electronic device 8 and the first conducting layer 10 to a second contact 11 of the electronic device respectively, when the connector assembly is connected to the electronic device. Also, in this embodiment the flexible planar circuit 4 is folded around the ridge 3.

[0061] In embodiments multiple first signal lines 6 can be arranged besides each other with a mutual distance between 300 pm and 1 mm, for example, 350 pm on the first side of the first dielectric layer 5. In this embodiment the flexible planar circuit comprises a microstrip formed by the first dielectric layer, the first signal line, the second dielectric layer and the first conducting layer. The connector assembly connects the microstrip to the electronic device and enables transfer of high frequency signals up to the infrared and visible ranges. The multiple first signal lines can be used either as signal lines or as grounding lines. In an embodiment the signal lines are separated by grounding lines.

[0062] Fig. 2B shows diagrammatically a cross-section of the connector assembly in a plane along the line A-A’ perpendicular to the ridge 3 according to an embodiment of this disclosure. In this embodiment the first dielectric layer 5, the second dielectric layer 9, the first conducting layer 10 and the first signal line 6 of the flexible planar circuit are like those of the flexible planar circuit is as described with reference to Fig. 2A. In this embodiment the first opening in the flexible planar circuit 4 comprises a first via 12 through the second dielectric layer 9 at the connection portion 42 of the flexible planar circuit and connected with the first signal line 6. This first via can be a well-known buried via. The first via 12 can have a diameter in the range between 10 and 100 pm, for example 50 pm. In this embodiment the flexible planar circuit 4 is bent partially around the ridge 3 such that the connection portion 42 is transverse to the entrance portion 41 of the flexible planar circuit. The ridge 3 connects respectively the first signal line 6 to the first contact 7 through the first via 12 and the first conducting layer 10 to the second contact 11, when the connector assembly is connected to the electronic device. In this arrangement a microstrip is formed by the first conducting layer 10, the signal line 6 and the first and second dielectric layers 5,9. The connector assembly connects the microstrip to the electronic device and enables transfer of high frequency signals up to infrared and visible wavelength ranges. An advantage of this arrangement is that the contact surfaces of the contacts 7, 11 of the electronic device 8 can be about the same height or level. In embodiments multiple first signal lines 6 can be arranged besides each other with a mutual distance between 300 p and 1 mm on the first side of the first dielectric layer 5. For example, the number of signal lines can be 8, 16 or more.

[0063] In embodiments the flexible planar circuits can have multiple first and second dielectric layers wherein the first signal lines are arranged between the first and second dielectric layers, respectively.

[0064] Fig. 2C shows diagrammatically a cross-section of the connector assembly in a plane along the line A-A’ perpendicular to the ridge 3 according to an embodiment of this disclosure. In this embodiment the first dielectric layer 5, the second dielectric layer 9 and the first signal line 6 of the flexible planar circuit are like those of the flexible planar circuit is as described with reference to Fig. 2A. In this embodiment the flexible planar circuit 4 is provided with a second conducting layer 13 at a second side of the first dielectric layer 5 opposite the first side. Furthermore, the flexible planar circuit comprises a second via 14 in the first dielectric layer 5 and the second dielectric layer 9 in the connection portion 42 of the flexile planar circuit. The second via 14 is connected to the second conducting layer 13. The ridge 3 connects the first signal line 6 to the first contact 7 through the first opening and the second conducting layer 13 to the second contact 11 through the second via 14, when the connector assembly is connected to the electronic device. Also, in this embodiment the flexible planar circuit 4 is folded around the ridge 3.

[0065] In this arrangement a microstrip is formed by the second conducting layer 13, the signal line 6 and the first and second dielectric layers 5,9. The connector assembly connects the microstrip to the electronic device and enables transfer of high frequency signals up to infrared and visible wavelength ranges.

[0066] In embodiments multiple first signal lines 6 can be arranged besides each other with a mutual distance between 300 p and 1 mm on the first side of the first dielectric layer 5. For example, the number of signal lines can be 8, 16 or more.

[0067] Fig. 2D shows diagrammatically a cross-section of the connector assembly in a plane along the line A-A’ perpendicular to the ridge 3 according to an embodiment of this disclosure. In this embodiment the first dielectric layer 5, the second dielectric layer 9, the first signal line 6, the second conducting layer 13 and the second via’s 14 of the flexible planar circuit are like those of the flexible planar circuit is as described with reference to Fig. 2C. Furthermore, in this embodiment the flexible planar circuit 4 comprises a first conducting layer 10. In this embodiment the first opening comprises the first via 12 provided in the second dielectric layer 9 at the connection portion of the flexible planar circuit. The second conducting layer 13 is connected to the first conducting layer 10 through the second via 14. In this embodiment the flexible planar circuit 4 is bent partially around the ridge 3 such that the connection portion 42 is transverse to the entrance portion 41 of the flexible planar circuit. The ridge 3 connects respectively the first signal line 6 to the first contact 7 via the first via 12 and the second conducting layer 13 to the second contact 11 via the second via 14, when the connector assembly is connected to the electronic device.

[0068] An advantage of this arrangement is that the contact surfaces of the contacts 7,11 of the electronic device 8 can be about the same height or level.

[0069] In embodiments multiple first signal lines 6 can be arranged besides each other with a mutual distance between 300 pm and 1 mm, for example, 350 pm on the first side of the first dielectric layer 5. In this embodiment the flexible planar circuit comprises a microstrip formed by the first dielectric layer, the first signal line, the second dielectric layer and the first conducting layer. The connector assembly connects the microstrip to the electronic device and enables transfer of high frequency signals up to infrared and visible wavelength ranges. The first signal lines can be used either as signal lines or as grounding lines. In an embodiment the signal lines are separated by grounding lines. Fig. 3 A shows diagrammatically a cross-section of the connector assembly in a plane along the line A-A’ perpendicular to the ridge 3 according to an embodiment of this disclosure. In this embodiment the first dielectric layer 5, the second dielectric layer 9, the second conducting layer 13, the signal line 6 and the second via’s 14 are like those of the flexible planar circuit as described with reference to Fig. 2C. Furthermore, in this embodiment the flexible planar circuit 4 is also provided with the first conducting layer 10 at the first side of the second dielectric layer 9 directed away from the first dielectric layer 5. The first opening in the second dielectric layer 9 at the connection portion is not covered with the first conducting layer 10. In this embodiment the flexible planar circuit 4 is bent partially around the ridge 3 such that the connection portion 42 is transverse to the entrance portion 41 of the flexible planar circuit. The ridge 3 connects respectively the first signal line 6 to the first contact 7 of the electronic device 8, the first conducting layer 10 and the second conducting layer 13 to the second contact 11 of the electronic device through the second via 14, when the connector assembly is connected to the electronic device.

[0070] In this embodiment the flexible planar circuit comprises a stripline formed by the two conducting layers 10,13, the signal line 6 and the first and second dielectric layer 5,9. This stripline enables transfer of high frequency signals up to the infrared and visible wavelength ranges. Furthermore, in embodiments multiple first signal lines 6 can be arranged besides each other with a mutual distance in the range between 300 p and 1 mm, for example, 350 pm on the first side of the first dielectric layer 5. The multiple first signal lines can be used either as a signal line or as grounding line. In an embodiment the signal lines and the groundlines are alternately arranged besides each other.

[0071] Fig. 3B shows diagrammatically a cross-section of the connector assembly in a plane along the line A-A’ perpendicular to the ridge 3 according to an embodiment of this disclosure. In this embodiment the first dielectric layer 5, the second dielectric layer 9, the first conducting layer 10, the second conducting layer 13 and the signal line 6 and the second vias 14 are like those of the flexible planar circuit as described with reference to Fig. 3A.

[0072] Furthermore, the first opening in the second dielectric layer 9 is provided with the first via 12 in the connection portion. In this embodiment the flexible planar circuit 4 is bent partially around the ridge 3 such that the connection portion 42 is transverse to the entrance portion 41 of the flexible planar circuit. The ridge 3 connects respectively the first signal line 6 to the first contact 7 of the electronic device 8 through the first via 12, and the first conducting layer 10 and the second conducting layer 13 to the second contact 11 of the electronic device through the second via 14, when the connector assembly is connected to the electronic device. Also, in this embodiment the flexible planar circuit comprises a stripline formed by the two conducting layers 10,13, the signal line 6 and the first and second dielectric layer 5,9. The connector assembly connects the stripline to the electronic device and enables transfer of high frequency signals up to infrared and visible wavelength ranges.

[0073] An advantage of this arrangement is that the contact surfaces of the contacts 7,11 of the electronic device 8 can be about the same height or level. Furthermore, in embodiments multiple first signal lines 6 can be arranged besides each other with a mutual distance in the range between 300 pm and 1 mm, for example, 350 pm on the first side of the first dielectric layer 5. The multiple first signal lines can be used either as a signal line or as grounding line. In an embodiment the signal lines and the grounding lines are alternately arranged besides each other.

[0074] Fig. 4A shows diagrammatically a cross-section of the connector assembly in a plane along the line A-A’ perpendicular to the ridge 3 according to an embodiment of this disclosure. In this embodiment the first dielectric layer 5 is like the first dielectric layer as described with reference to Fig. IB. Furthermore, in this embodiment the first signal line 6 is arranged at the first side of the first dielectric layer in a first end portion of the first dielectric layer 5. Furthermore, a second signal line 15 is provided at the first side of the first dielectric layer 5 in a second direction transverse to the ridge 3 at the other end portion at the first side of the first dielectric layer, opposite to the first end portion. In this embodiment the first signal line 6 is in line with the second signal line 15. The end portion of the first signal line 6 is in the connection portion of the flexible planar circuit and an end portion of the second signal line 15 is also located in the connecting portion. The end portion of the second signal line 15 is separated at a distance d from the end portion of first signal line 6. Furthermore, the ridge 3 connects respectively the first signal line 6 to the first contact 7 and the second signal line 15 to a third contact 16 of the electronic device 8, when the connector assembly is connected to the electronic device. Also, in this embodiment the flexible planar circuit 4 is folded partially around the ridge 3 such that the connection portion 42 is transverse to the entrance portion 41 of the flexible planar circuit. An advantage of this arrangement is that the number of signal lines on the flexible substrate can be further increased.

[0075] Fig. 4B shows diagrammatically a cross-section of the connector assembly in a plane along the line A-A’ perpendicular to the ridge 3 according to an embodiment of this disclosure. In this embodiment the first dielectric layer 5, the first signal line 6 and second signal line 15 are like those as those of the flexible planar circuit as described with reference to Fig. 4A. Furthermore, in this embodiment this flexible planar circuit is provided with a second dielectric layer 9 at the first side of the first dielectric layer, the second dielectric layer 9 is provided with a first opening in the connection portion. Furthermore, a first conducting layer 10 is provided at the second dielectric layer at a first side facing away from the first dielectric layer 9, a second conducting layer 13 is provided at the second side of the first dielectric layer 5 opposite to the first side and a second via 14 is provided through the first dielectric layer 5and the second dielectric layer 9. The second via connects the first conducting layer 10 and the second conducting layer 13. The first opening comprises a first via 12 and a third via 17 in the connection portion of the second dielectric layer 9. The third via 17 can a buried via.

[0076] In this embodiment the ridge 3 connects respectively the first signal line 6 to the first contact 7 through the first via 12 and the second signal line 15 to a third contact 16 of the electronic device 8 through the third via 17, and the first conducting layer 10 and the second conducting layer 13 to the second contacts 11 through the second vias 14, when the connector assembly is connected to the electronic device. Also, in this embodiment the flexible planar circuit 4 is folded around the ridge 3 such that the connection portion 42 is transverse to the entrance portion 41 of the flexible planar circuit. In this embodiment the flexible planar circuit comprises two striplines formed respectively by the two conducting layers 10,13, the signal lines 6 15 and the first and second dielectric layer 5,9. The connector assembly connects the striplines to the electronic device and enables transfer of high frequency signals up to infrared and visible wavelength ranges.

[0077] In embodiments multiple, for example 8, first signal lines 6 and second signal lines 15 can be arranged besides each other with a mutual distance in the range between 300 pm and 1 mm, for example 350 pm on the first side of the first dielectric layer 5. The multiple first signal lines 6 and second signal line 15 can be used either as a signal line or as grounding line. In an embodiment signal lines and groundlines are alternately arranged besides each other.

[0078] Fig 5 shows diagrammatically a bottom view of the flexible planar circuit 4. In this embodiment the flexible planar is like the flexible planar circuit as described with reference to Fig. 4B provided with a first signal line 6 and a second signal line 15. Furthermore, the first via 12 is connected to the end of the first signal line 6 and the third via 17 is connected to the end of the second signal line 15. Furthermore, the flexible planar circuit is provided with second vias 14 at both sides of the end of the first signal line 6 and the end of the second signal line 15 through the first dielectric layer and the second dielectric layer at the connection portion. The second via 14 connects the first conducting layer 12 and the second conducting layer 13. Also, in this embodiment the flexible planar circuit 4 is folded around the ridge 3 such that the connection portion 42 is transverse to the entrance portion 41 of the flexible planar circuit. This arrangement of second vias reduces electro- magnetic interference with the first signal line.

[0079] Fig. 6 shows diagrammatically a bottom view of the flexible planar circuit 4 according to an embodiment of this disclosure. In this embodiment the flexible planar is like the flexible planar circuit is as described with reference to Fig. 5. Furthermore, in this embodiment the flexible planar circuit is provided with four first signal lines 6 and four second signal lines 15. Furthermore, in the connection portion the end of the first signal lines 6 are provided with first vias 12 and the ends of the second signals 15 are provided with third vias 17. Furthermore, second vias 14 are provided between the ends of the first signal line 6 and the ends of the second signal lines 15 to connect the first conducting layer 10 and the second conducting layer 13. This arrangement of the second vias reduces crosstalk between the first signal lines and second signal lines.

[0080] Fig. 7 shows diagrammatically a side view of a connector assembly according to an embodiment of this disclosure. In this embodiment the support member 2 is provided with four ridges 3 and four flexible planar circuits 4. The flexible planar circuits are stacked beside each other in the connector assembly. The flexible planar circuits 4 are bent in a loop, so that the connecting portions are bent around the ridges 3. The ends of the first signal lines and the second signal lines of the flexible planar circuits 4 can be connected to control devices or other peripheral devices. Furthermore, each flexible planar circuits can be provided with multiple first signal lines and multiple second signal lines. The number of first signals lines are, for example, eight and the number of second signal lines is, for example, eight. In this embodiment each flexible planar circuit comprises 16 signal lines and the connector assembly has 64 signal lines in total. The number of signals in the connector assembly can be further extended by either increasing of the number of flexible planar circuits or the number of signal lines per flexible planar circuits.

[0081] In an embodiment the connector assembly is provided with a shield 19 comprising an absorbing material arranged to absorb ingressing radiation from the outside from DC to beyond visible light frequencies. The absorbing material can be conducting particles, resistive particles or carbon powder in a binding material or thermo-setting material.

[0082] In an embodiment the connector assembly is provided with a magnetic field shield 20 arranged to magnetically shield the connector assembly. The magnetic field shield comprises a superconducting material or p -metal. The superconducting material can be one of Niobium Nb, Niobium Titanium NbTi, NiobiumTitaniumnitride, NbTiN, and Indium, In. Fig. 8 shows diagrammatically a side view of a connector assembly according to an embodiment of this disclosure. The connector assembly 1 comprises a support member 2 provided with a ridge 3 and a flexible planar circuit 4. Furthermore, the support member 2 comprises a light photon barrier. The light photon barrier is provided with a channel 18. The channel is provided with 4 corners. Furthermore, the flexible planar circuit 4 is folded into the channel 18 and around the ridge 3. In this embodiment the light photon barrier reduces EM radiation that may enter the flexible planar circuit 4 from the outside of the connector assembly and that is transferred through the flexible planar circuit to the electronic device. This EM-radiation can have a wavelength up to infra-red ranges and visible light ranges.

[0083] Although illustrative embodiments of the present invention have been described with reference to the accompanying drawings, it is to be understood that the invention is not limited to these embodiments. Various changes or modifications may be affected by one skilled in the art without departing from the scope or the spirit of the invention as defined in the claims. Accordingly, reference throughout this specification to "one embodiment" or "an embodiment" means that a particular feature, structure, or characteristic described in connection with the embodiment is included in at least one embodiment of the present invention. Thus, the appearances of the phrases "in one embodiment" or "in an embodiment" in various places throughout this specification are not necessarily all referring to the same embodiment. Furthermore, it is noted that the particular features, structures, or characteristics may be combined in any suitable manner in one or more embodiments.

Claims

CLAIMS1. A connector assembly (1) for connecting to an electronic device comprising: a support member (2) provided with a ridge (3); a flexible planar circuit (4) provided with an entrance portion (41) arranged parallel to a longitudinal axis (21) of the support member and a connection portion (42), and comprising a first dielectric layer (5); a first signal line (6) arranged in a first direction transverse to the ridge at a first side of the first dielectric layer directed away from the support member (2); wherein the connection portion (42) of the flexible planar circuit comprises a first portion of the signal line (6) and the ridge (3) is arranged to deform the connection portion (42) of the planar flexible circuit at the ridge transverse to the entrance portion (41) of the flexible planar circuit (4) to connect the first portion of the first signal line (6) to a first contact (7) of the electronic device (8), when the connector assembly is connected to the electronic device.

2. The connector assembly of claim 1, wherein the flexible planar circuit (4) further comprises a second dielectric layer (9) at the first signal line (6) and the first side of the first dielectric layer (5), the second dielectric layer is provided with a first opening at the connection portion through the second dielectric layer arranged to open the first portion of the first signal line.

3. The connection assembly of claim 2 wherein the first opening comprises a first via (12) arranged to connect the first portion to the first contact (7) of the electronic device (8).

4. The connector assembly of claim 2 or 3, wherein the flexible planar circuit comprises a first conducting layer (10) at a first side of the second dielectric layer (9), directed away from the first dielectric layer (5), the ridge (3) is arranged to connect the first conducting layer (10) to a second contact (11) of the electronic device, when the connector assembly is connected to the electronic device.

5. The connector assembly of any one of the claims 1-4, wherein the flexible planar circuit comprises a second conducting layer (13) at a second side of the first dielectric layer (5) opposite to the first side and a second via (14) through the first dielectric layer (5) in the connection portion of the flexible planar circuit, the second via is arranged to connect the second conducting layer (13) to a second contact (11) of the electronic device through the second via (14), when the connector assembly is connected to the electronic device.

6. The connector assembly of claim 1- 5, wherein the first signal line (6) is arranged in a first end portion of the first dielectric layer (5), the first portion of the first signal line is an end portion of the first signal line at the connection portion, a second signal line (15) is provided, at the first side of the first dielectric layer (5) in a second direction transverse to the ridge at another end portion of the first dielectric layer, opposite to the first end portion, an end portion of the second signal line is arranged in the connection portion, the end portion of the second signal line is separated at a distance from the end portion of the first signal line, the ridge is further arranged to connect the end portion of the second signal line (15) to a third contact (16) of the electronic device, when the connector assembly is connected to the electronic device.

7. The connector assembly of claim 6 when referring to claim 2 to 5, wherein the flexible planar circuit is provided with a third via (17) through the second dielectric layer, the third via is arranged to connect the end portion of the second signal line to the third contact (16).

8. The connector assembly of claim 6 or 7, when referring to claim 5, wherein the second via (14) is located between the end portions of the first signal line (6) and the second signal line (15).

9. The connector assembly of one of the claims 1-8 comprising a resilient member (31) arranged between the ridge and the connection portion of flexible planar circuit.

10. The connecter assembly of claim 1, wherein the connection portion of the flexible planar circuit is provided with two slots at lateral sides of the first portion of the first signal line, the ridge is provided with a slit , and the slit is arranged to receive the first portion of the signal line when the connector assembly is connected to the electronic device.

11. The connector assembly of claim 10, wherein the flexible planar circuit is provided with a further signal line parallel to the first signal line, the connection portion comprising a second portion of the further signal line arranged besides the second slot, the connection portion is further provided with a third slot at another lateral side of the second portion of the second signal line side, not directed to the second slot, and the ridge is provided with a second slit parallel to the first slit, the second slit arranged to receive the second portion of further signal line when the connector assembly is connected to the electronic device.

12. The connector assembly of any of the claims 1 - 11, further comprising a shield comprising an absorbing material arranged to absorb ingressing radiation from the outside from DC to beyond visible light frequencies.

13. The connector assembly of any of the claims 1 - 12, further comprising a light photon barrier (18) arranged to reduce light photon transport to the electronic device.

14. Electronic system comprising a connector assembly according to any of the claims 1

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