Banknote handling device and conversion table creation method

Abstract

In a banknote handling device (1), a memory (12) of a thickness sensor module (10) stores a plurality of pieces of reference data indicating association between a detection value of a thickness sensor (11) and a measurement value of the thickness of a banknote. A processor (21) of a control board (20) reads the plurality of pieces of reference data stored in the memory (12) from the memory (12), creates a conversion table for converting the detection value into the measurement value on the basis of the read plurality of pieces of reference data, and writes the created conversion table into the memory (12).

Description

Banknote handling device and conversion table creation method

[0001] The present disclosure relates to a banknote handling machine and a method for creating a conversion table.

[0002] A banknote handling device used in an automated teller machine (ATM) or the like has a banknote validation unit that validates banknotes. The banknote validation unit has, for example, a transport mechanism that transports banknotes and multiple types of sensor modules used to validate the banknotes transported by the transport mechanism. One example of the sensor module used to validate banknotes is a thickness sensor module that measures the thickness of the banknote.

[0003] JP 2023-057402 A JP 2022-042446 A

[0004] Since the sensitivity of the thickness sensors in the thickness sensor module varies from one to another, different detection values ​​may be output from the thickness sensors for banknotes having the same thickness.

[0005] In response to this, after the thickness sensor module is incorporated into a banknote handling device, an adjustment (hereinafter sometimes referred to as "sensor adjustment") is performed for each banknote handling device, in which a reference medium having a predetermined thickness is used to calculate a correction coefficient so that the different detection values ​​output by each thickness sensor for the reference medium become the same measurement value.

[0006] However, if the sensor adjustment using the reference medium as described above were performed for each banknote handling device, the number of steps in the manufacturing phase of the banknote handling device would increase.

[0007] Therefore, the present disclosure proposes a technique that can reduce the number of steps in the manufacturing phase of a banknote handling machine.

[0008] The banknote handling machine of the present disclosure includes a thickness sensor module and a control board. The thickness sensor module includes a thickness sensor that detects the thickness of a banknote and a memory. The control board includes a processor. The processor reads from the memory a plurality of reference data that indicate correspondence between detection values ​​of the thickness sensor and measured values ​​of the banknote thickness, the reference data being stored in the memory. The processor also creates a conversion table for converting the detection values ​​into the measured values ​​based on the plurality of reference data read from the memory, and writes the created conversion table to the memory.

[0009] According to the disclosed technology, it is possible to reduce the number of steps in the manufacturing phase of a banknote handling machine.

[0010] Fig. 1 is a diagram showing an example of the configuration of a banknote handling apparatus according to the present disclosure. Fig. 2 is a diagram showing an operation example 1 in the manufacturing phase of a banknote handling apparatus according to the present disclosure. Fig. 3 is a diagram showing an operation example 2 in the manufacturing phase of a banknote handling apparatus according to the present disclosure. Fig. 4 is a diagram showing an operation example 3 in the manufacturing phase of a banknote handling apparatus according to the present disclosure. Fig. 5 is a diagram showing an example of a processing procedure in a banknote handling apparatus according to the present disclosure.

[0011] Hereinafter, an embodiment of the present disclosure will be described with reference to the drawings.

[0012] [Example] <Configuration of banknote handling device> Fig. 1 is a diagram showing an example configuration of a banknote handling device according to the present disclosure. In Fig. 1, the banknote handling device 1 has a thickness sensor module 10 and a control board 20. The thickness sensor module 10 has a thickness sensor 11, a memory 12, and a connector 13. The control board 20 has a processor 21 and a connector 22. The thickness sensor module 10 and the control board 20 are connected via the connector 13 and the connector 22.

[0013] <Operation of the Banknote Handling Apparatus> Figures 2, 3, and 4 are diagrams showing examples of operation in the manufacturing phase of the banknote handling apparatus of the present disclosure. Figure 2 shows operation example 1 when the thickness sensor 11 is thickness sensor SA, Figure 3 shows operation example 2 when the thickness sensor 11 is thickness sensor SB, and Figure 4 shows operation example 3 when the thickness sensor 11 is thickness sensor SC. The thickness sensors SA, SB, and SC are sensors of the same model. However, because the sensitivity of each of the thickness sensors SA, SB, and SC varies, different detection values ​​are output from each of the thickness sensors SA, SB, and SC for banknotes of the same thickness. Therefore, in this embodiment, a table (hereinafter sometimes referred to as a "conversion table") for converting the detection value of the thickness sensor 11 (hereinafter sometimes referred to as a "sensor detection value") into a banknote thickness measurement value (hereinafter sometimes referred to as a "thickness measurement value") is created for each of the thickness sensors SA, SB, and SC as follows.

[0014] <Operation Example 1 (FIG. 2)> Operation example 1 shown in FIG. 2 is an example of operation in the manufacturing phase of the banknote handling machine 1 when the thickness sensor 11 is the thickness sensor SA.

[0015] 2, in the manufacturing phase of the banknote handling machine 1, first, the processor 21 reads from the memory 12 reference data DA1, DA2, DA3, DA4, and DA5, which indicate correspondences between the sensor detection values ​​of the thickness sensor SA and the thickness measurements. In the reference data DA1, a sensor detection value of 36546 corresponds to a thickness measurement value of 0.4 mm, in the reference data DA2, a sensor detection value of 34283 corresponds to a thickness measurement value of 0.7 mm, in the reference data DA3, a sensor detection value of 32692 corresponds to a thickness measurement value of 1.0 mm, in the reference data DA4, a sensor detection value of 31626 corresponds to a thickness measurement value of 1.3 mm, and in the reference data DA5, a sensor detection value of 30940 corresponds to a thickness measurement value of 1.6 mm.

[0016] Here, the reference data DA1, DA2, DA3, DA4, and DA5 are acquired in advance by the manufacturer of the thickness sensor module 10 before shipping the thickness sensor module 10 and written to the memory 12. In other words, the thickness sensor module 10 having the thickness sensor SA is shipped from the manufacturer of the thickness sensor module 10 with the reference data DA1, DA2, DA3, DA4, and DA5 written in the memory 12, and delivered to the manufacturer of the banknote handling machine 1. At the manufacturer of the banknote handling machine 1, after the thickness sensor module 10 with the reference data DA1, DA2, DA3, DA4, and DA5 written in the memory 12 is connected to the control board 20, the processor 21 reads the reference data DA1, DA2, DA3, DA4, and DA5 from the memory 12.

[0017] Next, the processor 21 uses interpolation to create a conversion table TA for converting the sensor detection values ​​of the thickness sensor SA into thickness measurement values ​​based on the reference data DA1, DA2, DA3, DA4, and DA5 read from the memory 12. The conversion table TA shown in FIG. 2 is a conversion table for the thickness sensor SA, and is formed from, for example, 1,600 data points obtained by interpolation over a thickness measurement range of 0 mm to 1.6 mm. Note that 1,600 data points are just an example, and the number of data points obtained by interpolation may be changed depending on the thickness detection range and thickness detection accuracy.

[0018] Then, the processor 21 writes the created conversion table TA into the memory 12 .

[0019] <Operation Example 2 (FIG. 3)> Operation example 2 shown in FIG. 3 is an example of operation in the manufacturing phase of the banknote handling machine 1 when the thickness sensor 11 is the thickness sensor SB.

[0020] 3, in the manufacturing phase of the banknote handling machine 1, the processor 21 first reads from the memory 12 reference data DB1, DB2, DB3, DB4, and DB5, which indicate correspondences between the sensor detection values ​​of the thickness sensor SB and the thickness measurement values. In reference data DB1, a sensor detection value of 42572 corresponds to a thickness measurement value of 0.4 mm, in reference data DB2, a sensor detection value of 39042 corresponds to a thickness measurement value of 0.7 mm, in reference data DB3, a sensor detection value of 36682 corresponds to a thickness measurement value of 1.0 mm, in reference data DB4, a sensor detection value of 35222 corresponds to a thickness measurement value of 1.3 mm, and in reference data DB5, a sensor detection value of 34396 corresponds to a thickness measurement value of 1.6 mm.

[0021] Here, the reference data DB1, DB2, DB3, DB4, and DB5 are acquired in advance by the manufacturer of the thickness sensor module 10 before shipping the thickness sensor module 10 and written to the memory 12. In other words, the thickness sensor module 10 having the thickness sensor SB is shipped from the manufacturer of the thickness sensor module 10 with the reference data DB1, DB2, DB3, DB4, and DB5 written in the memory 12, and delivered to the manufacturer of the banknote handling machine 1. At the manufacturer of the banknote handling machine 1, after the thickness sensor module 10 with the reference data DB1, DB2, DB3, DB4, and DB5 written in the memory 12 is connected to the control board 20, the processor 21 reads the reference data DB1, DB2, DB3, DB4, and DB5 from the memory 12.

[0022] Next, the processor 21 creates a conversion table TB for converting the sensor detection values ​​of the thickness sensor SB into measured thickness values ​​using interpolation based on the reference data DB1, DB2, DB3, DB4, and DB5 read from the memory 12. The conversion table TB shown in Fig. 3 is a conversion table for the thickness sensor SB, and is formed from, for example, 1600 data points obtained by interpolation in the range of measured thickness values ​​from 0 mm to 1.6 mm.

[0023] Then, the processor 21 writes the created conversion table TB into the memory 12 .

[0024] <Operation Example 3 (FIG. 4)> Operation example 3 shown in FIG. 4 is an example of operation in the manufacturing phase of the banknote handling machine 1 when the thickness sensor 11 is the thickness sensor SC.

[0025] 4, in the manufacturing phase of the banknote handling machine 1, the processor 21 first reads from the memory 12 reference data DC1, DC2, DC3, DC4, and DC5, which indicate correspondences between the sensor detection values ​​of the thickness sensor SC and the thickness measurement values. In reference data DC1, a sensor detection value of 37856 corresponds to a thickness measurement value of 0.4 mm, in reference data DC2, a sensor detection value of 35787 corresponds to a thickness measurement value of 0.7 mm, in reference data DC3, a sensor detection value of 34272 corresponds to a thickness measurement value of 1.0 mm, in reference data DC4, a sensor detection value of 33310 corresponds to a thickness measurement value of 1.3 mm, and in reference data DC5, a sensor detection value of 32902 corresponds to a thickness measurement value of 1.6 mm.

[0026] Here, the reference data DC1, DC2, DC3, DC4, and DC5 are acquired in advance by the manufacturer of the thickness sensor module 10 before shipping the thickness sensor module 10 and written to the memory 12. In other words, the thickness sensor module 10 having the thickness sensor SC is shipped from the manufacturer of the thickness sensor module 10 with the reference data DC1, DC2, DC3, DC4, and DC5 written in the memory 12, and delivered to the manufacturer of the banknote handling machine 1. At the manufacturer of the banknote handling machine 1, after the thickness sensor module 10 with the reference data DC1, DC2, DC3, DC4, and DC5 written in the memory 12 is connected to the control board 20, the processor 21 reads the reference data DC1, DC2, DC3, DC4, and DC5 from the memory 12.

[0027] Next, the processor 21 creates a conversion table TC for converting the sensor detection values ​​of the thickness sensor SC into thickness measurement values ​​using an interpolation method based on the reference data DC1, DC2, DC3, DC4, and DC5 read from the memory 12. The conversion table TC shown in Fig. 4 is a conversion table for the thickness sensor SC, and is formed from, for example, 1600 data points obtained by the interpolation method in a thickness measurement value range from 0 mm to 1.6 mm.

[0028] Then, the processor 21 writes the created conversion table TC into the memory 12 .

[0029] As in the above-described operation examples 1, 2, and 3, the processor 21 creates a conversion table for each of the thickness sensors 11 .

[0030] <Processing Procedure in Banknote Handling Machine> Fig. 5 is a diagram showing an example of a processing procedure in the banknote handling machine of the present disclosure. In Fig. 5, the processing of steps S100, S105, and S110 is processing in the manufacturing phase by the manufacturer of the banknote handling machine 1, and the processing of steps S115, S120, and S125 is processing in the operation phase by the user of the banknote handling machine 1.

[0031] In step S100, the processor 21 reads from the memory 12 a plurality of reference data items indicating the correspondence between the sensor detection values ​​and the thickness measurement values.

[0032] Next, in step S105, the processor 21 creates a conversion table based on the plurality of reference data read from the memory 12 using an interpolation method.

[0033] Next, in step S110 , the processor 21 writes the created conversion table into the memory 12 .

[0034] Next, in step S115 , the processor 21 reads the conversion table from the memory 12 when measuring the thickness of the banknote using the thickness sensor 11 .

[0035] Next, in step S120 , the processor 21 acquires the sensor detection value output from the thickness sensor 11 .

[0036] Then, in step S125, the processor 21 converts the sensor detection value [digit] into a thickness measurement value [mm] using a conversion table.

[0037] The above is a description of the embodiment.

[0038] As described above, the banknote handling device (banknote handling device 1 of the embodiment) of the present disclosure includes a thickness sensor module (thickness sensor module 10 of the embodiment) and a control board (control board 20 of the embodiment). The thickness sensor module includes a thickness sensor (thickness sensor 11 of the embodiment) that detects the thickness of a banknote, and a memory (memory 12 of the embodiment). The control board includes a processor (processor 21 of the embodiment). The memory stores a plurality of reference data items that correspond to the detected values ​​of the thickness sensor and the measured values ​​of the banknote thickness. The processor reads the plurality of reference data items stored in the memory from the memory, creates a conversion table for converting the detected values ​​into measured values ​​based on the read plurality of reference data items, and writes the created conversion table to the memory.

[0039] This eliminates the need for sensor adjustment using a reference medium during the manufacturing phase of the banknote handling machine, thereby reducing the number of steps required during the manufacturing phase of the banknote handling machine. Also, since the thickness sensor module has a memory that stores multiple reference data that indicate the correspondence between the detection value of the thickness sensor and the measured value of the banknote thickness, it becomes easy to replace only the thickness sensor module, thereby improving the maintainability of the banknote handling machine.

[0040] The processor also creates a conversion table using an interpolation method based on a plurality of reference data.

[0041] In this way, a conversion table covering a wide range of thickness measurements can be created from a small number of reference data.

[0042] After writing the conversion table to the memory, when the thickness of a banknote is measured using the thickness sensor, the processor reads the conversion table from the memory and converts the sensor detection value into a thickness measurement value using the conversion table.

[0043] In this way, even if there is a variation in sensitivity between thickness sensors, the sensor detection values ​​can be converted into the same thickness measurement value, so that an accurate thickness measurement value can be obtained.

[0044] REFERENCE SIGNS LIST 1 banknote handling device 10 thickness sensor module 11 thickness sensor 12 memory 20 control board 21 processor

Claims

1. A banknote handling device comprising: a thickness sensor module having a thickness sensor for detecting the thickness of a banknote and a memory; and a control board having a processor, wherein the processor reads from the memory a plurality of pieces of reference data stored in the memory, the reference data indicating the association between the detection value of the thickness sensor and the measured value of the thickness of the banknote, creates a conversion table for converting the detection value into the measured value based on the plurality of pieces of reference data, and writes the conversion table into the memory.

2. The banknote handling device according to claim 1, wherein the processor creates the conversion table using an interpolation method based on the plurality of pieces of reference data.

3. The banknote handling device according to claim 1, wherein after writing the conversion table into the memory, when measuring the thickness of the banknote using the thickness sensor, the processor reads the conversion table from the memory and converts the detection value into the measured value using the conversion table.

4. The banknote handling device according to claim 1, wherein the processor creates a different conversion table for each thickness sensor.

5. A conversion table creation method, wherein a processor reads from a memory a plurality of pieces of reference data stored in the memory, the reference data indicating the association between the detection value of a thickness sensor for detecting the thickness of a banknote and the measured value of the thickness of the banknote, and creates a conversion table for converting the detection value into the measured value based on the plurality of pieces of reference data.

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