Method for recovering resin component from plated resin member

Abstract

Disclosed is a method for recovering a resin component from a plated resin member, which is obtained by plating the surface of a resin member, by separating a plating component from the plated resin member, the method including: a treatment step A for heating the plated resin member; a treatment step B for cooling the plated resin member after the treatment step A; and a treatment step C for crushing the plated resin member after the treatment step B.

Description

Method for recovering resin components from plated resin members

[0001] The present invention relates to a method for recovering a resin component from a plated resin member, and more particularly to a method for efficiently separating plating components from a plated resin member having a plated surface by a simple method, thereby recovering the resin component.

[0002] Molded articles made of ABS resins have excellent impact resistance, mechanical strength, and chemical resistance, and are therefore used in a wide range of fields, including office equipment, information and communication equipment, electronic and electrical equipment, home appliances, vehicles such as automobiles, and construction. Furthermore, when plated, molded articles made of ABS resins have the characteristics of excellent plating appearance, high plating film adhesion strength, and excellent thermal cycling properties. Therefore, molded articles made of ABS resins are also used in a wide variety of applications, including as plated resin components.

[0003] In recent years, with growing concern about environmental issues, waste and non-standard plated resin members have been recycled by separating the plating component from the resin component and recovering the resin component, and various methods for this have been proposed.

[0004] For example, Patent Document 1 proposes a method of exposing a plastic part having a coating film formed on the surface thereof to a high-temperature atmosphere of 400°C or higher and 1000°C or lower to embrittle and remove the coating film.

[0005] Patent Document 2 proposes a method for recovering resin components from plated resin material, which includes a fine pulverization step in which the plated resin material is coarsely pulverized, and the resulting coarsely pulverized material is pulverized by causing the material to collide with each other in a high-speed vortex flow, and a division step in which the pulverized material is divided into multiple blocks according to particle size, and the plating components are separated from the pulverized material.

[0006] JP 2012-167213 A JP 2001-353723 A

[0007] All of the conventional methods have the following problems, and do not provide results that justify the recovery costs: (1) They require high-temperature heating treatment (e.g., Patent Document 1) or cryogenic cooling treatment; (2) They require special equipment for pulverization (e.g., Patent Document 2); (3) The process is complicated; and (4) They require expensive equipment and consume a large amount of energy.

[0008] In particular, in the method of directly crushing the plated resin member, the plating film may become embedded in the resin member during crushing, making it difficult to remove from the resin member, resulting in poor recovery efficiency. Furthermore, while many studies have been conducted on the recovery of metals, which are plating components, few studies have been conducted on the recovery of resin components.

[0009] The present invention provides a method for separating plating components and recovering resin components from plated resin members, which have a plated surface, and has the following advantages: (1) It does not require ultra-high temperature heating or cryogenic temperature cooling. (2) It does not require large, expensive, or specialized equipment. (3) It allows easy and efficient recovery of resin components from any plated resin member using only a small amount of energy.

[0010] The present inventors have found that the above-mentioned problems can be solved by heating the plated resin member, cooling it, and then pulverizing it.

[0011] [1] A method for recovering a resin component by separating a plating component from a plated resin member having a surface plated, the method comprising: a treatment step A of heating the plated resin member; a treatment step B of cooling the plated resin member after the treatment step A; and a treatment step C of crushing the plated resin member after the treatment step B.

[0012] [2] The method for recovering a resin component from a plated resin member according to [1], wherein the heat treatment temperature in the treatment step A is 100 to 200°C.

[0013] [3] The method for recovering a resin component from a plated resin member according to [1] or [2], wherein the cooling treatment temperature in the treatment step B is 0°C or lower.

[0014] [4] The method for recovering a resin component from a plated resin member according to any one of [1] to [3], wherein the treatment step C is carried out immediately after the treatment step B at a temperature of 0°C or less.

[0015] [5] The method for recovering a resin component from a plated resin member according to any one of [1] to [4], further comprising a treatment step E of dissolving and removing plating components remaining on the surface of the resin member after the treatment step C.

[0016] [6] The method for recovering a resin component from a plated resin member according to [5], further comprising a treatment step D between the treatment steps C and E, in which plating components peeled off from the resin member by crushing in the treatment step C are separated.

[0017] [7] The method for recovering a resin component from a plated resin member according to any one of [1] to [6], wherein the resin component contains a styrene-based resin.

[0018] [8] The method for recovering a resin component from a plated resin member according to [7], wherein the resin component is a styrene-based resin.

[0019] [9] The method for recovering a resin component from a plated resin member according to [7] or [8], wherein the styrene-based resin is an ABS resin.

[0020]

[10] The method for recovering a resin component from a plated resin member according to any one of [1] to [9], wherein the plated resin member is a vehicle part or a scrap material thereof.

[0021] The method for recovering resin components from plated resin members of the present invention allows for easy and efficient recovery of resin components from any plated resin member with minimal energy consumption, without the need for ultra-high temperature heating, cryogenic cooling, or large, expensive, specialized equipment. The resin components recovered by the present invention can be recycled by themselves or mixed with new resin without significantly impairing the physical properties required for resin products. Furthermore, the present invention also allows for the separation and recovery of metal components from the resin components, enabling them to be recycled as valuable metals.

[0022] Hereinafter, embodiments of the present invention will be described in detail.

[0023] The method for recovering resin components from a plated resin member of the present invention is a method for separating and recovering plating components from a plated resin member having a plated surface, and involves sequentially performing the following treatment steps A to C.

[0024] The method for recovering resin components from a plated resin member of the present invention preferably includes the following treatment step E after treatment step C. The method for recovering resin components from a plated resin member of the present invention may further include the following treatment step D between treatment steps C and E. The method for recovering resin components from a plated resin member of the present invention may also include the following treatment step F after treatment step E. The method for recovering resin components from a plated resin member of the present invention may further include the following treatment steps G and H.

[0025] Treatment step A: A treatment step for heating the plated resin member Treatment step B: A treatment step for cooling the plated resin member that has undergone treatment step A Treatment step C: A treatment step for crushing the plated resin member that has undergone treatment step B Treatment step D: A treatment step for separating the plating components that have been peeled off from the resin member by crushing in treatment step C Treatment step E: A treatment step for dissolving and removing the plating components remaining on the surface of the resin member after treatment step C or treatment step D Treatment step F: A treatment step for rinsing and drying the resin member that has undergone treatment step E Treatment step G: A treatment step for polishing and separating the crushed resin member obtained in treatment step C or treatment step D Treatment step H: A treatment step for pelletizing the resin components obtained in treatment step C, treatment step D or treatment step G

[0026] In the present invention, processing steps A to C or processing steps A to D are performed in the order of processing step A → processing step B → processing step C or processing step A → processing step B → processing step C → processing step D. There are no particular restrictions on the order or combination of processing steps E, F, G, and H, and necessary processing steps can be selected and performed in any combination at any stage depending on the processing situation. Therefore, in the process up to processing steps A to C or processing steps A to D, or in the process thereafter, the state of separation of the plating components, etc. can be observed, and then necessary processing steps can be selected from these processing steps E to H and performed in a determined order.

[0027] The plated resin member to be treated in the present invention, the operating method and treatment conditions for each treatment step, etc. will be described below.

[0028] <Plated Resin Member> The plated resin member to be treated in the present invention is a resin member having a plated surface.

[0029] The resin constituting the resin member is not particularly limited, and examples thereof include various thermoplastic resins or thermosetting resins. Specific examples include engineering plastics or super-engineering plastics such as nylon, polyacetal, modified polyphenylene ether, polycarbonate, polyethylene terephthalate, polybutylene terephthalate, polyphenylene sulfide, polyamide, polyether sulfone, and liquid crystal polymer; polyolefin resins such as polyethylene, polypropylene, polyvinyl chloride, polystyrene, acrylonitrile butadiene styrene copolymer resin (ABS resin), acrylonitrile styrene copolymer resin, and methyl methacrylate butadiene styrene copolymer resin (MBS resin); and polymer alloys or polymer blends of these resins.

[0030] Among these, the resin constituting the resin member preferably contains a styrene-based resin because of its excellent plating compatibility. More preferred resins constituting the resin member include rubber-containing styrene-based resins, such as rubber-reinforced polystyrene (HI resin), ABS resin, and MBS resin, with ABS resin being particularly preferred.

[0031] Plated resin members to be treated in the present invention include waste materials or non-standard products from various products such as office equipment, information and communication equipment, electronic and electrical equipment, home appliances, vehicles such as automobiles, building materials, etc. Plated resin members to be treated in the present invention particularly include vehicle parts such as automobiles or waste materials thereof, for example, automobile front grilles, headlight housings, door handles, wheel caps, emblems, etc.

[0032] The surfaces of these plated resin members are usually plated with metal to a thickness of about 0.1 μm to 200 μm.

[0033] Examples of plating components include metals such as copper, nickel, chromium, tin, lead, ruthenium, aluminum, and indium, particularly copper, nickel, and chromium, or a combination of two or more of these metals.

[0034] If these plated resin members are excessively large, they can be cut into smaller pieces before the heat treatment in treatment step A. However, if a crusher, pulverizer, or the like is used as a cutting means, the plating (metal portion) of the plated resin member will dig into the resin member, making it difficult to peel and remove in subsequent treatments. For this reason, from the perspective of treatment efficiency, it is preferable to subject the plated resin member to the treatment of the present invention as removed from the product, or, if cutting is required, to cutting it into approximately 1 / 2 to 1 / 4 pieces with a blade such as a saw or a utility knife before subjecting it to the heat treatment in treatment step A. Furthermore, if necessary, the plated resin member may be divided into pieces of approximately 10 cm square.

[0035] <Treatment Step A: Heat Treatment> The apparatus used for the heat treatment is not particularly limited, and may be any apparatus that has a heating means, can heat to a suitable heat treatment temperature described below, and can accommodate or load a plated resin member into a heating vessel, heating tank, heating furnace, or the like of the apparatus. For example, a hot air dryer that heats a plated resin member by blowing hot air onto it is preferred because it is simple, relatively inexpensive, and easily available and usable. Furthermore, an apparatus that combines hot air dryers in series and continuously heats plated resin members placed on a conveyor or the like is efficient and industrially preferred because it allows for continuous loading and unloading.

[0036] If the heat treatment temperature in treatment step A is 300° C. or higher, for example, 400° C., there is a high possibility that the resin of the plated resin member will decompose and deteriorate. For this reason, the heat treatment temperature is preferably less than 300° C., for example, 100 to 200° C. Within this temperature range, the plated components of the plated resin member can be effectively peeled and separated while suppressing decomposition and deterioration of the resin components.

[0037] Furthermore, when the heat resistance temperature (ISO: 75) of the plated resin member is known, the heat treatment temperature is preferably the heat resistance temperature + 50 to 100°C. If the heat treatment temperature is less than the heat resistance temperature + 50°C, the plated portion of the plated resin member may peel off, but this may not be sufficient. If the heat treatment temperature exceeds the heat resistance temperature + 100°C, the resin may decompose and deteriorate.

[0038] There is no particular limit to the heat treatment time in treatment step A. For example, as long as the temperature inside the equipment is maintained at 100 to 200°C, there will be no problems, including resin decomposition, even if the workpiece is left inside the equipment for a long period of time. However, from the viewpoints of plating component stripping efficiency and treatment efficiency, it is preferable that the heat treatment time be 15 to 30 minutes.

[0039] In the plated resin member heat-treated in treatment step A, the plating film peels off and floats off the resin member due to the difference in thermal expansion between the resin and the plated metal caused by heating. Therefore, when the plated resin member heat-treated in treatment step A is removed from the heat treatment device, the plated portion has peeled off from the resin member and can be easily removed.

[0040] As described above, the plated resin member that has undergone the heat treatment of treatment step A has most of the plating components peeled off and is also called a "resin member." However, in the present invention, for the sake of convenience, the member that has undergone treatment steps A to C will be consistently called a "plated resin member."

[0041] <Treatment Step B: Cooling Treatment> The plated resin member that has undergone the heat treatment of treatment step A is then subjected to the cooling treatment of treatment step B. The cooling treatment of treatment step B may be carried out immediately after the heat treatment, or may be carried out after an interval. For example, the plated portion may be removed from the heat-treated plated resin member, or the resin member may be allowed to cool to room temperature before proceeding to the cooling treatment step of treatment step B.

[0042] The purpose of the cooling treatment in treatment step B is not to more effectively remove the plated portion by the heat treatment in treatment step A, but to include a pretreatment element, so to speak, for efficient fracturing in the subsequent crushing treatment in treatment step C. That is, because the resin member of the plated resin member has a soft surface, if it is directly put into a crusher or the like after the heat treatment in treatment step A, a large amount of resin powder will be generated, which often causes problems when the resin member is recycled and used. For this reason, in the present invention, prior to the crushing treatment in treatment step C, the cooling treatment in treatment step B is performed to harden the resin member of the plated resin member, thereby suppressing the generation of resin powder when crushed in a crusher and facilitating the recycling of the recovered resin.

[0043] The cooling treatment apparatus may be any apparatus, without particular limitations, as long as it has a cooling means, can cool to a suitable cooling treatment temperature described below, and can accommodate or load the plated resin member into a cooling vessel, cooling tank, or the like of the apparatus. For example, a low-temperature constant temperature bath or the like is preferred because it is simple, relatively inexpensive, and easily available and usable. Furthermore, a continuous apparatus in which the plated resin member is moved on a conveyor or the like and the entire apparatus, including the conveyor, is covered by a cooling device, which is efficient and industrially preferred because it allows the plated resin member to be continuously introduced into and removed from the apparatus.

[0044] The cooling treatment temperature in treatment step B may be any temperature at which the resin member becomes hardened and easily crushed by cooling. Therefore, although it depends on the type of resin, the cooling treatment temperature is usually 0°C or lower, preferably -10°C or lower, and more preferably -30°C or lower. If the cooling treatment temperature is too low, the energy cost for cooling increases and a special cooling device is required, but the degree of hardening of the resin remains almost unchanged. Therefore, the lower limit of the cooling treatment temperature is preferably -50°C or higher, particularly -30°C or higher.

[0045] The cooling time in treatment step B depends on the shape, thickness, cooling temperature, etc. of the plated resin member, but since it is sufficient that the resin portion of the plated resin member becomes hard by the cooling treatment, it is preferable from the viewpoint of treatment efficiency to be about 10 to 30 minutes. Although there is no problem with continuing cooling for a longer time, it is inefficient.

[0046] <Treatment Step C: Crushing Treatment> In the present invention, the cooling treatment in the treatment step B hardens the resin portion of the plated resin member, thereby minimizing the generation of resin powder during the crushing treatment. Therefore, the crushing treatment in the treatment step C is preferably performed immediately and continuously after the cooling treatment in the treatment step B. Here, "continuously" means that the resin member removed from the cooling device in the treatment step B is immediately subjected to the crushing treatment, i.e., the resin member removed from the cooling device is immediately placed in the crushing device. By subjecting the resin member to the crushing treatment immediately after the cooling treatment, the crushing treatment can be performed at a low temperature approximately equivalent to the cooling treatment temperature.

[0047] It should be noted that the terms "continuously" and "immediately" in the above explanation do not mean that there is no "instantaneous" gap between them. For example, even if, for some reason, it is not possible to "immediately" introduce the resin member into the apparatus for treatment step C after removing it from the cooling apparatus for treatment step B, the resin member can be introduced into the apparatus for treatment step C without any problems as long as it can be kept at a temperature below the cooling temperature for treatment step B, for example, below 0°C.

[0048] As the crushing device, a general crusher, grinder, or the like can be used.

[0049] In this treatment step C, it is preferable to crush the plated resin member to about 1 cm by a breaking treatment and recover the resin pieces. For ease of handling after recovery, it is preferable that the resin pieces be 1 cm or less, for example, about 5 mm in size.

[0050] <Treatment Step D: Separation of Plating Components> Treatment Step D, which separates the plating components peeled off from the resin member by the crushing treatment in Treatment Step C, is not necessarily performed. However, by performing this treatment Step D, the plating components can be separated and recovered, and the plating metal can also be recycled. In Treatment Step D, the plating component metal can be separated and recovered by, for example, magnetic separation or the like.

[0051] <Treatment Step E: Dissolution Treatment> Dissolution treatment can be performed as necessary when the heating, cooling, and crushing treatments in Treatment Steps A to C do not sufficiently remove the plated portions, or when it is desired to minimize the inclusion of plated metal components in the recovered resin pieces and improve the purity of the recovered resin.

[0052] The dissolution treatment in treatment step E is a treatment using a general chemical solution that dissolves the plated portion from the plated member. There are no particular limitations on the chemical solution as long as it can dissolve the plating film, and it can be selected depending on the plating metal. As mentioned above, the plating metal is mainly copper, nickel, chromium, or an alloy of these. Therefore, it is preferable to select a chemical solution that can dissolve copper, nickel, or chromium-based plating films.

[0053] Preferable chemical solutions include nitric acid solution, aqueous hydrogen peroxide solution, ammonium persulfate solution, etc. The chemical concentration of these chemical solutions is usually about 10 to 20% by mass, in order to minimize the influence on the resin being recovered.

[0054] The dissolution treatment in treatment step E can be carried out by contacting the resin pieces that have been subjected to treatment step C or D with the above-mentioned chemical solution.

[0055] There are no particular limitations on the temperature or treatment time during the dissolution treatment. Generally, the higher the temperature, the higher the dissolution efficiency. The dissolution treatment is preferably carried out at 40 to 60°C for approximately 0.5 to 2 hours. After the dissolution treatment, the resin pieces are separated from the chemical solution by filtration or the like, and, if necessary, are subjected to the next treatment step F, namely, washing with water and drying.

[0056] <Treatment Step F: Washing and Drying Treatment> The washing and drying treatment of treatment step F is not necessarily required. However, by performing washing and drying treatment after the dissolution treatment of treatment step E to wash away the chemical solution and dry, it is possible to recover a high-purity resin component suitable for recycling. Drying after water washing can usually be performed at a temperature of about 80 to 90°C.

[0057] <Processing Step G: Polishing Treatment> The polishing treatment in processing step G is an additional processing step that is carried out when separation between the plating layer and the resin member is not sufficient in the processes up to processing step C or processing step D.

[0058] The polishing treatment may include a step (step G-1) in which the crushed resin members obtained in the steps up to treatment step C or treatment step D are placed in a container filled with water and stirred to separate the plating components remaining on the resin members. In this step, the resin members collide with each other in the stirring container and are polished, resulting in the peeling off of the plating components.

[0059] By increasing the agitation strength, the resin members collide with each other and are polished, which allows the plating components to be peeled off and separated more effectively. For this reason, a mixer for resin is preferred as the agitation device. Furthermore, a mixer with a screw for resin is particularly preferred, as it allows the plated resin members and water to be continuously poured in, which is effective and efficient.

[0060] After the plating components are stripped using a mixer or the like, it is preferable to pass the product through a washing step (step G-2) to separate the plating components from the resin components. Washing methods include air spraying (air washing) and water washing. This washing step is a treatment step in which there are almost no plating components present, since the product has already gone through treatment step C or treatment step D, and the plating components are recovered as polished powder in the above step G-1, so washing with water is preferable.

[0061] When washing with water, it is necessary to remove moisture, and it is preferable to remove moisture (step G-3) using a dryer, dehydrator, or the like. In this case, it is efficient to perform water washing and moisture removal continuously. For this reason, it is preferable to put the object to be treated into a washing and dehydrating device or the like to separate the resin member from other components (plating components, resin fragment powder, etc.). Examples of equipment for washing and dehydrating include a centrifuge and a dehydrator. Among these, a pellet dehydrator for resin is preferable because it allows continuous processing.

[0062] Furthermore, in order to effectively separate the plating components from the resin member and to more effectively perform the treatment of step G-1, it is preferable to wash the plated resin member with water or put it into a wet grinder or the like as a pre-treatment step of step G-1 to remove the plating components attached to the resin member in the treatments up to this treatment step, or to grind it with a grinder. If the grinding step using a grinder is carried out here, it is preferable to further remove moisture by washing, dehydration, or the like.

[0063] <Processing Step H: Pelletization> In order to recover the resin component from the resin workpiece, it is possible to use the resin component obtained in Processing Step C, Processing Step D, or Processing Step G as it is. However, it is preferable to first feed the resin component into an extruder and pelletize it, as this expands the range of uses, such as mixing with other resins and transportation. When pelletizing using an extruder, the extrusion conditions and the like can be determined taking into account the performance of the recovered resin component.

[0064] <Recycling of recovered resin> The resin component recovered by the method of the present invention for recovering a resin component from a plated resin member can be recycled as a molding raw material for various products, either alone or by mixing the recovered resin with new resin in a ratio of about 10 to 50 mass %.

[0065] The present invention will be described in more detail below with reference to examples, but the present invention is not limited to the following examples as long as it does not depart from the gist of the invention.

[0066] Example 1 The following treatment steps A, B, and C were carried out to recover resin components from a plated resin member.

[0067] <Treatment Step A: Heat Treatment> A plated resin member (an automobile front grille: approximately 1 m x 40 cm, chrome-plated on the surface, with ABS resin stamped on the back) was placed in a hot air dryer set at 120°C and removed after 15 minutes. <Treatment Step B: Cooling Treatment> The heat-treated plated resin member was placed in a thermostatic bath set at 0°C and removed after 20 minutes. <Treatment Step C: Crushing Treatment> The plated resin member removed from the cooling treatment (thermostatic bath) was immediately placed in a crusher and crushed to pieces 1 cm or less, and the resin pieces were recovered. This crushing treatment was performed immediately after the cooling treatment in Treatment Step B, so the plated resin member could be subjected to temperature conditions approximately similar to the cooling treatment temperature in Treatment Step B.

[0068] Examples 2 to 4 The same procedures as in Example 1 were carried out except that the heating temperature in treatment step A and / or the cooling temperature in treatment step B were changed as shown in Table 1.

[0069] Example 5 The same procedure as in Example 1 was carried out, except that the disruption treatment in treatment step C was followed by the dissolution treatment in treatment step E and the water washing and drying treatment in treatment step F.

[0070] <Treatment step E: Dissolution treatment> The crushed resin pieces were placed in a 15 L beaker containing a 10% by mass aqueous solution of ammonium persulfate, heated to 50°C, and held for 1 hour while stirring. The resin pieces were then recovered by filtering through a metal filter mesh. <Treatment step F: Water washing and drying treatment> The recovered resin pieces were washed with water and then dried in a hot air dryer set at 80°C for 2 hours to obtain good crushed resin pieces.

[0071] Examples 6 to 8 The same procedures as in Example 5 were carried out except that the heating temperature in treatment step A and / or the cooling temperature in treatment step B were changed as shown in Table 1.

[0072] Example 9 The same procedure as in Example 8 was carried out, except that a treatment step D for separating plating components peeled off from the resin member by crushing in treatment step C was carried out between the crushing treatment in treatment step C and the dissolution treatment in treatment step E. Here, treatment step D was carried out by feeding the resin member crushed in treatment step C into a magnetic separator (manufactured by Nippon Magnetics Co., Ltd.), separating the plating components from the resin portion, and recovering the plating components.

[0073] [Evaluation] The following evaluations were carried out on the resin pieces recovered in Examples 1 to 9. The results are shown in Table 1.

[0074] <Peeled State> After the crushing treatment in treatment step C, the peeled state (remaining state) of the plating layer portion of the resin piece was visually observed.

[0075] <Recovery rate> The finally recovered resin pieces were visually inspected for contamination with plating components and evaluated according to the following criteria. ◎: No plating components were observed at all. (TGA measurement of the recovered resin pieces showed that the metal components contained in the ash were below the detection limit.) ◯: Very small amounts of plating components were observed. (One resin piece out of 100 recovered resin pieces had plating components remaining attached.) △: A small amount of plating components was observed. (Two to four resin pieces out of 100 recovered resin pieces had plating components remaining attached.) ×: Many plating components were observed. (Five or more resin pieces out of 100 recovered resin pieces had plating components remaining attached.)

[0076] <Impact resistance (Charpy impact test)> In order to evaluate the performance of the finally recovered resin component, 30% by mass of the recovered resin pieces were blended with new resin (ABS resin / manufactured by Techno UMG) to prepare test pieces using an injection molding machine, and a Charpy impact test (notched) was carried out at 23°C in accordance with ISO 179 standard to measure the Charpy impact strength (kJ / m ２ ) was measured. In addition, a Charpy impact test was also carried out on a new resin-only test piece, and the result was 25 kJ / m ２ It was.

[0077]

[0078] From Table 1, it can be seen that according to the present invention, plating components can be separated from plated resin members using common processing equipment without excessively high-temperature heating or excessively low-temperature cooling, and the resin components can be efficiently recovered. It can also be seen that the resin components recovered by the present invention can be recycled without significant loss of physical properties. It can also be seen that the effects of the present invention can be more effectively achieved by performing the dissolution treatment in treatment step E.

[0079] In the above example, no separation process was performed on the plating components peeled off from the resin member in treatment step D. However, by separating and recovering the peeled plating components by magnetic separation or the like between the crushing process in treatment step C and the dissolution process in treatment step E, the recovered metals can be recycled.

[0080] Although the present invention has been described in detail using specific embodiments, it will be apparent to those skilled in the art that various modifications can be made without departing from the spirit and scope of the present invention. This application is based on Japanese Patent Application No. 2023-198433, filed on November 22, 2023, and is incorporated by reference in its entirety.

Claims

1. A method for separating plating components from a plated resin member having a surface plated with plating, and recovering the resin components, comprising: a treatment step A of heating the plated resin member; a treatment step B of cooling the plated resin member after treatment step A; and a treatment step C of crushing the plated resin member after treatment step B.

2. The method for recovering a resin component from a plated resin part according to claim 1, wherein the heat treatment temperature in said treatment step A is 100 to 200°C.

3. The method for recovering a resin component from a plated resin part according to claim 1, wherein the cooling treatment temperature in said treatment step B is 0°C or lower.

4. A method for recovering resin components from plated resin parts as described in claim 1, wherein said treatment step C is carried out successively to said treatment step B at a temperature of 0°C or lower.

5. A method for recovering resin components from plated resin members as described in claim 1, further comprising a treatment step E of dissolving and removing plating components remaining on the surface of said resin member after said treatment step C.

6. A method for recovering resin components from plated resin parts as described in claim 5, comprising a treatment step D between said treatment steps C and E, for separating plating components peeled off from said resin parts by crushing in said treatment step C.

7. The method for recovering a resin component from a plated resin part according to claim 1, wherein the resin component includes a styrene-based resin.

8. The method for recovering a resin component from a plated resin part according to claim 7, wherein the resin component is a styrene-based resin.

9. The method for recovering a resin component from a plated resin part according to claim 7, wherein the styrene-based resin is an ABS resin.

10. The method for recovering a resin component from a plated resin part according to any one of claims 1 to 9, wherein the plated resin part is a vehicle part or a scrap part thereof.

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