Substrate treatment device, treatment container replacement method, substrate treatment method, and storage medium

Abstract

A substrate treatment device (1) according to the present disclosure comprises: a treatment container (30); a supply line; a discharge line (34b); and a reinforcement member (40). The treatment container (30) has a treatment space (S) capable of accommodating a substrate (W), and the treatment space (S) is pressurized during the treatment of the substrate (W). The supply line supplies a treatment fluid into the treatment space (S). The discharge line (34b) discharges the treatment fluid in the treatment space (S). The reinforcement member (40) surrounds the outside of the treatment container (30) and is fixed integrally with the treatment container (30).

Description

SUBSTRATE PROCESSING APPARATUS, PROCESSING VESSEL EXCHANGE METHOD, SUBSTRATE PROCESSING METHOD, AND STORAGE MEDIUM

[0001] The present disclosure relates to a substrate processing apparatus, a processing vessel replacing method, a substrate processing method, and a storage medium.

[0002] Conventionally, a supercritical process has been known in which the surface of a substrate such as a semiconductor wafer (hereinafter referred to as a wafer) is treated with a liquid, and then the substrate, whose surface is wetted with the liquid, is brought into contact with a treatment fluid to dry the substrate (see Patent Document 1).

[0003] Japanese Patent Application Laid-Open No. 2017-157745

[0004] The present disclosure provides a technique that can improve ease of maintenance of a processing vessel.

[0005] A substrate processing apparatus according to one aspect of the present disclosure includes a processing vessel, a supply line, a discharge line, and a reinforcing member. The processing vessel has a processing space capable of accommodating a substrate, and the processing space is pressurized during substrate processing. The supply line supplies a processing fluid into the processing space. The discharge line discharges the processing fluid from the processing space. The reinforcing member surrounds the outside of the processing vessel and is fixed integrally to the processing vessel.

[0006] According to the present disclosure, the ease of maintenance of a processing vessel can be improved.

[0007] FIG. 1 is a diagram illustrating an example of the configuration of a substrate processing apparatus according to a first embodiment. FIG. 2 is a diagram illustrating an example of the configuration of a liquid processing unit according to the first embodiment. FIG. 3 is a schematic perspective view illustrating an example of the configuration of a drying unit according to the first embodiment. FIG. 4 is a partially exploded perspective view illustrating an example of the configuration of a drying unit according to the first embodiment. FIG. 5 is a schematic perspective view illustrating an example of the configuration of a processing vessel according to the first embodiment. FIG. 6 is a cross-sectional view taken along line VI-VI in FIG. 5. FIG. 7 is a schematic plan view illustrating an example of the configuration of a processing vessel according to the first embodiment. FIG. 8 is a cross-sectional view taken along line VIII-VIII in FIG. 7. FIG. 9 is a cross-sectional view taken along line IX-IX in FIG. 3. FIG. 10 is a diagram illustrating a procedure for removing a reinforcing member from a processing vessel. FIG. 11 is a schematic view illustrating an example of a processing vessel replacement method according to the first embodiment. FIG. 12 is a schematic cross-sectional view illustrating an example of the configuration of a processing vessel according to a second embodiment. FIG. 13 is a schematic cross-sectional view illustrating another example of the configuration of a processing vessel according to the second embodiment. FIG. 14 is a schematic cross-sectional view illustrating another example of the configuration of a processing vessel according to the second embodiment. 15 and 16 are perspective views of a first member of a processing vessel according to a third embodiment, as viewed obliquely from below and above, respectively.

[0008] Hereinafter, embodiments (hereinafter referred to as "embodiments") for carrying out a substrate processing apparatus, a processing vessel replacement method, a substrate processing method, and a storage medium according to the present disclosure will be described in detail with reference to the drawings. Note that the present disclosure is not limited to these embodiments. Furthermore, the embodiments can be appropriately combined within the scope of not causing any contradiction in the processing content. Furthermore, the same components in the following embodiments will be assigned the same reference numerals, and redundant explanations will be omitted.

[0009] Furthermore, in the following embodiments, expressions such as "constant," "orthogonal," "perpendicular," or "parallel" may be used, but these expressions do not necessarily mean "constant," "orthogonal," "perpendicular," or "parallel" in the strict sense. In other words, the above expressions allow for deviations due to, for example, manufacturing precision, installation precision, etc.

[0010] In the drawings referred to below, for ease of understanding, the X-axis, Y-axis, and Z-axis directions are defined as being orthogonal to each other, and an orthogonal coordinate system is shown in which the positive Z-axis direction is the vertically upward direction. The rotation direction around the vertical axis is also referred to as the θ direction.

[0011] Patent Document 1 discloses a substrate processing apparatus including a processing vessel for performing supercritical processing on wafers, a fluid supply line for supplying a processing fluid into the processing vessel, and a fluid discharge line for discharging the fluid from the processing vessel.

[0012] Supercritical processing is performed under elevated pressure within a processing vessel. For this reason, processing vessels used for supercritical processing have a partition wall surrounding the processing space made of a thick metal material so as to withstand the high pressure. Such processing vessels are heavy, which makes them difficult to maintain, for example, difficult to lift. Such maintenance difficulties are not limited to processing vessels used for supercritical processing, but can also occur in processing vessels used for high-pressure processing.

[0013] Therefore, there is a need for a technology that can improve the ease of maintenance of the processing vessel.

[0014] First Embodiment <Configuration of Substrate Processing Apparatus> First, the configuration of a substrate processing apparatus 1 according to a first embodiment will be described with reference to Fig. 1. Fig. 1 is a diagram showing an example of the configuration of the substrate processing apparatus 1 according to the first embodiment.

[0015] 1, the substrate processing apparatus 1 includes a loading / unloading station 2 and a processing station 3. The loading / unloading station 2 and the processing station 3 are provided adjacent to each other.

[0016] The loading / unloading station 2 includes a carrier placement unit 11 and a transport unit 12. A plurality of carriers C are placed on the carrier placement unit 11, each of which accommodates a plurality of semiconductor wafers W (hereinafter referred to as "wafers W") in a horizontal position.

[0017] The transport section 12 is provided adjacent to the carrier placement section 11. Inside the transport section 12, a transport device 13 and a delivery section 14 are arranged.

[0018] The transfer device 13 includes a wafer holding mechanism that holds the wafer W. The transfer device 13 is capable of moving in horizontal and vertical directions and rotating about a vertical axis, and transfers the wafer W between the carrier C and the delivery unit 14 using the wafer holding mechanism.

[0019] The processing station 3 is provided adjacent to the transport section 12. The processing station 3 includes a transport block 4 and a plurality of processing blocks 5.

[0020] The transport block 4 includes a transport area 15 and a transport device 16. The transport area 15 is, for example, a rectangular parallelepiped region extending along the arrangement direction (X-axis direction) of the loading / unloading stations 2 and the processing stations 3. The transport device 16 is arranged in the transport area 15.

[0021] The transfer device 16 includes a wafer holding mechanism that holds the wafer W. The transfer device 16 is capable of moving in the horizontal and vertical directions and rotating about a vertical axis, and transfers the wafer W between the delivery unit 14 and the plurality of processing blocks 5 using the wafer holding mechanism.

[0022] The processing blocks 5 are arranged adjacent to the transfer area 15 on both sides of the transfer area 15. Specifically, the processing blocks 5 are arranged on one side (positive Y-axis direction side) and the other side (negative Y-axis direction side) of the transfer area 15 in a direction (Y-axis direction) perpendicular to the arrangement direction (X-axis direction) of the loading / unloading stations 2 and processing stations 3.

[0023] Although not shown, the processing blocks 5 are arranged in multiple stages (for example, three stages) along the vertical direction. The wafers W are transferred between the processing blocks 5 arranged in each stage and the delivery part 14 by a single transfer device 16 arranged in the transfer block 4. The number of stages of the processing blocks 5 is not limited to three.

[0024] Each processing block 5 includes a liquid processing unit 17 , a drying unit 18 and a supply unit 19 .

[0025] Liquid processing unit 17 performs a cleaning process to clean the upper surface, which is the pattern formation surface, of wafer W. Liquid processing unit 17 also performs a liquid film forming process to form a liquid film on the upper surface of wafer W after the cleaning process. The configuration of liquid processing unit 17 will be described later.

[0026] The drying unit 18 performs a supercritical drying process on the wafer W after the liquid film formation process. Specifically, the drying unit 18 dries the wafer W by bringing the wafer W after the liquid film formation process into contact with a processing fluid in a supercritical state (hereinafter also referred to as a "supercritical fluid"). The configuration of the drying unit 18 will be described later.

[0027] The supply unit 19 supplies the processing fluid to the drying unit 18. Specifically, the supply unit 19 includes a group of supply devices including a flow meter, a flow regulator, a back pressure valve, a heater, etc., and a housing that houses the group of supply devices. In this embodiment, the supply unit 19 supplies CO 2 as the processing fluid. ２ is fed to the drying unit 18.

[0028] Liquid processing unit 17, drying unit 18, and supply unit 19 are arranged along transport area 15 (i.e., along the X-axis direction). Of liquid processing unit 17, drying unit 18, and supply unit 19, liquid processing unit 17 is arranged at a position closest to load / unload station 2, and supply unit 19 is arranged at a position farthest from load / unload station 2.

[0029] Thus, each processing block 5 includes one liquid processing unit 17, one drying unit 18, and one supply unit 19. That is, the substrate processing apparatus 1 is provided with the same numbers of liquid processing units 17, drying units 18, and supply units 19.

[0030] 1, the substrate processing apparatus 1 includes a control device 6. The control device 6 is, for example, a computer, and includes a control unit 61 and a storage unit 62.

[0031] Control unit 61 includes various circuits and a microcomputer having a CPU (Central Processing Unit), ROM (Read Only Memory), RAM (Random Access Memory), input / output ports, etc. The CPU of the microcomputer reads and executes programs stored in the ROM, thereby controlling conveying devices 13 and 16, liquid processing unit 17, drying unit 18, supply unit 19, etc.

[0032] Such a program may be stored in a computer-readable storage medium and installed from that storage medium into the storage unit 62 of the control device 6. Examples of computer-readable storage media include a hard disk (HD), a flexible disk (FD), a compact disk (CD), a magnet optical disk (MO), and a memory card.

[0033] The storage unit 62 is realized by, for example, a semiconductor memory element such as a RAM or a flash memory, or a storage device such as a hard disk or an optical disk.

[0034] In the substrate processing apparatus 1 configured as described above, first, the transfer device 13 in the loading / unloading station 2 removes the wafer W from the carrier C placed on the carrier placement unit 11 and places the removed wafer W on the delivery unit 14. The wafer W placed on the delivery unit 14 is then removed from the delivery unit 14 by the transfer device 16 in the processing station 3 and carried into the liquid processing unit 17.

[0035] The wafer W carried into liquid processing unit 17 is subjected to cleaning processing and liquid film forming processing by liquid processing unit 17, and then carried out from liquid processing unit 17 by transfer device 16. The wafer W carried out from liquid processing unit 17 is carried into drying unit 18 by transfer device 16, and is subjected to drying processing by drying unit 18.

[0036] The wafer W that has been dried by the drying unit 18 is carried out of the drying unit 18 by the transfer device 16 and placed on the transfer section 14. Then, the processed wafer W placed on the transfer section 14 is returned to the carrier C on the carrier placement section 11 by the transfer device 13.

[0037] <Configuration of Liquid Processing Unit> Next, the configuration of liquid processing unit 17 will be described with reference to Fig. 2. Fig. 2 is a diagram showing an example of the configuration of liquid processing unit 17 according to the first embodiment. Liquid processing unit 17 is configured as, for example, a single-wafer cleaning apparatus that cleans wafers W one by one by spin cleaning.

[0038] As shown in FIG. 2, in liquid processing unit 17, wafer W is held substantially horizontally by wafer holding mechanism 25 disposed in outer chamber 23 that forms the processing space, and wafer W is rotated by rotating wafer holding mechanism 25 around a vertical axis.

[0039] The liquid processing unit 17 then moves the nozzle arm 26 above the rotating wafer W and supplies chemical liquid and rinsing liquid in a predetermined order from the chemical liquid nozzle 26 a provided at the tip of the nozzle arm 26, thereby cleaning the top surface of the wafer W.

[0040] In liquid processing unit 17, a chemical liquid supply path 25a is also formed inside wafer holding mechanism 25. The lower surface of wafer W is also cleaned by the chemical liquid and rinse liquid supplied from chemical liquid supply path 25a.

[0041] The cleaning process may first involve removing particles and organic contaminants using an alkaline chemical solution, SC1 liquid (a mixture of ammonia and hydrogen peroxide), followed by a rinse using deionized water (hereinafter referred to as "DIW") as a rinse solution.

[0042] Next, the native oxide film is removed using an acidic chemical solution, diluted hydrofluoric acid (hereinafter referred to as "DHF"), and then rinsing with DIW is performed.

[0043] The various chemical solutions described above are received in the outer chamber 23 or the inner cup 24 disposed within the outer chamber 23, and are discharged from a drainage port 23a provided at the bottom of the outer chamber 23 or a drainage port 24a provided at the bottom of the inner cup 24. Furthermore, the atmosphere within the outer chamber 23 is exhausted from an exhaust port 23b provided at the bottom of the outer chamber 23.

[0044] The liquid film forming process is performed after the rinse process in the cleaning process. Specifically, the liquid processing unit 17 supplies liquid IPA (isopropyl alcohol) to the upper and lower surfaces of the wafer W while rotating the wafer holding mechanism 25. This replaces the DIW remaining on both surfaces of the wafer W with IPA. Thereafter, the liquid processing unit 17 gradually stops the rotation of the wafer holding mechanism 25. Note that hereinafter, the liquid IPA will also be referred to as "IPA liquid."

[0045] After the liquid film formation process is completed, the wafer W, with a liquid film of IPA liquid still formed on its upper surface, is transferred to the transport device 16 by a transfer mechanism (not shown) provided in the wafer holding mechanism 25, and is then transported out of the liquid processing unit 17.

[0046] The liquid film formed on the wafer W prevents pattern collapse caused by evaporation (vaporization) of the liquid on the top surface of the wafer W during transport of the wafer W from the liquid processing unit 17 to the drying unit 18 or during loading into the drying unit 18.

[0047] <Configuration of Drying Unit and Processing Container> Next, the configurations of the drying unit 18 and the processing container 30 will be described with reference to FIGS. 3 to 6. FIG. 3 is a schematic perspective view showing an example configuration of the drying unit 18 according to the first embodiment. FIG. 4 is a partially exploded perspective view showing an example configuration of the drying unit 18 according to the first embodiment. FIG. 5 is a schematic perspective view showing an example configuration of the processing container 30 according to the first embodiment. FIG. 6 is a cross-sectional view taken along line VI-VI in FIG. 5.

[0048] Drying unit 18 includes a processing vessel 30 and a reinforcing member 40. Processing vessel 30 has an internal processing space S capable of accommodating wafers W having a diameter of, for example, 300 mm. During the drying process of wafers W, processing space S within processing vessel 30 is pressurized.

[0049] The processing vessel 30 has a loading / unloading port 31 that connects the processing space S with the outside and through which the wafer W is loaded and unloaded into and from the processing space S. The drying unit 18 includes a lid 32a (see FIG. 6 ) that closes the loading / unloading port 31. The lid 32a is disposed at one end (negative Y-axis direction) of the processing vessel 30 in the transfer direction (Y-axis direction) of the wafer W.

[0050] The lid 32a is connected to a rotation mechanism and a linear motion mechanism (not shown). The rotation mechanism rotates the lid 32a around a horizontal axis (here, the X-axis) perpendicular to the transfer direction of the wafer W. Specifically, by rotating the lid 32a, the rotation mechanism can change the posture of the lid 32a between the state shown in FIG. 6 and a state rotated 90° from the state shown in FIG. 6. By rotating the lid 32a 90° from the state shown in FIG. 6, the transfer device 16 (see FIG. 1) can transfer the held wafer W into the processing space S through the transfer port 31. The linear motion mechanism (not shown) moves the lid 32a along the transfer direction of the wafer W. Specifically, the linear motion mechanism changes the position of the lid 32a between a state in which the lid 32a blocks the transfer port 31 via the sealing member 311 as shown in FIG. 6 and a state in which the lid 32a is retracted to open the transfer port 31 as shown in FIG. 6. The sealing member 311 is, for example, an O-ring.

[0051] The processing vessel 30 has a maintenance port 35 at a position opposite the loading / unloading port 31 across the processing space S. The maintenance port 35 connects the processing space S to the outside. The maintenance port 35 is used, for example, when performing maintenance on the processing vessel 30 with the reinforcing member 40 attached to the processing vessel 30.

[0052] The drying unit 18 includes a lid 32b that closes the maintenance port 35 (see FIG. 6). The lid 32b is disposed on the other end side (positive Y-axis direction side) of the processing vessel 30 in the wafer W transfer direction (Y-axis direction). The lid 32b closes the maintenance port 35 via a sealing member 351. The sealing member 351 is, for example, an O-ring.

[0053] In this way, the processing space S is a space that is open at both ends in the loading direction, and the processing space S is sealed by closing the loading / unloading port 31 and the maintenance port 35 with the lids 32a and 32b, respectively.

[0054] The cover 32a is provided with a supply port 33a. The supply port 33a is connected to a supply line (not shown) that supplies the supercritical fluid to the drying unit 18. The processing space S is also provided with an exhaust port 33b. The exhaust port 33b is connected to an exhaust line 34b that exhausts the supercritical fluid and other fluids from the drying unit 18.

[0055] The supply port 33a opens horizontally toward the processing space S. The supercritical fluid supplied from a supply line (not shown) flows horizontally within the processing space S from the transfer port 31 toward the maintenance port 35.

[0056] The discharge port 33b is disposed near the maintenance port 35. For example, the discharge port 33b may be open to the bottom surface of the processing space S near the maintenance port 35. The supercritical fluid that has flowed through the processing space S toward the maintenance port 35 is discharged from the discharge port 33b via the discharge line 34b to the outside of the processing space S. Note that the supercritical fluid discharged to the outside of the processing space S may include IPA liquid that has dissolved in the supercritical fluid in a supercritical state from the surface of the wafer W.

[0057] The processing vessel 30 includes a plurality of support pins 305 in the processing space S. The support pins 305 are provided on the bottom surface of the processing space S and support the wafer W in a floating state above the bottom surface of the processing space S.

[0058] A temperature sensor 306 is built into the support pin 305. The temperature sensor 306 detects the temperature of the wafer W supported by the support pin 305. In conventional processing vessels, the partition wall covering the processing space S is formed to be relatively thick, making it difficult to form a fine through-hole for inserting the temperature sensor 306. In contrast, in the processing vessel 30 according to the first embodiment, the partition wall covering the processing space S can be formed to be thin, making it easy to form a fine through-hole for inserting the temperature sensor 306.

[0059] In the drying unit 18, the IPA liquid between the patterns formed on the wafer W comes into contact with the supercritical fluid in a high-pressure state (for example, 16 MPa), and gradually dissolves in the supercritical fluid, gradually replacing the spaces between the patterns. Finally, the spaces between the patterns are filled only with the supercritical fluid.

[0060] After the IPA liquid is removed from between the patterns, the pressure inside the processing vessel 30 is reduced from a high pressure state to atmospheric pressure, thereby ２ The IPA changes from a supercritical state to a gaseous state, and the gaps between the patterns are occupied only by gas. In this way, the IPA liquid between the patterns is removed, and the drying process of the wafer W is completed.

[0061] A supercritical fluid has a lower viscosity than a liquid (e.g., IPA liquid) and a high ability to dissolve liquids. In addition, there is no interface between the supercritical fluid and a liquid or gas in equilibrium with the supercritical fluid. As a result, a drying process using a supercritical fluid can dry the liquid without being affected by surface tension. Therefore, according to the embodiment, it is possible to prevent the pattern from collapsing during the drying process.

[0062] In this embodiment, IPA liquid is used as the liquid for preventing drying, and CO in a supercritical state is used as the processing fluid. ２ However, a liquid other than IPA may be used as the liquid for preventing drying. ２ Fluids other than the above may also be used as the processing fluid.

[0063] The reinforcing member 40 surrounds the outside of the processing vessel 30 and is fixed integrally with the processing vessel 30. The detailed configuration of the reinforcing member 40 will be described later.

[0064] As described above, the substrate processing apparatus 1 according to the first embodiment has a configuration in which the drying unit 18 can be separated into the processing vessel 30 that processes the wafer W and the reinforcing member 40 that reinforces the processing vessel 30. This configuration improves ease of maintenance compared to conventional processing vessels constructed from a single piece of metal. For example, conventional processing vessels constructed from a single piece of metal are difficult to lift during maintenance. In contrast, the processing vessel 30 according to the first embodiment can be made lighter and more compact than conventional processing vessels because the strength is ensured by the reinforcing member 40. Therefore, by removing the reinforcing member 40 during maintenance, the lightweight and compact processing vessel 30 can be lifted alone.

[0065] Furthermore, conventional processing vessels are manufactured by cutting a large block of metal, which results in relatively high manufacturing costs. In contrast, the drying unit 18 according to the first embodiment allows the processing vessel 30 and the reinforcing member 40 to be manufactured separately, which reduces manufacturing costs compared to conventional processing vessels.

[0066] Next, the detailed configuration of the processing vessel 30 will be described with further reference to FIGS. 7 and 8. FIG. 7 is a schematic plan view showing an example configuration of the processing vessel 30 according to the first embodiment. FIG. 8 is a cross-sectional view taken along line VIII-VIII in FIG. 7. Note that the top plate 302, the cooling plate 55, and the like are omitted from FIG. 7, and the support pins 305 and the like are omitted from FIG. 8.

[0067] The processing vessel 30 is made of metal. The outer surface of the processing vessel 30 that comes into contact with the reinforcing member 40 may be covered with a buffer material 303. Specifically, the outer surface of the processing vessel 30 other than the surface where the loading / unloading port 31 and the surface where the maintenance port 35 are provided may be covered with the buffer material 303. The buffer material 303 may be, for example, a resin sheet. By covering the outer surface of the processing vessel 30 with the buffer material 303 in this manner, sliding resistance when the reinforcing member 40 is attached to or detached from the processing vessel 30 can be reduced. Furthermore, direct contact between the reinforcing member 40 made of a metal material and the processing vessel 30 may generate metal dust. In contrast, by covering the outer surface of the processing vessel 30 with the buffer material 303, the generation of metal dust can be suppressed.

[0068] The processing vessel 30 has a recess 301 in the upper part thereof for accommodating a heater 50 (described later), and the processing vessel 30 has a top plate 302 that closes the recess 301. A buffer material 303 is provided on the outer surface of the processing vessel 30 including the upper surface of the top plate 302. As shown in FIG. 6 , the buffer material 303 is also provided on the bottom surface of the processing vessel 30, which is the surface opposite to the top plate 302.

[0069] The drying unit 18 also includes a heater 50 for heating the wafer W and a plurality of temperature sensors 60 for detecting the temperature of the wafer W heated by the heater 50 .

[0070] The heater 50 is provided in a recess 301 provided in the processing vessel 30. The heater 50 heats the processing space S through the partition wall of the processing vessel 30.

[0071] 7, the heater 50 may include a plurality of heating regions 50a, 50b, and 50c arranged concentrically in the radial direction of the wafer W. Here, an example is shown in which the heater 50 includes three heating regions 50a to 50c, but the number of heating regions included in the heater 50 is not limited to three.

[0072] The plurality of temperature sensors 60 are arranged at positions facing each of the heating regions 50a to 50c across the wafer W. In the first embodiment, the temperature sensors 60 include one temperature sensor 60a facing the heating region 50a across the wafer W, four temperature sensors 60b facing the heating region 50b across the wafer W, and four temperature sensors 60c facing the heating region 50c across the wafer W.

[0073] Based on the temperature detected by the temperature sensor 60, the control unit 61 (see FIG. 1) controls the outputs of the heating regions 50a to 50c, which are arranged at positions facing the temperature sensor 60 across the wafer W. For example, the control unit 61 may control the output of the heating region 50a based on the temperature detected by the temperature sensor 60a. Similarly, the control unit 61 may control the output of the heating region 50b based on the temperature detected by the temperature sensor 60b, and may control the output of the heating region 50c based on the temperature detected by the temperature sensor 60c.

[0074] Here, an example has been described in which the heater 50 includes a plurality of independently controllable heating regions 50a to 50c, but the heater 50 may also be configured to include a single heating region.

[0075] The drying unit 18 may include a cooling plate 55. The cooling plate 55 is disposed, for example, inside the recess 301 of the processing vessel 30 and above the heater 50. The cooling plate 55 can, for example, suppress a temperature rise in the processing space S.

[0076] The processing vessel 30 includes a recess 301 capable of accommodating the heater 50 and the cooling plate 55, and a top plate 302 covering the recess 301. When the recess 301 is covered by the top plate 302, the outer surface of the processing vessel 30 that contacts the reinforcing member 40 is flush. This configuration makes it difficult for a gap to form between the processing vessel 30 and the reinforcing member 40 when the reinforcing member 40 is attached to the processing vessel 30. When the processing vessel 30 is viewed along the wafer W load direction (see FIG. 8 ), the outer surfaces of the processing vessel 30 that contact the reinforcing member 40 in a direction perpendicular to the wafer W load direction (both left and right side surfaces of the processing vessel 30) are convexly curved. In other words, when the processing vessel 30 is viewed along the wafer W load direction, the processing vessel 30 has a flattened elliptical (oval) shape in the thickness direction (Z-axis direction). In this way, the outer surface of the processing vessel 30 that comes into contact with the reinforcing member 40 has a smooth shape without any corners, which further reduces the generation of metal dust due to contact between the reinforcing member 40 and the processing vessel 30.

[0077] <Configuration of Reinforcing Member> Next, the detailed configuration of the reinforcing member 40 will be described with reference to Fig. 9. Fig. 9 is a cross-sectional view taken along line IX-IX of Fig. 3 .

[0078] The reinforcing member 40 surrounds the outside of the processing vessel 30 and is fixed integrally to the processing vessel 30. The reinforcing member 40 may be made of a metal material different from that of the processing vessel 30. The reinforcing member 40 may be made of, for example, chromium-molybdenum steel (SCM).

[0079] The reinforcing member 40 includes a first member 41, a second member 42, a third member 43, and a fourth member 44. The first member 41 and the second member 42 sandwich the processing vessel 30 in a direction perpendicular to the main surface of the wafer W (Z-axis direction) and surround the outside of the processing vessel 30.

[0080] Specifically, the first member 41 covers the top surface and one of the left and right side surfaces (here, the right side surface) of the processing vessel 30. The surface of the first member 41 that covers the top surface of the processing vessel 30 is flat like the top surface of the processing vessel 30, and the surface that covers the side surface of the processing vessel 30 is curved like the side surface of the processing vessel 30.

[0081] The second member 42 covers the bottom surface and the other of the left and right side surfaces (here, the left side surface) of the processing vessel 30. The surface of the second member 42 covering the bottom surface of the processing vessel 30 is flat like the bottom surface of the processing vessel 30, and the surface covering the side surface of the processing vessel 30 is curved like the side surface of the processing vessel 30.

[0082] The third member 43 and the fourth member 44 sandwich and fix the first member 41 and the second member 42 in the direction along the main surface of the wafer W (X-axis direction).

[0083] Specifically, as shown in FIG. 4 , the structure of the reinforcing member 40, which is made up of the first member 41 and the second member 42, includes two grooves 401 and two protrusions 402. The grooves 401 and the protrusions 402 are provided on the side surfaces of the structure in a direction perpendicular to the direction in which the wafer W is carried in. The grooves 401 extend in the vertical direction (Z-axis direction), and both ends in the vertical direction are open. The protrusions 402 are located inside the grooves 401 and protrude in a direction perpendicular to the direction in which the wafer W is carried in. The protrusions 402 are formed by combining a protrusion 411 provided on the first member 41 and a protrusion 421 provided on the second member 42.

[0084] The third member 43 and the fourth member 44 are integrated with the first member 41 and the second member 42 by fitting into recessed portions formed by the grooves 401 and the protrusions 402 of the structure composed of the first member 41 and the second member 42 (see FIG. 3 ). Specifically, the third member 43 and the fourth member 44 have recesses 43a and 44a on their surfaces that contact the first member 41 and the second member 42, respectively, at positions facing the protrusions 402. The recesses 43a and 44a are shaped to fit into the protrusions 402. The recesses 43a and 44a of the third member 43 and the fourth member 44 fit into the protrusions 402, thereby preventing separation of the first member 41 and the second member 42 in the vertical direction. The third member 43 and the fourth member 44 integrated with the first member 41 and the second member 42 are flush with the first member 41 and the second member 42.

[0085] 9 , the protrusion 402 has a tapered shape that narrows toward the tip in the protruding direction. The recess 43a of the third member 43 has a tapered shape that narrows toward the depth direction of the recess 43a (here, the positive direction of the X axis). Similarly, the recess 44a of the fourth member 44 has a tapered shape that narrows toward the depth direction of the recess 44a (here, the negative direction of the X axis).

[0086] The third member 43 and the fourth member 44 are fastened together by bolts 70 and 71 with the first member 41 and the second member 42 sandwiched therebetween, thereby preventing the first member 41 and the second member 42 from separating in the left-right direction.

[0087] Specifically, the reinforcing member 40 has insertion holes 406 and 407 extending from the third member 43 toward the fourth member 44. The insertion hole 406 passes through the first member 41, and the insertion hole 407 passes through the second member .

[0088] One end of the insertion holes 406, 407 opens into one of the third member 43 and the fourth member 44 (here, the third member 43), and a screw groove (not shown) is formed on the circumferential surface of the other end of the insertion holes 406, 407 (here, the fourth member 44).

[0089] The bolt 70 is inserted from an opening provided in the third member 43 into the insertion hole 406 and threaded into a thread groove provided on the other end side of the insertion hole 406. Similarly, the bolt 71 is inserted from an opening provided in the third member 43 into the insertion hole 407 and threaded into a thread groove provided on the other end side of the insertion hole 407. In this way, the third member 43 and the fourth member 44 are fastened together with the first member 41 and the second member 42 sandwiched therebetween.

[0090] Pins 408a and 408b and elastic bodies 409a and 409b are disposed inside the insertion hole 406. Similarly, pins 408c and 408d and elastic bodies 409c and 409d are disposed inside the insertion hole 407.

[0091] The pin 408a and the elastic body 409a are disposed in a portion of the insertion hole 406 that is formed in the third member 43. Of the pin 408a and the elastic body 409a, the elastic body 409a is disposed in a position close to one end (opening) of the insertion hole 406, and the pin 408a is disposed in a position sandwiched between the elastic body 409a and the first member 41. The pin 408a is a cylindrical member, and is inserted through the bolt 70. When the third member 43 and the fourth member 44 are fastened together by the bolt 70, the elastic body 409a is housed in the insertion hole 406 in a state in which the pin 408a is biased toward the first member 41.

[0092] The pin 408b and the elastic body 409b are disposed in a portion of the insertion hole 406 that is formed in the fourth member 44. Of the pin 408b and the elastic body 409b, the elastic body 409b is disposed in a position close to the other end (thread groove) of the insertion hole 406, and the pin 408b is disposed in a position sandwiched between the elastic body 409b and the first member 41. The pin 408b is a cylindrical member, and is inserted through the bolt 70. When the third member 43 and the fourth member 44 are fastened by the bolt 70, the elastic body 409b is housed in the insertion hole 406 in a state where it biases the pin 408b toward the first member 41.

[0093] The pin 408c and the elastic body 409c are disposed in a portion of the insertion hole 407 that is formed in the third member 43. Of the pin 408c and the elastic body 409c, the elastic body 409c is disposed in a position close to one end (opening) of the insertion hole 407, and the pin 408c is disposed in a position sandwiched between the elastic body 409c and the second member 42. The pin 408c is a cylindrical member, and is inserted through the bolt 71. When the third member 43 and the fourth member 44 are fastened together by the bolt 71, the elastic body 409c is housed in the insertion hole 407 in a state in which the pin 408c is biased toward the second member 42.

[0094] The pin 408d and the elastic body 409d are disposed in a portion of the insertion hole 407 that is formed in the fourth member 44. Of the pin 408d and the elastic body 409d, the elastic body 409d is disposed in a position close to the other end (thread groove) of the insertion hole 407, and the pin 408d is disposed in a position sandwiched between the elastic body 409d and the second member 42. The pin 408d is a cylindrical member, and is inserted into the bolt 71. When the third member 43 and the fourth member 44 are fastened by the bolt 71, the elastic body 409d is housed in the insertion hole 407 in a state in which the pin 408d is biased toward the second member 42.

[0095] In this way, the reinforcing member 40 includes elastic bodies 409a and 409c (an example of a first elastic body) that urge the third member 43 in the direction opposite to the tightening direction of the bolts 70 and 71. The reinforcing member 40 also includes elastic bodies 409b and 409d (an example of a second elastic body) that urge the fourth member 44 in the direction opposite to the tightening direction of the bolts 70 and 71.

[0096] Furthermore, the reinforcing member 40 includes a plurality of elastic bodies 410 (an example of third elastic bodies). The plurality of elastic bodies 410 are located between the first member 41 and the second member 42 and bias the first member 41 and the second member 42 in directions separating them from each other. Specifically, the elastic bodies 410 are disposed obliquely with respect to the horizontal direction. The first member 41 and the second member 42 are fixed by the third member 43 and the fourth member 44 in a state in which they are biased by the plurality of elastic bodies 410 in directions separating them from each other obliquely. The elastic bodies 409a to 409d and the elastic body 410 are, for example, springs.

[0097] The reinforcing member 40 further includes a plurality of elastic bodies 415 (an example of a fourth elastic body). The plurality of elastic bodies 415 are located between the lower surface of the processing vessel 30 and the second member 42 and bias the processing vessel 30 and the second member 42 in directions away from each other. Specifically, a plurality of recesses 307 are formed in the lower surface of the processing vessel 30, and each elastic body 415 is housed in the recess 307 while biasing the processing vessel 30 in a direction away from the second member 42. The elastic body 415 is, for example, a ball plunger having a ball at one end on the side contacting the second member 42.

[0098] Next, a procedure for removing the reinforcing member 40 from the processing vessel 30 will be described with reference to Fig. 10. Fig. 10 is an explanatory view of the procedure for removing the reinforcing member 40 from the processing vessel 30.

[0099] First, loosen the bolts 70 and 71. When the bolts 70 and 71 are loosened, the elastic forces of the elastic bodies 409a to 409d cause the third member 43 and the fourth member 44 to move in a direction away from the first member 41 and the second member 42. In this way, by utilizing the elastic forces of the elastic bodies 409a to 409d, the third member 43 and the fourth member 44 can be easily separated from the first member 41 and the second member 42.

[0100] As described above, the convex portion 402 of the structure formed by the first member 41 and the second member 42 and the concave portions 43a, 44a of the third member 43 and the fourth member 44 have a tapered shape. Therefore, when the third member 43 and the fourth member 44 move in a direction away from the first member 41 and the second member 42, a gap is generated between the first member 41 and the second member 42 and the third member 43 and the fourth member 44 not only in the left-right direction but also in the up-down direction. When a gap is generated in the up-down direction, the first member 41 moves in a direction away from the second member 42 due to the biasing force of the multiple elastic bodies 410. As described above, because the multiple elastic bodies 410 are arranged diagonally, the first member 41 moves diagonally upward relative to the second member 42. As a result, a gap is generated between the first member 41 and the second member 42 not only in the up-down direction but also in the left-right direction. This allows the first member 41 to be separated from the second member 42 without interfering with the oval processing vessel 30 .

[0101] In this way, a gap is generated between the first member 41 and the second member 42, and then the processing vessel 30 is pulled out through the gap. When the first member 41 moves in a direction away from the second member 42, the biasing force of the multiple elastic bodies 415 causes the processing vessel 30 to move in a direction away from the second member 42. As described above, the multiple elastic bodies 415 are ball plungers, and each has a ball at the end that contacts the second member 42. Therefore, when the processing vessel 30 is removed, the balls of the multiple elastic bodies 415 roll, allowing the processing vessel 30 to be easily removed.

[0102] In this way, by providing the drying unit 18 with elastic bodies 409a to 409d, multiple elastic bodies 410 and multiple elastic bodies 415, the work of removing the reinforcing member 40 from the processing vessel 30 (the work of removing the processing vessel 30 from the reinforcing member 40) can be facilitated.

[0103] <Processing Vessel Replacing Method> Next, a method for replacing the processing vessel 30 according to the first embodiment will be described with reference to Fig. 11. Fig. 11 is a schematic view showing an example of the processing vessel replacing method according to the first embodiment.

[0104] First, at a predetermined replacement timing, the reinforcing member 40 is detached from the drying unit 18, and the processing vessel 30 is taken out (step S101). Specifically, as described above, the operator loosens the bolts 70, 71 (see FIGS. 9 and 10 ) that secure the reinforcing member 40 to the processing vessel 30, thereby removing the processing vessel 30 from the reinforcing member 40. The predetermined replacement timing may be a regular timing, such as once a month, or may be any other timing.

[0105] Next, the operator cleans the removed processing vessel 30 (step S102), and stores the cleaned processing vessel 30 in the storage unit 80 (step S103).

[0106] Next, the worker removes the other processing vessel 30 stored in the storage unit 80 from the storage unit 80 (step 104) and attaches the removed processing vessel 30 to the reinforcing member 40. This completes the replacement of the processing vessel 30. As described above, according to the substrate processing apparatus 1 of the first embodiment, the processing vessel 30 that processes the substrate and the reinforcing member 40 are separated, so that only the processing vessel 30 can be easily replaced.

[0107] The removed processing vessel 30 may be inspected before being cleaned. If an abnormality is found during the inspection, the processing vessel 30 may be reclaimed by polishing or the like, or may be discarded if reclaiming is difficult. On the other hand, if no abnormality is found during the inspection, the processing vessel 30 may proceed to the next processing vessel cleaning step (step S102).

[0108] As described above, the substrate processing apparatus 1 according to the first embodiment is configured such that the drying unit 18 can be separated into the processing vessel 30 that processes the wafer W and the reinforcing member 40 that reinforces the processing vessel 30. This configuration makes maintenance easier than with a conventional processing vessel 30 that is configured as a single unit made of metal.

[0109] 12 to 14 are schematic cross-sectional views showing a configuration example of a processing vessel 30 according to a second embodiment. As shown in FIGS. 12 to 14, the drying unit 18 may further include an optical sensor 90. In this case, the processing vessel 30 may include a through-hole 37 that connects the processing space S to the outside, and a transparent member 38 that closes the through-hole. The optical sensor 90 irradiates light into the processing space S through the transparent member 38.

[0110] 12 , the through-hole 37a and the optical sensor 90a are disposed near the center below the wafer W. The optical sensor 90a may be, for example, a photoelectric sensor capable of detecting the presence or absence of the wafer W. The optical sensor 90a may also be, for example, a laser displacement meter capable of measuring the distance from the optical sensor 90a to the wafer W.

[0111] 13, the through-hole 37b and the optical sensor 90b are disposed near the center above the wafer W. The optical sensor 90b may be, for example, a spectroscopic interference laser displacement meter capable of measuring the thickness of a liquid film formed on the wafer W.

[0112] 14 , the through holes 37c, 37d and the optical sensors 90c, 90d are respectively disposed at the lower end of the wafer W. Each of the optical sensors 90c, 90d may be, for example, a photoelectric sensor capable of detecting the presence or absence of the wafer W. In this way, by detecting the presence or absence of the wafer W at a plurality of positions, it is possible to detect deviation of the wafer W from the desired position.

[0113] As described above in the first embodiment, the processing vessel 30 can be separated into the processing vessel 30 for processing the wafer W and the reinforcing member 40 for fixing the processing vessel 30. This makes it easier to process the processing vessel 30, such as by providing the through-hole 37, compared to a conventional integrated processing vessel. This makes it possible to provide the drying unit 18 with more functions, such as measurement using the optical sensor 90.

[0114] 15 and 16 are schematic diagrams illustrating a configuration example of a processing vessel 30 according to a third embodiment. FIG. 15 is a perspective view of a first member 181 of the processing vessel 30 according to the third embodiment, as viewed obliquely from below. FIG. 16 is a perspective view of a second member 182 of the processing vessel 30 according to the third embodiment, as viewed obliquely from above. Note that members such as support pins 305 are omitted from FIGS. 15 and 16 .

[0115] 15 and 16 , the processing vessel 30 may have a detachable member that constitutes the bottom of the processing space S. Specifically, the processing vessel 30 may have a configuration that is separable into a first member 181 that constitutes the peripheral wall and ceiling of the processing space S, and a second member 182 that is detachable from the first member 181 and constitutes the bottom of the processing space S.

[0116] In this configuration, special cutting is not required to form the processing space S, compared to when the processing vessel 30 is made of a single piece of metal, and this facilitates the manufacture of the processing vessel 30. Also, for example, it is possible to replace only the second member 182 of the processing vessel 30 with a new one, or only the first member 181 with a new one.

[0117] The present disclosure may be configured as follows: (1) A substrate processing apparatus comprising: a processing vessel having a processing space capable of accommodating a substrate, the processing space being pressurized during processing of the substrate; a supply line for supplying a processing fluid into the processing space; a discharge line for discharging the processing fluid from the processing space; and a reinforcing member surrounding the outside of the processing vessel and integrally fixed to the processing vessel. (2) The substrate processing apparatus according to (1), wherein the processing vessel comprises: a loading / unloading port that connects the processing space to the outside and through which the substrate is loaded and unloaded into the processing space; and a lid that closes the loading / unloading port. (3) The substrate processing apparatus according to (1) or (2), wherein the processing vessel is made of metal, and an outer surface that comes into contact with the reinforcing member is covered with a buffer material. (4) The substrate processing apparatus according to any one of (1) to (3), wherein the processing vessel has a member that forms a bottom of the processing space that is detachable. (5) The substrate processing apparatus according to any one of (1) to (4), comprising: a heater provided in the processing vessel to heat the substrate accommodated in the processing vessel; and a plurality of temperature sensors provided in the processing vessel to detect the temperature of the substrate heated by the heater, wherein the heater comprises a plurality of heating regions arranged concentrically in a radial direction of the substrate, and the plurality of temperature sensors are arranged at least one for each of the heating regions at positions opposing each other across the substrate. (6) The substrate processing apparatus according to (5), further comprising a controller that controls, based on the temperature detected by the temperature sensor, an output of the heating region arranged at a position opposing the temperature sensor across the substrate. (7) The substrate processing apparatus according to (5) or (6), further comprising a cooling plate provided in the processing vessel to cool the substrate heated by the heater. (8) A substrate processing apparatus according to any one of (1) to (7), comprising an optical sensor, wherein the processing vessel comprises: a through-hole connecting the processing space with the outside; and a transparent member covering the through-hole, and the optical sensor irradiates light into the processing space through the transparent member.(9) The substrate processing apparatus according to (8), wherein the through hole and the optical sensor are disposed above or below the substrate, and the optical sensor measures the presence or absence of the substrate, the distance from the optical sensor to the substrate, or the thickness of a liquid film formed on the substrate. (10) The substrate processing apparatus according to any one of (1) to (9), wherein the reinforcing member comprises: a first member and a second member surrounding the outside of the processing vessel sandwiching the processing vessel in a direction perpendicular to the main surface of the substrate, and a third member and a fourth member sandwiching the first member and the second member in a direction along the main surface of the substrate. (11) The substrate processing apparatus according to (10), wherein the third member and the fourth member are fastened with a bolt while sandwiching the first member and the second member, the third member comprising a first elastic body that urges the third member in a direction opposite to the tightening direction of the bolt, and the fourth member comprising a second elastic body that urges the fourth member in a direction opposite to the tightening direction of the bolt. (12) The substrate processing apparatus according to (11), wherein the reinforcing member is located between the first member and the second member and includes a third elastic body that biases the first member and the second member in directions away from each other. (13) The substrate processing apparatus according to (12), wherein the third member and the fourth member include recesses on surfaces that contact the first member and the second member, and the first member and the second member include protrusions on surfaces that contact the third member and the fourth member at positions facing the recesses, and the recesses have a tapered shape that narrows in width in a depth direction of the recesses. (14) The substrate processing apparatus according to any one of (1) to (13), wherein the processing vessel and the reinforcing member are formed of different metal materials. (15) A processing vessel replacement method for replacing a processing vessel in a substrate processing apparatus according to any one of (1) to (14), comprising the steps of: removing the reinforcing member from the substrate processing apparatus and removing the processing vessel at a predetermined replacement timing; cleaning the removed processing vessel; storing the cleaned processing vessel in a storage unit; removing another processing vessel stored in the storage unit from the storage unit; and attaching the reinforcing member to the removed processing vessel.(16) A substrate processing method in the substrate processing apparatus described in (5), comprising: a step of acquiring a detection result from the temperature sensor, and a step of controlling an output of the heating region disposed at a position opposite the temperature sensor across the substrate, based on the acquired detection result. (17) A computer-readable storage medium storing a program that runs on a computer and controls the substrate processing apparatus, the program causing the computer to control the substrate processing apparatus so as to perform the substrate processing method described in (16) when executed.

[0118] The disclosed embodiments should be considered in all respects as illustrative and not restrictive. Indeed, the above-described embodiments may be embodied in various forms. Furthermore, the above-described embodiments may be omitted, substituted, or modified in various ways without departing from the scope and spirit of the appended claims.

[0119] REFERENCE SIGNS LIST 1 substrate processing apparatus 6 control device 18 drying unit 30 processing container 31 loading / unloading port 32a, 32b lid 40 reinforcing member 41 first member 42 second member 43 third member 44 fourth member 61 control unit 62 storage unit

Claims

1. A substrate processing apparatus comprising: a processing vessel having a processing space capable of accommodating a substrate, the processing space being pressurized when the substrate is processed; a supply line for supplying a processing fluid into the processing space; a discharge line for discharging the processing fluid from the processing space; and a reinforcing member that surrounds the outside of the processing vessel and is fixed integrally to the processing vessel.

2. The substrate processing apparatus according to claim 1, wherein the processing vessel is provided with a loading / unloading port that connects the processing space with the outside and through which the substrate is loaded and unloaded into the processing space, and further provided with a lid that closes the loading / unloading port.

3. The substrate processing apparatus according to claim 1, wherein the processing vessel is made of metal, and the outer surface that comes into contact with the reinforcing member is covered with a buffer material.

4. The substrate processing apparatus according to claim 1, wherein the processing vessel has a detachable member that constitutes the bottom of the processing space.

5. A substrate processing apparatus as described in claim 1, comprising: a heater provided in the processing vessel for heating the substrate contained in the processing vessel; and a plurality of temperature sensors provided in the processing vessel for detecting the temperature of the substrate heated by the heater, wherein the heater has a plurality of heating regions arranged concentrically in the radial direction of the substrate, and the plurality of temperature sensors are arranged at least one each in positions opposing each of the heating regions and the substrate.

6. The substrate processing apparatus according to claim 5, further comprising a control unit that controls the output of the heating region arranged opposite the temperature sensor across the substrate, based on the temperature detected by the temperature sensor.

7. The substrate processing apparatus according to claim 5, further comprising a cooling plate provided in said processing vessel for cooling said substrate heated by said heater.

8. A substrate processing apparatus as described in claim 1, comprising an optical sensor, the processing vessel comprising: a through hole communicating the processing space with the outside; and a transparent member covering the through hole, the optical sensor irradiating light into the processing space through the transparent member.

9. The substrate processing apparatus of claim 8, wherein the through hole and the optical sensor are positioned above or below the substrate, and the optical sensor measures the presence or absence of the substrate, the distance from the optical sensor to the substrate, or the thickness of a liquid film formed on the substrate.

10. The substrate processing apparatus of claim 1, wherein the reinforcing member comprises: a first member and a second member that surround the outside of the processing vessel sandwiching the processing vessel in a direction perpendicular to the main surface of the substrate; and a third member and a fourth member that sandwich the first member and the second member in a direction along the main surface of the substrate.

11. A substrate processing apparatus as described in claim 10, wherein the third member and the fourth member are fastened with a bolt while sandwiching the first member and the second member, the third member has a first elastic body that urges the third member in a direction opposite to the tightening direction of the bolt, and the fourth member has a second elastic body that urges the fourth member in a direction opposite to the tightening direction of the bolt.

12. The substrate processing apparatus according to claim 11, wherein the reinforcing member is provided with a third elastic body located between the first member and the second member and biasing the first member and the second member in directions away from each other.

13. The substrate processing apparatus of claim 12, wherein the third member and the fourth member have recesses on their surfaces that contact the first member and the second member, the first member and the second member have protrusions at positions opposite the recesses on their surfaces that contact the third member and the fourth member, and the recesses have a tapered shape that narrows in width in the depth direction of the recesses.

14. The substrate processing apparatus according to claim 1, wherein the processing vessel and the reinforcing member are formed of different metallic materials.

15. A processing vessel replacement method for replacing a processing vessel in a substrate processing apparatus as described in claim 1, comprising the steps of: removing the reinforcing member from the substrate processing apparatus and removing the processing vessel at a predetermined replacement timing; cleaning the removed processing vessel; storing the cleaned processing vessel in a storage section; removing from the storage section another processing vessel stored in the storage section; and attaching the reinforcing member to the removed processing vessel.

16. A substrate processing method according to claim 5, comprising: a step of acquiring a detection result from the temperature sensor; and a step of controlling an output of the heating region arranged opposite the temperature sensor across the substrate based on the acquired detection result.

17. A computer-readable storage medium having stored thereon a program that runs on a computer and controls a substrate processing apparatus, the program, when executed, causing a computer to control the substrate processing apparatus so as to perform the substrate processing method according to claim 16.

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