Electrodeposited copper foil and preparation device therefor, negative electrode sheet, battery cell, battery, and electric apparatus

Abstract

An electrodeposited copper foil and a preparation device therefor, a negative electrode sheet, a battery cell, a battery, and an electric apparatus. The preparation device for the electrodeposited copper foil comprises a pulsed power supply and a foil-forming apparatus. The pulsed power supply has a positive electrode and a negative electrode. The foil-forming apparatus comprises a cathode member and an anode member, wherein the anode member is provided with a plating solution tank for containing an electroplating solution, and at least part of the cathode member is located in the plating solution tank. The positive electrode is electrically connected to the cathode member, and the negative electrode is electrically connected to the anode member.

Description

Electrolytic copper foil and its preparation equipment, negative electrode sheet, battery cell, battery and electrical device

[0001] This application claims priority to the Chinese patent application filed with the China Patent Office on November 27, 2023, with application number 202311601317.6 and invention name “Electrolytic copper foil and its preparation equipment, negative electrode sheet, battery cell and battery”, the entire contents of which are incorporated by reference into this application. Technical Field

[0002] The present application belongs to the technical field of electrolytic copper foil preparation, and in particular relates to an electrolytic copper foil and its preparation equipment, a negative electrode sheet, a battery cell, a battery and an electrical device. Background Art

[0003] Copper foil is an extremely thin copper material used in a wide range of applications, including composite materials, electronic materials, and decorative materials. Electrolytic copper foil is an emerging material with broad application prospects. It is widely used in the electronics industry, such as circuit boards, electronic components, and batteries. Its excellent electrical and thermal conductivity improves the performance and stability of electronic products. Furthermore, electrolytic copper foil is used for decorative and protective purposes on metal surfaces.

[0004] Electrolytic copper foil is usually produced by electrolysis using a DC power supply, but the tensile strength and ductility of the electrolytic copper foil currently produced in this way are not high.

[0005] Application Contents

[0006] The purpose of the embodiments of the present application is to provide an electrolytic copper foil and its preparation equipment, negative electrode sheet, battery cell, battery and electrical device, including but not limited to solving the problem of low tensile strength and ductility of electrolytic copper foil produced by direct current power supply electrolysis in related technologies.

[0007] The technical solution adopted in the embodiment of this application is:

[0008] In a first aspect, an electrolytic copper foil preparation device is provided, which includes a pulse power supply and a foil production device, the pulse power supply having a positive electrode and a negative electrode; the foil production device includes a cathode component and an anode component, the anode component is constructed with a plating tank for carrying an electroplating solution, and at least a portion of the cathode component is located in the plating tank; the positive electrode is electrically connected to the cathode component, and the negative electrode is electrically connected to the anode component; wherein the peak current range of the pulse power supply is 70kA to 200kA.

[0009] In the electrolytic copper foil preparation equipment of the embodiment of the present application, during the preparation of the electrolytic copper foil, the plating solution is injected into the plating solution tank, and at least a portion of the cathode component is immersed in the plating solution. Then, a pulse power supply is connected, and the cathode component and the anode component are connected through the plating solution current. Under the action of the current, the copper ions in the plating solution are reduced on the cathode component to form copper metal, forming the electrolytic copper foil, thus completing the production of the electrolytic copper foil. In this process, due to the use of a pulse power supply, the output pulse current of the pulse power supply can accelerate the production speed of the electrolytic copper foil grains, shorten the production time of the grains, thereby facilitating the refinement of the electrolytic copper foil grains, improving the tensile strength and elongation of the electrolytic copper foil, and improving the quality of the electrolytic copper foil.

[0010] In one embodiment, the peak current of the pulse power supply ranges from 70 kA to 200 kA.

[0011] By adopting the technical solution of the embodiment of the present application, the peak current range of the pulse power supply is 70kA to 200kA. The peak current of the pulse power supply is relatively large, the grain production speed of the electrolytic copper foil is fast, and the grain production time is short, thereby refining the grains of the electrolytic copper foil and even reaching nanocrystalline, thereby greatly improving the tensile strength and elongation of the electrolytic copper foil. At the same time, it is also conducive to the mass production of high-quality electrolytic copper foil.

[0012] In one embodiment, the peak current of the pulse power supply ranges from 100 kA to 150 kA.

[0013] By adopting the technical solution of the embodiment of the present application, the peak current of the pulse power supply is more reasonable, the electrolytic copper foil prepared by the electrolytic copper foil preparation equipment has excellent performance, and the pulse power supply is also easy to prepare, which is conducive to the mass production of high-performance electrolytic copper foil.

[0014] In one embodiment, the duty cycle of the pulse power supply ranges from 1% to 50%.

[0015] By adopting the technical solution of the embodiment of the present application, the duty cycle range is reasonable, and combined with the above-mentioned peak current, the production capacity and performance of the electrolytic copper foil can be better balanced.

[0016] In one embodiment, the duty cycle of the pulse power supply ranges from 5% to 20%.

[0017] By adopting the technical solution of the embodiment of the present application, the duty cycle of the pulse power supply is set more reasonably, and combined with the above-mentioned peak current, the production capacity and performance of the electrolytic copper foil can be better balanced.

[0018] In one embodiment, the pulse width of the pulse power supply ranges from 1 ms to 50 ms.

[0019] By adopting the technical solution of this embodiment, the pulse width of the pulse power supply is reasonably set, which can take into account both the quality and production efficiency of the electrolytic copper foil.

[0020] In one embodiment, the pulse width of the pulse power supply ranges from 10 ms to 30 ms.

[0021] By adopting the technical solution of this embodiment, the pulse width of the pulse power supply is set more reasonably, which can better balance the quality and production efficiency of the electrolytic copper foil.

[0022] In one embodiment, the average current range of the pulse power supply is 1 kA to 50 kA.

[0023] By adopting the technical solution of this embodiment, the average current of the pulse power supply is reasonably set, which can take into account both the quality and production efficiency of the electrolytic copper foil.

[0024] In one embodiment, the average current range of the pulse power supply is 3 kA to 20 kA.

[0025] By adopting the technical solution of this embodiment, the average current setting of the pulse power supply is more reasonable, which can better balance the quality and production efficiency of the electrolytic copper foil.

[0026] In one embodiment, the peak current density of the anode member is in the range of 181 A / dm 2 ~454A / dm 2 .

[0027] By adopting the technical solution of this embodiment, the peak current density of the anode component is reasonably set, and both the quality and production efficiency of the electrolytic copper foil can be taken into account.

[0028] In one embodiment, the peak current density of the anode member is in the range of 200 A / dm 2 ~240A / dm 2 .

[0029] By adopting the technical solution of this embodiment, the peak current density of the anode component is reasonably set, and both the quality and production efficiency of the electrolytic copper foil can be taken into account.

[0030] In one embodiment, the average current density of the anode member is in the range of 2A / dm 2 ~113A / dm 2 .

[0031] By adopting the technical solution of this embodiment, the average current density of the anode component is reasonably set, and both the quality and production efficiency of the electrolytic copper foil can be taken into account.

[0032] In one embodiment, the average current density of the anode member is in the range of 30 A / dm 2 ~80A / dm 2 .

[0033] By adopting the technical solution of this embodiment, the average current density of the anode component is reasonably set, and both the quality and production efficiency of the electrolytic copper foil can be taken into account.

[0034] In one embodiment, the output waveform of the pulse power supply is a rectangular wave.

[0035] By adopting the technical solution of this embodiment, the rectangular wave can provide a higher current density, making the electrolysis process faster and thus improving electrolysis efficiency. Compared with a continuous DC power supply, the rectangular wave can reduce polarization of the anode, thereby reducing energy consumption. In addition, the rectangular wave can control the growth rate of the electrolytic copper foil, avoiding surface roughness and internal defects caused by excessive growth. By adjusting the width, interval, and amplitude of the rectangular wave, the thickness of the electrolytic copper foil can be precisely controlled, improving the quality of the electrolytic copper foil.

[0036] In one embodiment, the pulse power supply includes a plurality of battery cells, and the plurality of battery cells are connected in parallel.

[0037] By adopting the electrolytic copper foil preparation equipment of this embodiment, the pulse power supply includes multiple battery cells, the battery cells are connected in parallel, and the current of the pulse power supply is equal to the sum of the currents of all the battery cells, so that the pulse power supply can output a larger current, thereby realizing the preparation of high-performance electrolytic copper foil.

[0038] In one embodiment, each battery unit includes a plurality of battery modules, and the plurality of battery modules are connected in parallel.

[0039] By adopting the electrolytic copper foil preparation equipment of this embodiment, the battery unit includes multiple battery modules, the battery modules are connected in parallel, and the current of the battery unit is equal to the sum of the currents of all battery modules, so that the battery unit can output a larger current, and the pulse power supply can also output a larger current, thereby realizing the preparation of high-performance electrolytic copper foil.

[0040] In one embodiment, the electrolytic copper foil preparation apparatus further comprises a copper busbar electrically connected between the positive electrode and the cathode of the pulse power supply.

[0041] By adopting the technical solution of this embodiment, the positive electrode and the cathode of the pulse power supply are connected by a copper busbar, which has a simple connection method and is easy to process and manufacture.

[0042] In one embodiment, the copper busbar comprises a silver-plated copper busbar, and the silver-plated copper busbar is electrically connected between the positive electrode and the cathode of the pulse power supply.

[0043] By adopting the technical solution of this embodiment and using a silver-plated copper busbar, the skin effect of current can be reduced, the heating of the copper busbar can be reduced, and the quality of the electrolytic copper busbar can be improved.

[0044] In one embodiment, the electrolytic copper foil preparation equipment further includes an electroplating solution component mixing device, which is used to adjust the concentration of at least some components in the electroplating solution.

[0045] By adopting the technical solution of this embodiment, the electroplating solution component mixing device can at least adjust the concentration of some components in the electroplating solution to an appropriate concentration range, thereby improving the performance and quality of the prepared electrolytic copper foil.

[0046] In one embodiment, the electroplating solution component mixing device is used to adjust the concentration of at least part of the components in the electroplating solution according to the detection results of the produced electrolytic copper foil.

[0047] By adopting the technical solution of this embodiment, the concentration of the components in the electroplating solution is adjusted according to the detection results of the prepared electrolytic copper foil, and a closed loop is formed between detection and adjustment, which reduces errors and ensures that the prepared electrolytic copper foil has better quality and performance.

[0048] In one embodiment, the electroplating solution component preparation device includes a first container and a first connecting pipe. The first container is used to load the leveling agent. The first connecting pipe connects the first container and the plating solution tank.

[0049] By adopting the technical solution of this embodiment, it is concluded from the test results of the electrolytic copper foil that when a leveling agent needs to be added to the electroplating solution, the leveling agent in the first container can flow into the plating solution tank through the first pipe to increase the concentration of the leveling agent in the electroplating solution, thereby improving the quality and performance of the electrolytic copper foil. In addition, the structure is simple and easy to process and manufacture.

[0050] In one embodiment, the first connecting pipe is provided with a first flow detection member for detecting the flow of the first connecting pipe.

[0051] By adopting the technical solution of this embodiment, the amount of the leveling agent added can be accurately controlled through the first flow detection element, which is beneficial to improving the quality and performance of the electrolytic copper foil.

[0052] In one embodiment, the electroplating solution component preparation device includes a second container and a second connecting pipe, the second container is used to load the wetting agent, and the second connecting pipe connects the second container and the plating solution tank.

[0053] By adopting the technical solution of this embodiment, it is concluded from the test results of the electrolytic copper foil that when the wetting agent in the electroplating solution needs to be added, the wetting agent in the second container can flow into the plating solution tank through the second pipe to increase the concentration of the wetting agent in the electroplating solution, thereby improving the quality and performance of the electrolytic copper foil; in addition, the structure is simple and easy to process and manufacture.

[0054] In one embodiment, the second connecting pipe is provided with a second flow detection member for detecting the flow of the second connecting pipe.

[0055] By adopting the technical solution of this embodiment, the amount of wetting agent added can be accurately controlled through the second flow detection component, which is beneficial to improving the quality and performance of the electrolytic copper foil.

[0056] In one embodiment, the electroplating solution component preparation device includes a third container and a third connecting pipe. The third container is used to load a solution containing chloride ions. The third connecting pipe connects the third container and the plating solution tank.

[0057] By adopting the technical solution of this embodiment, it is concluded from the test results of the electrolytic copper foil that when a solution containing chloride ions needs to be added to the electroplating solution, the solution containing chloride ions in the third container can flow into the plating tank through the third pipe to increase the concentration of the solution containing chloride ions in the electroplating solution, thereby improving the quality and performance of the electrolytic copper foil; in addition, the structure is simple and easy to process and manufacture.

[0058] In one embodiment, the third connecting pipe is provided with a third flow detection member for detecting the flow of the third connecting pipe.

[0059] By adopting the technical solution of this embodiment, the addition amount of the solution containing chloride ions can be accurately controlled through the third flow detection component, which is beneficial to improving the quality and performance of the electrolytic copper foil.

[0060] In one embodiment, the electroplating solution component preparation device includes a fourth container and a fourth connecting pipe. The fourth container is used to load brightener, and the fourth connecting pipe connects the fourth container and the plating solution tank.

[0061] By adopting the technical solution of this embodiment, it is concluded from the test results of the electrolytic copper foil that when brightener needs to be added to the electroplating solution, the brightener in the fourth container can flow into the plating solution tank through the fourth pipe to increase the concentration of the brightener in the electroplating solution, thereby improving the quality and performance of the electrolytic copper foil; in addition, the structure is simple and easy to process and manufacture.

[0062] In one embodiment, the fourth connecting pipe is provided with a fourth flow detection member for detecting the flow in the fourth connecting pipe.

[0063] By adopting the technical solution of this embodiment, the amount of brightener added can be accurately controlled through the fourth flow detection component, which is beneficial to improving the quality and performance of the electrolytic copper foil.

[0064] In one embodiment, the electroplating solution component preparation device includes a fifth container and a fifth connecting pipe. The fifth container is used to load the copper sulfate solution. The fifth connecting pipe connects the fifth container and the plating solution tank.

[0065] By adopting the technical solution of this embodiment, it is concluded from the test results of the electrolytic copper foil that when copper sulfate solution needs to be added to the electroplating solution, the copper sulfate solution in the fifth container can flow into the plating tank through the fifth pipe to increase the concentration of the copper sulfate solution in the electroplating solution, thereby improving the quality and performance of the electrolytic copper foil. In addition, the structure is simple and easy to process and manufacture.

[0066] In one embodiment, the fifth connecting pipe is provided with a fifth flow detection member for detecting the flow in the fifth connecting pipe.

[0067] By adopting the technical solution of this embodiment, the addition amount of the copper sulfate solution can be accurately controlled through the fourth flow detection component, which is beneficial to improving the quality and performance of the electrolytic copper foil.

[0068] In a second aspect, an electrolytic copper foil is provided. The electrolytic copper foil is produced using the electrolytic copper foil production equipment described in the above embodiment.

[0069] The electrolytic copper foil of the embodiment of the present application is produced by using the above-mentioned electrolytic copper foil production equipment, and the electrolytic copper foil has high tensile strength and elongation.

[0070] In a third aspect, a negative electrode sheet is provided, comprising the electrolytic copper foil as described in the above embodiment.

[0071] The negative electrode sheet of the embodiment of the present application adopts the above-mentioned electrolytic copper foil. The electrolytic copper foil has high tensile strength and elongation, which is of great help in the subsequent design and development of ultra-thin battery cells.

[0072] In a fourth aspect, a battery cell is provided, comprising the negative electrode sheet as described in the above embodiment.

[0073] The battery cells of the embodiments of the present application use the above-mentioned negative electrode sheets, which can significantly improve the cycle life and safety of high-expansion force battery cells, such as silicon-doped system batteries, and can improve the problem of expansion and fracture of the negative electrode sheets in the late stage of the battery cell charge and discharge cycle.

[0074] In a fifth aspect, a battery is provided, comprising the battery cell as described in the above embodiment.

[0075] The battery of the embodiment of the present application adopts the above-mentioned battery cell, which has good performance and is conducive to improving the cycle life and safety of the battery.

[0076] In a sixth aspect, an electrical device is provided, comprising the battery as described in the above embodiment.

[0077] The battery of the embodiment of the present application adopts the above-mentioned battery, which has good performance and safety, and is conducive to improving the reliability of the use of electrical devices.

[0078] The above description is only an overview of the technical solution of the present application. In order to more clearly understand the technical means of the present application, it can be implemented in accordance with the contents of the specification. In order to make the above and other purposes, features and advantages of the present application more obvious and easy to understand, the specific implementation methods of the present application are listed below. BRIEF DESCRIPTION OF THE DRAWINGS

[0079] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the following briefly introduces the drawings required for use in the embodiments or descriptions of the prior art. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.

[0080] FIG1 is a schematic structural diagram of an electrolytic copper foil preparation device provided in one embodiment of the present application.

[0081] FIG2 is a tensile curve diagram of an electrolytic copper foil prepared by an electrolytic copper foil preparation device provided in another embodiment of the present application.

[0082] FIG3 is a schematic structural diagram of a vehicle provided in yet another embodiment of the present application.

[0083] FIG4 is an exploded schematic diagram of a battery provided in yet another embodiment of the present application.

[0084] FIG5 is a schematic structural diagram of a battery cell provided in yet another embodiment of the present application.

[0085] FIG6 is an exploded schematic diagram of a battery cell provided in yet another embodiment of the present application.

[0086] FIG7 is a schematic structural diagram of an electrode assembly provided in yet another embodiment of the present application.

[0087] FIG8 is a cross-sectional view taken along line AA in FIG7 .

[0088] Among them, the reference numerals in the figures are:

[0089] 1000, vehicle; 1100, battery; 1200, controller; 1300, motor; 10, housing; 11, first part; 12, second part; 20, battery cell; 21, end cap; 211, electrode terminal; 212, pressure relief mechanism; 22, housing; 23, electrode assembly; 231, positive electrode sheet; 2311, positive electrode current collector; 2312, positive electrode active material layer; 232, negative electrode sheet; 2321, negative electrode current collector; 2322, negative electrode active material layer; 233, separator;

[0090] 100. Electrolytic copper foil preparation equipment; 110. Pulse power supply; 111. Battery cell; 120. Foil production device; 121. Cathode component; 122. Anode component; 1221. Plating solution tank; 123. Plating solution; 131. Silver-plated copper busbar; 132. Electrical connector; 140. Plating solution component mixing device; 1401. First container; 1402. First connecting tube; 1403. Second container; 1404. Second connecting tube; 1405. Third container; 1406. Third connecting tube; 1407. Fourth container; 1408. Fourth connecting tube; 1409. Fifth container; 1410. Fifth connecting tube; 200. Electrolytic copper foil. DETAILED DESCRIPTION

[0091] In order to make the technical problems, technical solutions and beneficial effects to be solved by this application more clearly understood, this application is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain this application and are not intended to limit this application.

[0092] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by those skilled in the art to which this application belongs; the terms used herein are only for the purpose of describing specific embodiments and are not intended to limit this application; the terms "including" and "having" and any variations thereof in the specification and claims of this application and the above-mentioned figure descriptions are intended to cover non-exclusive inclusions.

[0093] In the description of the embodiments of this application, the technical terms "first," "second," etc., are used solely to distinguish between different objects and should not be understood to indicate or imply relative importance, or to implicitly specify the quantity, specific order, or primary-secondary relationship of the technical features indicated. Therefore, a feature designated "first" or "second" may explicitly or implicitly include one or more of such features.

[0094] References herein to "embodiments" mean that a particular feature, structure, or characteristic described in connection with the embodiments may be included in at least one embodiment of the present application. The appearance of this phrase in various places in the specification does not necessarily refer to the same embodiment, nor does it constitute an independent or alternative embodiment that is mutually exclusive of other embodiments. It is understood, both explicitly and implicitly, by those skilled in the art that the embodiments described herein may be combined with other embodiments in any suitable manner.

[0095] In the description of the embodiments of this application, the term "and / or" is simply a description of the association relationship between associated objects, indicating that three relationships can exist. For example, A and / or B can represent the following three situations: A exists alone, A and B exist simultaneously, and B exists alone. In addition, the character " / " in this document generally indicates that the associated objects are in an "or" relationship.

[0096] In the description of the embodiments of this application, the term "plurality" refers to two or more (including two). Similarly, "multiple groups" refers to two or more (including two groups), and "multiple sheets" refers to two or more (including two sheets). "Several" means one or more, unless otherwise specifically defined.

[0097] In the description of the embodiments of the present application, the technical terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings. They are only for the convenience of describing the embodiments of the present application and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation. Therefore, they should not be understood as limiting the embodiments of the present application.

[0098] In the description of the embodiments of the present application, unless otherwise expressly specified or limited, technical terms such as "installed," "connected," "connected," and "fixed" should be understood in a broad sense. For example, they can refer to fixed connections, detachable connections, or integration; mechanical connections or electrical connections; direct connections or indirect connections through an intermediate medium; and internal connections between two components or interactions between two components. Those skilled in the art can understand the specific meanings of the above terms in the embodiments of the present application based on specific circumstances.

[0099] In the description of the embodiments of the present application, unless otherwise expressly specified or limited, when an element is referred to as being “fixed to” or “disposed on” another element, it may be directly on the other element or indirectly on the other element. When an element is referred to as being “connected to” another element, it may be directly connected to the other element or indirectly connected to the other element.

[0100] Copper foil is an extremely thin copper material, including electrolytic copper foil, rolled copper foil, hot-rolled copper foil, etc. Among them, electrolytic copper foil is widely used as a conductive material for circuit boards and anode materials for batteries due to its excellent electrical and thermal conductivity.

[0101] Electrolytic copper foil is made using electrolytic copper foil preparation equipment, which usually includes a power supply, an anode component and a cathode component. The anode component is formed with a plating tank, which is loaded with electroplating solution, and the cathode component is at least partially immersed in the electroplating solution; the anode component is electrically connected to the negative pole of the power supply, and the cathode component is electrically connected to the positive pole of the power supply. Through the action of the current, the copper ions in the plating solution are reduced on the cathode component to form copper metal, forming electrolytic copper foil.

[0102] Electrolytic copper foil is commonly produced using DC power supplies in mass production. Improving the mechanical properties of electrolytic copper foil primarily relies on the addition of organic additives, such as amines, polyethers, cellulose, and sulfur-containing organic compounds, to balance tensile strength and elongation. However, the underlying mechanism of action is unclear, and direct observation is currently unavailable. Furthermore, additive adjustments have reached their limits, preventing simultaneous improvement in tensile strength and elongation.

[0103] Based on this, the electrolytic copper foil preparation equipment of the embodiment of the present application adopts a pulse power supply. The output pulse current of the pulse power supply can increase the grain production speed of the electrolytic copper foil and shorten the grain production time, thereby facilitating the refinement of the grains of the electrolytic copper foil, improving the tensile strength and elongation of the electrolytic copper foil, and improving the quality of the electrolytic copper foil.

[0104] As shown in Figure 1, in one embodiment of the present application, an electrolytic copper foil preparation device 100 is provided, which includes a pulse power supply 110 and a foil production device 120; the pulse power supply 110 has a positive electrode and a negative electrode; the foil production device 120 includes a cathode component 121 and an anode component 122, and the anode component 122 is constructed with a plating tank 1221 for carrying an electroplating solution 123, and at least a portion of the cathode component 121 is located in the plating tank 1221; the positive electrode is electrically connected to the cathode component 121, and the negative electrode is electrically connected to the anode component 122.

[0105] Pulse power supply 110 is a power supply device that can output pulse current with a specific frequency and pulse width. Pulse power supply 110 operates on a DC power supply by adjusting the switching frequency and duty cycle to achieve pulse output. Pulse power supply 110 can be, but is not limited to, a switching power supply, an inverter power supply, or a DC-DC converter.

[0106] The positive terminal of the pulse power supply 110 may refer to the current outflow terminal of the pulse power supply 110, and the negative terminal of the pulse power supply 110 may refer to the current inflow terminal of the pulse power supply 110. During the operation of the pulse power supply 110, the time interval during which the pulse current repeats within a complete cycle is called a pulse period. The output waveform of the pulse current can be various, such as rectangular wave, square wave, triangle wave, etc.

[0107] Cathode 121 is a component electrically connected to the positive electrode of pulse power supply 110. Cathode 121 can be made of materials such as stainless steel or titanium alloy. Cathode 121 can be cylindrical or hollow cylindrical, and has a smooth surface to minimize damage to electrolytic copper foil 200.

[0108] Anode 122 is a component electrically connected to the negative electrode of pulse power supply 110. Anode 122 is made of copper and can be flat, cylindrical, or in other shapes. In one embodiment, anode 122 is a semicircular plate to fit the cylindrical cathode 121. Furthermore, the size and shape of the anode can be adjusted based on the design and production requirements of the specific plating tank 1221.

[0109] The electroplating solution 123 may refer to a solution that undergoes an electrochemical reaction under the action of an electric current and may include copper sulfate, a leveler, a brightener, and the like.

[0110] The plating tank 1221 may be a tank structure formed by the anode member 122. The plating tank 1221 is used to hold the electroplating solution 123. The shape of the plating tank 1221 may be adapted to the shape of the cathode member 121 to improve the quality of the electrolytic copper foil 200. The plating tank 1221 may have various shapes, such as cylindrical, square, etc.

[0111] At least part of the cathode component 121 is located in the plating solution tank 1221. It can be understood that part of the cathode component 121 is located in the plating solution tank 1221, and the other part is located outside the plating solution tank 1221. After the plating solution 123 is injected into the plating solution tank 1221, part of the cathode component 121 will also be immersed in the plating solution 123; or, the cathode component 121 is entirely located in the plating solution tank 1221. After the plating solution 123 is injected into the plating solution tank 1221, part of the cathode component 121 can be immersed in the plating solution 123, or the cathode component 121 can be immersed in the plating solution 123.

[0112] The positive electrode is electrically connected to the cathode member 121. It is understood that the positive electrode of the pulse power supply 110 and the cathode member 121 are electrically conductive. The positive electrode of the pulse power supply 110 and the cathode member 121 can be electrically conductive through a wire, a copper busbar, or direct electrical contact.

[0113] The negative electrode is electrically connected to the anode 122. It is understood that there is electrical conduction between the negative electrode of the pulse power supply 110 and the anode 122. Electrical conduction between the negative electrode of the pulse power supply 110 and the anode 122 can be achieved through a wire, a copper busbar, or direct electrical contact.

[0114] In the electrolytic copper foil manufacturing apparatus 100 of the embodiment of the present application, during the process of manufacturing the electrolytic copper foil 200, the electroplating solution 123 is injected into the plating solution tank 1221, and at least a portion of the cathode member 121 is immersed in the electroplating solution 123. Then, the pulse power supply 110 is turned on, and the cathode member 121 and the anode member 122 are electrically connected through the electroplating solution 123. Under the action of the current, the copper ions in the electroplating solution 123 are reduced on the cathode member 121 to form copper metal, thereby forming the electrolytic copper foil 200, thereby completing the manufacturing of the electrolytic copper foil 200. In this process, due to the use of the pulse power supply 110, the pulse current output by the pulse power supply 110 can accelerate the grain production speed of the electrolytic copper foil 200, shorten the grain production time, thereby facilitating the refinement of the grains of the electrolytic copper foil 200, improving the tensile strength and elongation of the electrolytic copper foil 200, and improving the quality of the electrolytic copper foil 200.

[0115] In one embodiment, the pulse power supply adopts an industrial pulse power supply, but the peak current of the industrial pulse power supply 110 is usually about 5000A. However, the tensile strength and elongation of the electrolytic copper foil prepared in this way have certain advantages over the electrolytic copper foil prepared by the current DC power supply, but the advantages are not particularly obvious.

[0116] In some embodiments, the peak current of the pulse power supply 110 ranges from 70 kA to 200 kA.

[0117] The peak current of the pulse power supply 110 may refer to the maximum instantaneous current in the pulse current generated by the pulse power supply 110. The peak current of the pulse power supply 110 may be directly measured using an ammeter, an oscilloscope, or other measuring instruments; or may be directly obtained from the label or specification sheet of the pulse power supply 110.

[0118] The peak current range of the pulse power supply 110 is 70kA to 200kA. It is understandable that the peak current of the pulse power supply 110 can be 70kA, 200kA, or any value between 70kA and 200kA. As an example, the peak current of the pulse power supply 110 can be, but is not limited to, 70kA, 80kA, 90kA, 100kA, 110kA, 120kA, 130kA, 140kA, 150kA, 160kA, 170kA, 180kA, 190kA, and 200kA.

[0119] The peak current of the industrial pulse power supply 110 is approximately 5000A, while the peak current of the pulse power supply 110 in the embodiment of the present application is greater than or equal to 70kA, which is much greater than the peak current of the industrial pulse power supply 110. In addition, the peak current of the pulse power supply 110 in the embodiment of the present application is less than or equal to 200kA, so that the peak current of the pulse power supply 110 is not too large, which greatly increases the manufacturing difficulty and manufacturing cost of the pulse power supply 110, thereby facilitating the mass production of the electrolytic copper foil 200.

[0120] By adopting the technical solution of this embodiment, since the peak current range of the pulse power supply 110 is 70kA to 200kA, the peak current of the pulse power supply 110 is relatively large, the grain production speed of the electrolytic copper foil 200 is fast, and the grain production time is short, thereby refining the grains of the electrolytic copper foil 200, even reaching nanocrystalline, thereby greatly improving the tensile strength and elongation of the electrolytic copper foil 200, and at the same time, it is also conducive to the mass production of high-quality electrolytic copper foil 200.

[0121] In actual production, the tensile strength of the electrolytic copper foil 200 produced by the electrolytic copper foil preparation equipment 100 of the embodiment of the present application is greatly improved compared with the DC power supply, reaching 800 MPa. At the same time, the elongation is greater than or equal to 6%. In addition, the electrolytic copper foil 200 is characterized and analyzed by material EBSD (Electron Backscatter Diffraction), which shows that uniformly refined nanocrystals are generated in the electrolytic copper foil 200, which also explains from a mechanistic perspective the essence of the electrolytic copper foil 200 produced by the electrolytic copper foil preparation equipment 100 of the embodiment of the present application having the properties of ultra-high tensile strength and ultra-high elongation.

[0122] The ultra-high-strength, high-ductility electrolytic copper foil 200 produced by the electrolytic copper foil production equipment 100 of the present embodiment has extremely high application value in the lithium battery industry. On the one hand, it is of great benefit for the application of extremely thin and even future ultra-thin lithium battery copper foil current collectors, such as 4.5um and 3.5um copper foils. On the other hand, it significantly improves the cycle life and safety of high-expansion battery cells, such as silicon-doped battery cells 1100, and can alleviate the expansion and fracture of negative electrode sheets 232 in the late stages of the charge and discharge cycle of battery cells 20. It also meets the needs of the batch production of 1450mm wide cathode rollers in the electrolytic copper foil 200 industry.

[0123] In some embodiments, the peak current of the pulse power supply 110 ranges from 100 kA to 150 kA.

[0124] It will be appreciated that the peak current of the pulse power supply 110 may be 100 kA, 150 kA, or any value between 100 kA and 150 kA; as an example, the peak current of the pulse power supply 110 may be, but is not limited to, 100 kA, 105 kA, 110 kA, 115 kA, 120 kA, 125 kA, 130 kA, 135 kA, 140 kA, 145 kA, or 150 kA.

[0125] By adopting the technical solution of the embodiment of the present application, the peak current of the pulse power supply 110 is more reasonable, the electrolytic copper foil 200 prepared by the electrolytic copper foil preparation equipment 100 has excellent performance, and the pulse power supply 110 is also easy to prepare, which is conducive to the mass production of high-performance electrolytic copper foil 200.

[0126] Table 1 below shows some experimental process parameters for preparing electrolytic copper foil 200 and mechanical property parameters of electrolytic copper foil 200. The mechanical properties of electrolytic copper foil 200 were tested by a universal testing tensile machine, using a 50mm gauge length and a tensile speed of 50mm / min. Other aspects of the test operation can refer to the contents recorded in the national standard GB / T228.1-2010, which will not be repeated here. The waveform of the pulse current used in Examples 1 to 10 is a rectangular wave, and Comparative Example 1 uses a DC power supply. Among them, in Examples 1 to 10 and Comparative Example 1, multiple pieces of electrolytic copper foil 200 can be taken as samples, and after multiple tests and taking the average value, the tensile strength and elongation in the table are obtained. Combined with Figure 2, Figure 2 is a tensile curve of multiple tests of Example 1.

[0127] The duty cycle in the table refers to the duty cycle of the pulse power supply 110. The duty cycle of the pulse power supply 110 is the ratio of the time the pulse signal is active (or at a high level) to the total time within a pulse cycle. It is usually expressed as a percentage, ranging from 0% to 100%. The duty cycle of the pulse power supply 110 can be directly measured using an oscilloscope or logic analyzer; alternatively, it can be obtained directly from the label or specification sheet of the pulse power supply 110.

[0128] The plating solution temperature may refer to the temperature of the electroplating solution 123 in a working state; the plating solution temperature may be directly measured using a thermometer or other device.

[0129] The copper ion concentration may refer to the concentration of copper ions in the electroplating solution 123. The concentration of copper ions in the electroplating solution 123 may be measured by potentiometric titration.

[0130] The pulse width can be the pulse width of the pulse power supply 110. The pulse width of the pulse power supply 110 refers to the duration of the high level in one pulse cycle. The pulse width can be measured using an oscilloscope, a frequency meter, a counter, or other equipment.

[0131] The pole pitch may refer to the distance between the anode member 122 and the cathode member 121 ; for example, the distance between the opposing surfaces of the cathode member 121 and the anode member 122 .

[0132] Table 1

[0133] As shown in Table 1, when the peak current is in the range of 70kA to 95kA, the tensile strength of the electrolytic copper foil 200 is in the range of 786MPa to 820MPa, and the elongation is in the range of 6.84% to 6.93%; when the peak current is in the range of 100kA to 150kA, the tensile strength of the electrolytic copper foil 200 is in the range of 826MPa to 892MPa, and the elongation is in the range of 6.94% to 7.13%; when the peak current is in the range of 155kA to 200kA, the tensile strength of the electrolytic copper foil 200 is in the range of 826MPa to 892MPa, and the elongation is in the range of 6.94% to 7.13%. kA, the tensile strength of the electrolytic copper foil 200 obtained is in the range of 904 MPa to 923 MPa, and the elongation is in the range of 6.7% to 6.9%; while the tensile strength of the electrolytic copper foil 200 obtained using a DC power supply is 410 MPa, and the elongation is 5.36%. Compared with the electrolytic copper foil 200 obtained by using the pulse power supply 110 of the embodiment of the present application, the electrolytic copper foil 200 obtained by the pulse power supply 110 of the embodiment of the present application has higher tensile strength and better elongation.

[0134] In some embodiments, the duty cycle of the pulse power supply 110 ranges from 1% to 50%.

[0135] It is understood that during the production of the electrolytic copper foil 200, the duty cycle of the pulse power supply 110 can be 1%, 50%, or any value between 1% and 50%. As an example, the duty cycle of the pulse power supply 110 can be, but is not limited to, 1%, 5%, 10%, 15%, 20%, 25%, 30%, 35%, 40%, 45%, or 50%. In one embodiment, the duty cycle of the pulse power supply 110 can be adjustable within a range of 1% to 50%, or a portion of the range of 1% to 50%. In another embodiment, the duty cycle of the pulse power supply 110 can be non-adjustable, and by replacing the pulse power supply 110 with a different duty cycle, the preparation requirements of different duty cycles can be met.

[0136] If the duty cycle is too low, the thickness of the electrolytic copper foil 200 will be uneven, affecting the quality of the electrolytic copper foil 200 and reducing the production capacity of the electrolytic copper foil 200. If the duty cycle is too high, the performance will be close to that of DC plating, and the performance of the prepared electrolytic copper foil 200 will be poor. In addition, the duty cycle needs to be adjusted together with the peak current to achieve an equilibrium state.

[0137] By adopting the technical solution of the embodiment of the present application, the duty cycle range is reasonable, and combined with the above-mentioned peak current, the production capacity and performance of the electrolytic copper foil 200 can be better balanced.

[0138] In some embodiments, the duty cycle of the pulse power supply 110 ranges from 5% to 20%.

[0139] It is understandable that, during the process of manufacturing the electrolytic copper foil 200, the duty cycle of the pulse power supply 110 may be 5%, 20%, or any value between 5% and 20%. As an example, the duty cycle of the pulse power supply 110 may be, but is not limited to, 1%, 2%, 4%, 6%, 8%, 10%, 12%, 14%, 16%, 18%, or 20%.

[0140] By adopting the technical solution of the embodiment of the present application, the duty cycle of the pulse power supply 110 is set more reasonably, and combined with the above-mentioned peak current, the production capacity and performance of the electrolytic copper foil 200 can be better balanced.

[0141] Table 2 shows the process parameters for preparing the electrolytic copper foil 200 in some experiments and the mechanical properties parameters of the electrolytic copper foil 200. The mechanical properties of the electrolytic copper foil 200 were tested by a universal tensile testing machine, using a 50mm gauge length and a tensile speed of 50mm / min. Other aspects of the test operation can refer to the contents recorded in the national standard GB / T228.1-2010, which will not be repeated here. The waveform of the pulse current used in Examples 11 to 20 is a rectangular wave, and the DC power supply is used in Comparative Example 1. Among them, in Examples 11 to 20 and Comparative Example 1, multiple pieces of electrolytic copper foil 200 can be taken as samples, and the tensile strength and elongation in the table can be obtained after multiple tests and taking the average value.

[0142] Table 2

[0143] As shown in Table 2, when the duty ratio is in the range of 1% to 4.3%, the tensile strength of the electrolytic copper foil 200 is in the range of 684MPa to 790MPa, and the elongation is in the range of 5.69% to 6.15%; when the duty ratio is in the range of 5% to 20%, the tensile strength of the electrolytic copper foil 200 is in the range of 739MPa to 849MPa, and the elongation is in the range of 6.61% to 7.1%; when the duty ratio is in the range of 21% to 50%, the tensile strength of the electrolytic copper foil 200 is in the range of 10.1% to 20.0%. The tensile strength of the prepared electrolytic copper foil 200 is in the range of 619 MPa to 640 MPa, and the elongation is in the range of 6.15% to 6.6%; while the tensile strength of the electrolytic copper foil 200 prepared using a DC power supply is 410 MPa, and the elongation is 5.36%. Compared with the electrolytic copper foil 200 prepared using the pulse power supply 110 of the embodiment of the present application, the electrolytic copper foil 200 prepared using the pulse power supply 110 of the embodiment of the present application has higher tensile strength and better elongation.

[0144] In some embodiments, the pulse width of the pulse power supply 110 ranges from 1 ms to 50 ms.

[0145] It is understandable that, during the process of manufacturing the electrolytic copper foil 200, the pulse width of the pulse power supply 110 may be 1 ms, 50 ms, or any value between 1 ms and 50 ms; as an example, the pulse width of the pulse power supply 110 may be, but is not limited to, 1 ms, 5 ms, 10 ms, 15 ms, 20 ms, 25 ms, 30 ms, 35 ms, 40 ms, 45 ms, or 50 ms.

[0146] During the preparation of the electrolytic copper foil 200, if the pulse width is set too large, the current density during the electrolysis process will increase, resulting in pits and holes on the copper foil surface, affecting the quality of the electrolytic copper foil 200. If the pulse width is set too small, the current density during the electrolysis process will decrease, affecting the growth rate and thickness uniformity of the electrolytic copper foil 200.

[0147] By adopting the technical solution of this embodiment, the pulse width of the pulse power supply 110 is reasonably set, which can take into account both the quality and production efficiency of the electrolytic copper foil 200.

[0148] In some embodiments, the pulse width of the pulse power supply 110 ranges from 10 ms to 30 ms.

[0149] It is understandable that, during the process of manufacturing the electrolytic copper foil 200, the pulse width of the pulse power supply 110 may be 10ms, 30ms, or any value between 10ms and 30ms; as an example, the pulse width of the pulse power supply 110 may be, but is not limited to, 10ms, 12ms, 14ms, 16ms, 18ms, 20ms, 22ms, 24ms, 26ms, 28ms, or 30ms.

[0150] By adopting the technical solution of this embodiment, the pulse width of the pulse power supply 110 is set more reasonably, which can better balance the quality and production efficiency of the electrolytic copper foil 200.

[0151] Table 3 below shows the process parameters for preparing the electrolytic copper foil 200 in some experiments and the mechanical properties parameters of the electrolytic copper foil 200. The mechanical properties of the electrolytic copper foil 200 were tested by a universal tensile testing machine, using a 50mm gauge length and a tensile speed of 50mm / min. Other aspects of the test operation can refer to the contents recorded in the national standard GB / T228.1-2010, which will not be repeated here. The waveform of the pulse current used in Examples 21 to 30 is a rectangular wave, and the DC power supply is used in Comparative Example 1. Among them, in Examples 21 to 30 and Comparative Example 1, multiple pieces of electrolytic copper foil 200 can be taken as samples, and the tensile strength and elongation in the table can be obtained after multiple tests and taking the average value.

[0152] As shown in Table 3, when the pulse width is in the range of 1ms to 9ms, the tensile strength of the electrolytic copper foil 200 obtained is in the range of 826MPa to 861MPa, and the elongation is in the range of 6.94% to 7.37%; when the pulse width is in the range of 10ms to 30ms, the tensile strength of the electrolytic copper foil 200 obtained is in the range of 657MPa to 768MPa, and the elongation is in the range of 6.73% to 6.83%; when the pulse width is in the range of 31ms to 50ms, The tensile strength of the prepared electrolytic copper foil 200 is in the range of 653 MPa to 669 MPa, and the elongation is in the range of 5.68% to 6.63%; while the tensile strength of the electrolytic copper foil 200 prepared using a DC power supply is 410 MPa, and the elongation is 5.36%. Compared with the electrolytic copper foil 200 prepared using the pulse power supply 110 of the embodiment of the present application, the electrolytic copper foil 200 prepared using the pulse power supply 110 of the embodiment of the present application has higher tensile strength and better elongation.

[0153] Table 3

[0154] In some embodiments, the average current of the pulse power supply 110 ranges from 1 kA to 50 kA.

[0155] The average current refers to the average current of the pulse power supply 110. The average current of the pulse power supply 110 refers to the average value of the current within a pulse cycle. For example, the waveform of the pulse current emitted by the pulse power supply 110 is rectangular. The average current of the pulse power supply 110 is equal to the peak current multiplied by the duty cycle.

[0156] It is understandable that, during the process of manufacturing the electrolytic copper foil 200, the average current of the pulse power supply 110 may be 1 kA, 50 kA, or any value between 1 kA and 50 kA; as an example, the duty cycle of the pulse power supply 110 may be, but is not limited to, 1 kA, 5 kA, 10 kA, 15 kA, 20 kA, 25 kA, 30 kA, 35 kA, 40 kA, 45 kA, or 50 kA.

[0157] During the preparation of the electrolytic copper foil 200, if the average current of the pulse power supply 110 is set too high, the copper ion deposition rate during the electrolysis process will be too fast, resulting in uneven thickness of the electrolytic copper foil 200 and affecting the quality and performance of the electrolytic copper foil 200. If the average current of the pulse power supply 110 is set too low, the copper ion deposition rate during the electrolysis process will be too slow, thereby reducing the production efficiency of the electrolytic copper foil 200 and increasing production costs.

[0158] By adopting the technical solution of this embodiment, the average current of the pulse power supply 110 is reasonably set, which can take into account both the quality and production efficiency of the electrolytic copper foil 200.

[0159] In some embodiments, the average current of the pulse power supply 110 ranges from 3 kA to 20 kA.

[0160] It is understandable that, during the process of manufacturing the electrolytic copper foil 200, the average current of the pulse power supply 110 may be 3kA, 20kA, or any value between 3kA and 20kA; as an example, the average current of the pulse power supply 110 may be, but is not limited to, 3kA, 5kA, 7kA, 9kA, 11kA, 13kA, 15kA, 17kA, 19kA, or 20kA.

[0161] By adopting the technical solution of this embodiment, the average current setting of the pulse power supply 110 is more reasonable, which can better balance the quality and production efficiency of the electrolytic copper foil 200.

[0162] In some embodiments, the peak current density of the anode member 122 is in the range of 181 A / dm 2 ~454A / dm 2 .

[0163] The peak current density of the anode member 122 may refer to the peak current per unit area of ​​the anode member 122. For example, if the anode member 122 is a semicircular plate, the peak current flowing per unit area of ​​the outer surface of the semicircular plate, i.e., the peak current density of the semicircular plate, is equal to the peak current divided by the area of ​​the outer surface of the semicircular plate. In actual calculations, since the thickness of the semicircular plate is relatively small, the difference between the inner and outer surfaces of the semicircular plate is not significant. Therefore, the peak current density of the semicircular plate may also be equal to the peak current divided by the area of ​​the inner surface of the semicircular plate.

[0164] During the process of manufacturing the electrolytic copper foil 200, the peak current density can be 181A / dm 2 、454A / dm 2 Or at 181A / dm 2 and 454A / dm 2 As an example, the peak current density can be but not limited to 181A / dm 2 、200A / dm 2 , 250A / dm 2 、300A / dm 2 、350A / dm 2 、400A / dm 2 、450A / dm 2 、454A / dm 2 .

[0165] Generally speaking, if the peak current density is too large, it may cause problems such as rough surface, increased holes, and uneven thickness of the electrolytic copper foil 200, thereby reducing the quality and performance of the copper foil; if the peak current density is too small, it may cause problems such as slow growth rate of the electrolytic copper foil 200, low production efficiency, and increased cost.

[0166] By adopting the technical solution of this embodiment, the peak current density of the anode member 122 is reasonably set, and both the quality and production efficiency of the electrolytic copper foil 200 can be taken into consideration.

[0167] In some embodiments, the peak current density of the anode member 122 is in the range of 200 A / dm 2 ~240A / dm 2 .

[0168] During the process of manufacturing the electrolytic copper foil 200, the peak current density can be 200A / dm 2 、240A / dm 2 Or at 200A / dm 2 and 240A / dm 2 As an example, the peak current density can be but not limited to 200A / dm 2 、205A / dm 2 、210A / dm 2 、215A / dm 2 、220A / dm 2 、225A / dm 2 、230A / dm 2 、235A / dm 2 、240A / dm 2 .

[0169] By adopting the technical solution of this embodiment, the peak current density of the anode member 122 is reasonably set, and both the quality and production efficiency of the electrolytic copper foil 200 can be taken into consideration.

[0170] In some embodiments, the average current density of the anode member 122 is in the range of 2 A / dm 2 ~113A / dm 2 .

[0171] The average current density of the anode member 122 may refer to the average current per unit area of ​​the anode member 122. For example, if the anode member 122 is a semicircular plate, the average current flowing per unit area of ​​the outer surface of the semicircular plate, i.e., the average current density of the semicircular plate, is equal to the average current divided by the area of ​​the outer surface of the semicircular plate. In actual calculations, since the thickness of the semicircular plate is relatively small, the difference between the inner and outer surfaces of the semicircular plate is not significant. Therefore, the average current density of the semicircular plate may also be equal to the average current divided by the area of ​​the inner surface of the semicircular plate.

[0172] During the process of manufacturing the electrolytic copper foil 200, the average current density can be 2A / dm 2 、113A / dm 2 Or at 2A / dm 2 and 113A / dm 2 As an example, the average current density can be but not limited to 2A / dm 2 、10A / dm 2 , 20A / dm 2 、30A / dm 2 、40A / dm 2 、50A / dm 2 、60A / dm 2 , 70A / dm 2 、80A / dm 2 、90A / dm 2 、100A / dm 2 、110A / dm 2 、113A / dm 2 .

[0173] Generally speaking, if the average current density is too large, it may cause problems such as rough surface, increased holes, and uneven thickness of the electrolytic copper foil 200, thereby reducing the quality and performance of the copper foil; if the average current density is too small, it may cause problems such as slow growth rate of the electrolytic copper foil 200, low production efficiency, and increased cost.

[0174] By adopting the technical solution of this embodiment, the average current density of the anode member 122 is reasonably set, and both the quality and production efficiency of the electrolytic copper foil 200 can be taken into consideration.

[0175] In some embodiments, the average current density of the anode member 122 is in the range of 30 A / dm 2 ~80A / dm 2 .

[0176] During the process of manufacturing the electrolytic copper foil 200, the average current density can be 30A / dm 2 、80A / dm 2 Or at 30A / dm 2 and 80A / dm 2 As an example, the average current density can be but not limited to 30A / dm 2 、35A / dm 2 、40A / dm 2 、45A / dm 2 、50A / dm 2 、55A / dm 2 、60A / dm 2 、65A / dm 2 , 70A / dm 2 , 75A / dm 2 、80A / dm 2 .

[0177] By adopting the technical solution of this embodiment, the average current density of the anode member 122 is reasonably set, and both the quality and production efficiency of the electrolytic copper foil 200 can be taken into consideration.

[0178] In one embodiment, the output waveform of the pulse power supply 110 is a rectangular wave.

[0179] A rectangular wave may refer to a periodic waveform whose current value remains constant over a certain period of time and is rectangular in shape along the horizontal axis. For example, within a cycle, the pulse power supply 110 outputs a constant current for a portion of the time and does not output current for another portion of the time.

[0180] By adopting the technical solution of this embodiment, the rectangular wave can provide a higher current density, making the electrolysis process faster and thus improving electrolysis efficiency. Compared with a continuous DC power supply, the rectangular wave can reduce the polarization of the anode member 122, thereby reducing energy consumption. In addition, the rectangular wave can control the growth rate of the electrolytic copper foil 200, avoiding surface roughness and internal defects of the electrolytic copper foil 200 caused by excessive growth. By adjusting the width, interval, and amplitude of the rectangular wave, the thickness of the electrolytic copper foil 200 can be precisely controlled, improving the quality of the electrolytic copper foil 200.

[0181] In some embodiments, the pulse power supply 110 includes a plurality of battery cells 111 , and the plurality of battery cells 111 are connected in parallel.

[0182] The battery unit 111 may refer to a component including multiple battery modules, and the battery module may include multiple battery cells 20. The battery units 111 may be modular components connected in series, parallel or mixed. As an example, the battery unit 111 includes a cabinet, and multiple battery modules are loaded in the cabinet to form a whole to facilitate the assembly and use of the pulse power supply 110.

[0183] The multiple battery cells 111 can be connected in parallel via conductive components such as wires and copper busbars.

[0184] By adopting the electrolytic copper foil preparation equipment 100 of this embodiment, the pulse power supply 110 includes multiple battery cells 111, and the battery cells 111 are connected in parallel. The current of the pulse power supply 110 is equal to the sum of the currents of all the battery cells 111, so that the pulse power supply 110 can output a larger current, thereby realizing the preparation of high-performance electrolytic copper foil 200.

[0185] In some embodiments, each battery unit 111 includes multiple battery modules, and the multiple battery modules are connected in parallel.

[0186] Multiple battery modules can be connected in parallel through conductive components such as wires and copper busbars.

[0187] By adopting the electrolytic copper foil preparation equipment 100 of this embodiment, the battery unit 111 includes multiple battery modules, the battery modules are connected in parallel, and the current of the battery unit 111 is equal to the sum of the currents of all the battery modules, so that the battery unit 111 can output a larger current, and the pulse power supply 110 can also output a larger current, thereby realizing the preparation of high-performance electrolytic copper foil 200.

[0188] In one embodiment, the electrolytic copper foil preparation apparatus 100 further includes a copper busbar electrically connected between the positive electrode of the pulse power supply 110 and the cathode member 121 .

[0189] Copper busbars are a type of conductive material used for power transmission, typically made of copper. The shape and size of copper busbars can be customized to meet specific needs. Common shapes include rectangular, circular, and special shapes.

[0190] By adopting the technical solution of this embodiment, the positive electrode of the pulse power supply 110 and the cathode member 121 are connected by a copper busbar, which has a simple connection method and is easy to process and manufacture.

[0191] In one embodiment, the copper busbar includes a silver-plated copper busbar 131 , which is electrically connected between the positive electrode of the pulse power supply 110 and the cathode 121 .

[0192] Silver-plated copper busbar 131 is an electronic material made by coating a copper busbar with a layer of silver. Copper busbars themselves have good electrical conductivity, and silver is even more conductive. Therefore, silver-plated copper busbar 131 has higher electrical conductivity and good oxidation resistance, which can improve electrical performance and stability.

[0193] By adopting the technical solution of this embodiment and using the silver-plated copper busbar 131 , the skin effect of current can be reduced, the heating of the copper busbar can be reduced, and the quality of the electrolytic copper busbar can be improved.

[0194] In one embodiment, multiple battery cells 111 are connected in parallel through copper wires, the positive electrodes of the multiple battery cells 111 are electrically connected to the cathode member 121 through a silver-plated copper busbar 131, and the negative electrodes of the multiple battery cells 111 are electrically connected to the anode member 122 through an electrical connector 132, which may be a copper busbar, a wire, or the like. As an example, the pulse power supply 110 includes 48 battery modules, the output current peak value of the pulse power supply 110 is 120kA, the voltage is 0V to 6V, the duty cycle is adjustable in the range of 1% to 50%, and the average current is 1kA to 50kA. The 48 battery modules are respectively installed in 6 cabinets, with 8 battery modules arranged in each cabinet. Each battery module is designed to have an output current of 2500A and an output voltage of 6V. The 8 battery modules are assembled in parallel into an integrated cabinet to form a battery cell 111. The output current of each battery cell 111 is 20kA and the voltage is 6V. The eight battery modules are connected in parallel via multiple strands of copper wires, and the positive electrodes of the six battery cells 111 are integratedly connected to the conductive sliders of the cathode components 121 via silver-plated copper busbars 131 .

[0195] In one embodiment, the electrolytic copper foil preparation equipment 100 further includes an electroplating solution component mixing device 140 , which is used to adjust the concentration of at least some components in the electroplating solution 123 .

[0196] The plating solution component preparation device 140 may be a component capable of adjusting the concentration of at least some components in the plating solution 123. Specifically, the plating solution component preparation device 140 may adjust the concentration of some components in the plating solution 123, or may adjust the concentration of all components in the plating solution 123. For example, the plating solution component preparation device 140 may adjust the concentrations of deionized water, a high-concentration copper sulfate solution, a polyethylene glycol solution, a hydrochloric acid solution, a gelatin solution, and a sulfur-containing organic solution in the plating solution 123.

[0197] By adopting the technical solution of this embodiment, the electroplating solution component preparation device 140 can at least adjust the concentration of some components in the electroplating solution 123 to a suitable concentration range, thereby improving the performance and quality of the prepared electrolytic copper foil 200.

[0198] In one embodiment, the electroplating solution component preparation device 140 is used to adjust the concentration of at least some components in the electroplating solution 123 according to the detection result of the prepared electrolytic copper foil 200 .

[0199] It is understandable that the prepared electrolytic copper foil 200 is first tested, and then the concentration of the components in the electroplating solution 123 is adjusted by the electroplating solution component mixing device 140 according to the test results of the electrolytic copper foil 200, thereby improving the quality of the electrolytic copper foil 200.

[0200] By adopting the technical solution of this embodiment, the concentration of the components in the electroplating solution 123 is adjusted according to the detection results of the prepared electrolytic copper foil 200, and the detection and adjustment form a closed loop, reducing errors, so that the prepared electrolytic copper foil 200 has better quality and performance.

[0201] In one embodiment, the electroplating solution component preparation device 140 includes a first container 1401 and a first connecting pipe 1402 . The first container 1401 is used to load the leveling agent. The first connecting pipe 1402 connects the first container 1401 and the plating solution tank 1221 .

[0202] First container 1401 can be a container for holding a leveling agent; the primary function of the leveling agent is to improve the uniformity and smoothness of electrolytic copper foil 200. The leveling agent can fill the concave portions of the surface of the electrolytic copper busbar, making the electrolytic copper foil 200 more flat and smooth. Leveling agents can include, but are not limited to, hydroxide solutions (e.g., sodium hydroxide, potassium hydroxide, etc.), organic additives (e.g., polyethylene glycol, polyacrylic acid, etc.), metal salt solutions (e.g., nickel sulfate, cobalt sulfate, etc.), acid solutions (e.g., sulfuric acid, nitric acid, etc.), and gelatin solutions.

[0203] The first connecting pipe 1402 may refer to a pipe connecting the first container 1401 and the plating solution tank 1221 .

[0204] By adopting the technical solution of this embodiment, it can be concluded from the test results of the electrolytic copper foil 200 that when the leveling agent in the electroplating solution 123 needs to be added, the leveling agent in the first container 1401 can flow into the plating solution tank 1221 through the first pipe to increase the concentration of the leveling agent in the electroplating solution 123, thereby improving the quality and performance of the electrolytic copper foil 200. In addition, the structure is simple and easy to process and manufacture.

[0205] In one embodiment, the number of first containers 1401 can be one or more, and the first connecting tubes 1402 are connected to the first containers 1401 one by one. Multiple first containers 1401 can be loaded with the same leveling agent or different leveling agents. The specific setting is based on actual conditions and is not limited here.

[0206] In one embodiment, the first connecting pipe 1402 is provided with a first flow detection member for detecting the flow of the first connecting pipe 1402 .

[0207] The first flow detection component may refer to a component used to detect the flow of the first connecting pipe 1402. The first flow detection component may be, but is not limited to, a vortex flowmeter, a turbine flowmeter, an electromagnetic flowmeter, an ultrasonic flowmeter, or a mass flowmeter.

[0208] By adopting the technical solution of this embodiment, the amount of the leveling agent added can be accurately controlled through the first flow detection component, which is beneficial to improving the quality and performance of the electrolytic copper foil 200.

[0209] In one embodiment, the electroplating solution component preparation device 140 includes a second container 1403 and a second connecting pipe 1404 . The second container 1403 is used to load the wetting agent. The second connecting pipe 1404 connects the second container 1403 and the plating solution tank 1221 .

[0210] The second container 1403 can be a container capable of holding a wetting agent; the main function of the wetting agent is to improve the uniformity and smoothness of the electrolytic copper foil 200. The main function of the wetting agent is to improve the wettability of the electroplating solution 123 on the surface of the electrolytic copper busbar, thereby promoting the transfer of current and improving the electroplating efficiency. The wetting agent can reduce the surface tension between the liquid and the solid surface, making it easier for the electroplating solution 123 to form a uniform electroplating layer on the surface of the electrolytic copper busbar. The wetting agent can be, but is not limited to, organic sulfides (e.g., mercaptans, thioethers, etc.), organic acids (e.g., acetic acid, citric acid, etc.), surfactants (e.g., anionic, cationic, and nonionic surfactants), and polymers (e.g., polyethylene glycol, polyacrylic acid, hydroxyethyl cellulose, etc.).

[0211] The second connecting pipe 1404 may refer to a pipe connecting the second container 1403 and the plating solution tank 1221 .

[0212] By adopting the technical solution of this embodiment, it can be concluded from the test results of the electrolytic copper foil 200 that when the wetting agent in the electroplating solution 123 needs to be added, the wetting agent in the second container 1403 can flow into the plating solution tank 1221 through the second pipe to increase the concentration of the wetting agent in the electroplating solution 123, thereby improving the quality and performance of the electrolytic copper foil 200; in addition, the structure is simple and easy to process and manufacture.

[0213] In one embodiment, the number of second containers 1403 can be one or more, and the second connecting tubes 1404 are connected to the second containers 1403 one-to-one. Multiple second containers 1403 can be loaded with the same wetting agent or different wetting agents. The specific setting is based on actual conditions and is not limited here.

[0214] In one embodiment, the second connecting pipe 1404 is provided with a second flow detection member for detecting the flow of the second connecting pipe 1404 .

[0215] The second flow detection component may refer to a component used to detect the flow of the second connecting pipe 1404. The second flow detection component may be, but is not limited to, a vortex flowmeter, a turbine flowmeter, an electromagnetic flowmeter, an ultrasonic flowmeter, or a mass flowmeter.

[0216] By adopting the technical solution of this embodiment, the amount of wetting agent added can be accurately controlled through the second flow detection component, which is beneficial to improving the quality and performance of the electrolytic copper foil 200.

[0217] In one embodiment, the electroplating solution component preparation device 140 includes a third container 1405 and a third connecting pipe 1406 . The third container 1405 is used to load a solution containing chloride ions. The third connecting pipe 1406 connects the third container 1405 and the plating solution tank 1221 .

[0218] The third container 1405 can be a container capable of holding a solution containing chloride ions. The primary function of the solution containing chloride ions is to improve the uniformity and smoothness of the electrolytic copper foil 200. The chloride ions in the solution containing chloride ions are a good electrolyte, improving the conductivity of the electroplating solution 123 and thereby increasing the efficiency of current transmission. The chloride ions also promote the reduction reaction of copper ions, making them more easily reduced to copper metal and deposited on the cathode 121. The chloride ions also help maintain the balance between metal ions and acid ions in the electroplating solution 123, thereby maintaining the stability of the electroplating solution 123 and extending the service life of the electroplating solution 123. The solution containing chloride ions can include, but is not limited to, sodium chloride solution, sodium chloride solution, potassium chloride solution, copper chloride solution, and hydrochloric acid solution.

[0219] The third connecting pipe 1406 may refer to a pipe connecting the third container 1405 and the plating solution tank 1221 .

[0220] By adopting the technical solution of this embodiment, it can be concluded from the test results of the electrolytic copper foil 200 that when the solution containing chloride ions in the electroplating solution 123 needs to be added, the solution containing chloride ions in the third container 1405 can flow into the plating solution tank 1221 through the third pipe to increase the concentration of the solution containing chloride ions in the electroplating solution 123, thereby improving the quality and performance of the electrolytic copper foil 200. In addition, the structure is simple and easy to process and manufacture.

[0221] In one embodiment, the number of third containers 1405 can be one or more, and each third container 1405 is connected to each third connecting pipe 1406 in a one-to-one correspondence. The multiple third containers 1405 can be loaded with the same solution containing chloride ions, or they can be loaded with different solutions containing chloride ions. The specific setting depends on actual conditions and is not limited here.

[0222] In one embodiment, the third connecting pipe 1406 is provided with a third flow detection member for detecting the flow of the third connecting pipe 1406 .

[0223] The third flow detection component may refer to a component used to detect the flow of the third connecting pipe 1406. The third flow detection component may be, but is not limited to, a vortex flowmeter, a turbine flowmeter, an electromagnetic flowmeter, an ultrasonic flowmeter, or a mass flowmeter.

[0224] By adopting the technical solution of this embodiment, the addition amount of the solution containing chloride ions can be accurately controlled through the third flow detection component, which is beneficial to improving the quality and performance of the electrolytic copper foil 200.

[0225] In one embodiment, the electroplating solution component preparation device 140 includes a fourth container 1407 and a fourth connecting pipe 1408 . The fourth container 1407 is used to load brightener, and the fourth connecting pipe 1408 connects the fourth container 1407 and the plating solution tank 1221 .

[0226] Fourth container 1407 may be a container for brightener. The main function of brightener is to improve the uniformity and smoothness of electrolytic copper foil 200. Brightener increases the reducing power of metal ions in electroplating solution 123, making the coating brighter and denser. Brighteners may include, but are not limited to, aluminates (such as aluminum sulfate and aluminum nitrate), zinc sulfate, stannous chloride, sodium carbonate, aminosulfonic acid, and sodium polydisulfanesulfonate. Brighteners can increase the hardness and wear resistance of the coating and improve its appearance.

[0227] The fourth connecting pipe 1408 may refer to a pipe connecting the fourth container 1407 and the plating solution tank 1221 .

[0228] By adopting the technical solution of this embodiment, it can be concluded from the test results of the electrolytic copper foil 200 that when brightener in the electroplating solution 123 needs to be added, the brightener in the fourth container 1407 can flow into the plating solution tank 1221 through the fourth pipe to increase the concentration of the brightener in the electroplating solution 123, thereby improving the quality and performance of the electrolytic copper foil 200. In addition, the structure is simple and easy to process and manufacture.

[0229] In one embodiment, the number of fourth containers 1407 can be one or more, and each of the fourth containers 1407 is connected to the fourth connecting tube 1408 in a one-to-one correspondence. The multiple fourth containers 1407 can be loaded with the same brightener or different brighteners, and the specific setting depends on actual conditions and is not limited here.

[0230] In one embodiment, the fourth connecting pipe 1408 is provided with a fourth flow detection member for detecting the flow of the fourth connecting pipe 1408 .

[0231] The fourth flow detection component may refer to a component used to detect the flow of the fourth connecting pipe 1408. The fourth flow detection component may be, but is not limited to, a vortex flowmeter, a turbine flowmeter, an electromagnetic flowmeter, an ultrasonic flowmeter, or a mass flowmeter.

[0232] By adopting the technical solution of this embodiment, the amount of brightener added can be accurately controlled through the fourth flow detection component, which is beneficial to improving the quality and performance of the electrolytic copper foil 200.

[0233] In one embodiment, the electroplating solution component preparation device 140 includes a fifth container 1409 and a fifth connecting pipe 1410 . The fifth container 1409 is used to load the copper sulfate solution. The fifth connecting pipe 1410 connects the fifth container 1409 and the plating solution tank 1221 .

[0234] The fifth container 1409 can be a container capable of holding a copper sulfate solution. The copper sulfate solution primarily provides copper ions and participates in the electrochemical reaction. During the electrolysis process, the copper ions in the copper sulfate solution enter the electroplating solution 123 at the anode 122 and are then reduced to pure copper (electrolytic copper) at the cathode through electrolysis.

[0235] The fifth connecting pipe 1410 may refer to a pipe connecting the fifth container 1409 and the plating solution tank 1221 .

[0236] By adopting the technical solution of this embodiment, it can be concluded from the test results of the electrolytic copper foil 200 that when the copper sulfate solution in the electroplating solution 123 needs to be added, the copper sulfate solution in the fifth container 1409 can flow into the plating solution tank 1221 through the fifth pipe to increase the concentration of the copper sulfate solution in the electroplating solution 123, thereby improving the quality and performance of the electrolytic copper foil 200. In addition, the structure is simple and easy to process and manufacture.

[0237] In one embodiment, the fifth connecting pipe 1410 is provided with a fifth flow detection member for detecting the flow of the fifth connecting pipe 1410 .

[0238] The fifth flow detection component may refer to a component for detecting the flow of the fifth connecting pipe 1410 , and the fifth flow detection component may be, but is not limited to, a vortex flowmeter, a turbine flowmeter, an electromagnetic flowmeter, an ultrasonic flowmeter, or a mass flowmeter.

[0239] By adopting the technical solution of this embodiment, the addition amount of the copper sulfate solution can be accurately controlled by the fourth flow detection component, which is beneficial to improving the quality and performance of the electrolytic copper foil 200.

[0240] In one embodiment, one end of the first connecting tube 1402 is connected to the first container 1401, one end of the second connecting tube 1404 is connected to the second container 1403, one end of the third connecting tube 1406 is connected to the third container 1405, one end of the fourth connecting tube 1408 is connected to the fourth container 1407, and one end of the fifth connecting tube 1410 is connected to the fifth container 1409. The other end of the first connecting tube 1402, the other end of the second connecting tube 1404, the other end of the third connecting tube 1406, the other end of the fourth connecting tube 1408 and the other end of the fifth connecting tube 1410 are assembled to form a group of connecting tubes and then connected to the liquid inlet of the plating tank 1221. The pipeline layout is simple and the production is simple.

[0241] In one embodiment, the plating solution component preparation device 140 further includes a control device that automatically adds the required electrolyte components based on the detection results of the electrolytic copper foil 200, achieving precise control. The specific control principle and control circuit diagram are mature technologies and will not be detailed here.

[0242] The electrolytic copper foil preparation device 100 is described below with reference to some embodiments.

[0243] In this embodiment, the electrolytic copper foil preparation equipment 100 includes a pulse power supply 110 and a foil production device 120, the pulse power supply 110 has a positive electrode and a negative electrode; the foil production device 120 includes a cathode component 121 and an anode component 122, the anode component 122 is constructed with a plating tank 1221 for carrying an electroplating solution 123, and at least a portion of the cathode component 121 is located in the plating tank 1221; the positive electrode is electrically connected to the cathode component 121, and the negative electrode is electrically connected to the anode component 122; wherein, the peak current range of the pulse power supply 110 is 70kA to 200kA, and the output waveform of the pulse power supply 110 is a rectangular wave.

[0244] In this embodiment, the cathode component 121 is cylindrical, that is, the cathode component 121 is a cathode roller, and the anode plate is a semicircular plate. The semicircular plates are arranged to form a semicircular groove as a plating tank 1221. The bottom of the plating tank 1221 is provided with a liquid inlet for supplying the electroplating liquid 123 to flow in. The cathode roller and the semicircular plate are coaxially arranged, and the cathode roller can rotate relative to the semicircular plate to drive the plating liquid 123 to flow, so as to promote the formation of electrolytic copper foil 200.

[0245] In this embodiment, the pulse power supply 110 includes a plurality of battery cells 111, each battery cell 111 includes a cabinet and a plurality of battery modules arranged in the cabinet, the plurality of battery modules are connected in parallel, the plurality of battery cells 111 are connected in parallel, and the positive electrodes of the plurality of battery cells 111 are integratedly connected to the conductive slider of the cathode member 121 through a silver-plated copper bus 131.

[0246] In this embodiment, the electrolytic copper foil preparation equipment 100 further includes an electroplating solution component mixing device 140 for adjusting the concentration of at least some components in the electroplating solution 123 according to the detection results of the prepared electrolytic copper foil 200 .

[0247] In this embodiment, the electroplating solution component preparation device 140 includes a first container 1401 and a first connecting pipe 1402 . The first container 1401 is used to load the leveling agent. The first connecting pipe 1402 connects the first container 1401 and the plating solution tank 1221 .

[0248] In this embodiment, the first connecting pipe 1402 is provided with a first flow detection member for detecting the flow of the first connecting pipe 1402 .

[0249] In this embodiment, the electroplating solution component preparation device 140 includes a second container 1403 and a second connecting pipe 1404 . The second container 1403 is used to load the wetting agent. The second connecting pipe 1404 connects the second container 1403 and the plating solution tank 1221 .

[0250] In this embodiment, the second connecting pipe 1404 is provided with a second flow detection member for detecting the flow of the second connecting pipe 1404 .

[0251] In this embodiment, the electroplating solution component preparation device 140 includes a third container 1405 and a third connecting pipe 1406 . The third container 1405 is used to load a solution containing chloride ions. The third connecting pipe 1406 connects the third container 1405 and the plating solution tank 1221 .

[0252] In this embodiment, the third connecting pipe 1406 is provided with a third flow detection member for detecting the flow of the third connecting pipe 1406 .

[0253] In this embodiment, the electroplating solution component preparation device 140 includes a fourth container 1407 and a fourth connecting pipe 1408 . The fourth container 1407 is used to load brightener, and the fourth connecting pipe 1408 connects the fourth container 1407 and the plating solution tank 1221 .

[0254] In this embodiment, the fourth connecting pipe 1408 is provided with a fourth flow detection member for detecting the flow of the fourth connecting pipe 1408 .

[0255] In this embodiment, the electroplating solution component preparation device 140 includes a fifth container 1409 and a fifth connecting pipe 1410 . The fifth container 1409 is used to load the copper sulfate solution. The fifth connecting pipe 1410 connects the fifth container 1409 and the plating solution tank 1221 .

[0256] In this embodiment, the fifth connecting pipe 1410 is provided with a fifth flow detection member for detecting the flow of the fifth connecting pipe 1410 .

[0257] In this embodiment, one end of the first connecting tube 1402 is connected to the first container 1401, one end of the second connecting tube 1404 is connected to the second container 1403, one end of the third connecting tube 1406 is connected to the third container 1405, one end of the fourth connecting tube 1408 is connected to the fourth container 1407, and one end of the fifth connecting tube 1410 is connected to the fifth container 1409. The other end of the first connecting tube 1402, the other end of the second connecting tube 1404, the other end of the third connecting tube 1406, the other end of the fourth connecting tube 1408 and the other end of the fifth connecting tube 1410 are assembled to form a group of connecting tubes and then connected to the liquid inlet of the plating tank 1221. The pipeline layout is simple and the production is simple.

[0258] In another embodiment of the present application, an electrolytic copper foil 200 is provided. The electrolytic copper foil 200 is produced by using the electrolytic copper foil production device 100 as described in the above embodiment.

[0259] The electrolytic copper foil 200 of the embodiment of the present application is produced by using the electrolytic copper foil production equipment 100 described above. The electrolytic copper foil 200 has high tensile strength and elongation.

[0260] The electrical devices of the embodiments of the present application may be, but are not limited to, mobile phones, tablets, laptop computers, electric toys, electric tools, battery-powered vehicles, electric cars, ships, spacecraft, etc. The electric toys may include fixed or mobile electric toys, such as game consoles, electric car toys, electric ship toys, and electric airplane toys, etc. The spacecraft may include airplanes, rockets, space shuttles, and spacecraft, etc.

[0261] For the convenience of description, the following embodiments are described by taking a vehicle 1000 as an example of an electrical device according to an embodiment of the present application.

[0262] Please refer to Figure 3, which is a schematic structural diagram of the vehicle 1000 provided in some embodiments of the present application. The vehicle 1000 can be a fuel vehicle, a gas vehicle or a new energy vehicle. The new energy vehicle can be a pure electric vehicle, a hybrid vehicle or an extended-range vehicle, etc. A battery 1100 is provided inside the vehicle 1000, and the battery 1100 can be provided at the bottom, head or tail of the vehicle 1000. The battery 1100 can be used to power the vehicle 1000. For example, the battery 1100 can serve as an operating power source for the vehicle 1000. The vehicle 1000 may also include a controller 1200 and a motor 1300. The controller 1200 is used to control the battery 1100 to power the motor 1300, for example, for starting, navigating and driving the vehicle 1000.

[0263] In some embodiments of the present application, the battery 1100 can serve not only as an operating power source for the vehicle 1000, but also as a driving power source for the vehicle 1000, replacing or partially replacing fuel or natural gas to provide driving power for the vehicle 1000.

[0264] Referring to Figure 4 , an embodiment of a battery 1100 includes a housing 10 and battery cells 20, with the battery cells 20 housed within the housing 10. The housing 10 provides a storage space for the battery cells 20 and can have various structures. In some embodiments, the housing 10 can include a first portion 11 and a second portion 12, which overlap each other and together define a storage space for the battery cells 20. The second portion 12 can be a hollow structure with one end open. The first portion 11 can be a plate-like structure, with the first portion 11 overlapping the open side of the second portion 12, thereby jointly defining the storage space. Alternatively, the first portion 11 and the second portion 12 can each be a hollow structure with one end open, with the open side of the first portion 11 overlapping the open side of the second portion 12. Of course, the housing 10 formed by the first portion 11 and the second portion 12 can have various shapes, such as a cylinder or a rectangular parallelepiped.

[0265] In the battery 1100 , there may be multiple battery cells 20 , and the multiple battery cells 20 may be connected in series, in parallel, or in mixed connection. Mixed connection means that the multiple battery cells 20 are connected in both series and in parallel.

[0266] In one embodiment, multiple battery cells 20 may be directly connected in series, parallel, or hybrid, and the entire battery cell 20 may then be housed within the housing 10. Alternatively, the battery 1100 may be constructed by first connecting multiple battery cells 20 in series, parallel, or hybrid to form a battery module, which is then connected in series, parallel, or hybrid to form a complete battery module, and then housed within the housing 10. The battery 1100 may also include other structures, such as a busbar assembly for electrically connecting the multiple battery cells 20.

[0267] Each battery cell 20 may be a secondary battery 1100 or a primary battery 1100; it may also be a lithium-sulfur battery 1100, a sodium-ion battery 1100, or a magnesium-ion battery 1100, but is not limited thereto. The battery cell 20 may be cylindrical, flat, rectangular, or in other shapes.

[0268] As another embodiment of the battery 1100 , the battery 1100 may not include the housing 10 , but may be assembled into an electrical device by electrically connecting a plurality of battery cells 20 and forming a whole with necessary fixing structures.

[0269] In the present application, the battery cell 20 may include a lithium-ion secondary battery, a lithium-ion primary battery, a lithium-sulfur battery, a sodium-lithium-ion battery, a sodium-ion battery, a lithium metal battery, or a magnesium-ion battery, etc., and the embodiments of the present application do not limit this. The battery cell 20 may be cylindrical, flat, rectangular, or in other shapes, and the embodiments of the present application do not limit this. The battery cell 20 is generally divided into three types based on the packaging method: cylindrical battery cells, prismatic battery cells, and soft-pack battery cells, and the embodiments of the present application do not limit this.

[0270] The battery 1100 referred to in the embodiments of this application refers to a single physical module comprising one or more battery cells 20 to provide higher voltage and capacity. For example, the battery 1100 referred to in this application may include a battery module or a battery pack. The battery 1100 generally includes a housing 10 for enclosing one or more battery cells 20. The housing 10 prevents liquids or other foreign matter from affecting the charging or discharging of the battery cells 20.

[0271] In one embodiment, as shown in conjunction with FIG. 5 and FIG. 6 , the battery cell 20 further includes an end cover 21 , a housing 22 and an electrode assembly 23 .

[0272] The end cap 21 is a component that covers the opening of the housing 22 to isolate the internal environment of the battery cell 20 from the external environment. The shape of the end cap 21 can be adapted to the shape of the housing 22 to fit the housing 22. Optionally, the end cap 21 can be made of a material with a certain degree of hardness and strength (such as an aluminum alloy). This prevents the end cap 21 from deforming when subjected to compression or collision, thereby enhancing the structural strength and safety of the battery cell 20. Functional components such as electrode terminals 211 can be provided on the end cap 21. The electrode terminals 211 can be used to electrically connect to the electrode assembly 23 to output or input electrical energy to the battery cell 20. In some embodiments, the end cap 21 can also be provided with a pressure relief mechanism 212 for relieving internal pressure when the internal pressure or temperature of the battery cell 20 reaches a threshold. The end cap 21 can also be made of a variety of materials, such as copper, iron, aluminum, stainless steel, aluminum alloy, plastic, etc., and this embodiment of the present application does not impose any specific limitations on this. In some embodiments, an insulating member may be provided inside the end cap 21 to isolate the electrical connection components in the housing 22 from the end cap 21 to reduce the risk of short circuit. For example, the insulating member may be made of plastic, rubber, or the like.

[0273] The housing 22 is a component that cooperates with the end cap 21 to form the internal environment of the battery cell 20. This internal environment can be used to accommodate the electrode assembly 23, electrolyte, and other components. The housing 22 and end cap 21 can be separate components. An opening can be provided in the housing 22, and the end cap 21 is placed over the opening to form the internal environment of the battery cell 20. Alternatively, the end cap 21 and housing 22 can be integrated. Specifically, the end cap 21 and housing 22 can form a common connection surface before other components are inserted into the housing. When the interior of the housing 22 needs to be enclosed, the end cap 21 is placed over the housing 22. The housing 22 can have a variety of shapes and sizes, such as a rectangular parallelepiped, a cylindrical shape, or a hexagonal prism. Specifically, the shape of the housing 22 can be determined based on the specific shape and size of the electrode assembly 23. The housing 22 can be made of a variety of materials, such as copper, iron, aluminum, stainless steel, aluminum alloy, plastic, etc., and this embodiment of the present application does not impose any particular limitations on this.

[0274] As shown in Figures 7 and 8 , the electrode assembly 23 includes a positive electrode sheet 231, a negative electrode sheet 232, and a separator 233. The battery cell 20 primarily operates by the movement of metal ions between the positive electrode sheet 231 and the negative electrode sheet 232. The positive electrode sheet 231 includes a positive electrode current collector 2311 and a positive electrode active material layer 2312. The positive electrode active material layer 2312 is coated on the surface of the positive electrode current collector 2311. The portion of the positive electrode current collector 2311 not coated with the positive electrode active material layer 2312 is the positive electrode tab. The negative electrode sheet 232 includes a negative electrode current collector 2321 and a negative electrode active material layer 2322. The negative electrode active material layer 2322 is coated on the surface of the negative electrode current collector 2321. The portion of the negative electrode current collector 2321 not coated with the negative electrode active material layer 2322 is the negative electrode tab.

[0275] In one embodiment, the material of the positive electrode current collector 2311 can be aluminum, and the material of the positive active material layer can be lithium cobalt oxide, lithium iron phosphate, ternary lithium or lithium manganate, etc. The material of the negative electrode current collector 2321 can be copper, that is, the negative electrode current collector 2321 can be made of electrolytic copper foil 200, and the material of the negative active material layer can be carbon, silicon, lithium metal or lithium alloy, etc. In order to ensure that a large current can pass through without melting, the number of positive electrode ears is multiple and stacked together, and the number of negative electrode ears is multiple and stacked together. The material of the isolation film 233 can be polypropylene (PP) or polyethylene (PE), etc. In addition, the electrode assembly 23 in the embodiment of the present application includes but is not limited to a winding structure or a laminated structure.

[0276] In another embodiment of the present application, a negative electrode sheet 232 is provided, comprising the electrolytic copper foil 200 as described in the above embodiment.

[0277] It is understandable that the negative electrode current collector 2321 of the negative electrode sheet 232 adopts the electrolytic copper foil 200 described in the above embodiment.

[0278] The negative electrode sheet 232 of the embodiment of the present application adopts the electrolytic copper foil 200 described above. The electrolytic copper foil 200 has high tensile strength and elongation, which is of great help in the subsequent design and development of the ultra-thin battery cell 20.

[0279] In another embodiment of the present application, a battery cell 20 is provided, comprising the negative electrode sheet 232 as described in the above embodiment.

[0280] The battery cell 20 of the embodiment of the present application adopts the above-mentioned negative electrode sheet 232, which has a significant improvement in cycle life and safety for high-expansion force battery cells, such as the silicon-doped system battery 1100, and can improve the expansion and fracture problem of the negative electrode sheet 232 in the late charge and discharge cycle of the battery cell 20.

[0281] In another embodiment of the present application, a battery 1100 is provided, comprising the battery cell 20 as described in the above embodiment.

[0282] The battery 1100 of the embodiment of the present application adopts the above-mentioned battery cell 20. The battery cell 20 has good performance, which is beneficial to improving the cycle life and safety of the battery 1100.

[0283] In another embodiment of the present application, an electrical device is provided, comprising the battery 1100 as described in the above embodiment.

[0284] The battery 1100 of the embodiment of the present application adopts the above-mentioned battery 1100. The battery 1100 has good performance and safety, which is beneficial to improving the reliability of the electrical device.

[0285] The above description of the various embodiments tends to emphasize the differences between the various embodiments. The same or similar aspects can be referenced with each other and will not be repeated herein for the sake of brevity.

[0286] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present application, rather than to limit them. Although the present application has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some or all of the technical features therein. These modifications or replacements do not deviate the essence of the corresponding technical solutions from the scope of the technical solutions of the embodiments of the present application, and they should all be included in the scope of the claims and specification of the present application. In particular, as long as there is no structural conflict, the various technical features mentioned in the various embodiments can be combined in any way. The present application is not limited to the specific embodiments disclosed herein, but includes all technical solutions that fall within the scope of the claims.

Claims

1. An electrolytic copper foil preparation device, wherein: include: A pulse power supply having a positive pole and a negative pole; The foil production device comprises a cathode component and an anode component. The anode component is configured with a plating solution tank for carrying electroplating solution, and at least part of the cathode component is located in the plating solution tank. The positive electrode is electrically connected to the cathode component, and the negative electrode is electrically connected to the anode component.

2. The electrolytic copper foil preparation device according to claim 1, wherein: The peak current range of the pulse power supply is 70kA to 200kA.

3. The electrolytic copper foil preparation device according to claim 2, wherein: The peak current range of the pulse power supply is 100kA to 150kA.

4. The electrolytic copper foil preparation device according to any one of claims 1 to 3, wherein: The duty cycle of the pulse power supply ranges from 1% to 50%.

5. The electrolytic copper foil preparation device according to claim 4, wherein: The duty cycle of the pulse power supply ranges from 5% to 20%.

6. The electrolytic copper foil preparation device according to any one of claims 1 to 5, wherein: The pulse width of the pulse power supply ranges from 1 ms to 50 ms.

7. The electrolytic copper foil preparation device according to claim 6, wherein: The pulse width of the pulse power supply ranges from 10ms to 30ms.

8. The electrolytic copper foil preparation device according to any one of claims 1 to 7, wherein: The average current range of the pulse power supply is 1 kA to 50 kA.

9. The electrolytic copper foil preparation device according to claim 8, wherein: The average current range of the pulse power supply is 3kA to 20kA.

10. The electrolytic copper foil preparation device according to any one of claims 1 to 9, wherein: The peak current density of the anode element is in the range of 181A / dm 2 ~454A / dm 2 .

11. The electrolytic copper foil preparation device according to claim 10, wherein: The peak current density of the anode member is in the range of 200A / dm 2 ~240A / dm 2 .

12. The electrolytic copper foil preparation device according to any one of claims 1 to 11, wherein: The average current density of the anode member is in the range of 2A / dm 2 ~113A / dm 2 .

13. The electrolytic copper foil preparation device according to claim 12, wherein: The average current density of the anode member is in the range of 30A / dm 2 ~80A / dm 2 .

14. The electrolytic copper foil preparation device according to any one of claims 1 to 13, wherein: The output waveform of the pulse power supply is a rectangular wave.

15. The electrolytic copper foil preparation device according to any one of claims 1 to 14, wherein: The pulse power supply includes a plurality of battery cells, and the plurality of battery cells are connected in parallel.

16. The electrolytic copper foil preparation device according to claim 15, wherein: Each of the battery units includes a plurality of battery modules, and the plurality of battery modules are connected in parallel.

17. The electrolytic copper foil preparation device according to any one of claims 1 to 16, wherein: The electrolytic copper foil preparation equipment also includes a copper busbar, which is electrically connected between the positive electrode of the pulse power supply and the cathode member.

18. The electrolytic copper foil preparation device according to claim 17, wherein: The copper busbar comprises a silver-plated copper busbar, and the silver-plated copper busbar is electrically connected between the positive electrode of the pulse power supply and the cathode member.

19. The electrolytic copper foil preparation device according to any one of claims 1 to 18, wherein: The electrolytic copper foil preparation equipment also includes a plating solution component mixing device, which is used to adjust the concentration of at least part of the components in the plating solution.

20. The electrolytic copper foil preparation device according to claim 19, wherein: The electroplating solution component mixing device is used to adjust the concentration of at least part of the components in the electroplating solution according to the detection result of the prepared electrolytic copper foil.

21. The electrolytic copper foil preparation device according to claim 19 or 20, wherein: The electroplating solution component mixing device comprises a first container and a first connecting pipe, wherein the first container is used to load a leveling agent, and the first connecting pipe connects the first container and the plating solution tank.

22. The electrolytic copper foil preparation device according to claim 21, wherein: The first connecting pipe is provided with a first flow detection member for detecting the flow of the first connecting pipe.

23. The electrolytic copper foil preparation device according to any one of claims 19 to 22, wherein: The electroplating solution component preparation device also includes a second container and a second connecting pipe, wherein the second container is used to load a wetting agent, and the second connecting pipe connects the second container and the plating solution tank.

24. The electrolytic copper foil preparation device according to claim 23, wherein: The second connecting pipe is provided with a second flow detection member for detecting the flow of the second connecting pipe.

25. The electrolytic copper foil preparation device according to any one of claims 19 to 24, wherein: The electroplating solution component preparation device also includes a third container and a third connecting pipe. The third container is used to load a solution containing chloride ions. The third connecting pipe connects the third container and the plating solution tank.

26. The electrolytic copper foil preparation device according to claim 25, wherein: The third connecting pipe is provided with a third flow detection member for detecting the flow of the third connecting pipe.

27. The electrolytic copper foil preparation device according to any one of claims 19 to 26, wherein: The electroplating solution component mixing device also includes a fourth container and a fourth connecting pipe. The fourth container is used to load brightener, and the fourth connecting pipe connects the fourth container and the plating solution tank.

28. The electrolytic copper foil preparation device according to claim 27, wherein: The fourth connecting pipe is provided with a fourth flow detection member for detecting the flow of the fourth connecting pipe.

29. The electrolytic copper foil preparation device according to any one of claims 19 to 28, wherein: The electroplating solution component mixing device also includes a fifth container and a fifth connecting pipe. The fifth container is used to load the copper sulfate solution. The fifth connecting pipe connects the fifth container and the plating solution tank.

30. The electrolytic copper foil preparation device according to claim 29, wherein: The fifth connecting pipe is provided with a fifth flow detection member for detecting the flow of the fifth connecting pipe.

31. An electrolytic copper foil, wherein: The electrolytic copper foil is produced by using the electrolytic copper foil production equipment described in any one of claims 1 to 29.

32. A negative electrode sheet, wherein: Comprising the electrolytic copper foil as claimed in claim 31.

33. A battery cell, wherein: Including the negative electrode sheet as described in claim 32.

34. A battery, wherein: Comprising the battery cell as claimed in claim 33.

35. An electrical device, wherein: Comprising the battery of claim 34.

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