Server node and server

Abstract

Embodiments of the present application relate to the technical field of servers, and provide a server node and a server, which are used for mitigating the problem of maintenance inconvenience of liquid cooling systems. The server node comprises a first liquid cooling device, a second liquid cooling device, and a liquid distribution device. In the liquid distribution device, a first liquid inlet pipe, a first liquid outlet pipe, a liquid distributor, a liquid distribution inlet pipe, and a liquid distribution outlet pipe are all connected to a support member, the first liquid inlet pipe is communicated with a first liquid inlet connector and the liquid distribution inlet pipe by means of the liquid distributor, and the first liquid outlet pipe is communicated with a first liquid outlet connector and the liquid distribution outlet pipe by means of the liquid distributor. The first liquid inlet connector is connected to a first liquid inlet end of the first liquid cooling device, and the first liquid outlet connector is connected to a first liquid outlet end of the first liquid cooling device. A first connector is provided at the end of the liquid distribution inlet pipe distant from the liquid distributor and is connected to a second liquid inlet end. A second connector is provided at the end of the liquid distribution outlet pipe distant from the liquid distributor and is connected to a second liquid outlet end. The server node is used for providing a computing service.

Description

Server nodes and servers

[0001] This application claims priority to the Chinese patent application filed with the State Intellectual Property Office on November 30, 2023, with application number 202311634098.1 and application name “Server Node and Server”, the entire contents of which are incorporated by reference into this application. Technical Field

[0002] The present application relates to the technical field of server nodes, and in particular to a server node and a server. Background Art

[0003] Servers can manage resources and provide services to users. As computing power increases, GPUs (Graphics Processing Units) are installed in servers. After the GPU is added to the server, the liquid cooling system used to dissipate heat for the server becomes complex and inconvenient to maintain.

[0004] Summary of the Invention

[0005] The embodiment of the present application aims to provide a server node and a server for improving the problem that the liquid cooling system is inconvenient to maintain.

[0006] To achieve the above objectives, the embodiments of the present application provide the following technical solutions:

[0007] On the one hand, a server node is provided. The server node includes a chassis, a first subnode, a first liquid cooling device disposed in the first subnode, a second subnode, a second liquid cooling device disposed in the second subnode, and a liquid separation device. The first liquid cooling device includes a first liquid inlet and a first liquid outlet; the second liquid cooling device includes a second liquid inlet and a second liquid outlet. The liquid separation device is disposed in the chassis. The liquid separation device is disposed in the chassis; the liquid separation device includes: a support, a first liquid inlet pipe, a first liquid outlet pipe, a liquid separator, a first liquid inlet joint, a first liquid outlet joint, a liquid separation inlet pipe, a liquid separation outlet pipe, a first joint, and a second joint; the first liquid inlet pipe, the first liquid outlet pipe, the liquid separator, the liquid separation inlet pipe, and the liquid separation outlet pipe are all connected to the support; the first liquid inlet pipe is used to input a liquid cooling medium. The first liquid inlet pipe is connected to the first liquid inlet joint and the liquid separation inlet pipe through the liquid separator, and the first liquid outlet pipe is connected to the first liquid outlet joint and the liquid separation outlet pipe through the liquid separator; the first liquid inlet joint is connected to the first liquid inlet end, and the first liquid outlet joint is connected to the first liquid outlet end. The first joint is provided at the end of the liquid separation inlet pipe away from the liquid separator, and the first joint is connected to the second liquid inlet end; the second joint is provided at the end of the liquid separation outlet pipe away from the liquid separator, and the second joint is connected to the second liquid outlet end.

[0008] In the above-mentioned server node, the support member can support the first liquid inlet pipe, the first liquid outlet pipe, the liquid separator, the liquid separator inlet pipe and the liquid separator outlet pipe, and the liquid separator device can be installed uniformly, so that the liquid separator device can be maintained separately. The first liquid inlet pipe can be connected to the first liquid inlet joint and the liquid separator inlet pipe through the liquid separator, and the first liquid outlet pipe can be connected to the first liquid outlet joint and the liquid separator outlet pipe through the liquid separator, so that the liquid-cooling medium in the first liquid inlet pipe can be diverted to the first liquid inlet joint and the liquid separator inlet pipe through the liquid separator, wherein the first liquid inlet joint can be connected to the first liquid inlet end of the first liquid cooling device, so that the first liquid cooling device can be connected to the liquid-cooling medium, and the liquid-cooling medium in the first liquid cooling device can be output to the first liquid outlet joint through the first liquid outlet end. The liquid separator inlet pipe can be output to the second liquid inlet end of the second liquid cooling device through the first joint, so that the liquid-cooling medium in the liquid separator inlet pipe can enter the second liquid cooling device through the first joint, and the liquid-cooling medium in the second liquid cooling device can be output to the liquid separator outlet pipe through the second liquid outlet end. The liquid-cooling medium in the first liquid outlet connector and the liquid-distribution outlet pipe can be converged to the first liquid outlet pipe through the liquid separator. Therefore, by providing a liquid separator, the liquid-cooling medium can be separated and converged, which is beneficial for modularizing the liquid-distribution device, reducing leakage points, and facilitating maintenance of the liquid-distribution device. Furthermore, the liquid-cooling medium required for both the first liquid-cooling device and the second liquid-cooling device is introduced through the liquid-distribution device, thereby simplifying the structure of the liquid-cooling system and facilitating maintenance of the liquid-cooling system.

[0009] In some embodiments, the chassis includes a first side and a second side disposed opposite each other, and the first side is provided with a mounting opening, and the first subnode is mounted in the chassis through the mounting opening, wherein the direction from the first side to the second side is a first direction. The first subnode and the second subnode are stacked in sequence along a second direction. The liquid dispensing device is located on one side of the first subnode in a third direction, wherein the third direction intersects the second direction and the first direction.

[0010] Wherein, by arranging the liquid separation device on one side of the first sub-node in the third direction, the width of the server node in the second direction can be reduced.

[0011] In some embodiments, the first liquid inlet end and the first liquid outlet end are both facing the second side, and the first liquid inlet connector and the first liquid outlet connector are both facing the first side, wherein, when the first sub-node is installed in the chassis through the mounting port, the first liquid inlet connector is docked with the first liquid inlet end, and the first liquid outlet connector is docked with the first liquid outlet end.

[0012] Among them, the first liquid inlet end and the second liquid inlet end are facing the second side, while the first liquid inlet connector and the first liquid outlet connector are facing the first side. Therefore, when the first sub-node enters the chassis along the plug-in and pull-out direction, the first liquid inlet end can be docked with the first liquid inlet connector, and the second liquid inlet end can be docked with the first liquid outlet connector. When the first sub-node exits the chassis along the plug-in and pull-out direction, the first liquid inlet end can be detached from the first liquid inlet connector and decoupled from the first liquid inlet connector, while the second liquid inlet end can be detached from the first liquid outlet connector and decoupled from the first liquid outlet connector. Such a setting can facilitate the installation of the first sub-node, as well as the connection and decoupling of the first liquid cooling device and the liquid separation device in the first sub-node.

[0013] In some embodiments, the liquid dispensing device further comprises a guide post, one end of which is connected to a side of the liquid dispenser facing the first side, wherein the guide post extends along a first direction, where the first direction is the direction from the first side to the second side. The first liquid cooling device comprises a guide portion, the guide portion comprising a guide surface, the guide surface facing the second side, and a guide hole disposed on the guide surface. When the first subnode is installed in the chassis via the mounting port, the guide post is inserted into the guide hole.

[0014] When the first sub-node is installed in the chassis through the mounting port, the guide column can enter the guide hole. At this time, the guide hole can limit the moving direction of the guide column, thereby limiting the moving direction of the first sub-node where the liquid separation device is located, and reducing the deviation caused by the moving direction of the first sub-node. If the moving direction of the first sub-node is offset, it will cause the first liquid inlet end and the first liquid inlet joint to deviate from the alignment, thereby causing the first liquid inlet end and the first liquid inlet joint to be unreliable connected, and the second liquid inlet end and the first liquid outlet joint to be unreliable connected, resulting in leakage. Therefore, by setting a guide hole to limit the moving direction of the guide column, the phenomenon of leakage can be reduced.

[0015] In some embodiments, the first liquid cooling device includes a liquid inlet manifold, a liquid outlet manifold and multiple first liquid cooling components; the first liquid inlet end is located at one end of the liquid inlet manifold, and the liquid inlet manifold is provided with multiple first interfaces; the first liquid outlet end is located at one end of the liquid outlet manifold, and the liquid outlet manifold is provided with multiple second interfaces; one end of the first liquid cooling component is connected to a first interface, and the other end is connected to a second interface, and the first liquid cooling component is used to dissipate heat for the first heat dissipation device of the first sub-node.

[0016] Among them, the two ends of the first liquid cooling component are respectively connected to the first interface and the second interface, so that the liquid cooling medium in the liquid inlet manifold can enter the first liquid cooling component and flow into the liquid outlet manifold from the first liquid cooling component. In this way, the first liquid cooling component can dissipate heat for the first device to be cooled in the first sub-node.

[0017] In some embodiments, the first liquid cooling assembly includes a liquid inlet connecting pipe, a liquid cooling plate, and a liquid outlet connecting pipe. The liquid cooling plate is provided with a liquid cooling channel. One end of the liquid inlet connecting pipe is connected to one end of the liquid cooling channel, and the other end of the liquid inlet connecting pipe is connected to a first interface. One end of the liquid outlet connecting pipe is connected to the other end of the liquid cooling channel, and the other end of the liquid outlet connecting pipe is connected to a second interface. The liquid cooling plate is configured to contact the surface of the first component to be cooled of the first subnode.

[0018] The first liquid-cooling assembly includes a liquid-cooling plate. In multiple first liquid-cooling assemblies, the liquid coolant in the liquid inlet manifold passes through multiple liquid inlet connecting pipes and then enters multiple liquid-cooling plates. Therefore, when the liquid coolant enters the liquid-cooling channels within the liquid-cooling plates, the liquid pressure drop is roughly equal. Consequently, the heat dissipation effect of each liquid-cooling plate is roughly the same, which helps improve the heat dissipation uniformity of the first liquid-cooling assembly.

[0019] In some embodiments, the first liquid cooling component includes a liquid inlet connecting pipe, multiple liquid cooling plates and a liquid outlet connecting pipe; a liquid cooling channel is provided in the liquid cooling plate, and the liquid cooling channels of the multiple liquid cooling plates are connected in parallel; one end of the liquid inlet connecting pipe is connected to a first interface, and the liquid inlet connecting pipe is connected to one end of the liquid cooling channels of the multiple liquid cooling plates; one end of the liquid outlet connecting pipe is connected to a second interface, and the liquid outlet connecting pipe is connected to the other end of the liquid cooling channels of the multiple liquid cooling plates.

[0020] Among them, multiple liquid cooling plates can introduce liquid cooling medium from the liquid inlet manifold through the liquid inlet connecting pipe, and the liquid cooling medium in multiple liquid cooling plates can be discharged into the liquid outlet manifold through the liquid outlet connecting pipe. Therefore, the number of connecting pipes provided in the first liquid cooling assembly can be reduced, thereby improving the neatness of the pipe layout of the first liquid cooling device.

[0021] In some embodiments, the first liquid cooling device also includes at least one second liquid cooling component, one end of the second liquid cooling component is connected to a first interface, and the other end is connected to a second interface, and the second liquid cooling component is used to dissipate heat for the third device to be cooled of the first sub-node, wherein the third device to be cooled is a switching chip.

[0022] The third device to be cooled in the first sub-node can be cooled by providing the second liquid cooling assembly.

[0023] In some embodiments, the first sub-node includes a first connector and a first box, and the first connector is arranged at an end of the first box away from the first side; the second sub-node includes a second connector and a second box, and the second connector is arranged at an end of the second box away from the first side; the server node also includes a backplane, the backplane includes a circuit board and a third connector and a fourth connector arranged on the circuit board, wherein the circuit board is perpendicular to the second direction, the third connector is docked with the first connector, and the fourth connector is electrically connected to the second connector through a cable.

[0024] Because the backplane is adjacent to the first subnode and the second subnode is stacked on the first subnode, the distance between the backplane and the second connector of the second subnode is relatively close, thereby reducing the length of the cable, thereby shortening the signal transmission link, reducing signal loss, and increasing the signal transmission rate. At the same time, the third connector directly connects to the first connector, thereby shortening the signal transmission link between the first subnode and the circuit board, thereby reducing signal loss.

[0025] In another aspect, a server is provided. The server comprises a cabinet and a plurality of server nodes as provided in some of the above embodiments. The cabinet has a storage space formed therein, and the plurality of server nodes are disposed in the storage space.

[0026] The above-mentioned server has the same structure and beneficial technical effects as the server nodes provided in some of the above-mentioned embodiments, which will not be repeated here.

[0027] In some embodiments, the server node further comprises: a liquid inlet pipe and a liquid return pipe, wherein the liquid inlet pipe is connected to an end of the first liquid inlet pipe of the server node away from the liquid dispenser, and the liquid return pipe is connected to an end of the first liquid outlet pipe of the server node away from the liquid dispenser.

[0028] The liquid inlet pipe is connected to the end of the first liquid inlet pipe away from the liquid distributor, so that the first liquid inlet pipe can receive the liquid cooling medium input by the liquid inlet pipe. The liquid return pipe is connected to the end of the first liquid outlet pipe away from the liquid distributor, so that the liquid cooling medium in the first liquid outlet pipe can be output to the liquid return pipe. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] To more clearly illustrate the technical solutions of this application, the following briefly introduces the drawings required for use in some embodiments of this application. Obviously, the drawings described below are only drawings of some embodiments of this application, and those skilled in the art can also derive other drawings based on these drawings. Furthermore, the drawings described below are schematic diagrams and are not intended to limit the actual dimensions of the products, actual processes of the methods, actual timing of signals, and the like involved in the embodiments of this application.

[0030] FIG1 is a structural diagram of a server according to some embodiments of the present application;

[0031] FIG2 is a schematic diagram of a module structure of a server node in FIG1 ;

[0032] FIG3 is a schematic structural diagram of a chassis of the server node in FIG1 ;

[0033] FIG4 is a schematic structural diagram of the server node in FIG1 with the chassis top plate removed;

[0034] FIG5 is a structural diagram of the first subnode in FIG4 ;

[0035] FIG6 is a structural diagram of the liquid separation device in FIG2 ;

[0036] FIG7 is a structural diagram of the liquid separation device in FIG2 from another perspective;

[0037] FIG8 is a structural diagram of the first liquid cooling device in FIG5 ;

[0038] FIG9 is a simplified structural diagram of the first liquid cooling device in FIG8 ;

[0039] FIG10 is another structural diagram of the first liquid cooling device in FIG5 ;

[0040] FIG11 is a simplified structural diagram of the first liquid cooling device in FIG10 ;

[0041] FIG12 is another structural diagram of a first liquid cooling device according to some embodiments;

[0042] FIG13 is another structural diagram of a server node in some embodiments of the present application. DETAILED DESCRIPTION

[0043] The following will be combined with the accompanying drawings to clearly and completely describe the technical solutions in some embodiments of the present disclosure. Obviously, the embodiments described are only some embodiments of the present disclosure, not all embodiments. Based on the embodiments provided by the present disclosure, all other embodiments obtained by ordinary technicians in this field are within the scope of protection of the present disclosure.

[0044] Unless the context requires otherwise, throughout the specification and claims, the term "comprise" and its other forms, such as the third person singular form "comprises" and the present participle form "comprising", are to be interpreted as open and inclusive, that is, "including, but not limited to". In the description of the specification, the terms "some embodiments", "example" or "some examples" and the like are intended to indicate that the particular features, structures, materials or characteristics associated with the embodiment or example are included in at least one embodiment or example of the present disclosure. The schematic representation of the above terms does not necessarily refer to the same embodiment or example. In addition, the particular features, structures, materials or characteristics may be included in any one or more embodiments or examples in any appropriate manner.

[0045] In the following, the terms "first" and "second" are used for descriptive purposes only and should not be understood to indicate or imply relative importance or implicitly specify the number of the technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of the embodiments of the present disclosure, unless otherwise specified, "plurality" means two or more.

[0046] As used herein, "parallel" and "perpendicular" include the conditions described and conditions similar to the conditions described, and the range of the similar conditions is within an acceptable deviation range, wherein the acceptable deviation range is determined by a person of ordinary skill in the art taking into account the measurement in question and the errors associated with the measurement of the specific quantity (i.e., the limitations of the measurement system). For example, "parallel" includes absolute parallelism and approximate parallelism, wherein the acceptable deviation range for approximate parallelism can be, for example, a deviation within 5°; "perpendicular" includes absolute perpendicularity and approximate perpendicularity, wherein the acceptable deviation range for approximate perpendicularity can also be, for example, a deviation within 5°.

[0047] Figure 1 is a structural diagram of a server according to some embodiments of the present application. A coordinate system is established in Figure 1 , where the length direction of the cabinet 100 is the X direction, the width direction is the Y direction, and the height direction is the Z direction.

[0048] Referring to Figure 1 , the server 1000 includes a cabinet 100 and multiple server nodes 300. The cabinet 100 has a storage space formed therein; the multiple server nodes 300 are disposed within the storage space. Thus, the cabinet 100 can protect multiple electronic devices 200.

[0049] For example, a cabinet opening is provided on one side of the cabinet 100, and multiple server nodes 300 can be installed in the cabinet 100 through the cabinet opening. When the server node 300 is installed in the cabinet 100, the moving direction of the server node 300 can be the Y direction.

[0050] As shown in FIG1 , the cabinet 100 may include multiple side walls, which may enclose a storage space, and the multiple side walls may include a first side wall 120 disposed opposite to the cabinet opening 110. The cabinet opening 110 and the first side wall 120 are disposed opposite to each other in the Y direction.

[0051] The server node 300 is provided with at least one CPU (Central Processing Unit), which can provide computing services.

[0052] In the related art, a liquid cooling system is used to dissipate heat from the CPU in the server node 300 .

[0053] As the computing power of the server node 300 increases, a GPU (Graphics Processing Unit) or an NPU (Neural Network Processing Unit) is also installed in the server node 300. The liquid cooling system also needs to dissipate heat from the GPU and / or NPU, which makes the liquid cooling system complex and inconvenient to maintain.

[0054] Based on this, an embodiment of the present application provides a server node 300.

[0055] Figure 2 is a block diagram of the structure of the server node 300 in Figure 1 ; Figure 3 is a block diagram of the chassis of the server node 300 in Figure 1 ; Figure 4 is a block diagram of the server node 300 in Figure 1 without the chassis top plate 311 ; and Figure 5 is a block diagram of the first subnode 320 in Figure 4 . It should be noted that in order to distinguish the first subnode 320, the second subnode 340, the liquid dispensing device 400, and the fan 360 in Figure 2 , the first subnode 320, the second subnode 340, the liquid dispensing device 400, and the fan 360 are drawn using different line types.

[0056] 2 , 3 , 4 , and 5 , the server node 300 may include a chassis 310, a first subnode 320, a first liquid cooling device 500, a second subnode 340, a second liquid cooling device, and a liquid separation device 400. The chassis 310 has a housing space formed therein, and the first subnode 320, the second subnode 340, and the liquid separation device 400 are disposed within the housing space.

[0057] For example, as shown in FIG. 2 , the first sub-node 320 and the second sub-node 340 may be stacked along the Z direction.

[0058] In some examples, as shown in FIG3 , a chassis 310 may include a top plate 311 and a bottom plate 312 disposed opposite each other in the Z direction, and a first side plate 313 and a second side plate 314 disposed opposite each other in the X direction. The top plate 311, the bottom plate 312, the first side plate 313, and the second side plate 314 may enclose a receiving space.

[0059] In addition, the chassis 310 may further include a partition plate 315, which is disposed between the top plate 311 and the bottom plate 312, and the partition plate 315 and the top plate 311 are disposed opposite each other in the Z direction. The first sub-node 320 may be disposed between the partition plate 315 and the bottom plate 312, and the second sub-node 340 may be located between the partition plate 315 and the top plate 311.

[0060] Referring to Figures 4 and 5 , the first subnode 320 includes a first housing 321 and a first device to be cooled disposed within the first housing 321. A first liquid cooling device 500 is disposed within the first housing 321 and dissipates heat for the first device to be cooled. The first liquid cooling device 500 includes a first liquid inlet 5001 and a first liquid outlet 5002. For example, there may be multiple first devices to be cooled. For example, the first devices to be cooled may include a CPU (Central Processing Unit), a GPU (Graphics Processing Unit), or an NPU (Neural Network Processing Unit). The second subnode 340 includes a second housing and a second device to be cooled disposed within the second housing. The second liquid cooling device may dissipate heat for the second device to be cooled. The second devices to be cooled may include multiple second devices to be cooled. For example, the second devices to be cooled may include a CPU, a memory module, a network interface card, etc.

[0061] For example, the first device to be cooled is a GPU, and the second device to be cooled is a CPU. FIG6 is a structural diagram of the liquid separation device 400 in FIG2 ; FIG7 is a structural diagram of the liquid separation device 400 in FIG2 from another perspective, wherein FIG7 does not show the support member 480 in the liquid separation device 400.

[0062] Please refer to Figures 6 and 7. The liquid separating device 400 is arranged in the chassis 310 (as shown in Figure 4); the liquid separating device 400 includes: a support member 480, a first liquid inlet pipe 410, a first liquid outlet pipe 420, a liquid separator 430, a first liquid inlet connector 440, a first liquid outlet connector 450, a liquid separating inlet pipe 460, a liquid separating outlet pipe 470, a first connector 461 and a second connector 471.

[0063] The first liquid inlet pipe 410 , the first liquid outlet pipe 420 , the liquid separator 430 , the liquid separation inlet pipe 460 and the liquid separation outlet pipe 470 are all connected to the support member 480 , wherein the first liquid inlet pipe 410 is used to input liquid cooling medium.

[0064] The first liquid inlet pipe 410 is connected to the first liquid inlet joint 440 and the liquid separation inlet pipe 460 through the liquid separator 430 , and the first liquid outlet pipe 420 is connected to the first liquid outlet joint 450 and the liquid separation outlet pipe 470 through the liquid separator 430 .

[0065] The first liquid inlet connector 440 is connected to the first liquid inlet end 5001 , and the first liquid outlet connector 450 is connected to the first liquid outlet end 5002 .

[0066] The first connector 461 is disposed at one end of the liquid-distributing inlet pipe 460 away from the liquid distributor 430 , and the first connector 461 is connected to the second liquid-inlet end.

[0067] The second connector 471 is disposed at one end of the liquid outlet pipe 470 away from the liquid distributor 430 and is connected to the second liquid outlet end.

[0068] The liquid cooling medium may be deionized water, ethylene glycol aqueous solution or the like.

[0069] Please refer to Figures 6 and 7. The support member 480 can support the first liquid inlet pipe 410, the first liquid outlet pipe 420, the liquid separator 430, the liquid separation inlet pipe 460 and the liquid separation outlet pipe 470, and can uniformly install the liquid separation device 400, and then the liquid separation device 400 can be maintained separately, which is also conducive to the maintenance of the liquid cooling system.

[0070] For example, the support member 480 may include a first end 4801 and a second end 4802 opposite to each other, and a placement space is formed in the support member 480 .

[0071] For example, a third connector 411 is provided at one end of the first liquid inlet pipe 410 away from the liquid distributor 430 , wherein the third connector 411 is used to input the liquid cooling medium.

[0072] For example, a fourth connector 421 is provided at one end of the first liquid outlet pipe 420 away from the liquid distributor 430 , wherein the first liquid outlet pipe 420 is used to output the liquid cooling medium. For example, the liquid cooling medium can be output through the fourth connector 421 .

[0073] The third connector 411 and the fourth connector 421 can be located outside the support member 480, on a side of the support member 480 away from the first end 4801. Portions of the first liquid inlet pipe 410 and the first liquid outlet pipe 420 are located outside the support member 480, extending from the second end 4802 of the support member 480 into the accommodating space of the support member 480 and to the first end 4801. The first liquid inlet connector 440 and the first liquid outlet connector 450 are disposed at the second end 4802 and located outside the support member 480, thereby facilitating connection between the first liquid inlet connector 440 and the first liquid inlet end 5001 of the first liquid cooling device 500, and between the first liquid outlet connector 450 and the first liquid outlet end 5002 of the first liquid cooling device 500.

[0074] A first joint 461 is provided at one end of the liquid separation inlet pipe 460 away from the liquid separator 430, and a second joint 471 is provided at one end of the liquid separation outlet pipe 470 away from the liquid separator 430. The first joint 461 and the second joint 471 are respectively connected to the second liquid inlet end and the second liquid outlet end of the second liquid cooling device.

[0075] For example, both the first connector 461 and the second connector 471 may be connected to the support member 480 . In this case, the support member 480 may support the first connector 461 and the second connector 471 .

[0076] Among them, the liquid-cooling working medium can enter the first liquid inlet pipe 410 through the third joint 411, and then flow into the liquid separator 430 through the first liquid inlet pipe 410. The liquid separator 430 can divert the liquid-cooling working medium. The liquid separator 430 can divert the liquid-cooling working medium in the first liquid inlet pipe 410 to the first liquid inlet joint 440 and the liquid separation inlet pipe 460.

[0077] The first liquid inlet connector 440 is connected to the first liquid inlet end 5001 of the first liquid cooling device 500. Therefore, the liquid coolant can enter the first liquid cooling device 500 through the first liquid inlet end 5001. After the liquid coolant in the first liquid cooling device 500 dissipates heat from the first heat-dissipating device, it can flow out through the first liquid outlet end 5002. The first liquid outlet end 5002 is connected to the first liquid outlet connector 450, allowing the liquid coolant to enter the liquid distributor 430 through the first liquid outlet connector 450.

[0078] The end of the liquid separation inlet pipe 460, remote from the liquid separator 430, can be connected to the second liquid inlet end of the second liquid cooling device. Thus, the liquid coolant can enter the second liquid cooling device through the liquid separation inlet pipe 460. After the liquid coolant in the second liquid cooling device cools the second heat dissipation device, it can flow out through the second liquid outlet end. The second liquid outlet end is connected to the liquid separation outlet pipe 470, allowing the liquid coolant to enter the liquid separator 430 through the liquid separation outlet pipe 470.

[0079] The liquid separator 430 can converge the liquid-cooling medium in the liquid separation outlet pipe 470 and the liquid-cooling medium entering the first liquid outlet joint 450. At this time, the liquid-cooling medium in the liquid separation outlet pipe 470 and the liquid-cooling medium entering the first liquid outlet joint 450 can converge to the first liquid outlet pipe 420, and then the liquid-cooling medium can flow out from the first liquid outlet pipe 420 through the fourth joint 421.

[0080] Among them, because the first liquid inlet pipe 410 can be connected to the first liquid inlet joint 440 and the liquid separation inlet pipe 460 through the liquid separator 430, and the first liquid outlet pipe 420 can be connected to the first liquid outlet joint 450 and the liquid separation outlet pipe 470 through the liquid separator 430, the liquid cooling medium can be separated and converged through the liquid separator 430, which is beneficial to realize the modularization of the liquid separation device 400 and facilitate the maintenance of the liquid separation device 400. In addition, the liquid separation device 400 occupies a small area in the chassis, which is beneficial to reducing the coverage area of ​​the leakage point.

[0081] In addition, the liquid cooling medium required by the first liquid cooling device 500 and the liquid cooling medium required by the second liquid cooling device are both introduced by the liquid separation device 400, thereby simplifying the structure of the liquid cooling system, facilitating maintenance of the liquid cooling system, and improving the anti-leakage reliability of the liquid cooling system.

[0082] In some embodiments, in some examples, the server 1000 may further include a liquid inlet pipe and a liquid return pipe. The liquid inlet pipe is connected to the end of the first liquid inlet pipe 410 away from the liquid distributor 430. The liquid inlet pipe is used to input liquid cooling medium, so that the first liquid inlet pipe 410 can be connected to the liquid cooling medium in the liquid inlet pipe. One end of the liquid return pipe is connected to the end of the first liquid outlet pipe 420 away from the liquid distributor 430, so that the liquid cooling medium flowing out of the first liquid outlet pipe 420 can enter the liquid return pipe.

[0083] The liquid inlet pipe and the liquid return pipe may be arranged in the cabinet 100 .

[0084] In some examples, the liquid inlet pipe is provided with multiple liquid inlet interfaces, and one end of a first liquid inlet pipe 410 away from the liquid dispenser 430 is connected to a liquid inlet interface. For example, the first liquid inlet pipe 410 is connected to the liquid inlet interface via a third connector 411 .

[0085] The liquid return pipe is provided with a plurality of liquid return interfaces, and one end of a first liquid outlet pipe 420 away from the liquid distributor 430 is connected to a liquid return interface. For example, the first liquid outlet pipe 420 is connected to the liquid return interface via a fourth connector 421 .

[0086] Furthermore, the server 1000 may be equipped with a cooling distribution device connected to the liquid inlet pipe and the liquid return pipe. In this case, the liquid coolant in the first liquid outlet pipe 420 may enter the first liquid outlet pipe 420 through the cooling distribution device. The cooling distribution device may also provide power for the flow of the liquid coolant. For example, the cooling distribution device may be a pump.

[0087] One server 1000 can be configured with one cooling distribution device. Alternatively, multiple servers 1000 can share one cooling distribution device. In some embodiments, referring again to FIG. 3 , a chassis 310 includes a first side 3101 and a second side 3102 disposed opposite each other. The first side 3101 of the chassis 310 is provided with a mounting opening 3103. For example, the direction from the first side 3101 to the second side 3102 is a first direction F1, which can be parallel to the Y direction.

[0088] For example, the installation opening 3103 may be surrounded by the bottom plate 312 , the partition plate 315 , the first side plate 313 , and the second side plate 314 .

[0089] In some examples, the server node 300 may further include a fan 360, which may dissipate heat for the first sub-node 320 and the second sub-node 340. For example, the fan 360 may be located on a side of the first sub-node 320 away from the first side 3101, and the fan 360 may be located on a side of the second sub-node 340 away from the first side 3101.

[0090] Please refer to Figures 4 to 6 again. The first liquid inlet end 5001 and the first liquid outlet end 5002 are both facing the second side 3102, and the first liquid inlet connector 440 and the first liquid outlet connector 450 are both facing the first side 3101. When the first sub-node 320 is installed in the chassis 310 through the installation port 3103, the first liquid inlet connector 440 is docked with the first liquid inlet end 5001, and the first liquid outlet connector 450 is docked with the first liquid outlet end 5002.

[0091] Therefore, when the first subnode 320 enters the chassis 310 along the plug-in direction, the first liquid inlet end 5001 can dock with the first liquid inlet connector 440, and the first liquid outlet end 5002 can dock with the first liquid outlet connector 450. When the first subnode 320 exits the chassis 310 along the plug-in direction, the first liquid inlet end 5001 can detach from the first liquid inlet connector 440 and decouple from the first liquid inlet connector 440, while the first liquid outlet end 5002 can detach from the first liquid outlet connector 450 and decouple from the first liquid outlet connector 450. This arrangement facilitates the installation of the first subnode 320 and the connection and decoupling of the first liquid cooling device 500 and the liquid separation device 400 within the first subnode 320. The plug-in direction can be the Y direction.

[0092] In some examples, the first subnode 320 includes a first housing 321 . The first liquid cooling device 500 is disposed in the first housing 321 , with a first liquid inlet 5001 and a first liquid outlet 5002 extending from the first housing 321 and both facing the second side 3102 .

[0093] The first liquid inlet connector 440 and the first liquid outlet connector 450 are located on a side of the liquid distributor 430 facing the first side 3101. At this time, the first liquid inlet connector 440 and the first liquid outlet connector 450 both face the first side 3101.

[0094] For example, the first housing 321 includes a third side 3211 and a fourth side 3212 that are disposed opposite to each other along the Y direction. When the first sub-node 320 is installed in the chassis 310 through the mounting opening 3103, the third side 3211 is located in the mounting opening 3103, and the fourth side 3212 is located in the chassis 310 and adjacent to the second side 3102 of the chassis 310.

[0095] In some examples, the first liquid inlet 5001 and the first liquid outlet 5002 may be located at an end of the first housing 321 adjacent to the first side 3101 .

[0096] In some examples, the third connector 411 and the fourth connector 421 can be located on the second side 3102 of the chassis 310, the liquid dispenser 430 can be located inside the chassis 310 and adjacent to the first side 3101, the first liquid inlet pipe 410 can extend from the second side 3102 of the chassis 310 to the liquid dispenser 430, and the first liquid outlet pipe 420 can extend from the second side 3102 of the chassis 310 to the liquid dispenser 430.

[0097] In some examples, the liquid separating device 400 may further include a handle 491 , wherein the handle 491 is disposed on the support 480 . By disposing the handle 491 on the support 480 , it is convenient for operation and maintenance personnel to install and disassemble the liquid separating device 400 .

[0098] Please refer to FIG. 4 again. In some embodiments, the first sub-node 320 and the second sub-node 340 are stacked in sequence along the second direction F2. For example, the second direction F2 may be parallel to the Z direction.

[0099] The liquid dispensing device 400 is located on one side of the first subnode 320 along the third direction F3, wherein the third direction F3 intersects the second direction F2 and the first direction F1. For example, the third direction F3 is perpendicular to the second direction F2, the third direction F3 is perpendicular to the first direction F1, and the first direction F1 is perpendicular to the second direction F2.

[0100] By disposing the liquid dispensing device 400 on one side of the first sub-node 320 in the third direction F3 , the width of the server node 300 in the second direction F2 can be reduced.

[0101] In some examples, the first liquid inlet 5001 and the first liquid outlet 5002 may extend from one side of the first housing 321 in the third direction F3.

[0102] Please refer to Figure 7 again. In a possible implementation, the liquid separation device 400 may also include a first valve 493 and a second valve 494, wherein the first valve 493 is arranged on the first liquid inlet pipe 410, and the second valve 494 can be arranged on the first liquid outlet pipe 420. When any one of the liquid separation device 400, the first liquid cooling device 500 and the second liquid cooling device leaks, the first valve 493 and the second valve 494 can be closed to stop the flow of the liquid-cooling medium and prevent the liquid-cooling medium from continuing to flow into the liquid separation device 400, the first liquid cooling device 500 and the second liquid cooling device, causing the server node or the server node below it to be soaked in the liquid-cooling medium and damaged / shut down; optionally, the server node can also send an alarm signal to the monitoring center to facilitate maintenance personnel to maintain the server node 300 in a timely manner.

[0103] For example, the first valve 493 may be an electromagnetic shut-off valve, and the second valve 494 may be an electromagnetic shut-off valve.

[0104] Please refer to Figures 6 and 7. In some embodiments, the liquid separating device 400 further includes a guide column 490, one end of which is connected to the side of the liquid separator 430 facing the first side 3101, wherein the guide column 490 extends along the first direction F1, and the first direction F1 is the direction from the first side 3101 to the second side 3102.

[0105] FIG8 is a structural diagram of the first liquid cooling device 500 in FIG5 .

[0106] 8 , the first liquid cooling device 500 includes a guide portion 510 . The guide portion 510 includes a guide surface 511 facing the second side 3102 . A guide hole 512 is defined on the guide surface.

[0107] When the first sub-node 320 is installed in the chassis 310 through the installation opening 3103 , the guide post 490 is inserted into the guide hole 512 .

[0108] For example, the guide portion 510 is located outside the first box body 321 .

[0109] For example, the guide hole 512 may extend along a first direction F1 , and the first direction F1 may be parallel to the Y direction.

[0110] The number of guide posts 490 can be the same as the number of guide holes 512. The number of guide holes 512 can be one or more, and in the embodiment of the present application, the number of guide holes 512 is not limited. For example, the number of guide holes 512 is 2.

[0111] When the first sub-node 320 is installed in the chassis 310 through the installation opening 3103 , the plurality of guide posts 490 are respectively inserted into the plurality of guide holes 512 .

[0112] When the first subnode 320 is installed in the chassis 310 through the installation port 3103, the guide post 490 can enter the guide hole 512. At this time, the guide hole 512 can limit the movement direction of the guide post 490, thereby limiting the movement direction of the first subnode 320 where the liquid separation device 400 is located, reducing the deviation caused by the movement direction of the first subnode 320. If the movement direction of the first subnode 320 is offset, it will cause the first liquid inlet end 5001 and the first liquid inlet connector 440 to deviate from the alignment, thereby causing the first liquid inlet end 5001 and the first liquid inlet connector 440 to be unreliable connected, and the first liquid outlet end 5002 and the first liquid outlet connector 450 to be unreliable connected, thereby causing leakage. Therefore, by setting the guide hole 512 to limit the movement direction of the guide post 490, leakage can be prevented.

[0113] FIG9 is a simplified structural diagram of the first liquid cooling device 500 in FIG8 .

[0114] 8 and 9 , in some embodiments, the first liquid cooling device 500 includes a liquid inlet manifold 520 , a liquid outlet manifold 530 , and a plurality of first liquid cooling components 540 .

[0115] The first liquid inlet end 5001 is located at one end of the liquid inlet manifold 520 , which is provided with a plurality of first interfaces 521 . The first liquid outlet end 5002 is located at one end of the liquid outlet manifold 530 , which is provided with a plurality of second interfaces 531 .

[0116] One end of the first liquid cooling component 540 is connected to a first interface 521 , and the other end is connected to a second interface 531 . The first liquid cooling component 540 is used to dissipate heat for the first device to be cooled in the first sub-node 320 .

[0117] For example, the liquid inlet manifold 520 and the liquid outlet manifold 530 may extend along the X direction, and the liquid inlet manifold 520 and the liquid outlet manifold 530 may be stacked in the Z direction.

[0118] The first liquid cooling device 500 may further include a second liquid inlet connector 550 and a second liquid outlet connector 560. The second liquid inlet connector 550 is disposed on the first liquid inlet end 5001 and can interface with the first liquid inlet connector 440. The second liquid outlet connector 560 is disposed on the first liquid outlet end 5002 and can interface with the first liquid outlet connector 450. The guide portion 510 may be located between the second liquid inlet connector 550 and the second liquid outlet connector 560.

[0119] Part of the surface of the first liquid cooling component 540 may be in contact with the first device to be cooled, so that the liquid cooling medium flowing through the first liquid cooling component may absorb the heat of the first device to be cooled.

[0120] Both ends of the first liquid cooling assembly 540 are connected to the first interface 521 and the second interface 531 respectively, so that the liquid cooling medium in the liquid inlet manifold 520 can enter the first liquid cooling assembly 540 and flow from the first liquid cooling assembly 540 into the liquid outlet manifold 530 .

[0121] Referring to Figure 9, in some embodiments, the first liquid cooling assembly 540 includes a liquid inlet connecting pipe 541, a liquid outlet connecting pipe 542, and a liquid cooling plate 543. Liquid cooling channels are provided within the liquid cooling plate 543. One end of the liquid inlet connecting pipe 541 is connected to one end of the liquid cooling channel, and the other end is connected to a first interface 521. One end of the liquid outlet connecting pipe 542 is connected to the other end of the liquid cooling channel, and the other end of the liquid outlet connecting pipe 542 is connected to a second interface 531. The liquid cooling plate 543 is configured to contact the surface of the first component to be cooled in the first subnode 320.

[0122] The surface of the liquid cooling plate 543 may be in contact with the surface of the first component to be cooled, so that the liquid cooling plate 543 can absorb the heat of the first component to be cooled.

[0123] The liquid cooling medium may enter the liquid inlet connecting pipe 541 and the liquid cooling plate 543 in sequence from the liquid inlet manifold 520 , and then flow out from the liquid outlet connecting pipe 542 and enter the liquid outlet manifold 530 .

[0124] In some embodiments, in multiple first liquid cooling assemblies 540, the liquid coolant in the liquid inlet manifold 520 enters the multiple liquid cooling plates 543 through multiple liquid inlet connecting pipes 541. Therefore, when the liquid coolant enters the liquid cooling channels within the liquid cooling plates 543, the liquid pressure drop is approximately equal. Therefore, the heat dissipation effect of each liquid cooling plate 543 is approximately the same, which is conducive to improving the heat dissipation uniformity of the first liquid cooling assembly 540. The liquid pressure drop can also be called flow resistance.

[0125] The number of first liquid-cooling assemblies 540 can be the same as the number of first components to be cooled. For example, the number of first components to be cooled can be multiple. For example, if the number of first components to be cooled is 8, the number of first liquid-cooling assemblies 540 can be 8. Of course, the number of first components to be cooled can also be more or less, for example, 9, 10, 11, or 12. In the embodiments of this application, these are not listed one by one.

[0126] Furthermore, in some other embodiments, the liquid inlet connecting tube 541 and the liquid outlet connecting tube 542 may also be made of a hard material, such as a metal material such as Cu. If the liquid inlet connecting tube 541 and the liquid outlet connecting tube 542 are copper tubes, the liquid inlet connecting tube 541 and the liquid cooling plate 543 can be welded, and the liquid outlet connecting tube 542 and the liquid cooling plate 543 can be welded.

[0127] FIG10 is another structural diagram of the first liquid cooling device 500 in FIG5 , and FIG11 is a simplified structural diagram of the first liquid cooling device 500 in FIG10 .

[0128] Unlike the first liquid cooling device 500 shown in FIG8 , referring to FIG10 and FIG11 , in some embodiments, the first liquid cooling assembly 540 includes a liquid inlet connecting pipe 541, a liquid outlet connecting pipe 542, and multiple liquid cooling plates 543. Liquid cooling channels are provided within the liquid cooling plates 543, and the liquid cooling channels of the multiple liquid cooling plates 543 are connected in parallel. One end of the liquid inlet connecting pipe 541 is connected to a first interface 521, and the liquid inlet connecting pipe 541 is connected to one end of the liquid cooling channels of the multiple liquid cooling plates 543. One end of the liquid outlet connecting pipe 542 is connected to a second interface 531, and the other end of the liquid cooling channels of the multiple liquid cooling plates 543 are connected.

[0129] The liquid cooling medium in the liquid inlet manifold 520 can enter the liquid inlet connecting pipe 541 , and the liquid cooling medium in the liquid inlet connecting pipe 541 can be divided into multiple streams and enter the liquid cooling channels of the multiple liquid cooling plates 543 respectively.

[0130] The liquid cooling medium in the liquid cooling channels of the plurality of liquid cooling plates 543 may all flow into the liquid outlet connecting pipe 542 and flow out from the liquid outlet connecting pipe 542 .

[0131] Among them, multiple liquid cooling plates 543 can introduce liquid cooling medium from the liquid inlet manifold 520 through the liquid inlet connecting pipe 541, and the liquid cooling medium in multiple liquid cooling plates 543 can be discharged into the liquid outlet manifold 530 through the liquid outlet connecting pipe 542, thereby reducing the number of connecting pipes set in the first liquid cooling component 540, thereby improving the neatness of the pipe layout of the first liquid cooling device 500.

[0132] Among them, in the first liquid cooling component 540, the number of liquid cooling plates 543 can be 2, 3, 4 or even more, which are not listed here one by one. In Figures 10 and 11, the embodiment of the present application is illustrated by taking the first liquid cooling component 540 including 2 liquid cooling plates 543 as an example.

[0133] Referring to FIG. 10 , the plurality of liquid cooling plates 543 in the first liquid cooling assembly 540 may be sequentially arranged along the Y direction.

[0134] In some examples, there may be multiple first liquid cooling assemblies 540 , for example, 2, 3, 4, 5, 6, etc. In FIG10 , some embodiments of the present application are illustrated with four first liquid cooling assemblies 540 .

[0135] The plurality of first liquid cooling components 540 are sequentially arranged along the X direction, and the liquid cooling plates 543 in the plurality of first liquid cooling components 540 are sequentially arranged along the X direction.

[0136] Please continue to refer to Figures 10 and 11. In some examples, the first liquid cooling device 500 may further include a tee pipe, the liquid inlet connecting pipe 541 may be connected to a portion of the liquid cooling plate 543 through the tee pipe, and the liquid outlet connecting pipe 542 may be connected to a portion of the liquid cooling plate 543 through the tee pipe.

[0137] In some examples, the liquid inlet connecting tube 541 can be a hose, thereby reducing the rigid connection between the liquid inlet manifold 520 and the liquid cooling plate 543, thereby reducing the assembly stress between the liquid inlet connecting tube 541 and the liquid inlet manifold 520 and between the liquid inlet connecting tube 541 and the liquid cooling plate 543, and at the same time, relaxing the length tolerance requirement of the liquid inlet connecting tube 541, which is beneficial to production and assembly.

[0138] The liquid outlet connecting pipe 542 can be a hose, which can reduce the rigid connection between the liquid inlet manifold 520 and the liquid cooling plate 543, thereby reducing the assembly stress between the liquid outlet connecting pipe 542 and the liquid outlet manifold 530 and between the liquid outlet connecting pipe 542 and the liquid cooling plate 543, and at the same time relax the length tolerance requirement of the liquid outlet connecting pipe 542, which is conducive to production and assembly.

[0139] In addition, if the first heat dissipation device fails and requires repair or replacement, the liquid cooling plate 543 can be removed to perform independent maintenance on the first heat dissipation device. If the liquid inlet and outlet connecting pipes 541 and 542 are flexible pipes, maintenance personnel can easily remove the liquid inlet and outlet connecting pipes 541 and 542 on-site, thereby facilitating rapid maintenance of the first heat dissipation device.

[0140] FIG12 is another structural diagram of the first liquid cooling device 500 according to some embodiments. It should be noted that the first liquid cooling component 540 of the first liquid cooling device 500 is not shown in FIG12 .

[0141] Referring to Figures 10 and 12, in some embodiments, the first liquid cooling device 500 further includes at least one second liquid cooling component 570, one end of the second liquid cooling component 570 is connected to a first interface 521, and the other end is connected to a second interface 531, and the second liquid cooling component 570 is used to dissipate heat for the third device to be cooled of the first sub-node 320, wherein the third device to be cooled is a switching chip.

[0142] For example, the third component to be cooled may be a switch chip. The second liquid cooling assembly 570 can be provided to dissipate heat for the third component to be cooled.

[0143] In some examples, the second liquid cooling assembly includes a liquid inlet connecting pipe 571, a liquid outlet connecting pipe 572 and a group of liquid cooling heat sinks 573X, wherein the group of liquid cooling heat sinks 573X includes multiple liquid cooling heat sinks 573, and liquid cooling pipes are formed in the liquid cooling heat sinks 573.

[0144] In a group of liquid-cooled heat sinks 573X, the liquid cooling pipes of multiple liquid-cooled heat sinks 573 are connected end to end.

[0145] One end of the liquid inlet connecting pipe 571 is connected to a first interface 521, the other end of the liquid inlet connecting pipe 571 is connected to the head end of the liquid cooling pipe of the liquid cooling heat sink 573 located at the first position in a group of liquid cooling heat sinks 573X, one end of the liquid outlet connecting pipe 572 is connected to the tail end of the liquid cooling pipe of the liquid cooling heat sink 573 located at the tail position in a group of liquid cooling heat sinks 573X, and the other end of the liquid outlet connecting pipe 572 is connected to a second interface 531.

[0146] Among them, the number of liquid-cooled heat sinks 573 in a group of liquid-cooled heat sinks 573X can be 2, 3, 4, 5, or even more. In Figures 10 and 12, taking a group of liquid-cooled heat sinks 573X including 3 liquid-cooled heat sinks 573 as an example, some embodiments of the present application are illustrated.

[0147] For example, the three liquid-cooled heat sinks 573 are respectively a first liquid-cooled heat sink 573A, a second liquid-cooled heat sink 573B, and a third liquid-cooled heat sink 573C, wherein the first liquid-cooled heat sink 573A is the first liquid-cooled heat sink 573, and the third liquid-cooled heat sink 573C is the last liquid-cooled heat sink 573.

[0148] Among them, "the liquid cooling pipes of multiple liquid cooling heat sinks 573 are connected end to end" means that the tail end of the first liquid cooling heat sink 573A is connected to the head end of the second liquid cooling heat sink 573B, and the tail end of the second liquid cooling heat sink 573B is connected to the head end of the third liquid cooling heat sink 573C.

[0149] For example, the second liquid cooling assembly 570 may further include multiple connecting pipes. In a set of liquid cooling heat sinks 573X, the liquid cooling pipes of two adjacent liquid cooling heat sinks 573 may be connected via connecting pipes. In this case, the tail end of the first liquid cooling heat sink 573A is connected to the head end of the second liquid cooling heat sink 573B via a connecting pipe, and the tail end of the second liquid cooling heat sink 573B is connected to the head end of the third liquid cooling heat sink 573C via a connecting pipe.

[0150] For example, the connecting pipe can be a hose or a hard pipe. In the embodiment of the present application, there is no limitation on the material of the connecting pipe.

[0151] The head end of the first liquid cooling heat sink 573A is connected to the end of the liquid inlet connecting pipe 571 away from the liquid inlet manifold 520, and the tail end of the third liquid cooling heat sink 573C is connected to the end of the liquid outlet connecting pipe 572 away from the liquid outlet manifold 530.

[0152] In some examples, the second liquid cooling assembly includes two groups of second liquid cooling assemblies 570 , wherein, as shown in FIG. 10 , the plurality of liquid cooling heat sinks 573 in the two groups of second liquid cooling assemblies 570 are alternately arranged along the X direction.

[0153] For example, the liquid inlet manifold 520 , the liquid cooling heat sink 573 and the plurality of liquid cooling plates 543 in the first liquid cooling assembly 540 may be sequentially arranged along the Y direction.

[0154] FIG13 is another structural diagram of the server node 300 according to some embodiments of the present application.

[0155] Referring to FIG. 13 , in some embodiments, the first sub-node 320 includes a first connector 322 and a first box 321 . The first connector 322 is disposed at an end of the first box 321 away from the first side 3101 .

[0156] The second sub-node 340 includes a second connector 342 and a second box 341 . The second connector 342 is disposed at an end of the second box 341 away from the first side 3101 .

[0157] The server node 300 also includes a backplane 370, which includes a circuit board 371 and a third connector 372 and a fourth connector 373 arranged on the circuit board 371, wherein the circuit board 371 is perpendicular to the second direction F2, the third connector 372 is docked with the first connector 322, and the fourth connector 373 is electrically connected to the second connector 342 via a cable 380.

[0158] Among them, the first sub-node 320 can be electrically connected or optically connected (for example, optical fiber) to the third connector 372 through the first connector 322, and the second sub-node 340 can be electrically connected to the fourth connector 373 through the second connector 342 and the cable 380, and the circuit board 371 is provided with a conductive line connected between the third connector 372 and the fourth connector 373, so that the first sub-node 320 and the second sub-node 340 can be electrically connected, and then the first sub-node 320 and the second sub-node 340 can communicate.

[0159] Because the backplane 370 is adjacent to the first subnode 320 and the second subnode 340 is stacked on the first subnode 320, the backplane 370 is closer to the second connector 342 of the second subnode 340, thereby reducing the length of the cable 380 and, in turn, shortening the signal transmission link, thereby increasing the transmission rate and reducing signal loss. Furthermore, the third connector 372 directly interfaces with the first connector 322, thereby shortening the signal transmission link between the first subnode 320 and the circuit board 371, thereby reducing signal loss.

[0160] The above description is merely a specific embodiment of the present application, but the scope of protection of the present application is not limited thereto. Any changes or substitutions that a person skilled in the art can conceive within the technical scope disclosed in this application should be included within the scope of protection of the present application. Therefore, the scope of protection of the present application should be based on the scope of protection of the claims.

Claims

1. A server node, characterized in that: include: Chassis; A first subnode and a first liquid cooling device disposed in the first subnode, wherein the first liquid cooling device comprises a first liquid inlet end and a first liquid outlet end; A second subnode and a second liquid cooling device disposed in the second subnode, wherein the second liquid cooling device includes a second liquid inlet and a second liquid outlet; A liquid dispensing device is arranged in the chassis; the liquid dispensing device comprises: a support, a first liquid inlet pipe, a first liquid outlet pipe, a liquid dispenser, a first liquid inlet joint, a first liquid outlet joint, a liquid dispensing inlet pipe, a liquid dispensing outlet pipe, a first joint and a second joint, wherein the first liquid inlet pipe, the first liquid outlet pipe, the liquid dispenser, the liquid dispensing inlet pipe and the liquid dispensing outlet pipe are all connected to the support; wherein the first liquid inlet pipe is used to input a liquid cooling medium, and the first liquid outlet pipe is used to output a liquid cooling medium; The first liquid inlet pipe is connected to the first liquid inlet joint and the liquid separation liquid inlet pipe through the liquid distributor, and the first liquid outlet pipe is connected to the first liquid outlet joint and the liquid separation liquid outlet pipe through the liquid distributor; The first liquid inlet connector is connected to the first liquid inlet end, and the first liquid outlet connector is connected to the first liquid outlet end; The first connector is disposed at an end of the liquid dispensing inlet pipe away from the liquid dispenser, and the first connector is connected to the second liquid inlet end; The second connector is disposed at an end of the liquid dispensing outlet pipe away from the liquid dispenser, and the second connector is connected to the second liquid outlet end.

2. The server node according to claim 1, characterized in that: The chassis comprises a first side and a second side which are arranged opposite to each other, and the first side is provided with an installation opening, and the first sub-node is installed in the chassis through the installation opening, wherein the direction from the first side to the second side is a first direction; The first sub-node and the second sub-node are stacked in sequence along a second direction; The liquid separation device is located on one side of the first subnode in a third direction, wherein the third direction intersects with the second direction and the first direction.

3. The server node according to claim 2, characterized in that: The first liquid inlet end and the first liquid outlet end are both facing the second side, and the first liquid inlet connector and the first liquid outlet connector are both facing the first side, wherein, when the first sub-node is installed in the chassis through the mounting port, the first liquid inlet connector is docked with the first liquid inlet end, and the first liquid outlet connector is docked with the first liquid outlet end.

4. The server node according to claim 2, characterized in that: The liquid dispensing device further comprises a guide column, one end of which is connected to a side of the liquid dispenser facing the first side, wherein the guide column extends along a first direction, and the first direction is a direction from the first side to the second side; The first liquid cooling device comprises a guide portion, the guide portion comprises a guide surface, the guide surface faces the second side, and a guide hole is arranged on the guide surface; Wherein, when the first sub-node is installed in the chassis through the installation opening, the guide column is inserted into the guide hole.

5. The server node according to any one of claims 1 to 4, characterized in that: The first liquid cooling device includes a liquid inlet manifold, a liquid outlet manifold and a plurality of first liquid cooling components; The first liquid inlet end is located at one end of the liquid inlet manifold, and the liquid inlet manifold is provided with a plurality of first interfaces; The first liquid outlet is located at one end of the liquid outlet manifold, and the liquid outlet manifold is provided with a plurality of second interfaces; One end of the first liquid cooling component is connected to one of the first interfaces, and the other end is connected to one of the second interfaces. The first liquid cooling component is used to dissipate heat for a first device to be cooled of the first sub-node.

6. The server node according to claim 5, characterized in that: The first liquid cooling component includes a liquid inlet connecting pipe, a liquid cooling plate and a liquid outlet connecting pipe, wherein a liquid cooling channel is provided in the liquid cooling plate, one end of the liquid inlet connecting pipe is connected to one end of the liquid cooling channel, the other end of the liquid inlet connecting pipe is connected to one of the first interfaces, one end of the liquid outlet connecting pipe is connected to the other end of the liquid cooling channel, and the other end of the liquid outlet connecting pipe is connected to one of the second interfaces; The liquid cooling plate is used to contact the surface of the first device to be cooled by the first sub-node.

7. The server node according to claim 5, characterized in that: The first liquid cooling component includes a liquid inlet connecting pipe, a plurality of liquid cooling plates and a liquid outlet connecting pipe; a liquid cooling channel is provided in the liquid cooling plate, and the liquid cooling channels of the plurality of liquid cooling plates are connected in parallel; One end of the liquid inlet connecting pipe is connected to one of the first interfaces, and the liquid inlet connecting pipe is connected to one end of the liquid cooling channels of the plurality of liquid cooling plates; One end of the liquid outlet connecting pipe is connected to one of the second interfaces, and the other end of the liquid outlet connecting pipe is connected to the liquid cooling channels of the plurality of liquid cooling plates.

8. The server node according to any one of claims 5 to 7, characterized in that: The first liquid cooling device also includes at least one second liquid cooling component, one end of the second liquid cooling component is connected to one of the first interfaces, and the other end is connected to one of the second interfaces, and the second liquid cooling component is used to dissipate heat for a third device to be cooled of the first sub-node, wherein the third device to be cooled is a switching chip.

9. The server node according to any one of claims 2 to 8, characterized in that: The first subnode includes a first connector and a first box, wherein the first connector is disposed at an end of the first box away from the first side; The second sub-node includes a second connector and a second box, and the second connector is arranged at an end of the second box away from the first side; The server node also includes a backplane, which includes a circuit board and a third connector and a fourth connector arranged on the circuit board, wherein the circuit board is perpendicular to the second direction, the third connector is docked with the first connector, and the fourth connector is electrically connected to the second connector through a cable.

10. A server, characterized in that: A cabinet, wherein a receiving space is formed in the cabinet; A plurality of server nodes as described in any one of claims 1-9, wherein the plurality of server nodes are arranged in the accommodation space.

11. The server according to claim 10, characterized in that: Also includes: Liquid inlet pipe and liquid return pipe; Wherein, the liquid inlet pipe is connected to an end of the first liquid inlet pipe of the server node away from the liquid distributor, and the liquid inlet pipe is used to input liquid cooling medium; The liquid return pipe is connected to an end of the first liquid outlet pipe of the server node away from the liquid distributor.

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