Modular design-based chip packaging method and system

Abstract

Disclosed in the present invention are a modular design-based chip packaging method and system. The modular design-based chip packaging system comprises a control terminal module, and further comprises: an information acquisition module used for acquiring parameter information of a target chip of packaging, and storing the parameter information into a memory; a device detection module used for detecting the types, models and production capacities of chip packaging devices and the positional relationship between the chip packaging devices, to list executable packaging processes; a design module used for matching parameter information of the chip packaging devices with the parameter information of the target chip to design steps of a packaging process for the target chip; and an adjustment and optimization module used for changing, on the basis of a production result of small-batch production, one or more production parameters to optimize the chip packaging devices, and recording the production parameters and the production result of each optimization into the memory. The system has the advantages of flexibility, high efficiency, data sharing, convenience in maintenance, and convenience in adjustment.

Description

A chip packaging method and system based on modular design Technical Field

[0001] The present invention belongs to the technical field of chip packaging, and in particular relates to a chip packaging method and system based on modular design. Background Art

[0002] The Chinese invention patent with publication (announcement) number CN115600539A discloses a chip packaging modular design method and system. The invention relates to the field of chip packaging technology, and specifically to a chip packaging modular design method and system, including: a control terminal, which is the main control end of the system and is used to issue execution commands; an acquisition module, which is used to acquire the attribute characteristics of the packaged target chip; an analysis module, which is used to analyze the executable functions of the chip packaging equipment; a configuration module, which is used to obtain the attribute characteristics of the packaged target chip stored in the storage unit and the executable functions of the chip packaging equipment analyzed in the analysis module, and adaptively configure the attribute characteristics of the packaged target chip and the executable functions of the chip packaging equipment; the present invention can be configured according to the attribute characteristics of the chip and the functions of the chip packaging equipment, and further generate an operation module of the chip packaging equipment according to the configuration, so as to control the operation of the chip packaging equipment with the generated operation module, so as to meet the demand that the chip packaging equipment is intelligently controlled to package and process various types of chips.

[0003] The problems with this existing technology are: on the one hand, it lacks flexibility, efficiency, data sharing and convenient maintenance; on the other hand, when the processing requirements change, it needs to be re-debugged, which is inconvenient.

[0004] Summary of the Invention

[0005] In response to the problems existing in the prior art, the present invention provides a chip packaging method and system based on modular design, which has the advantages of flexibility, high efficiency, data sharing and convenient maintenance, and is easy to debug, thereby solving the problems in the prior art.

[0006] The present invention is implemented as follows: a chip packaging system based on a modular design includes a control terminal module as the main control terminal of the system, which is used to issue execution commands and control the operation of the entire system, and also includes:

[0007] An information acquisition module is used to obtain parameter information of the packaged target chip and store it in a memory;

[0008] The equipment detection module is used to detect the type, model, production capacity and location relationship of chip packaging equipment, and list the executable packaging processes;

[0009] The design module matches the parameter information of the chip packaging equipment and the target chip and designs the process steps for packaging the target chip. The debugging and optimization module changes one or more production parameters to optimize the chip packaging equipment based on the production results of small batch production, and records the production parameters and production results of each optimization into the memory.

[0010] Product testing module, used to test product quality.

[0011] As a preferred embodiment of the present invention, the information acquisition module includes:

[0012] The sensor acquisition unit automatically collects parameter information of the target chip through the sensor;

[0013] A measurement input unit, for manually inputting parameter information of the target chip through a measurement device;

[0014] The parameter input unit is used to directly input the parameter information of the target chip, and manually input the parameter information into the information acquisition module according to the detailed parameters provided by the target chip supplier;

[0015] A parameter processing unit processes and verifies the collected or input target chip parameters;

[0016] A storage unit, used to store the processed target chip parameter information in a memory;

[0017] The query and management unit queries and manages the stored parameter information of the target chip. By providing a user interface or interface, it allows users to query and obtain the parameter information of the target chip according to specific conditions, and perform management, backup or export operations.

[0018] As a preferred embodiment of the present invention, the parameter information of the target chip includes the following parameters: size and package type, pin configuration and quantity, heat dissipation requirements, electrical characteristics, environmental requirements and reliability indicators.

[0019] As a preferred embodiment of the present invention, the device detection module includes the following units:

[0020] Device identification unit, used to identify the type and model of chip packaging equipment;

[0021] The capacity detection unit estimates the equipment's capacity by recording its production cycle and speed, and stores this information in the system for subsequent query and analysis;

[0022] A positioning detection unit, used to detect the position relationship of the device;

[0023] The process matching unit is used to match the executable packaging process according to the type, model and location relationship of the equipment;

[0024] The process standard unit is used to list the process standards that match the equipment and provide process standard information on corresponding process parameters and processing accuracy requirements based on the equipment capabilities and limitations to ensure the quality and consistency of the packaging process.

[0025] As preferred embodiment of the present invention, the design module includes the following units:

[0026] A device parameter matching unit is used to match the parameter information of the chip packaging device according to the device's capabilities, constraints, and the requirements of the target chip;

[0027] A target chip parameter analysis unit, used for analyzing parameter information of the target chip;

[0028] The process design unit is used to design appropriate process steps based on the equipment parameter matching results and target chip parameter analysis results, combined with the packaging process requirements;

[0029] The process verification unit is used to verify the feasibility and effectiveness of the process design. Through simulation or actual operation, it verifies whether the designed process steps meet the packaging requirements of the target chip and makes necessary adjustments and optimizations.

[0030] The process step generation unit is used to generate the process steps for target chip packaging, convert the verified process design results into specific process steps, including process parameter settings and operation instructions, and save them for subsequent use.

[0031] As a preferred embodiment of the present invention, the debugging and optimization module includes:

[0032] The production result analysis unit is used to analyze the results of small-batch production. By collecting and counting key indicators in the production process, the production effect is analyzed and whether the requirements are met is evaluated;

[0033] The parameter adjustment unit is used to adjust production parameters to optimize chip packaging equipment. It adjusts relevant production parameters based on the feedback information from production result analysis and the capabilities and limitations of the equipment.

[0034] The optimization strategy generation unit is used to generate corresponding optimization strategies based on production result analysis and parameter adjustment, including specific adjustment plans, target settings and execution steps;

[0035] Parameter recording and storage unit, used to record the production parameters and production results of each optimization, and save them in the memory, and record the parameter changes and corresponding production results during the debugging process for subsequent backtracking and reference;

[0036] The parameter retrieval and optimization unit is used to retrieve similar production parameters and production results according to the requirements of production results, and optimize on this basis.

[0037] As a preferred embodiment of the present invention, a modular process docking module is further included for associating several chip packaging systems based on modular design. When one factory is unable to process a certain process, and the production capacity of the process is surplus in another factory, process docking can be performed.

[0038] As a preferred embodiment of the present invention, an order module is further included, in which the purchaser places an order and the factory receives the order.

[0039] As a preferred embodiment of the present invention, the order module includes an order splitting unit for splitting an order into several sub-orders according to the processing procedures, and different factories can undertake different sub-orders;

[0040] Transportation optimization unit, used to reduce transportation costs between different sub-orders;

[0041] Responsibility division unit is used to determine the responsibility for non-conforming products in each process.

[0042] A chip packaging method based on modular design is also provided, comprising the following steps:

[0043] Step S1, obtaining parameter information of the packaged target chip and storing it in a memory;

[0044] Step S2, detecting the type, model, production capacity, and location of chip packaging equipment, and listing executable packaging processes;

[0045] Step S3, matching the parameter information of the chip packaging equipment and the target chip, and designing the process steps for packaging the target chip;

[0046] Step S4, according to the production results of the small batch production, changing one or more production parameters to optimize the chip packaging equipment, and recording the production parameters and production results of each optimization into a memory;

[0047] Step S5: testing the quality of the product.

[0048] Compared with the prior art, the present invention has the following beneficial effects:

[0049] 1. Flexibility and scalability: Through modular design, the system can add or replace individual functional modules as needed to adapt to different requirements and changes. For example, more equipment detection modules or product detection modules can be added according to actual conditions.

[0050] 2. Efficiency and Accuracy: Each module focuses on a specific task, improving the system's execution efficiency and accuracy. The control terminal module is responsible for issuing commands and operating control for the entire system. The information acquisition module is responsible for acquiring and storing target chip parameter information. The design module is responsible for matching parameters and designing process steps. The debugging and optimization module optimizes based on production results. The product inspection module is responsible for ensuring product quality.

[0051] 3. Data sharing and reference: Data and information can be shared between modules. For example, the equipment information provided by the equipment detection module can be used by the design module, and the optimization records can also be used as a reference for subsequent optimization processes. This can improve efficiency and consistency and avoid duplication of work.

[0052] 4. Fault isolation and easy maintenance: Due to the modularity of the system, when a module fails, it can be repaired or replaced independently without affecting the operation of the entire system. This helps to quickly resolve the problem and reduce downtime.

[0053] 5. Data recording and backtracking: By recording the production parameters and results of each optimization into the memory, data backtracking and analysis can be performed to understand the system performance and the effect of the improvement, which is very important for continuous improvement debugging and quality control. BRIEF DESCRIPTION OF THE DRAWINGS

[0054] FIG1 is a schematic block diagram of a chip packaging system based on a modular design according to an embodiment of the present invention;

[0055] 2 is a schematic block diagram of a detailed information acquisition module of a chip packaging system based on a modular design according to an embodiment of the present invention;

[0056] 3 is a schematic block diagram of a detailed device detection module of a chip packaging system based on a modular design according to an embodiment of the present invention;

[0057] 4 is a second schematic block diagram of a detailed device detection module of a chip packaging system based on a modular design according to an embodiment of the present invention;

[0058] 5 is a schematic block diagram of the detailed design modules of a chip packaging system based on modular design according to an embodiment of the present invention;

[0059] 6 is a schematic block diagram of a chip packaging system based on a modular design and detailed optimization module according to an embodiment of the present invention;

[0060] 7 is a schematic block diagram of a modular process docking module of a chip packaging system based on modular design provided by an embodiment of the present invention;

[0061] 8 is a schematic block diagram of a chip packaging system with an order module based on a modular design according to an embodiment of the present invention;

[0062] FIG9 is a flowchart of a chip packaging method based on modular design according to an embodiment of the present invention. DETAILED DESCRIPTION

[0063] In order to further understand the content, features and effects of the present invention, the following embodiments are given as examples and described in detail with reference to the accompanying drawings.

[0064] The structure of the present invention is described in detail below with reference to the accompanying drawings.

[0065] Referring to FIG1 , a modular chip packaging system according to an embodiment of the present invention includes a control terminal module, which serves as the main control terminal of the system and is used to issue execution commands and control the operation of the entire system. The system also includes:

[0066] An information acquisition module is used to obtain parameter information of the packaged target chip and store it in a memory;

[0067] The equipment detection module is used to detect the type, model, production capacity and location relationship of chip packaging equipment, and list the executable packaging processes (including the target chips that can be processed and the process standards that can be achieved, such as accuracy and even production capacity);

[0068] The design module matches the parameter information of the chip packaging equipment and the target chip and designs the process steps for packaging the target chip. The debugging and optimization module changes one or more production parameters to optimize the chip packaging equipment based on the production results of small batch production, and records the production parameters and production results of each optimization into the memory.

[0069] Product testing module, used to test product quality.

[0070] The chip packaging system based on modular design has the following benefits:

[0071] Flexibility and scalability: Through modular design, the system can add or replace individual functional modules as needed to adapt to different requirements and changes. For example, more equipment detection modules or product detection modules can be added according to actual conditions.

[0072] Efficiency and Accuracy: Each module focuses on a specific task, improving the system's execution efficiency and accuracy. The control terminal module is responsible for issuing commands and operating control for the entire system. The information acquisition module is responsible for acquiring and storing target chip parameter information. The design module is responsible for matching parameters and designing process steps. The debugging and optimization module optimizes based on production results. The product inspection module ensures product quality.

[0073] Data sharing and reference: Data and information can be shared between modules. For example, the equipment information provided by the equipment detection module can be used by the design module, and the optimization records can also be used as a reference for subsequent optimization processes. This can improve efficiency and consistency and avoid duplication of work.

[0074] Fault isolation and easy maintenance: Due to the modularity of the system, if a module fails, it can be repaired or replaced independently without affecting the operation of the entire system. This helps to quickly resolve the problem and reduce downtime.

[0075] Data recording and backtracking: By recording the production parameters and results of each optimization into the memory, data can be backtracked and analyzed to understand the system performance and the effect of improvement, which is very important for continuous improvement and quality control.

[0076] Overall, the chip packaging system based on modular design has the advantages of flexibility, high efficiency, data sharing and convenient maintenance, which can improve production efficiency, product quality and system reliability.

[0077] Referring to FIG2 , the information acquisition module includes:

[0078] The sensor acquisition unit automatically collects parameter information of the target chip through sensors; according to the characteristics and parameter requirements of the target chip, it selects suitable sensors for data acquisition, such as temperature sensors, humidity sensors, voltage sensors, etc.

[0079] The measurement input unit manually inputs the parameter information of the target chip through the measuring device; when there is no applicable sensor or manual intervention is required, the measuring instrument is used to measure the target chip and the measurement results are input into the information acquisition module.

[0080] The parameter input unit is used to directly input the parameter information of the target chip. According to the detailed parameters provided by the target chip supplier, the parameter information is manually input into the information acquisition module through a keyboard, mouse or other input devices.

[0081] The parameter processing unit processes and verifies the collected or input target chip parameters. This includes operations such as data verification, unit conversion, and range checking to ensure the accuracy and validity of the parameters.

[0082] The storage unit is used to store the processed target chip parameter information in memory. You can use internal memory, external memory, or cloud storage, and choose the appropriate storage device and solution according to your needs.

[0083] The query and management unit queries and manages the stored parameter information of the target chip. By providing a user interface or interface, it allows users to query and obtain the parameter information of the target chip according to specific conditions, and perform management, backup or export operations.

[0084] The above units can work together to form a complete information acquisition module. Through sensor acquisition, measurement input or parameter input, parameter processing and storage, the parameter information of the target chip is accurately recorded and saved for subsequent analysis, application and management.

[0085] Exemplarily, the parameter information of the target chip includes the following parameters: size and package type, pin configuration and quantity, heat dissipation requirements, electrical characteristics, environmental requirements, and reliability indicators.

[0086] Size and package type: Understand the size and package type of the chip, such as QFN, BGA, etc., to determine the appropriate package method. Among them, QFN is the abbreviation of Quad Flat No-leads, which means a four-sided pinless package. It is a common surface mount technology package. The QFN package has the advantages of small size, low cost and good heat dissipation performance, and is widely used in the field of integrated circuits. BGA is the abbreviation of Ball Grid Array, which means a ball grid array package, and is also a common surface mount technology package. The BGA package uses spherical pins arranged at the bottom of the chip to provide higher pin density and better electrical performance. The BGA package also has good thermal conductivity and reliability, and is suitable for high-speed, high-density integrated circuits.

[0087] Pin configuration and count: Understand the chip's pin configuration and count to ensure proper connections and layout.

[0088] Heat dissipation requirements: Understand the chip's heat dissipation requirements, including power consumption, maximum operating temperature, etc., to select appropriate heat dissipation design and packaging materials.

[0089] Electrical characteristics: Understand the electrical characteristics of the chip, such as operating voltage, current requirements, signal transmission rate, etc., to ensure that the packaging process will not affect the performance of the chip.

[0090] Environmental requirements: Understand the working environment requirements of the chip, such as anti-static, dust-proof, and moisture-proof levels, to select the appropriate packaging materials and packaging methods.

[0091] Reliability indicators: Understand the chip's reliability indicators, such as MTBF (mean time between failures) and failure rate, to select packaging processes and materials that meet the requirements. MTBF is the abbreviation for Mean Time Between Failures, which means the average time between failures. It is an indicator used to measure the reliability of a device or system, indicating the average number of failures between operating times under normal conditions of use. MTBF is usually expressed in hours and is calculated by dividing the sum of the observed failure times by the number of observed failures. A higher MTBF value indicates that the device or system has a lower failure rate, that is, it is more reliable.

[0092] Understanding these parameters can help packaging engineers select appropriate packaging technology and materials to ensure that the chip can work properly after packaging and meet performance and reliability requirements.

[0093] It should be noted that the information acquisition module can automatically collect information through sensors, or input parameters after measurement, or directly input parameters of the target chip (the target chip supplier usually provides detailed parameters of the target chip).

[0094] Referring to FIG3 , the device detection module includes the following units:

[0095] The device identification unit is used to identify the type and model of the chip packaging equipment. It uses automatic identification technology, such as barcode scanning or RFID, to obtain the device's unique identifier and thus determine the type and model of the device.

[0096] The capacity detection unit estimates the equipment's capacity by recording the equipment's production cycle and speed, and stores it in the system for subsequent query and analysis.

[0097] The positioning detection unit is used to detect the position relationship of the equipment. Indoor positioning technologies such as Wi-Fi positioning, Bluetooth positioning, or RFID positioning can be used to obtain the equipment's location information in real time to support subsequent process allocation and scheduling.

[0098] The process matching unit is used to match executable packaging processes based on the type, model, and location of the equipment. Based on the pre-defined process library and the equipment's capabilities and constraints, it selects the executable processes that match the equipment and presents them to the user.

[0099] The process standard unit is used to list the process standards that match the equipment and provide process standard information on corresponding process parameters and processing accuracy requirements based on the equipment capabilities and limitations to ensure the quality and consistency of the packaging process.

[0100] Through the collaboration of these units, the equipment detection module can detect the type, model, production capacity, and location of chip packaging equipment, and provide executable packaging procedures and related process standards. This helps optimize production scheduling, improve production efficiency, and ensure that the packaging process meets specifications and requirements.

[0101] 4 , the device detection module includes an order screening unit. That is, all devices are connected to the network, and unexecutable services can be directly excluded and used to screen orders.

[0102] Referring to FIG5 , the design module includes the following units:

[0103] The device parameter matching unit is used to match the parameter information of the chip packaging device, such as temperature range and size adaptation, according to the device's capabilities, constraints and the requirements of the target chip.

[0104] The target chip parameter analysis unit is used to analyze the parameter information of the target chip. By obtaining detailed parameters or other relevant information provided by the target chip supplier, it analyzes the chip's packaging requirements, process characteristics, etc.

[0105] The process design unit is used to design appropriate process steps, including welding, packaging, and testing, based on the equipment parameter matching results and target chip parameter analysis results, combined with the requirements of the packaging process.

[0106] The process verification unit is used to verify the feasibility and effectiveness of the process design. Through simulation or actual operation, it verifies whether the designed process steps meet the packaging requirements of the target chip and makes necessary adjustments and optimizations.

[0107] The process step generation unit is used to generate the process steps for target chip packaging, convert the verified process design results into specific process steps, including process parameter settings and operation instructions, and save them for subsequent use.

[0108] Through the collaboration of these units, the design module can match the chip packaging equipment and target chip parameter information, design process steps suitable for the target chip packaging, and perform verification and generation. This ensures that the packaging process matches the requirements of the target chip, improving production efficiency and product quality.

[0109] Referring to FIG6 , the debugging and optimization module includes:

[0110] The production result analysis unit is used to analyze the results of small-batch production. By collecting and counting key indicators in the production process, such as defective product rate, good product rate, production cycle, etc., it analyzes the production effect and evaluates whether it meets the requirements.

[0111] The parameter adjustment unit is used to adjust production parameters to optimize chip packaging equipment. Based on the feedback information from the production result analysis and combined with the equipment's capabilities and limitations, it adjusts relevant production parameters such as temperature, speed, pressure, etc.

[0112] The optimization strategy generation unit is used to generate corresponding optimization strategies based on production result analysis and parameter adjustment, including specific adjustment plans, target settings and execution steps.

[0113] The parameter recording and storage unit is used to record the production parameters and production results of each optimization and save them in the memory, and record the parameter changes and corresponding production results during the debugging process for subsequent backtracking and reference.

[0114] The parameter retrieval and optimization unit is used to retrieve similar production parameters and results based on the production result requirements and optimize them based on them. By comparing historical records with cases similar to the target requirements, it can quickly find feasible debugging solutions and improve debugging efficiency.

[0115] Through the collaboration of these units, the debugging and optimization module can adjust production parameters based on the results of small-batch production to optimize chip packaging equipment. By analyzing production results, adjusting parameters, and generating optimization strategies, the production process is continuously improved. The parameters and results of each optimization are recorded for subsequent query and reference. Furthermore, through parameter retrieval and optimization, historical experience can be leveraged to quickly identify optimization solutions for similar situations in new debugging tasks, improving debugging efficiency and accuracy.

[0116] Referring to FIG7 , it also includes a modular process docking module for associating several chip packaging systems based on modular design. When one factory cannot process a certain process, and another factory has surplus production capacity for the process, process docking can be performed.

[0117] In existing technology, if a chip packaging device is damaged or missing, the processing process cannot be carried out, which may cause the entire factory to stop production. However, this setting can prevent production stoppages and optimize the equipment's production capacity. Of course, whether to agree to this is still up to the person in charge.

[0118] 8 , it also includes an order module, in which buyers place orders and factories receive orders.

[0119] The order module includes an order splitting unit, which is used to split the order into several sub-orders according to the processing procedures. Different factories can undertake different sub-orders;

[0120] Transportation optimization unit, used to reduce transportation costs between different sub-orders;

[0121] Responsibility division unit is used to determine the responsibility for non-conforming products in each process.

[0122] Transport optimization units can be achieved by:

[0123] Route planning and optimization: Through transportation route planning and optimization algorithms, we select the best transportation path and method to reduce transportation costs. We take into account the location of different factories, order volume, and cargo characteristics to rationally arrange transportation plans.

[0124] Batch assembly and shipping: Adjacent or similar sub-orders are assembled and shipped in batches to reduce shipping times and costs. Orders are split into multiple sub-orders based on the processing steps using the order splitting unit. Based on the factory's capabilities and resources, sub-orders suitable for the same factory are batched together.

[0125] Supply Chain Collaboration: Establish a supply chain collaboration mechanism, including information sharing and coordination with suppliers and factories. Buyers place orders in the order module, and factories receive them there. This enables timely order delivery and processing, reducing communication costs and time delays, and improving overall efficiency.

[0126] Transportation method selection: Choose the appropriate transportation method, such as land, sea, or air, based on factors such as the characteristics of the goods, distance, and timeliness requirements. Compare the costs and timeliness of different transportation methods and choose the most economical and appropriate one.

[0127] Data analysis and optimization: Continuously optimize shipping strategies and order management processes by analyzing order and shipping cost data. Leverage data analysis tools and algorithms to identify potential cost savings and efficiency gains for continuous improvement.

[0128] The above measures can help solve transportation cost issues and order management problems, improve transportation efficiency, reduce costs, and ensure that orders can be delivered to buyers on time.

[0129] Furthermore, the responsibility division unit includes the following subunits:

[0130] Data Acquisition Subunit: This unit is responsible for collecting data related to product quality. It can use sensors, monitoring equipment, or manual input to obtain key production process data and quality indicator data.

[0131] Anomaly Monitoring Subunit: This unit is responsible for identifying anomalies in the production process. It monitors data in real time and applies simple rules or algorithms to detect anomalies such as exceeding thresholds or unusual trends.

[0132] The Problem Location Subunit is responsible for locating the process where defective products are likely to occur. Based on the output of the anomaly detection unit and process information from the production process, combined with empirical judgment or simple logical reasoning, it attempts to determine the process where the problem may have occurred.

[0133] Verification and Confirmation Subunit: This unit is responsible for verifying the accuracy of the process where the problem occurs. Through further observation, measurement, testing, or elimination of other possibilities, it is confirmed that the problem does occur in the specific process and the relevant information is recorded.

[0134] Responsibility Division Sub-Unit: This unit is responsible for allocating responsibilities based on the results of the Verification and Confirmation Unit. Based on pre-defined responsibility division rules, the number of quality issues and severity of each process are calculated to determine the proportion of responsibility for each process.

[0135] Feedback and Improvement Sub-Unit: This unit is responsible for providing feedback on issues and responsibilities to relevant personnel and promoting the implementation of improvement measures. Through timely communication, training, or the introduction of improvement measures, the defective product rate is reduced and overall quality levels are improved.

[0136] Importantly, when designing this low-cost responsibility-division module, it is important to consider simplifying the data collection and processing process, making the most of existing equipment and resources to reduce costs. If the cost of separate processing is higher than the cost of processing it all at one factory, the order splitting unit is not enabled.

[0137] 9 , the present invention further provides a chip packaging method based on modular design, comprising the following steps:

[0138] Step S1, obtaining parameter information of the packaged target chip and storing it in a memory;

[0139] Step S2, detecting the type, model, production capacity, and location of chip packaging equipment, and listing executable packaging processes;

[0140] Step S3, matching the parameter information of the chip packaging equipment and the target chip, and designing the process steps for packaging the target chip;

[0141] Step S4, according to the production results of the small batch production, changing one or more production parameters to optimize the chip packaging equipment, and recording the production parameters and production results of each optimization into a memory;

[0142] Step S5: testing the quality of the product.

[0143] Working principle of the present invention:

[0144] Through its modular design, the system can add or replace individual functional modules as needed to adapt to varying requirements and changes. For example, additional equipment detection modules or product detection modules can be added based on actual needs. Each module focuses on a specific task, improving system efficiency and accuracy. The control terminal module is responsible for issuing commands and operating control for the entire system. The information acquisition module acquires and stores target chip parameter information. The design module matches parameters and designs process steps. The debugging and optimization module performs optimization based on production results. The product detection module ensures product quality. Modules can share data and information. For example, the equipment detection module provides device information that can be used by the design module, and optimization records can be used as a reference for subsequent optimization processes. This improves efficiency and consistency and avoids duplication of effort. Due to the modular system, if a module fails, it can be repaired or replaced independently without affecting the operation of the entire system. This helps to quickly resolve problems and reduce downtime. By recording the production parameters and results of each optimization in memory, data can be backtracked and analyzed to understand system performance and the effectiveness of improvements, which is crucial for continuous improvement and quality control.

[0145] It should be noted that, in this document, relational terms such as first and second, etc., are used only to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship or order between these entities or operations. Moreover, the terms "comprises," "comprising," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that includes a list of elements includes not only those elements but also other elements not explicitly listed, or elements inherent to such process, method, article, or apparatus.

[0146] While embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions, and variations may be made to these embodiments without departing from the principles and spirit of the invention, and that the scope of the invention is defined by the appended claims and their equivalents.

Claims

1. A chip packaging system based on modular design includes a control terminal module, which serves as the main control end of the system and is used to issue execution commands and control the operation of the entire system, and is characterized in that: Also includes: An information acquisition module is used to acquire parameter information of the packaged target chip and store it in a memory; The equipment detection module is used to detect the type, model, production capacity and positional relationship of chip packaging equipment, and list the executable packaging processes; A design module matches the parameter information of the chip packaging equipment and the target chip, and designs the process steps of the target chip packaging; The debugging and optimization module changes one or more production parameters to optimize the chip packaging equipment according to the production results of the small batch production, and records the production parameters and production results of each optimization into the memory; Product testing module, used to test product quality; The information acquisition module includes: A sensor acquisition unit automatically acquires parameter information of the target chip through sensors; A measurement input unit, which manually inputs parameter information of the target chip through a measurement device; A parameter input unit is used to directly input parameter information of the target chip, and manually input the parameter information into the information acquisition module according to the detailed parameters provided by the target chip supplier; A parameter processing unit processes and verifies the collected or input target chip parameters; A storage unit, used to store the processed target chip parameter information in a memory; The query and management unit queries and manages the stored parameter information of the target chip. By providing a user interface or interface, it allows the user to query and obtain the parameter information of the target chip according to specific conditions, and perform management, backup or export operations.

2. The chip packaging system based on modular design as claimed in claim 1, characterized in that: The parameter information of the target chip includes the following parameters: size and package type, pin configuration and quantity, heat dissipation requirements, electrical characteristics, environmental requirements and reliability indicators.

3. The chip packaging system based on modular design as claimed in claim 1, characterized in that: The device detection module includes the following units: A device identification unit, used to identify the type and model of chip packaging equipment; The capacity detection unit estimates the equipment's capacity by recording the equipment's production cycle and speed, and stores it in the system for subsequent query and analysis; A positioning detection unit, used to detect the position relationship of the device; The process matching unit is used to match the executable packaging process according to the type, model and position relationship of the equipment; The process standard unit is used to list the process standards that match the equipment and provide corresponding process standards according to the equipment capabilities and constraints. The process parameters and processing accuracy requirements of the process standard information are collected to ensure the quality and consistency of the packaging process.

4. The chip packaging system based on modular design as claimed in claim 1, characterized in that: The design module includes the following units: A device parameter matching unit, used to match the parameter information of the chip packaging device according to the device's capabilities, restrictions and requirements of the target chip; A target chip parameter analysis unit, used for analyzing parameter information of the target chip; The process design unit is used to design appropriate process steps based on the equipment parameter matching results and the target chip parameter analysis results combined with the packaging process requirements; The process verification unit is used to verify the feasibility and effectiveness of the process design. Through simulation or actual operation, it verifies whether the designed process steps meet the packaging requirements of the target chip and makes necessary adjustments and optimizations. The process step generation unit is used to generate the process steps for target chip packaging, convert the verified process design results into specific process steps, including process parameter settings and operation instructions, and save them for subsequent use.

5. The chip packaging system based on modular design as claimed in claim 1, characterized in that: The debugging and optimization module includes: The production result analysis unit is used to analyze the results of small batch production. By collecting and counting the key indicators in the production process, the production effect is analyzed and whether the requirements are met; A parameter adjustment unit is used to adjust production parameters to optimize chip packaging equipment, and adjust relevant production parameters based on feedback information from production result analysis and combined with equipment capabilities and constraints; The optimization strategy generation unit is used to generate corresponding optimization strategies based on production result analysis and parameter adjustment, including specific adjustment plans, target settings and execution steps; The parameter recording and storage unit is used to record the production parameters and production results of each optimization and save them in the memory, and record the parameter changes and corresponding production results during the debugging process for subsequent tracing and reference; The parameter retrieval and optimization unit is used to retrieve similar production parameters and production results according to the requirements of production results, and optimize on this basis.

6. The chip packaging system based on modular design as claimed in claim 1, characterized in that: It also includes a modular process docking module, which is used to associate several chip packaging systems based on modular design. When one factory is unable to process a certain process, but there is surplus production capacity of the process in another factory, process docking can be performed.

7. The chip packaging system based on modular design as claimed in claim 1, characterized in that: It also includes an order module, in which the purchaser places an order and the factory receives the order.

8. The chip packaging system based on modular design as claimed in claim 7, characterized in that: The order module includes an order splitting unit, which is used to split an order into several sub-orders according to the processing procedures, and different factories can undertake different sub-orders; Transportation optimization unit, used to reduce transportation costs between different sub-orders; The responsibility division unit is used to determine the responsibility for non-conforming products in each process.

9. A chip packaging method based on modular design, characterized in that: The following steps are involved: Obtain parameter information of the packaged target chip and store it in a memory; Detect the type, model, production capacity, and location of chip packaging equipment, and list the executable packaging processes; Match the parameter information of the chip packaging equipment and the target chip, and design the process steps for packaging the target chip; According to the production results of the small batch production, one or more production parameters are changed to optimize the chip packaging equipment, and the production parameters and production results of each optimization are recorded in the memory; Check the quality of the product.

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