Server node and server

Abstract

Embodiments of the present application relate to the technical field of server nodes, and provide a server node and a server, used for reducing the liquid leakage risk. The server node comprises a case, a first child node, a liquid inlet pipe, a liquid outlet pipe, and a first liquid cooling device. The case comprises a first side and a second side arranged opposite to each other in a first direction; the first child node is mounted in the case, and the first child node comprises a first case body and a first device to be cooled arranged in the first case body; the liquid inlet pipe extends from the second side to the first side; the liquid outlet pipe extends from the second side to the first side; the first liquid cooling device comprises a first liquid inlet end and a first liquid outlet end; the first liquid inlet end and the first liquid outlet end are located on the side of the first case body close to the first side and located outside the first case body; the first liquid inlet end is connected to the end of the liquid inlet pipe located on the first side; and the first liquid outlet end is connected to the end of the liquid outlet pipe located on the first side. The server node is used for providing a computing service.

Description

Server nodes and servers

[0001] This application claims priority to the Chinese patent application filed with the State Intellectual Property Office on November 30, 2023, with application number 202311634012.5 and application name “Server Node and Server”, the entire contents of which are incorporated by reference into this application. Technical Field

[0002] The present application relates to the field of server technology, and in particular to a server node and a server. Background Art

[0003] Multiple server nodes can be installed in a cabinet, and in related technologies, a liquid cooling system can be used to dissipate heat for electronic devices in the server node. The server node may include a chassis and a liquid inlet connecting pipe, a liquid outlet connecting pipe, and a sub-node arranged in the chassis, a first sub-node, and a liquid cooling mechanism is also provided in the sub-node, and the liquid inlet connecting pipe and the liquid outlet connecting pipe are provided outside the sub-node. The liquid cooling mechanism includes two joints, and the two joints are located on the side of the sub-node close to the liquid inlet connecting pipe. Therefore, in the process of installing the sub-node into the chassis, the two joints of the first liquid cooling mechanism will be blindly connected to the liquid inlet connecting pipe and the liquid outlet connecting pipe, thereby causing the connection relationship between the two joints and the liquid inlet connecting pipe and the liquid outlet connecting pipe to be unreliable, increasing the risk of leakage.

[0004] Summary of the Invention

[0005] The embodiment of the present application aims to provide a server node and a server for increasing the reliability of the connection of a liquid cooling mechanism and reducing the risk of liquid leakage.

[0006] To achieve the above objectives, the embodiments of the present application provide the following technical solutions:

[0007] On the one hand, a server node is provided, which includes: a chassis, a first subnode, a liquid inlet pipe, a liquid outlet pipe, and a first liquid cooling device. The chassis includes a first side and a second side arranged opposite to each other in a first direction; the first subnode is installed in the chassis, the first subnode includes a first housing and a first heat dissipation device arranged in the first housing; the liquid inlet pipe extends from the second side to the first side; the liquid outlet pipe extends from the second side to the first side; the first liquid cooling device is used to dissipate heat for the first heat dissipation device, wherein the first liquid cooling device includes a first liquid inlet end and a first liquid outlet end, the first liquid inlet end and the first liquid outlet end are located on a side of the first housing adjacent to the first side and are located outside the first housing, wherein the first liquid inlet end is connected to an end of the liquid inlet pipe located on the first side, and the first liquid outlet end is connected to an end of the liquid outlet pipe located on the first side.

[0008] The above-mentioned server node can be installed in a cabinet. When the server node is installed in the cabinet, the second side of the chassis can be located in the cabinet, and the first side of the chassis can be located at the cabinet opening. When the first sub-node is installed in the chassis, the first liquid inlet end and the first liquid outlet end of the first liquid cooling pipe are both located on a side of the first housing adjacent to the first side, and the first liquid inlet end and the first liquid outlet end are both located outside the first housing. This facilitates the first liquid inlet end to be connected to the end of the liquid inlet pipe located on the first side, and the first liquid outlet end to be connected to the end of the liquid outlet pipe located on the first side, thereby avoiding blind connection between the first liquid cooling device in the first sub-node and the liquid inlet pipe, as well as blind insertion between the first liquid cooling device in the first sub-node and the liquid outlet pipe, thereby ensuring the reliability of the connection between the first liquid cooling device and the liquid inlet pipe, as well as the reliability of the connection between the first liquid cooling device and the liquid outlet pipe. Furthermore, since the first liquid inlet of the first liquid cooling device is located outside the first housing, the connection between the first liquid inlet of the first liquid cooling device and the liquid inlet pipe is also located outside the first housing. Therefore, if leakage occurs at the connection between the first liquid inlet of the first liquid cooling device and the liquid inlet pipe, the leaked liquid is prevented from soaking the electronic components within the first housing, thereby preventing short circuits and damage to the electronic components. Similarly, since the first liquid outlet of the first liquid cooling device is located outside the first housing, the connection between the first liquid outlet of the first liquid cooling device and the liquid outlet pipe is also located outside the first housing. Therefore, if leakage occurs at the connection between the first liquid outlet of the first liquid cooling device and the liquid outlet pipe, the leaked liquid is prevented from soaking the electronic components within the first housing, thereby preventing short circuits and damage to the electronic components.

[0009] In some embodiments, the server node further comprises: a first connector and a second connector; the first connector being disposed at an end of the liquid inlet pipe near the first side and connected to the first liquid inlet end of the first liquid cooling device; and the second connector being disposed at an end of the liquid outlet pipe near the second side and connected to the first liquid outlet end of the first liquid cooling device. The liquid inlet pipe and the liquid outlet pipe are both disposed within the chassis, with at least a portion of the first connector located outside the chassis, and at least a portion of the second connector located outside the chassis.

[0010] At least a portion of the first connector is located outside the chassis, thereby facilitating connection between the first connector and the first liquid inlet of the first liquid cooling device. At least a portion of the second connector is located outside the chassis, thereby facilitating connection between the second connector and the first liquid outlet of the first liquid cooling device.

[0011] In some embodiments, the first liquid cooling device includes a first liquid inlet pipe, a first liquid cooling plate, and a first liquid outlet pipe. A first liquid channel is provided within the first liquid cooling plate, and the outer surface of the first liquid cooling plate is in contact with a first device to be cooled. The first liquid inlet pipe includes a first sub-inlet pipe, a first pipe connector, and a second sub-inlet pipe. The first pipe connector includes a first interface, a second interface, and a third interface. One end of the first sub-inlet pipe is connected to the end of the liquid inlet pipe on the first side, and the other end is connected to the first interface. One end of the second sub-inlet pipe is connected to the second interface, and the other end is connected to one end of the first liquid channel. The first liquid outlet pipe includes a first sub-outlet pipe, a second pipe connector, and a second sub-outlet pipe. The second pipe connector includes a fourth interface, a fifth interface, and a sixth interface. One end of the first sub-outlet pipe is connected to the other end of the first liquid channel, and the other end is connected to the fourth interface. One end of the second sub-outlet pipe is connected to the fifth interface, and the other end is connected to the end of the liquid outlet pipe on the first side. The server node also includes a second sub-node and a second liquid cooling device. The second sub-node is mounted within the chassis and includes a second housing and a second device to be cooled disposed within the second housing. The second liquid cooling device is used to dissipate heat for the second component to be cooled. The second liquid cooling device includes a second liquid inlet and a second liquid outlet. The second liquid inlet and the second liquid outlet are located on a side of the second box body adjacent to the first side and are located outside the second box body, wherein the second liquid inlet is connected to the third interface and the second liquid outlet is connected to the sixth interface.

[0012] Among them, the liquid cooling medium can enter the first sub-liquid inlet pipe from the liquid inlet pipe, and then flow through the first pipe connector. In the first pipe connector, the liquid cooling medium can be divided into two paths, one of which enters the first liquid channel of the first liquid cooling plate to dissipate heat to the first device to be cooled. The liquid cooling medium in the first liquid channel can flow into the first sub-liquid outlet pipe and then merge into the second pipe connector. The other path of liquid cooling medium can enter the second liquid cooling device to dissipate heat to the second device to be cooled. The liquid cooling medium in the second liquid cooling device can merge into the second pipe connector, so that the liquid cooling medium in the second liquid outlet pipe and the liquid cooling medium in the first sub-liquid outlet pipe can merge in the second pipe connector, and then enter the second sub-liquid outlet pipe and flow into the liquid outlet pipe. In addition, when the second sub-node is installed in the chassis, the second liquid inlet and second liquid outlet of the second liquid cooling device can be located on the side of the second box body close to the cabinet opening of the cabinet, so that the operation and maintenance personnel can conveniently connect the second liquid inlet of the second liquid cooling device with the third interface, and the second liquid outlet of the second liquid cooling device with the sixth interface, thereby avoiding blind connection between the second liquid cooling device and the third interface in the second sub-node, and blind connection between the second liquid cooling device and the sixth interface in the second sub-node, and ensuring the connection reliability between the second liquid cooling device and the third interface, and the connection reliability between the second liquid cooling device and the sixth interface.

[0013] In some embodiments, the second liquid cooling device includes a second liquid inlet pipe, a second liquid cooling plate, and a second liquid outlet pipe. The second liquid cooling plate is provided with a second liquid channel, and the outer surface of the second liquid cooling plate is in contact with the second heat dissipation device. One end of the second liquid inlet pipe is connected to the third interface, and the other end is connected to one end of the second liquid channel. One end of the second liquid outlet pipe is connected to the other end of the second liquid channel, and the other end is connected to the sixth interface.

[0014] The second liquid cooling plate can be attached to the second device to be cooled, thereby improving the heat dissipation effect of the second liquid cooling plate on the second device to be cooled.

[0015] In some embodiments, the first box body also includes a first plate body, the first plate body is located on the first side of the chassis, and the first plate body is provided with a seventh mounting port and an eighth mounting port. The first pipe connector and the second pipe connector are both provided inside the first box body. The server node also includes a first type of connector and a second type of connector; the first type of connector is connected to the third interface of the first pipe connector, and the first type of connector is connected to the second liquid inlet end of the second liquid cooling device, and the first type of connector is installed at the seventh mounting port; the second type of connector is connected to the sixth interface of the second pipe connector, and the second type of connector is connected to the second liquid outlet end of the second liquid cooling device, and the second type of connector is installed at the eighth mounting port. Among them, the first type of connector is installed at the seventh mounting port, so that the first plate body can support the first type of connector. The second type of connector is installed at the eighth mounting port, so that the first plate body can support the first type of connector and the second type of connector.

[0016] In some embodiments, the second box body also includes a third plate body, the third plate body is located on the first side of the chassis, and a ninth mounting port and a tenth mounting port are provided on the third plate body; the second liquid inlet end and the second liquid outlet end of the second liquid cooling device extend from the ninth mounting port and the fourth mounting port respectively.

[0017] Among them, the second liquid inlet end and the second liquid outlet end of the second liquid cooling device extend from the ninth mounting port and the tenth mounting port respectively, so that the third plate body can support the second liquid cooling device and facilitate the connection of the two ends of the second liquid cooling device with the first type joint and the second type joint respectively.

[0018] In some embodiments, the server node further comprises: a first connector, a second connector, a third connector, and a fourth connector. The first connector is provided at one end of the liquid inlet pipe located on the first side, and the third connector is provided at one end of the liquid inlet pipe located on the second side. The second connector is provided at one end of the liquid outlet pipe located on the first side, and the fourth connector is provided at one end of the liquid outlet pipe located on the second side.

[0019] The flow rate of the first connector can be equal to the flow rate of the third connector. If the flow rate of the connector on the inlet manifold is larger, the above-mentioned inlet pipe can be selected. The flow rate of the fourth connector can be equal to the flow rate of the second connector. If the flow rate of the connector on the outlet manifold is larger, the above-mentioned outlet pipe can be selected.

[0020] In some embodiments, the liquid inlet pipe includes a first liquid inlet pipe section, a first pipe section connector and multiple second liquid inlet pipe sections, the first pipe section connector is provided with a first liquid inlet and multiple second liquid inlets, one end of the first liquid inlet pipe section is connected to the first liquid inlet, and the other end of the first liquid inlet pipe section is located on the first side; one end of the multiple second liquid inlet pipe sections are respectively connected to the multiple second liquid inlets; and / or, the liquid outlet pipe includes a first liquid outlet pipe section, a second pipe section connector and multiple second liquid outlet pipe sections, the second pipe section connector is provided with a first liquid outlet and multiple second liquid outlets, one end of the first liquid outlet pipe section is connected to the first liquid outlet, and the other end of the first liquid outlet pipe section is located on the first side; one end of the multiple second liquid outlet pipe sections are respectively connected to the multiple second liquid outlets.

[0021] The flow rate of the second liquid inlet pipe section is smaller than that of the first liquid inlet pipe section. Therefore, if the flow rate of the connector on the liquid inlet manifold is small, the above liquid inlet pipe can be selected. The flow rate of the second liquid outlet pipe section is smaller than that of the first liquid outlet pipe section. Therefore, if the flow rate of the connector on the liquid outlet manifold is small, the above liquid outlet pipe can be selected.

[0022] In some embodiments, the server node further comprises: a first connector, a second connector, a third connector, and a fourth connector. The first liquid inlet pipe segment is provided with a first connector at one end located on the first side, and the second liquid inlet pipe segment is provided with a third connector at one end located on the second side. The first liquid outlet pipe segment is provided with a second connector at one end located on the first side, and the second liquid outlet pipe segment is provided with a fourth connector at one end located on the second side.

[0023] In some embodiments, the server node further includes a valve. The liquid inlet pipe and / or the liquid outlet pipe are provided with a valve for controlling the flow of the working medium in the liquid inlet pipe, the liquid outlet pipe and the first liquid cooling device.

[0024] Among them, when leakage occurs in the liquid inlet pipe, the liquid outlet pipe, the first liquid cooling device, the second liquid cooling device and each joint, the liquid cooling medium can be controlled to stop flowing through the valve, thereby facilitating repair of the leakage.

[0025] In another aspect, a server is provided. The server comprises a cabinet, a liquid cooling manifold, and a plurality of server nodes according to any of the above-described embodiments. A storage space is formed within the cabinet. The liquid cooling manifold comprises an inlet manifold and an outlet manifold disposed within the storage space. The server nodes are disposed within the storage space, and the server nodes and the liquid cooling manifold are sequentially arranged along a first direction. The end of the liquid inlet pipe of the server node located on the second side is connected to the liquid inlet manifold, and the end of the liquid outlet pipe of the server node located on the second side is connected to the outlet manifold.

[0026] The above-mentioned server has the same structure and beneficial technical effects as the server nodes provided in some of the above-mentioned embodiments, which will not be repeated here. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] To more clearly illustrate the technical solutions of this application, the following briefly introduces the drawings required for use in some embodiments of this application. Obviously, the drawings described below are only drawings of some embodiments of this application, and those skilled in the art can also derive other drawings based on these drawings. Furthermore, the drawings described below are schematic diagrams and are not intended to limit the actual dimensions of the products, actual processes of the methods, actual timing of signals, and the like involved in the embodiments of this application.

[0028] FIG1 is a structural diagram of a server according to some embodiments of the present application;

[0029] FIG2 is a structural diagram of a server in the related art;

[0030] FIG3 is a structural diagram of a server according to some embodiments of the present application;

[0031] FIG4 is a simplified diagram of the liquid cooling system structure of a server in some embodiments of the present application;

[0032] FIG5 is a structural diagram of the server node in FIG3 from a first perspective V1;

[0033] FIG6 is a structural diagram of the server 1000 in FIG3 from a third perspective V3;

[0034] FIG7 is a structural diagram of the server node in FIG3 under a second perspective V2;

[0035] FIG8 is another structural diagram of a server node according to some embodiments of the present application;

[0036] FIG9 is a structural diagram of the server node in FIG8 from a fourth perspective V4. DETAILED DESCRIPTION

[0037] The following will be combined with the accompanying drawings to clearly and completely describe the technical solutions in some embodiments of the present application. Obviously, the embodiments described are only some embodiments of the present application, not all embodiments. Based on the embodiments provided in this application, all other embodiments obtained by ordinary technicians in this field are within the scope of protection of this application.

[0038] Unless the context requires otherwise, throughout the specification and claims, the term "comprise" and its other forms, such as the third person singular form "comprises" and the present participle form "comprising", are to be interpreted as open and inclusive, that is, "including, but not limited to". In the description of the specification, the terms "one embodiment", "some embodiments", "exemplary embodiments", "example", "specific example" or "some examples" are intended to indicate that the specific features, structures, materials or characteristics associated with the embodiment or example are included in at least one embodiment or example of the present application. The schematic representation of the above terms does not necessarily refer to the same embodiment or example. In addition, the specific features, structures, materials or characteristics may be included in any one or more embodiments or examples in any appropriate manner.

[0039] In the following, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of the embodiments of this application, unless otherwise specified, "plurality" means two or more.

[0040] “A and / or B” includes the following three combinations: A only, B only, and a combination of A and B.

[0041] Figure 1 is a structural diagram of a server according to some embodiments of the present application. A coordinate system is established in Figure 1 , where the length of the cabinet 100 is the X direction, the width is the Y direction, and the height is the Z direction. The X direction is perpendicular to the Y direction, the X direction is perpendicular to the Z direction, and the Y direction is perpendicular to the Z direction.

[0042] 1 , a server 1000 includes a cabinet 100 and multiple server nodes 200. The cabinet 100 has a storage space formed therein, and the multiple server nodes 200 can be disposed in the storage space. In this case, the cabinet 100 can protect the multiple server nodes 200.

[0043] For example, a plurality of server nodes 200 may be arranged in an array within the cabinet 100 .

[0044] For example, a cabinet opening is provided on one side of the cabinet 100, and multiple server nodes 200 can be installed in the cabinet 100 through the cabinet opening. When the server node 200 is installed in the cabinet 100, the moving direction of the server node 200 can be the Y direction.

[0045] As shown in FIG1 , the cabinet 100 may include multiple side walls, which may enclose a storage space, and the multiple side walls may include a first side wall 120 disposed opposite to the cabinet opening 110. The cabinet opening 110 and the first side wall 120 are disposed opposite to each other in the Y direction.

[0046] As the power consumption of the server node 200 gradually increases, the heat dissipation of the server node 200 gradually increases. In order to ensure the heat dissipation effect of the server node 200, liquid cooling systems are increasingly used in the server 1000.

[0047] FIG. 2 is a structural diagram of a server 1000 ′ in the related art.

[0048] 2 , in related art, the server 1000 ′ may further include a liquid cooling manifold, which may include a liquid inlet manifold 310 ′ and a liquid outlet manifold, wherein the liquid inlet manifold 310 ′ and the liquid outlet manifold are disposed in the cabinet 100 (as shown in FIG1 ).

[0049] In the cabinet 100 , the server nodes 200 ′ and the liquid cooling manifolds may be arranged sequentially along the Y direction.

[0050] In related technologies, the server node 200' may further include a chassis 500', a liquid inlet connecting pipe 370', a liquid outlet connecting pipe, and a node 410'. The node 410' may include a liquid cooling mechanism 360' and components to be cooled. The liquid cooling mechanism 360' may cool the components to be cooled in the node 410'.

[0051] Among them, the liquid inlet connecting pipe 370' and the liquid outlet connecting pipe are both located at the rear end of the chassis 500', and the node 410 is located at the front end of the chassis 500'. Among them, the rear end of the chassis 500' refers to the end of the chassis 500' away from the cabinet opening 110 (as shown in Figure 1), and the front end of the chassis 500' refers to the end of the chassis 500' close to the cabinet opening 110 (as shown in Figure 1).

[0052] Among them, the front end of the chassis 500' is provided with an installation port, and the node 410' can be installed into the chassis 500' through the installation port. At this time, the liquid inlet end of the liquid cooling mechanism 360' can be connected to the end of the liquid inlet connecting pipe 370' away from the liquid inlet manifold 310', and the liquid outlet end of the liquid cooling mechanism 360' can be connected to the end of the liquid outlet connecting pipe away from the liquid outlet manifold.

[0053] Among them, since the operation and maintenance personnel cannot observe the positions of the liquid inlet connecting pipe 370' and the liquid outlet connecting pipe when installing the server node 200', the liquid cooling mechanism 360' in the server node 200' is blindly connected to the liquid inlet connecting pipe 370', and the liquid cooling mechanism 360' is blindly connected to the liquid outlet connecting pipe. This may cause the liquid cooling mechanism 360' to be inaccurately aligned with the liquid inlet connecting pipe 370' and the liquid outlet connecting pipe, thereby causing unreliable connections between the liquid cooling mechanism 360' and the liquid inlet connecting pipe 370' and the liquid outlet connecting pipe, resulting in leakage.

[0054] Based on this, an embodiment of the present application provides a server node 200.

[0055] Figure 3 is a structural diagram of the server 1000 in some embodiments of the present application, wherein in Figure 3, the coordinate system corresponding to the server node 200 is different from the coordinate system corresponding to the liquid inlet manifold 310 and the liquid outlet manifold 320; Figure 4 is a simplified structural diagram of the liquid cooling system in the server 1000 in some embodiments of the present application.

[0056] Please refer to Figures 3 and 4. The server 1000 may include a cabinet 100, a server node 200 and a liquid cooling manifold. The liquid cooling manifold includes: a liquid inlet manifold 310 and a liquid outlet manifold 320. The server node 200, the liquid inlet manifold 310 and the liquid outlet manifold 320 can be arranged in the accommodation space of the cabinet 100, wherein the server node 200 and the liquid cooling manifold are arranged in sequence along the first direction F1.

[0057] Server node 200 includes a chassis 500, a first subnode 400, a liquid inlet pipe 710, a liquid outlet pipe 720, and a first liquid cooling device 730. Chassis 500 includes a first side 501 and a second side 502, which are arranged opposite each other in a first direction F1. As shown in FIG3 , the direction indicated by arrow F1 is the first direction F1. First subnode 400 is installed within chassis 500 and includes a first housing 410 and a first heat dissipation device 420 disposed within the first housing 410. Liquid inlet pipe 710 extends from second side 502 to first side 501. Liquid outlet pipe 720 extends from second side 502 to first side 501.

[0058] The first liquid cooling device 730 is used to dissipate heat for the first heat dissipation device 420, wherein the first liquid cooling device 730 includes a first liquid inlet end 7301 and a first liquid outlet end 7302, the first liquid inlet end 7301 and the first liquid outlet end 7302 are located on a side of the first box body 410 adjacent to the first side 501, and are located outside the first box body 410, wherein the first liquid inlet end 7301 is connected to one end of the liquid inlet pipe 710 located on the first side 501, and the first liquid outlet end 7302 is connected to one end of the liquid outlet pipe 720 located on the first side 501.

[0059] One end of the liquid inlet pipe 710 located on the second side 502 is connected to the liquid inlet manifold 310 , and one end of the liquid outlet pipe 720 located on the second side 502 is connected to the liquid outlet manifold 320 .

[0060] For example, the liquid inlet manifold 310 is provided with a plurality of liquid inlet interfaces, and the liquid inlet interfaces are provided with a first connector 340 . One end of the liquid inlet pipe 710 located on the second side 502 is connected to one of the first connectors 340 .

[0061] The liquid outlet manifold is provided with a plurality of liquid outlet interfaces, each of which is provided with a second connector 350 . One end of the liquid outlet pipe 720 located on the second side 502 is connected to one of the second connectors 350 .

[0062] 3 , in some examples, the plurality of first connectors 340 on the inlet manifold 310 may be located on a side of the inlet manifold 310 close to the outlet manifold 320 , and the plurality of second connectors 350 on the outlet manifold 320 may be located on a side of the outlet manifold 320 close to the inlet manifold 310 .

[0063] The first direction F1 may be parallel to the Y direction. When the chassis 500 is installed in the cabinet 100, the first side 501 of the chassis 500 is located at the cabinet opening 110 of the cabinet 100 (as shown in FIG1 ), and the second side 502 of the chassis 500 is located in the cabinet 100 and adjacent to the first side wall 120 (as shown in FIG1 ).

[0064] In some possible embodiments, the first sub-node 400 is detachably mounted within the first housing 410. For example, the first sub-node 400 can be pulled out along the first direction F1. Within the first sub-node 400, the first heat dissipation device 420 may include a CPU (central processing unit), a GPU (graphics processing unit), or an NPU (neural network processing unit). In addition, other types of chips may also be used, which are not listed here. In the embodiments of the present application, the type of the first heat dissipation device 420 is not limited.

[0065] For example, the liquid inlet pipe 710 may include a first end 7101 and a second end 7102 that are oppositely disposed, wherein the first end 7101 is located on the first side 501 of the chassis 500, and the second end 7102 is located on the second side 502 of the chassis 500. The first end 7101 may be connected to the first liquid inlet end 7301 of the first liquid cooling device 730, and the second end 7102 may be connected to the liquid inlet manifold 310. For example, the second end 7102 may be connected to the first connector 340 on the liquid inlet manifold 310.

[0066] The liquid outlet pipe 720 may include a third end 7201 and a fourth end 7202 disposed opposite each other, wherein the third end 7201 is located on the first side 501 of the chassis 500, and the fourth end 7202 is located on the second side 502 of the chassis 500. The third end 7201 may be connected to the first liquid outlet end 7302 of the first liquid cooling device 730, and the fourth end 7202 may be connected to the liquid outlet manifold 320. For example, the fourth end 7202 may be connected to the second connector 350 on the liquid outlet manifold 320.

[0067] The liquid inlet pipe 710 and the liquid outlet pipe 720 may be made of a bendable material. For example, the liquid inlet pipe 710 and the liquid outlet pipe 720 may be made of a plastic material.

[0068] When the chassis 500 is installed in the cabinet 100, the operation and maintenance personnel can open the first side wall 120 (as shown in Figure 1) to expose the liquid inlet manifold 310 and the liquid outlet manifold 320, so that the operation and maintenance personnel can connect the second end 7102 of the liquid inlet pipe 710 to the first connector 340 and connect the fourth end 7202 of the liquid outlet pipe 720 to the second connector 350.

[0069] The liquid inlet pipe 710 can be connected to the chassis 500, and the liquid outlet pipe 720 can be connected to the chassis 500. For example, the liquid inlet pipe 710 and the liquid outlet pipe 720 can be snap-fitted to the chassis 500, or connected via other fixings. The liquid inlet pipe 710 and the liquid outlet pipe 720 can be disposed inside or outside the chassis 500. Alternatively, the liquid inlet pipe 710 can be partially located inside and partially located outside the chassis 500, while the liquid outlet pipe 720 can be partially located inside and partially located outside the chassis 500.

[0070] The first liquid cooling device 730 is partially disposed in the first housing 410 , wherein a portion of the outer surface of the first liquid cooling device 730 can be in contact with the outer surface of the first heat dissipation device 420 , thereby the first liquid cooling device 730 can dissipate heat from the first heat dissipation device 420 .

[0071] The first liquid inlet end 7301 of the first liquid cooling device 730 can be connected to the first end 7101 of the liquid inlet pipe 710 , so that the first liquid cooling device 730 can be connected to the liquid cooling medium in the liquid inlet pipe 710 .

[0072] The first liquid outlet end 7302 of the first liquid cooling device 730 may be connected to the third end 7201 of the liquid outlet pipe 720 , so that the liquid cooling medium in the first liquid cooling device 730 may enter the liquid outlet pipe 720 .

[0073] Among them, the liquid cooling medium in the liquid inlet manifold 310 can enter the liquid inlet pipe 710 through the first joint 340, and the liquid cooling medium in the liquid inlet pipe 710 can enter the first liquid cooling device 730 through the first liquid inlet end 7301. After the liquid cooling medium dissipates heat to the heat dissipation device, it can flow out from the first liquid outlet end 7302 and enter the liquid outlet pipe 720, and the liquid cooling medium in the liquid outlet pipe 720 can return to the liquid outlet manifold 320.

[0074] The server 1000 may also be provided with a cooling distribution device 330 . The cooling distribution device 330 is connected to the liquid inlet manifold 310 and the liquid outlet manifold 320 . The cooling distribution device 330 can flow the liquid coolant in the liquid outlet manifold 320 into the liquid inlet manifold 310 and provide power for the flow of the liquid coolant. For example, the cooling distribution device 330 may be a pump.

[0075] Among them, one server 1000 can be equipped with one cooling distribution device 330 , or one cooling distribution device 330 can be equipped for multiple servers 1000 . In this case, the liquid inlet manifolds 310 and the liquid outlet manifolds 320 in the multiple servers 1000 share one cooling distribution device 330 .

[0076] When the first sub-node 400 is installed in the chassis 500, the first liquid inlet end 7301 and the first liquid outlet end 7302 can be located on the side of the first box body 410 close to the cabinet port 110 of the cabinet 100, so that the operation and maintenance personnel can easily connect the first liquid inlet end 7301 of the first liquid cooling device 730 with the first end 7101 of the liquid inlet pipe 710, and the first liquid outlet end 7302 of the first liquid cooling device 730 with the third end 7201 of the liquid outlet pipe 720, thereby avoiding blind connection between the first liquid cooling device 730 and the liquid inlet pipe 710 in the first sub-node 400, and blind connection between the first liquid cooling device 730 and the liquid outlet pipe 720 in the first sub-node 400, ensuring the connection reliability between the first liquid cooling device 730 and the liquid inlet pipe 710, and the connection reliability between the first liquid cooling device 730 and the liquid outlet pipe 720, thereby preventing leakage.

[0077] In addition, since the first liquid inlet end 7301 of the first liquid cooling device 730 is located outside the first box body 410, the connection between the first liquid inlet end 7301 of the first liquid cooling device 730 and the liquid inlet pipe 710 is located outside the first box body 410. Therefore, when leakage occurs at the connection between the first liquid inlet end 7301 of the first liquid cooling device 730 and the liquid inlet pipe 710, the leaked liquid can be prevented from soaking the electronic components in the first box body 410, thereby preventing the electronic components from short-circuiting and being damaged. Similarly, since the first liquid outlet end 7302 of the first liquid cooling device 730 is located outside the first box body 410, the connection between the first liquid outlet end 7302 of the first liquid cooling device 730 and the liquid outlet pipe 720 is located outside the first box body 410. Therefore, when leakage occurs at the connection between the first liquid outlet end 7302 of the first liquid cooling device 730 and the liquid outlet pipe 720, the leaked liquid can be prevented from soaking the electronic components in the first box body 410, thereby preventing the electronic components from short-circuiting and being damaged.

[0078] Please refer to FIG. 3 and FIG. 4 again. In some embodiments, the server node 200 further includes: a second sub-node 600 and a second liquid cooling device 810 .

[0079] The second sub-node 600 can be provided to increase the computing power of the server node 200. Of course, in addition to the second sub-node 600, more nodes can be provided in the server node 200. For example, three, four, five, or even six nodes can be provided in the server node 200. In the embodiment of the present application, there is no limit on the number of nodes in the server node 200.

[0080] The second subnode 600 is installed in the chassis 500 and includes a second housing 610 and a second heat dissipation device 620 disposed in the second housing 610. The second liquid cooling device 810 is used to dissipate heat from the second heat dissipation device 620. The second liquid cooling device 810 includes a second liquid inlet 8101 and a second liquid outlet 8102. The second liquid inlet 8101 and the second liquid outlet 8102 are located on a side of the second housing 610 adjacent to the first side 501 and outside the second housing 610. The second liquid inlet 8101 is connected to an end of the liquid inlet pipe 710 located on the first side 501, and the second liquid outlet 8102 is connected to an end of the liquid outlet pipe 720 located on the first side 501.

[0081] For example, the second liquid cooling device 810 is partially disposed within the second housing 610. The outer surface of the second liquid cooling device 810 can be in contact with the outer surface of the second heat dissipation device 620, thereby dissipating heat from the second heat dissipation device. For example, the second heat dissipation device 620 can include a CPU and a GPU. For example, in a server, the first heat dissipation device is a CPU, and the second heat dissipation device is a GPU.

[0082] The second liquid inlet end 8101 of the second liquid cooling device 810 can be connected to the first end 7101 of the liquid inlet pipe 710, so that the second liquid cooling device 810 can be connected to the liquid cooling medium in the liquid inlet pipe 710. The second liquid inlet end 8101 can be directly connected to the first end 7101, or the second liquid inlet end 8101 can be indirectly connected to the first end 7101 through other connecting pipes.

[0083] The second liquid outlet end 8102 of the second liquid cooling device 810 can be connected to the third end 7201 of the liquid outlet pipe 720, so that the liquid cooling medium in the second liquid cooling device 810 can enter the liquid outlet pipe 720. The second liquid outlet end 8102 can be directly connected to the third end 7201, or the second liquid outlet end 8102 can be indirectly connected to the third end 7201 via another connecting pipe.

[0084] When the second sub-node 600 is installed in the chassis 500, the second liquid inlet end 8101 and the second liquid outlet end 8102 of the second liquid cooling device 810 can be located on the side of the second box body 610 close to the cabinet port 110 of the cabinet 100, so that the operation and maintenance personnel can easily connect the second liquid inlet end 8101 of the second liquid cooling device 810 with the first end 7101 of the liquid inlet pipe 710, and the second liquid outlet end 8102 of the second liquid cooling device 810 with the third end 7201 of the liquid outlet pipe 720, thereby avoiding blind insertion of the second liquid cooling device 810 and the liquid inlet pipe 710 in the second sub-node 600, and blind insertion of the second liquid cooling device 810 and the liquid outlet pipe 720 in the second sub-node 600, thereby ensuring the connection reliability between the second liquid cooling device 810 and the liquid inlet pipe 710, and the connection reliability between the second liquid cooling device 810 and the liquid outlet pipe 720.

[0085] For example, the server node 200 may further include two tees, which are respectively disposed at the first end 7101 of the liquid inlet pipe 710 and the third end 7201 of the liquid outlet pipe 720. The first liquid inlet end 7301 of the first liquid cooling device 730 and the second liquid inlet end 8101 of the second liquid cooling device 810 are both connected to the tees on the liquid inlet pipe 710, while the first liquid outlet end 7302 of the first liquid cooling device 730 and the second liquid outlet end 8102 of the second liquid cooling device 810 may both be connected to the tees on the liquid outlet pipe 720. Referring to Figures 3 and 4 , in some embodiments, the first liquid cooling device 730 includes a first liquid inlet pipe 731, a first liquid cooling plate 732, and a first liquid outlet pipe 733.

[0086] A first liquid channel is provided in the first liquid cooling plate 732 , and an outer surface of the first liquid cooling plate 732 is attached to the first heat dissipation device 420 .

[0087] The first liquid inlet pipe 731 includes a first sub-liquid inlet pipe 7311, a first pipe connector 7312 and a second sub-liquid inlet pipe 7313. The first pipe connector 7312 includes a first interface, a second interface and a third interface. One end of the first sub-liquid inlet pipe 7311 is connected to one end of the liquid inlet pipe 710 located on the first side 501 (as shown in Figure 3), and the other end is connected to the first interface. One end of the second sub-liquid inlet pipe 7313 is connected to the second interface, and the other end is connected to one end of the first liquid channel.

[0088] The first liquid outlet pipe 733 includes a first sub-liquid outlet pipe 7331, a second pipe connector 7332 and a second sub-liquid outlet pipe 7333, and the second pipe connector 7332 includes a fourth interface, a fifth interface and a sixth interface; one end of the first sub-liquid outlet pipe 7331 is connected to the other end of the first liquid channel, and the other end is connected to the fourth interface; one end of the second sub-liquid outlet pipe 7333 is connected to the fifth interface, and the other end is connected to one end of the liquid outlet pipe 720 located on the first side 501.

[0089] The second liquid inlet end 8101 of the second liquid cooling device 810 is connected to the third interface, and the second liquid outlet end of the second liquid cooling device 810 is connected to the sixth interface.

[0090] The liquid coolant can enter the liquid inlet pipe 710 from the liquid inlet manifold 310, then enter the first sub-liquid inlet pipe 7311 from the liquid inlet pipe 710, and then flow through the first pipe connector 7312. At the first pipe connector 7312, the liquid coolant can be divided into two paths. One path of the liquid coolant enters the first liquid channel of the first liquid cooling plate 732 to dissipate heat from the first heat dissipation device 420. The liquid coolant in the first liquid channel can flow into the first sub-liquid outlet pipe 7331 and then into the second pipe connector 7332.

[0091] The other liquid coolant can enter the second liquid cooling device 810 to dissipate heat from the second heat dissipation device 620. The liquid coolant in the second liquid cooling device 810 can flow into the second pipe connector 7332. Thus, the liquid coolant in the second liquid cooling device 810 and the liquid coolant in the first sub-liquid outlet pipe 7331 can merge in the second pipe connector 7332, then enter the second sub-liquid outlet pipe 7333, flow into the liquid outlet pipe 720, and finally flow into the liquid outlet manifold 320.

[0092] In some embodiments, the second liquid cooling device 810 includes a second liquid inlet pipe 811, a second liquid cooling plate 812 and a second liquid outlet pipe 813. A second liquid channel is provided in the second liquid cooling plate 812, and the outer surface of the second liquid cooling plate 812 is attached to the second heat dissipation device 620.

[0093] One end of the second liquid inlet pipe 811 is connected to the third interface, and the other end is connected to one end of the second liquid channel.

[0094] One end of the second liquid outlet pipe 813 is connected to the other end of the second liquid channel, and the other end is connected to the sixth port.

[0095] The outer surface of the second liquid cooling plate 812 is attached to the second heat dissipation device 620 , thereby improving the heat dissipation effect of the second heat dissipation device 620 .

[0096] In some examples, the diameter of the second liquid inlet pipe 811 may be different from the diameter of the second sub-liquid inlet pipe 7313, and thus the flow rate of the second liquid inlet pipe 811 may be different from the flow rate of the second sub-liquid inlet pipe 7313. Of course, in other examples, the diameter of the second liquid inlet pipe 811 may be the same as the diameter of the second sub-liquid inlet pipe 7313.

[0097] The diameter of the second liquid outlet pipe 813 can be different from the diameter of the first sub-liquid outlet pipe 7331, and thus the flow rate of the second liquid outlet pipe 813 can be different from the flow rate of the first sub-liquid outlet pipe 7331. Of course, in some other examples, the diameter of the second liquid outlet pipe 813 can be the same as the diameter of the first sub-liquid outlet pipe 7331.

[0098] 3 and 4 , in some embodiments, the server node 200 further includes: a first connector 740 , a second connector 750 , a third connector 760 , and a fourth connector 770 .

[0099] The first connector 740 is disposed at an end of the liquid inlet pipe 710 near the first side 501 and is connected to the first liquid inlet end 7301 of the first liquid cooling device 730. The second connector 750 is disposed at an end of the liquid outlet pipe 720 near the second side 502 and is connected to the first liquid outlet end 7302 of the first liquid cooling device 730. The liquid inlet pipe 710 and the liquid outlet pipe 720 are both disposed within the chassis 500, with at least a portion of the first connector 740 located outside the chassis 500, and at least a portion of the second connector 750 located outside the chassis 500.

[0100] In some examples, the chassis 500 may include a top plate 510 and a bottom plate 520 disposed opposite to each other in the Z direction, and the liquid inlet pipe 710 and the liquid outlet pipe 720 may be connected to the top plate 510 and located on a side of the top plate 510 close to the bottom plate 520 .

[0101] At least a portion of the first connector 740 is located outside the chassis 500 , thereby facilitating connection between the first connector 740 and the first liquid inlet end 7301 of the first liquid cooling device 730 .

[0102] At least a portion of the second connector 750 is located outside the chassis 500 , thereby facilitating connection between the second connector 750 and the first liquid outlet 7302 of the first liquid cooling device 730 .

[0103] The third connector 760 is disposed at the second end 7102 of the liquid inlet pipe 710 . The third connector 760 can be connected to the first connector 340 . Thus, the liquid inlet pipe 710 can be connected to the liquid inlet manifold 310 through the third connector 760 and the first connector 340 .

[0104] The fourth connector 770 is disposed at the fourth end 7202 of the liquid outlet pipe 720 . The fourth connector 770 can be connected to the second connector 350 . Thus, the liquid outlet pipe 720 can be connected to the liquid outlet manifold 320 through the fourth connector 770 and the second connector 350 .

[0105] The third connector 760 and the fourth connector 770 are both located outside the chassis 500 .

[0106] Please refer to Figure 3 again. In some embodiments, the chassis 500 includes a first side panel 530, a second side panel 540 and a first mounting port 550. The first side panel 530 and the first mounting port 550 are both located on opposite sides of the second side panel 540. The direction in which the first side panel 530 points to the second side panel 540 is the same as the direction in which the first side 501 points to the second side 502. The first side panel 530 and the second side panel 540 are arranged relative to each other in the first direction F1.

[0107] FIG5 is a structural diagram of the server node 200 in FIG3 from a first perspective V1.

[0108] Referring to FIG. 5 , a first mounting hole 531 and a second mounting hole 532 are defined on the first side plate 530 .

[0109] The first connector 740 is installed in the first mounting hole 531, thereby allowing the first side plate 530 to securely support the first connector 740. Part of the first connector 740 is located inside the chassis 500, while the remaining portion is located outside the chassis 500, facilitating connection between the first connector 740 and the first liquid inlet port 7301 of the first liquid cooling device 730.

[0110] The second connector 750 is installed in the second mounting hole 532, thereby supporting the first side plate 530. Part of the second connector 750 is located inside the chassis 500, while the remaining part is located outside the chassis 500, thereby facilitating connection between the second connector 750 and the first liquid outlet 7302 of the first liquid cooling device 730.

[0111] Referring to FIG3 , in some examples, the server node 200 may further include a fifth connector 780 and a sixth connector 790 , wherein the fifth connector 780 is disposed at the first liquid inlet end 7301 of the first liquid cooling device 730 , and the sixth connector 790 is disposed at the first liquid outlet end 7302 of the first liquid cooling device 730 . The fifth connector 780 may be connected to the first connector 740 mounted on the liquid inlet pipe 710 (shown in FIG3 ), and the sixth connector 790 may be connected to the second connector 750 mounted on the liquid outlet pipe 720 (shown in FIG3 ).

[0112] Continuing with FIG. 3 , in some embodiments, the first box body 410 further includes a first plate body 411 , and the first plate body 411 is located on the first side 501 of the chassis 500 .

[0113] For example, the first plate 411 may be perpendicular to the Y direction.

[0114] In addition to the first plate 411, the first box 410 may further include a bottom plate 412 connected to the first plate 411, wherein the bottom plate 412 may be perpendicular to the Z direction. The first box 410 may only include the first plate 411 and the bottom plate 412, and the remaining panels of the first box 410 may be configured according to actual conditions.

[0115] Please continue to refer to Figure 5. A fifth mounting port 4111 and a sixth mounting port 4112 are provided on the first plate body 411. The first liquid inlet end 7301 and the first liquid outlet end 7302 of the first liquid cooling device 730 extend from the fifth mounting port 4111 and the sixth mounting port 4112 respectively. In this way, the first plate body 411 can support the first liquid cooling device 730 and can facilitate the connection of the two ends of the first liquid cooling device 730 to the first joint 740 and the second joint 750 respectively.

[0116] For example, the first sub-liquid inlet pipe 7311 (as shown in FIG. 4 ) extends from the fifth installation port 4111 , and the second sub-liquid outlet pipe 7333 (as shown in FIG. 4 ) extends from the sixth installation port 4112 .

[0117] Continuing to refer to FIG. 5 , in some embodiments, a seventh installation opening 4113 and an eighth installation opening 4114 are further provided on the first plate 411 .

[0118] The first pipe connector 7312 (as shown in FIG. 3 ) and the second pipe connector 7332 (as shown in FIG. 4 ) are both disposed inside the first box 410 .

[0119] The server node 200 also includes a first type connector 910 and a second type connector 920. The first type connector 910 is connected to the third interface of the first pipe connector 7312 (as shown in Figure 4), and the first type connector 910 is connected to the second liquid inlet end 8101 of the second liquid cooling device 810.

[0120] The first type connector 910 is installed in the seventh installation opening 4113 , so that the first plate 411 can support the first type connector 910 .

[0121] The second type joint 920 is connected to the sixth interface of the second pipe connector 7332 (as shown in FIG. 4 ), and the second type joint 920 is connected to the second liquid outlet 8102 of the second liquid cooling device 810 .

[0122] The second type connector 920 is installed in the eighth installation port 4114 , so that the first plate 411 can support the first type connector 910 and the second type connector 920 .

[0123] In some examples, part of the first type connector 910 is located inside the first box body 410 and part of it is located outside the first box body 410 , thereby facilitating connection between the second liquid inlet end 8101 of the second liquid cooling device 810 and the first type connector 910 .

[0124] The second type connector 920 is partially located inside the first box body 410 and partially located outside the first box body 410 , thereby facilitating connection between the second liquid outlet end 8102 of the second liquid cooling device 810 and the first type connector 910 .

[0125] 3 , in some embodiments, the second box body 610 further includes a third plate body 611 , and the third plate body 611 is located on the first side 501 of the chassis 500 .

[0126] For example, the third plate 611 may be perpendicular to the Y direction.

[0127] In addition to the third plate 611, the second box 610 may further include a bottom plate 612 connected to the third plate 611, wherein the bottom plate 612 may be perpendicular to the Z direction. The second box 610 may only include the third plate 611 and the bottom plate 612, and the remaining panels of the second box 610 may be configured according to actual conditions.

[0128] A ninth mounting port 6111 and a tenth mounting port 6112 are provided on the third plate body 611; the second liquid inlet end 8101 and the second liquid outlet end 8102 of the second liquid cooling device 810 extend from the ninth mounting port 6111 and the tenth mounting port 6112 respectively, so that the third plate body 611 can support the second liquid cooling device 810 and can facilitate the connection of the two ends of the second liquid cooling device 810 with the first type joint 910 and the second type joint 920 respectively.

[0129] For example, the second liquid inlet pipe 811 extends from the ninth installation port 6111 , and the second liquid outlet pipe 813 extends from the second liquid outlet pipe 813 .

[0130] In some examples, the server node 200 further includes a third type connector 930 and a fourth type connector 940, wherein the third type connector 930 and the fourth type connector 940 are respectively disposed at the second liquid inlet 8101 and the second liquid outlet 8102 of the second liquid cooling device 810. The second liquid inlet 8101 of the second liquid cooling device 810 is connected to the first type connector 910 via the third type connector 930, and the second liquid outlet 8102 of the second liquid cooling device 810 is connected to the second type connector 920 via the fourth type connector 940.

[0131] For example, the third type connector 930 is installed at one end of the second liquid inlet pipe 811 (as shown in FIG. 4 ) away from the second liquid cooling plate 812 (as shown in FIG. 4 ), and the fourth type connector 940 is installed at one end of the second liquid outlet pipe 813 (as shown in FIG. 4 ) away from the second liquid cooling plate 812 .

[0132] FIG6 is a structural diagram of the server 1000 in FIG3 at a third viewing angle V3. In FIG6 , the coordinate system corresponding to the server node 200 is different from the coordinate systems corresponding to the liquid inlet manifold 310 and the liquid outlet manifold 320 .

[0133] 6 , the liquid inlet pipe 710 further comprises a first type of liquid inlet pipe. A first connector 740 is provided at one end of the first type of liquid inlet pipe located on the first side 501 , and a third connector 760 is provided at one end of the liquid inlet pipe 710 located on the second side 502 .

[0134] The flow rate of the first connector 740 can be equal to the flow rate of the third connector 760. In the case of a larger flow rate, the first type of liquid inlet pipe can be selected as the liquid inlet pipe. The liquid outlet pipe 720 includes a first type of liquid outlet pipe, which has a second connector 750 at one end located on the first side 501 and a fourth connector 770 at one end located on the second side 502.

[0135] The flow rate of the fourth joint 770 may be equal to the flow rate of the second joint 750 . In the case of a larger flow rate, the first type of liquid outlet pipe may be selected as the liquid outlet pipe.

[0136] FIG7 is a structural diagram of the server node 200 in FIG3 at a second perspective V2.

[0137] 7 , a third mounting hole 541 and a fourth mounting hole 542 are provided on the second side plate 540 . The liquid inlet pipe 710 extends from the third mounting hole 541 to the outside of the chassis 500 , and the liquid outlet pipe 720 extends from the fourth mounting hole 542 to the outside of the chassis 500 .

[0138] Among them, by setting the third mounting hole 541 on the second side plate 540, the liquid inlet pipe 710 can be easily extended from the chassis 500, and by setting the fourth mounting hole 542 on the second side plate 540, the liquid outlet pipe 720 can be easily extended from the chassis 500.

[0139] In some examples, the second side panel 540 may be provided with ventilation holes to improve the heat dissipation effect of the server node 200 .

[0140] FIG8 is another structural diagram of the server node 200 according to some embodiments of the present application.

[0141] Please refer to Figure 8. In some embodiments, the liquid inlet pipe 710 also includes a second type of liquid inlet pipe, which includes a first liquid inlet pipe section 711, a first pipe section connector 712 and multiple second liquid inlet pipe sections 713. The first pipe section connector 712 is provided with a first liquid inlet port and multiple second liquid inlets. One end of the first liquid inlet pipe section 711 is connected to the first liquid inlet port, and the other end of the first liquid inlet pipe section 711 is located on the first side; one end of the multiple second liquid inlet pipe sections 713 is respectively connected to the multiple second liquid inlets.

[0142] Among them, the end of the first liquid inlet pipe section 711 away from the first pipe section connector 712 is the first end 7101 of the liquid inlet pipe 710. At this time, a first joint 740 is provided on the end of the first liquid inlet pipe section 711 away from the first pipe section connector 712.

[0143] The ends of the second liquid inlet pipe sections 713 facing away from the first pipe section connector 712 are respectively connected to the first joints 340. A third joint 760 is provided at the end of one second liquid inlet pipe section 713 facing away from the first pipe section connector 712.

[0144] The diameter of the second liquid inlet pipe section 713 is smaller than that of the first liquid inlet pipe section 711 , and thus the flow rate of the second liquid inlet pipe section 713 is smaller than that of the first liquid inlet pipe section 711 .

[0145] When the flow rate is small, the second type of liquid inlet pipe can be selected as the liquid inlet pipe.

[0146] In some embodiments, the liquid outlet pipe 720 includes a second type of liquid outlet pipe, the second type of liquid outlet pipe includes a first liquid outlet pipe section 721, a second pipe section connector 722 and multiple second liquid outlet pipe sections 723, the second pipe section connector 722 is provided with a first liquid outlet and multiple second liquid outlets, one end of the first liquid outlet pipe section 721 is connected to the first liquid outlet, and the other end of the first liquid outlet pipe section 721 is located on the first side; one end of the multiple second liquid outlet pipe sections 723 are respectively connected to the multiple second liquid outlets.

[0147] The end of the first liquid outlet pipe section 721 away from the second pipe section connector 722 is the third end 7201 of the liquid outlet pipe 720 . At this time, the end of the first liquid outlet pipe section 721 away from the second pipe section connector 722 is provided with a second joint 750 .

[0148] The ends of the plurality of second liquid outlet pipe sections 723 facing away from the second pipe section connector 722 are respectively connected to the plurality of second joints 350. A fourth joint 770 is provided at the end of one second liquid outlet pipe section 723 facing away from the second pipe section connector 722.

[0149] The diameter of the second liquid outlet pipe section 723 is smaller than that of the first liquid outlet pipe section 721 , and thus the flow rate of the second liquid outlet pipe section 723 is smaller than that of the first liquid outlet pipe section 721 .

[0150] When the flow rate is small, the second type of liquid outlet pipe can be selected as the liquid outlet pipe.

[0151] In some embodiments, the server node further includes: a first connector 740, a second connector 750, a third connector 760, and a fourth connector 770. The first liquid inlet pipe section 711 is provided with a first connector 740 at one end of the first side 501, and the second liquid inlet pipe section 713 is provided with a third connector 760 at one end of the second side 502; the first liquid outlet pipe section 721 is provided with a second connector 750 at one end of the first side 501, and the second liquid outlet pipe section 723 is provided with a fourth connector 770 at one end of the second side 502.

[0152] In this embodiment, at least a portion of the first connector 740 is located outside the chassis 500 , so that the first connector 740 can be easily connected to the first liquid inlet end 7301 of the first liquid cooling device 730 .

[0153] At least a portion of the second connector 750 is located outside the chassis 500 , thereby facilitating connection between the second connector 750 and the first liquid outlet 7302 of the first liquid cooling device 730 .

[0154] The third connector 760 is disposed at one end of the second liquid inlet pipe section 713 located on the second side 502 . The third connector 760 can be connected to the first connector 340 . Thus, the liquid inlet pipe 710 can be connected to the liquid inlet manifold 310 through the third connector 760 and the first connector 340 .

[0155] The fourth connector 770 is disposed at one end of the second liquid outlet pipe section 723 located on the second side 502 . The fourth connector 770 can be connected to the second connector 350 . Thus, the liquid outlet pipe 720 can be connected to the liquid outlet manifold 320 through the fourth connector 770 and the second connector 350 .

[0156] The third connector 760 and the fourth connector 770 are both located outside the chassis 500 .

[0157] Figure 9 is a structural diagram of the server node 200 in Figure 8 from a fourth viewing angle V4. Referring to Figure 9 , the second side panel 540 is provided with a third mounting hole 541 and a fourth mounting hole 542. Multiple second liquid inlet pipe sections 713 of the second type of liquid inlet pipe extend from the third mounting hole 541, and multiple second liquid outlet pipe sections 723 of the second type of liquid inlet pipe extend from the fourth mounting hole 542.

[0158] Please refer back to Figure 3. In some embodiments, the chassis 500 may further include a partition, wherein the partition may be arranged between the top plate 510 and the bottom plate 520. The liquid inlet pipe 710 and the liquid outlet pipe 720 may be connected to the partition and located between the partition and the top plate 510.

[0159] 6 and 8 , the server node 200 further includes a valve 950. The valve 950 is provided on the liquid inlet pipe 710 and / or the liquid outlet pipe 720 and is used to control the flow of the working medium in the liquid inlet pipe, the liquid outlet pipe and the first liquid cooling device.

[0160] Among them, if leakage occurs in any of the liquid inlet pipe 710, the liquid outlet pipe 720, the first liquid cooling device 730, the second liquid cooling device 810 and each joint, the valve 950 can be used to control the liquid cooling medium to stop flowing, thereby facilitating repair of the leak.

[0161] In some examples, the second subnode 600 and the first subnode 400 may be stacked along the second direction Z, with the liquid inlet pipe 710 and the liquid outlet pipe 720 located on one side of the second subnode 600 in the X direction. It is understood that, in this case, the liquid inlet pipe 710 and the liquid outlet pipe 720 are also located on one side of the first subnode 400 in the X direction.

[0162] The above description is merely a specific embodiment of the present application, but the scope of protection of the present application is not limited thereto. Any changes or substitutions that a person skilled in the art can conceive within the technical scope disclosed in this application should be included within the scope of protection of the present application. Therefore, the scope of protection of the present application should be based on the scope of protection of the claims.

Claims

1. A server node, characterized in that: include: A chassis, the chassis comprising a first side and a second side disposed opposite to each other in a first direction; A first subnode is installed in the chassis, wherein the first subnode includes a first box body and a first heat dissipation device disposed in the first box body; a liquid inlet pipe extending from the second side to the first side; a liquid outlet pipe, the liquid outlet pipe extending from the second side to the first side; A first liquid cooling device, the first liquid cooling device is used to dissipate heat for the first heat dissipation device, the first liquid cooling device includes a first liquid inlet end and a first liquid outlet end, the first liquid inlet end and the first liquid outlet end are located on a side of the first housing adjacent to the first side, and are located outside the first housing, the first liquid inlet end is connected to an end of the liquid inlet pipe located on the first side, and the first liquid outlet end is connected to an end of the liquid outlet pipe located on the first side.

2. The server node according to claim 1, characterized in that: Also includes: A first joint and a second joint; the first joint is arranged at one end of the liquid inlet pipe close to the first side, and the first joint is connected to the first liquid inlet end of the first liquid cooling device; the second joint is arranged at one end of the liquid outlet pipe close to the second side, and the second joint is connected to the first liquid outlet end of the first liquid cooling device; Wherein, the liquid inlet pipe and the liquid outlet pipe are both arranged in the chassis, at least a part of the first joint is located outside the chassis, and at least a part of the second joint is located outside the chassis.

3. The server node according to claim 1 or 2, characterized in that: The first liquid cooling device comprises a first liquid inlet pipe, a first liquid cooling plate and a first liquid outlet pipe; A first liquid channel is provided in the first liquid cooling plate, and an outer surface of the first liquid cooling plate is attached to the first heat dissipation device; The first liquid inlet pipe comprises a first sub-liquid inlet pipe, a first pipe connector and a second sub-liquid inlet pipe, the first pipe connector comprises a first interface, a second interface and a third interface; one end of the first sub-liquid inlet pipe is connected to one end of the liquid inlet pipe located on the first side, and the other end is connected to the first interface; one end of the second sub-liquid inlet pipe is connected to the second interface, and the other end is connected to one end of the first liquid channel; The first liquid outlet pipe includes a first sub-liquid outlet pipe, a second pipe connector and a second sub-liquid outlet pipe, and the second pipe connector includes a fourth interface, a fifth interface and a sixth interface; one end of the first sub-liquid outlet pipe is connected to the other end of the first liquid channel, and the other end is connected to the fourth interface; one end of the second sub-liquid outlet pipe is connected to the fifth interface, and the other end is connected to one end of the liquid outlet pipe located on the first side; The server node further includes: a second sub-node and a second liquid cooling device; The second sub-node is installed in the chassis, and the second sub-node includes a second box body and a second heat dissipation device arranged in the second box body; The second liquid cooling device is used to dissipate heat for the second component to be cooled, and the second liquid cooling device includes a second liquid inlet and a second liquid outlet, the second liquid inlet and the second liquid outlet are located on a side of the second box body adjacent to the first side, and are located outside the second box body, wherein the second liquid inlet is connected to the third interface, and the second liquid outlet is connected to the sixth interface.

4. The server node according to claim 3, characterized in that: The second liquid cooling device comprises a second liquid inlet pipe, a second liquid cooling plate and a second liquid outlet pipe, the second liquid cooling plate is provided with a second liquid channel, and the outer surface of the second liquid cooling plate is attached to the second heat dissipation device; One end of the second liquid inlet pipe is connected to the third interface, and the other end is connected to one end of the second liquid channel; One end of the second liquid outlet pipe is connected to the other end of the second liquid channel, and the other end is connected to the sixth interface.

5. The server node according to claim 4, characterized in that: The first box body further includes a first plate body, the first plate body is located on the first side of the chassis, and the first plate body is provided with a seventh mounting opening and an eighth mounting opening; The first pipe connector and the second pipe connector are both arranged inside the first box; The server node also includes a first type of connector and a second type of connector; the first type of connector is connected to the third interface of the first pipe connector, and the first type of connector is connected to the second liquid inlet end of the second liquid cooling device, and the first type of connector is installed at the seventh mounting port; the second type of connector is connected to the sixth interface of the second pipe connector, and the second type of connector is connected to the second liquid outlet end of the second liquid cooling device, and the second type of connector is installed at the eighth mounting port.

6. The server node according to claim 4 or 5, characterized in that: The second box body also includes a third plate body, which is located on the first side of the chassis, and is provided with a ninth mounting port and a tenth mounting port; the second liquid inlet end and the second liquid outlet end of the second liquid cooling device extend out from the ninth mounting port and the fourth mounting port respectively.

7. The server node according to any one of claims 1 to 6, characterized in that: Also includes: a first joint, a second joint, a third joint, and a fourth joint; The first joint is disposed at one end of the liquid inlet pipe located at the first side, and the third joint is disposed at one end of the liquid inlet pipe located at the second side; The second joint is disposed at one end of the liquid outlet pipe located at the first side, and the fourth joint is disposed at one end of the liquid outlet pipe located at the second side.

8. The server node according to any one of claims 1 to 6, characterized in that: The liquid inlet pipe comprises a first liquid inlet pipe section, a first pipe section connector and a plurality of second liquid inlet pipe sections, the first pipe section connector is provided with a first liquid inlet port and a plurality of second liquid inlets, one end of the first liquid inlet pipe section is connected to the first liquid inlet port, and the other end of the first liquid inlet pipe section is located at the first side; One ends of the plurality of second liquid inlet pipe sections are respectively connected to the plurality of second liquid inlets; and / or, The liquid outlet pipe comprises a first liquid outlet pipe section, a second pipe section connector and a plurality of second liquid outlet pipe sections, the second pipe section connector is provided with a first liquid outlet and a plurality of second liquid outlets, one end of the first liquid outlet pipe section is connected to the first liquid outlet, and the other end of the first liquid outlet pipe section is located at the first side; One ends of the plurality of second liquid outlet pipe sections are respectively connected to the plurality of second liquid outlets.

9. The server node according to claim 8, characterized in that: Also includes: a first joint, a second joint, a third joint, and a fourth joint; The first liquid inlet pipe section has one end located at the first side provided with the first joint, and the second liquid inlet pipe section has one end located at the second side provided with the third joint; The second joint is disposed at one end of the first liquid outlet pipe section located at the first side, and the fourth joint is disposed at one end of the second liquid outlet pipe section located at the second side.

10. The server node according to any one of claims 1 to 9, characterized in that: Also includes: A valve is provided on the liquid inlet pipe and / or the liquid outlet pipe, and is used to control the flow of the working medium in the liquid inlet pipe, the liquid outlet pipe and the first liquid cooling device.

11. A server, characterized in that: A cabinet, wherein a receiving space is formed in the cabinet; A liquid cooling manifold, the liquid cooling manifold comprising: a liquid inlet manifold and a liquid outlet manifold arranged in the accommodating space; A plurality of server nodes as claimed in any one of claims 1 to 10, wherein the server nodes are arranged in the storage space In the time, the server node and the liquid cooling manifold are arranged in sequence along the first direction, the end of the liquid inlet pipe of the server node located on the second side is connected to the liquid inlet manifold, and the end of the liquid outlet pipe of the server node located on the second side is connected to the liquid outlet manifold.

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